Chip package structure facilitating heat dissipation

Abstract

This invention relates to the field of chip packaging technology and discloses a chip packaging structure that facilitates heat dissipation, including a main body and a chip, with the interior of the main body being hollow. When a connecting channel is formed on both sides of the top of the main body, the heat generated by the chip can be dispersed outward through this channel. Simultaneously, when multiple flip plates are flipped to expose the sidewalls of the chip, an open heat dissipation channel is formed. The flow of air and the outflow of hot gas accelerate the outward diffusion of heat, thereby reducing the possibility of heat flowing back into the chip and accumulating inside the chip when its heat is blocked during operation. This improves the heat dissipation efficiency and packaging quality of the chip after packaging.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, specifically to a chip packaging structure that facilitates heat dissipation. Background Technology

[0002] With the development of semiconductor technology, chip integration has been continuously improved, the number of transistors per unit area and the power consumption have continued to rise, and heat dissipation has become a key bottleneck restricting chip performance and reliability.

[0003] When packaging chips, the chip is placed into a packaging cavity, and encapsulation resin is injected into the cavity and then mounted onto a substrate to achieve the purpose of packaging. During packaging, the bottom surface of the chip is in contact with the substrate and the filler on the sidewalls. Since the top and bottom surfaces of the chip have the highest heat density when it is working, the heat generated by the chip during operation is blocked by the substrate and filler after packaging, making it difficult for the heat to dissipate outward. This can easily lead to heat flowing back into the chip. Furthermore, the top of the chip is covered by the encapsulation plastic, which can easily cause heat to accumulate inside the chip, affecting the heat dissipation efficiency and packaging quality after chip packaging. Summary of the Invention

[0004] The purpose of this invention is to provide a chip packaging structure that facilitates heat dissipation, so as to solve the problems mentioned in the background art.

[0005] To solve the above-mentioned technical problems, the present invention is achieved through the following technical solution:

[0006] The present invention is a chip packaging structure that facilitates heat dissipation, comprising a main body and a chip, wherein the interior of the main body is hollow, and further comprising;

[0007] A rotating mechanism is installed on the side wall of the main body to prevent dust from entering during chip operation.

[0008] The reinforcement mechanism is installed inside the main body to increase heat dissipation during chip operation.

[0009] The encapsulation of the chip by the main body enables the rotating mechanism and the reinforcing mechanism to dissipate the heat generated by the chip when it is working.

[0010] Both the left and right sides of the main body are slidably connected to C-shaped rings, and a right-angled triangle plate is fixedly connected to the side of the C-shaped rings near the middle of the main body.

[0011] Furthermore, the main body includes several square grooves formed on the left and right sides of the main body, and several notched grooves formed on the side of the main body near the square grooves. The main body includes:

[0012] The fixing mechanism is installed inside the main body;

[0013] The sliding component is installed inside the main body.

[0014] A limiting component is installed on the side wall of the sliding component.

[0015] Furthermore, the rotating mechanism includes a central rod that rotates through a plurality of square slots. The rotating mechanism includes:

[0016] The flipping assembly is mounted on the outer surface of the center rod.

[0017] Furthermore, the reinforcing mechanism includes four protruding plates disposed inside the main body. The reinforcing mechanism includes:

[0018] Heat dissipation assembly, with the bottom of the mounting plate for the heat dissipation assembly installed;

[0019] The guide component is installed on the side wall of the heat dissipation component.

[0020] Furthermore, the fixing mechanism includes a central ring fixedly connected inside the main body;

[0021] The bottom of the main body is fixedly connected to a base plate.

[0022] Furthermore, the sliding assembly includes two inclined rods slidably connected to the inner wall of the body near the C-ring side;

[0023] An inclined block is fixedly connected to the bottom of the C-shaped ring.

[0024] Furthermore, the limiting component includes a hollow copper tube rotatably connected to the side of the C-ring away from the center of the main body, and several arc-shaped heat-conducting tubes are rotatably connected to the outer surface of the hollow copper tube.

[0025] The end of the arc-shaped heat pipe that is away from the hollow copper pipe is set inside the notch groove;

[0026] A limiting spring is fixedly connected to the top of the arc-shaped heat-conducting pipe located inside the notch groove, and the top of the limiting spring is fixedly connected to the top inner wall of the notch groove.

[0027] Furthermore, the flipping assembly includes a flipping plate that is rotatably fixed to the outer surface of the central rod located inside the square groove, and several flipping plates are fixedly connected to a long rod on one side near the main body;

[0028] The end of the flip plate furthest from the second long rod is designed to be flexible.

[0029] Furthermore, the heat dissipation assembly includes a heat-conducting plate fixedly connected to the bottom of four protruding plates, and several heat-conducting copper pipes fixedly connected to the top of the heat-conducting plate, which slide through to the top outer wall of the main body.

[0030] Furthermore, several folded honeycomb panels are fixedly connected to the top of the heat-conducting plate, and the top of the folded honeycomb panels is fixedly connected to the bottom of the main body.

[0031] The guiding assembly includes a curved plate rotatably connected to the heat-conducting plate near the C-ring, with short rods fixedly connected to both the front and back of the curved plate.

[0032] The present invention has the following beneficial effects:

[0033] 1. This invention, through a fixing mechanism, a limiting component, and a flipping component, pushes a long rod two when the tilting rod slides downward, causing multiple flipping plates to flip outward and form tilted fins on both sides of the main body. At this time, the two sides of the chip can be exposed to the air. When multiple arc-shaped heat pipes flip outward, their outer walls contact the top of the substrate, increasing the contact area for heat conduction. This allows the heat generated by the chip to be transferred to the substrate and further diffused through the substrate. Subsequently, when a connecting channel is formed on both sides of the top of the main body, the heat generated by the chip can be dispersed outward through this channel. At the same time, when multiple flipping plates flip and expose the side walls of the chip, an open heat dissipation channel is formed. The flow of air and the outflow of hot gas can accelerate the outward diffusion of heat, thereby reducing the situation where heat is blocked during chip operation and flows back into the chip and accumulates inside the chip. This improves the heat dissipation efficiency and packaging quality of the chip after packaging.

[0034] 2. In this invention, through the heat dissipation component and the sliding component, when the bottom of the heat-conducting plate is pulled open and contacts the top of the chip, the multiple heat-conducting copper pipes and the vertical honeycomb structure on the heat-conducting plate can quickly diffuse heat to the outside of the main body and form an additional heat conduction path, thereby accelerating the outward dissipation of heat conduction. At the same time, the contact and pressing of the heat-conducting plate with the chip can also reduce the displacement of the chip or the breakage of contact with the substrate caused by external vibration during operation. This can enhance the heat dissipation efficiency of the chip during operation and also further enhance the stability of the chip during operation.

[0035] 3. In this invention, through the flipping component and the guiding component, when the flipping plate rotates and tilts, the end of the flipping plate will bend downward. At this time, the bending of the bending plate and the flipping plate can be guided at the connection between the two sides of the main body, thereby reducing the situation where dust-laden gas enters the main body through the connection between the two sides of the main body and the outside during chip operation, causing dust to adhere to the chip surface. This reduces the impact of dust accumulation on heat dissipation, thereby ensuring the stability of the chip's working environment and heat dissipation, and improving the cleanliness of the environment during chip operation.

[0036] Of course, any product implementing this invention does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0037] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0038] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0039] Figure 2 This is a schematic diagram of the overall partial cross-sectional structure of the present invention;

[0040] Figure 3 This is a schematic diagram of the main body of the invention;

[0041] Figure 4 This is a schematic diagram of the sliding component of the present invention;

[0042] Figure 5 For the present invention Figure 7 Enlarged view of point B in the middle;

[0043] Figure 6 For the present invention Figure 4 Enlarged view of point A in the middle;

[0044] Figure 7 This is a partial cross-sectional schematic diagram of the sliding component of the present invention;

[0045] Figure 8 This is a schematic diagram of the heat dissipation component of the present invention;

[0046] Figure 9 For the present invention Figure 8 Enlarged view of point C in the middle;

[0047] Figure 10 This is a schematic diagram of the planar flow direction of the present invention.

[0048] The attached diagram lists the components represented by each number as follows:

[0049] In the diagram: 1. Main body; 101. Square groove; 102. Notch groove; 11. Fixing mechanism; 111. Central ring; 112. Base plate; 12. Sliding assembly; 121. C-shaped ring; 122. Right-angled triangle plate; 123. Inclined rod; 13. Limiting assembly; 131. Hollow copper tube; 132. Arc-shaped heat conduction pipe; 133. Limiting spring; 2. Rotation mechanism; 201. Central rod; 21. Flipping assembly; 211. Flipping plate; 212. Long rod II; 3. Reinforcing mechanism; 301. Convex plate; 31. Heat dissipation assembly; 311. Heat conduction plate; 312. Heat conduction copper tube; 313. Folded honeycomb plate; 32. Guiding assembly; 321. Bending plate; 322. Short rod; 4. Chip. Detailed Implementation

[0050] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0051] Please see Figures 1-10 As shown, the present invention is a chip packaging structure that facilitates heat dissipation, including a main body 1 and a chip 4. The interior of the main body 1 is hollow, and it also includes;

[0052] Rotating mechanism 2 is installed on the side wall of the main body 1; it is used to prevent dust from entering when the chip 4 is working.

[0053] Reinforcing mechanism 3 is installed inside the main body 1 to increase heat dissipation when chip 4 is working.

[0054] The encapsulation of chip 4 by the main body 1 enables the rotating mechanism 2 and the reinforcing mechanism 3 to dissipate the heat generated by chip 4 when chip 4 is working.

[0055] C-shaped rings 121 are slidably connected to the left and right sides of the main body 1, and a right-angled triangle plate 122 is fixedly connected to the side of the C-shaped rings 121 near the middle of the main body 1.

[0056] The main body 1 includes several square grooves 101 formed on the left and right sides of the main body 1, and several notched grooves 102 formed on the side of the main body 1 near the square grooves 101. The main body 1 includes:

[0057] Fixing mechanism 11 is installed inside the main body 1;

[0058] Sliding component 12 is installed inside the main body 1;

[0059] Limiting component 13 is installed on the side wall of sliding component 12.

[0060] Rotating mechanism 2, the rotating mechanism 2 includes a central rod 201 that rotates through the interior of a plurality of square slots 101, the rotating mechanism 2 includes:

[0061] The flipping component 21 is installed on the outer surface of the center rod 201.

[0062] The reinforcing mechanism 3 includes four protruding plates 301 disposed inside the main body 1. The reinforcing mechanism 3 includes:

[0063] Heat dissipation component 31, the bottom of the protruding plate 301 is installed on the heat dissipation component 31;

[0064] The guide component 32 is installed on the side wall of the heat dissipation component 31.

[0065] The fixing mechanism 11 includes a central ring 111 fixedly connected inside the main body 1;

[0066] The bottom of the main body 1 is fixedly connected to a base plate 112.

[0067] The sliding assembly 12 includes two inclined rods 123 that are slidably connected to the inner wall of the main body 1 on the side near the C-ring 121;

[0068] The bottom of the C-shaped ring 121 is fixedly connected to an inclined block. First, the chip 4 is installed and connected to the substrate 112. Then, the central ring 111 inside the main body 1 covers the outer surface of the chip 4. Then, the top of the main body 1 is pressed down so that the bottom of the main body 1 is connected to the top of the substrate 112.

[0069] The limiting component 13 includes a hollow copper tube 131 rotatably connected to the C-shaped ring 121 on the side away from the middle of the main body 1, and a number of arc-shaped heat-conducting tubes 132 are rotatably connected to the outer surface of the hollow copper tube 131.

[0070] The end of the arc-shaped heat pipe 132 away from the hollow copper pipe 131 is located inside the notch groove 102;

[0071] A limiting spring 133 is fixedly connected to the top of the arc-shaped heat conduction pipe 132 located inside the notch groove 102. The top of the limiting spring 133 is fixedly connected to the top inner wall of the notch groove 102. When the bottom of the main body 1 is in contact with the top of the substrate 112, the bottom ends of the multiple arc-shaped heat conduction pipes 132 will contact the side wall of the substrate 112. Then, when the top of the main body 1 is pressed down, the multiple arc-shaped heat conduction pipes 132 will be squeezed upward under the reaction force generated by the substrate 112 and will slide obliquely upward while also flipping outward.

[0072] The flipping assembly 21 includes a flipping plate 211 that is rotatably fixedly connected to the outer surface of the central rod 201 located inside the square groove 101, and a long rod 212 is fixedly connected to one side of the flipping plate 211 near the main body 1.

[0073] The end of the flip plate 211 away from the long rod 212 is flexible. When the tilt rod 123 slides down, it pushes the long rod 212 and drives multiple flip plates 211 to flip outward and form inclined fins on both sides of the main body 1. At this time, the two sides of the chip 4 can be exposed to the air. When multiple arc-shaped heat pipes 132 flip outward, their outer walls can increase the contact area for heat conduction when they contact the top of the substrate 112.

[0074] The heat dissipation assembly 31 includes a heat-conducting plate 311 fixedly connected to the bottom of four protruding plates 301. Several heat-conducting copper pipes 312 are fixedly connected to the top of the heat-conducting plate 311, and the heat-conducting copper pipes 312 slide through to the top outer wall of the main body 1.

[0075] Several folded honeycomb plates 313 are fixedly connected to the top of the heat-conducting plate 311, and the top of the folded honeycomb plates 313 is fixedly connected to the bottom of the main body 1.

[0076] The guiding component 32 includes a bent plate 321 rotatably connected to the heat-conducting plate 311 near the C-shaped ring 121. Short rods 322 are fixedly connected to both the front and back of the bent plate 321. When the bottom of the heat-conducting plate 311 is pulled open and the folded honeycomb plate 313 contacts the top of the chip 4, the multiple heat-conducting copper pipes 312 and the vertical honeycomb structure on the heat-conducting plate 311 can quickly diffuse heat to the outside of the main body 1 and form an additional heat conduction path, thereby accelerating the outward dissipation of heat conduction.

[0077] In use, first install and connect chip 4 to substrate 112. Then, cover the outer surface of chip 4 with the central ring 111 inside the main body 1. Then, press down on the top of the main body 1 to connect the bottom of the main body 1 with the top of substrate 112. Then, apply filler between the outside of the main body 1 and substrate 112 to cover chip 4 and fix it on the top of substrate 112 to complete the encapsulation of chip 4.

[0078] When the bottom of the main body 1 contacts the top of the substrate 112, the bottom ends of the multiple arc-shaped heat pipes 132 will contact the sidewalls of the substrate 112. Then, when the top of the main body 1 is pressed down, the multiple arc-shaped heat pipes 132 will be pushed upwards by the reaction force generated by the substrate 112, causing them to slide obliquely upwards and flip outwards. When the multiple arc-shaped heat pipes 132 flip outwards, their outer walls will contact the top of the substrate 112. Simultaneously, the outward rotation of the multiple arc-shaped heat pipes 132 will cause the C-shaped ring 121 to slide outwards via the hollow copper tube 131. At this time, the left and right sides of the main body 1 will be connected by the sliding of the C-shaped ring 121. Subsequently, as the C-shaped ring 121 slides outwards, the inclined block at the bottom of the C-shaped ring 121 will press against the sidewall of the inclined rod 123, causing it to slide downwards. When the inclined rod 123 slides downwards, it will push the long rod 212 and... Multiple flip plates 211 are flipped outwards, forming inclined fins on both sides of the main body 1. At this time, the sides of the chip 4 are exposed to the air. When multiple arc-shaped heat pipes 132 are flipped outwards, their outer walls contact the top of the substrate 112, increasing the contact area for heat conduction. This allows the heat generated by the chip 4 to be transferred to the substrate 112 and further diffused through the substrate 112. Subsequently, when a connecting channel is formed on both sides of the top of the main body 1, the heat generated by the chip 4 can be dispersed outwards through this channel. At the same time, when multiple flip plates 211 are flipped to expose the side walls of the chip 4, an open heat dissipation channel is formed. The flow of air and the outflow of hot gas can accelerate the outward diffusion of heat, thereby reducing the situation where the heat of the chip 4 is blocked during operation and heat flows back into the chip 4 and accumulates inside the chip 4. This improves the heat dissipation efficiency and packaging quality of the chip after packaging.

[0079] When the C-ring 121 is stretched and slides, the sliding of the C-ring 121 will cause the right-angled triangle 122 to press against the protrusion 301 during the sliding. When the protrusion 301 is pressed, it will cause the heat-conducting plate 311 to slide downward. When the heat-conducting plate 311 slides downward, it will contact the top of the chip 4 and exert a downward pressure on the chip 4. At the same time, the downward pressure of the heat-conducting plate 311 will stretch the folded honeycomb plate 313 and also cause the bending plate 321 to move downward synchronously. At this time, the bending plate 321 will slide down the side wall of the chip 4 at an angle. When the bottom of the heat-conducting plate 311 is pulled... When the folded honeycomb plate 313 is opened and comes into contact with the top of the chip 4, the multiple heat-conducting copper pipes 312 and the vertical honeycomb structure on the heat-conducting plate 311 can quickly diffuse heat to the outside of the main body 1 and form an additional heat conduction path, thereby accelerating the outward dissipation of heat conduction. At the same time, the contact and pressing of the heat-conducting plate 311 with the chip 4 can also reduce the displacement of the chip 4 under external vibration or the break in contact with the substrate 112 during operation, thereby enhancing the heat dissipation efficiency of the chip 4 during operation and also further enhancing the stability of the chip 4 during operation.

[0080] When the C-ring 121 slides and causes the heat-conducting plate 311 to slide downwards, the sliding of the C-ring 121 will push the short rod 322 through the C-ring 121, causing the short rod 322 to cause the top of the bending plate 321 to bend, presenting... Figure 9 In the intermediate state, the top of the bent plate 321 faces the through hole on the side wall of the main body 1. At the same time, when the flip plate 211 rotates and tilts, the end of the flip plate 211 bends downward, and a gap is formed between the bent plate 321 and the flip plate 211. Figure 10 In this state, the bending of the bending plate 321 and the flipping plate 211 can be guided by bending at the connection between the two sides of the main body 1. This reduces the possibility of dust-laden gas entering the main body 1 through the connection between the two sides of the main body 1 and the outside during operation, causing dust to adhere to the surface of the chip 4. This reduces the impact of dust accumulation on heat dissipation, thereby ensuring the stability of the chip 4's working environment and heat dissipation, and improving the cleanliness of the working environment of the chip 4.

[0081] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A chip packaging structure for easy heat dissipation, comprising a body (1) and a chip (4), wherein the interior of the body (1) is hollow, characterized in that, Also includes: A rotating mechanism (2) is installed on the side wall of the main body (1) to prevent dust from entering when the chip (4) is working. A reinforcing mechanism (3) is installed inside the main body (1) to increase the heat dissipation of the chip (4) during operation. Among them, the encapsulation of the chip (4) by the main body (1) enables the rotating mechanism (2) and the reinforcing mechanism (3) to dissipate the heat generated by the chip (4) when the chip (4) is working; C-shaped rings (121) are slidably connected to the left and right sides of the main body (1), and a right-angled triangle plate (122) is fixedly connected to the side of the C-shaped ring (121) near the middle of the main body (1). The main body (1) includes several square slots (101) opened on the left and right sides of the main body (1). Rotating mechanism (2), the rotating mechanism (2) includes a central rod (201) that rotates through a plurality of square slots (101), the rotating mechanism (2) includes: A flipping assembly (21) is mounted on the outer surface of the center rod (201); The reinforcing mechanism (3) includes four protruding plates (301) disposed inside the main body (1), and the reinforcing mechanism (3) includes: Heat dissipation assembly (31), wherein the bottom of the heat dissipation assembly (31) is mounted on the protrusion (301); A guide component (32) is mounted on the side wall of the heat dissipation component (31); The flipping assembly (21) includes a flipping plate (211) that is rotatably fixedly connected to the outer surface of the central rod (201) located inside the square groove (101), and a number of the flipping plates (211) are fixedly connected to a long rod (212) on the side near the main body (1). The end of the flip plate (211) away from the long rod (212) is bendable; The heat dissipation assembly (31) includes a heat-conducting plate (311) fixedly connected to the bottom of four protruding plates (301), and a number of heat-conducting copper pipes (312) are fixedly connected to the top of the heat-conducting plate (311). The heat-conducting copper pipes (312) slide through to the top outer wall of the main body (1). The top of the heat-conducting plate (311) is fixedly connected with several folded honeycomb plates (313).

2. The chip packaging structure for easy heat dissipation according to claim 1, characterized in that: The main body (1) has several notches (102) on one side near the square groove (101), and the main body (1) includes: A fixing mechanism (11) is installed inside the main body (1); A sliding component (12) is installed inside the main body (1); Limiting component (13) is installed on the side wall of sliding component (12).

3. The chip packaging structure for easy heat dissipation according to claim 2, characterized in that: The fixing mechanism (11) includes a central ring (111) fixedly connected inside the main body (1); The bottom of the main body (1) is fixedly connected to a base plate (112).

4. The chip packaging structure for easy heat dissipation according to claim 3, characterized in that: The sliding assembly (12) includes two inclined rods (123) that are slidably connected to the inner wall of the body (1) near the C-ring (121). An inclined block is fixedly connected to the bottom of the C-shaped ring (121).

5. The chip packaging structure for easy heat dissipation according to claim 4, characterized in that: The limiting component (13) includes a hollow copper tube (131) rotatably connected to the C-shaped ring (121) on the side away from the middle of the main body (1), and a plurality of arc-shaped heat-conducting tubes (132) are rotatably connected to the outer surface of the hollow copper tube (131). The arc-shaped heat pipe (132) is located at the end away from the hollow copper pipe (131) inside the notch groove (102); A limiting spring (133) is fixedly connected to the top of the arc-shaped heat-conducting pipe (132) located inside the notch groove (102), and the top of the limiting spring (133) is fixedly connected to the top inner wall of the notch groove (102).

6. The chip packaging structure for easy heat dissipation according to claim 5, characterized in that: The top of the folded honeycomb panel (313) is fixedly connected to the bottom of the main body (1); The guide assembly (32) includes a curved plate (321) rotatably connected to the heat-conducting plate (311) on the side near the C-ring (121), and short rods (322) are fixedly connected to both the front and back sides of the curved plate (321).

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