Electrostatic discharge device and method of metal mask

Abstract

According to the electrostatic discharge device of the metal mask, charges on the surface of a product are directly led out through the electrostatic discharge assembly, and the electrostatic adsorption component on the surface of the product is reduced. The electrostatic discharge assembly in the electrostatic discharge device can be in contact with the surface to be subjected to electrostatic discharge in a buffering mode, buffering of the first buffering height can be achieved, and the position deviation is dynamically compensated while electrostatic charges are discharged. The electrostatic discharge assembly is in buffer contact with the surface to be subjected to electrostatic discharge, so that hard collision and mechanical contact can be avoided in the contact process, the surface of a product is prevented from being scratched / polluted, and the yield of the product is improved.

Description

Technical Field

[0001] The present invention relates to precision processing equipment in the field of semiconductor or display panel manufacturing, and in particular to an electrostatic discharge device and method for a metal mask. Background Art

[0002] In existing technology, laser processing stations typically use electrostatic adsorption to secure products. Specifically, after the product is loaded onto the glass platform, a positive voltage of 150V-200V is applied to the platform to secure the product to the platform surface using electrostatic adsorption. This process has the following technical drawbacks: 1. When the electrostatics are on, the product is subject to a downward electrostatic force, forcing the air between the product and the glass platform to be expelled, creating a local negative pressure environment. 2. Due to the charge induction effect, after the electrostatics are turned off, some static charge will still remain between the glass platform and the product, and the negative pressure environment will still exist. Experiments have shown that this state of negative pressure adsorption and residual static electricity takes 10-30 minutes to dissipate naturally. When unloading, the combined effect of the negative pressure adsorption force and the residual static adsorption force will generate excessive adhesion between the product and the platform, causing local areas of the product to be excessively adsorbed by the platform. If the material is forcibly unloaded at this time, the adsorption area of ​​the product will be subjected to uneven pulling force, which is very likely to cause plastic deformation or even structural damage, seriously affecting the product yield.

[0003] This problem is particularly acute for precision components such as ultra-thin flexible substrates. Existing methods, which simply rely on prolonged resting time to eliminate adsorption forces, not only significantly reduce equipment utilization but also fail to fundamentally address the issue of mechanical damage during unloading. Therefore, a technical solution that can effectively eliminate residual adsorption forces is urgently needed to address this long-standing industry challenge. Summary of the Invention

[0004] The purpose of this application is to provide an electrostatic discharge device and method for a metal mask, which can effectively eliminate the residual adsorption force after electrostatic adsorption and fundamentally solve the problem of mechanical damage to the product during blanking.

[0005] The present application provides an electrostatic discharge device for a metal mask, which is connected to a product pick-up and placement device. The product pick-up and placement device includes: A drive assembly, used to realize the lifting and lowering of the product picking and placing device in the Z-axis direction; A connecting assembly, fixedly connected to the driving assembly; Wherein, the electrostatic discharge device comprises: An electrostatic discharge component is fixedly disposed on the connecting component, and the electrostatic discharge component can buffer contact with the surface to be discharged static electricity, and can achieve a first buffer height h1; The electrostatic discharge component includes: a retractable member having a fixed housing and a retractable shaft, wherein the retractable shaft can be extended or shortened along the Z axis in the fixed housing, and the retractable member passes through the through hole of the connecting assembly; a fixing member, used for fixing the retractable member to the connecting assembly; and The release member is fixedly arranged at the end of the telescopic shaft. When the release member contacts the surface to be released from static electricity, the telescopic shaft extends or shortens along the Z axis in the fixed housing to buffer the contact force between the release member and the surface to be released from static electricity.

[0006] In one embodiment, the electrostatic release device further includes: a grounding component fixedly disposed on the electrostatic release component, one end of the grounding component being electrically connected to the electrostatic release component, and one end of the grounding component being electrically connected to the outer shell of the product placement device.

[0007] In one embodiment, the release member includes a release unit, and the electrostatic contact surface of the release unit has a plating layer, and the plating layer is a gold plating layer or a rhodium plating layer.

[0008] In one embodiment, the connection assembly comprises: a first connecting member, one end of which is fixedly connected to the driving assembly; the first connecting member has a bending angle of 90°; a second connecting member fixedly connected to the other end of the first connecting member, the second connecting member extending along the Z-axis direction and closer to the surface to be discharged; and A third connecting member is fixedly connected to the second connecting member, the third connecting member has a bending angle of 90°, and has an extended surface in the XY plane; one end of the third connecting member is fixedly connected to the end of the second connecting member extending along the Z axis, and the other end of the third connecting member is fixedly connected to the electrostatic release component.

[0009] In one embodiment, the third connecting member further includes a supporting plate extending along the X-axis direction; The carrier plate has a plurality of through holes arranged at intervals, and each of the through holes is provided with a release member; The release member further comprises: A release assembly formed by combining a copper block and a high-density copper wire; the size of the release assembly in the Z-axis direction is the same as the size of the release unit in the Z-axis direction.

[0010] In one embodiment, the third connecting member further includes a supporting plate extending along the X-axis direction; The carrier plate has a plurality of through holes arranged at intervals, and a release member is arranged in each of the through holes; The release member comprises: at least one of said releasing monomers; and A release assembly formed by combining at least one copper block and high-density copper wire; The contact area between the releasing monomer and the surface to be released is located in the edge area of ​​the product, and the contact area between the releasing assembly and the surface to be released is located in the product pattern area.

[0011] In one embodiment, the connection assembly comprises: a fourth connecting member, one end of which is fixedly connected to the driving assembly; the fourth connecting member has a bending angle of 90°; and a fifth connecting member, fixedly connected to the other end of the fourth connecting member; The release member comprises: A first releasing element is fixedly mounted on the fifth connecting member; and The second release element is connected to the first release element, and the second release element has a third buffer height h3 in the Z-axis direction.

[0012] In one embodiment, the fifth connecting member comprises: A connecting body extending along the X-axis direction; A plurality of connecting posts are integrally formed with the connecting body, and each of the connecting posts is fixedly connected to one of the first releasing elements.

[0013] In one embodiment, each of the electrostatic discharge components is connected to one of the grounding components; The grounding assembly includes: independent multiple strands of tinned copper braided tape connected to a common grounding busbar; the resistance of the grounding loop is less than 1Ω.

[0014] The present application also includes a method for discharging electrostatic energy from a metal mask, using any of the electrostatic discharging devices for the metal mask described above. The method comprises: S01, driving the electrostatic discharge assembly to move downward along the Z-axis toward the surface of the metal mask product at a first speed, detecting and feeding back the height value of the electrostatic discharge assembly in real time; automatically switching to a second speed when the lower end of the electrostatic discharge assembly is at a first distance from the surface of the metal mask product, the second speed being less than the first speed; S02, detecting pressure values ​​borne by the electrostatic discharge component at multiple positions, and switching to a pressure closed-loop mode when it is detected that the pressure value at any position reaches a first pressure value; S03, the pressure closed-loop mode includes: setting the target pressure as a standard pressure value, dynamically adjusting the output force of the drive assembly in the Z-axis direction, so that the pressure values ​​at multiple locations are uniform; when the pressure values ​​at multiple locations are uniform, it is determined that the electrostatic discharge assembly is in stable contact with the surface of the metal mask product; S04, continuously monitor the surface voltage, cumulative release time, and voltage decay slope of the metal mask product. When any one of the above three parameters meets the constraint conditions, the electrostatic release component is controlled to be lifted along the Z axis at a third speed, and the third speed is greater than the first speed.

[0015] The electrostatic discharge device and method of the metal mask of the present application have at least the following advantages or beneficial effects: 1. The electrostatic discharge device for the metal mask provided in this application directly removes the charge from the product surface through an electrostatic discharge component, thereby reducing the electrostatic adsorption component on the product surface. The electrostatic discharge component in the electrostatic discharge device can buffer the surface from which the static electricity is to be released and can achieve a buffering effect of a first buffer height, thereby dynamically compensating for positional deviations while releasing the static charge. The electrostatic discharge component can buffer the surface from which the static electricity is to be released, thereby avoiding hard collisions and mechanical contact during the contact process, thereby preventing scratches / contamination on the product surface and improving product yield.

[0016] 2. The electrostatic discharge device for the metal mask provided in this application stably extracts charge through buffering contact between the electrostatic discharge component and the surface to be discharged, and physically contacts the metal mask product with zero damage (the electrostatic discharge component can provide buffering of a first buffer height h1). Electrically connected to the housing of the product placement device through the grounding component, a millisecond-level DC charge path is formed, thereby eliminating electrostatic adsorption (residual static electricity) on the metal mask product. The surface of the glass carrier does not need to be roughened, ensuring nanometer-level flatness accuracy. The electrostatic discharge device provided in this embodiment provides underlying technical support for the manufacture of metal masks for Micro LEDs, OLEDs, and other applications, improving the yield of metal masks and directly reducing the unit cost of metal masks.

[0017] 3. The electrostatic discharge assembly of the metal mask provided in this application has a first buffer height in the Z-axis direction. This ensures that when the release element descends or the product ascends, even if there are minor unevennesses on the product surface or glass carrier, each release element can uniformly contact the product surface under elastic pressure. Furthermore, in this embodiment, a pressure detection module and / or a voltage detection module can be further provided to monitor the relationship between the release element's buffer height in the Z-axis direction, the pressure applied to the product, and the product surface charge. This allows precise control of the release element's Z-axis rise or fall height, monitoring the product surface charge and determining whether residual static electricity has been fully discharged. Furthermore, by real-time monitoring of the pressure between the release element and the product surface and the product surface charge, the dynamic relationship between the release element's height on the product surface and the product surface charge can be balanced, thereby achieving the goal of fully discharging residual static electricity while avoiding damage to the product surface. In this embodiment, an automated control system can achieve closed-loop control of these three parameters: displacement, pressure, and residual charge, thereby enabling process traceability and abnormality warnings. Furthermore, the electrostatic release component completes a single lifting action in the Z-axis direction, simultaneously completing the static electricity release on the product surface and weakening the adsorption force between the glass carrier and the product surface, and its static electricity removal efficiency is greatly improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the specific implementation methods or the description of the prior art. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0019] Figure 1a A front view of an electrostatic discharge device provided in one embodiment of the present application; Figure 1b A side view of an electrostatic discharge device provided in accordance with an embodiment of the present application; Figure 2 A schematic diagram of the structure of the electrostatic discharge component and the grounding component provided in an embodiment of the present application; Figure 3 A schematic diagram of a structure in which an electrostatic discharge assembly provided in one embodiment of the present application is disposed on a carrier board; Figure 4 A schematic structural diagram of an electrostatic discharge assembly provided in another embodiment of the present application disposed on a carrier board; Figure 5 A schematic structural diagram of an electrostatic discharge assembly provided in yet another embodiment of the present application being disposed on a carrier board; Figure 6aA schematic diagram of a portion of the structure of an electrostatic discharge device provided in another embodiment of the present application; Figure 6b A front view of the structure of an electrostatic discharge device provided in another embodiment of the present application; Figure 7 A schematic structural diagram of a connection assembly in an electrostatic discharge device provided in another embodiment of the present application; Figure 8 A structural side view of an electrostatic discharge device provided in another embodiment of the present application; Figure 9 A top view of the product pick-up and placement device provided in an embodiment of the present application when picking up or placing a metal mask product; Figure 10 A top view of the electrostatic discharge device provided in an embodiment of the present application performing electrostatic discharge on a metal mask product.

[0020] Description of reference numerals: Product pick-and-place device 100, suction cup 101, electrostatic discharge device 200, glass stage 301, electrostatic buffer film 302, metal mask 303; Drive assembly 10; Connecting component 20: First connecting member 21, second connecting member 22, third connecting member 23: a carrying plate 231; The fourth connecting member 24 and the fifth connecting member 25 are connected to the main body 251 and the connecting column 252; Electrostatic discharge assembly 30: retractable component 31, fixed component 32, release component 33: Release monomer 331, Release assembly 332: copper block 332-1, copper wire 332-2; First release element 34: main copper strip 341, covering copper strip 342, second release element 35; Grounding assembly 40: grounding member 41 and grounding connector 42. DETAILED DESCRIPTION

[0021] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0022] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without creative work are within the scope of protection of the present application.

[0023] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0024] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the inventive product is typically placed when in use. These terms are intended only to facilitate the description of this application and simplify the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limiting this application. Furthermore, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0025] Furthermore, terms such as "horizontal" and "vertical" do not necessarily mean that a component must be absolutely horizontal or overhanging, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but rather that it can be slightly tilted.

[0026] It should also be noted that, in the description of this application, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0027] Regarding the first problem mentioned in the background technology: the negative pressure problem between the product and the glass platform surface, existing solutions usually increase the surface roughness of the glass platform by physically or chemically roughening the surface to promote air to enter the gap between the product and the glass platform faster after the static electricity is turned off, thereby reducing the negative pressure adsorption force. However, this method has obvious limitations: surface roughening may affect the flatness of the glass platform, resulting in uneven product fitting, which in turn affects processing accuracy. At the same time, the improvement in roughness is limited, and the air penetration rate is still slow, which cannot completely eliminate the negative pressure adsorption effect. There is still a risk of local pulling and deformation of the product during unloading.

[0028] Regarding the second issue mentioned in the background technology: the problem of residual static electricity, some technical solutions in the existing technology include adding a contact-type static elimination mechanism to the laser equipment, such as using a hard conductor to conduct away residual charge by directly contacting the product. However, this method has the following shortcomings: contact-type static elimination may cause scratches or contamination on the product surface due to mechanical contact. The hard conductor needs to be precisely aligned, otherwise the static elimination may not be thorough due to poor contact. It can only eliminate static electricity residue and cannot simultaneously solve the problem of negative pressure adsorption. The product may still be damaged due to the combined adsorption force during unloading.

[0029] In summary, existing technologies are unable to effectively solve the problems of negative pressure adsorption and static electricity residue simultaneously, and there may be risks such as reduced processing accuracy and secondary damage to the product. A more reliable, non-contact solution is urgently needed. The following embodiments of this application solve the paradox of "surface treatment accuracy and static electricity removal efficiency cannot be taken into account at the same time": traditional solutions sacrifice platform flatness (roughening) or increase the risk of contact damage (hard contact) to improve the static removal effect. The static electricity release device provided in the following embodiments of this application achieves nanometer-level processing accuracy while achieving zero damage through non-invasive charge diversion + adaptive buffering.

[0030] See also Figure 1a and Figure 1b The present application provides an electrostatic discharge device 200 for a metal mask. The electrostatic discharge device 200 is integrated into a product placement device 100. The product placement device 100 includes a drive component 10 and a connection component 20. The electrostatic discharge device 200 includes an electrostatic discharge component 30.

[0031] The drive assembly 10 is used to realize the lifting and lowering of the product pick-up and placement device in the Z-axis direction. The drive assembly is also used to control the lifting and lowering of the electrostatic release assembly 30 in the electrostatic release device 200 in the Z-axis direction. The drive assembly 10 can be set as a driving cylinder. The drive assembly 10 is fixedly connected to the product pick-up and placement device 100 and is used to control the lifting and lowering of the copper block of the electrostatic release assembly 30 in the Z-axis direction. The drive assembly 10 is controlled by the controller, and the repeatability of the drive assembly 10 is ±0.01mm. The drive assembly 10 can realize nano-level motion control, and the Z-axis lifting cycle is ≤0.5s, which can be combined with the metal mask production line. The abnormal response speed of the drive assembly 10 is <10ms.

[0032] The connecting assembly 20 is fixedly connected to the driving assembly 10. It is also fixedly connected to the electrostatic discharge assembly 30 in the electrostatic discharge device 200. The connecting assembly 20 is fixedly connected to the driving assembly 10 (e.g., a driving cylinder) and the electrostatic discharge assembly 30 (e.g., a copper block). The electrostatic discharge assembly 30 is fixedly mounted on the connecting assembly 20 and can buffer contact with the surface to be discharged, achieving a first buffer height h1.

[0033] Please see further Figure 2 and Figure 3 The electrostatic discharge component 30 includes: a retractable component 31, a fixing component 32 and a release component 33.

[0034] The telescopic member 31 has a fixed housing and a telescopic shaft. The telescopic shaft can be extended or shortened in the fixed housing. Figure 2 The fixed housing shown has an external thread for fixed connection with the fixing member 32. The telescopic member 31 passes through the through hole of the connecting component 20. The telescopic shaft may include a precision spring. The fixing member 32 may be set as a fixing screw, and the fixing member 32 is used to fix the telescopic member 31 to the connecting component 20. The release member 33 is fixedly set at the end of the telescopic shaft. When the release member 33 contacts the surface to be released from static electricity, the telescopic shaft is extended or shortened in the fixed housing to buffer the contact force between the release member 33 and the surface to be released from static electricity. Figure 2 As shown, the release member 33 can achieve a first buffer height h1 under the drive of the telescopic shaft. In some embodiments, the first buffer height h1 is 1mm-5mm. That is, the release member 33 has an independent buffer stroke of 1mm-5mm in the direction perpendicular to the product surface (Z-axis direction). The release member 33 can be made of a high-purity copper block with a resistivity as low as 1.68×10 -8 Ω·m, to achieve millisecond-level charge release (<0.2s).

[0035] In this embodiment, the electrostatic discharge assembly 30 in the electrostatic discharge device 200 provides a buffered contact with the surface to be discharged, achieving a first buffer height, thereby dynamically compensating for positional deviations while discharging static charge. This buffered contact between the electrostatic discharge assembly 30 and the surface to be discharged avoids hard collisions and mechanical contact during the contact process, thereby preventing scratches and contamination on the product surface and improving product yield.

[0036] In one embodiment, the electrostatic discharge device 200 further includes a grounding assembly 40. Grounding assembly 40 is fixedly mounted to the electrostatic discharge assembly 30. One end of grounding assembly 40 is electrically connected to the electrostatic discharge assembly 30, and another end of grounding assembly 40 is electrically connected to the outer housing of the product placement device 100. This prevents breakdown of electronic devices during the production / testing of metal masks, damage to electronic device performance, or electromagnetic interference (EMI) to the metal mask, which could cause production line downtime. Grounding assembly 40 directs residual charge directly to the device housing, simultaneously dissipating electrostatic attraction. This eliminates the combined forces of static electricity and negative pressure when the product is removed, eliminating the risk of product deformation at the root.

[0037] The electrostatic discharge device 200 provided in this embodiment can maintain the original flatness of the glass carrier 301, without the need for roughening the glass carrier 301, and 100% retaining its optically flat surface, thereby ensuring the uniformity of the fit between the product and the glass carrier 301 and avoiding micron-level processing deviations caused by the rough surface of the glass carrier 301.

[0038] The electrostatic discharge device 200 provided in this embodiment directly conducts the charge on the surface of the product through the electrostatic discharge component 30, thereby reducing the electrostatic adsorption component on the surface of the product. A grounding path is formed by the grounding component 40, which cuts off the charge accumulation near the electrostatic discharge component 30 / near the grounding component 40, so that the adsorption voltage on the surface of the product loses the electrostatic synergistic effect. That is, through the coordinated cooperation of the electrostatic discharge component 30 and the grounding component 40, the electrostatic adsorption force on the surface of the product is simultaneously eliminated. The electrostatic discharge component 30 in the electrostatic discharge device 200 can contact the surface to be discharged in a buffering manner and can achieve a buffering of the first buffering height h1, thereby achieving dynamic compensation for position deviation while releasing electrostatic charge. The electrostatic discharge component 30 can contact the surface to be discharged in a buffering manner, which can avoid hard collision and mechanical contact during the contact process, thereby avoiding scratches / contamination on the product surface, thereby improving product yield.

[0039] In this embodiment, the electrostatic discharge assembly 30 maintains a stable charge discharge by buffering contact with the surface to be discharged, while also ensuring zero damage to the metal mask product during physical contact (the electrostatic discharge assembly 30 provides a buffering height h1). Electrically connected to the housing of the product placement and retrieval device 100 via the grounding assembly 40, a millisecond-level direct current path for the charge is established, thereby eliminating electrostatic adsorption (residual static electricity) on the metal mask product. The surface roughening of the glass carrier 301 is unnecessary, ensuring nanometer-level flatness accuracy. The electrostatic discharge device 200 provided in this embodiment provides underlying technical support for the manufacture of metal masks for applications such as Micro LEDs and OLEDs, improving the yield of metal masks and directly reducing the cost per metal mask.

[0040] In one embodiment, the electrostatic discharge assembly 30 (which may include multiple discharge members 33 and / or multiple secondary discharge elements 35) forms a large-area equipotential contact with the product surface, significantly improving charge discharge efficiency. Static electricity is eliminated within the ramp-up and ramp-down cycles of the driver assembly 10 (typically less than 0.5 seconds), ensuring seamless production line operation. The grounding path of the grounding assembly 40 is directly coupled to the housing of the product placement device 100, preventing electromagnetic interference (EMI) from being transmitted to sensitive electronic components and reducing production line downtime due to electrostatic breakdown to near zero.

[0041] In this embodiment, the electrostatic discharge assembly 30 has a first buffer height h1 in the Z-axis direction (perpendicular to the product surface). This ensures that when the discharge members 33 descend or the product ascends to create surface contact, even if there are minor irregularities on the product surface or the glass carrier 301, each discharge member 33 can uniformly contact the product surface under elastic pressure. Furthermore, in this embodiment, a pressure detection module and / or a voltage detection module can be further provided to monitor the relationship between the Z-axis buffer height of the discharge members 33, the pressure applied to the product, and the surface charge of the product. This allows precise control of the Z-axis height of the discharge members 33, monitoring the surface charge of the product, and determining whether residual static electricity has been fully discharged. Furthermore, by real-time monitoring of the pressure between the discharge members 33 and the product surface and the surface charge, the dynamic relationship between the height of the discharge members 33 on the product surface and the surface charge can be balanced, thereby achieving the desired effect of fully dissipating residual static electricity while avoiding damage to the product surface. In this embodiment, an automated control system achieves closed-loop control of displacement, pressure, and residual charge, enabling process traceability and abnormality warnings. Furthermore, the electrostatic discharge assembly 30 performs a single Z-axis lift, simultaneously dissipating static electricity from the product surface and weakening the adhesion between the glass stage 301 and the product surface, significantly improving static removal efficiency.

[0042] In some embodiments, the release member 33 is a hollow cylindrical structure, the hollow position of which allows the retractable member 31 to be inserted and set. The retractable member 31 also includes a limiting member, which is arranged at one end close to the release member. The grounding assembly 40 includes a grounding member 41, a grounding connector 42 and a grounding wire (not shown). The grounding member 41 has a 90° bending angle and a through hole in a first extension plane perpendicular to the Z-axis direction. The limiting member of the retractable member 31 is located in the through hole and is used to limit the continued extension of the retractable member 31 in the Z-axis direction. The grounding member 41 has a mounting hole for the grounding connector 42 in a second extension plane perpendicular to the first extension plane. The grounding connector 42 can be set as a screw (hexagonal screw) for fixing the grounding wire. Each release member 33 can be independently connected with a sufficiently thick grounding wire (for example, a grounding wire with a cross-sectional area ≥ 4mm 2 Multi-strand ultra-flexible tinned copper braid). If multiple release members 33 are provided, multiple groups of grounding wires can be connected in parallel to the low-resistance busbar for unified grounding connection. In one embodiment, a high-purity copper block with only one top surface and a hollow cylindrical structure is used as a release member 33. The connection point between a release member 33 and a grounding member 41 can be achieved by first drilling a hole in the center of the top surface of the release member 33, and then using a stainless steel screw + star-shaped washer + conductive gasket to crimp the braided grounding wire terminal to ensure firmness and low resistance. If multiple release members 33 are provided, it is absolutely necessary to absolutely avoid connecting the high-purity copper blocks in series with wires before grounding, which will result in a long release path, high resistance, and poor effect for the copper blocks far from the grounding point.

[0043] In this embodiment, the electrostatic discharge assembly 30 includes a retractable member 31, a fixed member 32, and a release member 33. The grounding assembly 40 includes a grounding member 41, a grounding connector 42, and a grounding wire (not shown). This connection between the electrostatic discharge assembly 30 and the grounding assembly 40 ensures a more secure connection and lowers connection resistance, shortening the path for electrostatic current to be released through the electrostatic discharge assembly 30 and improving the electrostatic discharge effect.

[0044] The surface of the release member 33 that directly contacts the metal mask product is coated with a coating. This coating prevents copper oxidation, which can increase contact resistance and ensure long-term, stable, and reliable contact. The area of ​​the release member 33 that doesn't directly contact the metal mask product is coated with an insulating ceramic coating, providing an anti-interference shield. This shielding function blocks high-frequency interference and suppresses electromagnetic pulses during discharge. Furthermore, the insulating ceramic coating, with a withstand voltage exceeding 15kV, prevents false triggering of high-voltage equipment.

[0045] See also Figure 2 、 Figure 3 、 Figure 4 and Figure 5 In one embodiment, as Figure 2As shown, the electrostatic discharge assembly 30 includes a release member 33 (the release member 33 is configured as a release unit 331). In some embodiments, as shown in FIG. Figure 3 、 Figure 4 and Figure 5 As shown, the electrostatic discharge assembly 30 includes a plurality of release members 33 arranged at intervals. Figure 3 The plurality of release members 33 arranged at intervals are all configured as release units 331 . Figure 4 The plurality of release members 33 arranged at intervals are all configured as a release assembly 332 . Figure 5 The electrostatic discharge assembly 30 includes a release member 33 composed of multiple release monomers 331 and a release member 33 composed of multiple release assemblies 332. Figure 2 and Figure 3 In the illustrated embodiment, the release element 331 can be configured as a cylindrical hollow copper block or a high-purity oxygen-free copper structure to ensure optimal conductivity. The electrostatic contact surface of the release element 331 (the surface of the release element 331 that directly contacts the metal mask product) is plated with a gold or rhodium coating. In one embodiment, the release element 331 can be a cylindrical hollow copper block structure with a diameter of 15 mm to 25 mm. The electrostatic contact surface of the release element 331 can be finely polished. In some embodiments, the thickness of the gold or rhodium coating is greater than 1 μm.

[0046] In this embodiment, a coating is applied to the surface of the release element 331 that directly contacts the metal mask product. This coating prevents copper oxidation, which can increase contact resistance, ensuring long-term, stable, and reliable contact. The gold or rhodium plating layer must exhibit a certain degree of wear resistance to extend the service life of the release element 331.

[0047] See also Figure 1a and Figure 1b As shown, in one embodiment, the connecting component 20 includes: a first connecting member 21, a second connecting member 22 and a third connecting member 23. One end of the first connecting member 21 is fixedly connected to the cylinder of the driving component 10. The first connecting member 21 has a bending angle of 90°. The other end of the first connecting member 21 is fixedly connected to the second connecting member 22. The second connecting member 22 is extended along the Z-axis direction and is closer to the surface to be released from static electricity. The third connecting member 23 is fixedly connected to the second connecting member 22. The third connecting member 23 also has a bending angle of 90°. The third connecting member 23 has an extension surface in the XY plane. One end of the third connecting member 23 is fixedly connected to the end of the second connecting member 22 extending along the Z-axis, and the other end of the third connecting member 23 is fixedly connected to the electrostatic release component 30, and the electrostatic release component 30 is extended along the Z-axis direction.

[0048] Specific examples Figure 1bThe first connector 21 and the third connector 23 shown have portions extending along the Y-axis. The third connector 23 also has portions extending along the X-axis. The first and second connectors 21 and 22 can be made of high-resistance alloys or resistance alloys (e.g., nickel-chromium alloys, copper-nickel alloys, iron-chromium-aluminum alloys, etc.). The third connector 23 can be made of metals or alloys with good electrical conductivity, such as copper, copper alloys (e.g., beryllium-copper alloys, copper-nickel-silicon alloys, copper-chromium-zirconium alloys), nickel, nickel alloys (e.g., nickel-titanium alloys or palladium-nickel alloys), tungsten, and tungsten alloys (e.g., copper-tungsten alloys). Portions of the aforementioned connection assembly 20 can be in contact with or positioned alongside the product placement device 100 to conserve space between the electrostatic discharge device 200 and the product placement device 100.

[0049] See also Figure 3 、 Figure 4 and Figure 5 In one embodiment, the third connecting member 23 further includes a Figure 1a A carrier plate 231 is provided extending in both the positive and negative directions of the X-axis. The carrier plate 231 has multiple through-holes spaced apart, each of which houses a release member 33. In this embodiment, multiple release members 33 may be arranged in an array. The extension length of the third connector 23 in the X-direction can be designed based on the product size. In this embodiment, the structural arrangement of the third connector 23 allows for a greater number of release members 33 of varying configurations, thereby improving electrostatic discharge efficiency.

[0050] The release member 33 also includes a release assembly 332 of a copper block 332-1 and a high-density copper wire 332-2. The solid copper block 332-1 can be welded to the high-density copper wire 332-2. The high-density copper wire 332-2 can be set as a brass wire with a wire diameter of 0.1 and a length of 10mm-80mm. The length can be selected according to actual needs. The density of the high-density copper wire 332-2 is 90 pieces / mm. 2 -150 roots / mm 2 , for example, it can be set to 120 pieces / mm 2 The high-density copper wire 332-2 can achieve a second buffer height h2 in the Z-axis direction, wherein the second buffer height can reach 0.5mm-1.5mm. The size of the release assembly 332 in the Z-axis direction is the same as the size of the release monomer 331 in the Z-axis direction. The copper block 332-1 can be set to a cylindrical, cubic or other shape. The copper block 332-1 can be set to a hollow copper block or a solid copper block. Figure 3 As shown, a plurality of release members 33 are arranged at intervals on the carrier plate 231. Figure 4 As shown, a plurality of release assemblies 332 are arranged at intervals on the carrier plate 231. Figure 5As shown, a plurality of release units 331 and a plurality of release assemblies 332 are spaced apart on the carrier plate 231 , wherein the positions of the release units 331 and the release assemblies 332 are interchangeable.

[0051] In this embodiment, the carrier plate 231 included in the third connecting member 23 can be set as a long strip base, for example, with a length slightly less than 1200mm, such as 1150mm, on which a plurality of independent release units 331, such as 5-8, or a release assembly 332 including a cylindrical solid copper block 332-1 and a high-density copper wire 332-2, are vertically fixed at equal intervals of 150mm-250mm. The contact area between the release member 33 and the surface to be released is about 100mm. 2 -180mm 2 In a specific embodiment, the contact area between the release member 33 and the surface to be discharged is 150 mm. 2 . The thickness of the release member 33 can be set to 10 mm. The thickness of the release member 33 can ensure the rigidity and heat dissipation of the electrostatic release component 30. The contact surface area between the release member 33 and the static surface to be released ensures that the electrostatic release component 30 has sufficient release current density. In this embodiment, the release member 33 is provided to include a combination of a release monomer 331 and a release assembly 332. On the one hand, it is convenient to observe or detect the displacement of the release member 33 when the release member 33 contacts the static surface to be released (which can be reflected by whether the release assembly 332 is deformed, or by). On the other hand, the release monomer 331 and the release assembly 332 are combined to facilitate the full release of static electricity.

[0052] See also Figure 6a 、 Figure 6b 、 Figure 7 and Figure 8 In one embodiment, the connecting assembly 20 includes a fourth connecting member 24 and a fifth connecting member 25. One end of the fourth connecting member 24 is fixedly connected to the cylinder of the driving assembly 10. The fourth connecting member 24 has a 90° bend angle. The fifth connecting member 25 is fixedly connected to the other end of the fourth connecting member 24.

[0053] The electrostatic discharge assembly 30 includes a first release element 34 and a second release element 35. The first release element 34 is fixedly mounted on the fifth connector 25. The second release element 35 is connected to the first release element 34. The second release element 35 has a third buffer height h3 in the Z-axis direction, wherein the second buffer height can be 2mm-10mm. The contact area between the second release element 35 and the surface to be discharged is 40mm. 2 -80mm 2 In a specific embodiment, the contact area between the second release element 35 and the surface to be discharged is 70 mm 2Specifically, the first release element 34 and the second release element 35 can be made of copper. The second release element 35 can be made of a copper strip with a certain width, which is surrounded to form a hollow ring with a hollow center. Figure 6b As shown, the first release element 34 may include a main copper strip 341 and a covering copper strip 342. The main copper strip 341 is directly fixedly connected to the fifth connector 25. The covering copper strip 342 is disposed on the outside of the main copper strip 341, wrapping the main copper strip 341 and a portion of the fifth connector 25. The covering copper strip 342 is used to strengthen the connection between the main copper strip 341 and the fifth connector 25.

[0054] This embodiment provides a detailed structure of another electrostatic discharge device 200. The connection assembly 20 and electrostatic discharge assembly 30 comprise a simpler structure, yet still achieves highly efficient electrostatic discharge. In this embodiment, a third buffer height h3 in the Z-axis direction is achieved by a second discharge element 35.

[0055] See also Figure 7 and Figure 8 In one embodiment, the fifth connector 25 includes a connecting body 251 and a plurality of connecting posts 252 . The connecting body 251 extends along the X-axis. The connecting posts 252 are integrally formed with the connecting body 251, and each connecting post 252 is fixedly connected to a first release element 34 . The connecting posts 252 are spaced apart, and each connecting post 252 is further provided with a grounding assembly 40 . Specifically, the grounding assembly 40 can be wrapped around the connecting post 252 and further secured by a copper tape 342 .

[0056] This embodiment provides a specific structural form of the fifth connector 25 and clarifies the connection method between the grounding assembly 40 and the fifth connector 25. The structural design of the fifth connector 25 in this embodiment facilitates the installation of the first release element 34 and the second release element 35, thereby facilitating the static discharge of the metal mask product.

[0057] See also Figure 6a 、 Figure 6b and Figure 8 In one embodiment, each electrostatic discharge assembly 30 is connected to a grounding assembly 40. The grounding assembly 40 comprises: an independent multi-strand tinned copper braid with an impedance of <0.1Ω. The cross-sectional area of ​​the grounding assembly 40 is ≥4mm 2. The grounding component 40 can be connected to a common grounding busbar. The grounding component 40 can also be connected to the product pick-up and placement device 100. The resistance of the grounding loop formed by the grounding component 40 is less than 1Ω, and more ideally, its grounding resistance value is <0.5Ω. The grounding resistance can also be monitored at all times during the static electricity removal process. For example, a real-time monitoring module can be integrated into the grounding loop, and an audible and visual alarm will be issued when the grounding resistance increases abnormally, such as >1.5Ω. In this embodiment, through the optimized setting of the grounding component 40, an ultra-low impedance grounding path can be formed. After being exported through the grounding component 40, the residual voltage on the surface of the metal mask product is reduced to <0.03kV, and the false triggering caused by electromagnetic interference is eliminated. The grounding component 40 has a long fatigue life, specifically a bending life of more than 1 million times, and a long maintenance cycle. After the grounding component 40 is installed, use a grounding resistance tester to measure and record it, and review it regularly, such as monthly.

[0058] Table 1: Comparison of technical effects between the traditional solution and the solution of this application.

[0059]

[0060] The above table 1 is the application scheme of this application Figure 1a-Figure 5 The embodiment shown, and Figure 6a-Figure 8 The embodiment shown. Compared with the traditional solution, the static electricity removal time in the present application solution is significantly reduced, the product damage rate is greatly reduced, and the frequency of production line shutdowns is greatly reduced. In a production line shutdown accident caused by the use of the traditional solution, the production line of the metal mask product was shut down for 8 hours, resulting in a large number of failed products, prolonged product delivery time, and reduced production efficiency. After adopting the present application solution, the production line of the metal mask product has not been shut down, the static electricity removal time of each product has been greatly shortened, the product damage rate has also been reduced, and it fully meets the current production needs.

[0061] In the embodiment of the present application, a multi-point contact is designed to cover the long-sized metal mask product, thereby increasing the contact area of ​​the static-eliminating contact surface (such as Figure 1a-Figure 5 In the embodiment shown, the contact area between the electrostatic discharge component 30 and the surface to be discharged is 100 mm 2 -180mm 2 ,like Figure 6a-Figure 8 In the embodiment shown, the contact area between the electrostatic discharge component 30 and the surface to be discharged is 40 mm 2 -80mm 2 Gold plating on the surface of the release unit 331 can, on the one hand, ensure low contact resistance and improve electrostatic discharge efficiency, and on the other hand, improve oxidation resistance and ensure electrostatic discharge performance through regular maintenance.

[0062] In some embodiments of the present application, the electrostatic discharge assembly 30 has a first buffer height h1 of 1mm-5mm. In other embodiments, the electrostatic discharge assembly 30 has a buffer height (first buffer height h1 + second buffer height h2) of 1mm-6.5mm. In still other embodiments, the electrostatic discharge assembly 30 has a third buffer height h3 of 2mm-10mm. This buffer design achieves more uniform surface contact, ensuring uniform pressure at all points on the metal mask product surface. It also facilitates gradual static discharge, avoids sparks, and facilitates monitoring and standardized operation during the electrostatic discharge process.

[0063] The present application also provides a method for discharging electrostatic energy from a metal mask, comprising: The product placement device 100 places the product to be tested on the glass stage 301. Figure 9 The glass carrier 301 is used to place the metal mask product (metal mask 303 in the figure). The electrostatic buffer film 302 is located on the glass carrier 301. The electrostatic buffer film 302 is made of PET non-adhesive electrostatic frosted film. Its frosted surface is in direct contact with the metal mask 303, which is used to improve the negative pressure problem between the metal mask 303 and the glass carrier 301. When the metal mask 303 is placed on the glass carrier 301, the electrostatic buffer film 302 is located between the metal mask 303 and the glass carrier 301 in the stacking direction. The metal mask 303 includes a product area and an edge support area, wherein the edge support area is located above the electrostatic buffer film 302 to prevent the frosted surface of the electrostatic buffer film 302 from damaging the product area. Correspondingly, when the product pick-up and placement device 100 acts on the metal mask 303, it also acts on the product area to prevent the suction cup 101 of the product pick-up and placement device 100 from damaging the product area.

[0064] The controller controls the application of a forward voltage to the product to be tested so as to electrostatically adsorb the product to be tested and perform various tests.

[0065] After the test is completed, the controller controls the working environment humidity to be adjusted to 40%-60% RH. In this step, the working environment humidity of 40%-60% RH can effectively suppress the generation of static electricity and accelerate the weak discharge of charge through the air as a supplement to the static discharge of the static discharge component 30.

[0066] After the test is complete, the controller controls the metal mask product to be blown with ionized air. During this step, an ion blower can be installed near the pickup station to provide airflow to the metal mask product pickup area. This ion blower neutralizes any static charge that may remain on the product or surrounding insulating materials (such as glass surfaces and non-conductive parts of the product) after the ESD component 30 contacts the product, which is difficult for the component to discharge (e.g., on non-conductive parts of the product). This also neutralizes any triboelectric charge that may be regenerated during operation. This provides a double layer of protection.

[0067] Glass stage 301 is in the first position. The controller controls electrostatic discharge device 200 to contact the product to be discharged for a first time (settable to 1-2 seconds). Electrostatic discharge device 200 is then raised. Glass stage 301 moves to the second position. The controller controls electrostatic discharge device 200 to contact the product to be discharged for a second time (settable to 1-2 seconds). After the metal mask is discharged, the product placement device 100 removes the product.

[0068] See also Figure 10 , corresponding to Figure 5 The top view of the electrostatic discharge device 200 shown in FIG. 3 is a top view of the electrostatic discharge device 200 when performing electrostatic discharge on a metal mask product. In the figure, the surface of the electrostatic discharge component 30 in contact with the metal mask 303 is the surface of the discharge unit 331 or the surface of the discharge assembly 332. Figure 10 In the embodiment shown in FIG, the static electricity of the metal mask 303 is fully released by the static electricity release component 30 having a certain buffer height, so as to solve the negative pressure problem and static electricity residual problem between the product and the surface of the glass platform.

[0069] In one embodiment, the electrostatic discharge device 200 further includes a pressure sensor and a displacement sensor integrated into the electrostatic discharge assembly 30. The pressure sensor is integrated into the lowest end of the release member 33 or the second release element 35 in the Z-axis direction, i.e., the surface in contact with the product or near the surface. The displacement sensor is integrated into the lowest end of the third connector 23 or the fifth connector 25 in the Z-axis direction to accurately measure the displacement of the electrostatic discharge assembly 30. The electrostatic discharge device 200 further includes a voltage detector, which is disposed between the glass stage 301 and the metal mask 303 to continuously detect the electrostatic voltage. Alternatively, the electrostatic discharge device 200 further includes a non-contact electrostatic voltmeter that rapidly scans the surface of the metal mask product before and after the electrostatic discharge device 200 performs electrostatic discharge, particularly at the ends and center of the product, to verify the electrostatic discharge effect, i.e., whether the residual voltage on the surface of the metal mask product drops to 0.03 kV or below after being conducted through the grounding assembly 40.

[0070] In this embodiment, the drive assembly 10 is precisely programmed and controlled by a controller, and in combination with a pressure sensor to provide real-time feedback on the contact status between the electrostatic discharge assembly 30 and the product surface, a three-parameter closed-loop control of "displacement-pressure-charge" is formed, achieving process traceability and abnormality warning. The displacement-pressure-charge control method includes: Methods for discharging electrostatic energy from metal masks include: In step S01, the controller drives the ESD assembly 30 to move downward perpendicularly (in the Z-axis direction) toward the surface of the metal mask product at a constant first speed (which can be set to 0.3 mm / s). The displacement sensor detects and provides feedback on the height of the ESD assembly 30 in real time at a frequency of 100 Hz or higher. When the lower end of the ESD assembly 30 is at a first distance (which can be set to 2.0 mm) from the product surface, it automatically switches to a micro-motion mode at a second speed (which is less than the first speed and can be set to 0.1 mm / s).

[0071] S02, detecting the pressure values ​​at multiple locations of the electrostatic discharge component 30, and switching to the pressure closed loop mode when the pressure value at any location reaches a first pressure value. Since the electrostatic discharge component 30 may include multiple release members 33 or second release members 35, a pressure sensor may be provided on each release member 33 or second release member 35. Therefore, when any pressure sensor detects that the pressure value reaches the first pressure value (which can be set to 0.1 N / cm 2 ), it is determined as the initial contact moment and the pressure closed-loop mode is immediately executed.

[0072] The pressure closed-loop mode includes: setting the target pressure to the standard pressure value, dynamically adjusting the output force of the drive assembly 10 in the Z-axis direction, so that the pressure values ​​at multiple positions are uniform. The specific implementation method includes: switching the controller to the pressure closed-loop mode, setting the target pressure to the standard pressure value (the standard pressure value can be set to 4.0±0.3 N / cm 2 -4.8±0.3 N / cm 2 ).

[0073] The controller dynamically adjusts the output force of the driving component 10 in the Z-axis direction to make the pressure values ​​of multiple pressure detection points uniform (the maximum pressure difference of multiple pressure detection points can be set to ≤1.0 N / cm 2 The pressure values ​​at multiple locations are uniform, which can be understood as the pressure values ​​at multiple locations tending to the standard pressure value, or as the maximum pressure difference between the pressure values ​​at multiple locations being less than or equal to 1.0 N / cm 2 .

[0074] If the pressure standard deviation of multiple pressure test points is continuously greater than 0.8 N / cm 2If it exceeds 3 seconds, the tilt compensation algorithm is activated to automatically balance the pressure distribution. The tilt compensation algorithm includes: reading the pressure sensor data of all electrostatic discharge components 30, and performing a moving average filter (window width 0.2 seconds) on each electrostatic discharge component 30 to eliminate mechanical vibration noise; calculating the key indicators of pressure distribution: average pressure, pressure range, and standard deviation; when the pressure distribution is judged to be significantly uneven through the above key indicators, compensation is started; calculating the pressure deviation of each 30, generating compensation instructions, and performing pressure compensation in steps (first compensating the low pressure point, then compensating the high pressure point); after the compensation is completed, the effect is verified and iterated, and the single-point pressure value and pressure oscillation amplitude must be monitored in real time during each compensation process. The above-mentioned tilt compensation algorithm can be integrated into the controller. When it needs to be activated and executed, the corresponding tilt compensation algorithm module in the controller can be directly called.

[0075] S03, when the pressure values ​​at multiple locations (pressure detection points) are uniform, it is determined that the electrostatic discharge component 30 is in stable contact with the surface of the metal mask product, voltage monitoring is performed, and the voltage release strategy is adjusted.

[0076] Voltage monitoring and adjustment of voltage release strategies include: S031 , based on the detection data of the voltage detector, calculate the voltage decay slope S (S=ΔV / Δt) every 0.1 second.

[0077] S032, dynamically adjust the voltage release strategy according to the voltage decay slope: When S<-100V / s, maintain the current state; When -100V / s≤S<-50V / s, the static discharge time is extended by 1 second; When S≥-50V / s, the electrostatic discharge component is activated to vibrate 30 times (the micro-vibration can be set to an amplitude of 10μm and a frequency of 50Hz) to accelerate the discharge of static electricity; S04, continuously monitoring the surface voltage, cumulative release time, and voltage decay slope of the metal mask product. When any one of the three parameters (surface voltage, cumulative release time, and voltage decay slope) satisfies a constraint condition, the electrostatic discharge assembly 30 is triggered to separate from the surface of the metal mask product. The constraints include: the surface voltage of the metal mask product is ≤0.03kV; the cumulative release time is greater than 10 seconds; and the voltage decay slope |S| is <10V / s for more than 3 seconds.

[0078] The specific steps of triggering the separation of the electrostatic release component 30 from the surface of the metal mask product include: the controller controls the electrostatic release component 30 to lift along the Z axis at a third speed (the third speed can be set to 0.5mm / s), and simultaneously monitors the voltage rebound value ΔV_sep at the moment of separation; if |ΔV_sep|>10V, immediately pause and alarm, and the third speed is greater than the first speed.

[0079] Within a preset time (settable to 5 seconds) after separation, the surface voltage of the metal mask is measured (using a non-contact electrostatic voltmeter to scan the voltage at the center and four corners of the surface). If the surface voltage |V_residual| at all points is ≤0.03kV, electrostatic discharge is complete. If any point exceeds the limit, a secondary discharge process is automatically initiated (with a configurable pressure increase of 10%-20%).

[0080] In this embodiment, the electrostatic release method of the metal mask adopts a "displacement-pressure-charge" three-parameter closed-loop control method. Pressure control can eliminate micron-level scratches on products; three speeds are used for different displacement amounts in the Z-axis direction to avoid the risk of electric sparks generated by secondary discharge; the voltage is released quickly, and the single operation time is shortened to 1s-2s, and the longest does not exceed 8.5s; the electrostatic release method involved in this application has a high degree of integration, and the control process is embedded in the pickup action, which is convenient to operate.

[0081] The metal mask ESD discharge method also includes storing all parameters (displacement, pressure, and voltage time series data) after each batch of ESD is completed, binding the product ID, and automatically generating a process report, noting abnormal events. Alerts are also triggered based on rules (e.g., an alarm is triggered if the residual voltage exceeds 0.03kV three times in a row).

[0082] In the embodiment of the present application, by associating the original sensor data fragments (such as the data 10 seconds before the pressure imbalance) with abnormal events, early warning tracing can be achieved, the cause of the alarm can be found, and the problem can be solved in a timely manner.

[0083] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An electrostatic discharge device for a metal mask, connected to a product pick-up and placement device, the product pick-up and placement device comprising: A drive assembly (10) for achieving lifting and lowering of the product pick-up and placement device in the Z-axis direction; and, A connecting assembly (20) fixedly connected to the driving assembly (10); Characterized in that the electrostatic discharge device (200) comprises: An electrostatic discharge component (30) is fixedly arranged on the connecting component (20), and the electrostatic discharge component (30) can be in buffered contact with a surface to be discharged from static electricity; The electrostatic discharge component (30) comprises: A telescopic member (31) has a fixed housing and a telescopic shaft, wherein the telescopic shaft can be extended or shortened along the Z axis in the fixed housing, and the telescopic member (31) passes through the through hole of the connecting assembly (20); a fixing member (32) for fixing the retractable member (31) to the connecting assembly (20); and A release member (33) is fixedly arranged at the end of the telescopic shaft. When the release member (33) contacts the surface to be discharged from static electricity, the telescopic shaft is extended or shortened along the Z axis in the fixed housing to buffer the contact force between the release member (33) and the surface to be discharged from static electricity.

2. The electrostatic discharge device for a metal mask according to claim 1, wherein: The electrostatic discharge device (200) further includes: a grounding component (40) fixedly disposed on the electrostatic discharge component (30), one end of the grounding component (40) being electrically connected to the electrostatic discharge component (30), and one end of the grounding component (40) being electrically connected to the outer shell of the product placement device.

3. The electrostatic discharge device for a metal mask according to claim 2, wherein: The release member (33) comprises a release unit (331), wherein the electrostatic contact surface of the release unit (331) has a plating layer, and the plating layer is a gold plating layer or a rhodium plating layer.

4. The electrostatic discharge device for a metal mask according to claim 3, wherein: The connecting assembly (20) comprises: a first connecting member (21), one end of the first connecting member (21) being fixedly connected to the driving assembly (10); the first connecting member (21) having a bending angle of 90°; a second connecting member (22) fixedly connected to the other end of the first connecting member (21), the second connecting member (22) extending along the Z-axis direction and closer to the surface to be discharged; and A third connecting member (23) is fixedly connected to the second connecting member (22), the third connecting member (23) having a bending angle of 90° and an extension surface in the XY plane; one end of the third connecting member (23) is fixedly connected to the end of the second connecting member (22) extending along the Z axis, and the other end of the third connecting member (23) is fixedly connected to the electrostatic release component (30).

5. The electrostatic discharge device for a metal mask according to claim 4, characterized in that: The third connecting member (23) further comprises a bearing plate (231) extending along the X-axis direction; The carrying plate (231) has a plurality of through holes arranged at intervals, and a release member (33) is arranged in each of the through holes; The release member (33) further comprises: A release assembly (332) is formed by combining a copper block (332-1) and a high-density copper wire (332-2); the size of the release assembly (332) in the Z-axis direction is the same as the size of the release monomer (331) in the Z-axis direction.

6. The electrostatic discharge device for a metal mask according to claim 4, characterized in that: The third connecting member (23) further comprises a bearing plate (231) extending along the X-axis direction; The carrying plate (231) has a plurality of through holes arranged at intervals, and a release member (33) is arranged in each of the through holes; The release member (33) comprises: at least one of said releasing monomers (331); and, a release assembly (332) formed by combining at least one copper block (332-1) and a high-density copper wire (332-2); The contact area between the release monomer (331) and the surface to be released from static electricity is located in the edge area of ​​the product, and the contact area between the release assembly (332) and the surface to be released from static electricity is located in the product pattern area.

7. The electrostatic discharge device for a metal mask according to claim 2, wherein: The connecting assembly (20) comprises: a fourth connecting member (24), one end of the fourth connecting member (24) being fixedly connected to the driving assembly (10); the fourth connecting member (24) having a bending angle of 90°; and a fifth connecting member (25) fixedly connected to the other end of the fourth connecting member (24); The release member (33) comprises: A first release element (34) is fixedly mounted on the fifth connecting member (25); and The second release element (35) is connected to the first release element (34), and the second release element (35) has a third buffer height in the Z-axis direction.

8. The electrostatic discharge device for a metal mask according to claim 7, wherein: The fifth connecting member (25) comprises: A connecting body (251), wherein the connecting body (251) is extended along the X-axis direction; A plurality of connecting posts (252) are integrally formed with the connecting body (251), and each of the connecting posts (252) is fixedly connected to one of the first releasing elements (34).

9. The electrostatic discharge device of the metal mask according to any one of claims 2 to 8, characterized in that: Each of the electrostatic release components (30) is connected to a grounding component (40); The grounding assembly (40) comprises: independent multiple strands of tinned copper braided tape connected to a common grounding busbar.

10. A method for discharging electrostatic charge from a metal mask, characterized in that: The electrostatic discharge device of the metal mask according to any one of claims 1 to 9, wherein the method comprises: S01, driving the electrostatic discharge component (30) to move downward along the Z-axis direction toward the surface of the metal mask product at a first speed, detecting and feeding back the height value of the electrostatic discharge component (30) in real time; when the lower end of the electrostatic discharge component (30) is at a first distance from the surface of the metal mask product, automatically switching to a second speed, the second speed being less than the first speed; S02, detecting the pressure values ​​borne by the electrostatic discharge component (30) at multiple positions, and switching to a pressure closed-loop mode when it is detected that the pressure value at any position reaches a first pressure value; the pressure closed-loop mode includes: setting a target pressure as a standard pressure value, and dynamically adjusting the output force of the drive component (10) in the Z-axis direction to make the pressure values ​​borne by the multiple positions uniform; S03, when the pressure values ​​at multiple locations are uniform, it is determined that the electrostatic discharge component (30) is in stable contact with the surface of the metal mask product, voltage monitoring is performed, and the voltage release strategy is adjusted; S04, continuously monitoring the surface voltage, cumulative release time, and voltage decay slope of the metal mask product, and when any one of the three parameters satisfies a constraint condition, controlling the electrostatic release component (30) to be lifted along the Z axis at a third speed, wherein the third speed is greater than the first speed.

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