Modularized satellite group component

Abstract

A modular satellite group component disclosed by the present invention comprises a power supply module, a communication module, an attitude control module, a data processing module, a propulsion module and a system management module, the power supply module comprises a solar cell panel, a storage battery pack and an energy management circuit, and the communication module comprises a communication antenna, a radio frequency transceiver and a baseband processing unit. The attitude control module comprises a sensor, an execution mechanism and a controller, the data processing module comprises a processor, a memory and a data interface, the propulsion module comprises a propellant storage tank, an engine and a pipeline system, and the system management module comprises a high-performance processor, a storage unit and a communication interface circuit. The method has the beneficial effects that the maintenance efficiency is improved, the maintenance cost is reduced, function upgrading is facilitated, the design flexibility is enhanced, the development cost is reduced, the development period is shortened, and the satellite reliability and expandability are improved.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of satellites, and particularly relates to a modular satellite assembly component. BACKGROUND

[0002] In the current aerospace field, satellite technology is widely used in communication, remote sensing, navigation and other important fields. However, in the design and manufacturing process of traditional satellites, an integrated design mode is generally adopted. This design tightly integrates various functional components of the satellite, which meets the requirements of specific tasks in the early stage of aerospace development.

[0003] The traditional integrated satellite design integrates various functional components such as power supply system, communication system, attitude control system, etc. according to a fixed layout, and the lines and mechanical structures of the components are interwoven. In terms of function implementation, the systems are tightly coupled and work cooperatively through unified control logic. For example, in a certain type of communication satellite, the power supply line runs through the entire satellite platform, and the lines of the communication antenna, signal processing unit and other components are interpenetrated. The installation position of the attitude control actuator is also limited by the layout of other components.

[0004] Difficult maintenance and high cost: when a component of the satellite fails, it is difficult for maintenance personnel to quickly locate and replace the faulty component due to the tight integration of the components, and the entire satellite system often needs to be disassembled and checked, resulting in long maintenance period and high cost. According to statistics, the time consumed for a single major component maintenance of a traditional satellite can reach several months, and the cost can be as high as 10%-20% of the satellite manufacturing cost.

[0005] Limited function upgrade: with the rapid development of aerospace technology, the functional requirements of satellites are constantly updated. The traditional integrated design cannot meet the rapid upgrade requirements. If the function upgrade is to be realized, the satellite needs to be greatly modified, which not only consumes time and effort, but also may affect the original performance of the satellite. For example, to add a new remote sensing frequency band function to a traditional satellite, the load system, data processing system and communication system of the satellite need to be redesigned and adjusted.

[0006] Insufficient design flexibility: different aerospace tasks have different requirements for the combination of satellite functions. Under the traditional design, the compatibility and interchangeability of the components are poor, and the satellite configuration cannot be flexibly adjusted according to the task, making it difficult to quickly respond to diversified task requirements.

[0007] Long development cycle and high cost: due to the interwoven lines and mutual restriction of mechanical structures between components, the assembly, integration and test (AIT) process needs to be repeatedly debugged, resulting in a long development cycle. The integrated design cannot realize the standardization of modules for mass production, and the key components need to be customized and manufactured, with more than 40% of the manual assembly and debugging, which is extremely costly. SUMMARY

[0008] The technical problems to be solved by the present invention are the difficulties and high costs in maintaining traditional satellites, limited function upgrades, insufficient design flexibility, long development cycles and high costs.

[0009] To achieve the above-mentioned objectives, the present invention adopts the following technical solution: including a power module, a communication module, a posture control module, a data processing module, a propulsion module and a system management module, the power module including a solar panel, a battery pack and an energy management circuit, the communication module including a communication antenna, a radio frequency transceiver and a baseband processing unit, the posture control module including a sensor, an actuator and a controller, the data processing module including a processor, a memory and a data interface, the propulsion module including a propellant storage tank, an engine and a piping system, and the system management module including a high-performance processor, a storage unit and a communication interface circuit.

[0010] Preferably, the solar panels are made of high-efficiency gallium arsenide photovoltaic materials, and are made into cell sheets through processes such as photolithography, etching, and coating. The cell sheets are then assembled in series and parallel to form a solar panel array; the battery packs are made of high-energy-density lithium-ion battery cells, which are combined in series and parallel, and a battery management system BMS is installed to achieve battery charge and discharge management and status monitoring; the energy management circuit adopts printed circuit board PCB technology, and electronic components such as DC-DC converters and MPPT controllers are soldered on the circuit board to complete the production of the energy management circuit.

[0011] Preferably, the communication antenna designs an antenna structure according to the communication frequency band and performance requirements, uses metal materials through stamping, welding and other processes to make the antenna radiation unit, and then assembles it with the feeding network to form a communication antenna; the RF transceiver uses a high-performance RF chip, and uses surface mount technology (SMT) to weld the chip and other electronic components on the RF circuit board to complete the assembly of the RF transceiver; the baseband processing unit designs the baseband processing circuit, welds the processor, memory and other chips on the circuit board, and writes the baseband processing software and burns it into the processor.

[0012] Preferably, the sensor includes a gyroscope and an accelerometer, and the gyroscope and accelerometer chips are manufactured using MEMS technology. The chips are packaged and integrated with the signal conditioning circuit to form a sensor module. The actuator includes a torque motor and a jet propulsion system. The torque motor is manufactured using high-precision processing technology to produce the motor rotor and stator, and the bearings and encoders are installed. The jet propulsion system manufacturing includes propellant nozzle processing, solenoid valve installation and pipeline connection. The controller hardware part includes a microcontroller, a drive circuit and a signal conditioning chip, and the software part includes an attitude control algorithm and a dynamic response strategy, which can adjust the control parameters in real time to adapt to different orbital environments.

[0013] Preferably, the processor adopts a multi-core heterogeneous architecture to improve data processing efficiency, and the memory adopts solid-state storage technology to ensure the reliability of data storage; the data processing module reserves expansion interfaces and space to improve performance by increasing processor cores or expanding memory capacity; the processor and memory both adopt advanced flip-chip technology to install multi-core processors and large-capacity memory chips on a circuit board; the data interface is a high-speed data interface circuit that adopts differential signal transmission technology to ensure the stability and high speed of data transmission.

[0014] Preferably, the propellant storage tank is made of high-strength aluminum alloy material and is manufactured through processes such as spinning and welding, and is subjected to pressure testing and sealing testing; the engine is an electric propulsion engine, and its manufacturing includes ion source processing, acceleration grid production and power system assembly; the piping system uses high-pressure resistant and corrosion-resistant piping materials, and its installation process performs pipeline connection and sealing treatment to ensure that the propellant delivery system is leak-free.

[0015] Preferably, the high-performance processor adopts a radiation-resistant multi-core RISC processor, which integrates 4-8 processing cores based on the reduced instruction set architecture RISC, supports parallel computing and task partitioning processing, and meets the real-time control and multi-task scheduling requirements of satellites; the storage unit adopts a three-level architecture of "cache + main memory + non-volatile storage", cache: 256KB-1MB radiation-resistant SRAM is integrated on the chip, with an access delay of <10ns, supporting fast data reading and writing and task caching; main memory: configured with 2GB-4GB radiation-resistant DDR3 SDRAM, operating frequency of 800MHz, and using error checking and correction technology; non-volatile storage: equipped with 128GB-512GB radiation-resistant NAND flash memory, supports power-off data protection, adopts wear leveling algorithm, and has a service life of more than 10 years, meeting the satellite on-orbit data log storage requirements; the communication interface circuit includes a high-speed data interface, a control signal interface, a power control interface and a status monitoring interface.

[0016] Preferably, the power module, communication module, attitude control module, data processing module, propulsion module and system management module have the following standardized interface designs:

[0017] Mechanical interface: Adopting a unified mechanical structure and connection standards, the electrical connectors of all modules are designed on the bottom surface of the single unit, enabling "blind plug-in" installation with the integrated support platform. Connection methods include a snap-on quick-connect structure with a positioning pin and a bolt-type connection structure, ensuring convenient module installation and removal while meeting the mechanical strength requirements of satellite launch and on-orbit operation. The dimensional tolerance of the mechanical interface is controlled within ±0.1mm to ensure the accuracy and stability of module installation and meet the high-precision requirements of module installation.

[0018] Electrical interface: Unified electrical connection specifications and signal transmission standards are established between modules. The core of this is the use of an integrated support platform, a "system-level platform" that integrates the electrical interconnection functions of the satellite structure and equipment. This platform integrates all power buses, high-speed data buses, and control signal lines. All modules connect to it through blind-plug electrical connectors at the bottom, thus achieving electrical connection between all modules, completely eliminating traditional cables and realizing a "cableless" design. Interface specifications include power interface, data interface, and control interface. The power interface adopts an anti-reverse connection design to avoid failures caused by incorrect interface connection. The power interface has overcurrent and overvoltage protection functions. The data interface uses high-speed differential signal transmission technology with a transmission rate of up to 0Gbps. The control interface has a fault isolation function. The specific isolation method is: the system management module sends instructions to the power distribution and switching module (PDSM). After receiving the instructions, the matrix switch integrated in the PDSM can accurately disconnect the power path to the specific faulty module, thereby physically isolating it from the main power bus.

[0019] Software interface: Defines standardized communication protocols and data formats between modules to enable information exchange and collaborative work between modules. Designed using a service-oriented architecture (SOA), the software interface offers excellent compatibility and scalability, supporting the integration of different software versions and functional modules. The software interface also features fault detection and isolation, implemented by the system management module continuously monitoring telemetry data uploaded from each module via the LVDS bus.

[0020] The modules interact with each other through standardized interfaces, which reduces the coupling between modules.

[0021] Preferably, the power module, communication module, attitude control module, data processing module, propulsion module and system management module have the following optimized designs:

[0022] Miniaturization and lightweighting: Advanced integration technologies and new materials are used to reduce module size and weight. In the data processing module, system-on-chip (SoC) technology is used to integrate processors, memory, and other functions on the same chip, reducing module size by 40%. In structural design, carbon fiber composite materials are used to reduce module weight by 30%.

[0023] Low-power design: Module power consumption is reduced through optimized circuit design, the use of low-power components, and intelligent power management strategies. Intelligent power management is a dynamic energy allocation algorithm executed by the system management module. This algorithm monitors the energy status of the entire system in real time and optimizes energy allocation based on the region and operating mode.

[0024] In sunny areas, when energy is sufficient, the system management module calculates the exact total current required, i.e., load current + battery charging current, and instructs each power control module (PCU) to operate in constant current output mode. When energy is insufficient, the PCU is instructed to operate in maximum power point tracking (MPPT) mode.

[0025] In the shaded area, the system is fully powered by batteries. The system management module continuously monitors the battery discharge depth and proactively switches off non-critical loads when necessary to conserve power. A sleep / wake-up mechanism is introduced in each module to reduce power consumption when not in operation.

[0026] Improved reliability and maintainability: The modules employ internal redundant design and fault detection technology, and key components are equipped with backup units, such as dual backup power supplies and dual processors. When the primary device fails, the backup device automatically switches to ensure the normal operation of the satellite. At the same time, each module integrates a self-diagnosis system, which is implemented by combining distributed status monitoring with centralized intelligent decision-making. Each module has low-level self-test and telemetry reporting functions, and the system management module, as the decision-making core, is responsible for centralized autonomous fault diagnosis, isolation, and reconstruction of the FDIR. It continuously collects the health status and telemetry data of all modules via the high-speed LVDS bus. Upon receiving an alarm message, such as overcurrent or no telemetry response, it queries its internal fault response rule library, makes an autonomous decision, and sends a command, thereby achieving rapid and autonomous fault handling without ground intervention. The self-diagnosis system can also transmit fault information to the ground control center via the communication module, facilitating timely repair and replacement by ground personnel.

[0027] Preferably, the communication protocol includes power module software, communication module software, attitude control module software, data processing module software, propulsion module software and system management module software. The fault isolation is that the system management module actively sends instructions to the power distribution and switching module according to the preset fault diagnosis and response logic FDIR, controls the matrix switch inside it to cut off the power supply of the fault channel, thereby completing the isolation operation and disconnecting the fault module or load from the entire system.

[0028] The beneficial effects of the present invention are:

[0029] Improved maintenance efficiency and reduced costs: When a module fails, only the corresponding module needs to be replaced, eliminating the need to overhaul the entire satellite. This significantly reduces maintenance time and costs. For example, if a communication module fails, a new one can be quickly replaced, quickly restoring communication functionality.

[0030] Easier function upgrades: As technology advances, satellite functionality can be enhanced by replacing or upgrading corresponding modules without requiring large-scale satellite modifications. For example, to improve a satellite's data processing capabilities, simply replace it with a more powerful data processing module.

[0031] Enhanced design flexibility: The modular design makes satellite design more flexible. Different modules can be flexibly combined to meet different mission requirements, allowing for the rapid construction of a satellite system that meets the requirements. For example, for different remote sensing missions, remote sensing modules with different performance can be combined with other modules to achieve different remote sensing functions.

[0032] Reduced development costs and cycle time: Since modules can be standardized and mass-produced, production costs are reduced. Furthermore, the cable-free modular design greatly simplifies the assembly, integration, and test (AIT) process, reducing reliance on highly skilled labor and the potential for human error. This significantly shortens the development cycle and lays the foundation for rapid mass production of constellation satellites.

[0033] Improved satellite reliability: The system utilizes a distributed architecture, ensuring that failure of a single module will not catastrophically impact the overall system's operation. Modules interact through standardized interfaces, reducing inter-module coupling. Furthermore, the system features autonomous fault diagnosis, isolation, and reconstruction (FDIR) capabilities, enabling proactive response to faults and improving the satellite's overall reliability.

[0034] Scalability: The modular division takes into account future technological development and functional upgrades, reserving expansion interfaces and space. For example, data processing capabilities can be improved by upgrading the system management module or adding a dedicated co-processing module. Functionality can also be expanded between integrated support platforms through dedicated interfaces. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 This is a block diagram of the structural relationship of each independent module of the satellite.

[0036] Figure 2 This is a structural block diagram of the snap-on mechanical interface between modules.

[0037] Figure 3 This is a block diagram of the connection relationship of the electrical interfaces of each module.

[0038] Figure 4 This is a flowchart showing how each module software implements information interaction through standardized communication protocols. DETAILED DESCRIPTION

[0039] 1. Module Division Strategy and Manufacturing

[0040] like Figure 1-4As shown in the figure, according to the functional characteristics of the satellite, the satellite is divided into multiple independent functional modules that are interconnected: power module, communication module, attitude control module, data processing module, propulsion module and system management module.

[0041] 1. Power Module: Integrating solar panels, a battery pack, and energy management circuitry, it provides a stable power supply for the satellite, offering efficient energy conversion and storage. The solar panels utilize novel photoelectric conversion materials, improving photoelectric conversion efficiency by 5%-20%. The battery pack utilizes high-energy-density lithium-ion batteries, ensuring a stable power supply even in low-light conditions.

[0042] Solar panel manufacturing: High-efficiency gallium arsenide photovoltaic materials are selected and processed into cells through processes such as photolithography, etching, and coating. The cells are then connected in series and parallel to form solar panel arrays.

[0043] Battery pack manufacturing: Select high-energy-density lithium-ion battery cells, connect them in series and parallel, and install a battery management system (BMS) to achieve battery charge and discharge management and status monitoring.

[0044] Energy management circuit manufacturing: Using printed circuit board (PCB) technology, DC-DC converters, MPPT controllers and other electronic components are soldered onto the circuit board to complete the production of the energy management circuit.

[0045] 2. Communication Module: This module includes the communication antenna, RF transceiver, and baseband processing unit, enabling communication between the satellite and ground stations, as well as between other satellites. The communication antenna utilizes reconfigurable antenna technology to support multi-band communication; the RF transceiver features adaptive power regulation to ensure stable transmission of communication signals.

[0046] Communication antenna manufacturing: Design the antenna structure according to the communication frequency band and performance requirements, use metal materials through stamping, welding and other processes to make the antenna radiation unit, and then assemble it with the feed network to form a communication antenna.

[0047] RF transceiver manufacturing: Select high-performance RF chips and use surface mount technology (SMT) to solder the chips and other electronic components on the RF circuit board to complete the assembly of the RF transceiver.

[0048] Baseband processing unit manufacturing: Design baseband processing circuits, solder processor, memory and other chips on circuit boards, write baseband processing software and burn it into the processor.

[0049] 3. Attitude Control Module: This module, comprised of sensors such as gyroscopes and accelerometers, actuators such as torque motors and jet thrusters, and a controller, precisely controls the satellite's attitude. The sensors utilize high-precision micro-electromechanical systems (MEMS) technology, achieving measurement accuracy of up to 0.0°. The actuators employ intelligent control algorithms for rapid attitude adjustment. The controller hardware consists of a microcontroller, driver circuits, and signal conditioning chips. The software integrates the attitude control algorithm (which I've changed to the same name as the controller manufacturing section below) and dynamic response strategies, enabling real-time adjustment of control parameters to accommodate varying orbital environments.

[0050] Sensor manufacturing: Gyroscope and accelerometer chips are manufactured using MEMS technology. The chips are packaged and integrated with signal conditioning circuits to form sensor modules.

[0051] Actuator Manufacturing: Torque motor manufacturing uses high-precision processing technology to produce motor rotors and stators, and install bearings and encoders; jet propulsion manufacturing includes propellant nozzle processing, solenoid valve installation and pipeline connection.

[0052] Controller manufacturing: Design the attitude control circuit, solder the microcontroller, drive circuit and other components on the circuit board, write the attitude control algorithm and burn it into the microcontroller.

[0053] 4. Data Processing Module: Equipped with a high-performance processor, large-capacity memory, and data interfaces, it processes, stores, and transmits satellite-collected data. The processor utilizes a multi-core heterogeneous architecture to improve data processing efficiency, while the memory utilizes solid-state storage technology to ensure reliable data storage. The data processing module includes reserved expansion interfaces and space, allowing performance to be enhanced by adding processor cores or expanding memory capacity.

[0054] Processor and memory installation: Using advanced flip-chip technology, multi-core processors and large-capacity memory chips are mounted on the circuit board.

[0055] Data interface circuit design: Design high-speed data interface circuits and adopt differential signal transmission technology to ensure the stability and high speed of data transmission.

[0056] System integration and testing: Assemble the processor, memory, data interface circuit, etc. together and perform system integration testing to ensure that the data processing module functions normally.

[0057] 5. Propulsion Module: This module includes the propellant tanks, engines, and associated piping systems, providing power for satellite orbit adjustment and attitude control. The engines utilize electric propulsion technology, which reduces propellant consumption by 30%-40% compared to traditional chemical propulsion.

[0058] Propellant storage tank manufacturing: High-strength aluminum alloy materials are used to make storage tanks through spinning, welding and other processes, and then pressure testing and sealing testing are carried out.

[0059] Engine manufacturing: Electric propulsion engine manufacturing includes ion source processing, acceleration grid production and power system assembly; engine performance testing is carried out to ensure that thrust and specific impulse requirements are met.

[0060] Pipeline system installation: Use high-pressure and corrosion-resistant pipeline materials, connect and seal the pipelines to ensure that the propellant delivery system is leak-free.

[0061] 6. System Management Module: The satellite's core control center, responsible for coordinating the collaborative work of various functional modules, dynamic energy management, and autonomous fault handling. Its hardware components include a high-performance processor, storage unit, and communication interface circuits.

[0062] High-performance processor manufacturing: Adopting radiation-resistant multi-core RISC processor, based on reduced instruction set architecture (RISC), integrating 4-8 processing cores, supporting parallel computing and task partitioning processing, meeting the satellite real-time control and multi-task scheduling requirements.

[0063] Storage unit manufacturing: Adopts a three-level architecture of "cache + main memory + non-volatile storage". Cache: 256KB-1MB radiation-resistant SRAM is integrated on-chip with access latency <10ns, supporting fast data reading and writing and task caching; Main memory: 2GB-4GB radiation-resistant DDR3 SDRAM is configured, operating at 800MHz, and adopts error checking and correction technology; Non-volatile storage: Equipped with 128GB-512GB radiation-resistant NAND flash memory, supports power-off data protection, adopts wear-leveling algorithm, and has a service life of more than 10 years, meeting the satellite's on-orbit data log storage needs.

[0064] Communication interface circuit design: integrating high-speed data interface, control signal interface, power control interface and status monitoring interface.

[0065] 2. Standardized interface design

[0066] Mechanical Interface: Utilizing a unified mechanical structure and connection standards, all modules' electrical connectors are located on the bottom of the module, enabling blind-mating installation with the integrated support platform. Connection methods include snap-on quick-connects with locating pins and bolt-on connections, ensuring easy module installation and removal while meeting the mechanical strength requirements for satellite launch and on-orbit operation. The dimensional tolerance of the mechanical interface is controlled within ±0.1mm, ensuring accurate and stable module installation and ensuring high-precision module installation.

[0067] Electrical Interfaces: Unified electrical connection specifications and signal transmission standards are established between modules. Core to this is the adoption of a comprehensive support platform—a "system-level platform" that integrates the electrical interconnection functions of the satellite structure and equipment. This platform integrates all power buses, high-speed data buses, and control signal lines. All modules connect to it via blind-mate electrical connectors on the bottom, enabling electrical connections between modules. This completely eliminates traditional cables and achieves a "cableless" design. Interface specifications include power, data, and control interfaces. The power interface features a reverse polarity design to prevent failures caused by incorrect connection. The power interface provides overcurrent and overvoltage protection. The data interface utilizes high-speed differential signaling technology with a transmission rate of up to 0Gbps. The control interface features fault isolation. This isolation function is achieved by sending commands from the system management module to the power distribution and switching module (PDSM). Upon receiving these commands, the PDSM's integrated matrix switch (e.g., a 3x3 matrix constructed with MOSFETs) precisely disconnects the power path to the faulty module, physically isolating it from the main power bus.

[0068] Software interface: This defines standardized communication protocols and data formats between modules, enabling information exchange and collaborative operation. Designed using a service-oriented architecture (SOA), the software interface offers excellent compatibility and scalability, supporting the integration of different software versions and functional modules. The software interface also provides fault detection and isolation capabilities. This is achieved by the system management module continuously monitoring telemetry data uploaded from each module via the LVDS bus. For example, if the power distribution module reports an overcurrent fault in a channel, the system management module detects this anomaly.

[0069] Fault isolation is when the system management module actively sends instructions to the power distribution and switching module based on the preset fault diagnosis and response logic (FDIR), controlling its internal matrix switch to cut off the power supply of the fault channel, thereby completing the isolation operation and disconnecting the faulty module or load from the entire system.

[0070] The modules interact with each other through standardized interfaces, which reduces the coupling between modules.

[0071] 3. Module design optimization

[0072] Miniaturization and Lightweighting: Advanced integration technologies and new materials are used to reduce module size and weight. For example, in the data processing module, system-on-chip (SoC) technology is used to integrate processor, memory, and other functions on a single chip, reducing the module size by 40%. In structural design, carbon fiber composite materials are used to reduce module weight by 30%.

[0073] Low-power design: Module power consumption is reduced through optimized circuit design (for example, using the low-power STM32L5 series microprocessor), the use of low-power components, and intelligent power management strategies. Intelligent power management is a dynamic energy allocation algorithm executed by the system management module. This algorithm monitors the energy status of the entire system in real time and optimizes energy allocation based on the region (sun / shaded) and operating mode.

[0074] In sunny areas, when energy is abundant, the system management module calculates the precise total current required (load current + battery charging current) and instructs each power control unit (PCU) to operate in constant current output mode. When energy is insufficient, the PCU is instructed to operate in maximum power point tracking (MPPT) mode.

[0075] In the shaded area, the system is powered entirely by batteries. The system management module continuously monitors the battery discharge depth and proactively switches off non-critical loads when necessary to conserve power. A sleep / wakeup mechanism is introduced in each module to reduce power consumption when not in operation.

[0076] Improved reliability and maintainability: Modules utilize internal redundancy and fault detection technology, with backup units for key components, such as dual power supplies and dual processors. If a primary device fails, the backup automatically switches to ensure satellite operation. Each module also incorporates a self-diagnostic system, implemented through a combination of distributed status monitoring and centralized intelligent decision-making. Each module features low-level self-test and telemetry reporting capabilities, while the system management module, as the decision-making core, is responsible for centralized autonomous fault diagnosis, isolation, and reconstruction (FDIR). It continuously collects health status and telemetry data from all modules via a high-speed bus (such as LVDS). Upon receiving an alarm (e.g., overcurrent or unresponsive telemetry), it consults its internal fault response rule library, makes an autonomous decision, and issues a command (e.g., resetting the module or isolating the faulty channel), enabling rapid and autonomous fault resolution without ground intervention. The self-diagnostic system also transmits fault information to the ground control center via a communication module, enabling timely repair and replacement.

[0077] 4. Module Assembly Process

[0078] Mechanical Assembly: In a cleanroom, each module is secured to the satellite platform using specialized fixtures, in accordance with the overall satellite layout. First, the locating pins are installed, and then the module's clips are aligned with the slots. Mechanical pressure is used to lock the clips into the slots, completing the module's mechanical connection.

[0079] Electrical connection: According to the electrical interface design drawings, use dedicated cables to connect the power interface, data interface, and control interface of each module in sequence. During the connection process, strictly check the connection quality of the interface to ensure that the electrical connection is firm and the contact is good.

[0080] Software debugging: Download each module's software program to the module controller via ground-based testing equipment. Debug inter-module communications according to the software interface communication protocol, testing the accuracy and stability of inter-module information exchange. Conduct system integration debugging, simulating actual satellite operating scenarios, and testing the satellite's overall functionality.

[0081] 5. Replacement of faulty module

[0082] Fault detection and location: When the satellite is in orbit, module faults are detected and located through the self-diagnosis system of each module and ground monitoring equipment.

[0083] Safe operation: Switch the satellite to safe mode, shut down the power and functions related to the faulty module, and ensure the safety of the replacement process.

[0084] Remove the faulty module: Loosen the mechanical buckle of the faulty module, unplug the electrical connection cable, and remove the faulty module from the satellite platform.

[0085] Install the new module: Align the new module with the installation position, insert the positioning pins, connect the electrical cables, and tighten the mechanical buckles to complete the installation of the new module.

[0086] Software configuration and testing: Configure the software of the new module to make it compatible with the satellite system; perform functional testing to ensure that the new module works properly and the overall performance of the satellite is restored.

[0087] 6. Module Upgrade

[0088] Demand analysis and module selection: Based on the satellite function upgrade requirements, analyze and determine the modules that need to be upgraded, and select new modules that meet the upgrade requirements.

[0089] Preparation work: Back up satellite data and develop upgrade plans and emergency plans.

[0090] Module replacement and installation: Follow the module replacement process to remove the original module and install the upgraded module.

[0091] Software upgrade and debugging: Update the software of the upgrade module and adapt and adjust other related satellite software; conduct comprehensive software debugging and system testing to ensure that the upgraded satellite functions normally and has improved performance.

Claims

1. A modular satellite assembly component, characterized in that: It includes a power module, a communication module, an attitude control module, a data processing module, a propulsion module and a system management module. The power module includes a solar panel, a battery pack and an energy management circuit. The communication module includes a communication antenna, a radio frequency transceiver and a baseband processing unit. The attitude control module includes a sensor, an actuator and a controller. The data processing module includes a processor, a memory and a data interface. The propulsion module includes a propellant storage tank, an engine and a piping system. The system management module includes a high-performance processor, a storage unit and a communication interface circuit.

2. A modular satellite assembly according to claim 1, characterized in that: The solar panels are made of high-efficiency gallium arsenide photovoltaic materials and are made into cell slices through processes such as photolithography, etching, and coating. The cell slices are then assembled in series and parallel to form a solar panel array; the battery pack uses high-energy-density lithium-ion battery cells, which are combined in series and parallel, and is equipped with a battery management system (BMS) to achieve battery charge and discharge management and status monitoring; the energy management circuit adopts printed circuit board (PCB) technology, and electronic components such as DC-DC converters and MPPT controllers are soldered on the circuit board to complete the production of the energy management circuit.

3. The modular satellite assembly according to claim 1, characterized in that: The communication antenna is designed with an antenna structure according to the communication frequency band and performance requirements, and the antenna radiation unit is made of metal materials through stamping, welding and other processes, and then assembled with the feeding network to form a communication antenna; the RF transceiver uses a high-performance RF chip, and uses surface mount technology (SMT) to weld the chip and other electronic components on the RF circuit board to complete the assembly of the RF transceiver; the baseband processing unit designs the baseband processing circuit, welds the processor, memory and other chips on the circuit board, and writes the baseband processing software and burns it into the processor.

4. The modular satellite assembly according to claim 1, characterized in that: The sensor includes a gyroscope and an accelerometer. The gyroscope and accelerometer chips are manufactured using MEMS technology. The chips are packaged and integrated with a signal conditioning circuit to form a sensor module. The actuator includes a torque motor and a jet propulsion system. The torque motor is manufactured using high-precision processing technology to produce the motor rotor and stator, and install bearings and encoders. The jet propulsion system manufacturing includes propellant nozzle processing, solenoid valve installation and pipeline connection. The controller hardware part includes a microcontroller, a drive circuit and a signal conditioning chip. The software part includes an attitude control algorithm and a dynamic response strategy, which can adjust the control parameters in real time to adapt to different orbital environments.

5. The modular satellite assembly according to claim 1, characterized in that: The processor adopts a multi-core heterogeneous architecture to improve data processing efficiency, and the memory adopts solid-state storage technology to ensure the reliability of data storage; the data processing module reserves expansion interfaces and space to improve performance by increasing processor cores or expanding memory capacity; the processor and memory both adopt advanced flip-chip technology to install multi-core processors and large-capacity memory chips on a circuit board; the data interface is a high-speed data interface circuit that uses differential signal transmission technology to ensure the stability and high speed of data transmission.

6. The modular satellite assembly according to claim 1, characterized in that: The propellant storage tank is made of high-strength aluminum alloy material through spinning, welding and other processes, and is subjected to pressure testing and sealing testing; the engine is an electric propulsion engine, and its manufacturing includes ion source processing, acceleration grid production and power system assembly; the piping system uses high-pressure and corrosion-resistant piping materials, and its installation process involves piping connection and sealing treatment to ensure that the propellant delivery system is leak-free.

7. The modular satellite assembly according to claim 1, characterized in that: The high-performance processor adopts a radiation-resistant multi-core RISC processor, which integrates 4-8 processing cores based on the reduced instruction set architecture RISC, supports parallel computing and task partitioning processing, and meets the requirements of satellite real-time control and multi-task scheduling; the storage unit adopts a three-level architecture of "cache + main memory + non-volatile storage", with 256KB-1MB of radiation-resistant SRAM integrated on the cache chip, with an access delay of <10ns, supporting fast data reading and writing and task caching; the main memory is configured with 2GB-4GB of radiation-resistant DDR3 SDRAM, operating at a frequency of 800MHz, and adopting error checking and correction technology; the non-volatile storage is equipped with 128GB-512GB of radiation-resistant NAND flash memory, supports power-off data protection, adopts a wear-leveling algorithm, and has a service life of more than 10 years, meeting the satellite's on-orbit data log storage requirements; the communication interface circuit includes a high-speed data interface, a control signal interface, a power control interface, and a status monitoring interface.

8. The modular satellite assembly according to claim 1, characterized in that: The power module, communication module, attitude control module, data processing module, propulsion module and system management module have the following standardized interface designs: Mechanical interface: Utilizing a unified mechanical structure and connection standards, the electrical connectors of all modules are designed on the bottom surface of the single unit, enabling "blind plug-in" installation with the integrated support platform. Connection methods include a snap-on quick-connect structure with a positioning pin and a bolt-type connection structure, ensuring easy module installation and removal while meeting the mechanical strength requirements for satellite launch and on-orbit operation. The dimensional tolerance of the mechanical interface is controlled within ±0.1mm, ensuring the accuracy and stability of module installation and meeting the high-precision requirements of module installation. Electrical Interface: Unified electrical connection specifications and signal transmission standards are established between modules. The core of this is the use of a comprehensive support platform, a "system-level platform" that integrates the electrical interconnection functions of the satellite structure and equipment. This platform integrates all power buses, high-speed data buses, and control signal lines. All modules connect to it via blind-plug electrical connectors at the bottom, thus achieving electrical connection between all modules, completely eliminating traditional cables and realizing a "cableless" design. Interface specifications include power, data, and control interfaces. The power interface uses a reverse connection protection design to avoid failures caused by incorrect interface connection. The power interface has overcurrent and overvoltage protection functions. The data interface uses high-speed differential signal transmission technology with a transmission rate of up to 0Gbps. The control interface has a fault isolation function. The specific isolation method is: the system management module sends commands to the power distribution and switching module (PDSM). Upon receiving the command, the matrix switch integrated in the PDSM can accurately disconnect the power path to the specific faulty module, thereby physically isolating it from the main power bus. Software interface: Defines standardized communication protocols and data formats between modules to enable information exchange and collaborative work between modules. Designed using a service-oriented architecture (SOA), the software interface offers excellent compatibility and scalability, supporting the integration of different software versions and functional modules. The software interface also features fault detection and isolation, implemented by the system management module continuously monitoring telemetry data uploaded from each module via the LVDS bus. The modules interact with each other through standardized interfaces, which reduces the coupling between modules.

9. The modular satellite assembly according to claim 1, characterized in that: The power module, communication module, attitude control module, data processing module, propulsion module and system management module have the following optimized designs: Miniaturization and lightweighting: Advanced integration technologies and new materials are used to reduce module size and weight. In the data processing module, system-on-chip (SoC) technology is used to integrate processors, memory, and other functions on the same chip, reducing module size by 40%. In structural design, carbon fiber composite materials are used to reduce module weight by 30%. Low-power design: Module power consumption is reduced through optimized circuit design, the use of low-power components, and intelligent power management strategies. Intelligent power management is a dynamic energy allocation algorithm executed by the system management module. This algorithm monitors the energy status of the entire system in real time and optimizes energy allocation based on the region and operating mode. In sunny areas, when energy is sufficient, the system management module calculates the exact total current required, i.e., load current + battery charging current, and instructs each power control module (PCU) to operate in constant current output mode. When energy is insufficient, the PCU is instructed to operate in maximum power point tracking (MPPT) mode. In the shaded area, the system is fully powered by batteries. The system management module continuously monitors the battery discharge depth and proactively switches off non-critical loads when necessary to conserve power. A sleep / wake-up mechanism is introduced in each module to reduce power consumption when not in operation. Improved reliability and maintainability: The modules employ internal redundant design and fault detection technology, and key components are equipped with backup units, such as dual backup power supplies and dual processors. When the primary device fails, the backup device automatically switches to ensure the normal operation of the satellite. At the same time, each module integrates a self-diagnosis system, which is implemented by combining distributed status monitoring with centralized intelligent decision-making. Each module has low-level self-test and telemetry reporting functions, and the system management module, as the decision-making core, is responsible for centralized autonomous fault diagnosis, isolation, and reconstruction of the FDIR. It continuously collects the health status and telemetry data of all modules via the high-speed LVDS bus. Upon receiving an alarm message, such as overcurrent or no telemetry response, it queries its internal fault response rule library, makes an autonomous decision, and sends a command, thereby achieving rapid and autonomous fault handling without ground intervention. The self-diagnosis system can also transmit fault information to the ground control center via the communication module, facilitating timely repair and replacement by ground personnel.

10. The modular satellite assembly according to claim 8, characterized in that: The communication protocol includes power module software, communication module software, attitude control module software, data processing module software, propulsion module software and system management module software. The fault isolation is that the system management module actively sends instructions to the power distribution and switching module according to the preset fault diagnosis and response logic FDIR, controls the matrix switch inside it to cut off the power supply of the fault channel, thereby completing the isolation operation and disconnecting the faulty module or load from the entire system.

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