Heating disc assembly and vacuum film pressing equipment

Abstract

The invention relates to the technical field of semiconductors, and particularly discloses a heating disc assembly and vacuum film pressing equipment, the heating disc assembly comprises an upper heating disc, a heating piece and a lower sealing plate which are sequentially stacked, the surface, close to the lower sealing plate, of the upper heating disc is provided with a groove, and the groove forms a spiral path on the surface of the upper heating disc; at least part of the heating piece is arranged along the path of the groove and is embedded in the groove in interference fit with the groove; and after at least part of the heating piece is fixed in the groove, the upper hot disc is fixedly connected with the lower sealing plate. The groove is formed in the surface, close to the lower sealing plate, of the upper hot plate, the heating piece is embedded into the groove in an interference fit mode, and it can be guaranteed that the heating piece is fixed into the upper hot plate. Meanwhile, the heating piece is embedded into the upper heating disc by forming the groove, heat emitted by the heating piece can be conducted on the upper heating disc more uniformly and timely, and the problems that the temperature uniformity is poor, the heating piece is damaged and the like due to local temperature accumulation are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, in particular to a heating disk assembly and vacuum lamination equipment. Background Art

[0002] Wafer lamination is a crucial step in the semiconductor manufacturing process. To ensure lamination quality and performance, wafer lamination equipment must meet very strict temperature control requirements. Temperature non-uniformity can lead to inconsistent film thickness or other defects, which in turn affect the performance of the final product. Traditional heating technologies often struggle to meet this high-precision temperature control requirement. Therefore, ensuring ultra-high temperature uniformity across the entire working area to meet the growing demands of advanced semiconductor manufacturing processes has become a pressing issue. Summary of the Invention

[0003] Based on this, it is necessary to provide a heating plate assembly and a vacuum lamination device to address the problem of how to ensure heating uniformity in the prior art.

[0004] A heating plate assembly comprises an upper heating plate, a heating element and a lower sealing plate which are stacked in sequence, wherein a groove is provided on the surface of the upper heating plate close to the lower sealing plate, and the groove forms a spiral path on the surface of the upper heating plate; at least a portion of the heating element is arranged along the path of the groove and is embedded in the groove with an interference fit; after at least a portion of the heating element is fixed in the groove, the upper heating plate is fixedly connected to the lower sealing plate.

[0005] In one embodiment, the upper heating plate is provided with a through hole, and the orthographic projection of the through hole on the lower sealing plate does not intersect with the orthographic projection of the groove on the lower sealing plate.

[0006] In one embodiment, the upper heating plate is provided with at least two through holes.

[0007] In one embodiment, the heating element is a heating wire, and the diameter of the heating wire ranges from 2.5 mm to 3.5 mm.

[0008] In one embodiment, the diameter of the groove is 0.85 to 0.95 times the diameter of the heating wire.

[0009] In one embodiment, the depth of the groove is 1 to 1.05 times the diameter of the heating wire.

[0010] In one embodiment, the distance between the grooves ranges from 5 mm to 20 mm.

[0011] In one embodiment, the lower sealing plate is provided with a guide hole, and both ends of the heating element extend out of the heating plate assembly through the guide hole.

[0012] In one embodiment, the surface of the upper heating plate close to the lower sealing plate is the first surface, the surface of the lower sealing plate close to the upper heating plate is the second surface, and the surface roughness of the first surface and the second surface ranges from 0.1 μm to 3.2 μm.

[0013] A vacuum lamination device comprises the heating plate assembly as described in any one of the above embodiments.

[0014] The above-mentioned heating plate assembly can ensure that the heating element is fixed in the upper heating plate by providing a groove on the surface of the upper heating plate near the lower sealing plate, and embedding the heating element into the groove in an interference fit manner. At the same time, by providing a groove to embed the heating element in the upper heating plate, the heat generated by the heating element can be conducted more evenly and promptly on the upper heating plate, and problems such as poor temperature uniformity and damage to the heating element due to local temperature accumulation will not occur. In addition, the spiral design of the groove can ensure that the heating element is coiled as much and evenly as possible on the surface of the upper heating plate, so that the heat generated by the heating element can heat the upper heating plate more evenly, thereby improving the temperature uniformity and temperature control accuracy of the heating plate assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the implementation methods of this specification or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the implementation methods or the description of the prior art. Obviously, the drawings described below are only some implementation methods recorded in this specification. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0016] Figure 1 This is a schematic structural diagram of a heating plate assembly in one embodiment of the present application;

[0017] Figure 2 for Figure 1 An exploded view of the heating plate assembly is shown;

[0018] Figure 3 This is a schematic diagram of the first surface in one embodiment of the present application;

[0019] Figure 4 This is a schematic diagram of a first surface in another embodiment of the present application;

[0020] Figure 5 This is a schematic structural diagram of an upper hot plate in one embodiment of the present application;

[0021] Figure 6This is a partial cross-sectional enlarged schematic diagram of an upper heating plate in one embodiment of the present application;

[0022] Figure 7 This is a partial cross-sectional enlarged schematic diagram of an upper heating plate in another embodiment of the present application. DETAILED DESCRIPTION

[0023] To facilitate understanding of the present invention, the present invention will be described more fully below with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the accompanying drawings. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present disclosure.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used in this specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0025] In the semiconductor manufacturing process, wafer lamination is a crucial step, and the wafer lamination equipment needs to meet very strict temperature control requirements. Specifically, the chuck plate in the equipment (that is, the workbench used to fix the wafer) needs to be heated to above 120°C, and extremely high temperature uniformity must be achieved throughout the entire heating plate to avoid product quality problems caused by temperature differences. Traditional heating technologies often find it difficult to meet this high-precision temperature control requirement. Generally speaking, the temperature control accuracy that ordinary heaters can achieve is around ±1°C, and the temperature uniformity control can only reach the standard of ±1°C.

[0026] Figure 1 This is a schematic diagram of the structure of the heating plate assembly in one embodiment of the present application. Figure 2 for Figure 1 The exploded view of the heating plate assembly is shown. In one embodiment, the heating plate assembly may include an upper heating plate 100, a heating element 200, and a lower sealing plate 300 stacked in sequence. The upper heating plate 100 may include two opposing surfaces. In this embodiment, the surface of the upper heating plate 100 adjacent to the lower sealing plate 300 may be defined as a first surface 110. A groove 120 may be formed on the first surface 110. Figure 3 This is a schematic diagram of the first surface in one embodiment of the present application, as shown in FIG. Figure 3As shown, the groove 120 can form a spiral path on the first surface 110. The groove 120 surrounds the first surface 110 in a regular spiral extension, forming a continuous concentric circular path structure. In a preferred embodiment, the groove 120 can be machined on the first surface 110 with high precision using numerical control processing equipment (such as CNC, Computerized Numerical Control, computer numerical control), controlling the dimensional tolerance of the groove 120, and providing a precise installation foundation for the pre-embedded heating element 200.

[0027] At least part of the heating element 200 can be arranged along the path of the groove 120, and at least part of the heating element 200 and the groove 120 are interference fit and embedded in the groove 120. After at least part of the heating element 200 is fixed in the groove 120, the upper heating plate 100 and the lower sealing plate 300 can be fixedly connected to realize the assembly of the heating plate assembly as a whole. The upper heating plate 100 and the lower sealing plate 300 can be fixedly connected by glue, welding, etc. That is, after the heating plate assembly is assembled as a whole, the groove 120 and the surface of the lower sealing plate 300 close to the upper heating plate 100 cooperate to form a hollow cavity with a spiral path, and the heating element 200 and the groove 120 are interference fit and embedded in the hollow cavity.

[0028] By providing a groove 120 on the first surface 110 of the upper heating plate 100 and inserting the heating element 200 into the groove 120 in an interference fit, the heating element 200 can be secured within the upper heating plate 100. Furthermore, by providing the groove 120 and inserting the heating element 200 into the upper heating plate 100, the heat generated by the heating element 200 can be conducted more evenly and promptly throughout the upper heating plate 100, preventing problems such as poor temperature uniformity or damage to the heating element 200 due to localized temperature accumulation. Furthermore, by designing the groove 120 into a spiral shape, the heating element 200 can be coiled as evenly as possible around the surface of the upper heating plate 100, thereby allowing the heat generated by the heating element 200 to heat the upper heating plate 100 more evenly, thereby improving the temperature uniformity and temperature control accuracy of the heating plate assembly.

[0029] In one embodiment, the upper heating plate 100 is a circular structure, and the lower sealing plate 300 is also a circular structure. The upper heating plate 100 and the lower sealing plate 300 are arranged concentrically. Preferably, the diameter of the upper heating plate 100 is the same as the diameter of the lower sealing plate 300. Since the wafer has a circular structure, the upper heating plate 100 and the lower sealing plate 300 are designed as circular structures. The overall shape of the heating plate assembly better fits the wafer, allowing for better wafer processing.

[0030] Figure 4This is a schematic diagram of the first surface in another embodiment of the present application. In one embodiment, the upper heating plate 100 can also be provided with a through hole 130, which passes through the upper heating plate 100 in the thickness direction. There is no intersection between the orthographic projection of the through hole 130 on the lower sealing plate and the orthographic projection of the groove 120 on the lower sealing plate 300, that is, when designing the opening positions of the through hole 130 and the groove 120, the groove 120 can be avoided by designing the opening position of the through hole 130 to prevent the through hole 130 from affecting the normal operation of the heating element 100 embedded in the groove 120. In this embodiment, the through hole 130 can be used as a temperature detection hole, and the temperature sensor can be extended into the interior of the heating plate assembly through the through hole 130, so that the temperature inside the heating plate assembly can be monitored using the temperature sensor. Among them, the temperature sensor can include but is not limited to a thermocouple, an RTD (Resistance Temperature Detector) and a thermistor.

[0031] Figure 5 This is a schematic diagram of the structure of an upper heating plate in one embodiment of the present application. In one embodiment, the upper heating plate 100 can be provided with at least two through-holes 130. In actual applications, different numbers of through-holes 130 can be designed according to different application requirements. Furthermore, the heating plate assembly can be divided into different zones, with at least one temperature sensor located in each zone to monitor the different zones. By strategically designing the location, layout, and number of through-holes 130 on the upper heating plate 100, temperature sensors can be used to accurately reflect the temperature distribution of the entire heating plate assembly. The layout of through-holes 130 in the upper heating plate 100 for installing temperature sensors can be determined through testing and can be either asymmetrical or symmetrical. By using temperature sensors to quickly and in real time monitor each zone of the upper heating plate 100, temperature fluctuations of the upper heating plate 100 can be controlled within a very small range, meeting temperature uniformity requirements of ±0.5°C or even more stringent. In addition, multi-point temperature monitoring allows for independent adjustment of different zones, effectively reducing temperature differences caused by uneven heating, thereby ensuring temperature uniformity of the upper heating plate 100.

[0032] In one embodiment, through-hole 130 can also serve as a threaded mounting hole or other functional hole. It can also be used for connecting and stacking between structures, facilitating the installation and interaction between the heating plate assembly and other devices. Furthermore, because through-hole 130 and recess 120 are designed to avoid each other, components within through-hole 130 and recess 120 do not interfere with each other, thereby ensuring the stability of the heating plate assembly.

[0033] In one embodiment, the heating element 200 can be a heating wire, and the diameter of the heating wire can range from 2.5mm to 3.5mm. The heating wire can be made of a high resistivity material, such as nickel-chromium alloy, iron-chromium-aluminum alloy, etc. Existing heating plates usually use heating wires with a diameter of more than 8mm. The spacing between the heating wires is large, which leads to problems such as untimely heat conduction and large temperature differences between different areas. In the embodiment of the present application, an extremely fine heating wire is pre-buried in the heating plate assembly. Due to the small diameter of the heating wire, the bending and coiling are more flexible, so that the heating wire can be coiled in a more compact and uniform manner in various areas of the heating plate assembly, and the heat emitted by the heating wire can be better conducted to various areas of the heating plate assembly. At the same time, due to the small diameter of the heating wire, when coiled in a ring, the spacing between adjacent heating wires in the same direction can be designed to be smaller, so that the heating wire can transfer heat to the heating plate more evenly and in a timely manner, ensuring temperature uniformity in each area of ​​the heating plate.

[0034] In a preferred embodiment, the distance between the grooves 120 ranges from 5 mm to 20 mm. That is, with the center of the upper heating plate 100 as the origin, the distance between adjacent grooves 120 in the radial direction of the upper heating plate 100 ranges from 5 mm to 20 mm. Considering that heat transfer rates may vary at different locations on the upper heating plate 100, in actual applications, adjacent grooves 120 may be spaced the same or at different distances based on specific design requirements.

[0035] In one embodiment, the diameter of the groove 120 is 0.85 to 0.95 times the diameter of the heating wire. That is, the diameter of the groove 120 is slightly smaller than the diameter of the heating wire, so that an interference fit can be achieved between the groove 120 and the heating wire, ensuring that the heating wire is more firmly embedded in the groove 120.

[0036] In one embodiment, the depth of the groove 120 is 1 to 1.05 times the diameter of the heating wire. By designing the depth of the groove 120 to be the same as or slightly larger than the diameter of the heating wire, the heating wire can be completely inserted into the groove 120 during installation, thereby achieving a better fit and a tighter connection between the upper heating plate 100 and the lower sealing plate 300, ensuring that the heat generated by the heating wire can be better transferred to the upper heating plate 100, preventing heat waste and ensuring more accurate temperature uniformity.

[0037] Figure 6 This is a partial cross-sectional enlarged schematic diagram of an upper heating plate in one embodiment of the present application. Figure 6 For Yanru Figure 4 The cross-sectional structure diagram obtained by cutting the upper heating plate along the AA section line shown is as follows: Figure 7 This is a partial cross-sectional enlarged schematic diagram of the upper heating plate in another embodiment of the present application. Figure 7 For Yanru Figure 4 The schematic diagram of the cross-sectional structure can be obtained by cutting the upper heating plate along the BB section line shown. Figure 6 It can be seen that the depth of the groove 120 in the thickness direction of the upper heating plate 100 is less than the thickness of the upper heating plate 100. In a preferred embodiment, the depth of the groove 120 in the thickness direction of the upper heating plate 100 is 0.2 to 0.3 times the thickness of the upper heating plate 100. Figure 7 It can be seen that the through hole 130 passes through the upper heating plate 100 in the thickness direction of the upper heating plate 100 .

[0038] In one embodiment, the lower cover plate 300 defines guide holes through which the ends of the heating element 200 extend outside the heating plate assembly. After the heating element 200 is inserted into the recess 120, the ends of the heating element 200 can extend from the surface of the lower cover plate 300, in principle, of the heating plate 100, outside the heating plate assembly through the guide holes, thereby enabling the heating element 200 to be connected to other components or devices (such as a heating control device).

[0039] In one embodiment, the surface of the upper heating plate 100 close to the lower sealing plate 300 is the first surface 110, and the surface of the lower sealing plate 300 close to the upper heating plate 100 is the second surface. The surface roughness of the first surface 110 and the second surface ranges from 0.1 μm to 3.2 μm. High-precision CNC is used to ensure the surface roughness of the first surface 110 and the second surface. Since the groove 120 is opened on the first surface 110 of the upper heating plate 100, high-precision CNC can also be used to process the groove 120 to ensure the surface roughness of the groove 120. The smaller the surface roughness of the first surface 110, the second surface, and the groove 120, the higher the fit between the components in the heating plate assembly, thereby increasing the thermal conductivity and improving the temperature uniformity of the heating plate assembly.

[0040] The present application also provides a vacuum lamination device, which may include a heating plate assembly as described in any one of the above embodiments. The vacuum lamination device is a device used in semiconductor manufacturing, flat panel display production and other industries that require high-precision coating processes. The vacuum lamination device improves the quality and uniformity of thin film deposition by utilizing a vacuum environment, while ensuring that no bubbles or impurities are present in the film layer. By applying the above-mentioned heating plate assembly to the vacuum lamination device, it is possible to achieve both temperature uniformity and temperature control accuracy through precise heating element pre-embedded design, unique heat conduction design, temperature detection hole layout, etc., to ensure the quality and consistency of the final product. The groove 120 is used to achieve the precise layout of the heating element 200 in the heating plate assembly, ensuring that the heat emitted by the heating element 200 can be transmitted to the heating plate assembly in a timely and uniform manner, thereby ensuring the temperature uniformity of each area in the heating plate assembly.

[0041] Throughout this specification, references to terms such as "some embodiments," "other embodiments," and "desired embodiments" indicate that a particular feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. Although these terms are used interchangeably throughout this specification, they do not necessarily refer to the same embodiment or example.

[0042] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0043] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A heating plate assembly, characterized in that: It includes an upper heating plate, a heating element and a lower sealing plate which are stacked in sequence. A groove is provided on the surface of the upper heating plate close to the lower sealing plate, and the groove forms a spiral path on the surface of the upper heating plate; at least part of the heating element is arranged along the path of the groove and is embedded in the groove with an interference fit; after at least part of the heating element is fixed in the groove, the upper heating plate is fixedly connected to the lower sealing plate.

2. The heating plate assembly according to claim 1, wherein: The upper heating plate is provided with a through hole, and the orthographic projection of the through hole on the lower sealing plate does not intersect with the orthographic projection of the groove on the lower sealing plate.

3. The heating plate assembly according to claim 2, wherein: The upper heating plate is provided with at least two through holes.

4. The heating plate assembly according to claim 1, wherein: The heating element is a heating wire, and the diameter of the heating wire ranges from 2.5 mm to 3.5 mm.

5. The heating plate assembly according to claim 4, characterized in that: The diameter of the groove is 0.85 to 0.95 times the diameter of the heating wire.

6. The heating plate assembly according to claim 1, wherein: The depth of the groove is 1 to 1.05 times the diameter of the heating wire.

7. The heating plate assembly according to claim 1, wherein: The distance between the grooves ranges from 5 mm to 20 mm.

8. The heating plate assembly according to claim 1, wherein: The lower sealing plate is provided with a guide hole, and both ends of the heating element extend out of the heating disk assembly through the guide hole.

9. The heating plate assembly according to claim 1, wherein: The surface of the upper heating plate close to the lower sealing plate is a first surface, and the surface of the lower sealing plate close to the upper heating plate is a second surface. The surface roughness of the first surface and the second surface ranges from 0.1 μm to 3.2 μm.

10. A vacuum lamination device, characterized in that: The invention comprises a heating plate assembly according to any one of claims 1 to 9.

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