A heat dissipation system and an electrical appliance

Abstract

The application provides a heat dissipation system and an electrical appliance. The heat dissipation system comprises a heat dissipation air duct, which comprises an air duct body and a partition plate. The air duct body has a first inner air inlet, a first inner air outlet and a ventilation cavity communicating the first inner air inlet and the first inner air outlet. The partition plate is arranged in the ventilation cavity and divides the ventilation cavity into an air inlet cavity and a heat dissipation cavity. The air inlet cavity communicates with the first inner air inlet, the heat dissipation cavity is arranged to accommodate a first device to be cooled and communicates with the first inner air outlet, and the partition plate is provided with a plurality of parallel communication holes to communicate the air inlet cavity and the heat dissipation cavity. The plurality of communication holes on the partition plate of the heat dissipation air duct can form a plurality of separate air ducts, the serial air path is changed into a parallel air path, the generation of heat accumulation effect is inhibited, and the heat dissipation efficiency of the plurality of first devices to be cooled in the heat dissipation cavity is greatly improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of heat dissipation technology, in particular to a heat dissipation system and an electrical appliance. BACKGROUND

[0002] With the advancement of technology, the volume of photovoltaic inverters is getting smaller and smaller, while the power is getting larger and larger. In addition, photovoltaic inverters are installed outdoors, so the box of the photovoltaic inverter needs to have certain waterproof ability, which puts higher requirements on the heat dissipation design of the photovoltaic inverter.

[0003] In one case, the cabinet of the photovoltaic inverter is composed of two parts, the upper part of the cabinet is a sealed cabinet, and the live parts are installed in the upper part of the cabinet; the lower part of the cabinet is an independent air duct. The heat of the heating components in the upper part of the cabinet is first conducted to the heat sink, and then the heat is taken away through air cooling on the outside. The heating components can be MOS tube electronic components. When the heating components are distributed in front and back, the cooling air flows from front to back, which will blow the heat of the front heating components to the back row, resulting in the phenomenon of front cooling and back heating between the front and back distributed heating components, that is, the uneven cooling situation. SUMMARY

[0004] The embodiment of the present application provides a heat dissipation system, which comprises a heat dissipation air duct piece 1, and the heat dissipation air duct piece 1 comprises:

[0005] an air duct piece body 11, which has a first inner air inlet 111, a first inner air outlet 112, and a ventilation cavity 110 communicating the first inner air inlet 111 and the first inner air outlet 112; and

[0006] a partition plate 12, which is arranged in the ventilation cavity 110 and divides the ventilation cavity 110 into an air inlet cavity 114 and a heat dissipation cavity 115 distributed in a first direction, the air inlet cavity 114 is communicated with the first inner air inlet 111, the heat dissipation cavity 115 is arranged to accommodate a plurality of first heat dissipation components arranged in at least one column in a second direction and communicated with the first inner air outlet 112, the partition plate 12 is provided with a plurality of communication holes 121 penetrating the partition plate 12, and the plurality of communication holes 121 are arranged to be spaced apart along the arrangement direction of the plurality of first heat dissipation components, the first direction is perpendicular to the partition plate 12, and the second direction is parallel to the partition plate 12.

[0007] In some example embodiments, the air duct piece body 11 comprises a first air duct wall 116, which forms a cavity wall of the air inlet cavity 114 and is arranged opposite to the partition plate 12 in the first direction;

[0008] The end surface of the first air duct wall 116 facing the partition plate 12 comprises an inclined pressurized surface 1163, which is arranged to gradually decrease in distance from the first inner air inlet 111 in the first direction.

[0009] In some example embodiments, the first air duct wall 116 comprises an inclined wall 1161 and a straight wall 1162, which is parallel to the partition plate 12 and located at one end of the inclined wall 1161 close to the first inner air inlet 111;

[0010] The inclined wall 1161 is inclined towards the side of the first direction close to the partition plate 12 in the direction away from the first inner air inlet 111, and the end surface of the inclined wall 1161 facing the partition plate 12 constitutes the pressurized surface 1163.

[0011] In some example embodiments, the air duct body 11 further comprises a second air duct wall 117, a third air duct wall 118 and a fourth air duct wall 119;

[0012] The second air duct wall 117, the third air duct wall 118 and the fourth air duct wall 119 are connected to the three sides of the first air duct wall 116 respectively;

[0013] The fourth air duct wall 119 is arranged opposite to the first inner air inlet 111 in the second direction, and the second air duct wall 117 and the third air duct wall 118 are arranged opposite to each other in a third direction and are both connected to the fourth air duct wall 119, the third direction being parallel to the partition plate 12 and perpendicular to the second direction;

[0014] In the first direction, the second air duct wall 117, the third air duct wall 118 and the fourth air duct wall 119 each have a first part located above the partition plate 12 and connected to the partition plate 12, and a second part extending downward from the connection with the partition plate 12;

[0015] The first part of the second air duct wall 117, the first part of the third air duct wall 118, the first part of the fourth air duct wall 119 and the first air duct wall 116 jointly form the air inlet cavity 114;

[0016] The second part of the second air duct wall 117, the second part of the third air duct wall 118 and the second part of the fourth air duct wall 119 jointly form the heat dissipation cavity 115;

[0017] The first inner air outlet 112 is formed in the second part of the second air duct wall 117.

[0018] In some example embodiments, the partition plate 12 comprises an open region 122, and the communication hole 121 is located in the open region 122.

[0019] The distance between the open region 122 and the second air duct wall 117 in the third direction is greater than the distance between the open region 122 and the third air duct wall 118 in the third direction.

[0020] In some example embodiments, the heat dissipation system further comprises an air duct support 2 with a flow guide chamber 23, and a housing 3 for accommodating the heat dissipation air duct 1 and the air duct support 2;

[0021] The air duct support 2 and the heat dissipation air duct 1 are arranged in front of and behind each other in the second direction, and the air duct support 2 is provided with a second inner air inlet 21, a second inner air outlet 22, a third inner air inlet 28, and a third inner air outlet 29, all of which are in communication with the flow guide chamber 23, the second inner air outlet 22 is arranged to install a first heat dissipation fan 51, and the third inner air outlet 29 is arranged to install a second heat dissipation fan 52;

[0022] The housing 3 is provided with a first outer air inlet 341, a second outer air inlet 343, a first outer air outlet 342, and a second outer air outlet 344;

[0023] The first outer air inlet 341 and the first outer air outlet 342 are both arranged on one side of the heat dissipation air duct 1 in the third direction, and the second outer air inlet 343 and the second outer air outlet 344 are both arranged on the other side of the heat dissipation air duct 1 in the third direction, the third direction being parallel to the partition plate 12 and perpendicular to the second direction;

[0024] In the third direction, the first outer air inlet 341 and the second outer air inlet 343 respectively face the second inner air inlet 21 and the third inner air inlet 28;

[0025] The first inner air inlet 111 and the second inner air outlet 22 are in communication with each other, the first inner air outlet 112 is in communication with the first outer air outlet 342, and the second outer air outlet 344 is in communication with the third inner air outlet 29 through the region of the housing 3 for accommodating the second heat dissipation device.

[0026] In some example embodiments, the air duct support 2 comprises a fifth air duct wall 24 and a seventh air duct wall 26 arranged at intervals in the second direction, and the space between the fifth air duct wall 24 and the seventh air duct wall 26 constitutes the flow guide chamber 23 extending in the third direction;

[0027] The fifth air duct wall 24 and the seventh air duct wall 26 enclose the second inner air inlet 21 at one end in the third direction, and enclose the third inner air inlet 28 at the other end in the third direction.

[0028] The flow guide chamber 23 comprises a first air cavity 231, a second air cavity 232 and a third air cavity 233 arranged in sequence in the third direction, wherein the second inner air inlet 21 is located at a side of the first air cavity 231 away from the second air cavity 232, and the third inner air inlet 28 is located at a side of the third air cavity 233 away from the second air cavity 232.

[0029] The minimum size of the first air cavity 231 in the third direction is greater than the maximum size of the second air cavity 232 in the third direction, and the minimum size of the third air cavity 233 in the third direction is greater than the maximum size of the second air cavity 232 in the third direction.

[0030] In some example embodiments, the air duct support 2 further comprises a sixth air duct wall 25, which is located between the fifth air duct wall 24 and the seventh air duct wall 26 and is connected to the fifth air duct wall 24 and the seventh air duct wall 26 at one end in the first direction, respectively.

[0031] The seventh air duct wall 26 is provided with the second inner air outlet 22 and the third inner air outlet 29 arranged at intervals in the third direction.

[0032] The seventh air duct wall 26 is provided with a first mounting portion 210 for mounting the first heat dissipation fan 51 and a second mounting portion 211 for mounting the second heat dissipation fan 52, wherein the first mounting portion 210 is connected to the sixth air duct wall 25 and is arranged corresponding to the second inner air outlet 22, and the second mounting portion 211 is connected to the sixth air duct wall 25 and is arranged corresponding to the third inner air outlet 29.

[0033] The application further provides an electrical appliance, comprising the heat dissipation system and an electrical component, wherein the electrical component comprises a first electrical component 71 cooled by the heat dissipation cavity 115 of the heat dissipation system.

[0034] In some example embodiments, the electrical appliance further comprises:

[0035] a circuit board 6 arranged in the housing 3 of the heat dissipation system; and

[0036] Heat sink 8, the first electrical component 71 and the heat sink 8 are respectively disposed on opposite sides of the circuit board 6, the circuit board 6 is provided with a plurality of heat conduction holes 61 for transferring the heat of the first electrical component 71 to the heat sink 8, and the heat sink 8 is accommodated in the heat dissipation cavity 115 of the heat dissipation system.

[0037] The heat dissipation system of this application embodiment can form multiple individual air ducts extending along the first direction by multiple interconnecting holes on the partition plate, which transforms the front and rear serial air ducts into multiple parallel air ducts, suppresses the heat accumulation effect of the heat of the first heat dissipation device on the front side on the heat dissipation device in the rear row, greatly improves the heat dissipation efficiency of multiple first heat dissipation devices in the heat dissipation cavity, effectively solves the problem of the front being cool and the back being hot of multiple first heat dissipation devices, and improves the problem of uneven heat dissipation. Attached Figure Description

[0038] Figure 1 This is a schematic diagram of the internal structure of an electrical device according to an exemplary embodiment of the present invention;

[0039] Figure 2 A cross-sectional view of an electrical device according to this exemplary embodiment;

[0040] Figure 3 for Figure 2 A magnified view of part A in the diagram;

[0041] Figure 4 This is a first exploded view of a heat dissipation duct component, a heat dissipation fan, and a first electrical component of an electrical device according to an exemplary embodiment of the present invention.

[0042] Figure 5 A second exploded view of a heat dissipation duct component, a heat dissipation fan, and a first electrical component of an electrical device according to an exemplary embodiment of the present invention;

[0043] Figure 6 A schematic diagram of a heat dissipation air duct component for this exemplary embodiment;

[0044] Figure 7 A schematic diagram of an electrical device for this exemplary embodiment;

[0045] Figure 8 for Figure 7 A schematic diagram of the shell inside;

[0046] Figure 9 for Figure 7 Installation diagram of the heat dissipation air duct components;

[0047] Figure 10 for Figure 7 A schematic diagram of venetian blinds;

[0048] Figure 11A schematic view of a wind duct support of the present exemplary embodiment;

[0049] Figure 12 A schematic view of the installation of a sealing member in Figure 7

[0050] Figure 13 A schematic view of the installation of a circuit board in Figure 7

[0051] Figure 14 A schematic view of the installation of a wind duct support in Figure 7

[0052] Figure 15 A schematic view of the installation of an upper cover in Figure 7

[0053] Figure 16 A cross-sectional simulation view of a heat dissipation wind field of an electric appliance of the present exemplary embodiment;

[0054] Figure 17 Another cross-sectional simulation view of a heat dissipation wind field in a heat dissipation wind duct member of an electric appliance of the present exemplary embodiment;

[0055] Figure 18 A cross-sectional simulation view of a heat dissipation wind field in a heat dissipation wind duct member of an electric appliance of the present exemplary embodiment;

[0056] Figure 19 A simulation view of a temperature field of each component in a heat dissipation wind duct member of an electric appliance of the present exemplary embodiment.

[0057] In the drawings, the components represented by each reference numeral are listed as follows:

[0058] 1 - heat dissipation wind duct member, 11 - wind duct member body, 110 - ventilation cavity, 111 - first inner air inlet, 112 - first inner air outlet, 113 - first installation port, 114 - air inlet cavity, 115 - heat dissipation cavity, 116 - first wind duct wall, 1161 - inclined wall, 1162 - straight wall, 1163 - pressurized surface, 117 - second wind duct wall, 1171 - first portion of the second wind duct wall, 1172 - second portion of the second wind duct wall, 118 - third wind duct wall, 1181 - first portion of the third wind duct wall, 1182 - second portion of the third wind duct wall, 119 - fourth wind duct wall, 1191 - first portion of the fourth wind duct wall, 1192 - second portion of the fourth wind duct wall, 12 - partition plate, 121 - communication hole, 122 - open hole region;

[0059] ​​​​2-duct support, 21-second inner air inlet, 22-second inner air outlet, 23-flow guide chamber, 24-fifth duct wall, 25-sixth duct wall, 26-seventh duct wall, 27-second mounting port, 28-third inner air inlet, 29-third inner air outlet, 210-first mounting portion, 211-second mounting portion, 231-first air cavity, 232-second air cavity, 233-third air cavity;

[0060] 3-housing, 31-lower shell, 311-mounting hole, 32-upper cover, 33-inner cover, 34-louvers, 341-first outer air inlet, 342-first outer air outlet, 343-second outer air inlet, 344-second outer air outlet, 345-rail, 35-waterproof rubber ring, 36-sealing element, 37-insulating sheet;

[0061] 4-Bluetooth board, 51-first cooling fan, 52-second cooling fan, 6-circuit board, 61-heat-conducting hole, 71-first electrical component, 72-second electrical component, 73-third electrical component, 8-radiator. DETAILED DESCRIPTION

[0062] The principles and features of the present application are described below in conjunction with the accompanying drawings, which are presented only for illustrative purposes and are not intended to limit the scope of the present application.

[0063] Figure 1 Fig. 1 is a schematic view of an internal structure of an electric appliance according to an exemplary embodiment of the present application, Figure 2 Fig. 2 is a sectional view of an electric appliance according to an exemplary embodiment of the present application, Figure 3 Fig. 3 is a schematic view of a cooling duct according to an exemplary embodiment of the present application, Figure 2 Fig. 4 is a schematic view of a cooling duct according to an exemplary embodiment of the present application, Figure 4 Fig. 5 is a first exploded view of a cooling duct, a cooling fan, and a first electrical component according to an exemplary embodiment of the present application, Figure 5 Fig. 6 is a second exploded view of a cooling duct, a cooling fan, and a first electrical component according to an exemplary embodiment of the present application, Figure 6 Fig. 7 is a schematic view of a cooling duct according to an exemplary embodiment of the present application.

[0064] The present exemplary embodiment provides a cooling system, such as Figures 1 to 6As shown, the heat dissipation system can include a heat dissipation air duct member 1, wherein the heat dissipation air duct member 1 can include an air duct member body 11 and a partition plate 12. The air duct member body 11 can have a first inner air inlet 111, a first inner air outlet 112, and a ventilation cavity 110 communicating the first inner air inlet 111 and the first inner air outlet 112. The partition plate 12 can be located in the ventilation cavity 110 and separate the ventilation cavity 110 into an air inlet cavity 114 and a heat dissipation cavity 115 distributed in a first direction, the air inlet cavity 114 can be in communication with the first inner air inlet 111, the heat dissipation cavity 115 can accommodate a plurality of first devices to be cooled arranged in at least one column in a second direction and be in communication with the first inner air outlet 112, the partition plate 12 is provided with a plurality of communication holes 121 penetrating the partition plate 12, and the plurality of communication holes 121 can be arranged in intervals along the arrangement direction of the plurality of first devices to be cooled. The first direction is perpendicular to the partition plate 12, the first direction can be the up-down direction, one side of the first direction can be up and the other side can be down; and the second direction is parallel to the partition plate 12, the second direction is perpendicular to the first direction, the second direction can be the front-back direction, one side of the second direction can be front and the other side can be back. The above-mentioned first devices to be cooled can be the first electrical components 71 of the electrical equipment and the heat sink 8.

[0065] In the heat dissipation system, by arranging the partition plate 12 in the air duct member body 11 and arranging the plurality of first devices to be cooled above and below the partition plate 12, and by opening a plurality of communication holes 121 on the partition plate 12 to form a plurality of air ducts extending in the first direction alone, the airflow in the second direction can be diverted to flow in the first direction, that is, the front-back serial air path is changed into a plurality of parallel air paths in the up-down direction. Thus, the heat of the plurality of first devices to be cooled distributed in the second direction is carried away in parallel through the plurality of parallel air paths, the heat accumulation effect of the front row of first devices to be cooled on the rear row of first devices to be cooled is suppressed, the heat dissipation efficiency of the plurality of first devices to be cooled in the heat dissipation cavity 115 is greatly improved, the problem of front cooling and rear heating of the plurality of first devices to be cooled is effectively solved, and the problem of uneven heat dissipation is improved.

[0066] In some example embodiments, as shown in Figure 5 and Figure 6 As shown, the first air duct wall 116 can serve as a cavity wall of the air inlet cavity 114, and the end face of the first air duct wall 116 facing the partition plate 12 includes an inclined pressurizing face 1163, and the distance between the pressurizing face 1163 and the partition plate 12 in the first direction is gradually reduced in a direction away from the first inner air inlet 111. Thus, under the action of the pressurizing face 1163, the size of the air inlet cavity 114 gradually narrows in the first direction to compress the airflow, and the wind speed of the airflow entering the ventilation cavity 110 gradually increases along the front-back distribution direction of the plurality of first devices to be cooled, which is conducive to the flow from front to back in the ventilation cavity 110 and also conducive to the balanced heat dissipation of the plurality of first devices to be cooled.

[0067] In some exemplary embodiments, such as Figure 5 and Figure 6 As shown, the first air duct wall 116 includes an inclined wall 1161 and a straight wall 1162. The straight wall 1162 is parallel to the partition plate 12 and located at the end of the inclined wall 1161 near the first inner air inlet 111. The distance between the straight wall 1162 and the partition plate 12 is larger than that between the inclined wall 1161 and the inclined wall 1162, forming a larger opening in the first inner air inlet 111, allowing for better entry of external airflow. The inclined wall 1161 gradually slopes towards the partition plate 12 in the first direction, away from the first inner air inlet 111, so that the angle between the straight wall 1162 and the partition plate 12 can be an obtuse angle. The end face of the inclined wall 1161 facing the partition plate 12 in the first direction constitutes the aforementioned pressurized surface 1163. The inclined wall 1161 can compress the air velocity, so that the air velocity flowing through the downstream connecting hole 121 is close to the air velocity flowing through the upstream connecting hole 121. This prevents the air velocity from decreasing as the airflow flows, and prevents the formation of a stable airflow from front to back in the heat dissipation cavity 115. This would prevent the airflow that carries away the heat of the first heat-dissipating component from the front from flowing to the first heat-dissipating component on the rear side, thereby affecting the heat dissipation of the first heat-dissipating component on the rear side. In order to achieve efficient and uniform heat dissipation for the multiple first heat-dissipating components in the heat dissipation cavity 115.

[0068] In some exemplary embodiments, such as Figures 2 to 6 As shown, the first internal air inlet 111 can be disposed on the front side of the air duct body 11. The air duct body 11 includes a first air duct wall 116, a second air duct wall 117, a third air duct wall 118, and a fourth air duct wall 119. The first air duct wall 116 is located above the partition plate 12 in a first direction. The second air duct wall 117, the third air duct wall, and the fourth air duct wall 119 are respectively connected to the three sides of the first air duct wall 116. The fourth air duct wall 119 is disposed opposite to the first internal air inlet 111 in a second direction. The first internal air inlet 111 is located in front of the first air duct wall 116, and the fourth air duct wall 119 is located behind the first air duct wall 116. The second air duct wall 117 and the third air duct wall 118 are arranged opposite each other in the third direction and are both connected to the fourth air duct wall 119. The third direction is parallel to the partition plate 12 and perpendicular to the second direction. The third direction can be left or right. One side of the third direction can be left and the other side can be right. The second air duct wall 117 is on the left and the third air duct wall 118 is on the right.

[0069] In some exemplary embodiments, such as Figures 2 to 6As shown, the second air duct wall 117, the third air duct wall 118 and the fourth air duct wall 119 can all be connected with the partition plate 12, and the partition plate 12 is located in the space surrounded by the second air duct wall 117, the third air duct wall 118 and the fourth air duct wall 119. In the first direction, the second air duct wall 117, the third air duct wall 118 and the fourth air duct wall 119 all have a first part above and connected with the partition plate 12, and a second part extending downward from the connection with the partition plate 12. For example, the second air duct wall 117 has a first part 1171 of the second air duct wall and a second part 1172 of the second air duct wall; the third air duct wall 118 has a first part 1181 of the third air duct wall and a second part 1182 of the third air duct wall; and the fourth air duct wall 119 has a first part 1191 of the fourth air duct wall and a second part 1192 of the fourth air duct wall. The first part 1171 of the second air duct wall, the first part 1181 of the third air duct wall, the first part 1191 of the fourth air duct wall and the first air duct wall 116 together form the air inlet cavity 114; the second part 1172 of the second air duct wall, the second part 1182 of the third air duct wall and the second part 1192 of the fourth air duct wall together form the heat dissipation cavity 115; and the first inner air outlet 112 is arranged on the second part 1172 of the second air duct wall.

[0070] It can be understood that the fourth air duct wall 119 is arranged in the direction of the first inner air inlet 111, so that the air flow entering the air inlet cavity 114 from the first inner air inlet 111 cannot go out from the side of the fourth air duct wall 119, thereby reducing the air flow entering the heat dissipation cavity 115 from the communication hole 121 on the partition plate 12, and then affecting the heat dissipation of the first device to be cooled below the heat dissipation cavity 115. In addition, the second part 1182 of the third air duct wall is not perforated, and the first inner air outlet 112 is arranged on the second part 1172 of the second air duct wall opposite to the second part 1182 of the third air duct wall, so that the air flow after heat dissipation can go out from one side, reducing the influence of the air flow after heat dissipation on other devices around the air duct body 11.

[0071] In some example embodiments, as Figures 2 to 6As shown, the first air duct wall 116 can form the upper cavity wall of the air inlet cavity 114. The second part 1172 of the second air duct wall is located on the left side of the heat dissipation cavity 115, forming the left cavity wall of the heat dissipation cavity 115, and the first part 1171 of the second air duct wall can form the left cavity wall of the air inlet cavity 114. The second part 1182 of the third air duct wall is located on the right side of the heat dissipation cavity 115, forming the right cavity wall of the heat dissipation cavity 115, and the first part 1181 of the third air duct wall can form the right cavity wall of the air inlet cavity 114. The second part 1192 of the fourth air duct wall is located on the back side of the heat dissipation cavity 115, forming the back cavity wall of the heat dissipation cavity 115, and the first part 1191 of the fourth air duct wall can form the back cavity wall of the air inlet cavity 114. The first air duct wall 116, the second air duct wall 117, the third air duct wall 118, and the fourth air duct wall 119 are all solid plates without ventilation holes. The heat dissipation cavity 115 is open at one end close to the first inner air inlet 111 in the second direction, forming the first mounting port 113, to provide a flow space for the air after heat dissipation. The first inner air outlet 112 is located at the bottom of the second part 1172 of the second air duct wall.

[0072] In some example embodiments, as shown in Figures 2 to 6 The heat dissipation air duct 1 can be used for heat dissipation of the circuit board 6, wherein the circuit board 6 is arranged in the housing 3 of the electrical appliance, and the circuit board 6 can be the main board of the electrical appliance and can be used for controlling the operation of the electrical appliance. The first electrical component 71 and the heat sink 8 are arranged on opposite sides of the circuit board 6, respectively. The circuit board 6 is provided with a plurality of heat conduction holes 61 for transferring heat of the first electrical component 71 to the heat sink 8, and the heat sink 8 is accommodated in the heat dissipation cavity 115 of the heat dissipation air duct 1. The first electrical component 71 can be a power tube (such as a MOS tube), and the heat sink 8 can be a patch heat sink. The upper and lower sides of the circuit board 6 can be respectively provided with the heat sink 8 and the first electrical component 71, and the heat sink 8 and the first electrical component 71 are arranged one by one. The circuit board 6 is provided with a plurality of heat conduction holes 61 to transfer heat of the first electrical component 71 to the heat sink 8. The heat sink 8 can be accommodated in the heat dissipation cavity 115 of the heat dissipation system to dissipate heat from the heat sink 8 by using the heat dissipation air in the heat dissipation cavity 115, thereby achieving heat dissipation of the first electrical component 71.

[0073] In some example embodiments, as shown in Figures 2 to 6 The heat dissipation air duct 1 can be mounted on the circuit board 6, the heat sink 8 is in the heat dissipation cavity 115, and the first inner air outlet 112 is on one side of the heat sink 8 in the third direction. A plurality of heat sinks 8 are arranged in the second direction to form a column of heat sinks 8, and the plurality of heat sinks 8 can be arranged in a plurality of columns of heat sinks 8, and the plurality of columns of heat sinks 8 are arranged in the third direction.

[0074] In some example embodiments, as shown in Figures 2 to 6As shown, the partition plate 12 can include an open region 122, a plurality of communication holes 121 are located in the open region 122 and are uniformly arranged in the open region 122, and the communication holes 121 can realize the flow of the up and down air flow in the first direction. The communication holes 121 penetrate the partition plate 12 in the first direction, the plurality of communication holes 121 can be circular holes, the plurality of communication holes 121 are arranged in a column along the second direction, the plurality of communication holes 121 can be arranged in a plurality of columns, and the plurality of columns are arranged in the third direction. The communication holes 121 close to the first inner air inlet 111 in the plurality of communication holes 121 can be upstream communication holes 121, and the communication holes 121 away from the first inner air inlet 111 can be downstream communication holes 121. The plurality of communication holes 121 can be arranged one-to-one with the plurality of heat sinks 8, and the communication holes 121 are directly above the heat sinks 8, so that the air flow can directly cool the heat sinks 8, and each heat sink 8 can be individually cooled through the corresponding communication hole 121.

[0075] In some example embodiments, as shown in Figures 2 to 6 As shown, the distance between the open region 122 and the second air duct wall 117 in the third direction is greater than the distance between the open region 122 and the third air duct wall 118 in the third direction. Wherein, the distance between the open region 122 and the second air duct wall 117 in the third direction can be L1, the edge of the open region 122 extending away from the second air duct wall 117 in the third direction extends to the third air duct wall 118, and L1 is greater than 0. Thus, any communication hole 121 is arranged to the right, that is, the communication hole 121 is close to the third air duct wall 118 and away from the second air duct wall 117, so as to concentrate on cooling the first device to be cooled in the heat dissipation cavity 115, and the air flow after cooling is more convenient to flow out from the first inner air outlet 112 on the second part 1172 of the second air duct wall.

[0076] In some example embodiments, as shown in Figures 2 to 6 As shown, the air duct body 11 and the partition plate 12 are of an integrated structure, that is, the entire heat dissipation air duct 1 is of an integrated structure. Of course, the air duct body 11 and the partition plate 12 can also be of a split structure and fixedly connected together. The heat dissipation air duct 1 can be of a plastic material, and of course, the heat dissipation air duct 1 can also be of other materials.

[0077] In some example embodiments, as shown in Figure 7As shown, when this heat dissipation system is applied to electrical equipment, high-power devices (the first devices to be cooled) are often arranged in a concentrated manner during board layout. The airflow may cause heat generated by the upstream high-power devices to be transferred to the downstream high-power devices, forming thermal coupling and ultimately leading to a localized heat accumulation effect, further exacerbating the uneven heat dissipation problem. Therefore, to avoid heat accumulation effects when multiple first devices are laid parallel to the airflow path, the heat dissipation duct component 1 in this embodiment can change the serial airflow path to a parallel airflow path. In a serial airflow path, a row of first devices laid parallel to the airflow path can only receive cooling air sequentially, not simultaneously. This causes the airflow to continuously conduct heat from the upstream first device to be cooled to the downstream first device to be cooled, resulting in the downstream first device becoming increasingly hot. However, with the heat dissipation duct component 1 in this embodiment, the cooling air is simultaneously blown from multiple connecting holes 121 on the partition plate 12 onto multiple first devices to be cooled (i.e., a parallel airflow path). Thus, each first device to be cooled receives low-temperature cooling air, preventing heat accumulation. Therefore, the heat dissipation duct component 1 in this embodiment can not only centrally cool the multiple first heat-dissipating devices in the heat dissipation cavity 115, but also allow all the multiple first heat-dissipating devices in the heat dissipation cavity 115 to receive cool air from the multiple connecting holes 121 on the partition plate 12. The multiple connecting holes 121 on the partition plate 12 can form multiple individual air ducts, changing the serial air path into a parallel air path, suppressing the heat accumulation effect of the heat from the first heat-dissipating devices in the front row on the first heat-dissipating devices in the rear row, greatly improving the heat dissipation efficiency of the multiple first heat-dissipating devices in the heat dissipation cavity 115, effectively solving the problem of the front being cool and the back being hot among the multiple first heat-dissipating devices, and improving the problem of uneven heat dissipation.

[0078] Figure 8 This is a schematic diagram of an electrical device for an exemplary embodiment of the present invention. Figure 7 for Figure 9 A schematic diagram of the shell in the middle. Figure 7 for Figure 10 Installation diagram of the heat dissipation air duct components. Figure 7 for Figures 6 to 10 The schematic diagram of the venetian blinds in some exemplary embodiments, such as Figures 6 to 10 As shown, the heat dissipation system may include a housing 3, within which the circuit board 6 and the heat dissipation duct component 1 are located. The housing 3 has a first external air inlet 341, a second external air inlet 343, a first external air outlet 342, and a second external air outlet 344 for connecting the inside and outside. The first external air inlet 341 and the first external air outlet 342 are both located on one side of the heat dissipation duct component 1 in a third-direction direction, while the second external air inlet 343 and the second external air outlet 344 are both located on the other side of the heat dissipation duct component 1 in a third-direction direction. The first internal air outlet 112 can communicate with the first external air outlet 342.

[0079] In some example embodiments, as shown in Figures 6 to 10 The housing 3 includes a fixedly connected lower shell 31 and an upper cover 32, which can be sheet metal parts, but are not limited thereto, for example, the lower shell 31 and the upper cover 32 can also be other materials. The lower shell 31 and the upper cover 32 enclose a mounting space, the lower shell 31 of the housing 3 is provided with mounting holes 311 on the left and right sides, two louvers 34 are respectively mounted at the two mounting holes 311, one louver 34 is provided with a first external air inlet 341 and a first external air outlet 342, and the other louver 34 is provided with a second external air inlet 343 and a second external air outlet 344. The first external air inlet 341 is located on the front side of the first external air outlet 342, and the second external air inlet 343 is located on the front side of the second external air outlet 344. Each louver 34 is provided with two guide rails 345 on the side facing the inside of the lower shell 31, both of which extend in a first direction and are arranged in a second direction. The first external air inlet 341 and the second external air inlet 343 are located between the two guide rails 345.

[0080] In some example embodiments, as shown in Figure 11 The first external air inlet 341 and the first external air outlet 342 are provided on a first shell wall of the housing 3, and the length direction of the heat dissipation air duct member 1 of the heat dissipation system is parallel to the first shell wall, that is, the length direction of the heat dissipation air duct member 1 is along the front-back direction. The second external air inlet 343 and the second external air outlet 344 are located on a second shell wall of the housing 3, and the circuit board 6 further has a second to-be-cooled component, which can be a third electrical component 73, which can be located between the heat dissipation air duct member 1 and the second external air outlet 344.

[0081] Figure 1 A schematic view of a duct support for the present example embodiment, in some example embodiments, as shown in Figure 2 , Figure 8 , Figure 11 , Figure 1 The heat dissipation system further includes a duct support 2 having a flow guide chamber 23, which is arranged in the housing 3. The duct support 2 and the heat dissipation air duct member 1 are arranged in front of and behind each other in the second direction. The duct support 2 is provided with a second internal air inlet 21, a second internal air outlet 22, a third internal air inlet 28, and a third internal air outlet 29, all of which are in communication with the flow guide chamber 23. The second internal air outlet 22 is arranged to mount the first heat dissipation fan 51, and the third internal air outlet 29 is arranged to mount the second heat dissipation fan 52.

[0082] In some example embodiments, as shown in Figure 2 , Figure 8 , Figure 11 , Figure 1As shown, in the third direction, the first outer air inlet 341 and the second outer air inlet 343 are respectively opposite to the second inner air inlet 21 and the third inner air inlet 28. The first inner air inlet 111 is opposite to the second inner air outlet 22, and the second outer air outlet 344 is opposite to the third inner air outlet 29 through the area of the shell 3 for accommodating the third electrical component 73. Thus, the air duct support 2 guides two air inlets to two directions respectively, which is beneficial to save space and facilitate miniaturization. The first outer air inlet 341, the second inner air inlet 21, the flow guide chamber 23, the second inner air outlet 22, the first inner air inlet 111, the air inlet cavity 114, the heat dissipation cavity 115, the first inner air outlet 112 and the first outer air outlet 342 are sequentially communicated to form an air duct for dissipating heat from the first to-be-cooled component. The second outer air inlet 343, the third inner air inlet 28, the flow guide chamber 23, the third inner air outlet 29, and the second outer air outlet 344 are sequentially communicated to form an air duct for dissipating heat from the second to-be-cooled component. Thus, the two heat dissipation air ducts dissipate heat from specific objects respectively and do not affect each other.

[0083] In some example embodiments, as shown in Figure 2 、 Figure 8 、 Figure 10 、 Figure 11 、 Figure 1 The air duct support 2 can be an integral structure and made of plastic, but is not limited thereto. For example, the air duct support 2 can also be made of other materials or can be a split structure. The air duct support 2 can include a fifth air duct wall 24, a sixth air duct wall 25 and a seventh air duct wall 26 connected in sequence and in a U shape. The fifth air duct wall 24, the sixth air duct wall 25 and the seventh air duct wall 26 enclose an opening at one end in the third direction, i.e., the second inner air inlet 21. The fifth air duct wall 24, the sixth air duct wall 25 and the seventh air duct wall 26 enclose another opening at the other end in the third direction, i.e., the third inner air inlet 28. The heat dissipation air can enter the flow guide chamber 23 from the second inner air inlet 21 at the left end of the air duct support 2, or enter the flow guide chamber 23 from the third inner air inlet 28 at the right end of the air duct support 2. The fifth air duct wall 24 and the seventh air duct wall 26 of the air duct support 2 are respectively connected to the two guide rails 345 on the louver 34.

[0084] In some example embodiments, as shown in Figure 2 、 Figure 8 、 Figure 11 、 Figure 1As shown, the fifth air duct wall 24 is located in front of the seventh air duct wall 26, and the sixth air duct wall 25 is located on the top of the fifth air duct wall 24 and the seventh air duct wall 26. An opening is formed between the fifth air duct wall 24 and the seventh air duct wall 26 and opposite to the sixth air duct wall 25, that is, a second mounting port 27 is provided for the third device to be cooled to extend into the flow guide chamber 23. The opening formed between the fifth air duct wall 24 and the seventh air duct wall 26, that is, the second mounting port 27, can be arranged downward, and the third device to be cooled can extend into the flow guide chamber 23 from the second mounting port, so that the cooling air in the flow guide chamber 23 can cool the third device to be cooled. The third device to be cooled can be the second electrical component 72. The second electrical component 72 can be arranged on the circuit board 6, and / or the third device to be cooled further includes the Bluetooth board 4.

[0085] In some example embodiments, as shown in Figure 2 、 Figure 8 、 Figure 11 、 Figure 1 As shown, the seventh air duct wall 26 is provided with a second inner air outlet 22 and a third inner air outlet 29, both of which are in communication with the flow guide chamber 23. The second inner air outlet 22 is located on the side of the third inner air outlet 29 close to the second inner air inlet 21 in the third direction, that is, the second inner air outlet 22 is on the left side and the third inner air outlet 29 is on the right side. The second inner air outlet 22 is opposite to the first inner air inlet 111 on the front side of the cooling air duct member 1, and the third inner air outlet 29 is opposite to the space where the second device to be cooled is located.

[0086] In some example embodiments, as shown in Figure 2 、 Figure 8 、 Figure 11 、 Figure 1 As shown, a first mounting portion 210 is arranged at the second inner air outlet 22, and the first mounting portion 210 is arranged to mount the first cooling fan 51, wherein the first mounting portion 210 and the first cooling fan 51 can be located in the flow guide chamber 23, and the first mounting portion 210 is connected to the sixth air duct wall 25 and the seventh air duct wall 26, respectively. A second mounting portion 211 is arranged at the third inner air outlet 29, and the second mounting portion 211 is arranged to mount the second cooling fan 52, wherein the second mounting portion 211 and the second cooling fan 52 can be located in the flow guide chamber 23, and the second mounting portion 211 is connected to the sixth air duct wall 25 and the seventh air duct wall 26, respectively. The first mounting portion 210 and the second mounting portion 211 are arranged left and right, and the sixth air duct wall 25 is further provided with a positioning structure for positioning the Bluetooth board 4, and the positioning structure can match the shape of the Bluetooth board 4.

[0087] In some example embodiments, as shown in Figure 2 、 Figure 8 、 Figure 11 、 Figure 1As shown, the flow guide chamber 23 comprises a first air cavity 231, a second air cavity 232 and a third air cavity 233 arranged in sequence in the third direction, in which the second inner air inlet 21 is located on the side of the first air cavity 231 away from the second air cavity 232, and the third inner air inlet 28 is located on the side of the third air cavity 233 away from the second air cavity 232. The minimum dimension of the first air cavity 231 in the third direction is greater than the maximum dimension of the second air cavity 232 in the third direction, and the minimum dimension of the third air cavity 233 in the third direction is greater than the maximum dimension of the second air cavity 232 in the third direction, so that the spatial width of the second air cavity 232 is relatively narrow compared to the first air cavity 231 and the third air cavity 233, and the air duct support 2 forms a structure of narrow middle and wide sides.

[0088] In some example embodiments, as Figure 2 、 Figure 8 、 Figure 11 、 Figure 12 As shown, the first heat dissipation fan 51 and the second heat dissipation fan 52 are fixed to the air duct support 2, and the first outer air inlet 341 and the first outer air outlet 342 can be effectively separated by the air duct support 2, and the second outer air inlet 343 and the second outer air outlet 344 can be effectively separated by the air duct support 2. The air duct support 2 is provided without the need for additional fan mounting area and flow guide space, greatly optimizing the layout inside the shell 3 of the electrical appliance, and also building independent air ducts near the first outer air inlet 341 and the second outer air inlet 343 to provide heat dissipation for the third to-be-cooled device near the first outer air inlet 341 and the second outer air inlet 343 and the second to-be-cooled device inside the shell 3. In addition, the air outlet of the first heat dissipation fan 51 directly faces the first inner air inlet 111 of the heat dissipation air duct 1, which can ensure that the heat of the first to-be-cooled device is quickly and effectively removed; the air outlet of the second heat dissipation fan 52 can directly blow to the second to-be-cooled device, ensuring that the heat of the second to-be-cooled device is quickly and effectively removed. The air duct support 2 separates a separate flow guide chamber 23 inside the shell 3, and the first heat dissipation fan 51 and the second heat dissipation fan 52 are installed to the air duct support 2, which can save additional fan mounting area and flow guide space, greatly optimizing the layout inside the shell 3 of the electrical appliance, and the independent flow guide chamber 23 formed inside the air duct support 2 can also cool the third to-be-cooled device in the flow guide chamber 23.

[0089] In some example embodiments, as Figure 7 、 Figure 13 、 Figure 7 、 Figure 14As shown, the cooling air can enter the housing 3 through the first and second outer air inlets 341, 343, and then enter the flow guide chamber 23 through the second and third inner air inlets 21, 28 to cool the third heat-generating component in the flow guide chamber 23. Part of the cooling air in the flow guide chamber 23 can be discharged from the second inner air outlet 22 and enter the air duct 1 to cool the first heat-generating component in the cooling chamber 115, and then flow out of the housing 3 through the first outer air outlet 342. The rest of the cooling air in the flow guide chamber 23 can be discharged from the third inner air outlet 29 and enter the housing 3 of the electrical equipment to cool other heat-generating components (e.g., the second heat-generating component) in the housing 3 but outside the flow guide chamber 23 and the cooling chamber 115, and then be discharged from the housing 3 through the second outer air outlet 344.

[0090] Figure 7 FIG. 8 is a schematic view of the installation of the sealing member in the air duct support of FIG. 6, Figure 15 Figure 7 FIG. 9 is a schematic view of the installation of the circuit board in the air duct support of FIG. 6, Figure 1 Figure 7 FIG. 10 is a schematic view of the installation of the air duct support in the upper cover of FIG. 6, Figures 12 to 15 Figure 1 FIG. 11 is a schematic view of the installation of the upper cover in the electrical equipment of FIG. 6, in some example embodiments, as shown in Figure 7 Figures 12 to 15 Figure 1 Figure 7 The electrical equipment can include the cooling system described above. The electrical equipment can be an inverter, such as a photovoltaic inverter. Of course, the electrical equipment is not limited to an inverter, but can also be other electrical equipment that needs to be cooled.

[0091] In some example embodiments, as shown in Figure 8 Figures 10 to 15 Figure 10 ​​​​​​​​As shown, the electrical appliance can include a plurality of electrical components, which can include a Bluetooth board 4, a circuit board 6, and a first electrical component 71, a second electrical component 72, and a third electrical component 73 disposed on the circuit board 6. The electrical appliance further includes an inner cover 33, a sealing member 36, a first heat dissipation fan 51, a second heat dissipation fan 52, a waterproof rubber ring 35, an insulating sheet 37, etc. The waterproof rubber ring 35 can be fitted into two louvers 34, and the two louvers 34 with the installed waterproof rubber ring 35 can be screwed to the left and right sides of the lower shell 31 of the shell 3. The circuit board 6 can be placed in the lower shell 31 and fastened with screws, and the inner cover 33 can be covered on the circuit board 6. The first heat dissipation fan 51, the second heat dissipation fan 52, and the Bluetooth board 4 can be installed in the air duct support 2, and the air duct support 2 with the installed first heat dissipation fan 51, the second heat dissipation fan 52, and the Bluetooth board 4 can be slid into the lower shell 31 and fixed. The sealing member 36 (such as a sealing sponge) can be attached to the lower shell 31, and the upper cover 32 can be fixed to the lower shell 31 and press the sealing member 36 to ensure the sealing between the upper cover 32 and the lower shell 31. The insulating sheet 37 can be fixed in the lower shell 31 and clamped between the lower shell 31 and the circuit board 6 to ensure the insulation between the lower shell 31 and the circuit board 6.

[0092] In some example embodiments, as Figure 8 , Figure 12 , Figure 13 , Figure 9 shown, a method for equipping an electrical appliance can be applied to the above-mentioned electrical appliance, and the method includes:

[0093] Step one, as shown in Figure 11 , the adhesive side of the waterproof rubber ring 35 is attached to the slot of the louver 34, and the waterproof rubber ring 35 is pressed to ensure stable assembly. The inclination angle of the blades of the louver 34 is about 40 degrees (or other angles), and a sufficient inclination angle can ensure that the dripping water slides down along the louver 34 and does not bounce into the shell 3, so that the shell 3 can meet the IP22 waterproof requirement.

[0094] Step two, as shown in Figure 10 , the louver 34 with the waterproof rubber ring 35 is installed on the left and right sides of the lower shell 31 and screwed tightly, ensuring that the waterproof rubber ring 35 can achieve a compression of 0.3 mm, ensuring the waterproof effect of the waterproof rubber ring 35 and preventing water droplets from entering the shell 3 from the gap between the louver 34 and the lower shell 31.

[0095] Step three, as shown in Figure 14 , the insulating sheet 37 is attached to the inside of the lower shell 31 to insulate the electrical components of the lower shell 31 and the circuit board 6.

[0096] Step four, as shown in Figure 15 , the circuit board 6 is placed in the lower shell 31 and fastened with screws.

[0097] Step 5: Fix the heat dissipation duct component 1 onto the circuit board 6, such as... Figure 16 As shown.

[0098] Step six: Secure the first cooling fan 51, the second cooling fan 52, and the Bluetooth board 4 to the air duct bracket 2, as follows. Figure 16 As shown; then, along the guide rail 345 on the louver 34 (see...) Figure 17 Slide the duct bracket 2 into the lower housing 31 and secure both sides of the duct bracket 2 with screws; then, secure the inner cover 33 (which can be a sheet metal part); finally, attach a sealing element 36 (such as sealing sponge) around the lower housing 31 to ensure the waterproof performance of the housing 3. Figure 18 As shown.

[0099] Step 7: Close the top cover 32 to complete the assembly. Figure 19 As shown.

[0100] During the operation of the electrical equipment, the first electrical component 71, the second electrical component 72, the third electrical component 73, and the Bluetooth board 4 all generate heat, especially the densely arranged first electrical components 71. The ventilation cavity 110 in the heat dissipation duct component 1 is divided into two cavities by the partition plate 12: the air inlet cavity 114 and the heat dissipation cavity 115, and the air inlet cavity 114 and the heat dissipation cavity 115 are connected by a connecting hole 121 on the partition plate 12 for airflow transfer. The heat dissipation cavity 115 contains a heat sink 8 (e.g., a surface mount heat sink 8) mounted on the upper side of the circuit board 6. The heat generated by the first electrical components 71 is conducted to the heat sink 8 through the heat conduction holes 61 (e.g., solder holes) on the circuit board 6, and then the heat is carried away by the cooling air in the heat dissipation cavity 115. The heat dissipation duct component 1 is closely attached to the first cooling fan 51, and the air inlet cavity 114 faces the first cooling fan 51. After passing through the air inlet cavity 114, the cooling air reaches the heat dissipation cavity 115 through the connecting hole 121 on the lower partition plate 12. Then, it dissipates and cools the heat sink 8 inside the heat dissipation cavity 115, and then escapes from the first internal air outlet 112 on the left side of the heat dissipation cavity 115, carrying away the heat generated by the first electrical component 71 located on the lower side of the circuit board 6. This heat dissipation duct component 1 can not only concentrate the cooling of the heat sink 8 inside the heat dissipation cavity 115, but also allow each heat sink 8 in the heat dissipation cavity 115 to receive cool air through the connecting hole 121. Each connecting hole 121 can form a separate air duct, changing the originally serial air path into a parallel air path, suppressing the generation of heat accumulation effect, greatly improving the heat dissipation efficiency, and improving the problem of uneven heat dissipation.

[0101] Figure 19 This is a cross-sectional simulation diagram of the heat dissipation airflow of an electrical device according to this exemplary embodiment. ​As shown, the wind enters the first outer air inlet 341 and the second outer air inlet 343 from the left and right sides of the shell 3, and is used to dissipate heat from the devices along the air duct path. Under the partitioning effect of the air duct support 2, an independent flow guide chamber 23 is formed in the air duct support 2, and the wind speed is high, which can achieve good heat dissipation effect on the second electrical component 72. In addition, the high-power first electrical component 71 (such as a high-power patch MOS tube) on the circuit board 6 is arranged downstream of the air outlet of the first heat dissipation fan 51, and the third electrical component 73 on the circuit board 6 is arranged downstream of the air outlet of the second heat dissipation fan 52. The wind flows to the first electrical component 71 and the third electrical component 73 after being used to dissipate heat, and then flows to the first outer air outlet 342 and the second outer air outlet 344 on both sides, which achieves good heat dissipation effect on the entire circuit board 6.

[0102] According to ​ As shown, the first heat dissipation fan 51 blows cold air through the air inlet cavity 114 of the heat dissipation air duct piece 1, and then enters the heat dissipation cavity 115 from the communication hole 121 to dissipate heat for the heat sinks 8 in the heat dissipation cavity 115. The wind speed in the heat dissipation cavity 115 is basically above 1.2 m / s, and the highest wind speed can even reach 2 m / s. It can be seen that the design of the heat dissipation air duct piece 1 can well dissipate heat for the devices concentrated in the heat dissipation cavity 115.

[0103] According to ​ As shown, the wind speed between the heat sinks 8 in the heat dissipation cavity 115 is relatively uniform, and the wind flowing into the heat dissipation cavity 115 flows out from the first inner air outlet 112 on the side thereof, so as to take away the heat generated by the devices in the heat dissipation cavity 115.

[0104] ​ The simulation diagram of the temperature field of each device in the heat dissipation air duct piece 1. According to ​ As shown, although these heat sinks 8 are arranged in parallel along the air path and are not staggered in position, under the effect of the heat dissipation air duct piece 1 of the embodiment of the present application, the temperatures of these heat sinks 8 are relatively uniform, and no local heat accumulation effect is caused.

[0105] Therefore, the electric appliance device of the embodiment has the following beneficial effects:

[0106] Firstly, the electric appliance device not only meets the IP22 protection level, but also has the heat dissipation system described above, which can reduce the size of the device while improving the heat dissipation efficiency of the device.

[0107] Secondly, the electric appliance of the embodiment of the present application installs the first heat dissipation fan 51 and the second heat dissipation fan 52 in the air duct support 2, and then fixes them at the middle part of the circuit board 6, so that the air duct support 2 is located in the air duct path of the whole device. This design not only saves the space required for installing the first heat dissipation fan 51 and the second heat dissipation fan 52 and the flow guide space required for the heat dissipation wind, but also enables the devices to be cooled on the upstream and downstream of the first heat dissipation fan 51 and the second heat dissipation fan 52 to be cooled sufficiently, thereby significantly improving the heat dissipation efficiency.

[0108] At the same time, the heat dissipation air duct 1 changes the serial air path into a parallel air path, which can prevent the first electrical component 71 on the upstream from being in thermal coupling with the first electrical component 71 on the downstream, thereby avoiding the local heat accumulation effect and further aggravating the problem of uneven heat dissipation, avoiding the phenomenon that the first electrical component 71 is cool in front and hot at the back, and greatly improving the heat dissipation efficiency of the first electrical component 71.

[0109] In the description of the present application, it should be understood that the orientations or positional relationships indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0110] In addition, the terms "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first" and "second" can explicitly or implicitly include at least one of the features.

[0111] In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically limited.

[0112] In the present application, unless otherwise specifically defined and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication or interaction relationship between two elements, unless otherwise specifically limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0113] In the present application, unless specifically defined and limited otherwise, the first feature "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature "over", "above" and "on top of" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the first feature is higher than the second feature in horizontal height. The first feature "under", "below" and "underneath" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the first feature is lower than the second feature in horizontal height.

[0114] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, the person skilled in the art can combine and combine the different embodiments or examples described in the present application and the features of the different embodiments or examples without contradiction.

[0115] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be construed as limiting the present application, and the person skilled in the art can make changes, modifications, replacements and variations to the above embodiments within the scope of the present application.

Claims

1. A heat dissipation system, characterized by, The heat dissipation air duct piece (1) comprises: an air duct piece body (11) having a first inner air inlet (111), a first inner air outlet (112), and a ventilation cavity (110) communicating the first inner air inlet (111) and the first inner air outlet (112); and a partition plate (12) arranged in the ventilation cavity (110) and separating the ventilation cavity (110) into an air inlet cavity (114) and a heat dissipation cavity (115) distributed in a first direction, the air inlet cavity (114) being in communication with the first inner air inlet (111), the heat dissipation cavity (115) being arranged to accommodate a plurality of first devices to be cooled arranged in at least one column in a second direction and in communication with the first inner air outlet (112), the partition plate (12) being provided with a plurality of communication holes (121) penetrating the partition plate (12), the plurality of communication holes (121) being arranged to be spaced apart along the arrangement direction of the plurality of first devices to be cooled, the first direction being perpendicular to the partition plate (12), and the second direction being parallel to the partition plate (12); the air duct piece body (11) comprises a first air duct wall (116) forming a cavity wall of the air inlet cavity (114) and being arranged opposite to the partition plate (12) in the first direction; an end surface of the first air duct wall (116) facing the partition plate (12) comprises an inclined pressurizing surface (1163), the pressurizing surface (1163) being arranged to gradually decrease in distance from the first inner air inlet (111) in the first direction; the first air duct wall (116) comprises an inclined wall (1161) and a flat wall (1162), the flat wall (1162) being parallel to the partition plate (12) and located at one end of the inclined wall (1161) close to the first inner air inlet (111); the inclined wall (1161) is inclined to the side of the first direction close to the partition plate (12) in the direction away from the first inner air inlet (111), and an end surface of the inclined wall (1161) facing the partition plate (12) in the first direction constitutes the pressurizing surface (1163).

2. The heat dissipation system of claim 1, wherein, the air duct piece body (11) further comprises a second air duct wall (117), a third air duct wall (118), and a fourth air duct wall (119); the second air duct wall (117), the third air duct wall (118), and the fourth air duct wall (119) are connected to three sides of the first air duct wall (116), respectively; the fourth air duct wall (119) is arranged opposite to the first inner air inlet (111) in the second direction, the second air duct wall (117) and the third air duct wall (118) are arranged opposite to each other in a third direction and are both connected to the fourth air duct wall (119), the third direction being parallel to the partition plate (12) and perpendicular to the second direction; In the first direction, the second air duct wall (117), the third air duct wall (118) and the fourth air duct wall (119) each have a first part above and connected to the partition plate (12), and a second part extending downward from the connection with the partition plate (12); The first part of the second air duct wall (117), the first part of the third air duct wall (118), the first part of the fourth air duct wall (119) and the first air duct wall (116) enclose the air inlet cavity (114); The second part of the second air duct wall (117), the second part of the third air duct wall (118) and the second part of the fourth air duct wall (119) enclose the heat dissipation cavity (115); The first inner air outlet (112) is provided on the second part of the second air duct wall (117).

3. The heat dissipation system of claim 2, wherein, The partition plate (12) comprises an open area (122), and the communication hole (121) is located in the open area (122); The distance between the open area (122) and the second air duct wall (117) in the third direction is greater than the distance between the open area (122) and the third air duct wall (118) in the third direction.

4. The heat dissipation system according to any one of claims 1 to 3, characterized in that, The heat dissipation system further comprises an air duct support (2) having a flow guide chamber (23), and a shell (3) for accommodating the heat dissipation air duct (1) and the air duct support (2); The air duct support (2) and the heat dissipation air duct (1) are arranged in front of and behind each other in the second direction, and the air duct support (2) is provided with a second inner air inlet (21), a second inner air outlet (22), a third inner air inlet (28) and a third inner air outlet (29) which are all in communication with the flow guide chamber (23), the second inner air outlet (22) is arranged to install a first heat dissipation fan (51), and the third inner air outlet (29) is arranged to install a second heat dissipation fan (52); The shell (3) is provided with a first outer air inlet (341), a second outer air inlet (343), a first outer air outlet (342) and a second outer air outlet (344); The first outer air inlet (341) and the first outer air outlet (342) are both arranged on one side of the heat dissipation air duct (1) in the third direction, and the second outer air inlet (343) and the second outer air outlet (344) are both arranged on the other side of the heat dissipation air duct (1) in the third direction, the third direction being parallel to the partition plate (12) and perpendicular to the second direction; In the third direction, the first outer air inlet (341) and the second outer air inlet (343) respectively face the second inner air inlet (21) and the third inner air inlet (28); The first inner air inlet (111) and the second inner air outlet (22) are in communication with each other, the first inner air outlet (112) is in communication with the first outer air outlet (342), and the second outer air outlet (344) is in communication with the third inner air outlet (29) through the area of the shell (3) for accommodating the second heat dissipation device.

5. The heat dissipation system of claim 4, wherein, The air duct support (2) comprises a fifth air duct wall (24) and a seventh air duct wall (26) arranged at intervals in the second direction, and a space between the fifth air duct wall (24) and the seventh air duct wall (26) constitutes the guide flow chamber (23) extending in the third direction; The fifth air duct wall (24) and the seventh air duct wall (26) enclose the second inner air inlet (21) at one end of the third direction, and enclose the third inner air inlet (28) at the other end of the third direction; The guide flow chamber (23) comprises a first air cavity (231), a second air cavity (232) and a third air cavity (233) arranged in sequence in the third direction, and in the third direction, the second inner air inlet (21) is located on the side of the first air cavity (231) away from the second air cavity (232), and the third inner air inlet (28) is located on the side of the third air cavity (233) away from the second air cavity (232); The minimum size of the first air cavity (231) in the third direction is greater than the maximum size of the second air cavity (232) in the third direction, and the minimum size of the third air cavity (233) in the third direction is greater than the maximum size of the second air cavity (232) in the third direction.

6. The heat dissipation system of claim 5, wherein, The air duct support (2) further comprises a sixth air duct wall (25) located between the fifth air duct wall (24) and the seventh air duct wall (26) and connected to the fifth air duct wall (24) and the seventh air duct wall (26) at one end of the first direction, respectively; The seventh air duct wall (26) is provided with the second inner air outlet (22) and the third inner air outlet (29) arranged at intervals in the third direction; The seventh air duct wall (26) is provided with a first mounting portion (210) for mounting the first heat dissipation fan (51) and a second mounting portion (211) for mounting the second heat dissipation fan (52), the first mounting portion (210) is connected to the sixth air duct wall (25) and is arranged corresponding to the second inner air outlet (22), and the second mounting portion (211) is connected to the sixth air duct wall (25) and is arranged corresponding to the third inner air outlet (29).

7. An electrical appliance characterized by The heat dissipation system comprises the heat dissipation system according to any one of claims 1 to 6, and an electrical component, wherein the electrical component comprises a first electrical component (71) dissipating heat through the heat dissipation cavity (115) of the heat dissipation system.

8. The electrical appliance of claim 7, wherein, Further comprising: a circuit board (6) arranged in the housing (3) of the heat dissipation system; and a heat sink (8), wherein the first electrical component (71) and the heat sink (8) are arranged on opposite sides of the circuit board (6), the circuit board (6) is provided with a plurality of heat conduction holes (61) for transferring heat of the first electrical component (71) to the heat sink (8), and the heat sink (8) is accommodated in the heat dissipation cavity (115) of the heat dissipation system.

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