Air-liquid mixed heat dissipation device for high-power device and electronic equipment

Abstract

The embodiment of the invention provides a wind-liquid mixed heat dissipation device for a high-power device and electronic equipment. The heat dissipation device comprises a heat conduction piece, a first heat dissipation part and a second heat dissipation part, the first heat dissipation part comprises at least one group of first air cooling heat dissipation fins; the second heat dissipation part comprises at least one cold plate and at least one group of second air cooling heat dissipation fins, and the at least one cold plate and the high-power device are arranged at intervals in the horizontal direction; the first end of the heat conduction piece is located between the first air cooling heat dissipation fin and the high-power device. The second end is provided with at least one heat-conducting branch plate, the heat-conducting branch plate can cover at least one surface of the at least one cold plate, and the first end of the heat-conducting piece can absorb heat generated by the high-power device and conduct the heat to the plurality of heat-conducting branch plates at the second end of the heat-conducting piece; the at least one group of second air-cooling radiating fins are positioned on one side, far away from the cold plate, of the at least one heat-conducting branch plate; the first heat dissipation part is used for dissipating heat of the first end of the heat conduction piece, and the second heat dissipation part is used for dissipating heat of the second end of the heat conduction piece.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an air-liquid hybrid heat dissipation device for high-power devices and electronic equipment. Background Art

[0002] With the development of information and communication technology, the upgrading of industries such as cloud computing, HPC (High Performance Computing), big data, 5G (fifth generation mobile communication technology), and AI (Artificial Intelligence) has accelerated, and the energy consumption of IT (Information Technology) and CT (Communication Technology) equipment required by data centers has increased accordingly. The power consumption of single-chip CPUs (Central Processing Units) and GPUs (Graphics Processing Units) in IT equipment has reached 550W and 1000W, respectively, while the power consumption of single-chip MACs (Media Access Control) in CT equipment has reached 750W. In the future, the power consumption of single-chip CPUs will exceed 600W, and that of single-chip GPUs and MACs will reach approximately 1400W. In the limited space of IT / CT equipment, air-cooling solutions are expected to have difficulty meeting the heat dissipation requirements of these chips, especially MAC and GPU chips. In addition, the national energy-saving policy requires that the PUE (Power Usage Effectiveness) of new data centers be 100W. The Power Usage Effectiveness (PUE) must reach 1.25 or below 1.3. PUE is a metric for evaluating data center energy efficiency, representing the ratio of all energy consumed by the data center to the energy used by the IT load. Poor heat dissipation in high-power components, such as chips, can lead to slower processing speeds, delayed responses, increased risk of chip failure, and shortened chip lifespan, directly impacting device performance. Furthermore, overheating of high-power components can cause equipment failures and even jeopardize the overall safe operation of the data center. Therefore, heat dissipation technology for high-power components presents significant challenges.

[0003] In recent years, cold plate and immersion cooling solutions have been adopted for cooling high-power devices. However, immersion cooling faces challenges such as low industry maturity, environmental risks associated with fluorinated liquids, expensive immersion fluids, high deployment costs, and difficult maintenance. Cold plate cooling also faces reliability risks due to leakage. For high-power devices, leakage can be a serious problem, potentially causing downtime and disrupting business operations, or even fires and resulting in personal injury and property damage.

[0004] How to solve the heat dissipation of high-power devices while improving the reliability of the heat dissipation device is the key point in the future heat dissipation design of IT / CT equipment. Summary of the Invention

[0005] The purpose of the embodiments of the present application is to provide an air-liquid hybrid cooling device and electronic equipment for high-power devices, so as to solve the problems of insufficient heat dissipation capacity of high-power devices in the prior art and liquid leakage from the cold plate to the devices during liquid cooling.

[0006] The specific technical solutions are as follows:

[0007] An embodiment of the first aspect of the present application provides an air-liquid hybrid heat dissipation device for high-power devices, wherein the high-power device and the heat dissipation device are both located in a housing of an electronic device, and the heat dissipation device includes: a heat conductor and a first heat dissipation portion and a second heat dissipation portion arranged at intervals; the first heat dissipation portion includes at least one group of first air-cooled heat dissipation fins; the second heat dissipation portion includes at least one cold plate and at least one group of second air-cooled heat dissipation fins, and the at least one cold plate is arranged at intervals along the horizontal direction with the high-power device; the heat conductor has a first end located between the first air-cooled heat dissipation fins and the high-power device; the second end has at least one heat-conducting branch plate, and the at least one heat-conducting branch plate can cover at least one surface of the at least one cold plate; the first end of the heat conductor can absorb the heat generated by the high-power device and conduct it to multiple heat-conducting branch plates at the second end of the heat conductor; at least one group of second air-cooled heat dissipation fins is located on the side of the at least one heat-conducting branch plate away from the cold plate; the first heat dissipation portion is used to dissipate heat from the first end of the heat conductor, and the second heat dissipation portion is used to dissipate heat from the second end of the heat conductor.

[0008] In some embodiments, the air-liquid hybrid heat dissipation device further comprises a heat dissipation fan, and the heat dissipation fan is used to conduct heat from the first heat dissipation part and the second heat dissipation part to the outside.

[0009] In some embodiments, the air-liquid hybrid heat dissipation device has a liquid-cooled cold source component; the liquid-cooled cold source component includes a first liquid inlet pipe, a first liquid outlet pipe and a cold source; one end of the first liquid inlet pipe is connected to the cold source, and the other end is connected to the liquid inlet of the cold plate; the cold source can provide cooling liquid to the cold plate through the first liquid inlet pipe; one end of the first liquid outlet pipe is connected to the liquid outlet of the cold plate, and the other end is used to discharge the cooling liquid after heat exchange in the cold plate.

[0010] In some embodiments, the air-liquid hybrid heat dissipation device has a liquid-cooled cold source component; the liquid-cooled cold source component includes a second liquid inlet pipe, a second liquid outlet pipe, a pump and a heat exchanger; the second liquid outlet pipe is connected at one end to the liquid outlet of the cold plate, and the other end is connected to the inlet of the heat exchanger, and is used to transport the coolant after heat exchange in the cold plate to the heat exchanger for cooling; the second liquid inlet pipe is connected at one end to the outlet of the heat exchanger, and the other end is connected to the liquid inlet of the cold plate; the pump is located between the outlet of the heat exchanger and the liquid inlet of the cold plate, and is used to transport the coolant cooled in the heat exchanger to the cold plate through the second liquid inlet pipe.

[0011] In some embodiments, the first heat dissipation portion further has a first heat exchange plate; the second heat dissipation portion further has at least one group of second heat exchange plate groups; each group of the second heat exchange plate groups is arranged in a one-to-one correspondence with the heat conductive branch plate; the first heat exchange plate is arranged between the high-power device and the first end of the heat conductive component; each group of the second heat exchange plate group includes two second heat exchange plates, and the two second heat exchange plates are respectively located on both sides of the heat conductive branch plate along the height direction.

[0012] In some embodiments, a leakage isolation plate is provided at the interval between the first heat dissipation portion and the second heat dissipation portion, and at a side of the second heat dissipation portion away from the first heat dissipation portion. The leakage isolation plate is used to isolate the cold plate from the high-power device to prevent coolant leaking from the cold plate from flowing to the high-power device.

[0013] In some embodiments, the air-liquid hybrid heat dissipation device further has a leakage collection component; the leakage collection component includes a liquid collecting tank, a guide channel and a drainage outlet; the liquid collecting tank is arranged below the cold plate, and is used to collect the coolant flowing out of the cold plate; the guide channel is connected to the liquid outlet of the liquid collecting tank at one end, and is connected to the drainage outlet at the other end, and is used to discharge the coolant in the liquid collecting tank to the outside through the drainage outlet.

[0014] In some embodiments, the leakage collection assembly further comprises a leakage detection device, and the leakage detection device is used to detect whether the cold plate is leaking.

[0015] In some embodiments, the air-liquid hybrid heat dissipation device also has a temperature detector and a temperature alarm device. The temperature detector is provided on the high-power device, and the temperature detector is used to detect the temperature of the high-power device. The temperature alarm device is electrically connected to the temperature detector, and the temperature alarm is used to issue a warning based on the temperature value detected by the temperature detector.

[0016] An embodiment of the second aspect of the present application provides an electronic device, comprising the above-mentioned air-liquid hybrid heat dissipation device for high-power devices.

[0017] Beneficial effects of the embodiments of the present application:

[0018] In this embodiment, heat generated by the high-power device is dissipated through air cooling via the first air-cooled fins of the first heat dissipation section, liquid cooling via the cold plate of the second heat dissipation section, and air cooling via the second air-cooled fins. This arrangement effectively dissipates heat from the high-power device, thereby improving its heat dissipation capacity. Because the cold plate and the high-power device are horizontally spaced apart, leakage risk points, such as the cold plate's process welds, heat transfer pipes, and the cold plate's liquid inlet and outlet joints, are avoided from the device. Even if the cold plate leaks, liquid will not fall on the high-power device, preventing damage to the high-power device caused by cold plate leakage and improving its reliability during operation. Furthermore, the simultaneous air and liquid cooling of the high-power device by the first and second heat dissipation sections meets the heat dissipation requirements of the high-power device while consuming minimal energy. This effectively conserves resources and meets the requirements of national energy conservation policies. Since the first heat dissipation part and the second heat dissipation part are respectively provided with the first air-cooled heat dissipation fins and the second air-cooled heat dissipation fins, the heat dissipation device provided in the embodiment of the present application has a good air-cooled heat dissipation capacity foundation. Even in the case of liquid cut-off of the cold plate or pipeline blockage, after the liquid is cut off from the cold plate, the high-power device can be cooled by the first air-cooled heat dissipation fins and the second air-cooled heat dissipation fins, so that the high-power device can operate normally, thereby reducing the impact on the business and improving the maintenance time.

[0019] Of course, it is not necessary to achieve all the advantages described above at the same time when implementing any product or method of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other embodiments can also be obtained based on these drawings.

[0021] Figure 1 A front view schematic diagram of a first heat dissipation device provided in an embodiment of the present application;

[0022] Figure 2 for Figure 1 A schematic top view of the first heat dissipation device is shown;

[0023] Figure 3 for Figure 1 A schematic top view of the first heat dissipation device and the housing of the electronic device is shown;

[0024] Figure 4 A front view schematic diagram of a second heat dissipation device provided in an embodiment of the present application;

[0025] Figure 5 A front view schematic diagram of a third heat dissipation device provided in an embodiment of the present application;

[0026] Figure 6 for Figure 5 A schematic top view of a third type of heat dissipation device is shown.

[0027] Reference numerals:

[0028] High-power device 110; motherboard 120; heat sink 200; heat conductor 210; first end 211; second end 212; heat conduction branch plate 213; first heat dissipation portion 220; first air-cooled heat sink fin 221; first heat exchange plate 222; second heat dissipation portion 230; cold plate 231; fixing bracket 2310; second air-cooled heat sink fin 232; second heat exchange plate 233; housing 300 of electronic device; cooling fan 400; liquid-cooled cold source assembly 500; first liquid inlet pipe 510; first liquid outlet pipe 520; cold source 530; second liquid inlet pipe 540; second liquid outlet pipe 550; pump 560; heat exchanger 570; liquid leakage isolation plate 600; liquid leakage collection assembly 700; liquid collecting tank 710; diversion channel 720; liquid discharge outlet 730; liquid leakage detection rope 740; liquid leakage alarm 750;

[0029] Horizontal direction X; height direction Y. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field based on this application are within the scope of protection of this application.

[0031] In order to solve the problem of insufficient heat dissipation capacity for high-power devices in the existing technology and the problem of liquid leakage from the cold plate to the device during liquid cooling, see Figure 1 、 Figure 2 and Figure 3 , Figure 1 A front view schematic diagram of a first heat dissipation device provided in an embodiment of the present application;

[0032] Figure 2 for Figure 1 A schematic top view of the first heat dissipation device is shown; Figure 3 for Figure 1The schematic diagram of a top view of the first heat dissipation device and the housing of an electronic device is shown; an embodiment of the first aspect of the present application provides an air-liquid hybrid heat dissipation device for high-power devices, wherein the high-power device 110 and the heat dissipation device 200 are both located in the housing 300 of the electronic device, the high-power device 110 is mounted on the mainboard 120, and is a device that generates high heat, and the heat dissipation device 200 is used to dissipate heat from the high-power device 110. The heat dissipation device 200 specifically includes: a heat conducting member 210 and a first heat dissipation portion 220 and a second heat dissipation portion 230 that are spaced apart; the first heat dissipation portion 220 includes at least one group of first air-cooled heat dissipation fins 221; the second heat dissipation portion 230 includes at least one cold plate 231 and at least one group of second air-cooled heat dissipation fins 232, and at least one cold plate 231 is spaced apart from the high-power device 110 in the horizontal direction X; the first end 211 of the heat conducting member 210 is located between the first air-cooled heat dissipation fin 221 and the high-power device 110; the second end 212 has at least one heat conducting branch plate 213, at least one The heat-conducting branch plate 213 can cover at least one surface of at least one cold plate, for example, it can cover the upper surface or the lower surface of the cold plate; the first end 211 of the heat-conducting member 210 can absorb the heat generated by the high-power device 110 and conduct it to the multiple heat-conducting branch plates 213 at the second end 212 of the heat-conducting member 210; at least one group of second air-cooled heat sinks 232 are respectively located on the side of at least one heat-conducting branch plate 213 away from the cold plate; the first heat dissipation portion 220 is used to dissipate heat from the first end 211 of the heat-conducting member 210, and the second heat dissipation portion 230 is used to dissipate heat from the second end 212 of the heat-conducting member 210.

[0033] In this embodiment, since the heat conductor 210 is connected to the first heat dissipation portion 220 and the second heat dissipation portion 230 respectively, the first end 211 of the heat conductor 210 is located between the first air-cooled heat sink fin 221 and the high-power device 110. This allows heat generated by the high-power device 110 during operation to be heat-exchanged through the first end 211 of the heat conductor 210 to the first air-cooled heat sink fin 221 and the second end 212 of the heat conductor 210. Heat from the second end 212 of the heat conductor 210 can then be heat-exchanged with the second air-cooled heat sink fin 232 and the cold plate 231. This arrangement effectively dissipates heat from the high-power device 110, reduces heat accumulation in the high-power device 110, and enables timely cooling of the high-power device 110, thereby improving the heat dissipation capability of the high-power device 110 and reducing malfunctions of the high-power device 110 due to overheating. According to experimental tests, the heat dissipation device provided in the embodiment of the present application is used to dissipate heat from the high-power device 110. Compared with the prior art method of dissipating heat from the high-power device using only air cooling or liquid cooling, the heat dissipation efficiency can be significantly improved. Moreover, since the first heat dissipation portion and the second heat dissipation portion are respectively provided with first air-cooled heat dissipation fins and second air-cooled heat dissipation fins, the heat dissipation device provided in the embodiment of the present application has a good air-cooled heat dissipation capacity foundation. Even if the cold plate 231 has an accident such as liquid leakage, joint disconnection, flow interruption or flow channel blockage, the high-power device 110 can be dissipated in time through the first air-cooled heat dissipation fins 221 and the second air-cooled heat dissipation fins 232, ensuring the reliability of heat dissipation and allowing the high-power device to operate normally, thereby reducing the impact on business and improving maintenance time. When the inlet and outlet pipes of the cold plate are disconnected, the second heat dissipation portion is equivalent to an air-cooled radiator, so the second heat dissipation portion can obtain the same maintainability as an air-cooled radiator.

[0034] Because the cold plate 231 is spaced apart from the high-power device 110 in the horizontal direction X, leakage risk points such as the process welds of the cold plate 231, the heat transfer pipes, and the joints at the liquid inlet and outlet of the cold plate 231 can be avoided from the device. Even if the cold plate 231 leaks, it will not fall on the high-power device 110, thereby preventing damage to the high-power device 110 caused by the leakage of the cold plate 231, thereby improving the reliability of the high-power device 110 during operation. Moreover, because the cold plate 231 is isolated from the high-power device 110, even if the cold plate 231 leaks, it will not affect the high-power device 110. Therefore, compared with the cold plate 231 arranged above the high-power device 110 in the prior art, the cold plate 231 in the embodiment of the present application has lower manufacturing process requirements for the interface, which can reduce process complexity, thereby reducing the manufacturing cost of the cold plate 231, and further reducing the cost of the entire heat dissipation device 200.

[0035] Since the cold plate 231 is arranged at the far end, the liquid inlet pipe and the liquid outlet pipe corresponding to the cold plate 231 will not interfere with the cables of the high-power device 110. Compared with setting the cold plate directly above the high-power device 110, the difficulty of the heat dissipation layout inside the electronic device can be reduced; moreover, since the cold plate 231 is arranged on one side of the high-power device 110, compared with being set directly above the high-power device 110, the distance between the cold plate 231 and the outer wall of the electronic device housing where the liquid inlet and outlet are arranged is shorter, thereby shortening the length of the liquid cooling pipeline inside the electronic device housing, and the spatial layout is more conducive to the diversion and drainage of liquid leakage from the cold plate.

[0036] As analyzed above, with the cooperation of the first heat dissipation part 220 and the second heat dissipation part 230, the high-power device 110 can simultaneously achieve air cooling and liquid cooling, which can not only meet the heat dissipation requirements of the high-power device 110, but also meet the heat dissipation requirements with very little energy consumption, effectively saving resources and responding to the country's energy-saving policy requirements.

[0037] The number of the cold plates 231 can be set according to actual working conditions. The number of the cold plates 231 can be one or two.

[0038] like Figure 1 As shown, in Figure 1 In the first heat dissipation device shown, there is one cold plate 231 and two heat-conducting branch plates 213 , which are U-shaped and wrap around the side and upper and lower surfaces of the cold plate 231 , so that the heat-conducting branch plates 213 can fully exchange heat with the cold plate 231 .

[0039] like Figure 4 As shown, Figure 4 This is a front view schematic diagram of the second heat dissipation device provided in an embodiment of the present application; there are two cold plates 231 and three heat-conducting branch plates 213. The three heat-conducting branch plates 213 are E-shaped and wrap around the side surfaces and upper and lower surfaces of the two cold plates 231, so that the heat-conducting branch plates 213 can fully exchange heat with the cold plates 231.

[0040] It should be noted that Figure 4 The second heat dissipation device shown is Figure 1 and Figure 2 The first heat dissipation device shown in the figure is different only in the number of the cold plate 231 and the heat conducting branch 213. The arrangement of the heat conducting member 210, the first fan heat dissipation fin 221 and the second air cooling heat dissipation fin 232 are the same as those in the first heat dissipation device shown in the figure. Figure 1 and Figure 2 The same as the first heat sink shown.

[0041] Based on the above embodiment:

[0042] As an optional embodiment, Figure 1 and Figure 2 As shown, in Figure 1 In the first heat dissipation device shown, the air-liquid hybrid heat dissipation device 200 has a liquid-cooled cold source component 500; the liquid-cooled cold source component 500 includes a first liquid inlet pipe 510, a first liquid outlet pipe 520 and a cold source 530; the first liquid inlet pipe 510 is connected to the cold source 530 at one end and to the liquid inlet of the cold plate 231 at the other end; the cold source 530 can provide cooling liquid to the cold plate 231 through the first liquid inlet pipe 510; one end of the first liquid outlet pipe 520 is connected to the liquid outlet of the cold plate 231, and the other end is used to discharge the cooling liquid after heat exchange in the cold plate 231.

[0043] exist Figure 1 In the first heat sink shown, the liquid-cooled cold source assembly 500 operates in an open-circuit configuration. Specifically, the liquid inlet end of the first liquid inlet pipe 510 is directly connected to the cold source 530, while the liquid outlet end of the first liquid outlet pipe 520 discharges directly to the exterior of the electronic device. This open-circuit configuration simplifies piping and is suitable for use in fixed installations such as base stations. Since a heat exchanger 570 and pump 560 are not required, the liquid-cooled cold source assembly 500 occupies less space within the electronic device housing, further miniaturizing the heat sink 200 and allowing it to occupy a smaller space within the electronic device.

[0044] It should be noted that Figure 4 The second heat sink shown is Figure 1 and Figure 2 The difference between the first heat dissipation device shown is only the number of cold plates and heat-conducting branch plates. Therefore, the open-circuit liquid cooling source component 500 is also applicable to Figure 4 The heat sink shown has two cold plates and three heat conducting branch plates.

[0045] As an optional embodiment, Figure 5 and Figure 6 As shown, Figure 5 A front view schematic diagram of a third heat dissipation device provided in an embodiment of the present application; Figure 6 for Figure 5 A top view of the third heat dissipation device is shown; Figure 3The third type of heat dissipation device structure shown is an air-liquid hybrid heat dissipation device having a liquid-cooled cold source component 500; the liquid-cooled cold source component 500 includes a second liquid inlet pipe 540, a second liquid outlet pipe 550, a pump 560 and a heat exchanger 570; the second liquid outlet pipe 550, one end of which is connected to the liquid outlet of the cold plate 231, and the other end is connected to the inlet of the heat exchanger 570, for transporting the coolant after heat exchange in the cold plate 231 to the heat exchanger 570 for cooling; the second liquid inlet pipe 540, one end of which is connected to the outlet of the heat exchanger 570, and the other end of which is connected to the liquid inlet of the cold plate 231; the pump 560, located between the outlet of the heat exchanger 570 and the liquid inlet of the cold plate 231, is used to transport the coolant cooled in the heat exchanger 570 to the cold plate 231 through the second liquid inlet pipe 540.

[0046] exist Figure 5 and Figure 6 In the third heat dissipation device shown, the liquid-cooled cold source assembly 500 is a closed-circuit circulation, and the pump 560 and the heat exchanger 570 are arranged inside the housing 300 of the electronic device. No external cold source is required, making the electronic device easier to move; the high-temperature coolant in the cold plate 231 that has exchanged heat with the heat conductor 210 flows into the heat exchanger 570 through the second liquid outlet pipe 550, and the heat exchanger 570 performs heat exchange and cooling on the high-temperature coolant. The cooled coolant enters the cold plate 231 through the second liquid inlet pipe 540 and continues to exchange heat with the heat conductor 210; the above-mentioned closed-circuit liquid cooling pipeline can save coolant because the coolant can be recycled, making the heat dissipation device 200 provided in the embodiment of the present application more energy-efficient.

[0047] Specifically, the pump 560 may be a real pump 560 driven by external mechanical power, or an abstract pump 560 driven by internal capillary force or gravity.

[0048] It should be noted that Figure 5 and Figure 6 The third heat sink shown is Figure 1 and Figure 2 The difference between the first heat dissipation device shown is only that the working mode of the liquid cooling source component 500 is different. Figure 5 and Figure 6 The number of cold plates corresponding to the closed-circuit liquid-cooled cold source assembly 500 in the third heat dissipation device shown can be one or two.

[0049] In the above three heat dissipation devices, the number of the first air-cooled heat dissipation fins 221 can be set according to actual working conditions. For example, the first air-cooled heat dissipation fins 221 can be a group, and a group of first air-cooled heat dissipation fins 221 is arranged at the top of the first end 211 of the heat conductor 210; the first air-cooled heat dissipation fins 221 can also be two groups, one of which is a group of first air-cooled heat dissipation fins 221 arranged at the top of the first end 211 of the heat conductor 210, and the other group of first air-cooled heat dissipation fins 221 is arranged on the side of the first end 211 of the heat conductor 210 away from the second heat dissipation part; the first air-cooled heat dissipation fins 221 can also be multiple groups, one of which is a group of first air-cooled heat dissipation fins 221 at the top of the heat conductor 210, and the remaining multiple groups are arranged in an array around the heat conductor 210, increasing the heat exchange area with the first end 211 of the heat conductor 210, thereby increasing the heat exchange efficiency.

[0050] In the above three heat dissipation devices, the number of the second air-cooled heat dissipation fins 232 can be set according to the actual working conditions. When there are two groups of second air-cooled heat dissipation fins 232, one group is set at the top of the top heat-conducting branch plate 213, and the other group is set at the bottom of the bottom heat-conducting branch plate 213. When the number of second air-cooled heat dissipation fins 232 is greater than two groups, two of the groups can be set at the top of the top heat-conducting branch plate 213 and the bottom of the bottom heat-conducting branch plate 213, and the remaining second air-cooled heat dissipation fins 232 are arranged around the second end of the heat conductor.

[0051] Specifically, shark skin bionic micro grooves can be added to the surface of the first air-cooled heat sink fin 221 and the second air-cooled heat sink fin 232. The depth of the shark skin bionic micro grooves can be 0.1-0.3 mm, which can reduce the air flow resistance by about 12%, thereby further improving the air cooling efficiency of the first air-cooled heat sink fin 221 and the second air-cooled heat sink fin 232, and thus improving the cooling capacity of the high-power device 110.

[0052] Specifically, the cold plate 231 can be a modular cold plate 231, that is, it is divided into multiple independent microchannel units, and the multiple independent microchannel units do not circulate with each other; the cold plate has several inlet / outlet liquid interfaces for circulating coolant, and the coolant is not limited to single-phase liquids such as PG25 (polyoxyethylene and polypropylene ether), EG25 (ethylene glycol coolant) and deionized water, and can also be phase change liquids such as R134a (1,1,1,2-tetrafluoroethane) to achieve single-phase or phase change circulating liquid cooling and heat dissipation.

[0053] Specifically, since the air-cooled heat sink is designed in the embodiment of the present application and there is a basis for air-cooled heat dissipation, the performance requirements of the remote cold plate can be traded off in certain scenarios. For example, relatively low-cost process solutions such as FTCP (Embedded Tube Cold Plate), EMCP (Extruded Micro-channel Cold Plate), PFCP (Pocketed Folded-fin Cold Plate) or SCCP (Stamped / Inflated Cold Plate) can be selected to eliminate or reduce welding and machining, thereby achieving cost benefits while ensuring reliability; of course, MCCP (Machine-added Channel Cold Plate (milling grooves, skiving teeth, drilling holes)) can also be used to form the cold plate.

[0054] During actual installation, the cold plate 231 can be fixedly mounted by the cold plate fixing frame 2310, and the second air-cooled heat sink can be fixedly connected to the heat-conducting mounting frame by a detachable connection method such as welding or screw connection. This application does not limit the connection method between the second air-cooled heat sink and the cold plate.

[0055] Specifically, the heat conducting member 210 in all the above embodiments can be a high thermal conductivity material / channel such as a heat pipe, a thermosyphon, a VC (vapor chamber), an LHP (loop heat pipe), a CPL (capillary pumped loop), or an LTS (loop thermosyphon); wherein the material of the heat conducting branch plate 213 can be a material with excellent thermal conductivity such as copper or aluminum, and this application does not limit the material of the heat conducting branch plate 213.

[0056] For any of the three heat dissipation devices described above, the air-liquid hybrid heat dissipation device 200 may further include a heat dissipation fan 400, which is used to transfer heat from the first heat dissipation portion and the second heat dissipation portion to the outside. Specifically, the heat dissipation fan 400 may be located on the side of the second heat dissipation portion 230 away from the high-power device, or on the side of the first heat dissipation portion away from the second heat dissipation portion. This application does not limit the location of the heat dissipation fan 400. Figure 3The arrows on the left and right sides represent the airflow direction generated by the cooling fan. The suction force generated by the cooling fan 400 can transfer heat from the cold plate 231, the second air-cooled heat sink fins 232, and the second end 212 of the heat conductor 210 in the second heat sink 230 to the outside, away from the high-power area. This reduces the accumulation of heat in the second heat sink 230 and promptly reduces the amount of heat on the second heat sink 230, thereby improving the heat dissipation capacity and efficiency of the high-power device 110.

[0057] Specifically, there may be multiple cooling fans 400 arranged in an array. For example, when four low-power fans replace a single high-power fan, the noise is reduced by 40% while generating the same wind force.

[0058] In any of the three heat dissipation devices described above, the first heat dissipation portion 220 further includes a first heat exchange plate 222; the second heat dissipation portion 230 further includes at least one second heat exchange plate group; each second heat exchange plate group is provided in a one-to-one correspondence with the heat conductive branch plate 213; the first heat exchange plate 222 is provided between the high-power device 110 and the first end 211 of the heat conductive member 210; and each second heat exchange plate group includes two second heat exchange plates 233, with the two second heat exchange plates 233 being located on either side of the heat conductive branch plate 213 along the height direction Y. When the connection between the cold plate and the second air-cooled heat sink is an assembly connection, that is, a detachable connection, the first heat exchange plate 222 and the second heat exchange plate 233 can both be TIM (Thermal Interface Material). TIM has excellent thermal conductivity and wettability, can fully fill small gaps between solid surfaces, reduce contact thermal resistance, and improve heat dissipation performance. There are various types of TIMs, including thermally conductive silicone gaskets, thermally conductive gels, thermally conductive grease, and thermally conductive phase change materials. By providing a TIM, the heat exchange efficiency between the high-power device 110 and the first end 211 of the thermal conductor 210, and between the thermal branch plate 213 and the cold plate 231, is increased by 50%, enabling timely elimination of hot spots in the thermal conductor 210, thereby further improving the heat dissipation efficiency of the high-power device 110. When the connection between the cold plate and the second air-cooled heat sink is by welding, the second heat exchanger can be soldered between the cold plate and the second air-cooled heat sink.

[0059] Any of the three heat dissipation devices above, such as Figures 1 to 3As shown, leakage isolation plates 600 are provided in the gap between the first heat dissipation portion 220 and the second heat dissipation portion 230, and on the side of the second heat dissipation portion 230 away from the first heat dissipation portion 220. The leakage isolation plates 600 are used to isolate the cold plate 231 from the high-power device 110, preventing coolant leaking from the cold plate 231 from flowing toward the high-power device 110. In this embodiment, the provision of the leakage isolation plates 600 further isolates the cold plate 231 from the high-power device 110, thereby further improving the reliability of the high-power device 110 during use.

[0060] It should be noted that this application only shows the leakage isolation plate 600 in the first type of heat dissipation device. Figure 4 The second heat dissipation device shown and Figure 5 and Figure 6 In the third heat dissipation device shown, the liquid leakage isolation plate 600 has the same structure, position and function as those of the first heat dissipation device.

[0061] Any of the three heat dissipation devices above, such as Figures 1 to 3 As shown, the air-liquid hybrid heat dissipation device 200 also has a leakage collection component 700; the leakage collection component 700 includes a liquid collecting tank 710, a guide channel 720 and a drain outlet 730; the liquid collecting tank 710 is provided below the cold plate 231 and is used to collect the coolant flowing out of the cold plate 231; the guide channel 720 is connected to the liquid outlet of the liquid collecting tank 710 at one end and to the drain outlet 730 at the other end, and is used to discharge the coolant in the liquid collecting tank 710 to the outside through the drain outlet 730. Specifically, the guide channel 720 passes through the leakage isolation plate 600 located on the side of the second heat dissipation part 230 away from the first heat dissipation part 220 and is connected to the drain outlet 730. It should be noted that this application only shows the leakage collection component 700 in the first type of heat dissipation device. Figure 4 The second heat dissipation device shown and Figure 5 and Figure 6 In the third heat dissipation device shown, the leakage liquid collection component 700 has the same structure and position as those of the first heat dissipation device.

[0062] like Figures 1 to 3As shown, the present application further considers that the connections between different components in the heat sink 200 are often the most likely locations for coolant leakage. For example, the coolant inlet of the cold plate 231 can be connected to the first liquid inlet pipe 510 using a pagoda and clamp method, and the coolant outlet can be connected to the first liquid outlet pipe 520 using a pagoda and clamp method. Alternatively, for ICT (Information Technology and Communications Technology) equipment, the inlet and outlet of the cold plate 231 can be connected using a quick connector method. Leakage may occur at the connection between the coolant inlet and the first liquid inlet pipe 510 and at the connection between the coolant outlet and the first liquid outlet pipe 520. To this end, this embodiment provides a liquid collection tank 710 below the cold plate 231. When leakage occurs at the connection between the cold plate 231 and the first liquid inlet pipe 510 and the first liquid outlet pipe 520, the leaked coolant is collected in the liquid collection tank 710, preventing the leaked coolant from overflowing onto the high-power device 110, further improving the overall safety and reliability of the equipment. The liquid collecting tank 710 can be provided to facilitate the collection and cleaning of the coolant by the maintenance personnel. Specifically, the liquid collecting tank 710 can be an aluminum tank body.

[0063] Further, such as Figure 3 As shown, the leakage collection assembly 700 also includes a leakage detection device for detecting whether the cold plate is leaking. Specifically, the leakage detection device may include a leakage detection cord 740 and a leakage alarm 750. One end of the leakage detection cord 740 is immersed in the liquid collection tank 710, and the other end is connected to the leakage alarm 750. The leakage alarm 750 can issue a warning based on the resistance value of the leakage detection cord 740. It should be noted that the leakage detection device can also be implemented in other ways, such as a leakage detection membrane.

[0064] In this embodiment, the leak detection cord 740 is a leak detection device based on the principle of liquid conductivity. When the leak detection cord 740 is soaked with coolant, the two signal lines in the leak detection cord 740 are short-circuited, and the resistance of the leak detection cord 740 is significantly reduced. For example, if a leak occurs at the connection between the coolant inlet of the cold plate 231 and the first liquid inlet pipe 510, the leak detection cord 740 is soaked with coolant, causing the resistance of the leak detection cord 740 to change. When the leak alarm 750 detects the resistance of the leak detection cord 740, it issues a warning, prompting personnel to promptly address the components at the leaking location to prevent further damage to the high-power device 110 caused by the coolant.

[0065] It should be noted that the above-mentioned cooling fan 400, the first heat exchange plate and the second heat exchange plate group, the leakage isolation plate and the leakage collection component can be set at the same time, or they can be set in combination of any several, or only one of them can be selected for setting.

[0066] On the basis of all the above embodiments, the air-liquid hybrid heat dissipation device 200 also has a temperature detector (not shown) and a temperature alarm device (not shown). The temperature detector is provided on the high-power device 110. The temperature detector is used to detect the temperature of the high-power device 110. The temperature alarm device is electrically connected to the temperature detector. The temperature alarm is used to issue a warning based on the temperature value detected by the temperature detector.

[0067] It should be noted that the temperature detector can be set simultaneously with the above-mentioned cooling fan 400, the first heat exchange plate and the second heat exchange plate group, the leakage isolation plate and the leakage collection component, or a combination of any several of them, or only the temperature detector can be set.

[0068] The second embodiment of the present application provides an electronic device, such as Figures 1 to 3 As shown, the electronic device includes the air-liquid hybrid heat dissipation device 200 for the high-power device 110 of all the above embodiments.

[0069] In this embodiment, the electronic device may be a server or processor in a data center, and the high-power device 110 may be a motherboard in the server or processor. Since the heat conductor 210 is connected to the first heat dissipation portion 220 and the second heat dissipation portion 230 respectively, and since the first end 211 of the heat conductor 210 is located between the first air-cooled heat sink fin 221 and the high-power device 110, heat generated by the high-power device 110 during operation can be heat-exchanged to the first air-cooled heat sink fin 221 and the second end 212 of the heat conductor 210 through the first end 211 of the heat conductor 210, and heat from the second end 212 of the heat conductor 210 can be heat-exchanged with the second air-cooled heat sink fin 232 and the cold plate 231. Through the above arrangement, the high-power device 110 can be effectively dissipated, heat accumulation at the high-power device 110 can be reduced, and the high-power device 110 can be cooled in a timely manner, thereby improving the heat dissipation capacity of the high-power device 110 and reducing malfunction of the high-power device 110 due to overheating. According to experimental tests, the heat dissipation device provided in the embodiment of the present application is used to dissipate heat from the high-power device 110. Compared with the prior art of performing separate air cooling or separate liquid cooling on the high-power device, the heat dissipation efficiency can be improved by more than 50%. Moreover, even if the cold plate 231 has accidents such as liquid leakage, joint disconnection, flow interruption or flow channel blockage, the high-power device 110 can be cooled in time through the first air-cooled heat dissipation fins 221 and the second air-cooled heat dissipation fins 232, thereby improving the reliability of heat dissipation of the electronic equipment.

[0070] Because the cold plate 231 is spaced apart from the high-power device 110 in the horizontal direction X, leakage risk points such as the process welds of the cold plate 231, the heat transfer pipes, and the joints at the liquid inlet and outlet of the cold plate 231 can be avoided from the device. Even if the cold plate 231 leaks, it will not fall on the high-power device 110, thereby preventing damage to the high-power device 110 caused by the leakage of the cold plate 231, thereby improving the reliability of the high-power device 110 during operation. Moreover, because the cold plate 231 is isolated from the high-power device 110, even if the cold plate 231 leaks, it will not affect the high-power device 110. Therefore, compared with the cold plate 231 located above the high-power device 110 in the prior art, the cold plate 231 in the embodiment of the present application has lower manufacturing process requirements for the interface, thereby reducing process complexity, thereby reducing the manufacturing cost of the cold plate 231, and further reducing the cost of the entire heat dissipation device 200 and the manufacturing cost of the entire electronic device.

[0071] Since the cold plate 231 is arranged at the far end, the liquid inlet pipe and the liquid outlet pipe corresponding to the cold plate 231 will not interfere with the cables of the high-power device 110. Compared with setting the cold plate directly above the high-power device 110, the difficulty of the heat dissipation layout inside the electronic device can be reduced; moreover, since the cold plate 231 is arranged on one side of the high-power device 110, compared with being set directly above the high-power device 110, the distance between the cold plate 231 and the outer wall of the electronic device housing where the liquid inlet and outlet are arranged is shorter, thereby shortening the length of the liquid cooling pipeline inside the electronic device housing, and the spatial layout is more conducive to the diversion and drainage of liquid leakage from the cold plate.

[0072] As analyzed above, since the high-power device 110 is cooled by air and liquid with the cooperation of the first heat dissipation part 220 and the second heat dissipation part 230, the heat dissipation demand of the high-power device 110 is met in time, and the power of other heat dissipation equipment that requires electric drive, such as fans, can be reduced, thereby effectively saving resources and responding to the country's energy-saving policy requirements.

[0073] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.

[0074] The above description is only a preferred embodiment of the present application and is not intended to limit the scope of protection of the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application are included in the scope of protection of the present application.

Claims

1. An air-liquid hybrid heat dissipation device for high-power devices, characterized in that: The high-power device and the heat dissipation device are both located in a housing of the electronic device, and the heat dissipation device comprises: a heat conducting member and a first heat dissipation portion and a second heat dissipation portion that are spaced apart; The first heat dissipation portion includes at least one group of first air-cooled heat dissipation fins; The second heat dissipation unit includes at least one cold plate and at least one set of second air-cooled heat dissipation fins, wherein the at least one cold plate is spaced apart from the high-power device in a horizontal direction; The heat conducting member has a first end located between the first air-cooled heat sink fin and the high-power device; a second end having at least one heat conducting branch plate, the at least one heat conducting branch plate being capable of covering at least one surface of the at least one cold plate; the first end of the heat conducting member is capable of absorbing heat generated by the high-power device and conducting the heat to the multiple heat conducting branch plates at the second end of the heat conducting member; At least one group of the second air-cooled heat sink fins is located on a side of the at least one heat-conducting branch plate away from the cold plate; The first heat dissipation portion is used to dissipate heat from a first end of the heat conducting member, and the second heat dissipation portion is used to dissipate heat from a second end of the heat conducting member.

2. The air-liquid hybrid heat dissipation device for high-power devices according to claim 1, characterized in that: The air-liquid hybrid heat dissipation device further comprises a heat dissipation fan for conducting heat from the first heat dissipation part and the second heat dissipation part to the outside.

3. The air-liquid hybrid heat dissipation device for high-power devices according to claim 1, characterized in that: The air-liquid mixed heat dissipation device has a liquid-cooled cold source component; The liquid-cooled cold source assembly includes a first liquid inlet pipe, a first liquid outlet pipe and a cold source; One end of the first liquid inlet pipe is connected to the cold source, and the other end is connected to the liquid inlet of the cold plate; the cold source can provide cooling liquid to the cold plate through the first liquid inlet pipe; One end of the first liquid outlet pipe is connected to the liquid outlet of the cold plate, and the other end is used to discharge the cooling liquid after heat exchange in the cold plate.

4. The air-liquid hybrid heat dissipation device for high-power devices according to claim 1, characterized in that: The air-liquid mixed heat dissipation device has a liquid-cooled cold source component; The liquid-cooled cold source assembly includes a second liquid inlet pipe, a second liquid outlet pipe, a pump and a heat exchanger; The second liquid outlet pipe has one end connected to the liquid outlet of the cold plate and the other end connected to the inlet of the heat exchanger, and is used to transport the coolant after heat exchange in the cold plate to the heat exchanger for cooling; The second liquid inlet pipe has one end connected to the outlet of the heat exchanger and the other end connected to the liquid inlet of the cold plate; The pump is located between the outlet of the heat exchanger and the liquid inlet of the cold plate, and is used to transport the coolant cooled in the heat exchanger to the cold plate through the second liquid inlet pipe.

5. The air-liquid hybrid heat dissipation device for high-power devices according to claim 1, characterized in that: The first heat dissipation part further comprises a first heat exchange plate; the second heat dissipation part further comprises at least one second heat exchange plate group; each group of the second heat exchange plate groups is arranged in a one-to-one correspondence with the heat conduction branch plate; The first heat exchange plate is provided between the high-power device and the first end of the heat conducting member; Each second heat exchange plate group includes two second heat exchange plates, and the two second heat exchange plates are respectively located on both sides of the heat conduction branch plate along the height direction.

6. The air-liquid hybrid heat dissipation device for high-power devices according to claim 1, characterized in that: A leakage isolation plate is provided at the interval between the first heat dissipation part and the second heat dissipation part and at the side of the second heat dissipation part away from the first heat dissipation part. The leakage isolation plate is used to isolate the cold plate from the high-power device to prevent the coolant leaked from the cold plate from flowing to the high-power device.

7. The air-liquid hybrid heat dissipation device for high-power devices according to claim 1, 2, 5 or 6, characterized in that: The air-liquid mixed heat dissipation device also has a leakage collection component; The leakage collection assembly includes a liquid collecting trough, a diversion channel and a liquid discharge outlet; The liquid collecting tank is provided below the cold plate and is used to collect the coolant flowing out of the cold plate; One end of the guide channel is connected to the liquid outlet of the liquid collecting tank, and the other end is connected to the drainage outlet, and is used to discharge the cooling liquid in the liquid collecting tank to the outside through the drainage outlet.

8. The air-liquid hybrid heat dissipation device for high-power devices according to claim 7, characterized in that: The leakage collection assembly further comprises a leakage detection device, which is used to detect whether the cold plate is leaking.

9. The air-liquid hybrid heat dissipation device for high-power devices according to any one of claims 1 to 6, characterized in that: The air-liquid hybrid heat dissipation device also has a temperature detector and a temperature alarm device. The temperature detector is arranged on the high-power device, and the temperature detector is used to detect the temperature of the high-power device. The temperature alarm device is electrically connected to the temperature detector, and the temperature alarm is used to issue a warning based on the temperature value detected by the temperature detector.

10. An electronic device, characterized in that: include: An air-liquid hybrid heat dissipation device for high-power devices according to any one of claims 1 to 9.

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