A tile-based analog multi-beam phased array transceiver assembly

Abstract

The application provides a tile type analog multi-beam phased array transceiving assembly, which comprises a radio frequency common port connector, a low frequency connector, an upper cavity, a welding ring, a pin, a lower cavity, a fastening screw, a high-low frequency mixed pressure printed board, a radio frequency separate port connector, a multi-channel amplitude and phase control chip and a transceiving integrated multifunctional chip, the multi-channel amplitude and phase control chip and the transceiving integrated multifunctional chip are attached on the high-low frequency mixed pressure printed board, the radio frequency separate port connector, the upper cavity, the welding ring, the high-low frequency mixed pressure printed board, the lower cavity, the radio frequency common port connector and the low frequency connector are vertically stacked layer by layer from top to bottom, the radio frequency separate port connector is installed in the upper cavity, the radio frequency common port connector, the low frequency connector and the high-low frequency mixed pressure printed board are all fixed on the lower cavity, and the upper cavity, the lower cavity, the fastening screw and the welding ring are sealed by laser sealing and welding, so that the assembly is airtight packaged. The application improves the integration, miniaturization, stability and sealing of the multi-beam radio frequency signal transceiving assembly.

Description

Technical Field

[0001] This invention relates to the field of active phased array transceiver technology, and in particular to a tile-type analog multi-beam phased array transceiver. Background Technology

[0002] Active phased array transceiver (TR) modules are the core components of active phased array antennas. The technological development of tile-type TR modules, as a core component of active phased array antennas, is closely related to high integration, miniaturization, heat dissipation capabilities, and high power requirements. Traditional brick-type TR modules, with their vertical layout, are relatively large and cannot meet the urgent needs of modern radar and communication systems for compact designs. Tile-type TR modules, through horizontal layout and vertical assembly, significantly improve integration and reduce size, making them particularly suitable for high-density antenna array systems. In millimeter-wave bands (such as Ku and Ka bands), antenna element area is limited. Tile-type designs achieve three-dimensional chip integration through three-dimensional stacking technology (such as multi-layer circuit boards and blind slot structures), overcoming the physical limitations of traditional layouts. Each RF channel of the module contains both receive and transmit links, sharing phase shifters, attenuators, RF switches, and multi-layer RF power dividers and combiners for both transmit and receive operations. In a typical active phased array antenna system, each antenna radiating element is connected to a solid-state phased array TR component. By controlling the multi-functional amplitude and phase chip inside the component, the amplitude and phase reaching each radiating element can be controlled, thereby changing the energy distribution and phase distribution of each antenna element. This enables the beam to scan in space, simultaneously generating or receiving multiple independent beams, and achieving the purpose of obtaining target location and electronic equipment information.

[0003] In recent years, radar, wireless communication (such as 5G / 6G), satellite communication, electronic warfare and other fields have developed rapidly, and radio frequency analog multibeam technology has been widely used. Related platforms and usage environments have also become increasingly complex. Under multibeam operating conditions, TR components need to control the signal of each beam, including multi-layer radio frequency network power divider / combiner, power amplification, low-noise reception, amplitude and phase adjustment, etc. Traditional brick-type analog multibeam TR components suffer from low integration, poor sealing performance, high production and assembly difficulty, and high power consumption and cost, which limits the development of multibeam TR components. Summary of the Invention

[0004] To address the aforementioned problems, this invention provides a tile-type analog multi-beam phased array transceiver component, which effectively solves the problems of low integration, poor sealing performance, high design difficulty, and high production cost of multi-beam TR components.

[0005] The technical solution adopted in this invention is as follows:

[0006] A tile-type analog multi-beam phased array transceiver assembly includes an RF common port connector, a low-frequency connector, an upper cavity, solder rings, pins, a lower cavity, fastening screws, a high-low frequency mixed-voltage printed circuit board, an RF splitter connector, a multi-channel amplitude and phase control chip, and a transceiver integrated multi-function chip. The multi-channel amplitude and phase control chip and the transceiver integrated multi-function chip are mounted on the high-low frequency mixed-voltage printed circuit board. The RF splitter connector, upper cavity, solder rings, high-low frequency mixed-voltage printed circuit board, lower cavity, RF common port connector, and low-frequency connector are vertically stacked layer by layer from top to bottom. The RF splitter connector is installed in the upper cavity, and the RF common port connector, low-frequency connector, and high-low frequency mixed-voltage printed circuit board are all fixed on the lower cavity. The upper cavity, lower cavity, fastening screws, and solder ring are sealed together by laser sealing to achieve hermetically sealed assembly.

[0007] Furthermore, the RF common port connector is used for transmitting RF signal input and receiving RF signal output. The transmitting RF signal input from the RF common port connector is distributed through a multi-layer multi-beamforming network, controlled by multi-beam amplitude and phase, and amplified by the high-low frequency mixed voltage printed circuit board circuit before being output to the antenna through the RF splitter connector. The receiving is the opposite: the receiving RF signal input from the RF splitter connector is amplified by the transceiver multi-function chip with low noise, controlled by multi-beam amplitude and phase, and synthesized through a multi-layer multi-beamforming network before being output to the back-end through the RF common port connector.

[0008] Furthermore, the low-frequency connector is used for power supply and control signal input. The power supply and control signals input from the low-frequency connector are transmitted to the high-low frequency mixed voltage printed circuit board. Voltage distribution is performed through the multi-layer circuit traces inside the high-low frequency mixed voltage printed circuit board. The low-frequency signal after voltage distribution is transmitted to the multi-beam amplitude and phase control multi-function chip and the transceiver multi-function chip to realize the transmission of power supply and control signals. The multi-channel amplitude and phase control chip performs amplitude and phase modulation on the radio frequency signal, and the transceiver multi-function chip is used to amplify the power of the radio frequency signal and receive it with low noise.

[0009] Furthermore, the high- and low-frequency mixed-voltage printed circuit board includes RF chip control and power supply lines, multi-layer multi-beamforming networks, microstrip-to-strip-to-coaxial line transition lines, stripline-to-coaxial line transition lines, stripline shielding vias, RF ground interconnect vias, and high-density chip thermal vias. The RF chip control and power supply lines are used to receive power supply and control signals. The multi-layer multi-beamforming network is used to perform equal power distribution and in-phase synthesis of RF signals. The microstrip-to-strip-to-coaxial line transition lines are used to convert RF signals from microstrip form to coaxial line form, and the stripline-to-coaxial line transition lines are used to convert RF signals from stripline form to coaxial line form. The linear form is converted to a coaxial form. The stripline shielding hole is used to shield the internal stripline RF signal from the outside to reduce mutual interference between RF traces. The RF ground interconnect hole is used to interconnect the internal multi-layer RF ground. The high-density chip heat conduction hole is used to conduct the heat generated during the operation of the multi-channel amplitude and phase control multi-function chip and the transceiver multi-function chip. The RF chip control and power supply lines are respectively connected to the multi-beam amplitude and phase control multi-function chip and the transceiver multi-function chip. The multi-layer multi-beamforming network, the multi-channel amplitude and phase control multi-function chip and the transceiver multi-function chip are bonded together with gold wire.

[0010] Furthermore, the RF common port connector is integrated into the lower cavity and is connected to the high-low frequency mixed voltage printed circuit board through the RF button on the RF common port connector; the low frequency connector is integrated into the lower cavity and receives power supply and control signals through its own Kovar alloy inner conductor, which is sintered onto the low frequency connector by glass.

[0011] Furthermore, the multi-channel RF splitter connector is fixed on the upper cavity. The RF splitter connector integrates a hair button inside, and the upper cavity achieves communication with the RF signal of the high- and low-frequency mixed voltage printed circuit board through the hair button inside the RF splitter connector.

[0012] Furthermore, multiple slots are provided on the upper cavity near the high- and low-frequency mixed-voltage printed circuit board, and absorbing materials are placed in the slots to increase isolation and reduce the radio frequency signals radiated in the space.

[0013] Furthermore, the lower cavity connects to the radio frequency signals of the high- and low-frequency mixed-voltage printed circuit board via a button inside the radio frequency common port connector.

[0014] The beneficial technical effects of this invention are as follows:

[0015] The analog multibeam TR component of the present invention adopts a tile-type layout, with a clear and concise architecture, simple and efficient composition, compact structure, small size, light weight, and strong engineering practicality.

[0016] The analog multi-beam TR component of the present invention uses a high-low frequency mixed-voltage printed circuit board to realize analog multi-beam. The high-low frequency mixed-voltage printed circuit board integrates eight independent radio frequency networks, high-density radio frequency transition circuits, high-density chip heat conduction holes, and multiple multi-functional chips, which greatly improves the integration of the multi-beam radio frequency signal TR component and realizes the function of multi-beam while miniaturizing it.

[0017] The analog multi-beam TR component of this invention uses an integrated RF connector with a hair button for RF transmission. The inner conductor of the hair button is elastic, which effectively enhances the adaptability of the RF vertical transition and reduces the difficulty of RF alignment. The power supply and control use a low-frequency connector with sealing characteristics, which can achieve a high airtightness level while further miniaturizing the component.

[0018] The simulated multi-beam TR component of the present invention has a pre-set assembly groove for absorbing material in the upper cavity for placing the absorbing material, which enhances the stability of the chip working environment and improves the isolation between channels;

[0019] The analog multi-beam TR assembly of the present invention is arranged in a hierarchical structure of upper and lower cavities. The high and low frequency mixed voltage printed circuit board and the radio frequency interface between the upper and lower cavities are precisely aligned by pins. The upper and lower cavities are laser-sealed to achieve hermetic packaging, which has strong electromagnetic compatibility performance. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is an exploded view of the overall structure of a tile-type analog multi-beam phased array transceiver component provided in an embodiment of the present invention;

[0022] Figure 2 This is a schematic diagram of the overall structure of the tile-type analog multi-beam phased array transceiver assembly after hermetically sealed assembly provided in an embodiment of the present invention.

[0023] Explanation of reference numerals in the attached diagram: 1-Low frequency connector, 2-RF common port connector, 3-Fasting screw, 4-Lower cavity, 5-Pin, 6-High and low frequency mixed printed circuit board, 7-Solder ring, 8-Upper cavity, 9-RF split port connector. Detailed Implementation

[0024] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0025] A tile-type analog multi-beam phased array transceiver component, such as Figure 1 As shown, the device includes a low-frequency connector 1, an RF common port connector 2, a fastening screw 3, a lower cavity 4, a pin 5, a high-low frequency mixed-voltage printed circuit board 6, a solder ring 7, an upper cavity 8, an RF splitter connector 9, a multi-channel amplitude and phase control chip, and a transceiver multifunction chip. The multi-channel amplitude and phase control chip and the transceiver multifunction chip are mounted on the high-low frequency mixed-voltage printed circuit board 6. The RF splitter connector 9, the upper cavity 8, the solder ring 7, the high-low frequency mixed-voltage printed circuit board 6, the lower cavity 4, the RF common port connector 2, and the low-frequency connector 1 are stacked vertically layer by layer from top to bottom.

[0026] The radio frequency splitter connector 9 is installed inside the upper cavity 8, and the upper cavity 8 has reserved a position for the installation of the absorbing material.

[0027] The low-frequency connector 1, pin 5, RF common port connector 2, and high-low frequency mixed voltage printed circuit board 6 are mounted on the lower cavity 4. The upper cavity 8, lower cavity 4, fastening screw 3 and welding ring 7 are sealed together by laser sealing to achieve hermetic assembly of the components.

[0028] The RF common port connector 2 is used for transmitting RF signals and receiving RF signals. The transmitting RF signal input from the RF common port connector 2 is distributed through a multi-layer multi-beamforming network, controlled by multi-beam amplitude and phase, and amplified by the high-low frequency mixed voltage printed circuit board 6. Then, it is output to the antenna through the RF splitter connector 9. The receiving RF signal is the opposite. The receiving RF signal input from the RF splitter connector 9 is amplified by low noise, controlled by multi-beam amplitude and phase, and synthesized through a multi-layer multi-beamforming network by the transceiver multi-function chip. Then, it is output to the back-end through the RF common port connector 2.

[0029] Low-frequency connector 1 is used for power supply and control signal input. The power supply and control signals input from low-frequency connector 1 are transmitted to high-low frequency mixed voltage printed circuit board 6. The voltage is distributed through the multi-layer circuit traces inside the high-low frequency mixed voltage printed circuit board 6. The low-frequency signal after voltage distribution is transmitted to the multi-channel amplitude and phase control multi-function chip and the transceiver multi-function chip to realize the transmission of power supply and control signals. The multi-channel amplitude and phase control chip performs amplitude and phase modulation on the radio frequency signal, and the transceiver multi-function chip is used for power amplification and low-noise reception of the radio frequency signal.

[0030] In this embodiment, 128 RF connectors 9 with built-in snap buttons are fixed on the upper cavity 8. The connectors are connected to the pads on the high-low frequency mixed voltage printed circuit board 6 through snap buttons, so as to realize the RF signal connection between the high-low frequency mixed voltage printed circuit board 6 and the upper cavity 8. The upper cavity 8 has multiple slots on the side near the RF chip, and the inside is bonded with absorbing material to eliminate crosstalk between RF channels and enhance the stability of chip operation.

[0031] The high-low frequency mixed-voltage printed circuit board 6 includes RF chip control and power supply lines, multi-layer multi-beamforming network, microstrip-to-strip-to-coaxial line transition lines, stripline-to-coaxial line transition lines, stripline shielding vias, RF ground interconnect vias, and high-density chip thermal vias. The high-low frequency mixed-voltage printed circuit board 6 is implemented through RF multi-layer board mixed-voltage process. The chip control and power supply lines realize the control and power supply of multi-channel amplitude and phase control chips and transceiver multi-functional chips. The lines are distributed on multiple layers inside the high-low frequency mixed-voltage printed circuit board 6. The multi-layer multi-beamforming network mainly realizes the equal power distribution and in-phase synthesis of RF signals of multiple beams. It includes power divider and combiner lines, thin film resistors, RF vertical transition and impedance matching circuit. The power divider networks of different beams are distributed on different layers of the high-low frequency mixed-voltage printed circuit board 6. RF ground is added between layers of different beams to isolate the beams and reduce the mutual influence between different RF networks. RF ground interconnect vias are used to interconnect internal multi-layer RF grounds to ensure the integrity of internal RF signal transmission; stripline shielding vias are mainly used to shield the internal circuits of the multi-beam power divider network to ensure that the traces do not interfere with each other and that the RF circuit signals do not leak to the outside; microstrip line to stripline to coaxial line transition circuits are mainly used to convert the microstrip line RF signals near the interface end into the coaxial form RF signals required internally for transmission and conversion. The high-low frequency mixed voltage printed circuit board 6 integrates a total of 128 such transition circuits; stripline to coaxial line transition circuits are mainly used to convert the stripline RF signals near the interface end into the coaxial form RF signals required internally for transmission and conversion. The high-low frequency mixed voltage printed circuit board 6 integrates a total of 8 such transition circuits; high-density chip heat conduction vias are used to conduct heat generated during the operation of the multi-channel amplitude and phase control multi-function chip and the transceiver multi-function chip.

[0032] The main function of the multi-channel amplitude and phase control chip is to realize the amplitude control, phase control and gain amplification of multiple beam RF signals. For each beam RF signal, the multi-channel amplitude and phase control chip contains four sets of 1-to-4 networks, eight gain amplification chips and sixteen phase shift attenuation chips. The power divider network, gain amplification chips and sixteen phase shift attenuation chips of multiple beams are all integrated into a single CMOS chip, which greatly improves the integration of the TR component.

[0033] The main function of the transceiver multifunction chip is to amplify the transmit power and amplify the receive low noise of the RF chip. Multiple beams of RF signals share a single transceiver multifunction chip, further improving the integration of the TR component. The multi-channel amplitude and phase control chip and the transceiver multifunction chip are placed in corresponding slot positions inside the high-low frequency mixed voltage printed circuit board 6, and high-density chip heat dissipation holes are designed inside the slot positions to fully reduce thermal resistance.

[0034] The surface of the high- and low-frequency mixed-voltage printed circuit board 6 has multiple circular pads, the number, size and relative position of which correspond one-to-one with the number of pins of the RF split connector 9, the RF common port connector 2 and the low-frequency connector 1; the high- and low-frequency mixed-voltage printed circuit board 6 is soldered to the lower cavity 4 by the alignment pins 5.

[0035] The RF chip control and power supply lines are respectively connected to the multi-beam amplitude and phase control multi-function chip and the transceiver multi-function chip. The multi-layer multi-beamforming network, the multi-channel amplitude and phase control multi-function chip and the transceiver multi-function chip are bonded together by gold wire.

[0036] The RF common port connector 2 is fixed on the lower cavity 4 and is connected to the circular pad of the high-low frequency mixed voltage printed circuit board 6 through its internal built-in button, so as to realize the RF signal connection between the high-low frequency mixed voltage printed circuit board 6 and the lower cavity 4. The low frequency connector 1 is soldered on the lower cavity 4, and its low frequency pin passes through the high-low frequency mixed voltage printed circuit board 6 and is soldered to the pad on the surface of the high-low frequency mixed voltage printed circuit board 6 to realize the input of power supply and control signals.

[0037] Figure 2 This is a schematic diagram of the overall structure of the tile-type analog multi-beam phased array transceiver assembly after hermetically sealed assembly provided in an embodiment of the present invention.

[0038] The tile-type analog multi-beam phased array transceiver proposed in this invention has advantages such as high integration, lightweight, low assembly difficulty, low design difficulty, high hermeticity packaging and small size, and has a wide range of application value on various platforms.

[0039] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A tile-type analog multi-beam phased array transceiver component, characterized in that, The components include: an RF common port connector, a low-frequency connector, an upper cavity, a solder ring, pins, a lower cavity, fastening screws, a high-low frequency mixed-voltage printed circuit board, an RF split connector, a multi-channel amplitude and phase control chip, and a transceiver multifunction chip. The multi-channel amplitude and phase control chip and the transceiver multifunction chip are mounted on the high-low frequency mixed-voltage printed circuit board. The RF split connector, upper cavity, solder ring, high-low frequency mixed-voltage printed circuit board, lower cavity, RF common port connector, and low-frequency connector are vertically stacked layer by layer from top to bottom. The RF split connector is installed in the upper cavity. The RF common port connector, low-frequency connector, and high-low frequency mixed-voltage printed circuit board are all fixed on the lower cavity. The upper cavity, lower cavity, fastening screws, and solder ring are sealed together by laser sealing to achieve hermetically sealed assembly of the components. The RF common port connector is integrated into the lower cavity and is connected to the high-low frequency mixed voltage printed circuit board through the RF button on its own. The low frequency connector is integrated into the lower cavity and receives power and control signals through its own Kovar alloy inner conductor, which is sintered onto the low frequency connector with glass. The multi-channel RF splitter connector is fixed on the upper cavity. The RF splitter connector integrates a snap button inside. The upper cavity is connected to the RF signal of the high-low frequency mixed voltage printed circuit board through the snap button inside the RF splitter connector. The lower cavity is connected to the RF signal of the high-low frequency mixed voltage printed circuit board through the snap button inside the RF common port connector. The high- and low-frequency mixed-voltage printed circuit board includes RF chip control and power supply lines, multi-layer multi-beamforming network, microstrip-to-strip-to-coaxial line transition lines, stripline-to-coaxial line transition lines, stripline shielding vias, RF ground interconnect vias, and high-density chip heat dissipation vias. The RF chip control and power supply lines are used to receive power and control signals. The multi-layer multi-beamforming network is used to perform equal power distribution and in-phase synthesis of RF signals. The microstrip-to-strip-to-coaxial line transition lines are used to convert RF signals from microstrip form to coaxial line form. The stripline-to-coaxial line transition lines are used to convert RF signals from stripline form to coaxial line form. The stripline shielding vias are used to shield the internal stripline RF signals from the outside to reduce mutual interference between RF traces. The RF ground interconnect vias are used to interconnect the internal multi-layer RF ground. The high-density chip heat dissipation vias are used to conduct heat generated during the operation of the multi-channel amplitude and phase control multi-function chip and the transceiver multi-function chip. The power divider networks for different beams are distributed on different layers of the high-frequency and low-frequency mixed-voltage printed circuit board. Radio frequency grounds are added between the layers of different beams to isolate the beams. The microstrip line to stripline to coaxial line transition circuit mainly converts the microstrip line radio frequency signal near the splitter end into the coaxial form radio frequency signal required internally for transmission and conversion. A total of 128 such transition circuits are integrated on the high-frequency and low-frequency mixed-voltage printed circuit board. The stripline to coaxial line transition circuit mainly converts the stripline radio frequency signal near the main port end into the coaxial form radio frequency signal required internally for transmission and conversion. A total of 8 such transition circuits are integrated on the high-frequency and low-frequency mixed-voltage printed circuit board. For each beam RF signal, the multi-channel amplitude and phase control chip contains four sets of 1-to-4 networks, eight gain amplifier chips, and sixteen phase shift attenuation chips. The power divider network, gain amplifier chips, and sixteen phase shift attenuation chips for multiple beams are all integrated into a single CMOS chip.

2. The transceiver component according to claim 1, characterized in that, Multiple slots are provided on the upper cavity near the high- and low-frequency mixed-voltage printed circuit board, and microwave absorbing material is placed in the slots.

3. The transceiver component according to claim 1, characterized in that, The RF common port connector is used for transmitting RF signals and receiving RF signals. The transmitted RF signal input from the RF common port connector is distributed through a multi-layer multi-beamforming network, controlled by multi-beam amplitude and phase, and amplified by the high-low frequency mixed voltage printed circuit board circuit. Then, it is output to the antenna through the RF splitter connector. The receiving RF signal is the opposite. The received RF signal input from the RF splitter connector is amplified by the transceiver multi-function chip with low noise, controlled by multi-beam amplitude and phase, and synthesized through a multi-layer multi-beamforming network. Then, it is output to the back-end through the RF common port connector.

4. The transceiver component according to claim 1, characterized in that, The low-frequency connector is used for power supply and control signal input. The power supply and control signals input from the low-frequency connector are transmitted to the high-low frequency mixed voltage printed circuit board. The voltage is distributed through the multi-layer circuit traces inside the high-low frequency mixed voltage printed circuit board. The low-frequency signal after voltage distribution is transmitted to the multi-beam amplitude and phase control multi-function chip and the transceiver multi-function chip to realize the transmission of power supply and control signals. The multi-channel amplitude and phase control chip performs amplitude and phase modulation on the radio frequency signal, and the transceiver multi-function chip is used to amplify the power of the radio frequency signal and receive it with low noise.

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