Multilayer composite embedded electronic circuit board assembly

Abstract

The invention belongs to the technical field of circuit boards, and particularly relates to a multilayer composite embedded electronic circuit board assembly which comprises a circuit board body formed by pressing an upper layer board and a lower layer board, a plurality of installation grooves are distributed in the upper layer board and the lower layer board, each installation groove is internally provided with an element, each installation groove is internally provided with a phase change material, and the phase change materials are arranged in the installation grooves. The phase-change material is in contact with the element, a plurality of heat conduction structures are arranged in the upper layer plate and the lower layer plate, the heat conduction structures and the installation grooves are identical in number and correspond in position, detection control assemblies are further installed in the installation grooves, and each heat conduction structure comprises a heat conduction assembly which is installed on the side, away from the element, of the phase-change material. The heat conduction assembly extends out of the outer side of the lower-layer plate or the upper-layer plate, and heat dissipation fins are installed at the end, away from the phase change materials, of the heat conduction assembly. High temperature can be balanced when the temperature is normal, heat dissipation is started when the temperature is overheated, and the heat dissipation fins are controlled to be not in contact and self-heat to remove moisture when moisture invades.

Description

Technical Field

[0001] The present invention belongs to the technical field of circuit boards, and in particular relates to a multi-layer composite embedded electronic circuit board assembly. Background Art

[0002] As modern electronic devices continue to develop towards miniaturization and high performance, multi-layer composite embedded electronic circuit board assemblies have been widely used in many fields because they can effectively improve the integration and performance of electronic devices. From portable electronic devices to industrial control devices, from communication base stations to medical equipment, such circuit board assemblies play a key role.

[0003] Traditional multi-layer composite embedded electronic circuit board assemblies have exposed many problems that need to be solved in actual use. In terms of heat dissipation, when the internal components of the circuit board assembly are working, especially under high load operation, a large amount of heat is generated in local areas. Although some circuit boards are equipped with heat dissipation devices in the existing technology, the heat dissipation effect is not ideal.

[0004] Some circuit boards rely solely on simple heat sinks for natural heat dissipation. When faced with high heat generated by components, they are unable to dissipate the heat in a timely and effective manner, resulting in localized overheating. Excessive temperature not only affects the normal performance of components, reducing their operating speed and stability, but also accelerates component aging when in a high temperature environment for a long time, greatly shortening the service life of the components and the entire circuit board assembly.

[0005] At the same time, when there is moisture inside, traditional circuit board assemblies lack effective response mechanisms. The intrusion of moisture can cause moisture to the electronic components, leading to problems such as short circuits and corrosion, seriously affecting the reliability and stability of the circuit board assembly. Moreover, existing moisture-proof measures are often just simple sealing. However, in the actual complex use environment, such sealing is difficult to completely prevent the entry of moisture. Once moisture enters the circuit board, it may cause irreversible damage to the electronic components.

[0006] In summary, existing multi-layer composite embedded electronic circuit board assemblies have obvious defects in heat dissipation and moisture resistance, and cannot meet the growing high performance and high reliability requirements of modern electronic equipment. Summary of the Invention

[0007] The purpose of the present invention is to provide a multi-layer composite embedded electronic circuit board assembly, which can balance the high temperature when the temperature is normal, start heat dissipation when overheating, control the heat dissipation fins to prevent contact and self-heat to drive away moisture when moisture invades, and effectively prevent components from aging and damage due to high temperature and moisture.

[0008] The technical solutions adopted by the present invention are as follows:

[0009] A multi-layer composite embedded electronic circuit board assembly includes a circuit board body formed by pressing an upper plate and a lower plate together. Multiple mounting slots are distributed in the upper plate and the lower plate, each of which is equipped with a component. The mounting slot is also equipped with a phase change material, and the phase change material is in contact with the component. Multiple heat-conducting structures are provided in the upper plate and the lower plate, and the number of the multiple heat-conducting structures is the same as that of the mounting slots and their positions correspond to each other. A detection and control component is also installed in the mounting slot.

[0010] The heat-conducting structure includes a heat-conducting component, which is installed on the side of the phase change material away from the component, and extends to the outside of the lower plate or the upper plate. A heat dissipation fin is installed on the end of the heat-conducting component away from the phase change material.

[0011] The detection component includes a heat dissipation fin fixed inside the mounting slot, a memory conductive metal is installed on the upper part of the heat dissipation fin, and a movable conductive sheet is provided at the middle and top of one side of the memory conductive metal. An arc-shaped surface is provided in the upper plate and the lower plate at a position corresponding to the memory conductive metal, and two contact conductive sheets are provided on one side of the arc-shaped surface close to the memory conductive metal. When the memory conductive metal is deformed, the two movable conductive sheets respectively adhere to the two contact conductive sheets.

[0012] The heat-conducting assembly includes an upper heat-conducting bar and a lower heat-conducting bar. The upper heat-conducting bar is in contact with the phase change material, and the lower heat-conducting bar is in contact with the heat dissipating fin. An installation compartment is provided in the lower heat-conducting bar, and a contact bar is slidably connected in the installation compartment. The contact bar is located inside the installation compartment and an iron sheet is fixed thereto. A plurality of spring sheets are provided between the iron sheet and the lower heat-conducting bar. A contact groove is provided at one end of the upper heat-conducting bar close to the contact bar. Electromagnets are distributed on the outside of the upper plate and the lower plate and at positions corresponding to the iron sheet.

[0013] The memory conductive metal includes an active layer and a passive layer that are bonded to each other, and the active layer is arranged on a side close to the arc surface. An assembly groove is formed between the active layer and the passive layer, and a humidity-sensitive layer is assembled in the assembly groove. Through holes are evenly distributed on the active layer and the passive layer.

[0014] A plurality of heat-resistance bars are fixed to one end of the contact bar close to the upper heat-conducting bar, and a plurality of extending grooves corresponding to the heat-resistance bars are provided in the upper heat-conducting bar.

[0015] When the memory conductive metal is bent by heat, the movable conductive piece located in the middle of the memory conductive metal contacts the contact conductive piece located in the middle of the arc surface; when the memory conductive metal is bent by moisture, the movable conductive piece located at the top of the memory conductive metal contacts the contact conductive piece located at the top of the arc surface.

[0016] The circuit board body is also equipped with:

[0017] A signal acquisition circuit, connected to the two contact conductive sheets, for detecting the on / off status of the circuit at the positions of the two contact conductive sheets;

[0018] A logic control module, configured to receive a status signal from a signal acquisition circuit and output a control instruction, wherein the logic control module includes a humidity priority unit;

[0019] The execution drive module includes a drive unit and a heating and dehumidification unit. The execution drive module is used to receive instructions from the logic control module to control whether the electromagnet is started or not. When the circuit path at the position of the contact conductive sheet at the top is formed, the electromagnet is forced to start.

[0020] An abutment piece is further provided in the installation groove. The abutment piece is provided on a side of the component away from the phase change material, and the abutment piece is arranged in contact with the component.

[0021] A partition is provided between the upper plate and the lower plate.

[0022] The technical effects achieved by the present invention are:

[0023] When the temperature rises, the present invention increases the heat dissipation of the components by contacting the movable conductive sheet located in the middle of the memory conductive metal with the contact conductive sheet located in the middle of the arc surface. When the components are exposed to moisture, the movable conductive sheet located at the top of the memory conductive metal contacts the contact conductive sheet located at the top of the arc surface, which can cut off the heat dissipation and drive away moisture through self-heating. As a result, the high temperature is balanced when the temperature is normal, and heat dissipation is activated when the components are overheated. When moisture invades, the heat dissipation fins are controlled not to contact and self-heat to drive away moisture, effectively preventing the components from being aged or damaged by moisture, improving the performance and stability of the electronic circuit board components, and extending the service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a structural schematic diagram of the present invention;

[0025] Figure 2 is a top view of the circuit board body of the present invention;

[0026] Figure 3 It is a schematic diagram of the structure between the upper plate, the lower plate and the partition in the present invention;

[0027] Figure 4In the present invention Figure 3 Enlarged view of point A in the middle;

[0028] Figure 5 In the present invention Figure 4 Enlarged view of point B in the middle;

[0029] Figure 6 In the present invention Figure 4 Enlarged view of point C in the middle;

[0030] Figure 7 Schematic diagram of the structure between the active layer and the through hole in the present invention;

[0031] Figure 8 It is a schematic diagram of the structure between the active layer, the passive layer and the moisture-sensitive layer in the present invention.

[0032] In the accompanying drawings, the components represented by the reference numerals are as follows:

[0033] 1. Circuit board body; 11. Upper board; 12. Lower board; 13. Partition; 14. Mounting slot; 15. Contact conductive sheet; 2. Component; 3. Phase change material; 4. Abutment sheet; 5. Thermal conductive component; 51. Upper thermal conductive strip; 52. Lower thermal conductive strip; 53. Mounting compartment; 54. Contact strip; 55. Iron sheet; 56. Spring piece; 57. Contact slot; 58. Electromagnet; 59. Thermal resistance strip; 6. Heat sink; 7. Memory conductive metal; 71. Active layer; 72. Passive layer; 73. Assembly slot; 74. Moisture-sensitive layer; 75. Through hole; 8. Movable conductive sheet; 9. Arc surface; 10. Extending into the slot. DETAILED DESCRIPTION

[0034] In order to make the purpose and advantages of the present invention more clearly understood, the present invention is described in detail below with reference to the following examples. It should be understood that the following text is only used to describe one or more specific embodiments of the present invention and does not strictly limit the scope of protection of the present invention.

[0035] like Figures 1-8 As shown, a multi-layer composite embedded electronic circuit board assembly includes a circuit board body 1 formed by pressing an upper plate 11 and a lower plate 12 together. A partition 13 is provided between the upper plate 11 and the lower plate 12. The partition 13 is used to separate the upper plate 11 and the lower plate 12, thereby forming two independent circuits. The partition 13 can be made of rubber, resin, etc. A plurality of mounting grooves 14 are distributed in the upper plate 11 and the lower plate 12. Each mounting groove 14 is equipped with a component 2. The mounting groove 14 is also equipped with a phase change material 3. The phase change material 3 is in contact with the component 2. The outside of the phase change material 3 is isolated by a protective cover. When the component 2 is heated, it absorbs heat and melts, thereby achieving the effect of heat dissipation for the component 2. When the component 2 is not heated or heats less, it can solidify and release internal heat, thereby dissipating heat.

[0036] The phase-change material 3, which can be a paraffin-based composite material, is encapsulated by a 0.1mm-thick aluminum foil protective cover. The surface of the protective cover is distributed with heat-dissipating micropores with a diameter of 0.05mm to ensure efficient thermal contact with the component 2. When the temperature of the component 2 exceeds a certain threshold, the phase-change material 3 begins to melt, absorb heat, and expand in volume. The elastic deformation of the abutment sheet 4 buffers the pressure on the component 2, preventing mechanical damage.

[0037] An abutment sheet 4 is further provided in the mounting groove 14. The abutment sheet 4 is provided on the side of the component 2 away from the phase change material 3, and the abutment sheet 4 is provided in contact with the component 2. When the phase change material 3 melts or solidifies, its volume changes, and the abutment sheet 4 is provided so that the abutment sheet 4 can abut against the component 2, thereby making the component 2 tend to be generally stable. The abutment sheet 4 can be made of rubber or resin. A plurality of heat-conducting structures are provided in the upper plate 11 and the lower plate 12. The plurality of heat-conducting structures are the same in number and in corresponding positions as the mounting grooves 14.

[0038] Refer to the attached Figure 4 The heat-conducting structure includes a heat-conducting component 5, which is installed on the side of the phase change material 3 away from the element 2. The heat-conducting component 5 extends to the outside of the lower plate 12 or the upper plate 11. The end of the heat-conducting component 5 away from the phase change material 3 is equipped with a heat dissipation fin 6;

[0039] When the heat conducting component 5 is attached to the phase change material 3 , the heat conducting component 5 collects and guides the heat contacted by the phase change material 3 to the position of the heat dissipation fins 6 , and the heat is dissipated through the heat dissipation fins 6 .

[0040] A detection and control component is also installed in the installation slot 14.

[0041] Refer to the attached Figure 5 -Attached Figure 8 The detection and control component includes a heat sink 6 fixed inside the mounting slot 14, and a memory conductive metal 7 is installed on the upper part of the heat sink 6. The memory conductive metal 7 is an existing mature technology. It is a special metal material that can restore its original macroscopic shape in another temperature range after undergoing plastic deformation within a certain temperature range. The critical temperature at which its shape changes is called the "transformation temperature", also known as the "phase change temperature". When the memory metal is in an environment below the phase change temperature, its shape is called the "low-temperature phase", and when it is in an environment above the phase change temperature, its shape is called the "high-temperature phase"; a movable conductive sheet 8 is provided in the middle and top of one side of the memory conductive metal 7, and an arc-shaped surface 9 is provided in the upper plate 11 and the lower plate 12 and at a position corresponding to the memory conductive metal 7. Two contact conductive sheets 15 are provided on the side of the arc-shaped surface 9 close to the memory conductive metal 7. When the memory conductive metal 7 is deformed, the two movable conductive sheets 8 respectively fit with the two contact conductive sheets 15;

[0042] The heat conducting assembly 5 includes an upper heat conducting bar 51 and a lower heat conducting bar 52. The upper heat conducting bar 51 contacts the phase change material 3, and the lower heat conducting bar 52 contacts the heat dissipating fins 6. A mounting chamber 53 is provided in the lower heat conducting bar 52. A contact bar 54 is slidably connected to the mounting chamber 53. The contact bar 54 is located inside the mounting chamber 53 and fixed with an iron sheet 55. A plurality of springs 56 are provided between the iron sheet 55 and the lower heat conducting bar 52. A contact groove 57 is provided at one end of the upper heat conducting bar 51 close to the contact bar 54. Electromagnets 58 are distributed on the outer sides of the upper plate 11 and the lower plate 12 and at positions corresponding to the iron sheet 55.

[0043] Furthermore, when the memory conductive metal 7 is bent by heat, the movable conductive piece 8 located in the middle of the memory conductive metal 7 contacts the contact conductive piece 15 located in the middle of the arc-shaped surface 9; when the memory conductive metal 7 is bent by moisture, the movable conductive piece 8 located at the top of the memory conductive metal 7 contacts the contact conductive piece 15 located at the top of the arc-shaped surface 9.

[0044] The circuit board body 1 is also equipped with:

[0045] A signal acquisition circuit, connected to the two contact conductive sheets 15, for detecting the on / off status of the circuit at the positions of the two contact conductive sheets 15;

[0046] A logic control module, configured to receive status signals from a signal acquisition circuit and output control instructions, wherein the logic control module includes a humidity priority unit;

[0047] The execution drive module includes a drive unit and a heating and dehumidification unit. The execution drive module is used to receive instructions from the logic control module to control whether the electromagnet 58 is started or not. When the circuit path at the position of the contact conductive sheet 15 at the top is opened, the electromagnet 58 is forced to start.

[0048] When the memory conductive metal 7 is deformed by heat, the movable conductive sheet 8 located in the middle of the memory conductive metal 7 contacts the contact conductive sheet 15 located in the middle of the arc-shaped surface 9, thereby connecting the circuit. The memory conductive metal 7 is connected to the execution drive module, and the contact conductive sheet 15 is connected to the power supply. When the execution drive module is powered, it controls the electromagnet 58 to be de-energized. At this time, the spring 56 springs the iron sheet 55 and the contact bar 54 to contact the upper heat-conducting bar 51, thereby forming the upper heat-conducting bar 51, the contact bar 54 and the lower heat-conducting bar 52 into a whole, thereby directing the heat to the heat dissipation fins 6, and dissipating the heat through the heat dissipation fins 6.

[0049] When the memory conductive metal 7 is deformed by moisture, its deformation degree is even greater. At this time, the deformed memory conductive metal 7 drives the movable conductive sheet 8 at the top to contact the contact conductive sheet 15 at the top of the arc surface 9, thereby forcibly starting the electromagnet 58, so that the electromagnet 58 adsorbs the iron sheet 55 and drives the contact strip 54 and the upper heat-conducting strip 51 to break away from each other. A plurality of heat-resisting strips 59 are fixed to one end of the contact strip 54 close to the upper heat-conducting strip 51. The heat-resisting strip 59 is made of a non-heat-conducting material, which can be made of ceramic or other materials. The upper heat-conducting strip 51 is provided with a plurality of heat-resisting strips 59 that are in contact with the heat-resisting strip 51. 9 extends into the groove 10 accordingly, so that the heat-resistant strip 59 can block the heat transfer to a certain extent, thereby causing the interior of the mounting groove 14 to gradually heat up due to the self-heating of the component 2, and can dissipate the moisture in the component 2. The circuit board body 1 can also be connected to a time control module, such as a time relay, etc., to control the start-up time of the electromagnet 58. When the movable conductive piece 8 located on the top of the memory conductive metal 7 is out of contact with the contact conductive piece 15 located on the top of the arc-shaped surface 9, if the time has not reached the set value, the electromagnet 58 is still controlled to start by the execution drive module.

[0050] Refer to the attached Figure 7 -Attached Figure 8 The memory conductive metal 7 includes an active layer 71 and a passive layer 72 that are bonded to each other. The active layer 71 can be made of iron, and the passive layer 72 can be made of copper. The active layer 71 is arranged on the side close to the curved surface 9. An assembly groove 73 is formed between the active layer 71 and the passive layer 72, and a moisture-sensitive layer 74 is assembled in the assembly groove 73. The moisture-sensitive layer 74 is a material that expands when it absorbs water, and it can be a material such as hydrogel. It has good water absorption performance. Therefore, the overall bending effect of the memory conductive metal 7 is better than the bending effect when it is heated. The water absorption rate of the moisture-sensitive layer 74 can reach 300% of its own weight. Through holes 75 are evenly distributed on the active layer 71 and the passive layer 72.

[0051] When the memory conductive metal 7 is at room temperature, the active layer 71 and the passive layer 72 remain flat. When the temperature rises, the passive layer 72 has a higher thermal expansion coefficient and expands faster than the active layer 71, causing the memory conductive metal 7 to bend toward the active layer 71. The overall arc-shaped setting of the arc surface 9 makes the movable conductive sheet 8 located in the middle of the memory conductive metal 7 contact with the contact conductive sheet 15 located in the middle of the arc surface 9, and the through holes 75 set on the surfaces of the active layer 71 and the passive layer 72 allow moisture to enter the assembly groove through the through holes 75. The moisture-sensitive layer 74 absorbs moisture and expands. When the moisture-sensitive layer 74 absorbs moisture and expands isotropically, it generates a lateral thrust on the active layer 71 and the passive layer 72. Since the thermal expansion coefficients of the active layer 71 and the passive layer 72 are different, the expansion of the moisture-sensitive layer 74 forces the overall structure to bend toward the side with a smaller expansion coefficient. Through the self-heating in the mounting groove 14, the movable conductive sheet 8 located on the top of the memory conductive metal 7 and the contact conductive sheet 15 located on the top of the arc-shaped surface 9 can contact each other.

[0052] The foregoing is merely a preferred embodiment of the present invention. It should be noted that those skilled in the art may make various improvements and modifications without departing from the principles of the present invention, and such improvements and modifications are also within the scope of protection of the present invention. Structures, devices, and operating methods not specifically described or explained herein shall, unless otherwise specified or limited, be implemented in accordance with conventional means in the art.

Claims

1. A multi-layer composite embedded electronic circuit board assembly, comprising a circuit board body (1) formed by laminating an upper layer (11) and a lower layer (12), characterized in that: A plurality of mounting grooves (14) are distributed in the upper plate (11) and the lower plate (12), each of the mounting grooves (14) is equipped with a component (2), a phase change material (3) is also equipped in the mounting groove (14), and the phase change material (3) is in contact with the component (2), a plurality of heat-conducting structures are provided in the upper plate (11) and the lower plate (12), the plurality of heat-conducting structures are the same in number and in corresponding positions as the mounting grooves (14), and a detection and control component is also installed in the mounting groove (14).

2. The multi-layer composite embedded electronic circuit board assembly according to claim 1, characterized in that: The heat-conducting structure includes a heat-conducting component (5), which is installed on a side of the phase-change material (3) away from the element (2), and the heat-conducting component (5) extends to the outside of the lower plate (12) or the upper plate (11), and a heat dissipation fin (6) is installed at the end of the heat-conducting component (5) away from the phase-change material (3).

3. The multi-layer composite embedded electronic circuit board assembly according to claim 2, characterized in that: The detection component includes a heat dissipation fin (6) fixed inside the mounting groove (14), a memory conductive metal (7) is installed on the upper part of the heat dissipation fin (6), a movable conductive sheet (8) is provided at the middle and top of one side of the memory conductive metal (7), an arc surface (9) is provided in the upper plate (11) and the lower plate (12) and at a position corresponding to the memory conductive metal (7), and two contact conductive sheets (15) are provided on one side of the arc surface (9) close to the memory conductive metal (7), and when the memory conductive metal (7) is deformed, the two movable conductive sheets (8) are respectively fitted with the two contact conductive sheets (15); The heat-conducting assembly (5) includes an upper heat-conducting bar (51) and a lower heat-conducting bar (52), wherein the upper heat-conducting bar (51) contacts the phase change material (3), and the lower heat-conducting bar (52) contacts the heat dissipating fin (6), and an installation chamber (53) is provided in the lower heat-conducting bar (52), wherein a contact bar (54) is slidably connected in the installation chamber (53), and an iron sheet (55) is fixed to the contact bar (54) inside the installation chamber (53), and a plurality of spring pieces (56) are provided between the iron sheet (55) and the lower heat-conducting bar (52), and a contact groove (57) is provided at one end of the upper heat-conducting bar (51) close to the contact bar (54), and electromagnets (58) are distributed on the outer sides of the upper plate (11) and the lower plate (12) and at positions corresponding to the iron sheet (55).

4. The multi-layer composite embedded electronic circuit board assembly according to claim 3, characterized in that: The memory conductive metal (7) includes an active layer (71) and a passive layer (72) that are arranged in contact with each other, and the active layer (71) is arranged on a side close to the arc surface (9), an assembly groove (73) is formed between the active layer (71) and the passive layer (72), and a humidity-sensitive layer (74) is assembled in the assembly groove (73), and through holes (75) are evenly distributed on the active layer (71) and the passive layer (72).

5. The multi-layer composite embedded electronic circuit board assembly according to claim 3, characterized in that: A plurality of heat-resisting strips (59) are fixed to one end of the contact strip (54) close to the upper heat-conducting strip (51), and a plurality of extending grooves (10) corresponding to the heat-resisting strips (59) are provided in the upper heat-conducting strip (51).

6. The multi-layer composite embedded electronic circuit board assembly according to claim 3, characterized in that: When the memory conductive metal (7) is bent by heat, the movable conductive piece (8) located in the middle of the memory conductive metal (7) contacts the contact conductive piece (15) located in the middle of the arc-shaped surface (9); when the memory conductive metal (7) is bent by moisture, the movable conductive piece (8) located at the top of the memory conductive metal (7) contacts the contact conductive piece (15) located at the top of the arc-shaped surface (9).

7. The multi-layer composite embedded electronic circuit board assembly according to claim 6, characterized in that: The circuit board body (1) is also equipped with: a signal acquisition circuit, used for connecting to the two contact conductive sheets (15) and for detecting the on-off state of the circuit at the positions of the two contact conductive sheets (15); A logic control module, configured to receive a status signal from a signal acquisition circuit and output a control instruction, wherein the logic control module includes a humidity priority unit; The execution drive module includes a drive unit and a heating and dehumidification unit. The execution drive module is used to receive instructions from the logic control module to control whether the electromagnet (58) is started or not. When the circuit path at the position of the contact conductive sheet (15) at the top is opened, the electromagnet (58) is forced to start.

8. The multi-layer composite embedded electronic circuit board assembly according to claim 1, characterized in that: An abutment piece (4) is also provided in the installation groove (14), and the abutment piece (4) is provided on a side of the element (2) away from the phase change material (3), and the abutment piece (4) is provided in contact with the element (2).

9. The multi-layer composite embedded electronic circuit board assembly according to claim 1, characterized in that: A partition (13) is provided between the upper plate (11) and the lower plate (12).

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