Pin cutting equipment for processing optoelectronic device

Abstract

The invention discloses a pin cutting device for machining a photoelectronic device, and particularly relates to the technical field of metal wire machining, the pin cutting device comprises a cutting frame and a photoelectronic device body, the top end of the cutting frame is provided with a clamping block and a cutting knife, and the clamping block is used for positioning and fixing the photoelectronic device body; the cutting assembly is used for stably supporting the pins of the optoelectronic device body on the clamping blocks and adaptively adjusting the distance between the cutting assembly and the pins of the optoelectronic device body; through the arrangement of the cutting assembly, the cutting assembly can be attached to the suspended pin of the optoelectronic device body, the pin cutting position of the optoelectronic device body can be stably supported, and the optoelectronic device body and the pin of the optoelectronic device body are kept stable; the damage to the optoelectronic device caused by bending or breaking of the pins of the optoelectronic device due to excessive stress is prevented, so that the cutting positions of the pins of the optoelectronic device body are accurately cut, and the cutting effect of the optoelectronic device body is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of metal wire processing, in particular to a lead cutting device for processing optoelectronic devices. Background Art

[0002] Optoelectronic devices are various functional devices made using the electro-photon conversion effect. During the processing of optoelectronic devices, since optoelectronic devices have strict requirements on the length and shape of the pins, inaccurate pin length may affect the performance and reliability of the device. Therefore, pin cutting equipment is required to cut the pins of the optoelectronic devices to accurately control the length of the pins. When the pins of the optoelectronic devices are cut, the clamping blocks in the cutting equipment are required to limit the optoelectronic devices and keep the pins of the optoelectronic devices aligned with the cutting knife. In this process, since the pins of the optoelectronic devices are not in a fixed state and are consistently suspended during cutting, when the pins of the optoelectronic devices come into contact with the cutting knife, most of the force of the cutting knife will act directly on the pins, causing the pins of the optoelectronic devices to bend or break due to excessive force, which may cause damage during the cutting process, which may affect the cutting effect of the optoelectronic devices. Summary of the Invention

[0003] The object of the present invention is to provide a pin cutting device for processing optoelectronic devices. Through the setting of the cutting component, it can fit with the suspended pins of the optoelectronic device body, which is beneficial to stably support the pin cutting position of the optoelectronic device body, so that the optoelectronic device body and its pins remain stable, preventing the pins of the optoelectronic device from bending or breaking due to excessive force, causing damage to the optoelectronic device, and accurately cutting the pin cutting position of the optoelectronic device body, thereby improving the cutting effect of the optoelectronic device body, so as to solve the above-mentioned shortcomings in the technology.

[0004] In order to achieve the above-mentioned object, the present invention provides the following technical solution: a lead cutting device for processing optoelectronic devices, comprising:

[0005] A cutting frame and an optoelectronic device body, wherein a clamping block and a cutting knife are respectively installed on the top of the cutting frame, and the clamping block is used to position and fix the optoelectronic device body;

[0006] The cutting assembly is used for stably supporting the pins of the optoelectronic device body on the clamping block and adaptively adjusting the distance between the pins and the optoelectronic device body, and comprises a contact frame arranged on one side of the clamping block, two stabilizing frames symmetrically mounted on the contact frame for supporting the pins of the optoelectronic device body, and two L-shaped frames symmetrically and fixedly connected to the top end of the contact frame, wherein a rotating column is jointly arranged between the two L-shaped frames, the two stabilizing frames are located in the two L-shaped frames and are sleeved on the rotating column, one side of the two L-shaped frames adjacent to the two stabilizing frames is fixedly provided with a side rod frame, the top end of the two side rod frames is fixedly provided with a first stabilizing block, the bottom end of the contact frame is hingedly provided with two connecting arms, the two connecting arms are used for pushing the contact frame to move upward or downward, the top end of the cutting frame is provided with an adaptive assembly, the adaptive assembly is used for driving the two connecting arms to move, one side of the clamping block is provided with two groups of guide assemblies matched with the two first stabilizing blocks, the guide assemblies are used for pressing the pins of the optoelectronic device body on the first stabilizing blocks and the stabilizing frames, and the cut pins of the optoelectronic device body are collected, one of the L-shaped frames is provided with an auxiliary assembly for driving the rotating column to rotate, which is used for driving the two stabilizing frames to synchronously adjust in the two L-shaped frames and changing the contact surface between the stabilizing frames and the pins of the optoelectronic device body; and the stabilizing frame is arranged in a triangular structure, the three corners of the stabilizing frame are different in shape, and the shape of the three corners of the stabilizing frame comprises a circular shape, an elliptical shape and an inclined plate arc, so that the three corners of the stabilizing frame have different contact surfaces with the pins of the optoelectronic device body, so that the pressure on the pins during the cutting process is dispersed on the contact surface, the local stress concentration is reduced, the pins are prevented from being damaged due to excessive stress after cutting, and the cutting position is ensured to be accurate.

[0007] Preferably, the adaptive assembly comprises a guide groove arranged on one side of the cutting frame close to the clamping block, two hinged seats mounted at the bottom end of the two connecting arms, and a right and left threaded column rotationally connected in the guide groove, the bottom end of the two hinged seats is fixedly provided with a moving sleeve, the two moving sleeves are located in the guide groove and are sleeved on the outside of the right and left threaded column, a servo motor is fixedly arranged in the guide groove, and the servo motor is used for driving the right and left threaded column to rotate; and the two moving sleeves are provided with internal threads matched with the threads on the surface of the right and left threaded column, which are used for stably moving the two connecting arms, so that the two connecting arms move to push the contact frame and the stabilizing frame to move upward or downward, thereby adjusting the distance between the stabilizing frame and the pins of the optoelectronic device body, supporting the part of the pins of the optoelectronic device body outside the clamping block, so that the pins of the optoelectronic device body remain horizontal during cutting, facilitating accurate cutting of the pins of the optoelectronic device body, and thereby adapting to the use requirements of the pins of the optoelectronic device body of different heights.

[0008] Preferably, two limit blocks are fixed on the outside of the two movable sleeves, and a connecting rod is fixed on the side of the guide groove close to the positive and negative threaded columns, and the two limit blocks are slidably sleeved on the connecting rod; and the connecting rod and the positive and negative threaded columns are kept horizontal in the guide groove, and there is a distance between the positive and negative threaded columns and the connecting rod, so that the two limit blocks can maintain stable movement along the connecting rod, avoiding mutual interference between the limit blocks and the positive and negative threaded columns.

[0009] The cam is secured to the first gear and is secured to the second gear of the driver having a key connection with the guide rail, the cam being secured to the first gear and being secured to the second gear of the driver having a key connection with the guide rail. The movable second rack moves synchronously along the slide groove, so that the second stabilizing block and the first stabilizing block are synchronously close to and restricted to the outside of the pins of the optoelectronic device body, and then the pins of the optoelectronic device body are supported at multiple points on the rotating column and the stabilizing frame, and the rotating column and the side corresponding to the second stabilizing block are provided with a tooth structure, which can form multiple points of contact on the clamping surface, forming a firm bite effect, ensuring that the pins will not move easily due to impact force during cutting, thereby ensuring the stability and reliability of the cutting process, and at the same time, the pins of the optoelectronic device body can be kept in a taut state on the stabilizing frame, and then, the restriction of the second stabilizing block and the first stabilizing block can collect the pins of the optoelectronic device body after cutting, thereby avoiding the pins from splashing after cutting, and facilitating the protection of the equipment and the collection of waste.

[0010] Preferably, an I-shaped slide bar is installed on one side of the first rack and the second rack, and two positioning slide bars are opened in the slide bar for the two I-shaped slide bars to slide; and the two I-shaped slide bars slide between the two positioning slide bars and do not disengage, so that the first rack and the second rack can move stably in the slide bar to prevent displacement during the movement, and then the second stabilizing block can move stably with the first stabilizing block.

[0011] Preferably, the auxiliary component includes a connecting column installed between the rotating column and one of the L frames, a mounting ring disk fixed on one side of one of the L frames, and a rotating disk rotatably connected to the mounting ring disk, and one end of the connecting column passes through the L frame and the mounting ring disk and is fixed to one end of the rotating disk, and a guide block matching the rotating disk is fixed in the mounting ring disk; and the rotating disk is arranged in a ratchet wheel structure, so that the rotating disk and the guide block are combined to form a ratchet gear set that cooperates with each other, and the guide block is embedded in the outer tooth pitch of the rotating disk, so that the rotating disk and the guide block are combined to form a thorn same-direction rotation structure, so that the rotating disk can only rotate clockwise along the mounting ring disk, which can prevent the rotating disk from rotating in the opposite direction when rotating, thereby improving the precise adjustment of the rotating column.

[0012] Preferably, a resistance ring is provided on one side of the rotating disk, and a plurality of rod insertion grooves are opened in the mounting ring disk. An insertion rod is fixed to one end of the resistance ring, and one end of the insertion rod passes through the rotating disk and is inserted into one of the rod insertion grooves; and the insertion rod is inserted into one of the rod insertion grooves to restrict the rotating disk in the mounting ring disk, ensuring that the rotating disk remains stable in the mounting ring disk. At the same time, the insertion rod is connected to the rotating disk and will not be detached, so that the insertion rod moves along the rotating disk to extend one side of the rotating disk, which is convenient for the operator to have a stable grip on the rotating disk and improve the stability of the rotation of the rotating disk.

[0013] Preferably, a threaded interference block is also installed at one end of the interference ring, a threaded groove is opened in the middle of one end of the connecting column, and one end of the threaded interference block passes through the interference ring and is screwed into the threaded groove; and the interference ring and the rotating disk are both sleeved on the outside of the threaded interference block, so that the threaded interference block can rotate along the interference ring and the rotating disk and be screwed into the threaded groove, and the threaded interference block moves and interferes with the interference ring, further enhancing the restriction of the interference ring on the rotating disk, so that the threaded interference block and the interference ring maintain good cooperation, ensuring that the rotating column rotates to keep the position of the stabilization frame stable after adjustment.

[0014] In the above technical solution, the technical effects and advantages provided by the present invention are:

[0015] 1. By setting the cutting component, it can fit with the suspended pins of the optoelectronic device body, which is conducive to stably supporting the cutting position of the pins of the optoelectronic device body, so that the optoelectronic device body and its pins remain stable, preventing the pins of the optoelectronic device from bending or breaking due to excessive force, causing damage to the optoelectronic device, and accurately cutting the cutting position of the pins of the optoelectronic device body, thereby improving the cutting effect of the optoelectronic device body.

[0016] 2. By setting up the guide assembly, the second stabilizing block and the first stabilizing block can be simultaneously moved toward and restricted to the outside of the pins of the optoelectronic device body, so that the pins of the optoelectronic device body are supported at multiple points on the rotating column and the stabilizing frame, ensuring that the pins will not move easily due to impact force during cutting, thereby ensuring the stability and reliability of the cutting process.

[0017] 3. By setting the first stabilizing block and the second stabilizing block, the pins of the optoelectronic device body can be firmly engaged with each other, so that the restrictions of the second stabilizing block and the first stabilizing block can collect the pins of the optoelectronic device body after cutting, avoiding the pins from splashing after cutting, facilitating the protection of the equipment and the collection of waste, and further improving the flexibility of the equipment in cutting the pins of the optoelectronic device body.

[0018] 4. By setting up the auxiliary components, it is possible to drive the rotating column and the stabilizing frame to rotate, which is conducive to adjusting the contact surface between the stabilizing frame and the optoelectronic device body, so that the stabilizing frame and the pins of the optoelectronic device body have different contact surfaces. Therefore, during the cutting process, the pressure on the pins will be dispersed on the contact surface, reducing local stress concentration, preventing the pins from being damaged due to excessive force after cutting, ensuring the accuracy of the cutting position, and further improving the cutting effect of the optoelectronic device body. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments described in the present invention. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0020] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 A schematic diagram of the structure of the assembly of the cutting assembly and the optoelectronic device body of the present invention;

[0022] Figure 3 It is a structural schematic diagram of the cutting assembly of the present invention;

[0023] Figure 4 This is a schematic structural diagram of the assembly of the first stabilizing block and the stabilizing frame of the present invention;

[0024] Figure 5 It is a structural diagram of the adaptation component of the present invention;

[0025] Figure 6 This is an exploded view of the guide assembly of the present invention;

[0026] Figure 7This is a schematic diagram of the structure of the second stabilizing block and the first stabilizing block assembled according to the present invention;

[0027] Figure 8 This is a schematic structural diagram of the assembly of the rotating disk and the guide block of the present invention;

[0028] Figure 9 Schematic diagram of the structure of the auxiliary components of the present invention.

[0029] Description of reference numerals:

[0030] 1. Cutting frame; 11. Clamping block; 12. Cutting knife; 13. Optoelectronic device body;

[0031] 2. Cutting assembly; 21. Contact frame; 22. L frame; 23. Stabilizing frame; 24. Rotating column; 25. Engaging arm; 26. Side rod frame; 27. First stabilizing block;

[0032] 3. Adaptive assembly; 31. Positive and negative threaded column; 32. Articulated seat; 33. Moving sleeve; 34. Limit block; 35. Connecting rod; 36. Servo motor; 37. Guide groove;

[0033] 4. Guide assembly; 41. Support seat; 42. Connecting arm; 43. Second stabilizing block; 44. Push rod; 45. Positioning slide; 46. First rack; 47. Second rack; 48. Gear; 49. I-shaped slide;

[0034] 5. Auxiliary components; 51. Connecting column; 52. Mounting ring plate; 53. Rotating plate; 54. Guide block; 55. Insert rod; 56. Interference ring; 57. Threaded interference block; 58. Threaded groove; 59. Insert rod groove. DETAILED DESCRIPTION

[0035] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0036] The present invention provides Figures 1-9 The device for cutting leads for processing optoelectronic devices shown in the figure comprises: a cutting frame 1 and an optoelectronic device body 13. A clamping block 11 and a cutting blade 12 are respectively installed on the top of the cutting frame 1, and the clamping block 11 is used to position and fix the optoelectronic device body 13.

[0037] The cutting assembly 2 is used to stably support the pins of the optoelectronic device body 13 on the clamping block 11 and adaptively adjust the distance between the pins of the optoelectronic device body 13 and the cutting assembly 2, and includes a contact frame 21 arranged on one side of the clamping block 11, two stabilizing frames 23 symmetrically mounted on the contact frame 21 for supporting the pins of the optoelectronic device body 13, and two L frames 22 symmetrically fixedly connected to the top of the contact frame 21, a rotating column 24 is commonly installed between the two L frames 22, the two stabilizing frames 23 are located in the two L frames 22 and are sleeved on the rotating column 24, and the two L frames 22 are fixed with side rod frames 26 on one side adjacent to the two stabilizing frames 23, and the tops of the two side rod frames 26 are fixed with first stabilizing blocks 27, and the contact frame 2 1 is hinged to the bottom end of two connecting arms 25, and the two connecting arms 25 are used to push the contact frame 21 to move upward or downward. The top of the cutting frame 1 is provided with an adaptation component 3, and the adaptation component 3 is used to drive the two connecting arms 25 to move. One side of the clamping block 11 is provided with two sets of guide components 4 that cooperate with the two first stabilizing blocks 27, and the guide components 4 are used to press the pins of the optoelectronic device body 13 on the first stabilizing block 27 and the stabilizing frame 23, and collect the pins of the cut optoelectronic device body 13. One of the L frames 22 is provided with an auxiliary component 5 that drives the rotating column 24 to rotate, which is used to drive the two stabilizing frames 23 to adjust synchronously within the two L frames 22 and change the contact surface between the stabilizing frame 23 and the pins of the optoelectronic device body 13.

[0038] The adaptation component 3 includes a guide groove 37 opened on the side of the cutting frame 1 close to the clamping block 11, two hinged seats 32 installed at the bottom ends of the two connecting arms 25, and a forward and reverse threaded column 31 rotatably connected to the guide groove 37. The bottom ends of the two hinged seats 32 are fixed with movable sleeves 33, and the two movable sleeves 33 are located in the guide groove 37 and are sleeved on the outside of the forward and reverse threaded column 31. A servo motor 36 is fixed in the guide groove 37, and the servo motor 36 is used to drive the forward and reverse threaded column 31 to rotate; two limit blocks 34 are also fixed to the outside of the two movable sleeves 33, and a connecting rod 35 is fixed on the side of the guide groove 37 close to the forward and reverse threaded column 31, and the two limit blocks 34 are slidably sleeved on the connecting rod 35.

[0039] When the pins of the optoelectronic device are cut, the clamping block 11 first limits the optoelectronic device body 13 so that the part of the pins of the optoelectronic device body 13 that needs to be cut is located below the cutting knife 12. The servo motor 36 drives the positive and negative threaded columns 31 to rotate, and then the positive and negative threaded columns 31 rotate and engage with the two movable sleeves 33, so that the two movable sleeves 33 move relative to or oppositely along the positive and negative threaded columns 31. At this time, the two movable sleeves 33 move relative to each other to slide the two limit blocks 34 installed on their outside along the connecting rod 35, and the movement of the two movable sleeves 33 drives the two hinged seats 32 to move and push the two connecting arms 25 to move, so that the angle between the two connecting arms 25 changes, and the two connecting arms 25 move along the bottom of the contact frame 21 and push the contact frame 21 to The L frame 22, the side rod frame 26, the first stabilizing block 27 and the stabilizing frame 23 move upward, and the stabilizing frame 23 moves upward, so that the contact frame 21 moves and drives the L frame 22, the side rod frame 26, the first stabilizing block 27 and the stabilizing frame 23 to move upward synchronously. As the stabilizing frame 23 moves, it slowly approaches the pins of the optoelectronic device body 13 and supports it. Then, it can fit with the suspended pins of the optoelectronic device body 13, which is conducive to stably supporting the pin cutting part of the optoelectronic device body 13, so that the optoelectronic device body 13 and its pins remain stable. Then, the cutting knife 12 is driven to cut the pins of the optoelectronic device body 13, and then it can prevent the pins of the optoelectronic device from bending or breaking due to excessive force, causing damage to the optoelectronic device, so that the pin cutting position of the optoelectronic device body 13 is accurately cut, thereby improving the cutting effect of the optoelectronic device body 13.

[0040] refer to Figure 1-Figure 7 As shown, the guide assembly 4 includes a connecting bent arm 42 fixed to one side of the clamping block 11, a second stabilizing block 43 installed on the first stabilizing block 27, and a support seat 41 fixed to the side of the connecting bent arm 42 near the side rod frame 26, and the middle part of one side of the support seat 41 is recessed inward to form a slide groove, and the middle part of the inner part of the slide groove is rotatably connected to a gear 48, and a second rack 47 is fixed to the side of the second stabilizing block 43 near the slide groove, and a first rack 46 is installed on the side of the first stabilizing block 27 near the slide groove, and the second rack 47 and the first rack 46 are respectively located in the slide groove and meshed with the gear 48, and a push rod 44 is fixed to the top of the contact frame 21, and the push rod 44 is used to push the first rack 46 to slide along the slide groove; one side of the first rack 46 and the second rack 47 are both installed with an I-shaped slide bar 49, and two positioning slide grooves 45 are provided in the slide groove for the two I-shaped slide bars 49 to slide.

[0041] Through the above technical solution:

[0042] When the cutting component 2 is close to the pin of the optoelectronic device, first the first stabilizing block 27 and the side rod frame 26 move to move it upward along the side of the support seat 41, and the side rod frame 26 moves to push the first rack 46 to move upward along the slide groove, and then the first rack 46 is meshed with the gear 48 for transmission. At this time, the gear 48 rotates and meshes with the second rack 47 for transmission, so that the second rack 47 moves downward along the slide groove. As the second rack 47 moves downward, it drives the second stabilizing block 43 to move downward along the side of the support seat 41, so that the second stabilizing block 43 moves synchronously with the first stabilizing block 27, and then the second stabilizing block 43 and the first stabilizing block 27 slowly move toward the optoelectronic device itself. The outside of the pins of the body 13 are close to and in conflict with each other, so that the second stabilizing block 43 and the first stabilizing block 27 can simultaneously approach and restrict the outside of the pins of the optoelectronic device body 13, so that the pins of the optoelectronic device body 13 are supported at multiple points on the rotating column 24 and the stabilizing frame 23, ensuring that the pins will not move easily due to impact force during cutting. At the same time, the first stabilizing block 27 and the second stabilizing block 43 can firmly engage the pins of the optoelectronic device body 13, so that the restrictions of the second stabilizing block 43 and the first stabilizing block 27 can collect the pins of the optoelectronic device body 13 after cutting, thereby ensuring the stability and reliability of the cutting process.

[0043] refer to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 8 and Figure 9 As shown, the auxiliary component 5 includes a connecting column 51 installed between the rotating column 24 and one of the L frames 22, a mounting ring disk 52 fixed to one side of one of the L frames 22, and a rotating disk 53 rotatably connected in the mounting ring disk 52, and one end of the connecting column 51 passes through the L frame 22 and the mounting ring disk 52 and is fixed to one end of the rotating disk 53, and a guide block 54 that cooperates with the rotating disk 53 is fixed in the mounting ring disk 52; a resistance ring 56 is provided on one side of the rotating disk 53, and a plurality of rod insertion grooves 59 are opened in the mounting ring disk 52, and an insertion rod 55 is fixed at one end of the resistance ring 56, and one end of the insertion rod 55 passes through the rotating disk 53 and is inserted into one of the rod insertion grooves 59; a threaded resistance block 57 is also installed at one end of the resistance ring 56, and a threaded groove 58 is opened in the middle of one end of the connecting column 51, and one end of the threaded resistance block 57 passes through the resistance ring 56 and is screwed into the threaded groove 58.

[0044] Through the above technical solution:

[0045] When it is necessary to adjust the contact surface between the stabilizing frame 23 and the pin of the optoelectronic device, the threaded interference block 57 is rotated to engage it with the thread groove 58, so that the threaded interference block 57 moves horizontally outward along the thread groove 58, and then the threaded interference block 57 moves and moves outward along the rotating disk 53 and the interference ring 56. At this time, the distance between the threaded interference block 57 and the interference ring 56 is constantly increasing, and the threaded interference block 57 moves along the thread groove 58, so that the threaded interference block 57 and the interference ring 56 lose contact, and the interference ring 56 is pulled to move the rod 55 installed at one end thereof along one of the rod grooves 59 and the rotating disk 53 in the direction of the force, so that the rod 55 is separated from one of the rods. In the groove 59, as the rotating contact ring 56 drives the insertion rod 55 and the rotating disk 53 to rotate, the rotating disk 53 slides with the guide block 54, and then the rotating disk 53 rotates along the mounting ring disk 52, driving the connecting column 51 to rotate along the L frame 22 and the mounting ring disk 52, so that the rotation of the connecting column 51 drives the rotating column 24 to rotate, and then the rotation of the rotating column 24 drives the stabilizing frame 23 to rotate, which is conducive to adjusting the contact surface between the stabilizing frame 23 and the optoelectronic device body 13, so that the stabilizing frame 23 has different contact surfaces with the pins of the optoelectronic device body 13, preventing the pins from being damaged due to excessive force after cutting, ensuring the accuracy of the cutting position, and further improving the cutting effect of the optoelectronic device body 13.

[0046] The above description is only of certain exemplary embodiments of the present invention by way of illustration. It is undeniable that a person skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A lead cutting device for processing optoelectronic devices, characterized in that: include: A cutting frame (1) and an optoelectronic device body (13), wherein a clamping block (11) and a cutting knife (12) are respectively installed at the top end of the cutting frame (1), and the clamping block (11) is used to position and fix the optoelectronic device body (13); A cutting assembly (2) is used to stably support the pins of an optoelectronic device body (13) on a clamping block (11) and adaptively adjust the distance between the pins of the optoelectronic device body (13) and the cutting assembly (2), wherein the cutting assembly (2) comprises a contact frame (21) arranged on one side of the clamping block (11), two stabilizing frames (23) symmetrically mounted on the contact frame (21) for supporting the pins of the optoelectronic device body (13), and two L frames (22) symmetrically fixedly connected to the top of the contact frame (21), a rotating column (24) being commonly mounted between the two L frames (22), the two stabilizing frames (23) being located in the two L frames (22) and being sleeved on the rotating column (24), a side rod frame (26) being fixed on one side of the two L frames (22) adjacent to the two stabilizing frames (23), a first stabilizing block (27) being fixed on the top of the two side rod frames (26), and the contact frame (21) being fixed to the top of the two side rod frames (26). The bottom end of the cutting frame (1) is hinged with two connecting arms (25), and the two connecting arms (25) are used to push the contact frame (21) to move upward or downward. The top end of the cutting frame (1) is provided with an adaptation component (3), and the adaptation component (3) is used to drive the two connecting arms (25) to move. One side of the clamping block (11) is provided with two groups of guide components (4) that cooperate with the two first stabilizing blocks (27), and the guide components (4) are used to press the pins of the optoelectronic device body (13) on the first stabilizing block (27) and the stabilizing frame (23), and collect the pins of the cut optoelectronic device body (13). One of the L frames (22) is provided with an auxiliary component (5) that drives the rotating column (24) to rotate, and is used to drive the two stabilizing frames (23) to adjust synchronously in the two L frames (22), and change the contact surface between the stabilizing frame (23) and the pins of the optoelectronic device body (13).

2. The lead cutting device for optoelectronic device processing according to claim 1, characterized in that: The adapting assembly (3) comprises a guide groove (37) provided on a side of the cutting frame (1) close to the clamping block (11), two hinged seats (32) installed at the bottom ends of the two connecting arms (25), and a forward and reverse threaded column (31) rotatably connected in the guide groove (37), wherein the bottom ends of the two hinged seats (32) are both fixed with a movable sleeve (33), and the two movable sleeves (33) are located in the guide groove (37) and sleeved on the outside of the forward and reverse threaded column (31), and a servo motor (36) is fixed in the guide groove (37), and the servo motor (36) is used to drive the forward and reverse threaded column (31) to rotate.

3. The lead cutting device for processing optoelectronic devices according to claim 2, characterized in that: Two limit blocks (34) are fixed to the outside of the two movable sleeves (33), and a connecting rod (35) is fixed to one side of the guide groove (37) close to the positive and negative threaded columns (31), and the two limit blocks (34) are slidably sleeved on the connecting rod (35).

4. The lead cutting device for processing optoelectronic devices according to claim 1, characterized in that: The guide assembly (4) includes a connecting arm (42) fixed on one side of the clamping block (11), a second stabilizing block (43) mounted on the first stabilizing block (27), and a support seat (41) fixed on the side of the connecting arm (42) close to the side rod frame (26), and the middle part of one side of the support seat (41) is recessed inward to form a slide groove, and a gear (48) is rotatably connected to the middle part of the inner part of the slide groove. A second rack (47) is fixed on the side of the second stabilizing block (43) close to the slide groove, and a first rack (46) is mounted on the side of the first stabilizing block (27) close to the slide groove. The second rack (47) and the first rack (46) are respectively located in the slide groove and mesh with the gear (48). A push rod (44) is fixed on the top of the contact frame (21), and the push rod (44) is used to push the first rack (46) to slide along the slide groove.

5. The lead cutting device for processing optoelectronic devices according to claim 4, characterized in that: An I-shaped slide bar (49) is installed on one side of each of the first rack (46) and the second rack (47), and two positioning slide grooves (45) for the two I-shaped slide bars (49) to slide are provided in the slide groove.

6. The lead cutting device for processing optoelectronic devices according to claim 1, characterized in that: The auxiliary component (5) includes a connecting column (51) installed between the rotating column (24) and one of the L-frames (22), a mounting ring disk (52) fixed to one side of one of the L-frames (22), and a rotating disk (53) rotatably connected to the mounting ring disk (52), and one end of the connecting column (51) passes through the L-frame (22) and the mounting ring disk (52) and is fixed to one end of the rotating disk (53), and a guide block (54) that cooperates with the rotating disk (53) is fixed in the mounting ring disk (52).

7. The lead cutting device for processing optoelectronic devices according to claim 6, characterized in that: A contact ring (56) is provided on one side of the rotating disk (53), and a plurality of rod insertion grooves (59) are provided in the mounting ring disk (52). An insertion rod (55) is fixed to one end of the contact ring (56), and one end of the insertion rod (55) passes through the rotating disk (53) and is inserted into one of the rod insertion grooves (59).

8. The lead cutting device for processing optoelectronic devices according to claim 6, characterized in that: A threaded resistance block (57) is further installed at one end of the resistance ring (56), a threaded groove (58) is provided in the middle of one end of the connecting column (51), and one end of the threaded resistance block (57) passes through the resistance ring (56) and is screwed into the threaded groove (58).

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