Optical module

Abstract

The invention provides an optical module capable of reducing the size of an optical transmitter and the like. The optical module includes: a semiconductor light-emitting element; a heat insulation member mechanically connected to the semiconductor light-emitting element on the first surface side, the heat insulation member comprising at least one of glass and ceramic; and a mounting part which is located on the second surface side of the heat insulating member and in which a region corresponding to the optical circuit part of the optical circuit board is disposed. The second surface side of the heat insulating member faces in a direction facing the first surface side.

Description

Technical Field

[0001] The present invention relates to an optical module. Background Art

[0002] Patent Document 1 discloses an optical module comprising: a chip carrier carrying a wavelength-tunable laser element that emits laser light and a temperature detection element; a light detection element that detects the laser light output from the wavelength-tunable laser element; a temperature adjustment element that carries the chip carrier and the light detection element; and a housing that houses the temperature adjustment element and has a window for outputting laser light.

[0003] Prior art literature Patent Literature Patent Document 1: Japanese Patent Application Laid-Open No. 2020-13831 Summary of the Invention Problems to be solved by the invention Optical transmitters or optical transceivers (hereinafter referred to as optical transmitters, etc.) used in optical communications include, for example, semiconductor light-emitting elements such as semiconductor laser elements and a light modulator that modulates the light emitted from the semiconductor light-emitting element. Typically, within the housing of the optical transmitter, light emitted from the semiconductor light-emitting element is guided to the light modulator by an optical fiber. Meanwhile, demands for miniaturization of optical transmitters, etc. are increasing. However, miniaturization of optical transmitters, etc., is difficult with structures that incorporate optical fibers within the housing.

[0004] An object of the present invention is to provide an optical module capable of miniaturizing an optical transmitter or the like.

[0005] Means used to solve problems An optical module according to one embodiment of the present invention includes: a semiconductor light-emitting element; a thermal insulator mechanically connected to the semiconductor light-emitting element on a first surface side thereof and composed of at least one of glass and ceramic; and a mounting portion located on a second surface side of the thermal insulator and having an area corresponding to an optical circuit portion of an optical circuit substrate. The second surface side of the thermal insulator faces a direction opposite to the first surface side.

[0006] Effects of the Invention According to the present invention, an optical module capable of miniaturizing an optical transmitter or the like can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 It is a plan view showing the optical transceiver according to the first embodiment of the present invention.

[0008] Figure 2 This is a perspective view showing the peripheral structure of the optical module and photon IC.

[0009] Figure 3This is a perspective view showing the peripheral structure of the optical module and photon IC.

[0010] Figure 4 This is a cutaway perspective view showing the optical module together with a housing (casing) included in the optical transceiver.

[0011] Figure 5 It is a side sectional view showing the optical module together with the housing.

[0012] Figure 6 It is a perspective view showing the structure of the optical module as viewed from a heat insulating member.

[0013] Figure 7 It is a plan view showing the structure of the optical module as viewed from the heat insulating member.

[0014] Figure 8 This is a side view of the optical module.

[0015] Figure 9 It is a schematic diagram showing an enlarged view of the peripheral structure of the condenser lens and the light guide member.

[0016] Figure 10 It is a plan view showing an optical transceiver according to a second embodiment of the present invention.

[0017] Figure 11 This is an enlarged perspective view of the optical module.

[0018] Figure 12 This is an enlarged perspective view of the optical module.

[0019] Description of Reference Numerals 1A, 1B: optical transmitter and receiver; 2: Substrate; 2a: first short side; 2b: second short side; 3: base; 4: thermal insulation components; 4a: first side; 4b: second side; 5: Laser diode driver (LDD); 6: Transimpedance amplifier (TIA); 7: Digital signal processor (DSP); 8: terminal; 9a, 9b: optical fiber; 10A, 10B: optical modules; 11: semiconductor light emitting element; 12: Collimating lens; 13: Isolator; 14: Temperature control structure; 14a: first plate; 14b: second plate; 14c: Peltier element; 15: reflector component; 16: carrier; 17: Supporting member; 18: Window materials; 21: focusing lens; 22: light guide member; 22a: Part I; 22b: Part II; 22c: first reflector; 22d: second reflector; 24, 25: adhesive; 31: hood; 32: optical fiber holding portion; 33: heat sink; 40: frame; 41: top plate; 42: bottom plate; 20: Photon IC; L: Light. DETAILED DESCRIPTION

[0020] [Description of Embodiments of the Invention] First, the contents of the embodiments of the present invention will be described. [1] An optical module according to one embodiment of the present invention comprises: a semiconductor light-emitting element; a heat-insulating member mechanically connected to the semiconductor light-emitting element on a first surface side and composed of at least one of glass and ceramic; and a mounting portion located on a second surface side of the heat-insulating member and having an area corresponding to the optical circuit portion of the optical circuit substrate. The second surface side of the heat-insulating member faces in a direction opposite to the first surface side.

[0021] [2] Alternatively, the optical module of [1] may include a temperature control structure that is thermally connected to the semiconductor light emitting element and includes a first plate, a second plate, and a Peltier element disposed therebetween.

[0022] [3] In the optical module of [2] above, the surface of the temperature control structure on which the semiconductor light emitting element is mounted may face the heat insulating member and be spaced apart from the heat insulating member.

[0023] [4] An optical module according to one embodiment of the present invention comprises: a heat insulating plate mechanically connected to a semiconductor light emitting element on a first surface side thereof, the heat insulating plate being formed of at least one of glass and ceramic; a mounting portion located on a second surface side of the heat insulating plate, i.e., in an area overlapping with the semiconductor light emitting element, the mounting portion having an area corresponding to an optical circuit portion of an optical circuit substrate disposed thereon; the optical circuit substrate disposed on the mounting portion; and an optical coupling portion optically coupling the semiconductor light emitting element to the optical circuit substrate. The second surface side of the heat insulating plate faces a direction opposite to the first surface side.

[0024] [5] In the optical module of [4] above, the optical module may include a temperature control structure that is thermally connected to the semiconductor light emitting element and includes a first plate, a second plate, and a Peltier element disposed therebetween.

[0025] [6] In the optical module of [5] above, the first plate of the temperature control structure may be coupled to the first surface side of the heat insulating plate so as to face each other, and the semiconductor light emitting element may be mounted on the surface of the first plate on the side opposite to the heat insulating plate.

[0026] [Details of the embodiment of the present invention] Specific examples of the present invention are described below with reference to the accompanying drawings. The present invention is not limited to these examples but is defined by the claims, which are intended to encompass all modifications within the meaning and scope of the claims and equivalents thereof. In the following description, identical elements are denoted by the same reference numerals throughout the accompanying drawings, and any duplicate descriptions will be omitted.

[0027] [First embodiment] Figure 1 This is a top view of an optical transceiver 1A according to the first embodiment of the present invention. The optical transceiver 1A of this embodiment includes an optical transmitter and an optical receiver. To this end, the optical transceiver 1A includes a substrate 2, a base 3, a laser diode driver (LDD) 5, a transimpedance amplifier (TIA) 6, a digital signal processor (DSP) 7, multiple terminals 8, optical fibers 9a and 9b, an optical module 10A, and a photonic IC 20 (optical circuit board).

[0028] The substrate 2 is a plate-like member having a planar shape such as a rectangle. The substrate 2 is made of, for example, resin. A plurality of terminals 8 are arranged side by side along the first short side 2a of the substrate 2. The base 3 is arranged on the substrate 2 and fixed to the substrate 2. The base 3 is a plate-like member having a planar shape such as a rectangle. The constituent material of the base 3 is, for example, a laminate of glass epoxy resin or a laminate of ceramic. The optical fiber 9a and the optical fiber 9b are arranged on the substrate 2 at a position close to the second short side 2b on the side opposite to the first short side 2a. The optical fiber 9a outputs the transmission light from the optical transmitter to the outside of the optical transceiver 1A. The optical fiber 9b inputs the received light from the outside of the optical transceiver 1A to the optical receiver.

[0029] The photon IC 20 is arranged on the base 3 in an area close to the second short side 2b. The photon IC 20 is a device having an optical circuit portion integrated with an optical waveguide, a photodiode, and an optical modulator, for example, on a silicon substrate or an InP substrate. One end of each optical fiber 9a and optical fiber 9b is connected to the photon IC 20. The photon IC 20 inputs the transmission light modulated by the optical modulator into the optical fiber 9a. To this end, the photon IC 20 has an optical port for inputting the light before modulation input to the optical modulator. The photon IC 20 may also have a wavelength locking mechanism including an etalon filter. In addition, the photon IC 20 converts the received light received from the optical fiber 9b into a current signal through a photodiode.

[0030] LDD 5 incorporates a driver circuit for driving the optical modulator of photon IC 20. TIA 6 converts the current signal output from the photodiode of photon IC 20 into a voltage signal. LDD 5 and TIA 6 are arranged side by side on base 3 in an area near first short side 2a. LDD 5 and TIA 6 are electrically connected to corresponding terminals 8 among the plurality of terminals 8 via wiring embedded in substrate 2.

[0031] DSP 7 incorporates a large-scale integrated circuit that drives photonic IC 20 to process high-speed signals. DSP 7 is positioned on base 3 in an area near first short side 2a, aligned with photonic IC 20 along the long sides of substrate 2. DSP 7 is electrically connected to corresponding terminals 8 among a plurality of terminals 8 via wiring embedded in substrate 2.

[0032] The optical module 10A inputs pre-modulated light input to the optical modulator to the optical port of the photon IC 20. The optical module 10A is arranged on the base 3 in a region close to the second short side 2b, and is aligned with the LDD 5 and the TIA 6 along the long side of the substrate 2.

[0033] Figure 2 as well as Figure 31 and 2 are perspective views showing the peripheral structure of the optical module 10A and the photon IC 20. As shown in these figures, the LDD 5 and the TIA 6 are covered and protected by a cover 31 (indicated by phantom lines in the figure).

[0034] The optical module 10A includes a temperature control structure 14, a heat insulating member 4, and a support member 17. The temperature control structure 14 includes a first plate 14a and a second plate 14b that oppose each other. The first plate 14a and the second plate 14b are parallel to each other. Furthermore, the temperature control structure 14 includes a Peltier element 14c disposed between the first plate 14a and the second plate 14b. The Peltier element 14c transfers heat from the first plate 14a to the second plate 14b.

[0035] The thermal insulation member 4 is a plate-shaped member, such as a ceramic plate or a glass plate. An example of a ceramic is alumina. The thermal conductivity of glass is approximately 1.0 W / mK, while the thermal conductivity of alumina is 2-3 W / mK. The thermal insulation member 4 is positioned on the side of the first plate 14a that is opposite the second plate 14b. The thermal insulation member 4 has a first surface 4a and a second surface 4b. The first surface 4a faces the first plate 14a of the temperature control structure 14. The second surface 4b faces the direction opposite the first surface 4a. In one example, the second surface 4b is parallel to the first surface 4a. The second surface 4b faces the photonic IC 20. In other words, the photonic IC 20 includes an optical circuit component (including a modulator, waveguide, etc.) and is positioned on the second surface 4b of the thermal insulation member 4, facing the semiconductor light-emitting element 11. Specifically, the optical module 10A has a mounting portion located on the second surface 4b side of the thermal insulation member 4 and configured with an area corresponding to the optical circuit component of the photonic IC 20. The reason for providing the thermal insulation member 4 is as follows. The optical circuit portion of the photonic IC 20 (optical circuit board) controls its optical properties by controlling the electrical or thermal refractive index. When miniaturization is achieved by overlapping the optical circuit portion with the semiconductor light-emitting element 11, the semiconductor light-emitting element 11 and the photonic IC 20 are directly or indirectly mechanically connected. However, the resulting thermal coupling cannot be ignored, and the effect of heat generation from the photonic IC 20 on the semiconductor light-emitting element 11, and vice versa, cannot be ignored. When a temperature control structure 14 (TEC) is configured to control the temperature of the semiconductor light-emitting element 11, the temperature of the temperature control structure 14 may also affect the photonic IC 20.

[0036] In other words, the thermal insulation member 4 serves as a platform for placing the photonic IC 20. This prevents the transfer of heat generated by the photonic IC 20 to the semiconductor light-emitting element 11, suppressing temperature changes in the semiconductor light-emitting element 11 caused by this heat, and achieving wavelength stability. In addition to tunable LDs, the semiconductor light-emitting element 11 can also use CW, EML, and other technologies.

[0037] Support member 17 supports thermal insulation member 4 and second plate 14b at a distance therefrom. Support member 17 may also be shaped to surround various optical components (described later) mounted on first plate 14a. In this case, the optical components mounted on first plate 14a are hermetically sealed by thermal insulation member 4, second plate 14b, and support member 17.

[0038] Figure 4 It is a cutaway perspective view showing the optical module 10A together with the housing (casing) 40 included in the optical transceiver 1A. Figure 5 This is a side sectional view showing the optical module 10A together with the frame 40. The frame 40 houses the substrate 2 and all components arranged on the substrate 2 (including the optical module 10A and the photonic IC 20). The frame 40 has a top plate 41 and a bottom plate 42. The optical transceiver 1A also includes a heat sink (TIM: Thermal Interface Material) 33 sandwiched between the top plate 41 of the frame 40 and the second plate 14b. Furthermore, as shown in the figure, the optical transceiver 1A may also include a fiber holder 32 that clamps and holds the ends of the optical fibers 9a and 9b. By fixing the fiber holder 32 to the side of the photonic IC 20, the optical fibers 9a and 9b are connected to the photonic IC 20.

[0039] Figure 6 It is a perspective view showing the structure of the optical module 10A as viewed from the heat insulating member 4 . Figure 7 4 is a top view showing the structure of the optical module 10A as viewed from the heat insulating member 4. Figure 6 as well as Figure 7 In the figure, the heat insulating member 4 is omitted. Figure 8 10A are side views of an optical module 10A. As shown in these figures, the optical module 10A includes a semiconductor light-emitting element 11, a collimating lens 12, an isolator 13, a reflector member 15, a carrier 16, a condenser lens 21, and a light guide member 22. The semiconductor light-emitting element 11, the collimating lens 12, the isolator 13, the reflector member 15, and the carrier 16 are mounted on a first plate 14a and disposed between the first plate 14a and the heat insulating member 4.

[0040] The semiconductor light emitting element 11 is mounted on a carrier 16 and is thermally connected to the first plate 14a via the carrier 16. The surface of the temperature control structure 14 on which the semiconductor light emitting element 11 is mounted is opposite to the heat insulating member 4 and is arranged with a space therebetween. The semiconductor light emitting element 11 emits light in a direction intersecting the thickness direction of the first plate 14a. The semiconductor light emitting element 11 is, for example, a semiconductor laser element, and the light emitted from the semiconductor light emitting element 11 is, for example, laser light. The semiconductor laser element can be a wavelength tunable type, a continuous light emitting type, or an EML (Electro-absorption Modulator integrated Laser diode) integrated with an electric field absorption light modulator. The temperature of the semiconductor light emitting element 11 is controlled by the temperature control structure 14 so that the emission wavelength of the semiconductor light emitting element 11 becomes a predetermined wavelength. A plurality of wirings connected to the semiconductor light emitting element 11 are provided on the carrier 16.

[0041] The collimator lens 12 is mounted on the first plate 14a and optically coupled to the semiconductor light-emitting element 11. The collimator lens 12 collimates (collimates) the light emitted from the semiconductor light-emitting element 11. The reflector member 15 is optically coupled to the semiconductor light-emitting element 11 via the collimator lens 12, and folds the optical path of the light emitted from the semiconductor light-emitting element 11. The isolator 13 is optically coupled to the semiconductor light-emitting element 11 via the collimator lens 12 and the reflector member 15. The isolator 13 prevents light emitted from the semiconductor light-emitting element 11 from returning to the semiconductor light-emitting element 11.

[0042] When viewed in the thickness direction of the first plate 14a, the focusing lens 21 and the light-guiding member 22 are arranged on the outside of the first plate 14a and on the outside of the supporting member 17. The focusing lens 21 is arranged on the first surface 4a of the heat insulating member 4 and is fixed to the first surface 4a. The focusing lens 21 is optically coupled to the isolator 13 via an opening formed in the supporting member 17. In addition, when the supporting member 17 airtightly seals the semiconductor light emitting element 11, the collimating lens 12, and the isolator 13, a window material 18 for airtightly sealing the opening is provided at the opening of the supporting member 17. The light-guiding member 22 is optically coupled to the semiconductor light emitting element 11 via the collimating lens 12, the reflector member 15, the isolator 13, and the focusing lens 21. The light-guiding member 22 is arranged side by side with the heat insulating member 4 in a direction intersecting with the thickness direction of the first plate 14a (refer to Figure 8 ). The light guide member 22 is fixed to the heat insulating member 4.

[0043] Figure 9This is a schematic diagram showing an enlarged view of the surrounding structure of the condenser lens 21 and the light guide member 22. As shown in this figure, the condenser lens 21 is positioned in the optical path between the isolator 13 and the light guide member 22. The condenser lens 21 is secured to the first surface 4a of the heat insulating member 4 with an adhesive 24. The condenser lens 21 condenses light L emitted from the semiconductor light emitting element 11 toward the light guide member 22.

[0044] The light guide member 22 guides light L propagating on the first surface 4a of the heat insulating member 4 (specifically, between the first surface 4a and the first plate 14a) to the second surface 4b of the heat insulating member 4. The light guide member 22 of this embodiment includes a first portion 22a and a second portion 22b. The first portion 22a protrudes onto the first surface 4a of the heat insulating member 4 and is fixed to the first surface 4a of the heat insulating member 4 with an adhesive 25. The second portion 22b is integrally provided with the first portion 22a and is aligned with the heat insulating member 4 in a direction intersecting the thickness of the first plate 14a. The second portion 22b includes a first reflector 22c and a second reflector 22d. The first reflector 22c reflects the light L propagating on the first surface 4a in the thickness direction of the heat insulating member 4. The second reflector 22d reflects the light L reflected by the first reflector 22c toward the photon IC 20 on the second surface 4b. The photon IC 20 receives the light L guided by the light guide member 22 and modulates the light L. The second portion 22 b is, for example, a member that is transparent to the wavelength of the light L and is a prism having a first reflecting mirror 22 c and a second reflecting mirror 22 d that reflect the light L.

[0045] The effects achieved by the optical transceiver 1A and optical module 10A of the present embodiment described above will now be described. In the optical module 10A, the semiconductor light-emitting element 11 is mounted on the first plate 14a of the temperature control structure 14, and the first plate 14a is located on the thermal insulation member 4. This prevents heat generated in the photonic IC 20 from being transferred to the semiconductor light-emitting element 11, enabling appropriate temperature control of the semiconductor light-emitting element 11. Furthermore, light L emitted from the semiconductor light-emitting element 11 is guided from the first surface 4a of the thermal insulation member 4 to the second surface 4b by the light guide member 22. As in the present embodiment, an optical component such as the photonic IC 20 serving as a light modulation unit can be arranged on the second surface 4b of the thermal insulation member 4. Therefore, according to the optical module 10A of this embodiment, the light L emitted from the semiconductor light-emitting element 11 is guided to the light modulation unit without the use of an optical fiber, thereby enabling the optical transceiver 1A to be miniaturized.

[0046] As in this embodiment, the heat insulating member 4 may be a glass plate. Glass has higher heat insulating properties than ceramics, so in this case, it is possible to effectively suppress the heat generated in the photon IC 20 from being transferred to the semiconductor light emitting element 11.

[0047] As in the present embodiment, the optical module 10A may include a condenser lens 21 disposed outside the first plate 14a as viewed in the thickness direction of the first plate 14a, and condensing the light L emitted from the semiconductor light emitting element 11 toward the light guide member 22. In this case, the light L emitted from the semiconductor light emitting element 11 can be efficiently incident on the light guide member 22.

[0048] As in the present embodiment, the light guide member 22 may be fixed to the heat insulating member 4. In this case, the light guide member 22 can be easily integrated with other members (semiconductor light emitting element 11, temperature control structure 14, etc.).

[0049] As in this embodiment, the light guide member 22 may include a first reflector 22c that reflects light L propagating on the first surface 4a in the thickness direction of the heat insulating member 4, and a second reflector 22d that reflects the light L reflected by the first reflector 22c toward the second surface 4b. In this case, the light L emitted from the semiconductor light emitting element 11 can be appropriately guided from the first surface 4a to the second surface 4b of the heat insulating member 4.

[0050] The optical transmitter of this embodiment includes an optical module 10A and a photon IC 20 disposed on the second surface 4b of the heat insulating member 4 and receiving and modulating the light L guided by the light guide member 22. The optical transmitter includes the optical module 10A, which enables miniaturization of the optical transmitter.

[0051] As in this embodiment, the optical transmitter may include a housing 40 housing the optical module 10A and a heat sink 33 interposed between the second plate 14b and the housing 40. In this case, the heat generated in the semiconductor light emitting element 11 can be efficiently dissipated to the housing 40 via the temperature control structure 14.

[0052] As in this embodiment, an optical transceiver 1A includes an optical transmitter including an optical module 10A and an optical receiver. According to this optical transceiver 1A, the optical transmitter including the optical module 10A can be miniaturized.

[0053] [Second embodiment] Figure 10 This is a plan view of an optical transceiver 1B according to a second embodiment of the present invention. The optical transceiver 1B of this embodiment includes an optical module 10B instead of the optical module 10A of the first embodiment. The remaining structure of the optical transceiver 1B is the same as that of the optical module 10A.

[0054] Figure 11 as well as Figure 12This is an enlarged perspective view of optical module 10B. Optical module 10B inputs pre-modulated light from the optical modulator to the optical port of photon IC 20. Optical module 10B is positioned on base 3 in an area near second short side 2b, aligned with LDD 5 and TIA 6 along the long side of substrate 2.

[0055] The optical module 10B includes a thermal insulation member 4 (insulation plate), a semiconductor light-emitting element 11, a collimating lens 12, an isolator 13, and a temperature control structure 14. The thermal insulation member 4, similar to the first embodiment, is a plate-shaped member, such as a ceramic plate or a glass plate. The thermal insulation member 4 has a first surface 4a and a second surface 4b. The second surface 4b faces a direction opposite to the first surface 4a. In one example, the second surface 4b is parallel to the first surface 4a. The second surface 4b faces the photon IC 20. In other words, the photon IC 20 is disposed on the second surface 4b of the thermal insulation member 4.

[0056] The temperature control structure 14 includes a first plate 14a and a second plate 14b that are opposed to each other. The first plate 14a and the second plate 14b are parallel to each other. Furthermore, the temperature control structure 14 includes a Peltier element 14c disposed between the first plate 14a and the second plate 14b. The Peltier element 14c transfers heat from the first plate 14a to the second plate 14b. The first plate 14a is disposed on the first surface 4a of the thermal insulation member 4. In other words, the first plate 14a is coupled to the thermal insulation member 4 so as to face each other. Furthermore, the first plate 14a has a region aligned with the Peltier element 14c along the long side of the substrate 2.

[0057] The semiconductor light-emitting element 11 is mounted on the surface of the first plate 14a opposite the thermal insulation member 4, in an area of ​​the first plate 14a aligned with the Peltier element 14c. In the illustrated example, the semiconductor light-emitting element 11 is mounted on a carrier 16 provided in this area of ​​the first plate 14a. The semiconductor light-emitting element 11 emits light in a direction intersecting the thickness of the first plate 14a.

[0058] The collimator lens 12 is mounted on the first plate 14a and is optically coupled to the semiconductor light emitting element 11. The collimator lens 12 collimates (collimates) the light emitted from the semiconductor light emitting element 11. The isolator 13 is optically coupled to the semiconductor light emitting element 11 via the collimator lens 12. The isolator 13 prevents light emitted from the semiconductor light emitting element 11 from returning to the semiconductor light emitting element 11.

[0059] The optical module 10B further includes a condenser lens 21 and a light guide member 22. As in the first embodiment, the light guide member 22 is arranged alongside the thermal insulation member 4 in a direction intersecting the thickness of the first plate 14a. The light guide member 22 is optically coupled to the semiconductor light-emitting element 11, guiding light propagating along the first surface 4a of the thermal insulation member 4 to the second surface 4b of the thermal insulation member 4. The detailed structures of the condenser lens 21 and the light guide member 22 are the same as in the first embodiment.

[0060] In the optical module 10B of this embodiment, the semiconductor light-emitting element 11 is mounted on the first plate 14a of the temperature control structure 14, and the first plate 14a is located on the thermal insulation member 4. This prevents heat generated in the photonic IC 20 from being transferred to the semiconductor light-emitting element 11, allowing for appropriate temperature control of the semiconductor light-emitting element 11. Furthermore, light emitted from the semiconductor light-emitting element 11 is guided from the first surface 4a of the thermal insulation member 4 to the second surface 4b via the light guide member 22. Optical components such as the photonic IC 20, which serves as a light modulation unit, can be arranged on the second surface 4b of the thermal insulation member 4. Therefore, according to the optical module 10B of this embodiment, the light emitted from the semiconductor light-emitting element 11 is not required to be guided to the light modulation unit using optical fibers, thereby enabling a more compact optical transceiver.

[0061] The optical module of the present invention is not limited to the above-described embodiment and can be modified in various other ways. For example, in the above-described embodiment, the photon IC 20 is disposed on the second surface 4b of the thermal insulation member 4, and light guided by the light guide member 22 is incident on the photon IC 20. However, the components disposed on the second surface 4b of the thermal insulation member 4 are not limited to the photon IC 20. Alternatively, a grating coupler method may be employed, in which a hole is formed in the thermal insulation member 4 to couple light from the semiconductor light-emitting element 11 to the optical waveguide formed on the photon IC 20.

[0062] In the above embodiment, the light guide member 22 includes the first reflector 22c and the second reflector 22d. However, the structure of the light guide member is not limited thereto as long as it can guide light from the first surface 4a to the second surface 4b of the heat insulating member 4.

Claims

1. An optical module, wherein: The optical module has: Semiconductor light emitting element; a heat insulating member mechanically connected to the semiconductor light emitting element on the first surface side and made of at least one of glass and ceramic; as well as The mounting portion is located on the second surface side of the heat insulating member and is configured with an area corresponding to the optical circuit portion of the optical circuit substrate. The second surface side of the thermal insulation member faces a direction opposite to the first surface side.

2. The optical module according to claim 1, wherein: The optical module includes a temperature control structure that is thermally connected to the semiconductor light emitting element and includes a first plate, a second plate, and a Peltier element disposed between the first plate and the second plate.

3. The optical module according to claim 2, wherein: The surface of the temperature control structure on which the semiconductor light emitting element is placed faces the heat insulating member and is spaced apart from the heat insulating member.

4. An optical module, wherein: The optical module has: a heat shield, mechanically connected to the semiconductor light emitting element on the first surface side, and made of at least one of glass and ceramic; The mounting portion is located on the second surface side of the heat shield and is a region overlapping with the semiconductor light emitting element, and is configured with a region corresponding to the optical circuit portion of the optical circuit substrate; an optical circuit substrate, disposed on the mounting portion; as well as an optical coupling portion for optically coupling the semiconductor light emitting element to the optical circuit substrate; The second surface side of the thermal insulation member faces a direction opposite to the first surface side.

5. The optical module according to claim 4, wherein: The optical module includes a temperature control structure that is thermally connected to the semiconductor light emitting element and includes a first plate, a second plate, and a Peltier element disposed between the first plate and the second plate.

6. The optical module according to claim 5, wherein: The first plate of the temperature control structure is coupled to the first surface of the heat insulation plate so as to face each other. The semiconductor light emitting element is placed on a surface of the first plate opposite to the heat shield plate.

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