Display panel, preparation method of display panel and electronic equipment

Abstract

The embodiment of the invention provides a display panel, a preparation method of the display panel and electronic equipment, and relates to the technical field of display, the display panel comprises a substrate, a plurality of first electrodes, a pixel defining layer and an isolation structure, the pixel defining layer is provided with a plurality of pixel openings, the pixel openings expose part of the first electrodes, and the isolation structure is arranged on the substrate. The pixel defining layer is provided with a partition part connected with the body part of the pixel defining layer on one side of the pixel opening along the first direction, the arrangement directions of the partition parts in the plurality of pixel openings are consistent, the isolation structure is enclosed to form a plurality of isolation openings, and the isolation openings are communicated with the corresponding pixel openings. According to the invention, at least part of the light-emitting function part can be separated at the separation part, so that the problem of crosstalk between adjacent light-emitting units is not easy to generate.

Description

Technical Field

[0001] The present application relates to the field of display technology, and more specifically, to a display panel, a method for manufacturing a display panel, and an electronic device. Background Art

[0002] Organic Light Emitting Diode (OLED) display technology is considered the most promising new display technology for the next generation. Compared with liquid crystal display technology, OLED display technology has advantages such as low energy consumption, low cost, self-luminescence, wide viewing angle, and fast response speed.

[0003] Traditionally, pixel patterning is achieved using a fine metal mask (FMM) during the production of OLED display panels. FMM technology is mature and boasts extensive mass production experience. However, it also suffers from limitations such as limited precision and high cost. FMM-free technology eliminates the limitations of traditional OLED processes on display size, resolution, and other performance characteristics, offering the advantages of high performance, full-scale scalability, and agile delivery. Patents CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A, and CN118660589A describe FMM-free technology for reference.

[0004] However, there are still some problems with display panels that need to be solved urgently. Summary of the Invention

[0005] In order to overcome the technical problems mentioned in the above technical background, an embodiment of the present application provides a display panel, wherein the display panel includes: substrate; a plurality of first electrodes, spaced apart and arranged on the substrate; a pixel defining layer located on one side of the substrate, the pixel defining layer being provided with a plurality of pixel openings, the pixel openings exposing a portion of the first electrode, the pixel defining layer being provided with a partition portion connected to a main portion of the pixel defining layer on one side of the pixel opening along a first direction, the partition portions in the plurality of pixel openings being arranged in a consistent direction; The isolation structure is located on a side of the pixel defining layer away from the substrate. The isolation structure encloses and forms a plurality of isolation openings, and the isolation openings are connected to the corresponding pixel openings.

[0006] In some possible implementations, along the thickness direction of the substrate, a partition gap is provided between a side of the partition portion close to the substrate and a side of the first electrode away from the substrate, and the partition gap is connected to the isolation opening. Preferably, the display panel further comprises a light-emitting unit, at least a portion of which is located within the isolation opening, the light-emitting unit comprising the first electrode and a light-emitting functional portion located on a side of the first electrode away from the substrate, and at least a portion of a functional layer of the light-emitting functional portion located within the same isolation opening is disconnected at the partition portion; Preferably, at least a portion of the orthographic projection of the partition portion on the substrate is located within the orthographic projection of the isolation opening on the substrate; Preferably, the display panel further comprises a sacrificial portion located between the first electrode and the partition portion; Preferably, the sacrificial portion, the first electrode and the partition portion enclose the partition gap; Preferably, the first direction includes a moving direction of an evaporation source for evaporating the luminescent material layer.

[0007] In some possible implementations, along the thickness direction of the substrate, the height of the sacrificial portion is equal to the height of the partition gap; Preferably, a side of the sacrificial portion close to the substrate contacts a side of the first electrode away from the substrate, and a side of the sacrificial portion away from the substrate contacts a side of the partition portion close to the substrate; Preferably, along the thickness direction of the substrate, the height of the partition gap is greater than or equal to 0.1 μm and less than or equal to 0.5 μm; Preferably, along the first direction, a distance between a side of the sacrificial portion facing the center of the isolation opening and a side of the partition portion facing the center of the isolation opening is greater than or equal to 0.2 μm and less than or equal to 0.4 μm.

[0008] In some possible implementations, the portion of the light-emitting functional portion separated by the partition portion is located within the partition gap; Preferably, there is a gap between the light-emitting functional portion and the sacrificial portion located in the partition gap.

[0009] In some possible implementations, an orthographic projection of the sacrificial portion on the substrate surrounds a portion of an orthographic projection of the pixel opening on the substrate.

[0010] In some possible implementations, the light-emitting functional portion includes a hole injection portion, and the hole injection portion is disconnected at the partition portion; Preferably, the light-emitting functional portion further comprises a hole transport portion located on a side of the hole injection portion away from the substrate, and the hole transport portion is disconnected at the partition portion; Preferably, the light-emitting functional portion further includes a light-emitting auxiliary portion located on a side of the hole transport portion away from the substrate, and the light-emitting auxiliary portion is disconnected at the partition portion.

[0011] In some possible implementations, a distance from a side of the partition portion away from the substrate to the substrate is greater than a distance from a side of the main body portion away from the substrate to the substrate; Preferably, along the thickness direction of the substrate, the thickness of the partition portion is equal to the thickness of the main body portion.

[0012] In some possible implementations, the orthographic projection of the partition portion on the substrate surrounds a portion of the orthographic projection of the isolation opening on the substrate; Preferably, the sidewall of the pixel opening includes a side of the partition portion facing the center of the isolation opening.

[0013] In some possible implementations, at least a portion of the light-emitting functional portion is spaced apart from the isolation structure on a side away from the partition portion; Preferably, the light-emitting functional portion includes a hole injection portion, and the hole injection portion is spaced apart from the isolation structure on a side away from the partition portion; Preferably, the light-emitting functional portion further comprises a hole transport portion located on a side of the hole injection portion away from the substrate, and a side of the hole transport portion away from the partition portion is spaced apart from the isolation structure; Preferably, the light-emitting functional portion further comprises a light-emitting auxiliary portion located on a side of the hole transport portion away from the substrate, and a side of the light-emitting auxiliary portion away from the partition portion is spaced apart from the isolation structure; Preferably, the light-emitting unit further comprises a second electrode located on a side of the light-emitting functional portion away from the substrate, and the second electrode extends to overlap with the isolation structure.

[0014] In some possible implementations, the display panel further includes: a plurality of light-emitting units, at least a portion of each of the light-emitting units being located within the isolation opening; a plurality of packaging units, each of the packaging units being located on a side of the corresponding light-emitting unit away from the substrate, and each of the packaging units extending from a side of the isolation structure toward the isolation opening to a side of the isolation structure away from the substrate; Preferably, the plurality of packaging units corresponding to the plurality of light-emitting units are arranged at intervals; Preferably, a gap exists between the packaging unit located on a side of the isolation structure away from the substrate and the side of the isolation structure away from the substrate.

[0015] In some possible implementations, the display panel further includes a second encapsulation layer located on a side of the encapsulation unit away from the substrate, and a third encapsulation layer located on a side of the second encapsulation layer away from the substrate; Preferably, the materials of the encapsulation unit and the third encapsulation layer both include inorganic materials; Preferably, the material of the second encapsulation layer includes organic material.

[0016] In some possible embodiments, the isolation structure includes a first isolation portion and a second isolation portion stacked sequentially in a direction away from the substrate, an orthographic projection of a side of the first isolation portion away from the substrate on the substrate is located within an orthographic projection of the second isolation portion on the substrate, an orthographic projection area of ​​a side of the first isolation portion away from the substrate on the substrate is smaller than an orthographic projection area of ​​the second isolation portion on the substrate, and the second electrode of the light-emitting unit is electrically connected to the first isolation portion; Preferably, the isolation structure further comprises a third isolation portion located on a side of the first isolation portion facing the substrate, and the second electrode of the light-emitting unit is electrically connected to the third isolation portion; Preferably, the material of the third isolation portion includes molybdenum or titanium; and / or the material of the first isolation portion includes aluminum, silver or copper; and / or the material of the second isolation portion includes titanium or molybdenum.

[0017] In some possible implementations, the present application further provides a method for preparing a display panel, the method comprising: providing a substrate; A plurality of first electrodes, a pixel defining layer and an isolation structure are formed on one side of the substrate, the pixel defining layer is provided with a plurality of pixel openings, the pixel openings exposing a portion of the first electrode, the pixel defining layer is provided with a partition portion connected to the main body of the pixel defining layer on one side of the pixel opening along the first direction, the partition portions in the plurality of pixel openings are arranged in the same direction, the isolation structure encloses a plurality of isolation openings, and the isolation openings are connected to the corresponding pixel openings.

[0018] In some possible implementations, the step of forming a plurality of first electrodes, a pixel defining layer, and an isolation structure spaced apart on one side of the substrate includes: forming a first electrode material layer and a sacrificial material layer in sequence on one side of the substrate; performing patterning on the sacrificial material layer and the first electrode material layer to form a plurality of sacrificial material portions and a plurality of first electrodes respectively. performing patterning on the plurality of sacrificial material portions to expose a portion of the first electrode; forming a pixel defining material layer and an isolation material layer in sequence on a side of the sacrificial material portion away from the substrate; performing patterning on the isolation material layer, the pixel defining material layer, and the sacrificial material portion in sequence to form an isolation structure, a pixel defining layer, and a sacrificial portion, respectively, wherein the sacrificial portion, the first electrode, and the partition portion enclose the partition gap, and the partition gap is connected to the isolation opening; Preferably, after the step of forming a plurality of first electrodes, a pixel defining layer and an isolation structure spaced apart on one side of the substrate, the method further comprises: Vapor-depositing a light-emitting material layer located on a side of the isolation structure away from the substrate and within the isolation opening in a direction toward one side of the partition portion; forming a second electrode material layer and a first packaging material layer in sequence on a side of the light-emitting material layer away from the substrate; The first packaging material layer, the second electrode material layer and the light-emitting material layer are patterned to form a light-emitting unit and a packaging unit located on a side of the light-emitting unit away from the substrate.

[0019] In some possible implementations, the present application further provides an electronic device, which includes the display panel described in the present application, or includes a display panel prepared by the method for preparing the display panel described in the present application.

[0020] Compared with the prior art, this application has the following beneficial effects: The present application provides a display panel, a method for preparing a display panel, and an electronic device. By setting a pixel defining layer to include a main body portion and a partition portion that are interconnected, at least a portion of the light-emitting functional portion can be isolated at the partition portion, thereby making it less likely for crosstalk to occur between adjacent light-emitting units, thereby improving the display effect of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0022] Figure 1A schematic cross-sectional view of a display panel including a partition portion provided in an embodiment of the present application; Figure 2 A schematic cross-sectional view of a display panel including a sacrificial portion provided in an embodiment of the present application; Figure 3 A schematic cross-sectional view of a substrate provided in an embodiment of the present application; Figure 4 A schematic structural diagram of a pixel circuit provided in an embodiment of the present application; Figure 5 A schematic diagram of a partial top view of a display panel provided in an embodiment of the present application; Figure 6 Provided in the embodiments of this application Figure 5 Schematic diagram of the cross section at AA in the middle; Figure 7 A schematic cross-sectional view of a light-emitting functional portion provided in an embodiment of the present application; Figure 8 A schematic cross-sectional view of a display panel provided in an embodiment of the present application in which a light-emitting functional portion is completely isolated by a partition portion; Figure 9 A cross-sectional schematic diagram of a display panel provided in an embodiment of the present application includes a packaging unit; Figure 10 A schematic cross-sectional view of a packaging unit including a gap space provided in an embodiment of the present application; Figure 11 A cross-sectional schematic diagram of a display panel provided in an embodiment of the present application including a second encapsulation layer and a third encapsulation layer; Figure 12 A schematic cross-sectional view of a display panel provided in an embodiment of the present application showing that the second electrode is further extended to overlap with the first isolation portion; Figure 13 A schematic flow chart of a method for manufacturing a display panel provided in an embodiment of the present application; Figure 14 A cross-sectional schematic diagram of sequentially forming a first electrode material layer and a sacrificial material layer on one side of a substrate provided in an embodiment of the present application; Figure 15 A schematic cross-sectional view of the sacrificial material layer and the first electrode material layer after patterning, respectively, according to an embodiment of the present application; Figure 16 A schematic cross-sectional view of patterning a plurality of sacrificial material portions to expose a portion of a first electrode according to an embodiment of the present application; Figure 17 A cross-sectional schematic diagram of sequentially forming a pixel defining material layer and an isolation material layer on a side of a sacrificial portion away from a substrate according to an embodiment of the present application; Figure 18A cross-sectional schematic diagram of sequentially patterning an isolation material layer, a pixel defining material layer, and a sacrificial material portion according to an embodiment of the present application; Figure 19 A cross-sectional schematic diagram of a light-emitting material layer located on a side of the isolation structure away from the substrate and within the isolation opening, which is evaporated toward one side of the partition portion, according to an embodiment of the present application; Figure 20 A cross-sectional schematic diagram of sequentially forming a second electrode material layer and a first encapsulation material layer on a side of the light-emitting material layer away from the substrate provided in an embodiment of the present application; Figure 21 A schematic cross-sectional view of the first packaging material layer, the second electrode material layer, and the light-emitting material layer after patterning according to an embodiment of the present application; Figure 22 A schematic diagram of the three-dimensional structure of an electronic device provided in an embodiment of the present application.

[0023] Figure numerals: 01, display panel; 100, electronic device; 1, substrate; 2, pixel defining layer; 21, main body; 22, partition portion; 201, first sublayer; 202, second sublayer; 2001, pixel opening; 3, isolation structure; 31, first isolation portion; 32, second isolation portion; 33, third isolation portion; 4, first electrode; 5, light-emitting functional portion; 51, hole injection portion; 52, hole transport portion; 53, light-emitting auxiliary portion; 54, light-emitting portion; 55, electron transport portion; 56 , electron injection part; 6, second electrode; 7, light-emitting unit; 8, partition gap; 9, isolation opening; 10, sacrificial part; 11, packaging unit; 12, gap space; 13, second packaging layer; 14, third packaging layer; 15, first electrode material layer; 16, sacrificial material layer; 17, sacrificial material part; 18, pixel defining material layer; 19, isolation material layer; 20, light-emitting material layer; 23, second electrode material layer; 24, first packaging material layer; 25, planarization layer; 26, pixel circuit. DETAILED DESCRIPTION

[0024] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0025] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without making any creative efforts shall fall within the scope of protection of the present application.

[0026] It should be noted that similar reference numerals and letters represent similar items in the following figures. Therefore, once an item is defined in one figure, it does not need to be further defined or explained in subsequent figures. It should be noted that different features in the embodiments of the present application can be combined with each other without conflict.

[0027] Furthermore, when terms such as "upper," "above," "lower," "below," and "relatively" are used to define the relative position of two elements, this includes not only a state in which the two elements are directly in contact but also a state in which the two elements are separated by a gap or other elements. Furthermore, terms such as "first," "second," and "third" are used solely for purposes of distinction and description and should not be construed as indicating or implying relative importance.

[0028] It should be noted that, in the absence of conflict, different features in the embodiments of the present application can be combined with each other.

[0029] Increasing the density of light-emitting units (i.e., pixel density) in display panels is an important approach to improving display quality. However, current display panels manufactured using fine metal evaporation mask (FMM) technology are currently unable to achieve further increases in light-emitting unit density due to technical limitations. The inventors have discovered, through extensive research, that to address this technical issue, isolation structures can be incorporated into some display panels. During the full-layer evaporation of the light-emitting layer and the second electrode, these can be disconnected at the isolation structures. Through multiple evaporation and etching processes (i.e., light-emitting unit patterning), light-emitting units of different colors can be formed in different isolation openings.

[0030] The display panel in the related art includes a substrate, an isolation structure located on one side of the substrate, and a light-emitting unit located in an isolation opening formed by the isolation structure. The light-emitting unit includes a light-emitting functional part, which is easily overlapped with the isolation structure, thereby easily causing lateral crosstalk between adjacent light-emitting units.

[0031] In order to solve the above-mentioned technical problems, the following technical solutions are innovatively designed. The specific implementation solutions of this application will be described in detail below with reference to the accompanying drawings. It should be noted that the defects existing in the solutions in the above-mentioned prior art are the results obtained after practice and careful study. Therefore, the discovery process of the above-mentioned technical problems and the solutions proposed in the following embodiments for the above-mentioned problems should all be contributions made to this application in the process of invention and creation, and should not be understood as technical contents known to those skilled in the art.

[0032] See Figure 1 This embodiment provides a display panel, which includes a substrate 1, a pixel defining layer 2, an isolation structure 3 and a plurality of light-emitting units 7.

[0033] The display panel may be an organic light emitting diode (OLED) display panel or a quantum dot light emitting diode (QLED) display panel, and the display panel includes a display area with a display function and a non-display area.

[0034] The display area of ​​the display panel may be in a rectangular shape, or in other shapes such as a square, a circle, or an ellipse.

[0035] See Figure 2 The substrate 1 includes a pixel circuit layer and a planarization layer 25. The pixel circuit layer includes a pixel circuit 26 for driving the light-emitting unit 7 to emit light. Figure 2 The transistors in the pixel circuit 26 are shown. Vias are provided in the planarization layer 25, and the first electrode 4 of the light-emitting unit 7 is electrically connected to the transistors in the pixel circuit layer through the vias. Furthermore, the pixel circuit layer includes at least one insulating layer, which can include at least one of an inorganic layer and an organic layer. Furthermore, the substrate 1 includes scan lines that provide scan signals Scan and data lines that provide data signals Data to the pixel circuit 26.

[0036] See Figure 3 The pixel circuit 26 includes a driving transistor T1 and a data transistor T2. The first electrode of the data transistor T2 is connected to a data line providing a data signal Data, the gate of the data transistor T2 is connected to a scan line providing a scan signal Scan, the second electrode of the data transistor T2 is connected to the gate of the driving transistor T1, the two ends of the storage capacitor C1 are respectively connected to the gate and the first electrode of the driving transistor T1, and the second electrode of the driving transistor T1 is connected to the light-emitting unit 7. Figure 3 This is an embodiment of the pixel circuit 26. The pixel circuit 26 of the present application is not limited to Figure 3The 2T1C pixel circuit 26 shown may also be other pixel circuits 26 , such as a 7T1C, 8T1C pixel circuit 26 , etc.

[0037] The pixel defining layer 2 is located on one side of the substrate 1 and is provided with a plurality of pixel openings 2001 . The pixel defining layer 2 is provided with a partition portion 22 connected to the main portion 21 of the pixel defining layer 2 on one side of the pixel openings 2001 along the first direction.

[0038] The isolation structure 3 is located on a side of the pixel defining layer 2 away from the substrate 1 . The isolation structure 3 encloses a plurality of isolation openings 9 , which are connected to the corresponding pixel openings 2001 .

[0039] The display panel also includes a light-emitting unit 7, at least part of which is located in the isolation opening 9. The light-emitting unit 7 includes a first electrode 4 and a light-emitting functional portion 5 located on the side of the first electrode 4 away from the substrate 1. The pixel opening 2001 exposes part of the first electrode 4, and at least part of the functional layer in the light-emitting functional portion 5 located in the same isolation opening 9 is disconnected at the partition portion 22.

[0040] The carriers can flow through the functional layer of the light-emitting functional part 5. When the light-emitting material layer is formed, at least part of the light-emitting material layer will be disconnected at the partition part 22. At least part of the functional layer of the light-emitting functional part 5 finally formed will be disconnected at the partition part 22. In this way, the carriers flowing through the light-emitting functional part 5 are not easily transferred to the isolation structure 3, so that it is not easy to cause lateral leakage between adjacent light-emitting units 7, that is, it is not easy to cause crosstalk between adjacent light-emitting units 7, thereby improving the display effect of the display panel.

[0041] Based on the above design, this embodiment sets the pixel defining layer 2 to include a main body portion 21 and a partition portion 22 that are interconnected, so that at least part of the light-emitting functional portion 5 can be isolated at the partition portion 22, thereby making it less likely for crosstalk to occur between adjacent light-emitting units 7, thereby improving the display effect of the display panel.

[0042] For some possible implementations, see again Figure 1 The light-emitting unit 7 also includes a second electrode 6 located on the side of the light-emitting functional portion 5 away from the substrate 1. The second electrode 6 extends to overlap the isolation structure 3. The pixel opening 2001 is connected to the isolation opening 9. The orthographic projection of the pixel opening 2001 on the substrate 1 is located within the orthographic projection of the isolation opening 9 on the substrate 1. The orthographic projection area of ​​the pixel opening 2001 on the substrate 1 is smaller than the orthographic projection area of ​​the isolation opening 9 on the substrate 1.

[0043] The provision of the isolation structure 3 enables the display panel to form film layers of light-emitting units 7 of different colors in different isolation openings 9 without the need for a fine mask. Specifically, when forming the light-emitting material layer, the light-emitting material layer is separated by the isolation structure 3 to form a plurality of spaced light-emitting functional units 5. When forming the second electrode material layer, the second electrode material layer is separated by the isolation structure 3 to form a plurality of spaced second electrodes 6. The isolation structure 3 includes a conductive material, and the second electrodes 6 are electrically connected to the isolation structure 3. One first electrode 4, one light-emitting functional unit 5, and one second electrode 6 form one light-emitting unit 7. The first electrode 4 can be an anode, and the second electrode 6 can be a cathode.

[0044] In this way, different light-emitting units 7 can be made independent of each other, thereby reducing crosstalk between adjacent light-emitting units 7 and improving the display effect of the display panel. At the same time, due to the presence of the isolation structure 3, the light-emitting material layer and the second electrode material layer 23 in the light-emitting unit 7 of each color in the display panel can be first prepared on the entire surface and then patterned, thereby eliminating the need for a fine mask and further reducing the production cost of the display panel.

[0045] The plurality of isolation openings 9 include a plurality of first isolation openings, a plurality of second isolation openings, and a plurality of third isolation openings. A plurality of light-emitting units 7 are located on one side of the substrate 1, and the light-emitting units 7 include a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit that emit different luminous colors. For example, the first light-emitting unit may emit blue, the second light-emitting unit may emit green, and the third light-emitting unit may emit red. The first light-emitting unit, the second light-emitting unit, and the third light-emitting unit each include a first electrode 4, a light-emitting functional unit 5, and a second electrode 6 that are stacked. The first electrode 4 is disposed on the substrate 1, and the pixel defining layer 2 covers the end of the first electrode 4. The pixel defining layer 2 is provided with a pixel opening 2001, through which the first electrode 4 is exposed. The light-emitting functional units 5 of the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit cover the sidewalls of the pixel opening 2001 of the pixel defining layer 2 and the side of the pixel defining layer 2 facing away from the substrate 1. Each light-emitting functional unit 5 is located within the pixel opening 2001 and in contact with the first electrode 4.

[0046] The first light-emitting unit is arranged corresponding to the first isolation opening, the second light-emitting unit is arranged corresponding to the second isolation opening, and the third light-emitting unit is arranged corresponding to the third isolation opening. In one embodiment, one light-emitting unit 7 is arranged corresponding to one isolation opening 9, for example, the first light-emitting unit is arranged in a one-to-one correspondence with the first isolation opening, the second light-emitting unit is arranged in a one-to-one correspondence with the second isolation opening, and the third light-emitting unit is arranged in a one-to-one correspondence with the third isolation opening. At least part of the first light-emitting unit is arranged in the corresponding first isolation opening, at least part of the second light-emitting unit is arranged in the corresponding second isolation opening, and at least part of the third light-emitting unit is arranged in the corresponding third isolation opening. In another embodiment, multiple light-emitting units 7 are arranged corresponding to one isolation opening 9, for example, multiple light-emitting units 7 with the same light-emitting color are arranged corresponding to one isolation opening 9.

[0047] Furthermore, the pixel defining layer 2 is provided with a first pixel opening connected to the first isolation opening, a second pixel opening connected to the second isolation opening, and a third pixel opening connected to the third isolation opening. The areas of the orthographic projections of the first pixel opening, the second pixel opening, and the third pixel opening on the substrate 1 are the same or different. The shape of the orthographic projections of the pixel opening 2001 and the corresponding isolation opening 9 on the substrate 1 may be the same or different. Generally speaking, the area of ​​the orthographic projection of the isolation opening 9 on the substrate 1 is larger than the area of ​​the orthographic projection of the pixel opening 2001 connected to the isolation opening 9 on the substrate 1. The orthographic projection of the pixel opening 2001 of the light-emitting unit 7 on the substrate 1 overlaps with the orthographic projection of the isolation opening 9 on the substrate 1. The material of the pixel defining layer 2 is an inorganic material. For example, the pixel defining layer 2 is formed using at least one inorganic insulating material selected from silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiON).

[0048] In one embodiment, see Figure 4 The pixel defining layer 2 includes multiple sub-layers, and the multiple sub-layers include a first sub-layer 201 and a second sub-layer 202 stacked in sequence in a direction away from the substrate 1, that is, the pixel defining layer 2 can adopt a double-layer design.

[0049] For example, the first sub-layer 201 has better film-forming properties than the second sub-layer 202. That is, under conditions of equal thickness, the first sub-layer 201 can better cover the step structure formed by the first electrode 4 than the second sub-layer 202, without generating cracks. Conversely, to achieve the same step coverage effect, the thickness of the first sub-layer 201 is required to be thinner than that of the second sub-layer 202. In other words, the thickness requirement for the first sub-layer 201 is relatively low, which is conducive to thinning the product. In addition, good film-forming properties are reflected in the good coverage of the formed film, which is more dense and more conducive to isolating water vapor.

[0050] For example, the second sublayer 202 has better etching resistance than the first sublayer 201. Since the side of the pixel defining layer 2 facing away from the substrate 1 is etched during the display panel manufacturing process, by selecting a material with stronger etching resistance as the second sublayer 202, the etching resistance of the pixel defining layer 2 can be improved, further improving the reliability of the display panel.

[0051] Exemplarily, the first sub-layer 201 and the second sub-layer 202 are made of different materials. For example, the first sub-layer 201 is made of silicon nitride, and the second sub-layer 202 is made of silicon oxide.

[0052] The second electrodes 6 of the first, second, and third light-emitting units respectively cover the corresponding light-emitting functional parts 5. The second electrodes 6 are electrically connected to the isolation structure 3. The first electrodes 4 of each light-emitting unit 7 can be connected to the pixel circuit 26 through a via, so that the pixel circuit 26 drives the corresponding light-emitting unit 7 to emit light.

[0053] The first electrode 4 can have a multilayer structure. For example, the first electrode 4 may include a reflective layer and a pair of conductive oxide layers covering the upper and lower surfaces of the reflective layer, respectively. The reflective layer can be formed using, for example, a metal material with excellent light reflectivity, such as silver. Each conductive oxide layer can be formed using, for example, a transparent conductive oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), or IGZO (Indium Gallium Zinc Oxide). The second electrode 6 can be formed using, for example, a metal material such as a magnesium and silver alloy (MgAg).

[0054] To enable the light-emitting functional portion 5 to emit light, a pixel voltage is supplied to the first electrode 4 and a common voltage is supplied to the second electrode 6, respectively. This creates a potential difference between the first electrode 4 and the second electrode 6, causing the light-emitting functional portion 5 disposed therebetween to emit light. In one embodiment, if a potential difference is formed between the first electrode 4 and the second electrode 6 of a first light-emitting unit, the light-emitting material layer of the light-emitting functional portion 5 emits blue light. If a potential difference is formed between the first electrode 4 and the second electrode 6 of a second light-emitting unit, the light-emitting material layer of the light-emitting functional portion 5 emits green light. If a potential difference is formed between the first electrode 4 and the second electrode 6 of a third light-emitting unit, the light-emitting material layer of the light-emitting functional portion 5 emits red light.

[0055] The pixel voltage of the first electrode 4 is provided by the pixel circuit 26, and the common voltage of the second electrode 6 is provided by the isolation structure 3. Specifically, the second electrode 6 is electrically connected to the isolation structure 3. By providing the common voltage to the isolation structure 3, the common voltage is supplied to the second electrode 6. In other words, the isolation structure 3 has the function of supplying the common voltage to the second electrode 6.

[0056] For some possible implementations, see Figure 5 and Figure 6 Along the thickness direction of the substrate 1, there is a partition gap 8 between the side of the partition portion 22 close to the substrate 1 and the side of the first electrode 4 away from the substrate 1. The partition gap 8 is connected to the isolation opening 9, and at least part of the functional layer of the light-emitting functional portion 5 located in the same isolation opening 9 is disconnected at the partition portion 22.

[0057] The partition portion 22 and the main body portion 21 are integrally formed, and the partition portion 22 extends to the side of the first electrode 4 away from the substrate 1. Along the thickness direction Z of the substrate 1, there is a partition gap 8 between the partition portion 22 and the first electrode 4. At least part of the partition portion 22 is in a suspended state, so that the partition portion 22 can isolate the light-emitting functional portion 5.

[0058] Optionally, the display panel further includes a sacrificial portion 10 located between the first electrode 4 and the partition portion 22 , and the sacrificial portion 10 , the first electrode 4 and the partition portion 22 form a partition gap 8 .

[0059] Optionally, the sacrificial part 10 may be made of a metal material or an inorganic material.

[0060] The sacrificial portion 10 can raise the partition portion 22 , thereby making it easier to form the partition gap 8 between the partition portion 22 and the first electrode 4 , thereby improving the partitioning effect of the partition portion 22 on the light-emitting functional portion 5 .

[0061] Optionally, the orthographic projection of at least part of the partition portion 22 on the substrate 1 is located within the orthographic projection of the isolation opening 9 on the substrate 1 .

[0062] In this way, the partitioning portion 22 can more easily partition the light-emitting functional portion 5 located in the isolation opening 9 .

[0063] Optionally, the first direction X includes the moving direction of the evaporation source of the evaporated luminescent material layer, that is, the partition portion 22 and the main body portion 21 of the luminescent functional portion 5 are connected in a direction parallel to the substrate 1, and after the luminescent material layer is separated by the partition portion 22, the luminescent functional portion 5 located in the isolation opening 9 is formed.

[0064] For some possible implementations, see again Figure 6 Along the thickness direction Z of the substrate 1 , the height of the sacrificial portion 10 is equal to the height of the partition gap 8 .

[0065] Optionally, the side of the sacrificial portion 10 close to the substrate 1 contacts the side of the first electrode 4 away from the substrate 1 , and the side of the sacrificial portion 10 away from the substrate 1 contacts the side of the partition portion 22 close to the substrate 1 .

[0066] Since the partition gap 8 between the partition portion 22 and the first electrode 4 is formed by the sacrificial portion 10 , the sacrificial portion 10 contacts both the first electrode 4 and the partition portion 22 , and the height of the sacrificial portion 10 is equal to the height of the partition gap 8 .

[0067] Optionally, along the thickness direction Z of the substrate 1 , the height H of the partition gap 8 is greater than or equal to 0.1 μm and less than or equal to 0.5 μm. For example, the height H may be 0.1 μm, 0.2 μm, 0.3 μm, 0.4 μm, or 0.5 μm.

[0068] Optionally, along the first direction X, a distance W between a side of the sacrificial portion 10 facing the center of the isolation opening 9 and a side of the partition portion 22 facing the center of the isolation opening 9 is greater than or equal to 0.2 μm and less than or equal to 0.4 μm. For example, the distance W may be 0.2 μm, 0.25 μm, 0.3 μm, 0.35 μm, or 0.4 μm.

[0069] By reasonably setting the height H and the distance W, it is possible to effectively isolate at least the film layer that transfers carriers in the light-emitting functional part 5 without isolating the second electrode 6. In this way, without affecting the transmission of the second electrode 6 signal through the isolation structure 3, the path for the carriers in the light-emitting functional part 5 to be transferred to the isolation structure 3 can be effectively blocked, thereby effectively improving the problem of crosstalk between adjacent light-emitting units 7.

[0070] For some possible implementations, see again Figure 6 The portion of the light-emitting functional portion 5 partitioned by the partition portion 22 is located within the partition gap 8 .

[0071] Optionally, there is a gap between the light-emitting functional portion 5 and the sacrificial portion 10 located in the partition gap 8 .

[0072] The portion of the light-emitting functional portion 5 that is blocked by the blocking portion 22 extends into the blocking gap 8. The light-emitting functional portion 5 that extends into the blocking gap 8 generally does not completely fill the blocking gap 8. Therefore, a gap exists between the light-emitting functional portion 5 located within the blocking gap 8 and the sacrificial portion 10. This allows the light-emitting functional portion 5 to be blocked more effectively.

[0073] For some possible implementations, see Figure 6 and Figure 7 The light-emitting functional portion 5 includes a hole injection portion 51, a hole transport portion 52, a light-emitting auxiliary portion 53, a light-emitting portion 54, an electron transport portion 55 and an electron injection portion 56, which are stacked in sequence along a direction away from the substrate 1. The first electrode 4 is located on the side of the hole injection portion 51 close to the substrate 1, and the second electrode 6 is located on the side of the electron injection portion 56 away from the substrate 1.

[0074] Among them, the carriers mainly flow through the hole injection part 51, the hole transport part 52, and the light-emitting auxiliary part 53 in the light-emitting functional part 5, so that the crosstalk between adjacent light-emitting units 7 is mainly caused by the carriers flowing through the hole injection part 51, the hole transport part 52, and the light-emitting auxiliary part 53 being transferred to the isolation structure 3.

[0075] Therefore, the hole injection portion 51 is disconnected at the partition portion 22. In this way, the carriers flowing through the hole transport portion 52 are not easily transferred to the isolation structure 3, thereby improving the problem of lateral leakage between adjacent light-emitting units 7.

[0076] Optionally, the hole transport portion 52 is disconnected at the partition portion 22. In this way, carriers flowing through the hole transport portion 52 are not easily transferred to the isolation structure 3, thereby improving the problem of lateral leakage between adjacent light-emitting units 7.

[0077] Optionally, the light-emitting auxiliary portion 53 is disconnected at the partition portion 22. In this way, carriers flowing through the light-emitting auxiliary portion 53 are not easily transferred to the isolation structure 3, thereby improving the problem of lateral leakage between adjacent light-emitting units 7.

[0078] For some possible implementations, see again Figure 6 and Figure 7 At least a portion of the light-emitting functional portion 5 that is away from the partition portion 22 is spaced apart from the isolation structure 3 .

[0079] Along the direction of evaporation of the light-emitting material layer, when evaporating the light-emitting material layer, the light-emitting material layer is evaporated toward one side of the partition portion 22. The light-emitting material layer that is easily overlapped with the isolation structure 3 can be isolated by the partition portion 22. Therefore, the carriers flowing through the light-emitting functional portion 5 are not easily transferred to the isolation structure 3 through the side of the light-emitting functional portion 5 close to the partition portion 22.

[0080] Since the light-emitting material layer is evaporated onto one side of the partition portion 22, the side of the finally formed light-emitting functional portion 5 away from the partition portion 22 is not easy to overlap with the isolation structure 3, and the carriers flowing through the light-emitting functional portion 5 are not easy to be transferred to the isolation structure 3 through the side of the light-emitting functional portion 5 away from the partition portion 22, thereby making it difficult for the carriers flowing through the entire light-emitting functional portion 5 to be transferred to the isolation structure 3, thereby effectively improving the problem of lateral leakage between adjacent light-emitting units 7.

[0081] Optionally, the hole injection portion 51 is spaced apart from the isolation structure 3 on a side away from the partition portion 22 .

[0082] When the hole injection material layer is evaporated, the hole injection material layer is evaporated toward one side of the partition portion 22. The hole injection portion 51 that is easily overlapped with the isolation structure 3 can be isolated through the partition portion 22. Therefore, the carriers flowing through the hole injection portion 51 are not easily transferred to the isolation structure 3 through the side of the hole injection portion 51 close to the partition portion 22.

[0083] Since the hole injection material layer is evaporated on one side of the partition part 22, the side of the hole injection part 51 formed finally away from the partition part 22 is not easy to overlap with the isolation structure 3, and the carriers flowing through the hole injection part 51 are not easy to be transferred to the isolation structure 3 through the side of the hole injection part 51 away from the partition part 22, so that the carriers flowing through the entire hole injection part 51 are not easy to be transferred to the isolation structure 3, thereby effectively improving the problem of lateral leakage between adjacent light-emitting units 7.

[0084] Optionally, the hole transport portion 52 is spaced apart from the isolation structure 3 on a side away from the partition portion 22 .

[0085] When the hole transport material layer is evaporated, the hole transport material layer is evaporated toward one side of the partition portion 22. The hole transport portion 52 that is easily overlapped with the isolation structure 3 can be isolated by the partition portion 22. Therefore, the carriers flowing through the hole transport portion 52 are not easily transferred to the isolation structure 3 through the side of the hole transport portion 52 close to the partition portion 22.

[0086] Since the hole transport material layer is evaporated onto one side of the partition portion 22, the side of the hole transport portion 52 finally formed away from the partition portion 22 is not easy to overlap with the isolation structure 3, and the carriers flowing through the hole transport portion 52 are not easy to be transferred to the isolation structure 3 through the side of the hole transport portion 52 away from the partition portion 22, so that the carriers flowing through the entire hole transport portion 52 are not easy to be transferred to the isolation structure 3, thereby effectively improving the problem of lateral leakage between adjacent light-emitting units 7.

[0087] Optionally, the light-emitting auxiliary portion 53 is spaced apart from the isolation structure 3 on a side away from the partition portion 22 .

[0088] When evaporating the light-emitting auxiliary material layer, the light-emitting auxiliary material layer is evaporated toward one side of the partition portion 22. The light-emitting auxiliary portion 53 that is easily overlapped with the isolation structure 3 can be isolated through the partition portion 22. Therefore, the carriers flowing through the light-emitting auxiliary portion 53 are not easily transferred to the isolation structure 3 through the side of the light-emitting auxiliary portion 53 close to the partition portion 22.

[0089] Since the light-emitting auxiliary material layer is evaporated onto one side of the partition part 22, the side of the light-emitting auxiliary part 53 formed finally is not easy to overlap with the isolation structure 3 away from the partition part 22, and the carriers flowing through the light-emitting auxiliary part 53 are not easy to be transferred to the isolation structure 3 through the side of the light-emitting auxiliary part 53 away from the partition part 22, so that the carriers flowing through the entire light-emitting auxiliary part 53 are not easy to be transferred to the isolation structure 3, thereby effectively improving the problem of lateral leakage between adjacent light-emitting units 7.

[0090] For some possible implementations, see again Figure 5 The orthographic projection of the sacrificial portion 10 on the substrate 1 surrounds the orthographic projection of a portion of the pixel opening 2001 on the substrate 1 .

[0091] Optionally, the orthographic projection of the partition portion 22 on the substrate 1 surrounds the orthographic projection of part of the isolation opening 9 on the substrate 1 .

[0092] The sacrificial portion 10 can form a partition portion 22. Therefore, the orthographic projection of the sacrificial portion 10 on the substrate 1 is arranged to surround the orthographic projection of a portion of the pixel opening 2001 on the substrate 1, so that the orthographic projection of the partition portion 22 on the substrate 1 surrounds the orthographic projection of a portion of the isolation opening 9 on the substrate 1. In this way, along the direction of evaporation of the light-emitting material layer, the partition portion 22 is provided on one side of the isolation opening 9, while not provided on the other side. During evaporation of the light-emitting material layer, the light-emitting material layer is deposited toward one side of the partition portion 22. The partition portion 22 can isolate the light-emitting material layer that is easily overlapped with the isolation structure 3, while the other side of the light-emitting material layer is less likely to overlap with the isolation structure 3. This prevents carriers flowing through the light-emitting functional portion 5 from being transferred to the isolation structure 3.

[0093] Optionally, the sidewall of the pixel opening 2001 includes a side of the partition portion 22 facing the center of the isolation opening 9. The side of the partition portion 22 facing the center of the isolation opening 9 is a part of the sidewall of the pixel opening 2001, so that the partition portion 22 can more easily isolate the light-emitting functional portion 5.

[0094] In some possible implementations, the distance between the side of the partition portion 22 away from the substrate 1 and the substrate 1 is greater than the distance between the side of the main body portion 21 away from the substrate 1 and the substrate 1 . Optionally, along the thickness direction Z of the substrate 1 , the thickness of the partition portion 22 is equal to the thickness of the main body portion 21 .

[0095] In this embodiment, the partition portion 22 is formed by the entire pixel definition layer 2 , so that the partitioning effect of the partition portion 22 on the light-emitting functional portion 5 can be improved.

[0096] In some embodiments, see Figure 8The light-emitting functional part 5 is completely disconnected at the partition part 22 , that is, the partition part 22 can completely isolate the light-emitting functional part 5 , so that the carriers flowing through the light-emitting functional part 5 are less likely to be transferred to the isolation structure 3 .

[0097] For some possible implementations, see Figure 9 The display panel also includes a plurality of packaging units 11, which are located on the side of the corresponding light-emitting unit 7 away from the substrate 1, and part of the packaging unit 11 extends from the side of the isolation structure 3 toward the isolation opening 9 to the side of the isolation structure 3 away from the substrate 1.

[0098] Optionally, the multiple encapsulation units 11 corresponding to the multiple light-emitting units 7 are arranged at intervals.

[0099] Optionally, a gap exists between the packaging unit 11 located on the side of the isolation structure 3 away from the substrate 1 and the side of the isolation structure 3 away from the substrate 1 .

[0100] During the patterning process of the light-emitting unit 7 , the first packaging material layer 24 is disconnected at the isolation structure 3 to form the packaging unit 11 . The packaging unit 11 can completely and independently package the corresponding light-emitting unit 7 , thereby improving the display characteristics of the display panel.

[0101] The multiple packaging units 11 include multiple first packaging units corresponding to the multiple first light-emitting units, multiple second packaging units corresponding to the multiple second light-emitting units, and multiple third packaging units corresponding to the multiple third light-emitting units. The first packaging unit is arranged on the side of the corresponding first light-emitting unit away from the substrate 1, the second packaging unit is arranged on the side of the corresponding second light-emitting unit away from the substrate 1, and the third packaging unit is arranged on the side of the corresponding third light-emitting unit away from the substrate 1.

[0102] For example, see Figure 10 The packaging unit 11 includes a first segment and a second segment that are connected to each other. The first segment is located in the isolation opening 9 and is arranged on the side of the light-emitting unit 7 facing away from the substrate 1. The second segment is located on the side of the isolation structure 3 facing the isolation opening 9. The side surface of the first segment facing away from the substrate 1 and the side surface of the second segment facing away from the isolation structure 3 are at least partially connected to each other to enclose a gap space 12.

[0103] For example, see again Figure 9 The surface of the first segment facing away from the substrate 1 and the surface of the second segment facing away from the isolation structure 3 may also not be connected.

[0104] For some possible implementations, see Figure 11 The display panel further includes a second encapsulation layer 13 located on a side of the encapsulation unit 11 away from the substrate 1 , and a third encapsulation layer 14 located on a side of the second encapsulation layer 13 away from the substrate 1 .

[0105] Optionally, the materials of the encapsulation unit 11 and the third encapsulation layer 14 both include inorganic materials.

[0106] Optionally, the material of the second encapsulation layer 13 includes an organic material.

[0107] For example, the encapsulation unit 11 and the third encapsulation layer 14 can be formed by chemical vapor deposition (CVD), and the second encapsulation layer 13 can be formed by inkjet printing (IJP). The second encapsulation layer 13 and the third encapsulation layer 14 can provide a better encapsulation effect on the light-emitting unit 7, thereby further improving the encapsulation quality of the display panel.

[0108] Specifically, the material of the encapsulation unit 11 and the third encapsulation layer 14 includes at least one of silicon nitride (SiN), silicon oxide (SiO), and silicon oxynitride (SiON). The second encapsulation layer 13 is an organic insulating material, such as epoxy resin, acrylic resin, or other resin material.

[0109] For some possible implementations, see again Figure 10 The isolation structure 3 includes a first isolation portion 31 and a second isolation portion 32 stacked in sequence in a direction away from the substrate 1. The orthographic projection of the side of the first isolation portion 31 away from the substrate 1 on the substrate 1 is located within the orthographic projection of the second isolation portion 32 on the substrate 1. The orthographic projection area of ​​the side of the first isolation portion 31 away from the substrate 1 on the substrate 1 is smaller than the orthographic projection area of ​​the second isolation portion 32 on the substrate 1. The second electrode 6 of the light-emitting unit 7 is electrically connected to the first isolation portion 31.

[0110] Because the second isolating portion 32 is located on the side of the first isolating portion 31 away from the substrate 1, and the lateral width of the second isolating portion 32 is greater than the lateral width of the first isolating portion 31, the two ends of the second isolating portion 32 are arranged to protrude relative to the side surfaces of the first isolating portion 31. This shape of the isolating structure 3 is also called an overhanging shape. Therefore, the second isolating portion 32 disconnects the light-emitting material layer and the second electrode material layer 23 at the isolating structure 3. In this way, the isolating structure 3 formed by the first isolating portion 31 and the second isolating portion 32 can more easily enable the independent packaging of each light-emitting unit 7, thereby improving the packaging yield of the display panel.

[0111] The first isolation portion 31 and the second isolation portion 32 are made of different materials, and the etching rate of the second isolation portion 32 is lower than that of the first isolation portion 31. The material of the first isolation portion 31 includes a conductive material, specifically at least one of aluminum (Al) and an aluminum alloy. The aluminum alloy may include at least one of aluminum-neodymium alloy (AlNd), aluminum-yttrium alloy (AlY), or aluminum-silicon alloy (AlSi). The second isolation portion 32 may have a single-layer structure or a multi-layer structure. If the second isolation portion 32 has a single-layer structure, the material of the second isolation portion 32 may include at least one of titanium, titanium nitride, molybdenum, tungsten, a molybdenum-tungsten alloy, or a molybdenum-niobium alloy.

[0112] Please see again Figure 10 In the case where the second isolation portion 32 has a multi-layer structure, one layer of the second isolation portion 32 may be made of at least one of titanium, titanium nitride, molybdenum, tungsten, a molybdenum-tungsten alloy, or a molybdenum-niobium alloy, and another layer of the second isolation portion 32 may be made of a conductive oxide or an inorganic insulating material, such as an indium tin oxide (ITO) or indium zinc oxide (IZO).

[0113] Preferably, see again Figure 11 The isolation structure 3 further includes a third isolation portion 33 located on a side of the first isolation portion 31 facing the substrate 1 , and the second electrode 6 of the light emitting unit 7 is electrically connected to the third isolation portion 33 .

[0114] Preferably, the material of the third isolation portion 33 includes molybdenum or titanium; and / or the material of the first isolation portion 31 includes aluminum, silver or copper; and / or the material of the second isolation portion 32 includes titanium or molybdenum.

[0115] The third isolation portion 33 is provided to protrude relative to the first isolation portion 31 in a direction toward the center of the isolation opening 9. The orthographic projection of the first isolation portion 31 on the substrate 1 is located within the orthographic projection of the third isolation portion 33 on the substrate 1. The material of the third isolation portion 33 may include at least one of molybdenum (Mo), titanium (Ti), titanium nitride (TiN), molybdenum-tungsten alloy (MoW), or molybdenum-niobium alloy (MoNb).

[0116] When the isolation structure 3 includes a three-layer structure of a first isolation portion 31, a second isolation portion 32, and a third isolation portion 33, the second electrode 6 can extend to the side surface of the third isolation portion 33 facing away from the substrate 1 to be connected to the third isolation portion 33. At this time, the second electrode 6 can be connected to the first isolation portion 31 or not.

[0117] In some embodiments, see again Figure 11 The second electrode 6 extends to a surface of the third isolation portion 33 facing away from the substrate 1 , and the second electrode 6 is not connected to the first isolation portion 31 .

[0118] In other embodiments, see Figure 12 The second electrode 6 extends to a surface of the third isolation portion 33 facing away from the substrate 1 , and the second electrode 6 is connected to the first isolation portion 31 .

[0119] The display panel may further include at least one film layer such as a touch layer, a polarizing layer, and a protective cover plate. The film layer may also be bonded to the display panel via an adhesive layer such as an OCA (Optical Clear Adhesive).

[0120] For some possible implementations, see Figure 13 , the present application also provides a method for preparing a display panel, the method comprising: S10: providing a substrate 1.

[0121] S11: A first electrode 4, a pixel defining layer 2 and an isolation structure 3 are formed on one side of the substrate 1, a plurality of pixel openings 2001 are provided on the pixel defining layer 2, the pixel openings 2001 expose part of the first electrode 4, and the pixel defining layer 2 is provided with a partition portion 22 interconnected with the main body portion 21 on one side of the pixel opening 2001 along the first direction. The partition portions 22 in the plurality of pixel openings 2001 are arranged in the same direction, and the isolation structure 3 encloses a plurality of isolation openings 9, which are connected to the corresponding pixel openings 2001.

[0122] In the display panel formed by the above method, when the light-emitting material layer is formed, at least part of the light-emitting material layer will be disconnected at the partition portion 22, and at least part of the light-emitting functional portion 5 finally formed will be disconnected at the partition portion 22. In this way, the carriers flowing through the light-emitting functional portion 5 are not easily transferred to the isolation structure 3, so that it is not easy to cause lateral leakage between adjacent light-emitting units 7, that is, it is not easy to cause crosstalk between adjacent light-emitting units 7, thereby improving the display effect of the display panel.

[0123] In some possible implementations, the step of forming the first electrode 4, the pixel defining layer 2, and the isolation structure 3 on one side of the substrate 1 includes: See Figure 14 , a first electrode material layer 15 and a sacrificial material layer 16 are sequentially formed on one side of the substrate 1 .

[0124] See Figure 15 The sacrificial material layer 16 and the first electrode material layer 15 are patterned to form a plurality of sacrificial material portions 17 and a plurality of first electrodes 4 that are spaced apart from each other.

[0125] The plurality of sacrificial material portions 17 correspond one-to-one to the plurality of first electrodes 4 , and the orthographic projections of the sacrificial material portions 17 on the substrate 1 coincide with the orthographic projections of the first electrodes 4 on the substrate 1 .

[0126] See Figure 16 , the plurality of sacrificial material portions 17 are patterned to expose portions of the first electrodes 4 .

[0127] At this time, the orthographic projection of the sacrificial material portion 17 on the substrate 1 is located within the orthographic projection of the first electrode 4 on the substrate 1 .

[0128] See Figure 17 A pixel defining material layer 18 and an isolation material layer 19 are sequentially formed on a side of the sacrificial material portion 17 away from the substrate 1 .

[0129] See Figure 18 The isolation material layer 19, the pixel defining material layer 18 and the sacrificial material portion 17 are patterned in sequence to form an isolation structure 3, a pixel defining layer 2 and a sacrificial portion 10, respectively. The sacrificial portion 10, the first electrode 4 and the partition portion 22 form a partition gap 8, and the partition gap is connected to the isolation opening 9.

[0130] When patterning the sacrificial material portion 17 , the sacrificial material portion 17 can be etched not only in the longitudinal direction but also in the transverse direction, so that the finally formed sacrificial portion 10 can be retracted relative to the partition portion 22 , forming a partition gap 8 between the partition portion 22 and the first electrode 4 .

[0131] See Figure 19 A light-emitting material layer is evaporated toward the side of the partition portion 22 and is located on the side of the isolation structure 3 away from the substrate 1 and in the isolation opening 9 .

[0132] The nozzle for evaporating the light-emitting material layer (such as the hole injection material layer, the hole transport material layer, and the light-emitting auxiliary material layer) is tilted toward one side of the partition portion 22, so that the light-emitting material layer is evaporated toward one side of the partition portion 22. The light-emitting material layer that is easily overlapped with the isolation structure 3 can be isolated by the partition portion 22. Therefore, the carriers flowing through the light-emitting functional part 5 (such as the hole injection part, the hole transport part, and the light-emitting auxiliary part) are not easily transferred to the isolation structure 3 through the side of the light-emitting functional part 5 close to the partition portion 22.

[0133] Since the light-emitting material layer is evaporated onto one side of the partition portion 22, the side of the finally formed light-emitting functional portion 5 away from the partition portion 22 is not easy to overlap with the isolation structure 3, and the carriers flowing through the light-emitting functional portion 5 are not easy to be transferred to the isolation structure 3 through the side of the light-emitting functional portion 5 away from the partition portion 22, thereby making it difficult for the carriers flowing through the entire light-emitting functional portion 5 to be transferred to the isolation structure 3, thereby effectively improving the problem of lateral leakage between adjacent light-emitting units 7.

[0134] See Figure 20A second electrode material layer 23 and a first packaging material layer 24 are sequentially formed on the side of the light-emitting material layer away from the substrate 1 .

[0135] See Figure 21 The first packaging material layer 24 , the second electrode material layer 23 and the light-emitting material layer are patterned to form the light-emitting unit 7 and the packaging unit 11 located on a side of the light-emitting unit 7 away from the substrate 1 .

[0136] A first etching protection layer may be formed on a side of the first packaging material layer 24 of the first light-emitting unit away from the substrate 1 , and the first etching protection layer covers the isolation opening 9 and a portion of the isolation structure 3 corresponding to the first light-emitting unit.

[0137] The first etching protection layer can protect the light-emitting material layer of the first light-emitting unit, the second electrode material layer 23 and the first encapsulation material layer 24 .

[0138] The light-emitting material layer, the second electrode material layer 23 and the first packaging material layer 24 of the first light-emitting unit that are not covered by the first etching protection layer are removed, and the first etching protection layer is removed to form the light-emitting functional part 5, the second electrode 6 and the first packaging unit of the first light-emitting unit in the isolation opening 9 corresponding to the first light-emitting unit, and the second electrode 6 of the first light-emitting unit is extended to be electrically connected to the corresponding isolation structure 3.

[0139] The first light-emitting unit is completely covered by the first packaging unit, thereby reducing the risk of the evaporation material entering the evaporation equipment after being exposed to the air, causing equipment contamination and film disconnection.

[0140] In this way, the light-emitting functional part 5, the second electrode 6 and the first packaging unit can be formed only in the isolation opening 9 corresponding to the first light-emitting unit without the need for a precise mask, and the second electrode 6 of the first light-emitting unit can be electrically connected to the isolation structure 3, so that the first light-emitting unit can be formed in the first isolation opening at a lower cost.

[0141] Please see again Figure 9 , the remaining light-emitting units 7 , such as a second light-emitting unit, can be formed in the remaining isolation openings 9 by the above method.

[0142] For some possible implementations, see Figure 22This application also provides an electronic device 100, which includes the display panel 01 described in this application, or includes the display panel 01 produced by the display panel production method described in this application. The electronic device 100 may include a device with image processing capabilities, such as a mobile phone, a desktop computer, a laptop computer, a tablet computer, a car display, a wearable device, etc. Because the electronic device 100 includes the display panel 01 described in this application, the display effect of the electronic device 100 is better.

[0143] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0144] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A display panel, characterized in that: The display panel includes: substrate; a plurality of first electrodes, spaced apart and arranged on the substrate; a pixel defining layer located on one side of the substrate, the pixel defining layer being provided with a plurality of pixel openings, the pixel openings exposing a portion of the first electrode, the pixel defining layer being provided with a partition portion connected to a main portion of the pixel defining layer on one side of the pixel opening along a first direction, the partition portions in the plurality of pixel openings being arranged in a consistent direction; The isolation structure is located on a side of the pixel defining layer away from the substrate. The isolation structure encloses and forms a plurality of isolation openings, and the isolation openings are connected to the corresponding pixel openings.

2. The display panel according to claim 1, wherein: Along the thickness direction of the substrate, a partition gap is formed between a side of the partition portion close to the substrate and a side of the first electrode away from the substrate, and the partition gap is connected to the isolation opening; Preferably, the display panel further comprises a light-emitting unit, at least a portion of which is located within the isolation opening, the light-emitting unit comprising the first electrode and a light-emitting functional portion located on a side of the first electrode away from the substrate, and at least a portion of a functional layer of the light-emitting functional portion located within the same isolation opening is disconnected at the partition portion; Preferably, at least a portion of the orthographic projection of the partition portion on the substrate is located within the orthographic projection of the isolation opening on the substrate; Preferably, the display panel further comprises a sacrificial portion located between the first electrode and the partition portion; Preferably, the sacrificial portion, the first electrode and the partition portion enclose the partition gap; Preferably, the first direction includes a moving direction of an evaporation source for evaporating the luminescent material layer.

3. The display panel according to claim 2, wherein: Along the thickness direction of the substrate, the height of the sacrificial portion is equal to the height of the partition gap; Preferably, a side of the sacrificial portion close to the substrate contacts a side of the first electrode away from the substrate, and a side of the sacrificial portion away from the substrate contacts a side of the partition portion close to the substrate; Preferably, along the thickness direction of the substrate, the height of the partition gap is greater than or equal to 0.1 μm and less than or equal to 0.5 μm; Preferably, along the first direction, a distance between a side of the sacrificial portion facing the center of the isolation opening and a side of the partition portion facing the center of the isolation opening is greater than or equal to 0.2 μm and less than or equal to 0.4 μm.

4. The display panel according to claim 2, wherein: The portion of the light-emitting functional portion that is partitioned by the partition portion is located within the partition gap; Preferably, there is a gap between the light-emitting functional portion and the sacrificial portion located in the partition gap.

5. The display panel according to claim 2, wherein: The orthographic projection of the sacrificial portion on the substrate surrounds a portion of the orthographic projection of the pixel opening on the substrate.

6. The display panel according to claim 2, wherein: The light-emitting functional portion includes a hole injection portion, and the hole injection portion is disconnected at the partition portion; Preferably, the light-emitting functional portion further comprises a hole transport portion located on a side of the hole injection portion away from the substrate, and the hole transport portion is disconnected at the partition portion; Preferably, the light-emitting functional portion further includes a light-emitting auxiliary portion located on a side of the hole transport portion away from the substrate, and the light-emitting auxiliary portion is disconnected at the partition portion.

7. The display panel according to claim 1, wherein: The distance between the side of the partition portion away from the substrate and the substrate is greater than the distance between the side of the main body portion away from the substrate and the substrate; Preferably, along the thickness direction of the substrate, the thickness of the partition portion is equal to the thickness of the main body portion.

8. The display panel according to claim 1, wherein: The orthographic projection of the partition portion on the substrate surrounds a portion of the orthographic projection of the isolation opening on the substrate; Preferably, the sidewall of the pixel opening includes a side of the partition portion facing the center of the isolation opening.

9. The display panel according to claim 2, wherein: At least a portion of the light-emitting functional portion is spaced apart from the isolation structure on a side away from the partition portion; Preferably, the light-emitting functional portion includes a hole injection portion, and the hole injection portion is spaced apart from the isolation structure on a side away from the partition portion; Preferably, the light-emitting functional portion further comprises a hole transport portion located on a side of the hole injection portion away from the substrate, and a side of the hole transport portion away from the partition portion is spaced apart from the isolation structure; Preferably, the light-emitting functional portion further comprises a light-emitting auxiliary portion located on a side of the hole transport portion away from the substrate, and a side of the light-emitting auxiliary portion away from the partition portion is spaced apart from the isolation structure; Preferably, the light-emitting unit further comprises a second electrode located on a side of the light-emitting functional portion away from the substrate, and the second electrode extends to overlap with the isolation structure.

10. The display panel according to any one of claims 1 to 9, wherein: The display panel further includes: a plurality of light-emitting units, at least a portion of each of the light-emitting units being located within the isolation opening; a plurality of packaging units, each of the packaging units being located on a side of the corresponding light-emitting unit away from the substrate, and each of the packaging units extending from a side of the isolation structure toward the isolation opening to a side of the isolation structure away from the substrate; Preferably, the plurality of packaging units corresponding to the plurality of light-emitting units are arranged at intervals; Preferably, a gap exists between the packaging unit located on a side of the isolation structure away from the substrate and the side of the isolation structure away from the substrate.

11. The display panel according to claim 10, wherein: The display panel further includes a second encapsulation layer located on a side of the encapsulation unit away from the substrate, and a third encapsulation layer located on a side of the second encapsulation layer away from the substrate; Preferably, the materials of the encapsulation unit and the third encapsulation layer both include inorganic materials; Preferably, the material of the second encapsulation layer includes organic material.

12. The display panel according to claim 10, wherein: The isolation structure includes a first isolation portion and a second isolation portion stacked in sequence in a direction away from the substrate, the orthographic projection of the side of the first isolation portion away from the substrate on the substrate is located within the orthographic projection of the second isolation portion on the substrate, the orthographic projection area of ​​the side of the first isolation portion away from the substrate on the substrate is smaller than the orthographic projection area of ​​the second isolation portion on the substrate, and the second electrode of the light-emitting unit is electrically connected to the first isolation portion; Preferably, the isolation structure further comprises a third isolation portion located on a side of the first isolation portion facing the substrate, and the second electrode of the light-emitting unit is electrically connected to the third isolation portion; Preferably, the material of the third isolation portion includes molybdenum or titanium; and / or the material of the first isolation portion includes aluminum, silver or copper; and / or the material of the second isolation portion includes titanium or molybdenum.

13. A method for preparing a display panel, characterized in that: The method comprises: providing a substrate; A plurality of first electrodes, a pixel defining layer and an isolation structure are formed on one side of the substrate, the pixel defining layer is provided with a plurality of pixel openings, the pixel openings exposing a portion of the first electrode, the pixel defining layer is provided with a partition portion connected to the main body of the pixel defining layer on one side of the pixel opening along the first direction, the partition portions in the plurality of pixel openings are arranged in the same direction, the isolation structure encloses a plurality of isolation openings, and the isolation openings are connected to the corresponding pixel openings.

14. The method for manufacturing a display panel according to claim 13, wherein: The step of forming a plurality of first electrodes, a pixel defining layer and an isolation structure spaced apart on one side of the substrate comprises: forming a first electrode material layer and a sacrificial material layer in sequence on one side of the substrate; performing patterning on the sacrificial material layer and the first electrode material layer to form a plurality of sacrificial material portions and a plurality of first electrodes respectively. performing patterning on the plurality of sacrificial material portions to expose a portion of the first electrode; forming a pixel defining material layer and an isolation material layer in sequence on a side of the sacrificial material portion away from the substrate; performing patterning on the isolation material layer, the pixel defining material layer, and the sacrificial material portion in sequence to form an isolation structure, a pixel defining layer, and a sacrificial portion, respectively, wherein the sacrificial portion, the first electrode, and the partition portion enclose the partition gap, and the partition gap is connected to the isolation opening; Preferably, after the step of forming a plurality of first electrodes, a pixel defining layer and an isolation structure spaced apart on one side of the substrate, the method further comprises: Vapor-depositing a light-emitting material layer located on a side of the isolation structure away from the substrate and within the isolation opening in a direction toward one side of the partition portion; forming a second electrode material layer and a first packaging material layer in sequence on a side of the light-emitting material layer away from the substrate; The first packaging material layer, the second electrode material layer and the light-emitting material layer are patterned to form a light-emitting unit and a packaging unit located on a side of the light-emitting unit away from the substrate.

15. An electronic device, characterized in that: The electronic device comprises the display panel according to any one of claims 1 to 12, or comprises a display panel manufactured by the method for manufacturing a display panel according to claim 13 or 14.

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