Preparation method of lamp panel with EVA (Ethylene Vinyl Acetate) coating layer and lamp panel thereof
The EVA coating and the LED light board are hot-pressed to form a high-temperature resistant and sealed protective layer, which solves the problem of damage to LED lamps in high temperature, high humidity and corrosive environments, and improves the service life and optical performance of the light board.
Patent Information
- Application Number
- CN202510694975.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-28
- Publication Date
- 2025-09-26
AI Technical Summary
Traditional LED lamps have a short service life and are easily damaged in high temperature, high humidity and corrosive environments, which also affects their optical performance.
The EVA coating is hot-pressed and cured with the LED light panel to form a high-temperature resistant protective layer. The negative pressure design of the hot press ensures close contact and forms a sealing effect. The EVA coating is corrosion-resistant.
Significantly improve the service life and reliability of the light board in high temperature environments, prevent moisture intrusion and corrosion, extend the service life of the light board in corrosive environments, reduce replacement costs, and improve optical performance.
Smart Images

Figure CN120701922A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of lamp component preparation, and in particular to a method for preparing a lamp panel with an EVA coating layer and the lamp panel. Background Art
[0002] In modern industrial production, LED lamps are widely used due to their high efficiency, energy saving, and long lifespan. However, the service life and reliability of traditional LED lamps face challenges in high-temperature, high-humidity, and corrosive environments. For example, the ambient temperature in a hot workshop can reach as high as 100 degrees Celsius, causing damage to the electronic components and connecting circuits within the LED light panel due to overheating; high humidity causes condensation on the surface of the light panel, causing short circuits or corrosion; and corrosive gases or liquids can corrode the metal parts and electronic components of the light panel, accelerating their aging and damage. In practice, traditional LED lamps struggle to operate stably for long periods of time in such harsh environments. Frequent replacement of light panels increases operating costs and affects production efficiency.
[0003] To address these issues, while existing technologies have attempted to protect LED light panels, they remain insufficient. For example, conventional methods involve covering LED light panels with ordinary plastic films or coatings. However, these methods are ineffective in addressing damage to the panels caused by high temperatures, high humidity, and corrosive environments. Ordinary plastic films are prone to deformation and aging at high temperatures, losing their protective properties. Some coatings absorb water and swell in humid environments, causing the coating to crack and expose the panels to harmful environments. Furthermore, these methods may affect the optical performance of the lamp, such as reducing light transmittance or causing uneven light distribution, which can affect the lighting effect.
[0004] In view of the shortcomings of existing technologies, it is necessary to propose new technical solutions. Summary of the Invention
[0005] The present invention provides a method for preparing a light panel with an EVA coating layer and the light panel, aiming to solve at least one of the technical problems existing in the prior art.
[0006] The technical solution of the present invention is a method for preparing a light board with an EVA coating layer, comprising: a long strip of LED light board to be coated, wherein at least one row of LED lamp beads is arranged on one side along the extension direction of the LED light board, comprising the following steps: (1) Place the LED light panel into the working area of the hot press; (2) The EVA coating layer is input into the working area of the hot press, and the EVA coating layer is laminated on one side of the LED lamp board where the LED lamp beads are located; (3) Negative pressure airflow is input into the working area of the hot press to remove air, so as to allow the EVA coating layer to contact the surface of the LED lamp beads and the LED lamp board respectively; (4) The working area of the hot press press is to press the surface of the EVA coating layer through a hot pressing mold with working temperature, working pressure and working time to allow the EVA coating layer to melt and solidify on the surface of the LED lamp beads and the LED light board, thereby obtaining a light board with an EVA coating layer in which the EVA coating layer and the LED light board are bonded.
[0007] Furthermore, the material of the LED lamp board is an aluminum substrate, and a solder resist layer is coated on the surface of the LED lamp board corresponding to the LED lamp beads.
[0008] Furthermore, in step (3), a negative pressure airflow port for vacuuming the operating area of the hot press is arranged below the LED light board. When the negative pressure airflow port is in operation, the air pressure of the negative pressure airflow gradually decreases from the upper EVA coating layer to the lower LED light board, so as to allow the EVA coating layer to be tightly adsorbed to the lower LED light board by the negative pressure airflow.
[0009] Furthermore, in step (4), the hot pressing mold acts on the surface of the EVA coating layer through downward pressure, and the working temperature is 140 degrees Celsius to 145 degrees Celsius.
[0010] Furthermore, in step (4), the hot pressing mold acts on the surface of the EVA covering layer by pressing the downward pressure. The working pressure includes a first working pressure value acting on the middle part of the EVA covering layer and a second working pressure value acting on both sides of the adjacent middle part of the EVA covering layer, wherein the second working pressure value is greater than the first working pressure value.
[0011] Furthermore, the first working pressure value range is 0.5 MPa to 0.7 MPa, and the second working pressure value range is 0.8 MPa to 1 MPa.
[0012] Furthermore, in step (4), the working area of the hot press press uses a hot pressing mold with a working temperature and a working pressure to press the surface of the EVA coating layer for a working time ranging from 5 to 8 minutes.
[0013] Furthermore, in step (4), the shape of the surface of the EVA coating corresponding to the hot pressing mold is an arc. After the hot pressing mold is pressed on the surface of the EVA coating, the obtained lamp board with the EVA coating includes an edge of the EVA coating on each LED lamp bead extending from the top direction of the LED lamp bead to the side edge of the LED lamp board on one side in an arc shape to form an LED light-transmitting surface for scattering light outward.
[0014] Furthermore, in step (4), the size of the EVA coating layer of the light board with the EVA coating layer from the top to the bottom ranges from 1 to 1.5 mm.
[0015] A light board, comprising a light board with an EVA covering layer obtained by the above-mentioned method for preparing a light board with an EVA covering layer.
[0016] The beneficial effects of the present invention include: The preparation method of the light board with EVA coating layer is to heat-press and cure the EVA coating layer at a certain hot pressing temperature, so that the coating layer is tightly bonded to the light board to form a high-temperature resistant protective layer, which effectively prevents high temperature from damaging the internal electronic components and connecting lines of the LED light board, and significantly improves the service life and reliability of the light board in a high-temperature environment; the process design of negative pressure or even vacuum inside the hot press operation area ensures that the EVA coating layer is in close contact with and firmly bonded to the LED lamp beads and the surface of the light board, forming a good sealing effect, effectively preventing the intrusion of water vapor in a high humidity environment, preventing short circuits or corrosion problems caused by condensation on the surface of the light board, and enhancing the stability of the light board in a humid environment; in addition, the EVA coating layer itself has corrosion-resistant properties, and combined with the hot pressing process, it is tightly bonded to the light board to form a reliable protective layer, which can resist the erosion of corrosive gases or liquids on the metal parts and electronic components of the light board, extend the service life of the light board in a corrosive environment, and reduce the cost of frequent replacement due to damage to the light board.
[0017] In addition, additional aspects and advantages of the present invention will be set forth in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 The figure is a flow chart of a method for preparing a light panel with an EVA coating layer according to an embodiment of the present invention.
[0019] Figure 2 It is a side view of a lamp board manufactured by the method for manufacturing a lamp board with an EVA coating layer according to an embodiment of the present invention.
[0020] Figure 3 3. It is a top view of a lamp board manufactured by the method for manufacturing a lamp board with an EVA coating layer according to an embodiment of the present invention.
[0021] Figure 4 2 is a longitudinal sectional schematic diagram of a hot press corresponding to the method for preparing a light panel with an EVA coating layer according to an embodiment of the present invention.
[0022] Figure 5 It is a longitudinal sectional schematic diagram of a hot pressing mold corresponding to the method for preparing a lamp panel with an EVA coating layer according to an embodiment of the present invention. DETAILED DESCRIPTION
[0023] The following will be combined with the embodiments and drawings to clearly and completely describe the concept, specific structure and technical effects of the present invention so as to fully understand the purpose, scheme and effect of the present invention. It should be noted that the embodiments and features in the embodiments of this application can be combined with each other unless there is a conflict.
[0024] It should be noted that, unless otherwise specified, when a feature is referred to as being "fixed" or "connected" to another feature, it may be directly fixed or connected to the other feature or indirectly fixed or connected to the other feature. Furthermore, terms such as "upper," "lower," "left," "right," "top," and "bottom" used in this disclosure are intended solely to describe the relative positions of the components of the disclosure as shown in the accompanying drawings.
[0025] In addition, unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art. The terms used in this specification are only for describing specific embodiments and are not intended to limit the present invention. The term "and / or" as used herein includes any combination of one or more of the related listed items.
[0026] It should be understood that although the terms first, second, third, etc. may be used to describe various elements in the present disclosure, these elements should not be limited to these terms. These terms are only used to distinguish elements of the same type from each other. For example, a first element may also be referred to as a second element, and similarly, a second element may also be referred to as a first element without departing from the scope of the present disclosure.
[0027] Reference Figure 1 As shown in the flow chart, the present invention discloses a method for preparing a light board with an EVA coating layer. Reference Figure 3 As shown, a long strip of LED light board 1 to be coated is provided with at least one row of LED lamp beads 3 on one side along the extension direction of the LED light board 1. The LED lamp beads 3 are attached to the LED light board 1 by a chip mounter.
[0028] Specifically, the method for preparing a light panel with an EVA coating layer includes the following steps: (1) Place the LED light panel into the hot press working area, refer to Figure 4 The hot press of one embodiment shown in the figure can be used to implement any hot press in each step of the method. Figure 4 The hot press can convey the LED light panel to be coated to the working area inside the hot press through the conveyor belt 12. Among them, the conveyor belt 12 in the embodiment has dense holes, which is conducive to the negative air pressure of the negative pressure device 11 inside the hot press passing through the holes of the conveyor belt.
[0029] (2) The EVA coating layer is input into the working area of the hot press, and the EVA coating layer is laminated on one side of the LED lamp board where the LED lamp beads are located. Figure 4 The hot press shown can convey the EVA covering layer to one side of the LED light board where the LED lamp beads are located through a robot or other conveying device.
[0030] (3) Negative pressure airflow is input into the working area of the hot press to remove air, so as to allow the EVA coating layer to contact the surface of the LED lamp beads and the LED lamp board respectively. Figure 4 As shown, the conveyor belt 12 conveys the EVA coating layer and the LED light board to the middle position of the hot press to be hot pressed. The negative air pressure of the negative pressure device 11 inside the hot press acts on the working area of the hot press, so that the flexible EVA coating layer is adsorbed by the negative air pressure and adheres to the surface of the LED lamp beads and the LED light board. The negative air pressure needs to be continuously output until the hot pressing operation of step (4) is completed.
[0031] (4) The hot press machine's working area presses the surface of the EVA coating layer through a hot pressing mold with working temperature, working pressure and working time to allow the EVA coating layer to melt and solidify on the surface of the LED lamp beads and the LED light board to obtain a light board with an EVA coating layer 2 bonded to the LED light board. Figure 4 In the hot press shown, a hard object storage table can be placed below the EVA coating layer and LED light board to be hot pressed in the middle position, so that the EVA coating layer, LED light board and hard object storage table below the hot pressing mold 13 are subjected to force for hot pressing. The light board with the EVA coating layer obtained after hot pressing is then transported out of the hot press through the conveyor belt 12 to complete the operation.
[0032] The preparation method of the light board with EVA coating layer is to heat-press and cure the EVA coating layer at a certain hot pressing temperature, so that the coating layer is tightly bonded to the light board to form a high-temperature resistant protective layer, which effectively prevents high temperature from damaging the internal electronic components and connecting lines of the LED light board, and significantly improves the service life and reliability of the light board in a high-temperature environment; the process design of negative pressure or even vacuum inside the hot press operation area ensures that the EVA coating layer is in close contact with and firmly bonded to the LED lamp beads and the surface of the light board, forming a good sealing effect, effectively preventing the intrusion of water vapor in a high humidity environment, preventing short circuits or corrosion problems caused by condensation on the surface of the light board, and enhancing the stability of the light board in a humid environment; in addition, the EVA coating layer itself has corrosion-resistant properties, and combined with the hot pressing process, it is tightly bonded to the light board to form a reliable protective layer, which can resist the erosion of corrosive gases or liquids on the metal parts and electronic components of the light board, extend the service life of the light board in a corrosive environment, and reduce the cost of frequent replacement due to damage to the light board.
[0033] The entire preparation method includes inputting the LED light panel and EVA covering layer into the hot press working area, vacuuming, hot pressing and other steps. These steps can be completed by automated equipment, reducing manual operations, improving production efficiency, reducing labor costs, and ensuring the consistency and stability of product quality.
[0034] In some embodiments, the material of the LED light board is an aluminum substrate, and the surface of the LED light board corresponding to the LED lamp beads is coated with a solder mask layer. Combined with the sealing protection of the EVA coating layer, the light board can resist the influence of high temperature, high humidity and corrosive environment to a certain extent, thereby extending its service life.
[0035] Reference Figure 4 As shown, in step (3), a negative pressure airflow port for vacuuming the operating area of the hot press is set below the LED light board. A negative pressure airflow port is set on the surface of the negative pressure device 11 in the figure. The arrow in the figure indicates the direction of airflow, that is, the negative pressure airflow port of the negative pressure device 11 draws in airflow. When the negative pressure airflow port is working, the air pressure of the negative pressure airflow gradually decreases from the upper EVA coating to the lower LED light board, allowing the EVA coating to be tightly adsorbed to the lower LED light board by the negative pressure airflow. This step can reduce the residual bubbles between the EVA coating and the LED light board, and improve the yield rate of the hot pressing operation in step (4).
[0036] Combine Figure 5 The hot pressing mold is shown in detail. In step (4), the hot pressing mold is pressed on the surface of the EVA covering layer by downward pressure. The working pressure includes a first working pressure value acting on the middle part of the EVA covering layer and a second working pressure value acting on both sides of the adjacent middle part of the EVA covering layer. Figure 5 The first area 13a in the hot pressing mold corresponds to the first working pressure value, and the second areas 13b on both sides of the first area 13a correspond to the second working pressure value. The first area 13a is controlled to rise and fall by the first cylinder 14a, and the two second areas 13b are simultaneously controlled to rise and fall by the second cylinder 14b through the connecting rod. The two cylinders control different pressure values, so that the second working pressure value is greater than the first working pressure value. In this way, the hot pressing mold acts on the surface of the EVA coating on the LED light board, so that the finished product is as follows. Figure 2 As shown, the pressure in the middle is small and the pressure on both sides is large, so that the EVA cover is attached to the LED light board in an arc shape. In some embodiments, the first working pressure value range is 0.5MPa to 0.7MPa, and the second working pressure value range is 0.8MPa to 1MPa.
[0037] In step (4), the working area of the hot press press uses a hot pressing mold with a working temperature and working pressure to press the surface of the EVA coating layer for a working time ranging from 5 to 8 minutes.
[0038] In step (4), the hot pressing mold acts on the surface of the EVA coating layer through downward pressure. The working temperature is 140 degrees Celsius to 145 degrees Celsius. The parameters such as the working temperature, working pressure, working time and specific distribution of the working pressure of the hot pressing mold are clearly defined, so that the process parameters can be accurately controlled during the production process, further ensuring the stability and reliability of product quality and reducing the defective rate caused by unstable process parameters.
[0039] In step (4), refer to Figure 5 A cross-sectional view of the hot pressing mold 13 is shown, wherein the shape of the surface of the hot pressing mold corresponding to the EVA coating layer is arc-shaped. After the hot pressing mold is pressed on the surface of the EVA coating layer, the obtained lamp board with the EVA coating layer includes the edge of the EVA coating layer on each LED lamp bead extending from the top direction of the LED lamp bead to the side edge of the LED lamp board on one side in an arc-shaped direction to form an LED light-transmitting surface for scattering light outward.
[0040] In step (4), the size of the EVA coating layer of the light board with the EVA coating layer from the top to the bottom ranges from 1 to 1.5 mm. The thickness of the EVA coating layer takes into account both cost and can effectively protect the LED light board and lamp beads.
[0041] Reference Figure 2 、 3 and Figure 5 As shown, the present invention also discloses a lamp board, which includes a lamp board with an EVA coating layer obtained by the above-mentioned method for preparing a lamp board with an EVA coating layer. The EVA coating layer of the lamp board covers the LED lamp board and the LED lamp beads. This adhesive layer has excellent high-temperature resistance and can remain stable under high-temperature conditions, preventing the lamp beads and the lamp board from being damaged by high temperature, thereby extending the service life of the lamp in a high-temperature environment; in addition, the edge of the EVA coating layer on each LED lamp bead is arc-shaped, and the adjacent LED lamp beads along the side of the LED lamp board cooperate to form an LED light-transmitting surface for scattering light outward, avoiding the defect that traditional lamps need to match corresponding light-transmitting covers to achieve the scattering effect, avoiding the problems of light concentration and uneven lighting that may occur in traditional lamps, improving the lighting quality, and providing more comfortable and more effective lighting for industrial working environments.
[0042] The above description is merely a preferred embodiment of the present invention. The present invention is not limited to the aforementioned embodiments. As long as the technical effects of the present invention are achieved by the same means, any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present disclosure shall be included within the scope of protection of the present disclosure. Within the scope of protection of the present invention, its technical solutions and / or implementation methods may be modified and varied in various ways.
Claims
1. A method for preparing a light panel with an EVA coating, characterized in that: A long strip of LED light board to be coated, wherein at least one row of LED lamp beads is arranged on one side of the LED light board along the extension direction. The following steps are involved: The LED light panel is input into the working area of the heat press; Inputting the EVA covering layer into the working area of the hot press, the EVA covering layer is laminated on one side of the LED lamp board where the LED lamp beads are located; Negative pressure airflow is input into the working area of the heat press to remove air, so as to allow the EVA coating layer to contact the LED lamp beads and the surface of the LED lamp board respectively; The working area of the hot press press uses a hot pressing mold with working temperature, working pressure and working time to press the surface of the EVA covering layer to allow the EVA covering layer to melt and solidify on the surface of the LED lamp beads and the LED light board to obtain a lamp board with an EVA covering layer in which the EVA covering layer and the LED light board are bonded.
2. The method for preparing a light panel with an EVA coating according to claim 1, characterized in that: The material of the LED lamp board is an aluminum substrate, and a solder resist layer is coated on the surface of the LED lamp board corresponding to the LED lamp beads.
3. The method for preparing a light panel with an EVA coating according to claim 1, characterized in that: In step (3), a negative pressure airflow port for vacuuming the working area of the hot press is set below the LED light board. When the negative pressure airflow port is working, the air pressure of the negative pressure airflow gradually decreases from the upper EVA coating layer to the lower LED light board, so as to allow the EVA coating layer to be tightly adsorbed to the lower LED light board by the negative pressure airflow.
4. The method for preparing a light panel with an EVA coating according to claim 1, characterized in that: In step (4), the hot pressing mold acts on the surface of the EVA coating layer through downward pressure. The working temperature is 140 degrees Celsius to 145 degrees Celsius.
5. The method for preparing a light panel with an EVA coating according to claim 1, characterized in that: In step (4), the hot pressing mold acts on the surface of the EVA covering layer by pressing the working pressure, wherein the working pressure includes a first working pressure value acting on the middle part of the EVA covering layer and a second working pressure value acting on both sides of the adjacent middle part of the EVA covering layer. Wherein, the second working pressure value is greater than the first working pressure value.
6. The method for preparing a light panel with an EVA coating according to claim 5, characterized in that: The first working pressure value range is 0.5 MPa to 0.7 MPa, and the second working pressure value range is 0.8 MPa to 1 MPa.
7. The method for preparing a light panel with an EVA coating according to claim 1, characterized in that: In step (4), the working area of the hot press press uses a hot pressing mold with a working temperature and working pressure to press the surface of the EVA coating layer for a working time ranging from 5 to 8 minutes.
8. The method for preparing a light panel with an EVA coating according to claim 1, characterized in that: In step (4), the shape of the surface of the hot pressing mold corresponding to the EVA coating layer is arc-shaped. After the hot pressing mold is pressed on the surface of the EVA coating layer, the obtained lamp board with the EVA coating layer includes an edge of the EVA coating layer on each LED lamp bead extending from the top direction of the LED lamp bead to the side edge of the LED lamp board on one side in an arc shape to form an LED light-transmitting surface for scattering light outward.
9. The method for preparing a light panel with an EVA coating according to claim 1, characterized in that: In step (4), the size of the EVA coating layer of the light board with the EVA coating layer from the top to the bottom ranges from 1 to 1.5 mm.
10. A light board, characterized in that: It comprises a light board with an EVA coating layer obtained by the method for preparing a light board with an EVA coating layer as described in any one of claims 1 to 9.