Wafer alignment device and method

Abstract

The invention relates to the technical field of wafer alignment devices, and discloses a wafer alignment device and method.The wafer alignment device comprises a first base and a second base, a first placement table is arranged on the first base, and a second placement table is arranged on the second base; and the compensation mechanism comprises a secondary rotating table arranged outside the first placement table and the second placement table, the secondary rotating table is connected with the first base and the second base through bearings, and an annular groove is formed in the secondary rotating table. According to the invention, through cooperative work of the air bag, the rubber block and the air supply system in the secondary rotating table, when a wafer has edge finding deviation, external air supply equipment supplies air to the air cavity through the connecting pipe and the air supply disc, the air enters the air bag through the through groove to expand the air bag, the rubber block is pushed to jack the wafer, and secondary rotating calibration is realized; wafer rotation direction deviation caused by transmission mechanism defects or inertia can be actively calibrated, linear accumulation of angle deviation is avoided, and the edge searching calibration precision is remarkably improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer alignment devices, and more particularly, to a wafer alignment device and method. Background Art

[0002] Wafer alignment is a critical process in semiconductor wafer manufacturing, and its accuracy directly impacts chip manufacturing yield. Existing wafer alignment devices use edge-finding sensors in conjunction with a rotary stage to achieve high-precision positioning of wafer edge notches.

[0003] However, existing systems generally suffer from insufficient transmission reliability. They typically use a single transmission path, such as a worm gear drive, to drive the placement table. During long-term continuous operation, the worm gear and worm are constantly engaged. Frequent friction and stress cause the tooth surfaces to gradually wear out, increasing the backlash. This not only changes the transmission ratio of the transmission mechanism but also causes backlash, leading to significant deviations in the wafer's rotational positioning, seriously affecting alignment accuracy.

[0004] Specifically, once transmission components wear to a certain degree, the machine must be shut down to replace worn worm gears and other components to ensure wafer alignment accuracy. Frequent downtime for maintenance not only reduces production efficiency and increases maintenance costs, but can also introduce new errors during re-commissioning, further restricting the capacity and yield of semiconductor wafer manufacturing. Summary of the Invention

[0005] The present invention provides a wafer alignment device and method to solve the technical problem in related technologies that during long-term continuous operation, the worm wheel and the worm are always in a meshing state, and frequent friction and force cause the tooth surface to gradually wear out, and the tooth side clearance also increases accordingly, which not only changes the transmission ratio of the transmission mechanism, but also produces a backlash phenomenon, causing non-negligible deviations in the wafer during rotational positioning, seriously affecting the alignment accuracy.

[0006] The present invention provides a wafer alignment device, including a first base and a second base, wherein a first placement platform is provided on the first base, and a second placement platform is provided on the second base; a compensation mechanism, wherein the compensation mechanism includes a secondary rotation platform arranged outside the first placement platform and the second placement platform, the secondary rotation platform is connected to the first base and the second base bearings, an annular groove is opened inside the secondary rotation platform, and an airbag is provided inside the annular groove, and multiple groups of rubber blocks are distributed in a ring shape on the airbag.

[0007] As a further optimization scheme of the present invention, a gear is installed on the secondary rotating table, and a rack plate is meshed and connected to the gear. A cavity is opened inside the first base and the second base, and an electric push rod is installed in the cavity. The telescopic end of the electric push rod is fixedly connected to the rack plate.

[0008] As a further optimization solution of the present invention, an air supply disk is further provided outside the secondary rotary table, and a connecting pipe is installed on the air supply disk to connect with an external air supply device through the connecting pipe to supply air to the inside of the air supply disk.

[0009] As a further optimization scheme of the present invention, a replacement mechanism is also provided on the first placement table and the second placement table, and the replacement mechanism includes a connecting shaft respectively installed on the first placement table and the second placement table, and the ends of the connecting shaft away from the first placement table and the second placement table are respectively connected to the cavity bearing, and two sets of worm gears are installed on the connecting shaft, and a worm is provided on one side of the worm gear.

[0010] As a further optimization scheme of the present invention, one group of the worm wheel and the worm are in a meshing state, and another group of the worm wheel and the worm are in a separated state. A motor is also installed in the cavity, and sprockets are installed on the output shaft of the motor and the worm. The external meshing connection of multiple groups of the sprockets is connected with a chain. When the motor is driven to rotate, the worm is driven to rotate through the transmission connection between the sprocket and the chain.

[0011] As a further optimization scheme of the present invention, the bearing in the cavity is connected to a flip shaft, and a swing arm is installed on the flip shaft. Both ends of the swing arm are provided with a sliding groove, and the sliding groove is slidingly connected to the two ends of the worm. The two ends of the worm are also rotatably connected to a slider through a bearing, and the outside of the slider is slidingly connected to a sliding frame, and the sliding frame is fixedly connected to the cavity.

[0012] As a further optimization solution of the present invention, a pad is installed on the flip shaft, and a torsion spring is also provided on the flip shaft, one end of the torsion spring is fixedly connected to the cavity, and the other end of the torsion spring is fixedly connected to the pad.

[0013] As a further optimization scheme of the present invention, a locking mechanism is provided between the electric push rod and the flip shaft, and the locking mechanism includes a sleeve rod arranged in the cavity, and the interior of the sleeve rod is slidably connected to an insertion rod, and the insertion rod is fixedly connected to the inner wall of the cavity. A spring is provided on the outside of the insertion rod, and one end of the spring is fixedly connected to the sleeve rod, and the other end of the spring is fixedly connected to the cavity. A connecting rod is also installed on the sleeve rod, and a block is installed on the connecting rod.

[0014] As a further optimization scheme of the present invention, an arc groove is provided on the telescopic end of the electric push rod, and an arc block is engaged and connected in the arc groove, the arc block is fixedly connected to the sleeve rod, and a locking groove is provided inside the flip shaft, and the locking groove is engaged and connected with the block.

[0015] The beneficial effect of the present invention is that: the present invention cooperates with the air bag, rubber block and air supply system inside the secondary rotation table. When the wafer has edge-finding deviation, the external air supply equipment supplies air to the air cavity through the connecting pipe and the air supply disk. The gas enters the air bag through the through groove to expand it, pushing the rubber block to lift the wafer, realizing secondary rotation calibration. It can actively calibrate the wafer rotation direction deviation caused by transmission mechanism defects or inertia, avoid linear accumulation of angle deviation, and significantly improve the edge-finding calibration accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the three-dimensional structure of Example 1 of the present invention;

[0017] Figure 2 This is a schematic diagram of the partial explosion structure of Example 1 of the present invention;

[0018] Figure 3 This is a perspective diagram of the three-dimensional structure of Example 1 of the present invention;

[0019] Figure 4 This is a schematic diagram of the three-dimensional structure of Example 2 of the present invention;

[0020] Figure 5 This is a schematic diagram of a three-dimensional cross-sectional structure of Example 2 of the present invention;

[0021] Figure 6 This is a schematic diagram of the partial three-dimensional structure of Example 2 of the present invention. Figure 1 ;

[0022] Figure 7 This is a schematic diagram of the partial three-dimensional structure of Example 2 of the present invention. Figure 2 ;

[0023] Figure 8 This is a schematic diagram of a three-dimensional cross-sectional structure of a compensation mechanism according to a second embodiment of the present invention;

[0024] Figure 9 The second embodiment of the present invention Figure 8 A magnified view of the structure at center A;

[0025] Figure 10 This is a schematic diagram of a partial three-dimensional structure of a replacement mechanism according to the second embodiment of the present invention;

[0026] Figure 11 Schematic diagram of the position relationship of the locking mechanism of the second embodiment of the present invention;

[0027] Figure 12 It is a schematic diagram of the three-dimensional structure of the locking mechanism of Example 2 of the present invention.

[0028] In the figure: 1. Connecting seat; 2. First base; 3. Second base; 4. Connecting frame; 5. First placement table; 6. Second placement table; 7. First edge sensor; 8. Second edge sensor; 9. First light source; 10. Second light source; 11. First wafer; 12. Second wafer; 13. Compensation mechanism; 131. Secondary rotation table; 132. Air bag; 133. Rubber block; 134. Gear; 135. Rack plate; 136. Electric push rod; 137. Air supply plate; 1 38. Connecting tube; 139. Air cavity; 14. Replacement mechanism; 141. Connecting shaft; 142. Worm gear; 143. Worm; 144. Motor; 145. Sprocket; 146. Chain; 147. Turning shaft; 148. Swing arm; 149. Slide; 1410. Slider; 1411. Sliding frame; 1412. Spacer; 1413. Torsion spring; 15. Locking mechanism; 151. Sleeve rod; 152. Insert rod; 153. Spring; 154. Connecting rod; 155. Block. DETAILED DESCRIPTION

[0029] The subject matter described herein will now be discussed with reference to exemplary embodiments. It should be understood that these embodiments are discussed solely to enable those skilled in the art to better understand and implement the subject matter described herein, and that the functions and arrangements of the elements discussed may be varied without departing from the scope of this specification. Various examples may omit, substitute, or add various processes or components as needed. In addition, features described with respect to some examples may also be combined in other examples.

[0030] Example 1: The wafer alignment device is mainly based on the principle of optical imaging, using an optical lens to collect images of alignment marks on the wafer and mask, calculating the deviation through an image processing algorithm, emitting an electron beam to scan the wafer based on the electron beam detection principle, and determining the deviation of the mark position according to the electronic signal, or using the laser interference principle to use the laser interference characteristics and calculate the wafer deviation according to the change of interference fringes to achieve high-precision position detection and alignment.

[0031] according to Figure 1 、 Figure 2 and Figure 3 As shown, a wafer alignment device includes a connecting base 1, a first base 2, a second base 3 and a connecting frame 4. The first base 2, the second base 3 and the connecting frame 4 are all installed on the connecting base 1, and the first base 2 and the second base 3 are divided into two layers, upper and lower; wherein, the first base 2 is located below the second base 3, and the second base 3 is located above the first base 2.

[0032] Specifically, a first placement table 5 is provided on the first base 2, on which a first wafer 11 is placed. A first edge-finding sensor 7 is also mounted on the first base 2, and is used to detect the edge of the first wafer 11. A second placement table 6 is provided on the second base 3, on which a second wafer 12 is placed. A second edge-finding sensor 8 is also mounted on the second base 3, and is used to detect the edge of the second wafer 12. In addition, a first light source 9 and a second light source 10 are mounted on the connecting frame 4, and the positions of the first light source 9 and the second light source 10 correspond one-to-one to the positions of the first edge-finding sensor 7 and the second edge-finding sensor 8, respectively. A through-groove is provided on the second base 3, and the first light source 9 passes through the through-groove to provide fill light to the first wafer 11, and the second light source 10 is used to provide fill light to the second wafer 12.

[0033] It should be noted that, as shown in the figure, the first placement table 5 and the second placement table 6 are staggered, so that the positions of the first wafer 11 and the second wafer 12 on the wafer aligner are intersected, thereby facilitating fill light and edge finding operations.

[0034] Working principle: During operation, the first wafer 11 and the second wafer 12 are placed on the upper surfaces of the first placement table 5 and the second placement table 6 respectively, and the wafer aligner is controlled to turn on the first light source 9 and the second light source 10 to provide fill light for the first wafer 11 and the second wafer 12. The first edge-finding sensor 7 and the second edge-finding sensor 8 work at the same time to judge the positions of the first wafer 11 and the second wafer 12 and transmit the position information of the first wafer 11 and the second wafer 12 to the central processing unit. The central processing unit sends a signal to control the first placement table 5 and the second placement table 6 to rotate to align the wafers.

[0035] When placing the first wafer 11 and the second wafer 12 on the upper surfaces of the first placement table 5 and the second placement table 6 respectively, a wafer transport robot may be used.

[0036] It's important to understand that wafer handling robots are key equipment in semiconductor manufacturing. These include vacuum manipulators that utilize vacuum adsorption principles to accommodate a variety of wafer sizes with minimal damage; articulated robots that mimic the joints of the human arm and offer high flexibility for handling complex paths; and track-mounted robots that operate along pre-set tracks and offer high stability and positioning accuracy. Furthermore, wafer handling robots integrate key technologies such as high-precision positioning, motion control, and cleanliness, offering high levels of automation, efficiency, and reliability. They are widely used for inter-process handling throughout the wafer manufacturing process, as well as for material transfer from wafer dicing to chip packaging during the chip packaging process. They are crucial for improving semiconductor production efficiency and product quality.

[0037] In summary, this embodiment of the present invention adopts a double-layer workstation design, which saves space for the use environment compared to traditional aligners; and only uses one set of control system to achieve multi-wafer alignment at the same time, reducing the cost of users aligning multiple wafers at the same time.

[0038] Example 2: According to Figure 4 、 Figure 5 and Figure 6 As shown, a wafer alignment device includes a compensation mechanism 13 arranged outside the first placement table 5 and the second placement table 6, the compensation mechanism 13 includes a secondary rotating table 131 arranged outside the first placement table 5 and the second placement table 6, the secondary rotating table 131 is connected to the first base 2 and the second base 3 with bearings, an annular groove is provided inside the secondary rotating table 131, and an air bag 132 is provided inside the annular groove, and multiple groups of rubber blocks 133 are distributed in a ring shape on the air bag 132, a gear 134 is installed on the secondary rotating table 131, and a rack plate 135 is meshed and connected to the gear 134, a cavity is provided inside the first base 2 and the second base 3, and an electric push rod 136 is installed in the cavity, and the telescopic end of the electric push rod 136 is fixedly connected to the rack plate 135. By coordinating the secondary rotating platform 131 , the gear 134 , the rack plate 135 and the electric push rod 136 in the compensation mechanism 13 , the rotation direction deviation is actively calibrated to avoid the cumulative deviation caused by transmission mechanism defects and inertia, thereby improving the wafer edge calibration accuracy.

[0039] It should be understood that when deviation occurs during edge calibration of the first wafer 11 and the second wafer 12 , the airbag 132 is used to lift the deviated first wafer 11 or the second wafer 12 upward, and the first wafer 11 and the second wafer 12 are subjected to secondary rotation calibration processing.

[0040] When the electric push rod 136 is driven to perform telescopic movement, the rack plate 135 is controlled to move synchronously, and the gear 134 and the rack plate 135 are engaged and connected to drive the secondary rotating table 131 to rotate synchronously, thereby calibrating and positioning the first wafer 11 and the second wafer 12 in the rotation direction, avoiding cumulative deviations caused by excessive rotation, resulting in a decrease in the edge-finding calibration accuracy of the first wafer 11 and the second wafer 12, thereby calibrating and positioning the wafers in the rotation direction, effectively avoiding cumulative deviations caused by transmission mechanism defects and inertia, and significantly improving the wafer edge-finding calibration accuracy.

[0041] Specifically, an air supply tray 137 is installed on the exterior of the secondary rotating platform 131. This tray is connected to an external air supply device via a connecting pipe 138, which supplies air to the interior of the tray 137. The jacking calibration system, comprised of airbags 132, rubber blocks 133, and the air supply system, allows for flexible calibration for deviations of varying directions and degrees, providing additional vertical adjustment options and addressing the shortcomings of traditional single-point calibration.

[0042] Among them, according to Figure 7 、 Figure 8 and Figure 9 As shown, the secondary rotation platform 131 has an air cavity 139 formed within it, and multiple through slots are formed between the air cavity 139 and the annular groove. The ends of the through slots are connected to the air cavity 139 and the interior of the annular groove, respectively. The airbag 132 has an opening that matches the through slots, and the opening is fixedly connected to the through slots. In this embodiment, the provision of the through slots facilitates the flow of gas within the air cavity 139, thereby facilitating the gas to pass through the opening and enter the interior of the airbag 132, causing the airbag 132 to expand, thereby lifting and rotating the first wafer 11 and the second wafer 12 on the first placement platform 5 and the second placement platform 6, and calibrating the rotational position of the first wafer 11 and the second wafer 12.

[0043] Further, according to Figure 9 As shown, an annular slide is provided on the outside of the secondary rotating platform 131, and an annular guide rail is slidably connected to the annular slide, and the annular guide rail is fixedly connected to the air supply disk 137. In this embodiment, through the sliding connection between the annular slide and the annular guide rail, the air supply disk 137 can be used to rotate and supply air to the interior of the air cavity 139, so that it provides stable gas output during rotation. In addition, the meshing transmission of the gear 134 and the rack plate 135 ensures precise control of the rotation angle. The annular slide and the guide rail cooperate to ensure that the air supply disk 137 can stably supply air during rotation, ensuring the stability of the lifting force of the airbag 132 and improving calibration reliability.

[0044] according to Figure 6 、 Figure 7 and Figure 10 As shown, a replacement mechanism 14 is also provided on the first placement table 5 and the second placement table 6. The replacement mechanism 14 includes a connecting shaft 141 respectively installed on the first placement table 5 and the second placement table 6. The ends of the connecting shaft 141 away from the first placement table 5 and the second placement table 6 are respectively connected to the cavity bearings. Two groups of worm gears 142 are installed on the connecting shaft 141, and a worm 143 is provided on one side of the worm gear 142, one group of worm gears 142 and the worm 143 are in a meshing state, and the other group of worm gears 142 and the worm 143 are in a separated state. A motor 144 is also installed in the cavity, and a sprocket 145 is installed on the output shaft of the motor 144 and the worm 143. The external meshing connection of multiple groups of sprockets 145 is connected with a chain 146. When the driving motor 144 rotates, the transmission connection is connected through the sprocket 145 and the chain 146 to drive the worm 143 to rotate.

[0045] Specifically, according to Figure 10As shown, a tilt shaft 147 is connected to a bearing in the cavity, and a swing arm 148 is mounted on the tilt shaft 147. A slide groove 149 is provided at each end of the swing arm 148, and the slide grooves 149 are slidably connected to the ends of the worm 143. The ends of the worm 143 are also rotatably connected to sliders 1410 via bearings. The exterior of the slider 1410 is slidably connected to a sliding frame 1411, which is fixedly connected to the cavity. In this embodiment, the slide groove 149 switches the position of the worm 143 through the rotation of the swing arm 148. The position of the worm 143 is then limited by the limiting action of the slider 1410 and the sliding frame 1411, so that it can stably contact the worm wheel 142.

[0046] Further, according to Figure 10 As shown, a pad 1412 is mounted on the tilt shaft 147, and a torsion spring 1413 is also provided on the tilt shaft 147. One end of the torsion spring 1413 is fixedly connected to the cavity, and the other end of the torsion spring 1413 is fixedly connected to the pad 1412. In this embodiment, the torsion spring 1413 is in a compressed and force-storing state by default. When the limit of the tilt shaft 147 is released, the torsion spring 1413 generates a restoring force, causing the tilt shaft 147 to drive the swing arm 148 to rotate, adjusting the worm wheel 142 and worm 143 from a separated state to an engaged state, and adjusting the worm wheel 142 and worm 143 from an engaged state to a separated state, thereby switching the transmission of the worm wheel 142 and worm 143, and preventing the worm wheel 142 and worm 143 from being in an engaged state for a long time, which may cause calibration deviation. This design enables the device to switch the transmission path in a timely manner according to actual needs during operation, avoiding increased wear caused by long-term use of a single transmission path, and effectively improving the reliability and service life of the device. At the same time, flexible transmission switching also enhances the device's ability to cope with different working scenarios and calibration requirements.

[0047] It should be noted that the torsion spring 1413 mounted on the tilt shaft 147 is in a compressed and force-accumulating state by default. When the limit of the tilt shaft 147 is released, the torsion spring 1413 generates a restoring force to drive the swing arm 148 to rotate, automatically completing the switching of the transmission state between the worm gear 142 and the worm 143. This mechanism can effectively prevent the worm gear 142 and the worm 143 from being in a meshing state for a long time, causing excessive wear. When one set of worm gear 142 and worm 143 becomes worn and may affect calibration, the torsion spring 1413 can be promptly switched to the other set, reducing calibration deviations caused by component wear and ensuring the continued stable operation of the wafer alignment device. In addition, an alarm can be installed in the cavity. When the first edge-finding sensor 7 or the second edge-finding sensor 8 drives the compensation mechanism 13 to operate, the alarm is activated to notify the staff, allowing them to promptly replace the worm gear 142 and worm 143 and adjust the swing arm 148 to its initial position for the next use.

[0048] according to Figure 11 and Figure 12 As shown, a locking mechanism 15 is provided between the electric push rod 136 and the flip shaft 147. The locking mechanism 15 includes a sleeve rod 151 arranged in the cavity, and the sleeve rod 151 is internally slidably connected to an insertion rod 152, and the insertion rod 152 is fixedly connected to the inner wall of the cavity. A spring 153 is provided on the outside of the insertion rod 152, and one end of the spring 153 is fixedly connected to the sleeve rod 151, and the other end of the spring 153 is fixedly connected to the cavity. A connecting rod 154 is also installed on the sleeve rod 151, and a blocking block 155 is installed on the connecting rod 154.

[0049] Among them, an arc groove is opened on the telescopic end of the electric push rod 136, and an arc block is engaged in the arc groove, and the arc block is fixedly connected to the sleeve rod 151. A locking groove is opened inside the flip shaft 147, and the locking groove is engaged with the block 155.

[0050] It should be understood that when the electric push rod 136 is extended or retracted, the arc groove at its extension end is disengaged from the arc block on the sleeve rod 151, driving the sleeve rod 151 to slide along the insertion rod 152, and the spring 153 provides elastic buffering and reset force to ensure that the sleeve rod 151 moves smoothly, and then drives the block 155 to accurately engage or separate with the locking groove inside the flip shaft 147 through the connecting rod 154, so that the linear motion of the electric push rod 136 is closely related to the rotation control of the flip shaft 147. During the calibration process of the first wafer 11 and the second wafer 12, the locking and unlocking states of the flip shaft 147 can be accurately controlled according to the calibration requirements, ensuring that the work processes of the compensation mechanism 13 and the replacement mechanism 14 are carried out in an orderly manner, avoiding calibration deviations due to misoperation of the mechanism, and significantly improving the accuracy and stability of wafer alignment.

[0051] The above describes an embodiment of this specific implementation method, but this embodiment is not limited to the above specific implementation method. The above specific implementation method is merely illustrative and not restrictive. Ordinary technicians in this field can also make many forms based on the inspiration of this embodiment, all of which are protected by this embodiment.

Claims

1. A wafer alignment device, characterized in that: include: A first base (2) and a second base (3), wherein the first base (2) is provided with a first placement platform (5), and the second base (3) is provided with a second placement platform (6); A compensation mechanism (13) includes a secondary rotating platform (131) arranged outside the first placement platform (5) and the second placement platform (6), the secondary rotating platform (131) is connected to the first base (2) and the second base (3) by bearings, an annular groove is provided inside the secondary rotating platform (131), and an air bag (132) is provided inside the annular groove.

2. The wafer alignment device according to claim 1, wherein: A gear (134) is installed on the secondary rotating platform (131), and a rack plate (135) is meshedly connected to the gear (134). A cavity is opened inside the first base (2) and the second base (3), and an electric push rod (136) is installed in the cavity. The telescopic end of the electric push rod (136) is fixedly connected to the rack plate (135).

3. The wafer alignment device according to claim 2, wherein: An air supply disk (137) is also provided outside the secondary rotating platform (131), and a connecting pipe (138) is installed on the air supply disk (137) to connect with an external air supply device through the connecting pipe (138) to supply air to the inside of the air supply disk (137).

4. The wafer alignment device according to claim 2, wherein: The first placement platform (5) and the second placement platform (6) are further provided with a replacement mechanism (14), and the replacement mechanism (14) comprises a connecting shaft (141) respectively mounted on the first placement platform (5) and the second placement platform (6), and one end of the connecting shaft (141) away from the first placement platform (5) and the second placement platform (6) is respectively connected to the cavity bearing, and two sets of worm gears (142) are mounted on the connecting shaft (141), and a worm (143) is provided on one side of the worm gear (142).

5. The wafer alignment device according to claim 4, characterized in that: One group of the worm wheels (142) and the worm (143) are in a meshing state, and another group of the worm wheels (142) and the worm (143) are in a separated state. A motor (144) is also installed in the cavity, and a sprocket (145) is installed on the output shaft of the motor (144) and the worm (143). The external meshing connection of multiple groups of the sprockets (145) is connected with a chain (146). When the motor (144) is driven to rotate, the sprocket (145) and the chain (146) are connected to drive the worm (143) to rotate.

6. The wafer alignment device according to claim 4, characterized in that: The bearing in the cavity is connected to a flip shaft (147), and a swing arm (148) is installed on the flip shaft (147). Both ends of the swing arm (148) are provided with a slide groove (149), and the slide groove (149) is slidably connected to the two ends of the worm (143). The two ends of the worm (143) are also rotatably connected to a slider (1410) through a bearing, and the outside of the slider (1410) is slidably connected to a sliding frame (1411), and the sliding frame (1411) is fixedly connected to the cavity.

7. The wafer alignment device according to claim 6, characterized in that: A cushion block (1412) is installed on the flip shaft (147), and a torsion spring (1413) is also provided on the flip shaft (147). One end of the torsion spring (1413) is fixedly connected to the cavity, and the other end of the torsion spring (1413) is fixedly connected to the cushion block (1412).

8. The wafer alignment device according to claim 6, characterized in that: A locking mechanism (15) is provided between the electric push rod (136) and the flip shaft (147), and the locking mechanism (15) includes a sleeve rod (151) provided in the cavity, and the sleeve rod (151) is internally slidably connected to an insertion rod (152), and the insertion rod (152) is fixedly connected to the inner wall of the cavity. A spring (153) is provided on the outside of the insertion rod (152), and one end of the spring (153) is fixedly connected to the sleeve rod (151), and the other end of the spring (153) is fixedly connected to the cavity. A connecting rod (154) is also installed on the sleeve rod (151), and a clamping block (155) is installed on the connecting rod (154).

9. The wafer alignment device according to claim 8, characterized in that: An arc groove is provided on the telescopic end of the electric push rod (136), and an arc block is engaged and connected in the arc groove. The arc block is fixedly connected to the sleeve rod (151). A locking groove is provided inside the flip shaft (147), and the locking groove is engaged and connected with the block (155).

10. A method for using a wafer alignment device, using the wafer alignment device according to any one of claims 1 to 9, characterized in that: The steps include: S1, detection; When the first wafer (11) and the second wafer (12) are edge-finding calibrated, detecting whether a deviation occurs; S2, calibration; If a deviation occurs, the rack plate (135) is driven to move synchronously by controlling the telescopic movement of the electric push rod (136), and the meshing transmission of the gear (134) and the rack plate (135) is used to drive the secondary rotation table (131) to rotate, so as to calibrate the rotation direction of the wafer; at the same time, the external gas supply equipment supplies gas to the gas supply disk (137) through the connecting pipe (138), and the gas enters the air bag (132) to expand it, so as to lift the wafer and perform secondary rotation calibration; S3, replacement; When replacement is required, the locking mechanism (15) triggers the torsion spring (1413) to release the restoring force, drives the flip shaft (147) to drive the swing arm (148) to rotate, and pushes the worm (143) to switch positions through the sliding grooves (149) at both ends of the swing arm (148), adjusts the worm wheel (142) and the worm (143) in the separated state to the meshed state, and adjusts the worm wheel (142) and the worm (143) in the meshed state to the separated state, thereby completing the transmission path switching.

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