Method, device and equipment for detecting reliability of oxygen sensor chip and medium

Abstract

The embodiment of the invention discloses a reliability detection method and device for an oxygen sensor chip, equipment and a medium, and belongs to the technical field of oxygen sensors. The embodiment of the invention substantially relates to a brand new thermal shock test method which is different from an existing mode that a heating furnace is used for heating the chip, heat preservation is carried out, and the chip is taken out and then is rapidly subjected to water quenching, the water dripping amount, the chip water dripping position and the like are controllably selected in a water dripping test mode, and the human influence degree of the reliability detection result of the oxygen sensor chip can be reduced; the detection repeatability is improved; meanwhile, the spraying-resistant liquid amount of the oxygen sensor chip can be obtained according to the dripping test result, the spraying-resistant liquid amount can quantitatively represent the reliability indexes such as the thermal shock resistance of the oxygen sensor chip, quantitative analysis of the reliability of the oxygen sensor chip is achieved, and the test accuracy is high.

Description

Technical Field

[0001] Embodiments of the present invention relate to the technical field of oxygen sensors, and in particular to a reliability detection method, device, equipment, and medium for an oxygen sensor chip. Background Art

[0002] As a key component in automotive exhaust emission control systems, oxygen sensors play a vital role in improving fuel economy and controlling pollutant emissions. Their primary operating principle is to monitor the oxygen concentration in engine exhaust in real time and adjust the air-fuel ratio to optimize combustion efficiency and reduce emissions of harmful gases such as CO and NOx. With the implementation of increasingly stringent emission regulations, such as China VI, these regulations have placed higher demands on the performance, particularly reliability, of oxygen sensors.

[0003] Currently, mainstream oxygen sensors typically use yttrium-stabilized zirconia (YSZ) ceramic as the sensitive element, which exhibits excellent oxygen ion conductivity and high-temperature stability. However, during actual operation, particularly during cold start or high-humidity conditions, condensation forms within the exhaust system. When this condensation contacts the high-temperature sensor chip (typically operating at 700°C to 800°C), a sharp temperature gradient forms on the ceramic surface. The resulting thermal stress can easily cause microcracks or even fractures in the YSZ ceramic, leading to performance degradation and even failure of the oxygen sensor.

[0004] Existing technologies often use thermal shock testing to examine the stability and reliability of oxygen sensors' thermal shock protection layer structures under rapidly fluctuating temperatures. Specifically, these tests typically involve heating the chip in a furnace, maintaining the temperature, removing the chip, and rapidly quenching it with water. The presence of cracks on the chip's macroscopic surface serves as a basis for detecting thermal shock damage. However, this method's results are susceptible to human influence (due to the difficulty in controlling the timing of chip movement, the position and state of the chip in the water, etc., during the process from holding the chip to quenching it). This method also offers low repeatability. Furthermore, since the test results are based solely on macroscopic observation, they can only serve as a qualitative basis for analyzing the oxygen sensor's performance and are unable to quantitatively assess the chip's thermal shock stability. Summary of the Invention

[0005] Embodiments of the present invention provide a reliability testing method, apparatus, device, and medium for an oxygen sensor chip, thereby reducing the degree to which the reliability testing results of the oxygen sensor chip are affected by human factors, improving the repeatability of the test, and realizing quantitative reliability analysis of the oxygen sensor chip.

[0006] In a first aspect, an embodiment of the present invention provides a reliability detection method for an oxygen sensor chip, comprising at least:

[0007] performing an initial test on the oxygen sensor chip to obtain at least an initial limiting current platform of the oxygen sensor chip after the oxygen sensor chip passes the initial test;

[0008] The oxygen sensor chip is continuously subjected to at least one water drip test according to the initial limiting current platform until the oxygen sensor chip fails any test item in any of the water drip tests. The test is then stopped and the liquid resistance of the oxygen sensor chip is obtained.

[0009] Optionally, the initial test and the drip test include at least one of the following test items:

[0010] Chip internal crack test items, limiting current test items and AC impedance test items.

[0011] Optionally, performing an initial test on the oxygen sensor chip to obtain at least an initial limiting current platform of the oxygen sensor chip after the oxygen sensor chip passes the initial test comprises at least:

[0012] Constructing a first test loop consisting of an oxygen sensor, a power supply device, and a first measuring device connected in series, connecting the signal terminal PIN pin or the heater terminal PIN pin of the oxygen sensor to the power supply device, and placing the oxygen sensor in a crack detection solution;

[0013] A first preset voltage is provided to the first test circuit through the power supply device, and a loop current reading of the first measuring device under the first preset voltage is recorded. If the loop current reading remains at a preset level, it indicates that there is no crack inside the oxygen sensor chip.

[0014] Optionally, performing an initial test on the oxygen sensor chip to obtain at least an initial limiting current platform of the oxygen sensor chip after the oxygen sensor chip passes the initial test further comprises:

[0015] Constructing a second test loop consisting of the oxygen sensor, the power supply device, and a second measuring device, connecting the heater end PIN pin of the oxygen sensor to the power supply device, and connecting the signal end PIN pin of the oxygen sensor to the second measuring device;

[0016] Using the power supply device to provide a second preset voltage to the second test circuit, so that after the oxygen sensor chip is heated from an initial temperature state to an operating temperature state, the initial limiting current platform and AC impedance of the oxygen sensor chip are measured by the second measuring device;

[0017] After determining that there are no cracks inside the oxygen sensor chip, the initial limiting current platform exists and meets preset conditions, and the AC impedance has no sudden change, the oxygen sensor chip is deemed to have passed the initial test.

[0018] Optionally, continuing to perform at least one water drip test on the oxygen sensor chip based on the initial limiting current platform until the oxygen sensor chip fails any test item in any of the water drip tests, stopping the test and obtaining the liquid resistance of the oxygen sensor chip, at least includes:

[0019] Connecting the heater end PIN pin of the oxygen sensor to a power supply device, and using the power supply device to provide an operating voltage to the oxygen sensor, so as to heat the oxygen sensor chip from an initial temperature state to an operating temperature state;

[0020] A preset volume of dripping liquid is extracted one by one by a pipetting device, and the dripping liquid is dripped into a preset position of the oxygen sensor at one time until the dripping liquid is dripped a preset number of times, thus performing a dripping test;

[0021] After the drip test is completed, a first test loop is constructed by connecting the oxygen sensor, the power supply device, and the first measuring device in series, connecting the signal terminal PIN pin or the heater terminal PIN pin of the oxygen sensor to the power supply device, and placing the oxygen sensor in the crack detection solution;

[0022] providing a first preset voltage to the first test circuit through the power supply device, and recording a loop current reading of the first measuring device at the first preset voltage, wherein if the loop current reading remains at a preset level, it indicates that there is no crack inside the oxygen sensor chip;

[0023] Continue to build a second test loop consisting of the oxygen sensor, the power supply device, and the second measuring device, connect the heater end PIN pin of the oxygen sensor to the power supply device, and connect the signal end PIN pin of the oxygen sensor to the second measuring device;

[0024] Using the power supply device to provide a second preset voltage to the second test circuit, so that after the oxygen sensor chip is heated from the initial temperature state to the operating temperature state, the second measuring device is used to measure and obtain the current limiting current platform and the current AC impedance of the oxygen sensor chip;

[0025] After determining that there are no cracks inside the oxygen sensor chip, the current limiting current platform exists and the increase compared to the initial limiting current platform is not greater than a preset increase, and the current AC impedance has no sudden change, the oxygen sensor chip is deemed to have passed the current water drip test;

[0026] The dripping liquid volume extracted by the pipetting device is changed and the dripping test and test item steps are repeated until the oxygen sensor chip fails any test item in any of the dripping tests. The test is stopped and the dripping liquid resistance of the oxygen sensor chip is obtained.

[0027] Optionally, during any dripping test, the time interval between two adjacent dripping of liquid is not less than a preset time threshold, so that the oxygen sensor chip remains dry before the next dripping of liquid.

[0028] Optionally, the dripping liquid involved in the dripping test is at least one of water, an aqueous solution containing carbonate ions, and an aqueous solution containing nitrate ions.

[0029] In a second aspect, an embodiment of the present invention further provides a reliability detection device for an oxygen sensor chip, comprising at least:

[0030] an initial testing module, configured to perform an initial test on the oxygen sensor chip, so as to obtain at least an initial limiting current platform of the oxygen sensor chip after the oxygen sensor chip passes the initial test;

[0031] The water dripping test module is configured to continue performing at least one water dripping test on the oxygen sensor chip based on the initial limiting current platform until the oxygen sensor chip fails any test item in any of the water dripping tests, stop the test, and obtain the liquid resistance of the oxygen sensor chip.

[0032] In a third aspect, an embodiment of the present invention further provides an electronic device comprising a memory and a processor, wherein the memory stores a computer program that can be run on the processor, and when the processor executes the program, the steps of the reliability detection method of the oxygen sensor chip described in any one of the first aspects are implemented.

[0033] In a fourth aspect, an embodiment of the present invention further provides a computer-readable storage medium having a computer program stored thereon, wherein when the computer program is executed by a processor, the steps of reliability detection of the oxygen sensor chip according to any one of the first aspects are implemented.

[0034] The technical solution provided by the embodiments of the present invention performs an initial test on an oxygen sensor chip to obtain at least an initial limiting current plateau after the oxygen sensor chip passes the initial test. Furthermore, the oxygen sensor chip is subjected to at least one water drop test based on the initial limiting current plateau until the oxygen sensor chip fails any test item in any of the water drop tests. The test is then terminated and the oxygen sensor chip's liquid drop resistance is determined. Therefore, the embodiments of the present invention essentially provide a novel thermal shock testing method, distinct from the existing method of heating and maintaining the chip in a furnace, followed by rapid water quenching and rapid cooling. The water drop test allows for controllable selection of the water drop volume (for example, with microliter-level accuracy) and the chip's water drop location, thereby reducing the risk of human influence on the reliability test results of the oxygen sensor chip and improving test repeatability. Furthermore, the embodiments of the present invention obtain the liquid drop resistance of the oxygen sensor chip based on the water drop test results. This liquid drop resistance can be used to quantitatively characterize reliability indicators such as the oxygen sensor chip's thermal shock resistance, enabling quantitative reliability analysis of the oxygen sensor chip and achieving high test accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0036] Figure 1 This is a flow chart of a reliability detection method for an oxygen sensor chip provided by an embodiment of the present invention;

[0037] Figure 2 1 is a schematic structural diagram of a reliability detection device for an oxygen sensor chip provided by an embodiment of the present invention;

[0038] Figure 3 It is a structural diagram of an electronic device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0039] To make the objectives, technical solutions, and advantages of this application more clear, this application will be further described in detail below with reference to the accompanying drawings. Obviously, the embodiments described are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of this application.

[0040] The terms used in the examples of this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The singular forms "a," "the," and "the" used in the examples of this application and the appended claims are also intended to include plural forms, and unless the context clearly indicates otherwise, "a plurality" generally includes at least two.

[0041] It should be understood that the term "and / or" as used herein simply describes a relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A exists alone, A and B exist simultaneously, or B exists alone. Furthermore, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0042] It should be understood that although the terms first, second, third, etc. may be used to describe in the embodiments of the present application, these descriptions should not be limited to these terms. These terms are only used to distinguish the descriptions. For example, without departing from the scope of the embodiments of the present application, the first may also be referred to as the second, and similarly, the second may also be referred to as the first.

[0043] As used herein, the words "if" and "if" may be interpreted as "at the time of" or "when" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrases "if it is determined" or "if (stated condition or event) is detected" may be interpreted as "when it is determined" or "in response to the determination" or "when detecting (stated condition or event)" or "in response to detecting (stated condition or event)," depending on the context.

[0044] It should also be noted that the terms "include," "comprises," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a product or device comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such product or device. In the absence of further limitations, an element defined by the phrase "comprises a..." does not exclude the presence of other identical elements in the product or device comprising the element.

[0045] It should be noted in particular that any symbols and / or numbers in the specification that are not marked in the accompanying drawings are not drawing marks.

[0046] Figure 1This is a flow chart of a reliability testing method for an oxygen sensor chip provided by an embodiment of the present invention. This embodiment is applicable to oxygen sensor performance testing scenarios of various vehicles, such as fuel vehicles, hybrid vehicles, plug-in hybrid vehicles, etc. The reliability testing method for the oxygen sensor chip can be, but is not limited to, executed by the reliability testing device for the oxygen sensor chip in the embodiment of the present invention as the execution subject, and the execution subject can be implemented in software and / or hardware. Figure 1 As shown, the reliability detection method of the oxygen sensor chip includes at least the following specific steps:

[0047] S1. Performing an initial test on the oxygen sensor chip to obtain at least an initial limiting current platform of the oxygen sensor chip after the oxygen sensor chip passes the initial test.

[0048] The initial test may include multiple test items. In one specific embodiment, the initial test may optionally include at least one of the following test items: a chip internal crack test, a limiting current test, and an AC impedance test. Accordingly, the initial limiting current plateau may refer to the limiting current range of the oxygen sensor chip as measured by the limiting current test item during the initial test; for example, the initial limiting current plateau may specifically refer to the current range of 1 mA to 2 mA.

[0049] It can be understood that, in some embodiments, the chip internal crack test item can select any existing chip crack test method, for example, using the oxygen sensor chip post-package microcrack detection device provided by CN211577037U to perform detection on the internal cracks of the oxygen sensor chip; the limiting current test item can select any existing limiting current test method for oxygen sensor chips, for example, using the oxygen sensor limiting current detection method described in CN104237338A; the AC impedance test item can also select any existing AC impedance test method for oxygen sensor chips, for example, using the method and device for testing the consistency of high-temperature ceramic oxygen sensors involved in CN118604097A, and the AC impedance value acquisition process of the high-temperature ceramic oxygen sensor.

[0050] In another specific embodiment, optionally, the aforementioned step S1 at least includes:

[0051] (1-1) Construct a first test circuit consisting of an oxygen sensor, a power supply device, and a first measuring device connected in series, connect the signal terminal PIN pin or the heater terminal PIN pin of the oxygen sensor to the power supply device, and place the oxygen sensor in a crack detection solution.

[0052] (1-2) A first preset voltage is provided to the first test circuit through a power supply device, and a loop current reading of the first measuring device under the first preset voltage is recorded. If the loop current reading remains at a preset level, it indicates that there is no crack inside the oxygen sensor chip.

[0053] The power supply device may be a voltage-stabilized power supply; the first measuring device may be any device capable of measuring current, such as a digital multimeter; and the crack detection solution may be alcohol, methanol, n-butanol, saline or other solutions.

[0054] In addition, the first preset voltage and preset level can be adaptively configured based on the model, parameters, actual test requirements, etc. of the oxygen sensor chip, and the present invention is not limited thereto. For example, the preset level can be nanoamperes. This is because when the oxygen sensor chip is crack-free, the oxygen sensor pins are characterized as being open circuited, and the current flowing through the first test loop is generally nanoamperes. However, when the oxygen sensor chip is cracked, alcohol, methanol, n-butanol, brine, or other solutions have good wettability for YSZ ceramics. When the oxygen sensor chip is immersed in alcohol, methanol, n-butanol, brine, or other solutions, the alcohol, methanol, n-butanol, brine, or other solutions fill the cracks. A significant increase in the current flowing through the first test loop can be observed on a digital multimeter, reaching microamperes or milliamperes. The change in current level can be used to determine whether a crack has occurred within the oxygen sensor chip.

[0055] In another specific embodiment, optionally, the aforementioned step S1 at least further includes:

[0056] (1-3) Construct a second test loop consisting of an oxygen sensor, a power supply device, and a second measuring device. Connect the heater pin of the oxygen sensor to the power supply device, and connect the signal pin of the oxygen sensor to the second measuring device.

[0057] The second measuring device can be any device capable of measuring the limiting current and AC impedance of the oxygen sensor chip, such as an electrochemical analyzer. For example, if the power supply is a regulated power supply, the second measuring device is an electrochemical analyzer, and the oxygen sensor is a wide-band oxygen sensor (specifically, a six-wire sensor, wherein the six-wire sensor pins may include a pump current PIN pin, a virtual ground PIN pin, a heating PIN pin, a power heating PIN pin, an adjustment resistor PIN pin, and a Nernst voltage PIN pin; the pump current PIN pin and the virtual ground PIN pin are the positive and negative poles of the aforementioned signal terminal PIN pin, and the heating PIN pin and the power heating PIN pin are the positive and negative poles of the aforementioned heater terminal PIN pin), then the regulated power supply can be connected to the heating PIN pin and the power heating PIN pin (regardless of positive or negative), and the electrochemical analyzer can be connected to the pump current PIN pin and the virtual ground PIN pin (also regardless of positive or negative). Of course, it is understood that to ensure a positive output signal from the electrochemical analyzer, the pump current PIN pin can be connected to the working electrode of the electrochemical analyzer, and the virtual ground PIN pin can be connected to the auxiliary electrode of the electrochemical analyzer.

[0058] In another specific embodiment, the signal terminal PIN pin and the heater PIN pin of the oxygen sensor can be first connected to the connector, and then the lead connected to the oxygen sensor chip heater in the connector is connected to the voltage-regulated power supply, and the lead connected to the oxygen sensor chip signal in the connector is connected to the electrochemical analyzer.

[0059] (1-4) Using a power supply device to provide a second preset voltage to the second test circuit, so that after the oxygen sensor chip is heated from an initial temperature state to an operating temperature state, the initial limiting current platform and AC impedance of the oxygen sensor chip are measured by a second measuring device.

[0060] (1-5) After confirming that there are no cracks inside the oxygen sensor chip, the initial limiting current platform exists and meets the preset conditions, and there is no sudden change in the AC impedance, the oxygen sensor chip is deemed to have passed the initial test.

[0061] Among them, the second preset voltage may refer to the normal operating voltage of the oxygen sensor chip; the initial temperature state may refer to the room temperature state; the operating temperature state may be the temperature of the instruction oxygen sensor chip reaching the operating temperature; the preset condition may refer to the initial limiting current platform being within the aforementioned current range of 1mA-2mA.

[0062] S2. Continue to perform at least one water drip test on the oxygen sensor chip based on the initial limiting current platform until the oxygen sensor chip fails any test item in any water drip test. Then, stop the test and obtain the liquid drip resistance of the oxygen sensor chip.

[0063] There may be multiple test items for the drip test; in another specific embodiment, optionally, the drip test includes at least one of the following test items: a chip internal crack test item, a limiting current test item, and an AC impedance test item.

[0064] In another specific embodiment, optionally, the aforementioned step S2 at least includes:

[0065] (2-1) Connect the heater pin of the oxygen sensor to the power supply device, and use the power supply device to provide the oxygen sensor with an operating voltage so that the oxygen sensor chip is heated from the initial temperature state to the operating temperature state.

[0066] (2-2) A preset volume of dripping liquid is extracted one by one through a pipetting device, and the dripping liquid is dripped into the preset position of the oxygen sensor at one time until the dripping number reaches the preset number, and a dripping test is performed.

[0067] Among them, the pipetting device can be any automated dripping device; the preset volume can be, for example, 10 μL; if the side of the oxygen sensor with the air inlet hole is set as the front of the chip, the preset position can be the front, back or side of the chip; the preset number of times can be 10 times.

[0068] In another specific embodiment, optionally, during any dripping test, the time interval between two adjacent dripping of liquid is not less than a preset time threshold (the preset time threshold can be adaptively selected according to actual test needs, for example, it can be 10s), so that the oxygen sensor chip remains dry before the next dripping of liquid.

[0069] In another specific embodiment, optionally, the dripping liquid involved in the dripping test is at least one of water, an aqueous solution containing carbonate ions, and an aqueous solution containing nitrate ions.

[0070] (2-3) After the drip test is completed, a first test circuit is constructed consisting of an oxygen sensor, a power supply device, and a first measuring device connected in series. The signal terminal PIN pin or the heater terminal PIN pin of the oxygen sensor is connected to the power supply device, and the oxygen sensor is placed in the crack detection solution.

[0071] (2-4) A first preset voltage is provided to the first test circuit through a power supply device, and a loop current reading of the first measuring device at the first preset voltage is recorded. If the loop current reading remains at a preset level, it indicates that there is no crack inside the oxygen sensor chip.

[0072] (2-5) Continue to construct the second test circuit consisting of the oxygen sensor, power supply device and second measuring device, connect the heater end PIN pin of the oxygen sensor to the power supply device, and connect the signal end PIN pin of the oxygen sensor to the second measuring device.

[0073] (2-6) Using a power supply device to provide a second preset voltage to the second test circuit, so that after the oxygen sensor chip is heated from the initial temperature state to the operating temperature state, the second measuring device is used to measure the current limiting current platform and the current AC impedance of the oxygen sensor chip.

[0074] (2-7) After confirming that there are no cracks inside the oxygen sensor chip, that the current limiting platform exists and the increase compared to the initial current limiting platform is not greater than the preset increase, and that there is no sudden change in the AC impedance, the oxygen sensor chip is deemed to have passed the water drip test.

[0075] The preset increase may be, but is not limited to, 35%.

[0076] (2-8) The dripping liquid volume extracted by the pipetting device is changed and the above dripping test and test item steps are repeated until the oxygen sensor chip fails any test item in any dripping test. The test is stopped and the dripping liquid resistance of the oxygen sensor chip is obtained.

[0077] If a crack is found inside the oxygen sensor chip during a water drop test, the oxygen sensor is considered "scrapped" after that test. The oxygen sensor chip's liquid drop resistance can be calculated as the product of the preset volume for that test and the number of drops applied during that test. Alternatively, the oxygen sensor chip's liquid drop resistance can be calculated as the product of the preset volume for the previous test and the number of drops applied during the previous test. It should be understood that the liquid drop resistance of different surfaces varies depending on the chip structure, generally with the back surface > front surface > side surfaces.

[0078] Based on the above initial test and drip test steps, the inventors selected an oxygen sensor installed on a FAW vehicle for verification testing. The test process and results are as follows:

[0079] 1. Perform internal crack detection, limiting current test and AC impedance test on the initial chip.

[0080] A. Internal Crack Detection: Use a regulated power supply to apply 20V to the oxygen sensor's heater pin. Connect a digital multimeter in series with the circuit. Immerse the oxygen sensor chip in a 95% alcohol solution and record the digital multimeter reading as I1. The results are shown in Table 1. Table 1 indicates that the oxygen sensor chip has no cracks and can proceed to the next test.

[0081] Table 1

[0082]

[0083] B. Limiting current test: Connect the chip to a regulated power supply and an electrochemical analyzer respectively. Turn on the regulated power supply and the electrochemical analyzer. Set the chip operating voltage to 9V on the regulated power supply. Heat the chip from room temperature to the chip operating temperature. Test the chip head temperature at 750°C. Turn on the electrochemical analyzer and set the scan range to 0-1500mV. Measure the limiting current of the chip in air. When a platform appears, record the platform current as 1.55mA.

[0084] C. AC impedance test: Maintain the connections in B, heat the chip from room temperature to the operating temperature, and measure the AC impedance. The results are shown in Table 2.

[0085] Table 2

[0086]

[0087] 2. Water drip test

[0088] After passing the initial test, perform the drip test.

[0089] Keep the connections in B, turn on the regulated power supply and electrochemical analyzer, set the normal operating voltage of the chip on the regulated power supply, and heat it from room temperature to the operating temperature until it reaches 750°C.

[0090] Take 10 μL of water with a pipette, place the nozzle vertically at the heating center of the chip head, and keep the nozzle 0.5 cm away. Drip quickly from the front of the chip at one time to ensure that the water droplets touch the chip vertically.

[0091] After 10 μL was added dropwise 10 times, the test results are shown in Table 3.

[0092] Table 3

[0093]

[0094] According to Table 3, the drip test has passed. Increase the dripping amount and continue the dripping test.

[0095] Pipette 20 μL of water and add dropwise 10 times according to the same procedure.

[0096] The test results are shown in Table 4.

[0097] Table 4

[0098]

[0099] According to Table 4, there are cracks inside the chip and the air inlet is cracked. At this time, the liquid resistance value is 10μL.

[0100] The technical solution provided in this embodiment performs an initial test on an oxygen sensor chip to obtain at least an initial limiting current plateau after the oxygen sensor chip passes the initial test. Furthermore, the oxygen sensor chip is subjected to at least one water drop test based on the initial limiting current plateau until the oxygen sensor chip fails any test item in any of the water drop tests. The test is then terminated and the oxygen sensor chip's liquid drop resistance is determined. Therefore, this embodiment essentially provides a novel thermal shock testing method, distinct from the existing method of heating and maintaining the chip in a furnace, followed by rapid water quenching and rapid cooling. By using the water drop test, the drip volume (for example, with microliter-level accuracy) and the chip's dripping location can be controlled, thereby reducing the risk of human influence on the reliability test results of the oxygen sensor chip and improving test repeatability. Furthermore, based on the water drop test results, this embodiment determines the liquid drop resistance of the oxygen sensor chip. This liquid drop resistance can be used to quantitatively characterize reliability indicators such as the oxygen sensor chip's thermal shock resistance, enabling quantitative reliability analysis of the oxygen sensor chip and achieving high test accuracy.

[0101] Figure 2 This is a schematic diagram of the structure of a reliability detection device for an oxygen sensor chip provided by an embodiment of the present invention. This embodiment is applicable to oxygen sensor performance detection scenarios of various vehicles, such as fuel vehicles, hybrid vehicles, plug-in hybrid vehicles, etc. The reliability detection device for the oxygen sensor chip can be implemented in software and / or hardware. Figure 2 As shown, the reliability detection device of the oxygen sensor chip at least includes:

[0102] An initial test module 110 is configured to perform an initial test on the oxygen sensor chip, so as to obtain at least an initial limiting current platform of the oxygen sensor chip after the oxygen sensor chip passes the initial test;

[0103] The water dripping test module 120 is configured to continue performing at least one water dripping test on the oxygen sensor chip according to the initial limiting current platform until the oxygen sensor chip fails any test item in any water dripping test, then stop the test and obtain the liquid resistance of the oxygen sensor chip.

[0104] Optionally, the initial test and drip test include at least one of the following test items:

[0105] Chip internal crack test items, limiting current test items and AC impedance test items.

[0106] Optionally, the initial testing module 110 is specifically configured to:

[0107] Construct a first test loop consisting of an oxygen sensor, a power supply device, and a first measuring device connected in series, connect the signal terminal PIN pin or the heater terminal PIN pin of the oxygen sensor to the power supply device, and place the oxygen sensor in a crack detection solution;

[0108] A first preset voltage is provided to the first test circuit through the power supply device, and a loop current reading of the first measuring device under the first preset voltage is recorded. If the loop current reading remains at a preset level, it indicates that there is no crack inside the oxygen sensor chip.

[0109] Optionally, the initial testing module 110 is further configured to:

[0110] Construct a second test loop consisting of an oxygen sensor, a power supply, and a second measuring device. Connect the heater pin of the oxygen sensor to the power supply, and connect the signal pin of the oxygen sensor to the second measuring device.

[0111] Using a power supply device to provide a second preset voltage to the second test circuit, so that after the oxygen sensor chip is heated from an initial temperature state to an operating temperature state, an initial limiting current platform and AC impedance of the oxygen sensor chip are measured by a second measuring device;

[0112] After confirming that there are no cracks inside the oxygen sensor chip, the initial limiting current platform exists and meets the preset conditions, and there is no sudden change in the AC impedance, the oxygen sensor chip is deemed to have passed the initial test.

[0113] Optionally, the drip test module 120 is specifically used to:

[0114] Connect the heater pin of the oxygen sensor to the power supply device, and use the power supply device to provide the oxygen sensor with a working voltage to heat the oxygen sensor chip from the initial temperature state to the working temperature state;

[0115] A preset volume of dripping liquid is extracted one by one through the pipetting device, and the dripping liquid is dripped into the preset position of the oxygen sensor at one time until the dripping number reaches the preset number, and then a dripping test is performed;

[0116] After the drip test is completed, a first test loop is constructed consisting of the oxygen sensor, the power supply device, and the first measuring device connected in series. The signal terminal PIN pin or the heater terminal PIN pin of the oxygen sensor is connected to the power supply device, and the oxygen sensor is placed in the crack detection solution.

[0117] supplying a first preset voltage to the first test circuit through the power supply device, and recording a loop current reading of the first measuring device at the first preset voltage. If the loop current reading remains at a preset level, it indicates that there is no crack inside the oxygen sensor chip.

[0118] Continue to build a second test loop consisting of the oxygen sensor, power supply, and second measuring device. Connect the heater pin of the oxygen sensor to the power supply, and connect the signal pin of the oxygen sensor to the second measuring device.

[0119] Using a power supply device to provide a second preset voltage to the second test circuit, so that after the oxygen sensor chip is heated from an initial temperature state to an operating temperature state, a second measuring device is used to measure and obtain a current limiting platform and an AC impedance of the oxygen sensor chip;

[0120] After confirming that there are no cracks inside the oxygen sensor chip, that the secondary limiting current platform exists and the increase compared to the initial limiting current platform is not greater than the preset increase, and that there is no sudden change in the AC impedance, the oxygen sensor chip is deemed to have passed the water drip test.

[0121] The dripping liquid volume extracted by the pipetting device is changed and the above dripping test and test item steps are repeated until the oxygen sensor chip fails any test item in any dripping test. The test is stopped and the dripping liquid resistance of the oxygen sensor chip is obtained.

[0122] Optionally, during any dripping test, the time interval between two adjacent dripping operations is not less than a preset time threshold, so that the oxygen sensor chip remains dry before the next dripping operation.

[0123] Optionally, the dripping liquid involved in the dripping test is at least one of water, an aqueous solution containing carbonate ions, and an aqueous solution containing nitrate ions.

[0124] The technical solution provided in this embodiment uses an initial test module to perform an initial test on the oxygen sensor chip. After the oxygen sensor chip passes the initial test, at least an initial limiting current plateau is obtained for the oxygen sensor chip. Furthermore, the water drip test module continues to perform at least one water drip test on the oxygen sensor chip based on the initial limiting current plateau until the oxygen sensor chip fails any test item in any of the water drip tests. The test is then terminated and the oxygen sensor chip's liquid drop resistance is determined. Therefore, this embodiment essentially provides a novel thermal shock testing method, distinct from the existing method of heating and maintaining the chip in a furnace, followed by rapid water quenching and rapid cooling. By using the water drip test, the water drop volume and chip drop location can be controlled, reducing the degree of human influence on the reliability test results of the oxygen sensor chip and improving the repeatability of the test. Furthermore, based on the water drip test results, this embodiment determines the liquid drop resistance of the oxygen sensor chip. This liquid drop resistance can be used to quantitatively represent reliability indicators such as the oxygen sensor chip's thermal shock resistance, thus enabling quantitative reliability analysis of the oxygen sensor chip and achieving high test accuracy.

[0125] This embodiment provides an electronic device, Figure 3This is a schematic diagram of the structure of an electronic device provided by an embodiment of the present invention. Figure 3 Electronic device 1000 includes a processor 1001 and a memory 1002. Memory 1002 stores computer-readable instructions. When executed by processor 1001, the computer-readable instructions execute the steps of any of the above-described oxygen sensor chip reliability testing methods. According to the above technical solution, processor 1001 and memory 1002 are interconnected and communicate with each other via a communication bus and / or other connection mechanism (not shown). Memory 1002 stores a computer program executable by the processor. When electronic device 1000 is in operation, processor 1001 executes the computer program to perform the oxygen sensor chip reliability testing method of any of the optional implementations of the above-described embodiments, thereby achieving at least the following functions: performing an initial test on the oxygen sensor chip to obtain at least an initial limiting current plateau of the oxygen sensor chip after the oxygen sensor chip passes the initial test; and continuing to perform at least one water drip test on the oxygen sensor chip based on the initial limiting current plateau until the oxygen sensor chip fails any test item in any of the water drip tests, at which point the test is terminated and the liquid drip resistance of the oxygen sensor chip is obtained.

[0126] This embodiment provides a computer-readable storage medium having a computer program stored thereon. When executed by a processor, the program implements the reliability testing method for an oxygen sensor chip as provided in all the inventive embodiments of this application: performing an initial test on the oxygen sensor chip to obtain at least an initial limiting current plateau of the oxygen sensor chip after the oxygen sensor chip passes the initial test; continuing to perform at least one water drip test on the oxygen sensor chip based on the initial limiting current plateau until the oxygen sensor chip fails any test item in any water drip test, then stopping the test and obtaining the liquid drip resistance of the oxygen sensor chip.

[0127] Any combination of one or more computer-readable media may be employed. A computer-readable medium may be a computer-readable signal medium or a computer-readable storage medium. A computer-readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples (a non-exhaustive list) of computer-readable storage media include: an electrical connection having one or more conductors, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination thereof. In this document, a computer-readable storage medium may be any tangible medium containing or storing a program that may be used by or in conjunction with an instruction execution system, apparatus, or device.

[0128] A computer-readable signal medium may include a data signal propagated in baseband or as part of a carrier wave, which carries computer-readable program code. Such a propagated data signal may take a variety of forms, including, but not limited to, electromagnetic signals, optical signals, or any suitable combination thereof. A computer-readable signal medium may also be any computer-readable medium other than a computer-readable storage medium that can transmit, propagate, or transport a program for use by or in conjunction with an instruction execution system, apparatus, or device.

[0129] Program code embodied on a computer readable medium may be transmitted using any appropriate medium, including but not limited to wireless, wireline, optical fiber cable, RF, etc., or any suitable combination of the foregoing.

[0130] Computer program code for performing the operations of the present invention may be written in one or more programming languages, or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, and C++, as well as conventional procedural programming languages ​​such as "C" or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as a stand-alone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0131] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A reliability detection method for an oxygen sensor chip, characterized in that: At least: performing an initial test on the oxygen sensor chip to obtain at least an initial limiting current platform of the oxygen sensor chip after the oxygen sensor chip passes the initial test; The oxygen sensor chip is continuously subjected to at least one water drip test according to the initial limiting current platform until the oxygen sensor chip fails any test item in any of the water drip tests. The test is then stopped and the liquid resistance of the oxygen sensor chip is obtained.

2. The reliability detection method of the oxygen sensor chip according to claim 1, characterized in that: The initial test and the drip test include at least one of the following test items: Chip internal crack test items, limiting current test items and AC impedance test items.

3. The reliability detection method of the oxygen sensor chip according to claim 1 or 2, characterized in that: The performing of an initial test on the oxygen sensor chip to obtain at least an initial limiting current platform of the oxygen sensor chip after the oxygen sensor chip passes the initial test comprises at least: Constructing a first test loop consisting of an oxygen sensor, a power supply device, and a first measuring device connected in series, connecting the signal terminal PIN pin or the heater terminal PIN pin of the oxygen sensor to the power supply device, and placing the oxygen sensor in a crack detection solution; A first preset voltage is provided to the first test circuit through the power supply device, and a loop current reading of the first measuring device under the first preset voltage is recorded. If the loop current reading remains at a preset level, it indicates that there is no crack inside the oxygen sensor chip.

4. The reliability detection method of the oxygen sensor chip according to claim 3, characterized in that: The performing of an initial test on the oxygen sensor chip to obtain at least an initial limiting current platform of the oxygen sensor chip after the oxygen sensor chip passes the initial test further comprises: Constructing a second test loop consisting of the oxygen sensor, the power supply device, and a second measuring device, connecting the heater end PIN pin of the oxygen sensor to the power supply device, and connecting the signal end PIN pin of the oxygen sensor to the second measuring device; Using the power supply device to provide a second preset voltage to the second test circuit, so that after the oxygen sensor chip is heated from an initial temperature state to an operating temperature state, the initial limiting current platform and AC impedance of the oxygen sensor chip are measured by the second measuring device; After determining that there are no cracks inside the oxygen sensor chip, the initial limiting current platform exists and meets preset conditions, and the AC impedance has no sudden change, the oxygen sensor chip is deemed to have passed the initial test.

5. The reliability detection method of the oxygen sensor chip according to claim 1 or 2, characterized in that: The step of continuing to perform the water drip test on the oxygen sensor chip at least once based on the initial limiting current platform until the oxygen sensor chip fails any test item in any of the water drip tests, stopping the test and obtaining the liquid resistance of the oxygen sensor chip, at least includes: Connecting the heater end PIN pin of the oxygen sensor to a power supply device, and using the power supply device to provide an operating voltage to the oxygen sensor, so as to heat the oxygen sensor chip from an initial temperature state to an operating temperature state; A preset volume of dripping liquid is extracted one by one by a pipetting device, and the dripping liquid is dripped into a preset position of the oxygen sensor at one time until the dripping liquid is dripped a preset number of times, thus performing a dripping test; After the drip test is completed, a first test loop is constructed by connecting the oxygen sensor, the power supply device, and the first measuring device in series, connecting the signal terminal PIN pin or the heater terminal PIN pin of the oxygen sensor to the power supply device, and placing the oxygen sensor in the crack detection solution; providing a first preset voltage to the first test circuit through the power supply device, and recording a loop current reading of the first measuring device at the first preset voltage, wherein if the loop current reading remains at a preset level, it indicates that there is no crack inside the oxygen sensor chip; Continue to build a second test loop consisting of the oxygen sensor, the power supply device, and the second measuring device, connect the heater end PIN pin of the oxygen sensor to the power supply device, and connect the signal end PIN pin of the oxygen sensor to the second measuring device; Using the power supply device to provide a second preset voltage to the second test circuit, so that after the oxygen sensor chip is heated from the initial temperature state to the operating temperature state, the second measuring device is used to measure and obtain the current limiting current platform and the current AC impedance of the oxygen sensor chip; After determining that there are no cracks inside the oxygen sensor chip, the current limiting current platform exists and the increase compared to the initial limiting current platform is not greater than a preset increase, and the current AC impedance has no sudden change, the oxygen sensor chip is deemed to have passed the current water drip test; The dripping liquid volume extracted by the pipetting device is changed and the dripping test and test item steps are repeated until the oxygen sensor chip fails any test item in any of the dripping tests. The test is stopped and the dripping liquid resistance of the oxygen sensor chip is obtained.

6. The reliability detection method of the oxygen sensor chip according to claim 5, characterized in that: During any dripping test, the time interval between two adjacent dripping of liquid is not less than a preset time threshold, so that the oxygen sensor chip remains dry before the next dripping of liquid.

7. The reliability detection method of the oxygen sensor chip according to claim 1, characterized in that: The dripping liquid involved in the dripping test is at least one of water, an aqueous solution containing carbonate ions, and an aqueous solution containing nitrate ions.

8. A reliability detection device for an oxygen sensor chip, characterized in that: At least: an initial testing module, configured to perform an initial test on the oxygen sensor chip, so as to obtain at least an initial limiting current platform of the oxygen sensor chip after the oxygen sensor chip passes the initial test; The water dripping test module is configured to continue performing at least one water dripping test on the oxygen sensor chip based on the initial limiting current platform until the oxygen sensor chip fails any test item in any of the water dripping tests, stop the test, and obtain the liquid resistance of the oxygen sensor chip.

9. An electronic device comprising a memory and a processor, wherein the memory stores a computer program that can be run on the processor, wherein: When the processor executes the program, the steps of the reliability detection method of the oxygen sensor chip according to any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the reliability detection method of the oxygen sensor chip according to any one of claims 1 to 7 are implemented.

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