Wafer processing equipment and feeding method

Abstract

The invention discloses wafer processing equipment and a feeding method. The equipment comprises a bearing part, a feeding assembly and a detection part. The bearing surface of the bearing part is used for bearing a wafer, the bearing surface is provided with at least two adsorption areas, and the at least two adsorption areas comprise a central adsorption area arranged at the horizontal center of the bearing part and a peripheral adsorption area arranged at the edge of the bearing part; the feeding assembly comprises a feeding part, the feeding part is used for supporting the wafer so as to place the wafer on the bearing surface, and the detection piece is used for detecting the position of the wafer placed on the bearing surface. Wherein an avoiding groove is formed in the bearing surface, and an opening for the feeding part to enter is formed in the side of the avoiding groove. The present application facilitates concentric arrangement of the wafer and the carrier.

Description

Technical Field

[0001] The present application relates to the technical field of wafer processing equipment, and in particular to a wafer processing equipment and a loading method. Background Art

[0002] During the wafer processing, the wafer needs to be positioned and fixed with high precision to ensure the processing quality of the wafer. In the related art, the wafer is usually fixed by vacuum adsorption through adsorption holes on the carrier.

[0003] However, after the wafer is placed on the carrier, it often becomes misaligned with the carrier, resulting in low loading accuracy. This concentricity deviation can cause the wafer to not fully cover the suction holes on the carrier, or cause some suction holes to be outside the edge of the wafer, resulting in vacuum leakage. The occurrence of vacuum leakage weakens the suction force, resulting in a loose fixation of the wafer. During subsequent processing, it may shift or even fall off, affecting the processing quality of the wafer. Summary of the Invention

[0004] In response to the above-mentioned deficiencies in the related art, the present application provides a wafer processing equipment and a loading method to solve the problem of non-concentricity between the wafer and the carrier in the related art.

[0005] In order to solve the above technical problems, in a first aspect, the present application provides a wafer processing device, which includes: A carrier, the carrier having a carrying surface for carrying a wafer, the carrying surface having at least two adsorption areas, the at least two adsorption areas comprising a central adsorption area disposed at a horizontal center of the carrier and a peripheral adsorption area disposed at an edge of the carrier; A loading assembly, comprising a loading portion, the loading portion being used to support the wafer so as to place the wafer on the carrying surface; A detection member, used for detecting the position of the wafer placed on the carrying surface; Wherein, an avoidance groove is provided on the bearing surface, and a side of the avoidance groove has an opening for the feeding part to enter.

[0006] In a possible implementation of the first aspect, the avoidance groove is located between the peripheral adsorption area and the central adsorption area, and is arranged outside at least a portion of a circumferential edge of the central adsorption area; The peripheral adsorption zone surrounds a portion of the circumferential outer side of the central adsorption zone, and the peripheral adsorption zone forms the opening at two opposite ends of the circumferential direction of the central adsorption zone.

[0007] In a possible implementation of the first aspect, a plurality of adsorption holes are provided in each of the adsorption areas; The wafer processing equipment further includes: A vacuum pumping component is connected to each of the adsorption holes, and is used to vacuum each of the adsorption holes to adsorb and fix the wafer.

[0008] In a possible implementation of the first aspect, the plurality of adsorption holes in the central adsorption area are enclosed into a plurality of circular arrays concentric with the horizontal center; and / or, The plurality of adsorption holes in the peripheral adsorption area are sequentially arranged along the extension direction of the arc, and the arc is concentric with the horizontal center.

[0009] In a possible implementation of the first aspect, the wafer processing equipment further includes: A position adjustment component, used for driving the bearing member to move so as to change the position of the bearing member in the horizontal direction; A controller is electrically connected to the detection member and the position adjustment component. The controller is used to enable the position adjustment component to drive the carrier to move based on the position information detected by the detection member, so as to adjust the position of the carrier and make the horizontal center of the carrier coincide with the center position of the wafer.

[0010] In a possible implementation of the first aspect, the position adjustment component includes: a first adjusting unit, configured to drive the carrier to move along a first horizontal direction; A second adjustment unit is used to drive the supporting member to move along a second horizontal direction, and the first horizontal direction is perpendicular to the second horizontal direction.

[0011] In a possible implementation of the first aspect, the carrying device includes: a mounting seat, wherein the bearing member is arranged on the mounting seat; The first adjustment unit includes: a first guide seat, configured to cooperate with the mounting seat in a guiding manner in the first horizontal direction; a first driving member, electrically connected to the controller and configured to drive the mounting base to move along the first horizontal direction on the first guide base; The second adjustment unit includes: a second guide seat, cooperating with the first guide seat in guiding in the second horizontal direction; The second driving member is electrically connected to the controller and is used to drive the first guide seat to move along the second horizontal direction on the second guide seat.

[0012] In a possible implementation of the first aspect, the detection member includes a camera, which is disposed above the carrier and is configured to capture an image in a direction toward the wafer to detect the position of the wafer; or, The detection component includes an edge finder, which is arranged close to the edge of the carrier to detect the position of the wafer by detecting the position of a point on the edge of the wafer.

[0013] In a second aspect, the present application further provides a loading method, which is applied to the wafer processing equipment described in any one of the first aspects, and the method comprises: Using the loading portion of the loading assembly to support the wafer, so as to place the wafer on the carrying surface of the carrier; Using the central adsorption area on the carrying surface to adsorb and fix the wafer, wherein the central adsorption area is arranged at the horizontal center of the carrying member; Detecting the position of the wafer placed on the carrying surface using a detection component to obtain the position of the center of the wafer; Then, the loading portion is used to support the adsorbed surface of the wafer so as to separate the wafer from the carrying surface; The detected position information of the wafer is received, and the position of the carrier is adjusted according to the position information so that the horizontal center of the carrier coincides with the center position of the wafer.

[0014] In a possible implementation of the second aspect, after receiving the detected position information of the wafer and adjusting the position of the carrier according to the position information so that the horizontal center of the carrier coincides with the center position of the wafer, the method further includes: Then, the loading portion is used to support the wafer so as to place the wafer on the carrying surface; The wafer is fixed by adsorbing the central adsorption area and the peripheral adsorption area on the carrying surface, wherein the peripheral adsorption area is arranged at the edge of the carrying component.

[0015] Compared with the related art, this application has at least the following beneficial effects: In this application, when concentrically positioning the wafer and the carrier, the wafer is first supported by the loading portion of the loading assembly and placed on the carrier's carrying surface. The wafer can then be held by the central suction zone on the carrying surface. Even if there is a concentricity deviation between the wafer and the carrier, the central suction zone, located at the horizontal center of the carrier, can still be covered by the wafer. This means that there will be no vacuum leakage and the central suction zone can hold the wafer in place.

[0016] Subsequently, the detection component detects the position of the wafer on the carrier. When the detection is completed and the wafer is removed from the carrier, the position of the carrier can be adjusted based on the position information detected by the detection component so that the horizontal center of the carrier can coincide with the center position of the wafer placed on the carrier. In this way, while the spatial position of the wafer placed on the carrier by the loading assembly remains unchanged, the center of the wafer placed on the carrier again is conducive to aligning with the horizontal center position of the carrier, that is, it is conducive to concentric arrangement of the carrier and the wafer.

[0017] This improves the concentric positioning accuracy between the wafer and the carrier, allowing the wafer to completely cover the adsorption area on the carrier, thereby ensuring the adsorption force on the wafer and firmly fixing the wafer. This prevents the wafer from shifting or falling off during subsequent processing, ensuring the processing quality of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 A three-dimensional diagram of a portion of the structure of a wafer processing device provided in an embodiment of the present application; Figure 2 for Figure 1 A top view of Figure 3 for Figure 1 The main view; Figure 4 A top view of a carrier provided in an embodiment of the present application; Figure 5 One of the flow charts of the loading method provided in the embodiment of the present application; Figure 6 This is the second flow chart of the loading method provided in the embodiment of the present application.

[0020] Description of reference numerals: 1-carrying member; 11-carrying surface; 111-central adsorption area; 112-peripheral adsorption area; 12-adsorption hole; 13-avoidance groove; 14-opening; 2-feeding assembly; 21-feeding part; 3-Testing parts; 4-position adjustment assembly; 41-first adjustment unit; 411-first guide seat; 42-second adjustment unit; 421-second guide seat; 5-Mounting seat; 6- Rotational drive element. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0022] In this application, terms such as "upper," "lower," "left," "right," "front," "back," "top," "bottom," "inner," "outer," "vertical," "horizontal," "transverse," and "longitudinal" indicate positions or locations based on the positions or locations shown in the accompanying drawings. These terms are primarily intended to better describe this application and its embodiments and are not intended to limit the devices, elements, or components indicated to having a specific orientation, or to being constructed or operated in a specific orientation.

[0023] Furthermore, some of the above terms may be used to express other meanings besides indicating a position or location. For example, the term "on" may also be used to indicate a dependency or connection in certain circumstances. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0024] Furthermore, the terms "installed," "disposed," "provided with," "connected," and "connected" should be interpreted broadly. For example, they can refer to fixed connections, removable connections, or integral structures; mechanical connections or electrical connections; direct connections, indirect connections through an intermediary, or internal communication between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0025] Furthermore, the terms "first," "second," and the like are primarily used to distinguish different devices, elements, or components (which may or may not be the same in type and configuration) and are not intended to indicate or imply the relative importance or quantity of the devices, elements, or components indicated. Unless otherwise specified, "plurality" means two or more.

[0026] As described in the background of this application, during wafer processing, wafers need to be positioned and fixed with high precision to ensure the processing quality of the wafers. In related technologies, wafers are usually fixed by vacuum adsorption through adsorption holes on a carrier.

[0027] However, after the wafer is placed on the carrier, it often becomes misaligned with the carrier, resulting in low loading accuracy. This concentricity deviation can cause the wafer to not fully cover the suction holes on the carrier, or cause some suction holes to be outside the edge of the wafer, resulting in vacuum leakage. The occurrence of vacuum leakage weakens the suction force, resulting in a loose fixation of the wafer. During subsequent processing, it may shift or even fall off, affecting the processing quality of the wafer.

[0028] In view of the above-mentioned problems, the present application provides a wafer processing device to solve the problem of non-concentricity between the wafer and the carrier in the related art.

[0029] The technical solution of this application will be further described below with reference to specific embodiments and drawings: like Figure 1 、 Figure 2 and Figure 3 As shown, the wafer processing equipment includes a carrier 1, a loading assembly 2, and a detection component 3. Figure 1 and Figure 4 As shown, the carrier 1 has a carrying surface 11, which is used to carry wafers. The carrying surface 11 has at least two adsorption areas, including a central adsorption area 111 arranged at the horizontal center of the carrier 1 and a peripheral adsorption area 112 arranged at the edge of the carrier 1.

[0030] like Figure 1 、 Figure 2 and Figure 3 As shown, the loading assembly 2 includes a loading portion 21 for supporting the wafer so as to place the wafer on the carrying surface 11. The detection member 3 is used to detect the position of the wafer placed on the carrying surface 11 for the first time.

[0031] Among them, such as Figure 1 and Figure 2 As shown, an avoidance groove 13 is provided on the bearing surface 11 , and an opening 14 for the loading portion 21 to enter is provided on the side of the avoidance groove 13 .

[0032] In the present application, when concentrically positioning the wafer and the carrier 1, first, the wafer is supported by the loading portion 21 of the loading assembly 2 and placed on the carrying surface 11 of the carrier 1. The wafer can then be adsorbed by the central adsorption area 111 on the carrying surface 11. At this time, even if there is a concentricity deviation between the wafer and the carrier 1, the central adsorption area 111 can still be covered by the wafer because it is located at the horizontal center of the carrier 1. In other words, there will be no vacuum leakage at this time, and the central adsorption area 111 can adsorb and fix the wafer.

[0033] Subsequently, the detection member 3 detects the position of the wafer on the carrier 1. When the detection is completed and the wafer is removed from the carrier 1, the position of the carrier 1 can be adjusted based on the position information detected by the detection member 3 so that the horizontal center of the carrier 1 coincides with the center position of the wafer placed on the carrier 1. In this way, while the spatial position of the wafer placed on the carrier 1 by the loading assembly 2 remains unchanged, the center of the wafer placed on the carrier 1 again is facilitated to coincide with the horizontal center position of the carrier 1, that is, the carrier 1 and the wafer are arranged concentrically.

[0034] In this way, the concentric positioning accuracy of the wafer and the carrier 1 can be improved, and the wafer can completely cover the adsorption area on the carrier 1, thereby ensuring the adsorption force on the wafer and firmly fixing the wafer. In this way, during the subsequent processing, the wafer can be prevented from being displaced or falling off, and the processing quality of the wafer can be guaranteed.

[0035] According to the above description, since the concentric positioning of the carrier 1 and the wafer can be achieved directly on the carrier 1 by two pick-up and placement operations in this application, no additional transfer positioning platform is required, which can simplify the structural composition and reduce manufacturing costs.

[0036] It should be explained that the horizontal center of the carrier 1 coincides with the center of the wafer, which means that the horizontal center of the carrier 1 and the center of the wafer are located on the same central axis, that is, the center of the wafer is on the rotation axis of the carrier 1.

[0037] In addition, since there is an opening 14 on the side of the avoidance groove 13 for the loading part 21 to enter, during the process of the loading component 2 placing the wafer on the supporting surface 11, the loading part 21 can enter the avoidance groove 13 through the opening 14, and at the same time, the loading part 21 can also be moved to the placement position, so that the wafer supported on the loading part 21 can be placed on the supporting surface 11.

[0038] According to the above description, it can be seen that the opening 14 and the avoidance groove 13 can avoid interference between the loading part 21 and the carrying surface 11, ensuring that the loading part 21 can smoothly place the wafer on the carrying surface 11, providing a stable prerequisite for subsequent precise positioning and adsorption and fixing of the wafer, and improving the smoothness and reliability of the loading process.

[0039] Regarding the loading assembly 2, further, in some optional embodiments, the loading assembly 2 may further include a robotic arm, which may be a four-axis or six-axis robotic arm, etc. In this case, the loading portion 21 may be a supporting claw provided at the end of the robotic arm.

[0040] With this arrangement, the high-precision motion control of the robotic arm can be utilized to enable the support claws to accurately transfer the wafer, ensuring that the wafer is stably and accurately positioned close to the carrying surface 11 .

[0041] In other optional embodiments, the loading portion 21 may also be a vacuum suction cup provided at the end of the robotic arm. The vacuum suction cup may fix the side of the wafer away from the carrier 1 by adsorbing and placing the wafer on the carrier surface 11 .

[0042] In other embodiments, the loading assembly 2 may also be composed of an XY linear module or an XYZ linear module, wherein the XY linear module has two linear transmission directions, the X direction and the Y direction, and the XYZ linear module has three linear transmission directions, the X direction, the Y direction, and the Z direction. The structural configuration of the loading assembly 2 is relatively flexible and can be specifically configured according to actual needs, and this embodiment of the present application does not specifically limit this.

[0043] Regarding the number of peripheral adsorption areas 112, in the embodiment of the present application, there can be one, two or more peripheral adsorption areas 112. The number of peripheral adsorption areas 112 can be set flexibly. Specifically, it can be set according to actual needs. The embodiment of the present application does not make any specific limitation on this.

[0044] Regarding the shape of the adsorption area, in the embodiment of the present application, the shape of the adsorption area includes but is not limited to annular, circular, prismatic, rectangular, etc. The shape of the adsorption area is flexible. Specifically, it can be set according to actual needs. The embodiment of the present application does not make specific limitations on this.

[0045] Furthermore, in some optional embodiments, there is a distance between two adjacent adsorption areas in the horizontal direction.

[0046] Such a setting can ensure that the carrier 1 has a larger range of adsorption and fixation for the wafer, thereby ensuring the firmness of the carrier 1 in adsorbing and fixing the wafer, and at the same time can reduce the number of adsorption holes 12 to a certain extent, thereby helping to simplify the setting of the adsorption holes 12 on the carrier 1.

[0047] Furthermore, in some optional embodiments, as Figure 1 and Figure 4 As shown, the avoidance groove 13 is located between the peripheral adsorption area 112 and the central adsorption area 111 , and is disposed outside at least a portion of the circumferential edge of the central adsorption area 111 .

[0048] The peripheral adsorption area 112 surrounds a portion of the circumferential outer side of the central adsorption area 111 , and the peripheral adsorption area 112 forms openings 14 at two opposite ends of the circumferential direction of the central adsorption area 111 .

[0049] Such an arrangement can not only ensure a distance between the adjacent peripheral adsorption areas 112 and the central adsorption area 111 through the avoidance groove 13, but also provide sufficient space for setting the avoidance groove 13 through the distance between the peripheral adsorption area 112 and the central adsorption area 111, thereby facilitating the arrangement of the avoidance groove 13 on the bearing surface 11.

[0050] In other embodiments, the avoidance groove 13 may be located on a side of the peripheral adsorption zone 112 away from the central adsorption zone 111 , and the avoidance groove 13 may be disposed outside at least a portion of the circumferential edge of the peripheral adsorption zone 112 .

[0051] Such a configuration can reduce the restrictions of the peripheral adsorption area 112 and the central adsorption area 111 on the processing of the avoidance groove 13 , which is conducive to facilitating the processing of the avoidance groove 13 on the carrier 1 .

[0052] In some optional embodiments, such as Figure 4 As shown, a plurality of adsorption holes 12 are provided in each adsorption area, and the wafer processing equipment further includes a vacuum pumping component (not shown in the figure), which is connected to each adsorption hole 12 and is used to vacuum each adsorption hole 12 to adsorb and fix the wafer.

[0053] The design of setting multiple adsorption holes 12 in each adsorption area and vacuuming by a vacuum assembly can make the adsorption force evenly distributed on the contact surface of the wafer, avoiding local excessive force causing deformation or damage to the wafer; at the same time, the synergistic effect of multiple adsorption holes 12 can enhance the overall adsorption strength. Even if the adsorption strength of individual adsorption holes 12 is insufficient, the remaining adsorption holes 12 can still maintain a stable adsorption effect, effectively preventing the wafer from shifting or falling off during the processing process, providing reliable fixation guarantee for high-precision processing, and further improving the stability of processing quality.

[0054] In the embodiment of the present application, the vacuum pump component may include a vacuum pump or a vacuum generator, that is, the vacuum pump or vacuum generator is connected to the adsorption hole 12. The structural composition of the vacuum pump component is relatively flexible. Specifically, it can be set according to actual needs. The embodiment of the present application does not make specific limitations on this.

[0055] In other embodiments, the adsorption area can also adsorb and fix the wafer by means of a suction cup or air pressure adsorption. The way in which the adsorption area adsorbs and fixes the wafer is relatively flexible. Specifically, it can be determined according to actual needs. The embodiments of the present application do not make specific limitations on this.

[0056] Furthermore, in some optional embodiments, as Figure 4 As shown, the multiple adsorption holes 12 in the central adsorption area 111 are surrounded by multiple circular arrays concentric with the above-mentioned horizontal center.

[0057] This arrangement allows the adsorption holes 12 in the central adsorption area 111 to exert a uniform and symmetrical adsorption force on the wafer, ensuring balanced force on the wafer during initial fixation and preventing wafer deflection due to uneven local adsorption force. Furthermore, the concentric circular array layout corresponds to the horizontal center of the carrier 1. Even if there is a slight positional deviation during initial placement of the wafer, the adsorption holes 12 in the central adsorption area 111 are more likely to effectively contact the wafer, ensuring the stability of the initial adsorption, laying a good foundation for subsequent concentric adjustments, and further reducing the risk of vacuum leakage.

[0058] In other embodiments, the plurality of adsorption holes 12 in the central adsorption area 111 may also be arranged in a rectangular array, a pentagonal array, or a triangular array. The arrangement of the adsorption holes 12 is relatively flexible and can be specifically configured according to actual needs, and is not specifically limited in this embodiment of the present application.

[0059] In some optional embodiments, such as Figure 4 As shown, the plurality of adsorption holes 12 in the peripheral adsorption area 112 are sequentially arranged along the extension direction of the arc, and the arc is concentric with the above-mentioned horizontal center.

[0060] Such a configuration allows the adsorption holes 12 in the peripheral adsorption area 112 to form a uniform and symmetrical adsorption force on the wafer, ensuring that the wafer is subjected to balanced force when fixed, and avoiding wafer deflection due to uneven local adsorption force.

[0061] In other embodiments, the plurality of adsorption holes 12 in the peripheral adsorption area 112 may also be arranged in a rectangular array, a pentagonal array, or a triangular array. The arrangement of the adsorption holes 12 is relatively flexible and can be specifically configured according to actual needs, and is not specifically limited in this embodiment of the present application.

[0062] In some optional embodiments, such as Figure 4 As shown, the multiple adsorption holes 12 in the central adsorption area 111 are surrounded by multiple circular arrays concentric with the above-mentioned horizontal center, and the multiple adsorption holes 12 in the peripheral adsorption area 112 are arranged in sequence along the extension direction of the arc, and the arc is concentric with the above-mentioned horizontal center.

[0063] Such a configuration allows the adsorption holes 12 on the entire carrying surface 11 to form a uniform and symmetrical adsorption force on the wafer, which can further ensure that the wafer is subjected to balanced force when fixed and can further avoid wafer deflection due to uneven local adsorption force.

[0064] In some optional embodiments, such as Figure 1 、 Figure 2 and Figure 3As shown, the wafer processing equipment further includes a position adjustment component 4 and a controller (not shown in the figure). The position adjustment component 4 is used to drive the carrier 1 to move so as to change the position of the carrier 1 in the horizontal direction.

[0065] The controller is electrically connected to the detection part 3 and the position adjustment component 4. The controller is used to drive the position adjustment component 4 to move the carrier 1 according to the position information detected by the detection part 3, so as to adjust the position of the carrier 1 and make the horizontal center of the carrier 1 coincide with the center position of the wafer.

[0066] The controller is electrically connected to the detection element 3 and the position adjustment assembly 4. Based on the wafer position information obtained by the detection element 3, it precisely controls the position adjustment assembly 4 to drive the carrier 1 in the horizontal direction, thereby aligning the horizontal center of the carrier 1 with the center of the wafer. This automated closed-loop control mode avoids the errors and inefficiencies of manual adjustment, provides a stable baseline for subsequent adsorption, fixation, and processing operations, and significantly improves the accuracy and efficiency of wafer processing.

[0067] In other embodiments, the operator can manually adjust the position of the carrier 1 based on the position information detected by the detection member 3. In this way, the controller and the position adjustment component 4 can be omitted, which can simplify the composition of the wafer processing equipment and reduce manufacturing costs.

[0068] Furthermore, in some optional embodiments, as Figure 1 、 Figure 2 and Figure 3 As shown, the position adjustment assembly 4 includes a first adjustment unit 41 and a second adjustment unit 42. The first adjustment unit 41 is used to drive the carrier 1 to move along a first horizontal direction (eg Figure 2 The second adjustment unit 42 is used to drive the carrier 1 to move along the second horizontal direction (such as Figure 2 The first horizontal direction moves in the Y direction, and the first horizontal direction is perpendicular to the second horizontal direction.

[0069] Such a setting can realize the two-dimensional precise movement of the carrier 1 in the horizontal direction, and can flexibly and comprehensively adjust the position of the carrier 1 to ensure that no matter whether there is a deviation in the X direction or the Y direction of the initial placement of the wafer, the corresponding adjustment unit can be driven to make the carrier 1 and the wafer quickly reach a concentric state, greatly improving the accuracy and efficiency of the position adjustment, and providing a reliable guarantee for the subsequent stable adsorption and fixation of the wafer.

[0070] In other embodiments, the position adjustment assembly 4 may include only the first adjustment unit 41 or the second adjustment unit 42. This configuration can simplify the structure of the position adjustment assembly 4, facilitate the manufacture of the position adjustment assembly 4, and reduce manufacturing costs.

[0071] Furthermore, in some optional embodiments, as Figure 1 、 Figure 2 and Figure 3 As shown, the wafer processing equipment includes a mounting seat 5 , and the carrier 1 is arranged on the mounting seat 5 .

[0072] like Figure 1 、 Figure 2 and Figure 3 As shown, the first adjustment unit 41 includes a first guide seat 411 and a first driving member (not shown in the figure), wherein the first guide seat 411 is guided and matched with the mounting seat 5 in the first horizontal direction, and the first driving member is electrically connected to the controller and is used to drive the mounting seat 5 to move along the first horizontal direction on the first guide seat 411.

[0073] like Figure 1 、 Figure 2 and Figure 3 As shown, the second adjustment unit 42 includes a second guide seat 421 and a second driving member (not shown in the figure), wherein the second guide seat 421 is guided and cooperated with the first guide seat 411 in the second horizontal direction, and the second driving member is electrically connected to the controller and is used to drive the first guide seat 411 to move along the second horizontal direction on the second guide seat 421.

[0074] Such an arrangement can not only ensure the stability and accuracy of the movement of the carrier 1 in two vertical and horizontal directions, but also make the structure of the position adjustment component 4 more compact, which is conducive to reducing the space occupied by the position adjustment component 4.

[0075] In the embodiment of the present application, the guiding cooperation between the first guide seat 411 and the mounting seat 5, and the guiding cooperation between the second guide seat 421 and the first guide seat 411, can be achieved through guiding rails and guide grooves, or through guiding rods and guide holes. The guide rails can be air-floating guide rails.

[0076] It can be seen from the above description that the structural setting of the guide cooperation is relatively flexible. Specifically, it can be set according to actual needs. The embodiments of the present application do not make specific limitations on this.

[0077] In the embodiment of the present application, the first driving member and the second driving member can be a linear motor, a cylinder or a hydraulic cylinder, etc. The type selection of the first driving member and the second driving member is relatively flexible. Specifically, it can be selected according to actual needs. The embodiment of the present application does not make specific limitations on this.

[0078] In an embodiment of the present application, the first driving member and the second driving member can be directly connected to the corresponding mounting seat 5 or the first guide seat 411, or can be indirectly connected to the corresponding mounting seat 5 or the first guide seat 411 through a screw nut mechanism, a gear rack mechanism or a synchronous belt mechanism.

[0079] The connection method between the first driving member and the second driving member and the corresponding mounting seat 5 or the first guide seat 411 is relatively flexible. Specifically, it can be selected according to actual needs, and the embodiment of the present application does not make specific limitations on this.

[0080] In other embodiments, the first adjustment unit 41 may only include the first driving member, the second adjustment unit 42 may only include the second driving member, and the driving ends of the first driving member and the second driving member are both in contact with the mounting seat 5 .

[0081] With such arrangement, on the one hand, when the first driving member is driven, the driving end of the second driving member is fixed and does not move, and the mounting seat 5 can move along the first horizontal direction relative to the driving end of the second driving member; when the second driving member is driven, the driving end of the first driving member is fixed and does not move, and the mounting seat 5 can move along the second horizontal direction relative to the driving end of the first driving member.

[0082] On the other hand, the structural composition of the first adjustment unit 41 and the second adjustment unit 42 can be simplified, which is conducive to facilitating the manufacture of the first adjustment unit 41 and the second adjustment unit 42 and reducing the manufacturing cost.

[0083] In some optional embodiments, the detection component 3 includes a camera, which is disposed above the carrier 1 and is used to capture images in a direction toward the wafer to detect the position of the wafer.

[0084] With this setup, the camera captures the wafer's contour features (such as edges, notches, etc.) by capturing an image of the wafer placed on carrier 1. Based on the captured image, an image recognition algorithm can be used to analyze the contours, extract the wafer's geometric center parameters, and accurately determine its center position.

[0085] This non-contact detection method does not cause physical damage to fragile wafers, which helps reduce costs. At the same time, based on the divisional adsorption of the central adsorption area 111 and the peripheral adsorption area 112, combined with the camera's visual positioning, it helps to solve the problems of low wafer placement accuracy and the inability to autonomously position and detect.

[0086] In some further optional embodiments, the detection member 3 includes an edge finder, which is disposed near the edge of the carrier 1 to detect the position of the wafer by detecting the position of a point on the edge of the wafer.

[0087] With such a setting, the coordinate information of at least three non-collinear points on the edge can be obtained through contact or non-contact sensing between the edge finder and the edge of the wafer, and based on the coordinate information of these points, the center position of the wafer can be calculated by using geometric calculations (such as determining the center of a circle by three points), which can provide an effective basis for the controller to adjust the position of the carrier 1 to achieve concentric arrangement.

[0088] Furthermore, in some optional embodiments, as Figure 1 、 Figure 2 and Figure 3 As shown, the wafer processing equipment further includes a rotary driving member 6 , which is disposed on the mounting seat 5 . The rotary driving member 6 is used to drive the carrier 1 to rotate, and the carrier 1 is disposed on the mounting seat 5 through the rotary driving member 6 .

[0089] With this arrangement, when the rotary drive member 6 drives the carrier 1 to rotate, it can also drive the wafer to rotate synchronously. This not only facilitates the detection of the coordinate information of at least three non-collinear points on the wafer edge, but also enables the detection member 3 to perform multiple inspections of its edge or contour at different angles. By obtaining multiple sets of position data, the error of a single inspection can be reduced, and the accuracy of the center position calculation can be improved.

[0090] Especially when there are local defects on the edge of the wafer or the detection angle is limited, resulting in incomplete single detection, the rotation process allows the detection part 3 to capture more comprehensive edge information, ensure a more reliable judgment of the center position, and provide a more accurate basis for the subsequent concentric adjustment of the carrier 1 and the wafer.

[0091] In the embodiment of the present application, the rotating drive component 6 can be a DD motor (direct drive motor), a servo motor or a stepper motor, etc. The type of the rotating drive component 6 can be selected flexibly. Specifically, it can be selected according to actual needs. The embodiment of the present application does not make any specific restrictions on this.

[0092] In addition, the wafer processing equipment also includes a processing device, which is used to process the wafer carried on the carrying surface 11, and the processing device can be a laser processing device. The type of processing device can be selected flexibly. Specifically, it can be selected according to actual needs. The embodiment of the present application does not make specific limitations on this.

[0093] Figure 5 This is a flow chart of a loading method provided in an embodiment of the present application. This method can be applied to any wafer processing equipment in the above embodiments, and as Figure 5 As shown, the method includes: S501 : Using the loading portion 21 of the loading assembly 2 to support the wafer, so as to place the wafer on the carrying surface 11 of the carrier 1 .

[0094] S502 : Using the central adsorption area 111 on the carrying surface 11 to adsorb and fix the wafer. The central adsorption area 111 is located at the horizontal center of the carrier 1 .

[0095] S503: Using the detection component 3 to detect the position of the wafer placed on the carrying surface 11 to obtain the center position of the wafer.

[0096] S504 : The loading portion 21 is used to support the adsorbed surface of the wafer to separate the wafer from the carrying surface 11 .

[0097] S505: Receive the detected position information of the wafer, and adjust the position of the carrier 1 according to the position information so that the horizontal center of the carrier 1 coincides with the center position of the wafer.

[0098] This arrangement improves the concentric positioning accuracy of the wafer and carrier 1 when the wafer and carrier 1 are concentrically positioned, allowing the wafer to completely cover the adsorption area on the carrier 1, thereby ensuring the adsorption force on the wafer and firmly fixing the wafer. This prevents the wafer from shifting or falling off during subsequent processing, thereby ensuring the processing quality of the wafer.

[0099] Furthermore, in some optional embodiments, as Figure 6 As shown, after S505: receiving the detected position information of the wafer and adjusting the position of the carrier 1 according to the position information so that the horizontal center of the carrier 1 coincides with the center position of the wafer, the method further includes: S506 : Using the loading portion 21 to support the wafer again, so as to place the wafer on the carrying surface 11 .

[0100] S507 : Using the central adsorption area 111 and the peripheral adsorption area 112 on the carrier surface 11 to adsorb and fix the wafer.

[0101] In this way, the wafer is placed on the carrier 1 for the first time, the central adsorption area 111 adsorbs the wafer, and the position of the center of the wafer is obtained by the detection part 3. After the loading part 21 removes the wafer, the position of the carrier 1 is adjusted according to the position of the center of the wafer, and then the wafer is placed on the carrier 1 for the second time, so that the center of the wafer coincides with the horizontal center of the carrier 1; and through the joint action of the central adsorption area 111 and the peripheral adsorption area 112, a uniform and strong adsorption force can be formed, which can further strengthen the fixation of the wafer, further prevent it from being displaced or falling off in subsequent processing, and effectively ensure the stability of the wafer processing quality.

[0102] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A wafer processing equipment, characterized in that: include: A carrier (1), the carrier (1) having a carrier surface (11), the carrier surface (11) being used to carry a wafer, the carrier surface (11) having at least two adsorption areas, the at least two adsorption areas comprising a central adsorption area (111) arranged at the horizontal center of the carrier (1) and a peripheral adsorption area (112) arranged at the edge of the carrier (1); A loading assembly (2), the loading assembly (2) comprising a loading portion (21), the loading portion (21) being used to support the wafer so as to place the wafer on the carrying surface (11); A detection member (3) for detecting the position of the wafer placed on the carrying surface (11); Wherein, an avoidance groove (13) is provided on the bearing surface (11), and an opening (14) for the loading portion (21) to enter is provided on the side of the avoidance groove (13).

2. The wafer processing equipment according to claim 1, wherein: The avoidance groove (13) is located between the peripheral adsorption area (112) and the central adsorption area (111), and is arranged outside at least a portion of the circumferential edge of the central adsorption area (111); The peripheral adsorption area (112) surrounds a portion of the circumferential outside of the central adsorption area (111), and the peripheral adsorption area (112) forms the opening (14) at two opposite ends of the circumference of the central adsorption area (111).

3. The wafer processing equipment according to claim 1 or 2, characterized in that: Each of the adsorption areas is provided with a plurality of adsorption holes (12); The wafer processing equipment further includes: A vacuum pumping component is connected to each of the adsorption holes (12), and the vacuum pumping component is used to vacuum each of the adsorption holes (12) to adsorb and fix the wafer.

4. The wafer processing equipment according to claim 3, characterized in that: The plurality of adsorption holes (12) in the central adsorption area (111) are enclosed into a plurality of circular arrays concentric with the horizontal center; and / or, The plurality of adsorption holes (12) in the peripheral adsorption area (112) are arranged in sequence along the extension direction of the circular arc, and the circular arc is concentric with the horizontal center.

5. The wafer processing equipment according to claim 1 or 2, characterized in that: The wafer processing equipment further includes: A position adjustment component (4) is used to drive the carrier (1) to move so as to change the position of the carrier (1) in the horizontal direction; A controller is electrically connected to the detection member (3) and the position adjustment component (4), and the controller is used to enable the position adjustment component (4) to drive the carrier (1) to move based on the position information detected by the detection member (3), so as to adjust the position of the carrier (1) and make the horizontal center of the carrier (1) coincide with the center position of the wafer.

6. The wafer processing equipment according to claim 5, characterized in that: The position adjustment component (4) comprises: A first adjustment unit (41), the first adjustment unit (41) is used to drive the carrier (1) to move along a first horizontal direction; A second adjustment unit (42), the second adjustment unit (42) is used to drive the carrier (1) to move along a second horizontal direction, the first horizontal direction being perpendicular to the second horizontal direction.

7. The wafer processing equipment according to claim 6, characterized in that: The wafer processing equipment further includes: A mounting seat (5), wherein the carrier (1) is arranged on the mounting seat (5); The first adjustment unit (41) comprises: A first guide seat (411) is configured to cooperate with the mounting seat (5) in a guiding manner in the first horizontal direction; a first driving member electrically connected to the controller and used to drive the mounting seat (5) to move along the first horizontal direction on the first guide seat (411); The second adjustment unit (42) comprises: a second guide seat (421) configured to cooperate with the first guide seat (411) in guiding relation to the second horizontal direction; A second driving member is electrically connected to the controller and is used to drive the first guide seat (411) to move on the second guide seat (421) along the second horizontal direction.

8. The wafer processing equipment according to claim 1 or 2, characterized in that: The detection member (3) includes a camera, which is arranged above the carrier (1) and is used to detect the position of the wafer by taking an image in the direction of the wafer; or, The detection member (3) comprises an edge finder, which is arranged close to the edge of the carrier (1) to detect the position of the wafer by detecting the position of a point on the edge of the wafer.

9. A loading method, applied to the wafer processing equipment according to any one of claims 1 to 8, characterized in that: The feeding method comprises: Using the loading portion (21) in the loading assembly (2) to support the wafer, the wafer is placed on the carrying surface (11) of the carrier (1); Utilizing a central adsorption area (111) on the carrier surface (11) to adsorb and fix the wafer, wherein the central adsorption area (111) is arranged at the horizontal center of the carrier (1); Using a detection component (3) to detect the position of the wafer placed on the carrying surface (11) to obtain the position of the center of the wafer; Then, the loading portion (21) is used to support the adsorbed surface of the wafer so that the wafer is separated from the carrying surface (11); Receive the detected position information of the wafer, and adjust the position of the carrier (1) according to the position information so that the horizontal center of the carrier (1) coincides with the center position of the wafer.

10. The feeding method according to claim 9, characterized in that: After receiving the detected position information of the wafer and adjusting the position of the carrier (1) according to the position information so that the horizontal center of the carrier (1) coincides with the center position of the wafer, the method further includes: Then, the loading portion (21) is used to support the wafer so as to place the wafer on the carrying surface (11); The wafer is adsorbed and fixed by using the central adsorption area (111) and the peripheral adsorption area (112) on the carrying surface (11), wherein the peripheral adsorption area (112) is arranged at the edge of the carrying component (1).

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