Semiconductor material carrying method, control device, electronic equipment and storage medium

Abstract

The invention belongs to the technical field of semiconductor integrated circuits, and discloses a semiconductor material carrying method and device, electronic equipment and a storage medium. According to the scheme, when a carrying path of a semiconductor material is planned, a first parameter, a second parameter and a third parameter are comprehensively considered; the first parameter is obtained based on theoretical conveying time and / or historical shortest conveying time of a conveying road section, and the second parameter is obtained based on at least one of the conveying capacity of the conveying equipment, the busy degree of the conveying equipment and the historical conveying efficiency of the conveying equipment; the third parameter is obtained based on at least one of the working state of the carrying equipment, the on-off state of the carrying road section and the adjustment cardinal number, calculating the road section overhead of each carrying road section based on the first parameter, the second parameter and the third parameter so as to obtain the path overhead of each carrying path, and determining the material carrying path of the material carrying task based on the path overhead. And the carrying congestion in the carrying process is reduced, and the carrying efficiency of the semiconductor materials is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor integrated circuit technology, and in particular to a semiconductor material transport method, a control device, an electronic device, and a storage medium. Background Art

[0002] Semiconductor device manufacturing involves a series of process steps. The primary function of the logistics system in a semiconductor wafer fab is to move semiconductor materials to each process station at the correct time. These stations are often located on different floors of the wafer fab, or even across different wafer fabs. The industry primarily uses an Automatic Material Handling System (AMHS) to facilitate the flow of semiconductor materials between these stations.

[0003] Automatic material handling systems include various types of handling equipment, such as overhead handling equipment and cross-floor handling equipment. Aerial handling equipment is used to facilitate the flow of semiconductor materials within a single floor, while cross-floor handling equipment works in conjunction with overhead handling equipment to facilitate the cross-floor flow of semiconductor materials. In existing technology, the Material Control System (MCS) fails to consider the dynamic conditions of handling equipment when planning the transport routes of semiconductor materials, which can easily lead to transport congestion and low transport efficiency for the entire automatic material handling system. Summary of the Invention

[0004] In order to solve the above problems, the present application provides a semiconductor material transport method, a control device, an electronic device and a storage medium.

[0005] According to one aspect of an embodiment of the present application, a semiconductor material transport method is disclosed, the semiconductor material transport method comprising:

[0006] receiving a material transport task, wherein the material transport task includes a transport start location and a transport target location, wherein one or more transport paths are provided between the transport start location and the transport target location, and each transport path includes one or more transport segments, and a transport segment is formed between two adjacent transport nodes;

[0007] Calculating the segment cost of each transport segment based on a first parameter, a second parameter, and a third parameter, wherein the first parameter is obtained based on at least one of a theoretical transport time and a historical shortest transport time of the transport segment, the second parameter is obtained based on at least one of a transport capacity of a transport device, a busyness level of the transport device, and a historical transport efficiency of the transport device, and the third parameter is obtained based on at least one of a working status of the transport device, an on / off status of the transport segment, and an adjustment base;

[0008] Obtaining a path cost of the transport path based on the segment costs of each transport segment of the transport path;

[0009] A material transport path for the material transport task is determined based on the path cost.

[0010] In some embodiments, before calculating the section overhead of each transport section based on the first parameter, the second parameter and the third parameter, the semiconductor material transport method further includes: determining whether the material transport task is matched with a fixed path; if the material transport task is matched with a fixed path, determining whether the fixed path is unobstructed; if the fixed path is unobstructed, using the fixed path as the material transport path for the material transport task.

[0011] In some embodiments, the calculating of the section cost of each transport section based on the first parameter, the second parameter, and the third parameter includes: performing a weighted operation on the first parameter and the second parameter for the transport section to obtain a weighted parameter; and performing a weighted operation on the weighted parameter and the third parameter to obtain the section cost of the transport section. The obtaining of the path cost of the transport path based on the section costs of each transport section of the transport path includes: summing the section costs of each transport section of the transport path to obtain the path cost of the transport path. The determining of the material transport path for the material transport task based on the path cost includes: selecting the transport path with the smallest path cost as the material transport path for the material transport task.

[0012] In some embodiments, before calculating the section overhead of each transport section based on the first parameter, the second parameter and the third parameter, the semiconductor material transport method further includes: adding the theoretical transport time and the historical shortest transport time of the transport section to obtain the first parameter.

[0013] In some embodiments, the transport equipment includes at least one transport mechanism capable of performing material transport, and the transport capacity of the transport equipment is the number of transport mechanisms included in the transport equipment; the busyness of the transport equipment includes the number of first instructions issued to the transport equipment, and the first number of instructions is the total number of transport instructions that the transport equipment is executing and waiting to be executed; the historical transport efficiency of the transport equipment is the average transport time spent by the transport equipment to execute a transport instruction on the transport section. Before calculating the section overhead of each transport section based on the first parameter, the second parameter, and the third parameter, the semiconductor material transport method further includes: multiplying the number of first instructions issued to the transport equipment by the historical transport efficiency of the transport equipment to obtain a first intermediate parameter; dividing the first intermediate parameter by the number of transport mechanisms included in the transport equipment to obtain a second intermediate parameter; and obtaining a second parameter based on the second intermediate parameter.

[0014] In some embodiments, the conveying equipment includes multiple material conveying ports, and the multiple material conveying ports include at least one material conveying entrance and at least one material conveying exit, and the material conveying entrance and the material conveying exit form an internal conveying channel, and all internal conveying channels of the conveying equipment correspond to the same conveying section; the second parameter is also determined based on the priority of the material conveying port of the conveying equipment, wherein the priority of the material conveying port is determined based on the highest priority of the internal conveying channels; the busyness of the conveying equipment also includes the number of second instructions issued to the material conveying port of the conveying equipment, and the second instruction number is the total number of conveying instructions being executed and waiting to be executed by the material conveying port; the internal conveying channel priority is determined by at least one of the second instruction number of the material conveying port of the internal conveying channel and the theoretical priority of the material conveying port.

[0015] In some embodiments, the priority of the internal transport channel is determined by multiplying the number of second instructions issued to the material transport entrance of the internal transport channel by the theoretical priority of the material transport entrance, plus the product of the number of second instructions issued to the material transport exit of the internal transport channel and the theoretical priority of the material transport exit.

[0016] In some embodiments, obtaining the second parameter based on the second intermediate parameter further includes: adding the second intermediate parameter and the material conveying port priority of the conveying equipment to obtain the second parameter.

[0017] In some embodiments, before calculating the section overhead of each transport section based on the first parameter, the second parameter, and the third parameter, the semiconductor material transport method further includes: performing a weighted operation on the equipment parameter value of the transport equipment, the section on-off parameter value, and the adjustment base to obtain a third parameter. The equipment parameter value is obtained based on the working state of the transport equipment, the section on-off parameter value is obtained based on the on-off state of the transport section, the section on-off parameter value when the transport section is normally unobstructed is less than the section on-off parameter value when the transport section is blocked, and the adjustment base is positively correlated with the number of floors and the number of factories spanned between the transport starting position and the transport target position.

[0018] In some embodiments, the calculating of the route cost of each transport segment based on the first parameter, the second parameter, and the third parameter includes: calculating the route cost of each transport segment based on the relationship Route Cost = ((n×t / A+Ln×Lc)*Dynamic Ratio+(BaseCost+Min)*(1-Dynamic Ratio))×α%+(Count(VHL)×X%+Route on-off parameter value×Y%+Adjustment base×Z%)×β%. Among them, Route Cost represents the road section cost, (n×t / A+Ln×Lc) represents the second parameter, n represents the number of first instructions issued to the transport equipment, the first number of instructions is the total number of transport instructions being executed and waiting to be executed by the transport equipment, t represents the average transport time spent by the transport equipment to execute a transport instruction on the transport section, A represents the number of transport mechanisms included in the transport equipment, and the transport mechanism can execute transport instructions, Ln×Lc represents the priority of the material transport port of the transport equipment, Ln represents the number of second instructions issued to the material transport port of the transport equipment, the second number of instructions is the total number of transport instructions being executed and waiting to be executed by the material transport port, Lc represents the theoretical priority of the material transport port, DynamicRatio represents the weight coefficient corresponding to the second parameter, (Base Cost+Min) represents the first parameter, Base Cost represents the theoretical transport time, Min represents the shortest historical transport time, (1-Dynamic Ratio) represents the weight corresponding to the first parameter, (Count(VHL)×X%+section on-off parameter value×Y%+adjustment base×Z%) represents the third parameter, Count(VHL) represents the equipment parameter value of the transport equipment, and the equipment parameter value is obtained based on the working status of the transport equipment. α and β represent weight coefficients, α+β=100, and X, Y, and Z represent weight coefficients, X+Y+Z=100.

[0019] In some embodiments, the transport equipment includes multiple material transport ports and at least one material temporary storage area corresponding to each of the material transport ports, wherein the material temporary storage area is used to store materials to be transported. After determining the material transport path of the material transport task based on the path cost, the semiconductor material transport method further includes: obtaining the number of material temporary storage areas and the number of second instructions for each material transport port of the transport equipment; and determining the material transport port of the transport equipment on the material transport path based on the ratio of the number of second instructions issued to the material transport port to the number of material temporary storage areas for the material transport port.

[0020] According to one aspect of an embodiment of the present application, a semiconductor material handling control device is disclosed, which includes a task receiving module, a first calculation module, a second calculation module, and a path selection module. The task receiving module is used to receive a material handling task, wherein the material handling task includes a handling starting position and a handling target position, and there is one or more handling paths between the handling starting position and the handling target position, each of the handling paths includes one or more handling sections, and a handling section is formed between two adjacent handling nodes. The first calculation module is used to calculate the section cost of each of the handling sections based on a first parameter, a second parameter, and a third parameter, wherein the first parameter is obtained based on at least one of the theoretical handling time and the historical shortest handling time of the handling section, the second parameter is obtained based on at least one of the handling capacity of the handling equipment, the busyness of the handling equipment, and the historical handling efficiency of the handling equipment, and the third parameter is obtained based on at least one of the working status of the handling equipment, the on-off status of the handling section, and the adjustment base. The second calculation module is used to obtain the path cost of the transport path based on the segment costs of each transport segment of the transport path. The path selection module is used to determine the material transport path of the material transport task based on the path costs.

[0021] According to one aspect of an embodiment of the present application, an electronic device is disclosed, which includes one or more processors and a memory, wherein the memory is used to store one or more computer programs. When the one or more computer programs are executed by the one or more processors, the processor implements the semiconductor material handling method as described above.

[0022] According to one aspect of an embodiment of the present application, a computer-readable storage medium is disclosed, which stores computer-readable instructions. When the computer-readable instructions are executed by a processor of a computer, the computer executes the semiconductor material handling method as described above.

[0023] The technical solutions provided by the embodiments of the present application include at least the following beneficial effects:

[0024] The solution disclosed in the present application comprehensively considers the first parameter, the second parameter and the third parameter when planning the transport path of semiconductor materials. The first parameter is obtained based on the theoretical transport time and / or the historical shortest transport time of the transport section, the second parameter is obtained based on at least one of the transport capacity of the transport equipment, the busyness of the transport equipment, and the historical transport efficiency of the transport equipment, and the third parameter is obtained based on the working status of the transport equipment, the on-off status of the transport section and at least one of the adjustment base. The section overhead of each transport section is calculated based on the first parameter, the second parameter and the third parameter, thereby obtaining the path overhead of each transport path, and determining the material transport path of the material transport task based on the path overhead. When selecting the transport path of semiconductor materials, a variety of influencing factors such as static factors and dynamic factors are comprehensively considered, which can reduce the transport congestion during the transport of semiconductor materials and improve the transport efficiency of semiconductor materials.

[0025] It should be understood that the foregoing general description and the following detailed description are merely illustrative and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0027] Figure 1 A schematic diagram of a conventional transport scenario is shown;

[0028] Figure 2 A flow chart of a semiconductor material transport method according to an embodiment of the present application is shown;

[0029] Figure 3 A flowchart of determining a second parameter according to an embodiment of the present application is shown;

[0030] Figure 4 A partial flow chart of determining the second parameter according to an embodiment of the present application is shown;

[0031] Figure 5 A schematic diagram of a transport scenario according to an embodiment of the present application is shown;

[0032] Figure 6 A flow chart for determining a material delivery port according to an embodiment of the present application is shown;

[0033] Figure 7 A flow chart showing a semiconductor material transport method according to another embodiment of the present application is shown;

[0034] Figure 8 The following is a block diagram showing the composition of a semiconductor material transport control device according to an embodiment of the present application;

[0035] Figure 9 A block diagram showing the composition of an electronic device according to an embodiment of the present application is shown;

[0036] Figure 10 A block diagram of a computer system structure for implementing some embodiments of the present application is shown.

[0037] The following are the descriptions of the reference numerals:

[0038] 800. Semiconductor material handling control device; 801. Task receiving module; 802. First calculation module; 803. Second calculation module; 804. Path selection module; 805. First parameter acquisition module; 806. Second parameter acquisition module; 807. Third parameter acquisition module; 808. Material handling port determination module; 809. Fixed path selection module; 900. Electronic device; 901. Processor; 902. Memory; 1000. Computer system; 1001. CPU; 1002. ROM; 1003. RAM; 1004. Bus; 1005. I / O interface; 1006. Input part; 1007. Output part; 1008. Storage part; 1009. Communication part; 1010. Drive; 1011. Removable media. DETAILED DESCRIPTION

[0039] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these example embodiments are provided so that the description of this application will be thorough and complete and will fully convey the concepts of the example embodiments to those skilled in the art.

[0040] In the description of this application, it should be understood that the terms "first," "second," and "third" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include one or more features. In the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0041] In addition, described feature, structure or characteristic can be combined in one or more embodiments in any suitable manner.In the following description, many specific details are provided so as to provide a full understanding of the embodiments of the present application. However, it will be appreciated by those skilled in the art that the technical scheme of the present application can be put into practice without one or more of the specific details, or other methods, components, devices, steps etc. can be adopted. In other cases, known methods, devices, implementations or operations are not shown or described in detail to avoid blurring the various aspects of the application.

[0042] The flowcharts shown in the accompanying drawings are for illustrative purposes only and do not necessarily include all contents and operations / steps, nor must they be executed in the order described. For example, some operations / steps may be decomposed, while others may be combined or partially combined. Therefore, the actual execution order may vary depending on the actual situation.

[0043] Semiconductor device manufacturing involves a series of processes, requiring the transfer of semiconductor materials between multiple process stations. These stations are often located on different floors of a wafer fab, or even across different wafer fabs. Therefore, an automated material handling system is required to transport semiconductor materials between these stations. This automated material handling system includes multiple types of handling equipment, such as overhead and cross-floor equipment. Multiple units of each type of handling equipment are used to coordinate the transfer of semiconductor materials between various process stations.

[0044] During the semiconductor material transportation process, the Manufacturing Execution System (MES) sends material transportation tasks to the MCS, and the MCS plans the transportation path of the semiconductor materials based on the received material transportation tasks. Figure 1 As shown, semiconductor materials need to be transported from the process site on the third floor to the process site on the first floor. When planning the transport path of semiconductor materials, MCS randomly selects cross-floor transport equipment (Tower Stocker, TSTK). Some cross-floor transport equipment may be issued too many transport instructions or too few transport instructions. For example, the number of transport instructions issued to the cross-floor transport equipment TSTK01 is significantly greater than the number of transport instructions issued to the cross-floor transport equipment TSTK02. Due to the imbalance of transport instructions received by the cross-floor transport equipment, traffic jams may occur in certain areas. In addition, MCS does not consider the actual situation of the transport equipment, such as the transport capacity of the transport equipment, the number of transport instructions issued, historical transport time, real-time working status, etc., and may choose a long-distance transport path when there are other better transport paths. For example, choosing Figure 1 The material is transported along the path R1 shown, which increases the transport load of the transport equipment or causes transport congestion, resulting in low transport efficiency of the entire automatic material transport system.

[0045] To this end, the present application provides a semiconductor material transport method that can improve the transport efficiency of an automatic material transport system.

[0046] In wafer fab production, front opening unified pods (FOUPs) serve as the primary wafer carriers and are widely used in various process equipment. The semiconductor material in this application can be either a loaded or empty FOUP. Of course, the semiconductor material can also be other materials besides FOUPs, such as a mask box or overhead crane.

[0047] The transport equipment has multiple material transport ports, each of which includes a material transport entrance and a material transport exit. During the material transport process, the semiconductor material is transported into the transport equipment through the material transport entrance of the transport equipment and then transported out through the material transport exit of the transport equipment. The transport equipment includes one or more transport mechanisms capable of performing material transport, each of which is capable of transporting semiconductor materials from the material transport entrance of the transport equipment to the material transport exit of the transport equipment, as well as transporting semiconductor materials from the previous transport node to the material transport entrance of the current transport equipment, and transporting semiconductor materials from the material transport exit of the current transport equipment to the next transport node. Exemplarily, when the transport equipment is an aerial transport equipment, the transport mechanism is an overhead crane, which transports semiconductor materials from the material transport entrance of the aerial transport equipment to the material transport exit of the aerial transport equipment through the overhead crane, and transports semiconductor materials from the previous transport node to the material transport entrance of the current aerial transport equipment, and transports semiconductor materials from the material transport exit of the current aerial transport equipment to the next transport node.

[0048] The semiconductor material transport method provided by the present application is described in detail below in conjunction with specific implementation methods.

[0049] Figure 2 A flow chart of a semiconductor material transport method according to an embodiment of the present application is shown. Figure 2 As shown, the semiconductor material transport method at least includes a transport task receiving step, a section cost calculation step, a path cost calculation step, and a transport path determination step, which correspond to the following steps S210 to S240, respectively, and are described in detail as follows:

[0050] In step S210, a material transport task is received, and then step S220 is executed.

[0051] A material handling task consists of a starting location and a target location. The starting location is the initial point of the entire material handling task, and the target location is the destination of the entire material handling task. For example, if the material handling task involves moving semiconductor materials from process site A to process site B, process site A is the starting location and process site B is the target location.

[0052] There can be one or more transport paths between the starting and destination locations. When multiple transport paths exist, a material transport task can be performed using one of these paths. Each transport path consists of one or more transport segments, with a segment consisting of two adjacent transport nodes. Transport nodes are the material transfer points along a transport path, such as material handling ports on transport equipment, process stations, or transport corridors between transport equipment.

[0053] Exemplarily, the material handling task is to transport semiconductor materials from process site C to process site D. There are multiple transport paths between process site C and process site D, for example, transport path 1: process site C, process site C-transporting equipment OHT01, transporting equipment OHT01-transporting equipment TSTK03, transporting equipment TSTK03-transporting equipment OHT02, process site D; transport path 2: process site C, process site C-transporting equipment OHT01, transporting equipment OHT01-transporting equipment TSTK04, transporting equipment TSTK04-transporting equipment OHT02, process site D. For transport path 1, the transport channel from the C process site to the C process site and the transport equipment OHT01, the transport channel between the C process site and the transport equipment OHT01 to the transport channel between the transport equipment OHT01 and the transport equipment TSTK03, the transport channel between the transport equipment OHT01 and the transport equipment TSTK03 to the transport channel between the transport equipment TSTK03 and the transport equipment OHT02, and the transport channel between the transport equipment TSTK03 and the transport equipment OHT02 to the D process site are all a transport section; the C process site, the transport channel between the C process site and the transport equipment OHT01, the transport channel between the transport equipment OHT01 and the transport equipment TSTK03, the transport channel between the transport equipment TSTK03 and the transport equipment OHT02, and the D process site are all a transport node. For transport path 2, the transport channel from the C process site to the C process site and the transport equipment OHT01, the transport channel between the C process site and the transport equipment OHT01 to the transport channel between the transport equipment OHT01 and the transport equipment TSTK04, the transport channel between the transport equipment OHT01 and the transport equipment TSTK04 to the transport channel between the transport equipment TSTK04 and the transport equipment OHT02, and the transport channel between the transport equipment TSTK04 and the transport equipment OHT02 to the D process site are all a transport section; the C process site, the transport channel between the C process site and the transport equipment OHT01, the transport channel between the transport equipment OHT01 and the transport equipment TSTK04, the transport channel between the transport equipment TSTK04 and the transport equipment OHT02, and the D process site are all a transport node.

[0054] In step S220, the segment cost of each transport segment is calculated based on the first parameter, the second parameter, and the third parameter. Then, step S230 is executed.

[0055] The first parameter may be obtained based on the theoretical transport time of the transport section, for example, the theoretical transport time of the transport section may be used as the first parameter. The theoretical transport time of the transport section may be determined based on the actual distance and transport speed of the transport section. For each transport device, the maximum transport speed is often the same, and the theoretical transport time of the transport section mainly depends on the actual distance of the transport section.

[0056] The first parameter can be obtained based on the historical shortest transport time for the transport segment, for example, by using the historical shortest transport time for the transport segment as the first parameter. The historical shortest transport time for the transport segment is the shortest transport time spent by the transport equipment on the transport segment during a preset period of time. For example, the transport times corresponding to all transport instructions executed by the transport equipment on the transport segment on the previous day are obtained, and the shortest transport time among these is used as the historical shortest transport time for the transport segment.

[0057] The first parameter can also be derived based on the theoretical transport time and the historical shortest transport time for the transport section. For example, the first parameter is obtained by summing the theoretical transport time and the historical shortest transport time for the transport section. Determining the first parameter by taking both the theoretical and historical shortest transport times into account can better reflect the actual conditions of the transport section and facilitate the selection of a transport route with higher transport efficiency in subsequent steps.

[0058] The second parameter may be obtained based on the transport capacity of the transport equipment, for example, the transport capacity of the transport equipment is used as the second parameter. The transport capacity of the transport equipment may be obtained based on the number of transport mechanisms included in the transport equipment, for example, the number of transport mechanisms included in the transport equipment is used as the transport capacity of the transport equipment, that is, the number of transport mechanisms included in the transport equipment is used as the second parameter.

[0059] The second parameter may be obtained based on the busyness of the transport device, for example, the busyness of the transport device is used as the second parameter. The busyness of the transport device may be determined based on the number of first instructions, for example, the number of first instructions is used as the second parameter, where the number of first instructions is the total number of transport instructions being executed and waiting to be executed by the transport device.

[0060] The second parameter can be obtained based on the historical transport efficiency of the transport equipment, for example, by using the historical transport efficiency of the transport equipment as the second parameter. The historical transport efficiency of the transport equipment is the transport efficiency of the transport equipment on the transport section during a preset time period. For example, the transport times corresponding to all transport instructions executed by the transport equipment on the transport section on the previous day are obtained, and the average transport time spent by the transport equipment on each transport instruction executed on the transport section on the previous day is used as the historical transport efficiency of the transport equipment.

[0061] The second parameter can also be obtained based on multiple parameters, for example, based on the transport capacity of the transport equipment and the busyness of the transport equipment, or based on the transport capacity of the transport equipment and the historical transport efficiency of the transport equipment, or based on the busyness of the transport equipment and the historical transport efficiency of the transport equipment, or based on the transport capacity of the transport equipment, the busyness of the transport equipment and the historical transport efficiency of the transport equipment.

[0062] In one embodiment, if Figure 3 As shown, the step of determining the second parameter includes the following steps S310 to S330, which are described in detail as follows:

[0063] In step S310, the number of first instructions issued to the transport equipment is multiplied by the historical transport efficiency of the transport equipment to obtain a first intermediate parameter. Then, step S320 is executed.

[0064] In step S320, the first intermediate parameter is divided by the number of transport mechanisms included in the transport equipment to obtain a second intermediate parameter. Then, step S330 is executed.

[0065] In step S330 , a second parameter is obtained based on the second intermediate parameter.

[0066] exist Figure 3 In the illustrated embodiment, the number of first instructions issued to the transport device is multiplied by the transport device's historical transport efficiency to obtain the total time required for the transport device to execute the first number of transport instructions using one transport mechanism. The multiplication result is then divided by the number of transport mechanisms included in the transport device to obtain the time required for the transport device to complete the current first number of transport instructions. Based on this time, a second parameter is then determined. This second parameter can accurately represent the actual performance of the transport device and facilitate the selection of a transport path with higher transport efficiency in subsequent steps. In step S330, the second parameter can be obtained directly based on the second intermediate parameter.

[0067] In step S330 , the second parameter may be obtained based on the second intermediate parameter and the material transfer port priority of the transfer equipment. For example, the second intermediate parameter and the material transfer port priority are added together to obtain the second parameter.

[0068] The priority of the material handling port is described in detail as follows:

[0069] The conveying equipment includes multiple material conveying ports, which include at least one material conveying entrance and at least one material conveying exit. A material conveying entrance and a material conveying exit form an internal conveying channel. All internal conveying channels of a conveying equipment correspond to the same conveying section.

[0070] Specifically, when the conveying equipment includes a material conveying entrance and a material conveying exit, the conveying equipment has an internal conveying channel, and the conveying section where the internal conveying channel is located is the conveying section where the conveying equipment is located; when the conveying equipment includes M material conveying entrances and N material conveying exits (M and N are both positive integers, and M*N>1), the conveying equipment has M*N internal conveying channels, and the conveying sections where the M*N internal conveying channels are located are all the conveying sections where the conveying equipment is located, that is, the M material conveying entrances all correspond to the conveying nodes in front of the conveying equipment, and the N material conveying exits all correspond to the conveying nodes behind the conveying equipment.

[0071] The busyness of the transport equipment also includes the number of second instructions issued to the material transport port, where the number of second instructions is the total number of transport instructions being executed and waiting to be executed by the material transport port.

[0072] Specifically, the conveying equipment may have one or more material conveying entrances, and one or more material conveying exits. When the conveying equipment has multiple material conveying entrances, the number of second instructions assigned to the multiple material conveying entrances may be the same or different. When the conveying equipment has multiple material conveying exits, the number of second instructions assigned to the multiple material conveying exits may be the same or different. When the conveying equipment has multiple material conveying entrances or multiple material conveying exits, the busyness of the conveying equipment is related to the most idle material conveying exit, that is, the busyness of the conveying equipment also includes the busyness of the material conveying exit. For the same conveying equipment, multiple material conveying exits share the conveying mechanism of the conveying equipment, so the busyness of the material conveying exit includes the number of second instructions, and the number of second instructions is the total number of conveying instructions being executed and waiting to be executed by the material conveying exit.

[0073] The second parameter is also determined based on the priority of the material conveying port of the conveying equipment. The priority of the material conveying port is determined based on the highest priority of the internal conveying channel. The priority of the internal conveying channel is determined by at least one of the second instruction number of the material conveying port of the internal conveying channel and the theoretical priority of the material conveying port.

[0074] A transport device may have one or more internal transport channels. Different internal transport channels have different internal transport channel priorities based on the busyness of their material handling ports and at least one of their theoretical priorities. The highest internal transport channel priority is the material handling port priority of the transport device. The material handling port priority can refer to the degree of preference given to a transport device based on the status of its material handling port. For example, the highest internal transport channel priority of device A is preferred over the highest internal transport channel priority of device B. This makes device A more likely to be selected during the calculation of the second parameter, thereby affecting the selection of transport sections and transport paths.

[0075] Specifically, the second parameter is also determined based on the priority of the material conveying port of the conveying equipment, and the priority of the material conveying port is determined based on the highest priority of the internal conveying channel, including the following situations: the calculation of the second parameter can be to first determine the highest priority of the internal conveying channel for calculating the second parameter of the conveying equipment, or it can be based on the priority of each internal conveying channel, and then calculate according to the second parameter calculation method and select the best one as the second parameter of the conveying equipment, or each internal conveying channel can be regarded as a conveying section, and the path cost can be determined after calculating the second parameter, and the second parameter corresponding to the smallest path cost is regarded as the second parameter of the conveying equipment.

[0076] The determination of the priority of the internal transport channel can take into account at least one of the second instruction number and the theoretical priority of the material transport port. The determination of the priority of the internal transport channel taking into account the second instruction number is obviously to determine the degree to which the internal transport channel is preferentially selected according to the busyness of the material transport port. The determination of the priority of the internal transport channel takes into account the theoretical priority of the material transport port of the transporting equipment, which helps to allow the transporting equipment with redundant capacity to execute more transport instructions when determining the material transport path, reduce the execution of transport instructions of the transporting equipment with a larger load, and avoid overloading the transport equipment; in addition, based on the needs of certain specific scenarios, by configuring the theoretical priority of the material transport port, some transport equipment can be preferentially selected or not selected. For example, it is preferred to select transport equipment with a higher yield rate for transporting products, and reduce the probability of selecting transport equipment with a higher contamination rate for transporting products.

[0077] Specifically, the internal transport channel is associated with a material transport entrance and a material transport exit. When determining the priority of the internal transport channel, only the material transport entrance, only the material transport exit, or both can be considered. That is, the priority of the internal transport channel is determined by at least one of the second instruction number of the material transport exit of the internal transport channel and the theoretical priority of the material transport exit, including being determined by at least one of the second instruction number of the material transport entrance of the internal transport channel and the theoretical priority of the material transport entrance, or being determined by at least one of the second instruction number of the material transport exit of the internal transport channel and the theoretical priority of the material transport exit, or being jointly determined by at least one of the second instruction number of the material transport entrance of the internal transport channel and the theoretical priority of the material transport entrance, and at least one of the second instruction number of the material transport exit and the theoretical priority of the material transport exit.

[0078] In one embodiment, the priority of the internal transport channel is determined by multiplying the number of second instructions issued to the material transport entrance of the internal transport channel by the theoretical priority of the material transport entrance, and the product of the number of second instructions issued to the material transport exit of the internal transport channel and the theoretical priority of the material transport exit. For example, Figure 4 As shown, step S330 includes the following steps S410 to S420, which are described in detail as follows:

[0079] In step S410, the number of second instructions issued to the material transfer entrance of the internal transfer channel is multiplied by the theoretical priority of the material transfer entrance to obtain a third intermediate parameter. Furthermore, the number of second instructions issued to the material transfer exit of the internal transfer channel is multiplied by the theoretical priority of the material transfer exit to obtain a fourth intermediate parameter. Then, step S420 is executed.

[0080] In step S420, the third intermediate parameter and the fourth intermediate parameter are added together to obtain the internal transport channel priority. Then, step S430 is executed.

[0081] In step S430, the second intermediate parameter is added to the material transfer port priority of the transfer equipment to obtain a second parameter.

[0082] The third parameter can be obtained based on the working state of the transport equipment. The working state of the transport equipment can be mapped to the equipment parameter value, and the equipment parameter value of the transport equipment is used as the third parameter. The working state of the transport equipment can include congestion, fault conditions, etc. Different working states correspond to different equipment parameter values. For example, the value corresponding to the transport mechanism in the transport equipment that is working normally is 1, the value corresponding to the transport mechanism in the transport equipment that is slightly congested is 10, the value corresponding to the transport mechanism in the transport equipment that is moderately congested is 30, the value corresponding to the transport mechanism in the transport equipment that is severely congested is 50, the value corresponding to the transport mechanism in the transport equipment that is slightly faulty is 20, the value corresponding to the transport mechanism in the transport equipment that is undergoing fault repair is 50, and the value corresponding to the transport mechanism in the transport equipment that is in fault alarm is 100. The value corresponding to all the transport mechanisms of the transport equipment is added together to obtain the equipment parameter value of the transport equipment.

[0083] The third parameter can be obtained based on the on / off status of the transport section. The on / off status of the transport section can be mapped to a section on / off parameter value, and the section on / off parameter value is used as the third parameter. The section on / off parameter value when the transport section is normally unobstructed is smaller than the section on / off parameter value when the transport section is blocked. For example, when the transport section is normally unobstructed, the section on / off parameter value is 0; when the transport section is blocked, the section on / off parameter value is 100000. In this case, the section overhead is very high, and the transport section will not be selected, and the transport path containing the transport section will not be selected.

[0084] The third parameter can be obtained based on the adjustment base, for example, the adjustment base is used as the third parameter. The adjustment base is positively correlated with the number of floors and factories spanned between the transport starting position and the transport target position, that is, the more floors spanned between the transport starting position and the transport target position, the larger the adjustment base, and the more factories spanned between the transport starting position and the transport target position, the larger the adjustment base. When there are multiple process sites corresponding to the transport target position, for example, the material transport task is to transport semiconductor materials from process site A to process site B, there are multiple process sites B, and multiple process sites B are distributed on different floors of the same wafer fab, or even distributed in different wafer fabs, setting the adjustment base can give priority to the transport path corresponding to the process site on the same floor of the same wafer fab as the transport starting position, which helps to improve material transport efficiency.

[0085] In some embodiments, the number of factories spanning between the starting and destination locations has a greater impact on the adjustment base than the number of floors spanned between the starting and destination locations. This allows preference for selecting transport paths corresponding to process sites located in the same fab as the starting location, helping to improve material transport efficiency. For example, the adjustment base is determined based on the relationship: Adjustment Base = Sn × 30 + 10 + Fn × 500, where Sn represents the number of floors spanned between the starting and destination locations, and Fn represents the number of factories spanned between the starting and destination locations.

[0086] The third parameter can also be obtained based on multiple parameters, for example, based on the working status of the transporting equipment and the on-off status of the transporting section, or based on the working status of the transporting equipment and an adjustment base, or based on the on-off status of the transporting section and an adjustment base, or based on the working status of the transporting equipment, the on-off status of the transporting section and an adjustment base.

[0087] In some embodiments, a third parameter is obtained by performing a weighted calculation on the equipment parameter values ​​of the transport equipment, the link access parameter values, and the adjustment base. The third parameter is determined by comprehensively considering the equipment parameter values ​​of the transport equipment, the link access parameter values, and the adjustment base, thereby facilitating the selection of a transport path with higher transport efficiency in subsequent steps.

[0088] In some embodiments, step S220 includes: performing a weighted operation on the first parameter and the second parameter for the transport segment to obtain a weighted parameter; and performing a weighted operation on the weighted parameter and the third parameter to obtain a segment cost for the transport segment. By performing a weighted operation on each parameter, the obtained segment cost can more accurately reflect the transport efficiency of the transport segment, facilitating the selection of a transport route with higher transport efficiency in subsequent steps.

[0089] In some embodiments, in step S220, the route cost of each transport route is calculated based on the relationship: Route Cost = ((n×t / A+Ln×Lc)*Dynamic Ratio+(Base Cost+Min)*(1-Dynamic Ratio))×α%+(Count(VHL)×X%+Route On-Off Parameter Value×Y%+Adjustment Base×Z%)×β%.

[0090] Among them, Route Cost represents the road section cost, (n×t / A+Ln×Lc) represents the second parameter, n represents the number of first instructions issued to the transport equipment, t represents the average transport time spent by the transport equipment to execute a transport instruction on the transport section, A represents the number of transport mechanisms included in the transport equipment, Ln×Lc represents the priority of the material transport port of the transport equipment, Ln represents the number of second instructions issued to the material transport port of the transport equipment, Lc represents the theoretical priority of the material transport port, Dynamic Ratio represents the weight coefficient corresponding to the second parameter, (Base Cost+Min) represents the first parameter, Base Cost Cost represents the theoretical transport time of the transport section, Min represents the historical shortest transport time of the transport section, (1-DynamicRatio) represents the weight corresponding to the first parameter, (Count(VHL)×X%+section on-off parameter value×Y%+adjustment base×Z%) represents the third parameter, Count(VHL) represents the equipment parameter value of the transport equipment, α and β represent weight coefficients, α+β=100, X, Y, and Z represent weight coefficients, X+Y+Z=100.

[0091] For example, α is 60%, β is 40%, X is 30%, Y is 50%, and Z is 20%. The Dynamic Ratio can be any value between 1% and 99%, for example, 50%.

[0092] In step S230, the path cost of the transport path is obtained based on the link cost of each transport link of the transport path. Then, step S240 is executed.

[0093] In some embodiments, in step S230 , the segment costs of each transport segment of the transport path are summed to obtain the path cost of the transport path.

[0094] In step S240 , a material transport path of the material transport task is determined based on the path cost.

[0095] In some embodiments, in step S240, a transport path with the smallest path cost is used as the material transport path for the material transport task. Using a transport path with the smallest path cost as the material transport path for the material transport task can maximize material transport efficiency.

[0096] Below, the process of determining the material transport path in this application is explained by taking the different average transport time t spent by the transport equipment to execute a transport instruction in the transport section, without considering the material transport port priority in the second parameter (for example, making Lc=0, so that Ln×Lc=0) and the third parameter (for example, the third parameter is 0) as an example.

[0097] like Figure 5As shown in (a), semiconductor materials need to be transported from the first storage location of the P device to the second storage location of the Q device. The starting location is the first storage location of the P device, and the destination location is the second storage location of the Q device. There are two transport paths:

[0098] Transport path 1: P device, P device-transport device 01, transport device 01-transport device 02, transport device 02-Q device, second storage location;

[0099] Transport path 2: P equipment, P equipment-transport equipment 01, transport equipment 01-transport equipment 03, transport equipment 03-Q equipment, second storage location.

[0100] Among them, P device-transport equipment 01 represents the transport channel between P device and transport equipment 01, transport equipment 01-transport equipment 02 represents the transport channel between transport equipment 01 and transport equipment 02, transport equipment 02-Q device represents the transport channel between transport equipment 02 and Q device, transport equipment 01-transport equipment 03 represents the transport channel between transport equipment 01 and transport equipment 03, and transport equipment 03-Q device represents the transport channel between transport equipment 03 and Q device.

[0101] Based on the relationship Route Cost = ((n×t / A+Ln×Lc)*30+(Base Cost+Min)*70)×60%+(Count(VHL)×30%+Route On / Off Parameter Value×50%+Adjustment Base×20%)×40%, the route cost of each transport route is calculated. The route cost, path cost and related parameters are as follows: Figure 5 As shown in (b).

[0102] in, Figure 5 The controller identification number shown in (b) represents the device that performs the transport action, based on Figure 5 As can be seen from (b), transport path 2 has a smaller path cost than transport path 1. In step S240, transport path 2 is selected as the material transport path for the material transport task.

[0103] The conveying equipment includes a plurality of material conveying ports and at least one material temporary storage area corresponding to the material conveying ports, and the material temporary storage area is used to store the materials to be conveyed. For example, a material temporary storage area is used to store one material to be conveyed. In the aforementioned embodiment, the material conveying path is determined, that is, the conveying equipment involved in performing the material conveying task is selected, but the material conveying ports of the conveying equipment, that is, the material conveying entrance and the material conveying exit, are not selected. In some embodiments, after the MCS issues the conveying instruction to each conveying equipment involved in the determined material conveying path, that is, after determining the material conveying path of the material conveying task based on the path overhead, the semiconductor material conveying method also includes the step of determining the material conveying port of the conveying equipment. As Figure 6 As shown, the step of determining the material delivery port of the delivery equipment includes the following steps S610 and S620, which are described in detail as follows:

[0104] In step S610 , the number of temporary material storage areas and the second instruction number of each material conveying port of the conveying equipment are obtained.

[0105] In step S620 , the material conveying port of the conveying equipment in the material conveying path is determined based on the ratio of the number of second instructions issued to the material conveying port and the number of material temporary storage areas of the material conveying port.

[0106] It can be understood that after the transport equipment is confirmed, the material transport entrance and the material transport exit are determined respectively using the above-mentioned steps of determining the material transport port of the transport equipment.

[0107] For each material conveying port of the conveying equipment, there are also conveying instructions being executed and conveying instructions waiting to be executed. When determining the material conveying port of the conveying equipment in the material conveying path, first determine the number of conveying instructions issued to the material conveying port, and then determine the material conveying port of the conveying equipment in the material conveying path based on the ratio of the number of conveying instructions issued to the material conveying port and the number of material temporary storage areas.

[0108] Exemplarily, the material transfer port with the smallest current ratio is designated as the material transfer port for the transport equipment along the material transfer path. For example, transport equipment TSTK01 has material transfer ports A1, A2, A3, and A4. The number of temporary material storage areas at these ports is 2, 3, 4, and 5, respectively. The number of transfer instructions issued to these ports is 1, 2, 2, and 2, respectively. The ratios of the number of transfer instructions issued to these ports to the number of temporary material storage areas are 1 / 2 = 50%, 2 / 3 = 67%, 2 / 4 = 50%, and 2 / 5 = 40%, respectively. Port A4 has the smallest ratio, so port A4 is selected as the material transfer port for the transport equipment along the material transfer path.

[0109] Understandably, in Figure 6 In the illustrated embodiment, the material conveying port may be a material conveying entrance or a material conveying exit.

[0110] Furthermore, when the ratios of the number of transfer instructions issued to all material transfer ports of the transfer equipment and the number of material temporary storage areas are the same, the material transfer port with the least number of historical transfer instructions is selected as the material transfer port of the current transfer instruction transfer equipment in the material transfer path. For example, the ratios of the number of transfer instructions issued to the material transfer ports A1, A2, A3, and A4 and the number of material temporary storage areas are the same, and none of them exceeds 100%. The number of historical transfer instructions of the material transfer ports A1, A2, A3, and A4 within one month is obtained, and the material transfer port with the least number of historical transfer instructions is selected as the material transfer port of the current transfer instruction transfer equipment in the material transfer path. The selection of the material transfer port is the same as the selection method of the material transfer port, and will not be repeated here.

[0111] In summary, the solution disclosed in this application solves the problem of excessive or insufficient transport instructions being issued to certain transport equipment, or the imbalance of transport instructions received by the transport equipment, which can improve the efficiency of material transport and reduce transport congestion. At the same time, when selecting the transport path of semiconductor materials, a variety of influencing factors such as static factors and dynamic factors are comprehensively considered, which can reduce transport congestion during the transport process of semiconductor materials and further improve the transport efficiency of semiconductor materials.

[0112] Figure 7 A flow chart showing a semiconductor material transport method according to another embodiment of the present application is shown. Figure 7 As shown, in addition to the steps of receiving the transport task, calculating the segment cost, calculating the path cost, and determining the transport path described in the aforementioned embodiments, the semiconductor material transport method further includes steps such as fixed path matching prior to the segment cost calculation step. The semiconductor material transport method includes at least the following steps S710 to S770, which are described in detail below:

[0113] In step S710, a material transport task is received, and then step S720 is executed.

[0114] In step S720 , it is determined whether the material transport task matches a fixed path. If so, step S730 is executed; otherwise, step S750 is executed.

[0115] In step S730 , it is determined whether the fixed path is unobstructed. If so, step S740 is executed; otherwise, step S750 is executed.

[0116] In step S740 , a fixed path is used as the material transport path of the material transport task.

[0117] In step S750, the segment cost of each transport segment is calculated based on the first parameter, the second parameter, and the third parameter. Then, step S760 is executed.

[0118] In step S760, the path cost of the transport path is obtained based on the link cost of each transport link of the transport path. Then, step S770 is executed.

[0119] In step S770 , a material transport path of the material transport task is determined based on the path cost.

[0120] exist Figure 7 In the illustrated embodiment, after receiving a material handling task, the system first determines whether the task matches a fixed path. If so, it further determines whether the fixed path is unobstructed. If so, the fixed path is used as the material handling path for the task. If the task does not match a fixed path, or if the matched fixed path is obstructed, the system sequentially proceeds to the following steps: calculating the road segment cost, calculating the path cost, and determining the handling path, intelligently selecting a handling path. This system can not only use a fixed path for material handling based on specific scenarios, but also intelligently select a handling path for non-specific scenarios. This system can better meet the material handling needs of the semiconductor production process and achieve efficient handling of semiconductor materials.

[0121] See next Figure 8 As shown, this embodiment provides a semiconductor material transport control device 800 , which mainly includes a task receiving module 801 , a first calculation module 802 , a second calculation module 803 and a path selection module 804 .

[0122] Among them, the task receiving module 801 is used to receive material handling tasks. The material handling tasks include a handling starting position and a handling target position. There are one or more handling paths between the handling starting position and the handling target position. Each handling path includes one or more handling sections. A handling section is formed between two adjacent handling nodes.

[0123] The first calculation module 802 is used to calculate the section cost of each transport section based on the first parameter, the second parameter and the third parameter, wherein the first parameter is obtained based on at least one of the theoretical transport time and the historical shortest transport time of the transport section, the second parameter is obtained based on at least one of the transport capacity of the transport equipment, the busyness of the transport equipment, and the historical transport efficiency of the transport equipment, and the third parameter is obtained based on at least one of the working status of the transport equipment, the on / off status of the transport section, and the adjustment base.

[0124] In one embodiment, the first calculation module 802 is configured to perform a weighted operation on the first parameter and the second parameter for the transport section to obtain a weighted parameter; and perform a weighted operation on the weighted parameter and the third parameter to obtain the section cost of the transport section.

[0125] In one embodiment, the first calculation module 802 is configured to calculate the cost of a given route based on the relationship: Route Cost = ((n×t / A+Ln×Lc)*Dynamic Ratio+(Base Cost+Min)*(1-Dynamic Ratio))×α%+(Count(VHL)×X%+road section on-off parameter value×Y%+adjustment base×Z%)×β%, calculate the section cost of each transport section; wherein, RouteCost represents the section cost, (n×t / A+Ln×Lc) represents the second parameter, n represents the number of first instructions issued to the transport equipment, the number of first instructions is the total number of transport instructions being executed and waiting to be executed by the transport equipment, t represents the average transport time spent by the transport equipment to execute a transport instruction in the transport section, A represents the number of transport mechanisms included in the transport equipment, and the transport mechanism can execute transport instructions, Ln×Lc represents the priority of the material transport port of the transport equipment, Ln represents the number of second instructions issued to the material transport port of the transport equipment, the number of second instructions is the total number of transport instructions being executed and waiting to be executed by the material transport port, Lc represents the theoretical priority of the material transport port, Dynamic Ratio represents the weight coefficient corresponding to the second parameter, (Base Cost+Min) represents the first parameter, Cost represents the theoretical transport time, Min represents the shortest historical transport time, (1-Dynamic Ratio) represents the weight corresponding to the first parameter, (Count(VHL)×X%+section on / off parameter value×Y%+adjustment base×Z%) represents the third parameter, Count(VHL) represents the equipment parameter value of the transport equipment, and the equipment parameter value is obtained based on the working status of the transport equipment. α and β represent weight coefficients, α+β=100, and X, Y, and Z represent weight coefficients, X+Y+Z=100.

[0126] The second calculation module 803 is configured to obtain the path cost of the transport path based on the segment costs of each transport segment of the transport path.

[0127] In one embodiment, the second calculation module 803 is configured to sum the segment costs of each transport segment of the transport path to obtain the path cost of the transport path.

[0128] The path selection module 804 is configured to determine a material transport path for the material transport task based on the path cost.

[0129] In one embodiment, the path selection module 804 is configured to select a transport path with the minimum path cost as the material transport path for the material transport task.

[0130] In one embodiment, the semiconductor material transport control device 800 further includes a first parameter acquisition module 805 , which is configured to add the theoretical transport time and the historical shortest transport time of the transport section to obtain a first parameter.

[0131] In one embodiment, the semiconductor material handling control device 800 also includes a second parameter acquisition module 806, which is configured to multiply the number of first instructions issued to the handling equipment by the historical handling efficiency of the handling equipment to obtain a first intermediate parameter; divide the first intermediate parameter by the number of handling mechanisms included in the handling equipment to obtain a second intermediate parameter; and obtain a second parameter based on the second intermediate parameter.

[0132] In one embodiment, the second parameter acquisition module 806 is configured to further determine the second parameter based on the priority of the material handling port of the handling equipment, wherein the priority of the material handling port is determined based on the highest priority among the internal handling channels. The busyness of the handling equipment also includes the number of second instructions issued to the material handling port of the handling equipment, where the second instruction number is the total number of handling instructions being executed and waiting to be executed by the material handling port. The internal handling channel priority is determined by at least one of the number of second instructions issued to the material handling port of the internal handling channel and the theoretical priority of the material handling port.

[0133] In one embodiment, the priority of the internal transport channel is determined by multiplying the number of second instructions issued to the material transport entrance of the internal transport channel by the theoretical priority of the material transport entrance, plus the product of the number of second instructions issued to the material transport exit of the internal transport channel and the theoretical priority of the material transport exit.

[0134] In one embodiment, the second parameter acquisition module 806 is configured to add the second intermediate parameter and the material conveying port priority of the conveying equipment to obtain the second parameter.

[0135] In one embodiment, the semiconductor material handling control device 800 also includes a third parameter acquisition module 807, which is configured to perform a weighted operation on the equipment parameter value of the handling equipment, the section on-off parameter value and the adjustment base to obtain a third parameter; wherein the equipment parameter value is obtained based on the working status of the handling equipment, the section on-off parameter value is obtained based on the on-off status of the handling section, the section on-off parameter value when the handling section is normally unobstructed is less than the section on-off parameter value when the handling section is blocked, and the adjustment base is positively correlated with the number of floors and the number of factories spanned between the handling starting position and the handling target position.

[0136] In one embodiment, the semiconductor material handling control device 800 also includes a material handling port determination module 808, which is configured to obtain the number of material temporary storage areas of the handling equipment and the number of handling instructions issued to each material handling port; based on the ratio of the number of handling instructions issued to the material handling port and the number of material temporary storage areas, determine the material handling port of the handling equipment in the material handling path.

[0137] In one embodiment, the semiconductor material handling control device 800 also includes a fixed path selection module 809, which is configured to determine whether the material handling task matches a fixed path; if the material handling task matches a fixed path, then determine whether the fixed path is unobstructed; if the fixed path is unobstructed, then use the fixed path as the material handling path for the material handling task.

[0138] The implementation process of the functions and effects of each module in the above-mentioned semiconductor material transport control device 800 is specifically described in the implementation process of the corresponding steps in the above-mentioned semiconductor material transport method, and will not be repeated here.

[0139] See Figure 9 As shown, this embodiment provides an electronic device 900, which includes one or more processors 901 and a memory 902. The memory 902 is used to store one or more programs. When the one or more programs are executed by one or more processors 901, the electronic device 900 implements the semiconductor material handling method of the present application.

[0140] It should be noted that the electronic device 900 may be a photolithography device, or may be other devices other than the photolithography device.

[0141] Figure 10 A block diagram of a computer system structure for implementing some embodiments of the present application is shown. It should be noted that: Figure 10 The computer system shown is only an example and should not limit the functions and scope of use of the embodiments of the present application.

[0142] like Figure 10As shown, the computer system 1000 includes a CPU (Central Processing Unit) 1001, which can perform various appropriate actions and processes according to the program stored in the ROM (Read-Only Memory) 1002 or the program loaded from the storage part 1008 to the RAM (Random Access Memory) 1003, such as executing the semiconductor material handling method in the above embodiment. Various programs and data required for system operation are also stored in the RAM 1003. The CPU 1001, ROM 1002 and RAM 1003 are connected to each other via a bus 1004. An I / O (Input / Output) interface 1005 is also connected to the bus 1004.

[0143] The following components are connected to the I / O interface 1005: an input section 1006 including a keyboard, a mouse, and the like; an output section 1007 including devices such as a CRT (Cathode Ray Tube), an LCD (Liquid Crystal Display), and a speaker; a storage section 1008 including a hard disk; and a communication section 1009 including a network interface card such as a LAN (Local Area Network) card or a modem. The communication section 1009 performs communication processing via a network such as the Internet. A drive 1010 is also connected to the I / O interface 1005 as needed. Removable media 1010, such as a magnetic disk, an optical disk, a magneto-optical disk, or a semiconductor memory, is installed in the drive 1010 as needed, so that computer programs read from the removable media can be installed in the storage section 1008 as needed.

[0144] In particular, according to an embodiment of the present application, the process described above with reference to the flowchart can be implemented as a computer software program. For example, an embodiment of the present application includes a computer program product, which includes a computer program carried on a computer-readable medium, and the computer program includes a computer program for executing all or part of the steps shown in the flowchart in the semiconductor material handling method. In such an embodiment, the computer program can be downloaded and installed from the network through the communication part 1009, and / or installed from the removable medium 1011. When the computer program is executed by the central processing unit (CPU) 1001, the various functions defined in the system of the present application are performed.

[0145] It should be noted that the computer-readable medium shown in the embodiments of the present application may be a computer-readable signal medium or a computer-readable storage medium or any combination of the two. The computer-readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or component, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM), a flash memory, an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present application, a computer-readable storage medium may be any tangible medium containing or storing a program that can be used by or in combination with an instruction execution system, device or device. In the present application, a computer-readable signal medium may include a data signal propagated in baseband or as part of a carrier wave, which carries a computer-readable computer program. Such propagated data signals may take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. A computer-readable signal medium may also be any computer-readable medium other than a computer-readable storage medium that can transmit, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device. A computer program embodied on a computer-readable medium may be transmitted using any suitable medium, including but not limited to wireless, wired, or any suitable combination thereof.

[0146] The flowcharts and block diagrams in the accompanying drawings illustrate the possible implementation architecture, functions and operations of the systems, methods and computer program products according to various embodiments of the present application. Among them, each box in the flowchart or block diagram can represent a module, program segment, or part of the code, and the above-mentioned module, program segment, or part of the code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in an order different from that marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram or flowchart, and the combination of boxes in the block diagram or flowchart, can be implemented with a dedicated hardware-based system that performs the specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0147] The units involved in the embodiments described in this application may be implemented by software or hardware, and the units described may also be set in a processor. In some cases, the names of these units do not constitute limitations on the units themselves.

[0148] As another aspect, the present application further provides a computer-readable medium, which may be included in the electronic device described in the above embodiments, or may exist independently without being incorporated into the electronic device. The computer-readable medium carries one or more programs, and when the one or more programs are executed by the electronic device, the electronic device implements the method described in the above embodiments.

[0149] It should be noted that, although several modules or units of the device for action execution are mentioned in the above detailed description, this division is not mandatory. In fact, according to the embodiment of the application, the features and functions of two or more modules or units described above can be concretized in one module or unit. On the contrary, the features and functions of one module or unit described above can be further divided into multiple modules or units to be concretized.

[0150] Through the description of the above embodiments, it is easy for those skilled in the art to understand that the example embodiments described herein can be implemented by software or by combining software with necessary hardware. Therefore, the technical solution according to the embodiments of the present application can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (which can be a CD-ROM, a USB flash drive, a mobile hard disk, etc.) or on a network, and includes several instructions to enable a computing device (which can be a personal computer, a server, a touch terminal, or a network device, etc.) to execute the method according to the embodiments of the present application.

[0151] Those skilled in the art will readily appreciate other embodiments of the present invention after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present invention that follow the general principles of the present invention and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered merely as exemplary, and the true scope and spirit of the present application are indicated by the appended claims.

Claims

1. A semiconductor material transport method, characterized in that: include: receiving a material transport task, wherein the material transport task includes a transport start location and a transport target location, wherein one or more transport paths are provided between the transport start location and the transport target location, and each transport path includes one or more transport segments, and a transport segment is formed between two adjacent transport nodes; Calculating the segment cost of each transport segment based on a first parameter, a second parameter, and a third parameter, wherein the first parameter is obtained based on at least one of a theoretical transport time and a historical shortest transport time of the transport segment, the second parameter is obtained based on at least one of a transport capacity of a transport device, a busyness level of the transport device, and a historical transport efficiency of the transport device, and the third parameter is obtained based on at least one of a working status of the transport device, an on / off status of the transport segment, and an adjustment base; Obtaining a path cost of the transport path based on the segment costs of each transport segment of the transport path; A material transport path for the material transport task is determined based on the path cost.

2. The semiconductor material transport method according to claim 1, wherein: Before calculating the section cost of each transport section based on the first parameter, the second parameter, and the third parameter, the semiconductor material transport method further includes: Determine whether the material handling task matches a fixed path; If the material transport task matches a fixed path, determining whether the fixed path is unobstructed; If the fixed path is unobstructed, the fixed path is used as the material transport path for the material transport task.

3. The semiconductor material transport method according to claim 1, wherein: The calculating of the section cost of each transport section based on the first parameter, the second parameter, and the third parameter includes: For the transport section, performing a weighted operation on the first parameter and the second parameter to obtain a weighted parameter; Performing a weighted operation on the weighted parameter and the third parameter to obtain a section cost of the transport section; The obtaining of the path cost of the transport path based on the segment cost of each transport segment of the transport path includes: Adding up the segment costs of each transport segment of the transport path to obtain the path cost of the transport path; The determining of the material transport path of the material transport task based on the path cost includes: The transport path with the smallest path cost is used as the material transport path for the material transport task.

4. The semiconductor material transport method according to any one of claims 1 to 3, wherein: Before calculating the section cost of each transport section based on the first parameter, the second parameter, and the third parameter, the semiconductor material transport method further includes: The theoretical transport time and the historical shortest transport time of the transport section are added together to obtain a first parameter.

5. The semiconductor material transport method according to any one of claims 1 to 3, characterized in that: The transport equipment includes at least one transport mechanism capable of performing material transport. The transport capacity of the transport equipment is the number of transport mechanisms included in the transport equipment. The busyness of the transport equipment includes the number of first instructions issued to the transport equipment, which is the total number of transport instructions being executed and waiting to be executed by the transport equipment. The historical transport efficiency of the transport equipment is the average transport time spent by the transport equipment to execute a transport instruction on the transport section. Before calculating the section cost of each transport section based on the first parameter, the second parameter, and the third parameter, the semiconductor material transport method further includes: multiplying the number of first instructions issued to the transport device by the historical transport efficiency of the transport device to obtain a first intermediate parameter; Dividing the first intermediate parameter by the number of transport mechanisms included in the transport equipment to obtain a second intermediate parameter; A second parameter is obtained based on the second intermediate parameter.

6. The semiconductor material transport method according to claim 5, wherein: The conveying equipment includes a plurality of material conveying ports, wherein the plurality of material conveying ports include at least one material conveying entrance and at least one material conveying exit, wherein the material conveying entrance and the material conveying exit form an internal conveying channel, and all internal conveying channels of the conveying equipment correspond to the same conveying section; The second parameter is further determined based on the priority of the material handling port of the handling equipment, wherein the priority of the material handling port is determined based on the highest priority of the internal handling channel; The busyness of the transport equipment further includes the number of second instructions issued to the material transport port of the transport equipment, where the second instruction number is the total number of transport instructions being executed and waiting to be executed by the material transport port; The internal transport channel priority is determined by at least one of the second instruction number of the material transport ports of the internal transport channel and a theoretical priority of the material transport ports.

7. The semiconductor material transport method according to claim 6, wherein: The priority of the internal transport channel is determined by multiplying the number of second instructions issued to the material transport entrance of the internal transport channel by the theoretical priority of the material transport entrance, plus the product of the number of second instructions issued to the material transport exit of the internal transport channel and the theoretical priority of the material transport exit.

8. The semiconductor material transport method according to claim 6, wherein: The obtaining of the second parameter based on the second intermediate parameter further includes: The second intermediate parameter is added to the material conveying port priority of the conveying equipment to obtain a second parameter.

9. The semiconductor material transport method according to any one of claims 1 to 3, wherein: Before calculating the section cost of each transport section based on the first parameter, the second parameter, and the third parameter, the semiconductor material transport method further includes: Performing a weighted calculation on the equipment parameter value of the transport equipment, the road section connection parameter value, and the adjustment base to obtain a third parameter; Among them, the equipment parameter value is obtained based on the working status of the transport equipment, the section on-off parameter value is obtained based on the on-off status of the transport section, the section on-off parameter value when the transport section is normally unobstructed is less than the section on-off parameter value when the transport section is blocked, and the adjustment base is positively correlated with the number of floors and the number of factories spanned between the transport starting position and the transport target position.

10. The semiconductor material transport method according to any one of claims 1 to 3, characterized in that: The calculating of the section cost of each transport section based on the first parameter, the second parameter, and the third parameter includes: Calculate the route cost of each transport route based on the relationship: Route Cost = ((n×t / A+Ln×Lc)*Dynamic Ratio+(Base Cost+Min)*(1-Dynamic Ratio))×α%+(Count(VHL)×X%+Route On / Off Parameter Value×Y%+Adjustment Base×Z%)×β%. Among them, Route Cost represents the road section cost, (n×t / A+Ln×Lc) represents the second parameter, n represents the number of first instructions issued to the transport equipment, the first number of instructions is the total number of transport instructions being executed and waiting to be executed by the transport equipment, t represents the average transport time spent by the transport equipment to execute a transport instruction on the transport section, A represents the number of transport mechanisms included in the transport equipment, and the transport mechanism can execute transport instructions, Ln×Lc represents the priority of the material transport port of the transport equipment, Ln represents the number of second instructions issued to the material transport port of the transport equipment, the second number of instructions is the total number of transport instructions being executed and waiting to be executed by the material transport port, Lc represents the theoretical priority of the material transport port, Dynamic Ratio represents the weight coefficient corresponding to the second parameter, (Base Cost+Min) represents the first parameter, Base Cost represents the theoretical transport time, Min represents the shortest historical transport time, (1-Dynamic Ratio) represents the weight corresponding to the first parameter, (Count(VHL)×X%+section on-off parameter value×Y%+adjustment base×Z%) represents the third parameter, Count(VHL) represents the equipment parameter value of the transport equipment, and the equipment parameter value is obtained based on the working status of the transport equipment. α and β represent weight coefficients, α+β=100, and X, Y, and Z represent weight coefficients, X+Y+Z=100.

11. The semiconductor material transport method according to any one of claims 1 to 3, characterized in that: The conveying equipment includes a plurality of material conveying ports and at least one material temporary storage area corresponding to the material conveying ports, and the material temporary storage area is used to store materials to be conveyed; After determining the material transport path of the material transport task based on the path cost, the semiconductor material transport method further includes: Obtain the number of material temporary storage areas and the second instruction number of each material conveying port of the conveying equipment; The material conveying port of the conveying equipment in the material conveying path is determined based on a ratio of the number of the second instructions issued to the material conveying port and the number of the material temporary storage areas of the material conveying port.

12. A semiconductor material transport control device, characterized in that: include: a task receiving module, configured to receive a material transport task, wherein the material transport task includes a transport start location and a transport target location, wherein one or more transport paths are provided between the transport start location and the transport target location, and each transport path includes one or more transport sections, and a transport section is formed between two adjacent transport nodes; a first calculation module, configured to calculate the segment cost of each transport segment based on a first parameter, a second parameter, and a third parameter, wherein the first parameter is obtained based on at least one of a theoretical transport time and a historical shortest transport time of the transport segment, the second parameter is obtained based on at least one of a transport capacity of a transport device, a busyness level of the transport device, and a historical transport efficiency of the transport device, and the third parameter is obtained based on at least one of an operating status of the transport device, an on / off status of the transport segment, and an adjustment base; a second calculation module, configured to obtain a path cost of the transport path based on the segment costs of each transport segment of the transport path; A path selection module is used to determine a material transport path for the material transport task based on the path cost.

13. An electronic device, characterized in that: include: one or more processors; A memory for storing one or more computer programs, which, when executed by the one or more processors, enables the processors to implement the semiconductor material handling method according to any one of claims 1 to 11.

14. A computer-readable storage medium, characterized in that The computer-readable storage medium stores computer-readable instructions, and when the computer-readable instructions are executed by a processor of a computer, the computer is caused to execute the semiconductor material transport method according to any one of claims 1 to 11.

Images