Chip mounting machine

Abstract

The invention belongs to the technical field of semiconductor packaging, and particularly relates to a chip mounting machine which comprises a carrying table, a positioning device, a first template, a first carrying device, a heating device, a second template, a second carrying device and a driving device. Under the action of the first carrying device, the multiple first workpieces can be carried to the first template in the same preset posture, and the heating device can preheat the multiple first workpieces at the same time, so that it can be guaranteed that glue on the first workpieces is preheated at the same time, and then it is guaranteed that the duration time of the pre-curing state is the same; and the second workpiece can be carried to the second template in the same preset posture under the action of the second carrying device, so that the plurality of first workpieces and the second workpiece can be mounted at the same time, and the overall mounting efficiency is further improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a chip mounting machine. Background Art

[0002] Chip capping is part of the back-end packaging process for chip products. It involves attaching a cap to a chip package that has already undergone die placement and wire bonding, achieving a waterproof seal or heat dissipation. The capping process generally involves applying glue, pre-curing, and pressing and heating to cure.

[0003] Specifically, before attaching the lid, glue must first be drawn on the lid or product, and the glue must be preheated to put it in a pre-cured state. Then, the glue is attached and cured by pressing and heating. During this process, the glue gradually switches from the pre-cured state to the cured state to complete the attachment of the lid to the product.

[0004] However, the pre-curing state of glue has a certain time limit. If it exceeds a certain time, the glue will solidify and affect the quality of placement. Therefore, the single-piece processing method is often used to prevent the placement time from exceeding the pre-curing time of the glue. However, the single-piece processing method will lead to a decrease in the overall placement efficiency, especially for glue with a long preheating time. The single-piece processing method is far from meeting the production capacity requirements.

[0005] Therefore, the above problems need to be solved urgently. Summary of the Invention

[0006] The object of the present invention is to provide a chip mounting machine to improve the mounting efficiency between a cover and a product.

[0007] To achieve this object, the present invention adopts the following technical solutions:

[0008] A chip mounter, for mounting a first workpiece with glue on a second workpiece, comprising:

[0009] carrier;

[0010] a positioning device, disposed on the carrier, for carrying and positioning a plurality of the first workpieces so that all the first workpieces are arranged in a preset posture;

[0011] a first template, for receiving and fixing the first workpiece;

[0012] a first transport device, disposed between the positioning device and the first template, and configured to transport all of the first workpieces on the positioning device to the first template in the preset posture;

[0013] a heating device connected to the first template and used to simultaneously preheat the glue on each first workpiece in the first template to put it into a pre-cured state;

[0014] a second template, for receiving and fixing the second workpiece, and arranging the second workpiece in the preset posture;

[0015] a second transport device, configured to transport the second workpiece to the second template;

[0016] The driving device is provided on the carrier and is used for driving the first template and the second template to close the mold so that the first workpiece with glue is attached to the corresponding second workpiece.

[0017] Preferably, the platform is divided into a first transport area and a second transport area, the transport path of the second transport device is within the first transport area, and has a safety position for avoiding the transport path of the first transport device;

[0018] The chip mounter further includes a third transport device, which is used to transport the first workpiece to the positioning device, and a transport path of the third transport device is within the second transport area.

[0019] Preferably, the chip mounting machine also includes a visual inspection device, which is arranged on the carrier and is located on the transport path of the third transport device. The visual inspection device is used to detect the number of the first workpieces transported by the third transport device and is electrically connected to the first transport device and the second transport device.

[0020] Preferably, the first transport device, the second transport device or the third transport device comprises:

[0021] A transverse movement module is arranged in a transverse direction and has a transverse movement end that moves in the transverse direction;

[0022] a longitudinal movement module connected to the transverse movement end, the longitudinal movement module being arranged in the longitudinal direction and having a longitudinal movement end moving in the longitudinal direction;

[0023] a lifting mechanism, disposed at the longitudinal moving end and having a lifting end that moves in a vertical direction;

[0024] A vacuum adsorption mechanism is provided at the lifting end, and is used for adsorbing the first workpiece or the second workpiece.

[0025] Preferably, the longitudinal moving end of the first transport device and the longitudinal moving end of the third transport device are installed on the same longitudinal guide rail;

[0026] The transverse end of the first transport device and the transverse end of the second transport device are installed on the same transverse guide rail.

[0027] Preferably, the first template or the second template includes a substrate, a plurality of receiving grooves arranged on the substrate, and a vacuum suction hole arranged at the bottom of the receiving grooves, the vacuum suction hole is used to adsorb and fix the first workpiece or the second workpiece, the plurality of receiving grooves are arranged according to the preset posture, and the receiving grooves are adapted to imitate the first workpiece or the second workpiece.

[0028] Preferably, one of the first template and the second template is disposed on the carrier;

[0029] The driving device includes a rotating shaft that rotates around its own axis, and the rotating shaft is connected to the first template and the second template.

[0030] Preferably, one first template, one heating device, one second template and one driving device form a set of mounting structures, and a plurality of sets of the mounting structures are evenly distributed on the carrier.

[0031] Preferably, the heating device includes a plurality of heating rods, which are all inserted into the interior of the first template and used to heat the first template.

[0032] Preferably, the positioning device includes a positioning base and positioning holes arranged on the positioning base according to the preset posture, and the positioning holes are adapted to imitate the shape of a single first workpiece.

[0033] Beneficial effects of the present invention:

[0034] The chip mounting machine of the present invention can arrange multiple first workpieces in a preset posture under the action of a positioning device, and can transport multiple first workpieces to the first template in the preset posture under the action of a first conveying device. The heating device can preheat multiple first workpieces at the same time to facilitate the subsequent simultaneous mounting of multiple first workpieces, thereby improving the attachment efficiency of the first workpieces. Under the action of the second conveying device, the second workpiece can be transported to the second template in the same preset posture. With this arrangement, multiple first workpieces and second workpieces can be mounted at the same time, thereby improving the overall mounting efficiency. Moreover, since the first workpieces on the first template and the second workpieces on the second template are arranged the same, the accuracy of the docking between the first workpiece and the second workpiece and the mounting quality can be guaranteed during the mounting process. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 is a schematic structural diagram of a chip placement machine according to an embodiment of the present invention;

[0036] Figure 2Schematic diagram of the structure of the first loading station, the third handling device and the positioning device in an embodiment of the present invention;

[0037] Figure 3 is a schematic structural diagram of a first transport device in an embodiment of the present invention;

[0038] Figure 4 is a schematic structural diagram of a second transport device in an embodiment of the present invention;

[0039] Figure 5 1 is a schematic structural diagram of a mounting structure according to an embodiment of the present invention;

[0040] Figure 6 2 is a schematic structural diagram of a positioning device in an embodiment of the present invention.

[0041] In the picture:

[0042] 100, carrier; 200, positioning device; 300, first template; 400, first transport device; 500, second template; 600, second transport device; 700, driving device; 800, third transport device; 900, visual inspection device; 1000, visual positioning device; 1100, first loading device; 1200, second loading device;

[0043] 10. First loading station; 20. Second loading station; 30. Safety station;

[0044] 11. Transverse movement module; 12. Longitudinal movement module; 13. Lifting mechanism; 14. Vacuum adsorption mechanism;

[0045] 21. Base plate; 22. Receiving tank;

[0046] 31. Positioning base; 32. Positioning hole. DETAILED DESCRIPTION

[0047] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It will be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all structures.

[0048] In the description of the present invention, unless otherwise expressly specified or limited, the terms "connected," "connected," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention in specific circumstances.

[0049] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0050] In the description of this embodiment, terms such as "upper," "lower," "left," and "right" are used to refer to positions or locations based on those shown in the accompanying drawings. These terms are intended solely to facilitate description and simplify operation, and are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.

[0051] See also Figures 1 to 6 In this embodiment, a chip placement machine is provided for placing a first workpiece coated with glue onto a second workpiece. During the placement process, multiple first workpieces can be preheated simultaneously, and batch placement can be completed to improve placement efficiency. In this embodiment, the first workpiece is a lid, and the second workpiece is a product. The lid needs to be pre-applied with glue before placement. After a certain period of time, the glue solidifies and becomes non-sticky. Of course, in some other feasible embodiments, the first workpiece can also be a product, and the second workpiece can be a lid. Similarly, the product needs to be pre-applied with glue before placement.

[0052] Specifically, the chip mounting machine includes a carrier 100, a positioning device 200, a first template 300, a first conveying device 400, a heating device, a second template 500, a second conveying device 600 and a driving device 700. The positioning device 200 is arranged on the carrier 100, and the positioning device 200 is used to position multiple first workpieces so that all first workpieces are arranged in a preset posture; the first template 300 is used to receive and fix the first workpiece; the first conveying device 400 is arranged between the positioning device 200 and the first template 300, and is used to convey all first workpieces on the positioning device 200 to the first template 300 in a preset posture; the heating device and The first template 300 is connected and is used to simultaneously preheat the glue on each first workpiece in the first template 300 so that it is in a pre-curing state. The pre-curing state refers to the intermediate state of the glue before it is completely cured, that is, it is in a semi-gel state and has a certain viscosity; the second template 500 is used to receive and fix the second workpiece, and arrange the second workpiece in a preset posture; the second conveying device 600 is used to convey the second workpiece to the second template 500; the driving device 700 is arranged on the carrier 100, and is used to drive the first template 300 and the second template 500 to close the mold, so that the first workpiece with glue is mounted on the corresponding second workpiece.

[0053] It is understandable that multiple first workpieces need to be glued separately before being mounted. After the glue is applied, the multiple first workpieces are often placed in a carrier with the side with glue facing upwards. The first workpieces placed in the carrier are often in a disordered state. Under the action of the positioning device 200, the first workpieces to be mounted can be received and arranged in a preset posture. Under the action of the first transporting device 400, the multiple first workpieces can be transported to the first template 300 in the preset posture. The heating device can preheat the multiple first workpieces at the same time, thereby ensuring that the glue on each first workpiece is preheated at the same time. The viscosity of the glue is released, and the duration of the pre-curing state can be guaranteed to be the same, so that multiple first workpieces can be mounted at the same time later, thereby improving the attachment efficiency of the first workpiece. Under the action of the second conveying device 600, the second workpiece can be transported to the second template 500 in the same preset posture. With this arrangement, multiple first workpieces and second workpieces can be mounted at the same time, thereby improving the overall mounting efficiency. Moreover, since the arrangement of the first workpiece on the first template 300 and the second workpiece on the second template 500 is the same, the accuracy of the docking between the first workpiece and the second workpiece and the mounting quality during the mounting process can be guaranteed.

[0054] In this embodiment, the chip mounter further includes a first loading device 1100 and a third handling device 800. The first loading device 1100 is disposed on the carrier 100 and is used to transport the first workpiece to the first loading station 10. That is, the first loading device 1100 is used to transport the first workpiece from the carrier to the first loading station 10. The first loading device 1100 is preferably a conveying structure such as a belt conveyor in the prior art. The specific structure of the belt conveyor is prior art and will not be described in detail here. The third handling device 800 is used to transport the first workpiece to the positioning device 200. It is understood that the third handling device 800 is disposed between the first loading station 10 and the positioning device 200 and is capable of transporting the first workpiece on the first loading station 10 to the positioning device 200, where the workpiece is received and positioned by the positioning device 200. Since the first workpieces on the carrier are often in a disordered state, the third handling device 800 often chooses to transport them one by one during the transport process to facilitate subsequent positioning by the positioning device 200.

[0055] In addition, this embodiment also includes a second loading device 1200, which is disposed on the carrier 100 and is used to receive a second workpiece from the outside and transport it to the second loading station 20, so that the second transport device 600 can transport the workpiece from the second loading station 20 to the second template 500. The second loading device 1200 is preferably a conveying structure such as a belt conveyor in the prior art. The specific structure of the belt conveyor is prior art and will not be described in detail here.

[0056] Furthermore, to prevent collisions between the first, second, and third transport devices 400, 600, and 800 during transport, in this embodiment, the platform 100 is divided into a first and second transport areas. The transport path of the second transport device 600 is located in the first transport area and includes a safety station 30 for avoiding the transport path of the first transport device 400. The safety station 30 is located at the end of the platform 100 facing away from the first transport device 400. The transport path of the third transport device 800 is located in the second transport area. It is understood that the first loading station 10 and the positioning device 200 are located in the second transport area, and the second loading station 20, the first template 300, the second template 500, and the drive device 700 are all located in the first transport area. Therefore, the transport processes of the second and third transport devices 600 and 800 can proceed simultaneously, without requiring either device to stop for waiting. In order to avoid the second loading device 1200 occupying too much space on the carrier 100, the arrangement of the multiple second workpieces transported by the second loading device 1200 is often inconsistent with the preset posture arrangement, resulting in the second conveying device 600 needing to carry out multiple operations when conveying the second workpiece. Unlike the second conveying device 600 and the third conveying device 800, the first conveying device 400 needs to arrange the multiple first workpieces in a preset posture and convey them to the first template 300 at the same time during the conveying process. Therefore, the conveying time of the first conveying device 400 is much less than that of the second conveying device 600 and the third conveying device 800. Therefore, during the conveying process of the first conveying device 400, the movement of the second conveying device 600 to the safety station 30 will not have much impact on the overall mounting efficiency, and can also ensure safety performance.

[0057] In addition, during the placement process of the first and second workpieces, in addition to the clamping force of the first template 300 and the second template 500, the glue needs to be heated and cured by a heating device to ensure the connection strength between the first and second workpieces. The preheating time and heating and curing time of the heating device are about 30 minutes in total, while the time it takes for the first workpiece to be transported to the first template 300 is often about 3 minutes, and the time it takes for the second workpiece to be transported is also about 3 minutes. Therefore, to further improve the placement efficiency, in this embodiment, a first template 300, a heating device, a second template 500, and a driving device 700 constitute a group of placement structures, and multiple groups of placement structures are evenly distributed on the carrier 100. It is understandable that during the heating and curing process of one group of placement structures, the first transport device 400 and the second transport device 600 can respectively transport the first workpiece and the second workpiece to additional placement structures, thereby further improving the placement efficiency.

[0058] For example, nine groups of mounting structures are used as an example to illustrate in this embodiment. The nine groups of mounting structures (hereinafter referred to as the first group, the second group...) are arranged in two rows and five columns, among which there is only one mounting structure in a column at the edge, and the missing part of the column is the second conveying area. The second loading device 1200 is arranged between the two rows of mounting structures and can pass through the second conveying area so that the second loading station 20 is in the middle of the carrier 100 to ensure that the time required for the second conveying device 600 to reach each mounting structure during the conveying process is not much different.

[0059] During the placement process, after the first group is fully loaded with the first and second workpieces, heating and curing can begin. Subsequently, the first transport device 400, the second transport device 600, and the third transport device 800 can transport the first and second workpieces to the second group. After the second group is fully loaded with the first and second workpieces, heating and curing can begin. This process repeats. When the first transport device 400, the second transport device 600, and the third transport device 800 are transporting the first and second workpieces to the ninth group, or when the ninth group begins heating and curing, the heating and curing of the first group is completed. After the cured second workpiece is removed, the above operation is repeated to ensure the continuity of the first and second workpieces during the transportation process, thereby improving the placement efficiency. It should be noted that the number of placement structures is determined by the heating and curing time and the transportation efficiency of the first and second workpieces, and is not specifically limited here.

[0060] Furthermore, the second transport device 600 is used to remove the cured second workpiece from the second template 500. The chip mounter also includes an output device, which is disposed on the carrier 100. A conveyor device is used to receive and output the cured second workpiece from the second transport device 600. The output device is preferably a conveyor structure such as a belt conveyor in the prior art. The specific structure of the belt conveyor is known in the art and will not be described in detail here. The output device is disposed between the two rows of placement devices.

[0061] In this embodiment, the first conveying device 400, the second conveying device 600 or the third conveying device 800 includes a transverse moving module 11, a longitudinal moving module 12, a lifting mechanism 13 and a vacuum adsorption mechanism 14. The transverse moving module 11 is arranged in the transverse direction and has a transverse moving end that moves in the transverse direction; the longitudinal moving module 12 is connected to the transverse moving end, and the longitudinal moving module 12 is arranged in the longitudinal direction and has a longitudinal moving end that moves in the longitudinal direction; the lifting mechanism 13 is arranged at the longitudinal moving end and has a lifting end that moves in the vertical direction; the vacuum adsorption mechanism 14 is arranged at the lifting end, and the vacuum adsorption mechanism 14 is used to adsorb the first workpiece or the second workpiece. It is understood that the transverse and longitudinal modules 11 and 12 are linear modules in the prior art, and the structure of the linear modules is the prior art. Under the joint action of the transverse and longitudinal modules 11 and 12, the lifting mechanism 13 can be driven to move to any position within the plane. That is, under the action of the transverse and longitudinal modules 11 and 12 in the first transport device 400, the lifting mechanism 13 in the first transport device 400 can be moved above the positioning device 200 and above any first template 300. Under the action of the transverse and longitudinal modules 11 and 12 in the second transport device 600, the lifting mechanism 13 in the second transport device 600 can be moved above the second loading station 20, above any second template 500, above the output device, and to the safety station 30. Under the action of the transverse movement module 11 and the longitudinal movement module 12 in the third transport device 800 , the lifting mechanism 13 in the third transport device 800 can be moved above the first loading station 10 and above the positioning device 200 .

[0062] In addition, the lifting device is preferably a rack and pinion lifting device or a linear cylinder in the prior art. The specific structures of the rack and pinion lifting device or the linear cylinder are all prior art and will not be described in detail here. The vacuum adsorption mechanism 14 includes a vacuum suction plate, which is connected to an external negative pressure source to adsorb the first workpiece and the second workpiece. It should be noted that the size of the vacuum suction plate in the first conveying device 400 needs to meet the requirements of simultaneous adsorption of the first workpiece on the positioning device 200, so as to ensure that the glue on each first workpiece on the first template 300 is preheated at the same time, so as to facilitate the subsequent simultaneous placement of multiple first workpieces, thereby improving the placement efficiency. The vacuum suction plates in the second conveying device 600 and the third conveying device 800 are determined according to the actual working conditions and are not specifically limited here.

[0063] Furthermore, the longitudinal end of the first conveying device 400 and the longitudinal end of the third conveying device 800 are mounted on the same longitudinal guide rail; and the transverse end of the first conveying device 400 and the transverse end of the second conveying device 600 are mounted on the same transverse guide rail. It is understood that the longitudinal guide rail is provided with two longitudinal ends, which are respectively connected to the lifting mechanism 13 of the first conveying device 400 and the lifting mechanism 13 of the third conveying device, and the transverse guide rail is provided with two transverse ends, which are respectively connected to the longitudinal guide rails of the first conveying device 400 and the second conveying device 600. This arrangement can reduce the space occupied by the first conveying device 400, the second conveying device 600, and the third conveying device 800, and can also reduce production costs.

[0064] In this embodiment, the chip mounter further includes a visual inspection device 900, which is disposed on the carrier 100 and is located on the transport path of the third transport device 800. The visual inspection device 900 is used to detect the number of first workpieces transported by the third transport device 800 and is electrically connected to the first transport device 400 and the second transport device 600. It is understood that during the transport process of the third transport device 800, the visual inspection device 900 can detect the number of first workpieces transported by the third transport device 800. When the number reaches a preset value, it can transmit a signal to the first transport device 400 and the second transport device 600. The first transport device 400 can then transport the first workpiece on the positioning device 200 to the first template 300. At this time, the second transport device 600 can move to the safety station 30, thereby avoiding interference between the first transport device 400 and the second transport device 600.

[0065] Furthermore, the chip mounter also includes a visual positioning device 1000, which is disposed at the lifting end of the second conveying device 600. The visual positioning device 1000 is used to position the second workpiece and is electrically connected to the second conveying device 600. It is understood that when the second conveying device 600 is conveying the second workpiece to be mounted or the second workpiece that has completed curing, the second workpiece is positioned by the visual positioning device 1000 and the position information is fed back to the second conveying device 600 to improve the accuracy of the second conveying device 600 during the conveying process.

[0066] It should be noted that the visual detection device 900 and the visual positioning device 1000 are preferably CCD cameras in the prior art, and their use and the hardware and software used in conjunction with them are all prior art and will not be described in detail here.

[0067] In this embodiment, the positioning device 200 includes a positioning base 31 and positioning holes 32 arranged in a predetermined configuration on the positioning base 31. The positioning holes 32 are configured to conform to the contours of individual first workpieces. It is understood that the third handling device 800 can transport the first workpieces from the first loading station 10 to their corresponding positioning holes 32 one by one. The positioning holes 32 can then position the first workpieces so that they are arranged in the predetermined configuration on the positioning base 31. In other feasible embodiments, the positioning base 31 may be provided with a clamping structure for clamping the first workpiece, which will not be described in detail here.

[0068] Among them, the preset posture is preferably that the positioning holes 32 are arranged in an array on the positioning base 31. The number of the positioning holes 32 is determined according to actual production requirements and will not be elaborated here.

[0069] In this embodiment, the first template 300 or the second template 500 includes a substrate 21, a plurality of receiving grooves 22 provided on the substrate 21, and a vacuum suction hole provided at the bottom of the receiving groove 22. The vacuum suction hole is used to absorb and fix the first workpiece or the second workpiece. The plurality of receiving grooves 22 are arranged in a preset posture, and the receiving grooves 22 are adapted to imitate the first workpiece or the second workpiece. It is understandable that the first handling device 400 can carry the first workpiece to the corresponding receiving groove in a preset posture. During this process, the arrangement of the first workpiece will not change, thereby ensuring the accuracy of the placement of the first workpiece. During the handling process, the second handling device 600 first locates the position of the receiving groove in the second template 500 through the visual positioning device 1000. Then, when carrying the second workpiece, it can place the second workpiece in the corresponding receiving groove to ensure that the second workpiece can be arranged in the preset posture, thereby ensuring the accuracy of the first and second workpiece placement processes.

[0070] It should be noted that, for the first workpiece placed in the receiving groove, the glue is on the side wall of the first workpiece facing away from the substrate 21 , and for the second workpiece placed in the receiving groove, the part to be attached is on the side wall of the second workpiece facing away from the substrate 21 .

[0071] Furthermore, the heating device includes a plurality of heating rods, each of which is inserted into the interior of the first template 300 and is used to heat the first template 300. It is understood that the heating rods are inserted into the base plate 21. After the first workpiece is transferred to the first template 300, the heating rods can release heat, which can be transferred to the receiving groove through the base plate 21, thereby preheating the glue. Subsequently, during the mold closing process, the heating rods can continue to release heat to heat and cure the glue.

[0072] Preferably, the length of any heating rod is consistent with the length of the substrate 21 , and the number of heating rods depends on the width of the substrate 21 , which is not specifically limited here.

[0073] In this embodiment, one of the first template 300 and the second template 500 is disposed on the carrier 100; the driving device 700 includes a rotating shaft that rotates about its own axis, and the rotating shaft is connected to the other of the first template 300 and the second template 500. It will be understood that the first template 300 and the second template 500 are both disposed upward to facilitate receiving the first workpiece and the second workpiece. The driving device 700 includes a driving member that is connected to the rotating shaft and is capable of continuously applying a clamping force to the first template 300 and the second template 500, thereby enabling the first template 300 and the second template 500 to be clamped. Under the action of the clamping force, the posture of the first workpiece and the second workpiece can be maintained stable during the glue curing process, thereby improving the placement quality of the first workpiece and the second workpiece.

[0074] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention and are not intended to limit the embodiments of the present invention. A person skilled in the art would be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is not necessary and impossible to enumerate all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.

Claims

1. A chip mounter for mounting a first workpiece with glue on a second workpiece, characterized in that: include: a carrier (100); a positioning device (200), disposed on the carrier (100), the positioning device (200) being used to carry and position a plurality of the first workpieces so that all the first workpieces are arranged in a preset posture; a first template (300), for receiving and fixing the first workpiece; a first transport device (400) disposed between the positioning device (200) and the first template (300), and used for transporting all the first workpieces on the positioning device (200) to the first template (300) in the preset posture; a heating device connected to the first template (300) and used to simultaneously preheat the glue on each first workpiece in the first template (300) to place the glue in a pre-cured state; A second template (500) is used to receive and fix the second workpiece and arrange the second workpiece in the preset posture; a second transport device (600), used for transporting the second workpiece to the second template (500); A driving device (700) is provided on the carrier (100) and is used for driving the first template (300) and the second template (500) to close the mold so that the first workpiece with glue is attached to the corresponding second workpiece.

2. The chip mounter according to claim 1, wherein: The carrier (100) is divided into a first transport area and a second transport area, the transport path of the second transport device (600) is located in the first transport area, and has a safety position (30) for avoiding the transport path of the first transport device (400); The chip mounting machine further comprises a third transport device (800), wherein the third transport device (800) is used to transport the first workpiece to the positioning device (200), and a transport path of the third transport device (800) is within the second transport area.

3. The chip mounter according to claim 2, wherein: The chip mounting machine also includes a visual inspection device (900), which is arranged on the carrier (100) and is located on the transport path of the third transport device (800). The visual inspection device (900) is used to detect the number of the first workpieces transported by the third transport device (800) and is electrically connected to the first transport device (400) and the second transport device (600).

4. The chip mounter according to claim 2, wherein: The first transport device (400), the second transport device (600) or the third transport device (800) comprises: A transverse movement module (11) is arranged in a transverse direction and has a transverse movement end that moves in the transverse direction; A longitudinal movement module (12) is connected to the transverse movement end, the longitudinal movement module (12) is arranged in the longitudinal direction and has a longitudinal movement end that moves in the longitudinal direction; A lifting mechanism (13) is provided at the longitudinal moving end and has a lifting end that moves in a vertical direction; A vacuum adsorption mechanism (14) is provided at the lifting end, and the vacuum adsorption mechanism (14) is used to adsorb the first workpiece or the second workpiece.

5. The chip mounter according to claim 4, characterized in that: The longitudinal moving end of the first transport device (400) and the longitudinal moving end of the third transport device (800) are installed on the same longitudinal guide rail; The transverse end of the first transport device (400) and the transverse end of the second transport device (600) are installed on the same transverse guide rail.

6. The chip mounter according to claim 1, wherein: The first template (300) or the second template (500) comprises a base plate (21), a plurality of receiving grooves (22) arranged on the base plate (21), and a vacuum suction hole arranged at the bottom of the receiving groove (22), wherein the vacuum suction hole is used to adsorb and fix the first workpiece or the second workpiece, the plurality of receiving grooves (22) are arranged according to the preset posture, and the receiving grooves (22) are adapted to imitate the first workpiece or the second workpiece.

7. The chip mounter according to claim 1, wherein: One of the first template (300) and the second template (500) is disposed on the carrier (100); The driving device (700) includes a rotating shaft that rotates around its own axis, and the rotating shaft is connected to the first template (300) and the second template (500).

8. The chip mounter according to claim 1, wherein: A first template (300), a heating device, a second template (500) and a driving device (700) form a set of mounting structures, and a plurality of sets of the mounting structures are evenly distributed on the carrier (100).

9. The chip mounter according to claim 1, wherein: The heating device comprises a plurality of heating rods, each of which is inserted into the interior of the first template (300) and is used to heat the first template (300).

10. The chip mounter according to claim 1, wherein: The positioning device (200) comprises a positioning base (31) and positioning holes (32) arranged on the positioning base (31) in the preset posture, wherein the positioning holes (32) are adapted to imitate the shape of a single first workpiece.

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