Semiconductor wafer detection mechanism and equipment

Abstract

A semiconductor wafer detection mechanism disclosed by the present invention comprises an appearance detection unit and a thickness detection unit which are arranged adjacent to each other, the appearance detection unit comprises an automatic optical detection main body, and an annular light source lens module is installed on the automatic optical detection main body. A man-machine interaction assembly is arranged on one side of the automatic optical detection body, the thickness detection unit comprises an infrared light transmission thickness gauge shell assembly, a supporting sleeve is installed on the infrared light transmission thickness gauge shell assembly, and a second driving motor is installed in the supporting sleeve. The appearance detection unit and the thickness detection unit are designed for two times of detection, the time for replacing equipment can be saved, batch assembly line detection is more facilitated, the carrying time can be greatly shortened by designing a wafer transfer mechanism and designing multiple sets of integrated circular groove plates, meanwhile, a layered conductive mechanism is designed, and while rotating electrification is met, the production efficiency is improved. And single-line control of each single bidirectional electric rod is realized.

Description

Technical Field

[0001] The present invention belongs to the technical field of wafer detection, and in particular relates to a semiconductor wafer detection mechanism and equipment. Background Art

[0002] Semiconductor wafer inspection is a key link in ensuring chip quality, covering multiple technologies. Appearance inspection uses an optical microscope or automatic optical inspection body to identify surface defects such as scratches and cracks; size inspection uses laser scanning, interferometers, etc. to accurately measure parameters such as thickness and line width with nanometer accuracy. Electrical performance inspection connects the chip circuit through probes to test parameters such as current and voltage to verify whether the function is normal. X-ray inspection can penetrate the packaging layer to check internal welding and wiring defects. The above inspection technologies run through the entire chip manufacturing process, from wafer processing to packaging testing, and batch inspection is achieved through non-contact and automated means to ensure that the reliability and performance of semiconductor devices meet the standards, providing quality assurance for high-end chip manufacturing.

[0003] In the inspection of semiconductor chips, existing equipment and inspection mechanisms can often only achieve a single function, such as chip structure and defect inspection, chip thickness inspection, etc. When changing the inspection items, it is often necessary to change the equipment and site, and the chips need to be loaded and unloaded. This results in a longer cycle for the chips to complete the entire inspection process. In the production process of batch inspection chips, the efficiency of the equipment is low. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the shortcomings of the above-mentioned prior art and provide a semiconductor wafer detection mechanism and equipment.

[0005] The technical solution adopted to solve the above technical problems is: providing a semiconductor wafer inspection mechanism, including an appearance inspection unit and a thickness inspection unit arranged at adjacent positions, the appearance inspection unit including an automatic optical inspection body, the automatic optical inspection body being equipped with a ring-shaped light source lens module, and a human-machine interaction component being provided on one side of the automatic optical inspection body; The thickness detection unit includes an infrared light transmission thickness gauge housing assembly, a support sleeve is installed on the infrared light transmission thickness gauge housing assembly, a second drive motor is installed inside the support sleeve, the top of the support sleeve is rotatably connected to a rotating frame, and the bottom center of the rotating frame is fixedly connected to the output end of the second drive motor.

[0006] Furthermore, a second electric rod is fixedly connected to the top front end of the rotating frame, and a second suction cup assembly is fixedly connected to the output end of the second electric rod. An infrared light source and an optical focusing module are installed on one side of the rotating frame. A positioning platform corresponding to the second suction cup assembly is provided on the infrared light transmission thickness gauge housing assembly, and a light intensity detection and receiving module is provided inside the infrared light transmission thickness gauge housing assembly.

[0007] Through the above technical solution, the second electric rod pushes the second suction cup assembly to descend and sucks up the wafer body, and then the two integrated circular groove plates at this position open, and the wafer body is placed on the positioning platform through the second electric rod, and then the second drive motor drives the rotating frame to rotate, and then moves the infrared light source and the optical focusing module to the top of the wafer body, and starts to irradiate the wafer body. After the light passes through the wafer body, it is received by the light intensity detection and receiving module. The transmitted light intensity generated by wafer bodies of different thicknesses is different, and then a mathematical relationship between light intensity attenuation and object thickness is established according to the Lambert-Beer law, thereby calculating the thickness of the object. After the detection is completed, the second suction cup assembly, infrared light source and optical focusing module are reset, and multiple wafer bodies are placed on the wafer transfer mechanism and the two transmission and handling mechanisms.

[0008] A semiconductor wafer inspection device includes a semiconductor wafer inspection mechanism, including a supporting truncated table, the top of the outer wall of the supporting truncated table is fixedly connected to a limited supporting circular plate, a wafer transfer mechanism is provided on the top of the supporting truncated table, a layered conductive mechanism is installed in the center of the wafer transfer mechanism, a transmission and handling mechanism is placed on the front end surface and one side of the supporting truncated table, the appearance inspection unit is arranged on one side of the supporting truncated table, and the thickness inspection unit is arranged on the rear end of the supporting truncated table, and multiple wafer bodies are placed on the wafer transfer mechanism and the two transmission and handling mechanisms.

[0009] Furthermore, the chip transfer mechanism includes a first drive motor installed inside the supporting table, the top of the supporting table is rotatably connected to the output rotating disc, and the output end of the first drive motor is fixedly connected to the bottom center of the output rotating disc, and the outer walls of the output rotating disc are respectively fixedly connected to multiple groups of fixed shaft sleeves and multiple corresponding fixed frame rods, and multiple groups of the fixed shaft sleeves are rotatably connected to two rotating arms, and the other ends of multiple rotating arms are fixedly connected to an integrated circular groove plate, and the other ends of multiple fixed frame rods are installed with bidirectional electric rods, and both ends of multiple bidirectional electric rods are fixedly connected to movable shaft sleeves, and multiple movable shaft sleeves are rotatably connected to connecting shafts, and the top and bottom of the connecting shafts are fixedly connected to limited position circular blocks.

[0010] Through the above technical solution, when the two integrated circular groove plates need to be opened, the bidirectional electric rod starts to push the two movable shaft sleeves to move to both sides, and then pushes the rotating arm to rotate through the connecting shaft. At the same time, the connecting shaft and the rotating arm undergo relative displacement, thereby pushing the two rotating arms open and opening the two integrated circular groove plates. This can greatly reduce the handling time during the loading and unloading process of the chip body.

[0011] Furthermore, grooves corresponding to the connecting shaft and the limiting round block are respectively formed on the inner sides of the plurality of rotating arms.

[0012] The above technical solution ensures that the rotation of the rotating arm can be completed when the bidirectional electric rod is linearly extended and retracted.

[0013] Furthermore, the layered conductive mechanism includes a connecting shell installed at the top center of the chip transfer mechanism, a plurality of connecting wires are installed at the bottom of the connecting shell, and a plurality of connecting wires are fixedly connected to a U-shaped copper bar at one end inside the connecting shell. A sealing top cover is rotatably connected to the connecting shell, a plurality of layered copper rings are fixedly connected to the inner wall of the sealing top cover, and an integrated wire bundle is fixedly connected to the top center of the sealing top cover.

[0014] Through the above technical solution, for the driving of multiple bidirectional electric rods, since the extension and retraction time of multiple bidirectional electric rods are not exactly the same, multiple U-shaped copper bars and multiple layered copper rings are designed to achieve single-line control of each bidirectional electric rod while satisfying the rotation power supply. At the same time, the first drive motor drives the rotating disk to rotate on the fixed shaft sleeve, and then drives the rotation of multiple fixed frame rods and multiple fixed shaft sleeves, so as to realize the sequential detection of multiple chip bodies.

[0015] Furthermore, the lengths of the multiple U-shaped copper bars are different, and the multiple layered copper rings correspond to each other one by one.

[0016] Through the above technical solution, it is ensured that multiple U-shaped copper bars are electrically connected to the corresponding layered copper rings, thereby achieving one-to-one control.

[0017] Furthermore, the plurality of layered copper rings and the integrated wire bundle are electrically connected via wires.

[0018] Through the above technical solution, multiple layered copper rings are finally gathered into an integrated wire harness through wires inside the sealed top cover. The integrated wire harness is connected to the controller and power supply to achieve control of multiple bidirectional electric poles.

[0019] Furthermore, the transmission and handling mechanism includes a transmission device, the top of the transmission device is fixedly connected to an L-shaped support plate at one end close to the supporting table, a first electric rod is installed on the L-shaped support plate, and the output end of the first electric rod is fixedly connected to a first suction cup assembly.

[0020] Through the above technical solution, at the beginning of the inspection, the transmission device continuously transmits the chip body to the bottom of the first suction cup assembly in the transmission and handling mechanism, and the first electric rod pushes the first suction cup assembly down. After reaching the specified position, it adsorbs the chip body and then drives the chip body to reset. In this process, after the chip body is driven to rise, the horizontal height of the chip body is slightly higher than the horizontal height of the groove of the integrated circular groove plate. After releasing the chip body, the first suction cup assembly continues to reset upward to avoid the chip body being too high, which may easily cause damage to the chip body and displacement of the position.

[0021] Furthermore, the two transmission devices in the two transmission and handling mechanisms have opposite transmission directions.

[0022] Through the above technical solution, the loading and unloading of the wafer body are respectively achieved through the two transmission devices.

[0023] The beneficial effects of the present invention are as follows: (1) The present invention designs a wafer transfer mechanism and multiple sets of integrated circular groove plates, which can be opened in real time during loading, unloading and different detection mechanisms, thereby greatly reducing the handling time. At the same time, a layered conductive mechanism is designed. For the driving of multiple bidirectional electric rods, since the extension and retraction time of multiple bidirectional electric rods are not exactly the same, multiple U-shaped copper bars and multiple layered copper rings are designed. While satisfying the rotation power supply, single-line control of each bidirectional electric rod can be achieved. At the same time, the first drive motor drives the rotating disc to rotate on the fixed shaft sleeve, thereby driving multiple fixed racks and multiple fixed shaft sleeves to rotate, thereby realizing sequential detection of multiple wafer bodies. The overall detection mechanism realizes cyclic detection, which can greatly improve the detection efficiency of the equipment for batch detection of semiconductor wafers; (2) The present invention designs a rotating wafer transfer mechanism and an integrated circular groove plate that can be opened and closed. During the process of loading and unloading the wafer body, the overall device only needs to use the first electric rod and the first suction cup assembly to realize the transportation of the wafer body, and finally transmits it through the transmission device, further shortening the overall detection cycle. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention; Figure 2 It is a partial structural schematic diagram of the present invention; Figure 3 It is a schematic structural diagram of the wafer transfer mechanism of the present invention; Figure 4 It is a schematic diagram of the exploded structure of the wafer transfer mechanism of the present invention; Figure 5 This is a schematic diagram of the limiting circular block structure of the present invention; Figure 6 yes Figure 4 A partial enlarged view of point A in the middle; Figure 7 It is a schematic structural diagram of the layered conductive mechanism of the present invention; Figure 8 It is a schematic diagram of the three-dimensional cross-sectional structure of the connecting housing and the sealing top cover of the present invention; Figure 9 It is a schematic structural diagram of the transmission and handling mechanism of the present invention; Figure 10 is a schematic structural diagram of the first suction cup assembly of the present invention; Figure 11 Schematic diagram of the appearance inspection unit structure of the present invention; Figure 12 yes Figure 11 Schematic diagram of the cross-section structure; Figure 13 It is a schematic structural diagram of the thickness detection unit of the present invention; Figure 14 It is a schematic diagram of the cross-sectional structure of the thickness detection unit of the present invention.

[0025] Figure numerals: 1, supporting table; 2, limiting supporting circular plate; 3, wafer transfer mechanism; 301, first driving motor; 302, rotating disc; 303, fixed shaft sleeve; 304, rotating arm; 305, integrated circular groove plate; 306, fixed frame rod; 307, two-way electric rod; 308, movable shaft sleeve; 309, connecting shaft rod; 310, limiting circular block; 4, layered conductive mechanism; 401, connecting housing; 402, connecting wire; 403, U-shaped copper bar; 404, sealing top cover; 405, layered copper ring; 406, integrated wire bundle; 5, transmission and handling mechanism; 501, transmission Transport device; 502, L-shaped support plate; 503, first electric rod; 504, first suction cup assembly; 6, appearance inspection unit; 601, automatic optical inspection body; 602, ring light source lens module; 603, human-computer interaction component; 7, thickness detection unit; 701, infrared light transmission thickness gauge housing assembly; 702, support sleeve; 703, second drive motor; 704, rotating frame; 705, second electric rod; 706, second suction cup assembly; 707, infrared light source and optical focusing module; 708, positioning platform; 709, light intensity detection and receiving module; 8, wafer body. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0027] like Figure 1 、 Figure 11 and Figure 12 As shown, a semiconductor chip detection mechanism of this embodiment includes an appearance detection unit 6 and a thickness detection unit 7 arranged at adjacent positions, the appearance detection unit 6 includes an automatic optical detection body 601, and an annular light source lens module 602 is installed on the automatic optical detection body 601. A human-computer interaction component 603 is provided on one side of the automatic optical detection body 601. The annular light source module in the annular light source lens module 602 irradiates light to the surface of the chip body 8, and at the same time, the lens in the annular light source lens module 602 focuses the light signal to the image sensor and converts it into a digital image. The defect of the chip body 8 causes the reflected light to be different from that of the normal area due to the difference in surface structure, so as to judge whether the appearance of the chip body 8 meets the requirements.

[0028] like Figure 1 and Figure 11-14 As shown, the thickness detection unit 7 includes an infrared light transmission thickness gauge housing assembly 701, a support sleeve 702 is installed on the infrared light transmission thickness gauge housing assembly 701, a second drive motor 703 is installed inside the support sleeve 702, the top of the support sleeve 702 is rotatably connected to a rotating frame 704, and the bottom center of the rotating frame 704 is fixedly connected to the output end of the second drive motor 703, the top front end of the rotating frame 704 is fixedly connected to a second electric rod 705, the output end of the second electric rod 705 is fixedly connected to a second suction cup assembly 706, an infrared light source and an optical focusing module 707 are installed on one side of the rotating frame 704, a positioning platform 708 corresponding to the second suction cup assembly 706 is provided on the infrared light transmission thickness gauge housing assembly 701, and a light intensity detection The detection and receiving module 709 is used. At this time, the second electric rod 705 pushes the second suction cup assembly 706 to descend and suck up the wafer body 8. Then, the two integrated circular groove plates 305 at this position are opened, and the wafer body 8 is placed on the positioning platform 708 through the second electric rod 705. Then, the second drive motor 703 drives the rotating frame 704 to rotate, thereby moving the infrared light source and optical focusing module 707 to the top of the wafer body 8 and starting to irradiate the wafer body 8. After the light passes through the wafer body 8, it is received by the light intensity detection and receiving module 709. The transmitted light intensity generated by wafer bodies 8 of different thicknesses is different. Then, according to the Lambert-Beer law, a mathematical relationship between light intensity attenuation and object thickness is established to calculate the thickness of the object. After the detection is completed, the second suction cup assembly 706 and the infrared light source and optical focusing module 707 are reset.

[0029] like Figures 1-6As shown, a semiconductor wafer detection device includes a semiconductor wafer detection mechanism, including a supporting table 1, the top of the outer wall of the supporting table 1 is fixedly connected to a limited support circular plate 2, the top of the supporting table 1 is provided with a wafer transfer mechanism 3, the wafer transfer mechanism 3 includes a first driving motor 301 installed inside the supporting table 1, the top of the supporting table 1 is rotatably connected to an output rotating disc 302, and the output end of the first driving motor 301 is fixedly connected to the bottom center of the output rotating disc 302, the outer wall of the output rotating disc 302 is respectively fixedly connected to multiple groups of fixed shaft sleeves 303 and multiple corresponding fixed frame rods 306, the multiple groups of fixed shaft sleeves 303 are rotatably connected to two rotating arms 304, the other ends of the multiple rotating arms 304 are fixedly connected to an integrated circular groove plate 305, the other ends of the multiple fixed frame rods 306 are installed with a bidirectional electric rod 307, and the multiple bidirectional electric rods 307 are installed. Both ends of the rod 307 are fixedly connected with movable shaft sleeves 308, and multiple movable shaft sleeves 308 are rotatably connected with connecting shafts 309. The top and bottom of the connecting shaft 309 are fixedly connected with limited circle blocks 310. When the two integrated circular groove plates 305 need to be opened, the two-way electric rod 307 starts to push the two movable shaft sleeves 308 to move to both sides, and then pushes the rotating arm 304 to rotate through the connecting shaft 309. At the same time, the connecting shaft 309 and the rotating arm 304 undergo relative displacement, thereby pushing the two rotating arms 304 apart and opening the two integrated circular groove plates 305. During the loading and unloading process of the wafer body 8, the handling time can be greatly reduced. The inner sides of the multiple rotating arms 304 are respectively provided with grooves corresponding to the connecting shaft 309 and the limiting circle blocks 310, to ensure that the rotation of the rotating arm 304 can be completed when the two-way electric rod 307 is linearly extended and retracted.

[0030] like Figures 1-8As shown, a layered conductive mechanism 4 is installed at the center of the wafer transfer mechanism 3, and the layered conductive mechanism 4 includes a connecting shell 401 installed at the top center of the wafer transfer mechanism 3, and a plurality of connecting wires 402 are installed at the bottom of the connecting shell 401. The plurality of connecting wires 402 are fixedly connected to a U-shaped copper bar 403 at one end inside the connecting shell 401. A sealing top cover 404 is rotatably connected to the connecting shell 401, and a plurality of layered copper rings 405 are fixedly connected to the inner wall of the sealing top cover 404. An integrated wire bundle 406 is fixedly connected to the top center of the sealing top cover 404. For the driving of the plurality of bidirectional electric rods 307, since the extension and contraction times of the plurality of bidirectional electric rods 307 are not exactly the same, the plurality of U-shaped copper bars 403 and the plurality of layered copper rings 405 are designed to achieve the goal of satisfying the rotational power supply while also being able to achieve the goal of satisfying the rotational power supply. Each bidirectional electric rod 307 is now controlled by a single line. At the same time, the first drive motor 301 drives the rotating disk 302 to rotate on the fixed shaft sleeve 303, thereby driving the multiple fixed frame rods 306 and the multiple fixed shaft sleeves 303 to rotate, thereby realizing sequential detection of multiple wafer bodies 8. The lengths of the multiple U-shaped copper bars 403 are all different, and the multiple layered copper rings 405 correspond one to one, ensuring that the multiple U-shaped copper bars 403 are electrically connected to the corresponding layered copper rings 405, thereby realizing one-to-one control. The multiple layered copper rings 405 and the integrated wire harness 406 are electrically connected through wires. The multiple layered copper rings 405 are finally gathered into the integrated wire harness 406 through wires inside the sealing top cover 404. The control of the multiple bidirectional electric rods 307 can be realized by connecting the controller and the power supply through the integrated wire harness 406.

[0031] like Figures 1-10As shown, a transmission and handling mechanism 5 is placed on the front end surface and one side of the supporting truncated table 1. The transmission and handling mechanism 5 includes a transmission device 501. The top of the transmission device 501 is fixedly connected to an L-shaped support plate 502 at one end close to the supporting truncated table 1. A first electric rod 503 is installed on the L-shaped support plate 502. The output end of the first electric rod 503 is fixedly connected to a first suction cup assembly 504. At the beginning of the inspection, the transmission device 501 continuously transmits the chip body 8 to the bottom of the first suction cup assembly 504 in the transmission and handling mechanism 5. The first electric rod 503 pushes the first suction cup assembly 504 to descend. After reaching the specified position, the chip body 8 is adsorbed, and then the chip body 8 is driven to reset. After the chip body 8 is driven to rise during the process, the horizontal height of the chip body 8 is slightly higher than the horizontal height of the groove of the integrated circular groove plate 305. After releasing the chip body 8, the first suction cup assembly 504 continues to reset upward to avoid the chip body 8 being too high, which may easily cause damage to the chip body 8 and position displacement. The two transmission devices 501 in the two transmission and handling mechanisms 5 have opposite transmission directions. The two transmission devices 501 respectively realize the loading and unloading of the chip body 8. The appearance detection unit 6 is arranged on one side of the supporting table 1, and the thickness detection unit 7 is arranged at the rear end of the supporting table 1. Multiple chip bodies 8 are placed on the chip transfer mechanism 3 and the two transmission and handling mechanisms 5.

[0032] The working principle of this embodiment is as follows: when in use, the transmission device 501 located in the transmission and transport mechanism 5 at the front end of the supporting truncated table 1 continuously transmits the wafer body 8 to the bottom of the first suction cup assembly 504 in the transmission and transport mechanism 5, and at the same time, the bidirectional electric rod 307 at this position begins to push the two movable shaft sleeves 308 to move to both sides, and then pushes the rotating arm 304 to rotate through the connecting shaft 309. At the same time, the connecting shaft 309 and the rotating arm 304 are relatively displaced, thereby pushing the two rotating arms 304 apart and opening the two integrated circular groove plates 305. At this time, the first electric rod 503 pushes the first suction cup assembly 504 The first suction cup assembly 504 is pulled upward by the first electric rod 503 to reset the wafer body 8. In this process, the wafer body 8 is lifted up, and the level of the wafer body 8 is slightly higher than the level of the groove of the integrated circular groove plate 305. After the wafer body 8 is released, the first suction cup assembly 504 continues to reset upward. Then the first driving motor 301 drives the rotating disc 302 to rotate on the fixed shaft sleeve 303, and then drives the multiple fixed racks 306 and the multiple fixed shaft sleeves 303 to rotate until the two integrated circular groove plates 305 on which the discs are placed enter the interior of the appearance inspection unit 6, and at the same time the other integrated circular groove plate 305 enters the transmission and handling mechanism 5, and starts to continue loading. The annular light source module in the annular light source lens module 602 irradiates light onto the surface of the wafer body 8. At the same time, the lens in the annular light source lens module 602 focuses the light signal onto the image sensor and converts it into a digital image. The reflected light of the defects of the wafer body 8 is different from that of the normal area due to the difference in surface structure, so as to judge whether the appearance of the wafer body 8 meets the requirements; Then the wafer transfer mechanism 3 continues to rotate, and the wafer body 8 enters the interior of the thickness detection unit 7. At this time, the second electric rod 705 pushes the second suction cup assembly 706 to descend and suck up the wafer body 8. Then the two integrated circular groove plates 305 at this position are opened, and the wafer body 8 is placed on the positioning platform 708 through the second electric rod 705. Then the second driving motor 703 drives the rotating frame 704 to rotate, and then the infrared light source and optical focusing module 707 are moved to the top of the wafer body 8, and start to irradiate the wafer body 8. After the light passes through the wafer body 8, it is reflected by the light intensity. The detection and receiving module 709 receives the different intensities of the transmitted light generated by the wafer bodies 8 of different thicknesses, and then establishes a mathematical relationship between the light intensity attenuation and the thickness of the object based on the Lambert-Beer law, thereby calculating the thickness of the wafer. After the detection is completed, the second suction cup assembly 706 and the infrared light source and optical focusing module 707 are reset, and finally the wafer body 8 is rotated to the position of another transmission and handling mechanism 5 through the wafer transfer mechanism 3. The first electric rod 503 and the first suction cup assembly 504 in the transmission and handling mechanism 5 realize the transportation of the wafer body 8 and transmit it through the transmission device 501.

[0033] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of protection of the present invention.

Claims

1. A semiconductor wafer inspection mechanism, comprising an appearance inspection unit (6) and a thickness inspection unit (7) arranged adjacent to each other, characterized in that: The appearance detection unit (6) comprises an automatic optical detection body (601), a ring light source lens module (602) is mounted on the automatic optical detection body (601), and a human-machine interaction component (603) is provided on one side of the automatic optical detection body (601); The thickness detection unit (7) comprises an infrared light transmission thickness gauge housing assembly (701), a support sleeve (702) is mounted on the infrared light transmission thickness gauge housing assembly (701), a second drive motor (703) is mounted inside the support sleeve (702), the top of the support sleeve (702) is rotatably connected to a rotating frame (704), and the bottom center of the rotating frame (704) is fixedly connected to the output end of the second drive motor (703).

2. The semiconductor wafer inspection mechanism according to claim 1, wherein: The top front end of the rotating frame (704) is fixedly connected to a second electric rod (705), and the output end of the second electric rod (705) is fixedly connected to a second suction cup assembly (706). An infrared light source and an optical focusing module (707) are installed on one side of the rotating frame (704). A positioning platform (708) corresponding to the second suction cup assembly (706) is provided on the infrared light transmission thickness gauge housing assembly (701). A light intensity detection and receiving module (709) is provided inside the infrared light transmission thickness gauge housing assembly (701).

3. A semiconductor wafer inspection device, comprising the semiconductor wafer inspection mechanism according to claim 1, characterized in that: The invention comprises a supporting truncated platform (1), wherein the top of the outer wall of the supporting truncated platform (1) is fixedly connected to a limited supporting circular plate (2), a chip transfer mechanism (3) is arranged on the top of the supporting truncated platform (1), a layered conductive mechanism (4) is installed at the center of the chip transfer mechanism (3), a transmission and handling mechanism (5) is placed on the front end surface and one side of the supporting truncated platform (1), the appearance detection unit (6) is arranged on one side of the supporting truncated platform (1), and the thickness detection unit (7) is arranged at the rear end of the supporting truncated platform (1), and a plurality of chip bodies (8) are placed on the chip transfer mechanism (3) and the two transmission and handling mechanisms (5).

4. The semiconductor wafer inspection device according to claim 3, wherein: The wafer transfer mechanism (3) includes a first drive motor (301) installed inside the support truncated platform (1), the top of the support truncated platform (1) is rotatably connected to an output rotating disc (302), and the output end of the first drive motor (301) is fixedly connected to the bottom center of the output rotating disc (302), and the outer wall of the output rotating disc (302) is respectively fixedly connected to multiple groups of fixed shaft sleeves (303) and multiple corresponding fixed rack rods (306), and the multiple groups of fixed shaft sleeves (303) are rotatably connected to the output rotating disc (302). Two rotating arms (304) are connected, and the other ends of the plurality of rotating arms (304) are fixedly connected to an integrated circular groove plate (305). The other ends of the plurality of fixed frame rods (306) are installed with a bidirectional electric rod (307). Both ends of the plurality of bidirectional electric rods (307) are fixedly connected to a movable shaft sleeve (308). The plurality of movable shaft sleeves (308) are rotatably connected to a connecting shaft rod (309). The top and bottom of the connecting shaft rod (309) are fixedly connected to a limited position circular block (310).

5. The semiconductor wafer inspection device according to claim 4, characterized in that: The inner sides of the plurality of rotating arms (304) are respectively provided with grooves corresponding to the connecting shaft (309) and the limiting circular block (310).

6. The semiconductor wafer inspection equipment according to claim 3, wherein: The layered conductive mechanism (4) comprises a connecting shell (401) installed at the top center of the wafer transfer mechanism (3), a plurality of connecting wires (402) are installed at the bottom of the connecting shell (401), one end of each of the plurality of connecting wires (402) inside the connecting shell (401) is fixedly connected to a U-shaped copper bar (403), a sealing top cover (404) is rotatably connected to the connecting shell (401), a plurality of layered copper rings (405) are fixedly connected to the inner wall of the sealing top cover (404), and an integrated wire bundle (406) is fixedly connected to the top center of the sealing top cover (404).

7. The semiconductor wafer inspection device according to claim 6, wherein: The lengths of the plurality of U-shaped copper bars (403) are all different, and the plurality of layered copper rings (405) correspond one to one.

8. The semiconductor wafer inspection device according to claim 6, wherein: The plurality of layered copper rings (405) and the integrated wire bundle (406) are electrically connected via wires.

9. The semiconductor wafer inspection equipment according to claim 3, wherein: The transmission and transport mechanism (5) comprises a transmission device (501), wherein an L-shaped support plate (502) is fixedly connected to the top of the transmission device (501) at one end close to the supporting truncated table (1), a first electric rod (503) is mounted on the L-shaped support plate (502), and a first suction cup assembly (504) is fixedly connected to the output end of the first electric rod (503).

10. The semiconductor wafer inspection device according to claim 9, wherein: The two transmission devices (501) in the two transmission and handling mechanisms (5) have opposite transmission directions.

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