Automatic pin ring column cleaning system and process for silicon wafer polishing machine

Abstract

The automatic pin ring column cleaning system comprises a polishing machine body, a cleaning mechanism is arranged on the left side of the inner wall of the polishing machine body, and the cleaning mechanism comprises a cleaning cavity, a protection box, a moving assembly, a cleaning assembly, a scraping assembly and a liquid supply assembly; the cleaning cavity is fixedly connected with the left side of the inner wall of the polishing machine body, the protection box is arranged in the cleaning cavity, the protection box enters and exits from the protection box through the moving assembly, and the cleaning assembly sprays cleaning liquid to the surface of a pin ring column located in the protection box. According to the automatic cleaning system and process for the pin ring column of the silicon wafer polishing machine, the surface of the pin ring column is comprehensively cleaned through cooperation of the cleaning assembly and the scraping assembly, the cleaning assembly sprays cleaning liquid to the surface of the pin ring column, and cleaning is achieved through rotation of a scraping rod; therefore, the polishing effect is prevented from being affected by accumulation of polishing solution residues and silicon chip scraps.

Description

Technical Field

[0001] The invention relates to the technical field of silicon wafer polishing machines, in particular to an automatic cleaning system and process for a pin ring column of a silicon wafer polishing machine. Background Art

[0002] Silicon wafer polishing machines are used to perform high-precision polishing on the surface of silicon wafers during the semiconductor manufacturing process to meet the requirements of surface flatness and cleanliness. However, during long-term operation, the surface of the pin ring column will accumulate polishing liquid residues and silicon wafer debris, affecting the polishing effect.

[0003] Reference patent publication number "CN219925626U" discloses a silicon wafer polishing device, including a body base, with support legs and a top plate provided above the body base, and the top plate is located above the support legs. It also includes: a polishing assembly, located between the body base and the top plate, including a rolling element and a first elastic element, which is driven to move in a vertical direction by a first power source and driven to rotate by a second power source, so as to reduce friction impact when contacting the silicon wafer.

[0004] As shown in the above technology, a pin ring column is provided on the polishing disk. During long-term operation, the surface of the pin ring column will affect the polishing effect due to the accumulation of polishing liquid residues and silicon wafer debris. Therefore, the surface of the pin ring column needs to be cleaned. In the existing technology, cleaning is performed by simple flushing, which causes liquid to splash onto the polishing disk during cleaning, thereby affecting the subsequent silicon wafer polishing process. Summary of the Invention

[0005] In view of the deficiencies in the prior art, the present invention provides an automatic cleaning system and process for the pin ring column of a silicon wafer polishing machine, which solves the problem that the surface of the pin ring column of the existing silicon wafer polishing machine needs to be cleaned after long-term use.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: an automatic cleaning system for a pin ring column of a silicon wafer polishing machine, comprising a polishing machine body, the polishing machine body, a protective box, a moving assembly, a cleaning assembly, a scraping assembly and a liquid supply assembly;

[0007] The cleaning chamber is fixedly connected to the left side of the inner wall of the polishing machine body, the protective box is arranged inside the cleaning chamber, and the protective box is moved in and out of the protective box by a moving component, a cleaning component is provided in the protective door assembly, and the cleaning component sprays cleaning liquid onto the surface of the pin ring column in the protective box, a scraping component is provided on the cleaning assembly, and the scraping component is used to scrape impurities adhering to the surface of the pin ring column, a protective door assembly is provided on the right side of the protective box, and the protective door assembly contacts the pin ring column and automatically opens during the extension process of the cleaning chamber, a collecting component is provided on the left side of the protective door assembly to collect waste liquid and impurities generated by cleaning, and the collecting component is installed with the protective door assembly through the installation component.

[0008] Preferably, the movable assembly includes two front and rear slide rails, and the two slide rails are respectively fixedly connected to the front and back sides of the inner wall of the cleaning chamber. The surfaces of the two slide rails are slidably connected with sliders, and a connecting block is fixedly connected between the opposite sides of the two sliders, and the protective box is fixedly connected to the right sides of the two sliders.

[0009] Preferably, two left and right rotating seats are fixedly connected between the front and back sides of the inner wall of the cleaning chamber, a screw is rotatably connected between the opposite sides of the two rotating seats, a drive motor is fixedly connected to the left side of the left rotating seat, and the output end of the drive motor is fixedly connected to one end of the screw.

[0010] Preferably, the protective door assembly includes a sliding rod, which is fixedly connected to the front and back sides of the inner wall of the protective box. The surface of the sliding rod is slidably connected to two front and rear sliding seats, and one side of the two sliding seats is fixedly connected to the protective door. The surface of the sliding rod located between the inner wall of the protective box and the sliding seat is provided with a reset spring, and the opposite sides of the two protective doors are provided with a first inclined surface.

[0011] Preferably, the cleaning assembly includes a hollow shaft, which rotates with the top of the protective box, and one end of the hollow shaft located inside the protective box is fixedly connected to a cache box, and the bottom of the cache box is provided with a plurality of air outlet holes at equal distances along the circumference, and the air outlet holes are inclined to allow the inclined spray to be sprayed toward the surface of the pin ring column, and the surface of the hollow shaft located above the protective box is fixedly connected to a driven gear, and the top of the inner wall of the protective box is fixedly connected to an input motor, and the output end of the input motor is fixedly connected to a driving gear, and the driving gear is meshed with the driven gear for transmission, and a rotating joint is installed on the hollow shaft, and the liquid supply assembly is fixedly installed on the left side of the polishing machine body, and the water outlet of the liquid supply assembly is connected to the rotating joint through a hose.

[0012] Preferably, the scraping assembly includes a slide plate, which is fixedly connected to the surface of the cache box, and the inner surface of the slide plate is slidably connected to a T-shaped slider, the bottom of the T-shaped slider is fixedly connected to a scraper rod by bolts, the top of the cache box is fixedly connected to an electric push rod, the telescopic end of the electric push rod is fixedly connected to a U-shaped frame, and the U-shaped frame is fixedly connected to the top of the T-shaped slider.

[0013] Preferably, the collecting assembly includes two semicircular collecting boxes in front and back, the right sides of the two semicircular collecting boxes are fixedly connected with connecting rods, the two connecting rods are respectively installed on the left sides of the two protective doors through the mounting assembly, the opposite sides of the two connecting rods are provided with a second inclined surface, the bottoms of the two connecting rods are fixedly connected with a water outlet pipe, and the surface of the water outlet pipe is provided with a drainage hose.

[0014] Preferably, the mounting assembly includes a slide groove on the end surface of the connecting rod, the inner surface of the slide groove is slidably connected to a T-block, two upper and lower limit springs are fixedly connected between the inner wall of the slide groove and the T-block, the bottom of the protective door is provided with a T-slot for cooperating with the T-block, the end surface of the connecting rod is fixedly connected to two upper and lower positioning rods, and a positioning groove for cooperating with the positioning rod is provided on the left side of the sliding seat.

[0015] The present invention also discloses an operating process of an automatic cleaning system for a pin ring column of a silicon wafer polishing machine, which specifically includes the following steps:

[0016] Step 1: Start the drive motor and move the protective box by rotating the screw, so that the pin ring column enters the protective box. While the protective box moves, the buffer box enters above the pin ring column, and the electric push rod is started to make the scraper rod contact the surface of the pin ring column;

[0017] Step 2: Start the liquid supply component to pump the cleaning liquid into the buffer box and spray it onto the surface of the pin ring column. At the same time, start the input motor and rotate the buffer box through the transmission, thereby rotating the scraper rod and scraping and cleaning the surface of the pin ring column.

[0018] Step 3: The cleaning liquid flows through the surface of the pin ring column and enters the two connecting rods and is discharged through the drainage hose. At the same time, the scraped impurities fall into the two connecting rods. After cleaning, the two connecting rods are removed to dump the impurities.

[0019] Beneficial effects

[0020] The present invention provides an automatic cleaning system and process for the pin ring column of a silicon wafer polishing machine. Compared with the prior art, it has the following advantages:

[0021] 1. This automatic cleaning system and process for the pin ring column of a silicon wafer polishing machine comprehensively cleans the pin ring column surface through the cooperation of a cleaning component and a scraping component. The cleaning component sprays cleaning fluid onto the surface of the pin ring column and cleans it through the rotation of a scraper rod, thereby preventing the accumulation of polishing fluid residue and silicon wafer debris that affects the polishing effect.

[0022] 2. The automatic cleaning system and process for the pin ring column of the silicon wafer polishing machine protects the pin ring column during cleaning through the cooperation of the protective box, the moving assembly and the protective door assembly, thereby avoiding the problem of liquid splashing during cleaning.

[0023] 3. The automatic cleaning system and process for the pin ring column of the silicon wafer polishing machine collects the cleaning liquid and impurities through a collection component to prevent the impurities from falling onto the polishing disc. The collection component is installed on the protective door through an installation component, thereby facilitating the processing of the collected impurities and further improving the convenience of using the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the appearance of the present invention;

[0025] Figure 2 A schematic diagram of the cleaning mechanism of the present invention;

[0026] Figure 3 A schematic diagram of the interior of a cleaning chamber according to the present invention;

[0027] Figure 4 is a schematic diagram of the interior of the protective box of the present invention;

[0028] Figure 5 Schematic diagram of the cleaning component and scraping component of the present invention;

[0029] Figure 6 is a schematic diagram of a scraping assembly of the present invention;

[0030] Figure 7 Schematic diagram of the protective door assembly and the collection assembly of the present invention;

[0031] Figure 8 This is an exploded schematic diagram of the protective door, semicircular collection box and installation assembly of the present invention;

[0032] Figure 9 It is an enlarged view of point A of the present invention.

[0033] In the figure: 1. Polishing machine body; 2. Cleaning chamber; 3. Protective box; 4. Moving assembly; 41. Slide rail; 42. Slider; 43. Rotating seat; 44. Screw; 45. Connecting block; 46. Driving motor; 5. Protective door assembly; 51. Slide rod; 52. Sliding seat; 53. Protective door; 54. Return spring; 55. First inclined plane; 6. Cleaning assembly; 61. Hollow shaft; 62. Buffer box; 63. Air outlet; 64. Input motor; 65. Active gear Wheel; 66, driven gear; 67, rotating joint; 7, scraper assembly; 71, slide plate; 72, T-shaped slider; 73, scraper rod; 74, electric push rod; 75, U-shaped frame; 8, collection assembly; 81, semicircular collection box; 82, connecting rod; 83, second inclined plane; 84, water outlet pipe; 85, drain hose; 9, installation assembly; 91, slide; 92, T-block; 93, limit spring; 94, T-slot; 95, positioning rod; 10, liquid supply assembly. DETAILED DESCRIPTION

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0035] See also Figures 1-9 The automatic cleaning system for the pin ring column of the silicon wafer polishing machine provides three technical solutions:

[0036] The first embodiment comprises a polishing machine body 1, a polishing assembly is installed on the top of the polishing machine body 1, and a polishing disc is installed at the bottom of the inner wall, the polishing disc is driven by a driving component, a plurality of pin ring columns are fixedly installed on the top of the polishing disc at equal intervals along the circumference, and a cleaning mechanism is provided on the left side of the inner wall of the polishing machine body 1, the cleaning mechanism comprising a cleaning chamber 2, a protective box 3, a moving assembly 4, a cleaning assembly 6, a scraping assembly 7 and a liquid supply assembly 10;

[0037] The cleaning chamber 2 is fixedly connected to the left side of the inner wall of the polishing machine body 1. The protective box 3 is arranged inside the cleaning chamber 2, and the protective box 3 is moved in and out of the protective box 3 by the moving component 4. The protective door component 5 is provided with a cleaning component 6. The cleaning component 6 sprays the cleaning liquid onto the surface of the pin ring column in the protective box 3. The cleaning component 6 is provided with a scraping component 7, and the scraping component 7 is used to scrape impurities adhering to the surface of the pin ring column. The right side of the protective box 3 is provided with a protective door component 5. During the extension process of the cleaning chamber 2, the protective door component 5 contacts the pin ring column and opens automatically. The left side of the protective door component 5 is provided with a collecting component 8 to collect the waste liquid and impurities generated by cleaning, and the collecting component 8 is installed with the protective door component 5 through the installation component 9.

[0038] The moving assembly 4 includes two front and rear slide rails 41, and the two slide rails 41 are respectively fixedly connected to the front and back sides of the inner wall of the cleaning chamber 2. The surfaces of the two slide rails 41 are slidably connected with sliders 42, and a connecting block 45 is fixedly connected between the opposite sides of the two sliders 42. The protective box 3 is fixedly connected to the right sides of the two sliders 42, and two left and right rotating seats 43 are fixedly connected between the front and back sides of the inner wall of the cleaning chamber 2. A screw rod 44 is rotatably connected between the opposite sides of the two rotating seats 43. The left side of the left rotating seat 43 is fixedly connected to a drive motor 46, and the output end of the drive motor 46 is fixedly connected to one end of the screw rod 44.

[0039] The protective door assembly 5 includes a sliding rod 51, which is fixedly connected to the front and back sides of the inner wall of the protective box 3. The surface of the sliding rod 51 is slidably connected to two front and rear sliding seats 52. One side of the two sliding seats 52 is fixedly connected to a protective door 53. The surface of the sliding rod 51 located between the inner wall of the protective box 3 and the sliding seat 52 is sleeved with a reset spring 54, and the opposite sides of the two protective doors 53 are each provided with a first inclined surface 55.

[0040] The cooperation of the protection box 3, the moving assembly 4 and the protection door assembly 5 allows the pin ring column to be protected during cleaning, thereby avoiding the problem of liquid splashing during cleaning.

[0041] The second embodiment is mainly different from the first embodiment in that: the cleaning component 6 includes a hollow shaft 61, the hollow shaft 61 rotates with the top of the protective box 3, and one end of the hollow shaft 61 inside the protective box 3 is fixedly connected to a cache box 62, and a plurality of air outlet holes 63 are provided at equal distances along the circumference of the bottom of the cache box 62, and the air outlet holes 63 are inclined to allow the inclined spray to be sprayed toward the surface of the pin ring column, the surface of the hollow shaft 61 above the protective box 3 is fixedly connected to a driven gear 66, the top of the inner wall of the protective box 3 is fixedly connected to an input motor 64, and the output end of the input motor 64 is fixedly connected to a driving gear 65, and the driving gear 65 is meshed with the driven gear 66 for transmission, and a rotating joint 67 is installed on the hollow shaft 61, and the liquid supply component 10 is fixedly installed on the left side of the polishing machine body 1, and the water outlet of the liquid supply component 10 is connected to the rotating joint 67 through a hose.

[0042] The scraping assembly 7 includes a slide plate 71, which is fixedly connected to the surface of the cache box 62. The inner surface of the slide plate 71 is slidably connected to a T-shaped slider 72. The bottom of the T-shaped slider 72 is fixedly connected to a scraper rod 73 by bolts. The top of the cache box 62 is fixedly connected to an electric push rod 74. The telescopic end of the electric push rod 74 is fixedly connected to a U-shaped frame 75. The U-shaped frame 75 is fixedly connected to the top of the T-shaped slider 72.

[0043] The cleaning component 6 and the scraping component 7 cooperate to fully clean the surface of the pin ring column. The cleaning component 6 sprays the cleaning liquid onto the surface of the pin ring column and cleans it by rotating the scraper rod 73, thereby avoiding the accumulation of polishing liquid residues and silicon wafer debris affecting the polishing effect.

[0044] The third embodiment is mainly different from the second embodiment in that: the collecting assembly 8 includes two semicircular collecting boxes 81 in front and back, and the right sides of the two semicircular collecting boxes 81 are fixedly connected with connecting rods 82. The two connecting rods 82 are respectively installed on the left sides of the two protective doors 53 through the installation assembly 9. The opposite sides of the two connecting rods 82 are provided with a second inclined surface 83, and the bottoms of the two connecting rods 82 are fixedly connected with a water outlet pipe 84, and the surface of the water outlet pipe 84 is provided with a drainage hose 85.

[0045] The mounting assembly 9 includes a slide groove 91 on the end surface of the connecting rod 82, and a T-block 92 is slidably connected to the inner surface of the slide groove 91. Two upper and lower limit springs 93 are fixedly connected between the inner wall of the slide groove 91 and the T-block 92. A T-slot 94 for cooperating with the T-block 92 is provided at the bottom of the protective door 53, and two upper and lower positioning rods 95 are fixedly connected to the end surface of the connecting rod 82, and a positioning groove for cooperating with the positioning rod 95 is provided on the left side of the sliding seat 52.

[0046] The cleaning liquid and the cleaned impurities are collected by the collecting component 8 to prevent the impurities from falling onto the polishing disc, and the collecting component 8 is installed on the protective door 53 through the installing component 9, so as to facilitate the processing of the collected impurities and further improve the convenience of using the device.

[0047] The present invention also discloses an operating process of an automatic cleaning system for a pin ring column of a silicon wafer polishing machine, which specifically includes the following steps:

[0048] Step 1: When the pin ring column needs to be cleaned, the polishing disc rotates so that the pin ring column is aligned with the right side of the cleaning mechanism. At this time, the drive motor 46 is started, and the drive motor 46 rotates and drives the screw rod 44 to rotate. The rotation of the screw rod 44 causes the connecting block 45 to move. The connecting block 45 moves and drives the protective box 3 to move through the two sliders 42. During the movement of the protective box 3, the first inclined surfaces 55 on the two protective doors 53 contact the pin ring column, and the two protective doors 53 are pushed away from each other. As the protective box 3 moves, the pin ring column enters between the two connecting rods 82. At this time, the pin ring column is just below the buffer box 62, and the electric push rod 74 is started to make the scraper rod 73 contact the surface of the pin ring column;

[0049] Step 2: Start the liquid supply assembly 10 to pump the cleaning liquid into the buffer box 62 and spray it onto the surface of the pin ring column. At the same time, start the input motor 64. The input motor 64 drives the driving gear 65 to rotate. The driving gear 65 rotates and transmits the power to the driven gear 66. The driven gear 66 rotates to rotate the buffer box 62. The rotation of the buffer box 62 drives the scraper 73 to rotate along the surface of the pin ring column, thereby causing the scraper 73 to rotate and scrape and clean the surface of the pin ring column.

[0050] Step 3: The cleaning liquid flows through the surface of the pin ring column and enters the two connecting rods 82, and is discharged through the drainage hose 85. At the same time, the scraped impurities fall into the two connecting rods 82. After the cleaning is completed, the two connecting rods 82 are removed to dump the impurities. The connecting rods 82 are removed so that the positioning rod 95 comes out of the positioning groove by pulling the connecting rod 82 outward. At this time, the connecting rod 82 can be taken out by moving it downward.

[0051] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0052] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. An automatic cleaning system for a pin ring column of a silicon wafer polishing machine, comprising a polishing machine body (1), characterized in that: A cleaning mechanism is provided on the left side of the inner wall of the polishing machine body (1), and the cleaning mechanism comprises a cleaning chamber (2), a protective box (3), a moving component (4), a cleaning component (6), a scraping component (7) and a liquid supply component (10); The cleaning chamber (2) is fixedly connected to the left side of the inner wall of the polishing machine body (1); the protective box (3) is arranged inside the cleaning chamber (2), and the protective box (3) is moved in and out of the protective box (3) by means of a moving assembly (4); a cleaning assembly (6) is arranged in the protective door assembly (5); the cleaning assembly (6) sprays cleaning liquid onto the surface of the pin ring column in the protective box (3); a scraping assembly (7) is arranged on the cleaning assembly (6), and the scraping assembly (7) is used to scrape impurities adhering to the surface of the pin ring column; a protective door assembly (5) is arranged on the right side of the protective box (3); during the extension process of the cleaning chamber (2), the protective door assembly (5) contacts the pin ring column and automatically opens; a collecting assembly (8) is arranged on the left side of the protective door assembly (5) to collect waste liquid and impurities generated by cleaning, and the collecting assembly (8) is installed with the protective door assembly (5) through the installation assembly (9).

2. The automatic cleaning system for the pin ring column of a silicon wafer polishing machine according to claim 1, characterized in that: The moving assembly (4) includes two front and rear slide rails (41), the two slide rails (41) are fixedly connected to the front and back of the inner wall of the cleaning chamber (2), respectively, the surfaces of the two slide rails (41) are slidably connected to sliders (42), and a connecting block (45) is fixedly connected between the opposite sides of the two sliders (42), and the protective box (3) is fixedly connected to the right sides of the two sliders (42).

3. The automatic cleaning system for the pin ring column of a silicon wafer polishing machine according to claim 2, characterized in that: Two left and right rotating seats (43) are fixedly connected between the front and back sides of the inner wall of the cleaning chamber (2); a screw rod (44) is rotatably connected between the opposite sides of the two rotating seats (43); a driving motor (46) is fixedly connected to the left side of the left rotating seat (43), and the output end of the driving motor (46) is fixedly connected to one end of the screw rod (44).

4. The automatic cleaning system for the pin ring column of a silicon wafer polishing machine according to claim 1, characterized in that: The protective door assembly (5) includes a slide bar (51) which is connected to the protective box (3) The front and back sides of the inner wall are fixedly connected, the surface of the slide rod (51) is slidably connected to two front and rear sliding seats (52), one side of the two sliding seats (52) is fixedly connected to a protective door (53), the surface of the slide rod (51) located between the inner wall of the protective box (3) and the sliding seat (52) is sleeved with a return spring (54), and the opposite side of the two protective doors (53) is provided with a first inclined surface (55).

5. The automatic cleaning system for the pin ring column of a silicon wafer polishing machine according to claim 1, characterized in that: The cleaning assembly (6) includes a hollow shaft (61), the hollow shaft (61) rotates with the top of the protective box (3), one end of the hollow shaft (61) located inside the protective box (3) is fixedly connected to a buffer box (62), the bottom of the buffer box (62) is provided with a plurality of air outlet holes (63) at equal distances along the circumference, and the air outlet holes (63) are inclined to allow the air to be sprayed obliquely toward the surface of the pin ring column, and the surface of the hollow shaft (61) located above the protective box (3) is fixedly connected to a driven gear ( 66), the top of the inner wall of the protection box (3) is fixedly connected to an input motor (64), the output end of the input motor (64) is fixedly connected to a driving gear (65), the driving gear (65) and the driven gear (66) are meshed and transmitted, a rotating joint (67) is installed on the hollow shaft (61), the liquid supply component (10) is fixedly installed on the left side of the polishing machine body (1), and the water outlet of the liquid supply component (10) is connected to the rotating joint (67) through a hose.

6. The automatic cleaning system for the pin ring column of a silicon wafer polishing machine according to claim 1, characterized in that: The collecting assembly (8) comprises two front and rear semicircular collecting boxes (81), the right sides of the two semicircular collecting boxes (81) are fixedly connected with connecting rods (82), the two connecting rods (82) are respectively installed with the left sides of the two protective doors (53) through the mounting assembly (9), the opposite sides of the two connecting rods (82) are provided with a second inclined surface (83), the bottoms of the two connecting rods (82) are fixedly connected with a water outlet pipe (84), and the surface of the water outlet pipe (84) is provided with a drainage hose (85).

7. The automatic cleaning system for the pin ring column of a silicon wafer polishing machine according to claim 6, characterized in that: The mounting assembly (9) includes a slide groove (91) on the end surface of the connecting rod (82), the inner surface of the slide groove (91) is slidably connected to a T-block (92), and two upper and lower limit springs (93) are fixedly connected between the inner wall of the slide groove (91) and the T-block (92). The bottom of the protective door (53) is provided with a T-slot (94) for cooperating with the T-block (92), the end surface of the connecting rod (82) is fixedly connected to two upper and lower positioning rods (95), and the left side of the sliding seat (52) is provided with a positioning groove for cooperating with the positioning rod (95).

8. The operating process of the automatic cleaning system for the pin ring column of a silicon wafer polishing machine according to any one of claims 1 to 7, characterized in that: The specific steps include: Step 1: Start the driving motor (46) and rotate the screw rod (44) to move the protection box (3), so that the pin ring column enters the protection box (3), and at the same time as the protection box (3) moves, the buffer box (62) enters above the pin ring column, and starts the electric push rod (74) to make the scraper rod (73) contact the surface of the pin ring column; Step 2: Start the liquid supply assembly (10) to pump the cleaning liquid into the buffer box (62) and spray it onto the surface of the pin ring column. At the same time, start the input motor (64) and rotate the buffer box (62) through the transmission, thereby rotating the scraper (73) and scraping and cleaning the surface of the pin ring column. Step 3: The cleaning liquid flows through the surface of the pin ring column and enters the two connecting rods (82) and is discharged through the drainage hose (85). At the same time, the scraped impurities fall into the two connecting rods (82). After the cleaning is completed, the two connecting rods (82) are removed to dump the impurities.

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