Automatic processing equipment for NTC (Negative Temperature Coefficient) thermistor chip

Abstract

The invention relates to the field of NTC (Negative Temperature Coefficient) thermistor chip processing, and discloses NTC thermistor chip automatic processing equipment which comprises a dipping station, a draining station, a conveying belt and a guide rail, the conveying belt and the guide rail are used for bearing and conveying a mounting rack and a workpiece, the dipping station is used for completing dipping packaging and providing protection for a resistor chip after packaging is completed, and the draining station is used for draining off the resistor chip. The draining station is located on one side of the dipping station, redundant materials can be discharged through the draining station, packaging on a resistor can be plasticized through the draining station, the number of parts used for bearing a mounting frame and a workpiece is two in the draining station, and the draining station mainly comprises a collecting chamber, a rotating ring, a first mold, a second mold and a top column. The automatic processing equipment for the NTC thermistor chip, provided by the invention, is provided with the draining station, so that the situation that the upper part is small and the lower part is large can be prevented, the packaging can be in a consistent shape, the defective rate is reduced, and finally, overflowing glue liquid can be collected, the consumption of the glue liquid is reduced, and the use cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of NTC thermistor chip processing, in particular to an automatic processing device for NTC thermistor chips. Background Art

[0002] In the patent application with application announcement number CN210516369U, it includes a workbench, a motor is provided just below the workbench, the output end of the motor is fixedly connected to the bottom of the transmission roller group, the bottom of the transmission roller group is respectively connected to one end of the support rod and the transmission rod, the other end of the support rod passes through the workbench and is fixedly connected to the bottom of the negative pressure suction device, a pressure guide tube is fixedly installed on one side of the negative pressure suction device, one end of the pressure guide tube is fixedly installed with a suction head, the other end of the transmission rod passes through the workbench and is fixedly sleeved in the middle of the rotating disk, a packaging block is placed on the top of the rotating disk, a packaging head is provided above one side of the rotating disk, the top of the packaging head is fixedly installed on the bottom of one side of the connecting rod, the other end of the connecting rod is fixedly installed on the top of one side of the fixed rod, the bottom end of the fixed rod is fixedly installed on the top of the workbench, and conveyor belts are movably installed on both sides of the top of the workbench. The advantages are: the packaging device for the NTC thermistor, through the coordinated use of a motor, a transmission roller group, a support rod, a transmission rod, a rotating disk, a packaging head, a connecting rod and a fixed rod, enables the motor to simultaneously drive the support rod and the transmission rod to rotate through the transmission roller group, so that the rotation frequencies of the rotating disk and the suction head are consistent, thereby ensuring the synchronization of the adsorption work and the packaging work, and thus improving the effect of the packaging work.

[0003] In the prior art including the above-mentioned patents, the dip packaging technology currently used for thermistor packaging has multiple problems. First, the thickness of the glue layer is uneven, and it is easy to be thin at the top and thick at the bottom, and there are many bubbles remaining. This phenomenon will be more serious when the glue is drained, resulting in lower precision of the finished product. Second, when pulling after dipping is completed, the flow of colloid will generate shear force and tension, which may easily cause the leads on the chip to break, thereby easily increasing the defective rate of the workpiece. In addition, if too much is dipped during dipping, it may also carry the chip to fall into the dipping tank below. Summary of the Invention

[0004] The problem to be solved by the present invention is that the traditional method of dip encapsulation has low cost but many defects, such as easy damage during processing and inability to effectively control the package shape and amount outside the single resistor chip during draining.

[0005] In order to solve the above technical problems, the technical solution of the present invention is: an automatic processing equipment for NTC thermistor chips, including a dipping station and a draining station, and a conveyor belt and a guide rail for receiving and transporting the mounting frame and the workpiece. The dipping station is used to complete the dipping packaging and provide protection for the resistor chip after the packaging is completed. The draining station is located on one side of the dipping station. The draining station can discharge excess material and plasticize the packaging on the resistor. There are two components in the draining station responsible for receiving the mounting frame and the workpiece. The draining station mainly includes a collection chamber, a rotating ring, mold one, mold two and a top column. Both ends of the collection chamber are provided with rotating rings, and the rotating rings are connected to the external motor by belts. A guide rail is connected to the inner side of the rotating ring, and mold one and mold two are respectively provided below the guide rail. The lower end of the mold two is provided with a top column.

[0006] Preferably, the draining station also includes an electric push rod, which is used to push mold one and mold two to move toward the middle. The electric push rod is fixedly connected to mold one and mold two by bolts, and the electric push rod is fixed on the square steel on one side of the guide rail.

[0007] Preferably, the mold one and the mold two are provided with placement grooves on their opposite sides, and the placement grooves are used to fix the workpiece and plasticize the package under the workpiece. The lower end of the mold two is slidably provided with top pillars, and the number of the top pillars is consistent with the placement grooves. The top pillars are spaced apart from the inner wall of the placement grooves, and a cavity is left between the top pillars and the placement grooves for the packaging liquid to flow out.

[0008] Preferably, the dipping station includes an electric cylinder arranged on square steel, the electric cylinder is connected to the square steel, the electric cylinder is used to control the up and down movement of the conveyor belt, the electric cylinder and the conveyor belt are fixedly connected by bolts, and a dipping pool is provided below the electric cylinder.

[0009] Preferably, a cover plate is slidingly provided at the upper end of the dipping pool, the cover plate is arranged in an L shape, two cover plates are symmetrically provided along the center line of the dipping pool, a movable plate is slidingly provided at the upper end of the opposite side of the cover plate, and the movable plate is connected to the cover plate by an elastic telescopic rod.

[0010] Preferably, two sets of rollers are fixedly provided on the upper end of the movable plate, and mounting blocks are fixedly provided on both sides of the cover plate. The mounting blocks are only connected to the cover plate and are slidingly connected to the movable plate. A connecting plate is slidingly provided inside the mounting blocks, and the connecting plate is fixedly connected to the movable plate.

[0011] Preferably, an elastic member is provided at the lower end of the connecting plate, and the connecting plate can slide up and down in the mounting block through the elastic member. A spring is fixedly provided on one side of the mounting block, and the other end of the spring is fixedly connected to the dipping pool.

[0012] Preferably, a plurality of air holes are provided at the lower end of the outer side of the cover plate, and the air holes are connected to an external air pump through a connecting pipe. The air entering the cover plate can be blown out toward the middle after the movable plate is opened.

[0013] Preferably, the guide rail in the rotating ring is arranged at a position slightly above the center of the rotating ring, the collecting chamber is connected to the dipping pool through a guide groove, the number of the placement grooves is consistent with the number of workpieces on the mounting frame and the workpiece, and when the conveyor belt in the dipping station is displaced to the lower end, the cover plate can be moved to both sides first, and then the movable plate can be closed by the roller.

[0014] Preferably, guide rails and conveyor belts are provided in the dipping station and the draining station, and a plurality of guide rails and conveyor belts are provided on one side of the dipping station for loading materials.

[0015] Compared with the prior art, the technical solution of the present invention has the following advantages: (1) Under the action of the components in the draining station, during the draining process, the chip package can first be plasticized to prevent it from being smaller at the top and larger at the bottom, thereby ensuring that the package can provide better protection. Secondly, the package with different dipping amounts can be adaptively adjusted so that the resistors can present a consistent shape during the high-temperature curing stage and the package weight of each resistor can be controlled within an appropriate range. This can further provide a guarantee for the protection effect of the package and reduce the defective rate. Finally, the overflowed glue is collected and eventually returned to the dipping tank, thereby saving glue consumption and reducing the cost of use. Moreover, the guide rails in the draining station can be added so that it can process multiple groups of workpieces at one time without excessively increasing the manufacturing cost, thereby improving the working efficiency of the device and adapting to production lines with different production needs to a certain extent. (2) Under the action of the components in the dipping station, first, during the extraction stage after dipping, the leads can be prevented from being torn off by the flow of glue, thereby preventing the chip and the pin from falling off, and further ensuring that there will be no debris or fallen parts in the dipping tank. Secondly, the problem of continuous dripping of glue can be solved in a gentler way and without contacting the resistor body, thereby further ensuring the yield rate of the resistor. Finally, the cover plate can also reduce the probability of external impurities contaminating the internal glue by reducing the exposure time of the dipping tank. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the present invention; Figure 2 This is a schematic diagram of the dipping station structure of the present invention; Figure 3 This is a schematic structural diagram of the middle part of the dipping station of the present invention; Figure 4This is a schematic structural diagram of the cover plate and its related components of the present invention; Figure 5 For the present invention Figure 4 A in the middle is an enlarged structural diagram; Figure 6 This is a schematic diagram of the draining station structure of the present invention; Figure 7 This is a schematic diagram of the internal structure of the draining station of the present invention; Figure 8 This is a bottom view schematic diagram of the internal structure of the draining station of the present invention; Figure 9 Schematic diagram of the mold structure of the present invention; Figure 10 For the present invention Figure 9 The enlarged structural diagram at B in the middle; Figure 11 This is a schematic diagram of the conveyor belt and guide rail positions at the loading location of the device of the present invention.

[0017] In the figure: 1. Dipping station; 101. Electric cylinder; 102. Dipping tank; 103. Cover plate; 104. Movable plate; 105. Roller; 106. Mounting block; 107. Connecting plate; 108. Spring; 2. Draining station; 201. Collecting chamber; 202. Rotating ring; 203. Electric push rod; 2041. Mold 1; 2042. Mold 2; 205. Placement trough; 206. Ejector column; 3. Conveyor belt; 4. Guide rail; 5. Mounting frame and workpiece. DETAILED DESCRIPTION

[0018] To make the purpose, technical solutions and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0019] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the usual meanings understood by persons of ordinary skill in the field to which this disclosure belongs. The words “including” or “comprising” and the like used in this disclosure mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. The words “connected” or “connected” and the like are not limited to physical or mechanical connections, but may also include electrical connections, whether direct or indirect. “Up”, “down”, “left”, “right” and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0020] like Figures 1 to 11 As shown, the present invention provides an automatic processing equipment for NTC thermistor chips, including a dipping station 1 and a draining station 2, as well as a conveyor belt 3 and a guide rail 4 for receiving and transporting a mounting frame and a workpiece 5. The dipping station 1 is used to complete the dipping package and provide protection for the resistor chip after the package is completed. The draining station 2 is located on one side of the dipping station 1. The draining station 2 can discharge excess material and plasticize the package on the resistor. There are two components in the draining station 2 responsible for receiving the mounting frame and the workpiece 5. The draining station 2 mainly includes a collecting chamber 201, a rotating ring 202, a mold 1 2041, a mold 2 2042 and a top column 206. Both ends of the collecting chamber 201 are provided with a rotating ring 202, and the rotating ring 202 is connected to an external motor by a belt. A guide rail 4 is connected to the inner side of the rotating ring 202, and a mold 1 2041 and a mold 2 2042 are respectively provided below the guide rail 4. The lower end of the mold 2 2042 is provided with a top column 206.

[0021] The draining station 2 also includes an electric push rod 203, which is used to push mold 1 2041 and mold 2 2042 to move toward the middle. The electric push rod 203 is fixedly connected to mold 1 2041 and mold 2 2042 by bolts, and the electric push rod 203 is fixed on the square steel on one side of the guide rail 4.

[0022] The opposite sides of mold 1 2041 and mold 2 2042 are both provided with placement grooves 205, which are used to fix the workpiece and plasticize the package under the workpiece. The lower end of mold 2 2042 is slidably provided with a top column 206. The number of the top columns 206 is consistent with the placement grooves 205. The top columns 206 are spaced apart from the inner wall of the placement grooves 205, and a cavity is left between the top columns 206 and the placement grooves 205 for the packaging liquid to flow out.

[0023] The dipping station 1 includes an electric cylinder 101 arranged on the square steel. The electric cylinder 101 is connected to the square steel. The electric cylinder 101 is used to control the up and down movement of the conveyor belt 3. The electric cylinder 101 is fixedly connected to the conveyor belt 3 by bolts. A dipping pool 102 is provided below the electric cylinder 101.

[0024] A cover plate 103 is slidingly provided at the upper end of the dipping pool 102. The cover plate 103 is set in an L shape. Two cover plates 103 are symmetrically provided along the center line of the dipping pool 102. A movable plate 104 is slidingly provided at the upper end of the opposite side of the cover plate 103. The movable plate 104 is connected to the cover plate 103 by an elastic telescopic rod.

[0025] The upper end of the movable plate 104 is fixedly provided with two groups of rollers 105, both sides of the cover plate 103 are fixedly provided with mounting blocks 106, the mounting blocks 106 are connected with the cover plate 103 only, and are slidingly connected with the movable plate 104, the inside of the mounting block 106 is slidingly provided with a connecting plate 107, and the connecting plate 107 is fixedly connected with the movable plate 104.

[0026] The lower end of the connecting plate 107 is provided with an elastic piece, the connecting plate 107 can slide up and down in the mounting block 106 through the elastic piece, one side of the mounting block 106 is fixedly provided with a spring 108, and the other end of the spring 108 is fixedly connected with the dipping pool 102.

[0027] The outside lower end of the cover plate 103 is provided with a plurality of air holes, the air holes are connected with an external air pump through a connecting pipe, and the air entering the cover plate 103 can be blown out to the middle after the movable plate 104 is opened.

[0028] The guide rail 4 in the rotating ring 202 is arranged at a position deviated upward from the center of the rotating ring 202, the collecting chamber 201 is connected with the dipping pool 102 through a flow guide groove, the number of the placing grooves 205 is consistent with the number of the workpieces on the mounting frame and the workpieces 5, when the conveying belt 3 in the dipping station 1 is displaced to the lowermost end, the cover plate 103 can be first moved to both sides, and then the movable plate 104 is closed through the rollers 105.

[0029] The dipping station 1 and the draining station 2 are both provided with the guide rail 4 and the conveying belt 3, a plurality of guide rails 4 and conveying belts 3 are arranged on one side of the dipping station 1 and used for feeding.

[0030] The working principle and use process of the dipping station 1 are as follows: The mounting frame and the workpieces 5 are conveyed to the dipping station 1 under the action of the conveying belt 3, then the electric cylinder 101 is started, the conveying belt 3 below the electric cylinder 101 is moved downward, the cover plate 103 is first pushed to both sides during the movement, so that the workpieces can enter the dipping pool 102, and when the movable plate 104 is continuously moved and pressed down, the air pumped out by the air pump cannot directly blow the workpieces, and the workpieces begin to dip and encapsulate together; After the dipping is completed, the electric cylinder 101 is retracted, the movable plate 104 is first opened, at this time, the air pumped out by the air pump can first clean the resistance dipped less, the airflow forces the lower end to separate from the liquid surface in the dipping pool 102, when the workpiece is slightly higher than the cover plate 103, the cover plate 103 can clean the resistance dipped more, and the encapsulation liquid on the surface of the cover plate 103 can continuously flow downward, and cannot be directly blown off by the air, at this time, the cover plate 103 can force the encapsulation liquid to stop, and the encapsulation liquid remaining on the surface of the cover plate 103 can also return to the dipping pool 102 in the next dipping; After encapsulation, the mounting frame and the workpiece 5 continue to move until the draining station 2, at which time the electric push rod 203 can push the mold one 2041 and the mold two 2042 to the middle until the mold clamps the workpiece, at which time the encapsulation outside the resistor can be initially plasticized under the action of the mold. After the electric push rod 203 clamps the mold, the rotating ring 202 drives the guide rail 4 and the mold and the workpiece to rotate quickly. During rotation, the encapsulation outside the resistor is again plasticized under the action of the placement groove 205 and the centrifugal force. With the continuation of the rotation, the top column 206 moves to the resistor encapsulation under the action of the centrifugal force until it stops after the upper stop point. In this process, there are three cases: If the size of the encapsulation is correct, the top column 206 will not play any role: If too much glue solution is dipped during encapsulation, the top column 206 can continuously extrude inside, so that the excess glue solution can overflow from both sides of the top column 206: If the glue solution dipped during encapsulation is less, the glue solution remaining on both sides of the top column 206 can enter the placement groove 205 under the action of the centrifugal force and supplement the encapsulation inside: The squeezed glue solution can be collected by the collection chamber 201, and the collected glue solution can be reused by returning to the dipping pool 102 through the flow guide groove. The flow guide groove can also collect the dripping glue solution when the mounting frame and the workpiece 5 are transported.

[0031] The above embodiments are only exemplary embodiments of the present application and are not used to limit the present application. The protection scope of the present application is defined by the claims. Those skilled in the art can make various modifications or equivalent replacements to the present application within the spirit and protection scope of the present application, and such modifications or equivalent replacements shall also be considered to fall within the protection scope of the present application.

Claims

1. An automated processing device for NTC thermistor chips, comprising a dipping station (1) and a draining station (2), and a conveyor belt (3) and a guide rail (4) for receiving and transporting a mounting frame and a workpiece (5), characterized in that: The dipping station (1) is used to complete the dipping packaging and provide protection for the resistor chip after the packaging is completed. The draining station (2) is located on one side of the dipping station (1). The draining station (2) can discharge excess material and plasticize the packaging on the resistor. There are two components in the draining station (2) responsible for receiving the mounting frame and the workpiece (5). The draining station (2) mainly includes a collection chamber (201), a rotating ring (202), a mold 1 (2041), a mold 2 (2042) and a top column (206). Both ends of the collection chamber (201) are provided with a rotating ring (202). The rotating ring (202) is connected to an external motor by a belt. A guide rail (4) is connected to the inner side of the rotating ring (202). Mold 1 (2041) and mold 2 (2042) are respectively provided below the guide rail (4). The lower end of the mold 2 (2042) is provided with a top column (206).

2. The NTC thermistor chip automated processing equipment according to claim 1, characterized in that: The draining station (2) further includes an electric push rod (203), which is used to push mold 1 (2041) and mold 2 (2042) to move toward the middle. The electric push rod (203) is fixedly connected to mold 1 (2041) and mold 2 (2042) by bolts, and the electric push rod (203) is fixed to the square steel on one side of the guide rail (4).

3. The NTC thermistor chip automated processing equipment according to claim 1, characterized in that: The mold 1 (2041) and the mold 2 (2042) are both provided with placement grooves (205) on the opposite sides thereof. The placement grooves (205) are used to fix the workpiece and perform plasticity for the packaging under the workpiece. The lower end of the mold 2 (2042) is slidably provided with top pillars (206). The number of the top pillars (206) is consistent with the number of the placement grooves (205). The top pillars (206) are spaced apart from the inner wall of the placement grooves (205). A cavity is left between the top pillars (206) and the placement grooves (205) for the packaging liquid to flow out.

4. The NTC thermistor chip automated processing equipment according to claim 1, characterized in that: The dipping station (1) includes an electric cylinder (101) arranged on a square steel, the electric cylinder (101) being connected to the square steel, the electric cylinder (101) being used to control the upward and downward movement of the conveyor belt (3), the electric cylinder (101) being fixedly connected to the conveyor belt (3) by bolts, and a dipping tank (102) being arranged below the electric cylinder (101).

5. The NTC thermistor chip automated processing equipment according to claim 4, characterized in that: A cover plate (103) is slidably provided at the upper end of the dipping tank (102), and the cover plate (103) is arranged in an L shape. Two cover plates (103) are symmetrically provided along the center line of the dipping tank (102), and a movable plate (104) is slidably provided at the upper end of the opposite side of the cover plate (103), and the movable plate (104) is connected to the cover plate (103) through an elastic telescopic rod.

6. The NTC thermistor chip automated processing equipment according to claim 5, characterized in that: Two sets of rollers (105) are fixedly provided at the upper end of the movable plate (104), and mounting blocks (106) are fixedly provided on both sides of the cover plate (103). The mounting blocks (106) are only connected to the cover plate (103) and are slidably connected to the movable plate (104). A connecting plate (107) is slidably provided inside the mounting block (106), and the connecting plate (107) is fixedly connected to the movable plate (104).

7. The NTC thermistor chip automated processing equipment according to claim 6, characterized in that: An elastic member is provided at the lower end of the connecting plate (107), and the connecting plate (107) can slide up and down in the mounting block (106) through the elastic member. A spring (108) is fixedly provided on one side of the mounting block (106), and the other end of the spring (108) is fixedly connected to the dipping tank (102).

8. The NTC thermistor chip automated processing equipment according to claim 5, characterized in that: The lower end of the outer side of the cover plate (103) is provided with a plurality of air holes, which are connected to an external air pump through a connecting pipe. The air entering the cover plate (103) can be blown out toward the middle after the movable plate (104) is opened.

9. The NTC thermistor chip automated processing equipment according to claim 1, characterized in that: The guide rail (4) in the rotating ring (202) is arranged at a position slightly above the center of the rotating ring (202), the collecting chamber (201) is connected to the dipping tank (102) through a guide groove, the number of the placement grooves (205) is consistent with the number of workpieces on the mounting frame and the workpiece (5), and when the conveyor belt (3) in the dipping station (1) is moved to the lowermost end, the cover plate (103) can be moved to both sides first, and then the movable plate (104) can be closed by the roller (105).

10. The NTC thermistor chip automated processing equipment according to claim 1, characterized in that: Guide rails (4) and conveyor belts (3) are provided in both the dipping station (1) and the draining station (2), and a plurality of guide rails (4) and conveyor belts (3) are provided on one side of the dipping station (1) for loading materials.

Images