Fixing jig and machining equipment

Abstract

The invention provides a fixing jig and machining equipment, relates to the field of material machining, and solves the technical problem that a product is easily damaged if a rigid clamping mode is adopted during machining of the product. The fixing jig comprises a supporting assembly which is provided with at least one containing space and a first opening communicated with the containing space and the outside, and the first opening faces upwards; the memory alloy particles are arranged in the accommodating space and extend out of the first opening, so that the memory alloy particles support the product, and the memory alloy particles can deform at the process temperature to fit the shape of the product which is expanded after being heated, so that the pressure of the memory alloy particles on the deformed product is relatively low; and the risks of product coating damage and matrix deformation are reduced.

Description

Technical Field

[0001] The present application relates to the field of material processing, and in particular to a fixing fixture and processing equipment. Background Art

[0002] At present, products with Chemical Vapor Deposition (CVD) coatings, such as silicon carbide (SiC), silicon nitride (Si3N4), aluminum oxide (Al3O2), and tantalum carbide (TaC), are widely used in aerospace, energy equipment and other fields because of their high hardness, high temperature resistance and corrosion resistance.

[0003] In related technologies, traditional fixtures often use a rigid clamping method to fix the product. Rigid clamping will lead to stress concentration in the product (e.g., a stress concentration factor as high as 3.2), which far exceeds the fracture strength of the CVD coating (e.g., 300 MPa), and will cause microcracks at the interface between the coating and the substrate (tested crack extension depth range is approximately 5 μm ~ 20 μm). In addition, the thermal expansion coefficient mismatch between the traditional fixture and the coating is large (e.g., the thermal expansion coefficient of the steel fixture is 12×10 / K, the thermal expansion coefficient of the SiC coating is 4.7×10 / K, with a mismatch rate greater than 150%). When the processing temperature rises to 120°C, significant thermal stress (typically greater than 180 MPa) is generated between the fixture and the product, leading to large flatness deviations (e.g., 0.08 mm to 0.15 mm). Consequently, traditional rigid clamping methods can easily damage products, resulting in low yields and high costs associated with rework. Summary of the Invention

[0004] In order to solve the above technical problems, the present application is proposed. The embodiments of the present application provide a fixing fixture and a processing device.

[0005] In a first aspect, an embodiment of the present application provides a fixing fixture, comprising: a support component having at least one accommodating space and a first opening connecting the accommodating space with the outside world, the first opening facing upward; memory alloy particles, arranged in the accommodating space and extending from the first opening so that the memory alloy particles support the product, and the memory alloy particles can be deformed at the process temperature to fit the shape of the product after thermal expansion.

[0006] In some embodiments, the shape of the horizontal cross-section of the accommodating space includes: a polygon.

[0007] In some embodiments, the fixing fixture further includes: a cover plate, the cover plate having a central area and an edge area, the central area having a second opening, and the bottom of the edge area having an induction groove. When the memory alloy supports the product, the cover plate can be set above the product, and the second opening is configured to expose the processing area of ​​the product; at least one clamping component, when the cover plate is set above the product, the clamping component is arranged around the cover plate, and the clamping component can apply downward pressure to the edge area to fix the product.

[0008] In some embodiments, the clamping assembly includes: a driving part; a clamping part, which is driven and connected to the driving part and is configured to move in a vertical direction under the drive of the driving part to apply downward pressure to the edge area, or to move away from the edge area; wherein, the fixing fixture also includes: at least one pressure sensor, which is arranged at the bottom of the accommodating space and is located below the memory alloy particles, and is configured to detect the current pressure applied by the clamping part to the edge area; a controller, which is communicatively connected to the pressure sensor and the driving part, and is configured to receive the current pressure sent by the pressure sensor, and when the current pressure does not meet the preset pressure range, sends a pressure control signal to the driving part, so that the driving part controls the movement of the clamping part based on the pressure control signal.

[0009] In some embodiments, the support assembly includes: a base having a cavity; a support frame arranged on the upper side of the base, the support frame having at least one accommodating space and a first opening connecting the accommodating space with the outside world; wherein, the fixing fixture also includes: a cooling pipe arranged in the cavity, the inlet and outlet of the cooling pipe are respectively connected to the cooling device, the cooling device is configured to provide cooling gas to the inlet, the cooling gas can pass through the cooling pipe, return to the cooling device from the outlet, and be cooled by the cooling device, and then be provided to the inlet by the cooling device.

[0010] In some embodiments, the fixing fixture also includes: a temperature sensor, which is arranged at the bottom of the accommodating space and is located below the memory alloy particles, and the temperature sensor is configured to detect the current temperature of the memory alloy particles; a controller, which is communicatively connected to the temperature sensor and the cooling device, and is configured to receive the current temperature sent by the temperature sensor, and when the current temperature does not meet the preset temperature range, send a temperature control signal to the cooling device, so that the cooling device adjusts the flow rate of the cooling gas provided to the inlet based on the temperature control signal.

[0011] In some embodiments, the fixing fixture further includes: a buffer structure disposed below the support assembly and configured to absorb vibration energy of the support assembly.

[0012] In some embodiments, the material of the buffer structure includes: silica aerogel.

[0013] In a second aspect, an embodiment of the present application provides a processing device, comprising: a fixing fixture according to any one of the first aspects above, wherein the memory alloy particles of the fixing fixture are configured to support a product; and a cutting device configured to cut a processing area of ​​the product.

[0014] In some embodiments, the cutting device includes: a driving mechanism; a tool, which is driven and connected to the driving mechanism, wherein the driving mechanism can drive the tool to move so that the tool cuts the processing area of ​​the product, and the tool will generate a first vibration when cutting the processing area of ​​the product; wherein the processing equipment also includes: a piezoelectric ceramic brake, which is arranged on the tool, and the piezoelectric ceramic brake can generate a second vibration to weaken the first vibration of the tool, wherein the direction of the first vibration is collinear with the direction of the second vibration, the frequency of the first vibration is the same as the frequency of the second vibration, the amplitude of the first vibration is the same as the amplitude of the second vibration, and the phase of the first vibration is opposite to the phase of the second vibration.

[0015] The fixture and processing equipment proposed in the embodiments of the present application, by providing memory alloy particles, can support the product. After the product is thermally expanded, the memory alloy particles are able to deform at the process temperature to conform to the shape of the thermally expanded product. This reduces the pressure exerted by the memory alloy particles on the deformed product, reducing the risk of coating damage and substrate deformation, improving the yield rate, and reducing the proportion of product rework, thereby reducing costs. Furthermore, the memory alloy particles can absorb processing vibration energy, improving processing quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and other purposes, features, and advantages of the present application will become more apparent through a more detailed description of the embodiments of the present application in conjunction with the accompanying drawings. The accompanying drawings are intended to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the drawings, the same reference numerals generally represent the same components or steps.

[0017] Figure 1 Shown is a schematic structural diagram of a product.

[0018] Figure 2 Shown is a schematic structural diagram of a product and a fixing fixture provided by an exemplary embodiment of the present application.

[0019] Figure 3 Shown is a top view of a product and a fixing fixture provided by an exemplary embodiment of the present application.

[0020] Figure 4 An exemplary embodiment of the present application is shown. Figure 3 The product and the fixture are shown in a cross-sectional view along the BB direction.

[0021] Figure 5 An exemplary embodiment of the present application is shown. Figure 4 A partial enlarged view of the product and fixture in area A is shown.

[0022] Figure 6 Shown is a schematic structural diagram of a support frame provided by an exemplary embodiment of the present application.

[0023] Figure 7 Shown is a bottom view of a cover plate provided by an exemplary embodiment of the present application.

[0024] Figure 8 Shown is a schematic structural diagram of a processing device provided by an exemplary embodiment of the present application.

[0025] Reference numerals: 100. Product; 101. Substrate; 102. Coating; 200. Fixture; 201. Support assembly; 2011. Accommodating space; 2012. Base; 2013. Support frame; 202. Memory alloy particles; 203. Cover plate; 2031. Central area; 2032. Edge area; 20321. Induction groove; 204. Clamping assembly; 2041. Drive unit; 2042. Clamping unit; 205. Cooling pipe; 2051. Inlet; 2052. Outlet; 206. Wiring of temperature sensor; 300. Processing equipment; 400. Cutting device. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0027] Figure 1 Shown is a schematic structural diagram of a product.

[0028] like Figure 1 As shown, product 100 includes a substrate 101 and a coating 102, with coating 102 located on both sides of substrate 101. The coating material includes silicon carbide (SiC), silicon nitride (Si3N4), aluminum oxide (Al3O2), or tantalum carbide (TaC), while the substrate material includes graphite, C / C composite material, sintered SiC, etc. The fixture 200 provided in this embodiment of the application is used to secure product 100 during machining.

[0029] Figure 2 The figure shows a schematic structural diagram of a product and a fixing fixture provided by an exemplary embodiment of the present application. Figure 3 Shown is a top view of a product and a fixing fixture provided by an exemplary embodiment of the present application. Figure 4 An exemplary embodiment of the present application is shown. Figure 3 The cross-sectional view of the product and the fixture along the BB direction is shown. Figure 5 An exemplary embodiment of the present application is shown. Figure 4 The product and fixture shown are partially enlarged in area A. Figure 6 Shown is a schematic structural diagram of a support frame provided by an exemplary embodiment of the present application.

[0030] like Figures 2 to 6 As shown, an embodiment of the present application provides a fixture 200 comprising a support assembly 201 and memory alloy particles 202. The support assembly 201 has at least one receiving space 2011 and a first opening connecting the receiving space 2011 with the outside world, with the first opening facing upward. The memory alloy particles 202 are disposed in the receiving space 2011 and extend from the first opening, thereby supporting the product. The memory alloy particles 202 are capable of deforming at process temperatures to conform to the shape of the product after thermal expansion.

[0031] The height of the memory alloy particles 202 is slightly higher than that of the support assembly 201 , so that the product 100 is completely supported by the memory alloy particles 202 .

[0032] For example, Figure 6 As shown, there are multiple accommodating spaces 2011, which are arranged in m rows, where m is an integer greater than 1, and each row has at least one accommodating space 2011. For example, each accommodating space 2011 contains one or more memory alloy particles 202.

[0033] For example, the memory alloy particles 202 are nickel-titanium alloy (ie, Ni-Ti alloy). By using this material, the stiffness of the memory alloy particles 202 can be reduced by 60% at 300°C, effectively absorbing processing vibration energy and reducing the amplitude of the product 100 by 72%.

[0034] In the above embodiment, the provision of the memory alloy particles 202 supports the product 100. After the product 100 is thermally expanded, the memory alloy particles 202 are able to deform at the process temperature to conform to the shape of the thermally expanded product 100. This results in a lower pressure from the memory alloy particles 202 on the deformed product 100, reducing the risk of damage to the coating 102 (cracking rate reduced to ≤0.8%) and deformation of the substrate 101. This improves the yield rate (scrap rate reduced to ≤1.5%, compared to 12%-18% using a conventional fixture 200), reduces the proportion of rework required for the product 100, and thus reduces costs. Furthermore, the provision of the memory alloy particles 202 absorbs machining vibration energy, improving machining quality.

[0035] In some embodiments, as Figure 6 As shown, the shape of the horizontal cross section of the accommodating space 2011 includes: a polygon.

[0036] Exemplarily, the horizontal cross-section of the accommodating space 2011 is in the shape of a pentagon, a hexagon, a heptagon, or the like.

[0037] In the above embodiment, by making the horizontal cross-section of the accommodating space 2011 into a polygon, especially when the number of sides is five or more, the accommodating space 2011 can have a larger space to carry the alloy particles, and by making the horizontal cross-section of the accommodating space 2011 into a polygon rather than a circle, an ellipse, etc., the accommodating space 2011 can have more angular areas, and when the memristor alloy particles 202 are deformed at high temperature, the memristor alloy particles 202 can have more space to expand.

[0038] Figure 7 Shown is a bottom view of a cover plate provided by an exemplary embodiment of the present application.

[0039] In some embodiments, as Figures 2 to 4 and Figure 7 As shown, the fixture 200 further includes a cover plate 203 and at least one clamping assembly 204. The cover plate 203 has a central region 2031 and an edge region 2032. The central region 2031 has a second opening, and the bottom of the edge region 2032 has an induction groove 20321. When the memory alloy supports a product, the cover plate 203 can be positioned above the product, with the second opening configured to expose the product's processing area. When the cover plate 203 is positioned above the product, the clamping assembly 204 surrounds the cover plate 203 and applies downward pressure to the edge region 2032 to secure the product 100.

[0040] Exemplarily, the induction groove 20321 includes two groove walls, the bottoms of the two groove walls are connected, and the distance between the two groove walls gradually increases from bottom to top. The induction groove 20321 with this structure has high strength and is not easily damaged.

[0041] Exemplarily, the depth of the induction groove 20321 is 0.15 mm.

[0042] Exemplarily, the included angle between the two groove walls is 45°±1°.

[0043] For example, there are multiple induction grooves 20321, and the distance between two adjacent induction grooves 20321 is 8 mm (calculated by finite element simulation).

[0044] Exemplarily, there are four clamping assemblies 204 .

[0045] In the above embodiment, the provision of cover plate 203 prevents direct contact between clamping assembly 204 and coating 102 of product 100, reducing the risk of damage to coating 102. The provision of induction groove 20321 facilitates deformation of cover plate 203 when the two layers are squeezed together, thereby reducing the compressive force exerted by cover plate 203 on coating 102 and the risk of cracking caused by compression between coating 102 and cover plate 203. Actual testing has shown that the provision of induction groove 20321 significantly reduces peak stress on product 100, effectively preventing damage to product 100.

[0046] In some embodiments, as Figure 4 As shown, the clamping assembly 204 includes a driving portion 2041 and a clamping portion 2042. The clamping portion 2042 is drivably connected to the driving portion 2041 and is configured to move vertically under the drive of the driving portion 2041 to apply downward pressure to the edge region 2032 or to move away from the edge region 2032. The fixture 200 further includes at least one pressure sensor and a controller. The at least one pressure sensor is disposed at the bottom of the accommodation space 2011 and below the memory alloy particles 202. The controller is communicatively connected to the pressure sensor and the driving portion 2041 and is configured to receive the current pressure transmitted by the pressure sensor. If the current pressure does not meet a preset pressure range, the controller sends a pressure control signal to the driving portion 2041, causing the driving portion 2041 to control the movement of the clamping portion 2042 based on the pressure control signal.

[0047] Exemplarily, the driving portion 2041 includes a hydraulic driving device, such as a hydraulic cylinder.

[0048] Exemplarily, there are multiple clamping parts 2042 and multiple pressure sensors, and the clamping parts 2042 and the pressure sensors are arranged in a one-to-one correspondence. Each pressure sensor is arranged under the corresponding clamping part 2042 and is configured to detect the current pressure applied by the corresponding clamping part 2042 to the edge area 2032.

[0049] For example, the controller may calculate a pressure compensation value based on the current pressure and a preset pressure range, and then control the driving part 2041 based on the pressure compensation value to adjust the pressure applied by the clamping part 2042 to the edge area 2032 .

[0050] Traditional fixing jigs use a rigid clamping method for the product. The clamping force fluctuates by more than 15% during processing, which can easily cause damage and deformation of the product. In the above embodiment, this structure has the following advantages. First, the pressure applied by the clamping component 204 to the product 100 can be precisely controlled to avoid excessive pressure, damage to the coating 102, and deformation of the substrate 101 (the deformation rate of the product 100 can be reduced to 0.05% or less, while traditional fixing jigs will cause the product deformation rate to be ≥2%). Second, it can avoid the product 100 being loosely fixed due to insufficient pressure, thereby moving during the process. Third, because the pressure can be dynamically adjusted, even in high-temperature environments where product 100 experiences greater deformation, the pressure can be adaptively adjusted. (Under high-temperature conditions, due to the expansion of fixture 200 and product 100, if not adjusted, the clamping portion 2042 can exert excessive pressure on product 100. After adjustment, the pressure can be reduced by ≥40% as the temperature rises, ensuring that the current pressure falls within the preset pressure range.) This allows product 100 to withstand a 200°C processing environment and meet the requirements of high-speed cutting (high-speed cutting results in higher processing temperatures). Fourth, the pressure exerted on coating 102 by multiple clamping portions 2042 is consistent, ensuring uniform force on the surface of coating 102 (with an error of ≤±5%) and reducing the risk of cracking. Fifth, the system is compatible with the processing of irregular-shaped products 100 with CVD coatings 102 thicknesses ranging from 50 μm to 300 μm.

[0051] In some embodiments, as Figures 2 to 6As shown, the support assembly 201 includes: a base 2012 and a support frame 2013. The base 2012 has a cavity. The support frame 2013 is arranged on the upper side of the base 2012, and the support frame 2013 has at least one accommodating space 2011 and a first opening connecting the accommodating space 2011 with the outside. Among them, the fixing fixture 200 also includes: a cooling pipe 205, the cooling pipe 205 is arranged in the cavity (the cavity is located below the support frame 2013), the inlet 2051 and the outlet 2052 of the cooling pipe 205 are respectively connected to the cooling device, and the cooling device is configured to provide cooling gas to the inlet 2051. The cooling gas can pass through the cooling pipe 205 and return to the cooling device from the outlet 2052, and be cooled by the cooling device, and then provided to the inlet 2051 by the cooling device.

[0052] Exemplarily, the material of the support frame 2013 is silicon nitride ceramics, which has relatively stable chemical properties, will not contaminate the product, and can withstand temperatures of 1600°C.

[0053] Illustratively, the cooling gas comprises nitrogen.

[0054] Exemplarily, the temperature of the cooling gas ranges from -20°C to 25°C.

[0055] During machining (e.g., cutting, grooving, grinding, drilling, etc.) of the product 100, high temperatures are generated. This thermal expansion of the coating 102 and the substrate 101, coupled with a significant difference in thermal expansion coefficients between the coating 102 and substrate 101 (e.g., a difference of up to 6.5 times), can easily cause the coating 102 to crack or peel. In the above embodiment, by providing a cooling tube 205, the memory alloy particles 202 can be cooled, thereby cooling the product 100 in contact with the memory alloy particles 202. This reduces the risk of damage to the product 100 due to the significant difference in thermal expansion between the coating 102 and substrate 101 (which can lead to greater internal thermal stress in the product 100). Furthermore, recycling the cooling gas can conserve cooling gas and reduce costs. Testing has shown that nitrogen circulation cooling can save energy by 60%. In addition, by cooling the fixture 200, the service life of the fixture 200 can be increased, making the mold usable times ≥ 500,000 times (the usable times of traditional fixtures ≤ 200,000 times), and the wear-resistant coating of the fixture 200 extends its life by 3 times.

[0056] In some embodiments, the fixture 200 further includes: a temperature sensor ( Figure 3The temperature sensor's wiring 206 and the controller are shown in the figure. The temperature sensor is located at the bottom of the storage space 2011, below the memory alloy particles 202. The temperature sensor is configured to detect the current temperature of the memory alloy particles 202. The controller is in communication with the temperature sensor and the cooling device. It is configured to receive the current temperature from the temperature sensor and, if the current temperature does not meet a preset temperature range, send a temperature control signal to the cooling device, causing the cooling device to adjust the flow rate of the cooling gas provided to the inlet 2051 based on the temperature control signal.

[0057] Exemplarily, when the current temperature is lower than the preset temperature range, the cooling device can reduce the flow rate of the cooling gas provided to the inlet 2051, and when the current temperature is higher than the preset temperature range, the cooling device can increase the flow rate of the cooling gas provided to the inlet 2051.

[0058] For example, the optimal cooling rate (eg, 5°C / min to 15°C / min) can be calculated using a proportional, integral, and derivative (PID) algorithm, the current temperature, and a preset temperature range, and the flow rate of the cooling gas can be calculated based on the optimal cooling rate.

[0059] Illustratively, the temperature sensor has an accuracy range of ±0.5°C.

[0060] In the above embodiment, by providing a temperature sensor and a controller, the flow rate of the cooling gas can be dynamically adjusted so that the current temperature of the memory alloy particles 202 meets the preset temperature range (the temperature difference between the current temperature and the preset temperature range can be controlled within ±1°C). This keeps the temperature of the product 100 within a reasonable range, thereby preventing the temperature of the product 100 from being too high, thereby preventing the product 100 from being damaged due to the large difference in thermal expansion between the coating 102 and the substrate 101, and also preventing the local temperature of the coating 102 from being too high, causing the coating 102 to fail.

[0061] In some embodiments, a TaC transition layer may be added between the substrate 101 and the coating 102. The thermal expansion coefficient of the TaC transition layer is approximately 7.4×10 / ℃, by setting a TaC transition layer, the thermal expansion coefficient of each layer structure in the product 100 can be gradually changed, and the thermal expansion mismatch rate can be reduced from 6.5 times to 1.2 times, thereby reducing the thermal stress between adjacent layers of the product 100 (experiments show that the stress can be reduced by 58%).

[0062] In some embodiments, the fixture 200 further includes a buffer structure disposed below the support assembly 201 and configured to absorb vibration energy of the support assembly 201 .

[0063] In the above embodiment, by providing a buffer structure to absorb the vibration energy of the support assembly 201, the vibration of the product 100 and the fixing fixture 200 can be reduced, so that the processing device (such as a grooving device, a grinding device, a drilling device or a cutting device mentioned below) can accurately process the product 100, thereby reducing the flatness of the product 100 (making the flatness ≤0.03 mm / m).

[0064] In some embodiments, the material of the buffer structure includes: silica aerogel.

[0065] For example, the density of silica aerogel is 120 kg / m³ and its vibration absorption efficiency reaches 85%.

[0066] In the above embodiment, by providing a buffer structure of silica aerogel material, high-frequency vibration of the product 100 and the fixing fixture 200 can be effectively reduced.

[0067] In some embodiments, the fixture 200 can adopt a modular design to enable the fixture 200 to quickly adapt to different processing scenarios (such as turning and grinding), reducing equipment modification costs by more than 40%.

[0068] During processing, the coating 102 exhibited a high peeling rate of 12.7%, primarily due to insufficient bonding strength between the coating 102 and the substrate 101 (interfacial shear strength <20 MPa) and surface porosity defects (e.g., vacuum adsorption can cause the pores in the porous coating 102 to penetrate, increasing the porosity by 3% to 5%). To address this issue, product 100 can also undergo plasma activation pretreatment and nanoparticle densification technology.

[0069] Specifically, the plasma activation pretreatment includes: before the product is placed on the fixture 100, bombarding the surface of the coating 102 with argon (Ar) plasma (power 500 W, time 30 s), reducing the surface roughness Ra of the coating 102 from 1.2 μm to 0.4 μm and increasing the interfacial shear strength to 35 MPa. The nanoparticle densification technology includes: when preparing the coating 102 by CVD deposition on the substrate 101, adding 10wt% nanoparticles (such as nanoparticles with a particle size of 50 nm, such as nano-SiC particles), which can reduce the porosity of the coating 102 from 8% to 1.5% and increase the compressive strength to 450 MPa. Combined with the induction groove 20321 in the aforementioned embodiment, the stress peak of the product 100 can be reduced to less than 40% of the substrate yield strength.

[0070] In practical applications, the following steps 1 to 4 may be performed to adjust the processing environment of the product 100 in real time.

[0071] Step 1: Place the product 100 on the memory alloy particles 202 .

[0072] Step 2: The controller controls the driving part 2041 to drive the clamping part 2042 to apply an initial pressure (eg, 0.5 MPa to 1.2 MPa) to the edge area 2032 of the cover plate.

[0073] Step three, the pressure sensor monitors the current pressure applied by the clamping part 2042 to the edge area 2032 in real time, the controller receives the current pressure sent by the pressure sensor in real time, and when the current pressure does not meet the preset pressure range, sends a pressure control signal to the driving part 2041, so that the driving part 2041 controls the movement of the clamping part 2042 based on the pressure control signal.

[0074] Step 4: The temperature sensor monitors the current temperature of the memory alloy particles 202 in real time. The controller receives the current temperature sent by the temperature sensor and sends a temperature control signal to the cooling device when the current temperature does not meet the preset temperature range, so that the cooling device adjusts the flow rate of the cooling gas provided to the inlet 2051 based on the temperature control signal.

[0075] Among them, step three and step four can be performed simultaneously.

[0076] Figure 8 Shown is a schematic structural diagram of a processing device provided by an exemplary embodiment of the present application.

[0077] Based on the same concept, Figure 8 As shown, the embodiment of the present application further provides a processing device 300, which includes: the fixing fixture 200 and the cutting device 400 in the above embodiment. The memory alloy particles 202 of the fixing fixture 200 are configured to support the product 100. The cutting device 400 is configured to cut the processing area of ​​the product 100.

[0078] In some embodiments, the cutting device 400 includes a drive mechanism and a cutting tool. The cutting tool is in driving connection with the drive mechanism, wherein the drive mechanism is capable of driving the cutting tool to cut the processing area of ​​the product 100. When the cutting tool cuts the processing area of ​​the product 100, a first vibration is generated. The processing equipment 300 further includes a piezoelectric ceramic brake, which is disposed on the cutting tool and is capable of generating a second vibration to attenuate the first vibration of the cutting tool. The direction of the first vibration is collinear with the direction of the second vibration, the frequency of the first vibration is the same as the frequency of the second vibration, the amplitude of the first vibration is the same as the amplitude of the second vibration, and the phase of the first vibration is opposite to the phase of the second vibration.

[0079] Exemplarily, the tool has a clamping end and a cutting end, the driving mechanism is connected to the clamping end, the cutting end is configured as a processing area for cutting the product 100, and the piezoelectric ceramic brake is installed on the clamping end.

[0080] For example, the frequency of the piezoelectric ceramic actuator is 20 kHz and the amplitude is 2 μm.

[0081] Exemplarily, the adaptive feed rate of the cutting device 400 is 550 mm / min.

[0082] Because the tool's high-frequency vibration (50 Hz to 200 Hz) cannot be absorbed by conventional fixture damping, the edge area of ​​the product can reach an amplitude of 40 μm to 60 μm, worsening the surface roughness of coating 102, for example, causing the surface roughness Ra of coating 102 to exceed 5 μm. In the above embodiment, the provision of a piezoelectric ceramic actuator can effectively reduce tool vibration, stabilizing the surface roughness Ra of coating 102 at 0.8 μm to 1.2 μm (the surface roughness Ra of conventional processes is greater than 5 μm). At the same time, combined with the buffer structure of the aforementioned embodiment, the surface roughness of coating 102 can be more effectively reduced.

[0083] In summary, since the embodiment of the present application can ensure the processing quality of product 100 by automatically adjusting temperature and pressure, reducing the vibration amplitude of the tool, fixing the fixture 200, and the product 100, etc., the product 100 can be processed with a high degree of flatness through only a single cutting device 400. Traditional processing equipment, on the other hand, cannot control the deformation of the product 100 and the vibration during the cutting process, and therefore requires multiple processing adjustments (single-piece processing time exceeding 30 minutes) to produce qualified products 100. Therefore, the efficiency of the processing equipment 300 in the embodiment of the present application can be improved by 50% to 100%.

[0084] The basic principles of the present application have been described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, and effects mentioned in this application are merely illustrative and not restrictive, and it should not be assumed that these advantages, strengths, and effects are required of each embodiment of this application. In addition, the specific details disclosed above are merely illustrative and facilitating understanding, and are not restrictive. The above details do not limit this application to necessarily being implemented using the above specific details.

[0085] The block diagrams of the devices, devices, equipment, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As will be appreciated by those skilled in the art, these devices, devices, equipment, and systems can be connected, arranged, or configured in any manner. Words such as "include," "comprise," "have," and the like are open-ended words, meaning "including but not limited to," and can be used interchangeably therewith. The words "or" and "and" used herein refer to the words "and / or" and can be used interchangeably therewith, unless the context clearly indicates otherwise. The word "such as" used herein refers to the phrase "such as but not limited to," and can be used interchangeably therewith.

[0086] It should also be noted that in the apparatus, device, and method of the present application, each component or each step can be decomposed and / or recombined, and such decomposition and / or recombination should be regarded as equivalent solutions of the present application.

[0087] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0088] The above description has been provided for the purpose of illustration and description. Furthermore, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although a number of example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A fixing fixture, characterized in that: include: A support assembly having at least one accommodating space and a first opening connecting the accommodating space with the outside, wherein the first opening faces upward; Memory alloy particles are arranged in the accommodation space and extend from the first opening so that the memory alloy particles support the product. The memory alloy particles can be deformed at the process temperature to fit the shape of the product after thermal expansion.

2. The fixing fixture according to claim 1, characterized in that: The shape of the horizontal cross section of the accommodating space includes: a polygon.

3. The fixing fixture according to claim 1 or 2, characterized in that: Also includes: a cover plate, the cover plate having a central area and an edge area, the central area having a second opening, the bottom of the edge area having an induction groove, the cover plate being capable of being disposed above the product when the memory alloy supports the product, and the second opening being configured to expose a processing area of ​​the product; At least one clamping assembly is provided around the cover plate when the cover plate is provided above the product, and the clamping assembly is capable of applying downward pressure to the edge area to secure the product.

4. The fixing fixture according to claim 3, characterized in that: The clamping assembly comprises: Drive unit; a clamping portion, drivingly connected to the driving portion, and configured to move in a vertical direction under the driving of the driving portion to apply downward pressure to the edge area, or to move away from the edge area; Wherein, the fixing fixture further includes: at least one pressure sensor, disposed at the bottom of the accommodation space and below the memory alloy particles, and configured to detect a current pressure applied by the clamping portion to the edge region; The controller is communicatively connected to the pressure sensor and the driving part, and is configured to receive the current pressure sent by the pressure sensor and, when the current pressure does not meet a preset pressure range, send a pressure control signal to the driving part so that the driving part controls the movement of the clamping part based on the pressure control signal.

5. The fixing jig according to claim 1 or 2, characterized in that: The support assembly comprises: a base having a cavity; a support frame, disposed on an upper side of the base, the support frame having at least one accommodating space and the first opening connecting the accommodating space with the outside; Wherein, the fixing fixture further includes: A cooling pipe is arranged in the cavity, and the inlet and outlet of the cooling pipe are respectively connected to the cooling device. The cooling device is configured to provide cooling gas to the inlet. The cooling gas can pass through the cooling pipe and return to the cooling device from the outlet, and be cooled by the cooling device and then provided to the inlet by the cooling device.

6. The fixing fixture according to claim 5, characterized in that: The fixing fixture further comprises: a temperature sensor, disposed at the bottom of the accommodation space and below the memory alloy particles, wherein the temperature sensor is configured to detect a current temperature of the memory alloy particles; A controller is communicatively connected to the temperature sensor and the cooling device, and is configured to receive the current temperature sent by the temperature sensor and, when the current temperature does not meet a preset temperature range, send a temperature control signal to the cooling device so that the cooling device adjusts the flow rate of the cooling gas provided to the inlet based on the temperature control signal.

7. The fixing jig according to claim 1 or 2, characterized in that: Also includes: The buffer structure is disposed below the support assembly and is configured to absorb vibration energy of the support assembly.

8. The fixing fixture according to claim 7, characterized in that: The materials of the buffer structure include: Silica aerogel.

9. A processing equipment, characterized in that, include: The fixing jig according to any one of claims 1 to 8, wherein the memory alloy particles of the fixing jig are configured to support the product; The cutting device is configured to cut the processing area of ​​the product.

10. The processing equipment according to claim 9, characterized in that The cutting device comprises: Drive mechanism; a tool, drivingly connected to the drive mechanism, wherein the drive mechanism is capable of driving the tool to move so that the tool cuts the processing area of ​​the product, and the tool generates a first vibration when cutting the processing area of ​​the product; Wherein, the processing equipment also includes: A piezoelectric ceramic brake is provided on the tool, and the piezoelectric ceramic brake is capable of generating a second vibration to weaken the first vibration of the tool, wherein the direction of the first vibration is collinear with the direction of the second vibration, the frequency of the first vibration is the same as the frequency of the second vibration, the amplitude of the first vibration is the same as the amplitude of the second vibration, and the phase of the first vibration is opposite to the phase of the second vibration.

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