Calibration method and system for set compression stroke of vertical probe card, medium and equipment

Abstract

The invention provides a set compression stroke calibration method and system of a vertical probe card, a medium and equipment. The set compression stroke calibration method is realized by a calibration jig arranged on the vertical probe card, the calibration jig comprises a base and a telescopic rod arranged on the base, and the top end face of the telescopic rod is flush with a probe of the vertical probe card; the vertical probe card is mounted on the movable platform, and the movable platform is arranged opposite to the confrontation plane; the set compression stroke calibration method comprises the steps that the probe and the confrontation plane are made to abut against each other, so that the actual compression stroke, corresponding to the set compression stroke of the telescopic rod in the corresponding abutting turns of the probe, of the telescopic rod is obtained in the multiple abutting turns; based on a plurality of set compression strokes and a plurality of actual compression strokes, determining a corresponding relation between the set compression strokes and the actual compression strokes; and calibrating the set compression stroke of the probe based on the corresponding relation.

Description

Technical Field

[0001] The present application relates to the field of semiconductor device testing, and in particular to a method, system, medium, and equipment for calibrating a compression stroke of a vertical probe card. Background Art

[0002] Wafer testing is a crucial step in the integrated circuit (IC) production process, playing a crucial role in identifying defective wafers and preventing them from entering the next stage. Probe cards are a crucial component in this process. Vertical probe cards are currently the mainstream type of probe card. High-density applications with multiple pins and multiple sites (e.g., over 40,000 pins) can lead to significant deviations between the device's programmed overdrive (POT) and the actual probe contact travel (AOT).

[0003] Because the total contact force of high-pin-count probe cards is enormous (for example, 40,000 pins x 2g / pin = 80kg), the probe's reaction force must be overcome when the test head is pressed down or the chuck is lifted, resulting in nonlinear deviation between the Point-of-Interval (POT) and the Area-of-Interval (AOT). For example, when the POT is 100μm, the AOT may be only 70μm. This results in insufficient AOT, which in turn causes poor contact and abnormal test results. Increasing the compression stroke (OD) can solve the problem. Increasing the OD allows for better contact between the probe and the wafer or chip. However, if the increased OD causes the AOT to exceed the maximum allowable probe OD (for example, 100μm), the probe tip may be damaged. Currently, there is a lack of direct methods for measuring AOT, and adjusting the POT to ensure that the AOT remains within a safe range is a current need in this field. Summary of the Invention

[0004] To achieve the above objectives, the present invention provides a novel method, system, medium, and apparatus for calibrating the compression stroke of a vertical probe card. The method utilizes a calibration fixture to directly measure the compression displacement of the probe after compression, eliminating the influence of mechanical deviation on the test.

[0005] The first aspect of the present application provides a method for calibrating a set compression stroke of a vertical probe card, which can be implemented by a calibration jig provided on the vertical probe card, the calibration jig comprising a base and a telescopic rod provided on the base, the top surface of the telescopic rod being flush with the probe of the vertical probe card; the vertical probe card is mounted on a movable platform, and the movable platform is arranged relative to an opposing plane; the method for calibrating the set compression stroke may include: controlling the movable platform and / or the opposing plane to move toward each other so that the probe and the opposing plane are pressed against each other, thereby obtaining the actual compression stroke corresponding to the set compression stroke of the telescopic rod in the corresponding pressing round when the probe is in a plurality of pressing rounds; based on a plurality of set compression strokes and a plurality of actual compression strokes, determining the correspondence between the set compression stroke and the actual compression stroke; and calibrating the set compression stroke of the probe based on the correspondence.

[0006] According to some embodiments of the present application, obtaining multiple actual compression strokes corresponding to multiple set compression strokes may include: moving the movable platform and / or the antagonistic plane so that the probe and the telescopic rod contact the antagonistic plane; controlling the movable platform and / or the antagonistic plane to move respectively under multiple set travel displacements in the multiple pressing rounds, and obtaining the retraction displacement of the telescopic rod under each set travel displacement; designating the set travel displacement as the set compression stroke, and the retraction displacement as the actual compression stroke.

[0007] According to some embodiments of the present application, determining the corresponding relationship may include: constructing a data pair based on a plurality of set compression strokes and a plurality of corresponding actual compression strokes; and designating the data pair as the corresponding relationship.

[0008] According to some embodiments of the present application, calibrating the set compression stroke of the vertical probe card may include: based on the data pair, determining the set compression stroke corresponding to a specific set compression stroke when the actual compression stroke is equivalent to the specific set compression stroke; and calibrating the specific set compression stroke based on the corresponding set compression stroke.

[0009] According to some embodiments of the present application, determining the corresponding relationship may include: constructing multiple coordinate points based on multiple set compression strokes and multiple corresponding actual compression strokes; determining a fitting curve based on the multiple coordinate points, and specifying the fitting curve as the corresponding relationship.

[0010] According to some embodiments of the present application, calibrating the set compression stroke of the vertical probe card may include: using the fitting curve to calculate the calculated compression stroke when the actual compression stroke is equivalent to a specific set compression stroke; and calibrating the specific set compression stroke based on the calculated compression stroke.

[0011] According to some embodiments of the present application, the set compression stroke calibration method may further include: obtaining the maximum compression stroke of the probe, determining the set compression stroke of the probe when the actual compression stroke of the telescopic rod is equal to the maximum compression stroke; and designating the set compression stroke as a safety cutoff stroke.

[0012] The second aspect of the present application provides a system for setting compression stroke calibration of a vertical probe card, which may include: a memory, a processor, and a computer program stored on the memory and executable on the processor, wherein the computer program implements the steps of the above-mentioned method when executed by the processor.

[0013] A third aspect of the present application provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of the method described above are implemented.

[0014] In a fourth aspect, the present application provides a device for calibrating the set compression stroke of a vertical probe card, which may include a probe card test machine and a calibration jig; the calibration jig includes a base and a telescopic rod arranged on the base; the calibration jig is arranged on the vertical probe card, and the vertical probe card is installed on the test head of the probe card test machine, the test head and the chuck are arranged relative to each other, and the test head and / or the chuck are moved in a controlled manner so that the vertical probe card and the chuck move toward each other and press against each other; the focusing system of the probe card test machine senses the retraction displacement of the telescopic rod after the vertical probe card and the chuck are separated.

[0015] The compression stroke calibration method for setting a vertical probe card disclosed in this application can directly measure the actual compression stroke of the probe through a calibration fixture, eliminating the influence of mechanical deviation on the test. It can be compatible with the calibration requirements of probe cards with different pin numbers and site numbers. At the same time, the calibration fixture has a simple structure and is easy to operate. This application uses a calibration fixture through the principle of force-displacement conversion to solve the industry problem of high-density probe card compression stroke calibration, significantly improve test stability and probe life, and provide key process support for advanced process semiconductor testing.

[0016] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0018] Figure 1 is an exemplary flow chart of a method for setting a compression stroke calibration of a vertical probe card according to some embodiments of the present application; Figure 2 is an exemplary schematic diagram of a calibration jig according to some embodiments of the present application; Figure 3 is an exemplary cross-sectional view of a calibration jig according to some embodiments of the present application; Figure 4 is an exemplary installation diagram of a calibration jig according to some embodiments of the present application; Figure 5 is another exemplary installation diagram of a calibration jig according to some embodiments of the present application; Figure 6 is an exemplary structural diagram of an apparatus for setting compression stroke calibration of a vertical probe card according to some embodiments of the present application; Figure 7 is an exemplary block diagram of a computing device according to some embodiments of the present application. DETAILED DESCRIPTION

[0019] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar modifications without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0020] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used in this application and in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application. Words such as "include" or "comprise" used in this application mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. The terms "and / or" or "and / or" used in this application include any and all combinations of one or more related listed items.

[0021] The terms "including", "having" and their cognates used in this application are intended only to indicate specific features, numbers, steps, operations, elements, components or combinations of the aforementioned items, and should not be understood as first excluding the existence of one or more other features, numbers, steps, operations, elements, components or combinations of the aforementioned items or the possibility of adding one or more features, numbers, steps, operations, elements, components or combinations of the aforementioned items.

[0022] It should be noted that the terms "first", "second", "third", etc. used in this application are only used to distinguish descriptions and cannot be understood as indicating or implying relative importance. When a component is referred to as being "fixed on", "installed on" or "set on" another component, it can be directly on the other component or there can also be other components in the middle. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there can be other components in the middle at the same time. The orientation or position relationship indicated by "vertical", "parallel", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. is based on the orientation or position relationship shown in the accompanying drawings, and is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0023] To address the shortcomings of existing technologies, this application provides a method for calibrating the compression stroke of a vertical probe card. This method simulates the compressive behavior of a probe using a telescopic rod in a calibration fixture. When compressed, the rod retracts, and its displacement synchronizes with the actual compression of the probe, which can be used to determine the probe's AOT.

[0024] Some preferred embodiments of the present application are described below. It should be noted that the following description is for illustrative purposes and is not intended to limit the scope of protection of the present application. The steps involved in the present application can be performed precisely in order, or various steps can be processed in reverse order or simultaneously. At the same time, other operations can be added to these processes, or one or more operations can be removed from these processes.

[0025] Figure 1 This is an exemplary flow chart of a method for setting a compression stroke calibration of a vertical probe card according to some embodiments of the present application. The method for setting a compression stroke calibration can be implemented by a calibration fixture attached to the edge of the vertical probe card. Figures 2 to 5 An exemplary schematic diagram of a calibration fixture is shown, as shown in FIG. Figures 2 to 5As shown, the calibration jig 200 may include a base 210 and a telescopic rod 230 disposed on the base 210. Exemplarily, the telescopic rod 230 is mounted on the base 210 via a telescopic sleeve 220. For example, the telescopic rod 230 is positioned within the telescopic sleeve 220 with a clearance fit (the outer diameter of the telescopic rod 230 is equal to the inner diameter of the telescopic sleeve 220). This allows the telescopic rod 230 to penetrate deeper into the telescopic sleeve 230 when pressure is applied and remain in place after the force is removed. This allows the displacement of the telescopic rod 230 during the compression period to be determined. Furthermore, during multiple compression cycles, the travel displacement can be set in an incremental manner, for example, with a 10μm travel in the first compression cycle and a 20μm travel in the second compression cycle. This allows the travel displacement to increase sequentially. After the multiple compression cycles, the telescopic rod 230 can be pulled out by applying force, thereby allowing it to exit the telescopic sleeve 220, thus making the calibration jig 200 reusable. In other implementations, the telescopic rod 230 and telescopic sleeve 220 may be connected via an elastic member, such as a spring. In this manner, when compressed, the telescopic rod 230 will extend deeper into the telescopic sleeve 220. Testing equipment can then be used to determine the displacement of the telescopic rod 230 under pressure. Once the pressure is released, the restoring force of the elastic member causes the telescopic rod 230 to withdraw from the telescopic sleeve 220, returning to its original position and allowing for the next compression displacement measurement.

[0026] The various components of the calibration jig 200 can be made of polymer or metal materials. For example, polymer materials can include polyethylene (PE), polypropylene (PP), polyphenylene sulfide (PPS), polyimide (PI), polycarbonate (PC), polymethacrylate (PMMA), polyetheretherketone (PEEK), and polybutylene styrene (PBO). Metal materials can include iron, chromium, manganese, nickel, copper, aluminum, zinc, titanium, or metal alloys. This application does not limit these materials.

[0027] The calibration jig 200 can be attached to a blank area on the vertical probe card 300. The blank area may be an area where no probes are provided. An example may be an area near the edge of the vertical probe card 300. Figure 4 and Figure 5 As shown, the calibration jig 200 can be symmetrically attached to the left and right sides of the vertical probe card 300. This attachment can be achieved by gluing, for example, by applying adhesive to the bottom of the vertical probe card 300 or the base 210 of the calibration jig 200, and then adhering the calibration jig 200 to the vertical probe card 300. This attachment can also be achieved by magnetic attraction. For example, if the base 210 of the calibration jig 200 is a magnet, it can be directly attracted to the vertical probe card 300.

[0028] The calibration fixture 200 attached to the vertical probe card 300 can simulate the probes on the vertical probe card through the telescopic rod 230 ( Figure 3 and Figure 4(not shown). Exemplarily, the vertical probe card 300 can be mounted on a movable platform, such as a test head of a probe test machine. The movable platform can controllably drive the vertical probe card 300 to move toward an antagonistic plane. The antagonistic plane can refer to a rigid surface provided for pressing against the probes of the vertical probe card 300 and the telescopic rod 230, for example, it can be provided by a chuck of a probe test machine. The movable platform can be arranged relative to the antagonistic plane, for example, the two are arranged relative to each other in a vertical direction. In this way, when the telescopic rod 230 and the probe are pressed against the antagonistic plane at the same time, the compressive behavior of the probe can be simulated by the telescopic rod 230, so that the actual compression stroke (AOT) of the probe after compression can be determined by using the displacement of the telescopic rod 230 after compression, and the set compression stroke (POT) originally determined for the probe can be adjusted based on this. Generally, the vertical probe card 300 is horizontal after installation, and the initial height of the telescopic rod 230 can exceed the probe. At this time, the chuck can be controlled to rise to push the telescopic rod 230 to retract so that the top surface of the telescopic rod 230 can be set to be flush with the probe of the vertical probe card 300, thereby determining the reference point. The AOT and POT of the probe at the reference point are both 0. The top surface of the telescopic rod 230 can refer to the end away from the base 210, and the top surface can be a plane. For the top surface of the telescopic rod 230 to be flush with the probe of the vertical probe card 300, a feasible implementation method can be to control the chuck to rise until the top surface of the telescopic rod 230 touches and then stop, and then determine the distance between the top surface and the probe tip through the test equipment. Continue to control the chuck to rise this distance, so that the top surface of the telescopic rod 230 is flush with the probe of the vertical probe card 300.

[0029] Return Reference Figure 1 The method 100 for calibrating the set compression stroke of a vertical probe card using the calibration jig 200 may include the following steps: Step 110: controlling the movable platform and / or the opposing plane to move toward each other so that the probe and the opposing plane press against each other, thereby obtaining, in multiple pressing cycles, the actual compression stroke of the telescopic rod corresponding to the set compression stroke of the probe in the corresponding pressing cycle.

[0030] In some embodiments, the movable platform (e.g., the test head of the probe test machine) and / or the antagonistic plane (e.g., the chuck of the probe test machine) can be independently controlled to move so that the probe and the telescopic rod contact the antagonistic plane. For example, the test head can be controlled to move vertically downward, and the chuck can be controlled to move vertically upward. In one example, when the chuck is controlled to move to the above-mentioned reference point, the set compression stroke of the probe is zero. After completion, the movable platform and / or the antagonistic plane can be controlled to perform multiple pressing rounds to move separately under the set travel displacement in each pressing round. For example, the multiple set travel displacements corresponding to the multiple pressing rounds can be 10μm, 20μm, 30μm, 40μm, 50μm, 60μm, 70μm, 80μm, 90μm, 100μm, etc. The movable platform and / or the antagonistic plane may be connected to a drive motor electrically connected to a controller. Controlled by control commands issued by the controller (e.g., commands indicating a set travel displacement), the two platforms move toward each other, thereby pressing against each other and completing cycles of pressing. Taking the control of the movable platform's movement as an example, the probe will be compressed by the same amount as the movable platform's set travel displacement, assuming no mechanical resistance issues arise. In other words, the set travel displacement can be the probe's set compression stroke. If the movable platform's set travel displacement is 10 μm, the probe will also be compressed by 10 μm. However, due to the aforementioned mechanical resistance issues, the amount of probe compression will deviate from the set travel displacement. However, this offset has previously been difficult to determine intuitively. This application uses the retracted displacement of the telescopic rod to directly measure the amount of probe compression. In some embodiments, the movable platform and / or the antagonistic plane return to their initial position, such as the reference point, after each set travel displacement. For example, the chuck initially rises at the reference point to press against the probe and then descends back to the reference point. During this process, the telescopic rod is also compressed, but does not rebound. The retraction displacement of the telescopic rod can also be measured. For example, it can be done using an external measuring device or the focusing system of a probe test machine. For example, when the set travel displacement of the chuck is 10μm, the retraction displacement of the telescopic rod is 7μm. At this time, one pressing round is completed. When the next pressing round is carried out, the chuck can be re-controlled to move to the reference point, and start to rise and press the probe based on the corresponding set travel displacement, and will descend back to the reference point after completion. The retraction displacement of the telescopic rod can also be measured in this pressing round. In this way, each time the chuck rises and then descends after the set travel displacement, the retraction displacement of the telescopic rod can be obtained by measurement. This retraction displacement is also designated as the actual compression stroke of the telescopic rod, which is equivalent to the actual compression stroke of the probe.

[0031] In other implementations, the telescopic rod 230 may be resilient. In one pressing round, after the chuck rises to the reference point, it starts to rise with a set travel displacement of 10 μm to complete the pressing round. After completion, the chuck is fixed in position, and the retraction displacement of the telescopic rod 230 is measured by an external measuring device or a focusing system of a probe test machine. Subsequently, the chuck descends to the reference point, and the telescopic rod 230 returns to its original position, that is, the top surface is flush with the probe tip. In this way, in the next pressing round, the second pressing round can be completed in the same manner as described above based on the corresponding set travel displacement and the measurement of the retraction displacement of the telescopic rod 230 can be completed. This is done in sequence to complete multiple pressing rounds.

[0032] In some embodiments, the number of calibration jigs can be multiple, for example, 2, 3, 4, 5, or even more. Multiple calibration jigs can be symmetrically distributed on the vertical probe card to comprehensively simulate the pressure applied to the probe. The retraction displacements of the telescopic rods of the multiple calibration jigs can be mathematically calculated, such as by finding the average or median value, and the resulting statistical result can be used as the actual compression stroke of the telescopic rod under the set compression stroke.

[0033] Step 120 : Determine a correspondence between the set compression strokes and the actual compression strokes based on the multiple set compression strokes and the multiple actual compression strokes.

[0034] In some embodiments, the multiple set compression strokes and the multiple actual compression strokes can be constructed as data pairs. For example, assuming that the 10 set compression strokes are 10μm, 20μm, 30μm, 40μm, 50μm, 60μm, 70μm, 80μm, 90μm, and 100μm, and the corresponding 10 actual compression strokes measured are 7μm, 14μm, 20μm, 27μm, 33μm, 40μm, 46μm, 51μm, 54μm, and 57μm, respectively. Then, 10 data pairs can be combined, including: (10-7), (20-14), (30-20), (40-27), (50-33), (60-40), (70-46), (80-51), (90-54), and (100-57). The above 10 data pairs can be designated as the corresponding relationship.

[0035] In some embodiments, the multiple set compression strokes and the multiple actual compression strokes can be constructed as multiple coordinate points. For example, referring to the above example, 10 coordinate points can be obtained. Taking the actual compression stroke as the x value and the set compression stroke as the y value, the following coordinate points can be obtained: (7-10), (14-20), (20-30), (27-40), (33-50), (40-60), (46-70), (51-80), (54-90), (57-100). The above multiple coordinate points can be used to determine a fitting curve. Methods such as least squares fitting, polynomial fitting, spline interpolation, and non-parametric fitting can be used to implement the above curve fitting process. Alternatively, existing programs or software such as MATLAB, Python, Origin, Excel, Gnuplot, SciDAVis, JMP, R, IgorPro, Mathematica, and GraphPad Prism can also be used to apply the curve fitting process. The resulting fitting curve can be designated as the corresponding relationship.

[0036] Step 130: calibrate the set compression stroke of the probe based on the corresponding relationship.

[0037] In some embodiments, when the corresponding relationship is the above-mentioned data pair, when calibrating the set compression stroke, the set compression stroke corresponding to the actual compression stroke when it is equal to a specific set compression stroke can be determined based on the data pair. For example, if it is necessary to calibrate the set compression stroke of 40μm, the data pair can be queried to obtain a data pair containing an actual compression stroke of 40μm, such as the above-mentioned (60-40). Based on this data pair, it can be obtained that the set compression stroke corresponding to the actual compression stroke of 40μm is 60μm. The set compression stroke of 60μm can be used to calibrate the above-mentioned set compression stroke of 40μm. In other words, if the probe is required to be actually compressed by 40μm when pressure is applied, it is actually necessary to set the travel displacement of the movable platform and / or the counterplane to 60μm. Therefore, one implementation method may be to calibrate the set compression stroke originally of 40μm to 60μm.

[0038] In some embodiments, when the corresponding relationship is the above-mentioned fitting curve, when calibrating the set compression stroke, the fitting curve can be used to calculate the calculated compression stroke when the actual compression stroke is equivalent to a specific set compression stroke. Similarly, if it is necessary to calibrate the set compression stroke of 40μm, x=40 can be substituted into the expression of the fitting curve for calculation, and a stroke calculation value can be obtained, for example, y=59. The calculated value 59 can be used to calibrate the above-mentioned set compression stroke of 40μm. That is to say, if the probe is actually required to be compressed by 40μm when pressure is applied, it is actually necessary to set the travel displacement of the movable platform and / or the counterplane to 59μm. Therefore, one implementation method may be to calibrate the set compression stroke originally set to 40μm to 59μm.

[0039] It is understandable that the probe cannot be infinitely pressurized, and exceeding the maximum compression stroke will cause damage to the needle tip. Therefore, the set compression stroke calibration method provided in the present application can also determine the set compression stroke of the probe when the actual compression stroke of the telescopic rod is equal to the maximum compression stroke based on the obtained maximum compression stroke of the probe. For example, assuming that the maximum compression stroke of the probe is 100μm, the set compression stroke corresponding to the actual compression stroke of the probe equal to 100μm can be determined through the above correspondence, such as 140μm. The 140μm can then be designated as a safe cutoff stroke. When setting the set compression stroke, all values ​​are within the safe cutoff stroke range to ensure that the probe is not damaged due to pressure.

[0040] The disclosed method for calibrating the compression stroke of a vertical probe card directly measures the probe's actual compression stroke using a calibration fixture, eliminating the impact of mechanical deviation on the test. It is compatible with the calibration requirements of probe cards with varying pin and site counts. Furthermore, the calibration fixture features a simple structure and is easy to operate.

[0041] It should be noted that the above Figure 1 The description of each step in the description is only for example and explanation, and does not limit the scope of application of this specification. For those skilled in the art, under the guidance of this specification, Figure 1 Various modifications and changes may be made to the various steps in the present invention. However, these modifications and changes are still within the scope of this specification.

[0042] The present application also discloses a device for setting compression stroke calibration of a vertical probe card. Figure 6An exemplary structural diagram of an apparatus 600 for setting compression stroke calibration of a vertical probe card is shown. The apparatus 600 may include a probe card test machine 610 and the aforementioned calibration fixture. The same or similar calibration fixture may include a base and a telescopic rod disposed on the base as described above. The probe card test machine 610 may include a test head 611, and the vertical probe card VP may be mounted on the test head 611 and may move up and down with the test head 611. The probe card test machine also includes a base 612, and a chuck 613 may be mounted on the base 612. In some implementations, the chuck 613 may also move up and down, for example, the chuck 613 is a lifting platform. The test head 611 and / or the chuck 613 may move in a controlled manner so that the vertical probe card VP and the chuck 613 move toward each other and press against each other. This causes the telescopic rod mounted on the vertical probe card VP to retract. The device 600 may also include a focusing system 620, which can directly measure the retraction displacement of the telescopic rod after the probe and telescopic rod are simultaneously compressed. The focusing system 620 can measure the inward retraction displacement of the telescopic rod after the probe and chuck 613 press against each other at a set compression stroke, over multiple pressing cycles. This retraction displacement is used as the actual compression stroke of the probe. Each pressing cycle has a specific set compression stroke. For example, the position where the chuck 613 first contacts the probe and telescopic rod is the reference position. The upward movement of the chuck 613 presses against the probe and telescopic rod, and the displacement set for the chuck 613 is the corresponding set compression stroke. The retraction displacement of the telescopic rod under this set compression stroke is used as the actual compression stroke of the probe. During each pressing cycle, the chuck 613 (or the test head 611) is controlled to move from the reference position according to the predetermined displacement, pushing the telescopic rod inward. The retraction displacement of the telescopic rod is then measured to obtain the actual compression stroke of the probe in the corresponding pressing cycle. After completing a plurality of pressing rounds, a plurality of actual compression strokes of the probe corresponding to the set compression strokes can be obtained.

[0043] The device 600 may also include a control component. The control component can be electrically connected to the probe card test machine 610 and the focusing system 620 to control the operation of the above components. For example, the control component can control the operation of the probe card test machine 610, such as controlling the test head 611 and / or the chuck 613 to move toward each other so that the vertical probe card and the chuck 613 move toward each other and press against each other. For another example, the control component can control the focusing system 620 to measure the retraction displacement of the telescopic rod. For another example, the control component can execute the method 100 described above, including calibration of the set compression stroke of the probe.

[0044] In some embodiments, the control component can be a computing device, including but not limited to a server, an industrial computer, a desktop computer, a laptop computer, a smart mobile device, a PLD, an MCU, etc. or any combination thereof. Figure 7 An exemplary block diagram of a computing device for implementing the above control components is shown.

[0045] The computing device 700 may include any components used to implement the system described in the embodiments of the present application. For example, the computing device 700 may be implemented using hardware, software programs, firmware, or a combination thereof. For convenience, Figure 7 Only one processing device is drawn in the figure, but the computing functions described in the embodiments of the present application can be implemented in a distributed manner by a group of similar platforms to disperse the processing load of the system.

[0046] In some embodiments, computing device 700 may include a processor 710, memory 720, input / output 730, and a communication port 740. In some embodiments, processor (e.g., CPU) 710 may execute program instructions in the form of one or more processors. In some embodiments, memory 720 may include various forms of program memory and data storage, such as a hard disk, read-only memory (ROM), random access memory (RAM), etc., for storing various data files processed and / or transmitted by the computer. In some embodiments, input / output 730 may be used to support input / output between computing device 700 and other components. In some embodiments, communication port 740 may be connected to a network for data communication. Exemplary processing devices may include program instructions stored in read-only memory (ROM), random access memory (RAM), and / or other types of non-transitory storage media, executed by processor 710. The methods and / or processes of the embodiments of this specification may be implemented in the form of program instructions. Computing device 700 may also receive the programs and data disclosed herein via network communications.

[0047] For ease of understanding, Figure 7 Only one processor is shown in the figure as an example. However, it should be noted that the computing device 700 in the embodiments of this specification may include multiple processors, so the operations and / or methods implemented by one processor described in the embodiments of this application may also be implemented jointly or independently by multiple processors. For example, if in this specification, the processor of the computing device 700 performs steps A and B, it should be understood that steps A and B may also be performed jointly or independently by two different processors of the computing device 700 (for example, the first processor performs step A, the second processor performs step B, or the first and second processors perform steps A and B jointly).

[0048] While the basic concepts have been described herein, it will be apparent to those skilled in the art that the detailed disclosure herein is merely illustrative and does not constitute a limitation of the present application. Although not expressly provided herein, those skilled in the art may make various modifications, improvements, and amendments to the present application. Such modifications, improvements, and amendments are suggested herein and remain within the spirit and scope of the exemplary embodiments of the present application.

[0049] At the same time, this application uses specific terms to describe the embodiments of this application. For example, "one embodiment," "an embodiment," and / or "some embodiments" refer to a certain feature, structure, or characteristic related to at least one embodiment of this application. Therefore, it should be emphasized and noted that "one embodiment," "an embodiment," or "an alternative embodiment" mentioned twice or multiple times in different locations in this application does not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of this application may be appropriately combined.

[0050] Similarly, it should be noted that, in order to simplify the description of this application and thus facilitate understanding of one or more embodiments of the invention, the foregoing descriptions of the embodiments of this application sometimes combine multiple features into a single embodiment or its description. However, this disclosure method does not mean that the subject matter of this application requires more features than those recited in the claims. In fact, the features of an embodiment may be fewer than all the features of the individual embodiments disclosed above.

[0051] Finally, it should be understood that the embodiments described in this application are only intended to illustrate the principles of the embodiments of this application. Other variations may also fall within the scope of this application. Therefore, as examples and not limitations, the alternative configurations of the embodiments of this application may be considered consistent with the teachings of this application. Accordingly, the embodiments of this application are not limited to the embodiments explicitly introduced and described in this application. The above is only a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of this application should be included in the scope of protection of this application.

Claims

1. A method for calibrating a compression stroke of a vertical probe card, wherein the method is implemented by at least one calibration fixture provided on the vertical probe card, the calibration fixture comprising a base and a telescopic rod provided on the base, the top surface of the telescopic rod being flush with the probes of the vertical probe card; the vertical probe card being mounted on a movable platform, the movable platform being disposed opposite to a counter plane; and characterized in that: The method for setting the compression stroke calibration includes: controlling the movable platform and / or the opposing plane to move toward each other so that the probe and the opposing plane press against each other, thereby obtaining, in multiple pressing rounds, an actual compression stroke of the telescopic rod corresponding to a set compression stroke of the probe in the corresponding pressing round; determining, based on a plurality of set compression strokes and a plurality of actual compression strokes, a correspondence between the set compression strokes and the actual compression strokes; Based on the corresponding relationship, the set compression stroke of the probe is calibrated.

2. The method for setting compression stroke calibration according to claim 1, characterized in that: Get multiple actual compression strokes corresponding to multiple set compression strokes, including: Moving the movable platform and / or the counter plane so that the probe and the telescopic rod contact the counter plane; controlling the movable platform and / or the countermeasure plane to move respectively under a plurality of set travel displacements in the plurality of pressing rounds, and obtaining the retracted displacement of the telescopic rod under each set travel displacement; The set advance displacement is designated as the set compression stroke, and the retraction displacement is designated as the actual compression stroke.

3. The method for setting compression stroke calibration according to claim 1, wherein: Determining the corresponding relationship includes: constructing a data pair based on a plurality of set compression strokes and a plurality of corresponding actual compression strokes; The data pair is designated as the corresponding relationship.

4. The method for setting compression stroke calibration according to claim 3, wherein: The calibrating the set compression stroke of the vertical probe card includes: determining, based on the data pair, a set compression stroke corresponding to a specific set compression stroke when the actual compression stroke is equal to the set compression stroke; The specific set compression stroke is calibrated based on the corresponding set compression stroke.

5. The method for setting compression stroke calibration according to claim 1, wherein: Determining the corresponding relationship includes: constructing a plurality of coordinate points based on a plurality of set compression strokes and a plurality of corresponding actual compression strokes; A fitting curve is determined based on the plurality of coordinate points, and the fitting curve is designated as the corresponding relationship.

6. The method for setting compression stroke calibration according to claim 5, characterized in that: The calibrating the set compression stroke of the vertical probe card includes: Utilizing the fitting curve, calculating the calculated compression stroke when the actual compression stroke is equal to a specific set compression stroke; Based on the calculated compression stroke, the specific set compression stroke is calibrated.

7. The method for setting compression stroke calibration according to claim 1, wherein: The compression stroke calibration method further includes: Get the maximum compression stroke of the probe, determining a set compression stroke of the probe when the actual compression stroke of the telescopic rod is equal to the maximum compression stroke; Specifies the set compression stroke as the safety cutoff stroke.

8. A system for setting compression stroke calibration of a vertical probe card, characterized in that: include: A memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the computer program implements the steps of the method according to any one of claims 1 to 7 when executed by the processor.

9. A computer-readable storage medium, characterized in that The storage medium stores a computer program, which, when executed by a processor, implements the steps of the method according to any one of claims 1 to 7.

10. A device for setting compression stroke calibration of a vertical probe card, characterized in that: The device includes a probe card test machine and a calibration jig; the calibration jig includes a base and a telescopic rod arranged on the base; the calibration jig is arranged on the vertical probe card, and the vertical probe card is installed on the test head of the probe card test machine, the test head and the chuck are arranged relative to each other, and the test head and / or the chuck are moved in a controlled manner so that the vertical probe card and the telescopic rod move toward each other and press against each other; the focusing system of the probe card test machine senses the retraction displacement of the telescopic rod after the vertical probe card and the chuck are separated.

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