Heat dissipation control system, heat dissipation device, temperature management method, and related apparatus

Abstract

The application discloses a heat dissipation control system, a heat dissipation device, a temperature management method and related equipment, and relates to the technical field of heat dissipation. The heat dissipation control system comprises a sensing unit and a driving control unit; the sensing unit performs temperature sensing on an electronic device to form a temperature signal; the driving control unit serves as a driving controller of a heat dissipation component and can autonomously form a control instruction of the heat dissipation component, namely a driving control signal, based on the temperature signal while controlling the driving of the heat dissipation component; the driving control unit can also receive a control instruction of a baseboard management controller, namely a heat dissipation control signal, and fuse the heat dissipation control signal and the driving control signal to generate an adjustment control signal for adjusting the heat dissipation component. The technical problem of unreliable heat dissipation in an electronic device such as a server is solved, and the driving control unit can control the heat dissipation efficiency of the heat dissipation component, thereby being beneficial to guaranteeing the heat dissipation effect and improving the operation reliability of the electronic device.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of heat dissipation technology, and in particular to a heat dissipation control system, a heat dissipation device, a temperature management method, an electronic device, a computer program product and a computer readable storage medium. BACKGROUND

[0002] Electronic devices such as servers, switches, storage devices and PCs (Personal Computer) usually undertake tasks such as processing a large amount of data, running critical applications, providing services, etc., and thus a large amount of heat is easily generated during the operation of the electronic device. Therefore, a heat dissipation component is usually arranged inside the electronic device to dissipate heat for heat management.

[0003] The current common heat management mode is that the temperature information collected by the baseboard management controller is used to output a heat dissipation control signal for heat dissipation management of the heat dissipation component by using the heat dissipation control algorithm integrated in the baseboard management controller, so as to realize the control of the heat dissipation component. In this way, the heat dissipation efficiency of the heat dissipation component usually depends entirely on the baseboard management controller, and lacks autonomous regulation and control capability. When there is an abnormality between the heat dissipation component and the baseboard management controller, it is easy to appear the situation that the electronic device cannot be reliably and effectively cooled, and thus the risk of unreliable operation of the electronic device exists. SUMMARY

[0004] The present application provides a heat dissipation control system, a heat dissipation device, a temperature management method, an electronic device, a computer program product and a computer readable storage medium to at least solve the problem of unreliable heat dissipation in the electronic device such as a server in the related art.

[0005] The present application provides a heat dissipation control system, which comprises a sensing unit and a driving control unit. The sensing unit is used for temperature monitoring of an electronic device to form a temperature signal. The temperature signal represents the current temperature monitored. The driving control unit is connected with the sensing unit, and is used for connecting with a heat dissipation component and a baseboard management controller of the electronic device and driving the heat dissipation component to be in a working state. After obtaining the temperature signal, a driving control signal matched with the temperature signal is formed. The driving control signal and a heat dissipation control signal generated by the baseboard management controller based on the current temperature are fused to generate an adjustment control signal, so as to adjust the heat dissipation efficiency of the heat dissipation component.

[0006] The present application also provides a heat dissipation device, which comprises a heat dissipation control system in the above embodiment, a driving component and a heat dissipation component. The heat dissipation control system is used for generating an adjustment control signal. The driving component comprises a driving circuit connected with the heat dissipation control system, and is used for receiving the adjustment control signal output by the heat dissipation control to form a driving electric energy. The heat dissipation component is connected with the driving circuit, and is used for receiving the driving electric energy and dissipating heat for the electronic device.

[0007] The application further provides a temperature management method applied to the heat dissipation control system or the heat dissipation device in the above-mentioned embodiments, and the temperature management method comprises the following steps: obtaining a current temperature obtained by temperature monitoring on an electronic device; obtaining a heat dissipation control signal formed by a baseboard management controller based on the current temperature; fusing the temperature signal and the heat dissipation control signal to generate an adjustment control signal; and the adjustment control signal is used to adjust the heat dissipation efficiency of the heat dissipation component.

[0008] The application further provides an electronic device, which comprises a memory and a processor; the memory is used to store a computer program; and the processor is used to execute the computer program to realize the steps of the above-mentioned temperature management method.

[0009] The application further provides a computer readable storage medium, which stores a computer program, and the computer program is executed by a processor to realize the steps of the above-mentioned temperature management method.

[0010] The application further provides a computer program product, which comprises a computer program, and the computer program is executed by a processor to realize the steps of the above-mentioned temperature management method.

[0011] According to the application, since the drive control unit is the drive controller of the heat dissipation component, the drive control unit can form the control instruction of the heat dissipation component, i.e., the drive control signal, based on the temperature signal while controlling the drive of the heat dissipation component, and the drive control unit can also receive the control instruction of the baseboard management controller, i.e., the heat dissipation control signal, and fuse the heat dissipation control signal and the drive control signal to generate the adjustment control signal used to adjust the heat dissipation component. Therefore, the technical problem of unreliable heat dissipation in the electronic device such as a server can be solved, the drive control unit can control the heat dissipation efficiency of the heat dissipation component, and thus the operation reliability of the electronic device can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0012] In order to more clearly illustrate the embodiments of the application, the drawings needed in the embodiments will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative effort.

[0013] Figure 1 FIG. 1 is a structural schematic diagram of a heat dissipation device according to an embodiment of the application;

[0014] Figure 2 FIG. 2 is a structural schematic diagram of a heat dissipation control system according to an embodiment of the application;

[0015] Figure 3 FIG. 3 is a structural schematic diagram of another embodiment of the heat dissipation device according to the present application;

[0016] Figure 4 FIG. 4 is a structural schematic diagram of another embodiment of the heat dissipation control system according to the present application;

[0017] Figure 5 FIG. 5 is a deployment structural schematic diagram of an embodiment of the internal heat dissipation device of the electronic equipment according to the present application;

[0018] Figure 6 FIG. 6 is a flow schematic diagram of an embodiment of the temperature management method according to the present application;

[0019] Figure 7 FIG. 7 is a flow schematic diagram of another embodiment of the temperature management method according to the present application;

[0020] Figure 8 FIG. 8 is a flow schematic diagram of still another embodiment of the temperature management method according to the present application;

[0021] Figure 9 FIG. 9 is a structural schematic diagram of an embodiment of the electronic equipment according to the present application. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, any other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

[0023] It should be noted that, in the description of the present application, the terms “comprise”, “contain” or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or device. The terms “first”, “second” and the like in the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence.

[0024] In order for those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0025] In combination with the specific application environment architecture or specific hardware architecture on which the temperature management method is executed, the specific application environment architecture or specific hardware architecture is described here.

[0026] The embodiment of the present application provides a heat dissipation device, which is described in detail below in combination with the specific structure of the heat dissipation device and the working principle thereof.

[0027] The heat dissipation device can be applied to an electronic device,

[0028] Please refer to Figure 1 , Figure 1 Fig. 1 is a structural schematic diagram of an embodiment of the heat dissipation device of the present application.

[0029] In an embodiment, the heat dissipation device can include a heat dissipation control system 10, a driving assembly 20 and a heat dissipation assembly 30.

[0030] The heat dissipation control system 10 is used for generating an adjustment control signal PWM-F.

[0031] The driving assembly 20 includes a driving circuit 21 connected with the heat dissipation control system 10, which is used for receiving the adjustment control signal output by the heat dissipation control system 10 to form driving electric energy.

[0032] The heat dissipation assembly 30 is connected with the driving circuit 21, which is used for receiving the driving electric energy and dissipating heat of the electronic device.

[0033] In general, the heat dissipation device can perform thermal management on the electronic device, and can reduce the temperature of the electronic device when the temperature of the electronic device is high. The core function is to timely export and dissipate the excess heat generated by the electronic device during operation to the environment, so as to reduce the risk of performance degradation, shortened service life and even damage of the electronic device caused by high temperature.

[0034] In the embodiment, the heat dissipation control system 10 can be considered as an intelligent management system with functions of temperature sensing, logical decision, dynamic adjustment and the like to drive and control the running state of the heat dissipation assembly 30. The specific structure and working principle of the heat dissipation control system 10 will be described in detail below, and the core function is that the heat dissipation control system 10 can automatically adjust the heat dissipation efficiency of the heat dissipation assembly 30 according to the real-time temperature change of the electronic device. Compared with the traditional heat dissipation control mode which depends on the baseboard management controller 40, the heat dissipation control system 10 in the embodiment can automatically adjust the heat dissipation efficiency of the heat dissipation assembly 30. That is, when the temperature of the electronic device is low, the heat dissipation control system 10 can reduce the heat dissipation efficiency of the heat dissipation assembly 30; when the temperature of the electronic device is high, the heat dissipation control system 10 can increase the heat dissipation efficiency of the heat dissipation assembly 30 to enhance the heat dissipation capacity and reduce the situation that the temperature of the electronic device is too high.

[0035] The heat dissipation assembly 30 relies on a heat transfer mode to dissipate heat from the electronic device. For example, the heat transfer mode can include heat conduction, heat convection, and heat radiation. Among them, heat conduction means that heat is transferred from a high temperature area to a low temperature area through solid materials such as metal, for example, the heat of the central processing unit is conducted to the heat sink through the silicone grease. Heat convection means that heat is transferred through the flow of fluids such as air or liquid, for example, the heat of the heat sink is taken away by the air blown by the fan, or the cooling liquid circulates in the water cooling system. Heat radiation means that heat is emitted to the surrounding environment in the form of electromagnetic waves, and no medium is needed in the process.

[0036] Embodiments of the present application also provide a heat dissipation control system 10, which will be described in detail below in combination with the specific architecture of the heat dissipation control system 10 and its corresponding working principle.

[0037] Please refer to Figure 2 , Figure 2 is a structural schematic diagram of an embodiment of the heat dissipation control system of the present application.

[0038] In an embodiment, the heat dissipation control system 10 can include a sensing unit 11 and a driving control unit 12.

[0039] The sensing unit 11 is used to monitor the temperature of the electronic device to form a temperature signal. Among them, the temperature signal represents the current temperature monitored.

[0040] The driving control unit 12 is connected with the sensing unit 11, used to connect with the heat dissipation assembly 30 of the electronic device and the baseboard management controller 40 and drive the heat dissipation assembly 30 to be in working state, form a driving control signal matched with the temperature signal after obtaining the temperature signal, and generate an adjustment control signal by fusing the driving control signal and the heat dissipation control signal generated by the baseboard management controller 40 based on the current temperature, to adjust the heat dissipation efficiency of the heat dissipation assembly 30.

[0041] That is, the core function of the sensing unit 11 is to continuously monitor the temperature of the key heat generating components of the electronic device such as CPU (central processing unit), chip set, power module, etc. The current real-time temperature of the electronic device can be captured by temperature sensors including thermistors, digital temperature chips, etc., and this physical quantity is converted into an electrical signal, i.e. temperature signal, which can be recognized by the system. The essence of the temperature signal p is the accurate quantitative representation of the current temperature state, for example, when the load of the electronic device increases, the temperature signal will reflect the rising trend of the temperature synchronously. Accurate temperature monitoring is the basis for the reliability of the heat dissipation control system 10, that is, the temperature signal provided by the sensing unit 11 provides the original basis for the subsequent adjustment action, which can reduce the problems such as overheating of the device due to delayed or distorted temperature information, excessive heat dissipation leading to invalid energy consumption, etc., and can guarantee the reliability of the temperature control logic from the source.

[0042] The drive control unit 12 is a key node connecting the sensing unit 11, the heat dissipation assembly 30 and the baseboard management controller 40, and its core function is to realize dynamic optimization of heat dissipation efficiency through multi-signal fusion. The drive control unit 12 first receives the temperature signal transmitted by the sensing unit 11, and preliminarily generates a matching drive control signal based on the current temperature state. For example, when the temperature rises, the drive control signal will tend to increase the operating power of the heat dissipation assembly 30. At the same time, the drive control unit 12 will receive the heat dissipation control signal generated by the baseboard management controller 40 based on the global state of the device such as overall power consumption, environmental temperature, and heat dissipation demand of other components. The signal of the baseboard management controller 40 is more focused on global coordination, for example, when the device is in low power consumption mode, the maximum power of the heat dissipation assembly 30 will be limited to reduce energy consumption. The drive control unit 12 fuses the above two signals for calculation, and finally generates an adjustment control signal that takes into account the real-time local temperature and global operation demand, which directly acts on the heat dissipation assembly 30 to accurately adjust its heat dissipation efficiency such as dynamically adjusting the fan speed and liquid cooling flow.

[0043] In other words, the heat dissipation control system 10 in the embodiment includes a sensing unit 11 and a drive control unit 12. The sensing unit 11 is used for temperature sensing of the electronic device and forming a temperature signal based on the monitored current temperature. The drive control unit 12 is a drive controller 121 of the heat dissipation assembly 30, which can form a control instruction of the heat dissipation assembly 30 based on the temperature signal while controlling the drive of the heat dissipation assembly 30, that is, form a drive control signal matching the temperature signal. The drive control unit 12 can also receive a control instruction of the baseboard management controller 40 based on the current temperature, that is, a heat dissipation control signal, fuse the heat dissipation control signal and the drive control signal, and generate an adjustment control signal for adjusting the heat dissipation assembly 30. In other words, the drive control unit 12 can control the heat dissipation efficiency of the heat dissipation assembly 30, thereby being conducive to guaranteeing the heat dissipation effect and improving the operation reliability of the electronic device.

[0044] As can be seen, by fusing the local real-time temperature signal of the sensing unit 11 and the global optimization signal of the baseboard management controller 40 in the embodiment, the limitations of a single signal can be reduced, for example, relying only on local temperature may lead to excessive heat dissipation, and relying only on global signal may ignore the risk of local overheating, making the heat dissipation adjustment more in line with the actual needs of the electronic device.

[0045] Optionally, the sensing unit 11 can be arranged in the heat dissipation assembly 30 or in the electronic device adjacent to the heat dissipation assembly 30. In this way, the sensing unit 11 can collect the current temperature of the electronic device, such as the temperature of the air outlet of the server system. Taking the heat dissipation assembly 30 including a fan as an example, the sensing unit 11 can be installed on the fan body, and the signal line of the sensing unit 11 is directly connected to the fan driving board. Further, the driving control unit 12 can be arranged on the fan driving board, that is, the sensing unit 11 can be directly connected to the driving control unit 12. Of course, in an alternative embodiment, the sensing unit 11 can also be indirectly connected to the control unit through other components, which is not strictly limited here. The specific installation position of the sensing unit 11 can be planned and designed according to the actual structure of the heat dissipation assembly 30, which will not be described here.

[0046] Please refer to Figure 3 and Figure 4 , Figure 3 is a structural schematic diagram of another embodiment of the heat dissipation device of the present application, Figure 4 is a structural schematic diagram of another embodiment of the heat dissipation control system of the present application.

[0047] In an embodiment, the driving control unit 12 includes a driving controller 121 and an auxiliary controller 122.

[0048] The driving controller 121 is connected to the sensing unit 11, used to obtain the temperature signal V-Temp and the heat dissipation control signal BMC-PWM, and form a first control signal PWM-MCU matched with the heat dissipation control signal BMC-PWM. The driving controller 121 can control the driving of the heat dissipation assembly 30. For example, the driving controller 121 can be arranged with the MCU (Microcontroller Unit), FPGA (Field Programmable Gate Array), CPLD (Complex Programmable logic device) of the driving board of the heat dissipation assembly 30, which is not limited here.

[0049] The auxiliary controller 122 is connected to the sensing unit 11, used to judge whether the current temperature represented by the temperature signal V-Temp exceeds the temperature threshold after obtaining the temperature signal V-Temp, so as to generate a second control signal V-Con as the driving control signal. The second control signal V-Con is used to fuse with the first control signal PWM-MCU to form an adjustment control signal PWM-F.

[0050] That is, in the heat dissipation control system 10 of the electronic device provided in the embodiment, the drive control unit 12 can not be a single control module, but a cooperative architecture composed of the drive controller 121 and the auxiliary controller 122. Through the clear division of labor and close cooperation of the drive controller 121 and the auxiliary controller 122, the temperature signal V-Temp and the control instruction are processed in layers, and more accurate and reliable heat dissipation adjustment is realized.

[0051] The drive controller 121 can be connected with the sensing unit 11 and the baseboard management controller 40 (BMC), and obtain the real-time temperature signal V-Temp from the sensing unit 11 as the basis for judging the local heating state of the device; at the same time, the drive controller 121 can also receive the heat dissipation control signal BMC-PWM generated by the baseboard management controller 40, and the drive controller 121 can generate the first control signal PWM-MCU matched with the heat dissipation control signal BMC-PWM. The auxiliary controller 122 is also connected with the sensing unit 11, and the auxiliary controller 122 obtains the temperature signal V-Temp output by the sensing unit 11 in real time, continuously monitors the current temperature change; and compares the preset temperature threshold with the current temperature to judge whether there is an overheating risk, and adaptively generates the second control signal V-Con.

[0052] In this way, through the fusion of the first control signal PWM-MCU and the second control signal V-Con, the accuracy and reliability of the heat dissipation effect can be ensured. The drive controller 121 can focus on the conversion of the global strategy of the baseboard management controller 40, so as to ensure that the heat dissipation adjustment does not deviate from the overall operation goal of the device; the auxiliary controller 122 can focus on temperature safety, which can reduce the risk of heat dissipation control failure caused by a single global signal. Through the fusion of the first control signal PWM-MCU and the second control signal V-Con, the adjustment control signal PWM-F can respond to the global demand, and the auxiliary controller 122 can generate the second control signal V-Con based on the current temperature, which is beneficial to ensure the heat dissipation efficiency and reduce the risk of performance frequency reduction, hardware damage and other risks of the electronic device caused by the failure of the first control signal PWM-MCU due to overheating.

[0053] For example, the sensing unit 11 can include a voltage output type sensor, that is, the sensing unit 11 can convert the current temperature information monitored and collected into a voltage signal, that is, a temperature signal V-Temp. And the temperature signal V-Temp is transmitted to the drive controller 121 and the auxiliary controller 122 respectively.

[0054] The drive controller 121 can convert the temperature signal V-Temp transmitted by the sensing unit 11 into temperature data and record it. At the same time, the drive controller 121 can also receive the heat dissipation control signal BMC-PWM transmitted by the baseboard management controller 40 and output the first control signal PWM-MCU matching the heat dissipation control signal BMC-PWM.

[0055] Further, the first control signal PWM-MCU can also be used to control the heat dissipation efficiency of the heat dissipation assembly 30. For example, when the heat dissipation assembly 30 includes a fan, the first control signal PWM-MCU can also be used to control the speed of the fan, and the specific implementation will be described in detail below.

[0056] Further, the auxiliary controller 122 includes a first input end, a second input end, and a first output end.

[0057] The first input end is connected with the sensing unit 11 and used for inputting the temperature signal V-Temp.

[0058] That is to say, the first input end can be regarded as the connection point of the auxiliary controller 122 and the sensing unit 11, and can obtain the temperature signal V-Temp generated by the sensing unit 11. The current temperature of the electronic device monitored by the sensing unit 11 can be transmitted to the auxiliary controller 122 through the first input end as the original data for the auxiliary controller 122 to judge whether it is in a high-temperature or overheating state, so as to ensure that the current temperature can be reliably obtained by the auxiliary controller 122.

[0059] The second input end is used for inputting a threshold signal V-REF representing a temperature threshold.

[0060] That is to say, the second input end is used for inputting a temperature safety judgment reference, that is, by inputting the threshold signal V-REF, the safety temperature boundary of the electronic device is determined. The essence of the threshold signal V-REF can be regarded as a quantitative representation of the temperature threshold, and its source can be flexibly set according to the device requirements, for example, it can be set according to the preset hardware safety parameters, the user-defined protection threshold, etc. The second input end introduces the temperature threshold into the auxiliary controller 122, providing a clear standard for subsequent temperature comparison.

[0061] The auxiliary controller 122 compares the temperature signal V-Temp with the threshold signal V-REF to evaluate whether the current temperature exceeds the temperature threshold, so as to control the first output end to output the second control signal V-Con with different levels.

[0062] The first output end can be considered as a connection interface for the auxiliary controller 122 to play its regulating role, and the second control signal V-Con output by the first output end as a driving control signal formed by the driving control unit 12 to adapt to the current temperature can be in the form of different levels to represent the temperature risk level.

[0063] That is, the auxiliary controller 122 includes the first input end, the second input end and the first output end, and the input acquisition and output expression of the auxiliary controller 122 are realized through the three.

[0064] As such, the first input end of the auxiliary controller 122 can be connected to the sensing unit 11, which is conducive to ensuring that the temperature signal V-Temp can be reliably acquired by the auxiliary controller 122. The first input end of the auxiliary controller 122 can be indirectly connected to the sensing unit 11 through other components, or the first input end of the auxiliary controller 122 can be directly connected to the sensing unit 11 to realize transmission without intermediate links. At the same time, the threshold signal V-REF input by the second input end can provide a reference for temperature comparison, thereby being conducive to improving the accuracy and reliability of the evaluation result. The second control signal V-Con output by the auxiliary controller 122 can be fused with the first control signal PWM-MCU of the driving controller 121 to generate a final adjustment instruction, i.e., the adjustment control signal PWM-F, and the form of a level signal can also be used to improve the fusion efficiency in this embodiment.

[0065] Optionally, the threshold signal V-REF input by the second input end is a threshold level electrical signal.

[0066] When the first input end of the auxiliary controller 122 inputs the temperature signal V-Temp, the auxiliary controller 122 identifies the level of the temperature signal V-Temp as an observation level, and compares the observation level with the threshold level.

[0067] When the observation level is lower than the threshold level, the auxiliary controller 122 controls the first output end to output a second control signal V-Con with a low level. When the observation level is higher than the threshold level, the auxiliary controller 122 controls the first output end to output a second control signal V-Con with a high level.

[0068] That is, the temperature management boundary can be quantified by level in this embodiment. The threshold signal V-REF input by the second input end can not be an abstract temperature value, but an electrical signal in the form of a threshold level. This can directly convert the temperature safety boundary into a level parameter recognizable by the circuit, such as converting a temperature threshold of 100℃ into a 3V (volt) level electrical signal, and simplifying the temperature comparison from numerical judgment to level high-low comparison, thereby being conducive to improving the generation efficiency of the heat dissipation efficiency adjustment, i.e., improving the efficiency of the heat dissipation control.

[0069] In a simple way, when the auxiliary controller 122 obtains the temperature signal V-Temp through the first input end in this embodiment, it will first analyze the level of this signal and convert it into an observation level that can be directly used for comparison. The high and low of the observation level is positively correlated with the current temperature, that is, for example, the higher the temperature, the higher the level of the observed temperature signal V-Temp. Then, the auxiliary controller 122 can quickly compare the circuit of the temperature signal V-Temp and the threshold signal V-REF.

[0070] When the observation level is lower than the threshold level, the auxiliary controller 122 determines that the electronic device is in a safe temperature range, and at this time, the first output end can output a low-level second control signal V-Con. When the observation level exceeds the threshold level, the auxiliary controller 122 determines that the electronic device has an overheating risk, and switches the first output end to a high-level second control signal V-Con.

[0071] As Figure 4 illustrated in the embodiment, the auxiliary controller 122 can include a voltage comparator 1221.

[0072] The negative phase input end of the voltage comparator 1221 can be used as the first input end, and the positive phase input end of the voltage comparator 1221 can be used as the second input end.

[0073] That is, the positive phase input signal of the voltage comparator 1221 is the temperature signal V-Temp sent by the sensing unit 11. The negative phase input signal of the voltage comparator 1221 is the reference voltage of the temperature threshold, that is, the threshold signal V-REF. Among them, the threshold signal V-REF can be customized by the user according to the outlet temperature protection threshold, for example, if the set outlet temperature protection threshold is 100℃, the current temperature monitored and collected by the sensing unit 11 is 100℃, and the corresponding voltage signal is 3V (volt), then the reference voltage of the temperature threshold can be set to 3V.

[0074] The output signal of the voltage comparator 1221 is determined by the positive and negative phase input signals. If the level of the temperature signal V-Temp is greater than the level of the threshold signal V-REF, the output signal is a high-level second control signal V-Con, such as VCC (circuit supply voltage). Among them, VCC and the supply voltage of the drive controller 121 can be consistent, that is, to ensure that VCC is equal to the voltage of the high level of the first control signal PWM-MCU. If the level of the temperature signal V-Temp is lower than the level of the threshold signal V-REF, the output signal is a low-level second control signal V-Con.

[0075] Further, the voltage comparator 1221 can also include a ground end GND for grounding.

[0076] Please continue to refer to Figure 3 and Figure 4 In an embodiment, the drive control unit 12 further comprises a fusion controller 123 connected with the drive controller 121 and the auxiliary controller 122 respectively.

[0077] The fusion controller 123 is further configured to be connected with the drive circuit 21 to form an adjustment control signal PWM-F carrying drive modulation information after obtaining both the first control signal PWM-MCU and the second control signal V-Con, and transmit the adjustment control signal PWM-F to the drive circuit 21 to enable the drive circuit 21 to output drive energy matching the drive modulation information to the heat dissipation component 30.

[0078] In the architecture of the drive control unit 12 exemplified in the embodiment, the drive control unit 12 can comprise a coordination module, i.e., the fusion controller 123, in addition to the drive controller 121 responsible for global strategy execution and the auxiliary controller 122 responsible for local security protection. The fusion controller 123 can be designed to perform signal interaction fusion of the first control signal PWM-MCU and the second control signal V-Con through connection with the drive controller 121 and the auxiliary controller 122. The fusion controller 123 can be connected with the drive controller 121 and the auxiliary controller 122 respectively to receive the first control signal PWM-MCU and the second control signal V-Con output by the two in real time. Meanwhile, the fusion controller 123 is configured to interface with the drive circuit 21 and transmit the adjustment control signal PWM-F formed by fusing the first control signal PWM-MCU and the second control signal V-Con to the drive circuit 21.

[0079] The fusion controller 123 can receive the first control signal PWM-MCU output by the drive controller 121 and the second control signal V-Con output by the auxiliary controller 122. The first control signal PWM-MCU is generated based on the global heat dissipation strategy of the baseboard management controller 40, and the second control signal V-Con is a high-level or low-level electrical signal generated by the auxiliary controller 122 based on comparison between the current temperature and the temperature threshold. The first control signal PWM-MCU and the second control signal V-Con are logically integrated to form an adjustment control signal PWM-F carrying drive modulation information. The drive modulation information can include at least one of a PWM (Pulse Width Modulation) signal and a voltage adjustment signal.

[0080] The fusion controller 123 can transmit an adjustment control signal PWM-F carrying the drive modulation information to the drive circuit 21. In this way, the drive circuit 21 can output matched drive power to the heat dissipation component 30 according to the drive modulation information in the adjustment control signal PWM-F, so as to realize accurate adjustment of the heat dissipation efficiency. The matched drive power can represent voltage corresponding to the rotation speed, current corresponding to the power, etc., which is not limited herein.

[0081] Further, the drive modulation information includes a drive duty cycle.

[0082] When the level of the second control signal V-Con represents that the current temperature exceeds the temperature threshold, the fusion controller 123 configures the current drive duty cycle as a duty cycle extreme value, so as to output an adjustment control signal PWM-F to control the drive circuit 21 to output an extreme value drive signal for driving the heat dissipation component 30 to tend towards an efficiency extreme value.

[0083] In general, in the adjustment control signal PWM-F generated by the fusion controller 123, the drive duty cycle is a key parameter carrying the drive modulation information. For the heat dissipation system using the PWM technology, the drive duty cycle can control the running intensity of the heat dissipation component 30 to control the heat dissipation efficiency of the heat dissipation component 30. For example, when the drive duty cycle is 30%, the fan can run at 30% of the rated rotation speed; when the drive duty cycle is 100%, the fan can run at full load. The duty cycle extreme value can be 100%.

[0084] The duty cycle extreme value configuration in the embodiment can skip the gradual adjustment process, so that the heat dissipation component 30 can be quickly switched from the normal operation to the high-efficiency heat dissipation state. In this way, when the electronic device has an overheating risk or is already in an overheating state, the promotion time of the heat dissipation efficiency can be greatly shortened, for example, the switching of the fan from 50% rotation speed to 100% rotation speed can be completed in milliseconds, which can effectively reduce the risk of continuous temperature rise causing hardware damage such as chip burning due to overheating and capacitor bulging due to high temperature. In high-load burst scenarios such as instantaneous surge of server computing power and sudden load of industrial equipment, the extremely fast response of the heat dissipation efficiency promotion can significantly reduce the risk.

[0085] In addition, the duty cycle extreme value can serve as an upper limit reference for the heat dissipation efficiency adjustment. When the current temperature exceeds the temperature threshold, the fusion controller 123 can quickly lock the duty cycle extreme value to quickly form an extreme value drive signal, which can omit relatively complex parameter calculation or weight distribution, thereby being conducive to improving the simplicity and reliability of the heat dissipation efficiency regulation logic.

[0086] Taking the heat dissipation assembly 30 including a fan as an example, the fan drive controller 121 collects system air outlet temperature data from the temperature sensor at a fixed period. At the same time, the temperature signal V-Temp is transmitted in parallel to the high-temperature protection circuit for threshold determination. Once the temperature signal V-Temp is higher than the preset protection threshold, the high-temperature protection circuit will be triggered immediately, and the fan will enter a full-speed rotating state to quickly respond to the possible overheating risk and ensure the safe and stable operation of the system.

[0087] If the current temperature feedback by the temperature signal V-Temp is lower than the protection threshold, the system enters the normal speed regulation process. At this time, the fan drive controller 121 receives the control duty cycle signal from the baseboard management controller 40. Then, the drive controller 121 runs the temperature compensation regulation algorithm based on the collected air outlet temperature and the received baseboard management controller 40 duty cycle. Through comprehensive calculation and processing, the output duty cycle for controlling the fan speed is finally obtained, and the precise regulation of the fan speed is realized to ensure that the electronic equipment can maintain a temperature environment suitable for its normal operation under different working conditions.

[0088] Optionally, the fusion controller 123 includes an OR gate circuit 1231. The OR gate circuit 1231 includes a third input end, a fourth input end, and a second output end.

[0089] The third input end is connected with the drive controller 121. The fourth input end is connected with the auxiliary controller 122. The second output end is used to be connected with the drive circuit 21.

[0090] It can be considered that in the embodiment, the OR gate circuit 1231 in the hardware implementation of the fusion controller 123 is a key component that undertakes the signal fusion function of the first control signal PWM-MCU and the second control signal V-Con.

[0091] The third input end is connected with the drive controller 121, so as to be able to receive the first control signal PWM-MCU output by the drive controller 121. The fourth input end is connected with the auxiliary controller 122, responsible for receiving the second control signal V-Con output by the auxiliary controller 122. The second output end is the signal outlet of the OR gate circuit 1231, and the second output end is connected with the drive circuit 21, used to transmit the fused adjustment control signal PWM-F to the drive circuit 21.

[0092] The OR gate circuit 1231 is the electrical characteristic of logical OR, which realizes the signal fusion of the first control signal PWM-MCU and the second control signal V-Con, can simplify the signal fusion principle of the first control signal PWM-MCU and the second control signal V-Con, and improve the signal fusion efficiency of the first control signal PWM-MCU and the second control signal V-Con.

[0093] When the third input end receives the first control signal PWM-MCU and the fourth input end receives the second control signal V-Con, the OR gate circuit 1231 can perform logical judgment on the level state of the two signals. If the second control signal V-Con is at a high level, the second output end of the OR gate circuit 1231 can output a high level signal regardless of whether the first control signal PWM-MCU is at a high level or a low level or an abnormal level. If the second control signal V-Con is at a low level, the output signal state is determined by the first control signal PWM-MCU, and the third input end outputs a high level when the first control signal PWM-MCU is at a high level, and outputs a low level when the first control signal PWM-MCU is at a low level. In this way, the instantaneity of the safety response can be guaranteed at the hardware level to improve the system fault tolerance. By physically realizing the fusion of the first control signal PWM-MCU and the second control signal V-Con, the heat dissipation control efficiency and reliability can be further improved.

[0094] The input signals of the OR gate circuit 1231 are the first control signal PWM-MCU and the second control signal V-Con, and the output signal is the adjustment control signal PWM-F, which is used to finally input a driving circuit 21 such as a three-phase bridge driving circuit 21 of a driving board, so as to adjust the driving energy output by the driving circuit 21 to control the heat dissipation efficiency of the heat dissipation assembly 30. For example, the fan speed of the fan is controlled.

[0095] For example, the heat dissipation assembly 30 includes a fan. The fan is used to rotate at a rated speed extreme value when receiving an extreme value driving signal.

[0096] For example, the heat dissipation assembly 30 includes a fan, the temperature threshold is 100°C, and the level of the threshold signal V-REF is 3V. If the baseboard management controller 40 and the driving controller 121 are both in a normal operating state, the current temperature monitored by the sensing unit 11 should be lower than 100°C.

[0097] That is, the signal temperature signal V-Temp output by the sensing unit 11 is transmitted to the driving controller 121 to collect and obtain the current temperature by the driving controller 121. The driving controller 121 can also receive the heat dissipation control signal BMC-PWM sent by the baseboard management controller 40, and can combine the current temperature to perform gain processing calculation on the initial modulation information of the heat dissipation control signal BMC-PWM to obtain the first control signal PWM-MCU, which will be described in detail below.

[0098] The temperature signal V-Temp is also transmitted to the auxiliary controller 122, which compares the levels of the temperature signal V-Temp and the threshold signal V-REF. When the level of the temperature signal V-Temp is lower than the level of the threshold signal V-REF, the auxiliary controller 122 outputs a low-level second control signal V-Con. At this time, the input signals of the fusion controller 123 are the first control signal PWM-MCU and the low-level second control signal V-Con. The output signal of the fusion controller 123, i.e., the adjustment control signal PWM-F, can be consistent with the control signal first control signal PWM-MCU, and the fusion controller 123 can input the adjustment control signal PWM-F to the drive circuit 21 to realize control of the fan speed.

[0099] At the same time, in the present embodiment, if the substrate management controller 40 or the drive controller 121 has an abnormal situation such as a crash, i.e., the heat dissipation control signal BMC-PWM and / or the first control signal PWM-MCU is in an uncertain state, in the related art, the heat dissipation efficiency of the heat dissipation component 30 such as fan speed is in an uncertain state under this condition, which further may cause the risk of over-temperature of the electronic equipment system due to the collapse of the heat dissipation system, affecting the operation reliability.

[0100] Therefore, in the present embodiment, when the current temperature is higher than the temperature threshold, the level of the temperature signal V-Temp output by the sensing unit 11 will be higher than the level of the threshold signal V-REF, and the signal output by the auxiliary controller 122 after judgment will be a high-level second control signal V-Con. In this way, the output signal of the fusion controller 123 can be an adjustment control signal PWM-F with a duty cycle of 100% and a level of VCC, and the speed of the fan is driven to rotate at the highest speed, so as to drive the heat dissipation component 30 to dissipate heat for the electronic equipment at the highest heat dissipation efficiency, thereby effectively reducing the heat dissipation risk caused by the crash of the substrate management controller 40 or the drive controller 121, and improving the heat dissipation control effectiveness to benefit the protection of the operation reliability of the electronic equipment.

[0101] Similarly, in response to sudden increase of ambient temperature, device failure temperature rise and other special scenarios, the drive control unit 12 in the present embodiment can also drive the heat dissipation component 30 to operate at a high heat dissipation efficiency, thereby playing a protection role of full-speed heat dissipation as much as possible, and the drive control unit 12, the heat dissipation control system 10 and the heat dissipation device have good reaction efficiency, and can even perform temperature regulation autonomously without the controller such as the substrate management controller 40 or the drive controller 121.

[0102] Please continue to refer to Figure 3. In an embodiment, the heat dissipation control signal BMC-PWM comprises initial modulation information. The initial modulation information indicates the pulse modulation information of the driving power of the heat dissipation component 30 based on the current temperature of the electronic device.

[0103] The driving control unit 12 is configured to perform gain processing on the initial modulation information to form driving modulation information after obtaining the initial modulation information, and the adjustment control signal PWM-F carries the driving modulation information.

[0104] In the heat dissipation management process of the electronic device, the heat dissipation control signal BMC-PWM generated by the baseboard management controller 40 is a refined control parameter containing initial modulation information. The initial modulation information can define the pulse modulation of the driving power of the heat dissipation component 30, for example, by setting the frequency, duty cycle, and other parameters of the PWM signal to define the heat dissipation efficiency of the heat dissipation component 30. The initial modulation information can generally depend on the judgment and overall evaluation of the current temperature of the electronic device by the baseboard management controller 40. When the temperature of the electronic device is monitored to rise, the initial modulation information can correspondingly increase the duty cycle of the pulse signal, for example, from 30% to 50%, in order to control the heat dissipation component 30 to enhance the output and improve its heat dissipation efficiency. When the temperature of the electronic device is monitored to decrease, the initial modulation information can correspondingly decrease the duty cycle to reduce energy consumption.

[0105] The driving control unit 12 can perform gain processing on the initial modulation information to form driving modulation information for driving the heat dissipation component 30 after receiving the heat dissipation control signal BMC-PWM from the baseboard management controller 40, and load the driving modulation information into the adjustment control signal PWM-F for output.

[0106] For example, the driving control unit 12 can first extract the initial modulation information in the heat dissipation control signal BMC-PWM to determine the basic control trend and / or control parameters of the baseboard management controller 40, for example, the control parameters can include the target pulse duty cycle, the driving voltage reference, etc.

[0107] Further, the driving control unit 12 can dynamically optimize the initial modulation information according to the actual running scenarios of the electronic device, such as local temperature details, aging state of the heat dissipation component 30, environmental interference, etc. Optionally, the difference between the local temperature and the global temperature can also be considered in this process. For example, when the local temperature is slightly higher than the global average, the gain of the pulse duty cycle can be appropriately increased, for example, from the initial 50% to 60% with an additional gain of 10%. When the heat dissipation component 30 is aging and its efficiency is decreasing, gain compensation can be used to ensure the actual output. The gain-processed information is integrated into the driving modulation information, embedded into the adjustment control signal PWM-F, and transmitted to the driving circuit 21, so that the driving circuit 21 can recognize and convert the driving modulation information into driving power that precisely matches the heat dissipation demand, for example, a voltage pulse with a 60% duty cycle.

[0108] The gain processing of the initial modulation information by the drive control unit 12 can perform secondary calibration on the regulation accuracy, and the gain processing can correct the initial modulation information through real-time data feedback of the sensing unit 11, and the drive modulation information formed can be more suitable for the actual load demand of the heat dissipation assembly 30. The heat dissipation assembly 30 may, in long-term operation, be subject to efficiency decay due to problems such as aging and dust accumulation. The gain processing of the drive control unit 12 can dynamically improve the drive modulation information according to the changes in the characteristics of the assembly through a preset compensation algorithm, to ensure that the actual heat dissipation effect is always consistent with the target demand, thereby facilitating the extension of the effective service life of the heat dissipation assembly 30.

[0109] Further, the initial modulation information includes an initial duty cycle.

[0110] The drive control unit 12 is configured to evaluate a temperature change amount in a current control period. The temperature change amount represents a temperature difference between a current temperature and a temperature obtained in a previous adjacent control period.

[0111] When the temperature change amount is positive, the initial duty cycle is weighted by a first gain factor to obtain a drive duty cycle. When the temperature change amount is negative, the initial duty cycle is weighted by a second gain factor to obtain a drive duty cycle. The first gain factor is greater than the second gain factor.

[0112] In the initial modulation information generated by the baseboard management controller 40, the initial duty cycle can be used as a parameter for controlling the basic operating performance of the heat dissipation assembly 30. The heat dissipation assembly 30 can be set with a reference drive power by defining, for example, the high-level duty cycle of a PWM signal. For example, when the initial duty cycle is 40%, it can be considered that the baseboard management controller 40 wants to control the heat dissipation assembly 30 to operate at 40% of the rated power; when the initial duty cycle is increased to 60%, it can be considered that the baseboard management controller 40 system controls the operating power of the heat dissipation assembly 30 to be enhanced synchronously.

[0113] The drive control unit 12 generates the drive duty cycle by differentially weighting the initial duty cycle according to the temperature change trend. In each control period, the drive control unit 12 can calculate the temperature change amount, which is the difference between the current temperature and the temperature obtained in the previous period. This difference can be considered to reflect the heating trend of the electronic device, i.e., when the temperature change amount is positive, it can be considered to indicate that the temperature of the current electronic device is in the rising stage, and when the temperature change amount is negative, it can be considered to indicate that the temperature of the current electronic device is in the falling stage. In this embodiment, different gain factors can be selected to adjust the initial duty cycle according to the positive and negative of the temperature change amount. The first gain factor being greater than the second gain factor can facilitate the regulation of the heat dissipation efficiency of the heat dissipation assembly 30 when the temperature rises to be stronger than the adjustment range of the heat dissipation efficiency of the heat dissipation assembly 30 when the temperature falls.

[0114] That is, when the temperature change amount is a positive value, the first gain factor can quickly increase the drive duty cycle with a relatively high weight, so that the heat dissipation component 30 enhances the heat dissipation capability, thereby compensating for the temperature rise in the control period, and effectively preventing the temperature from continuously rising by pre-judging the heat dissipation efficiency, thereby reducing the risk of overheating due to regulation lag. For example, when the electronic device load suddenly increases and the temperature initially shows signs of rising, the drive duty cycle is simultaneously increased to control the temperature within a safe range as much as possible.

[0115] When the temperature change amount is a negative value, the second gain factor can gently reduce the drive duty cycle with a relatively low weight, thereby facilitating the reduction of energy consumption and noise while ensuring the heat dissipation effect. Such design can reduce the risk of large temperature rebound caused by excessive load reduction, further improving the reliability of heat dissipation control.

[0116] At the same time, through the differentiated setting of the first gain factor and the second gain factor, the heat dissipation control system 10 can balance the risk of temperature out of control and the risk of resource waste. By dynamically adjusting the drive duty cycle according to the temperature trend, the risk of long-term high-load operation of the heat dissipation component 30 can be reduced, and the mechanical wear of the heat dissipation component 30 such as fan bearing wear and the aging of electronic components such as drive circuit 21 heating can be reduced. At the same time, the risk of frequent start-stop of the heat dissipation component 30 caused by temperature fluctuations can be reduced, which can be beneficial to further prolong the service life of the heat dissipation device.

[0117] Optionally, the calculation formula of the drive duty cycle can be as shown in the following example:

[0118] Formula 1-1

[0119] Wherein, ΔT represents the temperature change amount; U1 represents the drive duty cycle formed by the drive control unit 12, which can be evaluated by the drive controller 121; U0 represents the initial duty cycle sent by the baseboard management controller 40; K1 represents the first gain factor; K2 represents the second gain factor.

[0120] For example, the first gain factor is greater than 1. The second gain factor is less than 1.

[0121] That is, when ΔT is greater than 0, it can be considered that the temperature change trend of the current temperature is temperature rise, and it can be considered that the overall electronic device or the position where the sensing unit 11 is located is in a temperature rise state. In the embodiment, the duty cycle transmitted by the baseboard management controller 40 can be further increased to enhance the heat dissipation efficiency of the heat dissipation component 30 such as the fan, for example, to increase the speed of the fan to enhance the heat dissipation performance, so as to ensure that the system temperature can be effectively controlled; ΔT is less than 0, it can be considered that the temperature change trend of the current temperature is temperature drop, which means that the overall electronic device or the position where the sensing unit 11 is located is in a cooling process. In the embodiment, the duty cycle transmitted by the baseboard management controller 40 can be reduced to reduce the energy consumption of the heat dissipation component 30 while meeting the heat dissipation demand, so as to realize the optimized balance between heat dissipation efficiency and energy consumption. At the same time, the regulation and control of the heat dissipation component 30 based on the change amount of the real-time temperature in the embodiment can effectively alleviate the delay of the control algorithm, that is, improve the instant effectiveness of the heat dissipation control.

[0122] Please continue to refer to Figure 3 In an embodiment, the drive control unit 12 further comprises an interactive port.

[0123] The interactive port is used to input an updated gain combination. The updated gain combination includes a new first gain factor and a new second gain factor of a target update.

[0124] When the updated gain combination is obtained through the interactive port, the drive control unit 12 identifies the updated gain combination to parse the new first gain factor and the new second gain factor, and updates the first gain factor and the second gain factor stored in the drive control unit 12 to the new first gain factor and the new second gain factor.

[0125] The interactive port of the drive control unit 12 is used to realize the flexibility of gain adjustment. The interactive port can provide a convenient first gain factor and / or second gain factor update interface for a user or a system administrator to indicate the replacement of a new first gain factor and a new second gain factor. In the embodiment, the dynamic parameters that can be flexibly adjusted according to actual needs are realized through the interactive port.

[0126] The interaction port can enhance the scene adaptation capability of the heat dissipation control system 10. That is, in the embodiment, considering that different devices and different operating environments have significant differences in heat dissipation requirements, the update gain combination can be input through the interaction port to enrich the diversification of the scene adaptation of the heat dissipation control system 10, so that the heat dissipation control system 10 can be migrated between different electronic devices without modifying the underlying circuit or firmware, the generalizability of the heat dissipation control system 10 can be improved, and the customization cost can be reduced. At the same time, the heat dissipation efficiency of the heat dissipation assembly 30 can be attenuated due to, for example, a decrease in fan speed and dust accumulation on the heat dissipation fins in long-term use. When the original gain factor cannot meet the heat dissipation requirements, the first gain factor can be improved through the interaction port to compensate for the performance loss caused by the aging of the heat dissipation assembly 30, prolong the service life of the heat dissipation device as a whole, and reduce the frequency of hardware replacement. Moreover, during the research and development or operation and maintenance of the heat dissipation device and the heat dissipation control system 10, the influence of different factors on temperature stability usually needs to be tested to adjust the first gain factor and the second gain factor to optimize the heat dissipation performance. In the embodiment, new parameters, i.e., a new first gain factor and a new second gain factor, can be input in real time through the interaction port, so that the heat dissipation effect optimization cost can be significantly reduced without repeatedly burning firmware or restarting the electronic device. Moreover, when the electronic device faces sudden environmental changes or temporary load requirements, the gain strategy can be quickly adjusted through the interaction port, so that the flexibility of the heat dissipation control system 10 can be improved, and the risk of electronic device failure caused by fixed parameters that are difficult to adapt to sudden scenarios can be reduced.

[0127] Further, when the update gain combination is obtained, the driving control unit 12 identifies the update trend of both the first gain factor and the second gain factor to form an update trend combination, and controls the heat dissipation assembly 30 to switch between different energy consumption modes based on the update trend combination.

[0128] That is, the user can flexibly adjust the size of the first gain factor and the second gain factor to switch different overall heat dissipation modes. For example, increasing the value of the first gain factor and decreasing the value of the second gain factor, the system will enter a conservative mode to reserve sufficient safety margin for the system temperature to cope with possible extreme working conditions; and decreasing the value of the first gain factor and increasing the value of the second gain factor, the system will switch to an energy-saving mode to reduce the overall energy consumption of the fan to a lower level on the premise of ensuring basic heat dissipation performance, thereby achieving the energy-saving goal.

[0129] Please refer to Figure 5 , Figure 5 which is a deployment structure schematic diagram of an embodiment of the internal heat dissipation device of the electronic device.

[0130] In an embodiment, the number of driving control units 12 is multiple, and the number of sensing units 11 is multiple.

[0131] The plurality of sensing units 11 are used to form a plurality of sensing heat dissipation components 30 with the plurality of heat dissipation components 30, and the plurality of sensing heat dissipation components 30 are respectively arranged at a plurality of positions of the electronic device.

[0132] Each driving control unit 12 is connected with a sensing heat dissipation component 30, and is used to receive a temperature signal V-Temp input by the sensing heat dissipation component 30 connected therewith, so as to generate an adjustment control signal PWM-F transmitted to the heat dissipation component 30 connected therewith.

[0133] Optionally, the sensing unit 11 can be arranged at the heat dissipation component 30, so that the sensing unit 11 can monitor the temperature at the position of the heat dissipation component 30. In this way, the temperature information collected by the sensing unit 11 can be used to independently control the heat dissipation efficiency of the heat dissipation component 30 in different areas, which can significantly improve the heat dissipation effectiveness and the adaptability to the real environment temperature, and can adapt to the temperature conditions at different positions to independently and specifically dissipate heat. In this way, the embodiment can overcome the limitation of unified adjustment of multiple heat dissipation components 30 such as a fan module composed of multiple fans, and on the basis of the duty cycle set by the baseboard management controller 40, the driving control unit 12 of each heat dissipation component 30 can be given autonomous adjustment capability. The driving control unit 12 of each heat dissipation component 30 can correct the heat dissipation efficiency of the heat dissipation component 30 according to the real-time temperature condition of the area where the heat dissipation component 30 is located, so as to improve the heat dissipation effectiveness of the possible local hot spot problem, and thus can be beneficial to guarantee the balance and efficiency of the heat dissipation effect.

[0134] Taking the heat dissipation component 30 as an example such as an exhaust fan and the sensing unit 11 including a temperature sensor, the temperature sensor can be arranged at the fan, that is, the temperature sensor can be added to the fan to realize the monitoring of the outlet air temperature by the fan, and the temperature management based on the driving control unit 12 of the temperature sensor on the fan driving board can effectively cope with scenarios such as downtime of the baseboard management controller 40 and / or the driving controller 121, and the temperature information collected by the temperature sensor can be used to design a temperature compensation control algorithm such as gain processing based on the driving controller 121 of the fan, so as to improve the heat dissipation control efficiency.

[0135] That is, in the circuit design of the drive control unit 12 such as the fan end drive board in the present application, the sensing unit 11 such as the temperature sensor and the auxiliary controller 122, the fusion controller 123 and the high-temperature protection circuit combined with the drive controller 121 are added, so that the current temperature can be collected and the hard protection mechanism of the system high temperature can be constructed, which can be beneficial to the stable operation of the heat dissipation control system 10 and the heat dissipation device in the scene of BMC (Baseboard Management Controller, baseboard management controller 40) or fan drive controller 121 downtime, so as to effectively dissipate heat for the electronic equipment. Moreover, the present application also increases the consideration of the current temperature change trend, and the temperature compensation control algorithm is combined with the change trend of the current temperature in the current control week, so as to be beneficial to improve the self-regulation and control ability of the heat dissipation efficiency of the heat dissipation assembly 30.

[0136] The description of the features in the corresponding embodiments of the heat dissipation device and the heat dissipation control system can be referred to the related description of the corresponding embodiments of the temperature management method, which will not be repeated here.

[0137] The embodiments of the present application provide a temperature management method, which is described in detail in combination with the execution process of the temperature management method.

[0138] Please refer to Figure 6 , Figure 6 The flowchart of an embodiment of the temperature management method of the present application.

[0139] It should be noted that the temperature management method can be applied to the heat dissipation control system in any of the above embodiments, or can be applied to the heat dissipation device in any of the above embodiments. In the present embodiment, the execution subject of the temperature management method is taken as the drive control unit of the heat dissipation control system described above as an example for illustration.

[0140] The heat dissipation control system can include a sensing unit and a drive control unit. The sensing unit is used for temperature monitoring of the electronic equipment to form a temperature signal; wherein the temperature signal represents the current temperature monitored; the drive control unit is connected with the sensing unit, used to connect with the heat dissipation assembly of the electronic equipment and the baseboard management controller and drive the heat dissipation assembly to be in working state, form a drive control signal matched with the temperature signal after obtaining the temperature signal, and generate an adjustment control signal by fusing the drive control signal and the heat dissipation control signal generated by the baseboard management controller based on the current temperature, to adjust the heat dissipation efficiency of the heat dissipation assembly.

[0141] The heat dissipation device can include a heat dissipation control system, a driving assembly, and a heat dissipation assembly as in the above embodiments; the heat dissipation control system is configured to generate an adjustment control signal; the driving assembly includes a driving circuit connected with the heat dissipation control system and configured to receive the adjustment control signal output by the heat dissipation control system to form driving electric energy; and the heat dissipation assembly is connected with the driving circuit and configured to receive the driving electric energy and dissipate heat from the electronic device.

[0142] S101: obtaining a current temperature sensed from the electronic device.

[0143] S102: obtaining a heat dissipation control signal generated by the baseboard management controller based on the current temperature.

[0144] S103: fusing the temperature signal and the heat dissipation control signal to generate an adjustment control signal; wherein the adjustment control signal is configured to adjust the heat dissipation efficiency of the heat dissipation assembly.

[0145] Therefore, the temperature of the electronic device can be sensed and a temperature signal can be generated based on the sensed current temperature. The driving control unit, as a driving controller of the heat dissipation assembly, can form a control instruction of the heat dissipation assembly based on the temperature signal while controlling the driving of the heat dissipation assembly, i.e., form a driving control signal matching the temperature signal. The driving control unit can also receive a control instruction of the heat dissipation assembly based on the current temperature, i.e., a heat dissipation control signal, fuse the heat dissipation control signal and the driving control signal to generate an adjustment control signal for adjusting the heat dissipation assembly. In other words, the driving control unit can control the heat dissipation efficiency of the heat dissipation assembly, thereby facilitating the guarantee of the heat dissipation effect and improving the operation reliability of the electronic device.

[0146] Please refer to Figure 7 , Figure 7 for a flowchart of another embodiment of the temperature management method.

[0147] S201: evaluating a temperature change amount in a current control period.

[0148] S202: obtaining an initial duty cycle sent by the baseboard management controller.

[0149] S203: determining whether the temperature change amount is a positive value.

[0150] In this embodiment, when the temperature change amount is a positive value, step S204 can be performed; when the temperature change amount is a negative value or not a positive value, step S205 can be performed.

[0151] S204: weighting the initial duty cycle by a first gain factor to obtain a driving duty cycle.

[0152] S205: weighting the initial duty cycle by a second gain factor to obtain a driving duty cycle.

[0153] S206: generating an adjustment control signal carrying the drive duty cycle.

[0154] Referring to Figure 8 , Figure 8 A flowchart of another embodiment of the temperature management method.

[0155] S301: obtaining a current temperature.

[0156] S302: determining whether the current temperature exceeds a temperature threshold.

[0157] In this embodiment, when it is determined that the current temperature exceeds the temperature threshold, step S303 can be performed; when it is determined that the current temperature does not exceed the temperature threshold, step S304 can be performed.

[0158] S303: triggering high-temperature protection, outputting an adjustment control signal to control the drive circuit to output an extreme value drive signal to drive the heat dissipation efficiency of the heat dissipation component to tend to an efficiency extreme value.

[0159] S304: obtaining initial modulation information sent by the baseboard management controller.

[0160] S305: gain processing the initial duty cycle to form drive modulation information.

[0161] S306: transmitting an adjustment control signal carrying the drive modulation information to the drive circuit.

[0162] Through the above description of the embodiments, those skilled in the art can clearly understand that the temperature management method according to the above embodiments can be realized by means of software and the necessary general hardware platform, and of course, it can also be realized by hardware.

[0163] The embodiments of the present application also provide an electronic device.

[0164] The electronic device includes a memory and a processor, the memory stores a computer program, and the processor is configured to run the computer program to perform the steps in any of the above temperature management method embodiments.

[0165] That is, the processor can at least obtain a current temperature obtained by temperature monitoring of the electronic device; obtain a heat dissipation control signal formed by the baseboard management controller based on the current temperature; and fuse the temperature signal and the heat dissipation control signal to generate an adjustment control signal; wherein the adjustment control signal is used to adjust the heat dissipation efficiency of the heat dissipation component.

[0166] Referring to Figure 9 , Figure 9 A structural diagram of an embodiment of the electronic device.

[0167] In an embodiment, the electronic device can be a server, and an internal structure diagram of the electronic device can be as shown in Figure 9

[0168] The electronic device includes a processor, a memory, a network interface and a database connected through a system bus. The processor of the electronic device is configured to provide computing and control capabilities. The memory of the electronic device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operating system and the computer program in the non-volatile storage medium to run. The database of the electronic device is configured to store data. The network interface of the electronic device is configured to communicate with an external terminal through a network connection. The computer program is executed by the processor to implement a temperature management method.

[0169] Embodiments of the present application also provide a computer readable storage medium.

[0170] The computer readable storage medium stores a computer program, and the computer program is configured to execute the steps in any of the above temperature management method embodiments when running.

[0171] That is, the computer program is configured to execute, when running, at least the following steps: obtaining a current temperature obtained by temperature monitoring of the electronic device; obtaining a heat dissipation control signal formed by the baseboard management controller based on the current temperature; fusing the temperature signal and the heat dissipation control signal to generate an adjustment control signal; and adjusting the heat dissipation efficiency of the heat dissipation component by using the adjustment control signal.

[0172] In an exemplary embodiment, the above computer readable storage medium can include, but is not limited to, a U disk, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk or an optical disk, and various media that can store computer programs.

[0173] Embodiments of the present application also provide a computer program product, and the computer program product includes a computer program. The computer program is executed by the processor to implement the steps in any of the above temperature management method embodiments.

[0174] That is, the computer program is executed by the processor to implement, at least, the following steps: obtaining a current temperature obtained by temperature monitoring of the electronic device; obtaining a heat dissipation control signal formed by the baseboard management controller based on the current temperature; fusing the temperature signal and the heat dissipation control signal to generate an adjustment control signal; and adjusting the heat dissipation efficiency of the heat dissipation component by using the adjustment control signal.

[0175] ​The embodiment of the present application further provides another computer program product, comprising a nonvolatile computer readable storage medium, the nonvolatile computer readable storage medium stores a computer program, the computer program is executed by a processor to implement the steps in any of the above temperature management method embodiments.

[0176] Those skilled in the art will further appreciate that the units and algorithms described in connection with the examples disclosed herein can be embodied directly in hardware, in software, or in a combination of the two. For the sake of brevity, descriptions of these conventional implementations are not included herein. Those skilled in the art will appreciate that the embodiments described herein can be practiced with a variety of computer systems including general purpose computers, computer modules specifically designed for the described implementations, and devices specifically configured to perform the described implementations.

[0177] The above provides a heat dissipation control system, a heat dissipation device, a temperature management method, an electronic device, a computer program product and a computer readable storage medium. The principles and implementation modes of the present application are described by applying specific examples. The above description of the embodiments is only applicable to help understand the method and its core idea. It should be pointed out that for those skilled in the art, without departing from the principles of the present application, some improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of the present application.

Claims

1. A heat dissipation control system, characterized in that, include: A sensing unit is used to monitor the temperature of an electronic device to generate a temperature signal; wherein the temperature signal represents the monitored current temperature; A drive control unit, connected to the sensing unit, is used to connect to the heat dissipation component and the substrate management controller of the electronic device and drive the heat dissipation component to work. After acquiring the temperature signal, it generates a drive control signal that matches the temperature signal. The drive control signal is fused with the heat dissipation control signal generated by the substrate management controller based on the current temperature to generate an adjustment control signal to adjust the heat dissipation efficiency of the heat dissipation component. The drive control unit includes a drive controller and an auxiliary controller; The drive controller is connected to the sensing unit and is used to acquire the temperature signal and the heat dissipation control signal to form a first control signal that matches the heat dissipation control signal. The auxiliary controller is connected to the sensing unit and is used to acquire the temperature signal and determine whether the current temperature represented by the temperature signal exceeds a temperature threshold in order to generate a second control signal as the drive control signal; wherein, the second control signal is used to fuse with the first control signal to form the adjustment control signal; When the second control signal indicates that the current temperature exceeds the temperature threshold, the adjustment control signal controls the heat dissipation efficiency of the heat dissipation component to tend towards the efficiency extreme value.

2. The heat dissipation control system according to claim 1, characterized in that, The auxiliary controller includes a first input terminal, a second input terminal, and a first output terminal; The first input terminal is connected to the sensing unit and is used to input the temperature signal; The second input terminal is used to input a threshold signal characterizing the temperature threshold. The auxiliary controller compares the temperature signal with the threshold signal to assess whether the current temperature exceeds the temperature threshold, and controls the first output terminal to output a second control signal of different levels.

3. The heat dissipation control system according to claim 2, characterized in that, The threshold signal input to the second input terminal is an electrical signal at the threshold level; When the temperature signal is input to the first input terminal of the auxiliary controller, the auxiliary controller identifies the level of the temperature signal as the observation level and compares the observation level with the threshold level. When the observed level is lower than the threshold level, the auxiliary controller controls its first output terminal to output a low-level second control signal; when the observed level is higher than the threshold level, the auxiliary controller controls its first output terminal to output a high-level second control signal.

4. The heat dissipation control system according to claim 1, characterized in that, The drive control unit further includes a fusion controller, which is connected to the drive controller and the auxiliary controller respectively; The fusion controller is also configured to connect to the drive circuit to form an adjustment control signal carrying drive modulation information after acquiring both the first control signal and the second control signal, and transmit the adjustment control signal to the drive circuit so that the drive circuit outputs drive power matching the drive modulation information to the heat dissipation component.

5. The heat dissipation control system according to claim 4, characterized in that, The driving modulation information includes the driving duty cycle; When the level of the second control signal indicates that the current temperature exceeds the temperature threshold, the fusion controller configures the current drive duty cycle to the duty cycle extreme value, so as to output the adjustment control signal to control the drive circuit to output the extreme value drive signal, which is used to drive the heat dissipation efficiency of the heat dissipation component to tend to the efficiency extreme value.

6. The heat dissipation control system according to claim 5, characterized in that, The heat dissipation assembly includes a fan; the fan is used to rotate at a calibrated extreme speed when receiving the extreme value drive signal.

7. The heat dissipation control system according to claim 4, characterized in that, The fusion controller includes an OR gate circuit; the OR gate circuit includes a third input terminal, a fourth input terminal, and a second output terminal. The third input terminal is connected to the drive controller; the fourth input terminal is connected to the auxiliary controller; and the second output terminal is used to connect to the drive circuit.

8. The heat dissipation control system according to claim 1, characterized in that, The heat dissipation control signal includes initial modulation information; wherein, the initial modulation information represents pulse modulation information generated by the substrate management controller based on the current temperature to drive the heat dissipation component. The drive control unit is used to perform gain processing on the initial modulation information after acquiring it to form drive modulation information, and to make the adjustment control signal carry the drive modulation information.

9. The heat dissipation control system according to claim 8, characterized in that, The initial modulation information includes the initial duty cycle; The drive control unit is used to evaluate the amount of temperature change within the current control cycle; wherein, the amount of temperature change represents the temperature difference between the current temperature and the previously acquired temperature. When the temperature change is positive, the initial duty cycle is weighted using a first gain factor to obtain the driving duty cycle; when the temperature change is negative, the initial duty cycle is weighted using a second gain factor to obtain the driving duty cycle; wherein, the first gain factor is greater than the second gain factor.

10. The heat dissipation control system according to claim 9, characterized in that, The first gain factor is greater than 1; the second gain factor is less than 1.

11. The heat dissipation control system according to claim 9, characterized in that, The drive control unit also includes an interaction port; The interactive port is used to input the updated gain combination; wherein, the updated gain combination includes a new first gain factor and a new second gain factor for the target update; When the updated gain combination is obtained through the interaction port, the drive control unit identifies the updated gain combination, parses the new first gain factor and the new second gain factor, and updates the first gain factor and the second gain factor stored in its internal storage to the new first gain factor and the new second gain factor.

12. The heat dissipation control system according to claim 11, characterized in that, When the updated gain combination is obtained, the drive control unit identifies the update trends of the first gain factor and the second gain factor to form an update trend combination, and controls the heat dissipation component to switch to different energy consumption modes based on different update trend combinations.

13. The heat dissipation control system according to claim 12, characterized in that, When the update trend combination is such that the update trend of the first gain factor is increasing and the update trend of the second gain factor is decreasing, the drive control unit controls the heat dissipation component to operate in efficiency mode. When the update trend combination is such that the update trend of the first gain factor is decreasing and the update trend of the second gain factor is increasing, the drive control unit controls the heat dissipation component to operate in energy-saving mode. The energy consumption of the heat dissipation component in the energy-saving mode is lower than that in the efficiency mode.

14. The heat dissipation control system according to claim 1, characterized in that, The number of drive control units is multiple, and the number of sensing units is multiple; The plurality of sensing units are used to form a plurality of sensing and heat dissipation components with the plurality of heat dissipation components, and the plurality of sensing and heat dissipation components are respectively disposed at a plurality of locations of the electronic device; Each of the drive control units is connected to the sensing and heat dissipation components and is used to receive the temperature signal input by the sensing and heat dissipation components to generate an adjustment control signal that is transmitted to the heat dissipation components to which it is connected.

15. A heat dissipation device, characterized in that, include: The heat dissipation control system as described in any one of claims 1 to 14 is used to generate an adjustment control signal; The driving component includes a driving circuit, which is connected to the heat dissipation control system and is used to receive the adjustment control signal output by the heat dissipation control system to generate driving power. A heat dissipation component, connected to the drive circuit, is used to receive the drive power and dissipate heat from the electronic device in which it is located.

16. A temperature management method, characterized in that, The temperature management method, applied to the heat dissipation control system as described in any one of claims 1 to 14 or the heat dissipation device as described in claim 15, comprises: Obtain the current temperature from temperature monitoring of the electronic device; Obtain the heat dissipation control signal generated by the substrate management controller based on the current temperature; The temperature signal and the heat dissipation control signal are combined to generate an adjustment control signal; wherein the adjustment control signal is used to adjust the heat dissipation efficiency of the heat dissipation component.

17. An electronic device, characterized in that, include: Memory, used to store computer programs; A processor, configured to implement the steps of the temperature management method as described in claim 16 when executing the computer program.

18. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by the processor, it implements the steps of the temperature management method of claim 16.

19. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program, wherein the computer program, when executed by a processor, implements the steps of the temperature management method as described in claim 16.

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