Stress monitoring device and system based on mechanoluminescent material and application

Abstract

The invention discloses a stress monitoring device and system based on a mechanoluminescent material and application, and relates to the technical field of stress monitoring. The stress monitoring device based on the mechanoluminescent material comprises an impedance matching layer, a mechanoluminescent layer, a shell and an image acquisition module, the mechanoluminescent layer is arranged on the impedance matching layer; at least one surface of the shell is opened, and the shell covers the impedance matching layer to form an accommodating cavity; and the image acquisition module is arranged in the accommodating cavity and is used for acquiring a light-emitting image of the mechanoluminescent layer. The stress monitoring device based on the mechanoluminescent material provided by the invention has the technical effects of high spatial resolution and high flexibility and adaptability.

Description

Technical Field

[0001] The present invention relates to the field of stress monitoring technology, and in particular to a stress monitoring device, system and application based on mechanoluminescent materials. Background Art

[0002] Infrastructure such as bridges, tunnels, dams, and high-rise buildings are core components of large-scale human construction projects and play a vital role in human life. Any structural damage caused by uneven stress that exceeds design expectations may pose serious risks to life and property. In order to promptly detect potential emergencies and reduce the possibility of structural damage, infrastructure requires regular high-precision stress monitoring.

[0003] The most common structural stress monitoring devices currently available are resistance strain gauges and fiber Bragg gratings (FBGs). These devices suffer from numerous shortcomings: resistance strain gauges can only measure stress information at the point of installation, resulting in a very limited monitoring range and difficulty in achieving continuous stress distribution monitoring over a large area. Furthermore, the devices are severely subject to electromagnetic interference, which can easily lead to distortion of the measurement signal. While fiber Bragg gratings (FBGs) can achieve a certain degree of regional monitoring through a distributed optical fiber arrangement, their spatial resolution is limited by the grating spacing design, typically ranging from millimeters to centimeters, making it difficult to achieve high spatial resolution at the micron level. Furthermore, the devices must be pre-buried or tightly mounted, and require the addition of precision optical components such as lens assemblies and fiber connectors, which not only increases system complexity but also significantly increases the installation and maintenance costs of the equipment. These shortcomings of existing structural stress monitoring devices make it difficult for existing technologies to meet the demand for large-scale, highly flexible, and high-spatial-resolution stress monitoring of infrastructure, particularly in areas such as crack detection and stress concentration area location. Summary of the Invention

[0004] The present invention provides a stress monitoring device based on a mesoluminescent material with high spatial resolution, strong flexibility and adaptability.

[0005] Stress monitoring devices based on mechanoluminescent materials include:

[0006] Impedance matching layer;

[0007] a mesoluminescent layer, disposed on the impedance matching layer;

[0008] A shell having at least one opening, wherein the shell cover is arranged on the impedance matching layer to form a receiving cavity;

[0009] An image acquisition module is provided in the accommodating cavity and is used for acquiring the luminescent image of the mechanoluminescent layer.

[0010] Optionally, the impedance matching layer is made of at least one of polydimethylsiloxane, polyurethane, silicone rubber, and polytetrafluoroethylene.

[0011] Optionally, the mechanoluminescent layer is formed by coating or depositing a mechanoluminescent material on the impedance matching layer.

[0012] Optionally, the image acquisition module includes a focusing lens group and a camera;

[0013] The focusing lens group is used to focus the light emitted by the mesoluminescent layer onto the image capturing unit of the camera.

[0014] Optionally, the stress monitoring device based on the mechanoluminescent material further includes a scattering layer provided on the impedance matching layer, and the scattering layer is coated on a side surface of the mechanoluminescent layer.

[0015] Optionally, the scattering layer is made of MgO.

[0016] Optionally, the stress monitoring device based on the mechanoluminescent material further includes a wireless communication module;

[0017] The wireless communication module is used to send the luminous image acquired by the image acquisition module to a remote computer device.

[0018] The present invention provides a stress monitoring system based on mechanoluminescent materials, comprising the above-mentioned stress monitoring device based on mechanoluminescent materials, and computer equipment;

[0019] The computer device includes a data receiving module, a memory and a processor;

[0020] The data receiving module is used to receive the luminescent image acquired by the stress monitoring device based on the mechanoluminescent material;

[0021] The memory stores an image processing program, and the processor executes the image processing program to process the luminous image to obtain corresponding stress analysis data.

[0022] Optionally, the computer device further includes a visualization module;

[0023] The visualization module is used to display the luminescent image acquired by the stress monitoring device based on the mechanoluminescent material and the stress analysis data.

[0024] The above-mentioned stress monitoring device based on mechanoluminescent material or stress monitoring system based on mechanoluminescent material is suitable for infrastructure stress monitoring; when the stress monitoring device is used, the side provided with the impedance matching layer is attached to the outer surface of the infrastructure component.

[0025] Optionally, the stress monitoring device is pressed against the outer surface of the infrastructure component through a retractable support rod; or, the shell of the stress monitoring device is provided with a key for installation, and the stress monitoring device is fixed to the outer surface of the infrastructure component through an auxiliary fixing structure; the auxiliary fixing structure includes at least one of an adhesive limiting ring, a detachable metal limiting plate, a nail-free expansion lock, and a guide rail slide groove.

[0026] The technical solution of the present invention integrates a mesoluminescent layer, an impedance matching layer, and an image acquisition module into an independent stress monitoring device unit. When the stress monitoring device unit is in use, the side provided with the impedance matching layer is attached to the outer surface of the infrastructure. When the impedance matching material is subjected to external stress, the external stress can be evenly applied to the mesoluminescent layer, and the mesoluminescent layer will generate a strong light signal. The image acquisition module captures and records the luminescent image with the light intensity distribution information of the luminescent area. By processing the luminescent image through a related image processing program, accurate measurement of the stress distribution data can be achieved.

[0027] The present invention has the following beneficial effects:

[0028] The stress monitoring mode based on obtaining luminescent images from mesoluminescent materials has a spatial resolution much higher than that of the spectroscopy detection mode and is completely immune to electromagnetic interference, making it suitable for long-term monitoring in high electromagnetic environments. In addition, the present invention integrates the mesoluminescent layer, impedance matching layer, and image acquisition module into an independent external unit. The modular design facilitates disassembly and maintenance when necessary, without the need for complex wiring or pre-embedded optical fibers. It has huge application potential and value for long-term stress monitoring of infrastructure where it is difficult to pre-embed or fix stress monitoring components by gluing them. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0030] Figure 1 Schematic diagram of the structure of some embodiments of the stress monitoring device and system based on mechanoluminescent materials of the present invention;

[0031] Figure 2 Schematic diagram of the fixed structure of the stress monitoring device in some application examples of the present invention;

[0032] Figure 3 Schematic diagram of the fixed structure of the stress monitoring device in other application examples of the present invention.

[0033] Explanation of the accompanying drawings: 1. Impedance matching layer; 2. Mechanoluminescent layer; 3. Shell; 4. Image acquisition module; 4-1. Focusing lens group; 4-2. Camera; 5. Scattering layer; 6. Computer equipment; 7. Measured structure; 8. Retractable support rod; 9. Structure capable of bearing external force; 10. Auxiliary fixing structure; 11. Key. DETAILED DESCRIPTION

[0034] In order to make the purpose, features, and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0035] An embodiment of the present invention provides a stress monitoring device based on a mechanoluminescent material.

[0036] See Figure 1 In some embodiments, the stress monitoring device includes an impedance matching layer 1, a mesoluminescent layer 2, a shell 3 and an image acquisition module 4; the mesoluminescent layer 2 is arranged on the impedance matching layer 1; the shell 3 has at least one opening and is covered on the impedance matching layer 1 to form a accommodating cavity; the image acquisition module 4 is arranged in the accommodating cavity for acquiring a luminous image of the mesoluminescent layer 2.

[0037] When the stress monitoring device is in use, the side with the impedance matching layer is attached to the outer surface of the infrastructure structure. When the impedance matching material is subjected to external stress, the external stress can be evenly applied to the mechanoluminescent material, and the mechanoluminescent material will generate a strong light signal. The image acquisition module captures and records the luminous image containing the light intensity distribution information of the luminous area. By processing the luminous image through the relevant image processing program, the accurate measurement of the stress distribution data can be achieved.

[0038] Among them, since the surface of the infrastructure is mostly rough solid materials such as cement and the surface is not smooth enough, highly applicable impedance matching materials are needed to improve the stress transfer efficiency, reduce signal reflection and energy loss, and evenly apply external stress to the mesoluminescent layer.

[0039] In some preferred embodiments, the material of the impedance matching layer can be selected from one or more combinations of flexible impedance matching materials such as polydimethylsiloxane, polyurethane, silicone rubber (such as Ecoflex), and polytetrafluoroethylene.

[0040] The mechanoluminescent layer is formed by coating or depositing a mechanoluminescent material on the impedance matching layer. The coating or deposition method includes but is not limited to a sol-gel method, a chemical vapor deposition method, spray coating, spin coating, and the like.

[0041] In an embodiment of the present invention, a mechanoluminescent material is a functional material that can produce luminescence when subjected to mechanical stress (such as friction, extrusion, stretching, impact, etc.). The mechanoluminescent material can be inorganic mechanoluminescent materials (such as ZnS-based luminescent materials, rare earth-doped ceramic luminescent materials), organic mechanoluminescent materials (such as triphenylamine, tetraphenylethylene, carbazole, anthracene, phenothiazine, dansyl derivatives, etc.) or inorganic-organic composite materials (such as organic resins doped with inorganic mechanoluminescent particles). In an embodiment of the present invention, mechanoluminescent materials with sensitive stress linear luminescence and a large linear range are preferably selected.

[0042] The image acquisition module includes a focusing lens group and a camera (such as a CCD camera); the focusing lens group is used to focus the light emitted by the mesoluminescent layer onto the image capture unit of the camera to improve the image acquisition resolution; the camera is used to capture the luminous image of the mesoluminescent layer; the focusing lens group and the camera can be integrated.

[0043] See Figure 1 In some preferred embodiments, the stress monitoring device further includes a scattering layer 5 provided on the impedance matching layer 1, and the scattering layer 5 is coated on the side of the mesoluminescent layer 2 to reduce the scattering loss of the mesoluminescent light intensity of the material and improve the collection efficiency of the optical signal.

[0044] The material of the scattering layer must meet the requirements of optical transparency, scattering coefficient, mechanical stability and compatibility with the mesoluminescent layer and the impedance matching layer. The optional materials include but are not limited to polymers (such as PDMS, epoxy resin, polyurethane, etc.) and inorganic oxides (such as MgO, SiO2, TiO2, ZnO, etc.).

[0045] In some preferred embodiments, the material of the scattering layer is MgO; MgO has excellent properties such as wide-band light transmittance, high temperature resistance, high chemical stability and corrosion resistance, and can be coated on the impedance matching layer by sol-gel method, chemical vapor deposition method, spraying method, solution immersion method or laser ablation method, and is compatible with the coating or deposition of mesoluminescent materials in terms of process.

[0046] In some preferred embodiments, the stress monitoring device based on mechanoluminescent material proposed in the present invention also includes a wireless communication module; the wireless communication module is used to send the luminescent image acquired by the image acquisition module to a remote computer device; the wireless communication module can select Bluetooth module, WIFI module, Zigbee module, cellular communication module (4G / 5G) and other types of communication modules suitable for wireless image transmission, which are not particularly limited in the embodiments of the present invention, and those skilled in the art can make a selection according to actual needs and application conditions.

[0047] In an embodiment of the present invention, a shell covering the impedance matching layer forms a dark box, which is used to block external light and protect the internal components of the stress monitoring device (the mesoluminescent layer, the image acquisition module, etc.), ensuring that the image acquisition module captures high-quality luminous images of the mesoluminescent layer; the shell is made of an opaque material, or other materials with an inner wall coated with a light-absorbing coating. Based on different application scenarios, the shell material can be selected from metal materials such as stainless steel, aluminum alloy, titanium alloy, or engineering plastics such as PA, POM, PEEK, or composite materials such as ceramic-based composites, carbon fiber reinforced polymers, and glass fiber reinforced plastics.

[0048] In some cases, the impedance matching layer and the shell are firmly combined together. When the stress monitoring device is in use, the entire device is fixed to the surface of the building component. When disassembly is required, the entire stress monitoring device is directly removed.

[0049] In other cases, the impedance matching layer and the shell are detachably connected, and the impedance matching layer and the mesoluminescent layer provided thereon together constitute a detachable unit that is adhered or otherwise fixed to a stress monitoring point on the surface of the building, while the shell and the image acquisition module constitute another detachable unit. When stress monitoring is required, the shell and the impedance matching layer are mechanically connected to form a complete stress monitoring device. When disassembly is required, it is only necessary to remove the detachable unit where the shell is located.

[0050] Based on the above embodiments of the stress monitoring device, the present invention further proposes a stress monitoring system based on a mesoluminescent material to construct a comprehensive stress monitoring solution.

[0051] See Figure 1 In some embodiments, a stress monitoring system based on mesoluminescent materials includes the stress monitoring device provided in the above embodiments, and a computer device 6 .

[0052] The computer device includes a data receiving module, a memory and a processor; the data receiving module is used to receive the luminous image obtained by the stress monitoring device; the memory stores an image processing program, and the processor processes the luminous image when executing the image processing program to obtain corresponding stress analysis data.

[0053] In some embodiments, the stress monitoring device includes a wireless communication module, and the data receiving module of the computer device selects a corresponding wireless communication receiving module to achieve remote monitoring of the stress situation of the infrastructure.

[0054] In some specific embodiments, the computer device also includes a visualization module; the visualization module is used to display the luminescent image obtained by the stress monitoring device and the stress analysis data processed by the computer device; the mesoluminescent layer of the stress monitoring device can intuitively reflect the stress magnitude through changes in light intensity. Combined with the high-resolution image captured by the camera, a two-dimensional stress distribution map can be generated in real time in the visualization module (including but not limited to CRT, LCD, OLED and other display screens and related components), which facilitates the rapid location of stress concentration areas or potential hidden dangers.

[0055] The stress detection mode based on mechanoluminescent materials to obtain luminescent images adopted in the embodiment of the present invention has a spatial resolution much higher than the spectroscopy detection mode and is immune to electromagnetic interference, making it suitable for long-term monitoring in high electromagnetic environments. In addition, the embodiment of the present invention integrates the mechanoluminescent layer, impedance matching layer, and image acquisition module into an independent external unit. The modular design facilitates disassembly, replacement, and maintenance when necessary, without the need for complex wiring or pre-embedding of optical fibers. It has huge application potential and value for long-term stress monitoring of infrastructure where it is difficult to pre-embed or fix stress monitoring components by gluing.

[0056] The stress monitoring device provided in the embodiments of the present invention can be adhered to the surface of the infrastructure structure, or can be more stably fixed to the surface of the infrastructure structure through some auxiliary components to improve the collection quality of the stress response signal; the fixing methods using auxiliary components include but are not limited to the following two methods:

[0057] Method 1: Back support fixation; see Figure 2 When there is a structure 9 that can bear external forces near the structure to be measured 7 (such as a concrete wall), the stress monitoring device can be connected to a retractable support rod 8 on the back of its shell, and the other end of the retractable support rod 8 is connected to a tripod with a fixing function or a detachable adsorption device (such as a vacuum suction cup). By adjusting the length of the retractable support rod 8 so that it abuts the surface of the structure 9 that can bear external forces, the retractable support rod 8 forms a pressing effect on the stress monitoring device; this support and fixing method can effectively share the gravity of the stress monitoring device itself, enhance its attachment stability on the structure to be measured 7, and avoid affecting the stress monitoring effect due to the device sliding or deflecting.

[0058] Method 2: Side wall positioning and limiting fixation; see Figure 3The side wall of the shell of the stress monitoring device is provided with a key 11 for installation. The key 11 is used to cooperate with the auxiliary fixing structure 10 set on the wall surface to fix the stress monitoring device to the surface of the measured structure 7; the auxiliary fixing structure 10 can choose an adhesive limit ring, and when installed, it is fixed to the surface of the measured structure 7 with a strong double-sided tape (such as 3MVHB tape) or a detachable adsorption device (such as a vacuum suction cup). The shape of the auxiliary fixing structure 10 matches the outer edge of the shell of the stress monitoring device, and it is pressed tightly against the surface of the measured structure 7 by providing radial restriction to the side wall of the stress monitoring device; the auxiliary fixing structure 10 can also choose a detachable metal limit plate, which is connected to the side wall of the stress monitoring device by bolts or by a preset magnet on the side wall of the device to achieve a magnetic connection; the auxiliary fixing structure 10 can also choose a nail-free expansion lock, a guide rail groove, etc. without destroying the structure to be measured to achieve positioning and fixation of the stress monitoring device.

[0059] When the stress monitoring device provided in the embodiment of the present invention is used for large-area stress monitoring of infrastructure, an array layout method can be adopted. For specific infrastructure, according to the preset stress monitoring spatial layout, multiple stress monitoring devices are arranged according to a certain spatial arrangement rule (such as linear arrangement, matrix arrangement, grid distribution, etc.) to form a stress monitoring network in the form of an array. Combined with image acquisition control methods such as regular acquisition or triggering of the luminous threshold of specific monitoring points, functions such as synchronous data acquisition, continuous time recording, feature point acquisition, and comparative analysis of stress changes in multiple regions of the measured structure are realized to meet the needs of multi-point, wide-area, long-term and customized stress monitoring.

[0060] Based on the above embodiments, the present invention also proposes the following specific application scenarios to further illustrate the implementation method of the present invention in actual application scenarios and the beneficial effects that can be produced; it should be noted that the following specific application scenarios are exemplary in nature and do not constitute any form of limitation on the scope of protection of the present invention.

[0061] Application Scenario 1: The stress monitoring device provided in the embodiment of the present invention is used for stress monitoring of building components in complex strong electromagnetic field environments such as wireless communication base stations, electrified railway contact networks, and power systems (substations, high-voltage transmission networks).

[0062] In these environments, if traditional resistance strain gauges are used for stress monitoring, strong electromagnetic fields will generate interference voltage in the resistance strain gauge wires through capacitive / inductive coupling, causing the measured value to deviate from the actual stress and may even damage the internal components of the resistance strain gauge sensor (such as the Wheatstone bridge, signal amplification circuit, etc.), causing the sensor to fail.

[0063] The stress monitoring device provided by the embodiment of the present invention is based on the luminescent image acquisition of mechanoluminescent materials. The luminescent process of the mechanoluminescent material under stress and the acquisition process of the luminescent image are not affected by electromagnetic interference, and the measurement of stress is more accurate. It should be noted that when wirelessly transmitting luminescent image data in these environments, it is necessary to evaluate the degree of interference of the electromagnetic field on the wireless signal transmission to avoid data loss or delay.

[0064] Application scenario 2: The stress monitoring device provided by the embodiment of the present invention is applied to long-term stress monitoring of high-risk, high-sensitivity major infrastructure components such as nuclear power plants and petrochemical storage tanks.

[0065] Critical components such as reactor pressure vessels, pipelines, and containment vessels are subjected to extreme environments such as high temperature, high pressure, and radiation for a long time. Stress concentration may cause material fatigue, crack expansion, and even leakage or explosion. Petrochemical storage tanks store flammable and explosive media (such as crude oil and liquefied petroleum gas), and stress is generated due to factors such as the weight of the media, temperature changes, and foundation settlement. If stress abnormalities or tank cracks are not discovered in time, leakage, fire, or environmental pollution may occur. The stress concentration areas of components in these high-risk environments are often located in welds, pipe areas, penetration interface areas, hidden structures (internal partitions / support beams), etc. Directly pre-embedding resistance strain gauges or fiber Bragg grating stress sensors will increase the risk of structural damage. In addition, these major infrastructures often require high-frequency sampling. Complex dynamic stress changes can easily lead to fatigue failure of resistance strain gauges or fiber Bragg grating stress sensors. The maintenance window period of reactors or petrochemical storage tanks is short, and the time for replacing and re-embedding stress sensors is extremely short.

[0066] The stress monitoring device provided in the embodiment of the present invention is used to monitor the stress of components in nuclear power plants and petrochemical storage tanks. There is no need to pre-embed the stress monitoring device inside the components. Only the side of the stress monitoring device provided with the impedance matching layer needs to be attached to stress monitoring areas such as welds, pipe connection areas, penetration interface areas, and concealed structures. The changes in the luminous intensity and light intensity distribution of the mesoluminescent layer can reflect the stress changes in the detection area in real time, meeting the needs of high-frequency sampling and dynamic sampling, and realizing early stress warning. The stress monitoring device provided in the embodiment of the present invention adopts a modular design, which is easy to disassemble and maintain. The stress monitoring device can be quickly replaced and deployed during the extremely short maintenance window period of the reactor or petrochemical storage tank. In addition, when a new stress concentration area appears in the relevant components of the reactor or petrochemical storage tank, a stress monitoring device can be added in that area, which has extremely high detection flexibility.

[0067] Application scenario 3: The stress monitoring device provided in the embodiment of the present invention is applied to large-scale infrastructure such as bridges, tunnels, and dams.

[0068] Long-term vehicle loads and temperature cycles may cause bridges to experience stress relaxation in the main beam, fatigue cracking, and support voiding; tunnels may collapse due to surrounding rock creep and lining crack expansion, especially tunnels crossing fault zones, which require real-time monitoring of convergence deformation; dam foundation seepage and dam body concrete aging can lead to stress redistribution. For example, excessive tensile stress at the heel of a gravity dam may cause deep sliding.

[0069] Large-scale infrastructure projects require long-term monitoring due to the slow changes in structural stress. Consequently, high requirements are placed on the long-term reliability of stress sensors. Traditional resistance strain gauges and fiber Bragg grating sensors have weak anti-interference capabilities. For example, vehicle vibration can cause strain signal contamination and noise, significantly impacting the strain gauge's detection accuracy. Temperature fluctuations (temperature differences within a 24-hour period and between seasons) can also induce thermal strain, necessitating the distinction between load strain and temperature strain. For bridge structural stress monitoring, the main cables and pylons are located at high altitudes, making traditional sensors difficult to embed and maintain, necessitating remote wireless monitoring solutions. For tunnel structural stress monitoring, the humid and corrosive environment can easily cause embedded stress sensors to fail, and the thin tunnel lining thickness (typically 0.3 to 1 meter) requires pre-installed mounting slots for embedded traditional stress sensors, potentially weakening the lining's structural strength. For dam structural stress monitoring, which can last up to a century, even stress sensors with excellent aging resistance (e.g., 10 to 20 years) require regular replacement. Embedded resistance strain gauges and fiber Bragg grating stress sensors cannot meet the long-term stress monitoring requirements of dams.

[0070] The stress monitoring device provided in the embodiment of the present invention is used to monitor the stress of large-scale infrastructure such as bridges, tunnels, and dams. The modular design facilitates disassembly, replacement, and maintenance when necessary, without the need for complex wiring or pre-buried optical fibers. The stress monitoring device integrates components such as the mechanoluminescent layer, impedance matching layer, and image acquisition module within the housing, making it highly adaptable to humid and corrosive environments. Compared with resistance strain gauges and fiber Bragg gratings, the mechanoluminescent mode is basically unaffected by temperature changes and vibrations, and has better long-term stability. The stress monitoring device provided in the embodiment of the present invention can transmit the collected luminescent images to a remote computer device via a wireless communication module, facilitating remote stress monitoring in high-risk operating areas such as high-altitude areas of bridges.

[0071] For the above large-scale infrastructure, under extreme loads such as typhoons and earthquakes, the stress monitoring device provided by the embodiment of the present invention can be used to obtain real-time stress data to assist in determining whether the structure has entered a dangerous state; by regularly collecting stress data (for example, setting daily, weekly, or monthly inspection cycles, and performing high-frequency collection when large loads such as strong winds, heavy rains, high temperatures, and cold waves occur), the remaining life of the structure can be predicted through long-term data accumulation.

[0072] The above-described embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A stress monitoring device based on mechanoluminescent material, characterized in that: include: Impedance matching layer; a mesoluminescent layer, disposed on the impedance matching layer; A shell having at least one opening, wherein the shell cover is arranged on the impedance matching layer to form a receiving cavity; An image acquisition module is provided in the accommodating cavity and is used to acquire a luminescent image of the mechanoluminescent layer.

2. The stress monitoring device based on mechanoluminescent material according to claim 1, characterized in that: The impedance matching layer is made of at least one of polydimethylsiloxane, polyurethane, silicone rubber, and polytetrafluoroethylene.

3. The stress monitoring device based on mechanoluminescent material according to claim 1, characterized in that: The mechanoluminescent layer is formed by coating or depositing a mechanoluminescent material on the impedance matching layer.

4. The stress monitoring device based on mechanoluminescent material according to claim 1, characterized in that: The image acquisition module includes a focusing lens group and a camera; The focusing lens group is used to focus the light emitted by the mesoluminescent layer onto the image capturing unit of the camera.

5. The stress monitoring device based on mechanoluminescent material according to claim 1, characterized in that: The invention also includes a scattering layer provided on the impedance matching layer, wherein the scattering layer covers the side surface of the mesoluminescent layer.

6. The stress monitoring device based on mechanoluminescent material according to claim 5, characterized in that: The scattering layer is made of MgO.

7. The stress monitoring device based on mechanoluminescent material according to claim 1, characterized in that: Also included is a wireless communication module; The wireless communication module is used to send the luminous image acquired by the image acquisition module to a remote computer device.

8. A stress monitoring system based on mechanoluminescent materials, characterized in that: A stress monitoring device based on a mechanoluminescent material according to any one of claims 1 to 7, and a computer device; The computer device includes a data receiving module, a memory and a processor; The data receiving module is used to receive the luminescent image acquired by the stress monitoring device based on the mechanoluminescent material; The memory stores an image processing program, and the processor processes the luminous image when executing the image processing program to obtain corresponding stress analysis data.

9. Application of the stress monitoring device based on mechanoluminescent material according to any one of claims 1 to 7 in infrastructure stress monitoring, characterized in that: The side of the stress monitoring device provided with the impedance matching layer is attached to the outer surface of the infrastructure component.

10. The use according to claim 9, characterized in that The stress monitoring device is pressed against the outer surface of the infrastructure component via a retractable support rod; Alternatively, the shell of the stress monitoring device is provided with a key for installation, and the stress monitoring device is fixed to the outer surface of the infrastructure component through an auxiliary fixing structure; the auxiliary fixing structure includes at least one of an adhesive limiting ring, a detachable metal limiting plate, a nail-free expansion lock, and a guide rail slide groove.

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