Detection method and detection device for non-airtight stacked package device, and processor

Abstract

The invention provides a non-airtight stacked packaging device detection method, a detection device and a processor, and the method comprises the steps: starting first detection equipment to carry out the detection processing of a to-be-detected stacked packaging device in a test box under the condition that the test box meets a first preset condition, and the detection processing comprises the steps: carrying out the multiple adjustment of the temperature of the test box, parameter detection is carried out on the to-be-detected stacked packaging device in the adjusting process to obtain electrical data; controlling the first detection equipment to circularly detect the to-be-detected stacked packaging device for multiple times until a second preset condition is met, judging whether the integrity of packaging metal of the to-be-detected stacked packaging device meets target integrity or not under the condition that the second preset condition comprises that the cycle index meets the preset number of times, and if yes, detecting the to-be-detected stacked packaging device according to the target integrity. And under the condition that the judgment result is yes, determining that the to-be-detected stacked packaging device is qualified, thereby solving the problem that the reliability of the stacked packaging device is difficult to detect in the prior art.

Description

Technical Field

[0001] The present application relates to the field of device detection technology, and in particular to a method for detecting non-airtight stacked packaged devices, a detection device for non-airtight stacked packaged devices, a computer-readable storage medium, a processor, and an electronic device. Background Art

[0002] Silicon-based stacking technology involves interconnecting and stacking multiple silicon substrates using micro-bumps to create chip packaging. It offers numerous advantages, including high precision, high integration, and low cost, and is gaining increasing application in high-performance packaging and integration applications, such as satellites. After two silicon substrates are soldered together using bumps, a gap of 1 to 5 μm exists between the two layers outside the bumps. This gap makes the silicon-based stacking package non-hermetic. During production, transportation, and installation, moisture from the external atmosphere can gradually penetrate the device through the gap, causing electrochemical corrosion of the internal chips, bonding wires, and adhesives, leading to performance degradation or even failure. Because silicon-based stacking packaged devices are non-hermetic, they cannot be subjected to detailed and coarse seal inspections similar to those for sealed devices according to GJB548C Method 1014 (the test method documented in "Test Methods and Procedures for Microelectronic Devices"). Consequently, there is no test method to verify the resistance of these packages to atmospheric moisture corrosion, posing a significant risk to the reliability of these devices. Summary of the Invention

[0003] The main purpose of this application is to provide a method for detecting non-airtight stacked packaging devices, a detection device for non-airtight stacked packaging devices, a computer-readable storage medium, a processor and an electronic device, so as to at least solve the problem in the prior art that it is difficult to perform reliability detection on stacked packaging devices.

[0004] To achieve the above objectives, according to one aspect of the present application, a method for testing non-airtight stacked packaged devices is provided, comprising: when a test chamber satisfies a first preset condition, activating a first testing device to perform testing on the stacked packaged device to be tested in the test chamber, the first preset condition comprising: a temperature in the test chamber being a first temperature, a ventilation volume per unit time of the test chamber being greater than or equal to a first threshold, and a relative humidity of air in the test chamber being greater than or equal to a second threshold, the first temperature being the maximum storage temperature of the stacked packaged device to be tested; the testing process comprising: adjusting the temperature of the test chamber multiple times, and performing parameter testing on the stacked packaged device to be tested during the adjustment process to obtain electrical data; controlling the first testing device to perform the testing process on the stacked packaged device to be tested for multiple cycles until a second preset condition is satisfied, the second preset condition comprising at least one of the following: the electrical data not meeting a target range, and the number of testing cycle times meeting a preset number; if the second preset condition comprises the number of cycles meeting the preset number, determining whether the integrity of the package metal of the stacked packaged device to be tested meets a target integrity, and if the determination result is yes, determining that the stacked packaged device to be tested is qualified.

[0005] Optionally, the detection method also includes: controlling the test chamber to pre-treat the stacked package device to be tested, and the pre-treatment is used to evaporate the water vapor adsorbed by the stacked package device to be tested, including: adjusting the temperature of the test chamber from room temperature to the first temperature at a first temperature change rate, and maintaining the temperature of the test chamber at the first temperature within a target time period.

[0006] Optionally, the temperature of the test chamber is adjusted multiple times, and during the adjustment process, parameter detection is performed on the stacked package device to be tested, including: adjusting the temperature of the test chamber from the first temperature to the second temperature, the second temperature being the minimum storage temperature of the stacked package device to be tested; after a first time period, adjusting the temperature of the test chamber from the second temperature to a third temperature, and controlling the first detection device to apply voltage to the stacked package device to be tested, and performing parameter detection on the stacked package device to be tested after a second time period, the third temperature being the minimum operating temperature of the stacked package device to be tested; adjusting the temperature of the test chamber from the third temperature to the second temperature, and controlling the first detection device to perform parameter detection on the stacked package device to be tested after a fourth time period; adjusting the temperature of the test chamber from the second temperature to the first temperature, and controlling the first detection device to perform parameter detection on the stacked package device to be tested, and after a fifth time period, adjusting the temperature of the test chamber from the first temperature to room temperature, and controlling the first detection device to perform parameter detection on the stacked package device to be tested.

[0007] Optionally, the detection method further includes: controlling the first detection device to cyclically perform the detection processing on the stacked package device to be tested for the preset number of times, and in the case that any detection processing before the last detection processing is interrupted, re-performing the detection processing on the stacked package device to be tested; in the case that the last detection processing is interrupted, re-performing the detection processing on the stacked package device to be tested twice in a row, and the number of cycles of the detection processing is the preset number plus 1.

[0008] Optionally, the judging whether the integrity of the package metal of the stacked package device to be tested meets the target integrity includes: controlling a second detection device to detect the corrosion area of ​​the package metal of the stacked package device to be tested to obtain the integrity of the package metal of the stacked package device to be tested; judging whether the corrosion area is less than or equal to a third threshold value to obtain a first judgment result, wherein, if the first judgment result indicates yes, it is determined that the stacked package device to be tested is qualified.

[0009] Optionally, the detection method also includes: obtaining the average temperature acceleration factor and the average humidity acceleration factor in the test chamber in the preset number of detection processes; detecting the life of the stacked package device to be tested based on the average temperature acceleration factor and the average humidity acceleration factor of the stacked package device to be tested, and obtaining the life span of the stacked package device to be tested.

[0010] Optionally, obtaining the average temperature acceleration factor and the average humidity acceleration factor in the test chamber in the preset number of detection processes includes: determining the average temperature acceleration factor in the preset number of detection processes based on the gas constant, the Arrhenius model, the thermodynamic temperature and the activation energy of the chemical reaction occurring in each of the detection processes; and determining the average humidity acceleration factor in the preset number of detection processes based on the temperature-humidity acceleration test model, the relative humidity when the test chamber has the highest temperature, the relative humidity when the test chamber has the lowest temperature, and the humidity index.

[0011] According to another aspect of the present application, a detection device for non-airtight stacked packaged devices is provided, comprising: a starting module for starting a first detection device to perform detection processing on the stacked packaged device to be tested in the test box when the test box meets a first preset condition, the first preset condition comprising: the temperature in the test box is a first temperature, the ventilation volume per unit time of the test box is greater than or equal to a first threshold value, and the relative humidity of the air in the test box is greater than or equal to a second threshold value, the first temperature is the maximum storage temperature of the stacked packaged device to be tested, the detection processing comprising: adjusting the temperature of the test box multiple times, and adjusting the temperature of the test box during the adjustment process. The stacked package device to be tested is subjected to parameter detection to obtain electrical data; a control module is used to control the first detection device to perform the detection process on the stacked package device to be tested for multiple cycles until a second preset condition is met and the test stops, the second preset condition including at least one of the following: the electrical data does not meet the target range, and the number of cycles of the detection process meets the preset number; a determination module is used to judge whether the integrity of the packaging metal of the stacked package device to be tested meets the target integrity when the second preset condition includes the number of cycles meeting the preset number, and to determine that the stacked package device to be tested is qualified if the judgment result is yes.

[0012] According to another aspect of the present application, a computer-readable storage medium is provided, which includes a stored program, wherein when the program is run, the device where the computer-readable storage medium is located is controlled to execute the method for detecting non-airtight stacked packaging devices.

[0013] According to another aspect of the present application, a processor is provided, which is configured to run a program, wherein the program executes the method for detecting a non-airtight stacked package device when running.

[0014] By applying the technical solution of the present application, first, when the test chamber meets the first preset condition, the first detection device is started to detect and process the stacked packaged device to be tested in the test chamber. The first preset condition includes: the temperature in the test chamber is a first temperature, the ventilation volume of the test chamber per unit time is greater than or equal to a first threshold, and the relative humidity of the air in the test chamber is greater than or equal to a second threshold. The first temperature is the maximum storage temperature of the stacked packaged device to be tested. This can simulate the use of the device in an extreme atmospheric environment. The high temperature and high humidity environment can accelerate the process of water vapor penetration and metal corrosion, which helps the penetration and condensation of water vapor inside the device, so that its ability to resist water vapor corrosion can be clearly detected in a short time. The testing process includes: adjusting the temperature of the test chamber multiple times, and performing parameter testing on the stacked packaged device to obtain electrical data during the adjustment process; controlling the first testing device to perform multiple cycles of testing on the stacked packaged device to be tested, and stopping when a second preset condition is met, the second preset condition including at least one of the following: the electrical data does not meet the target range, and the number of test processing cycles meets the preset number; if the second preset condition includes the number of cycles meeting the preset number, determining whether the integrity of the package metal of the stacked packaged device to be tested meets the target integrity, and if the judgment result is yes, determining that the stacked packaged device to be tested is qualified. By setting specific test chamber environmental parameters, including temperature, humidity, and air exchange rate, the device's use in extreme atmospheric environments is simulated to test its resistance to water vapor corrosion. The above-mentioned detection method can simulate the storage of devices in atmospheric water vapor in a short period of time. The corrosion process can be accelerated during this simulation process. By repeatedly detecting the electrical parameters of the device in the cyclic detection process, it is possible to promptly detect whether the device has been corroded by water vapor. According to the set qualification standards and test results, an accurate assessment can be made of whether the device can maintain good performance and reliability under simulated harsh environmental conditions, thereby solving the technical problem of difficulty in performing reliability testing on stacked packaged devices in the existing technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The drawings that constitute part of this application are used to provide a further understanding of this application. The illustrative embodiments of this application and their descriptions are used to explain this application and do not constitute an improper limitation on this application. In the drawings:

[0016] Figure 1 A hardware structure block diagram of a mobile terminal for performing a method for detecting a non-airtight stacked package device provided in an embodiment of the present application is shown;

[0017] Figure 2 A schematic flow chart of a method for detecting a non-airtight stacked package device provided in accordance with an embodiment of the present application is shown;

[0018] Figure 3A schematic flow chart of another method for detecting a non-airtight stacked package device provided according to an embodiment of the present application is shown;

[0019] Figure 4 A structural block diagram of a detection device for a non-airtight stack package device provided according to an embodiment of the present application is shown.

[0020] The above drawings include the following reference numerals:

[0021] 102. Processor; 104. Memory; 106. Transmission device; 108. Input / output device. DETAILED DESCRIPTION

[0022] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0023] In order to enable those skilled in the art to better understand the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of this application.

[0024] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present application described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0025] As introduced in the background technology, the silicon-based stacked packaging devices in the prior art are non-hermetic packages, and cannot be subjected to detailed and rough sealing inspections according to GJB548C method 1014 as referenced by sealed devices. Therefore, there is no test method to verify the ability of such packaging devices to resist atmospheric water vapor corrosion, resulting in a greater risk to the reliability of the use of silicon-based stacked packaging devices. In order to solve the problem in the prior art that it is difficult to perform reliability testing on stacked packaging devices, the embodiments of the present application provide a detection method for a stacked packaging device, a detection device for a stacked packaging device, a computer-readable storage medium, a processor and an electronic device.

[0026] The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present invention.

[0027] The method embodiments provided in the embodiments of the present application can be executed in a mobile terminal, a computer terminal or a similar computing device. Taking running on a mobile terminal as an example, Figure 1 FIG. 1 is a hardware structure block diagram of a mobile terminal for detecting a non-airtight stacked package device according to an embodiment of the present invention. Figure 1 As shown, the mobile terminal may include one or more ( Figure 1 Only one is shown) a processor 102 (the processor 102 may include but is not limited to a microprocessor MCU or a programmable logic device FPGA and other processing devices) and a memory 104 for storing data, wherein the mobile terminal may also include a transmission device 106 and an input and output device 108 for communication functions. It will be understood by those skilled in the art that Figure 1 The structure shown is only for illustration and does not limit the structure of the mobile terminal. Figure 1 More or fewer components than shown, or with Figure 1 Different configurations shown.

[0028] The memory 104 can be used to store computer programs, such as software programs and modules of application software, such as the computer program corresponding to the detection method of non-hermetic stacked package devices in the embodiment of the present invention. The processor 102 executes various functional applications and data processing by running the computer program stored in the memory 104, that is, implementing the above-mentioned method. The memory 104 may include high-speed random access memory and may also include non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some examples, the memory 104 may further include a memory remotely located relative to the processor 102, and these remote memories can be connected to the mobile terminal via a network. Examples of the above-mentioned networks include but are not limited to the Internet, corporate intranets, local area networks, mobile communication networks, and combinations thereof. The transmission device 106 is used to receive or send data via a network. Specific examples of the above-mentioned network may include a wireless network provided by the mobile terminal's communication provider. In one example, the transmission device 106 includes a network interface controller (NIC), which can be connected to other network devices via a base station to communicate with the Internet. In one example, the transmission device 106 may be a radio frequency (RF) module, which is used to communicate with the Internet wirelessly.

[0029] In this embodiment, a method for detecting non-airtight stacked packaged devices running on a mobile terminal, a computer terminal or a similar computing device is provided. It should be noted that the steps shown in the flowchart of the accompanying drawings can be executed in a computer system such as a set of computer-executable instructions, and although a logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in an order different from that shown here.

[0030] Figure 2 FIG. 1 is a flow chart of a method for detecting a non-airtight stacked package device according to an embodiment of the present application. Figure 2 As shown, the method includes the following steps:

[0031] Step S1: activating a first detection device to perform detection processing on the stacked packaged device to be tested in the test chamber when the test chamber meets a first preset condition. The first preset condition includes: the temperature in the test chamber is a first temperature, the ventilation volume per unit time of the test chamber is greater than or equal to a first threshold, and the relative humidity of the air in the test chamber is greater than or equal to a second threshold. The first temperature is the maximum storage temperature of the stacked packaged device to be tested. The detection processing includes: adjusting the temperature of the test chamber multiple times, and performing parameter detection on the stacked packaged device to be tested to obtain electrical data during the adjustment process.

[0032] Specifically, during the testing process, multiple stacked packaged devices to be tested can be tested simultaneously. The non-hermetic silicon-based stacked packaged devices to be tested are placed in a test chamber with controlled environmental parameters. The temperature within the test chamber is maintained at a first temperature, the device's maximum storage temperature (e.g., 125°C). This is to simulate the storage and operating conditions of the devices in an extremely high-temperature environment. Furthermore, the air exchange rate within the test chamber per unit time is greater than or equal to a first threshold, which can be per minute. The first threshold can be five times the chamber's volume. This means that the chamber replaces at least five times its own volume of air per minute. This ensures that ambient gas components (e.g., water vapor) can fully contact the devices, simulating the gas exchange in a real atmospheric environment. Finally, the relative humidity within the test chamber must be maintained above a second threshold (e.g., 80%) to provide a sufficient water vapor source and promote potential corrosion reactions. Both the first and second thresholds were determined during the refinement of the testing method of this application, resulting in more accurate test results. The device's maximum storage temperature varies depending on the type of storage chamber and is not specifically limited.

[0033] Specifically, during the testing process, the temperature of the test chamber is periodically adjusted from high to low and back again. During this temperature change, the device's electrical parameters, such as current, voltage, resistance, and leakage, are repeatedly tested. The parameters are selected based on the device's characteristics and are not specifically limited. This step helps observe and record changes in the device's electrical performance under temperature fluctuations. In particular, when the ambient temperature drops from high to low, moisture in the test chamber condenses on the device surface and may penetrate into the device. Changes in electrical parameters at this time can indicate the device's resistance to water vapor corrosion.

[0034] Step S2, controlling the first testing device to perform a multiple-cycle testing process on the package-on-package device to be tested, and stopping when a second preset condition is met, the second preset condition including at least one of the following: the electrical data does not meet the target range, and the number of testing process cycles meets a preset number;

[0035] Specifically, the test equipment should perform multiple continuous cycles of detection processing on the device, and each cycle at least includes a temperature change process from room temperature to the lowest and then to the highest, accompanied by parameter detection. The detection process will continue until the second preset condition is met, that is, when the detected electrical data significantly deviates from the target performance range, or the predetermined number of detection cycles is completed. Among them, the detected electrical data significantly deviates from the target performance range, indicating that the device has been corroded by water vapor and cannot work normally, and no subsequent detection processing can be performed on it. In this way, the time when the device is damaged can be judged more accurately, and the packaging of the device can be strengthened or other aspects can be improved in a targeted manner to improve the reliability of the device; the completion of the predetermined number of detection cycles indicates that the device maintains good performance throughout the entire cyclic detection process, and the inside of the device is not corroded by water vapor. The design of this cyclic test simulates the temperature and humidity fluctuations that devices often encounter in real working environments, and can more accurately evaluate their corrosion resistance. In the process of improving the detection method of the present application, it was confirmed that the above-mentioned predetermined number of detection cycles can be about 16.

[0036] Step S3, when the second preset condition includes the number of cycles meeting the preset number, judging whether the integrity of the package metal of the stacked package device to be tested meets the target integrity, and if the judgment result is yes, determining that the stacked package device to be tested is qualified.

[0037] Specifically, after completing all predetermined cycles of testing, indicating that the remaining device interior is free of water vapor corrosion, further inspection of the device's metal package integrity is required, specifically for visible signs of corrosion or damage to the metal layer. Only if the metal package integrity also meets specific target standards is the device considered to have withstood the accelerated corrosion test and thus qualified. This inspection can be accomplished through specific electrical tests.

[0038] Through this embodiment, first, when the test chamber meets the first preset condition, the first detection device is started to detect and process the stacked packaged device to be tested in the test chamber. The first preset condition includes: the temperature in the test chamber is a first temperature, the ventilation volume of the test chamber per unit time is greater than or equal to a first threshold, and the relative humidity of the air in the test chamber is greater than or equal to a second threshold. The first temperature is the maximum storage temperature of the stacked packaged device to be tested. This can simulate the use of the device in an extreme atmospheric environment. The high temperature and high humidity environment can accelerate the process of water vapor penetration and metal corrosion, which helps the penetration and condensation of water vapor inside the device, so that its ability to resist water vapor corrosion can be clearly tested in a short time. The testing process includes: adjusting the temperature of the test chamber multiple times, and performing parameter testing on the stacked packaged device to obtain electrical data during the adjustment process; controlling the first testing device to perform multiple cycles of testing on the stacked packaged device to be tested, and stopping when a second preset condition is met, the second preset condition including at least one of the following: the electrical data does not meet the target range, and the number of test processing cycles meets the preset number; if the second preset condition includes the number of cycles meeting the preset number, determining whether the integrity of the package metal of the stacked packaged device to be tested meets the target integrity, and if the judgment result is yes, determining that the stacked packaged device to be tested is qualified. By setting specific test chamber environmental parameters, including temperature, humidity, and air exchange rate, the device's use in extreme atmospheric environments is simulated to test its resistance to water vapor corrosion. The above-mentioned detection method can simulate the storage of devices in atmospheric water vapor in a short period of time. The corrosion process can be accelerated during this simulation process. By repeatedly detecting the electrical parameters of the device in the cyclic detection process, it is possible to promptly detect whether the device has been corroded by water vapor. According to the set qualification standards and test results, an accurate assessment can be made of whether the device can maintain good performance and reliability under simulated harsh environmental conditions, thereby solving the technical problem of difficulty in performing reliability testing on stacked packaged devices in the existing technology.

[0039] During the specific implementation process, other steps may be performed before the above-mentioned step S1, and the detection method also includes: controlling the test chamber to pre-treat the stacked package device to be tested, and the pre-treatment is used to evaporate the water vapor adsorbed by the stacked package device to be tested, including: adjusting the temperature of the test chamber from room temperature to a first temperature at a first temperature change rate, and maintaining the temperature of the test chamber at the first temperature within the target time period.

[0040] In the above embodiment, if Figure 3As shown, the stacked packaged devices to be tested undergo electrical testing in advance to ensure that their functionality and performance meet standards. The pretreatment process involves baking the stacked packaged devices in a test chamber. The temperature in the AB section is gradually increased from room temperature to T0 at a rate of no more than 10°C / min, allowing any moisture adsorbed inside and outside the device to fully vaporize and be expelled. T0 is the device's maximum storage temperature (125°C for military components, for example). The BC section bakes for no less than 24 hours, and the device is not powered during the baking process. This pretreatment effectively removes moisture adsorbed inside and outside the device, preventing it from affecting subsequent test results. It also ensures that the device is dry at the start of the test, resulting in more accurate test results that truly reflect the device's corrosion resistance in a water vapor environment.

[0041] In the above step S2 of the present application, the temperature of the test box is adjusted multiple times, and during the adjustment process, the parameters of the stacked package device to be tested are tested, such as Figure 3 Shown, including:

[0042] In step S21, the test chamber temperature is adjusted from a first temperature to a second temperature, which is the minimum storage temperature of the stacked package device under test. This section, called the high-temperature cooling stage (CD), involves decreasing the temperature from the first temperature T0 to the second temperature T1 at a ramp rate of 100°C / min. This allows ambient water vapor to condense on the device surface and penetrate into the device through the gap between the two silicon substrates. T1 is the device's minimum storage temperature (e.g., -55°C for military components). The test chamber is then maintained at a low temperature (DE), maintaining the temperature at T1 for 0.5 hours to allow the internal and external temperatures of the device to reach equilibrium and remain stable. This rapid temperature change simulates the environmental changes that the device may encounter in actual use, enabling comprehensive testing of the device's electrical performance at different temperatures and better verifying its stability in a water vapor corrosion environment.

[0043] In step S22, after the first time period (the aforementioned 0.5 hour), the temperature of the test chamber is adjusted from the second temperature to the third temperature, and the first detection device is controlled to apply voltage to the stacked package device to be tested. After the second time period, parameter detection is performed on the stacked package device to be tested, and the third temperature is the minimum operating temperature of the stacked package device to be tested. This step is a low-temperature heating step (EF segment), and the temperature is gradually increased from the second temperature T1 to the third temperature T2 at a temperature change rate of 3-5°C / min, where T2 is the minimum operating temperature of the device (such as -45°C for military components). Then, low-temperature insulation is performed, and the stacked package device to be tested is maintained at temperature T2 for 0.5 hour to allow the water vapor inside the device to diffuse evenly. The device is then powered on and tested from point F to verify whether the device function and performance are qualified.

[0044] The above-mentioned power-on test can be to apply a bias voltage to the device. In order to improve the test effect, the selected bias condition should utilize as many leads as possible to maximize the potential difference between the metallized lines (conductor circuits) in the device or between the external leads, so as to minimize power consumption.

[0045] In step S23, the temperature of the test chamber is adjusted from the third temperature to the second temperature, and the first detection device is controlled to perform parameter detection on the stacked package device to be tested after the fourth time period; low-temperature cooling (GH section) is performed to gradually cool the test chamber temperature from the third temperature T2 to the second temperature T1 at a temperature change rate of 3-5°C / min, while the device remains powered on, to verify whether the device function and performance are qualified; and low-temperature insulation (HI section) is performed to continuously test the stacked package device to be tested at the temperature T1 for 0.5h, so that the water vapor inside the device is balanced and reaches the maximum value, while the device remains powered on, to verify whether the device function and performance are qualified.

[0046] In step S24, the test chamber temperature is adjusted from the second temperature to the first temperature, and the first testing device is controlled to perform parameter testing on the stacked packaged device under test. After the fifth time period, the test chamber temperature is adjusted from the first temperature to room temperature, and the first testing device is controlled to perform parameter testing on the stacked packaged device under test. This step involves a low-temperature ramp (IJ segment), where the temperature is increased from the second temperature T1 to the first temperature T0 at a ramp rate of 100°C / min, with the device remaining powered on, to verify the device's functionality and performance. A high-temperature hold (JK segment) is then performed, where the stacked packaged device under test is held at T0 for a fifth time period (1 hour), with the device remaining powered on, to verify its functionality and performance. A high-temperature ramp (KL segment) is then performed, where the test chamber temperature is lowered from the first temperature T0 to room temperature at a ramp rate of 100°C / min, with the device remaining powered on, to verify its functionality and performance. The rapid temperature changes and power-on testing at high and low temperatures described above simulate the environmental changes that the device may encounter in actual use, accelerate the corrosion process, and enable comprehensive testing of the device's electrical performance at different temperatures, thereby better verifying the device's stability in a water vapor corrosion environment.

[0047] So far, the first cycle detection process is completed. Figure 3 As shown, the subsequent 2nd to Nth cycles start from point L (the device always remains powered on) and cycle steps S21 to S24 until all cycle tests are completed. The difference between step S21 in the 2nd to Nth cycles and the first cycle is that in the high-temperature cooling stage, the temperature is reduced from room temperature to the second temperature T1 at a temperature ramp rate of 100°C / min.

[0048] By simulating the device's operating and storage conditions in high and low temperature environments during the cyclic testing process, the corrosion process caused by water vapor penetration is accelerated, allowing for the observation of corrosion that may occur under long-term use within a limited timeframe. Continuously applying voltage to monitor parameters during the cyclic testing process ensures continuity in the test, thereby improving the reliability of the assessment.

[0049] During the process of multiple cycles of detection and processing, unexpected test interruptions (such as power outages or equipment failures) may occur. In order to maintain a high accuracy of the detection method after the interruption, in some optional implementations, the detection method also includes: controlling the first detection device to perform a preset number of detection and processing cycles on the stacked package device to be tested, and in the event that any detection and processing before the last detection and processing is interrupted, re-performing an inspection and processing on the stacked package device to be tested; this can ensure the continuity of the detection and processing, and even if an interruption occurs, the integrity of the test can be maintained by supplementing the cycle, so that the final monitoring data is valid.

[0050] If the last test cycle is interrupted, the stacked package device under test will be retested twice, with the number of test cycles equal to the preset number plus one. If an interruption occurs during the last cycle, in addition to re-running that cycle, a second uninterrupted cycle should be performed to maintain test integrity. Any intentional or accidental interruptions exceeding 24 hours during this cycle will require a complete retest.

[0051] The above detection method can also detect the device for a preset number of times and then detect the electrical parameters of the device. The processing of interruptions in this process is shown above.

[0052] In some optional embodiments, determining whether the integrity of the package metal of the stacked package device to be tested meets the target integrity includes: controlling a second detection device to detect the corrosion area of ​​the package metal of the stacked package device to be tested to obtain the integrity of the package metal of the stacked package device to be tested; determining whether the corrosion area is less than or equal to a third threshold value to obtain a first judgment result, wherein if the first judgment result indicates yes, the stacked package device to be tested is determined to be qualified. Based on the final detection result, it is determined whether the area of ​​corrosion of the plating or base metal of any packaging part of the device is ≤ the third threshold value (5%), and all electrical characteristics and parameter tests of the device are qualified. By using both the electrical characteristics (internal) and the corrosion area (external) of the device as judgment criteria, the water vapor protection capability of the non-hermetic package can be accurately evaluated. The above-mentioned third threshold value is an empirically derived qualification standard and provides a clear evaluation basis for the reliability of the device.

[0053] In some optional embodiments, the testing method further includes: obtaining an average temperature acceleration factor and an average humidity acceleration factor in the test chamber during a predetermined number of testing processes; and testing the lifespan of the stacked packaged device under test based on the average temperature acceleration factor and the average humidity acceleration factor, thereby obtaining a lifespan of the stacked packaged device under test. By using the acceleration factors to convert complex environmental effects into specific numerical values, the device's service life under normal temperature and humidity conditions can be predicted, facilitating quantitative analysis of lifespan predictions and providing an important basis for device reliability assessment.

[0054] After completing the water vapor corrosion resistance test according to the above method, calculate the accelerated corrosion time of each cycle at a maximum temperature of 125°C for a total of 2 hours. If the preset number of times is 16, the cycle duration at a maximum temperature of 125°C is a total of 32 hours. Based on the conditions of 125°C and 80% relative humidity (RH), calculate the equivalent specific time under normal environmental conditions of 25°C and 30% relative humidity (RH). In some optional embodiments, obtaining the average temperature acceleration factor and average humidity acceleration factor in the test chamber during the preset number of test processes includes:

[0055] According to the gas constant, Arrhenius model, thermodynamic temperature and activation energy of the chemical reaction in each detection process, the average temperature acceleration factor in the preset number of detection processes is determined; according to the Arrhenius model, the activation energy E a is 0.6eV, and the gas constant R is 8.617×10 -5 eV / K, calculated is 357;

[0056] According to the temperature-humidity accelerated test model, the relative humidity when the test chamber has the highest temperature, the relative humidity when the test chamber has the lowest temperature and the humidity index, the average humidity acceleration factor in the preset number of test processes is determined. Based on the temperature-humidity accelerated test model (Peck humidity correction model), the humidity index empirical value n is 3, and the calculation The total acceleration factor is 23.7. Therefore, the combined acceleration factor = temperature acceleration factor × humidity acceleration factor = 6767. Therefore, maintaining 125°C for 32 hours is equivalent to maintaining 25°C for 32 hours × 6767 = 216,544 hours (approximately 24.7 years). This device testing can be used to estimate the shelf life of the device, eliminating the need for frequent testing of storage devices, saving labor costs and time.

[0057] Non-hermetic packaged devices may also be exposed to other corrosive environments, such as salt spray, acidic gas, and alkaline gas environments. By adjusting test conditions, such as changing relative humidity and test gas composition, this application can also be used to test these corrosive environments, allowing for a comprehensive assessment of the device's corrosion resistance under different environmental conditions.

[0058] This test method can also be used to evaluate the corrosion resistance of different materials in non-hermetic packaging. For example, by replacing the microbump materials (such as Au, Cu / Ni / Au, Sn / Pb, Sn / Ag / Cu, etc.) in a stacked package device, the performance of different materials under water vapor corrosion can be compared, providing a basis for device design and material selection.

[0059] The detection method of the non-airtight stacked package device of the present application can also be applied to other devices that are watertight but not airtight.

[0060] The embodiments of the present application also provide a detection device for a stacked package device. It should be noted that the detection device for a stacked package device in the embodiments of the present application can be used to execute the detection method for a non-airtight stacked package device provided in the embodiments of the present application. The device is used to implement the above-mentioned embodiments and preferred implementation methods, and those that have been described will not be repeated. As used below, the term "module" can implement a combination of software and / or hardware that implements a predetermined function. Although the devices described in the following embodiments are preferably implemented in software, the implementation of hardware, or a combination of software and hardware, is also possible and conceived.

[0061] The following introduces the detection device for the stacked package device provided in the embodiment of the present application.

[0062] Figure 4 Schematic diagram of a detection device for a non-airtight stacked package device according to an embodiment of the present application. Figure 4As shown, the device includes: a starting module 10, which is used to start the first detection device to detect the stacked package device to be tested in the test box when the test box meets the first preset condition. The first preset condition includes: the temperature in the test box is a first temperature, the ventilation volume per unit time of the test box is greater than or equal to a first threshold, and the relative humidity of the air in the test box is greater than or equal to a second threshold, the first temperature is the maximum storage temperature of the stacked package device to be tested, and the detection process includes: adjusting the temperature of the test box multiple times, and performing parameter detection on the stacked package device to be tested during the adjustment process. to electrical data; a control module 20, for controlling the first detection device to perform the detection process on the stacked package device to be tested for multiple cycles until a second preset condition is met and the detection process stops. The second preset condition includes at least one of the following: the electrical data does not meet the target range, and the number of cycles of the detection process meets the preset number; a determination module 30, for judging whether the integrity of the package metal of the stacked package device to be tested meets the target integrity when the second preset condition includes that the number of cycles meets the preset number, and judging that the stacked package device to be tested is qualified when the judgment result is yes.

[0063] By starting the module, when the test chamber meets the first preset condition, the first detection device is started to detect and process the stacked packaged device to be tested in the test chamber. The first preset condition includes: the temperature in the test chamber is a first temperature, the ventilation volume of the test chamber per unit time is greater than or equal to a first threshold, and the relative humidity of the air in the test chamber is greater than or equal to a second threshold. The first temperature is the maximum storage temperature of the stacked packaged device to be tested. This can simulate the use of the device in an extreme atmospheric environment. The high temperature and high humidity environment can accelerate the process of water vapor penetration and metal corrosion, which is conducive to the penetration and condensation of water vapor inside the device, so that its water vapor corrosion resistance can be significantly tested in a short time. The testing process includes: adjusting the temperature of the test chamber multiple times, and performing parameter testing on the stacked packaged device to obtain electrical data during the adjustment process; a control module controlling the first testing device to perform multiple cycles of testing the stacked packaged device to be tested until a second preset condition is met, which includes at least one of the following: the electrical data does not meet the target range, and the number of detection process cycles meets a preset number of cycles; the determination module determines whether the integrity of the package metal of the stacked packaged device to be tested meets the target integrity when the second preset condition includes the number of cycles meeting the preset number, and if the judgment result is yes, determines that the stacked packaged device to be tested is qualified. By setting specific test chamber environmental parameters, including temperature, humidity, and air exchange rate, the device's use in extreme atmospheric environments is simulated to test its resistance to water vapor corrosion. The above-mentioned detection method can simulate the storage of devices in atmospheric water vapor in a short period of time. The corrosion process can be accelerated during this simulation process. By repeatedly detecting the electrical parameters of the device in the cyclic detection process, it is possible to promptly detect whether the device has been corroded by water vapor. According to the set qualification standards and test results, an accurate assessment can be made of whether the device can maintain good performance and reliability under simulated harsh environmental conditions, thereby solving the technical problem of difficulty in performing reliability testing on stacked packaged devices in the existing technology.

[0064] An optional solution is that the above-mentioned detection device also includes a first control module, which is used to control the above-mentioned test chamber to pre-treat the above-mentioned stacked packaged device to be tested, and the above-mentioned pre-treatment is used to evaporate the water vapor adsorbed by the above-mentioned stacked packaged device to be tested, including: adjusting the temperature of the above-mentioned test chamber from room temperature to the above-mentioned first temperature at a first temperature change rate, and maintaining the temperature of the above-mentioned test chamber at the above-mentioned first temperature within a target time period.

[0065] In an optional solution, the startup module includes a first sub-regulation module, a second sub-regulation module, a third sub-regulation module and a fourth sub-regulation module, wherein the first sub-regulation module is used to adjust the temperature of the above-mentioned test chamber from the above-mentioned first temperature to the second temperature, and the above-mentioned second temperature is the minimum storage temperature of the above-mentioned stacked package device to be tested; the second sub-regulation module is used to adjust the temperature of the above-mentioned test chamber from the above-mentioned second temperature to the third temperature after a first time period, and control the above-mentioned first detection device to apply voltage to the above-mentioned stacked package device to be tested, and perform parameter detection on the above-mentioned stacked package device to be tested after a second time period, and the above-mentioned third temperature is the minimum operating temperature of the above-mentioned stacked package device to be tested; the third sub-regulation module is used to adjust the temperature of the above-mentioned test chamber from the above-mentioned third temperature to the above-mentioned second temperature, and control the above-mentioned first detection device to perform parameter detection on the above-mentioned stacked package device to be tested after a fourth time period; the fourth sub-regulation module is used to adjust the temperature of the above-mentioned test chamber from the above-mentioned second temperature to the above-mentioned first temperature, and control the above-mentioned first detection device to perform parameter detection on the above-mentioned stacked package device to be tested, and after a fifth time period, adjust the temperature of the above-mentioned test chamber from the above-mentioned first temperature to room temperature, and control the above-mentioned first detection device to perform parameter detection on the above-mentioned stacked package device to be tested.

[0066] An optional solution, the above-mentioned detection device also includes a first sub-starting module and a second sub-starting module, wherein the first sub-starting module is used to control the above-mentioned first detection device to cyclically perform the above-mentioned detection processing on the above-mentioned stacked package device to be tested for the above-mentioned preset number of times, and in the case that any of the above-mentioned detection processing before the last above-mentioned detection processing is interrupted, the above-mentioned detection processing is re-performed on the above-mentioned stacked package device to be tested once; the second sub-starting module is used to cyclically perform the above-mentioned detection processing on the above-mentioned stacked package device to be tested twice in a row when the last above-mentioned detection processing is interrupted, and the number of cycles of the above-mentioned detection processing is the above-mentioned preset number plus 1.

[0067] An optional solution, the determination module includes a first sub-control module and a first sub-determination module, wherein the first sub-control module is used to control the second detection device to detect the corrosion area of ​​the packaging metal of the above-mentioned stacked package device to be tested, so as to obtain the integrity of the packaging metal of the above-mentioned stacked package device to be tested; the first sub-determination module is used to determine whether the above-mentioned corrosion area is less than or equal to a third threshold value, and obtain a first judgment result, wherein when the above-mentioned first judgment result indicates yes, it is determined that the above-mentioned stacked package device to be tested is qualified.

[0068] An optional solution, the detection device also includes a first sub-acquisition module and a third sub-starting module, wherein the first sub-acquisition module is used to obtain the average temperature acceleration factor and the average humidity acceleration factor in the above-mentioned test chamber in the above-mentioned detection process for the above-mentioned preset number of times; the third sub-starting module is used to detect the life of the above-mentioned stacked package device to be tested based on the average temperature acceleration factor and the average humidity acceleration factor of the above-mentioned stacked package device to be tested, and obtain the life span of the above-mentioned stacked package device to be tested.

[0069] An optional solution, the first sub-acquisition module includes a first determination unit and a second determination unit, wherein the first determination unit is used to determine the above-mentioned average temperature acceleration factor in the above-mentioned preset number of detection processes based on the gas constant, the Arrhenius model, the thermodynamic temperature and the activation energy of the chemical reaction occurring in each of the above-mentioned detection processes; the second determination unit is used to determine the above-mentioned average humidity acceleration factor in the above-mentioned preset number of detection processes based on the temperature-humidity acceleration test model, the relative humidity when the above-mentioned test chamber has the highest temperature, the relative humidity when the above-mentioned test chamber has the lowest temperature and the humidity index.

[0070] The stacked package device detection apparatus includes a processor and memory. The startup modules and other components are stored as program units in the memory, and the processor executes the program units stored in the memory to implement the corresponding functions. The modules are all located in the same processor; alternatively, the modules can be located in different processors in any combination.

[0071] The processor contains a core, which retrieves the corresponding program unit from the memory. One or more cores can be set, and the reliability of the stacked package device can be tested by adjusting the core parameters.

[0072] The memory may include non-permanent memory in a computer-readable medium, random access memory (RAM) and / or non-volatile memory, such as read-only memory (ROM) or flash RAM, and the memory includes at least one memory chip.

[0073] An embodiment of the present invention provides a computer-readable storage medium, which includes a stored program. When the program is executed, the device where the computer-readable storage medium is located is controlled to execute the method for detecting the non-airtight stacked package device.

[0074] Specifically, the detection method for non-hermetic stacked package devices includes:

[0075] Step S1: activating a first detection device to perform detection processing on the stacked package device to be tested in the test chamber when the test chamber meets a first preset condition. The first preset condition includes: the temperature in the test chamber is a first temperature, the ventilation volume per unit time of the test chamber is greater than or equal to a first threshold, and the relative humidity of the air in the test chamber is greater than or equal to a second threshold, the first temperature being the maximum storage temperature of the stacked package device to be tested, and the detection processing includes: adjusting the temperature of the test chamber multiple times, and performing parameter detection on the stacked package device to be tested during the adjustment process to obtain electrical data;

[0076] Step S2, controlling the first testing device to perform the testing process on the stacked package device to be tested for multiple cycles until a second preset condition is met, wherein the second preset condition includes at least one of the following: the electrical data does not meet a target range, and the number of cycles of the testing process meets a preset number;

[0077] Step S3, when the second preset condition includes that the number of cycles meets the preset number, judge whether the integrity of the package metal of the stacked package device to be tested meets the target integrity, and if the judgment result is yes, determine that the stacked package device to be tested is qualified.

[0078] Optionally, the above-mentioned detection method also includes: controlling the above-mentioned test chamber to pre-treat the above-mentioned stacked package device to be tested, and the above-mentioned pre-treatment is used to evaporate the water vapor adsorbed by the above-mentioned stacked package device to be tested, including: adjusting the temperature of the above-mentioned test chamber from room temperature to the above-mentioned first temperature at a first temperature change rate, and maintaining the temperature of the above-mentioned test chamber at the above-mentioned first temperature within the target time period.

[0079] Optionally, the temperature of the test chamber is adjusted multiple times, and during the adjustment process, parameter detection is performed on the stacked package device to be tested, including: adjusting the temperature of the test chamber from the first temperature to the second temperature, the second temperature being the lowest storage temperature of the stacked package device to be tested; after a first time period, adjusting the temperature of the test chamber from the second temperature to a third temperature, and controlling the first detection device to apply voltage to the stacked package device to be tested, and performing parameter detection on the stacked package device to be tested after a second time period, the third temperature being the lowest operating temperature of the stacked package device to be tested; adjusting the temperature of the test chamber from the third temperature to the second temperature, and controlling the first detection device to perform parameter detection on the stacked package device to be tested after a fourth time period; adjusting the temperature of the test chamber from the second temperature to the first temperature, and controlling the first detection device to perform parameter detection on the stacked package device to be tested, and after a fifth time period, adjusting the temperature of the test chamber from the first temperature to room temperature, and controlling the first detection device to perform parameter detection on the stacked package device to be tested.

[0080] Optionally, the above-mentioned detection method also includes: controlling the above-mentioned first detection device to cyclically perform the above-mentioned detection processing on the above-mentioned stacked package device to be tested for the above-mentioned preset number of times, and in the case that any of the above-mentioned detection processing before the last above-mentioned detection processing is interrupted, re-performing the above-mentioned detection processing on the above-mentioned stacked package device to be tested once; in the case that the last above-mentioned detection processing is interrupted, re-performing the above-mentioned detection processing on the above-mentioned stacked package device to be tested twice in a row, and the number of cycles of the above-mentioned detection processing is the above-mentioned preset number plus 1.

[0081] Optionally, the above-mentioned judgment of whether the integrity of the packaging metal of the above-mentioned stacked package device to be tested meets the target integrity includes: controlling the second detection equipment to detect the corrosion area of ​​the packaging metal of the above-mentioned stacked package device to be tested, and obtaining the integrity of the packaging metal of the above-mentioned stacked package device to be tested; judging whether the above-mentioned corrosion area is less than or equal to a third threshold value, and obtaining a first judgment result, wherein, when the above-mentioned first judgment result indicates yes, it is determined that the above-mentioned stacked package device to be tested is qualified.

[0082] Optionally, the above-mentioned detection method also includes: obtaining the average temperature acceleration factor and the average humidity acceleration factor in the above-mentioned test chamber in the above-mentioned detection processing for the above-mentioned preset number of times; detecting the life of the above-mentioned stacked package device to be tested based on the average temperature acceleration factor and the average humidity acceleration factor of the above-mentioned stacked package device to be tested, and obtaining the life span of the above-mentioned stacked package device to be tested.

[0083] Optionally, the above-mentioned obtaining of the average temperature acceleration factor and the average humidity acceleration factor in the above-mentioned test chamber in the above-mentioned preset number of detection processes includes: determining the above-mentioned average temperature acceleration factor in the above-mentioned preset number of detection processes based on the gas constant, the Arrhenius model, the thermodynamic temperature and the activation energy of the chemical reaction occurring in each of the above-mentioned detection processes; determining the above-mentioned average humidity acceleration factor in the above-mentioned preset number of detection processes based on the temperature-humidity acceleration test model, the relative humidity when the above-mentioned test chamber has the highest temperature, the relative humidity when the above-mentioned test chamber has the lowest temperature and the humidity index.

[0084] An embodiment of the present invention provides a processor, which is used to run a program, wherein the program executes the above-mentioned method for detecting non-airtight stacked package devices when running.

[0085] Specifically, the detection method for non-hermetic stacked package devices includes:

[0086] Step S1: activating a first detection device to perform detection processing on the stacked package device to be tested in the test chamber when the test chamber meets a first preset condition. The first preset condition includes: the temperature in the test chamber is a first temperature, the ventilation volume per unit time of the test chamber is greater than or equal to a first threshold, and the relative humidity of the air in the test chamber is greater than or equal to a second threshold, the first temperature being the maximum storage temperature of the stacked package device to be tested, and the detection processing includes: adjusting the temperature of the test chamber multiple times, and performing parameter detection on the stacked package device to be tested during the adjustment process to obtain electrical data;

[0087] Step S2, controlling the first testing device to perform the testing process on the stacked package device to be tested for multiple cycles until a second preset condition is met, wherein the second preset condition includes at least one of the following: the electrical data does not meet a target range, and the number of cycles of the testing process meets a preset number;

[0088] Step S3, when the second preset condition includes that the number of cycles meets the preset number, judge whether the integrity of the package metal of the stacked package device to be tested meets the target integrity, and if the judgment result is yes, determine that the stacked package device to be tested is qualified.

[0089] An embodiment of the present invention provides a device, which includes a processor, a memory, and a program stored in the memory and capable of running on the processor. When the processor executes the program, at least the following steps are implemented: when a test chamber meets a first preset condition, a first detection device is started to detect and process the stacked packaged device to be tested in the above-mentioned test chamber, and the above-mentioned first preset condition includes: the temperature in the above-mentioned test chamber is a first temperature, the ventilation volume per unit time of the above-mentioned test chamber is greater than or equal to a first threshold value, and the relative humidity of the air in the above-mentioned test chamber is greater than or equal to a second threshold value, and the above-mentioned first temperature is the highest storage temperature of the above-mentioned stacked packaged device to be tested. The above-mentioned detection process includes: the temperature of the above-mentioned test chamber is Perform multiple adjustments, and perform parameter detection on the above-mentioned stacked package device to be tested during the adjustment process to obtain electrical data; control the above-mentioned first detection equipment to perform the above-mentioned detection processing on the above-mentioned stacked package device to be tested for multiple cycles until the second preset condition is met and stop, the above-mentioned second preset condition includes at least one of the following: the above-mentioned electrical data does not meet the target range, and the number of cycles of the above-mentioned detection processing meets the preset number; when the above-mentioned second preset condition includes that the above-mentioned number of cycles meets the preset number, judge whether the integrity of the packaging metal of the above-mentioned stacked package device to be tested meets the target integrity, and when the judgment result is yes, determine that the above-mentioned stacked package device to be tested is qualified.

[0090] The devices in this article can be servers, PCs, PADs, mobile phones, etc.

[0091] The present application also provides a computer program product, which, when executed on a data processing device, is adapted to execute a program that is initialized to include at least the following method steps: when a test chamber satisfies a first preset condition, starting a first detection device to perform detection processing on the stacked packaged device to be tested in the test chamber, the first preset condition including: the temperature in the test chamber is a first temperature, the ventilation volume per unit time of the test chamber is greater than or equal to a first threshold, and the relative humidity of the air in the test chamber is greater than or equal to a second threshold, the first temperature being the maximum storage temperature of the stacked packaged device to be tested, the detection processing including: adjusting the temperature of the test chamber multiple times, And during the adjustment process, parameter detection is performed on the above-mentioned stacked package device to be tested to obtain electrical data; the above-mentioned first detection equipment is controlled to perform the above-mentioned detection processing on the above-mentioned stacked package device to be tested for multiple cycles until the second preset condition is met and stops, and the above-mentioned second preset condition includes at least one of the following: the above-mentioned electrical data does not meet the target range, and the number of cycles of the above-mentioned detection processing meets the preset number; when the above-mentioned second preset condition includes that the above-mentioned number of cycles meets the above-mentioned preset number, it is judged whether the integrity of the packaging metal of the above-mentioned stacked package device to be tested meets the target integrity, and when the judgment result is yes, it is determined that the above-mentioned stacked package device to be tested is qualified.

[0092] Obviously, those skilled in the art will appreciate that the various modules or steps of the present invention described above can be implemented using a general-purpose computing device, can be centralized on a single computing device, or can be distributed across a network of multiple computing devices. They can be implemented using program code executable by the computing device, and thus, can be stored in a storage device and executed by the computing device. In some cases, the steps shown or described herein can be performed in a different order than that shown, or can be fabricated as separate integrated circuit modules, or multiple modules or steps can be fabricated as a single integrated circuit module. Thus, the present invention is not limited to any particular combination of hardware and software.

[0093] Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, systems, or computer program products. Therefore, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment, or an embodiment combining software and hardware. Furthermore, the present application may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to magnetic disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0094] The present application is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of the present application. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 a process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0095] These computer program instructions may also be stored in a computer readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 a process or multiple processes and / or boxes Figure 1 The function specified in one or more boxes.

[0096] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing the instructions executed on the computer or other programmable device for implementing the process. Figure 1 a process or multiple processes and / or boxes Figure 1 The steps for the function specified in one or more boxes.

[0097] In a typical configuration, a computing device includes one or more processors (CPUs), input / output interfaces, network interfaces, and memory.

[0098] The memory may include non-permanent memory in a computer-readable medium, random access memory (RAM) and / or non-volatile memory in the form of read-only memory (ROM) or flash RAM. The memory is an example of a computer-readable medium.

[0099] Computer-readable media includes permanent and non-permanent, removable and non-removable media that can be implemented by any method or technology to store information. The information can be computer-readable instructions, data structures, program modules, or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disc read-only memory (CD-ROM), digital versatile disc (DVD) or other optical storage, magnetic cassettes, magnetic disk storage or other magnetic storage devices, or any other non-transmission media that can be used to store information that can be accessed by a computing device. As defined herein, computer-readable media does not include transitory media such as modulated data signals and carrier waves.

[0100] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0101] It should also be noted that the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, commodity, or apparatus that includes a series of elements includes not only those elements but also other elements not explicitly listed, or includes elements inherent to such process, method, commodity, or apparatus. In the absence of further limitations, an element defined by the phrase "comprises a ..." does not exclude the presence of other identical elements in the process, method, commodity, or apparatus that includes the element.

[0102] From the above description, it can be seen that the above embodiments of the present application achieve the following technical effects:

[0103] 1) The present invention's method for testing non-airtight stacked packaged devices simulates the device's use in extreme atmospheric environments by setting specific test chamber environmental parameters, including temperature, humidity, and air exchange rate, to test its resistance to water vapor corrosion. The above-mentioned testing method can simulate the storage of devices in atmospheric water vapor in a short period of time. This simulation can accelerate the corrosion process. Multiple tests of the device's electrical parameters during the cyclic testing process can promptly detect whether the device has been corroded by water vapor. Based on the set qualification standards and test results, an accurate assessment can be made of whether the device can maintain good performance and reliability under simulated harsh environmental conditions, thereby resolving the technical issue of difficulty in conducting reliability testing on stacked packaged devices in the prior art.

[0104] 2) The detection method of the non-airtight stacked package device of the present application can also perform life detection on the devices with strong reliability obtained by detection, and estimate the shelf life of the device. During this period, there is no need to frequently test the storage device, saving labor costs and time.

[0105] The foregoing description is merely a preferred embodiment of the present application and is not intended to limit the present application. Persons skilled in the art will readily appreciate that various modifications and variations are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A method for detecting a non-airtight stacked package device, characterized in that: include: When the test chamber satisfies a first preset condition, a first detection device is activated to perform detection processing on the stacked package device to be tested in the test chamber, the first preset condition including: a temperature in the test chamber being a first temperature, a ventilation volume per unit time of the test chamber being greater than or equal to a first threshold, and a relative humidity of air in the test chamber being greater than or equal to a second threshold, the first temperature being a maximum storage temperature of the stacked package device to be tested, and the detection processing including: adjusting the temperature of the test chamber multiple times, and performing parameter detection on the stacked package device to be tested to obtain electrical data during the adjustment process; Controlling the first detection device to perform the detection process on the stacked package device to be tested for multiple cycles until a second preset condition is met, wherein the second preset condition includes at least one of the following: the electrical data does not meet a target range, and the number of cycles of the detection process meets a preset number; When the second preset condition includes that the number of cycles meets the preset number, it is judged whether the integrity of the packaging metal of the stacked package device to be tested meets the target integrity, and if the judgment result is yes, it is determined that the stacked package device to be tested is qualified.

2. The method according to claim 1, characterized in that The detection method further comprises: Controlling the test chamber to perform pre-treatment on the stacked package device to be tested, wherein the pre-treatment is used to evaporate water vapor adsorbed by the stacked package device to be tested, including: The temperature of the test box is adjusted from room temperature to the first temperature at a first temperature ramp rate, and the temperature of the test box is maintained at the first temperature within a target time period.

3. The method according to claim 1, characterized in that The temperature of the test box is adjusted multiple times, and during the adjustment process, parameter detection is performed on the stacked package device to be tested, including: Adjusting the temperature of the test box from the first temperature to a second temperature, where the second temperature is the minimum storage temperature of the package-on-package device to be tested; After the first time period, the temperature of the test chamber is adjusted from the second temperature to a third temperature, and the first detection device is controlled to apply a voltage to the stacked package device to be tested, and parameter detection is performed on the stacked package device to be tested after the second time period, wherein the third temperature is the minimum operating temperature of the stacked package device to be tested; adjusting the temperature of the test box from the third temperature to the second temperature, and controlling the first detection device to perform parameter detection on the stacked package device to be tested after a fourth time period; The temperature of the test chamber is adjusted from the second temperature to the first temperature, and the first detection device is controlled to perform parameter detection on the stacked package device to be tested. After the fifth time period, the temperature of the test chamber is adjusted from the first temperature to room temperature, and the first detection device is controlled to perform parameter detection on the stacked package device to be tested.

4. The method according to claim 1, wherein The detection method further comprises: Controlling the first detection device to cyclically perform the detection process on the stacked package device to be tested for the preset number of times, and re-performing the detection process on the stacked package device to be tested if any of the detection processes before the last detection process is interrupted; In the case that the last detection process is interrupted, the detection process is repeated twice in succession on the stacked package device to be tested, and the number of cycles of the detection process is the preset number plus 1.

5. The method according to claim 1, wherein The determining whether the integrity of the package metal of the stacked package device to be tested meets the target integrity includes: Controlling a second detection device to detect the corrosion area of ​​the package metal of the stacked package device to be tested, so as to obtain the integrity of the package metal of the stacked package device to be tested; It is determined whether the corrosion area is less than or equal to a third threshold value to obtain a first determination result, wherein if the first determination result indicates yes, it is determined that the stacked package device to be tested is qualified.

6. The method according to claim 1, characterized in that The detection method further comprises: Obtaining an average temperature acceleration factor and an average humidity acceleration factor in the test chamber during the predetermined number of detection processes; The life of the stacked package device to be tested is detected according to the average temperature acceleration factor and the average humidity acceleration factor of the stacked package device to be tested, so as to obtain the life span of the stacked package device to be tested.

7. The method according to claim 6, characterized in that The obtaining of the average temperature acceleration factor and the average humidity acceleration factor in the test box during the detection process for the preset number of times includes: determining the average temperature acceleration factor in the predetermined number of detection processes according to a gas constant, an Arrhenius model, a thermodynamic temperature, and an activation energy of a chemical reaction occurring in each of the detection processes; The average humidity acceleration factor in the preset number of detection processes is determined according to a temperature-humidity acceleration test model, the relative humidity when the test box has the highest temperature, the relative humidity when the test box has the lowest temperature, and a humidity index.

8. A detection device for non-airtight stacked package components, characterized in that: include: a startup module, configured to start a first detection device to perform detection processing on the stacked package device to be tested in the test chamber when the test chamber meets a first preset condition, the first preset condition including: the temperature in the test chamber being a first temperature, the ventilation volume per unit time of the test chamber being greater than or equal to a first threshold, and the relative humidity of the air in the test chamber being greater than or equal to a second threshold, the first temperature being the maximum storage temperature of the stacked package device to be tested, the detection processing including: adjusting the temperature of the test chamber multiple times, and performing parameter detection on the stacked package device to be tested during the adjustment process to obtain electrical data; a control module, configured to control the first testing device to perform the testing process on the package-on-package device to be tested for a plurality of cycles until a second preset condition is satisfied and the test stops, the second preset condition comprising at least one of the following: the electrical data does not meet a target range, and the number of cycles of the testing process satisfies a preset number; A determination module is used to determine whether the integrity of the packaging metal of the stacked package device to be tested meets the target integrity when the second preset condition includes that the number of cycles meets the preset number, and if the judgment result is yes, determine that the stacked package device to be tested is qualified.

9. A computer-readable storage medium, characterized in that The computer-readable storage medium includes a stored program, wherein when the program is executed, the device where the computer-readable storage medium is located is controlled to execute the method for detecting a non-hermetic stacked package device according to any one of claims 1 to 7.

10. A processor, characterized in that: The processor is configured to run a program, wherein the program, when running, executes the method for detecting a non-airtight stacked package device according to any one of claims 1 to 7.

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