Low-resistance small-size chip capacitor

Abstract

The invention belongs to the technical field of chip capacitors, and particularly discloses a low-resistance small-size chip capacitor which comprises an epoxy resin shell, a hollow cavity is formed in the epoxy resin shell, an anode chip is arranged on one side of the epoxy resin shell, and a cathode chip is arranged on the other side of the epoxy resin shell. One end of the anode patch and one end of the cathode patch correspondingly extend into the hollow cavity, and the other end of the anode patch and the other end of the cathode patch correspondingly extend to the bottom of the epoxy resin shell; the rosin is filled into the storage cavity, the induction assembly can be triggered to release the rosin in the heated tin soldering process of the welding pins, tin soldering at the butt joint is easier, pseudo soldering is prevented, the positioning assembly can be triggered to work while the induction assembly works, meanwhile, the feedback assembly is opened, and therefore the rosin can be released. And corrosion hazards caused by overload damage in the subsequent use process of the capacitor are prevented.

Description

Technical Field

[0001] The present invention relates to the technical field of chip capacitors, and in particular to a low-resistance and small-volume chip capacitor. Background Art

[0002] Chip capacitors are made of ceramic dielectric diaphragms with printed electrodes (inner electrodes) stacked in an offset manner. After a one-time high-temperature sintering, a ceramic chip is formed. A metal layer (outer electrode) is then sealed at both ends of the chip to form a structure similar to a monolithic structure, so it is also called a monolithic capacitor.

[0003] Currently, in the semiconductor device packaging process, surface mount electronic component assembly usually involves printing metal solder on the carrier PCB board. The metal solder is usually a high melting point alloy solder mainly composed of tin. During the solder printing process, due to the presence of certain oil stains on the electrical interface of the PCB board or the pins of the electronic components, it is easy to cause cold solder joints in the soldering area, affecting the stability of the circuit connection. Summary of the Invention

[0004] In order to solve the problems existing in the prior art, the present invention provides a low-resistance and small-volume chip capacitor.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a low-resistance, small-volume chip capacitor, comprising an epoxy resin shell, a hollow cavity defined within the epoxy resin shell, an anode patch disposed on one side of the epoxy resin shell, and a cathode patch disposed on the other side of the epoxy resin shell, one end of each of the anode patch and the cathode patch correspondingly extending into the interior of the hollow cavity, and the other ends of each of the anode patch and the cathode patch correspondingly extending to the bottom of the epoxy resin shell; Welding pins are fixed to the bottom of the anode patch and the cathode patch, and limiting strips are fixed to the bottom of the two welding pins near one side edge. Sensing components are provided inside the two welding pins, positioning components are provided inside the two limiting strips, and two feedback components are provided inside the epoxy resin shell.

[0006] Preferably, a buffer cavity is provided in the middle of the epoxy resin shell, and the buffer cavity is located directly below the hollow cavity. A conical groove is provided on the inner bottom surface of the hollow cavity. Neutralization cavities are provided on both sides of the epoxy resin shell near the buffer cavity. Transition cavities are provided on one side of the epoxy resin shell near the two neutralization cavities. The tops of the two transition cavities are correspondingly connected to the tops of the two neutralization cavities, and the inner bottom surfaces of the two transition cavities are provided with drainage grooves that penetrate to the bottom of the epoxy resin shell.

[0007] Preferably, the sensing component includes an arc-shaped bimetallic strip, a storage cavity is provided inside the welding pin, a groove is provided on one side of the welding pin near the bottom edge, a through opening is provided on the top surface of the groove that passes through the storage cavity, air vents are provided on both sides of the inner wall of the storage cavity near the top edge that pass through to the outside of the welding pin, and two soldering grooves are provided at the bottom of the welding pin.

[0008] Preferably, an adjustment groove is opened inside the welding pin, one end of the arc-shaped bimetallic strip transitions to the inside of the adjustment groove, and a push plate is fixed to the other end of the arc-shaped bimetallic strip. One end of the push plate slides through the inside of the storage cavity, and the inner bottom surface of the storage cavity is slidingly sealed with a sealing slide. The penetration port is located below the sealing slide, and one end of the push plate is fixed to one side of the sealing slide.

[0009] Preferably, the positioning assembly includes a positioning rod, a driving cavity is opened inside the limit bar, the positioning rod is located inside the driving cavity, a cylindrical cavity is opened inside the welding pin directly below the adjustment groove, an inner cavity is opened in the middle of the limit bar, a side constraint opening is opened on the inner wall of one side of the cylindrical cavity that passes through the inner cavity, a contact rod is provided inside the cylindrical cavity, the top of the contact rod slides through the interior of the adjustment groove, and fits with the bottom of the arc-shaped bimetallic strip.

[0010] Preferably, an annular plate is fixed to the outer surface of the contact rod, and the annular plate slides between the inner walls of the cylindrical cavity. A second spring is fixed between the bottom of the annular plate and the inner bottom surface of the cylindrical cavity. A conical block is slidably arranged between the inner walls of the inner cavity, and a connecting plate is arranged inside the side constraint port, one end of the connecting plate is fixed to the bottom of the contact rod, and the other end of the connecting plate is fixed to the top of the conical block.

[0011] Preferably, one end of the positioning rod slides through the interior of the inner cavity, an arc block is fixed to one end of the positioning rod, the arc surface of the arc block and the conical surface of the conical block fit together, the other end of the positioning rod passes through the outside of the limit bar, a sliding plate is fixed to the outer surface of the positioning rod, the sliding plate slides between the inner walls of the driving cavity, and a third spring is fixed between one side of the sliding plate and one side inner wall of the driving cavity.

[0012] Preferably, the feedback component includes a pull-out plate, a pull-out groove is provided on one inner wall of the buffer cavity, an adjustment channel is provided inside the epoxy resin shell, one end of the pull-out groove passes through the interior of the adjustment channel, and the pull-out groove is connected to the inner bottom surface of the neutralization cavity and the inner bottom surface of the transition cavity, the pull-out plate slides between the inner walls of the pull-out groove, a first slot is provided on the bottom of the pull-out plate, and a second slot is provided on the bottom of the pull-out plate on one side of the first slot.

[0013] Preferably, a groove is provided on the inner bottom surface of the pull-out groove, and the first card slot and the second card slot are both located directly above the groove. A spring card is fixed to the inner wall of one side of the groove, and one end of the spring card extends and engages with the inside of the second card slot. One end of the pull-out plate is inclined, and a bending channel is provided inside the pull-out plate near one side edge, and both ends of the bending channel pass through to the top of the pull-out plate, and a connecting port is provided at the top of the pull-out plate near the other side edge that passes through to the bottom, and the connecting port is located on the inner side of the transition cavity, and the connecting port is opposite to the excretion groove, and one end of the bending channel is located inside the neutralization cavity, and the neutralization cavity and the buffer cavity are connected to each other through the bending channel.

[0014] Preferably, an adjusting rod is provided for sliding inside the adjusting channel, the bottom of the adjusting rod slides through the inside of the adjusting groove, and the bottom of the adjusting rod fits into the top of the arc-shaped bimetallic strip, the arc-shaped convex part of the arc-shaped bimetallic strip faces downward, a triangular groove is provided on one side of the adjusting rod, and the inclined part of one side of the pull-out plate extends into the inside of the triangular groove, a reciprocating cavity is provided on one side of the adjusting channel near the top edge, the top side of the adjusting rod is bent and extends into the inside of the reciprocating cavity, a first spring is fixed to the inner bottom surface of the reciprocating cavity, and the top of the first spring is fixed to the top bend of the adjusting rod.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention fills the storage cavity with rosin. During the soldering process of the soldering pins, the sensing component can be triggered to release rosin, making the soldering easier and preventing cold solder joints. When the sensing component is working, it will also trigger the positioning component to work and turn on the feedback component at the same time, preventing the capacitor from being damaged by overload and causing corrosion hazards during subsequent use. 2. When the induction component of the present invention is working, one end of the arc-shaped bimetallic strip contracts, thereby driving the push plate and the sealing slide plate to slide toward the side of the storage chamber. When one end of the sealing slide plate slides to the side of the through-hole, the through-hole is opened, and the fluid rosin inside the storage chamber can flow out to the inside of the through-hole, and cooperate with the solder wire at the welding pin for soldering; 3. When the positioning assembly of the present invention is working, the arc-shaped bimetallic strip will bend and deform due to heat during the welding process. When the contact rod is pressed downward, the contact rod slides downward and drives the conical block to slide downward. When the conical block slides downward, it pushes the arc block toward both sides of the inner cavity through the conical surface, thereby causing one end of the positioning rod to slide toward the outside of the limit bar, so that it fixes the welding pin and prevents shaking during welding; 4. When the feedback assembly in the present invention is working, when the adjusting rod slides downward, the pull-out plate can be pushed toward one side of the buffer cavity under the action of the inclined surface inside the triangular groove. At this time, one end of the pull-out plate extends to the inside of the buffer cavity, and the buffer cavity and the neutralization cavity can be connected through the bending channel. At the same time, the connecting port on the pull-out plate slides to the top of the drain groove, and the drain groove and the transition cavity are connected to each other through the connecting port. In this way, when the pressure inside the hollow cavity of the capacitor is increased after overloading in the subsequent use, it will be damaged preferentially through the conical groove. At this time, the corrosive parts inside the capacitor can flow into the buffer cavity, and then enter the neutralization cavity through the bending channel to react with the neutralizing substance before being discharged, avoiding corrosive damage to the outside. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The present invention provides a schematic diagram of the main three-dimensional structure of a low-resistance and small-volume chip capacitor; Figure 2 The present invention provides a schematic diagram of a three-dimensional structure of a low-resistance and small-volume chip capacitor when viewed from above; Figure 3 The present invention provides a schematic diagram of a cross-sectional three-dimensional structure of a low-resistance and small-volume chip capacitor; Figure 4 The present invention provides a schematic diagram of a cross-sectional three-dimensional structure of welding pins in a low-resistance and small-volume chip capacitor; Figure 5 For the present invention Figure 3 A partial enlarged view of point A in the middle; Figure 6 For the present invention Figure 3 A partial enlarged view of point B in the middle; Figure 7 For the present invention Figure 4 A magnified partial view of point C in the middle.

[0017] Figure: 1, epoxy resin shell; 2, anode patch; 3, welding pin; 4, air vent; 5, limit strip; 6, soldering groove; 7, twisted mouth; 8, through-hole; 9, cathode patch; 10, hollow cavity; 11, tapered groove; 12, buffer cavity; 13, neutralization cavity; 14, transition cavity; 15, storage cavity; 16, drainage groove; 17, pull-out groove; 18, pull-out plate; 19, bending channel; 20, connecting port; 21, first card slot; 22, second card slot; 23, groove; 24, spring Spring card; 25, reciprocating cavity; 26, adjusting channel; 27, adjusting rod; 28, first spring; 29, triangular groove; 30, sealing slide; 31, adjusting groove; 32, arc-shaped bimetallic strip; 33, push plate; 34, cylindrical cavity; 35, contact rod; 36, annular plate; 37, second spring; 38, side restraint port; 39, connecting plate; 40, inner cavity; 41, conical block; 42, driving cavity; 43, positioning rod; 44, sliding plate; 45, third spring; 46, arc-shaped block. DETAILED DESCRIPTION

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the implementation regulations described are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0019] See also Figure 1-7 The present invention provides a technical solution: a low-resistance, small-volume chip capacitor, comprising an epoxy resin shell 1, wherein a hollow cavity 10 is defined within the epoxy resin shell 1, an anode patch 2 is disposed on one side of the epoxy resin shell 1, and a cathode patch 9 is disposed on the other side of the epoxy resin shell 1, wherein one end of the anode patch 2 and the cathode patch 9 extend into the interior of the hollow cavity 10, and the other end of the anode patch 2 and the cathode patch 9 extend to the bottom of the epoxy resin shell 1; The bottom of the anode patch 2 and the cathode patch 9 are both fixed with welding pins 3, and the bottom of the two welding pins 3 is fixed with a limit strip 5 near the edge of one side. The inside of the two welding pins 3 is provided with an induction component, and the inside of the two limit strips 5 is provided with a positioning component. The inside of the epoxy resin shell 1 is provided with two feedback components. The inside of the epoxy resin shell 1 is provided with a buffer cavity 12 in the middle, and the buffer cavity 12 is located directly below the hollow cavity 10. The inner bottom surface of the hollow cavity 10 is provided with a conical groove 11. The inside of the epoxy resin shell 1 is provided with neutralization cavities 13 on both sides near the buffer cavity 12. The inside of the epoxy resin shell 1 is provided with a transition cavity 14 on one side near the two neutralization cavities 13. The tops of the two transition cavities 14 are correspondingly connected to the tops of the two neutralization cavities 13, and the inner bottom surfaces of the two transition cavities 14 are provided with drainage grooves 16 that pass through the bottom of the epoxy resin shell 1.

[0020] The effect achieved is that, by fixing the welding pins 3 at the bottom of the anode patch 2 and the cathode patch 9, and connecting the welding pins 3 with the epoxy resin shell 1, it is convenient to solder the welding pins 3 to the docking part of the PCB circuit board during soldering, and rosin is filled into the storage cavity 15. During the process of heating and soldering the welding pins 3, the sensing component can be triggered to release rosin, making the docking part easier to solder and preventing cold soldering. When the sensing component is working, it will also trigger the positioning component to work, and at the same time, the feedback component will be turned on to prevent the capacitor from being overloaded and damaged during subsequent use, causing corrosive hazards.

[0021] like Figure 2 、 Figure 3 and Figure 6As shown, the sensing component includes an arc-shaped bimetallic strip 32, a storage cavity 15 is opened inside the welding pin 3, a groove 7 is opened on one side of the welding pin 3 near the bottom edge, and a through-hole 8 is opened on the inner top surface of the groove 7 to penetrate into the interior of the storage cavity 15, and air vents 4 are opened on the inner walls of both sides of the storage cavity 15 near the top edge to penetrate to the outside of the welding pin 3, two soldering grooves 6 are opened at the bottom of the welding pin 3, and an adjustment groove 31 is opened inside the welding pin 3, one end of the arc-shaped bimetallic strip 32 transitions to the interior of the adjustment groove 31, and a push plate 33 is fixed to the other end of the arc-shaped bimetallic strip 32, one end of the push plate 33 slides through the interior of the storage cavity 15, and the inner bottom surface of the storage cavity 15 is slidably sealed with a sealing slide 30, the through-hole 8 is located below the sealing slide 30, and one end of the push plate 33 is fixed to one side of the sealing slide 30.

[0022] The effect achieved is that the melted solder wire during the soldering process will heat the joint between the soldering pin 3 and the PCB circuit board, and while being heated, the rosin inside the storage cavity 15 will melt and turn it into a fluid state, and the arc-shaped bimetallic strip 32 inside the soldering pin 3 will bend and deform when heated, thereby causing one end of the arc-shaped bimetallic strip 32 to shrink, thereby driving the push plate 33 and the sealing slide 30 to slide toward the side of the storage cavity 15. When one end of the sealing slide 30 slides to the side of the through-port 8, the through-port 8 is in an open state, and the fluid-state rosin inside the storage cavity 15 can flow out to the inside of the twisted port 7, and cooperate with the solder wire at the soldering pin 3 for soldering.

[0023] like Figure 2 、 Figure 3 、 Figure 4 、 Figure 6 and Figure 7As shown, the positioning assembly includes a positioning rod 43, a driving cavity 42 is opened inside the limiting strip 5, the positioning rod 43 is located inside the driving cavity 42, a cylindrical cavity 34 is opened inside the welding pin 3 just below the adjusting groove 31, an inner cavity 40 is opened in the middle of the limiting strip 5, and a side constraint opening 38 is opened on one side of the inner wall of the cylindrical cavity 34, which penetrates into the inner cavity 40. A contact rod 35 is provided inside the cylindrical cavity 34, and the top of the contact rod 35 slides through the inside of the adjusting groove 31 and fits with the bottom of the arc-shaped bimetallic strip 32. An annular plate 36 is fixed to the outer surface of the contact rod 35, and the annular plate 36 slides between the inner walls of the cylindrical cavity 34, and the bottom of the annular plate 36 and the inner bottom surface of the cylindrical cavity 34 are in contact with each other. A second spring 37 is fixed between the inner walls of the inner cavity 40, a conical block 41 is slidingly set between the inner walls of the inner cavity 40, a connecting plate 39 is set inside the side constraint port 38, one end of the connecting plate 39 is fixed to the bottom of the contact rod 35, and the other end of the connecting plate 39 is fixed to the top of the conical block 41, one end of the positioning rod 43 slides through the interior of the inner cavity 40, one end of the positioning rod 43 is fixed with an arc block 46, the arc surface of the arc block 46 and the conical surface of the conical block 41 fit together, the other end of the positioning rod 43 passes through the outside of the limit bar 5, and a sliding plate 44 is fixed on the outer surface of the positioning rod 43. The sliding plate 44 slides between the inner walls of the drive cavity 42, and a third spring 45 is fixed between one side of the sliding plate 44 and one side of the inner wall of the drive cavity 42.

[0024] The effect achieved is that, since the chip capacitor is small in size, it is easy to shake during welding. Therefore, by fixing the limit strip 5 at the bottom of the welding pin 3, the chip capacitor can be pre-positioned at the welding part of the PCB board before welding to prevent shaking during welding. During the welding process, the arc-shaped bimetallic strip 32 will be bent and deformed due to heat, and the contact rod 35 will be pressed downward. When the contact rod 35 slides downward, it will drive the conical block 41 to slide downward. When the conical block 41 slides downward, it will push the arc block 46 to both sides of the inner cavity 40 through the conical surface, and then make one end of the positioning rod 43 slide toward the outside of the limit strip 5, so that it fixes the welding pin 3 to prevent shaking during welding.

[0025] like Figure 3 、 Figure 5 and Figure 6As shown, the feedback component includes a pull-out plate 18, a pull-out groove 17 is provided on one side inner wall of the buffer chamber 12, an adjustment channel 26 is provided inside the epoxy resin shell 1, one end of the pull-out groove 17 passes through the inside of the adjustment channel 26, and the pull-out groove 17 is connected to the inner bottom surface of the neutralization chamber 13 and the inner bottom surface of the transition chamber 14. The pull-out plate 18 is slidably located between the inner walls of the pull-out groove 17, and a first card slot 21 is provided at the bottom of the pull-out plate 18. The bottom of the pull-out plate 18 is located at the first card slot 2 A second card slot 22 is provided on one side, and a groove 23 is provided on the inner bottom surface of the drawer slot 17. The first card slot 21 and the second card slot 22 are both located directly above the groove 23. A spring card 24 is fixed to the inner wall of one side of the groove 23. One end of the spring card 24 extends and engages with the inside of the second card slot 22. One end of the drawer plate 18 is inclined. A bending channel 19 is provided inside the drawer plate 18 near one side edge. Both ends of the bending channel 19 pass through the top of the drawer plate 18. The drawer plate The top of 18 is provided with a connection port 20 extending through the bottom near the edge of the other side. The connection port 20 is located inside the transition chamber 14. The connection port 20 is opposite to the discharge groove 16. One end of the bending channel 19 is located inside the neutralization chamber 13. The neutralization chamber 13 and the buffer chamber 12 are connected to each other through the bending channel 19. The internal sliding of the adjustment channel 26 is provided with an adjustment rod 27. The bottom of the adjustment rod 27 slides through the interior of the adjustment groove 31, and the bottom of the adjustment rod 27 is in contact with the arc-shaped bimetallic strip 32. The tops of the adjusting rod 27 fit together, the convex part of the arc surface of the arc-shaped bimetallic strip 32 faces downward, a triangular groove 29 is provided on one side of the adjusting rod 27, and the inclined part of one side of the pull-out plate 18 extends into the inside of the triangular groove 29. A reciprocating cavity 25 is provided on one side of the adjusting channel 26 near the top edge, and the top side of the adjusting rod 27 is bent and extends into the inside of the reciprocating cavity 25. A first spring 28 is fixed to the inner bottom surface of the reciprocating cavity 25, and the top of the first spring 28 is fixed to the top bend of the adjusting rod 27.

[0026] The effect achieved is that, first, the neutralizing substance is filled into the neutralizing chamber 13, and when the arc-shaped bimetallic strip 32 is heated and bends and deforms, the constraint on the bottom of the adjusting rod 27 is released. At this time, the adjusting rod 27 is driven to slide downward to the bottom of the adjusting channel 26 under the elastic force of the first spring 28. Since the pull-out plate 18 and the inclined surface extend to the inside of the triangular groove 29 on one side of the adjusting rod 27, the pull-out plate 18 can be pushed toward the side of the buffer chamber 12 under the action of the inclined surface inside the triangular groove 29 when the adjusting rod 27 slides downward. During the pushing process, one end of the spring card 24 slides out from the inside of the second card slot 22 and engages with the inside of the first card slot 21. At this time, one end of the pull-out plate 18 extends to the inside of the buffer chamber 12, The other end of the bending channel 19 on the pull-out plate 18 is connected to the buffer chamber 12, and one end of the bending channel 19 is located inside the neutralization chamber 13. At this time, the buffer chamber 12 and the neutralization chamber 13 can be connected through the bending channel 19. At the same time, the connecting port 20 on the pull-out plate 18 slides to the top of the drain groove 16, and the drain groove 16 and the transition chamber 14 are connected to each other through the connecting port 20. In this way, when the pressure inside the hollow cavity 10 of the capacitor is increased after overloading, it will be damaged preferentially through the conical groove 11 during subsequent use. At this time, the corrosive parts inside the capacitor can flow into the buffer chamber 12, and then enter the neutralization chamber 13 through the bending channel 19 to undergo a neutralization reaction with the neutralizing substance before being discharged, thereby avoiding corrosive damage to the outside.

[0027] Working principle: When using this device, first fill the storage cavity 15 with rosin, and fill the neutralizing substance in the neutralizing cavity 13. During the soldering process, the melted solder wire will heat the joint between the soldering pin 3 and the PCB circuit board. While being heated, the rosin in the storage cavity 15 will melt and become a fluid state. In addition, the arc-shaped bimetallic strip 32 inside the soldering pin 3 will bend and deform when heated, thereby causing one end of the arc-shaped bimetallic strip 32 to shrink, thereby driving the push plate 33 and the sealing slide 30 to slide toward the side of the storage cavity 15. When one end of the sealing slide 30 slides to the side of the through-port 8, the through-port 8 is in an open state. At this time, the fluid-state rosin inside the storage cavity 15 is The tin can flow out to the inside of the mouth 7 and be soldered with the solder wire at the welding pin 3. Since the chip capacitor is small in size, it is easy to shake during welding. Therefore, by fixing the limiting strip 5 at the bottom of the welding pin 3, the chip capacitor can be pre-positioned at the welding part of the PCB board before welding to prevent shaking during welding. During the welding process, the arc-shaped bimetallic strip 32 will be bent and deformed due to heat. The contact rod 35 is pressed downward. When the contact rod 35 slides downward, the conical block 41 is driven to slide downward. When the conical block 41 slides downward, it pushes the arc block 46 to both sides of the inner cavity 40 through the conical surface, thereby causing one end of the positioning rod 43 to slide toward the outside of the limiting strip 5, so that it fixes the welding pin 3. To prevent shaking during welding, when the arc-shaped bimetallic strip 32 is heated and bends and deforms, the constraint on the bottom of the adjusting rod 27 is released. At this time, the adjusting rod 27 is driven to slide downward to the bottom of the adjusting channel 26 under the elastic force of the first spring 28. Since the pull-out plate 18 and the inclined surface extend to the inside of the triangular groove 29 on one side of the adjusting rod 27, the pull-out plate 18 can be pushed toward the side of the buffer cavity 12 under the action of the inclined surface inside the triangular groove 29 when the adjusting rod 27 slides downward. During the pushing process, one end of the spring card 24 slides out from the inside of the second card slot 22 and engages with the inside of the first card slot 21. At this time, one end of the pull-out plate 18 extends to the inside of the buffer cavity 12, and the bend on the pull-out plate 18 The other end of the channel 19 is connected to the buffer chamber 12, and one end of the bent channel 19 is located inside the neutralization chamber 13. At this time, the buffer chamber 12 and the neutralization chamber 13 can be connected through the bent channel 19. At the same time, the connecting port 20 on the pull-out plate 18 slides to the top of the drain groove 16, and the drain groove 16 and the transition chamber 14 are connected to each other through the connecting port 20. In this way, when the pressure inside the hollow cavity 10 of the capacitor is increased after overloading in the subsequent use, it will preferentially break through the conical groove 11. At this time, the corrosive parts inside the capacitor can flow into the buffer chamber 12, and then enter the neutralization chamber 13 through the bent channel 19 to undergo a neutralization reaction with the neutralizing substance before being discharged, thereby avoiding corrosive damage to the outside.

[0028] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A low-resistance, small-volume chip capacitor, characterized in that: The invention comprises an epoxy resin shell (1), wherein a hollow cavity (10) is provided inside the epoxy resin shell (1), an anode patch (2) is provided on one side of the epoxy resin shell (1), and a cathode patch (9) is provided on the other side of the epoxy resin shell (1), one end of the anode patch (2) and the cathode patch (9) respectively extend to the inside of the hollow cavity (10), and the other end of the anode patch (2) and the cathode patch (9) respectively extend to the bottom of the epoxy resin shell (1); The bottoms of the anode patch (2) and the cathode patch (9) are both fixed with welding pins (3), the bottoms of the two welding pins (3) are both fixed with limiting strips (5) near one side edge, the interiors of the two welding pins (3) are both provided with sensing components, the interiors of the two limiting strips (5) are both provided with positioning components, and the interior of the epoxy resin shell (1) is provided with two feedback components.

2. The low-resistance, small-volume chip capacitor according to claim 1, characterized in that: A buffer cavity (12) is provided in the middle of the epoxy resin shell (1), and the buffer cavity (12) is located directly below the hollow cavity (10). A conical groove (11) is provided on the inner bottom surface of the hollow cavity (10). Neutralization cavities (13) are provided on both sides of the epoxy resin shell (1) near the buffer cavity (12). Transition cavities (14) are provided on one side of the epoxy resin shell (1) near the two neutralization cavities (13). The tops of the two transition cavities (14) are connected to the tops of the two neutralization cavities (13). The inner bottom surfaces of the two transition cavities (14) are provided with drainage grooves (16) that penetrate to the bottom of the epoxy resin shell (1).

3. The low-resistance, small-volume chip capacitor according to claim 2, characterized in that: The induction component includes an arc-shaped bimetallic strip (32), a storage cavity (15) is provided inside the welding pin (3), a groove (7) is provided on one side of the welding pin (3) near the bottom edge, a through hole (8) is provided on the top surface of the groove (7) and penetrates into the storage cavity (15), and air vents (4) are provided on both sides of the inner wall of the storage cavity (15) near the top edge and penetrate to the outside of the welding pin (3), and two soldering grooves (6) are provided at the bottom of the welding pin (3).

4. The low-resistance, small-volume chip capacitor according to claim 3, characterized in that: An adjustment groove (31) is provided inside the welding pin (3), one end of the arc-shaped bimetallic strip (32) transitions to the inside of the adjustment groove (31), and a push plate (33) is fixed to the other end of the arc-shaped bimetallic strip (32), one end of the push plate (33) slides through the inside of the storage cavity (15), and a sealing slide plate (30) is slidably and sealedly fitted on the inner bottom surface of the storage cavity (15), the through-port (8) is located below the sealing slide plate (30), and one end of the push plate (33) is fixed to one side of the sealing slide plate (30).

5. The low-resistance, small-volume chip capacitor according to claim 4, characterized in that: The positioning assembly includes a positioning rod (43), a driving cavity (42) is provided inside the limiting strip (5), the positioning rod (43) is located inside the driving cavity (42), a cylindrical cavity (34) is provided inside the welding pin (3) and is located directly below the adjustment groove (31), an inner cavity (40) is provided inside the limiting strip (5) and is located in the middle, a side constraint opening (38) is provided on one side inner wall of the cylindrical cavity (34) and extends into the inner cavity (40), a contact rod (35) is provided inside the cylindrical cavity (34), the top of the contact rod (35) slides through the inside of the adjustment groove (31) and fits with the bottom of the arc-shaped bimetallic strip (32).

6. The low-resistance, small-volume chip capacitor according to claim 5, characterized in that: An annular plate (36) is fixed to the outer surface of the contact rod (35), and the annular plate (36) slides between the inner walls of the cylindrical cavity (34). A second spring (37) is fixed between the bottom of the annular plate (36) and the inner bottom surface of the cylindrical cavity (34). A conical block (41) is slidably provided between the inner walls of the inner cavity (40). A connecting plate (39) is provided inside the side restraint port (38), and one end of the connecting plate (39) is fixed to the bottom of the contact rod (35), and the other end of the connecting plate (39) is fixed to the top of the conical block (41).

7. The low-resistance, small-volume chip capacitor according to claim 6, characterized in that: One end of the positioning rod (43) slides through the interior of the inner cavity (40), and an arc block (46) is fixed to one end of the positioning rod (43), and the arc surface of the arc block (46) fits with the conical surface of the conical block (41). The other end of the positioning rod (43) penetrates to the outside of the limit strip (5), and a sliding plate (44) is fixed to the outer surface of the positioning rod (43), and the sliding plate (44) slides between the inner walls of the driving cavity (42), and a third spring (45) is fixed between one side of the sliding plate (44) and the inner wall of one side of the driving cavity (42).

8. The low-resistance, small-volume chip capacitor according to claim 7, characterized in that: The feedback component includes a pull-out plate (18), a pull-out groove (17) is provided on one inner wall of the buffer cavity (12), an adjustment channel (26) is provided inside the epoxy resin shell (1), one end of the pull-out groove (17) passes through the inside of the adjustment channel (26), and the pull-out groove (17) is connected to the inner bottom surface of the neutralization cavity (13) and the inner bottom surface of the transition cavity (14), the pull-out plate (18) is slidably located between the inner walls of the pull-out groove (17), a first card slot (21) is provided on the bottom of the pull-out plate (18), and a second card slot (22) is provided on the side of the first card slot (21) at the bottom of the pull-out plate (18).

9. The low-resistance, small-volume chip capacitor according to claim 8, characterized in that: The inner bottom surface of the drawer slot (17) is provided with a groove (23), the first card slot (21) and the second card slot (22) are both located directly above the groove (23), a spring card (24) is fixed to the inner wall of one side of the groove (23), one end of the spring card (24) extends and engages with the inside of the second card slot (22), one end of the drawer plate (18) is inclined, and a bending channel (19) is provided inside the drawer plate (18) near one side edge, Both ends of the bending channel (19) pass through the top of the pull-out plate (18), and a connecting port (20) is provided at the top of the pull-out plate (18) near the other side edge, which passes through to the bottom. The connecting port (20) is located inside the transition cavity (14), and the connecting port (20) is opposite to the discharge groove (16). One end of the bending channel (19) is located inside the neutralization cavity (13), and the neutralization cavity (13) and the buffer cavity (12) are connected to each other through the bending channel (19).

10. The low-resistance, small-volume chip capacitor according to claim 9, characterized in that: An adjusting rod (27) is provided for sliding inside the adjusting channel (26), the bottom of the adjusting rod (27) slides through the inside of the adjusting groove (31), and the bottom of the adjusting rod (27) fits with the top of the arc-shaped bimetallic strip (32), the arc-shaped convex part of the arc-shaped bimetallic strip (32) faces downward, a triangular groove (29) is provided on one side of the adjusting rod (27), and an inclined part on one side of the pull-out plate (18) extends into the inside of the triangular groove (29), a reciprocating cavity (25) is provided on one side of the adjusting channel (26) near the top edge, the top side of the adjusting rod (27) is bent and extends into the inside of the reciprocating cavity (25), a first spring (28) is fixed to the inner bottom surface of the reciprocating cavity (25), and the top of the first spring (28) is fixed to the top bending part of the adjusting rod (27).

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