Board card test method and system, industrial personal computer and test case
By simulating sensors to provide test data for the maglev train main control board and comparing the consistency of actual feedback with expected feedback, the problem of main control board data analysis failure was solved, ensuring the safe operation of the maglev train.
Patent Information
- Application Number
- CN202511006568.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-21
- Publication Date
- 2025-09-23
AI Technical Summary
The main control board of a maglev train malfunctions during data analysis, resulting in untimely maintenance and potentially even safety issues. Existing technology makes it difficult to effectively test the data processing capabilities of the main control board.
By simulating sensors to provide test data for the board under test, actual feedback data and expected feedback data are generated, and the consistency between the two is compared to determine whether the board under test can accurately process the test data. This includes testing of the test function, self-test function, voltage conversion function, and data storage function.
Ensure that the board under test can perform data analysis normally, avoid safety hazards during the operation of the maglev train, and achieve accurate testing of the board functions.
Smart Images
Figure CN120686064A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of fault testing, and in particular to a board testing method, system, industrial control computer and testing chassis. Background Art
[0002] When a maglev train is running on track, different sensors are needed to collect different data of the maglev train's operation, and the corresponding main control board will perform data analysis and determine whether the maglev train is operating normally based on the analysis results. Therefore, whether the main control board can perform data analysis normally is related to whether the maglev train can operate safely. If a maglev train fails during operation and the main control board cannot analyze the data normally and obtains incorrect analysis results, it will lead to the inability to maintain the maglev train in time, and may even cause major safety problems. Summary of the Invention
[0003] The purpose of the present invention is to provide a board testing method, system, industrial computer and test chassis, in which a simulation sensor provides the test data required for the test function of the board under test, so as to determine whether the board under test can accurately process the corresponding test data based on the consistency between the actual feedback data generated by the board under test and the expected feedback data, and then determine whether the test function of the board under test is normal, thereby realizing the test of whether the board under test can perform data analysis normally.
[0004] To solve the above technical problems, the present invention provides a board testing method, comprising:
[0005] Determine the operating voltage of the board under test and supply power to the board under test;
[0006] Determining the test function of the board under test, and generating corresponding test data and expected feedback data based on the test function of the board under test;
[0007] Sending the test data to the board under test so that the board under test processes the test data;
[0008] Acquiring actual feedback data generated after the board under test processes the test data;
[0009] If the actual feedback data is consistent with the expected feedback data, it is determined that the board under test meets the preset functional requirements.
[0010] Preferably, after determining the operating voltage of the board under test and supplying power to the board under test, the method further includes:
[0011] Acquiring actual self-test data of the board under test;
[0012] Comparing the actual self-test data with the target self-test data;
[0013] If the actual self-test data is consistent with the target self-test data, it is determined that the self-test function of the tested board meets the preset self-test requirements.
[0014] Preferably, after determining the operating voltage of the board under test and supplying power to the board under test, the method further includes:
[0015] Obtaining the actual voltage of each target potential point of the board under test;
[0016] Comparing the actual voltage of each target potential point with the expected voltage of each target potential point one by one;
[0017] If the actual voltages at the target potential points are consistent with the expected voltages at the target potential points, it is determined that the voltage conversion function of the board under test meets the preset voltage conversion requirements.
[0018] Preferably, after determining the operating voltage of the board under test and supplying power to the board under test, the method further includes:
[0019] Sending a target address data read instruction to the board under test;
[0020] If the target data fed back by the board under test based on the target address data read instruction is received, it is determined that the data storage function of the board under test meets the preset storage function requirement.
[0021] Preferably, determining the test function of the board under test and generating corresponding test data and expected feedback data based on the test function of the board under test includes:
[0022] Determining a test function of the board under test, wherein the test function includes one or more combinations of a temperature detection function, an acceleration detection function, a speed detection function, and a gap detection function;
[0023] Generate a plurality of temperature values to be measured corresponding to the temperature detection function, and / or acceleration values to be measured corresponding to the acceleration detection function, and / or speed values to be measured corresponding to the speed detection function, and / or gap values to be measured corresponding to the gap detection function, and generate a temperature analog voltage corresponding to each of the temperature values to be measured, and / or an acceleration analog voltage corresponding to each of the acceleration values to be measured, and / or a speed analog voltage corresponding to each of the speed values to be measured, and / or a gap analog voltage corresponding to each of the gap values to be measured;
[0024] The method includes sending the test data to the board under test so that the board under test processes the test data, including:
[0025] Sending each of the temperature analog voltages, and / or each of the acceleration analog voltages, and / or each of the velocity analog voltages, and / or each of the gap analog voltages to the board under test, respectively, so that the board under test processes each of the temperature analog voltages, and / or each of the acceleration analog voltages, and / or each of the velocity analog voltages, and / or each of the gap analog voltages, respectively, and generates an actual temperature value corresponding to each of the temperature analog voltages, and / or an actual acceleration value corresponding to each of the acceleration analog voltages, and / or an actual velocity value corresponding to each of the velocity analog voltages, and / or an actual gap value corresponding to each of the gap analog voltages;
[0026] Acquiring actual feedback data generated after the board under test processes the test data, including:
[0027] Obtaining an actual temperature value corresponding to each of the temperature simulation voltages generated by the tested board, and / or an actual acceleration value corresponding to each of the acceleration simulation voltages, and / or an actual speed value corresponding to each of the speed simulation voltages, and / or an actual gap value corresponding to each of the gap simulation voltages;
[0028] If the actual feedback data is consistent with the expected feedback data, determining that the board under test meets the preset functional requirements includes:
[0029] If each of the actual temperature values is consistent with each of the temperature values to be measured, it is determined that the temperature detection function of the board under test meets the preset temperature detection requirements; if each of the actual acceleration values is consistent with each of the acceleration values to be measured, it is determined that the acceleration detection function of the board under test meets the preset acceleration detection requirements; if each of the actual speed values is consistent with each of the speed values to be measured, it is determined that the speed detection function of the board under test meets the preset speed detection requirements; if each of the actual gap values is consistent with each of the gap values to be measured, it is determined that the gap detection function of the board under test meets the preset gap detection requirements.
[0030] Preferably, generating a plurality of temperature values to be measured and generating a temperature simulation voltage corresponding to each of the temperature values to be measured comprises:
[0031] Generate a plurality of temperature values to be measured, and determine the actual resistance value of the thermistor when operating at each of the temperature values to be measured;
[0032] Determine a plurality of simulated resistors, wherein the resistance value of each simulated resistor is respectively the actual resistance value;
[0033] The analog resistors are controlled to be connected to the board under test in sequence, so that the board under test collects the temperature analog voltage at both ends of the analog resistors.
[0034] Preferably, before sending each of the speed simulation voltages and each of the gap simulation voltages to the board under test, the method further includes:
[0035] Determining the crystal oscillator frequency parameters of the board under test based on the model of the board under test;
[0036] selecting a target coil having a targeted impedance in a noise frequency band based on the crystal oscillator frequency parameter;
[0037] Sending each of the speed simulation voltages and each of the gap simulation voltages to the board under test respectively includes:
[0038] Each of the speed simulation voltages and each of the gap simulation voltages are filtered by the target coil and then transmitted to the board under test;
[0039] Obtaining the actual speed value corresponding to each of the speed simulation voltages and the actual gap value corresponding to each of the gap simulation voltages generated by the board under test, including:
[0040] The actual speed value corresponding to each of the speed simulation voltages and the actual gap value corresponding to each of the gap simulation voltages generated by the board under test are received through the target coil.
[0041] In order to solve the above technical problems, the present invention provides a board test system, comprising:
[0042] A first determining unit, configured to determine an operating voltage of a board under test and to supply power to the board under test;
[0043] a second determining unit, configured to determine a test function of the board under test, and generate corresponding test data and expected feedback data based on the test function of the board under test;
[0044] a data sending unit, configured to send the test data to the board under test, so that the board under test processes the test data;
[0045] An acquisition unit, configured to acquire actual feedback data generated after the board under test processes the test data;
[0046] The third determining unit is configured to determine that the board under test meets preset functional requirements if the actual feedback data is consistent with the expected feedback data.
[0047] In order to solve the above technical problems, the present invention provides an industrial computer, comprising:
[0048] Memory for storing computer programs;
[0049] The processor is used to implement the steps of the board test method as described above when executing the computer program.
[0050] In order to solve the above technical problems, the present invention provides a board test chassis, comprising the industrial computer as described above, and further comprising:
[0051] The interface board connected to the industrial computer is used to provide a data transmission channel between the industrial computer and the board under test.
[0052] The present application provides a board test method, system, industrial computer and test chassis, which determine the test function of the board under test after the board under test is powered on, and generate corresponding test data and expected feedback data based on the test function of the board under test, so that after the test data is sent to the board under test so that the board under test processes the test data, the actual feedback data generated by the board under test after the test data processing is obtained. If the actual feedback data is consistent with the expected feedback data, it is determined that the board under test meets the preset functional requirements. It can be seen that in this application, the analog sensor provides the test data required for the test function of the board under test, so as to determine whether the board under test can accurately process the corresponding test data based on the consistency between the actual feedback data generated by the board under test and the expected feedback data, and then determine whether the test function of the board under test is normal, thereby realizing the test of whether the board under test can perform data analysis normally. BRIEF DESCRIPTION OF THE DRAWINGS
[0053] In order to more clearly illustrate the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.
[0054] Figure 1 A schematic diagram of a process flow of a board test method provided in this application;
[0055] Figure 2 A schematic diagram of the structure of a board test system provided in this application;
[0056] Figure 3 A schematic diagram of the structure of an industrial computer provided in this application;
[0057] Figure 4 A schematic diagram of the structure of a board test chassis provided in this application;
[0058] Figure 5 A schematic diagram of the structure of the computer-readable storage medium provided in this application. DETAILED DESCRIPTION
[0059] The core of the present invention is to provide a board testing method, system, industrial computer and test chassis, in which the analog sensor provides the test data required for the test function of the board under test, so as to determine whether the board under test can accurately process the corresponding test data based on the consistency between the actual feedback data generated by the board under test and the expected feedback data, and then determine whether the test function of the board under test is normal, thereby realizing the test of whether the board under test can perform data analysis normally.
[0060] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.
[0061] Please refer to Figure 1 , Figure 1 A schematic diagram of a board test method provided in this application includes:
[0062] S11: Determine the operating voltage of the board under test and supply power to the board under test;
[0063] The current method for collecting and processing various parameters during maglev train operation involves using different sensors to collect and transmit data to the main control board. The main control board then processes the sensor data to determine whether the maglev train is operating normally. However, since abnormal operation of a maglev train can have irreversible consequences, the main control board's ability to process data properly is crucial for timely identification and maintenance of any abnormalities. Therefore, before the main control board is put into operation, it is necessary to test its ability to perform data detection properly.
[0064] Specifically, the main control board is the board under test during the test. In this embodiment, the operating voltage of the board under test is first determined, and power is supplied to the board under test. If the operating voltage of the board under test is 24V, 24V DC power can be output to the board under test to power on the board under test, so that the board under test can process data.
[0065] S12: Determine the test function of the board under test, and generate corresponding test data and expected feedback data based on the test function of the board under test;
[0066] After the board under test is powered on, the test function of the board under test is determined, and corresponding test data is generated for the test function of the board under test. That is, it is determined which sensor data transmitted by the board under test will be processed after it is put into use, and then the sensor is simulated to output corresponding test data. Since the data output by the sensor in the actual scenario is usually analog data, the board under test will convert the analog data into digital data after receiving the data output by the sensor. Then the test data is also unprocessed analog data, and expected feedback data corresponding to the test data is generated. That is, test data corresponding to the test function and expected feedback data corresponding to the test data are generated in advance, so as to determine whether the board under test can perform data processing normally based on this.
[0067] S13: Sending the test data to the board under test so that the board under test processes the test data;
[0068] The analog sensor sends test data to the board under test so that the board under test processes the test data, such as converting analog test data into digital test data. During this process, it may be subject to interference such as electromagnetic interference. If the test board can still convert the test data normally, the test function of the test board is normal.
[0069] S14: Acquire actual feedback data generated after the board under test processes the test data;
[0070] After receiving the test data, the board under test follows the same data processing process as when it receives the data output by the sensor, generating actual feedback data corresponding to the test data. For example, after processing the data collected by the sensor during the operation of the maglev train, it can directly reflect the data of the operation process of the maglev train.
[0071] S15: If the actual feedback data is consistent with the expected feedback data, it is determined that the board under test meets the preset functional requirements.
[0072] Since the expected feedback data corresponding to the test data has been generated in advance, that is, the expected feedback data is accurate data, then if the actual feedback data output by the board under test is consistent with the expected feedback data, it can be determined that the board under test can process the test data normally and generate accurate actual feedback data, which means that the test function of the board under test meets the preset functional requirements.
[0073] It should be noted that different test functions correspond to different test data, so the corresponding expected feedback data are different. If the actual feedback data generated by the board under test based on the test data corresponding to a certain test function is consistent with the expected feedback data, it can be determined that the test function meets the preset functional requirements. When all the test functions of the board under test meet the preset functional requirements, it can be determined that the entire board under test meets the preset functional requirements, that is, the board under test can be put into practical application and can accurately determine whether the maglev train is operating normally.
[0074] In summary, the analog sensor in this application provides the test data required for the test function of the board under test, so as to determine whether the board under test can accurately process the corresponding test data based on the consistency between the actual feedback data generated by the board under test and the expected feedback data, and then determine whether the test function of the board under test is normal, thereby realizing the test of whether the board under test can perform data analysis normally.
[0075] Based on the above embodiment:
[0076] As a preferred embodiment, after determining the operating voltage of the board under test and supplying power to the board under test, the method further includes:
[0077] Get the actual self-test data of the tested board;
[0078] Compare the actual self-test data with the target self-test data;
[0079] If the actual self-test data is consistent with the target self-test data, it is determined that the self-test function of the board under test meets the preset self-test requirements.
[0080] After the board under test is powered on, it usually performs a self-test. If the self-test result of the board under test is abnormal, it will also affect the accuracy of the data processing of the board under test. Therefore, in this application, the actual self-test data of the board under test is obtained after the board under test is powered on for self-test, and in this application, the target self-test data has been determined before the board under test is powered on for self-test. After comparing the actual self-test data of the board under test with the target self-test data, if the actual self-test data and the target self-test data are consistent, it can be determined that the self-test function of the board under test meets the preset self-test requirements, that is, the board under test can work normally, and it can be further determined whether the board under test can process data normally.
[0081] Specifically, during the self-test of the board under test, the test is to check whether the power supply voltage is within the normal range. If the power supply voltage exceeds the normal range, the board under test may not work properly or may be damaged. The test is to check whether the power module in the board under test can output current stably. By detecting the ripple and noise of the power module, it is ensured that the power quality meets the requirements. The test is to check whether the various interfaces on the board under test can communicate normally. For example, for the USB (Universal Serial Bus) interface, the self-test will try to send and receive data through the USB bus to detect whether the interface can correctly identify the peripheral device and establish a connection. The test is also to check the RAM (Random Access Memory) on the board under test. Read and write tests are typically performed on random access memory (RAM). This typically uses a "write-read" verification method, where a specific data pattern is first written to the RAM, then read out and verify that the data is consistent with the written data. For example, different values are written to different addresses in the RAM, then read and compared. If the data is consistent, the RAM's read and write functions are functioning properly. The memory capacity is checked to see if it matches the nominal value, and the correct capacity is verified by testing the memory's address space. Furthermore, processor and software functionality tests are performed, such as checking whether the processor on the board under test can boot and run normally. For example, for embedded processors, a self-test will check whether its clock signal is normal, whether instructions can be executed correctly, and processor performance indicators such as computing speed and instruction set support. The test also checks whether the firmware on the board under test (such as the BIOS (Basic Input Output System) and U-boot) is loaded correctly, and whether the driver for the board under test has been correctly installed. If a fault is detected during the self-test, the self-test program will issue an alarm signal, such as an audible buzzer or a flashing indicator light to notify the user of the board fault.
[0082] Based on this, the tested board generates a self-test report including actual self-test data after self-test. On the one hand, it can be displayed on the display screen, and on the other hand, it is convenient for this application to determine whether the self-test function of this board meets the preset self-test requirements.
[0083] As a preferred embodiment, after determining the operating voltage of the board under test and supplying power to the board under test, the method further includes:
[0084] Obtain the actual voltage of each target potential point of the board under test;
[0085] Compare the actual voltage of each target potential point with the expected voltage of each target potential point one by one;
[0086] If the actual voltages at the respective target potential points are consistent with the expected voltages at the respective target potential points, it is determined that the voltage conversion function of the board under test meets the preset voltage conversion requirements.
[0087] In this embodiment, after the board under test is powered on, the supply voltage will be converted into the operating voltage required by different modules. For example, if the supply voltage of the board under test is 24V, the voltage required by the storage unit is 3.3V, and the voltage required by the processor is 5V, the voltage conversion module in the board under test will convert the 24V voltage into 3.3V and 5V voltage respectively to power different modules.
[0088] In order to determine whether the different modules in the tested board can be powered on and work normally after the tested board is powered on, this embodiment also obtains the actual voltage of each target potential point, and determines whether the voltage of each target potential point meets the requirements based on the consistency between the actual voltage of each potential point and the expected voltage, that is, whether each module can be powered on and work normally.
[0089] Specifically, if the actual voltages of the 5V potential point and the 3.3V potential point are tested, if the actual voltage of the 5V potential point is 5V, the actual voltage is consistent with the expected voltage of 5V, and the 5V potential point is normal; if the actual voltage of the 3.3V potential point is 2V, the actual voltage is inconsistent with the expected voltage of 3.3V, and the 3.3V potential point is abnormal, and needs to be tested and maintained to ensure that each module in the tested board can work normally.
[0090] As a preferred embodiment, after determining the operating voltage of the board under test and supplying power to the board under test, the method further includes:
[0091] Send the target address data read instruction to the board under test;
[0092] If the target data fed back by the board under test based on the target address data read instruction is received, it is determined that the data storage function of the board under test meets the preset storage function requirement.
[0093] In this embodiment, the data storage function of the board under test is also tested. Specifically, expected data can be burned at the target address of the board under test first. When the board under test is tested, a target address data read instruction is sent to the board under test, that is, an instruction to read the data stored in the target address, and the target data fed back by the board under test is received. If the target data is received, it can be determined that the board under test can store data, the data storage function of the board under test is normal, and the data in the board under test can be read normally.
[0094] As a preferred embodiment, determining the test function of the board under test and generating corresponding test data and expected feedback data based on the test function of the board under test includes:
[0095] Determining a test function of the board under test, wherein the test function includes one or more combinations of a temperature detection function, an acceleration detection function, a speed detection function, and a gap detection function;
[0096] Generate a plurality of temperature values to be measured corresponding to the temperature detection function, and / or acceleration values to be measured corresponding to the acceleration detection function, and / or speed values to be measured corresponding to the speed detection function, and / or gap values to be measured corresponding to the gap detection function, and generate a temperature analog voltage corresponding to each temperature value to be measured, and / or an acceleration analog voltage corresponding to each acceleration value to be measured, and / or a speed analog voltage corresponding to each speed value to be measured, and / or a gap analog voltage corresponding to each gap value to be measured;
[0097] Send the test data to the board under test so that the board under test processes the test data, including:
[0098] Sending each temperature analog voltage, and / or each acceleration analog voltage, and / or each velocity analog voltage and / or each gap analog voltage to the board under test, respectively, so that the board under test processes each temperature analog voltage, and / or each acceleration analog voltage, and / or each velocity analog voltage and / or each gap analog voltage, respectively, and generates an actual temperature value corresponding to each temperature analog voltage, and / or an actual acceleration value corresponding to each acceleration analog voltage, and / or an actual velocity value corresponding to each velocity analog voltage, and / or an actual gap value corresponding to each gap analog voltage;
[0099] Obtain the actual feedback data generated by the tested board after processing the test data, including:
[0100] Obtaining actual temperature values corresponding to each temperature analog voltage generated by the board under test, and / or actual acceleration values corresponding to each acceleration analog voltage, and / or actual speed values corresponding to each speed analog voltage, and / or actual gap values corresponding to each gap analog voltage;
[0101] If the actual feedback data is consistent with the expected feedback data, it is determined that the board under test meets the preset functional requirements, including:
[0102] If each actual temperature value is consistent with each temperature value to be measured, it is determined that the temperature detection function of the board under test meets the preset temperature detection requirements; if each actual acceleration value is consistent with each acceleration value to be measured, it is determined that the acceleration detection function of the board under test meets the preset acceleration detection requirements; if each actual speed value is consistent with each speed value to be measured, it is determined that the speed detection function of the board under test meets the preset speed detection requirements; if each actual gap value is consistent with each gap value to be measured, it is determined that the gap detection function of the board under test meets the preset gap detection requirements.
[0103] In this embodiment, the operating temperature, acceleration, speed, and gap between the wheels and the track of a maglev train must be detected and processed in real time during operation. The results of this data processing are then used to determine whether the maglev train is operating normally. The test functions of the board under test can include one or a combination of temperature detection, acceleration detection, speed detection, and gap detection. Therefore, a maglev train is typically equipped with multiple sensors, such as temperature sensors, speed sensors, acceleration sensors, and gap sensors, to collect the corresponding data and transmit it to the main control board, which then processes the data. In this embodiment, before the main control board is put into use, it is tested, that is, the board under test is tested. The specific method is to simulate the output of different test data of each sensor. Each test data simulates the data output by different sensors, such as the temperature value to be measured output by the simulated temperature sensor, the acceleration value to be measured output by the acceleration sensor, the speed value to be measured output by the speed sensor, and the gap value to be measured output by the gap sensor, and simulate different sensors to transmit the corresponding temperature simulation voltages, acceleration simulation voltages, speed simulation voltages, and gap simulation voltages to the board under test, so that the board under test can detect the temperature simulation voltages, acceleration simulation voltages, speed simulation voltages, and gap simulation voltages. The analog voltage, each speed analog voltage and each gap analog voltage are respectively processed to generate corresponding actual temperature values, actual acceleration values corresponding to each acceleration analog voltage, actual speed values corresponding to each speed analog voltage and actual gap values corresponding to each gap analog voltage. Based on the consistency between the above data and the corresponding expected feedback data, it is determined whether the board under test can perform data processing normally, and then it is predetermined whether the board under test can process the data output by the sensor after being put into use, so as to ensure that the board under test put into use are all boards that can perform data processing normally, thereby ensuring accurate detection of the status of the maglev train.
[0104] It should also be noted that when it is determined that the gap detection function of the board under test meets the preset gap detection requirements, it can be further determined that the data processing function of the FPGA (Field Programmable Gate Array) of the board under test is normal.
[0105] In the above description, the board under test includes all the functions of temperature detection, acceleration detection, speed detection and gap detection as an example. However, in practice, the board under test may include only one or several of these test functions.
[0106] As a preferred embodiment, generating a plurality of temperature values to be measured and generating a temperature analog voltage corresponding to each temperature value to be measured includes:
[0107] Generate several temperature values to be measured and determine the actual resistance value of the thermistor when it works at each temperature value to be measured;
[0108] Determine a number of simulated resistors, each of which has a resistance value corresponding to the actual resistance value;
[0109] The analog resistors are controlled to be connected to the board under test in sequence, so that the board under test can collect the temperature analog voltage across the analog resistors.
[0110] When testing the temperature detection function of the board under test, multiple temperature simulation voltages are input to the board under test. Specifically, multiple simulation resistors are used to simulate the resistance values of the thermistor at different temperatures, so that the simulation resistors with different resistance values are connected to the board under test in sequence. The board under test determines the actual resistance value of the simulation resistor by detecting the temperature simulation voltage across the simulation resistor, and determines the actual temperature value based on the actual resistance value of the simulation resistor and the corresponding relationship between the resistance value of the thermistor and the temperature.
[0111] Specifically, if the resistance values of the analog resistors are 1580Ω, 1489Ω, 1393Ω, and 1314Ω, and each resistance value corresponds to an expected temperature value, the different analog resistors are connected to an excitation power supply so that current flows through the analog resistors. After the board under test is connected to the analog resistors, the voltage value across the analog resistors, that is, the temperature analog voltage, can be determined, and then the temperature analog voltage is converted into the feedback resistance value of the analog resistor, and the feedback resistance value is converted into the actual temperature value. If the actual temperature value is consistent with the corresponding expected temperature value, the board under test can perform normal temperature detection.
[0112] It should be noted that the board under test can be connected to one analog resistor each time, thereby reducing the data processing load of the board under test and improving the accuracy of testing the board under test.
[0113] As a preferred embodiment, before sending each speed simulation voltage and each gap simulation voltage to the board under test, the method further includes:
[0114] Determine the crystal oscillator frequency parameters of the board under test based on the model of the board under test;
[0115] Select a target coil with targeted impedance in the noise frequency band based on the crystal oscillator frequency parameters;
[0116] Send each speed analog voltage and each gap analog voltage to the board under test respectively, including:
[0117] Each speed analog voltage and each gap analog voltage are filtered by the target coil and then transmitted to the board under test;
[0118] Obtain the actual speed value corresponding to each speed simulation voltage and the actual gap value corresponding to each gap simulation voltage generated by the board under test, including:
[0119] The target coil receives the actual speed value corresponding to each speed simulation voltage and the actual gap value corresponding to each gap simulation voltage generated by the board under test.
[0120] In this embodiment, it is taken into account that different boards under test have different crystal oscillators, and thus different boards under test have different crystal oscillator frequency parameters. In order to avoid the influence of interference generated when testing the board under test on the detection results, the crystal oscillator frequency parameters of the board under test are also determined according to the model of the board under test, so as to select a target coil with a targeted impedance in the noise frequency band of the crystal oscillator according to the crystal oscillator frequency parameters. When the speed simulation voltage and the gap simulation voltage are transmitted, they are filtered through the target coil to avoid noise interference in the speed simulation voltage and the gap simulation voltage transmitted to the board under test, which may affect the accuracy of the actual feedback data generated by the board under test.
[0121] In addition, when receiving the actual speed value and actual gap value fed back by the board under test, they are also first filtered through the target coil to avoid noise interference in the actual speed value and actual gap value output by the board under test, which affects the accuracy of the results when the actual speed value and actual gap value are compared with the expected speed value and expected gap value respectively.
[0122] It should be noted that the speed analog voltage and the gap analog voltage may be AC signals, or pulse signals consisting of high and low levels. Therefore, the speed analog voltage and the gap analog voltage may be mixed with noise interference.
[0123] It should also be noted that the actual crystal oscillator frequency parameters, such as crystal oscillator frequency and phase, can be determined based on the actual speed value and actual gap value fed back by the board under test. The actual crystal oscillator frequency parameters can be compared with the crystal oscillator frequency parameters determined based on the model of the board under test to determine whether the crystal oscillator of the board under test is normal.
[0124] The following describes a specific embodiment:
[0125] After the board under test is powered on, the actual voltage of each target potential point of the board under test is obtained, and the expected voltage of each target potential point is determined. The actual voltage of each target potential point is compared with the expected voltage. If they are consistent, the target potential point is powered on normally. If they are inconsistent, the voltage of the target potential point is abnormal. The prompt module can provide a voltage abnormality prompt, and locate the specific target potential point where the abnormality occurs for prompting; after the board under test is powered on, a self-test is performed to generate actual self-test data, obtain the actual self-test data generated by the board under test, and compare the actual self-test data with the expected self-test data. If they are consistent, it can be determined that the self-test function of the board under test is normal and meets the preset self-test requirements; the expected data is pre-burned at the target address of the board under test, and after the board under test is powered on, a target address data read instruction is sent to the board under test to read the data stored in the target address of the board under test, or the target data fed back by the board under test is obtained, so that it can be determined that the data stored in the board under test can be read normally, that is, the data storage function of the board under test meets the preset storage function requirements. After the self-test of the tested board is completed, the test function of the tested board is first determined to include the temperature detection function, and several temperature values to be measured are generated. The resistance value of the thermistor under each temperature value to be measured is determined to determine the resistance value of the corresponding analog resistor. An excitation voltage is provided for each analog resistor, and each analog voltage is controlled in turn to be connected to the tested board. The tested board obtains the temperature analog voltage at both ends of the connected analog resistor in turn, and infers the resistance value of the analog resistor based on the temperature analog voltage, and then determines the corresponding actual temperature value. The actual temperature value output by each analog resistor according to the tested board is compared with the corresponding temperature value to be measured. If they are consistent, it is determined that the tested board meets the preset temperature detection requirements. The requirements include, specifically, sorting the analog resistors in descending order according to their resistance values, first controlling the first analog resistor to be connected to the board under test, determining the first actual temperature value output by the board under test, and if the first actual temperature value is consistent with the temperature value to be measured corresponding to the first analog resistor, controlling the second analog resistor to be connected to the board under test, and determining the second actual temperature value output by the board under test, and if the second actual temperature value is consistent with the temperature value to be measured corresponding to the second analog resistor, controlling the next analog resistor to be connected to the board under test, and so on, until the last actual temperature value output by the board under test is consistent with the temperature value to be measured corresponding to the last analog resistor, and determining that the board under test meets the preset temperature detection requirements;Then determine that the test function of the board under test includes an acceleration detection function, generate several acceleration values to be tested, and generate acceleration analog voltages corresponding to each acceleration value to be tested, sort them in order from large to small according to each acceleration value to be tested, first input the acceleration analog voltage corresponding to the first acceleration value to be tested to the board under test, determine the first actual acceleration value output by the board under test, if the first actual acceleration value is consistent with the first acceleration value to be tested, then input the acceleration analog voltage corresponding to the second acceleration value to be tested to the board under test, determine the second actual acceleration value output by the board under test, if the second actual acceleration value is consistent with the second acceleration value to be tested, input the acceleration analog voltage corresponding to the next acceleration value to be tested to the board under test The acceleration analog voltage is generated, and so on, until the last actual acceleration value output by the tested board is consistent with the last acceleration value to be measured, and it is determined that the tested board meets the preset acceleration detection requirements; after determining the crystal oscillator frequency parameters of the tested board, the speed detection function of the tested board is detected, and several speed values to be measured are generated, and the speed analog voltage corresponding to each speed value to be measured is generated. According to the order of the speed values to be measured from large to small, the speed analog voltage corresponding to the first speed value to be measured is first input to the tested board through the target coil, and the first actual speed value output by the tested board is received through the target coil. If the first actual speed value is consistent with the first speed value to be measured, the target coil is input to the tested board through the target coil. Input the speed analog voltage corresponding to the second speed value to be measured, receive the second actual speed value output by the tested board through the target coil, if the second actual speed value is consistent with the second speed value to be measured, input the speed analog voltage corresponding to the next speed value to be measured to the tested board through the target coil, and so on, until the last actual speed value output by the tested board received through the target coil is consistent with the last speed value to be measured, and determine that the tested board meets the preset speed detection requirements; detect the gap detection function of the tested board, generate several gap values to be measured, and generate gap analog voltages corresponding to each gap value to be measured, sort them in order from large to small according to the gap values to be measured, and input the speed analog voltage to the tested board through the target coil first. Input the gap simulation voltage corresponding to the first gap value to be measured, receive the first actual gap value output by the tested board through the target coil, if the first actual gap value is consistent with the first gap value to be measured, input the gap simulation voltage corresponding to the second gap value to be measured to the tested board through the target coil, receive the second actual gap value output by the tested board through the target coil, if the second actual gap value is consistent with the second gap value to be measured, input the gap simulation voltage corresponding to the next gap value to be measured to the tested board through the target coil, and so on, until the last actual gap value output by the tested board received through the target coil is consistent with the last gap value to be measured, and determine that the tested board meets the preset gap detection requirements.
[0126] Please refer to Figure 2 , Figure 2This is a schematic diagram of the structure of a board test system provided in this application, the system comprising:
[0127] The first determining unit 21 is used to determine the operating voltage of the board under test and to supply power to the board under test;
[0128] The second determining unit 22 is used to determine the test function of the board under test and generate corresponding test data and expected feedback data based on the test function of the board under test;
[0129] The data sending unit 23 is used to send the test data to the board under test so that the board under test processes the test data;
[0130] An acquisition unit 24 is used to acquire actual feedback data generated after the board under test processes the test data;
[0131] The third determining unit 25 is configured to determine that the board under test meets the preset functional requirements if the actual feedback data is consistent with the expected feedback data.
[0132] For an introduction to the board test system provided by the present invention, please refer to the above method embodiment, and the present invention will not be described in detail here.
[0133] Please refer to Figure 3 , Figure 3 This is a schematic diagram of the structure of an industrial computer provided in this application, which includes:
[0134] Memory 31, for storing computer programs;
[0135] The processor 32 is configured to implement the steps of the above-mentioned board testing method when executing the computer program.
[0136] For an introduction to the industrial computer provided by the present invention, please refer to the above method embodiment, and the present invention will not be described in detail here.
[0137] Please refer to Figure 4 , Figure 4 A schematic diagram of the structure of a board test chassis provided in this application includes the industrial computer as described above, and further includes:
[0138] The interface board connected to the industrial computer is used to provide a data transmission channel between the industrial computer and the board under test.
[0139] The industrial computer not only includes memory and processor, but can also be configured with RS485 serial port module, digital I / O module and analog I / O module. The industrial computer outputs corresponding excitation signals to the interface board through the RS485 serial port module, digital I / O module and analog I / O module respectively. The interface board transmits the excitation signal to the board under test. If the board under test can receive the excitation signal and provide feedback based on the excitation signal, the industrial computer determines that the serial port data transmission function of the board under test is normal after receiving the feedback from the board under test.
[0140] In addition, the interface board includes a coil selection board, a latch board, a receiving board and an excitation board. After determining the crystal oscillator frequency parameters of the board under test, the industrial computer selects the corresponding target coil through the coil selection board of the interface board, so that the interface board receives or sends data through the target coil. After the interface board receives the data sent by the board under test, the data is stored in the latch board and uploaded to the industrial computer for data processing, or the industrial computer reads the corresponding data from the latch board of the interface board; the excitation board is based on the control of the industrial computer and sends the corresponding data to the board under test.
[0141] It should be noted that a signal transfer chassis can be preset in the board test chassis. After the board under test is inserted into the signal transfer chassis, it is connected to the industrial interface board through the internal wiring of the board test chassis, and then communicates data with the industrial computer.
[0142] In addition, after the industrial computer is powered on, it can power the board under test. Specifically, the board test chassis can be connected to 220V AC power, and then the 220V AC power is converted into the working voltage of the board under test to power the board under test. After the industrial computer is powered on, the power power-on indicator light will light up to remind the user that the industrial computer has been powered on normally. After the user starts the industrial computer, the board test software will be opened, and the industrial computer will perform a self-test. If the self-test result is normal, the power self-test result indicator light will light up to remind the user that the industrial computer self-test is normal and the board under test can be tested. The processor 32 executes the computer program to implement the steps of the board test method as described above.
[0143] Furthermore, the latch board can be directly connected to each target potential point on the board under test, and the voltage of the target potential point can be directly written into the latch board and then uploaded to the industrial computer. This application does not limit this.
[0144] Please refer to Figure 5 , Figure 5 This is a structural diagram of a computer-readable storage medium provided in the present application. A computer program 52 is stored on the computer-readable storage medium 51. When the computer program 52 is executed by the processor 32, the steps of the logic circuit testing method described above are implemented.
[0145] For an introduction to the computer-readable storage medium 51 provided by the present invention, please refer to the above method embodiment, and the present invention will not elaborate on it here.
[0146] It should also be noted that, in this specification, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus comprising the element.
[0147] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A board testing method, characterized in that: include: Determine the operating voltage of the board under test and supply power to the board under test; Determining the test function of the board under test, and generating corresponding test data and expected feedback data based on the test function of the board under test; Sending the test data to the board under test so that the board under test processes the test data; Acquiring actual feedback data generated after the board under test processes the test data; If the actual feedback data is consistent with the expected feedback data, it is determined that the board under test meets the preset functional requirements.
2. The board testing method according to claim 1, wherein: After determining the operating voltage of the board under test and supplying power to the board under test, the method further includes: Acquiring actual self-test data of the board under test; Comparing the actual self-test data with the target self-test data; If the actual self-test data is consistent with the target self-test data, it is determined that the self-test function of the tested board meets the preset self-test requirements.
3. The board testing method according to claim 1, wherein: After determining the operating voltage of the board under test and supplying power to the board under test, the method further includes: Obtaining the actual voltage of each target potential point of the board under test; Comparing the actual voltage of each target potential point with the expected voltage of each target potential point one by one; If the actual voltages at the target potential points are consistent with the expected voltages at the target potential points, it is determined that the voltage conversion function of the board under test meets the preset voltage conversion requirements.
4. The board testing method according to claim 1, wherein: After determining the operating voltage of the board under test and supplying power to the board under test, the method further includes: Sending a target address data read instruction to the board under test; If the target data fed back by the board under test based on the target address data read instruction is received, it is determined that the data storage function of the board under test meets the preset storage function requirement.
5. The board testing method according to any one of claims 1 to 4, characterized in that: Determining the test function of the board under test and generating corresponding test data and expected feedback data based on the test function of the board under test, including: Determining a test function of the board under test, wherein the test function includes one or more combinations of a temperature detection function, an acceleration detection function, a speed detection function, and a gap detection function; Generate a plurality of temperature values to be measured corresponding to the temperature detection function, and / or acceleration values to be measured corresponding to the acceleration detection function, and / or speed values to be measured corresponding to the speed detection function, and / or gap values to be measured corresponding to the gap detection function, and generate a temperature analog voltage corresponding to each of the temperature values to be measured, and / or an acceleration analog voltage corresponding to each of the acceleration values to be measured, and / or a speed analog voltage corresponding to each of the speed values to be measured, and / or a gap analog voltage corresponding to each of the gap values to be measured; The method includes sending the test data to the board under test so that the board under test processes the test data, including: Sending each of the temperature analog voltages, and / or each of the acceleration analog voltages, and / or each of the velocity analog voltages, and / or each of the gap analog voltages to the board under test, respectively, so that the board under test processes each of the temperature analog voltages, and / or each of the acceleration analog voltages, and / or each of the velocity analog voltages, and / or each of the gap analog voltages, respectively, and generates an actual temperature value corresponding to each of the temperature analog voltages, and / or an actual acceleration value corresponding to each of the acceleration analog voltages, and / or an actual velocity value corresponding to each of the velocity analog voltages, and / or an actual gap value corresponding to each of the gap analog voltages; Acquiring actual feedback data generated after the board under test processes the test data, including: Obtaining an actual temperature value corresponding to each of the temperature simulation voltages generated by the tested board, and / or an actual acceleration value corresponding to each of the acceleration simulation voltages, and / or an actual speed value corresponding to each of the speed simulation voltages, and / or an actual gap value corresponding to each of the gap simulation voltages; If the actual feedback data is consistent with the expected feedback data, determining that the board under test meets the preset functional requirements includes: If each of the actual temperature values is consistent with each of the temperature values to be measured, it is determined that the temperature detection function of the board under test meets the preset temperature detection requirements; if each of the actual acceleration values is consistent with each of the acceleration values to be measured, it is determined that the acceleration detection function of the board under test meets the preset acceleration detection requirements; if each of the actual speed values is consistent with each of the speed values to be measured, it is determined that the speed detection function of the board under test meets the preset speed detection requirements; if each of the actual gap values is consistent with each of the gap values to be measured, it is determined that the gap detection function of the board under test meets the preset gap detection requirements.
6. The board testing method according to claim 5, wherein: Generating a plurality of temperature values to be measured and generating a temperature analog voltage corresponding to each of the temperature values to be measured, including: Generate a plurality of temperature values to be measured, and determine the actual resistance value of the thermistor when operating at each of the temperature values to be measured; Determine a plurality of simulated resistors, wherein the resistance value of each simulated resistor is respectively the actual resistance value; The analog resistors are controlled to be connected to the board under test in sequence, so that the board under test collects the temperature analog voltage at both ends of the analog resistors.
7. The board testing method according to claim 5, wherein: Before sending each of the speed simulation voltages and each of the gap simulation voltages to the board under test, the method further includes: Determining the crystal oscillator frequency parameters of the board under test based on the model of the board under test; selecting a target coil having a targeted impedance in a noise frequency band based on the crystal oscillator frequency parameter; Sending each of the speed simulation voltages and each of the gap simulation voltages to the board under test respectively includes: Each of the speed simulation voltages and each of the gap simulation voltages are filtered by the target coil and then transmitted to the board under test; Obtaining the actual speed value corresponding to each of the speed simulation voltages and the actual gap value corresponding to each of the gap simulation voltages generated by the board under test, including: The actual speed value corresponding to each of the speed simulation voltages and the actual gap value corresponding to each of the gap simulation voltages generated by the board under test are received through the target coil.
8. A board test system, characterized in that: include: A first determining unit, configured to determine an operating voltage of a board under test and to supply power to the board under test; a second determining unit, configured to determine a test function of the board under test, and generate corresponding test data and expected feedback data based on the test function of the board under test; a data sending unit, configured to send the test data to the board under test, so that the board under test processes the test data; An acquisition unit, configured to acquire actual feedback data generated after the board under test processes the test data; The third determining unit is configured to determine that the board under test meets preset functional requirements if the actual feedback data is consistent with the expected feedback data.
9. An industrial computer, characterized in that: include: Memory for storing computer programs; A processor, configured to implement the steps of the board testing method according to any one of claims 1 to 7 when executing a computer program.
10. A board test chassis, characterized in that: The industrial computer according to claim 9 further comprises: The interface board connected to the industrial computer is used to provide a data transmission channel between the industrial computer and the board under test.