A mold cooling device with intelligent temperature control

Abstract

This invention discloses a mold cooling device with intelligent temperature control, belonging to the field of cooling device technology. It includes a main board and partitioned cooling mechanisms mounted on the top and bottom of the main board, with a top plate mounted on the top of the partitioned cooling mechanism. This invention utilizes partitioned storage components to store cooling media at different temperatures. A cooling mechanism, in conjunction with the cooling components, cools the cooling media stored in different partitions. A liquid outlet box, along with a liquid guide pipe and a first liquid valve, mixes the cooling media stored in different partitions to obtain a cooling medium that meets the required temperature. The cooling mechanism reduces the cost of mold cooling. The storage box, placed in its mounting position, facilitates subsequent maintenance of the storage box and its internal components. An auxiliary mechanism completes the mixing of the liquid in the liquid outlet box, preventing localized temperature deviations that could affect product quality and mold lifespan.

Description

Technical Field

[0001] This invention relates to the field of refrigeration equipment technology, specifically to a mold cooling refrigeration device with intelligent temperature control. Background Technology

[0002] Cooling devices are required during mold operation. The primary reason for this cooling is to control the mold's temperature, ensuring a stable operating state during molding. Cooling quickly removes the heat generated by the mold, reducing temperature fluctuations and preventing deformation or cracking, thereby improving product dimensional accuracy and surface quality. Furthermore, effective cooling shortens the molding cycle, increases production efficiency, extends mold lifespan, and reduces maintenance costs.

[0003] A refrigeration device, disclosed in patent publication number CN113819668A, includes a housing, a fan, and a heat-conducting component. The housing has independently configured first and second heat dissipation cavities. An air inlet and an air outlet, both communicating with the first heat dissipation cavity, are provided on the housing. A heat-conducting medium is contained within the second heat dissipation cavity. The fan is connected to the housing and configured to provide a driving force for external airflow through the air inlet to the air outlet. One end of the heat-conducting component extends into the first heat dissipation cavity and contacts a heating element, while the other end extends into the second heat dissipation cavity and contacts the heat-conducting medium therein. The refrigeration device provided by this invention has superior heat dissipation performance.

[0004] Existing refrigeration devices mostly adopt a single, centralized cooling method, lacking the ability to autonomously adjust to different areas. This makes it difficult to achieve rapid cooling and intelligent temperature regulation, resulting in low cooling efficiency and failing to meet the needs of high-speed, precise temperature control in multiple areas of complex molds or equipment. In addition, traditional refrigeration systems often rely on natural circulation or simple circulation methods for coolant mixing, making it difficult to ensure that the coolant is fully and evenly mixed in each area. This may cause local temperature deviations, thereby affecting product quality and mold lifespan. At the same time, existing technologies often rely on compressor cooling systems, which is not conducive to reducing the energy consumption cost of mold cooling during the refrigeration process, i.e., it is not conducive to reducing cooling costs. Therefore, this invention is proposed. Summary of the Invention

[0005] The purpose of this invention is to provide a mold cooling device with intelligent temperature control to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a mold cooling device with intelligent temperature control, comprising a main board and partitioned cooling mechanisms installed on the top and bottom of the main board. A top plate is installed on the top of the partitioned cooling mechanism, which includes partitioned storage components and a cooling component. A cooling mechanism connected to the cooling component is installed on the top plate. The cooling mechanism absorbs and cools ambient air before introducing it into the cooling component, which then cools the partitioned storage components. An inlet box is installed outside the cooling component located on the top of the main board, and an outlet box is installed outside the cooling component located at the bottom of the main board. The partitioned storage component and the inlet box... An auxiliary mechanism is installed between the liquid box and the liquid outlet box. The partitioned storage component includes an air storage column. Both cooling components are connected to the air storage column. The air storage column is installed between the main board and the top plate. An annular block is installed on the outer wall of the air storage column. Several installation positions are formed between the annular block, the main board, and the top plate. Each installation position contains a storage box for storing cooling media at different temperatures. A liquid guide pipe connected to the liquid outlet box is embedded in the main board. A first liquid valve is installed on the liquid guide pipe. A bottom groove corresponding to the liquid guide pipe is opened on the bottom outer wall of the storage box. The temperature of the cooling media is adjusted by the liquid guide pipe in conjunction with the bottom groove and the first liquid valve. The storage box is installed and removed from the installation position by a connecting mechanism.

[0007] Furthermore, air guide pipes connected to the gas storage column are embedded in both ends and the outer walls of both sides of the annular block. A first air valve is installed on the outer wall of the air guide pipe. An air inlet groove adapted to the air guide pipe is opened on the outer wall of the storage box facing the outer wall of the annular block. The storage box is a hollow structure. Cooling gas is introduced into the cooling component through the cooling component in conjunction with the air guide pipe to complete the cooling of the cooling medium in the storage box.

[0008] Furthermore, the cooling assembly includes several cooling columns installed between the inner walls of both sides of the storage box. Several grooves are formed on the outer wall of the cooling column, and annular grooves are formed on both sides of the middle of the outer wall of the cooling column. Connecting blocks are inserted into the top and bottom of the annular grooves, and stirring rods are installed on the connecting blocks. A first mounting plate is installed in the middle of the inner wall of the cooling column. A cylinder is installed on the outer wall of the first mounting plate. Several fan blades are installed on the outer wall of the cylinder. Horizontal columns are installed on the outer walls of both ends of the cylinder. Vertical blocks are installed on the top and bottom outer walls of the horizontal columns. Magnets are embedded in the top outer walls of the vertical blocks. The connecting blocks are made of magnetic metal.

[0009] Furthermore, the cooling mechanism includes a circular plate, on the outer wall of the circular plate facing the air storage column, a cooling column containing a cooling medium is installed. Both the outer walls of the circular plate and the cooling column have several first circular grooves, and the cooling column has several second circular grooves. Several heat-absorbing columns, inserted into the second circular grooves, are installed on the outer wall of the circular plate facing the air storage column. A second mounting plate is installed in the first circular groove of the circular plate, and an intake fan driven by a drive motor is installed on the second mounting plate. The cooling column, in conjunction with the first circular grooves, cools the air, and the heat-absorbing columns regulate the temperature of the cooling medium in the cooling column.

[0010] Furthermore, the heat-absorbing column includes a heat-conducting carrier and a heat-absorbing material. The heat-conducting carrier includes a heat-conducting mesh installed on the outer wall of the heat-absorbing column. The heat-conducting mesh is made of a heat-conducting metal material. The heat-absorbing material includes a phase change material that can be repeatedly charged and released, and the heat-absorbing material also includes a reversible heat-absorbing material or a reversible complex.

[0011] Furthermore, the auxiliary mechanism includes an auxiliary box, in which several auxiliary tubes are embedded. An exhaust groove is provided on the outer wall of the storage box, and the air inlet of the auxiliary tube is inserted into the exhaust groove. A connecting tube is embedded in the top plate, and the top of the connecting tube is installed on the bottom outer wall of the liquid inlet box. A second liquid valve is installed on the outer wall of the liquid inlet box, and several conduits connected to the auxiliary tubes are installed on the top outer wall of the liquid outlet box.

[0012] Furthermore, an inlet pipe is installed on the outer wall of the inlet box, and a drain pipe is installed on the outer wall of the outlet box. A cooling medium circulation loop is formed through the inlet pipe, inlet box, connecting pipe, storage box, guide pipe, outlet box, and drain pipe.

[0013] Furthermore, slots are provided on the outer wall of the annular block at the top and bottom of the air duct, and a plug is installed on the outer wall of the storage box facing the outer wall of the annular block, which is inserted into the slot. Side slots are provided on the inner walls at both ends of the annular groove, and side blocks are installed on the connecting block, which are inserted into the side slots.

[0014] Compared with the prior art, the beneficial effects of the present invention are:

[0015] This intelligent temperature-controlled mold cooling device can store cooling media with different temperatures in designated zones through a partitioned storage component. A cooling mechanism, in conjunction with the cooling component, can cool the cooling media stored in different zones accordingly. A liquid outlet box, along with a liquid guide pipe and a first liquid valve, can mix the cooling media stored in different zones to obtain the required cooling medium. Specifically, temperature sensors can be installed in the storage box and the liquid outlet box to monitor the required cooling medium temperature. The cooling mechanism uses outside air, the cooling medium, and a heat-absorbing column to provide cooling gas, reducing the cost of mold cooling. The storage box is conveniently placed in the installation position, facilitating disassembly and subsequent maintenance of the storage box and its internal components. An auxiliary mechanism mixes the liquid in the liquid outlet box, preventing localized temperature deviations that could affect product quality and mold lifespan.

[0016] Meanwhile, during the cooling operation, air can enter the cooling column. The impact force of the air entering the cooling column will drive the fan blades and the cylinder to rotate, which in turn will drive the horizontal column and the vertical block to rotate. Since the magnet and the connecting block are made of magnetic metal, they can drive the connecting block and the stirring rod to rotate, thereby completing the mixing of the cooling medium inside the storage box. The grooves are designed to increase the contact area between the cooling medium and the cooling column, thereby improving the cooling efficiency of the cooling medium.

[0017] Simultaneously, heated liquid can be placed and removed through the inlet and outlet pipes to facilitate resource utilization and conservation. Gas can then be introduced into the outlet box via a conduit, where its impact force mixes the liquid. To improve mixing efficiency, a pressure pump can be installed on the conduit to prevent insufficient gas pressure from causing low mixing efficiency. The insertion of pins into slots provides a secure connection, enhancing the storage box's connectivity in its mounting position. Electromagnets can also be embedded in the slots, and the magnetic metal pins further improve connectivity. The use of side grooves prevents the stirring rod and connecting block from detaching from the cooling column. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0019] Figure 2 This is a schematic diagram of some of the auxiliary mechanisms of the present invention;

[0020] Figure 3 This is a schematic diagram of the top structure of the motherboard of the present invention;

[0021] Figure 4This is a schematic diagram of the cooling column structure of the present invention;

[0022] Figure 5 This is a schematic diagram of the bottom structure of the circular plate of the present invention;

[0023] Figure 6 This is a schematic diagram of the mounting position structure of the present invention;

[0024] Figure 7 This is a schematic diagram of the internal structure of the storage box of the present invention;

[0025] Figure 8 This is a schematic cross-sectional view of the cooling column structure of the present invention.

[0026] In the diagram: 1. Mainboard; 2. Zoned cooling mechanism; 201. Air storage column; 202. Storage box; 203. Annular block; 204. Slot; 205. Air guide pipe; 206. Cooling column; 207. Air inlet slot; 208. Insert post; 209. Groove; 210. Stirring rod; 211. Connecting block; 212. Vertical block; 213. First mounting plate; 214. Cylinder; 215. Horizontal column; 3. Auxiliary Auxiliary mechanism; 301, Auxiliary box; 302, Auxiliary pipe; 303, Connecting pipe; 304, Conduit; 4, Top plate; 5, Cooling mechanism; 501, Circular plate; 502, Cooling column; 503, First circular groove; 504, Second circular groove; 505, Second mounting plate; 506, Heat absorption column; 507, Air intake fan; 6, Liquid inlet box; 7, Liquid outlet box; 8, Liquid inlet pipe; 9, Liquid drain pipe; 10, Liquid guide pipe. Detailed Implementation

[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] The refrigeration equipment required for mold cooling mainly includes water cooling systems and refrigerant refrigeration systems. Water cooling systems remove heat from the mold by circulating cooling water and are the most common cooling method. Typically, compressor refrigeration systems (refrigerant systems) are used in the cooling process, achieving low-temperature cooling through compressors, evaporators, and condensers. While this method offers good cooling performance, it is not conducive to reducing energy consumption. Mold cooling refrigeration devices with intelligent temperature control integrate high-precision sensors to monitor the coolant temperature in real time and adjust it according to demand, achieving precise and stable cooling effects. This significantly improves the service life of molds and product quality, making it a crucial piece of equipment for improving production efficiency and product quality in modern advanced manufacturing.

[0029] like Figures 1-8 As shown, the present invention provides a technical solution: a mold cooling device with intelligent temperature control, including a main board 1 and partitioned cooling mechanisms 2 installed on the top and bottom of the main board 1. A top plate 4 is installed on the top of the partitioned cooling mechanism 2. The partitioned cooling mechanism 2 includes partitioned storage components and a cooling component. A cooling mechanism 5 connected to the cooling component is installed on the top plate 4. The cooling mechanism 5 absorbs and cools outside air before introducing it into the cooling component, which then cools the partitioned storage component. An inlet box 6 is installed outside the cooling component located at the top of the main board 1, and an outlet box 7 is installed outside the cooling component located at the bottom of the main board 1. An auxiliary mechanism 3 is installed between the partitioned storage component and the inlet box 6 and the outlet box 7. The partitioned storage component includes an air storage column 201. Both cooling components are connected to the air storage column 201. The air storage column 201 is installed between the main board 1 and the top plate 4. An annular block 203 is installed on the outer wall of the air storage column 201. Several mounting positions are formed between the annular block 203, the main board 1, and the top plate 4. Each mounting position contains a storage box 202 for storing cooling media at different temperatures. A liquid guide pipe 10 connected to the liquid outlet box 7 is embedded in the main board 1. A first liquid valve is installed on the liquid guide pipe 10. A bottom groove corresponding to the liquid guide pipe 10 is opened on the bottom outer wall of the storage box 202. The temperature of the cooling media is adjusted by the liquid guide pipe 10 in conjunction with the bottom groove and the first liquid valve. The storage box 202 is installed and removed from the mounting position by a connecting mechanism.

[0030] It is important to note that during use, it is necessary to ensure that there is sufficient cooling medium in the inlet box 6 and outlet box 7. The cooling medium can be coolant, etc. The partitioned storage component can store cooling media with different temperatures in different partitions. The cooling mechanism 5, in conjunction with the cooling component, can cool the cooling media stored in different partitions accordingly. The outlet box 7, in conjunction with the liquid guide pipe 10 and the first liquid valve, can mix the cooling media stored in different partitions to obtain the cooling medium that meets the usage requirements. Specifically, temperature sensors can be installed in the storage box 202 and outlet box 7 to monitor the required cooling medium temperature. The cooling mechanism 5, using outside air, cooling medium, and heat absorption column 506, can provide cooling gas, reducing the cost of mold cooling. The storage box 202, placed in the installation position, is easy to disassemble, facilitating subsequent maintenance of the storage box 202 and its internal components. The auxiliary mechanism 3 mixes the liquid in the outlet box 7 to avoid local temperature deviations, which could affect product quality and mold lifespan.

[0031] like Figure 6 and Figure 7As shown, air guide pipes 205 connected to the gas storage column 201 are embedded in the outer walls of both ends and sides of the annular block 203. A first air valve is installed on the outer wall of the air guide pipe 205. An air inlet groove 207 adapted to the air guide pipe 205 is opened on the outer wall of the storage box 202 facing the outer wall of the annular block 203. The storage box 202 is a hollow structure. Cooling gas is introduced into the cooling assembly through the cooling assembly in conjunction with the air guide pipe 205 to complete the cooling of the cooling medium in the storage box 202.

[0032] It should be noted that the gas storage column 201 is used to receive the cooled gas, and the gas in the gas storage column 201 can be introduced into the storage box 202 through the gas guide pipe 205. By using the set first gas valve, the gas can be controlled to enter the storage box 202 of different zones, thereby completing the cooling of the cooling medium in different storage boxes 202. A temperature sensor can be installed in the gas storage column 201 to monitor the gas temperature, and the gas is distributed into the corresponding storage box 202 by monitoring the gas temperature.

[0033] like Figure 7 and Figure 8 As shown, the cooling assembly includes several cooling columns 206 installed between the inner walls of both sides of the storage box 202. Several grooves 209 are formed on the outer wall of the cooling column 206. Annular grooves are formed on both sides of the middle part of the outer wall of the cooling column 206. Connecting blocks 211 are inserted into the top and bottom of the annular grooves. Stirring rods 210 are installed on the connecting blocks 211. A first mounting plate 213 is installed in the middle of the inner wall of the cooling column 206. A cylinder 214 is installed on the outer wall of the first mounting plate 213. Several fan blades are installed on the outer wall of the cylinder 214. Horizontal columns 215 are installed on the outer walls of both ends of the cylinder 214. Vertical blocks 212 are installed on the top and bottom outer walls of the horizontal columns 215. Magnets are embedded in the top outer wall of the vertical blocks 212. The connecting blocks 211 are made of magnetic metal.

[0034] It should be noted that after the first air valve is activated, the air in the gas storage column 201 enters the hollow interior of the storage box 202 through the air guide pipe 205. The cooling column 206 is connected to the hollow interior of the storage box 202. Therefore, during the cooling operation, air can enter the cooling column 206. The impact force of the gas entering the cooling column 206 will drive the fan blades and the cylinder 214 to rotate, which in turn drives the horizontal column 215 to rotate in conjunction with the vertical block 212. Since the magnet and the connecting block 211 are made of magnetic metal, the connecting block 211 and the stirring rod 210 can be driven to rotate, thereby completing the mixing of the cooling medium inside the storage box 202. The groove 209 is provided to increase the contact area between the cooling medium and the cooling column 206, thereby improving the cooling efficiency of the cooling medium.

[0035] like Figures 3-5As shown, the cooling mechanism 5 includes a circular plate 501. A cooling column 502, which stores cooling medium, is installed on the outer wall of the circular plate 501 facing the air storage column 201. Several first circular grooves 503 are opened on the outer walls of both the circular plate 501 and the cooling column 502. Several second circular grooves 504 are opened on the cooling column 502. Several heat-absorbing columns 506, which are inserted into the second circular grooves 504, are installed on the outer wall of the circular plate 501 facing the air storage column 201. A second mounting plate 505 is installed in the first circular groove 503 on the circular plate 501. An air intake fan 507 driven by a drive motor is installed on the second mounting plate 505. The cooling column 502 works in conjunction with the first circular groove 503 to cool the air, and the heat-absorbing columns 506 work to cool the cooling medium in the cooling column 502.

[0036] It should be noted that the circular plate 501, together with the heat-absorbing column 506, forms a detachable component, facilitating subsequent maintenance of the components on the circular plate 501. Through the first circular groove 503 and the air intake fan 507, outside air is introduced into the air storage column 201. An air collection hopper is installed between the cooling column 502 and the air storage column 201 to guide gas into the air storage column 201. When air enters the cooling column 502, it can be cooled. Through the heat-absorbing column 506, the cooling medium in the cooling column 502 can be cooled to continue cooling the air.

[0037] like Figure 5 As shown, the heat-absorbing column 506 includes a heat-conducting carrier and a heat-absorbing material. The heat-conducting carrier includes a heat-conducting mesh installed on the outer wall of the heat-absorbing column 506. The heat-conducting mesh is made of a heat-conducting metal material. The heat-absorbing material includes a phase change material that can be repeatedly charged and released, and the heat-absorbing material also includes a reversible heat-absorbing material or a reversible complex.

[0038] It is important to note that the phase change material (PCM) should be an organic PCM (such as paraffin / fatty acid) or a water-based / water-encapsulated PCM that can be repeatedly charged and released heat and has a phase change temperature window near the target cold region temperature. If the target temperature is high, a medium-temperature phase change material can be considered. The heat transfer medium can be graphite sheets / powder, metal mesh (aluminum, copper mesh), copper / aluminum foam, carbon fiber filler, etc., to improve overall thermal conductivity and shorten the heat diffusion path. During use, the encapsulation and interface material of the heat-absorbing column 506 uses thermally conductive adhesive / thermal interface material (TIM) or thermally conductive tape. The metal shell (aluminum or copper) forms a columnar structure, and an external thermal interface coating or coating is applied to improve durability. The reversible heat-absorbing material should be selected based on significant heat release / endothermic properties within the target temperature window. In chemical systems, such as reversible adsorbent materials (molecular sieves, activated carbon modified materials, oxides, etc.) or reversible complexes (certain metal complexes / organic coordination compounds), when the heat-absorbing column 506 needs to release heat, a slot can be opened in the middle of the heat-absorbing column 506, with the heat-conducting carrier and heat-absorbing material between the heat-absorbing column 506 and the slot. A copper column is installed inside the slot for heat conduction. At the same time, an exhaust fan is installed at the bottom of the heat-absorbing column 506, and a vertical slot is opened on the circular plate 501 to discharge heat, thus assisting the heat-absorbing column 506 in heat dissipation.

[0039] like Figures 2-3 As shown, the auxiliary mechanism 3 includes an auxiliary box 301, in which several auxiliary pipes 302 are embedded. An exhaust groove is provided on the outer wall of the storage box 202. The air inlet of the auxiliary pipe 302 is inserted into the exhaust groove. A connecting pipe 303 is embedded on the top plate 4. The top of the connecting pipe 303 is installed on the bottom outer wall of the liquid inlet box 6. A second liquid valve is installed on the outer wall of the liquid inlet box 6. Several conduits 304 connected to the auxiliary pipes 302 are installed on the top outer wall of the liquid outlet box 7.

[0040] It should be noted that the auxiliary pipe 302 and the exhaust trough are detachable flexible connections. A sealing ring can be installed on the auxiliary pipe 302 to improve the sealing performance. Sealing rings can also be installed on all pipes to improve the overall sealing performance of the device. The auxiliary box 301 can be used to store liquids that need to be heated. The auxiliary box 301 is equipped with an inlet pipe and an outlet pipe. The heated liquid can be placed and taken out through the inlet pipe and the outlet pipe to facilitate resource utilization and conservation. The gas can be introduced into the liquid outlet box 7 through the conduit 304. The gas enters the liquid outlet box 7 with an impact force to complete the mixing of the liquid in the liquid outlet box 7. In order to improve the mixing efficiency, a pressure pump can be installed on the conduit 304 to avoid insufficient gas pressure that would lead to low mixing efficiency.

[0041] like Figures 1-3As shown, an inlet pipe 8 is installed on the outer wall of the inlet box 6, and a drain pipe 9 is installed on the outer wall of the outlet box 7. A cooling medium circulation loop is formed through the inlet pipe 8, the inlet box 6, the connecting pipe 303, the storage box 202, the guide pipe 10, the outlet box 7, and the drain pipe 9.

[0042] It should be noted that by connecting the liquid inlet pipe 8 and the liquid outlet pipe 9 to the cooling medium interface on the mold, and then through the set cooling medium circulation loop, the cooling medium can be continuously cooled and the temperature can be controlled and regulated to cool the mold. In actual use, valves and liquid pumps can also be installed on the liquid inlet pipe 8 and the liquid outlet pipe 9.

[0043] like Figures 6-8 As shown, slots 204 are provided on the outer wall of the annular block 203 at the top and bottom of the air duct 205. A post 208 is installed on the outer wall of the storage box 202 facing the outer wall of the annular block 203 and inserted into the slot 204. Side grooves are provided on the inner walls of both ends of the annular groove. A side block is installed on the connecting block 211 and inserted into the side groove.

[0044] It should be noted that by inserting the pin 208 into the slot 204, a plugging effect can be provided, improving the connectivity of the storage box 202 in the installation position. At the same time, an electromagnet can be embedded in the slot 204. Since the pin 208 is made of magnetic metal, the connectivity can be further improved. By using the side groove, the stirring rod 210 and the connecting block 211 can be prevented from falling off the cooling column 206.

[0045] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended embodiments and their equivalents.

Claims

1. A mold cooling device with intelligent temperature control, comprising a main board (1) and a partitioned cooling mechanism (2) installed on the top and bottom of the main board (1), characterized in that: The partitioned cooling mechanism (2) is equipped with a top plate (4). The partitioned cooling mechanism (2) includes a partitioned storage component and a cooling component. A cooling mechanism (5) connected to the cooling component is installed on the top plate (4). The cooling mechanism (5) absorbs and cools the outside air and then introduces it into the cooling component. The cooling component then completes the cooling of the partitioned storage component. An inlet box (6) is installed on the outside of the cooling component located at the top of the main board (1). An outlet box (7) is installed on the outside of the cooling component located at the bottom of the main board (1). An auxiliary mechanism (3) is installed between the partitioned storage component and the inlet box (6) and the outlet box (7). The partitioned storage component includes a gas storage column (201). Both cooling components are connected to the gas storage column (201). The gas storage column (201) is installed between the main board (1) and the top plate (4). An annular block (203) is installed on the outer wall of the gas storage column (201). Several installation positions are formed between the annular block (203), the main board (1) and the top plate (4). Each installation position is equipped with a storage box (202) for storing cooling media at different temperatures. A liquid guide pipe (10) connected to the liquid outlet box (7) is embedded in the main board (1). A first liquid valve is installed on the liquid guide pipe (10). A bottom groove corresponding to the liquid guide pipe (10) is opened on the bottom outer wall of the storage box (202). The temperature of the cooling medium is adjusted by the liquid guide pipe (10) in conjunction with the bottom groove and the first liquid valve. The storage box (202) is disassembled and assembled in the installation position through the connecting mechanism.

2. The mold cooling and refrigeration device with intelligent temperature control according to claim 1, characterized in that: The annular block (203) has air guide pipes (205) embedded on both ends and the outer walls of both sides, which are connected to the gas storage column (201). A first air valve is installed on the outer wall of the air guide pipe (205). An air inlet groove (207) adapted to the air guide pipe (205) is opened on the outer wall of the storage box (202) facing the outer wall of the annular block (203). The storage box (202) is a hollow structure. The cooling gas is introduced into the cooling component through the cooling component in conjunction with the air guide pipe (205) to complete the cooling of the cooling medium in the storage box (202).

3. The mold cooling and refrigeration device with intelligent temperature control according to claim 1, characterized in that: The cooling assembly includes several cooling columns (206) installed between the inner walls of the two sides of the storage box (202). Several grooves (209) are provided on the outer wall of the cooling column (206). Annular grooves are provided on both sides of the middle part of the outer wall of the cooling column (206). Connecting blocks (211) are inserted into the top and bottom of the annular grooves. Stirring rods (210) are installed on the connecting blocks (211). A first mounting plate (213) is installed in the middle part of the inner wall of the cooling column (206). A cylinder (214) is installed on the outer wall of the first mounting plate (213). Several fan blades are installed on the outer wall of the cylinder (214). Horizontal columns (215) are installed on the outer walls of both ends of the cylinder (214). Vertical blocks (212) are installed on the top and bottom outer walls of the horizontal columns (215). Magnets are embedded in the top outer wall of the vertical blocks (212). The connecting blocks (211) are made of magnetic metal.

4. A mold cooling and refrigeration device with intelligent temperature control according to claim 1, characterized in that: The cooling mechanism (5) includes a circular plate (501). A cooling column (502) storing cooling medium is installed on the outer wall of the circular plate (501) facing the air storage column (201). Several first circular grooves (503) are opened on the outer wall of both the circular plate (501) and the cooling column (502). Several second circular grooves (504) are opened on the cooling column (502). Several heat-absorbing columns (506) inserted into the second circular grooves (504) are installed on the outer wall of the circular plate (501) facing the air storage column (201). A second mounting plate (505) is installed in the first circular groove (503) on the circular plate (501). An air intake fan (507) driven by a drive motor is installed on the second mounting plate (505). The cooling column (502) works in conjunction with the first circular groove (503) to cool the air. The heat-absorbing column (506) is used to cool the cooling medium in the cooling column (502).

5. A mold cooling and refrigeration device with intelligent temperature control according to claim 4, characterized in that: The heat-absorbing column (506) includes a heat-conducting carrier and a heat-absorbing material. The heat-conducting carrier includes a heat-conducting mesh installed on the outer wall of the heat-absorbing column (506). The heat-conducting mesh is made of a heat-conducting metal material. The heat-absorbing material includes a phase change material that can be repeatedly charged and released, and the heat-absorbing material also includes a reversible heat-absorbing material or a reversible complex.

6. A mold cooling and refrigeration device with intelligent temperature control according to claim 1, characterized in that: The auxiliary mechanism (3) includes an auxiliary box (301), in which several auxiliary tubes (302) are embedded. An exhaust groove is provided on the outer wall of the storage box (202). The air inlet of the auxiliary tube (302) is inserted into the exhaust groove. A connecting tube (303) is embedded on the top plate (4). The top of the connecting tube (303) is installed on the bottom outer wall of the liquid inlet box (6). A second liquid valve is installed on the outer wall of the liquid inlet box (6). Several conduits (304) connected to the auxiliary tubes (302) are installed on the top outer wall of the liquid outlet box (7).

7. A mold cooling and refrigeration device with intelligent temperature control according to claim 1, characterized in that: An inlet pipe (8) is installed on the outer wall of the inlet box (6), and a drain pipe (9) is installed on the outer wall of the outlet box (7). A cooling medium circulation loop is formed through the inlet pipe (8), the inlet box (6), the connecting pipe (303), the storage box (202), the guide pipe (10), the outlet box (7), and the drain pipe (9).

8. A mold cooling and refrigeration device with intelligent temperature control according to claim 3, characterized in that: The outer wall of the annular block (203) has slots (204) at the top and bottom of the air duct (205). The storage box (202) has a plug (208) on the outer wall facing the outer wall of the annular block (203) that is inserted into the slot (204). The inner walls of both ends of the annular groove have side grooves. The connecting block (211) has a side block inserted into the side groove.

Images