High-stability quartz crystal oscillator and electronic equipment thereof

Abstract

The invention relates to the technical field of quartz crystal oscillators, in particular to a high-stability quartz crystal oscillator and electronic equipment, the high-stability quartz crystal oscillator comprises a packaging assembly with a packaging cavity, a quartz gasket and a quartz wafer, the quartz gasket and the quartz wafer are packaged in the packaging cavity, and a pair of dispensing positions is arranged in the packaging cavity; the quartz gasket comprises a pair of first gasket parts; or the quartz gasket comprises a second padding part and a carrying part which are integrally arranged, and one side, far away from the dispensing position, of the carrying part is sunken relative to the second padding part; a pair of excitation electrodes is arranged on the quartz wafer, the quartz wafer is fixed at the adhesive dispensing positions through the pair of first pad arrangement parts or the pair of second pad arrangement parts, and the pair of excitation electrodes are electrically connected with the pair of adhesive dispensing positions respectively. The quartz crystal oscillator has the effects of reducing the influence of thermal stress on the vibration area of the quartz crystal wafer and improving the stability of the output frequency of the quartz crystal oscillator.

Description

Technical Field

[0001] The present application relates to the technical field of quartz crystal oscillators, and in particular to a high-stability quartz crystal oscillator and electronic equipment thereof. Background Art

[0002] In the design of precision electronic systems, quartz crystal oscillators serve as time reference sources. These include temperature-compensated crystal oscillators (TCXOs) and thermistor resonators. Both TCXOs and thermistor resonators play a crucial role as solutions for optimizing frequency stability in challenging temperature environments. A TCXO is a quartz crystal oscillator that uses an additional temperature compensation circuit to reduce oscillation frequency fluctuations caused by ambient temperature fluctuations. It features a U-shaped package structure, with the temperature compensation circuit and quartz crystal wafer enclosed on the same side of the base. Thermistor resonators are an economical improvement over traditional surface-mount crystal oscillators. By integrating a thermistor and varactor diode, they cleverly combine temperature sensing and frequency adjustment functions. They feature an H-shaped package structure, with the thermistor and quartz crystal wafer enclosed on the top and bottom sides of the base, respectively.

[0003] Related Document 1 discloses a quartz crystal resonator with a thermistor installed, comprising a base, an upper cover, a quartz crystal, and a thermistor. The base has a first inner groove and a second inner groove in the middle of the upper and lower ends, respectively. A dispensing portion is installed on one side of the upper surface of the bottom of the first inner groove, and a plurality of brackets are arranged laterally on the other side. The brackets decrease in height as they move closer to the dispensing portion. The quartz crystal is connected to the dispensing portion via conductive silver glue. A second electrode portion is installed at the bottom of the second inner groove. The second electrode portion is connected to the thermistor via solder. The thermistor is used to detect the temperature of the quartz crystal. The above technology arranges multiple brackets within the base, facilitating the integration of miniaturized chips. It also makes heat conduction faster, greatly improving the temperature hysteresis characteristics of the thermistor quartz crystal resonator and making temperature compensation more accurate.

[0004] However, with the continuous development of microelectronic products, higher requirements are placed on quartz crystal oscillators. For the above-mentioned related technologies, there is a requirement to further improve the output frequency stability of the quartz crystal oscillator while meeting the requirements of small size. Summary of the Invention

[0005] In order to reduce the impact of thermal stress on the vibration area of ​​the quartz wafer while meeting the requirements of small size and improve the stability of the quartz crystal oscillator output frequency, the purpose of this application is to provide a high-stability quartz crystal oscillator and its electronic equipment.

[0006] In the first aspect, the high-stability quartz crystal oscillator provided by this application adopts the following technical solutions: A high-stability quartz crystal oscillator, comprising: The invention comprises a packaging component having a packaging cavity, a quartz gasket and a quartz wafer packaged in the packaging cavity, wherein: A pair of glue dispensing positions are provided in the packaging cavity; The quartz gasket includes a pair of first padding portions, and the pair of the first padding portions are arranged corresponding to the pair of the dispensing positions; or the quartz gasket includes an integrally arranged second padding portion and a carrying portion, and the carrying portion is recessed relative to the second padding portion on a side away from the dispensing position; A pair of excitation electrodes are matched and arranged on the quartz chip, and the lead ends of the pair of excitation electrodes are respectively arranged corresponding to the pair of dispensing positions, wherein the quartz chip is fixed at the dispensing position through a pair of the first padding parts or the second padding parts, and the pair of excitation electrodes are respectively conductively connected to the pair of electrodes at the dispensing positions.

[0007] By adopting the above technical solution, a quartz gasket is provided between the packaging structure and the quartz wafer. The quartz gasket is provided as a pair of first padding parts, or an integrally provided second padding part and a mounting part, thereby realizing a small-volume package without affecting the piezoelectric effect formed by the quartz wafer through a pair of excitation electrodes. At the same time, the quartz gasket and the quartz wafer are made of the same material and have the same thermal expansion coefficient. On the basis of not affecting the installation of the quartz wafer, the influence of thermal stress on the vibration zone of the quartz wafer is effectively reduced. Under the condition of rapid temperature rise (1-5°C / s), the quartz crystal resonator can be provided with better thermal hysteresis performance, and the temperature-compensated crystal oscillator (TCXO) can be provided with better clock drift performance (that is, the time for the output frequency to reach stability under the condition of rapid temperature rise is effectively shortened), thereby comprehensively improving the output frequency stability of the quartz crystal oscillator. Furthermore, the quartz gasket is configured as a pair of first padding parts arranged at intervals, which reduces the demand for raw materials on the basis of improving output stability and facilitates separate installation; or includes an integrally arranged second padding part and a mounting part, which further improves the frequency output stability. The setting of the mounting part can adapt the installation of the gasket to match the installation of the quartz chip, thereby improving the installation effect.

[0008] Optionally, the thickness of the pair of first padding portions is 30.4-45.6 μm; further preferably, the thickness of the pair of first padding portions is 35-41 μm; Alternatively, the thickness of the second padding portion is 30.4-45.6 μm; further preferably, the thickness of the second padding portion is 35-41 μm.

[0009] By adopting the above technical solution, under the condition of the thickness, the packaging size requirements can be better met while improving the output frequency stability of the quartz crystal oscillator.

[0010] Optionally, the thickness of the carrying portion is 12-18 μm; further preferably, the thickness of the carrying portion is 14-16 μm.

[0011] By adopting the above technical solution, the mounting strength requirement is met while the thickness is set to be small, thereby reducing the space occupied by the quartz chip installation.

[0012] Optionally, the quartz gasket and the pair of glue dispensing positions are fixed by glue dispensing to form a pair of lower glue dispensing points, each of the lower glue dispensing points has a thickness of 15-25 μm, and a diameter of each of the lower glue dispensing points is 200-260 μm; The quartz gasket and the quartz wafer are fixed by glue dispensing to form a pair of upper glue points, each of which has a thickness of 7-17 μm and a diameter of 140-180 μm, and the thickness of the lower glue point is greater than that of the upper glue point.

[0013] By adopting the above technical solution, the thickness and diameter of the upper and lower glue points can be adjusted to meet the requirements of glue bonding and fixation, and control the vibration spacing of the quartz wafer, while improving the stability of the overall installation; further, in combination with the quartz gasket, the output frequency stability of the quartz crystal oscillator can be improved.

[0014] Optionally, a pair of first electrodes is provided on the quartz gasket, and the pair of first electrodes corresponds one-to-one to the pair of dispensing positions, and each first electrode includes an upper electrode, a connecting electrode, and a lower electrode connected in sequence in a U shape, and the upper electrode and the lower electrode of each first electrode are respectively provided on both sides of the quartz gasket along the thickness direction; A pair of the first electrodes are respectively provided on a pair of the first padding parts; or a pair of the first electrodes are provided on the second padding part with an interval therebetween.

[0015] By adopting the above technical solution, a pair of first electrodes cooperate with glue dispensing to realize conductive connection between the excitation electrode and the electrode at the glue dispensing point, thereby improving the connection effect.

[0016] Optionally, a side of the carrying portion close to the glue dispensing position is recessed relative to the second padding portion.

[0017] By adopting the above technical solution, both sides of the mounting part are recessed, and preferably the recessed depths on both sides are set to be consistent, thereby improving the strength of the mounting part and avoiding incorrect installation direction.

[0018] Optionally, the second padding portion has a notch extending through it along the thickness direction so as to divide the second padding portion into a pair of second padding branches, and the pair of second padding branches are arranged corresponding to a pair of the glue dispensing positions.

[0019] By adopting the above technical solution, the amount of padding chips can be reduced while ensuring the stability of the quartz crystal oscillator output frequency.

[0020] Optionally, when the quartz gasket includes a second padding portion and a mounting portion, along the length direction of the quartz wafer, the ratio of the length of the quartz gasket to the length of the quartz wafer is not less than 0.5.

[0021] By adopting the above technical solution, it is easy to carry and install.

[0022] Optionally, the free end of the quartz gasket is supported in the packaging cavity.

[0023] By adopting the above technical solution, the quartz gasket has a considerable length, and at the same time, by supporting it at the free end, the installation stability of the quartz gasket is guaranteed, thereby improving the stability of the output frequency of the quartz crystal oscillator.

[0024] In a second aspect, the electronic device provided by this application adopts the following technical solutions: An electronic device comprises the high-stability quartz crystal oscillator.

[0025] By adopting the above technical solution, the electronic device has a built-in high-stability quartz crystal oscillator, which can exert the effect of the above-mentioned high-stability quartz crystal oscillator.

[0026] In summary, this application includes at least one of the following beneficial technical effects: 1. A quartz gasket is provided between the packaging structure and the quartz wafer. The quartz gasket is provided as a pair of first padding parts, or an integrally provided second padding part and a mounting part. This realizes a small-volume package while not affecting the piezoelectric effect formed by the quartz wafer through a pair of excitation electrodes. At the same time, the quartz gasket and the quartz wafer are made of the same material and have the same thermal expansion coefficient. This effectively reduces the impact of thermal stress on the vibration zone of the quartz wafer without affecting the installation of the quartz wafer. Under rapid temperature rise conditions (1-5°C / s), it can provide better thermal hysteresis performance for the quartz crystal resonator and better clock drift performance for the temperature-compensated crystal oscillator (TCXO), thereby comprehensively improving the output frequency stability of the quartz crystal oscillator.

[0027] 2. The quartz gasket includes a mounting portion, which is recessed relative to the second pad portion. While meeting the mounting strength requirements, it is also configured with a small thickness to reduce the space occupied by the quartz wafer installation. Furthermore, the mounting portion ensures the installation stability of the quartz gasket by supporting it at the free end, thereby improving the effect of improving the stability of the quartz crystal oscillator output frequency. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 Schematic diagram of the structure of the high-stability quartz crystal oscillator in Example 1 of the present application; Figure 2Schematic diagram of the structure of the high-stability quartz crystal oscillator in Example 1 of the present application; Figure 3 This is a schematic diagram of the explosion structure of the high-stability quartz crystal oscillator in Example 1 of the present application; Figure 4 This is a schematic diagram of the explosion structure of the high-stability quartz crystal oscillator in Example 1 of the present application; Figure 5 is a top view of a quartz wafer mounted on a second base in Example 1 of the present application; Figure 6 is a top view of a quartz wafer mounted on a second base according to Example 2 of the present application; Figure 7 Schematic diagram of the structure of the quartz gasket of Example 2 of the present application; Figure 8 is a top view of a quartz wafer mounted on a second base according to Example 3 of the present application; Figure 9 Schematic diagram of the structure of the quartz gasket of Example 3 of the present application; Figure 10 Schematic diagram of the structure of the quartz gasket of Example 4 of the present application; Figure 11 Schematic diagram of the structure of the quartz gasket of Example 5 of the present application; Figure 12 This is a thermal stress simulation diagram of the quartz crystal oscillator of Example 1, Example 2, Example 4, and Comparative Example 1 of the present application.

[0029] Description of reference numerals: 1. Packaging component; 10. First base; 100. Receiving groove; 11. First enclosure; 12. First upper cover; 14. Glue dispensing position; 15. Packaging cavity; 16. Thermistor; 17. Temperature compensation chip; 2. Second base; 20. Bottom base; 21. Transition base; 210. Second electrode; 22. Mounting base; 220. Special-shaped hole; 2220. Rectangular portion; 2221. Splitting portion; 221. Extension portion; 222. Mounting portion; 223. Rectangular hole; 224. Electrode hole; 3. Second enclosure; 30. Upper enclosure; 31. Connecting enclosure; 4. Quartz gasket; 5. First padding portion; 6. Second padding portion; 60. Notch; 61. Second padding branch; 7. Mounting portion; 8. Quartz wafer; 90. Upper glue dispensing point; 91. Lower glue dispensing point. DETAILED DESCRIPTION

[0030] The following is combined with Figure 1 -Attached Figure 12 , further details of this application are given.

[0031] Example 1: Example 1 of the present application discloses a high-stability quartz crystal oscillator, referring to Figure 1 and Figure 2 The high-stability quartz crystal oscillator includes a packaging component 1, a quartz gasket 4, and a quartz wafer.

[0032] 1. The packaging component 1 can be a U-shaped package or an H-shaped package.

[0033] In one embodiment, referring to Figure 1 The product corresponding to the H-type packaging structure is a thermistor crystal resonator. The packaging component 1 includes a first base 10, a first enclosure 11, and a first upper cover 12 encapsulated on the first enclosure 11, which are fixed in sequence. The first base 10 cooperates with the first enclosure 11 and the first upper cover 12 to form a packaging cavity 15. The first base 10 is recessed on one side away from the packaging cavity 15 to have a receiving groove 100. The packaging cavity 15 is used to install a quartz wafer 8, and the receiving groove 100 is used to install a thermistor 16, so that the thermistor 16 and the quartz wafer 8 are respectively encapsulated on the upper and lower surfaces of the first base 10.

[0034] In another embodiment, referring to Figure 2 The product corresponding to the U-shaped packaging structure is a temperature-compensated crystal oscillator (TCXO). The packaging component 1 includes a second base 2, a second enclosure 3, and a second upper cover (not shown in the figure) packaged on the second enclosure 3, so that the second base 2, the second enclosure 3, and the second upper cover cooperate to form a packaging cavity 15.

[0035] Reference Figure 3 and Figure 4 The second base 2 includes a bottom base 20, a transition base 21, and a mounting base 22, which are positioned and fixed in sequence. The mounting base 22 includes a special-shaped hole 220 and a rectangular hole 223 that pass through the mounting base 22 in a direction close to the transition base 21. The rectangular hole 223 is rectangular or rectangular with four arc-shaped chamfered corners. The projection of the special-shaped hole 220 on a horizontal plane falls within the projection of the rectangular hole 223 on a horizontal plane. The special-shaped hole 220 includes a rectangular portion 2220 (hole body) overlapping with the rectangular hole 223 and a dividing portion 2221 (hole body) provided on one side of the rectangular portion 2220. This allows the mounting base 22 to form an extension portion 221 on the side of the rectangular hole 223 opposite to the dividing portion 2221, and a mounting portion 222 on the side having the dividing portion 2221. With this solution, the rectangular portion 2220 is arranged to form a larger installation space, which meets the requirements of the temperature compensation circuit layout and the installation of the temperature compensation chip 17. The special-shaped hole 220 is simultaneously used to form the extension portion 221 and the installation portion 222 to facilitate the installation of the quartz wafer, which is suitable for small size requirements.

[0036] Reference Figure 3 and Figure 4The second enclosure 3 includes an upper enclosure 30 and a connecting enclosure 31. The second base 2 and the upper enclosure 30 can be made of insulating materials such as ceramic or fiberglass. For example, the second base 2 and the upper enclosure 30 are made of ceramic, and the connecting enclosure 31 and the second upper cover are made of Kovar substrate.

[0037] In this embodiment, a U-shaped package is adopted.

[0038] The packaging cavity 15 has a pair of dispensing positions 14 , and electrodes are respectively provided at the corresponding dispensing positions.

[0039] Reference Figure 1 In one embodiment, a pair of dispensing positions 14 are disposed on the first base 10 .

[0040] Reference Figure 2 In another embodiment, a pair of dispensing positions 14 are provided on the second base 2. In this embodiment, a pair of dispensing positions 14 are provided on the mounting base 22, specifically, the matching mounting portion 222 is provided. For example, referring to Figure 3 and Figure 4 Each dispensing station 14 includes an upper conductive terminal, an extension line, and a lower conductive terminal. The upper conductive terminal of the dispensing station 14 is aligned with the top surface of the mounting portion 222 (the side facing away from the transition base 21), and has an electrode hole 224 corresponding to each upper conductive terminal. The extension line passes through the corresponding electrode hole 224, and then forms a lower conductive terminal on the bottom surface of the mounting portion 222. Correspondingly, a pair of second electrodes 210 are provided on the transition base 21, and the pair of second electrodes 210 are electrically connected to the pair of lower conductive terminals.

[0041] 2. About quartz gasket 4 Reference Figure 2 and Figure 5 The quartz gasket 4 is located within the packaging cavity 15 and is used to cushion the quartz wafer 8 and the glue dispensing position 14. The structure of the quartz gasket 4 can be adjusted according to actual conditions to meet the cushioning requirements. To further improve the cushioning effect, in one embodiment, the quartz gasket 4 includes a pair of first cushioning portions 5, which are correspondingly arranged with the pair of glue dispensing positions 14.

[0042] The material of the quartz gasket 4 is the same as that of the quartz wafer 8. The pair of first pads 5 and the pair of glue dispensing positions 14 are set in a one-to-one correspondence, that is, the pair of first pads 5 are respectively fixed at the pair of glue dispensing positions 14 to meet the fixing requirements, so as to serve as a support interval for the installation of the quartz wafer 8.

[0043] In this embodiment, a pair of first pads 5 are fixed to the mounting portion 222 and are disposed on both sides of the dividing portion 2221 to correspond to a pair of glue spots 14. The fixing method can be conductive bonding, which can be achieved by conductive silver glue. Figure 2 The conductive bonding between the quartz gasket 4 and the packaging component 1 is the conductive bonding between the quartz gasket 4 and the second base 2 , and the conductive bonding points are a pair of the glue dispensing positions 14 , that is, the upper conductive ends of the pair of glue dispensing positions 14 .

[0044] About the size of quartz spacer 4: In one embodiment, the thickness of the first cushioning portion 5 is 30.4-45.6 μm, and can be any size of 30.4 μm, 35 μm, 37 μm, 40 μm, 41 μm, 43 μm, or 45.6 μm. In this embodiment, the thickness of the first cushioning portion 5 is set to 38 μm.

[0045] 3. About Quartz Wafers A pair of excitation electrodes are matchedly arranged on the quartz chip 8, and the lead ends of the pair of excitation electrodes are respectively arranged corresponding to the pair of dispensing positions 14, wherein the quartz chip 8 is fixed at the dispensing position 14 through a pair of first padding parts 5 or the second padding parts 6, and the pair of excitation electrodes are respectively conductively connected to the pair of electrodes at the dispensing positions 14.

[0046] In one embodiment, a pair of excitation electrodes can be disposed on opposite sides of the quartz wafer 8, with the lead ends of the pair of excitation electrodes spaced apart and located on the side of the quartz wafer 8 opposite the quartz spacer 4 (i.e., the first pad 5). The pair of excitation electrodes is used to generate a piezoelectric effect on the quartz wafer 8. The excitation electrodes can be made of silver, gold, or a gold-silver alloy, depending on the specific application. In this embodiment, the lead ends of the pair of excitation electrodes are located near the upper conductive ends of the pair of dispensing positions 14, corresponding one-to-one with the upper conductive ends.

[0047] A pair of first pads 5 and the quartz wafer 8 are conductively bonded at the lead-out ends of a pair of excitation electrodes, so that the pair of excitation electrodes are conductively connected to a pair of dispensing positions 14 , thereby leading the pair of excitation electrodes to a pair of second electrodes 210 .

[0048] In this embodiment, the electrical connection between a pair of excitation electrodes and a pair of glue dispensing positions 14 can be achieved by gluing with conductive glue. In order to improve the stability of the installation of the quartz gasket 4 and the quartz wafer 8, in one embodiment, the quartz gasket 4 has a pair of first electrodes, and the pair of first electrodes corresponds one-to-one to the pair of glue dispensing positions 14. Each first electrode includes an upper electrode, a connecting electrode, and a lower electrode connected in sequence in a U shape, and the upper electrode and the lower electrode of each first electrode are respectively arranged on both sides of the quartz gasket 4 along the thickness direction; the electrical connection between the pair of excitation electrodes and the pair of glue dispensing positions 14 can also be achieved through a pair of first electrodes. Exemplarily: a pair of first electrodes are respectively arranged on a pair of first pads 5, the upper electrode of each first electrode is correspondingly connected to the lead-out end of the corresponding excitation electrode, and the lower electrode corresponds one-to-one to the upper conductive end of the electrode at the corresponding glue dispensing position 14.

[0049] In one embodiment, the quartz gasket 4 and the pair of glue spots 14 are fixed by glue dispensing to form a pair of lower glue spots 91 , each of the lower glue spots 91 has a thickness of 15-25 μm, and a diameter of 200-260 μm.

[0050] In the above embodiment, for the pair of first pads 5, a pair of lower glue dots 91 respectively glue and secure the lower electrode of the first pads 5 to the corresponding glue locations. For the second pads 6, a pair of lower glue dots 91 are spaced apart on the second pads and respectively glue and secure the lower electrode of the second pads 6 to the corresponding glue locations. Each lower glue dot 91 has a thickness of 15-25 μm and a diameter of 200-260 μm.

[0051] For example, the thickness of the lower glue dot 91 can be any of 15 μm, 17 μm, 19 μm, 20 μm, 22 μm, 24 μm, and 25 μm. In this embodiment, the thickness of the lower glue dot 91 is set to 20 μm. The diameter of the lower glue dot 91 can be any of 200 μm, 210 μm, 220 μm, 230 μm, 240 μm, 250 μm, and 260 μm. In this embodiment, the thickness of the lower glue dot 91 is set to 230 μm.

[0052] In one embodiment, the quartz gasket 4 and the quartz wafer 8 are fixed by glue dispensing to form a pair of upper glue points 90, each of the upper glue points 90 has a thickness of 7-17 μm, a diameter of each of the upper glue points 90 is 140-180 μm, and the thickness of the lower glue point 91 is greater than the thickness of the upper glue point 90.

[0053] In the above embodiment, for the pair of first pads 5, a pair of upper glue dots 90 respectively glue and secure the upper electrode and the corresponding excitation electrode lead of the first pad 5. For the second pad 6, a pair of upper glue dots 90 are spaced apart on the second pad and respectively glue and secure the upper electrode and the corresponding excitation electrode lead of the second pad 6. The thickness of each upper glue dot 90 is set to 7-17 μm, and the diameter of each upper glue dot 90 is 140-180 μm. The thickness of the lower glue dot 91 is greater than that of the upper glue dot 90.

[0054] For example, the thickness of the lower glue dot 91 can be any of 15 μm, 17 μm, 19 μm, 20 μm, 22 μm, 24 μm, and 25 μm. In this embodiment, the thickness of the lower glue dot 91 is set to 20 μm. The diameter of the lower glue dot 91 can be any of 140 μm, 150 μm, 160 μm, 170 μm, and 180 μm. In this embodiment, the thickness of the lower glue dot 91 is set to 160 μm.

[0055] Furthermore, when the upper glue point 90 and the lower glue point 91 are set simultaneously, it is comprehensively considered that the thickness of the lower glue point 91 is greater than the thickness of the upper glue point 90 .

[0056] The implementation principle of Example 1 of the present application is as follows: quartz crystal 8 is subjected to an external alternating electric field, generating mechanical vibrations to generate a specific frequency for use as a resonant element. The additional quartz gasket 4 has the same thermal expansion coefficient as quartz crystal 8, effectively reducing the impact of thermal stress on the vibration region of quartz crystal 8. For thermosensitive crystal resonators, under rapid temperature rise conditions (1-5°C / s), this can provide better thermal hysteresis performance for quartz crystal resonators; for temperature-compensated crystal oscillators, under rapid temperature rise conditions (1-5°C / s), this can provide better clock drift performance for temperature-compensated crystal oscillators (TCXOs).

[0057] Example 2 Example 2 of the present application discloses a high-stability quartz crystal oscillator, referring to Figure 6 The difference between this embodiment and embodiment 1 is that the quartz gasket 4 includes an integrally arranged second padding portion 6 and a carrying portion 7, and the side of the carrying portion 7 away from the dispensing position 14 is recessed relative to the second padding portion 6.

[0058] In one embodiment, the quartz gasket 4 is made of the same material as the quartz wafer 8. The quartz gasket 4 includes a second padding portion 6 and a mounting portion 7. The second padding portion 6 and the mounting portion 7 are integrally formed, and the mounting portion 7 is thinner than the second padding portion 6. In this embodiment, the side of the mounting portion 7 facing away from the glue dispensing position 14 (the top surface of the mounting portion 7) is recessed relative to the second padding portion 6. That is, the bottom surface of the mounting portion 7 (the side of the mounting portion 7 facing the glue dispensing position 14) is flush with the second padding portion 6, and the top surface of the mounting portion 7 is lower than the top surface of the second padding portion 6.

[0059] The second pad portion 6 is provided corresponding to a pair of glue dispensing positions 14 and is used to match and be installed at the glue dispensing positions 14 to meet the fixing requirements, so as to serve as a support interval for the installation of the quartz wafer 8 .

[0060] In this embodiment, the second pad portion 6 is fixed to the mounting portion 222 and is disposed on both sides of the dividing portion 2221 to correspond to a pair of glue dispensing positions 14. The fixing method can be conductive bonding, which can be achieved by conductive silver glue. Figure 2 The conductive bonding between the quartz gasket 4 and the packaging component 1 is the conductive bonding between the quartz gasket 4 and the second base 2 , and the conductive bonding points are a pair of the glue dispensing positions 14 , that is, the upper conductive ends of the pair of glue dispensing positions 14 .

[0061] About the size of quartz spacer 4: In one embodiment, the thickness of the second cushioning portion 6 is 30.4-45.6 μm, and can be any size of 30.4 μm, 35 μm, 37 μm, 40 μm, 41 μm, 43 μm, or 45.6 μm. In this embodiment, the thickness of the second cushioning portion 6 is set to 38 μm.

[0062] In one embodiment, the thickness of the mounting portion 7 is 12-18 μm. For example, it can be any size among 12 μm, 15 μm, and 18 μm. In this embodiment, the thickness of the mounting portion 7 is set to 15 μm.

[0063] In one embodiment, in order to further ensure miniaturization without affecting the vibration of the quartz chip 8, the distance between the mounting portion 7 and the quartz chip 8 is set to achieve the requirements of not affecting the size setting while not affecting the vibration space of the quartz chip 8. The thickness can be fine-tuned by dispensing the thickness.

[0064] In one embodiment, along the length direction of the quartz wafer 8 (the width direction of the second pad 6), the ratio of the length of the quartz spacer 4 to the length of the quartz wafer 8 is not less than 0.5. For example, while meeting the requirements for spacer installation, the ratio of the length of the quartz spacer 4 to the length of the quartz wafer 8 can be 0.5, 0.7, 0.8, 1, or 1.2.

[0065] In one embodiment, when the projection of the free end of the quartz gasket 4 on the horizontal plane overlaps with the projection of the extension portion 221 on the horizontal plane, the free end of the quartz gasket 4 can be selectively supported in the packaging cavity 15 , that is, supported in the extension portion 221 .

[0066] In order to ensure support stability, reduce the impact of thermal stress on the vibration area of ​​the quartz wafer, and improve the output frequency stability of the quartz crystal oscillator, in this embodiment, the ratio of the length of the quartz gasket 4 to the length of the quartz wafer 8 is 1, that is, the projections of the quartz gasket 4 and the quartz wafer 8 in the horizontal plane overlap, and the free end of the quartz gasket 4 can be selectively supported in the packaging cavity 15.

[0067] Example 3 Example 3 of the present application discloses a high-stability quartz crystal oscillator, referring to Figure 8 and Figure 9 The difference between this embodiment and embodiment 2 is that the second padding portion 6 has a notch 60 passing through it along the thickness direction to divide the second padding portion 6 into a pair of second padding branches 61, and the pair of second padding branches 61 are correspondingly arranged with a pair of the dispensing positions 14.

[0068] In one embodiment, the second padding portions 6 are directly connected to each other, and in this case, the notch 60 does not cut through the second padding portion 6 along the width direction of the first padding portion 5, that is, the bottom surface of the notch 60 is still composed of the second padding portion 6; or the second padding portions 6 are connected through the mounting portion 7, and in this case, the notch 60 cuts through the second padding portion 6 along the width direction of the first padding portion 5, that is, the bottom surface of the notch 60 is composed of the mounting portion 7.

[0069] The pair of second support legs 61 correspond one-to-one with the pair of glue dispensing locations 14 and are fixedly mounted at the corresponding glue dispensing locations 14. In this embodiment, the pair of second support legs 61 are fixed to the mounting portion 222 and are located on both sides of the dividing portion 2221. The fixing method can be conductive bonding, specifically conductive silver glue.

[0070] Example 4 Example 4 of the present application discloses a high-stability quartz crystal oscillator, referring to Figure 10 The difference between this embodiment and embodiment 2 is that the side of the mounting portion 7 close to the glue dispensing position 14 is recessed relative to the second pad portion 6.

[0071] In one embodiment, the top and bottom surfaces of the mounting portion 7 are recessed relative to the top and bottom surfaces of the second cushioning portion 6. The distance between the top surface of the mounting portion 7 and the top surface of the second cushioning portion 6 and the distance between the bottom surface of the mounting portion 7 and the bottom surface of the second cushioning portion 6 may be equal or unequal. In this embodiment, the distance between the top surface of the mounting portion 7 and the top surface of the second cushioning portion 6 and the distance between the bottom surface of the mounting portion 7 and the bottom surface of the second cushioning portion 6 are equal.

[0072] Example 5 Example 5 of the present application discloses a high-stability quartz crystal oscillator, referring to Figure 11 The difference between this embodiment and embodiment 4 is that the second padding portion 6 has a notch 60 passing through it along the thickness direction to divide the second padding portion 6 into a pair of second padding branches 61, and the pair of second padding branches 61 are correspondingly arranged with a pair of the dispensing positions 14.

[0073] In one embodiment, the second padding portions 6 are directly connected to each other, and in this case, the notch 60 does not cut through the second padding portion 6 along the width direction of the first padding portion 5, that is, the bottom surface of the notch 60 is still composed of the second padding portion 6; or the second padding portions 6 are connected through the mounting portion 7, and in this case, the notch 60 cuts through the second padding portion 6 along the width direction of the first padding portion 5, that is, the bottom surface of the notch 60 is composed of the mounting portion 7.

[0074] The pair of second support legs 61 correspond one-to-one with the pair of glue dispensing locations 14 and are fixedly mounted at the corresponding glue dispensing locations 14. In this embodiment, the pair of second support legs 61 are fixed to the mounting portion 222 and are located on both sides of the dividing portion 2221. The fixing method can be conductive bonding, specifically conductive silver glue.

[0075] Example 6 Embodiment 6 of the present application discloses an electronic device, which includes the aforementioned high-stability quartz crystal oscillator.

[0076] The electronic device may be a mobile (or notebook) personal computer with a built-in high-stability quartz crystal oscillator, a portable telephone (including PHS) with a built-in high-stability quartz crystal oscillator, or a digital still camera with a built-in high-stability quartz crystal oscillator.

[0077] The electronic devices such as the personal computers, mobile phones and digital still cameras described above have high-stability quartz crystal oscillators, and therefore can exhibit the effects of the high-stability quartz crystal oscillators and provide excellent reliability.

[0078] In addition, in addition to personal computers, portable phones, and digital still cameras, the high-stability quartz crystal oscillator of the present invention can also be applied to, for example, smartphones, tablet terminals, clocks (including smart watches), inkjet ejection devices, laptop personal computers, televisions, wearable terminals, cameras, video recorders, car navigation devices, pagers, electronic notepads, electronic dictionaries, calculators, electronic game equipment, word processors, workstations, video phones, anti-theft TV monitors, electronic binoculars, POS terminals, medical equipment, fish finders, measuring equipment, equipment for mobile terminal base stations, measuring instruments, flight simulators, network servers, etc.

[0079] Example 7: Example 7 of the present application discloses a moving object, which includes the high-stability quartz crystal oscillator.

[0080] The mobile object can be an automobile, which has a built-in high-stability quartz crystal oscillator. High-stability quartz crystal oscillators are widely used in electronic control units (ECUs) for keyless entry, anti-theft control systems, in-car navigation systems, automotive air conditioning, anti-lock braking systems (ABS), airbags, tire pressure monitoring systems (TPMS), engine control, battery monitoring for hybrid and electric vehicles, and vehicle posture control systems.

[0081] While the highly stable quartz crystal oscillator, electronic device, and mobile device of the present invention have been described above based on the illustrated embodiments, the present invention is not limited thereto, and the structures of the various components can be replaced with any other structure having the same function. Furthermore, any other structure can be added to the present invention.

[0082] Comparative Example 1 Comparative Example 1 of the present application discloses a high-stability quartz crystal oscillator. The difference between this comparative example and Example 1 is that the quartz gasket 4 is not included.

[0083] Experimental results According to Example 1, Example 2, Example 4, and Comparative Example 1, a high-stability quartz crystal oscillator (temperature-compensated crystal oscillator) was prepared, and then a simulation test was performed to obtain a stress distribution diagram of the corresponding quartz wafer 8. The results are shown in FIG. Figure 12 As shown. Figure 12 It can be seen that compared with comparative example 1, the maximum stress of Examples 1, 2, and 4 is reduced, that is, by setting the quartz gasket 4, the influence of thermal stress on the vibration zone of the quartz wafer can be effectively reduced, and the output frequency stability of the quartz crystal oscillator can be improved; further, the improvement effect of Examples 2 and 4 is better than that of Example 1, and the main reason may be that the quartz gasket 4 has better supporting stability.

[0084] The examples of this specific embodiment are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Identical components are represented by the same reference numerals. Therefore, any equivalent changes made based on the structure, shape, and principle of this application should be included in the scope of protection of this application.

Claims

1. High stability quartz crystal oscillator, characterized by: The invention comprises a packaging component (1) having a packaging cavity (15), a quartz gasket (4) and a quartz wafer packaged in the packaging cavity (15), wherein: A pair of glue dispensing positions (14) are provided in the packaging cavity (15); The quartz gasket (4) includes a pair of first padding portions (5), and the pair of first padding portions (5) are arranged corresponding to the pair of glue dispensing positions (14); or the quartz gasket (4) includes an integrally arranged second padding portion (6) and a carrying portion (7), and a side of the carrying portion (7) away from the glue dispensing position (14) is recessed relative to the second padding portion (6); A quartz chip (8) is matched with a pair of excitation electrodes, and the lead ends of the pair of excitation electrodes are respectively arranged corresponding to the pair of dispensing positions (14), wherein the quartz chip (8) is fixed at the dispensing position (14) through a pair of the first padding parts (5) or the second padding parts (6), and the pair of excitation electrodes are respectively conductively connected to the electrodes at the pair of dispensing positions (14).

2. The high-stability quartz crystal oscillator according to claim 1, characterized in that: The thickness of the pair of first padding portions (5) is 30.4-45.6 μm; Or the thickness of the second padding portion (6) is 30.4-45.6 μm.

3. The high-stability quartz crystal oscillator according to claim 1, characterized in that: The thickness of the carrying portion (7) is 12-18 μm.

4. The high-stability quartz crystal oscillator according to claim 1, characterized in that: A pair of first electrodes is provided on the quartz gasket (4), and the pair of first electrodes corresponds to a pair of dispensing positions (14) one by one. Each of the first electrodes includes an upper electrode, a connecting electrode, and a lower electrode connected in sequence in a U-shape, and the upper electrode and the lower electrode of each first electrode are respectively provided on both sides of the quartz gasket (4) along the thickness direction. A pair of the first electrodes are respectively arranged on a pair of the first padding parts (5); or a pair of the first electrodes are arranged at intervals on the second padding part (6).

5. The high-stability quartz crystal oscillator according to claim 4, characterized in that: The quartz gasket (4) and the pair of glue dispensing positions (14) are fixed by glue dispensing to form a pair of lower glue dispensing points (91), each of the lower glue dispensing points (91) has a thickness of 15-25 μm, and each of the lower glue dispensing points (91) has a diameter of 200-260 μm; The quartz gasket (4) and the quartz wafer (8) are fixed by glue dispensing to form a pair of upper glue dispensing points (90), each of the upper glue dispensing points (90) has a thickness of 7-17 μm, each of the upper glue dispensing points (90) has a diameter of 140-180 μm, and the thickness of the lower glue dispensing point (91) is greater than the thickness of the upper glue dispensing point (90).

6. The high-stability quartz crystal oscillator according to claim 1, characterized in that: The side of the carrying portion (7) close to the glue dispensing position (14) is recessed relative to the second pad portion (6).

7. The high-stability quartz crystal oscillator according to claim 1, characterized in that: The second padding portion (6) has a notch (60) extending through it in the thickness direction to divide the second padding portion (6) into a pair of second padding branches (61), and the pair of second padding branches (61) are arranged correspondingly to a pair of the glue dispensing positions (14).

8. The high-stability quartz crystal oscillator according to claim 1, characterized in that: When the quartz gasket (4) includes a second pad portion (6) and a mounting portion (7), along the length direction of the quartz wafer (8), the ratio of the length of the quartz gasket (4) to the length of the quartz wafer (8) is not less than 0.

5.

9. The high-stability quartz crystal oscillator according to claim 8, characterized in that: The free end of the quartz gasket (4) is supported in the packaging cavity (15).

10. An electronic device, characterized in that The invention comprises a high-stability quartz crystal oscillator as described in any one of claims 1 to 9.

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