Wireless communication module

Abstract

The wireless communication module comprises a box body, a circuit board and a first heat dissipation structure, the box body comprises a bottom shell and a top shell, and a power device is arranged on the circuit board; the first heat dissipation mechanism comprises a vapor chamber, a heat pipe, a heat conduction pad and a first heat dissipation piece, the heat conduction pad covers the exposed surface of the power device, the vapor chamber is in contact with the surface, away from the power device, of the heat conduction pad, the first heat dissipation piece is embedded in the first opening, and the heat dissipation surface of the first heat dissipation piece extends out of the containing cavity; the heat pipe comprises a first heat conduction section, a second heat conduction section and a third heat conduction section, the first heat conduction section is inserted into the non-cavity area of the vapor chamber, the second heat conduction section is located in the containing cavity and connected with the first heat conduction section and the third heat conduction section, and the third heat conduction section is inserted into the first heat dissipation piece. According to the communication-free module, heat dissipation can be accelerated in a natural convection or forced convection mode, so that the heat dissipation efficiency can be remarkably improved, and performance degradation or faults caused by long-term high-temperature operation of the wireless communication module are avoided.

Description

Technical Field

[0001] The present invention relates to the field of communication technology, and in particular to a wireless communication module. Background Art

[0002] The wireless communication module is a miniaturized communication device that integrates radio frequency, baseband and protocol processing functions. It achieves low-power, low-cost and high-reliability remote data transmission through technologies such as 5G RedCap (lightweight 5G). It is widely used in industrial Internet of Things, smart grid, video surveillance, wearable devices and other fields.

[0003] As a key component for enabling device networking, 5G wireless telecommunications modules require integrated high-performance chips that support complex functions such as 5G LAN, URLLC (Ultra-Reliable Low-Latency Communication), and network slicing. However, with the continuous improvement of chip computing power (e.g., process technology evolution to below 5nm and integration exceeding the 10 billion transistor level), power consumption density per unit volume has increased exponentially. Actual measurement data shows that under peak computing conditions, the local temperature of the module's core chip can reach over 85°C, far exceeding the temperature threshold for normal semiconductor device operation. To address the heat dissipation issues of high-density integrated circuits, traditional 5G modules generally use built-in active cooling solutions (such as micro-water cooling circulation systems or axial-flow air cooling structures). While this solution meets the requirements to a certain extent, the use of built-in active cooling solutions results in excessively large and heavy wireless communication modules. This makes them unsuitable for installation in compact applications (such as drones, wearable devices, and industrial sensors), severely restricting the application and promotion of 5G technology in lightweight and miniaturized devices. Summary of the Invention

[0004] In order to solve the above technical problems or at least partially solve the above technical problems, the present application provides a wireless communication module.

[0005] This application provides a wireless communication module, including:

[0006] The box body includes a bottom shell and a top shell connected to the bottom shell, wherein the bottom shell and the top shell together form a receiving cavity, and a first opening communicating with the receiving cavity is formed on an outer circumference of the top shell;

[0007] A circuit board is arranged in the accommodating cavity, and a power device is arranged on the circuit board;

[0008] a first heat dissipation mechanism, comprising a vapor chamber, a heat pipe, a thermal pad, and a first heat sink, wherein the thermal pad covers an exposed surface of the power device, the vapor chamber is disposed in the accommodating cavity and contacts a surface of the thermal pad facing away from the power device, the first heat sink is embedded in the first opening, and a heat dissipation surface of the first heat sink extends outside the accommodating cavity;

[0009] In which, the heat pipe includes a first heat conducting section, a second heat conducting section and a third heat conducting section. The first heat conducting section is inserted into the non-cavity area of ​​the heat spreader along the first direction. The second heat conducting section is located in the accommodating cavity, connecting the first heat conducting section and the third heat conducting section. The third heat conducting section is inserted into the first heat dissipation member along the first direction.

[0010] In one embodiment, the first heat sink includes a main body and a plurality of heat dissipation fins, the main body is embedded in the first opening, the plurality of heat dissipation fins are arranged on the surface of the main body at intervals along the first direction and extend out of the accommodating cavity, and the third heat conduction section is inserted into the main body along the first direction.

[0011] In one embodiment, a second heat dissipation mechanism is further included, wherein the second heat dissipation mechanism includes:

[0012] The mounting frame includes a top plate and two windshields, the two windshields being connected to opposite sides of the top plate along a second direction, and a covering space being enclosed between the two windshields and the top plate; after the box body is fixed to the top plate and placed in the covering space, the windshields extend along the second direction and cover the outer surface of the first heat sink, and a gap for airflow to pass through is left between the windshields and the first heat sink; wherein the second direction is perpendicular to the first direction;

[0013] An air guide member is mounted on the top plate, the air guide member having an air guide cavity and an air inlet and an air outlet communicating with the air guide cavity, the air outlet facing the cover space;

[0014] A fan is mounted on the top plate, and the fan blades extend into the air guide cavity so as to generate airflow through rotation, so that external air is sucked into the air guide cavity from the air inlet and flows to the cover space through the air outlet, and under the guidance of the wind shield, the airflow flows along the second direction through the heat dissipation surface of the first heat dissipation component.

[0015] In one embodiment, the second heat dissipation mechanism further includes:

[0016] a heat-conducting fin, which is provided in the air-guiding cavity and located between the air inlet and the fan;

[0017] A semiconductor refrigeration plate having a cold end surface and a hot end surface opposite to each other, wherein the cold end surface of the semiconductor refrigeration plate is attached to the top surface of the heat conducting fin;

[0018] a cover plate, which is arranged on the top of the air guide member to cover the air guide cavity, and the cover plate is provided with a second opening corresponding to the position of the semiconductor cooling plate, and the hot end surface of the semiconductor cooling plate is exposed to the outside of the cover plate through the second opening;

[0019] The second heat dissipation element is arranged on a side of the cover plate away from the air guide element and contacts the hot end surface of the semiconductor refrigeration plate.

[0020] In one embodiment, the windshield is provided with sliding grooves at both ends in the first direction, and the surface of the top shell with the first opening is provided with a limit block, and the limit block is located on the outside of the first opening and is used to adapt to the sliding groove to connect the mounting frame to the box body.

[0021] In one embodiment, a quick-install mechanism is further included, and the quick-install mechanism includes:

[0022] a mounting plate having a support surface, the bottom shell being placed on the support surface;

[0023] The locking mechanism includes a lock post, a lock sleeve, and a locking assembly, wherein one end of the lock post is connected to the support surface and the other end extends along the second direction. The lock sleeve extending along the second direction is connected to the outer surface of the windshield corresponding to the lock post. The lock sleeve has a cavity for inserting the lock post. The locking assembly is disposed in the cavity and has a locked state and an unlocked state.

[0024] When the mounting bracket is fixedly connected to the mounting plate, the locking assembly is in a locking state so that the lock column is locked in the cavity of the lock sleeve; when the mounting bracket and the mounting plate are disassembled, the locking assembly is in an unlocking state so that the lock column and the lock sleeve are separated.

[0025] In one embodiment, the quick-install mechanism further includes:

[0026] an elastic member disposed in the middle of the support surface so as to drive the locking sleeve to move by utilizing the elastic force received by the elastic member;

[0027] The locking assembly includes a locking sleeve, an elastic locking rod and a locking block. A locking head is provided at one end of the lock column away from the mounting plate, and a boss is formed on the lock column. The locking sleeve can be slidably mounted on the lock column and is located between the boss and the locking head. A mounting portion connected to the cavity is extended radially along the outer periphery of the lock sleeve. The elastic locking rod is accommodated in the mounting portion, and one end of the elastic locking rod extends toward the cavity and is connected to the locking block.

[0028] In one embodiment, the mounting plate has extending portions at both ends in the first direction, and the extending portions are provided with mounting lugs.

[0029] In one embodiment, a dust screen is installed at the air inlet.

[0030] In one embodiment, a battery cover is further included, wherein the top shell is concave to form a battery cavity, and the battery cavity accommodates a battery module for supplying power to the circuit board. The battery cover can be connected to the top shell in an openable and closable manner to cover the battery cavity.

[0031] The above technical solution provided by the embodiment of the present application has the following advantages compared with the prior art:

[0032] (1) The generated heat is transferred to the heat spreader by using the thermal pad, and then the heat is quickly transferred to the first heat sink through the first heat sink, the second heat sink, and the third heat sink. Since the heat dissipation surface of the first heat sink extends out of the accommodating cavity, it can directly contact the external air, so that the heat dissipation can be accelerated by natural convection or forced convection, thereby significantly improving the heat dissipation efficiency and avoiding the performance degradation or failure of the wireless communication module due to long-term high-temperature operation;

[0033] (2) By connecting the second heat dissipation mechanism to the box body, the fan rotation can be controlled to generate airflow, so that the external air is sucked into the air guide cavity from the air inlet and flows into the cover space through the air outlet. Since the wind shield is located on the outer surface of the first heat dissipation element, the air flowing into the cover space is blocked by the wind shield and blown toward the first heat dissipation element, forming forced convection, thereby quickly dissipating the heat of the power device conducted to the first heat dissipation element through the heat spreader and the heat pipe to the outside, effectively reducing the internal temperature of the module;

[0034] (3) The heat-conducting fins are cleverly used to increase the contact area with the air flow in the air guide cavity, and in conjunction with the cold end surface of the semiconductor refrigeration plate, the heat in the air flow can be quickly absorbed, the heat exchange efficiency is forced, and the temperature of the air flow entering the cover space is further reduced, forming a composite heat dissipation mode of "active cooling + forced air cooling". BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0036] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0037] In the attached figure:

[0038] Figure 1 This is a structural diagram of a wireless communication module in a disassembled state according to the present application;

[0039] Figure 2 This is a structural diagram of a wireless communication module in the present application in an assembled state;

[0040] Figure 3 This is a schematic diagram of a box body and a first heat dissipation mechanism in a wireless communication module of the present application;

[0041] Figure 4 This is a structural diagram of a top shell and a bottom shell in a wireless communication module of the present application;

[0042] Figure 5 This is an exploded schematic diagram of a second heat dissipation mechanism in a wireless communication module of the present application;

[0043] Figure 6 This is a structural diagram of a quick-install mechanism in a wireless communication module of the present application;

[0044] Figure 7 This is a structural diagram of the matching lock sleeve and lock cylinder in a wireless communication module of the present application.

[0045] Figure Number:

[0046] 10. Box body; 10a. Accommodating cavity; 11. Bottom shell; 111. Buckle; 12. Top shell; 12a. First opening; 12b. Battery cavity; 20. Circuit board; 21. Power device; 30. First heat dissipation mechanism; 31. Heat spreader; 32. Heat pipe; 321. First heat conduction section; 322. Second heat conduction section; 323. Third heat conduction section; 33. Thermal pad; 34. First heat dissipation element; 341. Main body; 342. Heat dissipation fins; 40. Second heat dissipation element; 41. Mounting frame; 41a. Covering space; 411. Top plate; 412. Wind shield; 412a. Slide; 42. Air guide; 42a. Air guide cavity; 43. Fan; 44. Heat conduction fins ;45. Semiconductor refrigeration plate;45a. Cold end surface;45b. Hot end surface;46. Cover plate;46a. Second opening;47. Second heat sink;50. Quick-install mechanism;51. Mounting plate;51a. Support surface;511. Extension portion;512. Mounting lug;52. Locking mechanism;521. Locking column;521a. Boss;522. Locking sleeve;522a. Cavity;523. Locking assembly;5231. Unlocking sleeve;5232. Elastic locking rod;5233. Locking block;53. Elastic member;54. Locking head;522b. Mounting portion;60. Dustproof net;70. Battery cover;80. Docking column;90. Docking sleeve;X, first direction;Y, second direction. DETAILED DESCRIPTION

[0047] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific embodiments of the present invention are now described in detail with reference to the accompanying drawings. In the following description, it should be understood that the directions or positional relationships indicated by "front", "back", "up", "down", "left", "right", "longitudinal", "horizontal", "vertical", "horizontal", "top", "bottom", "inside", "outside", "head", "tail", etc. are based on the directions or positional relationships shown in the accompanying drawings and are constructed and operated in specific directions. They are only for the convenience of describing the technical solution and do not indicate that the devices or components referred to must have specific directions. Therefore, they should not be understood as limiting the present invention.

[0048] It should also be noted that, unless otherwise clearly specified and limited, terms such as "installed", "connected", "connected", "fixed", and "set" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. When an element is referred to as being "on" or "under" another element, the element can be "directly" or "indirectly" located on the other element, or there may be one or more intervening elements. The terms "first", "second", "third", etc. are only for the convenience of describing the present technical solution, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", "third", etc. may explicitly or implicitly include one or more of such features. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0049] In the following description, specific details such as particular system structures and techniques are provided for purposes of illustration, not limitation, to facilitate a thorough understanding of the embodiments of the present invention. However, it will be apparent to those skilled in the art that the present invention may be practiced in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.

[0050] In the prior art, due to the design requirements of electromagnetic interference and electromagnetic radiation, wireless communication modules usually house the electrical circuit board in a box for electromagnetic shielding. However, the circuit board of the wireless communication module is integrated with multiple high-heat-generating power devices (such as integrated chips). The heat of the power devices is usually transferred to the surface of the shielding box by means of thermal adhesive or thermal pads. A thermal pad is set on the surface of the power device, and then the heat is transferred to the surface of the shielding box by the thermal pad, and then the heat is dissipated to the surrounding environment by the heat sink, thereby achieving the purpose of heat dissipation. However, this current heat dissipation method has low heat dissipation efficiency and cannot meet the heat dissipation requirements of the wireless communication module. Based on this, the present application provides a wireless communication module that can improve heat dissipation efficiency, occupies less space, and is more lightweight and compact. It should be noted here that the "first direction X" and "second direction Y" in this embodiment are defined for the convenience of describing the positional relationship between components, wherein the second direction Y is perpendicular to the first direction X. Specifically, the heat spreader 31 can be used as a reference, and the "first direction X" refers to the length direction of the heat spreader 31 (refer to Figure 1 The second direction Y refers to the height direction of the heat spreader 31 (refer to Figure 1 in the X direction).

[0051] Figure 1 This is a structural diagram of a wireless communication module in a disassembled state according to the present application; Figure 2 This is a structural diagram of a wireless communication module in the present application in an assembled state; Figure 3 This is a schematic diagram of a box body 10 and a first heat dissipation mechanism 30 in a wireless communication module of the present application. Figures 1 to 3 As shown, the wireless communication module includes a box body 10, a circuit board 20, a first heat dissipation mechanism 30, a second heat dissipation mechanism 40 and a quick-install mechanism 50. The second heat dissipation mechanism 40 is assembled on the periphery of the box body 10 through the quick-install mechanism 50 so that the box body 10 is covered by the second heat dissipation mechanism 40. The first heat dissipation mechanism 30 is used to quickly conduct the heat generated by the power device 21 during operation, and under the clamping of the second heat dissipation mechanism 40, accelerate the heat generated by the power device 21 on the circuit board 20 to be quickly dissipated into the atmosphere.

[0052] Specifically, the box body 10 includes a bottom shell 11 and a top shell 12 connected to the bottom shell 11. The bottom shell 11 and the top shell 12 together form a storage cavity 10a, and the outer peripheral side of the top shell 12 is provided with a first opening 12a connected to the storage cavity 10a. The circuit board 20 is arranged in the storage cavity 10a. The circuit board 20 is provided with a power device 21. The power device 21 refers to the integrated chip on the circuit board 20 of the wireless communication module in the current technology, which generates high heat during operation. The first heat dissipation mechanism 30 includes a heat spreader 31, a heat pipe 32, a thermal pad 33 and a first heat sink 34. The thermal pad 33 covers the exposed surface of the power device 21. The heat spreader 31 is arranged in the storage cavity 10a and contacts the surface of the thermal pad 33 facing away from the power device 21. The first heat sink 34 is embedded in the first opening 12a, and the heat dissipation surface of the first heat sink 34 extends out of the storage cavity 10a. Among them, the heat pipe 32 includes a first heat conducting section 321, a second heat conducting section 322 and a third heat conducting section 323. The first heat conducting section 321 is inserted into the non-cavity area of ​​the heat spreader 31 along the first direction X. The second heat conducting section 322 is located in the accommodating cavity 10a, connecting the first heat conducting section 321 and the third heat conducting section 323. The third heat conducting section 323 is inserted into the first heat dissipation member 34 along the first direction X.

[0053] That is, by covering the exposed surface of the power device 21 with a thermal pad 33, contacting the thermal pad 33 with a vapor chamber 31, inserting the first thermally conductive segment 321 of the heat pipe 32 into the non-cavity area of ​​the vapor chamber 31, inserting the third thermally conductive segment 323 into the first heat sink 34, and connecting the first thermally conductive segment 321 and the third thermally conductive segment 323, a first heat dissipation mechanism 30 is formed. When the power device 21 generates heat, the thermal pad 33 transfers the generated heat to the vapor chamber 31. The heat is then rapidly transferred to the first heat sink 34 via the first thermally conductive segment 321, the second thermally conductive segment 322, and the third thermally conductive segment 323. Because the heat dissipation surface of the first heat sink 34 extends outside the accommodating cavity 10a and is directly exposed to the outside air, heat dissipation is accelerated by natural or forced convection, thereby significantly improving heat dissipation efficiency and preventing performance degradation or failure of the wireless communication module due to long-term high-temperature operation. In addition, the slender shape of the heat pipe 32 and the thin structure of the heat spreader 31 can reduce the internal space occupied, which is suitable for the miniaturization and integration design requirements of the wireless communication module.

[0054] For example, the heat pipe 32 of this embodiment quickly transfers heat from the vapor chamber 31 to the first heat sink 34, thereby performing a heat transfer function. To this end, the heat pipe 32 can be made of a material with good thermal conductivity, or a phase change heat pipe 32 commonly used for heat transfer in the prior art can also be used, without limitation.

[0055] Furthermore, it should be noted that the vapor chamber 31 is a prior art, being a highly efficient heat dissipation element based on the principle of phase change heat transfer. It comprises upper and lower metal shells and a working medium, which are brazed and sealed at the edges to form a sealed hollow cavity, within which the working medium is contained. Specifically, in this embodiment, the vapor chamber 31 comprises a cavity region and a non-cavity region, with the first heat conducting section 321 of the heat pipe 32 inserted into the non-cavity region of the vapor chamber 31. This is to avoid penetrating the cavity of the vapor chamber 31, which would significantly reduce the thermal conductivity of the vapor chamber 31 and even render the heat dissipation function ineffective.

[0056] In addition, the exposed surface of the power device 21 is directly covered with a thermal pad 33 so that it can quickly absorb the heat generated by the power device 21 during operation and transfer it to the heat spreader 31 through close contact. The heat spreader 31 uses the internal phase change heat transfer principle to evenly distribute the concentrated heat to a larger area. Compared with the traditional method of only using the thermal pad 33 to transfer heat to the box body 10, it can effectively avoid local overheating of the power device 21, thereby maintaining the stability of the operating temperature of the power device 21.

[0057] Figure 4 This is a structural diagram of the top shell 12 and the bottom shell 11 in a wireless communication module of the present application. Figure 4To prevent the circuit board 20 from moving or shaking during use, this embodiment also provides docking posts 80 on the surface of the bottom shell 11 facing the top shell 12, and corresponding docking sleeves 90 on the surface of the top shell 12 facing the bottom shell 11. A through-hole is provided in the center of the solar panel to allow the docking posts 80 to pass through the through-hole and engage with the docking sleeves 90, thereby securing the solar panel. Furthermore, multiple clips 111 are distributed circumferentially on the surface of the bottom shell 11 facing the top shell 12. These clips 111, combined with their ability to clamp and limit the outer surface of the circuit board 20, ensure that the circuit board 20 is restrained and fixed, preventing movement.

[0058] Reference Figure 3 In one embodiment, the first heat sink 34 includes a main body 341 and a plurality of heat sink fins 342. The main body 341 is embedded in the first opening 12a. The plurality of heat sink fins 342 are spaced apart on the surface of the main body 341 along the first direction X and extend outside the accommodating cavity 10a. In actual use, when heat from the vapor chamber 31 is transferred to the main body 341 via the heat pipe 32, the plurality of heat sink fins 342 spaced apart on the surface of the main body 341 along the first direction X extend outside the accommodating cavity 10a, allowing the heat to be quickly removed by natural convection or forced convection. This allows the heat transferred from the power device 21 to the first heat sink 34 via the vapor chamber 31 and heat pipe 32 to be dissipated more quickly, thereby preventing excessive internal module temperatures from causing device performance degradation or failure.

[0059] In addition, the multiple heat dissipation fins 342 are arranged in a spaced-apart manner, providing a through-channel for airflow. When external air flows through the gaps between the fins, more efficient convection heat dissipation is achieved. Compared to a solid flat-plate heat dissipation structure, the spaced-apart fins can reduce air flow resistance, allowing airflow to carry away heat more smoothly. At the same time, by providing a first opening 12a on the outer periphery of the top shell 12, the main body 341 can be embedded and fixed to the top shell 12. This ensures a stable heat conduction path between the first heat dissipation ribs and the internal heat spreader 31 and heat pipe 32, while also utilizing the top shell 12 structure to secure the first heat sink 34, eliminating the need for other auxiliary fixings. This reduces the space occupied within the module and meets the design requirements of miniaturization and integration of wireless communication modules.

[0060] Figure 5 This is an exploded schematic diagram of the second heat dissipation mechanism 40 in a wireless communication module of the present application. Figure 5In one embodiment, the second heat dissipation mechanism 40 is further included. The second heat dissipation mechanism 40 includes a mounting frame 41, an air guide 42, and a fan 43. The mounting frame 41 includes a top plate 411 and two air shields 412. The two air shields 412 are connected to opposite sides of the top plate 411 along the second direction Y, and a cover space 41a is formed between the two air shields 412 and the top plate 411. After the box body 10 is fixed to the top plate 411 and placed in the cover space 41a, the air shields 412 extend along the second direction Y and cover the outer surface of the first heat dissipation member 34, and a gap for airflow to pass through is left between the air shields 412 and the first heat dissipation member 34. The air guide 42 is mounted on the top plate 411 and has an air guide cavity 42a and an air inlet and outlet connected to the air guide cavity 42a, with the air outlet facing the cover space 41a. The fan 43 is installed on the top plate 411, and the blades of the fan 43 extend into the air guide cavity 42a so as to generate airflow through rotation, so that external air is sucked into the air guide cavity 42a from the air inlet and flows to the cover space 41a through the air outlet. Under the guidance of the wind shield 412, the airflow flows along the second direction Y through the heat dissipation surface of the first heat dissipation component 34.

[0061] For example, the two side panels and the top panel 411 are used to form a housing space 41a, so that the box body 10 can be housed in the housing space 41a. The fan 43 is then controlled to rotate to generate airflow, so that external air is sucked into the air guide cavity 42a from the air inlet, and flows into the housing space 41a through the air outlet. Since the windshield 412 is located on the outer surface of the first heat sink 34, the air flowing into the housing space 41a is blocked by the windshield 412 and blown toward the first heat sink 34, thereby forming forced convection, thereby quickly dissipating the heat conducted from the power device 21 to the first heat sink 34 through the heat spreader 31 and the heat pipe 32 to the outside, effectively reducing the internal temperature of the module. In other words, the second heat dissipation mechanism 40 can form forced convection with the first heat sink 34, which can significantly increase the air flow rate and enhance the heat exchange efficiency between the first heat sink 34 and the air compared to the method of relying on natural air flow to dissipate heat.

[0062] For example, the two windshields 412 of the mounting frame 41 cover the outer surface of the first heat sink 34 along the second direction Y, leaving a gap between them and the first heat sink 34, thereby forming an airflow channel. This prevents airflow from diffusing to the sides (for example, without the windshields 412, airflow may escape from the sides of the heat sink), and focuses the airflow driven by the fan 43 along the second direction Y through the gaps between the heat sink fins 342, ensuring full contact between the airflow and the heat sink fins 342, maximizing the use of the fan 43's energy, and reducing ineffective heat dissipation.

[0063] Reference Figure 5In one embodiment, the second heat dissipation mechanism 40 further includes heat-conducting fins 44, semiconductor cooling fins 45, and a cover plate 46. The heat-conducting fins 44 are arranged in the air guide cavity 42a and between the air inlet and the fan 43. The semiconductor cooling fin 45 has a relative cold end surface 45a and a hot end surface 45b. The cold end surface 45a of the semiconductor cooling fin 45 is attached to the top surface of the heat-conducting fin 44. The cover plate 46 is arranged on the top of the air guide member 42 to seal the air guide cavity 42a. The cover plate 46 has a second opening 46a corresponding to the position of the semiconductor cooling fin 45. The hot end surface 45b of the semiconductor cooling fin 45 is exposed to the outside of the cover plate 46 through the second opening 46a. The second heat dissipation member 47 is arranged on the side of the cover plate 46 facing away from the air guide member 42 and contacts the hot end surface 45b of the semiconductor cooling fin 45.

[0064] For example, by attaching the cold end surface 45a of the semiconductor refrigeration plate 45 to the top surface of the heat-conducting fin 44, and the heat-conducting fin 44 is disposed in the air guide cavity 42a, when the fan 43 is running, external air is sucked in from the air inlet and flows through the heat-conducting fin 44. At this time, the cold end of the semiconductor refrigeration plate 45 absorbs heat from the air through the heat-conducting fin 44, causing the temperature of the airflow entering the air guide cavity 42a to decrease, thereby forming a pre-"pre-cooling" effect. The low-temperature airflow then blows toward the first heat sink 34 through the air outlet, thereby more efficiently removing heat from the heat dissipation surface of the first heat sink 34 and further improving the heat dissipation effect. In other words, by cleverly utilizing the heat-conducting fin 44 to increase the contact area with the airflow in the air guide cavity 42a, and in conjunction with the cold end surface 45a of the semiconductor refrigeration plate 45, heat in the airflow can be quickly absorbed, forcing the heat exchange efficiency, ensuring that the temperature of the airflow entering the cover space 41a is further reduced, and forming a composite heat dissipation mode of "active cooling + forced air cooling".

[0065] Exemplarily, the hot end surface 45b of the semiconductor refrigeration plate 45 is exposed to the outside through the second opening 46a of the cover plate 46 and contacts the second heat sink 47. When the semiconductor refrigeration plate 45 is working, the heat generated by the hot end is directly dissipated to the external environment through the second heat sink 47, and is completely isolated from the low-temperature air flow path in the air guide cavity 42a, thereby avoiding the heat from the hot end affecting the cooling effect in the air guide cavity 42a, ensuring the independence of the heat dissipation paths of the hot and cold ends, and improving the heat dissipation stability of the system.

[0066] Reference Figure 3 and Figure 5In one embodiment, the windshield 412 is provided with sliding grooves 412a at both ends in the first direction X, and a stopper is provided on the surface of the top shell 12 having the first opening 12a. The stopper is located outside the first opening 12a and is adapted to fit with the sliding groove 412a to connect the mounting bracket 41 to the box body 10. In other words, when the second heat dissipation mechanism 40 is connected to the box body 10, the sliding groove 412a on the windshield 412 is aligned with the stopper on the top shell 12, and then the mounting bracket 41 is moved toward the top shell 12 so that the stopper cooperates with the sliding groove 412a to limit the position. At this time, the mounting bracket 41 is pre-fixed to the box body 10 so that it can be subsequently fixed using auxiliary fixing members. Compared with the traditional method of fixing with screws, this method reduces the number of assembly steps and time, and can achieve rapid on-site installation. In addition, the slide groove 412a provides a clear insertion guide path for the limit block, ensuring that the mounting frame 41 and the box body 10 can be accurately aligned along the preset direction during assembly, avoiding misalignment or tilting caused by manual installation, thereby ensuring the position accuracy of the subsequent second heat dissipation mechanism 40.

[0067] Figure 6 This is a schematic diagram of the structure of a quick-install mechanism 50 in a wireless communication module of the present application. Figure 6 In one embodiment, a quick-installation mechanism 50 is further included. The quick-installation mechanism 50 includes a mounting plate 51 and a locking mechanism 52. The mounting plate 51 has a support surface 51a, and the bottom shell 11 is placed on the support surface 51a. The locking mechanism 52 includes a locking column 521, a locking sleeve 522, and a locking assembly 523. One end of the locking column 521 is connected to the support surface 51a, and the other end extends along the second direction Y. The outer surface of the windshield 412 is connected to the position corresponding to the locking column 521, and the locking sleeve 522 is connected along the second direction Y. The locking sleeve 522 has a cavity 522a for inserting the locking column 521. The locking assembly 523 is disposed in the cavity 522a, and the locking assembly 523 has a locked state and an unlocked state. When the mounting bracket 41 is fixedly connected to the mounting plate 51, the locking assembly 523 is in the locked state, so that the locking column 521 is locked in the cavity 522a of the locking sleeve 522. When the mounting bracket 41 and the mounting plate 51 are disassembled, the locking assembly 523 is in an unlocked state, so that the locking column 521 and the locking sleeve 522 are separated.

[0068] For example, when the second heat dissipation mechanism 40 is needed for assistance, the mounting bracket 41 is first placed above the box body 10 so that the locking sleeve 522 is aligned with the locking column 521, and then the mounting bracket 41 is moved along the second direction Y so that the mounting bracket 41 is continuously close to the box body 10 until the locking column 521 is inserted into the cavity 522a of the locking sleeve 522. At this time, the locking assembly 523 automatically enters the locking state, thereby quickly fixing the second heat dissipation mechanism 40 on the box body 10; when the second heat dissipation mechanism 40 needs to be disassembled, the locking assembly 523 is switched to the unlocked state so that the locking column 521 and the locking sleeve 522 can move relative to each other. At this time, the second heat dissipation mechanism 40 can be removed by simply pulling up the mounting bracket 41. The operation is simple and the installation time is greatly shortened. In other words, the clever use of the quick-install mechanism 50 can achieve the rapid disassembly of the second heat dissipation structure, which is suitable for scenarios where frequent installation, disassembly or replacement of modules is required, reducing manual operation costs and improving equipment deployment efficiency.

[0069] In addition, the installation position of the quick-install mechanism 50 does not interfere with the layout of the first heat sink 34 and the second heat sink 40, ensuring that after quick installation, the first heat sink 30 can still work normally through airflow guidance, avoiding affecting the heat dissipation efficiency of the module due to the installation structure design.

[0070] Reference Figure 6 Specifically, the quick-install mechanism 50 further includes an elastic member 53 , which is disposed in the middle of the support surface 51 a so as to utilize the elastic force received by the elastic member 53 to drive the locking sleeve 522 to move. Figure 7 This is a schematic diagram of the structure of the lock sleeve 522 and the lock cylinder 521 in a wireless communication module of the present application. Figure 7 The locking assembly 523 includes a locking sleeve 5231522, an elastic locking rod 5232 and a locking block 5233. A locking head 54 is provided at the end of the lock column 521 facing away from the mounting plate 51, and a boss 521a is formed on the lock column 521. The locking sleeve 5231522 can be slidably sleeved on the lock column 521 and is located between the boss 521a and the locking head 54. The outer periphery of the lock sleeve 522 is provided with a mounting portion 522b extending radially along its outer periphery and communicating with the cavity 522a. The elastic locking rod 5232 is accommodated in the mounting portion 522b, and one end of the elastic locking rod 5232 extends toward the cavity 522a and is connected to the locking block 5233.

[0071] The lock block 5233 is pressed against the locking pin 521 and the locking pin 5233 is pressed against the locking pin 521, and the locking pin 5233 is pressed against the locking pin 521. When the locking sleeve 5231 is in contact with the locking head 54, the locking sleeve 5231522 is driven to move toward the locking head 54, and the locking sleeve 5231522 is driven to move toward the locking head 54. When the locking sleeve 5231522 is in contact with the locking head 54, the locking sleeve 5231522 is restricted from moving upward. However, as the sliding sleeve continues to move upward, the locking block 5233 is still driven to move upward, so that the locking block 5233 slides past the locking sleeve 5231522 and the locking head 54 in turn, until the locking block 5233 is completely free from the restriction, and the locking sleeve 522 and the lock column 521 can move relative to each other. At this time, it is only necessary to pull the mounting bracket 41 upward to achieve the removal of the second heat dissipation mechanism 40.

[0072] In one embodiment, the mounting plate 51 has extensions 511 extending from both ends in the first direction X, and mounting lugs 512 are provided on the extensions 511. Thus, the mounting plate 51 has extensions 511 extending from both ends in the first direction X, and the mounting lugs 512 are provided on the extensions 511, so that it can be fixed to different mounting carriers (such as device housings and brackets) using connectors such as bolts and snaps 111, adapting to various installation scenarios.

[0073] In one embodiment, a dust screen 60 is installed at the air inlet. That is, the dust screen 60 is installed at the air inlet to intercept dust, particles and other impurities in the air, preventing them from entering the air guide cavity 42a and accumulating on the surfaces of components such as the fan 43, the semiconductor cooling plate 45, and the thermal fins 44, thereby preventing the heat dissipation efficiency from being reduced (such as increased rotation resistance of the fan 43 and obstructed heat conduction of the cooling plate) and component failure (such as a short circuit) due to dust coverage. It should be noted that the dust screen 60 can be made of a breathable material (such as a metal mesh or a fiber filter) so that it does not seriously hinder the passage of airflow while blocking dust, ensuring that the amount of air inhaled by the fan 43 meets the heat dissipation requirements and avoiding the attenuation of the heat dissipation effect due to increased air inlet resistance.

[0074] In one embodiment, a battery cover 70 is further included. The top shell 12 is recessed to form a battery cavity 12b. The battery cavity 12b houses a battery module that supplies power to the circuit board 20. The battery cover 70 is openably connected to the top shell 12 to seal the battery cavity 12b. In other words, by forming the battery cavity 12b recessed in the top shell 12, the battery module is embedded in the interior of the box body 10 without occupying additional space in the accommodating cavity 10a. This allows for a compact arrangement of the circuit board 20, the heat dissipation mechanism, and the battery, facilitating a lightweight and thin design for the module. In addition, the battery cover 70 is openably connected to the top shell 12 so that when the battery module is exhausted, the battery cover 70 can be opened and replaced without disassembling the entire module, thereby improving the convenience of using the device.

[0075] In summary, the wireless communication module of the present application has the following advantages:

[0076] (1) The generated heat is transferred to the heat spreader 31 by the thermal pad 33, and then quickly transferred to the first heat sink 34 through the first heat sink 321, the second heat sink 322 and the third heat sink 323. Since the heat dissipation surface of the first heat sink 34 extends outside the accommodating cavity 10a, it can directly contact the external air, so that the heat dissipation can be accelerated by natural convection or forced convection, thereby significantly improving the heat dissipation efficiency and preventing the performance degradation or failure of the wireless communication module due to long-term high-temperature operation;

[0077] (2) By connecting the second heat dissipation mechanism 40 to the box body 10, the fan 43 can be controlled to rotate to generate airflow, so that external air is sucked into the air guide cavity 42a from the air inlet and flows into the cover space 41a through the air outlet. Since the wind shield 412 is located on the outer surface of the first heat dissipation element 34, the air flowing into the cover space 41a is blocked by the wind shield 412 and blown toward the first heat dissipation element 34, forming forced convection, thereby quickly dissipating the heat of the power device 21 conducted to the first heat dissipation element 34 through the heat spreader 31 and the heat pipe 32 to the outside, thereby effectively reducing the internal temperature of the module;

[0078] (3) The heat-conducting fins 44 are cleverly used to increase the contact area with the air flow in the air guide cavity 42a, and in conjunction with the cold end surface 45a of the semiconductor refrigeration plate 45, the heat in the air flow can be quickly absorbed, the heat exchange efficiency is forced, and the temperature of the air flow entering the cover space 41a is further reduced, forming a composite heat dissipation mode of "active cooling + forced air cooling".

[0079] It is understandable that the above embodiments only express the preferred implementation modes of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the patent scope of the present invention. It should be pointed out that for ordinary technicians in this field, without departing from the concept of the present invention, the above technical features can be freely combined, and several deformations and improvements can be made, all of which fall within the scope of protection of the present invention. Therefore, all equivalent changes and modifications made to the scope of the claims of the present invention should fall within the scope of coverage of the claims of the present invention.

Claims

1. A wireless communication module, characterized in that: include: A box body (10) comprises a bottom shell (11) and a top shell (12) connected to the bottom shell (11), wherein the bottom shell (11) and the top shell (12) together form a receiving cavity (10a), and a first opening (12a) communicating with the receiving cavity (10a) is provided on an outer peripheral side of the top shell (12); A circuit board (20) is disposed in the accommodating cavity (10a), and a power device (21) is disposed on the circuit board (20); a first heat dissipation mechanism (30), comprising a heat spreader (31), a heat pipe (32), a thermal pad (33), and a first heat dissipation element (34); the thermal pad (33) covers the exposed surface of the power device (21); the heat spreader (31) is disposed in the accommodating cavity (10a) and contacts the surface of the thermal pad (33) facing away from the power device (21); the first heat dissipation element (34) is embedded in the first opening (12a), and the heat dissipation surface of the first heat dissipation element (34) extends out of the accommodating cavity (10a); The heat pipe (32) includes a first heat-conducting section (321), a second heat-conducting section (322) and a third heat-conducting section (323); the first heat-conducting section (321) is inserted into the non-cavity area of ​​the heat spreader (31) along a first direction (X); the second heat-conducting section (322) is located in the accommodating cavity (10a) and connects the first heat-conducting section (321) and the third heat-conducting section (323); the third heat-conducting section (323) is inserted into the first heat sink (34) along the first direction (X).

2. The wireless communication module according to claim 1, wherein: The first heat sink (34) includes a main body (341) and a plurality of heat dissipation fins (342), the main body (341) is embedded in the first opening (12a), the plurality of heat dissipation fins (342) are arranged on the surface of the main body (341) at intervals along the first direction (X) and extend out of the accommodating cavity (10a), and the third heat conduction section (323) is inserted into the main body (341) along the first direction (X).

3. The wireless communication module according to claim 1, wherein: It also includes a second heat dissipation mechanism (40), wherein the second heat dissipation mechanism (40) includes: The mounting frame (41) comprises a top plate (411) and two windshields (412), wherein the two windshields (412) are connected to opposite sides of the top plate (411) along a second direction (Y), and a cover space (41a) is formed between the two windshields (412) and the top plate (411); after the box body (10) is fixed on the top plate (411) and placed in the cover space (41a), the windshields (412) extend along the second direction (Y) and cover the outer surface of the first heat sink (34), and a gap for airflow to pass through is left between the windshields (412) and the first heat sink (34); wherein the second direction (Y) is perpendicular to the first direction (X); An air guide member (42) is mounted on the top plate (411), the air guide member (42) having an air guide cavity (42a) and an air inlet and an air outlet communicating with the air guide cavity (42a), the air outlet facing the housing space (41a); A fan (43) is mounted on the top plate (411), and the blades of the fan (43) extend into the air guide cavity (42a) so as to generate airflow through rotation, so that external air is sucked into the air guide cavity (42a) from the air inlet and flows to the cover space (41a) through the air outlet. Under the guidance of the wind shield (412), the airflow flows along the second direction (Y) through the heat dissipation surface of the first heat dissipation element (34).

4. The wireless communication module according to claim 3, wherein: The second heat dissipation mechanism (40) further includes: a heat-conducting fin (44), which is arranged in the air-conducting cavity (42a) and located between the air inlet and the fan (43); A semiconductor refrigeration plate (45) having a cold end surface (45a) and a hot end surface (45b) opposite to each other, wherein the cold end surface (45a) of the semiconductor refrigeration plate (45) is attached to the top surface of the heat-conducting fin (44); a cover plate (46) which is arranged on the top of the air guide member (42) to cover the air guide cavity (42a); a second opening (46a) is provided on the cover plate (46) at a position corresponding to the semiconductor cooling plate (45); a hot end surface (45b) of the semiconductor cooling plate (45) is exposed to the outside of the cover plate (46) through the second opening (46a); The second heat dissipation element (47) is arranged on a side of the cover plate (46) away from the air guide element (42) and is in contact with the hot end surface of the semiconductor cooling plate (45).

5. The wireless communication module according to claim 3, wherein: The windshield (412) is provided with sliding grooves (412a) at both ends in the first direction (X), and a limiting block (121) is provided on the surface of the top shell (12) on which the first opening (12a) is opened. The limiting block (121) is located on the outside of the first opening (12a) and is used to adapt to the sliding groove (412a) so that the mounting frame (41) is connected to the box body (10).

6. The wireless communication module according to claim 3, wherein: It also includes a quick-install mechanism (50), which includes: A mounting plate (51) having a supporting surface (51a), on which the bottom shell (11) is placed; A locking mechanism (52), comprising a locking column (521), a locking sleeve (522), and a locking assembly (523); one end of the locking column (521) is connected to the supporting surface (51a), and the other end extends along the second direction (Y); a locking sleeve (522) extending along the second direction (Y) is connected to the outer surface of the windshield (412) at a position corresponding to the locking column (521); the locking sleeve (522) has a cavity (522a) for inserting the locking column (521); the locking assembly (523) is arranged in the cavity (522a), and the locking assembly (523) has a locked state and an unlocked state; When the mounting frame (41) and the mounting plate (51) are fixedly connected, the locking assembly (523) is in a locking state so that the locking column (521) is locked in the cavity (522a) of the locking sleeve (522); when the mounting frame (41) and the mounting plate (51) are disassembled, the locking assembly (523) is in an unlocking state so that the locking column (521) and the locking sleeve (522) are disengaged.

7. The wireless communication module according to claim 6, wherein: The quick-install mechanism (50) further comprises: an elastic member (53) disposed in the middle of the support surface (51a) so as to utilize the elastic force applied thereto to drive the locking sleeve to move; The locking assembly (523) includes a locking sleeve (5231), an elastic locking rod (5232) and a locking block (5233); a locking head (54) is provided at one end of the locking column (521) away from the mounting plate (51); and a boss (521a) is formed on the locking column (521); the locking sleeve (5231) is slidably mounted on the locking column (521) and is located between the boss (521a) and the locking head (54); a mounting portion (522b) connected to the cavity (522a) is extended radially from the outer periphery of the locking sleeve (522); the elastic locking rod (5232) is received in the mounting portion (522b), and one end of the elastic locking rod (5232) extends toward the cavity (522a) and is connected to the locking block (5233).

8. The wireless communication module according to claim 6, wherein: Extension portions (511) extend from both ends of the mounting plate (51) in the first direction (X), and mounting lugs (512) are provided on the extension portions (511).

9. The wireless communication module according to claim 3, wherein: A dustproof net (60) is installed at the air inlet.

10. The wireless communication module according to claim 1, wherein: The invention also includes a battery cover (70), wherein the top shell (12) is concave to form a battery cavity (12b), and the battery cavity (12b) accommodates a battery module for supplying power to the circuit board (20). The battery cover (70) is connected to the top shell (12) in an openable and closable manner and is used to cover the battery cavity (12b).

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