Gripping device for wafer transfer

Abstract

The invention relates to the technical field of semiconductor processing, and provides a gripping device for wafer transfer, which comprises a first gripping assembly and a second gripping assembly which are oppositely arranged, at least one of the first grabbing assembly and the second grabbing assembly can move along the connecting assembly so as to be switched between a grabbing state and a releasing state; the first grabbing assembly comprises a first flexible fitting part, the second grabbing assembly comprises a second flexible fitting part, the first flexible fitting part and the second flexible fitting part are both flexible strips, and the first flexible fitting part and the second flexible fitting part can respectively wrap the side walls of the two opposite sides of a wafer in a grabbing state so as to grab the wafer. By means of the technical scheme, the technical problem that in the prior art, due to the fact that a flexible self-adaptive end effector for wafer transfer is complex in structure, assembly and maintenance difficulty is large is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and in particular to a gripping device for wafer transfer. Background Art

[0002] Wafer handling robots are key automation equipment in semiconductor manufacturing, used to efficiently and accurately transfer wafers in cleanroom environments, ensuring the stability and yield of the production process. Currently, mainstream end effectors are typically mechanical grippers and vacuum chucks. Mechanical grippers rely on rigid clamping, which can easily cause stress concentration at the edge of the wafer. Vacuum chuck grippers require the back of the wafer to be flat, and have poor adaptability to warped wafers, such as those deformed after high-temperature processing. To address these issues, flexible adaptive end effectors have emerged. These adapt to wafer deformation through elastic deformation structures to avoid deformation and reduce mechanical stress. However, multi-degree-of-freedom flexible hinges typically rely on distributed sensor control, making assembly and maintenance difficult. Summary of the Invention

[0003] To overcome the above-mentioned defects, an embodiment of the present invention provides a gripping device for wafer transfer, which solves the technical problem of difficult assembly and maintenance caused by the complex structure of the flexible adaptive end effector for wafer transfer in the related art.

[0004] According to one aspect, at least one embodiment of the present invention provides a gripping device for wafer transfer, comprising a first gripping component and a second gripping component disposed opposite to each other, and a connecting component for connecting the first gripping component and the second gripping component: At least one of the first gripping assembly and the second gripping assembly is movable along the connecting assembly to transition between a gripping state and a releasing state; The first grasping component includes a first flexible bonding part, and the second grasping component includes a second flexible bonding part. The first flexible bonding part and the second flexible bonding part are both flexible strips. In the grasping state, the first flexible bonding part and the second flexible bonding part can respectively cover the side walls on both sides of the wafer opposite to each other to grasp the wafer.

[0005] For example, in the gripping device for wafer transfer provided by at least one embodiment of the present invention, the first gripping assembly further includes a base, two first material rollers, and first tensioning members corresponding to the two first material rollers; The base is fixedly connected to the connecting assembly; The two first material rollers are parallel to each other and rotatably mounted on the base, and the two ends of the first flexible contact portion are respectively wound around the two first material rollers; The two first tensioning members are used to tension the first flexible fitting portion.

[0006] For example, in the gripping device for wafer transfer provided by at least one embodiment of the present invention, the second gripping assembly further includes a sliding frame, the sliding frame being rotatably provided with two second material rollers and second tensioning members corresponding to the two second material rollers; The sliding frame is movably connected to the connecting assembly; The two second material rollers are parallel to each other and rotatably mounted on the sliding frame, and the two ends of the second flexible contact portion are respectively wound around the two second material rollers; The two second tensioning members are used to tension the second flexible fitting portion.

[0007] For example, in the gripping device for wafer transfer provided by at least one embodiment of the present invention, the second gripping component also includes an adjustment component arranged on the sliding frame, and the adjustment component is used to drive the second material roller to rotate to adjust the tension of the second flexible bonding portion.

[0008] For example, in the gripping device for wafer transfer provided in at least one embodiment of the present invention, the adjustment component includes: a third material roller, rotatably arranged on a side of the sliding frame opposite to the second material roller, the second material roller coaxially rotating with the third material roller, and a flexible adjustment belt wound around the third material roller; an adjustment plate movably disposed on the sliding frame, the adjustment plate being provided with an adjustment portion for contacting the flexible adjustment strip, the adjustment plate being capable of pulling the flexible adjustment strip through the adjustment portion to rotate the third material roller; A linear telescopic member is provided on the base and is used for driving the adjustment plate to slide.

[0009] For example, in the gripping device for wafer transfer provided in at least one embodiment of the present invention, there are two third material rollers, which are coaxially rotated with the second material roller, and the two ends of the flexible adjustment belt are respectively wound around the two third material rollers.

[0010] For example, in the grasping device for wafer transfer provided by at least one embodiment of the present invention, the adjustment part is a rotating roller rotatably arranged on the adjustment plate, and the adjustment assembly also includes a tensioning roller rotatably arranged on the sliding frame. The tensioning roller is provided between the adjustment part and each of the third material rollers, and the flexible adjustment belt is sequentially wound around the third material roller, the tensioning roller, the adjustment part, another tensioning roller and another third material roller.

[0011] For example, in the gripping device for wafer transfer provided by at least one embodiment of the present invention, the connecting component includes a slide groove; The sliding frame includes a bracket body, and the bracket body includes a limiting slide plate inserted into the sliding groove. The limiting slide plate can move along the sliding groove to enable the sliding frame to be movably connected to the connecting assembly.

[0012] For example, in the grasping device for wafer transfer provided by at least one embodiment of the present invention, the sliding frame also includes support arms symmetrically distributed at both ends of the bracket body, the bracket body is connected to the connecting assembly, the two support arms are rotatably connected to the bracket body, and the two second material rollers are respectively rotatably arranged on the support arms.

[0013] For example, in at least one embodiment of the present invention, the grasping device for wafer transfer further includes a transmission member, which is used to drive the support arm to rotate, and the transmission member includes: a transmission gear, the transmission gear being rotatably disposed on the bracket body and fixedly connected to the support arm; A sliding tooth plate is movably connected to the limiting slide plate, the sliding tooth plate is located between the two transmission gears and is meshed with the transmission wheel, and the sliding tooth plate can drive the transmission gear to rotate by sliding.

[0014] For example, in the grasping device for wafer transfer provided by at least one embodiment of the present invention, a limiting boss is provided on the base, and an elastic connecting member is provided on the sliding frame, and the two ends of the elastic connecting member are respectively connected to the limiting portion of the limiting slide and the sliding tooth plate, and the elastic connecting member is used to elastically pull the sliding tooth plate so that the end of the sliding tooth plate abuts against the limiting boss.

[0015] For example, in at least one embodiment of the present invention, the grasping device for wafer transfer further includes a linear drive member disposed on the base, the linear drive member being configured to drive the sliding frame to slide, the linear drive member including: A rotating screw, wherein the rotating screw is rotatably arranged on the base; A sliding seat, the sliding seat is slidably arranged on the base and is transmission-connected to the rotating screw, and the sliding frame is connected to the sliding seat; A rotation driving member is provided on the base, and is used for driving the rotating screw to rotate.

[0016] The beneficial effects of the embodiments of the present invention are: In the present invention, a first gripping assembly and a second gripping assembly are provided on opposite sides of the connecting assembly, respectively. By adjusting the distance between the first gripping assembly and the second gripping assembly, the gripping device can be switched between a gripping state and a released state. The first gripping assembly includes a first flexible contact portion, and the second gripping assembly includes a second flexible contact portion. Both are flexible strips. The flexible strips grip the wafer and wrap around the sidewalls of the wafer. The elastic deformation of the flexible strips can adapt to wafer warping, avoid stress concentration caused by rigid clamping, and reduce the risk of wafer breakage. The modular design also facilitates maintenance, and the flexible strip gripping reduces the reliance of the flexible adaptive gripping device on distributed sensors. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly describes the drawings required for describing the embodiments of the present invention. Obviously, the drawings described below are merely exemplary embodiments of the present invention. Those skilled in the art can, without inventive effort, derive other drawings based on the contents of the exemplary embodiments of the present invention and these drawings.

[0018] Figure 1 Schematic diagram of the overall structure of a gripping device for wafer transfer in one embodiment of the present invention; Figure 2 for Figure 1 A schematic diagram of a partial structure of a gripping device for wafer transfer in an embodiment of the present invention; Figure 3 for Figure 2 A in the middle is an enlarged structural diagram; Figure 4 for Figure 1 A schematic structural diagram of a sliding frame in an embodiment of the present invention; Figure 5 for Figure 1 A schematic structural diagram of an adjustment component in an embodiment; Figure 6 for Figure 1 A schematic structural diagram of a transmission member in an embodiment of the present invention; Figure 7 for Figure 1 A schematic structural diagram of the base in an embodiment of the present invention; Figure 8 for Figure 7 The enlarged structural diagram at B in the middle; Figure 9 for Figure 1 A schematic diagram of a partial top view of a gripping device for wafer transfer in an embodiment of the present invention; Figure 10 for Figure 9 The enlarged structural diagram at C in the middle; Figure 11 for Figure 1A schematic structural diagram of a linear drive member in an embodiment of the present invention; Figure 12 for Figure 1 Another structural schematic diagram of the linear drive component in an embodiment of the present invention.

[0019] In the figure: 10, first grabbing assembly, 100, base, 110, first material roller, 120, first flexible fitting part, 130, limiting boss, 20, second grabbing assembly, 200, sliding frame, 201, bracket body, 2011, limiting slide plate, 210, second material roller, 220, second flexible fitting part, 230, support arm, 240, elastic connecting member, 250, limiting part, 300, adjustment assembly, 310, third material roller, 320, flexible adjustment strip, 330, adjustment plate, 331, adjustment part, 340, linear telescopic member, 350, tensioning roller, 400, transmission member, 410, transmission gear, 420, sliding tooth plate, 500, linear drive member, 510, rotating screw, 520, sliding seat, 530, rotating drive member, 60, connecting assembly. DETAILED DESCRIPTION

[0020] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention.

[0021] To simplify the drawings, only portions relevant to the invention are schematically depicted in each figure; they do not represent the actual structure of the product. Furthermore, to simplify the drawings and facilitate understanding, in some figures, only one component with the same structure or function is schematically depicted or labeled. In this document, "one" not only means "only one" but also "more than one," and "several" includes "two" and "more than two."

[0022] It should be noted that, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in the present invention based on the specific circumstances.

[0023] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0024] In the description of this embodiment, the terms "up", "down", "left", "right", etc., and the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be understood as a limitation on the present invention.

[0025] In addition, in the description of the present application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0026] like Figures 1 to 12As shown, it shows a grasping device for wafer transfer in one embodiment of the present invention, the grasping device includes a first grasping component 10 and a second grasping component 20 arranged relatively to each other, and a connecting component 60 for connecting the first grasping component 10 and the second grasping component 20: at least one of the first grasping component 10 and the second grasping component 20 can move along the connecting component 60 to switch between a grasping state and a release state; wherein the first grasping component 10 includes a first flexible bonding portion 120, and the second grasping component 20 includes a second flexible bonding portion 220, and the first flexible bonding portion 120 and the second flexible bonding portion 220 are both flexible strips, for example, strips made of polyimide or fluoropolymer. Exemplarily, the second grasping component 20 can move along the connecting component 60 to approach the first grasping component 10 so that the grasping device is in a grasping state. At this time, the first flexible fitting portion 120 and the second flexible fitting portion 220 can respectively cover the side walls on both sides of the wafer opposite to each other to grasp the wafer. After the grasping device grasps the wafer, it can be driven by a multi-axis robot arm or other mobile device to move the grasping device to a specified position. Subsequently, the second grasping component 20 moves in the opposite direction, and the second flexible fitting portion 220 moves away from the first flexible fitting portion 120 to put the grasping device in a released state, completing the transfer of the wafer. Alternatively, the first grasping component 10 can move along the connecting component 60 and cooperate with the second grasping component 20 fixedly connected to the connecting component 60 to complete the transfer of the wafer. It is also possible to enable both the first grasping component 10 and the second grasping component 20 to move along the connecting component 60, which is not limited here, so that the first grasping component 10 and the second grasping component 20 can approach each other to enter a grasping state or move away from each other to enter a released state.

[0027] In this embodiment, the first gripping assembly 10 is fixedly connected to the connecting assembly 60, and the second gripping assembly 20 is movably mounted on the connecting assembly 60. The first gripping assembly 10 further includes a base 100, two first material rollers 110, and a first tensioning member corresponding to the two first material rollers 110. The base 100 is fixedly connected to the connecting assembly 60 and can be connected to a mobile device such as a multi-axis robotic arm. Two mutually parallel first material rollers 110 are rotatably mounted on the base 100. The two first material rollers 110 are spaced apart, and a flexible strip is wound between the two rollers to form a first flexible contact portion 120. A first tensioning member is provided between the two first material rollers 110 and the base 100 to maintain tension on the first flexible contact portion 120. The first tensioning member can be a torsion spring. The second gripping assembly 20 is similar in structure to the first gripping assembly 10, except that the second gripping assembly 20 is movably connected to the connecting assembly 60. Specifically, the second grabbing assembly 20 also includes a sliding frame 200, which is rotatably provided with two second material rollers 210 and second tensioning members corresponding to the two second material rollers 210; wherein the sliding frame 200 is movably connected to the connecting assembly 60; the two second material rollers 210 are parallel to each other and are rotatably installed on the sliding frame 200, and the two ends of the second flexible bonding portion 220 are respectively wrapped around the two second material rollers 210; the two second tensioning members are used to tension the second flexible bonding portion 220, and the second tensioning members can also use torsion springs. When the grasping device enters the grasping state, the first flexible bonding part 120 and the second flexible bonding part 220 are bonded to the side wall of the wafer. As the first flexible bonding part 120 and the second flexible bonding part 220 approach and bond to the side wall of the wafer, the first tensioning member and the second tensioning member are compressed. At this time, the first material roller 110 and the second material roller 210 rotate and release the flexible strips to extend the length of the first flexible bonding part 120 and the second flexible bonding part 220 respectively, increase the contact area between the first flexible bonding part 120 and the second flexible bonding part 220 and the side wall of the wafer, make the force on the grasping part uniform, and improve the stability of the grasping.

[0028] Both the first and second tensioning members utilize torsion springs. The preload of the torsion springs tensions the flexible strip, ensuring that the strip maintains tension during operation. The spring force of the torsion springs can be controlled to maintain the appropriate tension within the flexible strip, preventing damage to the wafers caused by excessive tension. One end of the torsion spring is secured to a lug on the end of the roller via a pin, while the other end is secured to a corresponding bracket on the base 100 or carriage 200. During assembly, a preset torsional angle is used to generate the preload. This structure uses the spring's elastic potential energy to automatically compensate for slight slack in the flexible strip over time, driving the roller to rotate slightly to maintain stable tension between the first and second flexible contact portions 120 and 220. This prevents wafer clamping deviation caused by loose strip material and reduces the need for manual adjustments. The sleeve connection between the torsion spring and the roller ensures that the tension is evenly applied to both ends of the roller, ensuring consistent tension on both sides of the strip and further improving position stability.

[0029] An annular groove may be provided in the middle of the first and second material rollers 110, 210. The width of the annular groove is less than the width of the flexible strip and greater than the thickness of the wafer. During wafer grasping, the annular groove can limit the end face of the wafer, further improving grasping stability. The flexible strip is preferably wound in one or two layers around the first and second material rollers 110, 210. This allows the contours of the annular groove to be exposed after the flexible strip is partially embedded in the annular groove during grasping, thereby acting as a limiter. When the flexible strip is wound around the first and second material rollers 110, 210, the edges of the strip extend beyond the side walls of the groove to prevent the first and second material rollers 110, 210 from directly contacting the wafer. During wafer transfer, the grasping device always contacts the wafer via the flexible strip, transforming the typical rigid clamping contact into a flexible contact, thereby reducing the contact stress at the contact point between the grasping device and the wafer during the clamping process.

[0030] During operation, the linear drive 500 drives the slide 200 to slide, causing the second flexible contact portion 220 to approach the first flexible contact portion 120 until the sidewall of the wafer is covered by the first flexible contact portion 120 and the second flexible contact portion 220. After the sidewall of the wafer contacts the first flexible contact portion 120 and the second flexible contact portion 220, it can overcome part of the force of the torsion spring. At this time, the first material roller 110 and the second material roller 210 can rotate and release part of the flexible strip, thereby extending the length of the first flexible contact portion 120 and the second flexible contact portion 220, expanding the contact area between the sidewall of the wafer and the first flexible contact portion 120 and the second flexible contact portion 220, and improving the stability of the wafer during transfer. During use, since the size of each batch of wafers to be transferred is consistent, the linear drive 500 can be controlled to move the slide 200 a fixed distance. When grabbing the wafer, the flexible strip acts on the sidewall of the wafer and does not contact the working surface, that is, it does not interfere with the working surface of the wafer. The first flexible fitting portion 120 and the second flexible fitting portion 220 use a flexible strip to cover the sidewalls of the wafer. The elastic deformation of the flexible strip adapts to the warping of the wafer, avoiding stress concentration caused by rigid clamping and reducing the risk of wafer damage. The width of the annular groove of the first material roller 110 and the second material roller 210 is smaller than the width of the strip. After the strip is embedded, the edge extends beyond the groove and contacts the sidewall, reducing the rigid contact between the first material roller 110 and the second material roller 210 and the wafer. The torsion spring tensioning design ensures that the flexible strip always maintains stable tension, improving gripping stability. After the middle part of the flexible strip is embedded in the annular groove, the opening near the inside remains outward-expanding, forming an inclined limiting surface. This limiting surface can support the edge of the wafer end upward, retaining the limiting function of the edge of the flexible strip, and taking into account both flexible adaptation and structural constraints.

[0031] Reference Figure 2~Figure 3 、 Figure 5To reduce the forces between the wafer sidewalls and the flexible strip during the gripping process, an adjustment assembly for adjusting the length of the second flexible contact portion 220 is also provided on the slide frame 200. The adjustment assembly 300 includes a third material roller 310, an adjustment plate 330, and a linear telescopic member 340. The third material roller 310 is coaxially mounted with the second material roller 210 and secured coaxially with the second material roller 210 via a key connection, allowing the two to rotate synchronously. The flexible adjustment strip 320 is wound around the third material roller 310. The adjustment plate 330 is slidably mounted on the slide frame 200 and is provided with an adjustment portion 331 for contact with the flexible adjustment strip 320. When grasping a wafer, the adjustment plate 330 is slid. The adjustment portion 331 pulls the flexible adjustment strip 320, causing the third roller 310 to rotate. This rotation drives the second roller 210 to rotate, releasing the length of the flexible strip. This correspondingly increases the length of the second flexible contact portion 220, enabling active, adaptive adjustment of the length of the second flexible contact portion 220 during wafer grasping. This further reduces stress between the wafer and the flexible strip, improving grasping stability while minimizing the impact on wafer quality during grasping. The adjustment portion 331 can be a rotating roller that contacts the flexible adjustment strip 320. The output end of the linear expansion member 340 is fixed to the adjustment plate 330. When the adjustment plate 330 is driven to slide, the rotating roller pulls the flexible adjustment strip 320, driving the third roller 310 to rotate, thereby adjusting the length of the second flexible contact portion 220. A photoelectric encoder is mounted on the adjustment plate 330 to provide real-time position feedback. The controller adjusts the movement of the linear expansion member 340, achieving closed-loop control. The adjustment assembly 300 drives the adjustment plate 330 via the linear telescopic member 340, pulling the flexible adjustment strip 320 to rotate the third material roller 310, adjusting the length of the second flexible bonding portion 220 to adapt to the wafer size and increase the contact area between the second flexible bonding portion 220 and the wafer sidewall. There are two third material rollers 310, the same number as the second material rollers 210. The ends of the flexible adjustment strip 320 are respectively wound around the two third material rollers 310. The adjustment plate 330 is movably mounted on the slide 200, with the outer circumference of the adjustment portion 331 in contact with the flexible adjustment strip 320. The linear telescopic member 340 is a pneumatic cylinder or a micro-hydraulic cylinder, the cylinder body of which is fixed to the base 100, and the end of the piston rod is connected to the adjustment plate 330. When the linear expansion member 340 drives the adjustment plate 330 to slide, the rollers of the adjustment section 331 pull the flexible adjustment strip 320, driving the third material roller 310 and the second material roller 210 to rotate synchronously. This causes the flexible strip to partially wrap around or release the second flexible contact section 220, achieving stepless length adjustment. A limit switch on the sliding frame 200 limits the sliding range of the adjustment plate 330 to prevent excessive stretching of the strip.The adjustment assembly 300 mechanically adjusts the length of the second flexible contact portion 220. Combined with the sliding motion of the carriage 200, it adjusts the distance between the first and second flexible contact portions 120, 220. Adjusting the length of the connecting assembly 60 allows for adaptability to wafers ranging from φ100mm to φ300mm, enhancing the versatility of the device. To ensure that the flexible adjustment strip 320 remains taut and moves in an orderly manner during adjustment and release, a tensioning roller 350 is also provided on the carriage 200 to tension the flexible adjustment strip 320.

[0032] The connecting assembly 60 may be a plate-like structure with a slide groove provided thereon for guiding the sliding of the sliding frame 200. The sliding frame 200 includes a support body 201 and support arms 230 symmetrically distributed at both ends of the support body 201. The support body 201 includes a limiting slide 2011 that interacts with the slide groove. The slide groove and the limiting slide 2011 guide the sliding frame 200 to move along a preset path on the plate of the connecting assembly 60. Figure 4 The support arms 230 are symmetrically distributed on both sides of the support body 201, and the second material roller 210 is rotatably mounted on the support arms 230. By rotating the support arms 230, the position of the second material roller 210 can be adjusted. During the grasping process, the second material roller 210 can be brought closer to the side wall of the wafer, thereby allowing the second flexible fitting portion 220 to better adapt to the profile of the side wall of the wafer. Figure 6 One end of the support arm 230 that is rotatably connected to the sliding frame 200 is connected to the transmission member 400, and the support arm 230 is driven to rotate by the transmission member 400. The transmission member 400 includes a transmission gear 410 and a sliding tooth plate 420. The transmission gear 410 is rotatably set on the bracket body 201 and is fixedly connected to the support arm 230. After the transmission gear 410 rotates, it can drive the support arm 230 to rotate. The sliding tooth plate 420 is located between the two transmission gears 410 and can move on the limiting slide 2011. The teeth of the sliding tooth plate 420 are engaged with the transmission gear 410. After the sliding tooth plate 420 slides, the transmission gear 410 is driven to rotate by the meshing connection between the teeth and the transmission gear 410. At this time, the support arm 230 rotates following the transmission gear 410, so that the second material roller 210 can be close to or away from the side wall of the wafer. Further as Figures 6 to 11As shown, the sliding tooth plate 420 is connected to the limiting slide 2011 via an elastic connector 240. The elastic pulling action causes its end portion to abut against the limiting boss 130 of the base 100, thereby limiting the position of the sliding tooth plate 420. When the sliding frame 200 slides toward the base 100, the limiting action of the limiting boss 130 prevents the sliding tooth plate 420 from sliding along with the sliding frame 200. At this time, the elastic connector 240 is compressed, causing relative movement between the limiting slide 2011 and the sliding tooth plate 420. Under the meshing action of the teeth of the sliding tooth plate 420 and the transmission gear 410, the support arm 230 is driven to rotate, fine-tuning the angle of the second material roller 210 to ensure that the second flexible bonding portion 220 is bonded to the wafer. The transmission member 400 achieves fine-tuning of the angle of the support arm 230 through the meshing transmission of the sliding tooth plate 420 and the transmission gear 410, so that the second material roller 210 drives the second flexible fitting part 220 to adapt to the wafer side wall angle and improve the gripping fit. The elastic connector 240 cooperates with the limiting boss 130 to provide a reset force for the sliding tooth plate 420, ensuring transmission accuracy while avoiding damage to the structure caused by mechanical impact. The overall structure uses centralized mechanical transmission instead of distributed sensor control, reducing dependence on electronic components and improving the reliability of the equipment in the high temperature and high cleanliness environment of the clean room. The modular design allows each component to be disassembled and assembled independently, facilitating the rapid replacement of worn flexible strips or material rollers, shortening maintenance downtime, and improving production efficiency.

[0033] The support arm 230 is hinged to the end of the bracket body 201 via a rotating shaft; the two support arms 230 are symmetrically distributed on either side of the sliding frame 200, forming a symmetrical clamping structure. The transmission gear 410 is a gear, fixed to the end of the rotating shaft of the support arm 230 via a key connection, and rotates synchronously with the support arm 230. The sliding tooth plate 420 has teeth machined on both sides of the end near the transmission gear 410, which meshes with the transmission gears 410 on both sides. The elastic connector 240 is a spring, one end of which is mounted on the sliding tooth plate 420 and the other end is fixed to the limit portion 250 of the limit slide 2011. In its natural state, the elastic connector 240 pulls the sliding tooth plate 420, causing its end to tightly abut against the limit boss 130 of the base 100. When the slide 200 moves toward the base 100, the limiting boss 130 pushes the sliding tooth plate 420 to slide against the elastic force of the elastic connector 240. This, in turn, drives the transmission gear 410 through the sliding tooth plate 420, causing the support arm 230 to retract inward. When the slide 200 moves away from the base 100, the elastic connector 240 pulls the sliding tooth plate 420 back to its original position, causing the support arm 230 to expand outward. This linkage mechanism enables the second flexible contact portion 220 to adaptively adjust its clamping angle in response to the wafer's position, improving its contact with the wafer's sidewalls. The coordination between the elastic connector 240 and the limiting boss 130 synchronizes the movement of the support arm 230 with the movement of the slide 200, eliminating the need for additional drive components, simplifying the structure, and avoiding mechanical interference.

[0034] Reference Figure 11-12 The rotating lead screw 510 of the linear drive 500 is horizontally mounted on the base 100 through bearing seats at both ends. The lead screw nut cooperates with the threaded hole at the bottom of the sliding seat 520. The sliding seat 520 is slidably connected to the base 100 through a guide rod; the sliding frame 200 is fixed to the sliding seat 520 by bolts. The rotating drive 530 can be a servo motor or a stepper motor, which is connected to one end of the rotating lead screw 510 through a coupling. The encoder on the motor output shaft provides real-time feedback on the lead screw rotation angle, and the position closed-loop control of the sliding frame 200 is achieved through the controller. This structure achieves high-precision position control of the sliding frame 200 by driving the lead screw transmission through the rotating drive 530, meeting the positioning requirements of wafer production; the lead screw and the guide rail have a strong load-bearing capacity, which can stably support the weight of the sliding frame 200 and the grasping components, maintain stability during movement, and reduce the impact of vibration on the wafer.

[0035] Torsion spring tensioning ensures stable base tension, while adjustment assembly 300 expands the dimensional adaptability and actively adjusts the length of the second flexible contact portion 220. Support arm 230 and transmission element 400 enhance flexible adaptability, while linear drive 500 ensures motion accuracy. This completes the flexible wafer handling and transfer solution, from flexible contact gripping to active control of the length of the second flexible contact portion 220. These components are linked through mechanical transmission, reducing reliance on sensors and control systems, improving reliability and ease of maintenance in the demanding cleanroom environment.

[0036] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A gripping device for wafer transfer, characterized in that: The invention comprises a first grabbing assembly (10) and a second grabbing assembly (20) which are arranged opposite to each other, and a connecting assembly (60) for connecting the first grabbing assembly (10) and the second grabbing assembly (20): At least one of the first gripping assembly (10) and the second gripping assembly (20) is capable of moving along the connecting assembly (60) to switch between a gripping state and a releasing state; The first gripping component (10) includes a first flexible bonding portion (120), and the second gripping component (20) includes a second flexible bonding portion (220). The first flexible bonding portion (120) and the second flexible bonding portion (220) are both flexible strips. In the gripping state, the first flexible bonding portion (120) and the second flexible bonding portion (220) can respectively cover the side walls on two opposite sides of the wafer to grip the wafer.

2. The gripping device according to claim 1, characterized in that The first grabbing assembly (10) further includes a base (100), two first material rollers (110), and first tensioning members corresponding to the two first material rollers (110); The base (100) is fixedly connected to the connecting assembly (60); The two first material rollers (110) are parallel to each other and rotatably mounted on the base (100), and the two ends of the first flexible fitting portion (120) are respectively wound around the two first material rollers (110); The two first tensioning members are used to tension the first flexible fitting portion (120).

3. The gripping device according to claim 2, characterized in that The second grabbing assembly (20) further comprises a sliding frame (200), wherein the sliding frame (200) is rotatably provided with two second material rollers (210) and second tensioning members corresponding to the two second material rollers (210); The sliding frame (200) is movably connected to the connecting assembly (60); The two second material rollers (210) are parallel to each other and rotatably mounted on the sliding frame (200), and the two ends of the second flexible laminating portion (220) are respectively wound around the two second material rollers (210); The two second tensioning members are used to tension the second flexible fitting portion (220).

4. The gripping device for wafer transfer according to claim 3, wherein: The second grabbing assembly (20) further comprises an adjusting assembly (300) arranged on the sliding frame (200), wherein the adjusting assembly (300) is used to drive the second material roller (210) to rotate so as to adjust the tension of the second flexible laminating portion (220).

5. The gripping device for wafer transfer according to claim 4, characterized in that: The adjustment component (300) comprises: A third material roller (310) is rotatably arranged on a side of the sliding frame (200) opposite to the second material roller (210), the second material roller rotates coaxially with the third material roller (310), and a flexible adjustment belt (320) is wound around the third material roller (310); an adjustment plate (330), the adjustment plate (330) being movably disposed on the sliding frame (200), the adjustment plate (330) being provided with an adjustment portion (331) for contacting the flexible adjustment strip (320), the adjustment plate (330) being capable of pulling the flexible adjustment strip (320) via the adjustment portion (331) to rotate the third material roller (310); A linear telescopic member (340) is provided on the base (100), and the linear telescopic member (340) is used to drive the adjustment plate (330) to slide.

6. The gripping device for wafer transfer according to claim 5, characterized in that: There are two third material rollers (310), which are coaxially rotatably arranged corresponding to the second material roller (210), and both ends of the flexible adjustment strip (320) are respectively wound around the two third material rollers (310).

7. The gripping device for wafer transfer according to claim 6, wherein: The adjustment portion (331) is a rotating roller rotatably arranged on the adjustment plate (330), and the adjustment assembly (300) further includes a tensioning roller (350) rotatably arranged on the sliding frame (200). The tensioning roller (350) is provided between the adjustment portion (331) and each of the third material rollers (310), and the flexible adjustment strip (320) is sequentially wound around the third material roller (310), the tensioning roller (350), the adjustment portion (331), another tensioning roller (350) and another third material roller (310).

8. The gripping device for wafer transfer according to any one of claims 3 to 7, characterized in that: The connecting assembly (60) includes a slide groove; The sliding frame (200) comprises a bracket body (201), and the bracket body (201) comprises a limiting slide plate (2011) inserted into the sliding groove, and the limiting slide plate (2011) is capable of moving along the sliding groove so that the sliding frame (200) is movably connected to the connecting assembly (60).

9. The gripping device for wafer transfer according to claim 8, wherein: The sliding frame (200) further includes support arms (230) symmetrically distributed at both ends of the support body (201), the support body (201) is connected to the connecting assembly (60), the two support arms (230) are rotatably connected to the support body (201), and the two second material rollers (210) are rotatably arranged on the support arms (230).

10. The gripping device for wafer transfer according to claim 9, characterized in that: It also includes a transmission member (400), the transmission member (400) is used to drive the support arm (230) to rotate, and the transmission member (400) includes: a transmission gear (410), the transmission gear (410) being rotatably disposed on the bracket body (201) and fixedly connected to the support arm (230); A sliding tooth plate (420) is movably connected to the limiting slide plate (2011), the sliding tooth plate (420) is located between the two transmission gears (410) and meshes with the transmission gears (410), and the sliding tooth plate (420) can drive the transmission gears (410) to rotate.

11. The gripping device for wafer transfer according to claim 10, wherein: The base (100) is provided with a limiting boss (130), and the sliding frame (200) is provided with an elastic connecting member (240). The two ends of the elastic connecting member (240) are respectively connected to the limiting portion (250) of the limiting slide plate (2011) and the sliding tooth plate (420). The elastic connecting member (240) is used to elastically pull the sliding tooth plate (420) so that the end of the sliding tooth plate (420) abuts against the limiting boss (130).

12. The gripping device for wafer transfer according to claim 3, wherein: It also includes a linear drive member (500) disposed on the base (100), the linear drive member (500) being used to drive the sliding frame (200) to slide, the linear drive member (500) comprising: A rotating screw (510), wherein the rotating screw (510) is rotatably disposed on the base (100); A sliding seat (520), the sliding seat (520) is slidably disposed on the base (100) and is transmission-connected to the rotating screw (510), and the sliding frame (200) is connected to the sliding seat (520); A rotation driving member (530), wherein the rotation driving member (530) is arranged on the base (100), and the rotation driving member (530) is used to drive the rotation screw (510) to rotate.

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