Wafer buffer and method of supporting wafer
By using a wafer buffer designed with a V-shaped spring, the problem of damage to the wafer carrier caused by impact during transportation and handling is solved, achieving more stable wafer support and reducing particle generation.
Patent Information
- Application Number
- CN202510659622.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2019-07-19
- Filing Date
- 2020-07-15
- Publication Date
- 2025-09-26
AI Technical Summary
Existing wafer carriers are susceptible to physical shock during transportation and handling, resulting in wafer damage. Existing buffer designs cannot effectively reduce the uneven deflection and unbalanced holding force of the wafers during impact.
The wafer buffer adopts V-shaped spring design, which reduces the torque by shortening the moment arm, uses multiple elastic beams to support the wafer, contacts the wafer only in specific directions, and increases the convex contact surface to reduce particle generation.
It effectively reduces the damage to the wafer during impact, reduces uneven deflection and unbalanced holding force, and improves the stability and safety of the wafer in the carrier.
Smart Images
Figure CN120709206A_ABST
Abstract
Description
[0001] Divisional application information
[0002] This application is a divisional application of the invention patent application with the application date of July 15, 2020, application number 202080060001.9, and invention name “Chip Buffer”.
[0003] Cross-reference to related applications
[0004] This application claims priority to and the benefit of U.S. Provisional Application No. 62 / 876,234, filed on July 19, 2019, the entire contents of which are incorporated herein by reference for all purposes. Technical Field
[0005] The present disclosure relates to wafer carriers, for example, wafer buffers used in wafer carriers used in semiconductor processing, such as front opening pods ("FOUPs"). Background Art
[0006] Wafer carriers may be handled or transported manually or automatically. Such transport and handling may cause physical impact to the carrier. For example, such impact events include sudden acceleration or deceleration of the carrier, for example due to falling, mishandling, braking of the transport vehicle, and other such movement of the wafer carrier, or greater than about 2 m / s. 2 Wafer bumpers are used in wafer carriers to limit the movement of wafers (e.g., semiconductor substrates) within the carrier, for example, to prevent the wafers from hitting the side of the carrier when a physical impact occurs.
[0007] The wafer bumper typically includes arms that extend from the frame to the centerline of the door and terminate at contact points where the wafer contacts the wafer bumper. Contact at these contact points prevents the wafer from striking other wafers or parts inside the wafer carrier, thereby reducing the chance of damage when the wafer carrier experiences a shock event.
[0008] The wafer buffer must provide force to the wafer contained within the wafer carrier to provide retention and maintain the retention force within a predetermined range to prevent damage to the wafer or generation of particles that could adversely affect semiconductor processing and manufacturing. Summary of the Invention
[0009] The present disclosure relates to wafer carriers, for example, wafer buffers used in wafer carriers (eg, FOUPs) used in semiconductor processing.
[0010] By using a V-shaped spring, the moment arm between the contact with the wafer and the frame of the wafer buffer is reduced. Shortening this moment arm can reduce the torsional force on the wafer buffer, reduce the unevenness of the deflection and reduce the imbalance of the holding force of the wafer buffer.
[0011] In one embodiment, a wafer buffer includes a frame and a plurality of elastic beams. Each of the plurality of elastic beams includes a first arm coupled to the frame and extending in a first direction to a first arm end; a second arm coupled to the first arm at the first arm end and extending in a second direction different from the first direction to a second arm end; and a wafer contact coupled to the second arm at the second arm end.
[0012] In an embodiment, the plurality of spring beams are configured such that when a wafer is supported by both of the plurality of spring beams, the wafer contacts the wafer contact only at the ends of the second arms of both of the plurality of spring beams.
[0013] In an embodiment, the wafer contact is a V-groove wafer contact. In an embodiment, the wafer contact is a paddle-shaped wafer contact.
[0014] In an embodiment, a surface of the wafer contact configured to contact a wafer has a convex surface.
[0015] In an embodiment, the first arm is coupled to the frame at a periphery of the frame, and the first direction is towards a centerline of the frame.
[0016] In an embodiment, each of the spring beams includes a secondary contact point on the second arm, the secondary contact point being positioned where the second arm joins to the first arm, and wherein the secondary wafer contact is configured to contact the wafer only upon a shock event.
[0017] In one embodiment, a wafer carrier includes a wafer buffer, wherein the wafer buffer includes a frame and a plurality of spring beams. Each of the plurality of spring beams includes: a first arm coupled to the frame and extending in a first direction to a first arm end; a second arm coupled to the first arm at the first arm end and extending in a second direction different from the first direction to a second arm end; and a wafer contact coupled to the second arm at the second arm end.
[0018] In an embodiment, the wafer buffer is mounted on a door of the wafer carrier.
[0019] In an embodiment, the wafer carrier is a front-opening pod.
[0020] In an embodiment, a method of supporting a substrate includes contacting the substrate at two wafer contacts, wherein each of the two wafer contacts is coupled to a separate spring beam, each of the spring beams including a first arm extending in a first direction and a second arm coupled to the first arm and extending in a second direction different from the first direction, and the wafer contact is located at an end of the second arm opposite to where the second arm is coupled to the first arm.
[0021] In an embodiment, the method further comprises contacting the substrate at two secondary contact points on a second arm of a v-spring on which the wafer contact is positioned when a shock event occurs.
[0022] In an embodiment, the substrate contacts the spring beams only at the two wafer contacts.
[0023] In an embodiment, the wafer contact has a convex surface, the wafer contact being configured to contact the substrate at the convex surface. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] A more complete understanding of the present disclosure may be obtained from the following description of various illustrative embodiments considered in conjunction with the accompanying drawings.
[0025] Figure 1 A perspective view showing a wafer buffer according to an embodiment.
[0026] Figure 2 A cross-sectional view of a wafer buffer according to an embodiment is shown.
[0027] Figure 3 A cross-sectional view showing a portion of a wafer buffer according to an embodiment when a substrate is in contact with the wafer buffer.
[0028] Figure 4A A perspective view is shown of a wafer contact according to an embodiment.
[0029] Figure 4B Display of the achievements along Route 4B-4B Figure 4A Cross-sectional view of a wafer contact.
[0030] Figure 5 A plan view of a wafer contact according to an embodiment is shown.
[0031] Figure 6 A FOUP according to an embodiment is shown.
[0032] While the present disclosure is susceptible to various modifications and alternative forms, details thereof have been illustrated by way of example in the drawings and will be described in detail. However, it should be understood that the disclosure is not intended to be limited to the specific illustrative embodiments described. On the contrary, it is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the disclosure. DETAILED DESCRIPTION
[0033] As used in this specification and the appended claims, the singular form "a," "an," and "the" includes plural referents unless the content clearly dictates otherwise. As used in this specification and the appended claims, the term "or" is generally employed in its sense including "and / or" unless the content clearly dictates otherwise.
[0034] The term "about" generally refers to a range of numbers that are considered equivalent to the stated value (eg, having the same function or result). In many cases, the term "about" may include numbers rounded to the nearest significant figure.
[0035] The use of numerical ranges using endpoints includes all numbers subsumed within that range (eg, 1 to 5 includes 1, 1.5, 2, 2.75, 3, 3.80, 4, and 5).
[0036] The following detailed description should be read with reference to the drawings, in which similar elements in different drawings are numbered identically. The detailed description and the drawings, which are not necessarily to scale, depict illustrative embodiments and are not intended to limit the scope of the invention. The illustrative embodiments depicted are intended to be exemplary only. Unless expressly stated to the contrary, selected features of any illustrative embodiment may be incorporated into additional embodiments.
[0037] Figure 1 A perspective view of a wafer buffer 100 according to an embodiment is shown. The wafer buffer 100 is a component that can be incorporated into a wafer carrier (not shown), for example, bonded to a portion of the wafer carrier that faces the interior space of the wafer carrier, such as, for example, the inside of a door of the wafer carrier. The wafer buffer 100 can include features (not shown) that allow for bonding to a wafer carrier, such as, by way of non-limiting example, one or more mechanical engagement features, such as snaps, flanges, tabs or grooves, adhesive bonding, or other such features for bonding the wafer buffer 100 to a wafer carrier or a portion of a wafer carrier (such as a door of the wafer carrier). The wafer buffer 100 can mechanically retain a substrate within the wafer carrier by, for example, contacting the substrate at wafer contacts 110. The wafer buffer 100 can use a spring force to limit movement of the substrate so as to prevent significant displacement of the substrate or contact of the substrate with the walls of the interior space of the wafer carrier.
[0038] The wafer buffer 100 includes a frame 102. A plurality of spring beams 104 are coupled to the frame 102. Each of the spring beams 104 includes a first arm 106 coupled to the frame 102 and extending in a first direction, and a second arm 108 coupled to the first arm 106 at an end thereof opposite to where the first arm 106 is coupled to the frame 102. The second arm 108 extends from the point where it is coupled to the first arm 106 in a second direction different from the first direction in which the first arm 106 extends from the frame 102. Each of the spring beams 104 includes a wafer contact 110 located at an end of the second arm 108 opposite to where the second arm 108 is coupled to the first arm 106.
[0039] The frame 102 provides support and positioning for spring beams 104, which include wafer contact points 110. In one embodiment, the frame 102 is rectangular in shape, with a centerline 112 extending along the primary direction of the frame 102. In one embodiment, the frame 102 includes an outer portion forming the perimeter of the rectangle and ribs extending from one end of the frame 102 to the other along the centerline 112. In one embodiment, the frame 102 is configured to fit within a recess on a door of a wafer carrier (not shown). In one embodiment, features of the wafer buffer 100 configured to couple the wafer buffer 100 to the wafer carrier or a portion thereof may be positioned on the frame 102. The frame 102 may have other shapes so that the wafer carrier 100 can be accommodated within the interior space of the wafer carrier and so that the spring beams 104 can be coupled thereto, so that the spring beams 104 provide wafer contacts 110, so that the wafer contacts 110 can engage a substrate within the wafer carrier.
[0040] Each of the spring beams 104 is coupled to the frame 102. Each of the spring beams 104 includes a wafer contact 110. As non-limiting examples, the spring beams 104 may be spring plates, cantilevered linear bending springs, or V-shaped springs. The spring beams 104 may be arranged in pairs, with each pair configured to contact a substrate via the wafer contacts 110 of the paired spring beams 104 when the substrate is placed within the wafer carrier. The spring beams 104 may be arranged so that when the wafer buffer 100 is installed in the wafer carrier, the spring beams 104 present the wafer contacts 110 on the same side of the frame 102 relative to the interior space of the wafer carrier, for example, extending into the exterior space of the wafer carrier. The spring beams 104 may be aligned relative to the frame 102 centerline 112 so that when a substrate is placed within the wafer carrier to which the wafer buffer 100 is installed, the spring beams 104 together provide two wafer contacts 110 positioned to contact the substrate.
[0041] The first arm 106 is coupled to the frame 102 at a first end and is coupled to the second arm 108 at a second end opposite the first end. In an embodiment, the first arm 106 extends inwardly relative to the frame 102 from a perimeter of the frame 102 toward a centerline 112 of the frame 102. In an embodiment, the first arm 106 tapers as it extends from the frame 102 to the centerline 112 of the frame 102.
[0042] The second arm 108 is coupled to the first arm 106. The second arm 108 can be coupled to the first arm 106 at an end of the first arm 106 opposite the end where the first arm 106 is coupled to the frame 102. The second arm 108 can extend in a second direction that is different from the first direction in which the first arm 106 extends. The second arm 108 can extend in a direction opposite to the direction in which the first arm 106 extends relative to the perimeter of the frame 102 and the centerline 112 of the frame 102. For example, in embodiments where the first arm 106 extends inward from the perimeter of the frame 102 toward the centerline 112, the second arm 108 can extend in an opposite direction away from the centerline 112.
[0043] The second arm 108 may be coupled to the first arm 106 such that an angle is formed between the first arm 106 and the second arm 108. In an embodiment, the angle between the first arm 106 and the frame 102 ranges from 0° to 40°. In an embodiment, the angle between the first arm 106 and the second arm 108 ranges from 5° to 40°. In an embodiment, the ratio of the length of the second arm 108 to the length of the first arm 106 may range from 2:1 to 1:3. In an embodiment, the second arm 108 may have a length at least half that of the first arm 106. In an embodiment in which the wafer buffer 100 is configured for a 300mm FOUP, the first arm 106 may have a length ranging from 15mm to 45mm. In an embodiment in which the wafer buffer 100 is positioned in a recess within a wafer carrier, the lengths and angles of the first and second arms 106, 108 may position the wafer contact 110 within the recess in the wafer carrier.
[0044] The wafer contact 110 is positioned at the end of the second arm 108 opposite the point where the second arm 108 is joined to the first arm 106. The wafer contact 110 is a feature configured to engage the substrate when the substrate is within the wafer container. The wafer contact 110 may include a surface configured to contact an edge of the substrate. In an embodiment, the surface configured to contact the edge of the substrate may be curved, having a convex shape. The convex shape may provide a rolling interface between the wafer contact 110 and the substrate, and may limit the generation of particles by contact between the substrate and an edge or point along the surface. In an embodiment, the wafer contact 110 is a v-groove wafer contact including ears extending away from each other, wherein a surface is configured to contact the edge of the substrate at or near the apex of the V-shape formed by the ears as they extend away from each other. This wafer contact is Figure 4A 1 and described below. In an embodiment, the wafer contact 110 is a paddle-type wafer contact having a widened portion and two ears extending from the widened portion and parallel to each other. When the wafer contact 110 is a paddle-type wafer contact, the surface is configured to contact a substrate positioned between the ears. Figure 5 1 and described below. In an embodiment, the wafer contact 110 is the only feature configured to contact a substrate contained in the wafer buffer 100. In an embodiment, no other wafer contacts are provided besides the wafer contact 110 positioned at the end of the second arm 108 opposite where the second arm 108 is joined to the first arm 106.
[0045] In an embodiment, each of the frame 102, the spring beam 104, and the wafer contact member 110 may each be made of one or more polymers (e.g., an injection moldable polymer). In an embodiment, the one or more polymers include one or more polyolefins. In an embodiment, the one or more polymers include polycarbonate. In an embodiment, a carbon filler is included in the one or more polymers. In an embodiment, the one or more polymers are thermoplastic polymers. In an embodiment, the one or more polymers are selected based on the material removed at one or more of the interfaces between the wafer buffer 100 and the wafer carrier or the interface between the wafer buffer 100 and the substrate. In an embodiment, the wafer buffer 100 is formed as a single piece, for example, by a method such as injection molding as a non-limiting example. In an embodiment, the entire wafer buffer 100 is formed from the same material or combination of materials.
[0046] Figure 2A cross-sectional view of a wafer buffer 200 according to an embodiment is shown. Frame 202 includes a groove 204 for receiving a protrusion from a wafer carrier. Spring beam 206 includes a first arm 208 extending in a first direction from frame 202 to an end where first arm 208 is joined to second arm 210. Second arm 210 extends in a second direction from where it is joined to wafer contact 212.
[0047] The frame 202 includes an outer portion 214 that defines the perimeter of the frame 202. Vertical protrusions 216 may be included in the frame 202, for example, to increase the rigidity of the frame 202, assist in alignment of the frame 202 within a wafer carrier, interface with features of a wafer carrier, or perform other functions within the wafer carrier.
[0048] The groove 204 can receive one or more retaining features of a wafer carrier (not shown) into which the wafer buffer 200 is mounted to align with the frame within the wafer carrier. In a non-limiting embodiment, the retaining features of the wafer carrier can include flanges (not shown) that can snap into openings (not shown) through the frame 202 along the groove 204 to provide a snap fit between the frame 202 and the wafer carrier.
[0049] exist Figure 2 In the embodiment shown in FIG, spring beams 206 are positioned on each side of the frame 202, coupled to an outer portion 214. A first arm 208 extends inwardly from the outer portion 214 of the frame 202 toward a centerline of the frame 202.
[0050] The second arm 210 is coupled to the first arm 208 at an end of the first arm 208 opposite the end where it is coupled to the frame 202. The second arm 210 extends from the point where it is coupled to the first arm 208 in a second direction different from the direction in which the first arm 208 extends. The second direction may be opposite to the first direction relative to the perimeter and centerline of the frame 202. In an embodiment, the second arm 210 may be coupled to the first arm 208 such that an angle is formed between the first arm 208 and the second arm 210. The second arm 210 may be coupled to the first arm 208 such that an angle is formed between the first arm 208 and the second arm 210. In an embodiment, the angle between the first arm 208 and the frame 202 ranges from 0° to 40°. In an embodiment, the angle between the first arm 208 and the second arm 210 ranges from 5° to 40°. In an embodiment, the ratio of the length of the second arm 210 to the length of the first arm 208 may range from 2:1 to 1:3. In an embodiment, the second arm 210 may have a length that is at least half that of the first arm 208. In embodiments where the wafer buffer 200 is configured for use in a 300 mm FOUP, the first arm 208 may have a length in the range of 25 mm to 45 mm. In embodiments where the wafer buffer 200 is positioned in a recess within a wafer carrier, the lengths and angles of the first and second arms 208, 210 may be such that the wafer contact 220 is positioned within the recess in the wafer carrier.
[0051] like Figure 2 As shown in FIG, the second arm 210 may be curved as it extends from the first arm 208 to the wafer contact 212. The second arm 210 curves upward, away from the first arm 208, toward the wafer contact 212. The curvature of the second arm 210 allows the portion of the wafer contact 212 proximate to the substrate when it contacts the wafer contact 212 to be a secondary contact point 218 located at or near where the second arm 210 joins the first arm 208. The secondary contact point 218 may contact the wafer under certain conditions, such as an impact event. As non-limiting examples, such impact events may include sudden acceleration or deceleration of the carrier to supplement the holding force, for example, due to a drop, mishandling, braking of the transport vehicle, or other such movement of the wafer carrier. In embodiments, the secondary contact point 218 may also contact the wafer when the wafer is too large for the wafer carrier, for example, when a 301 mm or larger wafer is placed in a 300 mm FOUP.
[0052] The wafer contact 212 is coupled to the second arm 210 at an end of the second arm 210 opposite to where the second arm 210 is coupled to the first arm 208. The wafer contact 212 is a feature configured to engage the substrate when the substrate is within the wafer container. The wafer contact 212 may include a surface configured to contact an edge of the substrate. In an embodiment, the surface configured to contact the edge of the substrate may be curved, having a convex shape. The convex shape may provide a rolling interface between the wafer contact 212 and the substrate. The rolling interface may reduce the generation of particles by contact between the substrate and an edge or point along the surface. In an embodiment, the wafer contact 212 is a v-groove wafer contact including ears extending away from each other, wherein a surface is configured to contact the edge of the substrate at or near the apex of the V-shape formed by the ears as they extend away from each other. This wafer contact is Figure 4A , and described below. In an embodiment, the wafer contact 212 is a paddle-type wafer contact having a widened portion and two ears extending from the widened portion and parallel to each other. When the wafer contact 212 is a paddle-type wafer contact, the surface is configured to contact the substrate between the ears. Figure 5 are shown in and described below.
[0053] Figure 3 A cross-sectional view of a spring beam 300 is shown when a substrate 302 is in contact with a wafer bumper including the spring beam 300 according to an embodiment. The spring beam 300 includes a first arm 304, a second arm 306, and a wafer contact 308.
[0054] As a non-limiting example, substrate 302 is a substrate used in semiconductor manufacturing. Substrate 302 can be placed in a wafer carrier including a wafer buffer for transport or handling, such as during semiconductor manufacturing using the substrate.
[0055] The first arm 304 is coupled to a frame, such as the frame 102 or the frame 202, or is integrally formed with or directly coupled to a portion of a wafer carrier, such as a FOUP. The first arm 304 extends in a first direction from where it is coupled to the frame or surface of the wafer carrier to a first arm end 304 where it is coupled to a second arm 306.
[0056] The second arm 306 extends from the first arm 304 to the wafer contact 308. Figure 3As can be seen in FIG, second arm 306 bends as it extends from its end joined to first arm 304 to the end containing wafer contact 308. This bending can result in a secondary contact point 310 located at or near where second arm 306 joins first arm 304, i.e., the point on second arm 306 closest to substrate 302. Secondary contact point 310 can contact the wafer under certain conditions, such as an impact event. As non-limiting examples, such impact events can include sudden acceleration or deceleration of the carrier, such as due to a fall, mishandling, braking of a transport vehicle, and other such movements of the wafer carrier. When secondary contact point 310 and wafer contact 308 contact substrate 302, spring beam 300 provides additional holding force to substrate 302.
[0057] The wafer contact 308 is where the spring beam 300 contacts the substrate 302. For example, Figure 3 As shown in , the wafer contact 308 may include a v-groove wafer contact, wherein the substrate 302 is held between two ears forming a V-shape. Figure 3 In the cross-sectional view of FIG, one of the ears (ear 312) is visible, partially obscured by the substrate 302 in contact with the ear 312. The surface of the wafer contact 308 that contacts the substrate 302 may have a convex surface that curves and bends outward toward the substrate 302. The convex surface may allow for rolling contact with the substrate 302 and reduce points of increased stress or particle generation caused by contact between the substrate 302 and the wafer contact 308.
[0058] like Figure 3 As shown in FIG, substrate 302 contacts only wafer contacts 308 of spring beams under normal conditions. For example, during a shock event, when the acceleration of the substrate relative to the wafer carrier exceeds a threshold, the displacement of substrate 302 and the deflection of the second arm of the spring beam during the shock event may allow the substrate 302 to contact the secondary contact point 310 of spring beam 300. A shock event may be defined according to the specific application and handling process of the wafer carrier. In a non-limiting embodiment, a shock event may be caused by an acceleration of the wafer carrier greater than approximately 2 m / s. 2 In some embodiments, the spring beam 300 can be configured so that only the wafer contact 308 contacts the substrate 302 under all conditions, including shock events and normal handling of the wafer carrier. In some embodiments, the secondary contact point 310 can also be contacted when the substrate 302 is oversized relative to the wafer carrier, for example, when the substrate 302 is a 301 mm or larger wafer and the wafer carrier including the spring beam 300 is a 300 mm FOUP.
[0059] Figure 4A is a perspective view of a wafer contact 400 according to an embodiment. Figure 4B yes Figure 4A A cross-sectional view of the wafer contact 400 is shown in FIG. Figure 4A and 4B In the embodiment shown in FIG, the wafer contact 400 is a V-groove wafer contact. The wafer contact 400 may be positioned at the end of an arm of a spring beam, such as described above and Figure 1 The second arm 108 of the elastic beam 104 shown in FIG. 1 , or the second arm 108 of the elastic beam 104 described above and Figure 2 The second arm 210 of the spring beam 206 is shown in FIG. The wafer contact 400 is a V-groove wafer contact that includes a first ear 402A and a second ear 402B. The contact surface 404 is located where the first ear 402A joins the second ear 402B. Figure 4A As can be seen in FIG, the contact surface 404 may have a convex shape. The second ear may be a mirror image of the first ear 402. The first ear 402A and the second ear 402B diverge as they extend away from the contact surface 404, forming a V-shape with the contact surface 404 as the apex. When the wafer contact is contacting a substrate, the substrate may contact the contact surface and portions of the first ear 402A and the second ear 402B. The specific contact point may vary depending on the specific geometry of the wafer being contacted by the wafer contact 400.
[0060] Figure 5 A plan view of a wafer contact 450 is shown according to an embodiment. Figure 5 In the embodiment shown in FIG, the wafer contact 450 is a paddle-shaped wafer contact. The wafer contact 450 may be positioned at the end of an arm of a spring beam, such as described above and Figure 1 The second arm 108 of the elastic beam 104 shown in FIG. 1 , or the second arm 108 of the elastic beam 104 described above and Figure 2 4. The second arm 210 of the spring beam 206 is shown in FIG. The wafer contact 450 may include a widened portion 452 having a width greater than the width of the arm of the spring beam to which the wafer contact 450 is attached. Two ears 454 may extend from the widened portion 452. In an embodiment, the two ears 454 extend parallel to each other and perpendicular to a contact surface 456. The contact surface 456 may be located between the ears 454 on the widened portion 452 of the wafer contact 450. The contact surface 456 may be convex and include a curvature that bulges outward in the direction in which the ears 454 extend. The specific contact point may vary depending on the specific geometry of the wafer contacted by the wafer contact 400.
[0061] Figure 6A FOUP 500 is shown according to an embodiment. The FOUP 500 includes a plurality of spring beams 502 extending from a door 504. Each of the spring beams 502 includes a first arm 506 and a second arm 508, with a wafer contact 510 at the end of the second arm 508.
[0062] In an embodiment, the plurality of elastic beams 502 are integrated with the door 504 of the FOUP 500 .
[0063] In an embodiment, the plurality of spring beams 502 are attached to a frame, such as described above and Figure 1 , which is separate from the door 504 of the FOUP 500. The frame can be joined to the door 504 by, for example, one or more joining methods, where non-limiting examples include adhesives, snap-fit features, flanges, and tabs.
[0064] Each of the spring beams 502 includes a wafer contact 510. The spring beams 502 may be V-shaped springs. The spring beams 502 may be arranged in pairs, with each pair configured to contact a substrate via the wafer contacts 510 of the paired spring beams 502 when the substrate is placed within the wafer carrier. The spring beams 502 may be aligned so that the spring beams 502 together provide two wafer contacts 510 positioned to contact a substrate when the substrate is placed within the FOUP 500.
[0065] Each elastic beam 502 includes a first arm 506 and a second arm 508. The second arm 508 is coupled to the first arm 506. The first arm 506 can extend in a first direction. The second arm 508 can extend in a second direction different from the first direction in which the first arm 506 extends. In an embodiment, the second arm 508 can extend in a direction opposite to the direction in which the first arm 506 extends. The second arm 508 can be coupled to the first arm 506 so as to form an angle between the first arm 506 and the second arm 508. The second arm 508 can be coupled to the first arm 506 so as to form an angle between the first arm 506 and the second arm 508. In an embodiment, the angle between the first arm 506 and the frame 502 ranges from 0° to 40°. In an embodiment, the angle between the first arm 506 and the second arm 508 ranges from 5° to 40°. In an embodiment, the ratio of the length of the second arm 508 to the length of the first arm 506 can range from 2:1 to 1:3. In an embodiment, the second arm 508 may have a length that is at least half the length of the first arm 506. In an embodiment where the FOUP 500 is a 300 mm FOUP, the first arm 506 may have a length in the range from 55 mm to 45 mm.
[0066] The wafer contact 510 is positioned at the end of the second arm 508 opposite the point where the second arm 508 is joined to the first arm 506. The wafer contact 510 is a feature configured to engage the substrate when the substrate is within the wafer container. The wafer contact 510 may include a surface configured to contact an edge of the substrate. In an embodiment, the surface configured to contact the edge of the substrate may be curved, having a convex shape. The convex shape may provide a rolling interface between the wafer contact 510 and the substrate, and may limit the generation of particles by contact between the substrate and an edge or point along the surface. In an embodiment, the wafer contact 510 is a v-groove wafer contact including ears extending away from each other, wherein a surface is configured to contact the edge of the substrate at or near the apex of the V-shape formed by the ears as they extend away from each other. This wafer contact is Figure 4A In an embodiment, the wafer contact 510 is a paddle-type wafer contact having a widened portion and two ears extending from the widened portion and parallel to each other. When the wafer contact 510 is a paddle-type wafer contact, the surface is configured to contact the substrate positioned between the ears. Figure 5 In an embodiment, other than the wafer contact 510 located at the end of the second arm 508 opposite where the second arm 508 joins the first arm 506 , no other wafer contacts are provided on the spring beam 502 .
[0067] A plurality of spring beams 502 are positioned so that they provide wafer contacts 510 in an interior space 512 of a FOUP. In an embodiment, the spring beams 502 protrude from a door of the FOUP into the interior space 512 of the FOUP. The FOUP may further include wafer supports 516 along sidewalls 514 of the FOUP that support a substrate 518 while the substrate 518 is in the FOUP.
[0068] aspect:
[0069] It should be understood that any of aspects 1 to 7 may be combined with any of aspects 8 to 16 or aspects 17 to 20. It should be understood that any of aspects 8 to 16 may be combined with any of aspects 17 to 20.
[0070] Aspect 1. A chip buffer comprising: a frame; and a plurality of elastic beams, wherein each of the plurality of elastic beams includes: a first arm coupled to the frame and extending to a first arm end along a first direction; a second arm coupled to the first arm at the first arm end and extending to a second arm end along a second direction different from the first direction; and a chip contact coupled to the second arm at the second arm end.
[0071] Aspect 2. A wafer buffer according to Aspect 1, wherein the plurality of elastic beams are configured such that when a wafer is supported by two of the plurality of elastic beams, the wafer contacts the wafer contact only at the ends of the second arms of the two plurality of elastic beams.
[0072] Aspect 3. The wafer buffer according to any one of aspects 1 to 2, wherein the wafer contact is a V-groove wafer contact or a paddle-shaped wafer contact.
[0073] Aspect 4. The wafer buffer according to any one of aspects 1 to 3, wherein a surface of the wafer contact configured to contact a wafer has a convex surface.
[0074] Aspect 5. The wafer buffer according to any one of aspects 1 to 4, wherein the first arm is coupled to the frame at a periphery of the frame, and the first direction is toward a centerline of the frame.
[0075] Aspect 6. A chip buffer according to any one of Aspects 1 to 5, wherein each of the spring beams includes a secondary contact point on the second arm, the secondary contact point being positioned where the second arm is joined to the first arm, and wherein the secondary chip contact is configured to contact the chip only when an impact event occurs.
[0076] Aspect 7. A chip carrier comprising a chip buffer, wherein the chip buffer includes: a frame; and a plurality of elastic beams, wherein each of the elastic beams includes: a first arm, which is coupled to the frame and extends to a first arm end in a first direction; a second arm, which is coupled to the first arm at the first arm end and extends to a second arm end in a second direction different from the first direction; and a chip contact member, which is coupled to the second arm at the second arm end.
[0077] Aspect 8. The wafer buffer according to aspect 7, wherein the wafer buffer is mounted on a door of the wafer carrier.
[0078] Aspect 9. The wafer buffer according to any one of aspects 7 to 8, wherein the wafer carrier is a front-opening wafer pod.
[0079] Aspect 10. A wafer buffer according to any one of Aspects 7 to 9, wherein the plurality of elastic beams are configured such that when a wafer is supported by two of the plurality of elastic beams, the wafer contacts the wafer contact member at the ends of the second arms of the two plurality of elastic beams only when the wafer carrier is stationary.
[0080] Aspect 11. The wafer buffer according to any one of aspects 7 to 10, wherein each of the wafer contacts is a V-groove wafer contact or a paddle-shaped wafer contact.
[0081] Aspect 12. The wafer buffer according to any one of aspects 7 to 11, wherein a surface of the wafer contact configured to contact a wafer has a convex surface.
[0082] Aspect 13. The wafer buffer of any one of aspects 7 to 12, wherein the first arm is coupled to the frame at a periphery of the frame, and the first direction is toward a centerline of the frame.
[0083] Aspect 14. A chip buffer according to any one of Aspects 7 to 13, wherein each of the spring beams includes a secondary contact point on the second arm, the secondary contact point being positioned where the second arm is joined to the first arm, and wherein the secondary chip contact is configured to contact the chip only when an impact event occurs.
[0084] Aspect 15. A method for supporting a chip, comprising: contacting the substrate at two chip contacts, wherein each of the two chip contacts is coupled to a separate spring beam, each of the spring beams includes a first arm extending in a first direction, and a second arm coupled to the first arm and extending in a second direction different from the first direction, and the chip contact is located at an end of the second arm opposite to where the second arm is coupled to the first arm.
[0085] Aspect 16. The method of aspect 15, further comprising contacting the substrate at two secondary contact points on the second arm of the v-spring on which the wafer contact is positioned when a shock event occurs.
[0086] Aspect 17. The method of aspect 15, wherein the substrate contacts the spring beam only at the two wafer contacts.
[0087] Aspect 18. The method of any one of aspects 15 to 17, wherein the wafer contact has a convex surface, the wafer contact being configured to contact the substrate at the convex surface.
[0088] Thus, while a few illustrative embodiments of the present disclosure have been described, those skilled in the art will readily appreciate that still other embodiments can be made and used within the scope of the appended claims. The numerous advantages of the present disclosure covered by this document have been set forth throughout the description. However, it should be understood that the present disclosure is in many respects merely illustrative. Details, particularly matters of shape, size, and arrangement of parts, may be modified without exceeding the scope of the present disclosure. The scope of the present disclosure is, of course, defined by the language of the appended claims.
Claims
1. A method for supporting a wafer, comprising: contacting the wafer at two wafer contacts, wherein each of the two wafer contacts is bonded to a separate spring beam, Each of the elastic beams includes a first arm extending in a first direction, and a second arm coupled to the first arm and extending in a second direction different from the first direction, and The wafer contact is located at an end of the second arm opposite where the second arm is joined to the first arm.
2. The method of claim 1, further comprising contacting the wafer at two secondary contact points on the second arm of the v-spring on which the wafer contact is positioned when a shock event occurs. 3 . The method of claim 1 , wherein the wafer contacts the spring beam only at the two wafer contacts. The method of claim 1 , wherein the wafer contact has a convex surface, the wafer contact being configured to contact the wafer at the convex surface.