Flexible electric connector and electronic equipment

Abstract

The invention provides a flexible electric connector and electronic equipment, the flexible electric connector comprises an electric connector body and an electromagnetic shielding film covering at least one side surface of the electric connector body, and the electromagnetic shielding film comprises a high-molecular polymer and a non-metal-based conductive material in a preset mass ratio. The electromagnetic shielding film is simple in structure, and the high-molecular polymer can provide good flexibility for the electromagnetic shielding film, can be firmly bonded with the electric connector body and can also serve as a carrier of a non-metal-based conductive material, so that the electromagnetic shielding film can carry out good reflection attenuation and absorption attenuation on electromagnetic waves. Therefore, there is no need to arrange an additional structure to increase the thickness of the electromagnetic shielding film, the electromagnetic shielding film achieves the electromagnetic interference shielding effect, the signal line in the electric connector body is not liable to be damaged in the bending process of the electric connector body, and the reliability of the flexible electric connector is ensured.

Description

Technical Field

[0001] The present disclosure relates to the technical field of electrical connectors, and in particular to a flexible electrical connector and an electronic device. Background Art

[0002] Flexible electrical connectors are used to create flexible electrical connections between electronic components, enabling the placement of a large number of precision electronic components within a limited space, contributing to the portability and integration of electronic equipment. During signal transmission within the flexible connectors, the signal radiation transmitted through the flexible connectors can easily interfere with adjacent electronic components. Furthermore, signals from operating electronic components can easily interfere with the flexible connectors.

[0003] Currently, the film structure used for electromagnetic shielding includes a protective layer, a shielding layer, and an anisotropic conductive film, which is tightly attached to the flexible electrical connector. However, the existing electromagnetic shielding film has a complex structure and is relatively thick, which can easily increase the stress on the flexible electrical connector during bending, causing damage to the signal lines within the flexible electrical connector and shortening the flexible electrical connector's bending life. Summary of the Invention

[0004] In order to overcome the problems existing in the related art, the present disclosure provides a flexible electrical connector and an electronic device.

[0005] According to a first aspect of the present disclosure, there is provided a flexible electrical connector, comprising:

[0006] an electrical connector body;

[0007] An electromagnetic shielding film covers at least one side surface of the electrical connector body, wherein the electromagnetic shielding film comprises a high molecular polymer and a non-metallic-based conductive material in a preset mass ratio.

[0008] In some embodiments of the present disclosure, the preset mass ratio of the non-metal-based conductive material to the high molecular polymer is 1:9 to 1:1.

[0009] In some embodiments of the present disclosure, the electromagnetic shielding film satisfies at least one of the following:

[0010] Electromagnetic shielding effectiveness is 10dB-60dB;

[0011] Conductivity is 20S / m-120S / m;

[0012] Tensile stress is 200MPa-320MPa;

[0013] Elongation at break is 2.2%-4.4%;

[0014] Density is 1.6g / cm3 -2.7g / cm 3 .

[0015] In some embodiments of the present disclosure, the electromagnetic shielding film has a thickness of 2 μm-12 μm.

[0016] In some embodiments of the present disclosure, the high molecular weight polymer is a water-soluble polymer;

[0017] The high molecular polymer includes one or more of polyvinyl alcohol, polyacrylamide, polyethylene oxide, waterborne polyurethane, gelatin, cellulose, and modified cellulose.

[0018] In some embodiments of the present disclosure, in the electromagnetic shielding film, the non-metal-based conductive material and the high molecular polymer are in a physically mixed state, and the two are connected by hydrogen bonds.

[0019] In some embodiments of the present disclosure, the electromagnetic shielding film is formed by a spraying process using a mixed solution, wherein the mixed solution includes a preset solvent, and a preset mass ratio of the high molecular polymer and the non-metal-based conductive material.

[0020] In some embodiments of the present disclosure, the preset solvent includes one or more of deionized water, methanol, ethanol, and N,N-dimethylformamide.

[0021] In some embodiments of the present disclosure, the non-metal-based conductive material includes one or more of graphene, carbon nanotubes, transition metal carbides, transition metal nitrides, transition metal carbonitrides, and conductive carbon black.

[0022] In some embodiments of the present disclosure, the electromagnetic shielding film covers two oppositely disposed surfaces of the electrical connector body.

[0023] In some embodiments of the present disclosure, the outer surface of the electromagnetic shielding film includes a hydrophobic layer.

[0024] In some embodiments of the present disclosure, the water contact angle of the electromagnetic shielding film including the hydrophobic layer is (90°, 105°).

[0025] In some embodiments of the present disclosure, the material of the hydrophobic layer includes polyurethane adhesive or polydimethylsiloxane.

[0026] In some embodiments of the present disclosure, the electrical connector body includes a conductive layer and a protective layer covering the conductive layer, wherein the protective layer is provided with a through electrode penetrating the protective layer and connected to the conductive layer;

[0027] The electromagnetic shielding film covers the protection layer and contacts the through-electrode to be grounded to the conductive layer.

[0028] According to a second aspect of the present disclosure, an electronic device is provided, comprising the flexible electrical connector provided by the first aspect of the present disclosure.

[0029] The technical solutions provided by the embodiments of the present disclosure may include the following beneficial effects: the electromagnetic shielding film covering at least one side of the flexible electrical connector body has a simple structure. The polymer therein provides the electromagnetic shielding film with good flexibility, can be firmly bonded to the electrical connector body, and can also serve as a carrier for non-metallic conductive materials, enabling the electromagnetic shielding film to effectively reflect and absorb electromagnetic waves. Therefore, there is no need to provide additional structures to increase the thickness of the electromagnetic shielding film. While achieving an electromagnetic interference shielding effect, the electromagnetic shielding film is less likely to cause damage to the signal lines in the electrical connector body during the bending process of the electrical connector body, thereby ensuring the reliability of the flexible electrical connector.

[0030] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0032] Figure 1 is a schematic structural diagram of a flexible electrical connector according to an exemplary embodiment.

[0033] Figure 2 FIG. 4 is a diagram showing the electromagnetic shielding performance of an electromagnetic shielding film according to an exemplary embodiment.

[0034] Figure 3 FIG. 4 is a schematic diagram showing the conductivity of an electromagnetic shielding film according to an exemplary embodiment.

[0035] Figure 4 is a density diagram of an electromagnetic shielding film according to an exemplary embodiment.

[0036] Figure 5 FIG. 4 is a stress-strain curve of an electromagnetic shielding film according to an exemplary embodiment.

[0037] Figure 6 It is a schematic diagram of a bending stability test of an electromagnetic shielding film according to an exemplary embodiment.

[0038] Figure 7 is a schematic structural diagram of a flexible electrical connector according to another exemplary embodiment.

[0039] Figure 8is a schematic structural diagram of a flexible electrical connector according to another exemplary embodiment.

[0040] Figure 9 FIG. 4 is a schematic diagram showing a water contact angle test of an electromagnetic shielding film having a hydrophobic layer according to an exemplary embodiment.

[0041] Figure 10 FIG. 1 is a comparison diagram showing the electromagnetic interference shielding performance and resistance ratio change of an electromagnetic shielding film with a hydrophobic layer and without a hydrophobic layer according to an exemplary embodiment.

[0042] Figure 11 1 is an XPS graph of an electromagnetic shielding film having a hydrophobic layer and not having a hydrophobic layer according to an exemplary embodiment.

[0043] Figure 12 FIG. 4 is an EDS spectrum diagram of an electromagnetic shielding film having a hydrophobic layer according to an exemplary embodiment.

[0044] Figure 13 is a schematic structural diagram of a flexible electrical connector according to another exemplary embodiment. DETAILED DESCRIPTION

[0045] Exemplary embodiments will be described in detail herein, examples of which are illustrated in the accompanying drawings. In the following description, when referring to the drawings, like numbers in different figures represent like or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all possible embodiments consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present invention, as detailed in the appended claims.

[0046] Flexible electrical connectors are used to create flexible electrical connections between electronic components, enabling the placement of a large number of precision electronic components within a limited space, contributing to the portability and integration of electronic equipment. During signal transmission within the flexible connectors, the signal radiation transmitted through the flexible connectors can easily interfere with adjacent electronic components. Furthermore, signals from operating electronic components can easily interfere with the flexible connectors.

[0047] Currently, the film structure used for electromagnetic shielding includes a protective layer, a shielding layer, and an anisotropic conductive film, which is tightly attached to the flexible electrical connector. However, existing electromagnetic shielding films have a complex structure and are relatively thick, which can easily increase the stress on the flexible electrical connector during bending, leading to damage to the signal lines within the flexible electrical connector. If an electromagnetic shielding film layer is only applied to one side of the flexible electrical connector to reduce the stress, the flexible electrical connector will not be able to effectively shield the flexible electrical connector from electromagnetic interference. If an electromagnetic shielding film layer is applied to both outer surfaces of the flexible electrical connector, the bending life of the flexible electrical connector will be seriously affected.

[0048] In view of this, the present disclosure provides a flexible electrical connector, which includes an electrical connector body and an electromagnetic shielding film covering at least one side surface of the electrical connector body, wherein the electromagnetic shielding film includes a high molecular polymer and a non-metallic conductive material in a preset mass ratio. The electromagnetic shielding film in the present disclosure has a simple structure, wherein the high molecular polymer can provide good flexibility for the electromagnetic shielding film, and can be firmly bonded to the electrical connector body, and can also serve as a carrier of the non-metallic conductive material, so that the electromagnetic shielding film can perform good reflection attenuation and absorption attenuation on electromagnetic waves. Therefore, there is no need to set up an additional structure to increase the thickness of the electromagnetic shielding film. While achieving the electromagnetic interference shielding effect, the electromagnetic shielding film is not likely to cause damage to the signal line in the electrical connector body during the bending process of the electrical connector body, thereby ensuring the reliability of the flexible electrical connector.

[0049] An exemplary embodiment of the present disclosure provides a flexible electrical connector. This flexible electrical connector is a thin-film electronic device that can be bent, folded, twisted, compressed, stretched, and even deformed into any shape while maintaining high optoelectronic performance, reliability, and integration. Compared to traditional rigid electrical connectors, this flexible connector offers greater flexibility to meet growing market demands.

[0050] refer to Figure 1 As shown, Figure 1 FIG1 is a schematic structural diagram of a flexible electrical connector according to an exemplary embodiment. The flexible electrical connector 100 may include an electrical connector body 10, which is the main structure of the flexible electrical connector 100 for implementing a flexible electrical connection. The electrical connector body 10 may include, for example, an FFC connector (Flexible Flat Cable) or an FPC connector (Flexible Printed Circuit), which are flexible electronic components and devices capable of achieving electrical connections.

[0051] Since the electrical connector body 10 serves as a bridge connecting electronic components in the circuit, the signal radiation transmitted in the electrical connector body 10 is likely to interfere with adjacent electronic components. For example, when the electrical connector body 10 is used to connect the main board side and the folding side of a foldable electronic device, the signal radiation in the electrical connector body 10 is likely to interfere with the communication signal of the foldable electronic device, affecting the communication function of the device. For another example, when the electrical connector body 10 is used to connect a radio frequency antenna and a circuit board, the signal radiation in the electrical connector body 10 is likely to interfere with the radio frequency signal of the antenna, affecting the normal radiation of the antenna. Therefore, referring to Figure 1 As shown, an electromagnetic shielding film 20 is provided on at least one side surface of the electrical connector body 10. The electromagnetic shielding film 20 can shield the signal transmitted in the electrical connector body 10 to prevent the signal in the electrical connector body 10 from interfering with the electronic components adjacent to the electrical connector body 10. At the same time, the electromagnetic shielding film 20 can also shield the interference signal generated by the electronic components adjacent to the electrical connector body 10 to ensure that the electrical connector body 10 can transmit the signal normally and well.

[0052] Among them, reference Figure 1 The electromagnetic shielding film 20 is formed of a non-metallic conductive material and a polymer in a predetermined mass ratio. The non-metallic conductive material may include carbon-containing conductive materials such as graphene, carbon nanotubes, and carbon fibers, as well as composite conductive materials such as nickel-plated graphene and nickel-plated carbon fibers. It may also include polymer conductive materials such as polyaniline, polypyrrole, and polythiophene. The non-metallic conductive material may contain or generate charge carriers, thereby forming a conductive channel in the electromagnetic shielding film 20. This allows the electromagnetic shielding film 20 to function as a conductor with a certain electrical conductivity and achieve electromagnetic interference shielding through reflection loss, absorption loss, and multiple reflection attenuation.

[0053] A polymer refers to a high molecular weight compound formed by repeatedly connecting many identical, simple structural units. In some examples, the polymer may include materials such as epoxy resin, polylactic acid, acrylonitrile-butyl acrylate-styrene copolymer (AAS). These polymers are mixed with non-metallic conductive materials, or the raw materials for forming these polymers are mixed with non-metallic conductive materials, and an electromagnetic shielding film 20 is formed on at least one side of the electrical connector body 10 by using a solution dispersion method, 3D printing, dipping, spraying, coating, or the like. The polymer can be well bonded to the surface of the electrical connector body 10 and can also provide good flexibility for the electromagnetic shielding film 20, so that the electromagnetic shielding film 20 is not likely to cause damage to the signal line in the electrical connector body during the bending of the electrical connector body 10, while shielding the electrical connector body 10 from electromagnetic interference and maximizing the structural reliability of the electrical connector body 10.

[0054] refer to Figure 1 In the electromagnetic shielding film 20, the high molecular polymer can form a porous skeleton with a high internal surface area, so that the electromagnetic waves incident on the electromagnetic shielding film 20 can be multiply reflected or multiply scattered in the electromagnetic shielding film 20, thereby preventing the electromagnetic waves from penetrating the electromagnetic shielding film 20. That is, the electromagnetic shielding film 20 can reflect and attenuate the incident electromagnetic waves. In addition, the high molecular polymer can also serve as a carrier of the non-metallic-based conductive material. The non-metallic-based conductive material can be evenly distributed in the electromagnetic shielding film 20, so that the charge carriers in the non-metallic-based conductive material can move freely in the electromagnetic shielding film 20. Since the non-metallic-based conductive material and the high molecular polymer can generate physical contact in the electromagnetic shielding film 20, forming a physical interlocking structure, etc., there are rich contact interfaces between the high molecular polymer and the non-metallic-based conductive material. Since the non-metallic-based conductive material is more likely to be electronegative and the high molecular polymer is more likely to be electropositive, at the contact interface between the two, the high molecular polymer and the non-metallic-based conductive material are more likely to form an electric dipole, thereby achieving high interface polarization. When the electromagnetic shielding film 20 is in an electromagnetic field environment, the charge center of the electric dipole can be affected by the electromagnetic wave and vibrate and / or transfer. The vibration and / or transfer of the charge center of the electric dipole is continuous and has a lag compared to the frequency of the electromagnetic wave, resulting in energy loss of the electromagnetic interference signal after entering the electromagnetic shielding film 20. In addition, the electrons in the non-metallic conductive material can also absorb electromagnetic energy and move to the interlayer channels and surface of the non-metallic conductive material. The migrated electrons dissipate energy by colliding with the lattice of the non-metallic conductive material. In this way, the electromagnetic shielding film 20 can effectively absorb and efficiently dissipate incident electromagnetic waves.

[0055] Furthermore, in addition to serving as a carrier for non-metallic conductive materials and forming electric dipoles, polymers can also provide structural support for non-metallic conductive materials. The combination of the two can optimize the electron transmission pathways of non-metallic conductive materials and the electrical performance of the electromagnetic shielding film 20. Furthermore, the polymer serves as the skeleton and supporting structure of the electromagnetic shielding film 20. The stability and reliability of the polymer impart excellent mechanical properties, such as tensile strength and flexibility, to the electromagnetic shielding film 20, resulting in excellent structural stability and reliability. During the bending process of the electrical connector body 10, the electromagnetic shielding film 20 can bend with the bending of the electrical connector body 10, effectively covering the deformed electrical connector body 10 while maintaining excellent electromagnetic interference shielding performance. Therefore, the electromagnetic shielding film 20 provided by the present invention has a simple structure and does not require an additional structure to increase the strength, adhesion and other properties of the electromagnetic shielding film 20, so that the thickness of the electromagnetic shielding film 20 is relatively small. During the bending process of the electrical connector body 10, the stress applied to the electrical connector body 10 is relatively small, maintaining the bendability of the electrical connector body 10, thereby ensuring the reliability of the flexible electrical connector 100.

[0056] refer to Figure 1 In the electromagnetic shielding film 20, the non-metallic-based conductive material and the high molecular weight polymer have a predetermined mass ratio. The predetermined mass ratio can be a mass ratio that enables the electromagnetic shielding film 20 to have both good mechanical properties and electromagnetic shielding performance. When the mass ratio of the high molecular weight polymer in the electromagnetic shielding film 20 is too large, while the mass ratio of the non-metallic-based conductive material is too small, the electromagnetic shielding film 20 has good mechanical properties but poor electromagnetic interference shielding performance. When the mass ratio of the non-metallic-based conductive material in the electromagnetic shielding film 20 is too large, while the mass ratio of the high molecular weight polymer is too small, the electromagnetic shielding film 20 has good electromagnetic interference shielding performance but poor mechanical properties.

[0057] It is understood that, based on the specific usage scenario of the flexible electrical connector 100, the electromagnetic shielding film 20 can cover at least one side surface of the electrical connector body 10. For example, when electronic components are arranged on one side of the flexible electrical connector 100, the electromagnetic shielding film 20 can only cover one side surface of the electrical connector body 10, and the electromagnetic shielding film 20 is arranged between the electronic components and the electrical connector body 10 to play a role in electromagnetic interference shielding. For another example, when the requirements for the operating performance of the flexible electrical connector 100 and the electronic components are both very high, or when the electronic components are arranged around the flexible electrical connector 100, the electromagnetic shielding film 20 can cover both sides of the electrical connector body 10, or cover the entire outer surface of the electrical connector body 10, so that the electromagnetic shielding film 20 can achieve a complete and good electromagnetic interference shielding effect.

[0058] In some examples, the non-metallic conductive material in the electromagnetic shielding film 20 can be a carbon-containing conductive material. The carbon-containing conductive material can include one or more materials such as conductive graphite, graphene, carbon nanotubes, conductive carbon black, and MXene. Graphene is an allotrope of carbon with a single-layer hexagonal honeycomb lattice structure. Due to its two-dimensional structure, it has a large surface area and can provide the electromagnetic shielding film 20 with high charge carrier mobility and thermal conductivity. For example, the graphene can be a single-layer graphene or a multi-layer graphene, and the thickness of the graphene sheet can be between 0.4 nm and 0.6 nm.

[0059] MXene is a two-dimensional graphene-like layer structure obtained by processing MAX phase ceramics, wherein M refers to a transition metal element, A refers to a main group element, and X refers to a carbon element and / or a nitrogen element. Since the transition metal element has a strong bond energy with the carbon element and / or the nitrogen element, and the main group element has a more active chemical activity, the atomic layer formed by the main group element can be removed from the MAX phase ceramic to form MXene. That is, MXene is a general term for the family of transition metal carbides, transition metal nitrides, and transition metal carbonitrides. The MXene layer has excellent electrical conductivity and a certain degree of hydrophilicity, and can provide excellent reflection loss performance for the electromagnetic shielding film 20. Exemplarily, the thickness of the MXene layer can be between 1.3nm and 1.7nm.

[0060] Carbon nanotubes are coaxial nanotubes composed of hexagonally arranged carbon atoms. They have a one-dimensional structure and a high aspect ratio. They can form a network structure, improving the effective conductive path without sacrificing the flexibility and elasticity of the material. Therefore, they have good electrical conductivity and mechanical properties, which is conducive to forming a flexible electromagnetic shielding film 20. For example, the diameter of the carbon nanotubes can be between 13nm and 17nm. Conductive carbon black is a type of amorphous carbon that exists in the form of colloidal primary particles that are approximately spherical and can form a spatial network channel, thereby providing high charge carrier mobility for the electromagnetic shielding film 20.

[0061] Since carbon-containing conductive materials are rich in charge carriers, the electromagnetic shielding film 20 has good conductivity, and the charge carriers can move freely in the electromagnetic shielding film 20. When electromagnetic waves are incident on the electromagnetic shielding film 20, the electromagnetic shielding film 20 can reflect part of the electromagnetic waves, reducing the electromagnetic waves incident on the electromagnetic shielding film 20. That is, the electromagnetic shielding film 20 can play a role in reflection loss of electromagnetic waves.

[0062] In some examples, reference Figure 1The high molecular polymer in the electromagnetic shielding film 20 can be a water-soluble polymer. The water-soluble polymer is a type of high molecular material with strong hydrophilicity. The molecular structure of the water-soluble polymer contains a large number of hydrophilic groups. The hydrophilic groups of the water-soluble polymer molecules can generate electrostatic attraction with specific solvent molecules. This electrostatic attraction is called hydrogen bond, which makes the water-soluble polymer and the solvent form a uniform and stable dispersion system. At the same time, because the water-soluble polymer molecules contain hydrophilic groups and a certain number of hydrophobic groups, the water-soluble polymer has a certain surface activity. When it is dissolved or swelled in the solvent, it can reduce the surface tension of the solvent, which is beneficial to the wetting of the non-metallic-based conductive material by the solvent, thereby facilitating the non-metallic-based conductive material to maintain a uniform and stable dispersion. In this way, the non-metallic-based conductive material and the water-soluble polymer in the formed electromagnetic shielding film 20 can be evenly distributed, and the electromagnetic shielding film 20 has stable and uniform electromagnetic interference shielding performance.

[0063] For example, when the high molecular polymer in the electromagnetic shielding film 20 includes a water-soluble polymer, the water-soluble polymer may include one or more of polyvinyl alcohol (PVA), polyacrylic amide (PAM), polyethylene oxide (PEO), aqueous polyurethane, gelatin, cellulose, and modified cellulose. The above-mentioned water-soluble polymer has good film-forming properties and can provide structural support for the non-metallic conductive material in the electromagnetic shielding film 20, so that the formed electromagnetic shielding film 20 has good mechanical properties and flexibility, and can reduce the stress applied by the electromagnetic shielding film 20 to the electrical connector body 10 during the bending process of the electrical connector body 10, thereby improving the bending life of the electrical connector body 10.

[0064] Polyvinyl alcohol (PVA) is rich in polar hydroxyl groups, which facilitate the formation of a cross-linked network structure in the electromagnetic shielding film 20, ensuring good compatibility with non-metallic conductive materials and resulting in excellent mechanical properties for the resulting electromagnetic shielding film 20. Polyethylene oxide (PEO) has a regular linear helical structure, which ensures excellent mechanical properties for the electromagnetic shielding film 20 formed therefrom. Polyacrylamide (PAA) contains polar amide groups in its structural units, which facilitates its compatibility with non-metallic conductive materials and results in excellent mechanical properties for the resulting electromagnetic shielding film 20. Waterborne polyurethane (PU) exhibits excellent adhesion and flexibility. The presence of polar groups such as amino and ester groups enhances its compatibility with non-metallic conductive materials, resulting in excellent weather resistance for the electromagnetic shielding film 20 formed therefrom. Gelatin is a natural protein that can form a stable film at room temperature and exhibits excellent biocompatibility. Cellulose and modified celluloses such as hydroxymethyl cellulose and carboxymethyl cellulose exhibit good biodegradability, excellent film-forming properties, and plasticity, resulting in excellent uniformity and stability for the electromagnetic shielding film 20 formed therefrom.

[0065] In some examples, reference Figure 1 , because when forming the electromagnetic shielding film 20, a high molecular polymer or a raw material for forming the high molecular polymer is usually mixed with a non-metallic-based conductive material in a solvent to form a mixed solution. When the high molecular polymer in the electromagnetic shielding film 20 is a water-soluble polymer, in the mixed solution, the hydrophilic groups in the molecular structure of the water-soluble polymer can form hydrogen bonds with the solvent molecules. At the same time, since the hydrogen atoms in the water-soluble polymer are electropositive due to the offset of the electron pairs, and the non-metallic-based conductive material has abundant charge carriers and is electronegative, the water-soluble polymer can also generate an electrostatic attraction with the non-metallic-based conductive material. That is to say, in the mixed solution, the water-soluble polymer can also form hydrogen bonds with the non-metallic-based conductive material, so that the non-metallic-based conductive material can be evenly and stably dispersed in the mixed solution with the water-soluble polymer as the carrier, so that the mixed solution forms a uniform and stable dispersion system.

[0066] Next, the uniformly dispersed mixed solution is used to form an electromagnetic shielding film 20 on at least one side of the electrical connector body 10 using a solution dispersion method, 3D printing, dipping, spraying, coating, or other methods. Therefore, after the solvent in the mixed solution evaporates, the electromagnetic shielding film 20 is formed in which the water-soluble polymer and the non-metallic conductive material are physically mixed and uniformly distributed, and the two are connected by hydrogen bonds. The water-soluble polymer can provide structural support for the non-metallic conductive material, thereby ensuring that the mechanical properties and electromagnetic interference shielding performance of the electromagnetic shielding film 20 are uniformly distributed. For example, hydrogen bonding can be characterized and measured using methods such as infrared spectroscopy, nuclear magnetic resonance spectroscopy, X-ray diffraction, atomic force microscopy, Raman spectroscopy, gas phase microwave rotation spectroscopy, and neutron inelastic scattering.

[0067] In some examples, reference Figure 1 As shown, the electromagnetic shielding film 20 is formed by a spraying process using a mixed solution. The spraying process may include, for example, pneumatic spraying, electrospraying, ultrasonic spraying, cold spraying, and the like. The electromagnetic shielding film 20 formed by the spraying process can be directly and firmly bonded to the electrical connector body 10 by the polymer without the need for additional adhesives, and has good adaptability to the shape of the electrical connector body 10. In some examples, for example, a cold spraying process may be used to ensure high bonding strength between the electromagnetic shielding film 20 and the electrical connector body 10, minimize thermal impact on the electrical connector body 10, and provide a dense structure and low residual stress for the electromagnetic shielding film 20, thereby improving the overall reliability of the flexible electrical connector 100.

[0068] Since the molecular structure of the water-soluble polymer includes hydrophilic groups, the preset solvent used as a dispersant in the mixed solution can be a polar solvent containing polar groups such as hydroxyl (-OH) or carbonyl (-C=O). The preset solvent can, for example, include one or more of deionized water, methanol, ethanol, formamide, N,N-dimethylformamide, glycerol, propylene glycol, etc. When the water-soluble polymer is dispersed in the preset solvent, the hydrophilic groups in the water-soluble polymer can form hydrogen bonds with the polar groups in the preset solvent, so that the water-soluble polymer can have good solubility and dispersibility in the preset solvent. When making a mixed solution, the water-soluble polymer and the non-metallic-based conductive material are added to a volatile polar solvent in a preset mass ratio, and one or more dispersion methods such as mechanical stirring, high-speed shearing, and ultrasonic treatment are used to make the water-soluble polymer and the non-metallic-based conductive material uniformly dispersed in the preset solvent to form a uniform and stable mixed solution.

[0069] A uniformly dispersed mixed solution is sprayed onto at least one side of the electrical connector body 10. After the predetermined solvent evaporates, an electromagnetic shielding film 20 comprising a solid polymer and a solid non-metallic conductive material is formed. The solid polymer and the solid non-metallic conductive material are evenly distributed, resulting in electromagnetic shielding film 20 having stable and uniform electromagnetic interference shielding and mechanical properties.

[0070] In some examples, the preset mass ratio is the mass ratio of the non-metallic-based conductive material to the polymer. After multiple experiments, the preset mass ratio of the non-metallic-based conductive material to the polymer can be 1:9 to 1:1, and can be, for example, 1:9, 2:8, 3:7, 4:6, 4.5:5.5, 1:1, and so on. In other words, in the electromagnetic shielding film 20, the mass proportion of the non-metallic-based conductive material can be 10%-50%, and the mass proportion of the polymer can be 50%-90%. This ensures that the electromagnetic interference shielding performance and mechanical properties of the electromagnetic shielding film 20 are both within an optimal range.

[0071] In some examples, combined Figure 1 and Figure 2 As shown, Figure 2 This is a graph of the electromagnetic shielding performance of electromagnetic shielding films containing non-metallic conductive materials with different mass proportions. Figure 2 In the figure, the vertical axis is the electromagnetic shielding effectiveness (EMI SE), the unit is dB, and the horizontal axis is the electromagnetic wave frequency (Frequency), the unit is GHz. Figure 2 It can be seen that when the mass proportion of the non-metallic-based conductive material in the electromagnetic shielding film 20 is between 10% and 50%, the electromagnetic shielding effectiveness of the electromagnetic shielding film 20 at 8 GHz to 12 GHz can be between 10 dB and 60 dB. When the mass proportion of the non-metallic-based conductive material in the electromagnetic shielding film 20 is relatively small, the number of charge carriers in the electromagnetic shielding film 20 is relatively small, and the electromagnetic interference shielding performance of the electromagnetic shielding film 20 is moderate. For example, when the mass proportion of the non-metallic-based conductive material in the electromagnetic shielding film 20 is 10%, the electromagnetic shielding effectiveness of the electromagnetic shielding film 20 at 8 GHz to 12 GHz can be between 10 dB and 20 dB. When the mass proportion of the non-metallic-based conductive material in the electromagnetic shielding film 20 is relatively large, the number of charge carriers in the electromagnetic shielding film 20 is relatively large, and the electromagnetic interference shielding performance of the electromagnetic shielding film 20 is excellent. For example, when the mass proportion of the non-metallic-based conductive material in the electromagnetic shielding film 20 is 50%, the electromagnetic shielding effectiveness of the electromagnetic shielding film 20 at 8 GHz to 12 GHz can be between 50 dB and 60 dB.

[0072] In some examples, combined Figure 1 and Figure 3 As shown, Figure 3Schematic diagram of the conductivity of the electromagnetic shielding film 20 containing non-metallic conductive materials with different mass proportions. Figure 3 In the graph, the vertical axis is the conductivity (Conductivity), the unit is S / m, and the horizontal axis is the mass ratio of the non-metallic conductive material in the electromagnetic shielding film 20, the unit is wt%. Figure 3 It can be seen that when the mass proportion of the non-metallic-based conductive material in the electromagnetic shielding film 20 is between 10% and 50%, the conductivity of the electromagnetic shielding film 20 can be between 20 S / m and 120 S / m. The mass proportion of the non-metallic-based conductive material in the electromagnetic shielding film 20 is directly proportional to the conductivity of the electromagnetic shielding film 20. This indicates that the electromagnetic shielding film 20 has abundant charge carriers and a high polarization loss capability. The electromagnetic shielding film 20 can effectively reflect electromagnetic waves incident on the electromagnetic shielding film 20, effectively reducing reflection losses and the number of electromagnetic waves incident on the electromagnetic shielding film 20.

[0073] In some examples, combined Figure 1 and Figure 4 As shown, Figure 4 is a density diagram of the electromagnetic shielding film 20 containing non-metallic conductive materials with different mass proportions, Figure 4 In the figure, the vertical axis is density (Density), the unit is g / cm 3 , the horizontal axis is the mass percentage of the non-metallic conductive material in the electromagnetic shielding film 20, in wt%. Figure 4 It can be seen that when the mass proportion of the non-metallic conductive material in the electromagnetic shielding film 20 is between 10% and 50%, the density of the electromagnetic shielding film can be 1.6 g / cm 3 -2.7g / cm 3 The mass ratio of the non-metallic conductive material in the electromagnetic shielding film 20 is proportional to the density of the electromagnetic shielding film 20. The maximum density of the electromagnetic shielding film 20 is only 2.7 g / cm 3 , which shows that the electromagnetic shielding film 20 has the advantage of being light in weight. At least one side surface of the electrical connector body 10 is covered with the electromagnetic shielding film 20, which can provide good electromagnetic interference shielding performance for the electrical connector body 10 without adding too much extra weight to the flexible electrical connector 100.

[0074] In some examples, combined Figure 1 and Figure 5 As shown, when the high molecular polymer in the electromagnetic shielding film 20 is polyvinyl alcohol and the non-metallic conductive material is MXene, Figure 5 is the stress-strain curve of the electromagnetic shielding film 20 containing different mass proportions of MXene, Figure 5In the graph, the vertical axis is the tensile strength (Tensile Stress), the unit is MPa, and the horizontal axis is the strain (Strain), that is, the elongation at break, the unit is %. Figure 5 It can be seen that the tensile stress of the electromagnetic shielding film 20 can be between 200 MPa and 320 MPa, and the elongation at break of the electromagnetic shielding film 20 can be between 2.2% and 4.4%. When the mass proportion of the non-metallic-based conductive material in the electromagnetic shielding film 20 is small, and the mass proportion of the polymer is large, the mechanical properties of the electromagnetic shielding film 20 are relatively good. For example, when the mass proportion of MXene in the electromagnetic shielding film 20 is 10%, the tensile stress of the electromagnetic shielding film 20 can exceed 300 MPa, and the elongation at break is approximately 4.5%. When the mass proportion of the non-metallic-based conductive material in the electromagnetic shielding film 20 is large, the mechanical properties of the electromagnetic shielding film 20 are relatively weak. For example, when the mass proportion of the non-metallic-based conductive material in the electromagnetic shielding film 20 is 40%, the tensile stress of the electromagnetic shielding film 20 can reach approximately 250 MPa, and the elongation at break is approximately 2.5%.

[0075] In some examples, reference Figure 1 The thickness of the electromagnetic shielding film 20 can be between 2μm and 12μm to ensure that the electromagnetic shielding film 20 has good electromagnetic interference shielding performance, flexibility and mechanical properties. If the thickness of the electromagnetic shielding film 20 is too large, although the electromagnetic shielding film 20 can contain more non-metallic conductive materials of higher quality and the electromagnetic interference shielding performance will be better, the bendability of the electromagnetic shielding film 20 will decrease, which will easily increase the stress on the electrical connector body 10 when it is bent. If the thickness of the electromagnetic shielding film 20 is too small, the mechanical properties of the electromagnetic shielding film 20 will be greatly reduced, and the reliability will be reduced. Figure 6 As shown, Figure 6 This is a schematic diagram of the bending stability test of the electromagnetic shielding film. Figure 6 In the figure, the vertical axis is the ratio of the test resistance R of the electromagnetic shielding film after bending to the original resistance R0 of the electromagnetic shielding film, that is, the vertical axis is (R / R0), and the horizontal axis is the number of bending cycles (Bending cycles). Figure 1 and Figure 6 , an electromagnetic shielding film 20 with a thickness of 2μm-12μm is attached to the finger, and the following is performed: Figure 6In the 2000-cycle bending test shown, the ratio of the two remained essentially constant at approximately 1 after multiple bends. This means that after multiple bends, the resistance of the electromagnetic shielding film 20 remained close to its original resistance before bending, demonstrating the excellent flexibility and bendability of the electromagnetic shielding film 20, and its stable electromagnetic interference shielding performance. Therefore, during the repeated bending of the flexible electrical connector 100, the electromagnetic shielding film 20 can bend along with the repeated bending of the electrical connector body 10, maintaining its excellent electromagnetic interference shielding performance. Furthermore, due to the relatively low thickness of the electromagnetic shielding film 20, it does not increase the stress on the electrical connector body 10 during bending, thereby ensuring the reliability of the flexible electrical connector 100.

[0076] In some examples, since the structure of the electrical connector body 10 is generally a flat sheet structure, and the thickness of the electromagnetic shielding film 20 is relatively small and has good flexibility, Figure 7 As shown, electromagnetic shielding films 20 are provided to cover the opposing surfaces of the electrical connector body 10 to enhance the electromagnetic interference shielding performance of the electrical connector body 10 while maintaining a good flex life. Multiple tests have shown that the flexible electrical connector 100, with electromagnetic shielding films 20 provided on both opposing surfaces of the electrical connector body 10, has a flex life of 300,000 to 500,000 cycles, reaching the average flex life of conventional flexible electrical connectors.

[0077] In one exemplary embodiment, reference Figure 8 As shown, the outer surface of the electromagnetic shielding film 20 is also covered with a hydrophobic layer 30. The hydrophobic layer 30 can be formed from a material having a certain number of hydrophobic groups. The electromagnetic shielding film 20 with the hydrophobic layer 30 can have good hydrophobicity. When the flexible electrical connector 100 is in a high humidity environment, the hydrophobic layer 30 can ensure that the electromagnetic shielding film 20 can still provide good electromagnetic interference shielding performance.

[0078] In some examples, reference Figure 8 and Figure 9 As shown, Figure 9Figure 2 is a schematic diagram of a water contact angle test for an electromagnetic shielding film having a hydrophobic layer. When a liquid droplet contacts the hydrophobic layer 30 on the surface of the electromagnetic shielding film 20, the angle between the solid-liquid interface, the liquid interior, and the air-liquid interface at the interface between the solid hydrophobic layer 30, the liquid droplet, and the air is the water contact angle θ. Measurements show that the water contact angle θ of the electromagnetic shielding film 20 including the hydrophobic layer 30 is greater than 90°, indicating that the surface tension at the solid-air interface is less than that at the liquid-air interface. The droplet shrinks and aggregates into beads along the surface of the hydrophobic layer 30, making the hydrophobic layer 30 hydrophobic. The electromagnetic shielding film 20 including the hydrophobic layer 30 is not easily wetted. For example, measurements show that the water contact angle θ of the electromagnetic shielding film 20 including the hydrophobic layer 30 can be between greater than 90° and less than or equal to 105°, i.e., between (90°, 105°). This indicates that the electromagnetic shielding film 20 including the hydrophobic layer 30 exhibits good reliability in high humidity environments.

[0079] For example, refer to Figure 8 and Figure 10 As shown, Figure 10 This is a comparison chart of the changes in electromagnetic interference shielding performance and resistance ratio measured over time when electromagnetic shielding films with and without a hydrophobic layer are placed in an environment with 95% relative humidity and 65°C. Figure 10 In the figure, PA is the electromagnetic shielding film 20 without the hydrophobic layer 30, and C-PA is the electromagnetic shielding film 20 with the hydrophobic layer 30. The vertical axis on the left is the electromagnetic shielding effectiveness (EMI SE), in dB; the vertical axis on the right is the ratio of the original resistance R0 of the electromagnetic shielding film 20 to the test resistance Rx of the electromagnetic shielding film 20 obtained by testing over time, that is, (R0 / Rx), in %; the horizontal axis is the continuous residence time (Time), in days. Figure 10 It can be seen that under high temperature and high humidity conditions, the electromagnetic interference shielding performance and resistance ratio of the electromagnetic shielding film 20 with and without the hydrophobic layer 30 both show a downward trend over time, and the downward trend of the electromagnetic shielding film 20 with the hydrophobic layer 30 is smaller than that of the electromagnetic shielding film 20 without the hydrophobic layer 30. This indicates that the electromagnetic shielding film 20 with the hydrophobic layer 30 has good reliability and durability in high temperature and high humidity environments. At the same time, the hydrophobic layer 30 can also reduce the oxidation probability of the non-metallic-based conductive material in the electromagnetic shielding film 20, resulting in the electromagnetic shielding film 20 having excellent anti-oxidation performance in high temperature and high humidity environments.

[0080] It is understood that the material with hydrophobic groups is usually a high molecular organic compound. Figure 8When coated on the outer surface of the electromagnetic shielding film 20, the hydrophobic groups of the polymer organic compound face toward the side away from the electromagnetic shielding film 20, forming a hydrophobic surface layer, namely, the hydrophobic layer 30. At the same time, the side groups of the polymer organic compound can combine with the active hydrogen in the electromagnetic shielding film 20 to form hydrogen bonds, or generate interaction forces with the electromagnetic shielding film 20, thereby firmly bonding the hydrophobic layer 30 to the electromagnetic shielding film 20, thereby improving the reliability and weather resistance of the electromagnetic shielding film 20.

[0081] In some examples, the material forming the hydrophobic layer 30 may include polydimethylsiloxane (PDMS). Since PDMS has a very low solubility in water and is extremely difficult to absorb moisture, and due to the repulsive effect between the non-polar organic groups on its molecular backbone and the oxygen atoms in water molecules, PDMS has good hydrophobicity. In addition, the hydrophobic layer formed by PDMS also has good heat resistance, chemical stability, electrical insulation, weather resistance, and shear resistance. Therefore, the hydrophobic layer 30 formed by PDMS can provide good protection for the electromagnetic shielding film 20 and improve the mechanical properties of the electromagnetic shielding film 20.

[0082] In other examples, the material forming the hydrophobic layer 30 may include a polyurethane adhesive, which is an adhesive containing a carbamate group (-NH-COO-) and / or an isocyanate group (-NCO) in the molecular chain. Since the polyurethane adhesive system can form a complete and dense coating film, it can block the penetration of water or the infiltration of water molecules, so that the hydrophobic layer 30 formed thereby has good water resistance. At the same time, the active groups in the polyurethane adhesive can react with the active hydrogen in the electromagnetic shielding film 20 to generate covalent cross-linking groups. Moreover, since the surface of the electromagnetic shielding film 20 formed by the water-soluble polymer and the non-metallic conductive material is relatively rough, the polyurethane adhesive can penetrate into the recesses or pores on the surface of the electromagnetic shielding film 20 to form an interlocking effect, so that the hydrophobic layer 30 formed thereby forms a firm bond with the electromagnetic shielding film 20. In addition, the hydrophobic layer 30 formed by the polyurethane adhesive has elasticity and good extensibility, and has high tensile strength, thereby improving the mechanical properties of the electromagnetic shielding film 20 and having strong adaptability to the expansion and contraction deformation of the electromagnetic shielding film 20.

[0083] For example, refer to Figure 8 and Figure 11 As shown, Figure 11 1 and 2 are X-ray photoelectron spectroscopy (XPS) graphs of the electromagnetic shielding film having a hydrophobic layer and not having a hydrophobic layer. Figure 11In the XPS spectrum, the ordinate represents intensity, indicating the number of collected photons, and the abscissa represents the electron binding energy (eV). Because atoms have widely varying electronegativity, their binding energies also vary, forming characteristic peaks in the XPS spectrum. Figure 11 In the figure, PM is the spectrum of the electromagnetic shielding film 20 without the hydrophobic layer 30, and C-PM is the spectrum of the electromagnetic shielding film 20 with the hydrophobic layer 30, wherein the material of the hydrophobic layer 30 is polyurethane adhesive. Figure 11 It can be seen that the CO bonds in the electromagnetic shielding film 20 having the hydrophobic layer 30 are greatly increased, and the C═O bonds appear significantly, which indicates that there is a good covalent cross-linking effect between the hydrophobic layer 30 and the electromagnetic shielding film 20 .

[0084] refer to Figure 8 and Figure 12 As shown, Figure 12 3 is an energy dispersive X-ray spectroscopy (EDS) graph of the electromagnetic shielding film 20 having the hydrophobic layer 30 . Figure 12 In the embodiment, the high molecular polymer in the electromagnetic shielding film 20 is polyvinyl alcohol, the non-metallic conductive material is transition metal carbide, specifically carbon titanium, and the material of the hydrophobic layer 30 is polyurethane adhesive. Figure 12 The distribution of various elements in the electromagnetic shielding film 20 can be characterized by Figure 12 It can be seen that the film layer structure of the electromagnetic shielding film 20 is evenly distributed, and the elements have relatively obvious stratification.

[0085] In one exemplary embodiment, reference Figure 13 As shown, in the thickness direction of the electrical connector body 10, the electrical connector body 10 includes a conductive layer 11 and a protective layer 12 covering the conductive layer 11. The conductive layer 11 is used to achieve electrical conductivity of the electrical connector body 10. The conductive layer 11 can be formed of, for example, a conductive metal or metal alloy such as copper, silver, or nickel. It is understood that the conductive layer 11 can include a signal wiring layer for transmitting signals, a power wiring layer for providing power, a grounding layer (not shown in the figure) for grounding, and so on.

[0086] The protective layer 12 is used to insulate and protect the conductive layer 11 to prevent the conductive layer 11 from coming into contact with external water, oxygen, dust, etc., which could affect the electrical connectivity of the electrical connector body 10. The protective layer 12 can be formed of a polymer material having good flexibility, insulation, and chemical inertness. For example, the material may include PI (Polyimide) or PET (polyethylene glycol terephthalate). In some examples, the protective layer 12 can be configured with PI or PET as the outer layer and a laminated structure of an adhesive film attached to the conductive layer 11 on the inner layer. The adhesive film can be formed of a thermosetting adhesive, such as an epoxy resin adhesive or a polyurethane adhesive.

[0087] The protective layer 12 is provided with a through-electrode 13 that penetrates the protective layer 12 and is connected to the conductive layer 11. The through-electrode 13 can be formed of a conductive metal or alloy such as copper, iron, nickel, tin, etc., and is conductive. It is understood that when the through-electrode 13 is connected to the conductive layer 11, it can be connected to a grounding layer (not shown in the figure) in the conductive layer 11 for grounding. When the electromagnetic shielding film 20 covers the surface of the electrical connector body 10, the electromagnetic shielding film 20 covers the protective layer 12 of the electrical connector body 10. The electromagnetic shielding film 20 can contact the through-electrode 13 provided in the protective layer 12, thereby connecting to the grounding layer in the conductive layer 11, so that the electromagnetic shielding film 20 is grounded. When the electromagnetic shielding film 20 is in an electromagnetic wave environment, the charge carriers in the electromagnetic shielding film 20 can absorb electromagnetic interference radiation and cause the charge carriers to move. The charge accumulated in the electromagnetic shielding film 20 can be transferred to the conductive layer 11 through the through-electrode 13 for grounding discharge, thereby achieving a good electromagnetic interference shielding effect. It is understandable that the number of the through electrodes 13 in the protective layer 12 can be one or more, and the present disclosure does not limit this.

[0088] In some examples, only one conductive layer 11 is provided in the electrical connector body 10, and both side surfaces of the conductive layer 11 are covered with a protective layer 12, which is called a single-sided soft board. The through-electrodes 13 can be provided in the protective layer 12 on both side surfaces of the conductive layer 11 and grounded to the conductive layer 11, so that the electromagnetic shielding film 20 covering both side surfaces of the electrical connector body 10 can be grounded.

[0089] In other examples, the electrical connector body 10 is provided with multiple conductive layers 11, with adjacent conductive layers 11 insulated and separated by protective films, and both the top conductive layer 11 and the bottom conductive layer 11 are covered and protected by a protective layer 12, which is called a multi-layer flexible circuit board (not shown in the figure). In this case, the through-electrode 13 can be provided in the protective layer 12 on both sides of the electrical connector body 10 and grounded to the nearest conductive layer 11, so that the electromagnetic shielding film 20 covering both sides of the electrical connector body 10 can be grounded.

[0090] In one exemplary embodiment, the present disclosure provides an electronic device. The electronic device may include, for example, a mobile phone, a tablet computer, a wristband, a watch, headphones, VR glasses, sensors, and other devices. It may also include electronic devices with foldable devices, such as laptop computers, flip phones, and slider phones. Because electronic devices need to perform functions such as processing and storing data, the electronic device may be provided with a flexible electrical connector provided by the above-mentioned embodiments of the present disclosure. This ensures that the various electronic components and the flexible electrical connector in the electronic device are in good operating condition. The flexible electrical connector has good bendability and service life, thereby ensuring that the electronic device has good operating performance.

[0091] Other embodiments of the present invention will readily occur to those skilled in the art after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the invention being indicated by the following claims.

[0092] It should be understood that the present invention is not limited to the exact construction described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.

Claims

1. A flexible electrical connector, characterized in that: The flexible electrical connector comprises: an electrical connector body; An electromagnetic shielding film covers at least one side surface of the electrical connector body, wherein the electromagnetic shielding film comprises a high molecular polymer and a non-metallic-based conductive material in a preset mass ratio.

2. The flexible electrical connector according to claim 1, wherein: The preset mass ratio of the non-metal-based conductive material to the high molecular polymer is 1:9 to 1:

1.

3. The flexible electrical connector according to claim 2, characterized in that: The electromagnetic shielding film satisfies at least one of the following: Electromagnetic shielding effectiveness is 10dB-60dB; Conductivity is 20S / m-120S / m; Tensile stress is 200MPa-320MPa; Elongation at break is 2.2%-4.4%; Density is 1.6g / cm 3 -2.7g / cm 3 .

4. The flexible electrical connector according to claim 2, wherein: The thickness of the electromagnetic shielding film is 2 μm-12 μm.

5. The flexible electrical connector according to claim 1, wherein: The high molecular polymer is a water-soluble polymer; The high molecular polymer includes one or more of polyvinyl alcohol, polyacrylamide, polyethylene oxide, waterborne polyurethane, gelatin, cellulose, and modified cellulose.

6. The flexible electrical connector according to claim 5, characterized in that: In the electromagnetic shielding film, the non-metal-based conductive material and the high molecular polymer are in a physically mixed state, and the two are connected through hydrogen bonds.

7. The flexible electrical connector according to claim 5, characterized in that: The electromagnetic shielding film is formed by a spraying process using a mixed solution, wherein the mixed solution includes a preset solvent, and a preset mass ratio of the high molecular polymer and the non-metal-based conductive material.

8. The flexible electrical connector according to claim 7, characterized in that: The preset solvent includes one or more of deionized water, methanol, ethanol, and N,N-dimethylformamide.

9. The flexible electrical connector according to claim 1, wherein: The non-metal-based conductive material includes one or more of graphene, carbon nanotubes, transition metal carbides, transition metal nitrides, transition metal carbonitrides, and conductive carbon black.

10. The flexible electrical connector according to claim 1, wherein: The electromagnetic shielding film covers two oppositely disposed surfaces of the electrical connector body.

11. The flexible electrical connector according to any one of claims 1 to 10, characterized in that: The outer surface of the electromagnetic shielding film includes a hydrophobic layer.

12. The flexible electrical connector according to claim 11, characterized in that: The water contact angle of the electromagnetic shielding film including the hydrophobic layer is (90°, 105°).

13. The flexible electrical connector according to claim 11, characterized in that: The material of the hydrophobic layer includes polyurethane adhesive or polydimethylsiloxane.

14. The flexible electrical connector according to claim 11, characterized in that: The electrical connector body includes a conductive layer and a protective layer covering the conductive layer, wherein the protective layer is provided with a through electrode penetrating the protective layer and connected to the conductive layer; The electromagnetic shielding film covers the protection layer and contacts the through-electrode to be grounded to the conductive layer.

15. An electronic device, characterized in that: The electronic device comprises the flexible electrical connector according to any one of claims 1 to 14.

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