Manufacturing method of power division antenna

Abstract

The invention discloses a manufacturing method of a power division antenna, and the method comprises the steps: designing an electrode region and a resistance region of the power division antenna based on a preset power division antenna model, and screening a first material meeting a preset requirement and a first printing technology corresponding to the first material based on the graphic size of the electrode region, and determining a second material, material parameters and a corresponding second printing technology which meet a preset requirement based on the graphic size of the resistance area and a preset target resistance value, printing by adopting the first printing technology and the second printing technology, and curing the printed power division antenna, the first resistance value of the electrode area and the second resistance value of the resistance area are measured, when the first resistance value meets the preset fixed resistance value and the second resistance value meets the preset target resistance value, the manufacturing of the sub-antenna is determined, the flexibility degree is high, the process method is simple, and the control accuracy of the shape of the electrode and resistance network can be ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic additive manufacturing, and in particular to a method for manufacturing a power splitter antenna. Background Art

[0002] Power dividers are widely used in wireless communication systems, radar systems, satellite communication systems, and other fields. They can be used to distribute input signals to multiple antennas or receivers, achieving multi-channel power distribution to meet signal coverage and reception, as well as the system's needs for signal processing and transmission. The traditional power divider manufacturing process is overly complex, involving multiple steps such as impedance transformer and T-junction fabrication, circuit assembly, welding, and circuit packaging. The welding process often causes problems with pin parasitic resistance and parasitic capacitance, making it difficult to adapt to the high-precision application requirements of power dividers. Furthermore, with the development of curved conformal devices, existing manufacturing methods have become difficult to apply to curved substrates.

[0003] With the development of electronic additive manufacturing, 3D printing has provided a new solution for the manufacturing of power dividers. How to customize the shape, size and function of the power divider according to customer needs or specific application scenarios, adapt to the high-precision application requirements of the power divider, and simplify the process are urgent issues that need to be addressed. Summary of the Invention

[0004] In response to the problems of complex processes and multiple steps in traditional power splitter antenna preparation methods, the present invention provides a method for manufacturing a power splitter antenna with high flexibility and simple process methods. It can ensure precise control of the shapes of electrodes and resistor networks, and greatly improve the problems of parasitic resistance and capacitance caused by traditional resistor device mounting and welding.

[0005] To achieve the above object, the present invention adopts a method for manufacturing a power splitter antenna, comprising the following steps: Design the electrode area and resistance area of ​​the power splitter antenna based on the pre-set power splitter antenna model; selecting a first material that meets preset requirements and a first printing technology corresponding to the first material based on the graphic size of the electrode area; Determining a second material, material parameters, and a corresponding second printing technology that meet preset requirements based on the graphic size of the resistance area and the preset target resistance value; Printing is performed using the first printing technology and the second printing technology, and curing is performed on the printed power splitter antenna; measuring a first resistance value of the electrode region and a second resistance value of the resistor region; When the first resistance value satisfies the preset fixed resistance value and the second resistance value satisfies the preset target resistance value, it is determined that the fabrication of the power splitting antenna is completed.

[0006] Furthermore, the printing using the first printing technology and the second printing technology includes: Slicing the electrode area and the resistor area to generate printing path files respectively; The printing substrate is placed on the printing device platform and fixed, and before printing begins, the blade is aligned, the printing parameters are adjusted, and the printing programs corresponding to the first printing technology and the second printing technology are executed; The printing of the power splitter antenna is completed based on the printing program and the printing path file.

[0007] Furthermore, when the two resistance values ​​are greater than the preset target resistance values, the thickness of the stacked resistance pattern in the resistance region is increased; when the two resistance values ​​are less than the preset target resistance values, the resistance value is increased by laser trimming or physical material reduction.

[0008] Furthermore, the first material includes: conductive silver paste, conductive nano-silver ink or conductive nano-copper ink.

[0009] Furthermore, the second material includes: carbon paste, ruthenium oxide paste, graphene paste, carbon ink or graphene oxide ink; the material parameter is that the square resistance value of the second material is not less than twice the calculated square resistance value.

[0010] Furthermore, the graphic size of the electrode area is printed using a print head, and the thickness of the graphic size is controlled by multi-layer printing; the overlap amount of the graphic size of the resistor area with the graphic size of the electrode area is not less than 20% of the length of the resistor area.

[0011] Furthermore, the printing substrate is placed on the printing device platform and fixed, and the blade is aligned before printing begins, including: Determining the type of the printing substrate, wherein the type of the printing substrate includes: a film substrate and a hard substrate substrate; When the printing substrate is a film substrate, the film substrate is fixed by negative pressure adsorption; when the printing substrate is a hard substrate, the hard substrate is fixed by a pressing plate; Determining a processing technology for the tool setting process, wherein the processing technology includes: a contact micro-pen direct writing process and a non-contact aerosol and piezoelectric inkjet process; When the processing technology is a contact micro-pen direct writing process, the tool height is set to half the diameter of the small-diameter printing nozzle; when the processing technology is a non-contact aerosol and piezoelectric inkjet process, the tool height is set to 1 mm, wherein the tool height is the distance between the printing nozzle and the printing substrate.

[0012] Furthermore, the printing device platform adopts piezoelectric inkjet printing technology, micro-pen direct writing printing technology and aerosol jet printing technology.

[0013] Furthermore, the printing parameters include printing speed, air pressure, ink drop overlap rate and line overlap rate.

[0014] Furthermore, the first resistance value satisfies a preset fixed resistance value, including: The first resistance is less than 0.1Ω.

[0015] Compared with the prior art, the present invention has the following beneficial effects: The process is simple, avoiding the waste of raw materials associated with micromachining and the damage to power divider components caused by welding. Furthermore, the printing paste or ink has a certain degree of fluidity, which can form a smooth surface. The printed shape is free of sharp edges and burrs, thus reducing the problems of irregular shapes and performance mismatches caused by the mechanized manufacturing process in traditional power divider production.

[0016] After material compatibility research, the electrode material and the resistor material can achieve the performance index requirements of the power splitter antenna. The electrode material is made of excellent conductive metal material, which can achieve high-precision circuit connection and avoid affecting the resistance value.

[0017] The resistance of both the electrode and resistor parts can be flexibly controlled through fine-tuning of the pattern design model and layer thickness control.

[0018] The resistance value can be controlled by calculating the required thickness and size through a mathematical formula in advance, and the accuracy of the mathematical theoretical formula can be verified through preliminary basic experiments. After the resistor is printed and cured, if the resistance value is greater than the target resistance value, it can be reduced by printing again to increase the thickness. If the resistance value is less than the target resistance value, it can be increased by laser adjustment or reducing the thickness by subtracting material.

[0019] It is easy to integrate into existing three-axis and five-axis motion systems, and can realize the printing of flat resistors as well as curved resistors, which greatly increases its flexibility of application.

[0020] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present application, nor is it intended to limit the scope of the present application. Other features of the present application will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Hereinafter, the present invention will be described in more detail based on embodiments with reference to the accompanying drawings.

[0022] Figure 1 This is a flowchart of an exemplary method for manufacturing a power splitting antenna provided in this application; Figure 2 This is a specific implementation flow chart of an exemplary method for manufacturing a power splitting antenna provided in this application; Figure 3 This is a schematic diagram of an exemplary micro-pen direct writing printing electrode and resistor provided in this application; Figure 4 is a schematic diagram of an exemplary resistor value adjustment process provided by the present application; Figure 5 This is a schematic diagram of an exemplary printed power splitter antenna provided in this application; Figure 6 This is a physical diagram of an exemplary printed power splitter antenna provided in this application; Figure 7 This is a schematic diagram of the overlap position in a schematic diagram of an exemplary micro-pen direct writing printing electrode and resistor provided in this application.

[0023] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0024] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with examples and drawings. The exemplary embodiments of the present invention and their descriptions are only used to explain the present invention and are not intended to limit the present invention.

[0025] It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0026] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0027] This application uses electronic 3D printing technologies such as micro-pen direct writing and piezoelectric inkjet technology to prepare complex resistor network power divider antenna devices. These technologies greatly enhance the design flexibility and customization level. The shape, size, and function of the power divider can be customized according to customer needs or specific application scenarios, allowing for rapid prototype production directly from digital models. At the same time, electronic 3D printing technology can use a variety of materials including silver paste, kneading paste, copper paste, carbon paste, etc., providing a wide range of material options for the design of power dividers and helping to optimize their performance.

[0028] Furthermore, electronic 3D printing enables highly precise material deposition and curing, ensuring the precise size and shape of the power divider. Compared to traditional manufacturing methods, it significantly reduces production cycle time and improves efficiency. By precisely controlling the material deposition location, electronic 3D printing reduces material waste and lowers production costs. Printed resistors can be trimmed using laser subtractive methods to precisely control the target resistance value.

[0029] Power splitters are used to increase signal gain, filter and shape signals, and improve signal quality, playing a vital role in improving signal communication quality. The cost of preparing power splitters is high and the process is complex.

[0030] The present invention provides a method for manufacturing a power-splitting antenna. The electrode portion of the power-splitting antenna is printed on a substrate using a conductive nanosilver material or a conductive silver paste. A resistor material is printed and deposited on the electrode to form a specific power-splitting antenna pattern, thereby forming a complex resistor network power-splitting antenna device. The design concept primarily relies on separating the electrode and resistor, printing a transition zone between the two, and connecting the two by overlapping materials. The resistor value prepared in this manner can be adjusted to meet usage requirements. The overall process is simple, the cost is low, and the prepared power-splitting antenna has stable and reliable performance, with broad application prospects. The preparation method is described in the following examples.

[0031] A method for manufacturing a power splitter antenna, see Figure 1 The flowchart of a method for manufacturing a power splitter antenna shown includes steps S110 to S160.

[0032] S110: Designing an electrode region and a resistor region of the power splitting antenna based on a preset power splitting antenna model.

[0033] In this embodiment, the design can be specifically based on the complex resistor network power splitter antenna model, wherein, refer to Figure 5 The schematic diagram of the printed power splitter antenna model shown here includes information such as the electrode spacing and the target resistance value, providing preliminary information on the power splitter antenna pattern size. The printed pattern sizes of the electrodes and resistors should be kept minimal to avoid printing defects and distortion in smaller locations. The resistor pattern should be designed to be as thin as possible to facilitate subsequent thickness reduction through overlay printing to achieve the target resistance.

[0034] S120: Screening a first material that meets preset requirements and a first printing technology corresponding to the first material based on the graphic size of the electrode area.

[0035] S130: Determine a second material, material parameters, and a corresponding second printing technology that meet preset requirements based on the graphic size of the resistance area and the preset target resistance value.

[0036] In the above embodiments of the present application, according to the graphic dimensions of the designed power splitter antenna electrodes and resistors, a conductive material adapted to the electrode graphic dimensions and a resistor material adapted to the resistor graphic dimensions are selected, and the square resistance of the required resistor material is calculated according to the target resistance. The material selection should pay attention to the principle of material adaptability, and it is necessary to consider the curing temperature of the two materials, the matching with the temperature resistance of the substrate, the adhesion of the material on the substrate, the temperature shock resistance, the resistance drift rate with temperature, and the printability.

[0037] S140: Printing is performed using the first printing technology and the second printing technology, and curing is performed on the printed power splitter antenna.

[0038] In some embodiments, printing is performed using the first printing technology and the second printing technology, including steps S210 to S230, see Figure 2 A specific implementation flow chart of a method for manufacturing a power splitter antenna is shown.

[0039] S210: Slicing the electrode area and the resistor area to generate printing path files respectively.

[0040] In an embodiment of the present application, the electrode area and the resistor area of ​​the power splitter antenna can be sliced ​​using CAM software to generate printing path files respectively; the printing path can be planned and the print nozzle diameter can be selected to ensure that the printing material is accurately deposited according to the designed graphics to form a power splitter antenna.

[0041] S220: placing the printing substrate on the printing device platform and fixing it, performing knife alignment before printing, adjusting printing parameters, and executing printing programs corresponding to the first printing technology and the second printing technology.

[0042] In the embodiment of the present application, the printing substrate is placed on the printing device platform and fixed, the knife is aligned before printing begins, the printing parameters are adjusted, the printing program is executed, and the printing of the power splitter antenna is completed.

[0043] S230: Complete printing of the power splitter antenna based on the printing program and the printing path file.

[0044] In some embodiments, the printing substrate is placed on a printing device platform and fixed, and before printing begins, the blade is aligned and the printing parameters are adjusted, including: Determining the type of printing substrate, wherein the types of printing substrates include: film substrates and hard substrates; When the printing substrate is a film substrate, the film substrate is fixed by negative pressure adsorption; when the printing substrate is a hard substrate, the hard substrate is fixed by a pressing plate; Determine the processing technology for tool setting, where the processing technology includes: contact micro-pen direct writing process and non-contact aerosol and piezoelectric inkjet process; When the processing technology is a contact micro-pen direct writing process, the tool height is set to half the diameter of the small-diameter print nozzle; when the processing technology is a non-contact aerosol and piezoelectric inkjet process, the tool height is maintained at 1mm.

[0045] Usually, film substrates are fixed by negative pressure adsorption, and hard substrates are fixed by pressing plates. Before printing, the substrate surface should be clean and free of dirt.

[0046] Step S150: measuring a first resistance value of the electrode region and a second resistance value of the resistor region.

[0047] In this embodiment, the printed power splitter antenna is cured. After curing, the electrode and resistor values ​​are measured to ensure connectivity. The resistance value is then compared to the target resistance. If the target resistance is met, the power splitter antenna is complete. Low-temperature resistor materials such as carbon slurry and graphene slurry can be cured using methods such as ovens and hot plate sintering, while high-temperature resistor materials such as platinum materials require high-temperature sintering.

[0048] Step S160 : When the first resistance value satisfies the preset fixed resistance value and the second resistance value satisfies the preset target resistance value, it is determined that the fabrication of the power splitting antenna is completed.

[0049] In the embodiment of the present application, when the resistance value does not meet the requirements in step S160, if the difference is large, the resistance value is adjusted by reprinting by adjusting the optimized printing parameters. If the difference is small, the resistance value can be adjusted based on the resistor that has been printed and cured. After the resistance value control is stable, resin material packaging and other methods can also be used to avoid the influence of external environmental temperature, humidity, etc. on the stability of the resistor.

[0050] In some embodiments, see Figure 4 The schematic diagram of the resistor value adjustment process shown in FIG. 1 shows that when the second resistance value is greater than the preset target resistance value, the thickness of the stacked resistor pattern in the resistor region is increased (see FIG. Figure 4 The upper part is laminated and printed); when the resistance value is less than the preset target resistance value, laser trimming is used to increase the resistance value or physical subtraction is used to increase the resistance value (see Figure 4 The lower part is laser trimmed or physically cut).

[0051] In some embodiments, the electrode area is printed with a small diameter print head, and the thickness of the pattern is controlled by multi-layer printing. The electrode and resistor area pattern sizes are designed so that the overlap of the resistor pattern on the electrode is not less than 2 times the diameter of the selected print head, that is, not less than 20% of the length of the resistor area. This is to avoid the problem of missing lines due to unreasonable planning of the starting and ending lines during the printing path planning process, which may lead to dimensional deviation problems and changes in the final resistor value. Therefore, the size design and printing path planning should be reasonable as much as possible. For details, please refer to Figure 3 A schematic diagram of a micro-pen direct writing printing electrode and resistor is shown.

[0052] It should be noted that, see Figure 7 As shown by the arrow, the overlap amount includes the overlapping area of ​​the resistor and the electrode on one side.

[0053] In some embodiments, the resistor slurry is a carbon slurry, a ruthenium oxide slurry, a graphene slurry, a carbon ink, or a graphene oxide ink, and its square resistance is no less than the calculated square resistance of the printing material and no more than double the calculated square resistance. The goal is to achieve as precise a resistor printing value as possible in one go by combining theoretical calculation formulas with actual printing data measurements and a stacked printing strategy. This also facilitates fine-tuning of the resistor model size to achieve fine-tuning of the resistor value. Otherwise, if the resistance deviation is large, the target resistance cannot be achieved or is difficult to adjust to the target resistance.

[0054] In some embodiments, CAM software is used for path planning to generate a printing path. The path filling mode can be set to reciprocating filling, and the step distance is set to half the diameter of the print nozzle, that is, the overlap rate between printed lines is set to 40%. A higher overlap rate between lines can ensure that the printed graphics are complete, continuous and undistorted.

[0055] In some embodiments, the printing device is an electronic 3D printing device that integrates micro-pen direct writing printing technology and piezoelectric inkjet printing technology. The tool alignment process requires selecting a fixed point on the printing substrate for calibration to facilitate the subsequent tool alignment of the resistance material in the power splitter antenna.

[0056] In some embodiments, adjusting printing parameters involves adjusting layer height, print speed, or air pressure to achieve continuous, uniform, and breakpoint-free printed lines using a print line test. This is primarily intended to achieve consistent printed resistor patterns and, ultimately, consistent resistor values.

[0057] In some embodiments, the electrode resistance measurement value should be less than 0.1Ω. The electrode resistance can be changed by changing the thickness of the electrode region through multi-layer stacking. The influence of the electrode resistance on the resistance measurement should be reduced as much as possible.

[0058] In some embodiments, optimizing printing parameters means adjusting the resistance by changing the printing thickness by changing the printing speed, extrusion pressure, and number of printing layers.

[0059] In some embodiments, when fine-tuning of resistance is required, fine-tuning of resistance is achieved by adjusting printing parameters to change the width and thickness of the printed resistance line; when resistance needs to be adjusted over a larger range, the resistance value is increased by increasing or shortening the length of the design pattern if there is sufficient space between the two electrodes.

[0060] In some embodiments, resistance adjustment based on the printed and cured resistor means: when the actual printed resistance value is much greater than the target resistance value, the resistance value is adjusted by printing the same or different patterns on the original resistor pattern, changing the overall thickness or local thickness of the original resistor pattern, and selecting the same type of resistor paste with a suitable square resistance value according to the adjustment range. The same type of paste is preferred, mainly to ensure the same curing system and the adhesion between the pastes. Specifically, according to the range of resistance adjustment, the resistance is adjusted similarly to the effect of parallel resistors, and the appropriate square resistance paste is selected by calculating the required resistance value. Of course, different types of resistor pastes can also be selected while ensuring the matching of physical properties, such as curing temperature, interlayer adhesion, expansion coefficient and environmental adaptability.

[0061] In a specific embodiment, the present application is implemented in the following manner: Printing substrate: polyimide film Electrode: Electrode spacing is 0.3mm. Thickness: Based on the actual printing thickness (20-50μm). Printing material: Conductive silver paste, viscosity: 80-180Pa·s; thermal conductivity: 14.2W / mk; volume resistivity: 1.2×10-5Ω·cm; solids content: 100%. Curing temperature: 120°C for 0.5h. Electrode printing parameters: Use a 0.11mm diameter micro-pen direct writing nozzle, print pressure: 0.3MPa, layer height: 0.05mm, and print speed: 300mm / min.

[0062] Resistor: Target resistance: 50Ω ± 10%, resistor dimensions: 1.5 × 1.0mm, thickness: subject to actual printing thickness (20-50μm), printed resistor material: carbon paste, viscosity: (4-5) × 104Cp, square resistance: 1kΩ / , curing temperature: 160°C for 0.5h. Resistor printing parameters: 0.21mm micro-pen direct writing nozzle, printing pressure: 0.35MPa, layer height: 0.1mm, printing speed: 400mm / min.

[0063] Printing equipment: dual micro-pen direct writing 3D printer.

[0064] The specific printing process is as follows: S1. Printing Substrate Treatment: Place the polyimide film in a corona treatment chamber with a power setting of 25kW and a treatment duration of 10 seconds. The purpose of corona treatment is to improve the bond strength between the printed material and the substrate.

[0065] S2. Place the corona-treated polyimide film on the print platform. Since polyimide substrates are thin films, simply enable the negative pressure adsorption function to aid fixation. Clean the surface of the polyimide substrate with anhydrous ethanol and wipe it clean with a sterile cloth.

[0066] S3. Since the micro-pen direct writing printing process involves two materials, it is necessary to calibrate the coordinate origin and the tool setting. The camera calibration function of the device is used to complete the positioning of the coordinate origin and the calibration of the print head position.

[0067] S4. Use conductive silver paste to print the electrode area. The material selection and micro-pen direct writing process parameters are set as above. Complete the printing of the electrode area. After printing, remove it and place it in an oven at 120°C to cure for 0.5 hours.

[0068] S5. Use carbon paste material to print the resistor area. The material selection and micro-pen direct writing process parameters are set as above. Complete the printing of the resistor area. After printing, remove it and place it in an oven at 160°C to cure for 0.5 hours.

[0069] S6. Use a multimeter to measure the resistance value. The actual resistance value is 30Ω~50Ω. See Table 1 for the specific data and the morphology diagram. Figure 6 A physical picture of a printed power splitter antenna is shown.

[0070] S7. Since the actual resistance value tested is generally smaller than the target resistance value, laser resistance trimming can be used to reduce the thickness of the resistor block and lower the resistance value. A laser scanning area with the same size as the resistor is designed in the laser for scanning. After laser trimming, the resistance value of the resistor meets the requirement of 50Ω±10%.

[0071]

[0072] Table 1 It should be noted that, in this document, the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or system comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or system. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or system comprising the element.

[0073] The serial numbers of the above embodiments of the present invention are for description only and do not represent the advantages or disadvantages of the embodiments.

[0074] Through the description of the above embodiments, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus the necessary general hardware platform, and of course can also be implemented by hardware, but in many cases the former is a better embodiment. Based on this understanding, the technical solution of the present invention is essentially or the part that contributes to the prior art can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) as described above, and includes a number of instructions for enabling a terminal device (which can be a mobile phone, computer, server, or network device, etc.) to execute the methods described in each embodiment of the present invention.

[0075] The above are only preferred embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention description and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A method for manufacturing a power splitter antenna, characterized in that: The following steps are involved: Design the electrode area and resistance area of ​​the power splitter antenna based on the pre-set power splitter antenna model; selecting a first material that meets preset requirements and a first printing technology corresponding to the first material based on the graphic size of the electrode area; Determining a second material, material parameters, and a corresponding second printing technology that meet preset requirements based on the graphic size of the resistance area and the preset target resistance value; Printing is performed using the first printing technology and the second printing technology, and curing is performed on the printed power splitter antenna; measuring a first resistance value of the electrode region and a second resistance value of the resistor region; When the first resistance value satisfies the preset fixed resistance value and the second resistance value satisfies the preset target resistance value, it is determined that the fabrication of the power splitting antenna is completed.

2. The method for manufacturing a power splitter antenna according to claim 1, wherein: Printing by using the first printing technology and the second printing technology includes: Slicing the electrode area and the resistor area to generate printing path files respectively; The printing substrate is placed on the printing device platform and fixed, and before printing begins, the blade is aligned, the printing parameters are adjusted, and the printing programs corresponding to the first printing technology and the second printing technology are executed; The printing of the power splitter antenna is completed based on the printing program and the printing path file.

3. The method for manufacturing a power splitter antenna according to claim 1, wherein: When the two resistance values ​​are greater than the preset target resistance values, the thickness of the stacked resistance pattern in the resistance region is increased; when the two resistance values ​​are less than the preset target resistance values, the resistance value is increased by laser trimming or physical material reduction.

4. The method for manufacturing a power splitter antenna according to claim 1, wherein: The first material includes: conductive silver paste, conductive nano-silver ink or conductive nano-copper ink.

5. The method for manufacturing a power splitter antenna according to claim 1, wherein: The second material includes: carbon paste, ruthenium oxide paste, graphene paste, carbon ink or graphene oxide ink; the material parameter is that the square resistance value of the second material is not less than twice the calculated square resistance value.

6. The method for manufacturing a power splitter antenna according to claim 2, wherein: The graphic size of the electrode area is printed using a print head, and the thickness of the graphic size is controlled by multi-layer printing; the overlap amount of the graphic size of the resistor area with the graphic size of the electrode area is not less than 20% of the length of the resistor area.

7. The method for manufacturing a power splitter antenna according to claim 6, wherein: The printing substrate is placed on the printing device platform and fixed, and the blade is aligned before printing begins, including: Determining the type of the printing substrate, wherein the type of the printing substrate includes: a film substrate and a hard substrate substrate; When the printing substrate is a film substrate, the film substrate is fixed by negative pressure adsorption; when the printing substrate is a hard substrate, the hard substrate is fixed by a pressing plate; Determining a processing technology for the tool setting process, wherein the processing technology includes: a contact micro-pen direct writing process and a non-contact aerosol and piezoelectric inkjet process; When the processing technology is a contact micro-pen direct writing process, the tool height is set to half the diameter of the print head; when the processing technology is a non-contact aerosol and piezoelectric inkjet process, the tool height is set to 1 mm, wherein the tool height is the distance between the print head and the printing substrate.

8. The method for manufacturing a power splitter antenna according to claim 2, wherein: The printing device platform adopts piezoelectric inkjet printing technology, micro-pen direct writing printing technology and aerosol jet printing technology.

9. The method for manufacturing a power splitter antenna according to claim 2, wherein: The printing parameters include printing speed, air pressure, ink drop overlap rate and line overlap rate.

10. The method for manufacturing a power splitter antenna according to claim 1, wherein: It is characterized by: The first resistance value satisfies a preset fixed resistance value, including: The first resistance is less than 0.1Ω.

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