Component carrier, method for manufacturing component carrier, and package

Abstract

The invention relates to a component carrier (100), a method for manufacturing the component carrier and a package comprising such a component carrier (100) wherein the component carrier (100) comprises a stack (10, 20) having a stack direction (Z) and comprising at least one electrically insulating layer structure and at least one electrically conductive layer structure, the component carrier comprises at least a first component (11) and a second component (12), which are embedded one above the other in the stack (10, 20) in the stack direction (Z) and have a cavity (13) therebetween, the first component (11) and the second component (12) each comprising a component main surface (14, 16; 24, 26), and the component main surface (14, 16; 24, 26) partially delimit the cavity (13) in the stacking direction (Z), and wherein the cavity (13) is filled with an electrically conductive paste.

Description

Technical Field

[0001] The present invention generally relates to a component carrier comprising a stack having a stacking direction and comprising a plurality of layer structures, the stack particularly comprising at least one electrically insulating layer structure and at least one electrically conductive layer structure, and further comprising at least a first component and a second component, the first component and the second component being embedded in the stack one above the other along the stacking direction with a cavity between the first component and the second component. Furthermore, the present invention relates to a method for producing a component carrier. Furthermore, the present invention relates to a package comprising at least one component carrier. Background Art

[0002] Component carriers comprising a stack having a stacking direction and a multi-layer structure are well known in the prior art. It is also known to embed one or more components in a component carrier.

[0003] For example, US 2019 / 0164892 A1 describes a module having a lower module component and an upper module component, wherein the lower module component comprises a material in which at least one first structural component is embedded, and the upper module component comprises a material in which at least one second component is embedded. The upper module component and the lower module component are stacked together, and the lower module component and the upper module component are electrically and mechanically connected to each other.

[0004] In US2019 / 0109084 A1, a method for interconnecting two components is disclosed. The first component includes a first substrate and a set of structured metal pads arranged on a main surface. Each of the pads includes one or more channels that extend in the same plane as the average plane of the pad to form at least two raised structures. The second interconnected component includes a second substrate and a set of metal pillars arranged on the main surface. The structured metal pads are bonded to corresponding opposing metal pillars in the metal pillars using a metal paste. The paste is sintered to form a porous metal joint at the level of the channel. A metal interconnection between the substrates is obtained. During bonding, the metal paste is sintered by exposing the structured metal pads and the metal pillars to a reducing agent. The channels and raised structures increase the permeability of the reducing agent.

[0005] KR 20220018842 A discloses a method for forming a Cu-Cu flip chip interconnection and a Cu-Cu flip chip interconnection formed thereby, wherein the method comprises the following steps: (a) electroplating copper on an under-bump metal layer (UBM) and a pad of a first bonding material to form a copper pillar; (b) forming a copper nanoparticle aggregation layer physically connected to the surface of an upper portion of the copper pillar by wet deposition; and (c) positioning and aligning the copper nanoparticle aggregation layer formed on the first bonding material on the pad of a second bonding material, and applying pressure at 2°C in an atmospheric environment. At least one of the first bonding material and the second bonding material is heated and sintered at a temperature of 50° C. to solidify the contact points between the first bonding material and the second bonding material and bond the first bonding material to the second bonding material, thereby forming a Cu-Cu flip-chip interconnect. The copper nanoparticle aggregation layer is selected from one or more of: i) a copper particle aggregation layer having copper nano-nodules; ii) a copper fractal aggregation layer having copper nano-nodules; and iii) a copper coral aggregation layer having copper nano-nodules. Rapid sintering bonding is thus possible.

[0006] US Pat. No. 7,849,591 B2 discloses a configuration comprising: at least one wiring substrate constructed from an insulating substrate having adhesive properties; an electrically conductive layer formed on one side of the insulating substrate; a plug electrode made of an electrically conductive paste, the plug electrode being connected to the electrically conductive layer and extending through the insulating substrate; and an IC chip having a rewiring portion, the IC chip being embedded in an interlayer bonding material and the rewiring portion being connected to the plug electrode, the IC chip having a support plate disposed on the opposite side of the IC chip rewiring portion, an adhesive layer being provided between the rewiring portion and the support plate, and the IC chip having a rewiring layer constructed from the wiring substrate and the rewiring portion. Thus, according to the present invention, a multilayer printed wing board having highly defined components can be provided, thereby enabling manufacturing through a simple process without increasing costs or reducing yields.

[0007] US 9560770 B2 discloses a component-built-in board with a multi-layer structure, in which a plurality of unit boards are stacked and configured to have a plurality of electronic components built-in in a stacking direction, wherein the plurality of unit boards include: a double-sided board, the double-sided board including a first insulating layer, a first wiring layer formed on both surfaces of the first insulating layer, and a first interlayer electrically conductive layer penetrating the first insulating layer and connected to the first wiring layer, and the double-sided board including an opening in which the electronic components are accommodated; an intermediate board, the intermediate board including a second insulating layer, a first adhesive layer arranged on both surfaces of the second insulating layer, and a second interlayer electrically conductive layer penetrating the second insulating layer together with the first adhesive layer, and the double-sided board is arranged above and below the intermediate board.

[0008] US2014 / 247570 A1 proposes a circuit board structure having electronic components embedded therein and a method for manufacturing the circuit board structure. The circuit board structure includes: a substrate having a first circuit layer formed on at least one surface of the substrate, the electronic components being electrically connected to the first circuit via metal connectors; a first dielectric layer formed on the first circuit layer of the substrate and having a plurality of dielectric layer cavities for exposing the first circuit layer from the plurality of dielectric layer cavities and for receiving the electronic components in the plurality of dielectric layer cavities; a plurality of vias; a second dielectric layer formed on the first dielectric layer and the electronic components and having a plurality of dielectric layer vias for exposing the electronic components from the plurality of dielectric layer vias and for forming vias in the plurality of dielectric layer vias; and a second circuit layer formed on the second dielectric layer and electrically connected to the electronic components via the vias.

[0009] US2022 / 377911 A1 describes a component carrier intermediate product, which includes: a first electrically insulating layer structure; an at least partially uncured and patterned second electrically insulating layer structure having a recess, wherein the recess is filled with an electrically conductive material; and a component carrier part, which is arranged on the at least partially uncured and patterned second electrically insulating layer structure.

[0010] Based on this background, the technical problem to be solved by the present invention is to provide an alternative, in particular improved component carrier, an alternative, in particular improved method for manufacturing such a component carrier, and an alternative, in particular improved package comprising a component carrier, by means of which one or more of several existing challenges in terms of heat removal, mechanical strength, electrical reliability and / or yield losses, in particular due to the increasing complexity and miniaturization of electronic components in component carriers, can be at least partially solved, in particular when valuable embedded components such as microprocessor chips that have to be electrically connected are involved. Summary of the Invention

[0011] In view of the above, a component carrier, a method for producing a component carrier, and a package including a component carrier are provided according to the respective independent patent claims. Advantageous embodiments of the invention are defined by the dependent patent claims, the description, and the drawings. The wording of the claims is hereby expressly incorporated into the description.

[0012] According to a first aspect of the present invention, a component carrier is provided, comprising a stack having a stacking direction, wherein the stack comprises at least one electrically insulating layer structure and at least one electrically conductive layer structure, and the stack further comprises at least a first component and a second component, the first component and the second component being embedded in the stack one above the other in the stacking direction, with a cavity between the first component and the second component. The first component and the second component each comprise a component main surface, the component main surface facing the cavity and partially delimiting the cavity in the stacking direction, wherein the cavity is filled with an electrically conductive paste.

[0013] The component carrier according to the present invention allows for thinner stacks with more than one component layer. The arrangement of components directly above one another, with cavities between them at least partially bounded by the components, allows for component carriers with a reduced height. This reduces the space required to embed the components within the component carrier. This allows for very compact component carriers, thereby improving miniaturization, particularly of electronic packages that include at least one component carrier. In particular, embedded packages can be further miniaturized.

[0014] Furthermore, the component carrier according to the invention makes it very easy to produce direct and straight electrical connections with short path lengths between components, in particular between embedded components, wherein the electrical connection between at least two components can be established in particular via an electrically conductive paste for filling the cavity between the components. The component carrier according to the invention makes it possible to produce reliable vertical or Z-axis interconnections, in particular direct, straight, and as short as possible interconnections, between components arranged one above the other in different layers.

[0015] As a result, and / or due to the potentially small height of the component carrier, the electrical connection performance between components within the component carrier can be improved. In particular, short paths from one component to another can be achieved. This can reduce inductance and parasitic effects. In some cases, this can result in reduced signal delays and increased overall signal transmission speeds. This can be particularly advantageous in high-frequency applications.

[0016] The component carrier according to the invention may further allow for better thermal management, wherein, in some cases, in particular, the thermal resistance of the component carrier may be reduced.

[0017] The properties of a component carrier, in particular its electrical, thermal, and / or mechanical properties, can be influenced and / or adjusted by the design of the cavity (in particular its size and shape) and / or the material properties of the electrically conductive paste used to fill it. A cavity filled with an electrically conductive paste can serve as a heat drain, conducting away heat and thus contributing to the thermal management of the entire component carrier. If appropriately selected, the electrically conductive paste can also enhance the mechanical stability of the component carrier. In particular, the electrically conductive paste can influence resistance to thermal shock and environmental stresses.

[0018] In summary, the component carrier according to the invention can be further miniaturized while offering a high degree of flexibility in adapting to various applications.

[0019] The stack particularly comprises a plurality of layer structures, wherein, in a preferred embodiment, the stack may comprise at least one electrically insulating layer and at least one electrically conductive layer structure.

[0020] In order to easily establish an electrical connection between the first component and the second component, in particular to establish a direct electrical connection between the first component and the second component, preferably an electrical connection between the first component and the second component in the stacking direction (which may be a vertical direction), in particular a direct electrical connection, the first component and the second component can be arranged in a stack in such a way that the first component and the second component at least partially overlap each other when viewed from above. The first component and the second component can also be arranged so as to completely overlap.

[0021] The first component and / or the second component may in particular comprise at least one electrically conductive structure, for example one or more pads, which in particular faces the cavity, wherein, in a preferred embodiment, the components are arranged relative to one another such that at least the individual electrically conductive structures (for example pads) sufficiently overlap one another seen in top view to establish an electrical connection.

[0022] The main surfaces of the first and second components that bound the cavity between them may have identical surface shapes. However, this is not mandatory; the main surfaces of the first and second components that bound the cavity between them may also have different surface shapes and sizes. Only a certain degree of overlap is required to establish an electrical connection.

[0023] In a preferred embodiment, the first component and the second component are arranged, in particular embedded, in the stack such that a direct electrical connection between the first component and the second component in the stacking direction, preferably in the vertical direction, can be established by an electrically conductive paste filled in a cavity at least partially delimited by the first component and the second component.

[0024] The cavity design, in particular its shape and / or size, can be flexibly adapted to the specific application of the component carrier. This offers advantages, particularly in terms of design and performance. In particular, the electrical connection established by the electrically conductive paste used to fill the cavity can be precisely tailored to the respective application. For example, to achieve good heat dissipation, a larger cavity, in particular one with a greater extent in the planar direction, can be formed. For example, to establish precise signal connections, a very small cavity can be provided to minimize electrical losses and improve performance.

[0025] The component carrier according to the invention is suitable for bonding components with different pad ends to Cu, for example to Au, Ag, Ti, without any special pretreatment such as PVD or adhesion promoters. This allows a very flexible design of component carriers with at least two embedded components.

[0026] Therefore, in at least one embodiment, the first component and / or the second component may include at least one pad terminal for establishing an electrical connection from and to the component, wherein, in particular, the at least one pad terminal of the first component may be different from the at least one pad terminal of the second component.

[0027] In the context of the present application, the term "component carrier" may particularly denote any support structure on which and / or in which one or more components can be accommodated to provide mechanical support and / or electrical connection. In other words, the component carrier may be configured as a mechanical and / or electronic carrier for the components.

[0028] In particular, the component carrier can be one of a printed circuit board (PCB), an interposer (in particular an organic interposer) and a substrate (in particular an IC (integrated circuit) substrate), or the component carrier can be configured as one of a printed circuit board (PCB), an interposer (in particular an organic interposer) and a substrate (in particular an IC (integrated circuit) substrate).

[0029] The component carrier may in particular comprise one or more stacks and / or sub-stacks, wherein each stack may in particular comprise a plurality of layer structures, preferably each stack may comprise at least one electrically conductive layer structure and / or at least one insulating layer structure.

[0030] In at least one embodiment, the component carrier is in particular a laminated component carrier. In such an embodiment, the component carrier can in particular be a composite of a plurality of layer structures that are stacked and connected together by applying pressure and / or heat.

[0031] In the context of the present application, the term "stack" may particularly denote an arrangement of a plurality of layer structures that are preferably planar and mounted one above the other in a parallel manner. Some of the layer structures of the stack described herein may be directly stacked on top of one another, meaning that there are no further layer structures or components between them, or some of the layer structures of the stack described herein may be indirectly stacked on top of one another, wherein further layer structures or components not described in the present application may be arranged between other layer structures described in the present application, etc., unless expressly stated to the contrary.

[0032] In the context of the present application, the term "stacking direction" may particularly denote a direction perpendicular to the planar extension of at least one layer structure of the stack.

[0033] In the context of the present application, the term "layer structure" may particularly denote a continuous layer, a patterned layer or a plurality of non-continuous islands in a common plane.

[0034] In at least one embodiment, at least one body and / or layer structure and / or component of a component carrier includes a main surface. In the context of this application, the term "main surface" of a body, layer structure, or component may particularly denote one of two oppositely facing largest surfaces of the body, layer structure, or component. The main surfaces may be connected by circumferential sidewalls. The thickness of a body, such as a component, a stack, a sub-stack, or a layer structure may be defined by the distance between the two oppositely facing main surfaces.

[0035] In the context of the present application, the term "electrically conductive layer structure" may particularly denote an electrically conductive layer structure. The electrically conductive layer structure may particularly comprise one or more electrically conductive paths, traces, and / or signal traces. These electrically conductive structures may, for example, be etched from a copper sheet and may, for example, be laminated onto an electrically non-conductive or electrically insulating layer structure.

[0036] In at least one embodiment, the at least one electrically conductive layer structure of the component carrier comprises at least one of the following: copper, aluminum, nickel, silver, gold, palladium, tungsten, and magnesium, and / or alloys comprising at least one of these materials. While copper is generally preferred, other materials or coated versions thereof are also possible, in particular, versions coated with superconducting materials or conductive polymers, such as graphene or poly(3,4-ethylenedioxythiophene) (PEDOT), respectively. In some examples, the electrically conductive layer structure can have an electrical conductivity greater than 5*10^4 S / m, in particular greater than 10^6 S / m.

[0037] In the context of the present application, the term "electrically insulating layer structure" may denote an electrically non-conductive layer structure.

[0038] In at least one embodiment, at least one electrically insulating layer structure may include at least one of the following: a resin or polymer, such as an epoxy resin, a cyanate resin, a benzocyclobutene resin, or a bismaleimide-triazine resin; a polyphenylene derivative (e.g., based on polyphenylene ether, PPE), a polyimide (PI), a polyamide (PA), a liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE), and / or combinations thereof. Reinforcement structures, such as meshes, fibers, spheres, or other types of filler particles, made of glass (multilayer glass), may also be used to form a composite. Semi-cured resins combined with reinforcing agents, such as fibers impregnated with the above resins, are called prepregs and may also be used. These prepregs are typically named after their properties, such as FR4 or FR5, which describe their flame retardant properties. Although prepregs, particularly FR4, are generally preferred for rigid PCBs, other materials, particularly epoxy-based stacking materials (e.g., stacking films) or photosensitive dielectric materials, may also be used. For high-frequency applications, high-frequency materials such as polytetrafluoroethylene, liquid crystal polymers and / or cyanate ester resins may be preferred. In addition to these polymers, low-temperature co-fired ceramics (LTCC) or other low, very low or ultra-low DK materials may be used as electrical insulating structures in component carriers.

[0039] In the context of the present application, the term “component” may particularly denote an electronic component which is typically configured to be mounted on and / or embedded in a component carrier, wherein the component may also particularly be configured to be electrically connected to the component carrier.

[0040] The at least one component can be selected from at least one of the following: a non-electrically conductive inlay, an electrically conductive inlay (e.g., a metal inlay, preferably comprising copper or aluminum), a heat transfer unit (e.g., a heat pipe), an optical element (e.g., an optical waveguide or optical conductor connector), an electronic component, or a combination thereof. The inlay can be, for example, a metal block with or without an insulating material coating (IMS-inlay), which can be embedded or surface-mounted to promote heat dissipation. Suitable materials are defined by their thermal conductivity, which should be at least 2 W / mK. Such materials are typically based on, but not limited to, metals, metal oxides, and / or ceramics, such as copper, aluminum oxide (Al2O3), or aluminum nitride (AlN). Other geometries with increased surface area are also often used to increase heat exchange capacity. Furthermore, the component may be an active electronic component (having at least one realized pn junction), a passive electronic component such as a resistor, an inductor, or a capacitor, an electronic chip, a memory device (e.g., a DRAM or other data memory), a filter, an integrated circuit (e.g., a field programmable gate array (FPGA), a programmable array logic (PAL), a general array logic (GAL), and a complex programmable logic device (CPLD)), a signal processing component, a power management component (e.g., a field effect transistor (FET), a metal oxide semiconductor field effect transistor (MOSFET), a complementary metal oxide semiconductor (CMOS), a junction field effect transistor (JFET), or an insulated gate Field effect transistors (IGFETs), which are based on semiconductor materials such as silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), gallium oxide (Ga2O3), indium gallium arsenide (InGaAs), and / or any other suitable inorganic compound), optoelectronic interface elements, light-emitting diodes, optocouplers, voltage converters (e.g., DC / DC converters or AC / DC converters), cryptographic components, transmitters and / or receivers, electromechanical transducers, sensors, actuators, microelectromechanical systems (MEMS), microprocessors, capacitors, resistors, inductors, batteries, switches, cameras, antennas, logic chips, and energy harvesting units. However, in addition or alternatively, other components may also be embedded in the component carrier. For example, a magnetic element may be used as a component. Such a magnetic element may be a permanent magnetic element (e.g., a ferromagnetic element, an antiferromagnetic element, a multiferroic element, or a ferrimagnetic element, such as a ferrite core) or a paramagnetic element. However, the component may also be an IC substrate, an interposer, or another component carrier, for example in a board-in-board configuration. Components can usually be surface mounted on a component carrier and / or can be embedded in the interior of a component carrier. In addition, other components, in particular components that generate and emit electromagnetic radiation and / or are sensitive to electromagnetic radiation propagated from the environment, can also be used as components.

[0041] In the context of the present application, the term “cavity” may particularly denote a recess or a hollow space created within the structure of a component carrier, particularly between parts and / or components and / or layers of a component carrier.

[0042] The at least one cavity of the component carrier can be created at least partially or completely by mechanical manufacturing steps, for example, the at least one cavity of the component carrier can be created at least partially or completely by drilling and / or milling, in particular, the at least one cavity of the component carrier can be created at least partially or completely by laser drilling and / or mechanical drilling. Additionally or alternatively, the at least one cavity of the component carrier can be at least partially created using an etching process. The at least one cavity can be formed by assembling at least two parts of the cavity into a common cavity, wherein each part of the common cavity can be created at least partially or completely as described above. In examples, the cavity can be at least partially filled with an electrically conductive material, for example, the cavity can be filled with a material for an electrically conductive layer structure or a material of an electrically conductive layer structure, or the cavity can be filled with a material that at least partially forms an electrically conductive layer structure, and / or the cavity can be filled with an electrically insulating material, for example, the cavity can be filled with a material for an electrically insulating layer structure or a material of an electrically insulating layer structure, or the cavity can be filled with a material that at least partially forms an electrically insulating layer structure. In another example, at least a portion of the cavity may not have an electrically conductive layer structure and / or may not have an electrically insulating layer structure.

[0043] In the context of the present application, the term "printed circuit board" (PCB) may particularly denote a component carrier, in particular a plate-shaped component carrier, which is preferably formed by laminating a plurality of layers, eg by applying pressure and / or by supplying heat energy.

[0044] In at least one embodiment, particularly in a preferred embodiment of a PCB, the PCB is formed, in particular, by laminating a plurality of electrically conductive layer structures with a plurality of electrically insulating layer structures. The at least one insulating layer structure may, in particular, be at least partially arranged between two electrically conductive layer structures and / or adjacent to at least one electrically conductive layer structure and / or surrounding at least one electrically conductive layer structure.

[0045] As a preferred material for PCB technology, the electrically conductive layer structure can be made of copper, while the electrically insulating layer structure can include resin and / or glass fiber, so-called prepreg, or FR4 material. The various electrically conductive layer structures can be connected to each other in a desired manner by forming holes through the laminate, for example by laser drilling or mechanical drilling, and by partially or completely filling these holes with electrically conductive material (particularly copper) to form vias or any other through-hole connections. The filled holes can connect the entire stack or sub-stack (i.e., through-hole connections extending through multiple layers or the entire stack), or the filled holes can connect at least two electrically conductive layers, so-called vias. Similarly, optical interconnects can be formed through the various layers of the stack to accommodate an electro-optical circuit board (EOCB). In addition to one or more components that can be embedded in the printed circuit board, the printed circuit board can be specifically configured to accommodate one or more components on one surface or two opposite surfaces of the plate-like printed circuit board. The one or more components can be connected to the corresponding main surface by soldering. The dielectric portion of the PCB may include a resin with reinforcing fibers, such as glass fibers.

[0046] In the context of this application, the term "substrate" can particularly refer to a small component carrier, in particular an IC substrate. Relative to a PCB, an IC substrate can be a relatively small component carrier on which one or more components can be mounted and which can serve as a connection medium between one or more chips and another PCB. For example, an IC substrate can have approximately the same dimensions as the components (in particular electronic components) to be mounted on the substrate (for example, in the case of a chip-scale package (CSP)). More specifically, an IC substrate can be understood as a component carrier that is used for electrical connectors or power grids, as well as a component carrier that has connectors arranged horizontally and / or vertically, comparable to a printed circuit board (PCB) but with a relatively high density. Horizontal connectors are, for example, conductive pathways, while vertical connectors can be, for example, drilled holes. These horizontal and / or vertical connectors can be particularly arranged within the IC substrate and can be used to provide electrical, thermal, and / or mechanical connections between accommodated or unaccommodated components (e.g., bare wafers), in particular IC chips, and a printed circuit board or an intermediate printed circuit board. The dielectric part of the IC substrate can be made of a resin with reinforcing particles (such as reinforcing spheres, in particular glass spheres). In the context of the present application, a "substrate" in particular facilitates electrical connection and / or heat dissipation and / or provides mechanical strength. Therefore, in the context of the present application, the term "substrate" is particularly used as a synonym for "IC substrate". It must be noted that the term "substrate" in particular should not be confused with the term "base material" as commonly used in the context of wafers, in which context "base material" generally refers to the base material used in wafer manufacturing, which serves as the base material for building a device or circuit and forms a base layer for supporting the electronic or photonic structures integrated into the wafer. This is not the meaning of "substrate" in the context of the present application.

[0047] In the context of this application, the term "interposer" may particularly refer to a physical structure configured to bridge at least one electrical connection. The interposer may particularly be a physical interface layer structure. The interposer may particularly be configured to extend electrical connections to a wider spacing and / or bridge between different types of connections. The interposer may be made of various materials, including silicon, glass, or an organic substrate.

[0048] The substrate or interposer may in particular include or consist of a layer of at least one of the following: glass; silicon (Si) and / or a photosensitive or dry-etchable organic material, such as an epoxy-based stack material (e.g., an epoxy-based stack film); or a polymer compound (the polymer compound may or may not include photosensitive and / or heat-sensitive molecules), such as polyimide, polybenzoxazole.

[0049] In at least one embodiment, the component carrier can further comprise at least one inorganic layer structure, wherein the at least one inorganic layer structure can in particular be part of at least one stack of the component carrier.

[0050] In the context of the present application, the term "inorganic layer structure" may particularly refer to a layer structure comprising an inorganic material such as an inorganic compound. In particular, the dielectric material of the inorganic layer structure or even the entire inorganic layer structure may be made exclusively or at least approximately exclusively of an inorganic material. In another embodiment, the inorganic layer structure may include an inorganic dielectric material and also include another dielectric material. The inorganic compound may be a chemical compound lacking a carbon-hydrogen bond, or may be a chemical compound that is not an organic compound. In an example, the inorganic layer structure may include glass, such as silicon-based glass, and in particular, the inorganic layer structure may include solder lime glass, and / or borosilicate glass and / or aluminosilicate glass and / or lithium silicate glass and / or alkali-free glass. In another example, the inorganic layer structure may include a ceramic material, such as aluminum nitride and / or aluminum oxide and / or silicon nitride and / or boron nitride and / or tungsten-containing ceramic material. However, in another example, the inorganic layer structure may include semiconductor materials, such as silicon and / or germanium and / or silicon oxide and / or germanium oxide and / or silicon carbide and / or gallium nitride. In another embodiment, the inorganic layer structure may contain (elemental) metals and / or metal alloys, such as copper and / or tin and / or bronze. In yet another embodiment, the inorganic layer structure may include inorganic materials not listed in the examples mentioned above, such as: MoS2, CuGaO2, AgAlO2, LiGaTe2, AgInSe2, CuFeS2, BeO.

[0051] In at least one embodiment, particularly in a preferred embodiment, the first component and the second component are electrically connected to each other via the electrically conductive paste.

[0052] As a result, a direct electrical connection between the first component and the second component can be produced in a very simple manner within the component carrier, wherein in particular a very short and straight electrical connection can be produced with the advantages mentioned above.

[0053] In at least one embodiment, in particular in a preferred embodiment, at least the first component and the second component are directly connected and / or at least the first component and the second component are connected only via an (electrically conductive) paste.

[0054] In the context of the present application, the expression "directly and / or exclusively connected" may particularly denote a connection that is established without an intervening electrically conductive layer structure in between.

[0055] This allows the creation of a component carrier in which at least two components are electrically connected via the shortest possible electrical connection (via a straight connection). This electrical connection, in particular due to the short path length, allows the aforementioned advantages to be achieved. In particular, favorable electrical properties can be achieved. In some cases, for example, electrical losses, inductances, and parasitic effects can be reduced. By adjusting the design of the cavity, in particular its size and shape, and / or by selecting the electrically conductive paste, in particular its material properties, the thermal properties of the component carrier, in particular at least in the connection area of ​​the components, can be influenced and / or adjusted. Thus, for example, heat dissipation can be advantageously influenced, among other things.

[0056] As described above, at least one cavity of a component carrier according to the present invention can be created at least partially by mechanical manufacturing steps. For example, at least one cavity of a component carrier according to the present invention can be created at least partially by laser drilling and / or mechanical drilling. In particular, when a cavity is created at least partially by laser drilling and / or mechanical drilling, this can result in the cavity including at least partially tapered transverse walls. Thus, in at least one embodiment, the cavity can include tapered transverse walls.

[0057] In the context of the present application, the term "tapered" may particularly denote at least partially inclined with respect to the stacking direction and / or with respect to a main surface of at least one of the components defining the cavity.

[0058] In other words, this means that the tapering transverse wall may in particular be a wall which is at least partially inclined with respect to the stacking direction and / or with respect to a main surface of at least one of the components defining the cavity.

[0059] The inclination of the tapered transverse wall can be constant over the height of the cavity or can vary. Thus, in one embodiment of the component carrier according to the invention, the cavity comprising the tapered transverse wall can, in particular, be a cavity having at least partially an at least approximately trapezoidal shape in a cross-section taken in a plane parallel to the direction of stacking of the cavity. In another embodiment, the cavity comprising the tapered transverse wall can, in particular, be a cavity having at least partially an at least approximately hexagonal shape in a cross-section taken in a plane parallel to the direction of stacking of the cavity, preferably, the cavity comprising the tapered transverse wall can, in particular, be a cavity having at least partially an elongated or extended hexagonal shape in a cross-section taken in a plane parallel to the direction of stacking of the cavity.

[0060] This design of the component carrier allows providing a component carrier which has a smaller height and can be produced more easily.

[0061] In at least one embodiment, the cavity is also partially delimited in the transverse direction by at least one layer structure of the stack. The cavity can in particular be partially delimited by the same layer structure in which the cavity can be at least partially created, wherein the cavity can in particular be formed at least partially by a recess in the layer structure. The cavity can also be at least partially delimited by one or more different and independent layer structures surrounding the cavity.

[0062] In at least one embodiment, in particular in a preferred embodiment, in addition to being defined by components that partially delimit the cavity in particular in the stacking direction (in particular one from the top side and one from the bottom side), the cavity can also be partially delimited in particular by at least one layer structure of the stacking part. In particular, the cavity can also be partially delimited in the stacking direction and / or in the lateral direction by at least one layer structure of the stacking part. Preferably, the cavity can also be partially delimited in the stacking direction and / or in the lateral direction extending perpendicular to the stacking direction by at least one layer structure of the stacking part.

[0063] In other words, in at least one embodiment of the component carrier, the cavity can be partially delimited in the stacking direction by one of the main surfaces of the first component, by one of the main surfaces of the second component and by at least one layer structure of the stack, wherein the cavity can in particular be delimited in the stacking direction and / or in a lateral direction by the layer structure, in particular, the cavity can be delimited in the stacking direction and / or in a lateral direction extending perpendicular to the stacking direction by the layer structure.

[0064] This design of the component carrier allows providing a component carrier which has a smaller height and can be produced more easily.

[0065] In at least one embodiment, the cavity is partially delimited, in particular, by a first electrically insulating layer structure. In particular, the cavity may also be partially delimited by a plurality of insulating layer structures, which may in particular define the cavity as described above in a stacking direction and / or in a lateral direction, in particular, the plurality of insulating layer structures may define the cavity as described above in a stacking direction and / or in a lateral direction perpendicular to the stacking direction.

[0066] This design of the component carrier allows a very compact component carrier to be provided which has a small height and can be produced more easily.

[0067] In at least one embodiment, the cavity is completely delimited only by the first component, the second component, and the first electrically insulating layer structure, wherein the first component and the second component delimit the cavity in particular in the stacking direction, and the first insulating layer structure preferably delimits the cavity in the main extension direction of the component carrier and / or the component. The first insulating layer structure can in particular at least partially delimit the cavity in a direction perpendicular to the stacking direction.

[0068] This design allows to provide a very compact component carrier which has a small height and can also be manufactured very easily and very efficiently. However, in some cases, another design of the component carrier may be more advantageous, in which the cavity is not delimited solely by the first component, the second component and the first electrically insulating layer structure.

[0069] In at least one embodiment, particularly preferred embodiments, a component carrier, particularly a stack, may include at least one subcarrier. In the context of this application, the term "subcarrier" may particularly denote a structural element that supports the main carrier function of a component carrier. A subcarrier may form part of or a complete layer of a layer structure within the stack. A subcarrier may particularly have a specific function, particularly mechanical reinforcement of the component carrier.

[0070] In at least one embodiment, the component carrier includes a first subcarrier and a second subcarrier, which are stacked one above the other in a stacking direction. This can increase the design flexibility of the component carrier.

[0071] In at least one embodiment, in particular in a preferred embodiment, at least one component of the component carrier can be embedded (at least partially or completely) in a subcarrier, wherein in particular the first component and / or the second component can be at least partially embedded in the subcarrier. This design of the component carrier allows for a very compact component carrier that can be manufactured more easily and can also have advantageous mechanical properties.

[0072] In at least one embodiment, the first component is at least partially embedded in the first subcarrier, and the second component is at least partially embedded in the second subcarrier.

[0073] In at least one embodiment, in particular a preferred embodiment, at least one subcarrier can comprise a subcarrier main surface facing the cavity, wherein the cavity can also be partially delimited, in particular in the stacking direction, by the at least one subcarrier main surface.

[0074] This design of the component carrier allows a very compact component carrier to be provided, which can be produced more easily and can have advantageous mechanical properties.

[0075] In at least one embodiment, the first and second subcarrier each comprise a subcarrier main surface facing the cavity, wherein the cavity is particularly also partially delimited in the stacking direction by at least one of the subcarrier main surfaces.

[0076] In at least one embodiment, in particular in a preferred embodiment, the cavity can be partially delimited, in particular, by a subcarrier main surface of the first subcarrier and / or (preferably also) by a subcarrier main surface of the second subcarrier.

[0077] In at least one embodiment, in particular in a preferred embodiment, at least one component can be at least partially embedded in one of the sub-carriers so that a component main surface of the at least one component is exposed and thus faces the other sub-carrier, wherein the exposed component main surface can in particular limit the cavity.

[0078] This allows a direct electrical connection between the first component and the second component to be produced, wherein the component carrier can still be easily produced and can have advantageous mechanical properties.

[0079] In at least one embodiment, a first component is at least partially embedded in a first sub-carrier such that a component main surface of the first component is at least partially exposed and faces a second sub-carrier, wherein the exposed component main surface of the first component partially bounds the cavity, and wherein a second component is at least partially embedded in a second sub-carrier such that a component main surface of the second component is at least partially exposed and faces the first sub-carrier, wherein the exposed component main surface of the second sub-carrier partially bounds the cavity.

[0080] This design of the component carrier allows a very compact component carrier to be provided that can be manufactured more easily. This design allows in particular a component carrier to be provided that has a small height and components that are electrically connected along short electrical connection paths, since no unnecessary parts or structures are arranged between the two components.

[0081] In at least one embodiment, the first electrically insulating layer structure is an intermediate electrically insulating layer structure, or the first electrically insulating layer structure at least partially constitutes an intermediate electrically insulating layer structure, which is arranged between the first subcarrier and the second subcarrier in the stacking direction.

[0082] In the context of the present application, the term "intermediate" may particularly denote a layer structure within a stack that is neither the topmost nor the bottommost layer.

[0083] In particular, the necessary electrical insulation between the two components outside the cavity and / or the electrically conductive paste can thus be achieved in a simple and space-saving manner, respectively, by means of the intermediate electrically insulating layer structure.

[0084] In at least one embodiment, the intermediate electrically insulating layer structure comprises a recessed portion which at least partially delimits the cavity, in particular, the recessed portion at least partially delimits the cavity in a lateral direction, preferably, the recessed portion at least partially delimits the cavity in a direction perpendicular to the stacking direction.

[0085] In at least one embodiment, the cavity can be particularly completely bounded by the first component, the second component, and the first electrically insulating layer structure, and in particular, the cavity can be particularly completely bounded by the first component, the second component, and the intermediate electrically insulating layer structure. In other embodiments, the cavity can also be partially bounded by at least one other structure, and in particular, the cavity can also be partially bounded by at least one other layer structure, and preferably, the cavity can also be partially bounded by at least one other electrically insulating layer structure. In some embodiments, the cavity can also be partially bounded by at least one electrically conductive layer structure.

[0086] This allows providing a component carrier which comprises one or more of the advantages mentioned above and which can be flexibly adapted to a variety of use cases, in particular with regard to the layer structure and electrical connections required within the component carrier.

[0087] In at least one embodiment, in particular in a preferred embodiment, at least one sub-carrier may comprise a core structure layer, wherein the core structure layer may in particular comprise at least one cavity, preferably at least one component may be embedded in the at least one cavity, in particular at least one of the components partially delimits the cavity filled with the electrically conductive paste.

[0088] Therefore, in at least one embodiment, in particular in a preferred embodiment, at least one sub-carrier comprises a core structure layer comprising at least one cavity, wherein at least one component is embedded in the at least one cavity, preferably the first component or the second component is embedded in the at least one cavity.

[0089] In at least one embodiment, particularly in a preferred embodiment, the first subcarrier can include a first core structure layer comprising a first cavity, in particular, the first component being embedded in the first cavity. Alternatively or additionally, the second subcarrier can include a second core structure layer comprising a second cavity, in particular, the second component being embedded in the second cavity. Thus, in particular, the core structure layer can form a mechanically stiffened layer structure, or the core structure layer can be a mechanically stiffened layer structure. This allows at least one component to be embedded in a layer structure having a certain mechanical strength, thereby at least partially mechanically supporting and protecting the component.

[0090] In at least one embodiment, in particular a preferred embodiment, at least one subcarrier may include a first outer insulating layer structure, which may be arranged in particular on an outer side of the subcarrier, wherein the first outer insulating layer structure may preferably be arranged on an outer side of the subcarrier facing the cavity. Thus, the first outer insulating layer structure may in particular partially constitute the intermediate electrically insulating layer structure.

[0091] In at least one embodiment, at least one component is embedded in the sub-carrier such that a main surface of the component facing the cavity filled with the conductive paste is at a different (vertical) level in the stacking direction from a main surface of the core structure layer on the side of the sub-carrier facing the cavity and / or a main surface of the sub-carrier on the side facing the cavity. In other words, this means that in at least one embodiment, at least one component can be embedded in the sub-carrier such that a main surface of the at least one component facing the cavity is not flush with a main surface of the core structure layer and / or the sub-carrier on the side facing the cavity in which the component is embedded.

[0092] The main surface of the component can, in particular, protrude in the stacking direction from the vertical level of the main surface of the core structure layer and / or the subcarrier in which the component is embedded. This can be achieved, for example, by the component carrier having a height in the stacking direction that is greater than the layer thickness of the core structure layer and / or the subcarrier and / or by the component being arranged on a spacer layer structure, which is arranged in the cavity below the component and on the side of the component facing away from the part of the cavity filled with the electrically conductive paste.

[0093] Alternatively, the main surface of the component can be below the vertical level of the main surface of the core structure layer and / or the subcarrier in the stacking direction, in particular in the stacking direction. This can be achieved, for example, by the component carrier having a height in the stacking direction that is smaller than the layer thickness of the core structure layer and / or the subcarrier.

[0094] Even with a design in which the main surface of the component is not flush with the main surface of the core structure layer and / or not flush with the main surface of the sub-carrier on the side facing the cavity, the present invention still allows a correct connection of the component to be established at the connection surface of the component in a very efficient manner, since different vertical levels can be leveled, compensated and / or bridged, in particular by means of an electrically conductive paste.

[0095] Therefore, in at least one embodiment, at least one subcarrier comprises a first outer insulating layer structure which is arranged on an outer side of the subcarrier facing the cavity and partially constitutes the intermediate electrically insulating layer structure.

[0096] This allows a very compact component carrier to be provided.

[0097] In at least one embodiment, the first sub-carrier and the second sub-carrier may each include a first external insulation layer structure, wherein the first external insulation layer structures may each be arranged on the outer side of the sub-carrier facing the cavity, and each partially constitutes the intermediate electrical insulation layer structure, wherein at least one first external insulation layer structure may be arranged on the outer side of the core structure layer of the corresponding sub-carrier.

[0098] In an alternative embodiment, only the first subcarrier or the second subcarrier may comprise such a first outer insulation layer structure.Thus, the height of the component carriers, in particular the height of a respective stack of component carriers, may be further reduced.

[0099] In at least one embodiment, at least one sub-carrier may include a second outer insulating layer structure, which is particularly arranged on the opposite side of the sub-carrier, wherein, in the context of the present application, "on the opposite side" may particularly mean on the opposite side of the side on which the first insulating layer structure is arranged.

[0100] In some cases, such a second insulating layer structure may be particularly advantageous, in particular for realizing various (electrical) functions.

[0101] In at least one embodiment, a portion of the first external insulating layer structure and / or a portion of the second external insulating layer structure extends into the space between the component and the transverse walls of the core structure layer that delimit the component cavity, in particular, a portion of the first external insulating layer structure and / or a portion of the second external insulating layer structure extends into the space between the component and the transverse walls of the core structure layer that delimit the component cavity in the transverse direction, wherein the space to which the portion can extend is in particular a transverse space formed in a direction perpendicular to the stacking direction between the embedded or to-be-embedded component and the transverse walls of the core structure layer that delimit the cavity in the transverse direction in which the component is embedded or to-be-embedded.

[0102] By means of said portions, the space in the cavity between the core structure layer and the component embedded or to be embedded can be filled in an easy manner to ensure sufficient embedding of the component.

[0103] In at least one embodiment, at least one of the outer insulation layer structures is in contact with a major surface of the core structure layer, with one major surface of the component and with another outer insulation layer.

[0104] In particular, two outer insulation layers (ie, a first outer insulation layer and a second outer insulation layer) may be in contact with one main surface of the core structure layer, in contact with one component main surface, and in contact with another outer insulation layer.

[0105] In at least one embodiment, in particular in a preferred embodiment, the first and second outer insulation layers are in contact with one main surface of the core structure layer, with one main surface of the component, and with the other outer insulation layer, wherein this can be achieved in particular by at least one portion extending into the space between the component and the transverse wall of the core structure layer. In particular, the contact between the two outer insulation layer structures can be established by at least one portion extending into the transverse space between the component and the transverse wall of the core structure layer.

[0106] This allows for sufficient embedding of at least one component while easily achieving the required electrical insulation.

[0107] In at least one embodiment, at least one component is flush with one of the main surfaces of the core structure layer, so that one of the first external insulation layer structure and the second external insulation layer structure is in contact with the main surface of the component and the main surface of the core structure layer, thereby contacting at least two surfaces that are flush with each other, in particular the main surface of the component and the surface of the corresponding core structure layer.

[0108] In a preferred embodiment, at least one main surface of the component (in particular, the exposed main surface), or the external material (surface) of the component's pad is flush with one of the main surfaces of the core structure layer, so that one of the first external insulating layer structure and the second external insulating layer structure is in contact with the component main surface and the main surface of the core structure layer, thereby contacting at least two surfaces that are flush with each other, in particular the component main surface and the surface of the corresponding core structure layer.

[0109] This allows a very compact component carrier to be provided while ensuring reliable integration of the components.

[0110] In at least one embodiment, the portion of one of the first and second external insulation layer structures extends into the space between the component and the transverse wall of the core structure layer, which delimits the component cavity in particular in the transverse direction, so that the portion is flush with at least one main surface of the component and one of the main surfaces of the core structure layer, wherein, in particular, the other of the first and second external insulation layer structures is in contact with the portion, wherein the main surface of the component and the main surface of the core structure layer are flush with each other.

[0111] In some embodiments, this may result in a flat surface of the first outer insulating layer structure facing the exposed component. In other embodiments, the surface of the first outer insulating layer structure facing the exposed component may be uneven, for example due to the presence of electrically conductive structures on the surface of the core. In this case, the surface of the first outer insulating layer structure facing the exposed component may specifically follow the contour defined by the core structure layer and the overlying conductive structures.

[0112] In at least one embodiment, in particular, the component main surface, the surface of the corresponding core structure layer and the portion extending into the lateral space are flush with one another.

[0113] In at least one embodiment, the main surface of the component, the surface of the corresponding core structure layer and the portion extending into the lateral space can form a further inner surface of the stack facing another component, in particular a further inner surface of the stack facing another sub-carrier including another component.

[0114] This design allows easy production of the component carrier, in particular advantageous embedding and electrical connection of the components and at the same time achieving the required electrical insulation.

[0115] In at least one embodiment, the stack includes at least a first sub-stack and a second sub-stack, the first sub-stack and the second sub-stack being stacked one above the other in a stacking direction.

[0116] This allows providing a component carrier that can be produced in a very simple manner, wherein in at least one embodiment the stack of component carriers according to the invention is formed by placing a first sub-stack and a second sub-stack one above the other in the stacking direction.

[0117] Thus, at least one sub-stack may include at least one component, in particular, at least one sub-stack may include the first component or the second component.

[0118] In at least one embodiment, and particularly preferred embodiments, the first sub-stack includes the first component and the second sub-stack includes the second component.

[0119] This allows very easy production of the component carrier, in particular very easy formation of a stack having a cavity between the first component and the second component which is filled with an electrically conductive paste and is at least partially delimited by the first component and the second component.

[0120] In at least one embodiment, at least one sub-stack further includes a portion of the cavity located between the first component and the second component in the stacking direction.

[0121] In a preferred embodiment, the first sub-stack comprises a first portion of the cavity and the second sub-stack comprises a second portion of the cavity, wherein the entire cavity is in particular formed by stacking the first and second sub-stacks on top of each other.

[0122] This design allows to fill the cavity with the electrically conductive paste in a very easy manner when forming the stack, and thereby also to establish an electrical (inter)connection between the first component and the second component in a very easy manner.

[0123] In at least one embodiment, the first sub-stack further comprises a first sub-carrier, and wherein the second sub-stack further comprises a second sub-carrier, wherein, in particular, the first component is at least partially embedded in the first sub-carrier, and wherein, in particular, the second component is at least partially embedded in the second sub-carrier.

[0124] This design allows very efficient and easy production of the component carrier according to the invention with the advantages described above.

[0125] In at least one embodiment, at least one sub-stack further comprises at least a first outer insulating layer structure, said first outer insulating layer structure in particular forming at least a part of the intermediate layer structure.

[0126] The provision of at least one sub-stack comprising at least a first outer insulating layer structure, which in particular forms at least a part of an intermediate layer structure of the final stack, allows for a very simple integration of an (intermediate) insulating layer structure between the corresponding component layers. Furthermore, also in a very simple manner, the cavity filled with the electrically conductive paste can be electrically insulated at least in the lateral direction by the intermediate insulating layer structure, which is essential for the proper functioning of the electrical connection between the first and second components achieved via the electrically conductive paste.

[0127] In at least one embodiment, the first sub-stack and the second sub-stack each include a major surface facing each other, and in particular, the first sub-stack and the second sub-stack are connected via their major surfaces facing each other.

[0128] This design of the component carrier allows a direct electrical connection between the first and second components to be established in a very simple manner, in particular with a very short electrical connection path length, resulting in advantageous electrical properties.

[0129] In order to establish at least one additional electrical connection of the component carrier, for example, at least one additional electrical connection to an external part and / or at least one additional electrical connection to at least one of the components, for example, at least one additional electrical connection to an external part and / or another internal part of the component carrier, the component carrier may further comprise at least one electrically conductive structure, which may in particular be part of at least one sub-stack, in particular part of at least one sub-carrier. Thus, the at least one electrically conductive structure may in particular be arranged on and / or in a core structure layer of the respective sub-carrier, wherein the electrically conductive structure may in particular be plated. The at least one electrically conductive structure may be a layer (i.e., an essentially two-dimensional structure) or a conductive structure, for example a three-dimensional structure, such as a through-hole. For the conductive structure to function properly, preferably at least one electrically insulating layer structure, in particular at least one external insulating layer structure, is in contact with the electrically conductive structure, wherein the insulating layer structure preferably extends to the conductive structure for contact.

[0130] In at least one embodiment, in particular a preferred embodiment, at least one subcarrier comprises at least one plated electrically conductive structure, which is arranged on and / or in the core structure layer of the subcarrier for producing an electrical connection between at least one first element and at least one second element of the component carrier, wherein, preferably, the first outer insulating layer structure of the core structure layer is in contact with the electrically conductive structure and the core structure layer.

[0131] This allows providing a component carrier in a simple manner, which is configured to establish an electrical connection between at least a first element and at least a second element of the component carrier, wherein the second element can be an internal element of the component carrier or an external element that is not part of the component.

[0132] This allows a flexible design of the component carrier and provides a component carrier that is configured for a wide range of applications, wherein the component carrier can be particularly flexibly adapted to different applications.

[0133] In at least one embodiment, each sub-stack, in particular each sub-carrier of the sub-stack, comprises at least one plated electrically conductive structure, wherein in particular the sub-stacks, preferably the sub-carriers, are connected to each other via one or more plated electrically conductive structures. The at least one plated electrically conductive structure may be a three-dimensional plated structure, such as a via.

[0134] Thereby, an advantageous electrical connection between the sub-stacks, in particular between the sub-carriers, may be provided.

[0135] In some cases, plated connections may have advantages over electrical connections established with electrically conductive pastes.

[0136] However, in at least one embodiment of the component carrier according to the invention, the component carrier can also comprise at least one further electrical connection which is established via an electrically conductive paste.

[0137] In at least one embodiment, in particular in a preferred embodiment, the component carrier further comprises at least one alignment structure for aligning at least two parts of the component carrier relative to each other, in particular during production, in order to correctly produce the component carrier.

[0138] By means of such an alignment structure, for example, the first component and the second component can be aligned relative to each other when placed on top of each other to ensure sufficient overlap to establish a straight and direct electrical connection, particularly in the second direction.

[0139] In at least one embodiment, the component carrier further comprises at least one alignment structure, which is at least partially arranged on at least one sub-carrier and / or in at least one sub-carrier, in particular, the at least one alignment structure is at least partially arranged on at least one sub-stack and / or in at least one sub-stack.

[0140] Providing at least one alignment structure on and / or in at least one sub-stack, in particular on and / or in at least one sub-carrier, allows for improved alignment.

[0141] In at least one embodiment, at least one alignment structure can include a hole, a conductive pattern, and / or a pad, or a combination thereof, or a hole, a conductive pattern, and / or a pad, or a combination thereof. In another embodiment, particularly as an alternative to or in addition to the aforementioned options, the alignment structure can include or be formed from a plurality of holes or recesses, and / or a non-conductive pattern, or a combination thereof. To provide a compact component carrier, particularly one with a low height, thin alignment structures and / or alignment structures with a low height and / or alignment structures that are embedded later and do not increase the overall height of the stack or component carrier are preferred. Preferably, at least one structure already present in the component carrier also serves as an alignment structure. In particular, conductive and / or electrically conductive structures, traces, pads, and / or shape codes can serve as alignment structures in addition to their primary function. So-called "fiducial marks" can also be used for alignment.

[0142] This allows providing the at least one alignment structure without adding any further components to the component carrier, which is advantageous, in particular in terms of miniaturization.

[0143] In at least one embodiment, at least one alignment structure is configured to: align the intermediate layer; and / or align the paste; and / or align the sub-carriers; and / or align the sub-stacks; and / or align the combination of the intermediate layer, paste, sub-carriers and sub-stacks; and / or align at least two of the intermediate layer, paste, sub-carriers and sub-stacks relative to each other.

[0144] This makes it possible to achieve an advantageous alignment in a simple manner.

[0145] The component carrier may comprise one or more alignment structures, in particular the component carrier may comprise at least one alignment structure for each process step requiring alignment. This allows efficient and precise production of the component carrier.

[0146] In at least one embodiment, at least two components are arranged one above the other in the component carrier, in particular at least a first component and a second component can be arranged one above the other and with a defined lateral displacement relative to one another in the lateral direction.

[0147] In the context of the present application, the term "lateral offset" may denote the distance in the lateral direction between the geometric centers of two elements in the lateral direction, in particular the distance in the lateral direction between the geometric centers of two elements of a component carrier that are arranged one above the other.

[0148] In at least one embodiment, at least one component can be further electrically connected to another electrically conductive structure on the side of the main surface of the at least one component facing the cavity. In particular, at least one component can be further electrically connected to an electrically conductive structure provided on and / or in a core structure layer of a subcarrier facing the main surface of the component on the side of the main surface of the at least one component facing the cavity. For example, the component can be electrically connected to a via and, for example, electrically connected via the via to an electrically conductive structure located on the main surface of the subcarrier and / or the core structure layer facing the component.

[0149] This allows for additional connections of the component to other components on the side of the component facing the cavity. Thus, the design flexibility of the component carrier and / or the connection density of the component carrier can be increased. This can enhance miniaturization.

[0150] In at least one embodiment, the component carrier may further comprise at least a third component.

[0151] In at least one embodiment, the third component is also embedded in the stack, and the third component is stacked with the first component and / or the second component in the stacking direction and has a cavity between the third component and the first component and / or the second component, in particular, an additional or separate cavity between the third component and the first component and / or the second component, wherein the third component in particular also includes a component main surface facing the cavity and partially delimiting the cavity in the stacking direction, and wherein the cavity is in particular filled with an electrically conductive paste.

[0152] This allows the first and / or second component to be arranged with other components within a component carrier and / or within a stack of component carriers in a very compact and space-saving manner, and / or the first and / or second component to be connected with other elements within a component carrier and / or within a stack of component carriers. This increases the design flexibility and / or functionality of the component carrier, particularly in a very space-saving manner. In some embodiments, the connection density can also be increased, which can enhance miniaturization.

[0153] In at least one embodiment, the third component is electrically connected to at least one of the first and second components. Specifically, the third component is electrically connected to at least one of the first and second components via corresponding cavities filled with an electrically conductive paste. This allows for a very compact and space-saving way to connect multiple components within a component carrier and / or within a stack of component carriers. This increases the design flexibility and / or functionality of the component carrier, particularly in a very space-saving manner. In some embodiments, this also increases the connection density, which can enhance miniaturization.

[0154] In at least one embodiment, a third component can be embedded in the same structural layer as the first or second component. In particular, the third component can be embedded in the same subcarrier as the first or second component. The third component can, in particular, be embedded in the same subcarrier and / or core structure layer as components not connected to the third component. This allows for a very compact and space-saving arrangement of multiple components within a component carrier and / or within a stack of component carriers. This increases the design flexibility and / or functionality of the component carrier, in particular in a very space-saving manner. In some embodiments, the connection density can also be increased, which can enhance miniaturization.

[0155] In at least one embodiment, the first component, the second component and the third component can be electrically connected to each other, wherein one of these components can in particular serve as a bridge and one of these components can in particular be configured to bridge at least one signal from one component to another component, in particular, can in particular be configured to bridge at least one signal from one of the other two components to the other of the two components. This allows a plurality of components (at least three components) to be arranged and connected within a component carrier and / or within a stack of component carriers in a very compact and space-saving manner. Thus, the design flexibility and / or functionality of the component carrier can be increased, in particular, the design flexibility and / or functionality of the component carrier can be increased in a very space-saving manner. In some embodiments, the connection density can also be increased. This can further enhance miniaturization.

[0156] The component carrier according to the invention allows for the embedding of multiple components in a particularly compact and space-saving manner, with a high degree of flexibility in the arrangement of the components within the component carrier and / or within the stack, and with a large number of possible connection possibilities. At least in some embodiments, the connection density can be increased, and miniaturization can be enhanced.

[0157] The component carrier according to the present invention can also accommodate components of different sizes and / or different types. In at least one embodiment, at least two components can be of different types, thereby providing different functions. This increases the design flexibility and / or functionality of the component carrier.

[0158] In at least one embodiment, at least two components can have the same or different lengths in the transverse direction, and / or at least two components can have the same or different heights in the transverse direction. In particular, at least two components can have the same or different heights in a direction perpendicular to the stacking direction. The component carrier allows for the embedding of components of varying sizes. This increases the design flexibility and / or functionality of the component carrier, particularly in a very space-saving manner. In some embodiments, the connection density can also be increased, which can enhance miniaturization.

[0159] In at least one embodiment, the first component and the second component each include a pad, the pad particularly facing a cavity located between the components, the cavity being filled with an electrically conductive paste, wherein each pad includes a pad area having a pad area size, wherein the pads are arranged one above the other in a stacking direction and opposite one another so as to overlap, and wherein the pads are aligned with one another such that the pad areas of the pads overlap by at least 50% of the pad area size of the smaller of the overlapping pads. This ensures in a very simple manner that a reliable mechanical and / or electrical connection is established between the pads and, therefore, between the components.

[0160] This allows the first component and / or the second component to be connected to another component in a very compact and space-saving manner. This increases the design flexibility and / or functionality of the component carrier, particularly in a very space-saving manner. In some embodiments, the connection density can also be increased, which can enhance miniaturization.

[0161] In at least one embodiment, the first component and the second component each include a pad, which is arranged above each other and opposite to each other in the stacking direction so as to overlap, in particular with respect to a transverse direction perpendicular to the stacking direction, wherein the pads are aligned with each other, in particular, the pads are aligned with each other by at least one alignment structure.

[0162] In the context of the present application, the term "pad" may particularly denote a small, flat structure configured to serve as a contact point for replacing or electrically connecting at least one component. Such a pad may particularly comprise or be made of copper to ensure good electrical conductivity. The pad may particularly be plated with solder or a similar metal in order to solder at least one component to the pad, thereby establishing an electrical connection to the pad.

[0163] In particular, the pads (and / or other similar structures of the component arranged to establish a connection, in particular an electrical connection, to the component) are aligned so that the deviation from the ideal overlap (i.e. a lateral shift or offset, in particular a lateral shift or offset in a direction perpendicular to the stacking direction) does not exceed defined limits.

[0164] The limit can in particular be defined as a percentage relative to a size, in particular the limit can be defined as a percentage relative to a size or a lateral extension of the connecting structure, for example a percentage relative to a pad size in a lateral direction (i.e. in particular perpendicular to the stacking direction). Preferably, the smallest of the corresponding overlapping connecting structures defines the reference size. The (permissible) deviation (i.e. the permissible lateral offset) of the pads (or the corresponding connecting structures) stacked one above the other can in particular be in the range of 0.001% to 20% based on the minimum extension of the overlapping parts in the lateral direction. Preferably, the deviation is in the range of 0.001% to 10% based on the minimum extension of the overlapping parts in the lateral direction, more preferably in the range of 0.001% to 5% based on the minimum extension of the overlapping parts in the lateral direction, most preferably in the range of 0.001% to 2% based on the minimum extension of the overlapping parts in the lateral direction. In other words, this means that if the minimum extension of the first pad and the second component in the lateral direction, in particular in the lateral direction perpendicular to the stacking direction, is, for example, 150 μm, then when the allowed deviation (offset) is 10%, the maximum allowed lateral offset between the first pad and the second pad, in particular the maximum allowed lateral shift of the geometric center point of the first pad and the second pad in the lateral direction, can be 15 μm to establish a correct electrical connection.

[0165] However, in some cases a maximum deviation of 60 μm, 30 μm, 10 μm or even 5 μm may be more appropriate than the maximum deviation indicated in percentage as defined above.

[0166] It must be noted that the deviation or lateral offset between two connection pads at different vertical levels - which must not be exceeded to ensure a correct electrical connection between the pads - must not be confused with the lateral offset of the components to which the pads belong. For example, two components can be arranged with a lateral offset of 100 μm; however, the connection pads of the two components must be arranged on the respective components and relative to each other to ensure that the pads overlap correctly within a permissible deviation or lateral offset of, for example, 10 μm between the pads. This can be achieved by correctly positioning the pads on the components, which can be achieved by combining or taking into account the lateral offset of the respective components, if necessary.

[0167] This enables a direct connection of the first component and the second component to be established, in particular a straight direct connection of the first component and the second component, preferably an at least substantially shortest possible direct and straight connection of the first component and the second component in the stacking direction.

[0168] In at least one embodiment, the first component and the second component are each at least partially embedded in a sub-stack, in particular, the first component and the second component are each at least partially embedded in a sub-carrier, and the sub-stacks of the stack, in particular the corresponding sub-carriers, are arranged one above the other in the stacking direction and are in particular arranged relative to each other so that the first component and the second component, in particular the pads of the first component and the second component are facing each other and more in particular so that the first component and the second component, in particular the pads of the first component and the second component, at least partially overlap in the stacking direction, preferably to allow a connection between the components in the stacking direction to be established, wherein the first component and the second component, in particular the pads of the first component and the second component, can be aligned with each other, in particular by at least one alignment structure.

[0169] In this way, an advantageous component carrier can be provided. Additionally or alternatively, this can ensure a short distance between the first component and the second component, thereby achieving better electronic and thermal properties, in particular reduced electrical losses and / or improved heat dissipation.

[0170] In at least one embodiment, at least one of the first outer insulating layer structures and / or the intermediate electrically insulating layer structure comprises a plurality of layer structures, in particular exactly two layer structures, in particular at least one of the first outer insulating layer structures and / or the intermediate electrically insulating layer structure at least partially delimits a cavity filled with an electrically conductive paste.

[0171] In this way, a very compact component carrier can be provided which has a small number of layers but still performs an adequate function.

[0172] In at least one embodiment, at least two layer structures of the first external insulating layer structure and / or the intermediate electrical insulating layer structure are at least partially in contact with each other along the contact surface. Optionally, at least two layer structures of the first external insulating layer structure and / or the intermediate electrical insulating layer structure are completely in contact with each other along the contact surface, wherein the at least two layer structures are particularly at least partially connected to each other along the contact surface.

[0173] In this way, a very compact component carrier can be provided which has a small number of layers but still performs an adequate function.

[0174] In at least one embodiment, at least one electrically conductive structure of the component carrier is arranged at the contact surface, in particular between the two layers, preferably in the contact region.

[0175] Thus, a component carrier which is configured to establish at least one further internal connection and / or at least one external connection can be provided in an easy manner.

[0176] In at least one embodiment, at least one electrically conductive structure partially delimits the cavity, in particular a conductive layer structure arranged on an exposed main surface of the component facing the cavity partially delimits the cavity.

[0177] Such a design allows for providing an advantageous component carrier and / or for efficiently producing an advantageous component carrier.

[0178] In at least one embodiment, at least one electrically conductive layer structure is electrically connected to at least one pad of the first component or to at least one pad of the second component, in particular, at least one electrically conductive layer structure is electrically connected to at least one pad of the first component or to at least one pad of the second component via a conductive paste, but preferably, the at least one electrically conductive layer structure is not electrically connected to any pad of the other component.

[0179] This may bring the advantage of selectively establishing a connection for one of the components.

[0180] In at least one embodiment, at least one electrically conductive layer structure is arranged such that it contacts the conductive paste at lateral sides of the at least one electrically conductive layer structure and / or penetrates into the conductive paste from lateral sides of the cavity.

[0181] This may bring advantages of having higher design flexibility and electrically connecting only one component, in particular selectively connecting only one component.

[0182] In at least one embodiment, nanowires are arranged on a main surface of the first component and / or a main surface of the second component. The nanowires may also be arranged on a third component or other parts of the component carrier.

[0183] In the context of the present application, the term "nanowire" may particularly denote a group of wires having a wire diameter in the nanometer range, wherein the wires may be arranged in a structured, in particular regularly, or the wires may be arranged in an unstructured, in particular irregularly or chaotically. The nanowires may particularly comprise metal atoms, such as copper and / or silver, silicon or other materials and / or combinations thereof. The nanowires may preferably be configured to achieve electrical conductivity and / or electrical conduction. Due to their nanoscale size, the nanowires generally have a high surface-to-volume ratio, which may significantly influence the physical properties of the nanowires, in particular advantageously.

[0184] By means of the nanowires, better adhesion and / or electrical conductivity between the component and the paste can be achieved.

[0185] In at least one embodiment, in addition to or as an alternative to providing nanowires on a major surface of at least one component, nanowires may be provided on one or more other surfaces of the stack (as long as this does not have disadvantages and, for example, does not cause a short circuit).

[0186] In at least one embodiment, in addition to being filled with the electrically conductive paste, the cavity is also partially filled with other materials, in particular, the cavity is also partially filled with solder material and / or at least one spacer, for example, the cavity is also partially filled with solder material, and / or one or more copper blocks or one or more ceramic blocks.

[0187] This, in particular the provision of at least one spacer between components, can have the advantage of providing a component carrier with a constant and / or predetermined distance between the components. For example, the use of copper blocks can also enhance the heat transfer between the components and thus enhance the heat dissipation capacity of the component carrier.

[0188] This design of the component carrier according to the invention not only allows providing a component carrier with a constant distance between the components located therein, but also allows component carriers with defined distances between components to be produced reliably and in a very simple manner.

[0189] In at least one embodiment, the component carrier comprises at least one further cavity, which is also filled with an electrically conductive paste, which is electrically connected at least to the conductive layer structure and / or the two components and / or the two sub-carriers and / or the two sub-stacks to one another.

[0190] The electrically conductive paste that can be used to fill the one further cavity can in particular be the same or a different conductive paste than the electrically conductive paste used to fill the cavity between the first component and the second component.

[0191] By filling the at least one further cavity with an electrically conductive paste, further electrical interconnections within the component carrier can be established in a very simple manner.

[0192] In at least one embodiment, at least one cavity of the component carrier is filled with a solder paste and / or a sintering paste. The solder paste and / or the sintering paste may in particular comprise electrically conductive particles in the range of 500 nm to 30 μm.

[0193] In at least one embodiment, the electrically conductive paste may include copper, tin, silver, and / or bismuth.

[0194] In at least one embodiment, and particularly in a preferred embodiment, at least one cavity may be filled with a lead-free paste, and in particular, at least one cavity may be filled with a lead-free paste such as that of Ormet Circuits, Inc. 701 etc. filling. 701 electrically conductive paste, for example, is specifically designed to fill microvia structures, thereby creating Z-axis interconnects between multiple layers in packages and component carriers. By using this paste, yields can be increased and product manufacturing time can be reduced, providing an effective solution for creating interlayer connections.

[0195] In at least one embodiment, particularly in another preferred embodiment, alternatively or additionally, at least one cavity can be filled with an electrically conductive paste, for example, at least one cavity can be filled with "LF-371" paste from Copprint. The LF-371 paste is a screen-printed conductive copper paste for printing onto FR4, glass, and aluminum substrates, in particular, the LF-371 paste is a screen-printed conductive copper paste for printing onto FR4, glass, and aluminum substrates by thick screen printing.

[0196] The two conductive pastes mentioned here by way of example have advantageous properties with respect to the present invention, in particular advantageous viscosity, advantageous curing / sintering behavior and advantageous electrical conductivity.

[0197] Of course, one or more other suitable electrically conductive pastes may also be used, in particular, a paste having properties substantially identical or similar to those of the two pastes mentioned above as examples may also be used.

[0198] The method for manufacturing a component carrier according to the second aspect of the present invention comprises at least the following steps:

[0199] a) providing a first component and a second component, each component comprising a component major surface,

[0200] b) forming a stack having a stacking direction and comprising at least one electrically insulating layer structure and at least one electrically conductive layer structure, wherein forming the stack comprises:

[0201] The first component and the second component are embedded one above the other in the stacking direction with a cavity between the first component and the second component, and the main surfaces of the first component and the second component face the cavity and partially delimit the cavity in the stacking direction, and

[0202] filling the cavity with an electrically conductive paste; and

[0203] b) Providing a component carrier with the formed stack.

[0204] The method according to the second aspect of the present invention allows for thinner stacks with more than one component layer. This method allows for the production of component carriers with a reduced height and, therefore, very compact component carriers, thereby improving miniaturization, particularly of electronic packages comprising at least one component carrier. In particular, embedded packages can be further miniaturized.

[0205] Furthermore, the method according to the invention makes it possible to easily establish direct and straight electrical connections with short path lengths between components, in particular between embedded components stacked in a component carrier, wherein the electrical connection between at least two components can be established in particular via an electrically conductive paste used to fill the cavity between the components during production. The method according to the invention also makes it possible to establish reliable vertical or Z-axis interconnections, in particular direct and straight interconnections that are as short as possible, between components arranged one above the other in different layers.

[0206] In summary, the method according to the invention allows further miniaturization while offering a high degree of flexibility in adapting to various applications.

[0207] The stack preferably comprises a plurality of layer structures, in particular the stack comprises at least one electrically insulating layer and at least one electrically conductive layer structure.

[0208] In order to easily establish an electrical connection between the first component and the second component, preferably an electrical connection between the first component and the second component in a stacking direction (which may be a vertical direction), and in particular to establish a direct electrical connection between the first component and the second component, preferably a direct electrical connection between the first component and the second component in a stacking direction (which may be a vertical direction), the first component and the second component can be arranged in particular in a stack such that the first component and the second component ultimately at least partially overlap each other when viewed from above. The first component and the second component can also be arranged so as to completely overlap.

[0209] The first component and / or the second component may in particular comprise at least one electrically conductive structure, for example at least one pad, which in particular faces the cavity, wherein, in a preferred embodiment, these components are arranged relative to one another such that at least the respective electrically conductive structures (for example the pads) sufficiently overlap one another, seen in top view, to establish an electrical connection.

[0210] The major surfaces of the first and second components that bound the cavity between them can have identical surface shapes. However, this is not mandatory; alternatively, the major surfaces of the first and second components that bound the cavity between them can have different surface shapes and dimensions. Only a certain degree of overlap is required to establish an electrical connection. The smaller the lateral offset, the straighter the electrical connection that can be established. The straighter and more direct the electrical connection that can be established in the stacking direction, the shorter the electrical path length and, consequently, the better the electrical performance of the electrical connection.

[0211] In a preferred embodiment, the first component and the second component are arranged in the stack, in particular embedded in the stack, so that a direct electrical connection between the first component and the second component in the stacking direction, preferably in the vertical direction, can be established by an electrically conductive paste filled in a cavity at least partially delimited by the first component and the second component.

[0212] In at least one embodiment, the first component and the second component are electrically connected to each other via the electrically conductive paste.

[0213] Thus, a direct electrical connection between the first component and the second component can be established in a very easy manner within the component carrier, wherein, in particular, a very short and straight electrical connection can be established with the advantages mentioned above.

[0214] In at least one embodiment, forming the stack may include at least one of the following steps, and preferably all of the following steps:

[0215] forming a first sub-stack comprising a first component and a first portion of the cavity to be filled with an electrically conductive paste, wherein the first component is at least partially embedded in the first sub-stack,

[0216] forming a second sub-stack comprising a second component and a second portion of the cavity to be filled with the electrically conductive paste, wherein the second component is at least partially embedded in the second sub-stack,

[0217] filling the first portion of the cavity and / or the second portion of the cavity with an electrically conductive paste, and

[0218] The first sub-stack and the second sub-stack are arranged one above the other in the stacking direction, and the first part of the cavity and the second part of the cavity are facing each other, thereby forming a cavity located between the first part of the first part of the cavity of the first sub-stack and the second part of the second part of the cavity of the second sub-stack, which cavity is particularly a common cavity.

[0219] Thus, a stack for the component carrier according to the invention can be formed in a very easy and efficient manner.

[0220] Before arranging the first sub-stack and the second sub-stack above each other in the stacking direction, in particular the first part of the cavity and / or the second part of the cavity is in particular filled with an electrically conductive paste so that the (resulting common) cavity is completely filled with the electrically conductive paste.

[0221] The first portion of the cavity and the second portion of the cavity may in particular be slightly overfilled with conductive paste to ensure complete filling of the (common) cavity. The electrically conductive paste may in particular be slightly squeezed out, in particular in the region of the parting line or separating surface between the first and second sub-stacks.

[0222] In at least one embodiment, forming the first sub-stack and / or the second sub-stack may include at least one of the following steps, and preferably all of the following steps:

[0223] providing a first subcarrier and / or a second subcarrier, in particular, the first subcarrier and / or the second subcarrier comprising a core structure,

[0224] forming a cavity in the first subcarrier and / or the second subcarrier for arranging the first component and / or the second component respectively,

[0225] embedding the first component and / or the second component at least partially in the respective subcarrier and in the respective cavity, and

[0226] A portion of a (common) cavity is formed in each sub-stack, the cavity being configured to be filled with an electrically conductive paste, wherein, in particular, a first portion of the (common) cavity is formed in the first sub-stack and / or a second portion of the (common) cavity is formed in the second sub-stack.

[0227] This allows to form the stack in a very easy and effective manner. Additionally or alternatively, this can ensure reliable mechanical and / or electrical connections between the various components.

[0228] In at least one embodiment, embedding the first component and / or the second component in the respective sub-stack may include at least one of the following steps, and preferably all of the following steps:

[0229] providing at least one temporary carrier layer structure,

[0230] providing respective components on said temporary carrier layer structure in respective cavities of respective subcarriers,

[0231] embedding the component by using an electrically insulating material, wherein embedding in particular comprises providing an insulating layer structure, in particular on the core layer structure of the respective subcarrier on the opposite side of the temporary carrier layer structure, and

[0232] The temporary carrier layer structure is removed.

[0233] The use of a temporary carrier layer structure can increase the mechanical stability during the formation of the stack, wherein this can in particular result in more precise sub-carriers and more precise sub-stacks. The sequence of the method steps described above is in particular a preferred sequence, wherein the steps of providing at least one temporary carrier layer structure, providing the respective component on the temporary carrier layer structure in the respective cavity of the respective sub-carrier, embedding the component by using an electrically insulating material, and removing the temporary carrier layer structure are in particular performed successively in this sequence, i.e. the step of providing at least one temporary carrier layer structure is performed first, then the step of providing the respective component on the temporary carrier layer structure in the respective cavity of the respective sub-carrier is performed, then the embedding step is performed, and then the removal step is performed.

[0234] In some embodiments, the removal of the temporary carrier layer structure can be omitted. Thus, this initially "temporary" carrier layer structure becomes the permanent carrier layer structure. However, the advantage of removing the (temporary) carrier layer structure is that a component carrier having a smaller height can be provided compared to a component carrier having at least one permanent carrier layer structure. In contrast, retaining the carrier layer structure can allow for a component carrier having greater mechanical strength, in particular greater mechanical rigidity or dimensional stability. This can also be an advantage in some cases. Which one is preferred depends on the use and / or application of the component carrier.

[0235] In at least one embodiment, at least a portion of the (common) cavity is formed by providing a recess in the insulating layer structure constituting the stack.

[0236] Such a recess can in particular be formed or created by a mechanical process, for example, such a recess can be formed or created by drilling or milling, in particular, such a recess can be formed or created by laser drilling or mechanical drilling. In at least one embodiment, in particular in a preferred embodiment of the method according to the invention, a first portion of the (common) cavity is provided by a recess in the first outer layer structure of the first sub-stack, and / or a second portion of the (common) cavity is provided by a recess in the first outer layer structure of the second sub-stack, wherein at least one recess is preferably formed by laser drilling or mechanical drilling. Thus, at least one recess can comprise a tapered transverse wall.

[0237] In an advantageous embodiment, the at least one recess can be created only after pre-curing of the corresponding layer structure forming the recess.

[0238] Thus, the layer structure can be provided in a state with sufficient rigidity for mechanical processing, in particular for laser drilling or mechanical drilling to create at least one recess, while through a subsequent lamination process, appropriate and advantageous bonding with a corresponding layer structure of another sub-stack, in particular another sub-stack, can still be achieved.

[0239] In at least one embodiment, wherein the at least one first outer layer structure is in a pre-cured state when the first sub-stack and the second sub-stack are arranged one above the other.

[0240] This allows for a proper and advantageous joining between the sub-stacks, in particular between the corresponding layer structures of the sub-stacks, in particular by a subsequent lamination process.

[0241] For advantageous and efficient production of the component carrier, the at least one first outer layer structure may comprise a prepreg or may be produced from a prepreg.

[0242] In at least one embodiment, after the first sub-stack and the second sub-stack are arranged one above the other, at least a curing process can be applied to the stack, in particular for curing the electrically conductive paste in the cavity, and / or for curing at least one insulating layer structure, in particular for curing at least one external layer structure, and / or any other structure of the stack to be cured (for example, the electrically conductive paste located in at least one via) or any other structure of the stack to be cured.

[0243] In at least one embodiment, preferably, at least the electrically conductive paste of at least one layer structure of the laminate and one cavity is cured simultaneously. Preferably, all parts of the laminate to be cured are cured simultaneously, wherein, for curing, in particular, heat and / or pressure can be applied to the laminate, wherein in particular, pressure can be applied in the stacking direction.

[0244] Thus, proper lamination of the stack may be achieved and / or ensured.

[0245] In at least one embodiment, the method further comprises the step of providing at least one alignment structure, wherein at least one alignment structure is at least partially provided on at least one sub-stack and / or within at least one sub-stack, in particular on at least one sub-carrier and / or within at least one sub-carrier for: aligning the intermediate layer; and / or aligning the paste; and / or aligning the sub-carrier; and / or aligning the sub-stack; and / or aligning the combination of the intermediate layer, paste, sub-carrier and sub-stack; and / or aligning at least two of the intermediate layer, paste, sub-carrier and sub-stack relative to each other, in particular when forming the stack.

[0246] The at least one electrically conducting structure of the component carrier can be arranged in particular in at least one sub-stack and / or on at least one sub-stack and / or, in particular in at least one sub-carrier and / or on at least one sub-carrier.

[0247] Thus, correct alignment can be achieved in an easy manner and the component carrier can thus be manufactured efficiently.

[0248] In at least one embodiment, the method further comprises a connecting step of establishing electrical connections of at least two elements of the component carrier, in particular of at least two sub-stacks and / or at least two sub-carriers.

[0249] Thus, a component carrier with expanded functionality can be provided.

[0250] In at least one embodiment, the step of providing a component carrier comprising the formed stack further comprises providing at least one (external) electrically conductive stacking layer structure on at least one external surface of the stack for establishing an electrical connection between the stack and at least one external electronic component, wherein providing the (external) electrically conductive stacking layer structure particularly comprises electrically connecting the electrically conductive stacking layer structure to at least the first component and / or the second component embedded in the stack.

[0251] The electrically conductive stacked layer structure may be a layer which may be made of copper or include copper and which may be produced, for example, by plating.

[0252] In at least one embodiment, the outer electrically conductive layer structure may be first applied to the outer surface of the stack (in particular applied to the entire outer surface) and later defined, in particular, by a subsequent removal process using an etching process. Alternatively, the outer electrically conductive layer structure may be applied only partially to the outer surface.

[0253] The electrical connection between the at least one (external) electrically conductive stacked layer structure and the first component and / or the second component may be established by soldering, in particular by using solder balls arranged on an exposed outer surface of the cavity facing away from the components.

[0254] Therefore, a reliable electrical connection can be provided.

[0255] After the internal layer structure of the component carrier has been processed, in particular after forming a stack, one or both main surfaces of the processed layer structure can be covered symmetrically or asymmetrically with one or more further electrically insulating and / or electrically conductive layer structures (in particular by lamination). In other words, the stacking can be continued until the desired number of layers is obtained.

[0256] After the formation of the stack of electrically insulating and electrically conductive layer structures is complete, the resulting layer structure or component carrier can be subjected to a surface treatment.

[0257] In particular, in terms of surface treatment, an electrically insulating solder mask can be applied to one or both major surfaces of a laminate or component carrier. For example, such a solder mask can be formed over the entire major surface, and the solder mask layer can then be patterned to expose one or more electrically conductive surface portions that will be used to electrically couple the component carrier to an electronic peripheral. Surface portions of the component carrier that remain covered with the solder mask, particularly those containing copper, can be effectively protected from oxidation or corrosion.

[0258] In terms of surface treatment, a surface treatment portion can also be selectively applied to the exposed electrically conductive surface portions of the component carrier. Such a surface treatment portion can be an electrically conductive covering material on the exposed electrically conductive layer structure (such as a pad, a conductive trace, etc., in particular comprising or consisting of copper) on the surface of the component carrier. If such an exposed electrically conductive layer structure is not protected, the exposed electrically conductive component carrier material (in particular copper) will be oxidized, thereby reducing the reliability of the component carrier. The surface treatment portion can then be formed as, for example, a joint between a surface mounted component and a component carrier. The surface treatment portion has the function of protecting the exposed electrically conductive layer structure (in particular copper circuits), and the surface treatment portion can be joined to one or more components, for example by welding. Examples of suitable materials for the surface treatment portion are organic solderability preservatives (OSP), electroless nickel immersion gold (ENIG), electroless nickel immersion palladium immersion gold (ENIPIG), gold (in particular hard gold), chemical tin, nickel gold, nickel palladium, etc.

[0259] In at least one embodiment, the component carrier according to the first aspect of the invention, in particular at least one stack of component carriers, may further comprise a solder resist layer structure and / or a protective layer structure, wherein the protective layer structure may in particular be at least partially applied to at least a portion of the electrically conductive layer structure.

[0260] In the context of the present application, the term "solder resist layer structure" may particularly denote a layer structure that may also be referred to as a "solder resist mask" and that may particularly be applied to a surface of another layer structure, particularly to a main surface of the other layer structure, in order to prevent solder from adhering to unintended areas of the surface of the other layer structure during soldering, thereby ensuring that solder is applied only to designated areas, for example, to designated solder pads, and not to spaces between these designated areas.

[0261] In at least one embodiment, the solder resist structure may be an electrically insulating solder resist structure. In at least one embodiment, the solder resist structure may be applied to a main surface of an electrically conductive layer structure and / or to a main surface of an electrically insulating layer structure, wherein the solder resist structure may in particular be applied to the outermost main surface of the at least one electrically conductive layer structure of the component carrier. The solder resist structure may be applied to one main surface or two opposite main surfaces of a layer structure or a stack, wherein the solder resist structure may in particular be applied to the outermost main surface of a layer structure or a stack. The solder resist structure may be applied in terms of a surface treatment or by a surface treatment.

[0262] In at least one embodiment, the solder mask structure can be formed by first applying the solder mask structure to the entire main surface of the layer structure to be covered and then subsequently patterning the solder mask structure to expose one or more surface portions of the layer structure previously coated by the solder mask structure. In particular, the solder mask structure can first be applied to the entire main surface of the outermost electrically conductive layer structure of the component carrier and then subsequently patterning the solder mask structure to expose one or more electrically conductive surface portions of the electrically conductive layer structure previously coated by the solder mask structure. Thus, at least one opening can be formed in the solder mask structure, wherein the at least one opening can be delimited by at least one transverse wall of the solder mask structure, wherein, in particular, the at least one transverse wall delimits the opening in a transverse or transverse direction transverse to the stacking direction.

[0263] At least one exposed portion of the electrically conductive layer structure of the component carrier can be particularly configured to electrically couple the component carrier to an electronic peripheral device, or can be used to electrically couple the component carrier to an electronic peripheral device. The remaining surface portions covered by the solder resist structure, i.e. the unexposed surface portions, in particular the copper-containing surface portions, can be effectively protected against oxidation or corrosion. Thus, a component carrier can be provided, which is configured to be electrically coupled to an electronic peripheral device by using one or more of the exposed surface portions of the main surface of the electrically conductive layer structure, wherein the remaining portion of the electrically conductive layer structure is still covered by the solder resist structure and is thereby effectively protected against oxidation or corrosion, which is particularly applicable to the copper-containing surface portions. At least one solder resist structure can comprise at least one of the following: an epoxy resin, a phenolic resin, a polyimide resin, a polyester resin, a bismaleimide resin, a polyolefin-based resin, an isocyanate-based resin, a poly(meth)acrylate resin and a polyethylene terephthalate resin and / or a combination thereof.

[0264] In the context of the present application, the term "protective layer structure" may particularly denote a layer structure that can be regarded as a "surface treatment layer structure" and is particularly configured to prevent the surface to which the protective layer structure has been applied from changing one or more of the characteristic characteristics of the surface under defined conditions and within a defined time range.

[0265] The protective layer structure can, in particular, be a layer structure that can be temporarily applied to at least one exposed portion of the electrically conductive layer structure until an electrical connection between the exposed portion and, for example, an electronic peripheral device is established. If the exposed surface portion of the electrically conductive layer structure is unprotected, the exposed electrically conductive layer structure material (in particular, copper) can oxidize. This can lead to changes in one or more characteristic properties of the electrically conductive layer structure in the region of the exposed surface portion and make a component carrier having such an electrically conductive layer structure less reliable.

[0266] The protective layer structure has the function of protecting the exposed electrically conductive layer structure (especially the copper circuit) and can realize the joining process with one or more components, especially the reliable electrical connection process, for example, it can realize the joining process with one or more components, especially the reliable electrical connection process through welding.

[0267] In at least one embodiment, at least one protective layer structure can be selectively applied to one or more exposed electrically conductive surface portions of the electrically conductive layer structure of the component carrier in terms of or by means of a surface treatment.

[0268] The protective layer structure may include an electrically conductive covering material, or may be an electrically conductive covering material that is configured to be applied to exposed electrically conductive layer structures (e.g., pads, conductive traces, etc., in particular including or consisting of copper) of a surface of the component carrier, in particular the outermost electrically conductive main surface of the component carrier. Examples of materials suitable for the protective layer structure material are organic solderability preservatives (OSP), electroless nickel immersion gold (ENIG), electroless nickel immersion palladium immersion gold (ENIPIG), gold (in particular hard gold), chemical tin, nickel gold, nickel palladium, etc.

[0269] The protective layer structure can, for example, be formed as a joint between a surface-mounted component and a component carrier or serve as a joint between a surface-mounted component and a component carrier.

[0270] The package according to the third aspect of the invention comprises: at least one component carrier according to the first aspect of the invention; and / or at least one component carrier manufactured by the method according to the second aspect of the invention; and at least one further part assembled with the component carrier.

[0271] In the context of the present application, the term “package” may particularly denote an arrangement or a unit in which a component carrier and at least one further part are integrated.

[0272] In the context of the present application, the term "further part" may particularly denote any part configured to form a package together with at least one component carrier. This may include other hardware parts, software parts or mechanical parts to form a functional package or component or device or module of a larger system.

[0273] In at least one embodiment, the package is an electronic package or assembly.The package may include at least one electronic component.

[0274] The package can, for example, be an electronic circuit board comprising at least one component carrier according to the invention and at least one further part, wherein the one or more further parts can be formed by electrically connected parts and / or components (to each other and / or to the component carrier).

[0275] For example, the package may be an electronic module, an electronic device or any subassembly for an electronic device comprising at least one component carrier according to the invention and at least one further part.

[0276] Examples of electronic devices include smartphones, computers and laptops, televisions and monitors, wearable devices (e.g., smart watches and / or fitness trackers), household appliances (e.g., microwave ovens, refrigerators, and washing machines), medical devices (e.g., blood glucose meters and portable ultrasound machines), electronic devices for the automotive industry (e.g., ECUs for engine management, infotainment systems, safety systems (e.g., airbags), and navigation systems), and electronic devices for industrial machinery (e.g., control units for automation, robotics, and manufacturing equipment).

[0277] Examples of subassemblies for electronic devices are, in particular, electronic modules for the above-mentioned electronic devices. Examples of modules are, in particular, electronic control units (ECUs), power supply modules, connection or communication modules (e.g., HDMI or USB ports, WiFi modules, Bluetooth modules, and GPS modules), sensor modules (e.g., heart rate, GPS), microcontroller modules, battery management modules, display interface modules, driver modules, audio modules, RFID modules, and memory modules.

[0278] The preferred embodiments and the advantages of the preferred embodiments cited with reference to the component carrier apply correspondingly to the method according to the invention for producing a component carrier, and to the packaging, and vice versa.

[0279] Further features of the invention are set forth in the claims, the drawings, and the description of the drawings. All features and combinations of features mentioned above in the description, as well as the features and combinations of features mentioned below in the description of the drawings and / or shown in the drawings, individually or in combination, can be used not only in the combination indicated or shown in each case, but also in other technically feasible combinations or individually. BRIEF DESCRIPTION OF THE DRAWINGS

[0280] The aspects of the invention defined above, as well as further aspects of the invention evident from the examples, will now be explained in more detail by way of example of a preferred embodiment and with reference to the accompanying non-limiting drawings.

[0281] The accompanying drawings show:

[0282] Figure 1a : a section through a first embodiment of a component carrier according to the first aspect of the invention, which component carrier is produced by the method according to the second aspect of the invention,

[0283] Figure 1b : Figure 1a An enlarged cross-sectional view of the embodiment shown in FIG.

[0284] Figure 2: Section through a second embodiment of a component carrier according to the first aspect of the invention, which component carrier is also produced by the method according to the second aspect of the invention,

[0285] Figure 3 : a flow chart showing the steps of a method according to a second aspect of the invention for producing a component carrier according to the first aspect of the invention,

[0286] Figure 4a : process steps S1 to S9 of the first embodiment of the method according to the second aspect of the invention for forming a stack of another embodiment of a component carrier according to the first aspect of the invention,

[0287] Figure 4b : subsequent process steps S10 to S16 for further forming a stack according to a further embodiment of a component carrier according to the invention,

[0288] Figure 5 : a sectional view of a section through a further exemplary embodiment of a component carrier according to the invention,

[0289] Figure 6 : a sectional view of a section through a further exemplary embodiment of a component carrier according to the invention,

[0290] Figure 7 : a sectional view of a section through a further exemplary embodiment of a component carrier according to the invention,

[0291] Figure 8 : a sectional view of a section through a further exemplary embodiment of a component carrier according to the invention,

[0292] Figure 9 : a sectional view of a section through a further exemplary embodiment of a component carrier according to the invention, and

[0293] Figure 10 : a sectional view of a section through a further exemplary embodiment of a component carrier according to the invention, and

[0294] Figure 11 : Section through a further embodiment of a component carrier according to the first aspect of the invention. DETAILED DESCRIPTION

[0295] Figure 1aA cross section through a first embodiment of a component carrier 100 according to the first aspect of the present invention is shown, which is produced by a method according to the second aspect of the present invention. Component carrier 100 will be described in detail below, followed by a description of the production method for producing component carrier 100. Elements having the same function in different embodiments may be designated by the same reference numerals.

[0296] This example of a component carrier 100 according to the invention is a multilayer component carrier 100 comprising a first stack 10 and a second stack 20 , wherein each stack 10 , 20 has a stacking direction Z and comprises a plurality of electrically insulating layer structures and a plurality of electrically conductive layer structures.

[0297] The first stack 10 comprises first electrically insulating layer structures 70 and 71 which are laminated together to form a common intermediate electrically insulating layer structure 131 and a plurality of electrically conductive layer structures, in particular electrically conductive layer structures 40, 41, 42, 43, 44, 60-65 and 59.

[0298] The second stack 20 comprises first electrically insulating layer structures 73 and 74, which are also laminated together and form a common intermediate electrically insulating layer structure 132, and a plurality of electrically conductive layer structures, in particular electrically conductive layer structures 40, 45, 55, 56, 57, 58 and 68. Both stacks 10 and 20 of this exemplary component carrier 100 comprise further structures which are not indicated by reference numerals.

[0299] According to the present invention, each stack 10, 20 comprises a first part 11, 21 and a second part 12, 22 embedded in the respective stack 10, 20, wherein the parts 11 and 12 of the stack 10 are arranged one above the other in the stacking direction Z with a single cavity 13 between the parts 11 and 12 of the stack 10, and the parts 21 and 22 of the stack 20 are arranged one above the other in the stacking direction Z with three cavities 23 between the parts 21 and 22 of the stack 20, wherein Figure 1a In FIG. 2 , only one of the three cavities 23 is indicated with reference numeral 23 . The cavities 23 are separated from each other by electrically insulating layer material from the electrically insulating layer structures 73 , 74 .

[0300] The first components 11, 21 and the second components 12, 22 of the stack 10, 20 of the component carrier 100 according to the invention can be components of the same type or of different types. The different types of components can, in particular, be used for different (electrical / electronic) purposes. This significantly increases the number of possible applications for the component carrier 100 in a very simple manner. Combined with the design of the component carrier according to the invention, this makes it possible to very easily provide a component carrier that can be easily adapted to a wide range of applications and is highly flexible.

[0301] Figure 1a Each of the components 11 , 12 , 21 and 22 of the embodiment of the component carrier 100 according to the invention shown in FIG. 1 comprises Figure 1a The electrically conductive connecting structures 46 , 47 , 48 , 49 , 50 , 51 , 52 , 53 and 54 shown by way of example are used to establish an electrical connection with the components 11 , 12 , 21 , 22 .

[0302] The parts 11 and 12 of the first stack 10 each comprise a main surface 14 and 16 , respectively, facing said cavity 13 between the parts 11 and 12 and partially delimiting said cavity 13 in the stacking direction Z.

[0303] Components 21 and 22 of the second stack 20 also each include a major surface 24 and 26, respectively, wherein major surface 24 is associated with component 21 and major surface 26 is also associated with component 22. The major surfaces 24 and 26 also face the cavity 23 located between components 21 and 22.

[0304] Each component also includes a second major surface located on the opposite side from the cavity 13, 23, which for components 11, 12 and 21 is exemplarily shown by component major surfaces 15, 17 and 25. The second major surfaces 15, 17 and 25 are located opposite the first major surfaces 14, 16, 24, 26 and include additional connecting structures, such as pads (see, for example, structure 46 for component 11 in relation to the second major surface 15 of component 11), thereby enabling double-sided connection of the respective components 11, 12, 21, 22.

[0305] According to the present invention, the cavities 13 and 23 between the respective first components 11, 12 and the second components 21, 22 of the first stack 10 and the second stack 20 are each filled with an electrically conductive paste 29, so that the respective first components 11, 12 and the second components 21, 22 of the first stack 10 and the second stack 20 are directly electrically connected to each other.

[0306] The arrangement of components 11 and 12 directly above one another, with a cavity 13 filled with electrically conductive paste 29 between them, thereby directly electrically connecting components 11 and 12 to one another, and the arrangement of components 21 and 22 directly above one another, with a cavity 23 filled with electrically conductive paste 29 between them, thereby directly electrically connecting components 21 and 22 to one another, allow for the provision of a component carrier 100 with a very small height. Consequently, miniaturization, in particular of electronic packages including such component carriers 100, can be improved. This also allows for the provision of a component carrier 100 with direct, straight electrical connections between components 11 and 12 and between components 21 and 22, and with short path lengths between components 11 and 12 and between components 21 and 22. Consequently, improved performance of component carrier 100 can be achieved.

[0307] In this embodiment of the advantageous component carrier 100 according to the invention, the cavities 13 and 23 of the two stacked parts 10 and 20 are partially delimited in a lateral direction by the electrically insulating layer structure. Figure 1a denoted by X in the cross-section, and in this embodiment, the lateral direction extends in particular in a direction perpendicular to the stacking direction Z. The cavity 13 is delimited in the lateral direction by the electrically insulating layer structures 70 and 71 , respectively by the intermediate insulating layer structure 131 , and the cavity 23 is delimited in the lateral direction by the electrically insulating layer structures 73 and 74 , respectively by the intermediate layer structure 132 .

[0308] As shown exemplarily for the cavity 13 , this cavity 13 is in particular delimited as a whole only by the first component 11 , the second component 12 and the first electrically insulating layer structures 70 and 71 .

[0309] The transverse walls 18, 28 of the cavities 13 and 23 may extend in a direction parallel to the stacking direction Z or may be inclined relative to the stacking direction Z, wherein the transverse walls 18, 28 may in particular be tapered (see for example Figure 4b , S11 to S13). The shape, orientation and extension of the transverse walls 18, 28 of the cavities 13, 23 filled with the electrically conductive paste 29 may depend in particular on the process by which the cavities 13, 23 are created. In particular, when the cavities 13, 23 are created by laser drilling, the transverse walls 18, 28 of the cavities 13, 23 may be tapered, as for example in Figure 4b , as shown in S11 to S13.

[0310] Each component of this exemplary embodiment of the component carrier 100 according to the invention is embedded in a subcarrier 81 ′, 82 ′, 83 ′, 84 ′ (see Figure 2), in particular, each component of this exemplary embodiment of the component carrier 100 according to the present invention is embedded in a respective core structure layer 81, 82, 83, 84 of a respective sub-carrier 81', 82', 83', 84'. Component 11 is embedded, for example, in core structure layer 81, and component 12 is embedded, for example, in core structure layer 82. Component 21 is embedded in core structure layer 83, and component 22 is embedded in core structure layer 84. The core structure layers 81, 82, 83, 84 are preferably also electrically insulating layer structures, but include functional features such as glass fibers or one or more inorganic layer structures located internally to increase the mechanical strength and / or stiffness of the layer structure.

[0311] In at least one other embodiment, at least one subcarrier may optionally not have a core structure layer, i.e., the subcarrier does not include any core structure layer. At least one component may be embedded in another portion of the subcarrier that does not have the core structure. In particular, at least one component may be embedded in another layer of the subcarrier that does not have the core structure. For example, at least one component may be embedded in (another) electrically insulating layer structure.

[0312] Components 11, 12, 21 and 22 are each embedded in a corresponding sub-carrier 81', 82', 83', 84' and each are respectively embedded in their core structure layers 81, 82, 83, 84 so that the main surfaces 14, 16, 24, 26 of the components 11, 12, 21 and 22 are exposed and face the corresponding cavity 13, 23 and partially delimit the cavity 13, 23, wherein the components 11, 12, 21, 22 are further embedded so that the components 11, 12, 21, 22 face another component 12, 11, 22, 21 and face the corresponding sub-carrier 81', 82', 83', 84' embedded with the other component which also partially delimits the cavity 13, 23.

[0313] In order to embed the components 11, 12, 21, 22 into the core structure layers 81, 82, 83, 84, during the production of the component carrier 100, first a component cavity 19 is created (see Figure 4a ), in particular, a component cavity 19 is created by a cutting process, for example by laser cutting, and the components 11 , 12 , 21 , 22 are subsequently positioned and embedded in the component cavity 19 .

[0314] The component cavity 19 (see e.g. Figure 4a , S4 to S6) can have a lateral extension in the lateral direction X that is exactly matched to the dimensions of the component, such as for example for Figure 1a 11 and 12 are shown as examples, or the component cavity 19 may have a lateral extension greater than the lateral dimension of the corresponding component, such as Figure 1a . In this case, the portions 75, 76 of the electrically insulating layer structures 73, 74 delimiting the cavity 23 filled with the electrically conductive paste 29 can extend into the space 97 between the components 21, 22 and the lateral walls of the corresponding core structure layers 83, 84 delimiting the component cavity 19 (see also Figure 4a , S7 and S8).

[0315] The cavities 13 and 23 are each at least partially formed by a recess in the electrically insulating layer structures 70, 71, 73 and 74 which delimit the cavities 13, 23 in the lateral direction X, wherein the cavities 13 and 23 are in particular delimited in the lateral direction X by the lateral walls of the recess in the electrically insulating layer structures 70, 71, 73 and 74.

[0316] exist Figure 1a In this embodiment of the component carrier 100 according to the invention shown in FIG, the main surfaces 14, 16, 24, 26 of the components facing the cavities 13 and 23, respectively, are each at the same vertical level in the stacking direction Z relative to the corresponding main surfaces 108 of the core structure layers 81, 82, 83, 84 (see FIG. Figure 4a ) flush. However, in another embodiment, this may be different. In another embodiment, for example, the component height of at least one component in the stacking direction Z may be smaller than the inner height of the component cavity 19 in which the component is embedded (see Figure 4a ). Alternatively and generally speaking, the component height may be greater than the internal height of the corresponding component cavity 19, resulting in the component protruding in the stacking direction Z beyond the corresponding core structure layer in which it is embedded.

[0317] Each of the stacks 10 and 20 itself comprises a first sub-stack 10A, 20A and a second sub-stack 10B, 20B, respectively, wherein these sub-stacks 10A, 10B, 20A, 20B are stacked one above the other to form the respective stack 10 and 20.

[0318] Each sub-stack 10A, 10B, 20A, 20B comprises a sub-carrier 81′, 82′, 83′, 84′ having a core structure layer 81, 82, 83, 84, in which components 11, 12, 21, 22 are embedded, wherein an electrically insulating layer structure 131 and 132 are provided between the sub-stacks 10A and 10B and between the sub-stacks 20A and 20B, respectively. When forming the stacks 10 and 20, the electrically insulating layer structures 131 and 132 are each made from two separate outer insulating layer structures 70 and 71, and 73 and 74, of the corresponding sub-stacks 10A and 10B and 20A and 20B, respectively. This allows for very easy, efficient, and precise production of component carriers comprising at least two components arranged one above the other in the stacking direction.

[0319] In an alternative embodiment, the electrically insulating layer structures 131 and 132 may consist of or be made of only one electrically insulating layer structure. This may help reduce stack height and enhance miniaturization.

[0320] Figure 1a The component carrier 100 shown in FIG is produced by placing a first stack 10 and a second stack 20 on top of each other with an electrically insulating layer structure 72 between the first stack 10 and the second stack 20. Figure 1a Indicated by the separating plane 30 which is symbolically represented by a dashed line. Figure 1a As an alternative to the embodiment exemplarily shown in FIG, in which the electrically insulating layer structure 72 is produced by two separate electrically insulating layer structures combined to form a common insulating layer structure 72, the insulating layer structure 72 located between the first stack 10 and the second stack 20 can also be an insulating layer structure associated with only one of the stacks 10 and 20. In another embodiment, two separate electrically insulating layer structures can also be provided between the first stack 10 and the second stack.

[0321] The dashed line denoted by reference numeral 31 indicates the separation plane between the electrically insulating layer structures 73 and 74 before being laminated together to form the common electrically insulating layer structure 132. In some embodiments, the electrically insulating layer structures 73 and 74 may be laminated together such that the separation plane is no longer visible.

[0322] The dashed line denoted by reference numeral 32 indicates the separation plane between the electrically insulating layer structures 70 and 71 before being laminated together to form the common electrically insulating layer structure 131. In some embodiments, the electrically insulating layer structures 70 and 71 may be laminated together such that the separation plane is no longer visible.

[0323] The first stack 10 and the second stack 20 are stacked one above the other along a stacking direction Z with an electrically insulating layer structure 72 interposed therebetween. The first stack 10 and the second stack 20 are electrically connected to each other via a plurality of electrically conductive structures as are generally known in the art. For example, the first stack 10 and the second stack 20 are electrically connected to each other via electrically conductive structures 40 and 90, 96, 41, 91 and 42, 45, 92, 43 and 44, 58, 59 and 126.

[0324] Here, the electrically conductive structures 40, 41, 42, 43, 44, 45, 58, 59 are formed as pads. The electrically conductive structures 40, 41, 42, 43, 44, 45, 58, 59 are plated onto the corresponding adjacently arranged surfaces and include a certain amount of copper or are made of copper to ensure good electrical conductivity. Alternatively, the electrically conductive structures may include Ni, Pd, Cr, Ti, Ag, Au, or Sn.

[0325] In this example, the electrically conductive structures 90, 91 and 92 are so-called through-hole connections, which include through-holes filled with an electrically conductive material, for example copper, or which have an inner surface to which an electrically conductive coating is applied, in particular plated, which electrically conductive coating can also include copper or consist of copper, for example.

[0326] As exemplarily shown in this embodiment, the electrical connection established between the electrically conductive structures 58 and 59 comprises an electrically conductive structure formed by the electrically conductive paste 29 filled into the further cavity 96 and, via this electrically conductive paste 29, in this exemplary embodiment of the component carrier 100, the further electrical connection is also based on, for example, a plurality of electrical interconnections within the stack 10, 20.

[0327] In the embodiment shown here, the paste 29 used to fill the additional cavities 96 is the same paste used in the cavities 13 and 23 connecting the components 11, 12, 21, 22. In other embodiments, the pastes used may be different. Specifically, the paste used to fill the cavities 13, 23 between the components 11, 12, 21, 22 may be different from the paste used to fill the additional cavities 96. It may be advantageous to fill the cavities 13, 23 between the components 11, 12, 21, 22, and preferably only these cavities 13, 23, with a paste having a higher electrical and / or thermal conductivity than the paste used to fill the additional cavities 96. This allows for a favorable electrical and / or thermal connection between the individual components 11, 12, 21, 22, while reducing or even minimizing the amount of the typically more expensive highly conductive paste required for the component carrier.

[0328] Further electrically conductive structures may be provided, such as via connections 90 , 91 , 93 or 94 .

[0329] In some embodiments, not all of the further cavities 96 can be filled with a paste to establish an interlayer connection. One or more of the further cavities 96 can be at least partially or completely filled with a plating material, for example, one or more of the further cavities 96 can be at least partially or completely filled with Cu, Ni, Pd, Cr, Ti, Ag, Au, or Sn. However, in a preferred embodiment, only one type of conductive filling medium is selected within an insulating layer structure, i.e., in particular a plating material or a conductive paste. However, this does not apply to the case of (mechanical) drilled holes that are reached through multiple insulating layers.

[0330] In an example, the electrically conductive structure formed by paste 29 filled into further cavity 96 may include a shape having straight sidewalls, such as a cylindrical shape, and / or a shape having inclined sidewalls, such as a frusto-conical shape. This may depend in particular on the manufacturing method used to create the cavity.

[0331] Figure 1b Shown Figure 1a An enlarged cross-sectional view of the embodiment shown in Figure 1a As is apparent from this enlarged view, first component 21 and second component 22 are arranged one above the other, with their geometrical center points C1 and C2 in the transverse direction having a defined, slight transverse offset dx relative to one another in transverse direction X. Depending on the dimensions of components 21 and 22, in particular their transverse extensions / lengths L1 and L2, this can result in regions having a transverse extension ox in which components 21 and 22 do not overlap. If components 21 and 22 have the same dimensions, in particular the same length, i.e., L1 = L2, then the transverse non-overlap width ox is the same as the transverse offset dx, i.e., dx = ox.

[0332] from Figure 1a and Figure 1b It is apparent from the illustration in that in order for components 21 and 22 stacked one on top of another to be reliably electrically and / or thermally connected, the overlap of the components 21 and 22 must be minimal.

[0333] However, the overlap of the components 21 and 22 is not as important as a sufficient overlap of the conductive connection structures of the components 21 and 22 to be connected, such as the pads 51 and 50 shown of the components 21 and 22. In order to establish a reliable connection, the overlap of the conductive connection structures 50, 51 of the components (e.g., the overlap of the individual pads 50, 51, in particular the pad areas of the components) should be at least 50%. In some embodiments, a higher degree of overlap may be required. In some embodiments, the permissible deviation or permissible lateral offset (in the case of the pads 50, 51 to be connected) relative to each other is not necessarily greater than the permissible lateral offset (in the case of the pads 50, 51 to be connected) of the components. Figure 1b The overlap (shown as "px") can be limited relative to the ideal overlap, in particular to small deviations, for example to a maximum of 10 μm. Instead of being expressed as an absolute value, the limit can also be defined as a percentage, in particular based on the pad size, for example based on the pad size of the smallest pad among the pads to be connected.

[0334] Figure 1a and Figure 1b The components 21 and 22 of the component carrier 100 shown in FIG have the same length in the transverse direction X (i.e., L1=L2) and the same height H1, H2 in the stacking direction Z, i.e., H1=H2. This is because in this embodiment 100, the components 21 and 22 are identical. However, in another embodiment, the components 21 and 22 may have different lengths L1, L2 in the transverse direction X and / or different heights H1, H2 in the stacking direction and / or may be of different types, thereby realizing different functions. Figure 2 A cross section through a second embodiment of a component carrier 200 according to the first aspect of the invention is shown, which component carrier 200 is also produced by the method according to the second aspect of the invention. In this embodiment 200, the components 11 and 12 are also embedded in component cavities 19 in the respective sub-carriers 82 ′ and 81 ′, which have a greater extension in the lateral direction than the components 11 and 12, wherein the lateral spaces 97 and 98 between the components 11 and 12 and the core structure layer are filled by portions 99 and 101 of the insulation layer structures 70 and 71, similarly to the components 21 and 22.

[0335] Figure 3A flow chart showing the steps of a method according to a second aspect of the invention for producing a component carrier according to the first aspect of the invention is shown, wherein the described method exemplarily comprises a first step a) of providing a first component 11, 21 and a second component 21, 22, wherein each component 11, 12, 21, 22 comprises a component main surface 14, 16, 24, 26. The method further comprises a second step b) of forming a stack 10, 20 having a stacking direction Z and comprising at least one electrically insulating layer structure 70, 71, 73, 74 and at least one electrically conductive layer structure, wherein forming the stack 10, 20 comprises: nesting a first component 11, 21 and a second component 12, 22 one above the other in the stacking direction Z such that a cavity 13, 23 is provided between the first component 11, 21 and the second component 12, 22, and wherein the main surfaces 14, 16, 24, 26 of the first component 11, 21 and the second component 12, 22 face the cavity 13, 23 and partially delimit the cavity 13, 23 in the stacking direction Z; and filling the cavity 13, 23 with an electrically conductive paste 29. In a third step c), a component carrier 100 having the formed stack 10, 20 can be provided.

[0336] Specifically, step b) of forming the stack 10, 20 may comprise a plurality of sub-steps. Figure 4a and Figure 4b , describes a preferred method according to the second aspect of the present invention comprising a number of sub-steps.

[0337] exist Figure 4a In FIG, preferred process steps S1 to S9 of a first embodiment of a method according to the second aspect of the invention are shown for forming a stack of another embodiment of a component carrier according to the first aspect of the invention. Figure 4b , subsequent preferred process steps S10 to S16 for further forming the stack are shown.

[0338] In at least one embodiment of the method according to the present invention, some of the substeps described herein may be omitted, or some of the substeps described herein may be performed in different ways. In addition, other substeps are also possible. Some substeps may also be performed in different orders.

[0339] In a first step S1, a subcarrier 82' can be provided, which includes a core structure layer 82, an electrically conductive layer structure 66 made of copper plated onto a main surface 108 of the core structure layer 82 (here, the upper surface of the core structure layer 82), and further includes another electrically conductive layer structure 67, which is also made of copper and plated onto another main surface (here, the bottom surface of the core structure layer 82). As described above, the subcarrier does not necessarily include a core structure layer. Therefore, in alternative embodiments, the subcarrier 82' may not have a core layer structure. For example, the subcarrier 82' may include a resin layer. In addition, alternatively, the subcarrier 82' may include a glass core.

[0340] In the subsequent step S2, a vertical through hole 102 can be created through the sub-carrier 82'. Specifically, the vertical through hole 102 can be created through a mechanical manufacturing process, for example, a mechanical drilling process, preferably a mechanical or laser drilling process. However, other manufacturing methods are also applicable.

[0341] In a further step S3, for example by using a light-conformable mask as is well known in the art, a defined removal can be performed at defined locations of the electrically conductive copper layer structures 66 and 67 in order to define the location of the desired component cavity 19, in particular to mark or index the location of the desired component cavity 19, which must first be cut into the core structure layer 82 before the component can be embedded in the subcarrier 82'. Instead of using a light-conformable mask, other methods can be applied. After the defined removal of the electrically conductive layer structures 66 and 67 at defined locations, the layer structures 66 and 67 can include a plurality of recesses or interruptions 103, 104, 105, 106, 107, which indicate the locations where the component cavity 19 must be created and serve as registration marks and / or positioning elements.

[0342] The component cavity 19 can be created in a subsequent step S4, for example by laser cutting, for example by using a CO2 laser. In the example shown here, the component cavity 19 is formed as a "through hole". Alternatively, the component cavity 19 can have a basin shape.

[0343] After the component cavity 19 has been created, the electrically conductive structures 66 and 67 can be almost completely or completely removed from the main surface of the core structure layer 82 in a further step S5. However, in a preferred embodiment, the electrically conductive structures 66 and 67 are not completely removed. Preferably, at least one alignment structure 66, 67 remains. In this embodiment, a small portion of the electrically conductive layer structures 66 and 67 surrounding the through-hole 102 remains. These alignment structures 66, 67 allow the sub-carrier 82' to be precisely aligned in subsequent process steps. These alignment structures 66, 67 can, for example, be detected by radiation and / or capacitance, in particular contactlessly, and can indicate how the sub-carrier 82' must be positioned in the machine of the next process step in order to accurately perform the next manufacturing step.

[0344] In a subsequent step S6, in particular when component cavity 19 is a "through-hole" component cavity 19 and / or when the mechanical strength and / or dimensional stability of core structure layer 82 are insufficient for subsequent process steps, a temporary carrier layer 109 can be applied to one of the main surfaces of core structure layer 82, wherein temporary carrier layer 109 is applied to the bottom main surface of core structure layer 82. Some of the alignment structures, here alignment structures 67, can be temporarily embedded in this process. If component cavity 19 has, for example, a basin shape, this step S6 can be omitted.

[0345] In a subsequent step S7, a component (here component 12) can be inserted into the previously created component cavity 19. Depending on the lateral extent of the component cavity 19 between the component 12 and the core structure layer 82, there will or will not be a space 97 in the lateral direction.

[0346] In order to establish an electrical connection between the component 12 and another element, the component 12 may comprise electrically conductive structures 48 and 49 , in particular on a main surface of the component 12 .

[0347] After the component 12 to be embedded has been placed in the component cavity 19, in a further step S8, a first outer insulating layer structure 71 can be applied to the main surface of the core structure layer 82, here the first outer insulating layer structure 71 can be applied to the upper main surface 108, wherein, in this example, a portion 99 of the first electrically insulating layer structure 71 extends into the space 97 between the component 12 and the lateral wall of the core structure layer 82 and thereby fills the space 97. Due to the design of the component 12 in this example, the material of the electrically insulating layer structure 71 will also penetrate around the bottom corner of the component 12 and form a horizontal portion 110.

[0348] In another (not shown) embodiment, alternatively, a gel-like electrically insulating material can be applied into space 97, for example, by 3D printing and / or dispensing, wherein the top surface of the component is preferably uncovered. In other words, this means that, in at least one embodiment, at least two different materials can be used to embed the component, in particular, at least two different electrically insulating materials can be used, in particular, one electrically insulating material for forming the electrically insulating layer structure (here designated 71) and another different electrically insulating material for filling gap 97.

[0349] The material of the electrically insulating layer structure 71 may also extend into the through hole 102 and be filled by the portion 122 , as in Figure 4a and Figure 4b . In other embodiments, the through hole 102 can initially remain open and can then be coated, in particular plated or filled with an electrically conductive layer structure as is well known in the prior art for forming a through-hole connection. The through hole 102 can also be coated or plated with an electrically conductive layer structure, for example made of or comprising copper, and then filled with resin, in order to save copper material while still allowing the through-hole connection to be established. As an alternative to copper, it is also possible to use (Cu), Ni, Sn, Au or Ag and / or combinations thereof to provide a corresponding electrically conductive structure.

[0350] In a further step S9 the temporary carrier layer 109 can be removed. Thereby, the bottom main surface 17 of the component 12, respectively the bottom main surface 128 of the exposed core structure layer 82, can be (re)exposed.

[0351] For some embodiments, it may be advantageous to apply a second electrically insulating layer structure 112 to the other main surface 128 of the core structure layer 82 (here, to the bottom main surface of the core structure layer 82) in a further step S10. If such a second electrically insulating layer structure 112 is applied to the outer main surface 128 of the core structure layer 82 on the opposite side of the core structure layer 82, the second electrically insulating layer structure 112 is preferably applied such that it also contacts one main surface of the component 12 (here, the main surface 17) and contacts the other outer insulating layer structure (here, the layer structure 71). Portion 99 of the first electrically insulating layer structure 71 may preferably extend into the space 97 between the component 12 and the transverse wall of the core structure layer 82, so that the portion 99 is flush with one main surface of the component 12 and with one main surface of the core structure layer 82. Furthermore, the portion 99 may also contact the other outer insulating layer structure 112.

[0352] The second electrically insulating layer structure 112 may also comprise a portion extending into the space 97, just like the portion 99 of the first outer electrically insulating layer structure 71. Thus, a complete embedding of the component 12 may be achieved in a very easy manner.

[0353] The electrically insulating layer structures 71 and 112 are preferably currently only pre-cured and / or in the so-called "B-stage." In this state, the material, in particular the resin constituting the respective electrically insulating layer structures 71 and / or 112, is neither completely uncured nor completely cured, but rather partially cured. In this state, the resin is in particular no longer liquid, but has not yet completely cured. However, the resin is preferably viscous and semi-solid to a certain extent, and allows it to adhere to the core structure layer 82 and to be mechanically processed, in particular to create one or more cavities 13A, 114 in the layer structures 17 and 112, thereby preparing them for subsequent process steps.

[0354] Advantageous results can be achieved by using so-called "softlam" electrically insulating layer structures 71 and / or 112 that are configured to be processed under high temperature and high pressure, preferably in the range of 50°C to 240°C and in the range of 5 bar to 30 bar. In particular, good embedding and lamination results can be achieved. Providing at least one of the insulating layer structures 71 and / or 112 in a pre-cured state can further help prevent undesirable warping in subsequent process steps.

[0355] In a subsequent step S11, at least a first portion 13A of a cavity 13 is created in the preferably pre-cured first electrically insulating layer structure 71. In particular, at least a first portion 13A of a cavity 13 is cut out of the preferably pre-cured first electrically insulating layer structure 71, for example, by laser drilling. The cavity 13 must be filled with the electrically conductive paste 29, wherein the main surface of the component 12 is exposed, in particular, the electrically conductive structure 49 of the component 12 is exposed. In some embodiments, a laser lift-off process can additionally or alternatively be performed to remove the corresponding material to form the cavity 13 (at least the portions 13A, 13B of the cavity 13).

[0356] “Laser lift-off” is a well-known method for removing material using lasers, wherein the method allows very precise removal of material with minimal damage to the substrate.

[0357] It is worth noting that in the diagram regarding step S11, compared with the previous diagram, the sub-carrier 82' is in a state of being rotated 180 degrees (turned upside down 180 degrees and aligned with the original position). Figure 1a and Figure 2 consistent, where component 12 is the upper component).

[0358] In some embodiments, it may also be advantageous to create a cavity 114 in the second electrically insulating layer structure 112 to also expose the opposite main surface of the component 12, in particular to also expose the electrically conductive structure 48 of the component 12, so that an electrical connection between the component 12 and at least one other electrical component can be established from this side of the component 12 and / or to this side of the component 12.

[0359] and Figure 1a and Figure 2 In contrast to the illustration in FIG, in this example the transverse walls of the cavity portion 13A are inclined, which can be clearly seen. Furthermore, the recess 114 has a tapered transverse wall (not indicated by a reference numeral).

[0360] After step S11 , the subcarrier 82 ′ may be ready for assembly with another subcarrier 81 ′, in particular, the subcarrier 82 ′ may be ready for assembly with a subcarrier 81 ′ similar to or identical to the stack 10 for component carriers according to the invention.

[0361] Preferably, at this time or in a further step S12, a further subcarrier 81' is provided with components 11 embedded therein for forming the stack 10. Said further subcarrier 81' can in particular be manufactured according to the same method as described herein for the subcarrier 82'.

[0362] The sub-carrier 81' can also in particular include a core structure layer 81, in which the component 11 is embedded, wherein a first electrically insulating layer structure 70 has been applied to one of the main surfaces of the core structure layer 81 (on the side facing the cavity 13 to be filled later with the electrically conductive paste 29), and a second part 13B for forming the cavity 13 filled with the electrically conductive paste 29 is cut out in the first electrically insulating layer structure 70, thereby also resulting in a tapered lateral wall 18 that delimits the cavity 13 in the lateral direction. Preferably, the second part 13B for forming the cavity 13 filled with the electrically conductive paste 29 is also cut out in the first electrically insulating layer structure 70 by laser drilling, thereby also resulting in a tapered lateral wall 18 that delimits the cavity 13 in the lateral direction.

[0363] On the opposite side, ie the side facing away from the cavity portion 13B, a second electrically insulating layer structure 116 is applied, in which recesses or cavities 115 are also cut to expose corresponding electrically conductive structures on the side of the component 11 (not shown).

[0364] In a preferred embodiment, in a further step S13, at least one of the cavity portions 13A, 13B is filled with a conductive paste 29, wherein preferably both cavity portions 13A and 13B are filled with the electrically conductive paste 29. The paste 29 may in particular be a solder paste 29 or a sintering paste 29. In order to ensure that the cavity is completely filled with the conductive paste 29, at least one of the cavity portions 13A and 13B is preferably overfilled, e.g. Figure 4b 10B for forming the stack 10. The sub-stack 10A may particularly look similar to that shown at the subsequent step S14. The first insulating layer structure of the sub-stack 10B, which corresponds to the insulating layer structure 71 of the sub-stack 10A, is denoted by reference numeral 70. The second insulating layer structure of the sub-stack 10B, which corresponds to the insulating layer structure 112 of the sub-stack 10A on the opposite side, is denoted by reference numeral 116.

[0365] In a further step S14, the sub-stack 10A and the sub-stack 10B can be stacked one above the other in a stacking direction Z, in particular such that the sub-stack 10A and the sub-stack 10B overlap, in particular the electrically conductive structures or pads of the sub-stack 10A and the sub-stack 10B overlap to ensure a direct and correct electrical connection between the embedded components 11 and 12 via the electrically conductive paste 29, wherein the cavity 13 between the components 11 and 12 is completely filled with the electrically conductive paste 29. Thus, the cavity 13 is formed. Due to the tapered transverse walls 18 in this embodiment, the cavity 13 has a hexagonal shape, as can be seen from the Figure 4b As is apparent from the above, see for example steps S14 to S16.

[0366] Within defined tolerances of relative translation in the transverse direction X, precise superposition of the components 11 and 12 , ie arrangement of the components 11 and 12 above each other in the stacking direction Z, can be achieved in particular using the alignment structures 66 and 67 .

[0367] After the sub-stacks 10A and 10B are stacked one above the other in the stacking direction Z and precisely aligned to ensure overlap, preferably, axial pressure and / or heat are applied in the stacking direction Z to fully cure the portions of the resulting stack 10 that have not yet been fully cured and to laminate the sub-stacks 10A and 10B together. The electrically insulating layer structures 70 and 71 may be fused together to form a common intermediate insulating layer structure 131. In some embodiments, the electrically conductive paste 29 may be squeezed out of the cavity 13 into the contact area located in the separation plane 32 between the first sub-stack 10A and the second sub-stack 10B and between the electrically insulating layer structures 71 and 70.

[0368] The components 11 and 12 can in particular be embedded in the stack 10 so that the main surfaces of the components 11 and 12 are flush with the corresponding core structure layers 81 and 82, and so that the external insulation layer structures 70, 71, 112 and 116 are in contact with the main surfaces of the components and the core structure layers 81, 82, thereby contacting at least two surfaces that are flush with each other.

[0369] Figure 5 The cross-sectional view shows a cross section of a further exemplary embodiment of a component carrier 300 according to the invention, wherein in this embodiment the cavity 13 extends in the transverse direction such that the cavity 13 extends into the space between the core structure layers 81 and 82. The cavity 13 is therefore also partially delimited in the stacking direction Z by the core structure layers 81 and 82, in particular the cavity 13 is also partially delimited in the stacking direction Z by the main surfaces 108 of the core structure layers 81 and 82, which in this embodiment also form the main surfaces of the respective subcarrier ( Figure 5 are not indicated by reference numerals).

[0370] Apart from Figure 1a and Figure 2 In addition to the embodiment shown, in this embodiment, an electrically conductive layer structure 113 is provided, by means of which a further electrically conductive structure 96, also formed from an electrically conductive paste, is connected to the component 11 via an electrically conductive pad 125 and an electrically conductive paste 29 for filling the cavity 13. The additional electrically conductive layer structure 113 is arranged at a contact surface in the separating plane 32 between the electrically insulating layer structures 71 and 70.

[0371] Figure 6 A cross-sectional view of a cross section of a further exemplary embodiment of a component carrier 400 is shown, which also includes an additional electrically conductive layer structure 126. In this embodiment, however, the additional electrically conductive layer structure 126 is not arranged at a contact surface in the separating plane 32, but is arranged directly on the bottom main surface of the upper core structure layer 82, so that the additional electrically conductive layer structure 126 is also in contact with the bottom main surface of the component 12, in particular also with the electrically conductive layer structure (not shown further) of the component 12, and so that the additional electrically conductive layer structure 126 also penetrates into the conductive paste located in the cavity 13.

[0372] Depending on the electrical conductivity of the bottom side of upper component 12 , in particular of structure 48 , and accordingly of component 12 itself, an electrical connection to both components 11 and 12 or only to lower component 11 can be established via additional electrically conductive layer structure 126 .

[0373] If the bottom major surface (not indicated by a reference numeral) of the upper member 12, and in particular the structure 48, is electrically conductive, as in Figure 6 As shown in FIG, an electrical connection to the upper part 12 can be established via the electrically conductive structure 48 and via the electrically conductive layer structure 126. Figure 6 As shown by way of example in FIG, the upper component 12 is electrically connected to the lower component 11 via the pads 125 and the conductive structures 49 of the lower component 11, respectively via main surfaces (not indicated by reference numerals) of the respective components.

[0374] In at least one other possible embodiment, in particular in an alternative embodiment, the structure 48 may be an electrically insulating structure 48. In this case, the additional electrically conductive layer structure 126 may be electrically connected only to the lower component 11 (and not to the upper component 12), wherein the electrical connection between the lower component 11 and the additional electrically conductive layer structure 126 may be established in particular via the electrically conductive paste 29 located in the cavity 13 and via the pads 125 of the lower component 11, respectively via the main surfaces (not indicated with reference numerals) of the respective components, such as, for example Figure 6 shown.

[0375] Figure 7 A cross-sectional view shows a cross section of a further exemplary embodiment of a component carrier 500 according to the invention, wherein in this embodiment 500, nanowires 129 are arranged on a main surface of component 11, thereby at least partially delimiting cavity 13. Nanowires 129 can improve the adhesion of the electrically conductive paste to component 11. This allows for an improved electrical connection.

[0376] Figure 8 A cross-sectional view shows a cross section of a further exemplary embodiment of a component carrier 600 according to the present invention. In this embodiment 600, in addition to the conductive paste, a spacing block 130 is arranged in the cavity 13. This block 130 can particularly comprise or be made of copper and / or any other electrically conductive material. Such a block 130 can serve as a distance device 130 to ensure that a stack is provided with a defined distance between the first component 11 and the second component 12 in the stacking direction. Such a block 130 can particularly easily ensure that the components 11 and 12 are not compressed to an excessive extent during lamination, and prevent an excessive amount of electrically conductive paste 29 from being pressed out of the cavity 13.

[0377] Figure 9 The cross-sectional view shows a section through a further exemplary embodiment of a component carrier 700 according to the invention, wherein this embodiment is different from the previously described embodiment. Figure 1a 、 Figure 1b and Figure 2 1 and 200. However, in contrast to embodiments 100 and 200, in this embodiment 700, upper component 22 is significantly offset laterally to the left. In particular, upper component 22 is significantly offset laterally to the left by a distance dx. To further ensure a reliable electrical connection between the two components 21 and 22, this electrical connection is also established via cavity 23 filled with an electrically conductive paste (not indicated), with the pads of the components (also not indicated by reference numerals) overlapping almost completely, i.e., almost 100%.

[0378] The lateral offset dx of the component 22 creates a space above the lower component 21 in the stacking direction, wherein the space is used for further electrical connection of the component 21. Figure 9 It can be seen that in this exemplary embodiment 700, the component 21 is further electrically connected to another electrically conductive structure 133 via another pad 134 on the main surface side 24 of the component 21, which also faces the other two cavities 23. In this embodiment 700, the component 21 is electrically connected to the electrically conductive structure 133 provided on the core structure layer 84 of the subcarrier 84', and another component 22 electrically connected to the component 21 is embedded in the core structure layer 84 of the subcarrier 84', and the core structure layer 84 of the subcarrier 84' also faces the main surface 24 of the component 21.

[0379] exist Figure 9 In the embodiment 700 shown in FIG, further electrical connections are also achieved by means of an electrically conductive paste which is filled into further cavities 135, in particular further cavities 135 similar to the other cavities 23, and forms vias.

[0380] In another possible embodiment, the layer separation plane 31 can be located at a different vertical level (i.e. in the stacking direction Z), so as to be flush with the main surface of one of the core structure layers, for example, flush with the bottom main surface of the core structure layer 84 or flush with the upper main surface of the other core structure layer 83 for embedding the component 21. The separation plane 31 can also be flush with the outer material surface of the electrically conductive connecting structure, for example, flush with the outer material surface of the connecting structure 133 or 134.

[0381] Figure 10 Another possible embodiment of a component carrier 800 according to the invention is shown. Figure 9 The intermediate insulating layer structure formed by the two electrically insulating layer structures 73 and 74 shown in FIG. Figure 10In the embodiment shown by way of example in FIG, the component carrier 800 comprises an intermediate insulating layer structure 132 formed from only one electrically insulating layer structure 74, which is applied only to one of the core structure layers of the component carrier (here, to the core structure layer 83), for example, by soft lamination, printing, in particular 3D printing, etc., and is then introduced into the cavity 23, in particular completely into the cavity 23, in the intermediate insulating layer structure 132, after which the cavity 23 is filled with an electrically conductive paste to establish an electrical connection to the further component 22. Instead of filling with electrically insulating layer material from the electrically insulating layer structure 73, the space in the cavity 19 between the component 22 and the core layer structure 84 (not shown here) can be filled with another electrically insulating material 147, for example, by a gel-like electrically insulating material, as shown by way of example in the present embodiment 800.

[0382] In order to establish an electrical connection between the first component 21 and the subcarrier 84 ′, a subcarrier 84 ′ may be provided, which is also filled with an electrically conductive paste. Figure 9 Additional cavity 135 is shown and described above.

[0383] However, using only one electrically insulating layer structure 74 for the intermediate layer 132 allows the alternative use of plated standard vias 146 for establishing the electrical connection between the first component 21 and the subcarrier 84 ′, as shown. Figure 10 Said vias 146 can in particular be created in the same process step as the other cavities 23 and plated with a suitable electrically conductive plating material as is known from the prior art.

[0384] After the cavity 23, and respectively the cavity 135, is filled with an electrically conductive paste or is plated to form a plated standard via 146 to establish an electrical connection between the first component 21 and the upper sub-carrier 84', the bottom sub-stack (not indicated here by a figure mark - comprising the core structure layer 83, the first component 21 and the corresponding connecting structure (for example 133), and the cavity 23, 135 filled with the conductive paste, and respectively comprising the plated via 146) and the upper sub-stack (also not indicated - comprising the core structure layer 83 and the first component 21) can be stacked on top of each other and laminated together, in particular laminated together under the action of pressure and heat.

[0385] like Figure 10 This design of the component carrier shown in FIG. 1 with only one insulating layer structure (here 74 ) to form the intermediate layer (here 132 ) is not limited to Figure 10Furthermore, other embodiments of the component carrier according to the invention can be designed in a similar manner and comprise an intermediate layer formed from one electrically insulating layer structure instead of two electrically insulating layer structures combined by being stacked one above the other.

[0386] Figure 11 A section through another embodiment of a component carrier 900 according to the invention is shown, wherein the component carrier 900 can also include a third component 141, which is also above the first component 21 (at least partially superposed on the first component 21) and which is also electrically connected to the first component 21 via a further cavity 135 located between the first and third components 141 and via connection pads 133 and 134 on its main surface (side) 142 facing the first component 21. The cavity 135 is also filled with an electrically conductive paste and is also partially delimited by the third component 141, in particular by the connection pad 133 of the third component 141.

[0387] The third component 141 and the second component 22 are embedded in the same layer structure 84 , in particular, the third component 141 and the second component 22 are embedded in the same sub-carrier 84 ′.

[0388] The first component 21, the second component 22, and the third component 141 are electrically connected to each other, wherein, in this embodiment, the first component 21 serves as a bridge and is configured to bridge at least one signal from the second component 22 to the third component 141, and vice versa. Of course, another embodiment is also possible, wherein the third component and the first component 21 are embedded in the same layer structure, for example.

[0389] like Figure 11 As shown in , although components 22 and 141 are embedded in the same layer structure 84, components 21, 22, and 141 can have different heights (not shown) and different sizes and / or different functions. The main surfaces of the components can also be located at different vertical levels (i.e., in the stacking direction). For example, in embodiment 900, the upper main surface 143 of the third component 141, which is opposite the main surface 142 facing the cavity 135, is at a different vertical level than the upper main surface 144 of the second component 22 and is therefore not flush with the main surface 145 of the corresponding core structure layer 84.

[0390] Figure 11Components 22 and 141 of component carrier 900, shown as an example in FIG, are double-sided connection components. Each of these components 22 and 141 is also electrically connected to an electrically conductive layer structure 138 located on the outer surface of an electrically insulating layer structure 137, which is arranged on the upper surface of core structure layer 84. The electrical connection to electrically conductive layer structure 138, in particular to components 22 and 141, is formed by plated standard vias 136. To establish this double-sided connection, components 22 and 141 include electrically conductive connection structures (here, pads; not denoted by reference numerals) on both main surface sides.

[0391] As the illustrated embodiment clearly illustrates, the component carrier according to the invention allows for the embedding of a plurality of components of different sizes and types, with a high degree of flexibility regarding the arrangement of these components within the component carrier and / or within the stack, and enables a large number of possible reliable connection possibilities in a very compact and space-saving manner. Thus, at least in some embodiments, the connection density can be increased and miniaturization can be enhanced.

[0392] Reference Signs List

[0393] 100 First exemplary embodiment of a component carrier according to the invention

[0394] 200 Second exemplary embodiment of a component carrier according to the invention

[0395] 300 Further exemplary embodiments of the component carrier according to the invention

[0396] 400 Further exemplary embodiments of the component carrier according to the invention

[0397] 500 Further exemplary embodiments of the component carrier according to the invention

[0398] 600 Further exemplary embodiments of a component carrier according to the invention

[0399] 700 Further exemplary embodiments of a component carrier according to the invention

[0400] 800 Further exemplary embodiments of a component carrier according to the invention

[0401] 900 Further exemplary embodiments of a component carrier according to the invention

[0402] 10 First stacked element

[0403] 11 First component of the first stack

[0404] 12 Second component of the first stack

[0405] 13 A cavity filled with electrically conductive paste between the first and second components of the first stack

[0406] 13A A first portion of a cavity filled with electrically conductive paste between a first component and a second component of a first stack

[0407] 13B A second portion of the cavity filled with electrically conductive paste between the first and second components of the first stack

[0408] 14, 16 major surface of a component of the first stack facing the cavity of said stack

[0409] 15, 17 major surface of a component of the first stack facing away from the cavity of the stack

[0410] 18 Transverse wall of the cavity connecting the two parts of the first stack

[0411] 19 component cavity

[0412] 10A, 20A first sub-stack

[0413] 10B, 20B second sub-stack

[0414] 20 Second stacked element

[0415] 21 First component of the second stack

[0416] 22 Second component of the second stack

[0417] 23 a cavity filled with electrically conductive paste between the first and second components of the second stack 24, 26 a major surface of a component of the second stack facing the cavity of the stack

[0418] 25, 27 major surface of a component of the second stack facing away from the cavity of the stack

[0419] 28 Transverse wall of cavity connecting the two parts of the second stack

[0420] 29 Electrically conductive paste

[0421] 30 is located between the first stack and the second stack; the contact surface between adjacent layer structures

[0422] 31, 32 are located at the separation plane between the first sub-stack and the second sub-stack; the contact surface between adjacent layer structures

[0423] 40..45, 55..67 electrical conductive layer structure

[0424] Electrically conductive connection structure of components 46..54 and 68

[0425] 70..74 Electrical insulation layer structure

[0426] 70, 71 at least partially form a first electrically insulating layer structure of the middle layer of the first stack

[0427] 72 Electrically insulating layer structure located between the first stack and the second stack

[0428] 73, 74 at least partially forming a first electrically insulating layer structure of an intermediate layer of the second stack 75, 76, 99, 101 a portion of the electrically insulating layer structure extending into the space between the component and the transverse wall of the core structure layer

[0429] 81 ', 82 ' Sub-carriers of the first stack

[0430] 83', 84' sub-carriers of the second stack

[0431] 81..84 core structure layer

[0432] 90..94 through-hole connections, especially vias

[0433] 96 Additional cavity filled with electrically conductive paste

[0434] 97, 98 are located between the components and the transverse walls of the core structure layer

[0435] 102..107 Openings in electrically conductive structures

[0436] 108 Main surface of the core structure layer

[0437] 109 temporary bearing layer structure

[0438] Horizontal part of the electrical insulation layer structure 110, 111

[0439] 112, 116 second insulating layer structure

[0440] 113 Electrically conductive layer structure at the contact surface between two insulating layer structures

[0441] 114, 115 openings in the second electrically insulating layer structure

[0442] 117..121 Electrically conductive (layer) structure

[0443] 122 Part of the electrical insulation layer structure

[0444] 123, 124 Openings in electrically conductive structures

[0445] 125, 127 Electrically conductive (layer) structure

[0446] 126 Electrically conductive layer structure at the contact surface between the first insulating layer structure and the main surface of the core structure layer

[0447] 128 Second main surface of the core structure layer

[0448] 129 nanowire structure (layer)

[0449] 130 spacer blocks

[0450] 131, 132 intermediate electrical insulation layer structure

[0451] 133, 134 conductive connection structure

[0452] 135 Cavity filled with electrically conductive paste

[0453] 136 Vias, especially plated connections

[0454] 137 Electrical insulation layer structure

[0455] 138 Electrically conductive layer structure

[0456] 141 Third Part

[0457] 142, 143 Main surface of the third component

[0458] 144 main surface of the second component

[0459] 145 Main surface of the core structure layer

[0460] 146 standard plated vias

[0461] 147 Electrical insulation materials

[0462] C1 Geometric center of the first component in the transverse direction

[0463] C2 Geometric center of the second component in the transverse direction

[0464] dx Lateral offset between components

[0465] The horizontal extension of the non-overlapping area of ​​the ox component

[0466] lateral offset between px pads

[0467] H1 Height of the first component in the transverse direction

[0468] H2 Height of the second component in the transverse direction

[0469] L1: Length of the first component in the transverse direction

[0470] L2 Length of the second component in the transverse direction

[0471] X transverse direction, in particular the transverse direction perpendicular to the stacking direction

[0472] Z stacking direction.

Claims

1. A component carrier (100, 200, 300, 400, 500, 600, 700, 800, 900), comprising: A stack (10, 20) having a stacking direction (Z) and comprising at least one electrically insulating layer structure and at least one electrically conductive layer structure, wherein the stack (10, 20) further comprises at least a first component (11, 21) and a second component (12, 22), the first component (11, 21) and the second component (12, 22) being embedded in the stack (10, 20) one above the other along the stacking direction (Z) and having a cavity between the first component and the second component, wherein the first component (11, 21) and the second component (12, 22) each comprise a component main surface (14, 16; 24, 26) facing the cavity (13, 23) and partially delimiting the cavity (13, 23) in the stacking direction (Z), and Therein, the cavities (13, 23) are filled with an electrically conductive paste (29).

2. The component carrier (100, 200, 300, 400, 500, 600, 700, 800, 900) according to claim 1, wherein The first component (11, 21) and the second component (12, 22) are electrically connected to each other through the electrically conductive paste (29).

3. The component carrier (100, 200, 300, 400, 500, 600, 700, 800, 900) according to claim 1 or 2, wherein: The cavity (13, 23) is partially delimited in the transverse direction by at least one layer structure (70-76; 99, 101) of the stack (10, 20).

4. The component carrier (100, 200, 300, 400, 500, 600, 700, 800, 900), among which, The component carrier (100, 200, 300, 400, 500, 600, 700, 800, 900) comprises a first sub-carrier (82', 84') and a second sub-carrier (81', 83'), wherein the first sub-carrier (82', 84') and the second sub-carrier (81', 83') are stacked one above the other in a stacking direction (Z), in particular wherein the first sub-carrier (82', 84') and the second sub-carrier (81', 83') each comprise a sub-carrier main body facing the cavity (13, 23) surface (108), wherein, in particular, the cavity (13, 23) is also partially delimited in the stacking direction (Z) by at least one of the sub-carrier main surfaces (108), and / or in particular, wherein the stack (10, 20) comprises at least a first sub-stack (10A, 20A) and a second sub-stack (10B, 20B), the first sub-stack (10A, 20A) and the second sub-stack (10B, 20B) being stacked one above the other in the stacking direction (Z).

5. The component carrier (100, 200, 300, 400, 500, 600, 700, 800, 900) according to claim 4, wherein At least one of the first sub-carrier (82', 84') and the second sub-carrier (81', 83') includes a core structure layer (81, 82, 83, 84), and the core structure layer (81, 82, 83, 84) includes at least one component cavity (19), wherein at least one component is embedded in the at least one component cavity (19), preferably, the first component (11, 21) or the second component (12, 22) is embedded in the at least one component cavity (19).

6. The component carrier (100, 200, 300, 400, 500, 600, 700, 800, 900) according to claim 4 or 5, wherein: The first sub-stack (10A, 20A) comprises the first component (11, 21), and wherein the second sub-stack (10B, 20B) comprises the second component (12, 22).

7. The component carrier (100, 200, 300, 400, 500, 600, 700, 800, 900) according to claim 6, wherein At least one of the first sub-stack (10A, 20A) and the second sub-stack (10B, 20B) further comprises at least a first outer insulating layer structure (70, 71; 73, 74), in particular, the first outer insulating layer structure (70, 71; 73, 74) forms at least a part of the intermediate layer structure (131, 132).

8. The component carrier (100, 200, 300, 400, 500, 600, 700, 800, 900) according to any one of claims 4 to 7, wherein The component carrier (100, 200, 300, 400, 500, 600, 700, 800, 900) further comprises at least one alignment structure (66, 67, 102-107), the at least one alignment structure (66, 67, 102-107) being at least partially arranged on at least one of the first sub-carrier (82', 84') and the second sub-carrier (81', 83') and / or being at least partially arranged on the first sub-carrier (82', 84') and the second sub-carrier (81', 83'). In at least one of the two sub-carriers (81', 83'), in particular, the at least one alignment structure (66, 67, 102-107) is at least partially arranged on at least one of the first sub-stack (10A, 20A) and the second sub-stack (10B, 20B) and / or is at least partially arranged in at least one of the first sub-stack (10A, 20A) and the second sub-stack (10B, 20B), in particular wherein the at least one alignment structure (66, 67, 102-107) is at least partially arranged on at least one of the first sub-stack (10A, 20A) and the second sub-stack (10B, 20B) -107) is configured to: align the intermediate layer structure (131, 132); and / or align the electrically conductive paste (29); and / or align the first sub-carrier (82', 84') and the second sub-carrier (81', 83'); and / or align the first sub-stack (10A, 20A) and the second sub-stack (10B, 20B); and / or align the intermediate layer structure (131, 132), the electrically conductive paste (29), the first sub-carrier (82', 84') and the second sub-carrier (81', 83'), and the combination of the first sub-stack (10A, 20A) and the second sub-stack (10B, 20B); and / or aligning the intermediate layer structure (131, 132), the electrically conductive paste (29), the first sub-carrier (82', 84') and the second sub-carrier (81', 83'), and at least two of the first sub-stack (10A, 20A) and the second sub-stack (10B, 20B) relative to each other.

9. The component carrier (100, 200, 700, 800, 900) according to any one of the preceding claims, wherein At least two components (11, 12; 21, 22) are stacked one above the other and have a defined lateral offset (dX) relative to each other in a transverse direction (X), in particular at least the first component (11, 21) and the second component (12, 22) are stacked one above the other and have a defined lateral offset (dX) relative to each other in a transverse direction (X).

10. The component carrier (900) according to any one of the preceding claims, wherein The component carrier (900) further comprises at least a third component (141), wherein the third component (141) is also embedded in the stack (10, 20) and the third component (141) is stacked with the first component (21) and / or the second component (22) in a stacking direction (Z), and a further cavity (135) is present between the third component (141) and the first component (21) and / or the second component (22), wherein the third component (141) further comprises a component main surface (142), the component main surface (142) of the third component (141) faces the further cavity (135) and partially delimits the further cavity (135) in the stacking direction (Z), and wherein the further cavity (135) is filled with an electrically conductive paste.

11. The component carrier (900) according to claim 10, wherein The first component (21), the second component (22) and the third component (141) are electrically connected to each other, wherein the first component (21) among the first component (21), the second component (22) and the third component (141) serves as a bridge and is particularly configured to bridge at least one signal from the second component (22) to the third component (141), and in particular, the first component (21) among the first component (21), the second component (22) and the third component (141) is configured to bridge at least one signal from one of the second component (22) and the third component (141) to the other of the second component (22) and the third component (141).

12. The component carrier (300, 400) according to any one of the preceding claims, wherein At least one electrically conductive layer structure (113, 126) is arranged such that: the at least one electrically conductive layer structure (113, 126) is in contact with the electrically conductive paste (29) at a lateral side of the at least one electrically conductive layer structure (113, 126) and / or the at least one electrically conductive layer structure (113, 126) penetrates into the electrically conductive paste (29) from the lateral side of the cavity.

13. Component carrier according to any of the preceding claims, wherein The first component and the second component are directly connected, and / or the first component and the second component are connected only through the electrically conductive paste.

14. Component carrier according to any of the preceding claims, wherein The cavity includes tapered transverse walls.

15. The component carrier according to claim 7, wherein The cavity is completely bounded by only the first component, the second component and the first outer insulating layer structure.

16. The component carrier according to claim 4, wherein The first component is at least partially embedded in the first subcarrier, and the second component is at least partially embedded in the second subcarrier.

17. Component carrier according to claim 4 or 16, wherein The first component is at least partially embedded in the first sub-carrier so that: the component main surface of the first component is at least partially exposed and faces the second sub-carrier, wherein the exposed component main surface of the first component partially limits the cavity, and wherein the second component is at least partially embedded in the second sub-carrier so that: the component main surface of the second component is at least partially exposed and faces the first sub-carrier, wherein the exposed component main surface of the second sub-carrier partially limits the cavity.

18. The component carrier according to claim 7, wherein A portion of the first outer insulation layer structure and / or a portion of the second outer insulation layer structure of at least one of the first sub-stack and the second sub-stack extends into the space between the first component or the second component and a transverse wall of the core structure layer or the entire core structure layer that delimits the at least one component cavity.

19. The component carrier according to claim 18, wherein At least one component main surface is flush with one of the main surfaces of the core structure layer, so that one of the first outer insulation layer structure or the second outer insulation layer structure is in contact with the component main surface and the main surface of the core structure layer, thereby contacting at least two surfaces that are flush with each other.

20. A method for producing a component carrier (100, 200, 300, 400, 500, 600, 700, 800, 900), the method comprising at least the following steps: a) providing a first component (11, 21) and a second component (12, 22), each of the first component (11, 21) and the second component (12, 22) comprising a component major surface (14, 16, 24, 26), b) forming a stack (10, 20) having a stacking direction (Z) and comprising at least one electrically insulating layer structure (70-74) and at least one electrically conductive layer structure (40-45, 55-67; ​​112-113; 116-121; 125-127; 129), wherein forming the stack (10, 20) comprises: The first component (11, 21) and the second component (12, 22) are embedded one above the other in a stacking direction (Z), with a cavity (13, 23) between the first component (11, 21) and the second component (12, 22), and the component main surfaces (14, 16, 24, 26) of the first component (11, 21) and the second component (12, 22) face the cavity (13, 23) and partially delimit the cavity (13, 23) in the stacking direction (Z), and filling the cavities (13, 23) with an electrically conductive paste (29); and c) Providing a component carrier (100, 200, 300, 400, 500, 600, 700, 800, 900) with the formed stack (10, 20).

21. The method according to claim 20, wherein Forming the stack (10, 20) includes: forming a first sub-stack (10A, 20A) comprising a first component (11, 21) and a first portion (13A) of the cavity (13, 23) to be filled with the electrically conductive paste (29), wherein the first component (11, 21) is at least partially embedded in the first sub-stack (10A, 20A), forming a second sub-stack (10B, 20B) comprising a second component (12, 22) and a second portion (13B) of the cavity (13, 23) to be filled with the electrically conductive paste (29), wherein the second component (12, 22) is at least partially embedded in the second sub-stack (10B, 20B), filling the first portion of the cavity (13, 23) and / or the second portion of the cavity (13, 23) with the electrically conductive paste (29), and The first sub-stack (10A, 20A) and the second sub-stack (10B, 20B) are arranged one above the other in a stacking direction (Z), wherein the first portion of the cavity (13, 23) and the second portion of the cavity (13, 23) face each other, thereby forming the cavity (13, 23) between the first part (11, 21) of the first portion of the cavity (13, 23) of the first sub-stack (10A, 20A) and the second part (12, 22) of the second portion of the cavity (13, 23) of the second sub-stack (10B, 20B).

22. A package, comprising: at least one component carrier (100, 200, 300, 400, 500, 600, 700, 800, 900) according to any one of claims 1 to 19, and / or at least one component carrier (100, 200, 300, 400, 500, 600, 700, 800, 900) manufactured according to the method of claim 20 or 21; and at least one further part assembled with the component carrier (100, 200, 300, 400, 500, 600, 700, 800, 900).

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