Crystal grain detection method, computer equipment and storage medium

Abstract

The embodiment of the invention discloses a crystal grain detection method, computer equipment and a storage medium. According to the embodiment of the invention, before the crystal grain is detected, the pose of the microscope relative to the probe table is adjusted through the driving mechanism, the crystal grain to be detected can be placed on the probe table, and then the crystal grain is moved to the position under the probe card through the adjustment of the probe table; then moving the probe card to perform needle insertion on the crystal grains, and performing parameter test on the inserted crystal grains through the test machine to obtain parameters of the crystal grains; after the parameter test is completed, controlling the microscope to shoot the appearance of the crystal grain through the industrial personal computer, and transmitting an image obtained by shooting to the test machine; and finally, the tester integrates the parameter test data and the appearance image to judge whether the appearance and parameters of the crystal grains are qualified, and if both are qualified, the crystal grains are sent to the next procedure. According to the crystal grain detection device and the detection method, appearance detection and parameter testing are integrated on the same station, so that the detection period is shortened, and the fragment risk is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of integrated circuit testing, and in particular to a die detection method, a computer device, and a storage medium. Background Art

[0002] With the improvement of domestic integrated circuit technology, more and more high-end chips are produced and tested domestically, which also puts higher demands on domestic wafer testing capabilities.

[0003] At present, domestic manufacturers mainly use probers and AOI equipment (Automated Optical Inspection) to inspect wafers. The usual inspection steps are: after the wafer enters the factory, it is first sent to the AOI equipment for the first appearance inspection to determine whether the incoming material is normal; the normal wafer is sent to the prober for testing. After the wafer test is completed, the wafer that has completed the test is sent to the corresponding AOI equipment for the second appearance inspection to determine whether the appearance of the wafer after the test is normal. In actual operation, it is found that at least the following problems exist:

[0004] 1. Most AOI equipment is imported, and the purchase and maintenance costs are high;

[0005] Second, the inspection and testing production line is long, which extends the single production cycle of wafers;

[0006] 3. Each appearance inspection requires wafer handling, that is, taking the wafers out of the wafer cassette and taking them to the AOI equipment for inspection, which increases the risk of debris during handling and placement;

[0007] 4. AOI equipment occupies a large space, resulting in low space utilization in the clean room. Summary of the Invention

[0008] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a die inspection method, computer equipment, and storage medium to address the current problems of long wafer inspection cycles and the risk of fragmentation.

[0009] In the first aspect, the present application provides a grain detection method, which is applied to the appearance detection and parameter testing of grains. The grain detection method is performed based on a grain detection device, which includes an industrial computer, a test machine, a drive mechanism, a probe station, and a light source and a microscope arranged above the probe station. The industrial computer is respectively connected to the test machine, the probe station and the microscope for communication, and the microscope is installed at the moving end of the drive mechanism; the grain detection method includes: adjusting the position of the microscope relative to the probe station by the drive mechanism so that the light beam emitted by the light source can be reflected by the grain. The crystal to be tested is placed on the probe station, and the crystal is moved to the bottom of the probe card by the probe station; the crystal is punctured by the probe card, and the parameter test of the punctured crystal is performed by the test machine to obtain the parameters of the crystal; after completing the parameter test, the microscope is controlled by the industrial computer to photograph the appearance of the crystal, and the photographed image is transmitted to the test machine; the test machine combines the parameter test data and the appearance image to judge whether the appearance and parameters of the crystal are qualified, and if both are qualified, the crystal is sent to the next process.

[0010] Based on the above-mentioned grain detection method, before inspecting the wafer (grain), the position of the microscope relative to the probe station is adjusted by the driving mechanism so as to capture the grain placed on the probe station; and the grain to be tested can be placed on the probe station, and then the grain is moved to directly under the probe card through the adjustment of the probe station itself; then the probe card is moved to pierce the grain, and then the pierced grain is subjected to parameter testing by the test machine to obtain the parameters of the grain; after completing the parameter test, the microscope is controlled by the industrial computer to capture the appearance of the grain, and the captured image is transmitted to the test machine; finally, the test machine combines the parameter test data and the appearance image to determine whether the appearance and parameters of the grain are qualified. If both are qualified, the grain is sent to the next process. Compared with the existing technology, the present application can realize the concentration of appearance inspection and parameter testing at the same workstation (probe station) through the grain inspection device, thereby reducing the number of equipment required for both appearance inspection and parameter testing of the grain to one, thereby greatly reducing the space occupied by the equipment used for wafer inspection, and since there is no need to transfer the wafer to other workstations, the risk of wafer fragmentation during transportation and placement is avoided; at the same time, the grain inspection method of the present application can realize grain parameter testing and appearance inspection at the same workstation, reducing the steps of wafer inspection, thereby shortening the wafer production cycle.

[0011] In one or more embodiments of the above-mentioned grain detection method, the grain detection method further includes: before using the probe card to puncture the grain, controlling the microscope by the industrial computer to photograph the appearance of the grain, and transmitting the photographed image to the testing machine.

[0012] In one or more embodiments of the above-mentioned grain detection method, the grain detection device also includes a picking mechanism that establishes communication with the industrial computer, and the picking mechanism includes a robot and a conveyor table docked with the probe station; the grain detection method also includes: before using the probe card to puncture the grain, the tester determines whether the appearance of the grain is qualified based on the appearance image it obtains; if it is unqualified, the unqualified grain is picked out by the robot and the unqualified grain is placed on the conveyor table.

[0013] In one or more embodiments of the above-mentioned grain inspection method, after completing the parameter test, controlling the microscope by the industrial computer to photograph the appearance of the grain includes: photographing needle marks on the surface of the grain.

[0014] In one or more embodiments of the above-mentioned grain detection method, the probe card is installed on the driving mechanism and is located directly below the microscope; the probe card is provided with a through hole, and the projection area of ​​the through hole in the vertical direction can accommodate the lens of the microscope.

[0015] In one or more embodiments of the above-mentioned grain detection method, the driving mechanism includes a first mounting plate, a second mounting plate and a moving part, the second mounting plate is slidably arranged on the first mounting plate through a cross sliding structure, the moving part is connected to the second mounting plate, and the microscope is installed on the moving part of the moving part.

[0016] In one or more embodiments of the above-mentioned grain detection method, the grain detection method further includes: before the microscope photographs the grain, adjusting the overlap between the through hole and the lens of the microscope in the horizontal plane by moving the second mounting plate; and driving the microscope to move in the vertical direction by the movable member so that a set distance is maintained between the lens of the microscope and the grain.

[0017] In one or more embodiments of the above-mentioned grain detection method, the industrial computer and the probe station are connected via a GPIB interface; and / or the industrial computer and the test machine are connected via an Ethernet interface based on the TCP protocol.

[0018] In a second aspect, the present application provides a computer device, a memory and a processor, wherein the memory stores a computer program that can be run on the processor, and when the computer program is executed by the processor, the steps of the grain detection method are implemented.

[0019] In a third aspect, the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed, the steps of the grain detection method are implemented.

[0020] One or more of the above embodiments of the present application have at least one or more of the following beneficial effects:

[0021] Before inspecting the wafer (grain), the position of the microscope relative to the probe station is adjusted through the driving mechanism so that the grain placed on the probe station can be photographed; the grain to be tested can be placed on the probe station, and then the grain can be moved to the bottom of the probe card through the adjustment of the probe station itself; then the probe card is moved to pierce the grain, and then the pierced grain is tested by the test machine to obtain the parameters of the grain; after completing the parameter test, the microscope is controlled by the industrial computer to photograph the appearance of the grain, and the photographed image is transmitted to the test machine; finally, the test machine combines the parameter test data and appearance image to determine whether the appearance and parameters of the grain are qualified. If both are qualified, the grain will be sent to the next process. Compared with the existing technology, the present application can realize the concentration of appearance inspection and parameter testing at the same workstation (probe station) through the grain inspection device, thereby reducing the number of equipment required for both appearance inspection and parameter testing of the grain to one, thereby greatly reducing the space occupied by the equipment used for wafer inspection, and since there is no need to transfer the wafer to other workstations, the risk of wafer fragmentation during transportation and placement is avoided; at the same time, the grain inspection method of the present application can realize grain parameter testing and appearance inspection at the same workstation, reducing the steps of wafer inspection, thereby shortening the wafer production cycle.

[0022] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The disclosure of this application will be more easily understood with reference to the accompanying drawings. Those skilled in the art will readily appreciate that these drawings are for illustrative purposes only and are not intended to limit the scope of protection of this application. Furthermore, similar numbers in the figures represent similar components, where:

[0024] Figure 1 This is a simplified structural diagram of a grain detection device provided in an embodiment of the present application;

[0025] Figure 2 This is a schematic structural diagram of a driving mechanism provided in an embodiment of the present application;

[0026] Figure 3 This is a flow chart of a grain detection method provided in an embodiment of the present application;

[0027] Figure 4 This is an architectural diagram of a computer device provided in an embodiment of the present application.

[0028] Description of reference numerals:

[0029] 1. Test machine; 2. Industrial computer; 3. Microscope; 4. Light source; 5. Probe card; 51. Through hole; 6. Wafer; 7. Probe station; 8. Driving mechanism; 81. First mounting plate; 82. Second mounting plate; 83. Cross-sliding structure; 84. Moving part. DETAILED DESCRIPTION

[0030] Some embodiments of the present application are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principles of the present application and are not intended to limit the scope of protection of the present application.

[0031] After a series of semiconductor processes (such as photolithography, doping, and etching) on ​​the wafer, a large number of integrated circuit structures are formed. Each independent unit in these integrated circuit structures is called a die. Dies are obtained by cutting the wafer into multiple small pieces. Each die represents a complete electronic component and is usually fully functional, but at this stage it has not yet been packaged.

[0032] It should be noted that in actual operation, in order to facilitate centralized inspection of the dies, the wafer is usually not cut into individual dies during the inspection stage. Instead, the physical integrity of the multiple dies is maintained. At the same time, wafers and dies can refer to each other at this stage.

[0033] Currently, most wafer inspection and testing production lines are relatively long, resulting in a long single wafer production cycle, affecting wafer production efficiency; and each appearance inspection requires the wafer to be transported, that is, the wafer is taken out of the wafer box and taken to the AOI equipment for inspection, which increases the risk of debris during transportation and placement.

[0034] Therefore, the embodiment of the present application provides a grain detection method, computer equipment and storage medium. The grain detection method is based on a grain detection device, which includes an industrial computer, a test machine, a driving mechanism, a probe station, and a light source and a microscope arranged above the probe station. Before detecting the wafer (grain), the driving mechanism is used to adjust the position of the microscope relative to the probe station so as to photograph the grain placed on the probe station; and the grain to be tested can be placed on the probe station, and then the probe station itself is adjusted to move the grain to directly under the probe card; then the probe card is moved to puncture the grain, and then the punctured grain is tested by the test machine to obtain the parameters of the grain; after completing the parameter test, the industrial computer is used to control the microscope to photograph the appearance of the grain, and the photographed image is transmitted to the test machine; finally, the test machine combines the parameter test data and the appearance image to determine whether the appearance and parameters of the grain are qualified. If both are qualified, the grain is sent to the next process. Compared with the existing technology, the present application can realize the concentration of appearance inspection and parameter testing at the same workstation (probe station) through the grain inspection device, thereby reducing the number of equipment required for both appearance inspection and parameter testing of the grain to one, thereby greatly reducing the space occupied by the equipment used for wafer inspection, and since there is no need to transfer the wafer to other workstations, the risk of wafer fragmentation during transportation and placement is avoided; at the same time, the grain inspection method of the present application can realize grain parameter testing and appearance inspection at the same workstation, reducing the steps of wafer inspection, thereby shortening the wafer production cycle.

[0035] The present application will be described in detail below through specific embodiments.

[0036] Example 1

[0037] Reference Figure 1 and Figure 2 As shown, an embodiment of the present application provides a grain detection device, which includes an industrial computer 2, a test machine 1, a drive mechanism 8, a probe station 7, and a light source 4 and a microscope 3 arranged above the probe station 7. The industrial computer 2 is communicated with the test machine 1, the probe station 7 and the microscope 3 respectively, and the microscope 3 is installed at the moving end of the drive mechanism 8.

[0038] For ease of representation, Figure 1 In the figure, only the probe card 5 is shown in cross section, and the components that can reflect the light beam are represented by dotted lines. At the same time, the full arrows are used to represent the light beam irradiation path, and the half arrows are used to represent the communication relationship between the two.

[0039] In this embodiment, the die inspection device is used for appearance inspection and parameter testing of the die.

[0040] Among them, industrial computer 2 is a computer control system designed specifically for industrial environments, responsible for core tasks such as data acquisition, real-time control, and equipment management.

[0041] In this embodiment, the tester 1 is an ATE (Automatic Test Equipment) tester. Of course, when it is necessary to test other indicators of the wafer 6, other types of testers 1, such as a fast electrical parameter tester, can also be selected. The microscope 3 is an electron microscope.

[0042] It should be noted that, when performing parameter testing on a die, a probe card 5 is generally used, and the probe card 5 is usually part of a probe station 7. In actual use, the installation position of the probe card 5 can be flexibly adjusted according to actual needs.

[0043] In addition, the microscope 3 and the light source 4 need to be used in conjunction with each other, that is, after the light source 4 emits a light beam, the light beam is reflected by the object to be photographed (crystal grain), and the reflected light can enter the lens of the microscope 3. In actual use, it is necessary to flexibly adjust the shooting angle of the lens of the microscope 3 and the irradiation angle of the light source 4 according to factors such as the placement of the crystal grain and the installation position of the probe card 5. At the same time, a reflector (in the Figure 1 components such as those indicated by slashes) to adjust the path of the light beam.

[0044] As an example and not limitation, refer to Figure 2 As shown, the probe card 5 is mounted on the driving mechanism 8 and is located directly below the microscope 3, so that the driving mechanism 8 can be used to centrally adjust the postures of the probe card 5 and the microscope 3 relative to the probe station 7. The probe card 5 is provided with a through hole 51, and the projection area of ​​the through hole 51 in the vertical direction can accommodate the lens of the microscope 3, so that the microscope 3 can clearly capture the appearance of the grain through the through hole 51. Correspondingly, the light source 4 is mounted on the side of the microscope 3. After adopting the above-mentioned structural arrangement, the microscope 3, the light source 4 and the probe card 5 can be integrated to improve space utilization. At the same time, there is no need to adjust the angles of the microscope 3 and the light source 4, which simplifies the use steps of the grain detection device.

[0045] It should be noted that when adjusting the position of the probe card 5 relative to the probe station 7, the adjustment can be made by the drive mechanism 8 alone or by the structure of the probe station 7 alone. Of course, the adjustment can also be made by combining the drive mechanism 8 and the probe station 7. As an example and not a limitation, refer to Figure 2As shown, the driving mechanism 8 includes a first mounting plate 81, a second mounting plate 82, and a moving member 84. The second mounting plate 82 is slidably mounted on the first mounting plate 81 via a cross-sliding structure 83. The moving member 84 is connected to the second mounting plate 82, and the microscope 3 is mounted on the moving portion of the moving member 84. The above structure and the structure of the probe station 7 itself can be used to adjust the probe card 5. For example, the relative position of the probe card 5 in the horizontal plane can be adjusted by moving the second mounting plate 82, so that the through hole 51 can accommodate the lens of the microscope 3. Then, the structure of the probe station 7 itself (such as a lifting device) can be used to control the probe card 5 to approach or move away from the probe station 7. Specifically, the driving mechanism 8 is mounted on the corresponding structure of the probe station 7 itself.

[0046] In some examples, the driving mechanism 8 may also be a multi-axis robotic arm or a multi-axis driving platform, thereby adjusting the spatial position of the microscope 3. The cross sliding structure 83 may be a cross sliding platform or other component capable of sliding in two mutually perpendicular directions.

[0047] In some examples, the grain inspection device further includes a sorting mechanism that establishes communication with the industrial computer 2, and the sorting mechanism includes a manipulator and a conveyor platform docked with the probe station 7. The timing of the microscope 3 photographing the grains can be flexibly adjusted as needed; for example, before acupuncture of the grains, the microscope 3 photographs the grains to obtain an image of their appearance, which is then transmitted to the tester 1. If the tester 1 determines that the appearance image of the grains is unqualified, the industrial computer 2 can send a signal to the sorting mechanism, causing the manipulator and conveyor platform to start operation. The manipulator then grabs the unqualified grains and places them on the conveyor platform to transport them to the corresponding area.

[0048] It should be noted that the above-mentioned unqualified grains are generally grains that have been cut; or a cutting piece can be provided on the robot arm to cut off the unqualified grains.

[0049] The communication method between the industrial computer 2, the probe station 7, and the test machine 1 can be flexibly adjusted according to actual needs. In this embodiment, the industrial computer 2 and the probe station 7 are connected via a GPIB interface; and / or, the industrial computer 2 and the test machine 1 are connected via an Ethernet interface based on the TCP protocol.

[0050] GPIB (General Purpose Interface Bus), also known as the IEEE-488 bus, is an international standard parallel communication interface designed specifically for instrument control. TCP (Transmission Control Protocol) is the core transport layer protocol of the Internet. Ethernet interfaces include network ports (RJ45), serial ports (RS485), and fiber optic interfaces.

[0051] Example 2

[0052] Corresponding to the above embodiment 1, the embodiment of the present application further provides a grain detection method, which is applied to the appearance detection and parameter testing of grains, and the grain detection method is performed based on a grain detection device. Figure 3 As shown, the grain inspection method includes:

[0053] S100, adjusting the position of the microscope relative to the probe station through the driving mechanism so that the light beam emitted by the light source can enter the lens of the microscope after being reflected by the crystal grain;

[0054] The installation position and angle of the microscope 3 and the light source 4 can be flexibly adjusted according to factors such as the placement of the die. In this embodiment, the lens of the microscope 3 is vertically downward, and the light source 4 is installed on one side of the housing of the microscope 3, with the light beam outlet facing vertically downward.

[0055] In some examples, the die inspection method further includes:

[0056] Before the microscope 3 photographs the grains, the second mounting plate 82 is moved to adjust the overlap between the through hole 51 and the lens of the microscope 3 in the horizontal plane; the moving member 84 drives the microscope 3 to move in the vertical direction so that the lens of the microscope 3 maintains a set distance from the grains.

[0057] In actual use, the drive mechanism 8 can generally be connected to the structure of the probe station 7 itself, such as the lifting device and / or horizontal displacement device of the probe station 7, so as to quickly adjust the position of the microscope 3 relative to the supporting surface of the probe station 7. Generally, the microscope 3 is adjusted to the center position of the probe station 7, and then the drive mechanism 8 is used to adjust the position of the microscope 3 in a small range so that the lens of the microscope 3 can clearly capture the grains.

[0058] S200, placing the die to be tested on the probe station, and moving the die to the bottom of the probe card through the probe station;

[0059] Among them, the probe station 7 includes a frame and a platform on the frame, which is used to place the object to be tested, and the platform can move relative to the frame within a set horizontal plane, thereby driving the grain to move to the center position of the probe station 7, that is, directly below the probe card 5.

[0060] It should be noted that after the die enters the factory, it is generally necessary to first inspect the appearance of the die to obtain the appearance quality of the die before entering the factory.

[0061] In some examples, the die inspection method further includes:

[0062] Before the die is pricked with a probe card 5 , the industrial computer 2 controls the microscope 3 to photograph the appearance of the die, and transmits the photographed image to the testing machine 1 .

[0063] Specifically, when the crystal grain to be tested is moved to the position directly below the microscope 3, the microscope 3 has been adjusted before, so there is no need to adjust the focal length of the microscope 3 at this time; therefore, after the probe station 7 sends the information that the crystal grain has been moved into position to the industrial computer 2 through the GPIB interface, the industrial computer 2 controls the microscope 3 to take a picture of the crystal grain and transmits the captured image to the test machine 1.

[0064] Furthermore, in some examples, the die inspection method further includes:

[0065] Before the die is pricked with a probe card 5 , the tester 1 determines whether the appearance of the die is qualified based on the appearance image it obtains;

[0066] If unqualified, the unqualified grains are picked out by a robot and placed on a conveyor table.

[0067] It should be noted that in some examples, even if a die that has not been parameter tested is found to have appearance problems, there is no need to remove the problematic die. It is only necessary to store the test results in the test machine 1 and mark the unqualified die by setting a program in the test machine 1. For example, qualified corresponds to Pass=1; unqualified corresponds to Fail=901.

[0068] S300, using a probe card to poke a die, and then using a tester to perform parameter testing on the poke-poke die to obtain the parameters of the die;

[0069] Specifically, the die is probed with a probe card 5, establishing communication between the integrated circuit on the die's surface and the tester 1. This facilitates testing of the die's various parameters by the tester 1, thereby obtaining the die's actual parameters. Similarly, the tester 1's built-in program marks the results of this parameter test, with a pass value of 1 and a fail value of 200 to 899 (the specific numbers are specified by the test program).

[0070] S400: After completing the parameter test, the industrial computer controls the microscope to photograph the appearance of the grains, and transmits the photographed images to the testing machine;

[0071] Specifically, after the parameter test is completed, the probe card 5 is lifted, and at this time the lens of the microscope 3 is also lifted to the initial adjustment position. After the probe station 7 obtains the displacement information of the probe card 5, it notifies the microscope 3 to take a picture through the GP IB interface, thereby obtaining an image of the grain after the parameter test is completed, and transmits the captured image to the tester 1. The built-in program of the tester 1 marks the qualified as Pass=1; the unqualified as Fail=902.

[0072] Among them, each die is assigned a unique label during the entire inspection process, and the results of parameter testing and appearance inspection are bound to the die label.

[0073] S500: Determine whether the appearance and parameters of the die are qualified by combining the parameter test data and the appearance image in the testing machine. If they are qualified, the die is sent to the next process.

[0074] In this embodiment, the next step is generally a packaging step.

[0075] After the parameter test and appearance inspection are completed, the tester 1 judges all the test results. Only when the mark is 1 each time can the die be judged as a qualified die (pass die); if there is a failure, the failed die (fail die) will be output as a failure bin, and the output mark is 200~902 (parameter failure = 200~899, appearance failure = 901 / 902).

[0076] In some examples, after completing the parameter test, controlling the microscope 3 through the industrial computer 2 to photograph the appearance of the grain includes:

[0077] Photograph the needle marks on the grain surface.

[0078] Compared with the existing technology, the present application can realize the concentration of appearance inspection and parameter testing at the same station (probe station 7) for processing through the grain detection device, thereby reducing the number of equipment required for both the appearance inspection and parameter testing of the grain to one, thereby greatly reducing the space occupied by the equipment used for wafer 6 detection, and since there is no need to transfer wafer 6 to other stations, the risk of wafer 6 being broken during transportation and placement is avoided; at the same time, the grain detection method of the present application can realize grain parameter testing and appearance inspection at the same station, reducing the steps of wafer 6 detection, thereby shortening the wafer 6 production cycle. Ultimately, a single domestic device replaced multiple expensive test equipment, and the test steps were reduced, thereby greatly reducing the test cost.

[0079] Example 3

[0080] Corresponding to the above-mentioned embodiments 1 and 2, an embodiment of the present application further provides a computer device, comprising: a processor and a memory, wherein the memory stores a computer program that can be run on the processor, and when the computer program is executed by the processor, the steps of the grain detection method provided in any of the above-mentioned embodiments are executed.

[0081] in, Figure 4 The computer device 1500 is shown as an example and may include a processor 1510, a video display adapter 1511, a disk drive 1512, an input / output interface 1513, a network interface 1514, and a memory 1520. The processor 1510, the video display adapter 1511, the disk drive 1512, the input / output interface 1513, the network interface 1514, and the memory 1520 may be communicatively connected via a communication bus 1530.

[0082] Among them, the processor 1510 can be implemented by a general-purpose CPU (Central Processing Unit), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solution provided by the present invention.

[0083] The memory 1520 can be implemented in the form of ROM (Read Only Memory), RAM (Random Access Memory), static storage device, dynamic storage device, etc. The memory 1520 can store an operating system 1521 for controlling the operation of the electronic device and a basic input and output system (BIOS) for controlling the low-level operations of the electronic device. In addition, a web browser 1523, a data storage management system 1524, and a device identification information processing system 1525 can also be stored. The above-mentioned device identification information processing system 1525 can be an application program that specifically implements the operations of the aforementioned steps in the embodiment of the present invention. In short, when the technical solution provided by the present invention is implemented by software or firmware, the relevant program code is stored in the memory 1520 and is called and executed by the processor 1510.

[0084] The input / output interface 1513 is used to connect input / output modules to implement information input and output. The input / output modules can be configured as components in the device (not shown in the figure) or can be externally connected to the device to provide corresponding functions. Input devices may include a keyboard, mouse, touch screen, microphone, various sensors, etc., and output devices may include a display, speaker, vibrator, indicator light, etc.

[0085] The network interface 1514 is used to connect to a communication module (not shown) to enable communication between the device and other devices. The communication module can communicate via a wired method (such as USB, network cable, etc.) or a wireless method (such as mobile network, WIFI, Bluetooth, etc.).

[0086] The bus comprises a pathway that transmits information between the various components of the device (eg, processor 1510 , video display adapter 1511 , disk drive 1512 , input / output interface 1513 , network interface 1514 , and memory 1520 ).

[0087] In addition, the electronic device can also obtain information on specific collection conditions from the virtual resource object collection condition information database for use in condition judgment, etc.

[0088] It should be noted that although the above device only shows the processor 1510, video display adapter 1511, disk drive 1512, input / output interface 1513, network interface 1514, memory 1520, bus, etc., in a specific implementation, the device may also include other components necessary for normal operation. In addition, those skilled in the art will understand that the above device may also include only the components necessary to implement the solution of the present invention, and does not necessarily include all the components shown in the figure.

[0089] Example 4

[0090] Corresponding to the above-mentioned embodiments 1-3, the embodiments of the present application further provide a computer-readable storage medium. In this embodiment, the same or similar contents as those in the above-mentioned embodiments 1 to 3 can be referred to the above introduction and will not be repeated later.

[0091] A computer-readable storage medium stores a computer program, which, when executed by a processor, implements the following steps:

[0092] The position of the microscope 3 relative to the probe station 7 is adjusted by the driving mechanism 8 so that the light beam emitted by the light source 4 can enter the lens of the microscope 3 after being reflected by the crystal grains;

[0093] Place the die to be tested on the probe station 7 and move the die to the bottom of the probe card 5 through the probe station 7;

[0094] The die is probed with a probe card 5, and then the tester 1 performs parameter testing on the probed die to obtain the parameters of the die;

[0095] After completing the parameter test, the industrial computer 2 controls the microscope 3 to photograph the appearance of the grains and transmits the photographed images to the testing machine 1;

[0096] The testing machine 1 combines the parameter test data and the appearance image to determine whether the appearance and parameters of the grain are qualified. If both are qualified, the grain is sent to the next process.

[0097] In some embodiments, in the embodiments of the present application, when the computer program is executed by the processor, it can also implement steps corresponding to the method described in Example 2. Please refer to the detailed description in Example 2 and will not be repeated here.

[0098] From the above description of the embodiments, it can be seen that those skilled in the art can clearly understand that the present invention can be implemented by means of software plus the necessary general-purpose hardware platform. Based on this understanding, the technical solution of the present invention, or the portion that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a storage medium such as ROM / RAM, a magnetic disk, or an optical disk, and includes a number of instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in various embodiments of the present invention or certain parts of the embodiments.

[0099] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0100] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0101] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A grain inspection method, applied to grain appearance inspection and parameter testing, characterized in that: The grain detection method is performed based on a grain detection device, which includes an industrial computer, a test machine, a drive mechanism, a probe station, and a light source and a microscope arranged above the probe station. The industrial computer is respectively connected to the test machine, the probe station and the microscope for communication, and the microscope is installed at the moving end of the drive mechanism. The grain detection method comprises: Adjusting the position of the microscope relative to the probe station by the driving mechanism so that the light beam emitted by the light source can enter the lens of the microscope after being reflected by the crystal grain; Placing the die to be tested on the probe station, and moving the die to the bottom of the probe card through the probe station; Using the probe card to prick the die, and then using the tester to perform parameter testing on the pricked die to obtain parameters of the die; After completing the parameter test, the industrial computer controls the microscope to photograph the appearance of the grain, and transmits the photographed image to the testing machine; The testing machine comprehensively analyzes the parameter test data and the appearance image to determine whether the appearance and parameters of the grain are qualified. If both are qualified, the grain is sent to the next process.

2. The grain detection method according to claim 1, characterized in that: The grain detection method further includes: Before the die is pricked with a probe card, the microscope is controlled by the industrial computer to photograph the appearance of the die, and the photographed image is transmitted to the testing machine.

3. The grain detection method according to claim 2, characterized in that: The grain detection device further includes a picking mechanism communicating with the industrial computer, wherein the picking mechanism includes a manipulator and a conveying platform docked with the probe station; The grain detection method further includes: Before the die is pricked with a probe card, the tester determines whether the appearance of the die is qualified based on the appearance image obtained; If unqualified, the unqualified crystal grains are picked out by the robot arm and placed on the conveying platform.

4. The grain detection method according to claim 1, characterized in that: After completing the parameter test, controlling the microscope to photograph the appearance of the grains by the industrial computer includes: The needle marks on the surface of the grain were photographed.

5. The grain detection method according to claim 1, characterized in that: The probe card is mounted on the driving mechanism and is located directly below the microscope; The probe card is provided with a through hole, and the projection area of ​​the through hole in the vertical direction can accommodate the lens of the microscope.

6. The grain detection method according to claim 5, characterized in that: The driving mechanism includes a first mounting plate, a second mounting plate and a moving part. The second mounting plate is slidably mounted on the first mounting plate through a cross sliding structure. The moving part is connected to the second mounting plate. The microscope is mounted on the moving part of the moving part.

7. The method for detecting grains according to claim 6, further comprising: Before the microscope photographs the crystal grain, the second mounting plate is moved to adjust the overlap between the through hole and the lens of the microscope in the horizontal plane; the microscope is driven to move in the vertical direction by the moving member so that a set distance is maintained between the lens of the microscope and the crystal grain.

8. The grain detection method according to any one of claims 1 to 7, characterized in that: The industrial computer and the probe station are connected via a GPIB interface; and / or, The industrial computer and the test machine are connected via an Ethernet interface based on the TCP protocol.

9. A computer device, characterized in that: The method comprises a memory and a processor, wherein the memory stores a computer program that can be run on the processor, and when the computer program is executed by the processor, the steps of the grain detection method according to any one of claims 1 to 8 are implemented.

10. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, and when the computer program is executed, the steps of the grain inspection method according to any one of claims 1 to 8 are implemented.

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