Buffer device, mounting device and mounting method

Abstract

The invention provides a buffer device, a mounting device and a mounting method, which can reduce poor bonding between an electronic component and a mounting substrate due to the elapse of time from pretreatment to bonding treatment. A buffer device according to an embodiment includes: a repository 161 that stores a component supply body TW, which is a workpiece to which a wafer W, which is singulated into an electronic component E, is attached to a tape T mounted on a ring R, and a mounting substrate BW after surface treatment and / or cleaning treatment are / is performed on the component supply body TW and the mounting substrate BW; the mounting substrate BW is a workpiece on which the electronic component E separated from the component supply body TW is mounted; a chamber (162) that accommodates the storage tank (161); and an in-storage adjustment unit (163) that independently adjusts the temperature, humidity, and pressure of the gas in the storage tank (161) with respect to the chamber (162).

Description

Technical Field

[0001] The invention relates to a buffer device, an installation device and an installation method. Background Art

[0002] Direct bonding is a method for mounting electronic components such as semiconductor chips on a mounting substrate. Direct bonding is a method of directly bonding the connecting terminals of the mounting substrate and the electronic component to each other through solid-phase bonding without using bonding components (adhesives) such as solder bumps. The device that performs the bonding process to bond the electronic component to the mounting substrate is a bonding device. Direct bonding eliminates the need to consider the influence of bonding components, allows for narrow terminal spacing, and enables the manufacture of high-density packages.

[0003] In the case of directly bonding electronic components to mounting substrates, the electronic components and mounting substrates are pre-treated before this. In the pre-treatment, surface treatments or cleaning treatments such as activation treatment and cleaning treatment are performed. Activation treatment is a process that activates the surface of electronic components and mounting substrates by using active species such as ions and free radicals generated by plasmatizing the reaction gas. Activation refers to cutting the chemical bonds of molecules on the surface. In addition, cleaning treatment is a process that cleans the surface of electronic components and mounting substrates by using active species such as ions and free radicals generated. Cleaning refers to the removal of particles attached to the surface or the decomposition and removal of organic matter. Cleaning treatment is a process that cleans particles remaining on the surface of electronic components and mounting substrates.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Laid-Open No. 6-302486 Summary of the Invention

[0007] Problems to be solved by the invention

[0008] The surface conditions of electronic components and mounting substrates that have undergone the aforementioned pretreatment may gradually degrade over time, or organic matter may adhere to the surfaces, changing the bond strength. This can reduce the strength of the bond. Insufficient bond strength can result in a poor bond, leading to defective products.

[0009] Furthermore, during the bonding process using a bonding device to bring electronic components and mounting substrates into close contact, when multiple electronic components are mounted on a single mounting substrate, the timing of supplying the mounting substrate and the electronic components to the bonding device may differ. The preparation time from activation or cleaning to loading into the bonding device also varies between electronic components and mounting substrates. If there are differences in the timing or number of processes (mounting quantities) during the bonding process (mounting process) between electronic components and mounting substrates, the surface state during bonding will differ, increasing the likelihood that either the electronic component or the mounting substrate will become inactivated or become adhered to organic matter.

[0010] An object of the embodiments of the present invention is to provide a buffer device, a mounting device, and a mounting method that can reduce bonding defects between an electronic component and a mounting substrate caused by the passage of time from pre-processing to bonding processing.

[0011] Technical means to solve the problem

[0012] The buffer device of the embodiment comprises: a storage library for storing a parts supply body and a mounting substrate after they have been surface treated and / or cleaned, the parts supply body being a workpiece on which a chip that has been singulated into electronic parts is attached to a belt mounted on a ring, and the mounting substrate being a workpiece on which the electronic parts are mounted; a chamber for accommodating the storage library; and an in-repository adjustment unit for adjusting the temperature, humidity and pressure of the gas in the storage library independently of the chamber.

[0013] The mounting device of the embodiment comprises: a surface treatment section for performing surface treatment on the surface of a part supply body and / or a mounting substrate using plasma, the part supply body having a chip singulated into electronic parts attached to a belt mounted on a ring, and the mounting substrate for mounting the electronic parts; a supply body cleaning section for cleaning the part supply body; a mounting substrate cleaning section for cleaning the mounting substrate; the buffer device; a joining section for detaching the electronic parts from the part supply body and mounting them on the mounting substrate; a conveying section for conveying the part supply body and the mounting substrate; and a pre-treatment control section for cleaning and surface-treating any one of the surface treatment section, the supply body cleaning section and the mounting substrate cleaning section again when a predetermined time has passed since the part supply body or the mounting substrate was accommodated in the buffer device.

[0014] The mounting method of the embodiment includes: a surface treatment process, in which a surface treatment unit uses plasma to perform surface treatment on the surface of a part supply body and / or a mounting substrate, wherein the part supply body has a chip attached to a belt mounted on a ring and singulated into electronic parts, and the mounting substrate is used for mounting the electronic parts; a supply body cleaning process, in which a supply body cleaning unit cleans the part supply body; a mounting substrate cleaning process, in which a mounting substrate cleaning unit cleans the mounting substrate; a supply body accommodation process, in which a buffer device for the supply body temporarily accommodates the part supply body in a storage tank provided in a chamber and in which the gas inside is independently controlled relative to the chamber; a mounting substrate accommodation process , a buffer device for the mounting substrate temporarily accommodates the mounting substrate in a storage device arranged in a chamber and the internal gas of which is independently controlled relative to the chamber; and a joining process, a joining portion separates the electronic component from the component supply body and mounts it on the mounting substrate, and in the supply body accommodation process, when a predetermined time has passed since the component supply body was accommodated, the surface treatment process and / or the supply body cleaning process is performed again, and in the mounting substrate accommodation process, when a predetermined time has passed since the mounting substrate was accommodated, the surface treatment process and / or the mounting substrate cleaning process is performed again.

[0015] Effects of the Invention

[0016] The embodiment of the present invention can reduce bonding defects between an electronic component and a mounting substrate caused by the passage of time from pre-processing to bonding processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] [ Figure 1 ] is an explanatory diagram showing the processing of the installation device of the embodiment.

[0018] [ Figure 2 ] is a simplified perspective plan view showing the structure of the mounting device of the embodiment.

[0019] [ Figure 3 ] is a simplified structural diagram showing the supply body cleaning section and the mounting substrate cleaning section of the mounting device.

[0020] [ Figure 4 ] is a simplified structural diagram showing the supply body buffer section and the mounting substrate buffer section of the mounting device.

[0021] [ Figure 5 ] is a block diagram showing the control unit.

[0022] [ Figure 6 ] is a flowchart showing the action sequence of the implementation method.

[0023] [ Figure 7] is a flow chart showing the sequence from the storage of workpieces into the supply body buffer section and the mounting substrate buffer section to their removal.

[0024] [ Figure 8 ] is a simplified perspective plan view showing a modified example in which a storage library for a parts supply body and a storage library for an installation substrate are provided in a common chamber.

[0025] [ Figure 9 ] means in Figure 8 A simplified perspective plan view of an example in which a mounting portion for a component supply body and a mounting portion for a mounting substrate are provided in a chamber in a modified example of .

[0026] [ Figure 10 ] is a simplified perspective plan view showing a modified example of a storage library for a common parts supply body and an installation substrate.

[0027] [ Figure 11 ] means in Figure 11 A simplified perspective plan view of an example in which a mounting portion for a component supply body and a mounting portion for a mounting substrate are provided in a chamber in a modified example of . DETAILED DESCRIPTION

[0028] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The accompanying drawings are schematic diagrams, and the dimensions and ratios of the various parts may be exaggerated for ease of understanding.

[0029] [summary]

[0030] In this embodiment, if Figure 1 As shown, the parts supply body TW and the mounting substrate BW are processed. The parts supply body TW has a chip (semiconductor chip) W attached to a tape T installed on a ring R. At this time, the chip W is singulated into electronic parts E. The tape T is a sheet with an adhesive surface and can be stretched, and the adhesive force can be reduced by irradiation with UV (ultra-violet) light. The mounting substrate BW is a chip (semiconductor chip) for joining (mounting) the electronic parts E separated from the parts supply body TW. In addition, since the object of processing is the electronic parts E, the processing of the parts supply body TW in the following description refers to the processing of the electronic parts E. In addition, when the parts supply body TW and the mounting substrate BW are not distinguished, they are sometimes referred to as workpieces.

[0031] like Figure 2As shown, the mounting device 1 of this embodiment is a device that performs pre-treatment (activation treatment, cleaning treatment, and washing treatment) on the parts supply body TW and the mounting substrate BW, which are supplied in a plurality of pieces in a conveying container F such as a front-opening unified pod (FOUP) and a front-opening shipping box (FOSB) in the previous process, one by one, and then mounts the electronic components E.

[0032] The mounting device 1 is constructed by arranging a plurality of chambers 12 that accommodate devices for performing various processes around a base body 11 that is a box-shaped container. A loading port 13 for carrying a conveying container F is provided on the base body 11. The conveying container F that accommodates unprocessed parts supply bodies TW and mounting substrates BW is placed on the loading port 13, and the parts supply bodies TW and mounting substrates BW are taken out piece by piece from the conveying container F by the conveying unit 190, thereby carrying them into, processing, and carrying them out of each chamber 12. In addition, the structure is as follows: a fan filter unit (FFU) not shown in the figure is provided on the top plate of the base body 11 to generate a downflow formed by clean air, thereby maintaining a clean environment inside the base body 11. Such an FFU can also be provided in the chamber 12 as needed.

[0033] The mounting device 1 of this embodiment includes: a pre-processing device that performs pre-processing including activation processing, cleaning processing, and washing processing of the electronic component E; a buffer device that accommodates the component supply body TW and the mounting substrate BW at one time; and a bonding device that presses the electronic component E onto the mounting substrate BW.

[0034] More specifically, the installation device 1 of this embodiment is a device including a surface treatment unit 100, a supply body cleaning unit 110, an installation substrate cleaning unit 120, an adjustment processing unit 130, a measurement unit 140, an alignment unit 150, a supply body buffer unit 160, an installation substrate buffer unit 170, a bonding unit 180, a conveying unit 190, and a control unit 200.

[0035] The surface treatment unit 100, the supply cleaning unit 110, the mounting substrate cleaning unit 120, the adjustment processing unit 130, the measurement unit 140, and the alignment unit 150 constitute a pre-treatment device. The supply buffer unit 160 and the mounting substrate buffer unit 170 constitute a buffer device. The bonding unit 180 constitutes a bonding device. Workpieces are exchanged between the various devices using a transport device serving as a transport unit 190. Furthermore, the various devices are controlled by a control unit 200, thereby forming the mounting apparatus 1.

[0036] [Surface Treatment Department]

[0037] The surface treatment section 100 is a processing chamber that performs surface treatment on the parts supply body TW and the mounting substrate BW. Surface treatment is a process that modifies (activates and cleans) the surfaces of the parts supply body TW and the mounting substrate BW to be bonded. This modification also produces a hydrophilic effect. The surface treatment section 100 of this embodiment includes a plasma generator that converts the reaction gas introduced into a vacuum chamber 12 into plasma. The generated ions are irradiated onto the surfaces of the parts supply body TW and the mounting substrate BW to be bonded, thereby modifying their respective surfaces.

[0038] [Supply body cleaning section]

[0039] The supply cleaning section 110 is a processing chamber for cleaning the component supply TW. The supply cleaning section 110 removes particles remaining on the plasma-treated component supply TW or particles generated by the plasma treatment. The surfaces of the electronic components E, the spaces between the electronic components E, and the adhesive surfaces of the tape T are cleaned and removed. The presence of particles can affect bonding strength (weakening it). Therefore, cleaning the bonding surfaces can prevent weakening of bonding strength.

[0040] like Figure 3 As shown, the supply body cleaning unit 110 includes a cleaning chamber 111, which is a container in which the cleaning process is performed; a support unit 112, which supports the parts supply body TW; a rotating mechanism 113, which rotates the support unit 112; a cup 114, which receives the cleaning liquid L scattered from the surrounding area of ​​the parts supply body TW; and a supply unit 115, which supplies the cleaning liquid L. The supply unit 115 is provided with a nozzle 115a for dripping the cleaning liquid L and a moving mechanism 115b for moving the nozzle 115a.

[0041] The cleaning process is performed by supplying a cleaning liquid L from a nozzle 115a to the surface to be treated of the parts supply body TW, which is supported by the support portion 112 and rotated by the rotation mechanism 113. Deionized water (DIW) is used as the cleaning liquid L, for example. The cleaning chamber 111 is provided with an opening 111a for carrying the parts supply body TW in and out. The opening 111a is configured to be openable and closable by a shutter 111b.

[0042] In addition, although not shown in the figure, the rotating mechanism 113 of the supply body cleaning part 110 includes an expansion part, which stretches (expands) the belt T of the supply body cleaning part 110 supported by the support part 112 to increase the distance between the electronic parts E, thereby also cleaning the particles present in the said distance.

[0043] [Installation of substrate cleaning unit]

[0044] The mounting substrate cleaning section 120 is a processing chamber for cleaning the mounting substrate BW. The mounting substrate cleaning section 120 removes particles remaining on the mounting substrate BW that has been treated with plasma or particles generated by the plasma treatment. If particles are present, the bonding strength will be affected (the bonding strength will be weakened). Therefore, by cleaning the bonding surface, the weakening of the bonding strength can be suppressed. Figure 3 The supply body cleaning section 110 shown similarly includes: a cleaning chamber 111, which is a container for performing cleaning processing inside; a support section 112, which supports the mounting substrate BW; a rotating mechanism 113, which rotates the support section 112; a cup 114, which receives the scattered cleaning liquid L from around the mounting substrate BW; and a supply section 115, which supplies the cleaning liquid L.

[0045] [Adjustment Processing Department]

[0046] The adjustment processing unit 130 adjusts the tape T of the cleaned parts supply body TW by irradiating UV light so as to reduce the adhesive force of the tape T. Figure 1 As shown, the adjustment processing unit 130 includes an irradiation device 131 that irradiates UV light by causing a UV light source to scan the entire lower portion of the accommodated component supply body TW.

[0047] [Regulation and Measurement Department]

[0048] The measuring unit 140 positions the parts supply body TW. The measuring unit 140 is a contact-type centering device that adjusts the position of the parts supply body TW by contacting the outer periphery of the parts supply body TW so that the center of the parts supply body TW coincides with a reference position set inside.

[0049] [Alignment Department]

[0050] The alignment unit 150 positions the mounting substrate BW. The alignment unit 150 is a non-contact (optical) centering device that adjusts the position of the mounting substrate BW so that the center of the mounting substrate BW coincides with a reference position provided inside.

[0051] [Supply body buffer section]

[0052] The supply body buffer 160 is a buffer device that temporarily stores the component supply body TW. The supply body buffer 160 stores the component supply body TW before it is carried into the bonding unit 180. In addition, the supply body buffer 160 may also store the component supply body TW after a part of the electronic component E is separated by bonding. Figure 4As shown, the supply body buffer section 160 includes a storage tank 161, a chamber 162 (12), and an in-storage adjustment section 163. The storage tank 161 is a container for storing the part supply body TW after the part supply body TW is cleaned by the supply body cleaning section 110. The chamber 162 is one of the chambers 12 constituting the mounting device 1, and is a container for accommodating the storage tank 161. The in-storage adjustment section 163 controls the temperature, humidity, and pressure in the storage tank 161 independently of the chamber 162. Independent control means control without mutual gas circulation.

[0053] (Repository)

[0054] The storage 161 is box-shaped and is provided so as to be able to stack and store a plurality of component supply bodies TW at intervals. The storage 161 includes a support portion 611 , an opening 612 , a storage side door 613 , and an irradiation device 614 .

[0055] The support portion 611 is a shelf that supports the parts supply body TW. In the storage 161, a plurality of support portions 611 are arranged in multiple layers so as to support each piece of the parts supply body TW.

[0056] The opening 612 is a hole for loading and unloading the parts supply unit TW and is provided on one side of the storage 161. The storage side door 613 is sized to cover the opening 612 and is provided on the side of the storage 161 where the opening 612 is provided so as to be movable between a closed position for closing the opening 612 and an open position for opening the opening 612.

[0057] The storage-side shutter door 613 is a door that opens when the parts supply unit TW is loaded into or unloaded from the storage unit 161, and closes when the parts supply unit TW is loaded into or unloaded from the chamber 162. The storage-side shutter door 613 is connected to an opening and closing mechanism 613a that is driven by an air cylinder and slides along a guide member.

[0058] The irradiation device 614 irradiates the component supply bodies TW with UV light. For example, an excimer UV lamp is used as the irradiation device 614. The irradiation device 614 is arranged with a light source at a height and angle that allows the light to reach the component supply bodies TW on the support 611, on the side opposite the opening 612 within the storage 161. This allows the light to reach the electronic components E on each component supply body TW.

[0059] Furthermore, the storage 161 is provided with: a thermometer 161a for detecting the temperature of the gas inside the storage 161; a hygrometer 161b for detecting the humidity; and a manometer 161c for detecting the pressure (see Figure 5The thermometer 161a, the hygrometer 161b, and the pressure gauge 161c are connected to the control unit 200 described later.

[0060] (Chamber)

[0061] The chamber 162 is in the shape of a box having a size capable of accommodating the storage 161. The chamber 162 includes an opening 615, a chamber-side door 616, a placement unit 617, a robot 618, and an air blower 619.

[0062] The opening 615 is a hole for loading and unloading the parts supply unit TW and is provided on one side of the chamber 162. The chamber side door 616 is sized to cover the opening 615 and is provided on the side of the chamber 162 where the opening 615 is provided so as to be movable between a closed position for closing the opening 615 and an open position for opening the opening 615.

[0063] The chamber-side shutter door 616 is a door that opens when the component supply body TW is loaded into or unloaded from the chamber 162, and closes when the component supply body TW is loaded into or unloaded from the storage 161. The chamber-side shutter door 616 is connected to an opening and closing mechanism 616a that is driven by an air cylinder and slides along a guide member.

[0064] The loading section 617 is a table provided within the chamber 162 between the opening 615 and the storage 161, and is used to load the parts supply body TW brought in from the opening 615. The robot 618 is a transport device having a manipulator 618a that supports the parts supply body TW and transports the parts supply body TW between the loading section 617 and the storage 161. Specifically, the robot 618 loads the parts supply body TW placed on the loading section 617 into and out of the storage 161. The transport device is not limited to the robot 618; any structure may be used as long as it can load the parts supply body TW placed on the loading section 617 into and out of the storage 161.

[0065] Air supply device 619 generates a downflow of clean gas within chamber 162. Air supply device 619 is a fan filter unit (FFU) that includes an ultra-low penetration air filter (ULPA filter). An exhaust port (not shown) is located near the bottom of chamber 162 to discharge the clean gas outside chamber 162 without disrupting the downflow. Alternatively, a ventilation pipe for circulation can be provided in the FFU (not shown).

[0066] (In-house Adjustment Department)

[0067] The internal adjustment unit 163 includes a gas supply line 163a, a gas supply device 163b, a flowmeter 163c, a filter 163d, a valve 163e, an exhaust line 163f, and a valve 163g. The gas supply line 163a is connected to the upper portion of the storage reservoir 161 and is a ventilation path that leads outside the chamber 162 without communicating with the interior of the chamber 162. The gas supply device 163b supplies gas into the storage reservoir 161 via the gas supply line 163a. ​​In this embodiment, the gas supply device is a bubbling device that supplies gas obtained by humidifying preheated N2 by passing water through the gas supply line 163a.

[0068] The flowmeter 163c is a device for measuring the flow rate of gas in the gas supply path 163a. ​​The filter 163d is a device for cleaning the gas in the gas supply path 163a. ​​The valve 163e is a flow regulating valve for opening and closing the gas supply path 163a and regulating the gas flow rate.

[0069] The exhaust path 163f is connected to the lower portion of the storage 161 and is a ventilation path that is not communicated with the interior of the chamber 162 but leads to the outside of the chamber 162. The valve 163g is a flow regulating valve that opens and closes the exhaust path 163f and regulates the gas flow rate.

[0070] [Installation of the substrate buffer]

[0071] The mounting substrate buffer section 170 is a buffer device that temporarily stores the mounting substrate BW before it is carried into the joint section 180. The mounting substrate buffer section 170 stores the mounting substrate BW before it is carried into the joint section 180. In addition, the mounting substrate buffer section 170 may also store the mounting substrate BW on which the electronic components E are mounted by jointing. Figure 4 As shown, the mounting substrate buffer section 170 has a storage 161, a chamber 162 (12), and an in-storage adjustment section 163, similar to the supply body buffer section 160. In other words, the mounting substrate buffer section 170 has the same structure as the supply body buffer section 160, except that the objects carried into the chamber 162 and stored in the storage 161 are mounting substrates BW.

[0072] [Joint]

[0073] The joint section 180 is a processing chamber that separates the electronic components E from the component supply body TW and places them on the mounting substrate BW. Although not shown in the figure, the joint section 180 includes a supply mechanism, a pickup mechanism, and a mounting mechanism. The pickup mechanism picks up the electronic components E from the component supply body TW brought in by the supply mechanism and hands them over to the mounting mechanism, whereby they are placed on the mounting substrate BW brought in by the mounting mechanism. In addition, Figure 1 As shown, the bonding unit 180 of this embodiment turns the picked-up electronic component E over and mounts the pre-processed surface on the surface of the pre-processed mounting substrate BW.

[0074] [Transportation Department]

[0075] The conveying unit 190 conveys the component supply body TW and the mounting substrate BW between the loading port 13 and each chamber 12, and between each chamber 12. Figure 2 As shown, the transport unit 190 includes a transport robot 191 and a moving mechanism 192. The transport robot 191 is a dual-arm type with a pair of manipulators 191a. The manipulators 191a can support the component supply unit TW and the mounting substrate BW, respectively. The moving mechanism 192 moves the transport robot 191 and positions it at the loading port 13 and each chamber 12. The manipulators 191a carry the component supply unit TW and the mounting substrate BW into and out of each transport container F and each chamber 12.

[0076] [Control Department]

[0077] The control unit 200 is a computer that controls each part of the mounting device 1. The control unit 200 has: a processor that executes programs; a memory that stores various information such as programs or operating conditions; and a drive circuit that drives each component. That is, the control unit 200 controls the surface treatment unit 100, the supply body cleaning unit 110, the mounting substrate cleaning unit 120, the adjustment processing unit 130, the measurement unit 140, the alignment unit 150, the supply body buffer unit 160, the mounting substrate buffer unit 170, the bonding unit 180, and the conveying unit 190. Figure 5 As shown, the control unit 200 includes a storage unit 210 for storing information, an input unit 220 for inputting information, and a display unit 230 for displaying information.

[0078] In addition, if Figure 5 As shown in FIG. 1 , the control unit 200 of this embodiment includes a temperature and humidity control unit 240 for controlling the temperature and humidity inside the storage 161. The temperature and humidity control unit 240 controls the storage adjustment unit 163 based on the temperature measured by the thermometer 161a, the humidity measured by the hygrometer 161b, and the pressure measured by the pressure gauge 161c, thereby adjusting the temperature, humidity, and pressure inside the storage to a temperature, humidity, and pressure that maintains the active state of the electronic components E and the mounting substrates BW of the component supply body TW accommodated in the storage 161 (see FIG. 1 ). Figure 4 The ranges of temperature, humidity, and pressure for maintaining the active state are determined in advance through experiments, etc., and are input through the input unit 220 and stored in the storage unit 210.

[0079] Furthermore, the control unit 200 includes a pre-treatment control unit 250 and an irradiation control unit 260. The pre-treatment control unit 250 causes the surface treatment unit 100, the supply cleaning unit 110, or the mounting substrate cleaning unit 120 to perform cleaning and surface treatment again after a predetermined time has passed since the component supply unit TW or mounting substrate BW was placed in the buffer device (supply buffer unit 160, mounting substrate buffer unit 170). Specifically, if the component supply unit TW or mounting substrate BW that has undergone pre-treatment using surface treatment and cleaning is not mounted for a long time, the activation state of the bonding surface of the electronic component E or mounting substrate BW may gradually deactivate or organic matter may adhere to it. Therefore, the pre-treatment control unit 250 measures the elapsed time since placement and causes the pre-treatment to be performed again after the predetermined time has passed. This time is the time required to maintain the active state of the bonding surface within an allowable range. During this time, when the electronic component E is mounted on the mounting substrate BW, the bonding strength is within the allowable range. However, after this time has passed, the bonding strength exceeds the allowable range. That is, the desired bonding strength cannot be obtained. In addition, the set time is a time obtained in advance through experiments, etc. Such a set time is input in advance by the input unit 220 and stored in the storage unit 210.

[0080] When the preset time has passed, the irradiation control unit 260 does not perform the pre-processing again, but irradiates the component supply body TW or the mounting substrate BW with UV light via the irradiation device 614 (see Figure 4 ). Whether to unload the workpiece from the storage 161 and perform pre-processing again or to irradiate with UV light while the workpiece is contained in the storage 161 is determined according to the state or type of the workpiece. For example, in a case where a portion of the electronic components E of the parts supply body TW is detached due to installation but other electronic components E remain, the tape T is largely exposed, and if cleaning is performed, there is a possibility of contaminating the remaining electronic components E. Therefore, instead of performing pre-processing again, irradiation with UV light is performed. In addition, in a case where there is a possibility that the electronic components E mounted on the mounting substrate BW will be detached due to transportation or cleaning of the mounting substrate BW, instead of performing pre-processing again, irradiation with UV light is performed. Whether or not to perform UV light irradiation in this manner is input in advance by the input unit 220 and stored in the storage unit 210.

[0081] [action]

[0082] In addition to the Figures 1 to 5 In addition, also refer to Figure 6 、 Figure 7 The operation of the mounting device 1 of the present embodiment described above is explained in the flowchart. The mounting method of mounting the electronic component E on the mounting substrate BW in the following order is also one form of the present embodiment. Figure 6, but each process includes a state in which the processes are performed simultaneously and in parallel.

[0083] like Figure 2 As shown in FIG. 1 , a transport container F containing a component supply body TW and a transport container F containing a mounting substrate BW are placed on the loading port 13. Figure 4 As shown, a downflow is generated within the chamber 162 of the supply buffer 160 and the mounting substrate buffer 170 by the air supply device 619. Furthermore, N2 gas is supplied to the interior of the storage 161 from the gas supply device 163b of the internal storage adjustment unit 163. The supply and exhaust volumes of the N2 gas are adjusted by valves 163e and 163g to maintain the preset temperature, humidity, and pressure.

[0084] like Figure 1 、 Figure 2 As shown, the transport robot 191 receives the component supply body TW from the transport container F of the loading port 13 and transports the component supply body TW to the surface treatment section 100, where the surface of the electronic component E is activated and cleaned by plasma treatment (supply body surface treatment process: step S101). In addition, while the surface treatment of the component supply body TW is being performed, the transport robot 191 receives the mounting substrate BW from the transport container F. The transport robot 191 receives the component supply body TW after the surface treatment from the surface treatment section 100 and transports the mounting substrate BW to the surface treatment section 100. In the surface treatment section 100, the surface of the mounting substrate BW is activated and cleaned by plasma treatment (mounting substrate surface treatment process: step S102).

[0085] The conveying robot 191 transfers the part supply body TW after the surface treatment to the support part 112 of the supply body cleaning part 110. The supply body cleaning part 110 rotates the part supply body TW through the support part 112 and the rotating mechanism 113, and at the same time supplies the cleaning liquid L, thereby cleaning (supply body cleaning process: step S103). In addition, at this time, the belt T of the part supply body TW is expanded by the expansion part, and the cleaning is performed in a state where the intervals between the electronic components E are expanded. The cleaning liquid L is supplied for cleaning, and then rotated at high speed. After the cleaning liquid L is thrown off and dried, the expansion part releases the belt T to shrink it to its original state, so that the intervals between the electronic components E are restored to their original state. In addition, when the cleaning liquid L is water, hydroxyl groups can also be imparted to the surface of the part supply body TW.

[0086] After completing the surface treatment of the mounting substrate BW in the surface treatment unit 100, the conveying robot 191 receives the mounting substrate BW from the surface treatment unit 100 and hands it over to the mounting substrate cleaning unit 120. The mounting substrate cleaning unit 120 rotates the mounting substrate BW while supplying the cleaning liquid L, thereby cleaning it (mounting substrate cleaning process: step S104). The cleaning liquid L is supplied for cleaning, and then high-speed rotation is performed to throw off the cleaning liquid L for drying. The mounting substrate cleaning process includes a state in which it is carried out simultaneously with the supplier cleaning process. That is, the time for cleaning the part supplier TW overlaps with the time for cleaning the mounting substrate BW. In addition, when the cleaning liquid L is water, hydroxyl groups can also be imparted to the surface of the mounting substrate BW.

[0087] After the cleaning process of the parts supply body TW is completed, the transport robot 191 receives the parts supply body TW from the supply body cleaning unit 110 and hands it over to the measurement unit 140. In the measurement unit 140, the parts supply body TW is aligned (positioning process: step S105). After the alignment is completed, the transport robot 191 receives the parts supply body TW from the measurement unit 140 and hands it over to the adjustment unit 130. In the adjustment unit 130, the parts supply body TW is irradiated with UV light to reduce the adhesive force of the tape T (adjustment process: step S106). This positioning process and adjustment process overlap with the mounting substrate cleaning process.

[0088] After the cleaning process of the mounting substrate BW is completed, the transfer robot 191 receives the mounting substrate BW from the mounting substrate cleaning unit 120 and hands it over to the alignment unit 150. The alignment unit 150 performs positioning of the mounting substrate BW (positioning process: step S107).

[0089] After the adjustment process of the component supply body TW is completed, the transfer robot 191 receives the component supply body TW from the adjustment processing unit 130 and transfers it to the supply body buffer 160. After the positioning of the mounting substrate BW is completed, the transfer robot 191 receives the mounting substrate BW from the alignment unit 150 and transfers it to the mounting substrate buffer 170.

[0090] In this manner, after the component supply body TW and the mounting substrate BW are stored in the supply body buffer 160 and the mounting substrate buffer 170 (storage process: step S108), if the joining section 180 is able to receive them, the transport robot 191 receives the component supply body TW and the mounting substrate BW and transfers them to the joining section 180. In other words, in response to a signal from the joining section 180 indicating that they can be received, the transport robot 191 removes the component supply body TW and the mounting substrate BW from the supply body buffer 160 and the mounting substrate buffer 170 and transfers them to the joining section 180.

[0091] In addition, as described later, after surface treatment and / or cleaning, if the joint 180 has not been subjected to any treatment or is in a state where the treatment is completed, the part supply body TW and the mounting substrate BW can be directly supplied to the joint 180 without passing through the supply body buffer 160 and the mounting substrate buffer 170.

[0092] Reference Figure 7 The following flowchart describes the storage of a component supply body TW in the supply body buffer 160 or the storage and subsequent removal of a mounting substrate BW from the mounting substrate buffer 170. Here, the component supply body TW and mounting substrate BW are described as workpieces, without distinction. First, with the storage-side door 613 closed, the chamber-side door 616 is opened (step S201), and the transport robot 191 places the workpiece on the loading section 617 (step S202).

[0093] The chamber-side door 616 is closed (step S203), the storage-side door 613 is opened (step S204), and the robot 618 receives the workpiece on the loading portion 617 by supporting it on the support portion 611 in the storage 161 (step S205). The storage-side door 613 is closed (step S206), and the temperature, humidity, and pressure in the storage 161 are then adjusted.

[0094] If the preset time has not elapsed (step S207 returns NO) but the workpiece is ready for loading into the joint unit 180 (step S208 returns YES), the workpiece is unloaded. Specifically, while the chamber-side door 616 is closed, the storage-side door 613 is opened (step S209), and the robot 618 removes the workpiece and places it on the loading section 617 (step S210). The storage-side door 613 is closed (step S211), the chamber-side door 616 is opened (step S212), and the transport robot 191 unloads the workpiece from the loading section 617 (step S213).

[0095] If the preset time has elapsed (Yes in step S207) and UV irradiation is not set to be performed in the storage 161 (No in step S214), after the workpieces are unloaded in steps S209 to S213, surface treatment, cleaning, and conditioning are performed again for each workpiece (parts supply unit TW, mounting substrate BW). If UV irradiation is set to be performed in the storage 161 (Yes in step S214), UV irradiation of the workpiece is performed by the irradiation device 614 (step S215).

[0096] Return to Figure 6, the transport robot 191 delivers the component supply unit TW and the mounting substrate BW to the joining unit 180. In the joining unit 180, the electronic component E is picked up from the component supply unit TW and mounted on the mounting substrate BW (mounting process: step S109).

[0097] During the installation process, the transfer robot 191 receives the next component supply unit TW and mounting substrate BW from the transfer container F at the load port 13 and performs the same processing for the second and subsequent sheets as described above. After the installation of the first sheet is completed, in between each processing of the second and subsequent sheets, the transfer robot 191 receives the component supply unit TW and mounting substrate BW from the joint unit 180 and transfers them to the transfer container F at the load port 13.

[0098] The above-mentioned operations are repeated to mount the electronic component E on the mounting substrate BW. When the supply of the component supply body TW and / or the mounting substrate BW is completed, the mounting process is completed.

[0099] In addition, after the electronic component E of the component supplier TW is installed on the mounting substrate BW, different electronic components E can be joined to the unmounted area of ​​the mounting substrate BW, or the same electronic component E or different electronic components E can be overlapped and joined to the mounted electronic component E.

[0100] When using different electronic components E in this manner, the component supply body TW may be replaced with a component supply body TW containing different electronic components E while the electronic components E remain on the component supply body TW. Time passes between the surface treatment and cleaning of the replaced component supply body TW and the time it takes to be used again. Therefore, surface treatment and cleaning may be performed again as needed.

[0101] In this embodiment, the temperature, humidity, and pressure ranges required to maintain the active state are stored in the storage unit 210. These stored temperature, humidity, and pressure ranges can be set to optimal values ​​for each of the component supply unit TW and the mounting substrate BW. Consequently, the supply unit buffer unit 160 and the mounting substrate buffer unit 170 can each achieve an optimal in-warehouse environment. Of course, the applicable temperature, humidity, and pressure can also be set to the same values.

[0102] The mounting device 1 of this embodiment is described as a mounting device having a pretreatment device for performing pretreatment including activation treatment, cleaning treatment, and washing treatment of the electronic component E, a buffer device for accommodating the component supply body TW and the mounting substrate BW at one time, and a bonding device for crimping the electronic component E to the mounting substrate BW, but the pretreatment device and the buffer device may not necessarily be included as an integral part of the mounting device 1.

[0103] The mounting device 1 of this embodiment includes a case where the pre-processing device, buffer device, and bonding device are mounted on a base 11 as an integrated device, and also includes a case where the pre-processing device, buffer device, and bonding device are configured as independent devices and configured to exchange workpieces using independent conveying devices. In these cases, the control unit 200 may be included in each device, or each device may be controlled by a single control unit 200, or the control unit of each device may be controlled by a control unit 200 that controls all devices in an integrated manner.

[0104] [Effect]

[0105] (1) The buffer device of the present embodiment as described above (the supply body buffer section 160, the mounting substrate buffer section 170) comprises: a storage warehouse 161 for storing a part supply body TW and a mounting substrate BW after they have been subjected to surface treatment and / or cleaning treatment, wherein the part supply body TW is a workpiece in which a chip W singulated into an electronic part E is attached to a belt T mounted on a ring R, and the mounting substrate BW is a workpiece on which the electronic part E is mounted; a chamber 162 for accommodating the storage warehouse 161; and an in-warehouse adjustment section 163 for adjusting the temperature, humidity and pressure of the gas in the storage warehouse 161 independently of the chamber 162.

[0106] In addition, the mounting device 1 of this embodiment comprises: a surface treatment unit 100 for performing surface treatment on the surface of a parts supply body TW and / or a mounting substrate BW using plasma, wherein the parts supply body TW has a wafer W singulated into electronic parts E attached to a belt T mounted on a ring R, and the mounting substrate BW is for mounting electronic parts E; a supply body cleaning unit 110 for cleaning the parts supply body TW; a mounting substrate cleaning unit 120 for cleaning the mounting substrate BW; a buffer device (supply body buffer unit 160, a mounting substrate buffer section 170); a joining section 180 for separating the electronic component E from the component supply body TW and placing it on the mounting substrate BW; a conveying section 190 for conveying the component supply body TW and the mounting substrate BW; and a pre-processing control section 250 for causing any one of the surface treatment section 100, the supply body cleaning section 110 and the mounting substrate cleaning section 120 to perform cleaning and surface treatment again after a predetermined time has passed since the component supply body TW or the mounting substrate BW was placed in the buffer device.

[0107] The mounting method of this embodiment includes: a surface treatment process, in which the surface treatment unit 100 uses plasma to perform surface treatment on the surface of the part supply body TW and / or the mounting substrate BW, wherein the part supply body TW has a chip W attached to the belt T installed on the ring R and singulated into electronic parts E, and the mounting substrate BW is for mounting the electronic parts E; a supply body cleaning process, in which the supply body cleaning unit 110 cleans the part supply body TW; a mounting substrate cleaning process, in which the mounting substrate cleaning unit 120 cleans the mounting substrate BW; a supply body receiving process, in which the supply body is cleaned with plasma. The buffer device (supply body buffer part 160) temporarily accommodates the part supply body TW in a storage 161 which is provided in a chamber 162 and the internal gas is controlled independently of the chamber 162; the mounting substrate accommodating process, the buffer device for the mounting substrate (mounting substrate buffer part 170) temporarily accommodates the mounting substrate BW in a storage 161 which is provided in a chamber 162 and the internal gas is controlled independently of the chamber 162; and the bonding process, the bonding part 180 separates the electronic component E from the part supply body TW and mounts it on the mounting substrate BW.

[0108] Furthermore, with regard to the installation method, in the supply body accommodation process, when a predetermined time has passed since the part supply body TW was accommodated, the surface treatment process and / or the supply body cleaning process is performed again, and in the mounting substrate accommodation process, when a predetermined time has passed since the mounting substrate BW was accommodated, the surface treatment process and / or the mounting substrate cleaning process is performed again.

[0109] Thus, even if a waiting time occurs between the completion of pretreatment and the bonding, by allowing the workpiece to wait in the storage 161, which is located within the chamber 162 and has the temperature, humidity, and pressure adjusted to maintain the workpiece's active and clean state, the active and clean state of the bonding surface can be maintained, enabling good bonding. This can reduce the risk of poor bonding caused by the time between cleaning the workpiece and mounting the electronic component E.

[0110] Storage 161 is located within chamber 162, and workpieces are loaded and unloaded from storage 161 via chamber 162. This prevents direct contact between the interior of storage 161 and the exterior of storage 161, minimizing environmental changes within storage 161. The bonding surfaces of the workpieces housed within storage 161 are maintained in an active and clean state, enabling good bonding. This reduces bonding defects caused by the time elapsed between workpiece cleaning and mounting of the electronic components E.

[0111] Furthermore, the pressures in chamber 162 and reservoir 161 can be independently adjusted. Thus, by increasing the pressure in chamber 162 relative to the pressure outside chamber 162, it is possible to suppress the flow of external gas into chamber 162. By increasing the pressure in reservoir 161 relative to the pressure inside chamber 162, it is possible to suppress the flow of gas from chamber 162 into reservoir 161. This makes it possible to more reliably reduce environmental changes in reservoir 161.

[0112] The pressure inside chamber 162 and storage 161 is not limited to the above. By setting the air pressure inside storage 161 to be the same as the air pressure inside chamber 162, the outflow of gas from storage 161 and the inflow of gas from chamber 162 into storage 161 can be suppressed, thereby reducing the environmental changes inside storage 161.

[0113] By adjusting the pressure in the storage 161 and the chamber 162, the workpiece can be stored in the storage 161, where environmental changes are minimal. This maintains the active and clean state of the bonding surface, enabling good bonding. This reduces bonding defects caused by the time between cleaning the workpiece and mounting the electronic component E.

[0114] In addition, since only ambient gas, such as nitrogen (N2), can be supplied to the storage 161, the use of gases such as nitrogen can be suppressed to a minimum. In this way, it is possible to achieve a reduction in operating costs and an improvement in the performance of the storage environment in maintaining the active state of the workpiece joint surface and the clean state. In addition, the same ambient gas as that in the storage 161 can be supplied to the chamber 162 to set it to the same environmental state as that in the storage 161. In this way, when the workpiece is taken out / put in, the environment in the storage 161 can be maintained more strictly. In addition, the environmental state described here refers to a state determined by the type, composition, composition ratio, pressure, temperature, humidity, etc. of the gas. Among them, when the environment is set to be the same, the items listed here do not need to be all the same, and the same state of any one item or several items is also included.

[0115] (2) The chamber 162 is provided with an air supply device 619 that generates a downflow of clean gas in the chamber 162. Therefore, the cleanliness of the workpiece can be maintained from the time the workpiece is loaded into the chamber 162 to the time it is stored in the storage 161.

[0116] (3) An opening 615 and an opening 612 for moving workpieces in and out of the chamber 162 and the storage 161 are respectively provided. A chamber side door 616 is provided at the opening 615 of the chamber 162. The chamber side door 616 is opened when the workpiece is moved in and out of the chamber 162, and is closed when the workpiece is moved in and out of the storage 161. A storage storage side door 613 is provided at the opening 612 of the storage 161. The storage storage side door 613 is opened when the workpiece is moved in and out of the storage 161, and is closed when the workpiece is moved in and out of the chamber 162.

[0117] Therefore, when workpieces are loaded into or removed from chamber 162, gas outside chamber 162 is prevented from flowing into storage 161, minimizing changes in the environmental conditions within storage 161. Specifically, by providing a double door and controlling the timing so that each door does not open simultaneously, changes in the environment within storage 161 during workpiece loading and unloading can be minimized. More specifically, it is preferable to close opening 615 of chamber 162 when loading or unloading workpieces into or from chamber 162, wait until the environment within chamber 162 becomes the same as that within storage 161, and then open opening 612 of storage 161. This ensures that the environment within storage 161 is strictly maintained.

[0118] (4) The chamber 162 includes a loading portion 617 for loading the workpieces carried into the chamber 162, and a robot 618 as a transport device for loading and unloading the workpieces loaded on the loading portion 617 into and out of the storage 161. Therefore, the loading and unloading of the workpieces can be automated while maintaining the cleanliness of the storage 161.

[0119] (5) An irradiation device 614 for irradiating the workpiece with UV light is provided in the storage 161. This allows the surface of the workpiece to be activated and cleaned. In addition, the activated and cleaned state of the workpiece returned from the joint 180 and stored again can be maintained, or reactivation and recleaning can be performed. Furthermore, even if the workpiece is in a state that is not suitable for pre-treatment such as surface treatment or cleaning using plasma, it can be reactivated and recleaned. In addition, since the process of reprocessing the workpiece instead of returning it to the surface treatment section 100 or the supply cleaning section 110 or the mounting substrate cleaning section 120 can be replaced, the process of reprocessing can be reduced, thereby preventing a decrease in processing efficiency.

[0120] [Modification]

[0121] (1) During the processing steps of the mounting apparatus 1, it is not necessary to temporarily store the workpiece in the buffer device (supply body buffer section 160, mounting substrate buffer section 170) before bonding. If the bonding section 180 is able to accommodate the workpiece, the workpiece may be directly loaded into the bonding section 180 without passing through the buffer device. In this case, the workpiece is immediately put into the bonding process when its surface is in the required activated and cleaned state. This minimizes the impact on the bonding strength and eliminates unnecessary storage time in the buffer device, thereby improving operational efficiency.

[0122] Furthermore, even if the workpiece cannot be received by the joint section 180, a waiting time can be calculated based on the processing status of the joint section 180. If the waiting time is within a predetermined threshold time, the workpiece is not stored in the buffer device but is directly placed on standby. The threshold time can be set as the time during which the surface condition of the workpiece can maintain the desired activation state or clean state, and can be determined in advance through experiments, etc.

[0123] Alternatively, the time from the time the workpiece is loaded into the joint section 180 until the mounting process is completed may be calculated. If the time is within the threshold time for the surface condition of the workpiece to maintain the desired activated or clean state, the workpiece is loaded into the joint section 180 without being stored in the buffer device. In this case, if any waiting time occurs, this waiting time may also be taken into account.

[0124] Specifically, when loading the workpiece into the joint unit 180, if waiting time occurs depending on the processing status of the joint unit 180, the decision as to whether to store the workpiece in the buffer device can be made based on this waiting time. This eliminates unnecessary time spent storing the workpiece in the buffer device, improving operational efficiency. Furthermore, the necessary storage in the buffer device can be reliably performed, ensuring the required installation strength during installation.

[0125] Of course, it is also possible to immediately store the items in the buffer device when it is determined that the waiting time has occurred. As mentioned above, it is also possible to select whether to decide to store the items in the buffer device based on the waiting time or to store them immediately.

[0126] (2) The irradiation device 614 may be configured such that the light source is movable and scans along the surface of each workpiece, thereby uniformly irradiating the entire workpiece.

[0127] (3) The pretreatment control unit 250 may also use the time after the surface treatment and the time after the cleaning, and appropriately perform the surface treatment and cleaning again according to whether to give priority to the activation state and clean state of the surface or to give priority to the hydroxyl group-imparting state after cleaning. Furthermore, it is also possible not to perform the surface treatment again but only perform the cleaning treatment. By selecting various treatments in this way, treatments corresponding to various properties of the surface of the workpiece can be performed. In this way, the number of applicable products can be increased (see Figure 1 ).

[0128] When it is determined that a predetermined threshold time has elapsed during mounting in the bonding unit 180 , the pre-processing control unit 250 may perform surface processing and cleaning again without conveying the component supply body TW or the mounting substrate BW to the bonding unit 180 .

[0129] (4) A dedicated conveying unit 190 may be provided for re-surfacing and cleaning. Furthermore, the dedicated conveying unit 190 may be provided separately for the component supply unit TW and the mounting substrate BW. This allows the conveying process for re-surfacing and cleaning to be performed in parallel with the normal conveying unit 190, thereby realizing a highly productive mounting apparatus 1 based on high-speed and parallel processing.

[0130] (5) In the above embodiment, two buffers are used, namely, the supply buffer 160 for the component supply body TW and the mounting substrate buffer 170 for the mounting substrate BW. However, a single buffer may be used. For example, Figure 8 As shown, a single chamber 162 can be provided with a storage 161D for the parts supply unit TW and a storage 161E for the mounting substrate BW, allowing the parts supply unit TW and the mounting substrate BW to share the chamber 162. In this case, as shown, a single robot 618 can be used to distribute and store the workpieces between storage 161D and storage 161E. This reduces the number of chambers 162 and transfer devices (robot 618), thereby saving space, energy, and costs.

[0131] Furthermore, if Figure 9As shown, a loading section 617D for the parts supply body TW and a loading section 617E for the mounting substrate BW may be provided in the common chamber 162. Thus, even when the time points of loading / unloading between the parts supply body TW and the mounting substrate BW coincide, the workpiece can be loaded into the chamber 162 without waiting. In addition, even when approaching from the outside of the chamber 162 to load / unload a workpiece for one of the loading sections (617D or 617E), the robot 618 can simultaneously approach the other loading section (617E or 617D), thereby shortening the cycle time. In the above case, the conveying device in the chamber 162 may also be provided as a single robot 618. In this way, the number of chambers 162 or conveying devices (robots 618) can be reduced, thereby saving space, energy, and costs.

[0132] In addition, if Figure 10 As shown, even when a shared chamber 162 is used, a single storage 161 can be used for both the parts supply unit TW and the mounting substrates BW. In this case, as in the case of a parts supply unit TW comprising a ring R (a ring R holding a tape T with electronic components E attached thereto) and a mounting substrate BW (a wafer), if the mounting substrates BW and the parts supply unit TW are of different sizes, a common tray TR can be used to store the parts in the storage 161, thereby allowing the storage 161 to be shared. The tray TR is sized to accommodate both the parts supply unit TW and the mounting substrates BW. By configuring the storage 161 to accommodate the tray TR, both the parts supply unit TW and the mounting substrates BW can be placed on the tray TR, allowing the storage 161 to be shared. Of course, in this case, a single robot 618 can also be used. This allows the chamber 162 to be further reduced in size or the number of robots 618 to be reduced, further saving space, energy, and costs.

[0133] Furthermore, in the case described, Figure 11 As shown, a loading section 617D for the parts supply body TW and a loading section 617E for the mounting substrate BW can also be provided in the common chamber 162. This can further reduce the size of the chamber 162 or the number of robots 618, thereby further saving space, energy, and costs. Furthermore, even when the time points of loading / unloading between the parts supply body TW and the mounting substrate BW coincide, the workpiece can be loaded into the chamber 162 without waiting. In addition, even when approaching from the outside of the chamber 162 to load / unload a workpiece for one of the loading sections (617D or 617E), the robot 618 as a conveying device can simultaneously approach the other loading section (617E or 617D), thereby shortening the cycle time.

[0134] [Other embodiments]

[0135] While the embodiments of the present invention and variations of each part have been described above, these embodiments or variations of each part are provided as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other ways, and various omissions, substitutions, changes, and combinations can be made without departing from the gist of the invention. These embodiments and their variations are included in the scope or gist of the invention and are included in the invention described in the claims.

[0136] Explanation of Figure Numbers

[0137] 1: Install the device

[0138] 11: Matrix

[0139] 12: Chamber

[0140] 13: Loading port

[0141] 100: Surface treatment department

[0142] 110: Supply body cleaning unit

[0143] 111: Cleaning Room

[0144] 111a: Opening

[0145] 111b: Block the door

[0146] 112: Support

[0147] 113: Rotating mechanism

[0148] 114: Cup

[0149] 115: Supply Department

[0150] 115a: Nozzle

[0151] 115b: Mobile mechanism

[0152] 120: Install substrate cleaning unit

[0153] 130: Adjustment Processing Department

[0154] 131: Irradiation device

[0155] 140: Regulation and Measurement Department

[0156] 150: Alignment

[0157] 160: Supply body buffer part

[0158] 161, 161D, 161E: Repository

[0159] 161a: Thermometer

[0160] 161b: Hygrometer

[0161] 161c: Pressure gauge

[0162] 162: Chamber

[0163] 163: In-house Adjustment Department

[0164] 163a: Gas supply line

[0165] 163b: Gas supply device

[0166] 163c: Flow meter

[0167] 163d: Filter

[0168] 163e: Valve

[0169] 163f: Exhaust duct

[0170] 163g: Valve

[0171] 170: Install the substrate buffer

[0172] 180: Joint

[0173] 190: Transport Department

[0174] 191: Transport Robot

[0175] 191a: Robotic Arm

[0176] 192: Mobile mechanism

[0177] 200: Control Department

[0178] 210: Storage

[0179] 220: Input

[0180] 230: Display unit

[0181] 240: Temperature and humidity control department

[0182] 250: Preprocessing control unit

[0183] 260: Irradiation control unit

[0184] 611: Support

[0185] 612: Opening

[0186] 613: Storage room side door

[0187] 613a: Opening and closing mechanism

[0188] 614: Irradiation device

[0189] 615: Opening

[0190] 616: Chamber side door

[0191] 616a: Opening and closing mechanism

[0192] 617, 617D, 617E: Loading section

[0193] 618: Robot

[0194] 618a: Robotic Arm

[0195] 619: Air supply device

Claims

1. A buffer device, characterized in that have: a storage for storing component supply bodies and mounting substrates after surface treatment and / or cleaning, wherein the component supply bodies are workpieces on which wafers singulated into electronic components are attached to a belt mounted on a loop, and the mounting substrates are workpieces on which the electronic components are mounted; a chamber for accommodating the storage reservoir; as well as The in-storage adjustment unit adjusts the temperature, humidity, and pressure of the gas in the storage independently of the chamber.

2. The buffer device according to claim 1, characterized in that The chamber is provided with an air supply device, which generates a downflow of clean gas in the chamber.

3. The buffer device according to claim 1, characterized in that The chamber and the storage are respectively provided with openings for carrying the workpiece in and out. A chamber side door is provided at the opening of the chamber. The chamber side door is opened when the workpiece is carried out of or into the chamber, and is closed when the workpiece is carried out of or into the storage. A storage side door is provided at the opening of the storage. The storage side door is opened when the workpiece is carried in or out of the storage, and is closed when the workpiece is carried in or out of the chamber.

4. The buffer device according to claim 1, characterized in that The chamber has: a loading portion for loading the workpiece carried into the chamber; and The transport device carries the workpiece placed on the placement portion in and out of the storage.

5. The buffer device according to claim 1, characterized in that The storage is provided with an irradiation device for irradiating the workpiece with ultraviolet light.

6. The buffer device according to claim 1, characterized in that The storage stores the component supply body from which a part of the electronic component is detached and / or the mounting substrate on which the electronic component is mounted.

7. A mounting device, characterized in that have: a surface treatment section for performing surface treatment on a component supply body having wafers singulated into electronic components attached to a belt mounted on a loop and / or a mounting substrate using plasma; A supply body cleaning unit, for cleaning the parts supply body; A mounting substrate cleaning unit for cleaning the mounting substrate; The buffer device according to any one of claims 1 to 6; a joining portion for separating the electronic component from the component supply body and mounting the electronic component on the mounting substrate; A conveying unit for conveying the component supply body and the mounting substrate; as well as The pre-processing control unit causes any one of the surface processing unit, the supply unit cleaning unit, and the mounting substrate cleaning unit to perform cleaning and surface processing again when a predetermined time has passed since the component supply unit or the mounting substrate was accommodated in the buffer device.

8. An installation method, characterized in that include: a surface treatment step in which a surface treatment section performs surface treatment on a surface of a component supply member having wafers attached to a belt mounted on a loop and singulated into electronic components and / or a mounting substrate on which the electronic components are mounted using plasma; a supply body cleaning step, wherein the supply body cleaning unit cleans the part supply body; a mounting substrate cleaning step, wherein a mounting substrate cleaning unit cleans the mounting substrate; a supply body accommodation step, wherein a supply body buffer device temporarily accommodates the component supply body in a storage reservoir provided in a chamber and having an internal gas controlled independently of the chamber; a mounting substrate accommodating step in which a buffer device for mounting substrates temporarily accommodates the mounting substrates in a storage reservoir provided in a chamber and having an internal gas controlled independently of the chamber; as well as In a bonding step, the bonding section separates the electronic component from the component supply body and mounts the electronic component on the mounting substrate, and In the supply body accommodation step, when a predetermined time has passed since the component supply body was accommodated, the surface treatment step and / or the supply body cleaning step is performed again. In the mounting substrate accommodation step, when a predetermined time has elapsed since the mounting substrate was accommodated, the surface treatment step and / or the mounting substrate cleaning step is performed again.

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