Display chip and preparation method thereof, optical machine and electronic equipment

Abstract

The invention relates to a display chip and a preparation method thereof, an optical machine and electronic equipment, the display chip after packaging comprises a non-display area, and the surface of at least part of the non-display area meets the condition that the reflectivity is not greater than a first preset value. The invention provides a display chip, namely a packaged display chip, which comprises a non-display area, and the surface of at least part of the non-display area meets the condition that the reflectivity is not greater than a first preset value. The packaged display chips form the light machine, the display areas of the display chips form the display area of the light machine, the non-display area of the light machine forms the non-display area of the light machine, and due to the fact that the surface of at least part of the non-display area meets the mode that the reflectivity is not larger than the first preset value, the reflectivity of the non-display area is low, and the display effect of the light machine is improved. Therefore, when the light is reflected to the non-display area, secondary reflection is not needed any more, ghosting is effectively avoided, and the display effect is improved.

Description

Technical Field

[0001] The present invention relates to the field of micro-display technology, and in particular to a display chip and a preparation method thereof, an optical machine and an electronic device. Background Art

[0002] The packaged display chips form an optical machine, which is widely used in electronic devices (for example, AR near-eye electronic devices). However, ghost images are very likely to appear during the application process. Summary of the Invention

[0003] The problem solved by the present invention is to solve the problem of ghosting generated by an optical machine during use and to improve the display effect.

[0004] To solve the above problem, the present invention provides a display chip. The packaged display chip includes a non-display area. The surface of at least a portion of the non-display area satisfies a reflectivity not greater than a first preset value.

[0005] Optionally, the first preset value is 3%.

[0006] Optionally, the surface reflectivity of all areas in the non-display area satisfies a reflectivity not greater than the first preset value.

[0007] Optionally, the surface of the non-display area is made of light-absorbing material.

[0008] Optionally, the light-absorbing material includes a black material and a substrate;

[0009] The black material is one or more combinations of carbon black and silicon; or the substrate is one or more combinations of ink, resin or silica gel.

[0010] Optionally, the surface roughness of the non-display area is not greater than 2.0 um.

[0011] Optionally, the non-display area includes a first non-display area, wherein the first non-display area is the first surface of the encapsulation area, the first surface of the encapsulation area has an opening area, the area of ​​the opening area is greater than or equal to the area of ​​the display area, so that the display area exposes the opening area.

[0012] Optionally, the area of ​​the opening region is equal to the area of ​​the display region.

[0013] Optionally, the shape of the opening area is the same as that of the display area.

[0014] Optionally, the non-display area further includes a second non-display area; wherein the area of ​​the opening area is larger than the area of ​​the display area, and the second non-display area is the area between the display area and the opening area.

[0015] Optionally, the shape of the opening area is the same as or different from the shape of the display area.

[0016] Optionally, the first non-display area and the second non-display area are located in the same plane or different planes.

[0017] Optionally, the non-display area also includes a third non-display area, the area of ​​the opening area is equal to the area of ​​the display area, the third non-display area is the second surface of the packaging area, and the two sides of the third non-display area are respectively connected to the first non-display area and the display area; or the area of ​​the opening area is greater than the area of ​​the display area, the third non-display area is the second surface of the packaging area, and the two sides of the third non-display area are respectively connected to the first non-display area and the second non-display area.

[0018] Optionally, a longitudinal section of the third non-display area is a straight line, an oblique line or an arc.

[0019] Optionally, the first non-display area, the second non-display area and the third non-display area are all planes.

[0020] Optionally, the thickness of the first non-display area, the thickness of the second non-display area, and the thickness of the third non-display area are the same or different.

[0021] Optionally, the non-display area further includes a fourth non-display area, and the fourth non-display area is a non-display area of ​​the display chip before packaging.

[0022] Optionally, the fourth non-display area is a plane; the thickness of the first non-display area, the thickness of the second non-display area, the thickness of the third non-display area and the thickness of the fourth non-display area are the same or different.

[0023] Optionally, the display area displays a single color or a combined color; the single color includes one of red light, blue light and green light; the combined color includes a combined color formed by red light, blue light and green light.

[0024] Optionally, the display chip adopts one of Micro OLED or Micro LED.

[0025] Correspondingly, the present invention also provides an optical engine, which includes one or more display chips as described above.

[0026] Optionally, the optical machine displays a single color or a combined color;

[0027] Or the optical machine includes a mounting frame, and the surface of at least a portion of the mounting frame meets the requirement that the reflectivity is not greater than a first preset value.

[0028] Optionally, the types of the multiple display chips in the same optical engine are the same or different.

[0029] Optionally, the colors displayed by the multiple display chips in the same optical engine are the same or different.

[0030] Correspondingly, the present invention also provides an electronic device comprising the display chip.

[0031] Correspondingly, the present invention also provides a method for preparing a display chip, for the display chip after packaging,

[0032] Providing a display chip, the display chip including a non-display area;

[0033] The surface of the non-display area is processed so that the surface of at least a portion of the area satisfies a reflectivity not greater than a first preset value.

[0034] Optionally, the first preset value is 3%.

[0035] Optionally, the surface of the non-display area is processed by etching and / or coating.

[0036] Optionally, after the etching process, the surface roughness of the non-display area is no greater than 2.0 um.

[0037] Optionally, the surface of the non-display area is processed, wherein the order of the etching process and the coating process can be interchanged arbitrarily.

[0038] Optionally, the etching process includes dry etching and wet etching, and the surface of the non-display area is processed, wherein the order of the dry etching, the wet etching and the coating process can be interchanged arbitrarily.

[0039] Optionally, the coating process includes screen printing, and the material of the coating process is a light-absorbing material;

[0040] The light-absorbing material includes a black material and a substrate;

[0041] The black material is one or more combinations of carbon black and silicon; or the substrate is one or more combinations of ink, resin or silica gel.

[0042] Compared with the prior art, the technical solution of the present invention has the following advantages: the present invention provides a display chip, that is, a packaged display chip, including a non-display area, wherein the surface of at least a portion of the non-display area satisfies a reflectivity not greater than a first preset value. The present invention uses the packaged display chip to assemble an optical machine, wherein the display area of ​​the display chip constitutes the display area A of the optical machine, and the non-display area forms the non-display area A' of the optical machine. Since the surface of at least a portion of the non-display area A' satisfies a reflectivity not greater than a first preset value, the reflectivity of the non-display area A' is low, so that when light is reflected to the position of the non-display area A', it no longer reflects twice, thereby effectively solving the occurrence of ghosting and improving the display effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] The technical solutions and other beneficial effects of the present invention will be made apparent by describing in detail the specific embodiments of the present invention in conjunction with the accompanying drawings.

[0044] Figure 1 It is a schematic diagram of the ghost formation process;

[0045] Figure 2 is a cross-sectional schematic diagram of a display chip provided by one embodiment of the present invention;

[0046] Figure 3 yes Figure 2 A schematic top view of a display chip is provided;

[0047] Figure 4 is a cross-sectional schematic diagram of a display chip provided by another embodiment of the present invention;

[0048] Figure 5 is a cross-sectional schematic diagram of a display chip provided by another embodiment of the present invention;

[0049] Figure 6 is a cross-sectional schematic diagram of a display chip provided by another embodiment of the present invention;

[0050] Figure 7 is a cross-sectional schematic diagram of a display chip before packaging provided by one embodiment of the present invention;

[0051] Figure 8 yes Figure 7 A schematic top view of a display chip before packaging is provided;

[0052] Figure 9 is a cross-sectional schematic diagram of a packaged display chip provided by one embodiment of the present invention;

[0053] Figure 10 yes Figure 9 A schematic top view of a packaged display chip is provided;

[0054] Figure 11 This is a schematic cross-sectional view of an optical-mechanical structure provided by one embodiment of the present invention;

[0055] Figure 12 is a schematic cross-sectional view of an optical-mechanical structure provided by another embodiment of the present invention;

[0056] Figure 13 This is a schematic flow chart of a method for manufacturing a display chip provided by one embodiment of the present invention;

[0057] Reference numerals: 1-lens assembly, 2-waveguide lens, 3-display chip, 31-non-display area, 311-first non-display area, 312-second non-display area, 313-third non-display area, 314-third non-display area, 32-display area, 33-packaging area, 34-substrate, 35-soldering pad, 36-circuit board, 4-color combination component, 5-installation frame, 100-optical engine and 200-optical engine. DETAILED DESCRIPTION

[0058] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0059] The disclosure of the present invention provides many different embodiments or examples for realizing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and settings of specific examples are described in the present invention. Of course, they are merely examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numbers and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides examples of various specific processes and materials, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0060] Generally, terms can be understood at least in part based on the usage of the above disclosure. For example, the term "one or more" used in the present disclosure depends at least in part on the above disclosure and can be used to describe any component, structure or feature in the singular, or can be used to describe a combination of components, structures or features in the plural. Similarly, terms such as "one", "an" or "the" can also be understood at least in part based on the above disclosure as conveying singular usage or conveying plural usage. In addition, the term "based on..." can be understood as not necessarily intended to convey a set of exclusive factors, but rather can instead allow for the presence of additional factors that do not necessarily have to be explicitly described, depending at least in part on the above disclosure.

[0061] It should be readily understood that the meanings of “on,” “over,” and “over” in the present disclosure should be interpreted in the broadest sense, such that “on” means not only “directly on something,” but also includes “on something” with the presence of intermediate components or layers therebetween, and “on something” or “over something” means not only “on something” or “over something,” but also includes “on something” or “over something” with no intermediate components or layers therebetween.

[0062] Furthermore, for ease of description, spatially relative terms such as "below," "beneath," "lower," "above," and "upper" may be used herein to describe the relationship of one element or component to another element or component illustrated in the drawings. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the drawings. The device may be otherwise oriented, rotated 90 degrees, or at other orientations, and the spatially relative descriptors used herein should be interpreted accordingly.

[0063] The term "layer" as used in the present invention refers to a portion of a material that includes an area with a certain thickness. A layer may extend over the entire underlying or superstructure, or may have an extent that is less than the extent of the underlying or superstructure. In addition, a layer may be an area of ​​a homogeneous or inhomogeneous continuous structure, the thickness of which is less than the thickness of the continuous structure. For example, a layer may be located between the top and bottom surfaces of a continuous structure or between any pair of horizontal planes therebetween. A layer may extend horizontally, vertically and / or along a tapered surface. A substrate may be a layer, may include one or more layers therein, and / or may have one or more layers thereon, above and / or below. A layer may include multiple layers.

[0064] As can be seen from the background technology, the display chip after packaging is composed of an optical machine. The optical machine is used in AR near-eye electronic devices. The application process requires the optical machine to be equipped with an optical waveguide. Figure 1, display area A and non-display area A', when the light emitted from the display area A passes through the lens assembly 1 and is incident on the waveguide lens 2, the light is reflected back to the lens assembly 1; the light is reflected to the position of the non-display area A'. If the reflectivity of the non-display area A' is high, the light passing through the non-display area A' will be reflected twice and then pass through the lens assembly 1 again to form an image, forming a ghost image.

[0065] In order to overcome the ghosting problem that occurs during the use of an optical engine, the present invention provides a display chip, that is, a packaged display chip, including a non-display area, wherein the surface of at least a portion of the non-display area satisfies a reflectivity that is no greater than a first preset value. The present invention utilizes the packaged display chip to form an optical engine, wherein the display area of ​​the display chip constitutes the display area A of the optical engine, and the non-display area forms the non-display area A' of the optical engine. Because the surface of at least a portion of the non-display area A' satisfies a reflectivity that is no greater than the first preset value, the non-display area A' has a low reflectivity, so that when light is reflected to the non-display area A', it no longer reflects a second time, thereby effectively solving the problem of ghosting and improving the display effect.

[0066] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0067] It should be noted that the display area of ​​the display chip remains unchanged before and after packaging.

[0068] refer to Figure 2 , showing a cross-sectional schematic diagram of a display chip provided by an embodiment of the present invention, and reference Figure 3 , shows a top view schematic diagram of a display chip provided by an embodiment of the present invention, that is, the display chip 3 after packaging includes a non-display area 31 and a display area 32, and the non-display area 31 includes all areas on the display chip 3 except the display area 32.

[0069] The surface of at least a portion of the non-display area 31 satisfies a reflectivity no greater than a first preset value.

[0070] In some embodiments, the first preset value is 3%.

[0071] The present invention adopts a method in which the surface reflectivity is no greater than a first preset value, so that when the light emitted by the optical engine composed of the display chip is reflected back to the non-display area through the waveguide lens and the lens assembly, the non-display area will no longer be reflected a second time, thereby effectively solving the problem of ghosting and improving the display effect.

[0072] In some embodiments, reference Figure 2 and Figure 3, shows a cross-sectional and top view schematic diagram of a display chip provided by an embodiment of the present invention, where the non-display area 31 includes a first non-display area 311 .

[0073] The first non-display area 311 is a first surface of the encapsulation area 33 . The first surface of the encapsulation area 33 has an opening area. The opening area can at least expose the display area 32 .

[0074] When the area of ​​the opening region is equal to the area of ​​the display region 32 , the opening region can expose the display region 32 .

[0075] In some embodiments, the shape of the opening area is consistent with the shape of the display area 32 , thereby ensuring that the opening area can expose the display area 32 , which is not limited here.

[0076] The reflectivity of the first non-display area satisfies a reflectivity not greater than a first preset value, so that when the light emitted by the optical engine composed of the display chip is reflected back to the non-display area through the waveguide lens and the lens assembly, the non-display area will no longer be reflected a second time, thereby effectively solving the occurrence of ghosting and improving the display effect.

[0077] refer to Figure 4 , shows a cross-sectional and top view schematic diagram of a display chip provided by another embodiment of the present invention. When the area of ​​the opening area is larger than the area of ​​the display area 32, a second non-display area 312 exists between the display area 32 and the opening area.

[0078] In some embodiments, the second non-display area 312 is located between the display area 32 and the opening area of ​​the packaging area 33 , and the second non-display area 312 is set around the outer periphery of the display area 32 , and the packaging area 33 is set around the outer periphery of the second non-display area 312 .

[0079] In some embodiments, the opening area is of any shape and is not limited here, as long as it can at least expose the display area 32 . The empty area between the opening area and the display area 32 is the second non-display area 312 .

[0080] In some embodiments, the first non-display area 311 and the second non-display area 312 may be located on the same plane or on different planes. Figure 4 , the first non-display area 311 and the second non-display area 312 are located in different planes.

[0081] The reflectivity of the first non-display area and the second non-display area meets the requirement of not being greater than a first preset value, so that when the light emitted by the optical machine composed of the display chip is reflected back to the non-display area through the waveguide lens and the lens assembly, the non-display area will no longer be reflected a second time, thereby effectively solving the occurrence of ghosting and improving the display effect.

[0082] In some embodiments, reference Figure 5 The non-display area 31 further includes a third non-display area 313 , which is the second surface of the packaging area 33 . Both sides of the second surface of the packaging area 33 are connected to the first non-display area 311 and the display area 32 respectively.

[0083] In some embodiments, reference Figure 6 The non-display area 31 also includes a third non-display area 313. The third non-display area 313 is the second surface of the packaging area 33. Both sides of the second surface of the packaging area 33 are connected to the first non-display area 311 and the second non-display area 312 respectively.

[0084] In some embodiments, the longitudinal cross-section of the third non-display area 313 is a straight line. The cross-section structure may also be an oblique line, an arc line, or other shapes, which are not limited here.

[0085] In some embodiments, reference Figure 2 When the non-display area 31 includes the first non-display area 311, only the first non-display area 311 satisfies the reflectivity not greater than the first preset value, while the third non-display area 313 does not satisfy the reflectivity not greater than the first preset value. Light reflected back to the third non-display area 313 of the non-display area 31 will not form a ghost. Therefore, the purpose of eliminating ghosts can be achieved by satisfying the reflectivity not greater than the first preset value on the surface of at least part of the non-display area 31.

[0086] In some embodiments, reference Figure 5 When the non-display area 31 includes the first non-display area 311 and the third non-display area 313, when the first non-display area 311 and the third non-display area 313 both satisfy the reflectivity not greater than the first preset value, the surface of all areas in the non-display area 31 satisfies the reflectivity not greater than the first preset value, which can ensure the best display effect.

[0087] In some embodiments, reference Figure 4 When the non-display area 31 includes the first non-display area 311 and the second non-display area 312, only the first non-display area 311 and the second non-display area 312 meet the reflectivity not greater than the first preset value, while the third non-display area 313 does not meet the reflectivity not greater than the first preset value. Light reflected back to the third non-display area 313 of the non-display area 31 will not form a ghost. Therefore, the purpose of eliminating ghosts can be achieved by satisfying the reflectivity of at least part of the surface of the non-display area 31 not greater than the first preset value.

[0088] In some embodiments, reference Figure 6When the non-display area 31 includes the first non-display area 311, the second non-display area 312 and the third non-display area 313, the first non-display area 311, the second non-display area 312, and the third non-display area 313 all meet the surface reflectivity not greater than the first preset value. If all three meet the above conditions, the surface reflectivity of all areas in the non-display area 31 meets the reflectivity not greater than the first preset value, which can ensure the best display effect.

[0089] In some embodiments, the second non-display area 312 , the first non-display area 311 , and the third non-display area 313 are all flat surfaces.

[0090] In some embodiments, the thicknesses of the first non-display area 311 , the second non-display area 312 , and the third non-display area 313 may be the same or different.

[0091] The thickness of the first non-display area 311 ranges between 0 and 0.05 mm.

[0092] The thickness of the second non-display area 312 ranges between 0 and 0.05 mm.

[0093] The thickness of the third non-display area 313 ranges between 0 and 0.05 mm.

[0094] For example, the first non-display area 311 , the second non-display area 312 , and the third non-display area 313 have different thicknesses.

[0095] In some embodiments, the reflectivity of the non-display area 31 is achieved to be no greater than the first preset value by methods including but not limited to the following two methods, either of which may be used alone or in combination, which are not limited here.

[0096] In some embodiments, the material of the non-display area 31 is a light-absorbing material, which can partially or completely absorb the light reflected back to the non-display area 31 through the waveguide lens 2 and the lens assembly 1, so that the reflectivity of the entire non-display area 31 remains below a first preset value, and the non-display area 31 no longer reflects twice, thereby effectively solving the occurrence of ghosting and improving the display effect.

[0097] In some embodiments, the light-absorbing material includes a black material and a substrate, wherein the black material is one or more combinations of carbon black and silicon, and the substrate is one or more combinations of ink, resin, or silicone.

[0098] In some embodiments, the surface roughness of the non-display area 31 is no more than 2.0 um. This roughness can satisfy the reflectivity being less than a first preset value, so that the light emitted by the optical machine composed of the display chip is reflected back to the non-display area through the waveguide lens and the lens assembly. The non-display area will no longer be reflected a second time, thereby effectively solving the occurrence of ghosting and improving the display effect.

[0099] In some embodiments, the display area 32 can display a single color, including but not limited to red light, blue light and green light; it can also display a combined color, that is, a combined color formed by red light, blue light and green light, which is not limited here.

[0100] In some embodiments, the process of forming the encapsulation region 33 is as follows: Figure 7 , showing a cross-sectional schematic diagram of a display chip before packaging provided by an embodiment of the present invention, and reference Figure 8 , shows a top view schematic diagram of a display chip before packaging provided by an embodiment of the present invention. Before the display chip 3 is packaged, the display area 32 is set on the upper surface of the substrate 34, and a number of pads 35 are set in the non-display area on the upper surface of the substrate 34.

[0101] In some embodiments, substrate 34 has a Mohs hardness of 5 or greater and 8 or less.

[0102] In some embodiments, substrate 34 can be a layer, can include one or more layers therein, and / or can have one or more layers thereon, over, and / or under. A layer can include multiple layers.

[0103] In some embodiments, substrate 34 includes a semiconductor material, such as at least one of silicon, silicon carbide, gallium nitride, germanium, gallium arsenide, and cobalt phosphide. Substrate 34 may also include a non-conductive material, such as at least one of glass, plastic, sapphire wafer silicon, aluminum oxide, and silicon nitride.

[0104] In some embodiments, substrate 34 has a thickness of approximately 700 microns.

[0105] It is understandable that the pad 35 serves as a physical interface between the internal circuit and the external driving circuit, and can be used to transmit control signals, data signals and power supply, thereby ensuring accurate driving of each display unit 32 .

[0106] In some embodiments, the pads 35 can be used to mount the chip on the substrate through a welding process. The layout of the pads 35 must meet micron-level alignment accuracy to ensure the reliability of the chip in a vibration or shock environment.

[0107] It should be noted that the number and arrangement of the pads 35 can be selected according to actual conditions, such as the pads 35 being arranged in a single row or in multiple rows.

[0108] In some embodiments, the material of the pad 35 includes at least one of Cr, Ni, Al, Au, and Cu.

[0109] In some embodiments, the thickness of the pad 35 is greater than or equal to 0.1 micrometers and less than or equal to 20 micrometers.

[0110] refer to Figure 9 , showing a cross-sectional schematic diagram of a packaged display chip provided by an embodiment of the present invention, and reference Figure 10 , shows a top view schematic diagram of a packaged display chip provided by an embodiment of the present invention. The above structure is packaged, and the pads 35 are electrically connected to the pads on the circuit board 36 set on the lower surface of the substrate 34. The pads 35 are covered with packaging material to form a packaging area 33.

[0111] In some embodiments, the circuit board 36 is a flexible printed circuit (FPC) or a rigid circuit board.

[0112] In some embodiments, the material of the circuit board 36 includes at least one of FR (Fire Retardant), PI (Polyimide), CEM (Composit Epoxy Material), or ceramic.

[0113] In some embodiments, the circuit board 36 may be transparent or non-transparent, which is not limited here and is determined according to actual application scenarios.

[0114] In one embodiment, the circuit board 36 is L-shaped, S-shaped, or any other planar geometric shape, which is not limited here and is determined according to the actual application scenario. Designing the circuit board 36 into a circular shape, L-shaped, rectangular, annular, S-shaped, or other geometric shapes not only saves production costs but also facilitates heat dissipation of the display chip 3.

[0115] In some embodiments, reference Figure 7 and references Figure 8 , shows a top view of a display chip before packaging provided by one embodiment of the present invention. The non-display area 31 also includes a fourth non-display area 314. Before packaging, the display chip 3 is surrounded by the display area 32 as the fourth non-display area 314. Part or all of the fourth non-display area 314 can meet the reflectivity requirement of no more than a first preset value. After packaging, different types of non-display areas 31 are formed. The specific types are as follows:

[0116] 1) When all packaging is performed and only the display area 32 is exposed:

[0117] When the reflectivity of a part of the area or the whole area is not greater than the first preset value, after packaging, the reference Figure 2 , a non-display area 31 including a first non-display area 311 can be formed, and at this time, the fourth non-display area 314 is completely within the encapsulation area 33 .

[0118] The reflectivity of the first non-display area satisfies a reflectivity not greater than a first preset value, so that when the light emitted by the optical engine composed of the display chip is reflected back to the non-display area through the waveguide lens and the lens assembly, the non-display area will no longer be reflected a second time, thereby effectively solving the occurrence of ghosting and improving the display effect.

[0119] 2) When encapsulation is performed, exposing the display area 32 and the second non-display area 312:

[0120] 21) When the reflectivity of all regions is not greater than the first preset value, after packaging, it can be formed, referring to Figure 4 The non-display area 31 includes a first display area 311 and a second non-display area 312 . At this time, the other part of the fourth non-display area 314 that does not enter the packaging area 33 forms the second non-display area 312 .

[0121] 22) When the reflectivity of a part of the area is not greater than the first preset value, after packaging, it can be formed, referring to Figure 4 The non-display area 31 includes a first display area 311 and a second non-display area 312. The remaining portion of the fourth non-display area 314 that does not enter the encapsulation area 33 forms the second non-display area 312. The area of ​​the fourth non-display area 314 must be no less than that of the second non-display area 312, so that after encapsulation by the encapsulation area 33, the remaining unencapsulated area forms the second non-display area 312.

[0122] The reflectivity of the first non-display area and the second non-display area meets the requirement of not being greater than a first preset value, so that when the light emitted by the optical machine composed of the display chip is reflected back to the non-display area through the waveguide lens and the lens assembly, the non-display area will no longer be reflected a second time, thereby effectively solving the occurrence of ghosting and improving the display effect.

[0123] In some embodiments, the packaging includes: packaging using plastic packaging, wherein the plastic packaging uses one of COB (Chip on Board) packaging and MOC (Mock Object Container) packaging.

[0124] In some embodiments, the plastic package is made of a material selected from the group consisting of PC (Polycarbonate) resin and epoxy resin, or a combination thereof.

[0125] In some embodiments, the display chip 3 can adopt one of Micro OLED (Micro Organic Light Emitting Diode) and Micro LED (Micro Light Emitting Diode Display), as long as it can achieve display, and is not limited here.

[0126] refer to Figure 11 , shows a schematic cross-sectional view of an optical engine structure according to one embodiment of the present invention. Optical engine 100 includes a display chip 3. A lens assembly 1 and a waveguide lens 2 are sequentially positioned in front of a display area 32 of the display chip 3. The lens assembly 1 corresponds to the display area 32. Light emitted from the light-emitting surface passes through the lens assembly 1 and is emitted to the outside.

[0127] In some embodiments, the display chip 3 can display a single color, including but not limited to one of red, blue and green light; it can also display a mixed color, that is, achieved by a single color laser light source, which is not limited here.

[0128] In some embodiments, the specific specifications of the lens assembly 1 can be selected according to actual needs.

[0129] In some embodiments, adhesive is used to securely connect the non-display area 31 of the display chip 3 to the lens assembly 1. The use of adhesive strengthens the connection between the non-display area 31 of the display chip 3 and the lens assembly 1, preventing light deviation or scattering caused by mechanical vibration or external forces. Furthermore, the adhesive exhibits excellent optical properties, ensuring efficient light transmission between the display chip 3 and the lens assembly 1, improving light combining efficiency and display quality.

[0130] Specifically, silicone rubber glue, polyurethane glue, quick-drying glue, UV glue, or a combination of the above glues can be used for bonding.

[0131] Taking silicone rubber glue as an example, the non-luminous area 31 of the display chip 3 is tightly attached to the lens assembly 1, and then a layer of silicone rubber glue is applied and allowed to dry.

[0132] Since the optical engine adopts the above-mentioned display chip, after the light passes through the lens assembly and is incident on the waveguide lens, it is reflected back to the lens assembly, and then the light is reflected to the non-display area. The reflectivity of the non-display area is not greater than the first preset value. Therefore, the light emitted by the optical engine composed of the display chip, when reflected back to the non-display area through the waveguide lens and the lens assembly, will no longer be reflected a second time in the non-display area, thereby effectively solving the occurrence of ghosting and improving the display effect.

[0133] refer to Figure 12 , shows a schematic cross-sectional structure diagram of an optical machine structure provided by an embodiment of the present invention, the optical machine 200 includes at least two display chips 3 and a color combining component 4; the color combining component 4 includes a light emitting surface and at least two light incident surfaces, at least two display chips 3 are arranged around the color combining component 4, the light emitting paths of the at least two display chips 3 correspond to the at least two light incident surfaces of the color combining component 4, and the light emitted by the at least two display chips 3 enters the color combining component 4 through the at least two light incident surfaces and is emitted through the light emitting surface.

[0134] In some embodiments, the color combining component 4 is in the shape of a tetrahedron, such as a cuboid or a cube.

[0135] For example, the color combining component 4 can be composed of four sub-prisms with triangular cross-sections, and sub-semi-reflective and semi-transparent membranes are attached to the preset surfaces of the four sub-prisms. When the four sub-prisms are spliced ​​together, the sub-semi-reflective and semi-transparent membranes are connected to each other to form a first semi-reflective and semi-permeable membrane and a second semi-reflective and semi-permeable membrane.

[0136] In some embodiments, the display chip 3 and the light incident surface are fixedly connected by adhesive bonding. This significantly reduces light reflection and scattering, enhancing light purity and clarity. It also helps improve the optical performance of the display chip, providing better visibility and resulting in richer and more accurate image colors. It also simplifies the assembly process of the display chip 3 and the color combining component 4, improving overall durability and stability, thereby extending the lifespan of the final electronic device.

[0137] The bonding can be performed using silicone rubber glue, polyurethane glue, quick-drying glue, UV glue, or a combination of the above glues.

[0138] Taking the use of silicone rubber glue for bonding as an example, a plurality of display chips 3 are closely attached to the light incident surface respectively, and then a layer of silicone rubber glue is applied and waited to dry.

[0139] The optical machine 200 further includes a mounting frame 5 having a mounting space therein, into which the color combining assembly 4 is assembled and fixed. The mounting frame 5 protects the color combining assembly 4, reducing damage to the assembly 4 during use and improving the overall strength and durability of the optical machine. Specifically, the side of the mounting space is provided with a light outlet and at least two light inlets communicating with the mounting space; the at least two light inlet surfaces correspond to the at least two light inlets, and the light outlet surface corresponds to the light outlet.

[0140] In some embodiments, the reflectivity of the mounting frame 5 may or may not be below a first preset value. Since light passes through the lens assembly 1, enters the waveguide lens 2, is reflected back to the lens assembly 1, and then reflects onto the mounting frame 5, the optical path exceeds the light collection of the lens assembly 1, thus preventing ghost images. For better display effects, the reflectivity of the mounting frame 5 may also be below the first preset value.

[0141] In some embodiments, the mounting frame 5 is made of one or more materials selected from the group consisting of plastic and alloy. When the mounting frame is made of plastic, the plastic may comprise one or more of polycarbonate, thermoplastic, and polyetheretherketone. When the mounting frame is made of alloy, the alloy may comprise one or more of aluminum alloy and stainless steel.

[0142] Optical engine 200 also includes a lens assembly 1. Lens assembly 1 corresponds to the light-emitting surface of color combiner 4. Light emitted from the light-emitting surface passes through lens assembly 1 and is emitted externally. Lens assembly 1 is used to collimate the light emitted from the light-emitting surface. Lens assembly 1 corresponds to the light-emitting port of mounting frame 5 and is fixedly connected to the side of mounting frame 5 having the light-emitting port.

[0143] In some embodiments, the specific specifications of the lens assembly 1 can be selected according to actual needs.

[0144] In some embodiments, the multiple display chips 3 in the same optical engine 200 can be of the same type or different types, exemplarily, one or more combinations of Micro OLED and Micro LED.

[0145] In some embodiments, multiple display chips 3 in the same optical engine 200 can display the same color or different colors.

[0146] Correspondingly, the technical solution of the present invention further provides an electronic device, comprising a display chip as described in any one of the above embodiments.

[0147] refer to Figure 13 , shows a method 300 for manufacturing a display chip provided by an embodiment of the present invention, for a packaged display chip 3, comprising:

[0148] Step 301: Provide a display chip 3, wherein the display chip 3 includes a non-display area 31;

[0149] Step 302 : Processing the surface of the non-display area 31 so that the surface reflectivity of at least a portion of the non-display area 31 satisfies a first preset value.

[0150] In some embodiments, the first preset value is 3%.

[0151] The present invention adopts a method in which the surface reflectivity is no greater than a first preset value, so that when the light emitted by the optical engine composed of the display chip is reflected back to the non-display area through the waveguide lens and the lens assembly, the non-display area will no longer be reflected a second time, thereby effectively solving the problem of ghosting and improving the display effect.

[0152] In some embodiments, the non-display area 31 includes all areas of the display chip 3 except the display area 32 .

[0153] In some embodiments, the surface reflectivity of all areas in the non-display area 31 meets the requirement of being no greater than a first preset value.

[0154] In some embodiments, step 02: processing the surface of the non-display area 31 by etching and / or coating.

[0155] That is, etching treatment can be used alone; coating treatment can also be used alone; etching treatment and coating treatment can also be used together, and the order is not limited, that is, etching treatment is used first, then coating treatment, or coating treatment is used first, then etching treatment.

[0156] In some embodiments, the etching process includes dry etching and wet etching. Dry etching and wet etching are existing technologies and will not be described in detail. For processing the surface of the non-display area 31, dry etching can be used alone, wet etching can be used alone, or both dry etching and wet etching can be used. The order of the two methods is not limited, that is, dry etching can be used first, followed by wet etching, or wet etching can be used first, followed by dry etching.

[0157] In some embodiments, dry etching, wet etching, and coating processes are combined, and the order of the dry etching, wet etching, and coating processes can be interchanged arbitrarily, including the following methods:

[0158] (1) Dry etching alone;

[0159] (2) Wet etching alone;

[0160] (3) coating treatment alone;

[0161] (4) Dry etching and coating treatment are used, with no restriction on the order, i.e., dry etching is used first, then coating treatment, or coating treatment is used first, then dry etching;

[0162] (5) Wet etching and coating are used in any order, i.e., wet etching is used first, then coating is used, or coating is used first, then wet etching is used;

[0163] (6) Dry etching, wet etching and coating are used in any order, namely:

[0164] 61) First use dry etching, then wet etching, and finally coating treatment;

[0165] 62) First use dry etching, then coating, and finally wet etching;

[0166] 63) Wet etching is first used, followed by dry etching, and finally coating treatment;

[0167] 64) Wet etching is first used, followed by coating, and finally dry etching;

[0168] 65) First use coating treatment, then dry etching, and finally wet etching;

[0169] 66) First use coating treatment, then wet etching, and finally dry etching;

[0170] In some embodiments, the surface roughness of the non-display area 31 is no more than 2.0 um. This roughness can satisfy the reflectivity being less than a first preset value, so that the light emitted by the optical machine composed of the display chip is reflected back to the non-display area through the waveguide lens and the lens assembly. The non-display area will no longer be reflected a second time, thereby effectively solving the occurrence of ghosting and improving the display effect.

[0171] In some embodiments, the coating process may include but is not limited to screen printing. Screen printing is an existing technology and will not be described in detail.

[0172] In some embodiments, the coating material may be a light-absorbing material, so that the reflectivity of the non-display area 31 is less than a first preset value.

[0173] In some embodiments, the light-absorbing material includes a black material and a substrate, wherein the black material is one or more combinations of carbon black and silicon, and the substrate is one or more combinations of ink, resin, or silicone.

[0174] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

[0175] For ease of explanation, the above description has been presented in conjunction with specific embodiments. However, the above exemplary discussion is not intended to be exhaustive or to limit the embodiments to the specific forms disclosed above. Based on the above teachings, various modifications and variations are possible. The above embodiments have been selected and described to better explain the principles and practical applications, thereby enabling those skilled in the art to better utilize the embodiments and various variations of the embodiments suitable for specific use considerations.

Claims

1. A display chip, wherein the packaged display chip is characterized by: Including non-display area, The surface of at least a portion of the non-display area satisfies a reflectivity no greater than a first preset value.

2. The display chip according to claim 1, wherein: The first preset value is 3%.

3. The display chip according to claim 1, wherein: The surface reflectivity of the entire non-display area is no greater than the first preset value.

4. The display chip according to claim 1, wherein: The surface of the non-display area is made of light-absorbing material.

5. The display chip according to claim 4, wherein: The light-absorbing material includes a black material and a substrate; Wherein, the black material is one or more combinations of carbon black and silicon; or The substrate is one or more combinations of ink, resin or silica gel.

6. The display chip according to claim 1, wherein: The surface roughness of the non-display area is no greater than 2.0 μm.

7. The display chip according to claim 1, wherein: The non-display area includes a first non-display area, The first non-display area is the first surface of the packaging area. The first surface of the packaging area has an opening area. The area of ​​the opening area is greater than or equal to the area of ​​the display area, so that the display area exposes the opening area.

8. The display chip according to claim 7, wherein: The area of ​​the opening region is equal to the area of ​​the display region.

9. The display chip according to claim 8, wherein: The shape of the opening area is the same as that of the display area.

10. The display chip according to claim 7, wherein: The non-display area further includes a second non-display area; The area of ​​the opening region is larger than that of the display region, and the second non-display region is a region between the display region and the opening region.

11. The display chip according to claim 10, wherein: The shape of the opening area is the same as or different from the shape of the display area.

12. The display chip according to claim 10, wherein: The first non-display area and the second non-display area are located in the same plane or in different planes.

13. The display chip according to claim 7, wherein: The non-display area further includes a third non-display area, The area of ​​the opening area is equal to the area of ​​the display area, the third non-display area is the second surface of the packaging area, and two sides of the third non-display area are respectively connected to the first non-display area and the display area; or The area of ​​the opening area is larger than that of the display area. The third non-display area is the second surface of the packaging area. Two sides of the third non-display area are respectively connected to the first non-display area and the second non-display area.

14. The display chip according to claim 13, wherein: A longitudinal section of the third non-display area is one of a straight line, an oblique line or an arc.

15. The display chip according to claim 13, wherein: The first non-display area, the second non-display area, and the third non-display area are all flat surfaces.

16. The display chip according to claim 13, wherein: The thickness of the first non-display area, the thickness of the second non-display area, and the thickness of the third non-display area are the same or different; and / or The thickness of the first non-display area ranges between 0 and 0.05 mm; and / or The thickness of the second non-display area ranges between 0 and 0.05 mm; and / or The thickness of the third non-display area ranges between 0 and 0.05 mm.

17. The display chip according to claim 13, wherein: The non-display area further includes a fourth non-display area, and the fourth non-display area is a non-display area of ​​the display chip before packaging.

18. The display chip according to claim 17, wherein: The fourth non-display area is a plane. The thickness of the first non-display area, the thickness of the second non-display area, the thickness of the third non-display area, and the thickness of the fourth non-display area are the same or different.

19. The display chip according to claim 7, wherein: The display area displays a single color or a combined color; The monochromatic light includes one of red light, blue light and green light; The combined color includes a combined color formed by red light, blue light and green light.

20. The display chip according to claim 1, wherein: The display chip adopts one of Micro OLED or Micro LED.

21. An optical machine, characterized in that: It comprises one or more display chips according to any one of claims 1-20.

22. The optical machine according to claim 21, characterized in that: The light machine displays a single color or a combined color; Or the optical machine includes a mounting frame, and the surface of at least a portion of the mounting frame meets the requirement that the reflectivity is not greater than a first preset value.

23. The optical machine according to claim 21, characterized in that: The types of the multiple display chips in the same optical engine are the same or different.

24. The optical machine according to claim 21, characterized in that: The colors displayed by the multiple display chips in the same optical engine are the same or different.

25. An electronic device, characterized in that: It comprises the display chip as described in any one of claims 1-20.

26. A method for preparing a display chip after packaging, characterized in that: Providing a display chip, the display chip including a non-display area; The surface of the non-display area is processed so that the surface of at least a portion of the area satisfies a reflectivity not greater than a first preset value.

27. The method for preparing a display chip according to claim 26, wherein: The first preset value is 3%.

28. The method for preparing a display chip according to claim 26, wherein: The surface of the non-display area is processed by etching and / or coating.

29. The method for preparing a display chip according to claim 28, wherein: After the etching process, the surface roughness of the non-display area is no greater than 2.0 μm.

30. The method for preparing a display chip according to claim 28, wherein: The surface of the non-display area is processed, wherein the order of the etching process and the coating process is interchangeable.

31. The method for preparing a display chip according to claim 28, wherein: The etching process includes dry etching and wet etching, and the surface of the non-display area is processed, wherein the order of the dry etching, the wet etching and the coating process can be interchanged arbitrarily.

32. The method for preparing a display chip according to claim 28, wherein: The coating process includes screen printing, and the material of the coating process is a light-absorbing material; The light-absorbing material includes a black material and a substrate; Wherein, the black material is one or more combinations of carbon black and silicon; or The substrate is one or more combinations of ink, resin or silica gel.

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