Embedded core-in-circuit board multi-cell vacuum press bonding apparatus and method

Abstract

The application discloses a kind of embedded embedded core circuit board multi-bin vacuum pressing equipment and method, belong to PCB processing technical field, this embedded embedded core circuit board multi-bin vacuum pressing equipment includes cabin, heating mechanism and vacuumizing mechanism, preheating bin is set in cabin, pressing bin and buffer bin, first airtight door is isolated between preheating bin and pressing bin, second airtight door is arranged between pressing bin and buffer bin, and heating mechanism and vacuumizing mechanism control the temperature and vacuum degree of each chamber respectively;Transfer mechanism is used for transporting material, drive mechanism controls the opening and closing of feed bin door, discharge bin door and first airtight door and second airtight door;Control mechanism coordinates each unit to work cooperatively, realizes closed-loop control by real-time monitoring process parameters.The application solves the problems of heat crosstalk, pressure fluctuation and other problems existing in traditional single-bin equipment through multi-chamber physical isolation and independent environment control, improves the process stability and production efficiency of PCB embedded chip pressing.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of PCB processing, in particular to a multi-compartment vacuum lamination device and method for embedded core PCB. BACKGROUND

[0002] PCB vacuum lamination process is a precision manufacturing process that combines multiple layers of PCB with prepreg into a whole through hot pressing in a high temperature and high pressure environment. The lamination principle is to tightly combine multiple layers of circuit board materials under controlled temperature, pressure and time conditions through hot pressing process, to fill the interlayer voids with resin in the prepreg that melts and flows under heat, and then to form an insulating layer through solidification, while ensuring that there are no air bubbles between layers and achieving the predetermined thickness through pressure, and finally realizing reliable adhesion and electrical interconnection of the multi-layer circuit structure. However, during the lamination process of the PCB, a clear temperature gradient is formed between the embedded chip area and the ordinary area. This unevenness of temperature distribution will directly affect the flow behavior and solidification process of the resin, making it difficult for the internal gas of the resin to be completely discharged, and the residual air expands to form air bubble defects in the subsequent high temperature lamination process. At the same time, the chip area heats up quickly due to the fast heat conduction of metal, causing the resin to solidify too early, while the ordinary substrate area has insufficient resin flowability due to the thermal hysteresis effect, ultimately resulting in incomplete filling and forming quality defects such as microcavities.

[0003] To precisely control the temperature to achieve the best flowability of the resin, maintain appropriate pressure to ensure full contact between layers, and maintain stable thermodynamic conditions during the solidification stage to ensure interface bonding strength, the industry generally uses single-compartment lamination equipment to simulate the multi-stage process through programmed temperature control. However, since the preheating, lamination and cooling processes are sequentially performed in the same physical space, the preheating and lamination processes must be paused simultaneously when the equipment enters the cooling process, and the process switching inevitably produces significant thermal inertia delay, thus not only directly prolonging the overall production cycle, but also more likely to cause temperature fluctuations to exceed the process window range, resulting in a decrease in product consistency. At the same time, the pressure shock formed during the vacuum environment switching process can disrupt the stability of the resin flow, especially in fine pitch interconnection structures, which can easily cause micro-bubble defects, directly affecting the packaging reliability. These process defects not only significantly reduce product quality and lead to a decrease in yield, but also weaken the bonding strength between the chip and the PCB, seriously affecting the reliability of electrical connections. SUMMARY

[0004] The present application aims to at least solve one of the technical problems existing in the prior art. To this end, the present application proposes a multi-compartment vacuum lamination device for embedded core PCB, which can reduce temperature fluctuations and pressure shocks, thereby avoiding the generation of defects such as air bubbles and cavities, enhancing the interface bonding strength and electrical connection reliability, and ensuring the stability of lamination quality.

[0005] This invention also proposes a multi-compartment vacuum lamination method for embedded core circuit boards.

[0006] According to a first aspect of the present invention, an embedded core circuit board multi-compartment vacuum pressing device includes: a chamber, which is sequentially divided into a preheating chamber, a pressing chamber, and a buffer chamber along the material conveying direction; the preheating chamber is provided with a feeding chamber door, the buffer chamber is provided with a discharging chamber door, a first airtight door is provided between the preheating chamber and the pressing chamber, and a second airtight door is provided between the pressing chamber and the buffer chamber; a heating mechanism, including a first heating unit disposed on the preheating chamber, a second heating unit disposed on the pressing chamber, and a third heating unit disposed on the buffer chamber; the first heating unit... The second heating unit is configured to perform gradient temperature control on the preheating chamber and the pressing chamber, so that the temperatures of the preheating chamber and the pressing chamber increase sequentially; the vacuuming mechanism includes a first vacuuming unit disposed on the preheating chamber, a second vacuuming unit disposed on the pressing chamber, and a third vacuuming unit disposed on the buffer chamber. When the first airtight door is open, the preheating chamber and the pressing chamber are connected and isolated from the outside of the chamber. When the second airtight door is open, the pressing chamber and the buffer chamber are connected and isolated from the outside of the chamber; the transfer mechanism is disposed on the chamber and is used to transfer materials inside the chamber.

[0007] At least the following beneficial effects are achieved: the preheating chamber, lamination chamber, and buffer chamber operate independently, and the temperature and vacuum environment can be matched to the needs of different process stages. In the preheating chamber, the PCB board is fully softened by the resin and internal gases are expelled under the vacuum environment of the preheating temperature. In the lamination chamber, the preheated resin can flow uniformly and completely fill the gaps between the chips. The gradient temperature rise between the preheating and lamination chambers ensures that the prepreg resin reaches the optimal flow state. The vacuum environment of the preheating and lamination chambers effectively suppresses the formation of bubbles and microvoids. The buffer cooling of the buffer chamber avoids quality defects caused by temperature fluctuations or pressure changes during the resin curing process, thereby improving the reliability and consistency of the product. On the other hand, each process stage is carried out synchronously in an independent chamber, ensuring uninterrupted vacuum environment while achieving uninterrupted continuous operation of the lamination process, making the production rhythm more compact and conducive to improving production efficiency and reducing production cycle.

[0008] According to some embodiments of the present invention, materials are conveyed from back to front. The conveying mechanism includes: a first conveyor belt disposed in a preheating chamber, the rear end of which is provided with a first telescopic end for connecting to an external feeding system; a second conveyor belt disposed in a pressing chamber, the rear end of which is provided with a second telescopic end and the front end of which is provided with a third telescopic end for connecting to the first conveyor belt; and a third conveyor belt disposed in a buffer chamber, the third telescopic end of which is provided to connect to the third conveyor belt and the front end of which is provided with a fourth telescopic end for connecting to an external feeding system.

[0009] According to some embodiments of the present invention, multiple first conveyor belts, second conveyor belts and third conveyor belts are provided. Multiple first conveyor belts are arranged parallel to each other and spaced apart. Multiple second conveyor belts are arranged parallel to each other and spaced apart. Multiple third conveyor belts are arranged parallel to each other and spaced apart. The second conveyor belts and the first conveyor belts are staggered in the left-right direction so that the second telescopic end passes through the gap between adjacent first conveyor belts. The second conveyor belts and the third conveyor belts are staggered in the left-right direction so that the third telescopic end passes through the gap between adjacent third conveyor belts.

[0010] According to some embodiments of the present invention, the second conveyor belt includes a first conveying unit and a second conveying unit, both of which extend in a front-rear direction. A second telescopic end is disposed at one end of the first conveying unit near the first conveyor belt. The second conveying unit is located at one end of the first conveying unit near the third conveyor belt. A third telescopic end is disposed at one end of the second conveying unit near the third conveyor belt.

[0011] According to some embodiments of the present invention, a storage mechanism is also included, which is disposed within the chamber and is used to stack multiple groups of materials sequentially in a vertical direction.

[0012] According to some embodiments of the present invention, the storage mechanism includes: a first storage component, which is vertically and flexibly disposed in a preheating chamber and located on one side of a first conveyor belt, and is used to lift material on the first conveyor belt to a preset height or to lower material at a preset height onto the first conveyor belt; a second storage component, which is vertically and flexibly disposed in a pressing chamber and located on one side of a second conveyor belt, and is used to lift material on the second conveyor belt to a preset height or to lower material at a preset height onto the second conveyor belt; and a third storage component, which is vertically and flexibly disposed in a buffer chamber and located on one side of a third conveyor belt, and is used to lift material on the third conveyor belt to a preset height or to lower material at a preset height onto the third conveyor belt.

[0013] According to some embodiments of the present invention, a first receiving assembly includes two parallel first pallets, which are synchronously raised and lowered on opposite sides of a first conveyor belt. Each first pallet is correspondingly provided with a first correction plate, which is connected to the corresponding first pallet via an elastic reset member. The first correction plate is rotatably connected above the corresponding first pallet, and the two first correction plates are inclined towards each other to form a guide channel. The first correction plates are used to correct the positional deviation of the material. A second receiving assembly includes two parallel second pallets, which are synchronously raised and lowered on opposite sides of a second conveyor belt. Each second pallet is correspondingly provided with a second correction plate. The second correction plate is connected to the corresponding second pallet via an elastic reset member. The second correction plate is rotatably connected above the corresponding second pallet. The two second correction plates are inclined towards each other to form a guide channel. The second correction plate is used to correct the positional deviation of the material. The third receiving component includes two parallel third pallets. The two third pallets are synchronously raised and lowered on opposite sides of the third conveyor belt. Each third pallet is equipped with a corresponding third correction plate. The third correction plate is connected to the corresponding third pallet via an elastic reset member. The third correction plate is rotatably connected above the corresponding third pallet. The two third correction plates are inclined towards each other to form a guide channel. The third correction plate is used to correct the positional deviation of the material.

[0014] According to some embodiments of the present invention, a first anti-slip layer is provided on the top of the first pallet, a second anti-slip layer is provided on the top of the second pallet, and a third anti-slip layer is provided on the top of the third pallet. The first, second, and third anti-slip layers are used to prevent the material from shifting during the lifting process.

[0015] According to a second aspect of the present invention, the embedded embedded core circuit board multi-compartment vacuum lamination method employs the embedded embedded core circuit board multi-compartment vacuum lamination equipment described in the first aspect of the present invention, and the equipment further includes:

[0016] The drive mechanism is installed on the cabin body and is connected to the feed hopper door, the discharge hopper door, the first airtight door and the second airtight door respectively.

[0017] The control mechanism is electrically connected to the heating mechanism, vacuuming mechanism, transfer mechanism, and drive mechanism.

[0018] The methods include:

[0019] Obtain the PCB board type parameters and lamination process parameters based on the configuration interface;

[0020] Based on the pressing process parameters, the first heating unit controls the preheating chamber to heat up to the first target temperature, the second heating unit controls the pressing chamber to heat up to the second target temperature, and the second vacuuming unit controls the pressing chamber to reach the target vacuum level.

[0021] When the preheating chamber reaches the first target temperature, the drive mechanism opens the feeding chamber door, the transfer mechanism transfers the PCB board to the first preset station in the preheating chamber and then closes the feeding chamber door, and the first vacuum unit controls the preheating chamber to reach the target vacuum level.

[0022] Once the preheating chamber reaches the target vacuum level, the drive mechanism opens the first airtight door, and the transfer mechanism moves the PCB board to the second preset station in the pressing chamber and then closes the first airtight door.

[0023] The third vacuum unit controls the buffer chamber to reach the target vacuum level, the drive mechanism opens the second airtight door, and the transfer mechanism transfers the PCB board to the third preset station in the buffer chamber and then closes the second airtight door.

[0024] The third vacuum unit controls the buffer chamber to return to normal pressure, the drive mechanism opens the discharge chamber door, and the transfer mechanism outputs the PCB board that has been pressed and then closes the discharge chamber door.

[0025] It has at least the following beneficial effects: This embedded core circuit board multi-compartment vacuum pressing method has all the beneficial effects brought by the above-mentioned embedded core circuit board multi-compartment vacuum pressing equipment, which will not be repeated here.

[0026] According to some embodiments of the present invention, after closing the first airtight door, the preheating chamber is simultaneously controlled to return to normal pressure, the feeding chamber door is opened, and the next PCB board is sent into the preheating chamber.

[0027] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0028] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0029] Figure 1 This is a schematic diagram of the structure of the multi-compartment vacuum lamination equipment for embedded core circuit boards in this specific embodiment;

[0030] Figure 2 for Figure 1 Cross-sectional schematic diagram;

[0031] Figure 3 for Figure 1 Schematic diagram of the feeding structure of the preheating silo;

[0032] Figure 4 for Figure 1 A schematic diagram of the PCB board being transported from the preheating chamber to the lamination chamber;

[0033] Figure 5 for Figure 3 Top view;

[0034] Figure 6 for Figure 4 Top view;

[0035] Figure 7 for Figure 2 Structural diagram of the central storage and transfer mechanism;

[0036] Figure 8 for Figure 7 A schematic diagram of the structure of the first support plate and the first correction plate;

[0037] Figure 9 This is a flowchart illustrating the multi-compartment vacuum lamination method for embedded core circuit boards in this specific embodiment.

[0038] Figure label:

[0039] 100 chamber, 110 preheating chamber, 111 feed chamber door, 120 pressing chamber, 121 first airtight door, 122 second airtight door, 130 buffer chamber, 131 discharge chamber door;

[0040] The transfer mechanism 200 includes a first conveyor belt 210, a first telescopic end 211, a second conveyor belt 220, a first conveying unit 221, a second telescopic end 2211, a second conveying unit 222, a third telescopic end 2221, a third conveyor belt 230, a fourth telescopic end 231, a fourth conveyor belt 240, a fifth conveyor belt 250, and a sixth conveyor belt 260.

[0041] Storage mechanism 300, first storage component 310, first tray 311, first correction plate 312, second storage component 320, second tray 321, third storage component 330, third tray 331, first circulating conveyor 340, second circulating conveyor 350, third circulating conveyor 360.

[0042] PCB board 10, external feeding system 20. Detailed Implementation

[0043] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, left, right, front, back, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0044] In the description of this invention, "several" means one or more, "multiple" means two or more, "greater than," "less than," "exceeding," etc. are understood to exclude the stated number, and "above," "below," "within," etc. are understood to include the stated number. If "first," "second," etc. are used in the description, they are only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance or implicitly indicating the number of indicated technical features or the order of the indicated technical features.

[0045] In the description of this invention, unless otherwise explicitly defined, terms such as "set", "install", and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0046] Please refer to Figure 1 and Figure 2 This embodiment discloses a multi-compartment vacuum pressing device for embedded core circuit boards, including a chamber 100, a heating mechanism, a vacuuming mechanism, and a transfer mechanism 200. The chamber 100 is sequentially divided into a preheating chamber 110, a pressing chamber 120, and a buffer chamber 130 along the material conveying direction. The preheating chamber 110 is provided with a feeding chamber door 111, the buffer chamber 130 is provided with a discharging chamber door 131, a first airtight door 121 is provided between the preheating chamber 110 and the pressing chamber 120, and a second airtight door 122 is provided between the pressing chamber 120 and the buffer chamber 130. A heating mechanism is installed on the chamber 100, including a first heating unit installed on the preheating chamber 110, a second heating unit installed on the pressing chamber 120, and a third heating unit installed on the buffer chamber 130. The first and second heating units are configured to perform gradient temperature control on the preheating chamber 110 and the pressing chamber 120, so that the temperatures of the preheating chamber 110 and the pressing chamber 120 increase sequentially. A vacuuming mechanism is installed on the chamber 100, including a first vacuuming unit installed on the preheating chamber 110, a second vacuuming unit installed on the pressing chamber 120, and a third vacuuming unit installed on the buffer chamber 130. When the first airtight door 121 is open, the preheating chamber 110 and the pressing chamber 120 are connected and isolated from the outside of the chamber 100. When the second airtight door 122 is open, the pressing chamber 120 and the buffer chamber 130 are connected and isolated from the outside of the chamber 100. A transfer mechanism 200 is installed on the chamber 100 and is used to transfer materials inside the chamber 100.

[0047] like Figure 2As shown, the interior of the chamber 100 is sequentially divided into a preheating chamber 110, a pressing chamber 120, and a buffer chamber 130 along the material conveying direction. The preheating chamber 110 and the pressing chamber 120 are separated by a first airtight door 121, and the pressing chamber 120 and the buffer chamber 130 are separated by a second airtight door 122. The preheating chamber 110 is located at the feeding end and is equipped with a feeding chamber door 111, while the buffer chamber 130 is located at the discharging end and is equipped with a discharging chamber door 131. The heating mechanism includes a first heating unit, a second heating unit, and a third heating unit. The first heating unit is connected to the preheating chamber 110, the second heating unit is connected to the pressing chamber 120, and the third heating unit is connected to the buffer chamber 130. The vacuuming mechanism includes a first vacuuming unit, a second vacuuming unit, and a third vacuuming unit. The first vacuuming unit is connected to the preheating chamber 110, the second vacuuming unit is connected to the pressing chamber 120, and the third vacuuming unit is connected to the buffer chamber 130. Therefore, the preheating chamber 110, the pressing chamber 120, and the buffer chamber 130 all have independent temperature control and vacuum regulation capabilities. Each chamber can be set and maintained with specific temperature and vacuum environments at different process stages. The transfer mechanism 200 is installed in the chamber 100 and is used to achieve precise positioning and transfer of materials.

[0048] Based on the configuration interface, the board type parameters and lamination process parameters of the PCB board 10 with embedded chips are obtained. Based on the lamination process parameters, the first heating unit controls the preheating chamber 110 to heat up to the first target temperature, the second heating unit controls the lamination chamber 120 to heat up to the second target temperature, and the second vacuuming unit controls the lamination chamber 120 to reach the target vacuum level. When the preheating chamber 110 reaches the first target temperature, the drive mechanism opens the feeding chamber door 111, the transfer mechanism 200 transfers the PCB board 10 to the first preset station in the preheating chamber 110 and then closes the feeding chamber door 111. The first vacuuming unit controls the preheating chamber 110 to reach the target vacuum level. When the preheating chamber 110 reaches the target vacuum level, the drive mechanism opens the first airtight door 121, the transfer mechanism 200 transfers the PCB board 10 to the second preset station in the lamination chamber 120 and then closes the first airtight door 121. The third vacuum unit controls the buffer chamber 130 to reach the target vacuum level, the drive mechanism opens the second airtight door 122, and the transfer mechanism 200 transfers the PCB board 10 to the third preset station in the buffer chamber 130 and then closes the second airtight door 122. The third vacuum unit controls the buffer chamber 130 to return to normal pressure, the drive mechanism opens the discharge chamber door 131, and the transfer mechanism 200 outputs the pressed PCB board 10 and then closes the discharge chamber door 131.

[0049] It should be noted that each chamber is independent of the others, and the temperature and vacuum environment can be matched to the requirements of different process stages. In the preheating chamber 110, the PCB board 10 is fully softened by the resin under the vacuum environment of the preheating temperature, and internal gases are expelled. In the lamination chamber 120, the preheated resin can flow evenly and completely fill the gaps between the chips. The gradient temperature rise between the preheating chamber 110 and the lamination chamber 120 ensures that the prepreg resin reaches the optimal flow state. The vacuum environment of the preheating chamber 110 and the lamination chamber 120 effectively suppresses the formation of bubbles and microvoids, while the gradient cooling of the buffer chamber 130 avoids quality defects caused by temperature fluctuations or pressure changes during the resin curing process, thereby improving the reliability and consistency of the product. On the other hand, each process stage is carried out synchronously in an independent chamber. While ensuring an uninterrupted vacuum environment, the lamination process is run continuously without interruption, making the production rhythm more compact and conducive to improving production efficiency and reducing production cycle.

[0050] It should be noted that if a sliding rail mechanism that runs through adjacent compartments is used to transport the PCB board 10, complex through-sections need to be created between the compartments to accommodate the guide rails and transmission components. This through-structure will compromise the integrity of the compartment walls, resulting in discontinuous areas at the sealing interface. Since the vacuum pressing process requires extremely high airtightness of the compartments, the presence of these through-sections will create micro-leakage channels during the vacuuming process. For example, thermal deformation can lead to aging of the sealing strips or expansion of structural gaps. Even with compensating measures such as sealing strips, there is still a risk of sealing failure due to material thermal deformation under high-temperature pressing conditions. Long-term use will further deteriorate the sealing performance, thus affecting the lamination quality of the PCB board 10 and causing defects such as delamination and bubbles in the product.

[0051] In some specific embodiments of the present invention, the transfer mechanism 200 includes a first conveyor belt 210, a second conveyor belt 220, and a third conveyor belt 230. The first conveyor belt 210 is disposed in a preheating chamber 110 and is provided with a first telescopic end 211, which is used to connect with an external feeding system 20. The second conveyor belt 220 is disposed in a pressing chamber 120 and is provided with a second telescopic end 2211 and a third telescopic end 2221, which are used to connect with the first conveyor belt 210 and the third telescopic end 2221, which are used to connect with the third conveyor belt 230. The third conveyor belt 230 is disposed in a buffer chamber 130 and is provided with a fourth telescopic end 231 at its front end, which is used to connect with the third conveyor belt 230 and the fourth telescopic end 231, which are used to connect with the external feeding system 20.

[0052] like Figure 1 , Figure 3 and Figure 5As shown, a first conveyor belt 210 is installed inside the preheating chamber 110. The first conveyor belt 210 can extend outward through the first telescopic end 211 and connect with the external feeding system 20; for example... Figure 2 , Figure 4 and Figure 6 As shown, a second conveyor belt 220 is provided inside the pressing chamber 120. The second conveyor belt 220 has a bidirectional telescopic function, and it can connect with the preheating chamber 110 through the second telescopic end 2211 and with the buffer chamber 130 through the third telescopic end 2221. A third conveyor belt 230 is provided inside the buffer chamber 130, and it can extend outward through the fourth telescopic end 231 and connect with the external feeding system 20. According to the technical solution of the present invention, in order to meet the needs of precise control of different process stages, the sealed box is provided with three independently controllable chambers. The sealed box adopts a fully built-in transfer mechanism 200 to replace the traditional slide rail mechanism that penetrates the chamber wall. Seamless transport of PCB board 10 is achieved through the telescopic conveyor belt. Since there is no transfer component that penetrates two adjacent chambers, the risk of sealing failure caused by thermal deformation of traditional slide rails is avoided under high temperature pressing conditions. While maintaining efficient continuous production, a more stable vacuum environment is maintained, which is conducive to improving equipment utilization and production efficiency.

[0053] It is worth noting that the sealed chamber uses a fully built-in retractable conveyor belt instead of the traditional sliding rail mechanism that runs through the chamber wall. When the first airtight door 121 changes from the closed state to the open state, the second conveyor belt 220 extends from the pressing chamber 120 to the preheating chamber 110 through the second telescopic end 2211. When the second airtight door 122 changes from the closed state to the open state, the second conveyor belt 220 extends from the pressing chamber 120 to the buffer chamber 130 through the third telescopic end 2221. The PCB board 10 can be transferred without any through holes in the chamber isolation wall. When the first airtight door 121 or the second airtight door 122 changes from the open state to the closed state, the second telescopic end 2211 of the second conveyor belt 220 is in the retracted state, and the third telescopic end 2221 of the second conveyor belt 220 is in the retracted state. At this time, each chamber returns to an independent sealed space, ensuring the integrity of the vacuum environment.

[0054] It should be noted that the external feeding system 20 includes a feeding conveyor belt, the end of which forms a dockable material transfer interface with the feed end of the first conveyor belt 210, and the discharge end of the third conveyor belt 230 forms a continuous conveying path with the feeding conveyor belt connected to the downstream equipment.

[0055] In some specific embodiments of the present invention, multiple first conveyor belts 210, second conveyor belts 220 and third conveyor belts 230 are provided. Multiple first conveyor belts 210 are arranged parallel to each other and spaced apart. Multiple second conveyor belts 220 are arranged parallel to each other and spaced apart. Multiple third conveyor belts 230 are arranged parallel to each other and spaced apart. The second conveyor belts 220 and the first conveyor belts 210 are arranged alternately in the left-right direction so that the second telescopic end 2211 passes through the gap between adjacent first conveyor belts 210. The second conveyor belts 220 and the third conveyor belts 230 are arranged alternately in the left-right direction so that the third telescopic end 2221 passes through the gap between adjacent third conveyor belts 230.

[0056] like Figure 2 As shown, multiple first conveyor belts 210 are arranged in the preheating chamber 110 along the left-right direction, multiple second conveyor belts 220 are arranged in the pressing chamber 120 along the left-right direction, and multiple third conveyor belts 230 are arranged in the buffer chamber 130 along the left-right direction. There is a gap between two adjacent first conveyor belts 210 that can accommodate the passage of a second conveyor belt 220, and there is a gap between two adjacent third conveyor belts 230 that can accommodate the passage of a second conveyor belt 220. It should be noted that when the transfer mechanism 200 transfers material from the preheating chamber 110 to the pressing chamber 120, or from the pressing chamber 120 to the buffer chamber 130, if the conveyor belts between adjacent chambers are perfectly aligned, there is a risk that the material may shift, jam, or even fall during the transfer process due to mechanical positioning errors or thermal deformation. Therefore, the multiple first conveyor belts 210 arranged in parallel in the preheating chamber 110 and the corresponding second conveyor belts 220 in the pressing chamber 120 form a complementary conveying structure, and the multiple third conveyor belts 230 arranged in parallel in the buffer chamber 130 and the corresponding second conveyor belts 220 in the pressing chamber 120 form a complementary conveying structure. When the conveying operation is performed, the conveyor belts of adjacent chambers achieve staggered interlocking docking by controlling the corresponding telescopic ends, thereby forming a continuous transmission channel.

[0057] Specifically, the second conveyor belt 220 employs a staggered arrangement with its second telescopic end 2211 and the first conveyor belt 210 to ensure sufficient support for the PCB board 10 during transfer between the preheating chamber 110 and the pressing chamber 120. Similarly, the staggered arrangement of the second conveyor belt 220 with its third telescopic end 2221 and the third conveyor belt 230 also ensures stable transmission of the PCB board 10 during the output stage. It should be noted that all conveyor belts are fully retracted into their respective chambers when not in operation, and closing the corresponding passage doors maintains an independent sealed environment for each chamber.

[0058] In some specific embodiments of the present invention, the second conveyor belt 220 includes a first conveying unit 221 and a second conveying unit 222. Both the first conveying unit 221 and the second conveying unit 222 extend in the front-back direction. A second telescopic end 2211 is disposed at one end of the first conveying unit 221 near the first conveyor belt 210. The second conveying unit 222 is located at one end of the first conveying unit 221 near the third conveyor belt 230. The third telescopic end 2221 is disposed at one end of the second conveying unit 222 near the third conveyor belt 230.

[0059] like Figure 4 and Figure 6 As shown, the first conveying unit 221 is located at the front of the pressing chamber 120, and the second conveying unit 222 is located at the rear of the pressing chamber 120, both on the same straight line. The rear end of the first conveying unit 221 is a retractable second telescopic end 2211, which extends rearward to seamlessly connect with the first conveyor belt 210 when conveying is required. The front end of the second conveying unit 222 is a retractable third telescopic end 2221, which extends forward to connect with the third conveyor belt 230. It should be noted that the first conveying unit 221 and the second conveying unit 222 are controlled by independent drive systems, and their operating directions are synchronized. Specifically, when conveying from the preheating chamber 110 to the pressing chamber 120, the second telescopic end 2211 of the first conveying unit 221 extends to seamlessly connect with the first conveyor belt 210. After the first conveyor belt 210 and the first conveying unit 221 work together to convey the PCB board 10 to the second preset position on the first conveying unit 221 and the second conveying unit 222, the first conveying unit 221 and the second conveying unit 222 stop conveying. When conveying from the pressing chamber 120 to the buffer chamber 130, the third telescopic end 2221 of the second conveying unit 222 extends to form a continuous conveying path with the third conveyor belt 230. The conveying process is the same as the conveying process between the preheating chamber 110 and the pressing chamber 120, and will not be described further here.

[0060] It is worth noting that the first conveying unit 221 is specifically responsible for conveying the PCB board 10 in the preheating chamber 110 to the high-temperature zone of the pressing chamber 120, while the second conveying unit 222 is specifically responsible for transferring the pressed PCB board 10 to the low-temperature zone of the buffer chamber 130. This partitioned conveying design allows each conveyor belt assembly to bear the heat load of only two temperature zones, thereby significantly reducing the risk of thermal deformation.

[0061] Specifically, the first conveyor belt 210 includes a fixed base, a drive shaft, a first shaft, a second shaft, a third shaft, a fourth shaft, a belt, a cylinder, and a limiting frame. The first and second shafts are vertically fixed to the fixed base, with the first shaft directly above the second shaft. The third shaft and the drive shaft are horizontally arranged on the same side as the first and second shafts, with the third shaft horizontally aligned with the first shaft and the drive shaft horizontally aligned with the second shaft. The fourth shaft is slidably connected to the limiting groove of the fixed base via the limiting frame and is driven by the cylinder to move in a direction perpendicular to the axial direction. The belt is sequentially wound around the first, second, third, fourth, and drive shafts, forming a closed loop. When the cylinder extends, it pushes the fourth shaft outward, extending the belt path and stretching the first conveyor belt 210; when the cylinder retracts, the fourth shaft returns to its original position inward, tightening the belt and shortening the first conveyor belt 210. It should be noted that the drive shaft is driven by a motor, causing the belt to circulate and transport materials, while the limiting groove constrains the movement trajectory of the fourth shaft, ensuring stable belt operation. The structures of the first conveying unit 221, the second conveying unit 222, and the third conveyor belt 230 are the same as those of the first conveyor belt 210, and will not be described again here.

[0062] In some specific embodiments of the present invention, a storage mechanism 300 is also included. The storage mechanism 300 is disposed within the chamber 100 and is used to stack multiple sets of materials sequentially in a vertical direction. Specifically, the storage mechanism 300 is used to stack multiple sets of PCB boards 10 in a vertical direction within the preheating chamber 110, the pressing chamber 120, and the buffer chamber 130, thereby achieving simultaneous processing of multiple layers of materials. Through this three-dimensional layout, the equipment can simultaneously complete the preheating, pressing, and cooling processes of multiple PCB boards 10 in a single process cycle, thereby increasing the production capacity per unit time.

[0063] In some specific embodiments of the present invention, the storage mechanism 300 includes: a first storage component 310, a second storage component 320, and a third storage component 330. The first storage component 310 is vertically and flexibly disposed within the preheating chamber 110, and is located on one side of the first conveyor belt 210. The first storage component 310 is used to lift materials on the first conveyor belt 210 to a preset height or to lower materials at a preset height onto the first conveyor belt 210. The second storage component 320 is vertically and flexibly disposed within the pressing chamber 12. Within the buffer chamber 130, the second storage component 320 is located on one side of the second conveyor belt 220. The second storage component 320 is used to lift the material on the second conveyor belt 220 to a preset height or to lower the material at the preset height onto the second conveyor belt 220. The third storage component 330 is vertically and vertically disposed within the buffer chamber 130. The third storage component 330 is located on one side of the third conveyor belt 230. The third storage component 330 is used to lift the material on the third conveyor belt 230 to a preset height or to lower the material at the preset height onto the third conveyor belt 230.

[0064] like Figure 7 As shown, a first storage component 310 is provided in the preheating chamber 110, a second storage component 320 is provided in the pressing chamber 120, and a third storage component 330 is provided in the buffer chamber 130. The first storage component 310, the second storage component 320, and the third storage component 330 can all be raised and lowered on the inner wall of the chamber 100. The first storage component 310 is located on one side of the first conveyor belt 210, and its lifting trajectory runs through the first conveyor belt 210 vertically. That is, under a certain working condition, the first storage component 310 will rise from below the first conveyor belt 210 to above the first conveyor belt 210.

[0065] It should be noted that the first conveyor belt 210 located inside the preheating chamber 110 is equipped with a first storage component 310, the second conveyor belt 220 located inside the pressing chamber 120 is equipped with a second storage component 320, and the third conveyor belt 230 located inside the buffer chamber 130 is equipped with a third storage component 330. The storage components in each chamber control the handover process of the PCB board 10 through lifting control. Specifically, as shown... Figure 4 and Figure 6 As shown, when the PCB board 10 needs to be transported from the preheating chamber 110 to the pressing chamber 120, the second telescopic end 2211 of the second conveyor belt 220 extends into the preheating chamber 110 and docks with the first conveyor belt 210. The first storage component 310 descends and places the PCB board 10 on the first conveyor belt 210. The first conveyor belt 210 and the second conveyor belt 220 work together to transport the PCB board 10 from the preheating chamber 110 to the pressing chamber 120. The corresponding second storage component 320 in the pressing chamber 120 rises and lifts the PCB board 10 to stack and store it in the vertical direction. After the transport is completed, the second telescopic end 2211 is completely retracted. Similarly, when the PCB board 10 needs to be transported from the pressing chamber 120 to the buffer chamber 130, the third telescopic end 2221 of the second conveyor belt 220 extends into the buffer chamber 130 and docks with the third conveyor belt 230. The second storage component 320 descends to place the PCB board 10 on the second conveyor belt 220. The second conveyor belt 220 and the third conveyor belt 230 work together to transport the PCB board 10 from the pressing chamber 120 to the buffer chamber 130. The corresponding third storage component 330 in the buffer chamber 130 rises and lifts the PCB board 10 to stack and store it vertically. After the transport is completed, the third telescopic end 2221 is completely retracted. Throughout the process, all conveyor belts perform the transport process between adjacent chambers without disrupting the sealing continuity of the chamber walls.

[0066] In some specific embodiments of the present invention, the first storage component 310 includes two parallel first trays 311, which are synchronously raised and lowered on opposite sides of the first conveyor belt 210. Each first tray 311 is correspondingly provided with a first correction plate 312. The first correction plate 312 is connected to the corresponding first tray 311 through an elastic reset member and is rotatably connected above the corresponding first tray 311. The two first correction plates 312 are inclined towards each other to form a guide channel. The first correction plate 312 is used to correct the positional deviation of the material. The second storage component 320 includes two parallel second trays 321, which are synchronously raised and lowered on opposite sides of the second conveyor belt 220. Each second tray 321 Each of the three conveyor belts 230 has a corresponding second correction plate. The second correction plate is connected to the corresponding second support plate 321 through an elastic reset member. The second correction plate is rotatably connected above the corresponding second support plate 321. The two second correction plates are inclined towards each other to form a guide channel. The second correction plate is used to correct the positional deviation of the material. The third storage component 330 includes two parallel third support plates 331. The two third support plates 331 are synchronously raised and lowered on opposite sides of the third conveyor belt 230. Each third support plate 331 has a corresponding third correction plate. The third correction plate is connected to the corresponding third support plate 331 through an elastic reset member. The third correction plate is rotatably connected above the corresponding third support plate 331. The two third correction plates are inclined towards each other to form a guide channel. The third correction plate is used to correct the positional deviation of the material.

[0067] like Figure 7 and Figure 8 As shown, Figure 8 for Figure 7 The schematic diagram of the first support plate and the first correction plate shows that... Figure 7The structural diagram can also represent the structure of the second support plate and the second correction plate, and the third support plate and the third correction plate. In some specific embodiments of the present invention, two first circulating transmission components are provided in the preheating chamber 110. The two first circulating transmission components are vertically arranged and opposite to each other. Multiple first support plates 311 are provided on the first circulating transmission components. The multiple first support plates 311 are equidistantly arranged in the vertical direction. A first correction plate 312 is provided between each two vertically adjacent first support plates 311. Two horizontally adjacent first correction plates 312 form a guide channel with an upper flared opening. Two horizontally adjacent first support plates 311 form a support platform for lifting the PCB board 10. The first circulating transmission components are used to drive the first storage component 310 to rise and fall. Two second circulating transmission components are provided in the pressing chamber 120. The two second circulating transmission components are vertically arranged and opposite to each other. Multiple second support plates 321 are provided on the second circulating transmission components. The multiple second support plates 321 are equidistantly arranged in the vertical direction. A second alignment plate is provided between each two adjacent second support plates 321. The two horizontally adjacent second alignment plates form a guide channel with an upper flared opening. The two horizontally adjacent second support plates 321 form a support platform for lifting the PCB board 10. The second circulation transmission component is used to drive the second storage component 320 to rise and fall. Two third circulation transmission components are provided in the buffer compartment 130. The two third circulation transmission components are vertically arranged and opposite to each other. Multiple third support plates 331 are provided on the third circulation transmission components. The multiple third support plates 331 are equidistantly arranged in the vertical direction. A third alignment plate is provided between each two vertically adjacent third support plates 331. The two horizontally adjacent third alignment plates form a guide channel with an upper flared opening. The two horizontally adjacent third support plates 331 form a support platform for lifting the PCB board 10. The third circulation transmission component is used to drive the third storage component 330 to rise and fall. According to the technical solution of the present invention, taking the preheating chamber 110 as an example, when the PCB board 10 is fed into the preheating chamber 110 by the first conveyor belt 210, the first pallet 311 located below the first conveyor belt 210 rises to a preset height and completes the receiving of the PCB board 10. Before contacting the first pallet 311, the PCB board 10 will first contact the first correction plate 312. Under the guidance of the first correction plate 312, the PCB board 10 is corrected in direction to ensure smooth subsequent placement.

[0068] When the PCB board 10 enters the preheating chamber 110 via the first conveyor belt 210, the first pallet 311 rises from its initial position to a preset height, ready to receive the PCB board 10. Before the PCB board 10 contacts the first pallet 311, its edge first contacts the first alignment plate 312 positioned at the receiving position. When the PCB board 10 contacts the first alignment plate 312, it automatically adjusts its position under friction and guiding action to eliminate the offset error generated during the conveying process, ensuring that the PCB board 10 is accurately aligned with the predetermined position. After the alignment is completed, as the first pallet 311 continues to rise, the PCB board 10 completely detaches from the first conveyor belt 210, and the precisely aligned PCB board 10 smoothly falls onto the first pallet 311. The pressing chamber 120 and the buffer chamber 130 are set up in the same way as the preheating chamber 110, and will not be described further here.

[0069] It should be noted that, as Figure 7 As shown, the first, second, and third circulating transmission components can employ a synchronous belt drive system. Specifically, taking the preheating chamber 110 as an example, a pair of synchronous belt drive mechanisms are vertically mounted on the inner wall of the sealed chamber along the left-right direction inside the preheating chamber 110. The synchronous belt drive mechanism includes synchronous pulleys respectively mounted on the top and bottom of the preheating chamber 110, a synchronous belt that runs in a closed loop around the pulleys, and a servo motor that drives one of the pulleys to rotate. On the outer surface of the synchronous belt, multiple first support plates 311 are fixedly installed at equal intervals along the length direction. The spacing between adjacent first support plates 311 is set according to the thickness of the PCB board 10 and the process requirements. It should be noted that in the two sets of synchronous belt drive mechanisms, the rotation directions of the synchronous belts are arranged in opposite directions. Therefore, the first support plates 311 on the two sets of synchronous belts correspond one-to-one in the horizontal direction, forming a first storage assembly 310 for supporting the PCB board 10. The arrangement of the corresponding circulating transmission components in the pressing chamber 120 and the buffer chamber 130 is the same as that in the preheating chamber 110, and will not be described further here. When the PCB board 10 is fed into the preheating chamber 110 by the first conveyor belt 210, the control system controls the servo motor to drive the two synchronous belts to run synchronously, so that the first storage component 310 rises to its top and contacts the bottom of the PCB board 10, and smoothly lifts the PCB board 10 off the surface of the first conveyor belt 210, while ensuring that the PCB board 10 remains horizontal. This cycle is repeated to achieve the stacking of PCB boards 10 layer by layer. When the PCB board 10 needs to be transferred, the servo motor drives the synchronous belt to run in the opposite direction, so that the first storage component 310 descends to a position lower than the first conveyor belt 210, and the corresponding PCB board 10 is placed down onto the surface of the first conveyor belt 210. This cycle is repeated to achieve the output of PCB boards 10 one by one.

[0070] In some specific embodiments of the present invention, the transfer mechanism 200 further includes a fourth conveyor belt 240, a fifth conveyor belt 250, and a sixth conveyor belt 260. The fourth conveyor belt 240 is disposed in the preheating chamber 110 and is arranged parallel to one side of the first conveyor belt 210. The fifth conveyor belt 250 is disposed in the pressing chamber 120 and is arranged parallel to one side of the second conveyor belt 220. The sixth conveyor belt 260 is disposed in the buffer chamber 130 and is arranged parallel to one side of the third conveyor belt 230. The fourth conveyor belt 240, the fifth conveyor belt 250, and the sixth conveyor belt 260 are all used to support and assist in the transport of the PCB board 10.

[0071] like Figure 2 As shown, a fourth conveyor belt 240 is arranged parallel to the side of the first conveyor belt 210, a fifth conveyor belt 250 is arranged parallel to the side of the second conveyor belt 220, and a sixth conveyor belt 260 is arranged parallel to the side of the third conveyor belt 230. In some specific embodiments of the present invention, there are two fourth conveyor belts 240, with the first conveyor belt 210 positioned between the two fourth conveyor belts 240. The fifth and sixth conveyor belts 250 are arranged in the same manner as the fourth conveyor belt 240, and will not be further elaborated here. It should be noted that, taking the fourth conveyor belt 240 as an example, the fourth conveyor belt 240 serves as an auxiliary conveying structure for the first conveyor belt 210, and it operates synchronously with the first conveyor belt 210. That is, when the PCB board 10 is conveyed from the preheating chamber 110 to the pressing chamber 120, the first conveyor belt 210 and the fourth conveyor belt 240 start simultaneously, forming a composite support surface adapted to the width of the PCB board 10, thereby improving the stability of PCB boards 10 of different specifications during the transmission process.

[0072] In some specific embodiments of the present invention, a temporary storage mechanism is also included. The output end of the temporary storage mechanism is connected to the input end of the preheating chamber 110. The temporary storage mechanism includes a frame, two fourth circulation transmission components disposed on the frame, and a temporary storage conveyor disposed horizontally below the two fourth circulation transmission components. The two fourth circulation transmission components are vertically arranged and arranged opposite to each other. Multiple fourth trays are disposed on the fourth circulation transmission components. The multiple fourth trays are equidistantly arranged in the vertical direction. Two horizontally adjacent fourth trays form a fourth storage platform for supporting the PCB board 10.

[0073] It should be noted that if the upstream production line continuously conveys the PCB board 10 at a high rate, while the pressing equipment presses the PCB board 10 at a longer cycle, the speed mismatch between the two will lead to a serious lag in processing speed, resulting in the accumulation and congestion of the PCB board 10 at the entrance of the preheating chamber 110, reducing the overall equipment utilization rate. Therefore, based on this working condition, a temporary storage mechanism is provided at the input end of the preheating chamber 110. Specifically, the temporary storage conveyor consists of multiple parallel temporary storage conveyor belts, with a gap between adjacent temporary storage conveyor belts that can accommodate the passage of the first conveyor belt 210. That is, the multiple temporary storage conveyor belts and the first conveyor belt 210 form an interlocking conveying structure. When the temporarily stored PCB board 10 is input into the preheating chamber 110, the first conveyor belt 210 of the preheating chamber 110 extends outward by controlling the first telescopic end 211 to dock with the temporary storage conveyor belt, thereby forming a continuous transmission channel.

[0074] It should be noted that the fourth circulating transmission component adopts a synchronous belt transmission mechanism. Specifically, the synchronous belt transmission mechanism includes synchronous pulleys respectively installed at the top and bottom of the frame, a synchronous belt that runs in a closed loop around the pulleys, and a servo motor that drives one of the pulleys to rotate. On the outer surface of the synchronous belt, multiple fourth support plates are fixedly installed at equal intervals along the length direction. The fourth support plates on the two sets of synchronous belt transmission mechanisms correspond one-to-one in the horizontal direction, forming a fourth storage platform for supporting the PCB board 10. When the PCB board 10 is output from the upstream process, the control system activates the synchronous belt transmission mechanism, drives the synchronous belt to run through the servo motor, causing the fourth support plate to rise to its top and contact the bottom of the PCB board 10, and smoothly lift the PCB board 10 off the surface of the temporary storage conveyor belt. This cycle is repeated to stack the PCB board 10 layer by layer in the vertical direction, achieving the function of buffering the PCB board 10. When the PCB board 10 in the pressing chamber 120 completes the pressing process, the PCB board 10 in the preheating chamber 110 is transferred to the pressing chamber 120. At this time, the PCB board 10 temporarily stored on the temporary storage mechanism is ready to be transferred to the preheating chamber 110. When the preheating chamber 110 is depressurized and the chamber door is opened, the servo motor drives the synchronous belt to run, so that the fourth pallet is lowered to a position lower than the temporary storage conveyor belt, so that the PCB board 10 is smoothly placed on the surface of the temporary storage conveyor belt. This cycle is repeated to output the PCB board 10 one by one to the preheating chamber 110.

[0075] In addition, multiple temporary storage mechanisms can be set up, and the multiple temporary storage mechanisms are arranged sequentially along the conveying direction of the external feeding system 20. Thus, the PCB boards 10 output from the upstream production line can be dynamically allocated to the optimal temporary storage mechanism according to the real-time working conditions. That is, when the pressing process cycle is delayed, the temporary storage mechanism collects the excess boards output from the upstream production line. After the pressing chamber 120 is ready, the PCB boards 10 in the temporary storage mechanism are called in sequence for subsequent processing.

[0076] It is worth noting that after the upstream process inputs the PCB board 10 into the temporary storage mechanism in a forward sequence, the temporary storage mechanism and the preheating chamber 110 are conveyed in a reverse sequence. The preheating chamber 110 and the pressing chamber 120 are then conveyed in a forward sequence. The pressing chamber 120 and the buffer chamber 130 are conveyed in a reverse sequence again. Finally, the buffer chamber 130 outputs the PCB board 10 in the original forward sequence. The original arrangement order of the PCB board 10 is maintained throughout the entire pressing process, so that the output sequence of the PCB board 10 after multiple chamber conveying and two hours of pressing is completely consistent with the initial input, which is beneficial for PCB production traceability.

[0077] In some specific embodiments of the present invention, a first anti-slip layer is provided on the top of the first pallet 311, a second anti-slip layer is provided on the top of the second pallet 321, and a third anti-slip layer is provided on the top of the third pallet 331. The first, second, and third anti-slip layers are used to prevent material displacement during lifting. Specifically, to avoid relative slippage between the PCB board 10 and each supporting platform during the vacuum pressing process, an anti-slip structure is provided on each pallet. When the PCB board 10 is supported by the corresponding pallet in the chamber, the anti-slip layer on the pallet surface and the PCB board 10 form an interlock, thereby avoiding interlayer misalignment and bubble defects caused by board displacement during PCB pressing.

[0078] Specifically, the anti-slip layer uses silicone rubber modified epoxy resin.

[0079] Please refer to Figure 2 and Figure 9 This embodiment discloses a multi-compartment vacuum lamination method for embedded embedded circuit boards, applied to the aforementioned multi-compartment vacuum lamination equipment for embedded embedded circuit boards, which further includes:

[0080] A drive mechanism is installed on the cabin body. The drive mechanism is connected to the feed hopper door 111, the discharge hopper door 131, the first airtight door 121 and the second airtight door 122 respectively to ensure the synchronous opening and closing of each door.

[0081] The control mechanism is electrically connected to the heating mechanism, vacuuming mechanism, transfer mechanism 200 and drive mechanism. As the central hub of the system, the control mechanism receives feedback signals from each mechanism in real time and adjusts the operating status of each mechanism accordingly.

[0082] The methods include:

[0083] The board type parameters and lamination process parameters of PCB board 10 are obtained based on the configuration interface;

[0084] Based on the pressing process parameters, the first heating unit controls the preheating chamber 110 to heat up to the first target temperature, the second heating unit controls the pressing chamber 120 to heat up to the second target temperature, and the second vacuuming unit controls the pressing chamber 120 to reach the target vacuum level.

[0085] When the preheating chamber 110 reaches the first target temperature, the drive mechanism opens the feeding chamber door 111, the transfer mechanism 200 transfers the PCB board 10 to the first preset station in the preheating chamber 110 and then closes the feeding chamber door 111, and the first vacuum unit controls the preheating chamber 110 to reach the target vacuum level.

[0086] When the preheating chamber 110 reaches the target vacuum level, the drive mechanism opens the first airtight door 121, and the transfer mechanism 200 transfers the PCB board 10 to the second preset station in the pressing chamber 120 and then closes the first airtight door 121.

[0087] The third vacuum unit controls the buffer chamber 130 to reach the target vacuum level, the drive mechanism opens the second airtight door 122, and the transfer mechanism 200 transfers the PCB board 10 to the third preset station in the buffer chamber 130 and then closes the second airtight door 122.

[0088] The third vacuum unit controls the buffer chamber 130 to return to normal pressure, the drive mechanism opens the discharge chamber door 131, and the transfer mechanism 200 outputs the PCB board 10 that has been pressed and then closes the discharge chamber door 131.

[0089] In some specific embodiments of the present invention, after closing the first airtight door 121, the preheating chamber 110 is simultaneously controlled to return to normal pressure, the feeding chamber door 111 is opened, and the next PCB board 10 is sent into the preheating chamber 110.

[0090] In some specific embodiments of the present invention, after closing the second airtight door 122, the first airtight door 121 is opened, and at the same time the transfer mechanism 200 is controlled to send the preheated PCB board 10 in the preheating chamber 110 into the pressing chamber 120.

[0091] The following specific embodiment illustrates the multi-compartment vacuum lamination method for embedded core circuit boards.

[0092] The board type parameters and lamination process parameters of PCB board 10 are obtained based on the configuration interface;

[0093] Based on the pressing process parameters, the first heating unit controls the preheating chamber 110 to heat up to the first target temperature, the second heating unit controls the pressing chamber 120 to heat up to the second target temperature, and the second vacuuming unit controls the pressing chamber 120 to reach the target vacuum level. The first target temperature is 80°C, the second target temperature is 160°C, and the target vacuum level is 0.01 bar.

[0094] When the preheating chamber 110 reaches the first target temperature, the drive mechanism opens the feeding chamber door 111 and controls the first telescopic end 211 of the first conveyor belt 210 to extend outward, so that the first conveyor belt 210 and the external feeding system 20 form a continuous conveying path. The PCB board 10 is conveyed one by one to the first preset position directly below the first storage component 310 through the first conveyor belt 210. The first circulating transmission component is controlled to drive the first storage component 310 to rise to a preset height. The conveying action of the first conveyor belt 210 and the rising action of the first storage component 310 are repeated to stack the PCB board 10 layer by layer in the vertical direction. When the number of stacked layers reaches the preset number, the first telescopic end 211 is controlled to retract smoothly to the initial position, the feeding chamber door 111 is closed, and the first vacuum unit controls the preheating chamber 110 to reach the target vacuum degree.

[0095] Once the preheating chamber 110 reaches the target vacuum level, the drive mechanism opens the first airtight door 121, controlling the second telescopic end 2211 of the first conveying unit 221 to extend outward, so that the first conveying unit 221 and the first conveyor belt 210 form a continuous conveying path. The first circulating transmission component is controlled to drive the first storage component 310 to descend a preset height, so that the PCB board 10 stacked on the bottom layer is smoothly lowered onto the first conveyor belt 210. The first conveyor belt 210 and the second conveyor belt 220 are controlled to operate in coordination, continuously conveying the lowered PCB board 10 to the second preset position corresponding to the second storage component 320. The second circulating transmission component is controlled to drive the second storage component 320 to rise to a preset height, so that the top of the second storage component 320 contacts the lower end surface of the PCB board 10 for stable lifting. The conveying action of the first conveyor belt 210 and the second conveyor belt 220 and the rising action of the second storage component 320 are repeated to stack the PCB boards 10 layer by layer in the vertical direction. When all the PCB boards 10 in the preheating chamber 110 have been conveyed, the second telescopic end 2211 is controlled to retract smoothly to the initial position, the first airtight door 121 is closed, and the control mechanism adjusts the pressing pressure in the pressing chamber 120 to 27 kg / cm². 2 The pressing chamber 120 performs the pressing process according to the preset 2-hour pressing time, and the preheating chamber 110 depressurizes and receives the next batch of PCB boards 10.

[0096] After the third vacuum unit controls the buffer chamber 130 to reach the target vacuum level, the drive mechanism opens the second airtight door 122, controls the third telescopic end 2221 of the second conveying unit 222 to extend outward, so that the third conveyor belt 230 and the second conveying unit 222 form a continuous conveying path. The second circulating transmission component drives the second storage component 320 to descend to a preset height, so that the PCB board 10 stacked on the bottom layer is smoothly lowered onto the second conveyor belt 220. The second conveyor belt 220 and the third conveyor belt 230 are controlled to operate in coordination, continuously conveying the lowered PCB board 10 to the... The third storage component 330 is positioned at the third preset position; the third circulating transmission component is controlled to drive the third storage component 330 to rise to a preset height, so that the top of the third storage component 330 contacts the lower end face of the PCB board 10 to achieve stable lifting. The conveying actions of the second conveyor belt 220 and the third conveyor belt 230 and the rising action of the third storage component 330 are repeated to stack the PCB board 10 layer by layer in the vertical direction. When all the PCB boards 10 in the preheating chamber 110 have been conveyed, the third telescopic end 2221 is controlled to retract smoothly to the initial position and the second airtight door 122 is closed.

[0097] The third vacuum unit controls the buffer chamber 130 to return to normal pressure, the drive mechanism opens the discharge chamber door 131, and controls the fourth telescopic end 231 of the third conveyor belt 230 to extend outward, so that the third conveyor belt 230 and the external feeding system 20 form a continuous conveying path; it controls the third circulating transmission component to drive the third storage component 330 to descend a preset height, so that the PCB board 10 stacked on the bottom layer is smoothly lowered onto the third conveyor belt 230; it controls the third conveyor belt 230 and the external feeding system 20 to work together to continuously transport the lowered PCB board 10 to the external feeding system 20, and closes the discharge chamber door 131. At the same time, the first airtight door 121 is opened to transfer the PCB board 10 in the preheating chamber 110 to the pressing chamber 120, and this cycle is repeated to ensure continuous production.

[0098] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A multi-compartment vacuum lamination device for embedded core circuit boards, characterized in that, include: The chamber (100) is divided into a preheating chamber (110), a pressing chamber (120) and a buffer chamber (130) in sequence along the material conveying direction. The preheating chamber (110) is provided with a feed hopper door (111), the buffer chamber (130) is provided with a discharge hopper door (131), a first airtight door (121) is provided between the preheating chamber (110) and the pressing chamber (120), and a second airtight door (122) is provided between the pressing chamber (120) and the buffer chamber (130). The heating mechanism includes a first heating unit disposed on the preheating chamber (110), a second heating unit disposed on the pressing chamber (120), and a third heating unit disposed on the buffer chamber (130). The first heating unit and the second heating unit are configured to perform gradient temperature control on the preheating chamber (110) and the pressing chamber (120) so that the temperatures of the preheating chamber (110) and the pressing chamber (120) increase sequentially. The vacuuming mechanism includes a first vacuuming unit disposed on the preheating chamber (110), a second vacuuming unit disposed on the pressing chamber (120), and a third vacuuming unit disposed on the buffer chamber (130). When the first airtight door (121) is opened, the preheating chamber (110) and the pressing chamber (120) are connected and isolated from the outside of the cabin body (100). When the second airtight door (122) is opened, the pressing chamber (120) and the buffer chamber (130) are connected and isolated from the outside of the cabin body (100). A transfer mechanism (200) is disposed on the cabin (100) and is used to transfer materials inside the cabin (100).

2. The multi-compartment vacuum lamination equipment for embedded core circuit boards according to claim 1, characterized in that, The material is transferred from back to front, and the transfer mechanism (200) includes: The first conveyor belt (210) is disposed in the preheating chamber (110). The rear end of the first conveyor belt (210) is provided with a first telescopic end (211), which is used to connect with the external feeding system (20). The second conveyor belt (220) is disposed in the pressing chamber (120). The rear end of the second conveyor belt (220) is provided with a second telescopic end (2211), and the front end of the second conveyor belt (220) is provided with a third telescopic end (2221). The second telescopic end (2211) is used to connect with the first conveyor belt (210). The third conveyor belt (230) is located inside the buffer chamber (130). The third telescopic end (2221) is used to connect with the third conveyor belt (230). The front end of the third conveyor belt (230) is provided with a fourth telescopic end (231), which is used to connect with the external feeding system (20).

3. The multi-compartment vacuum lamination equipment for embedded core circuit boards according to claim 2, characterized in that, Multiple first conveyor belts (210), multiple second conveyor belts (220) and multiple third conveyor belts (230) are provided. Multiple first conveyor belts (210) are arranged parallel to each other and spaced apart. Multiple second conveyor belts (220) are arranged parallel to each other and spaced apart. Multiple third conveyor belts (230) are arranged parallel to each other and spaced apart. The second conveyor belts (220) and the first conveyor belts (210) are arranged alternately in the left and right direction so that the second telescopic end (2211) passes through the adjacent first conveyor belts (210). The second conveyor belts (220) and the third conveyor belts (230) are arranged alternately in the left and right direction so that the third telescopic end (2221) passes through the adjacent third conveyor belts (230).

4. The multi-compartment vacuum lamination equipment for embedded core circuit boards according to claim 3, characterized in that, The second conveyor belt (220) includes a first conveying unit (221) and a second conveying unit (222). Both the first conveying unit (221) and the second conveying unit (222) extend in the front-back direction. The second telescopic end (2211) is located at one end of the first conveying unit (221) near the first conveyor belt (210). The second conveying unit (222) is located at one end of the first conveying unit (221) near the third conveyor belt (230). The third telescopic end (2221) is located at one end of the second conveying unit (222) near the third conveyor belt (230).

5. The multi-compartment vacuum lamination equipment for embedded core circuit boards according to claim 2, characterized in that, It also includes a storage mechanism (300), which is disposed inside the cabin (100) and is used to stack multiple groups of materials sequentially in a vertical direction.

6. The multi-compartment vacuum lamination equipment for embedded core circuit boards according to claim 5, characterized in that, The storage mechanism (300) includes: The first storage component (310) is vertically and vertically disposed in the preheating chamber (110). The first storage component (310) is located on one side of the first conveyor belt (210). The first storage component (310) is used to lift the material on the first conveyor belt (210) to a preset height or to lower the material at the preset height onto the first conveyor belt (210). The second storage component (320) is vertically and vertically disposed within the pressing chamber (120). The second storage component (320) is located on one side of the second conveyor belt (220). The second storage component (320) is used to lift the material on the second conveyor belt (220) to a preset height or to lower the material at the preset height onto the second conveyor belt (220). The third storage component (330) is vertically and flexibly disposed within the buffer chamber (130). The third storage component (330) is located on one side of the third conveyor belt (230). The third storage component (330) is used to lift the material on the third conveyor belt (230) to a preset height or to lower the material at the preset height onto the third conveyor belt (230).

7. The multi-compartment vacuum lamination equipment for embedded core circuit boards according to claim 6, characterized in that, The first storage component (310) includes two parallel first trays (311). The two first trays (311) are synchronously raised and lowered on opposite sides of the first conveyor belt (210). Each first tray (311) is provided with a corresponding first correction plate (312). The first correction plate (312) is connected to the corresponding first tray (311) through an elastic reset member. The first correction plate (312) is rotatably connected above the corresponding first tray (311). The two first correction plates (312) are inclined towards each other to form a guide channel. The first correction plate (312) is used to correct the positional deviation of the material. The second storage component (320) includes two parallel second trays (321). The two second trays (321) are synchronously raised and lowered on opposite sides of the second conveyor belt (220). Each second tray (321) is provided with a corresponding second correction plate. The second correction plate is connected to the corresponding second tray (321) through an elastic reset member. The second correction plate is rotatably connected above the corresponding second tray (321). The two second correction plates are inclined towards each other to form a guide channel. The second correction plate is used to correct the positional deviation of the material. The third storage component (330) includes two parallel third trays (331). The two third trays (331) are synchronously raised and lowered on opposite sides of the third conveyor belt (230). Each third tray (331) is provided with a corresponding third correction plate. The third correction plate is connected to the corresponding third tray (331) through an elastic reset member. The third correction plate is rotatably connected above the corresponding third tray (331). The two third correction plates are inclined towards each other to form a guide channel. The third correction plate is used to correct the positional deviation of the material.

8. The multi-compartment vacuum lamination equipment for embedded core circuit boards according to claim 7, characterized in that, The first pallet (311) has a first anti-slip layer on top, the second pallet (321) has a second anti-slip layer on top, and the third pallet (331) has a third anti-slip layer on top. The first anti-slip layer, the second anti-slip layer and the third anti-slip layer are used to prevent the material from shifting during the lifting process.

9. A multi-compartment vacuum lamination method for embedded core circuit boards, characterized in that, The device is applied to the multi-compartment vacuum lamination apparatus for embedded core circuit boards as described in any one of claims 1 to 8, the apparatus further comprising: A drive mechanism is provided on the cabin (100), and the drive mechanism is connected to the feed hopper door (111), the discharge hopper door (131), the first airtight door (121) and the second airtight door (122) respectively; A control mechanism, which is electrically connected to the heating mechanism, the vacuuming mechanism, the transfer mechanism (200), and the drive mechanism; The method includes: The board type parameters and lamination process parameters of the PCB board (10) are obtained based on the configuration interface; Based on the pressing process parameters, the first heating unit controls the preheating chamber (110) to heat up to the first target temperature, the second heating unit controls the pressing chamber (120) to heat up to the second target temperature, and the second vacuuming unit controls the pressing chamber (120) to reach the target vacuum level. When the preheating chamber (110) reaches the first target temperature, the driving mechanism opens the feeding chamber door (111), the transfer mechanism (200) transfers the PCB board (10) to the first preset station in the preheating chamber (110) and then closes the feeding chamber door (111), and the first vacuum unit controls the preheating chamber (110) to reach the target vacuum level; When the preheating chamber (110) reaches the target vacuum level, the drive mechanism opens the first airtight door (121), and the transfer mechanism (200) transfers the PCB board (10) to the second preset station in the pressing chamber (120) and then closes the first airtight door (121). The third vacuum unit controls the buffer chamber (130) to reach the target vacuum level, the drive mechanism opens the second airtight door (122), and the transfer mechanism (200) transfers the PCB board (10) to the third preset station in the buffer chamber (130) and then closes the second airtight door (122). The third vacuum unit controls the buffer chamber (130) to return to normal pressure, the drive mechanism opens the discharge chamber door (131), and the transfer mechanism (200) outputs the PCB board (10) after pressing and then closes the discharge chamber door (131).

10. The multi-compartment vacuum lamination method for embedded core circuit boards according to claim 9, characterized in that, After closing the first airtight door (121), the preheating chamber (110) is simultaneously controlled to return to normal pressure, and the feeding chamber door (111) is opened to send the next PCB board (10) into the preheating chamber (110).

Images