Wafer box automatic packaging machine and packaging method

Abstract

The invention belongs to the field of wafer box packaging equipment, and particularly relates to an automatic wafer box packaging machine and a packaging method. Comprising a wafer box labeling detection work station for labeling a wafer box, an inner bag bagging heat sealing work station for bagging and packaging the labeled wafer box, and a drying agent attaching work station for attaching a drying agent to an inner bag; according to the packaging machine, by means of the structural composition of the limited packaging machine and the arrangement of the wafer box labeling detection work station, the inner bag bagging heat sealing work station and the drying agent attaching work station, labeling, bagging and drying agent attaching of the wafer boxes are stably and automatically completed, manpower input is greatly reduced, the production efficiency is improved, and the cleanliness is high.

Description

TECHNICAL FIELD

[0001] The application belongs to the field of wafer box packaging equipment, and particularly relates to a wafer box automatic packaging machine and a packaging method. BACKGROUND

[0002] A wafer needs to be subjected to chamfering, polishing and cleaning before photoetching, and after the above processes, the wafer is loaded into a clean wafer box and stored and transported by using a double-layer aluminum foil bag for vacuumizing. The vacuumizing packaging process of the aluminum foil bag of the wafer box is very important, which can effectively protect the wafer box from damage and isolate particle pollution, and ensure the yield of the wafer in the subsequent photoetching process. The vacuumizing packaging of the aluminum foil bag of the wafer box is currently manually performed by manual operations such as bagging, vacuumizing, bag folding, adhesive tape sticking for sealing, information label sticking and the like. The packaging mode is low in efficiency, needs to invest a large amount of manpower, is high in labor cost, and is difficult to guarantee cleanliness, and needs to be improved. SUMMARY

[0003] The application aims at overcoming the defects of the prior art, and provides a wafer box automatic packaging machine and a packaging method.

[0004] The application adopts the following technical scheme: A wafer box automatic packaging machine comprises a wafer box label sticking detection work station for sticking labels on wafer boxes, an inner bag loading and heat sealing work station for loading and sealing bags on the wafer boxes after the labels are stuck, and a desiccant sticking work station for sticking desiccants on the inner bags, The inner bag loading and heat sealing work station comprises a sealing table, a bag loading position arranged on the sealing table, an inner bag storage rack arranged on the sealing table, a bag taking device for clamping and taking the inner bag on the inner bag storage rack to the bag loading position, a bag opening device for opening the inner bag in the bag loading position, a material pushing device for pushing the wafer box into the opened inner bag, and a heat sealing device for heat sealing the bag opening of the inner bag. The desiccant attaching station includes an attaching workbench, a gluing position arranged on the attaching workbench, a loading and transporting device for transporting a wafer box to the gluing position, a first attaching device arranged on the attaching workbench to adhere the inner bag opening to one side of the inner bag, and a second attaching device for attaching the desiccant to the inner bag, wherein the first attaching device includes a first gluing positioning component arranged on the attaching workbench at one side of the gluing position, a push-flattening frame arranged on the attaching workbench opposite to the first gluing positioning component, a push-flattening roller rotatably arranged on the upper end of the push-flattening frame, and a push-flattening roller arranged on the push-flattening frame to fold the wafer box. A folding assembly with the end of the edge segment folded downward and a first tape attaching assembly arranged on the attaching workbench, the inner bag includes an inner bag body for housing the wafer box and a folding segment located on the outside of the heat seal. When the loading and handling device drives the wafer box housing the inner bag downward to the gluing position, the flattening roller pushes the folding segment upward to flatten it so that part of it is stored on the side of the opposite surface of the inner bag, and the remaining part is placed on the folding assembly. The folding assembly works to fold the remaining part of the folding segment downward to the top surface of the inner bag, and the first tape attaching assembly attaches the tape between the top surface of the inner bag and the end of the folding segment.

[0005] Preferably, the folding assembly includes a folding plate arranged on the flattening frame and movable in a direction close to the first glue positioning assembly and a folding cylinder arranged on the flattening frame and connected to and driving the folding plate to move. The folding plate is provided with a plurality of glue clearance areas for the first tape attaching assembly to attach tape. After the folding section is pushed upward by the flattening roller and stored on the opposite side of the inner bag, the remaining part is placed on the folding plate. The folding cylinder controls the folding plate to move close to the first glue positioning assembly so that the remaining part of the folding section is driven by the folding plate to be folded downward to the top surface of the inner bag.

[0006] Preferably, the heat sealing device includes a bag folding seat movable in a direction close to the bag filling position, two bag folding knives movably arranged on the packaging table, a negative pressure tube arranged on the inner side of one of the bag folding knives, an upper heat sealing assembly and a lower heat sealing assembly arranged opposite to each other, a first moving mechanism arranged on the packaging table to drive the bag folding seat to move, a second moving mechanism arranged on the bag folding seat to drive the two bag folding knives to move toward each other, an upper positioning plate extending downward on the upper heat sealing assembly, and a lower positioning plate extending upward on the lower heat sealing assembly and opposite to the upper positioning plate, the two bag folding knives are respectively opposite to the two side surfaces of the inner bag, and the upper positioning plate and the lower positioning plate are respectively opposite to the top surface and the bottom surface of the inner bag, the first moving mechanism drives the bag folding seat to move close to the bag filling position so that the negative pressure tube extends into the inner bag, and the bag folding knife on the same side is located on the outside of the inner bag; the second moving mechanism drives the two bag folding knives to move toward each other so that the bag folding knives drive the side surfaces of the inner bag in contact with them to move inward to complete the folding of the bag opening of the inner bag.

[0007] Preferably, the bag taking device includes a first bag taking rack arranged on the packaging table and extending in a direction close to the bag filling position, a second bag taking rack arranged vertically on the first bag taking rack and extending in a direction close to the inner bag storage rack, a support plate movably arranged on the first bag taking rack for placing the inner bag, a correction mechanism located below the second bag taking rack for correcting the position of the inner bag, a bag taking assembly movably arranged on the second bag taking rack for clamping the inner bag, a first driving assembly arranged on the first bag taking rack for driving the support plate to move, and a second driving assembly arranged on the second bag taking rack for driving the bag taking assembly to move, the bag taking assembly sucks the inner bag from the inner bag storage rack onto the support plate, and the first driving assembly drives the support plate with the inner bag placed thereon to move to the bag filling position.

[0008] Preferably, the correction mechanism includes a correction frame that can be moved up and down and is arranged below the second bag-taking frame, two first correction assemblies relatively arranged on both sides of the correction frame, two second correction assemblies relatively arranged on both sides of the correction frame and a correction lifting cylinder that is connected and drives the correction frame to move up and down, the two first correction assemblies and the two second correction assemblies are alternately arranged on the four sides of the correction frame, the first correction assembly includes a correction plate that can be moved along the relative side and a first correction cylinder arranged on the correction frame to drive the correction plate to move, the second correction assembly includes a correction column that can be moved along the relative side and a second correction cylinder arranged on the correction frame to drive the correction column to move, and the support plate is provided with a strip-shaped movable hole for the relative correction column to pass through.

[0009] Preferably, the bag taking assembly includes a movable seat movably arranged on the second bag taking rack, a bag taking plate arranged at the lower end of the movable seat and capable of extending into the inner bag storage rack, and a plurality of bag taking nozzles spaced apart at the lower end of the bag taking plate.

[0010] Preferably, the second attaching device includes an attaching robot arranged on the attaching workbench, a rotating frame arranged at the front end of the attaching robot, a tape supply mechanism for supplying tape, a desiccant storage rack arranged on the attaching workbench for storing desiccant, and a second detection component, a desiccant adsorption transfer component and a tape adsorption transfer component arranged at intervals on the outer periphery of the rotating frame.

[0011] Preferably, the wafer box labeling and inspection station includes a labeling table, a labeling conveying device arranged on the labeling table to transport the wafer box, a labeling device arranged on the labeling table and a label printer arranged on the labeling table, and the labeling device includes a labeling robot arranged on the labeling table, a mounting plate arranged at the front end of the labeling robot, and a first detection component, a label tearing component and a labeling component arranged at intervals on the mounting plate.

[0012] Preferably, it further comprises an outer bag bagging heat sealing work station and an outer bag labeling detection work station, the outer bag bagging heat sealing work station sets an outer bag on the wafer box after the desiccant is adhered and performs heat sealing, and the outer bag labeling detection work station performs labeling on the outer bag.

[0013] An automatic wafer box packaging method is performed based on the packaging machine of any one of the above, and specifically comprises the following steps: Step one, the wafer box with a top label enters the wafer box labeling detection work station, the incoming label is torn off by the wafer box labeling work station, and then an information label is attached; Step two, the wafer box with the attached information label is sent into the pushing device, the inner bag is taken out from the inner bag storage rack and moved to the bagging position by the bag taking device, the inner bag at the bagging position is opened upward by the bag opening device, the wafer box is pushed into the opened inner bag by the pushing device, the bag opening of the inner bag is folded first and then vacuumized by the heat sealing device, and the heat sealing treatment is performed immediately after vacuumization; Step three, the wafer box with the set inner bag is carried to the glue applying position by the loading carrying device, when the wafer box with the set inner bag is moved downward to the glue applying position by the loading carrying device, the folded edge section is pushed flat upward by the flat pushing roller so as to be partially stored in the opposite side edge of the inner bag, the remaining part is arranged on the folded edge assembly, the folded edge assembly works to make the remaining part of the folded edge section fold downward to the top surface of the inner bag, and the first adhesive tape attaching assembly attaches the adhesive tape between the top surface of the inner bag and the end part of the folded edge section to fix the folded edge section; the wafer box with the fixed folded edge section of the inner bag is moved to the second attaching device, the desiccant is fixed on the top surface of the inner bag by the second attaching device, and the attaching of the desiccant is completed.

[0014] As can be known from the above description of the present application, compared with the prior art, the present application has the beneficial effects that: by limiting the structural composition of the packaging machine, by setting the wafer box labeling detection work station, the inner bag bagging heat sealing work station and the desiccant attaching work station, the labeling, bagging and desiccant attaching of the wafer box are automatically completed stably, the labor input is greatly reduced, the production efficiency is improved, and the cleanliness is high; the overall equipment has high automation degree, and the automatic operation avoids the risk of wafer pollution in the wafer box caused by manual operation. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of the packaging machine; Figure 2 It is a structural schematic diagram of the loading work station; Figure 3 It is a structural schematic diagram of the wafer box labeling detection work station; Figure 4 It is a partial structural schematic diagram of the wafer box labeling detection work station; Figure 5 It is a partial structural schematic diagram of the labeling device; Figure 6Structure schematic diagram of the first conveying mechanism; Figure 7 Structure schematic diagram of the labeling conveying device; Figure 8 Structure schematic diagram of the inner bag filling and heat sealing work station; Figure 9 Structure schematic diagram of the inner bag filling and heat sealing work station; Figure 1 ; Figure 10 Structure schematic diagram of the inner bag filling and heat sealing work station; Figure 2 ; Figure 11 Structure schematic diagram of the inner bag filling and heat sealing work station; Figure 3 ; Figure 12 Structure schematic diagram of the bag taking device; Figure 13 Structure schematic diagram of the adsorption and bag supporting assembly; Figure 14 Structure schematic diagram of the first clamping and bag supporting assembly; Figure 15 Structure schematic diagram of the heat sealing device; Figure 16 Structure schematic diagram of the desiccant attaching work station; Figure 1 ; Figure 17 Structure schematic diagram of the desiccant attaching work station; Figure 2 ; Figure 18 Structure schematic diagram of the second attaching device; Figure 19 Structure schematic diagram of the edge folding assembly; Figure 20 Structure schematic diagram of the first adhesive tape attaching assembly; Figure 21 Structure schematic diagram of the first adhesive tape attaching assembly; Figure 22 Structure schematic diagram of the desiccant storage bin; Figure 23 Structure schematic diagram of the outer bag labeling and detecting work station; Figure 24 Structure schematic diagram of the inner bag; In the figure, 1. Loading station; 2. Wafer box labeling and inspection station; 3. Inner bag bagging and heat sealing station; 4. Desiccant attachment station; 5. Outer bag bagging and heat sealing station; 6. Outer bag labeling and inspection station; 7. Unloading station; 8. Inner bag; 11. Loading platform; 111. Transport channel; 12. Loading position; 121. Loading limit block; 13. Posture detection mechanism; 131. Micro switch; 132. Alarm light; 133. Diffuse reflection photoelectric switch; 14. Transfer mechanism; 141. Transfer platform; 142. Lifting assembly; 143. Mobile module; 144. Lifting frame; 145. Loading lifting cylinder; 21. Labeling platform; 211. Labeling position; 212. First moving channel; 213. Cache position; 214. Transfer position; 215. Second Moving channel; 216, third moving channel; 217, waste label rack; 22, limit assembly; 221, limit seat; 222, limit plate; 223, limit cylinder; 23, labeling conveying device; 231, conveying seat; 232, lifting assembly; 233, conveying mechanism; 234, lifting cylinder; 235, sliding seat; 24, labeling device; 241, labeling manipulator; 242, mounting plate; 243, first detection assembly; 244, label tearing assembly; 2441, label tearing rack; 2442, label tearing nozzle; 2443, label tearing positioning plate; 2444, first label tearing cylinder; 2445, second label tearing cylinder; 245, labeling assembly; 2451, labeling suction head; 2452, labeling cylinder; 25, label printer; 2 6. Defective product temporary storage area; 261. NG material placement position; 262. Temporary storage position; 27. Defective product handling device; 271. First handling mechanism; 272. Second handling mechanism; 273. First handling seat; 274. First driving member; 275. First handling module; 28. Unloading and handling device; 281. Unloading rack; 282. Unloading pneumatic clamp; 283. Multi-axis moving module; 29. ​​Label holder; 291. Label rack; 292. Label plate; 293. Label cylinder; 31. Packaging table; 32. Inner bag storage rack; 33. Bag taking device; 34. Bag supporting device; 35. Material pushing device; 36. Heat sealing device; 311. Bagging position; 321. Storage rack body; 322. Bag pressing rack; 323. Bag pressing roller; 324. Z direction Mobile module; 331, first bag-taking rack; 332, second bag-taking rack; 333, support plate; 3331, negative pressure nozzle; 3332, strip-shaped movable hole; 334, correction mechanism; 3341, correction rack; 3342, first correction component; 3343, second correction component; 3344, correction lifting cylinder; 3345, correction plate; 3346, first correction cylinder; 3347, correction column; 3348, second correction cylinder; 335, bag-taking assembly; 3351, moving seat; 3352, bag-taking plate; 3353, bag-taking nozzle; 336, first drive assembly; 337, second drive assembly; 341, suction bag-holding assembly; 3411, suction bag-holding rack; 3412, lifting plate; 3413, fixed nozzle;3414, adjustment plate; 3415, mobile suction nozzle; 3416, first lifting cylinder; 3417, second lifting cylinder; 342, first clamping bag support assembly; 3421, clamping bag support seat; 3422, upper clamping member; 3423, lower clamping member; 3424, first lifting member; 3425, second lifting member; 3426, upper clamping frame; 3427, upper clamping pneumatic clamp; 343, second clamping bag support assembly; 351, moving frame; 352, pusher plate; 353, first pusher cylinder; 354, second pusher cylinder; 355, pusher limit cylinder; 356, pusher linear moving module; 361, bag folding seat; 362, bag folding knife; 363, negative pressure pipe; 3631, main section; 3632, flat section; 3 64. Upper heat sealing assembly; 3641. Upper heat sealing seat; 3642. Upper heat sealing head; 3643. Upper heat sealing cylinder; 365. Lower heat sealing assembly; 3651. Lower heat sealing seat; 3652. Lower heat sealing head; 3653. First heat sealing cylinder; 3654. Mounting plate; 3655. Second heat sealing cylinder; 366. First moving mechanism; 367. Second moving mechanism; 368. Upper positioning plate; 369. Lower positioning plate; 41. Attachment workbench; 42. Glue attachment position; 43. Loading and handling device; 44. First attaching device; 45. Second attaching device; 46. Attachment conveying device; 441. First glue positioning assembly; 4411. First positioning frame; 4412. First positioning plate; 4413. First positioning cylinder; 442. 443. Flattening frame; 444. Folding assembly; 4441. Folding plate; 4442. Folding cylinder; 4443. Glueing clearance area; 445. First tape attaching assembly; 4451. First tape rack; 4452. First glue pressing assembly; 44521. Lower glue pressing block; 44522. Upper glue pressing block; 44523. First glue pressing cylinder; 44524. First guide roller; 4453. First glue pulling pneumatic clamp; 4454. First cutting assembly; 44541. First cutting knife; 44542. First cutting cylinder; 4455. First glue pulling cylinder; 4456. First adsorption assembly; 44561. First fixing frame; 44562. Adsorption seat; 44563. Tape adsorption head; 44564. First First adsorption cylinder; 44565, second adsorption cylinder; 4457, transfer seat; 4458, first transfer module; 4459, second transfer module; 451, attachment robot; 452, attachment rack; 453, second adhesive positioning assembly; 4531, second fixed rack; 4532, second positioning rack; 4533, second positioning plate; 4534, second positioning cylinder; 454, desiccant storage bin; 4541, storage rack; 4542, storage chamber; 4543, receiving plate; 4544, vertical moving module; 455, tape supply mechanism; 456, detection camera; 457, tape adsorption assembly; 4571, fixed adsorption head; 4572, floating adsorption head; 458, desiccant adsorption assembly; 461, receiving platform;462, lifting drive assembly; 463, conveying module; 61, outer bag labeling station; 62, clamping jaw carrying module; 63, storage and sticking device; 64, sticking device; 641, sticking manipulator; 642, sticking frame; 643, second detection assembly; 644, first sticking and sucking assembly; 645, second sticking and sucking assembly; 65, labeling printer; 66, transfer carrying module; 81, upper edge; 82, lower edge; 83, inner bag body; 84, edge folding section. DETAILED DESCRIPTION

[0016] The application will be further described in the following detailed description with reference to the drawings.

[0017] Referring to Figure 1 As shown in the drawings, a wafer box automatic packaging machine includes a feeding work station 1, a wafer box labeling and detecting work station 2 for labeling wafer boxes, an inner bag bagging and heat sealing work station 3 for bagging and sealing wafer boxes after labeling, a desiccant sticking work station 4 for sticking desiccants to inner bags 8, an outer bag bagging and heat sealing work station 5 for bagging and sealing wafer boxes after sticking desiccants, an outer bag labeling and detecting work station 6 for labeling outer bags, and a discharging work station 7. The feeding work station 1 sends wafer boxes to the wafer box labeling and detecting work station 2 for labeling, and the discharging work station 7 discharges the packaged wafer boxes.

[0018] Referring to Figure 2 As shown in the drawings, the feeding work station 1 includes a feeding table 11, a plurality of feeding positions 12 arranged at intervals on the feeding table 11, a plurality of posture detection mechanisms 13 arranged respectively on the plurality of feeding positions 12 for detecting the posture of wafer boxes, and a transfer mechanism 14 for carrying wafer boxes outward from the feeding positions 12. The feeding position 12 is provided with four feeding limiting blocks 121 arranged in a matrix, which are supported on the feeding table 11 between the four feeding limiting blocks 121.

[0019] The transfer mechanism 14 comprises a transfer table 141 moving along the arrangement direction of the plurality of loading positions 12, a jacking assembly 142 capable of driving the transfer table 141 to move up and down, and a moving module 143 arranged in the loading table 11 to drive the jacking assembly 142 to move the transfer table 141. The loading table 11 is provided with a conveying passage 111 for the movement of the transfer table 141. The jacking assembly 142 can drive the transfer table 141 to move upwards to drive the wafer box to move upwards and separate from the loading position 12. Specifically, the jacking assembly 142 comprises a jacking frame 144 connected with the moving module 143 and a loading jacking cylinder 145 arranged on the jacking frame 144 and connected with the transfer table 141. The transfer table 141 is driven by the loading jacking cylinder 145 to move upwards, jacks the wafer box on the loading position 12, and then cooperates with the moving module 143 to drive the wafer box to move outward and be conveyed to the wafer box labeling detection station 2. Further, the moving module 143 is a linear moving module, which is a mature technology in the mechanical field. Therefore, the specific structure and working principle of the linear moving module will not be described further.

[0020] The posture detection mechanism 13 comprises four micro switches 131 arranged in a matrix at the loading positions 12, a controller arranged on the loading table 11 and connected with the four micro switches 131, an alarm lamp 132 connected with the controller, and a diffuse reflection photoelectric switch 133 arranged on the loading table 11 and located on one side of the loading position 12. The four micro switches 131 are arranged on both sides of the conveying passage 111 opposite to each other. The four loading limit blocks 121 are arranged on both sides of the conveying passage 111 opposite to each other. The four micro switches 131 are arranged between the four loading limit blocks 121. Specifically, the alarm lamp 132 is a three-color alarm lamp. The loading posture information of the wafer box on the loading position 12 is detected by the cooperation of the four micro switches 131, and the diffuse reflection photoelectric switch 133 is used to determine whether the loading position 12 has a wafer box. When the wafer box on the loading position 12 is placed improperly, the controller controls the alarm lamp 132 to sound and light to remind and alarm, and the staff intervenes to handle.

[0021] Referring to Figures 3 to 7As shown, the wafer box labeling detection work station 2 comprises a labeling table 21, a labeling position 211 arranged on the labeling table 21, a limiting assembly 22 for limiting the wafer box at the labeling position 211, a labeling conveying device 23 arranged on the labeling table 21 for conveying the wafer box, a labeling device 24 arranged on the labeling table 21, a label printer 25 arranged on the labeling table 21, a substandard temporary storage area 26, a substandard carrying device 27 for transferring the substandard to the substandard temporary storage area 26, a discharging carrying device 28 for discharging the labeled wafer box, and a label seat 29 arranged on the labeling table 21 in front of the label printer 25. The wafer box has a raw material label attached to the upper surface. The labeling device 24 tears off the raw material label on the wafer box and attaches a new information label. One end of the raw material label is attached to the wafer packaging box, and the other end is free and not attached to the wafer packaging box. The bottom surface of the free end of the raw material label is not coated with a glue layer to facilitate tearing off by the labeling device 24. The information label is fully attached to the center of the top surface of the wafer packaging box to ensure that the attached information label does not easily fall off during subsequent transfer. Specifically, the label printer 25 is provided with two or more than two for printing information labels of different sizes. The label printer 25 is a prior art, and its working principle will not be further described.

[0022] The limiting assembly 22 comprises two limiting seats 221 arranged opposite to each other on both sides of the labeling position 211, two limiting plates 222 arranged on the two limiting seats 221 respectively and movable towards or away from each other, and two limiting cylinders 223 arranged on the two limiting seats 221 respectively and driving the limiting plates 222 to move. The wafer box at the labeling position 211 is fixed between the two limiting plates 222. The wafer box is fixed at the labeling position 211 by the cooperation of the limiting plates 222 and the limiting cylinders 223 to facilitate the tearing and labeling of the wafer box by the labeling device 24.

[0023] The labeling conveying device 23 includes a conveying seat 231 that can move up and down to receive the wafer box, a lifting component 232 that is connected to and drives the conveying seat 231 to move up and down, and a conveying mechanism 233 that is arranged in the labeling platform 21 to drive the conveying seat 231 and the lifting component 232 to move. Among them, a first moving channel 212 for the conveying seat 231 to move is formed on the labeling platform 21, and a buffer position 213 is provided at the front end of the first moving channel 212, and a transfer position 214 is provided at the rear end. When working, the wafer box is transported to the buffer position 213 through the transfer mechanism 14 in the loading station 1, and then the conveying seat 231 cooperates with the lifting component 232 and the conveying mechanism 233 to convey the wafer box to the labeling position 211 for tearing and labeling. Specifically, the lifting component 232 includes a conveying seat 231 and a lifting component 232. The lifting cylinder 234 connected to 231 and the sliding seat 235 connected to the conveying mechanism 233 for installing the lifting cylinder 234; the conveying mechanism 233 adopts a linear motion module, which is a mature existing technology, and its specific structure and working principle will not be further described here; when the conveying seat 231 drives the wafer box to move, the conveying mechanism 233 first drives the conveying seat 231 to move to the cache position 213 or the labeling position 211, and the lifting component 232 controls the conveying seat 231 to move upward to lift the wafer box, and the conveying mechanism 233 then controls the conveying seat 231 to move to the labeling position 211 or the transfer position 214. At this time, the lifting component 232 controls the conveying seat 231 to move downward and reset, and the wafer box can be supported at the labeling position 211 or the transfer position 214.

[0024] The labeling device 24 includes a labeling robot 241 arranged on the labeling table 21, a mounting plate 242 arranged at the front end of the labeling robot 241, and a first detection component 243, a label tearing component 244 and a labeling component 245 arranged at intervals on the mounting plate 242. When working, the label tearing component 244 tears off the incoming material label, and the labeling component 245 transfers the information label printed by the label printer 25 to the upper surface of the wafer box. The first detection component 243 is used to detect the information of the incoming material label, the information label printed by the label printer 25 and the attachment status of the information label; specifically, the first detection component 243 can adopt a CCD camera; the labeling component 245 includes a labeling adsorption head 2451 and a labeling cylinder 2452 arranged on the mounting plate 242 and connected to the labeling adsorption head 2451. The information label printed by the label printer 25 is adsorbed and transferred to the top surface of the wafer box for attachment through the labeling adsorption head 2451.

[0025] The tear label assembly 244 includes a tear label frame 2441 connected with the mounting disc 242, a tear label suction nozzle 2442 arranged on the tear label frame 2441, a tear label positioning plate 2443 movable up and down relative to the tear label suction nozzle 2442, a first tear label cylinder 2444 arranged on the tear label frame 2441 to drive the tear label positioning plate 2443 to move up and down, and a second tear label cylinder 2445 arranged on the tear label frame 2441 to drive the first tear label cylinder 2444 to move left and right relative to the tear label suction nozzle 2442. When the incoming label is torn off, the tear label suction nozzle 2442 is adsorbed on the top surface of the incoming label, the first tear label cylinder 2444 and the second tear label cylinder 2445 respectively control the tear label positioning plate 2443 to move, so that it moves to the bottom surface of the incoming label to cooperate with the tear label suction nozzle 2442 to clamp the incoming label. At this time, the labeling manipulator 241 works to control the tear label assembly 244 to move along the preset trajectory in the X-axis, Y-axis and Z-axis respectively, so as to tear the incoming label from the top surface of the wafer box. Specifically, the waste label frame 217 can be arranged on the labeling table 21 to place the torn incoming label and the defective information label.

[0026] The defective product temporary storage area 26 includes an NG material placement site 261 arranged opposite the transfer site 214 on the labeling table 21 and a plurality of temporary storage sites 262 arranged at intervals along the extension direction of the first moving channel 212. After the information label is attached, the first detection assembly 243 detects the information label. When the information label has serious wrinkles, missing corners, broken corners, blurred information, missing information or a label position offset that is too large, the labeling conveying device 23 moves the wafer box with the incorrectly attached label to the transfer site 214, and the defective product handling device 27 then handles the defective product from the transfer site 214 to the temporary storage site 262 for subsequent processing by the staff.

[0027] The defective product handling device 27 includes a first handling mechanism 271 for handling the defective product from the transfer site 214 to the NG material placement site 261 and a second handling mechanism 272 for moving the defective product from the NG material placement site 261 to the temporary storage site 262. The labeling table 21 is provided with a second moving channel 215 arranged perpendicularly to the first moving channel 212 and a third moving channel 216 arranged in parallel to the first moving channel 212 and communicating with the second moving channel 215. The transfer site 214 is arranged at the junction of the first moving channel 212 and the second moving channel 215, and the NG material placement site 261 is arranged at the junction of the second moving channel 215 and the third moving channel 216. Specifically, the structure of the second handling mechanism 272 is the same as that of the labeling conveying device 23, and the specific structure will not be described further.

[0028] The first transport mechanism 271 includes a first transport seat 273 which is movable up and down and is arranged in the second moving channel 215, a first driving member 274 which is connected to and drives the first transport seat 273 to move up and down, and a first transport module 275 which is connected to the first driving member 274 and drives the first transport seat 273 to move in the second moving channel 215. When working, the first driving member 274 can drive the first transport seat 273 to move upward to lift the defective products in the transfer position 214, and the first transport module 275 controls the first driving member 274 to drive the defective products to move to the NG material placement position 261. The first driving member 274 then controls the first transport seat 273 to move downward so that the defective products are supported in the NG material placement position 261 and are transported to the designated temporary storage position 262 by the second transport mechanism 272. Specifically, the first driving member 274 can adopt a cylinder to control the up and down movement of the first transport seat 273. Furthermore, the first transport module 275 adopts a linear motion module. The linear motion module is a mature existing technology, and its specific structure and working principle will not be further described here.

[0029] The unloading and handling device 28 moves the wafer box that has passed the labeling at the transfer position 214 outward, including an unloading rack 281, two unloading pneumatic clamps 282 relatively arranged on the unloading rack 281 for clamping the wafer box, and a multi-axis moving module 283 connected to the unloading rack 281, wherein the multi-axis moving module 283 includes an X-axis moving module, a Y-axis moving module and a Z-axis moving module to cooperate with the unloading pneumatic clamp 282 to move the wafer box that has passed the labeling outward.

[0030] The label holder 29 includes a label rack 291 arranged in front of the label printer 25, a label plate 292 that can move back and forth relative to the label printer 25 to receive information labels, and a label cylinder 293 arranged on the label rack 291 to drive the label plate 292 to move. The label plate 292 is coated with an anti-sticking layer to prevent the information label printed by the label printer 25 from adhering to the label plate 292 and affecting the adsorption and transfer of the labeling component 245.

[0031] Reference Figures 8 to 15 As shown, the inner bagging and heat-sealing station 3 performs bagging and heat-sealing processing on the wafer box after labeling, including a packaging table 31, a bagging position 311 set on the packaging table 31, an inner bag storage rack 32 set on the packaging table 31, a bag-taking device 33 for clamping the inner bag on the inner bag storage rack 32 to the bagging position 311, a bag-opening device 34 for opening the inner bag 8 at the bagging position 311, a pushing device 35 for pushing the wafer box into the opened inner bag 8, and a heat-sealing device 36 for heat-sealing the bag opening of the inner bag 8; for details, refer to Figure 24 As shown, the inner bag 8 includes two upper edges 81 arranged opposite to each other on the top surface thereof and two lower edges 82 arranged opposite to each other on the bottom surface thereof.

[0032] The inner bag storage rack 32 includes a storage rack body 321 for placing inner bags 8, two bag pressing racks 322 relatively arranged on both sides of the storage rack body 321, a bag pressing roller 323 that can move up and down between the two bag pressing racks 322, and a Z-direction moving module 324 that drives the storage rack body 321 to move up and down. Multiple un-stuffed inner bags 8 are stacked in sequence in the storage rack body 321, and the bag pressing roller 323 presses on the inner bag 8. Through the setting of the bag pressing roller 323, one side of the inner bag 8 in the storage rack body 321 is prevented from warping and bending, and bag pressing rollers 323 of different weights can be selected according to the softness and hardness of the inner bag 8 to ensure that the bag taking device 33 can only take out one inner bag 8 at a time.

[0033] The bag taking device 33 includes a first bag taking rack 331 provided on the packaging table 31 and extending in a direction close to the bag filling position 311, a second bag taking rack 332 provided vertically on the first bag taking rack 331 and extending in a direction close to the inner bag storage rack 32, a support plate 333 movably provided on the first bag taking rack 331 for placing the inner bag 8, a correction mechanism 334 located below the second bag taking rack 332 for correcting the position of the inner bag 8, a bag taking assembly 335 movably provided on the second bag taking rack 332 for clamping the inner bag 8, a first driving assembly 336 provided on the first bag taking rack 331 to drive the support plate 333 to move, and a second driving assembly 337 provided on the second bag taking rack 332 to drive the bag taking assembly 335 to move. When taking a bag, the bag taking assembly 335 35 sucks the inner bag 8 from the inner bag storage rack 32 to the support plate 333, and the first drive component 336 drives the support plate 333 with the inner bag 8 placed thereon to move to the bagging position 311; specifically, a plurality of negative pressure suction nozzles 3331 are provided on the support plate 333, and when the correction mechanism 334 completes the correction of the position of the inner bag 8, the plurality of negative pressure suction nozzles 3331 work to adsorb and fix the inner bag 8 on the support plate 333, to prevent the inner bag 8 from shifting during the process of the support plate 333 moving to the bagging position 311, thereby affecting the subsequent bag-holding process; further, the first drive component 336 and the second drive component 337 both adopt a linear motion module, which is a prior art, and its specific structure and working principle will not be further described here.

[0034] The correction mechanism 334 includes a correction frame 3341 movably arranged below the second bag taking frame 332, two first correction assemblies 3342 oppositely arranged on both sides of the correction frame 3341, two second correction assemblies 3343 oppositely arranged on both sides of the correction frame 3341, and a correction jack cylinder 3344 connected and driving the correction frame 3341 to move up and down, the two first correction assemblies 3342 and the two second correction assemblies 3343 are alternately arranged on the four sides of the correction frame 3341, specifically, the first correction assembly 3342 includes a correction plate 3345 movable close to the opposite side and a first correction cylinder 3346 arranged on the correction frame 3341 to drive the correction plate 3345 to move, and the second correction assembly 3343 includes a correction column 3347 movable close to the opposite side and a second correction cylinder 3348 arranged on the correction frame 3341 to drive the correction column 3347 to move, wherein the support plate 333 is provided with a strip-shaped moving hole 3332 for the opposite correction column 3347 to pass through.

[0035] The bag taking assembly 335 includes a moving seat 3351 movably arranged on the second bag taking frame 332, a bag taking plate 3352 arranged at the lower end of the moving seat 3351 and capable of extending into the inner bag storage frame 32, and a plurality of bag taking nozzles 3353 arranged at the lower end of the bag taking plate 3352, when taking the inner bag, the second driving assembly 337 controls the moving seat 3351 to move close to the inner bag storage frame 32, so that the plurality of bag taking nozzles 3353 are opposite to the front end of the inner bag in the inner bag storage frame 32, at this time, the plurality of bag taking nozzles 3353 are controlled to work, that is, the front end of the inner bag 8 is adsorbed, and then the second driving assembly 337 is reversely moved to take the inner bag 8 from the inner bag storage frame 32 to the support plate 333.

[0036] The bag supporting device 34 includes an adsorption bag supporting assembly 341 arranged above the bagging position 311 and two clamping bag supporting assemblies oppositely arranged on the packaging table 31 and respectively located on both sides of the inner bag 8, wherein the two clamping bag supporting assemblies are respectively arranged on both sides of the inner bag 8 and opposite to the two upper edges 81; when supporting the bag, the adsorption bag supporting assembly 341 adsorbs the top surface of the inner bag 8, and the clamping bag supporting assembly clamps the upper edge 81 and the lower edge 82 arranged on the same side to support the inner bag 8; specifically, the clamping bag supporting assembly includes a first clamping bag supporting assembly 342 and a second clamping bag supporting assembly 343 arranged at intervals.

[0037] The suction bag-holding assembly 341 includes a suction bag-holding frame 3411, a lifting plate 3412 that can move up and down and is set on the suction bag-holding frame 3411, a fixed suction nozzle 3413 set on the lifting plate 3412, an adjustment plate 3414 set on the lifting plate 3412 and movable relative to the fixed suction nozzle 3413, a movable suction nozzle 3415 set on the adjustment plate 3414 and opposite to the fixed suction nozzle 3413, a first lifting cylinder 3416 connected to and driving the lifting plate 3412 to move, and a second lifting cylinder 3417 set on the suction bag-holding frame 3411 and connected to and driving the first lifting cylinder 3416 to move up and down, wherein the movable suction nozzle 3415 and the fixed suction nozzle 3413 can be sucked and fixed on the top surface of the inner bag 8. Through the arrangement of the movable suction nozzle 3415, the suction bag-holding assembly 341 can adapt to inner bags 8 of different sizes.

[0038] The first bag clamping assembly 342 includes a bag clamping seat 3421, an upper clamping piece 3422 movably arranged on the bag clamping seat 3421 for clamping the relative upper edge 81, a lower clamping piece 3423 movably arranged on the bag clamping seat 3421 for clamping the relative lower edge 82, a first lifting piece 3424 arranged on the bag clamping seat 3421 for driving the upper clamping piece 3422 to move, and a second lifting piece 3425 arranged on the bag clamping seat 3421 for driving the lower clamping piece 3423 to move; wherein, the upper clamping piece 3422 includes an upper clamping frame 3426 connected to the first lifting piece 3424 and two upper clamping pneumatic clamps 3427 arranged relatively to the upper clamping frame 3426, and the two upper clamps The pneumatic clamping jaws 3427 can clamp the relative upper edges 81 respectively, and cooperate with the adsorption bag-stretching component 341 to move upward to open the inner bag 8; specifically, the structure of the lower clamping member 3423 is the same as that of the upper clamping member 3422, and no further description is given here. When the lower clamping member 3423 clamps the lower edge 82 on the same side, it cooperates with the negative pressure suction nozzle 3331 on the support plate 333, so that the inner bag 8 will not move upward with the upper clamping member 3422, ensuring that the inner bag 8 can be stably stretched to the required degree; further, the first lifting member 3424 and the second lifting member 3425 both adopt a linear moving module that can realize vertical movement. The linear moving module is an existing technology, and no further description is given here on its specific structure and working principle.

[0039] The second bag-holding assembly 343 has a structure that is substantially the same as that of the first bag-holding assembly 342 , with the difference being that it does not include a bag-holding seat 3421 , and the first lifting member 3424 and the second lifting member 3425 are vertically opposed to each other. Furthermore, a linear moving module is provided that can drive the first lifting member 3424 or the second lifting member 3425 to move in the pushing direction, so that the second bag-holding assembly 343 can adjust the clamping position according to the inner bags 8 of different sizes.

[0040] The pushing device 35 comprises a moving frame 351 arranged on the packaging table 31 and movable towards the bagging position 311, a pushing plate 352 arranged on the moving frame 351 and used for placing the wafer box, a first pushing cylinder 353 arranged on the moving frame 351 and used for moving the pushing plate 352 towards the bagging position 311, a second pushing cylinder 354 arranged on the pushing plate 352 and used for pushing the wafer box into the inner bag 8, two pushing limit cylinders 355 arranged on the pushing plate 352 and used for correcting the position of the wafer box, and a pushing linear moving module 356 arranged on the packaging table 31 and used for driving the moving frame 351 to move towards the bagging position 311. The two pushing limit cylinders 355 are arranged to correct the position of the wafer box, so as to ensure that the wafer box can smoothly enter the inner bag 8. When the inner bag 8 is opened, the first pushing cylinder 353 cooperates with the pushing linear moving module 356 to move the wafer box to the bag opening of the inner bag 8, and the second pushing cylinder 354 pushes the wafer box into the inner bag 8 so that the wafer box is supported on the supporting plate 333. At this time, the negative pressure suction nozzle 3331 on the supporting plate 333 stops working.

[0041] The heat sealing device 36 comprises two bag folding seats 361 arranged on the packaging table 31 and movable towards each other, two bag folding knives 362 arranged on the two bag folding seats 361 respectively, a negative pressure pipe 363 arranged on the inner side of one of the bag folding knives 362, an upper heat sealing assembly 364 and a lower heat sealing assembly 365 arranged opposite to each other, a first moving mechanism 366 arranged on the packaging table 31 and used for driving the bag folding seat 361 to move, a second moving mechanism 367 arranged on the packaging table 31 and used for driving the two bag folding seats 361 to move towards each other, an upper positioning plate 368 extending downwards from the upper heat sealing assembly 364, and a lower positioning plate 369 extending upwards from the lower heat sealing assembly 365 and opposite to the upper positioning plate 368. The two bag folding knives 362 are opposite to the two side surfaces of the inner bag 8 respectively. The first moving mechanism 366 drives the bag folding seat 361 to move towards the bagging position 311, so that the negative pressure pipe 363 extends into the inner bag 8, and the bag folding knife 362 on the same side is located outside the inner bag 8. The second moving mechanism 367 drives the two bag folding seats 361 to move towards each other, so that the bag folding knife 362 drives the side surface of the inner bag 8 in contact with the bag folding knife 362 to move inwards, so as to complete the bag folding process of the bag opening of the inner bag 8. The upper positioning plate 368 and the lower positioning plate 369 are opposite to each other and located on the side opposite to the wafer box and the negative pressure pipe 363. The wafer box can be positioned when the negative pressure pipe 363 is vacuumized, so as to prevent the wafer box from being displaced when the inner bag 8 is vacuumized. Specifically, the negative pressure pipe 363 comprises a main body segment 3631 connected with an external negative pressure source and a flat segment 3632 capable of extending into the inner bag 8. Further, the first moving mechanism 366 and the second moving mechanism 367 both adopt linear moving modules. The linear moving module is a prior art, and thus the specific structure and working principle thereof will not be described in detail.

[0042] The upper heat sealing assembly 364 includes an upper heat sealing seat 3641 arranged on the packaging table 31, an upper heat sealing head 3642 movably arranged on the upper heat sealing seat 3641, and an upper heat sealing cylinder 3643 connected to and driving the upper heat sealing head 3642 to move.

[0043] The lower heat sealing assembly 365 includes a lower heat sealing seat 3651 arranged on the packaging table 31, a lower heat sealing head 3652 arranged on the lower heat sealing seat 3651 and movable up and down, a first heat sealing cylinder 3653 connected to and driving the lower heat sealing head 3652 to move, a mounting plate 3654 for mounting the first heat sealing cylinder 3653 and a second heat sealing cylinder 3655 arranged on the lower heat sealing seat 3651 and connected to the mounting plate 3654, wherein the lower positioning plate 369 is arranged on the mounting plate 3654 and extends upward; after the inner bag 8 is folded, the upper heat sealing cylinder 3643 drives the upper heat sealing head 3642 to move downward and contact the top surface of the inner bag 8 at the folding position, and the second heat sealing cylinder 3655 drives the mounting plate 3654 to move upward. The mounting plate 3654 moves upward, driving the lower heat sealing head 3652 to contact the bottom surface of the inner bag 8, and the negative pressure tube 363 can start to vacuum the inner bag 8; when the negative pressure tube 363 completes vacuuming, the vacuum is closed and the nitrogen control valve is opened to fill a small amount of nitrogen. After completion, the first moving mechanism 366 drives the bag folding seat 361 to move and drive the negative pressure tube 363 to be pulled out of the inner bag 8. At this time, the first heat sealing cylinder 3653 drives the lower heat sealing head 3652 to move upward and cooperate with the upper heat sealing head 3642 to clamp the bag opening of the inner bag 8 for heat sealing. After the heat sealing heating is completed, the pressure is maintained. After the pressure maintaining is completed, the upper heat sealing component 364 and the lower heat sealing component 365 move in opposite directions to the standby state.

[0044] Reference Figures 16 to 22 As shown, the desiccant attaching station 4 is used to attach desiccant to the wafer box with the inner bag 8, including an attaching table 41, a gluing position 42 set on the attaching table 41, a loading and transporting device 43 for transporting the wafer box to the gluing position 42, a first attaching device 44 set on the attaching table 41 to adhere the bag opening of the inner bag 8 to one side of the inner bag 8, a second attaching device 45 for attaching the desiccant to the inner bag 8, and an attaching conveying device 46 for moving the wafer box on the gluing position 42 to the second attaching device 45; wherein, referring to Figure 24 As shown, the inner bag 8 includes an inner bag body 83 for housing the wafer box and a folded edge section 84 located outside the heat seal.

[0045] The loading and handling device 43 uses a pneumatic loading gripper in conjunction with a multi-axis moving module that can realize multi-axis movement to transport the wafer box to the gluing position 42. Among them, the structure of the pneumatic gripper cooperating with the multi-axis moving module to clamp and move the items is a mature technology in the mechanical field, and its specific structure and working principle will not be further described here.

[0046] The first attaching device 44 comprises a first adhesive positioning assembly 441 arranged on the attaching workbench 41 at one side of the adhesive position 42, a push flat frame 442 arranged on the attaching workbench 41 opposite to the first adhesive positioning assembly 441, a push flat roller 443 rotatably arranged on the upper end of the push flat frame 442, a folding edge assembly 444 arranged on the push flat frame 442 to fold the end of the folding edge segment 84 downward, and a first adhesive attaching assembly 445 arranged on the attaching workbench 41. In operation, when the wafer box with the inner bag 8 sleeved thereon is moved downward to the adhesive position 42 by the feeding and carrying device 43, the push flat roller 443 pushes the folding edge segment 84 upward to make part of the folding edge segment 84 be accommodated on the opposite side of the inner bag 8, and the rest of the folding edge segment 84 is folded downward to the top surface of the inner bag 8 by the folding edge assembly 444, and the first adhesive attaching assembly 445 attaches the adhesive between the top surface of the inner bag 8 and the end of the folding edge segment 84.

[0047] The first adhesive positioning assembly 441 comprises a first positioning frame 4411 arranged on the attaching workbench 41 opposite to the push flat frame 442, a first positioning plate 4412 movable toward the push flat frame 442, and a first positioning cylinder 4413 arranged on the first positioning frame 4411 to drive the first positioning plate 4412 to move. When the wafer box with the inner bag 8 sleeved thereon is moved to the adhesive position 42 by the feeding and carrying device 43, the first positioning cylinder 4413 drives the first positioning plate 4412 to move close to the wafer box to position the wafer box between the first positioning plate 4412 and the push flat frame 442, so as to ensure the operation of the first adhesive attaching assembly 445.

[0048] The folding edge assembly 444 comprises a folding edge plate 4441 movable toward the first adhesive positioning assembly 441 arranged on the push flat frame 442, and a folding edge cylinder 4442 arranged on the push flat frame 442 to connect and drive the folding edge plate 4441 to move. A plurality of adhesive accommodation areas 4443 for the first adhesive attaching assembly 445 to attach adhesive are arranged on the folding edge plate 4441 at intervals. In operation, after part of the folding edge segment 84 is pushed upward to be accommodated on the opposite side of the inner bag 8 by the push flat roller 443, the rest of the folding edge segment 84 is folded downward to the top surface of the inner bag 8 by the folding edge plate 4441 driven by the folding edge cylinder 4442 to move close to the first adhesive positioning assembly 441.

[0049] The first adhesive tape attaching assembly 445 comprises a first adhesive tape rack 4451 for placing an adhesive tape roll, a first adhesive pressing assembly 4452 arranged on the first adhesive tape rack 4451 for pressing the adhesive tape, a first adhesive pulling pneumatic gripper 4453 movable relative to the first adhesive pressing assembly 4452, a first cutting assembly 4454 arranged on the first adhesive tape rack 4451 outside the first adhesive pressing assembly 4452 for cutting the adhesive tape, a first adhesive pulling cylinder 4455 arranged on the first adhesive tape rack 4451 for driving the first adhesive pulling pneumatic gripper 4453 to move, a first suction assembly 4456 arranged on the first adhesive tape rack 4451 for suctioning the adhesive tape, a transfer seat 4457 arranged on the first adhesive tape rack 4451, a first transfer module 4458 connected to and driving the transfer seat 4457 to move close to the first adhesive tape positioning assembly 441, and a second transfer module 4459 arranged on the attaching workbench 41 for driving the first transfer module 4458 to move, wherein the first adhesive pulling cylinder 4455 controls the first adhesive pulling pneumatic gripper 4453 to pull the adhesive tape to move outward to the outside of the first suction assembly 4456, the first suction assembly 4456 can suction and fix the relative adhesive tape so that the first cutting assembly 4454 cuts the pulled adhesive tape, and the first transfer module 4458 and the second transfer module 4459 work respectively so that the cut adhesive tape can be moved to the top surface of the wafer box to fix the end of the edge folding section 84 to the top surface of the inner bag 8. Specifically, the moving direction of the second transfer module 4459 is perpendicular to the moving direction of the first transfer module 4458, and both the first transfer module 4458 and the second transfer module 4459 can adopt a linear movement module, which is a mature technology in the mechanical field, and the edge folding will not be described further in terms of specific structure and working principle.

[0050] The first adhesive pressing assembly 4452 comprises a lower adhesive pressing block 44521 arranged on the first adhesive tape rack 4451, an upper adhesive pressing block 44522 movable relative to the lower adhesive pressing block 44521, a first adhesive pressing cylinder 44523 arranged on the first adhesive tape rack 4451 and connected to and driving the upper adhesive pressing block 44522 to move up and down, and a first guide roller 44524 arranged on the first adhesive tape rack 4451 inside the lower adhesive pressing block 44521, wherein one end of the adhesive tape roll passes through the lower end of the first guide roller 44524 and then passes through the space between the upper adhesive pressing block 44522 and the lower adhesive pressing block 44521 to be pressed.

[0051] The first cutting assembly 4454 comprises a first cutting knife 44541 movably arranged on the first adhesive tape rack 4451 and a first cutting cylinder 44542 arranged on the first adhesive tape rack 4451 and connected to and driving the first cutting knife 44541 to move up and down, wherein the first cutting knife 44541 is located between the first adhesive pressing assembly 4452 and the first suction assembly 4456.

[0052] The first adsorption component 4456 includes a first fixed frame 44561 arranged on the first tape rack 4451, an adsorption seat 44562 arranged on the first fixed frame 44561 and movable up and down, a tape adsorption head 44563 arranged on the adsorption seat 44562 for adsorbing the tape, a first adsorption cylinder 44564 arranged on the first fixed frame 44561 and connected to the pneumatic adsorption seat 44562 to move up and down, and a second adsorption cylinder 44565 arranged on the adsorption seat 44562 and connected to drive the tape adsorption head 44563 to move up and down.

[0053] The second attaching device 45 includes an attaching robot 451 provided on the attaching workbench 41, an attaching rack 452 provided at the front end of the attaching robot 451, a second adhesive positioning assembly 453 provided on the attaching workbench 41 opposite to the attaching robot 451, a desiccant storage bin 454 provided on the attaching workbench 41 on one side of the second adhesive positioning assembly 453, a tape supply mechanism 455 provided on the attaching workbench 41 for supplying tape, and detection cameras 456, a tape adsorption assembly 457 and a desiccant adsorption assembly 458 provided at intervals on the periphery of the attaching rack 452. The attaching robot 451 controls the desiccant adsorption assembly 458. 58 adsorbs the desiccant to the surface of the inner bag 8, and then controls the tape adsorption component 457 to adsorb the tape from the tape supply mechanism 455 to the wafer box to adhere and fix the desiccant; wherein, the tape supply mechanism 455 is basically the same as the first tape attachment component 445, the difference is that: the first adsorption component 4456, the transfer seat 4457, the first transfer module 4458 and the second transfer module 4459 are not set; because the tape adsorption component 457 is set on the attachment frame 452 to move with the attachment robot 451, the first adsorption component 4456, the transfer seat 4457, the first transfer module 4458 and the second transfer module 4459 are not set.

[0054] The second adhesive laminating positioning assembly 453 includes a second fixing frame 4531 disposed on the laminating workbench 41, a second positioning frame 4532 disposed on the laminating workbench 41 opposite to the second fixing frame 4531, a second positioning plate 4533 movable in a direction approaching the second fixing frame 4531, and a second positioning cylinder 4534 disposed on the second positioning frame 4532 to drive the second positioning plate 4533 to move. The second positioning plate 4533 cooperates with the second fixing frame 4531 to fix the wafer packaging box to facilitate the placement of the desiccant and the attachment of the tape.

[0055] The desiccant storage bin 454 includes a storage rack 4541 arranged on the attachment workbench 41, a storage cavity 4542 for storing desiccant arranged in the storage rack 4541, a receiving plate 4543 that can move up and down and is arranged in the storage cavity 4542, and a vertical moving module 4544 that is arranged on the storage rack 4541 and is connected to and drives the receiving plate 4543 to move up and down; specifically, the vertical moving module 4544 adopts a linear moving module that can realize the up and down movement of the receiving plate 4543.

[0056] The tape adsorption assembly 457 includes a fixed adsorption head 4571 arranged on the attachment frame 452 and two floating adsorption heads 4572 arranged on the attachment frame 452 on both sides of the fixed adsorption head 4571. The two floating adsorption heads 4572 are respectively adsorbed and connected to the two ends of the tape. When the desiccant is fixed, the fixed adsorption head 4571 presses the adsorbed tape part against the upper surface of the desiccant, and the two floating adsorption heads 4572 press the two ends of the tape against the surface of the inner bag 8 to fix the desiccant.

[0057] The attachment conveying device 46 includes a receiving platform 461 that can be moved up and down and is set on the attachment workbench 41 for receiving the wafer box, a lifting drive component 462 that connects and drives the receiving platform 461 to move up and down, and a conveying module 463 that conveys the lifting drive component 462 and the receiving platform 461 from the first glue positioning component 441 to the second attachment device 45, wherein the lifting drive component 462 can adopt a cylinder; the conveying module 463 adopts a linear motion module.

[0058] The outer bag filling and heat sealing station 5 is used to put an outer bag on the wafer box with the desiccant attached and package it. The structure and working principle of this station are the same as those of the inner bag filling and heat sealing station 3. Its specific structure and working principle will not be further described here; specifically, the outer bag structure is the same as that of the inner bag 8, and the folding edge will not be further described.

[0059] Reference Figure 23As shown, the outer bag labeling inspection station 6 labels the wafer boxes that have completed the outer bag setting, including an outer bag labeling platform 61, a gripper handling module 62 that moves the wafer box from the outer bag bagging and heat sealing station 5 to the outer bag labeling platform 61, a storage and adhesion device 63 that stores and fixes the outer bag folded edge section on the top surface of the outer bag body, a bonding device 64 arranged on the outer bag labeling platform 61 for labeling the outer bag, two labeling printers 65 arranged on both sides of the bonding device 64 on the outer bag labeling platform 61, and a transfer and handling module 66 that moves the labeled qualified wafer boxes outward, wherein the two labeling printers 65 are used to print outer bag labels and ROSH labels respectively; specifically, the storage and adhesion device 63 has the same structure as the first bonding device 44 in the desiccant bonding station 4, and its specific structure and working principle are not further described here; the transfer and handling module 66 has the same structure as the labeling conveying device 23, and its specific structure and working principle are not further described here.

[0060] The laminating device 64 includes a laminating robot 641, a laminating frame 642 arranged in front of the laminating robot 641, a second detection component 643, a first laminating adsorption component 644 and a second laminating adsorption component 645 arranged at intervals on the laminating frame 642. When working, the first laminating adsorption component 644 adsorbs and adheres the outer bag label to the top surface of the outer bag, and the second laminating adsorption component 645 adsorbs and adheres the ROSH label to the top surface of the outer bag; specifically, the second detection component 643 can adopt a CCD camera; further, the first laminating adsorption component 644 and the second laminating adsorption component 645 are both composed of a laminating adsorption head and a laminating cylinder, and their specific structure and working principle will not be further described here.

[0061] When the outer bag folding section is completed and stored and fixed, the two label printers 65 print out labels at the same time, and the second detection component 643 takes a photo of the outer label to determine whether it is qualified. When the outer bag label is unqualified, the first bonding adsorption component 644 moves the waste label to the waste label rack and reprints the outer bag label relative to the label printer 65; when the outer bag label is qualified, the first bonding adsorption component 644 transfers the outer bag label to the top surface of the outer bag; after the outer bag label is labeled, the second detection component 643 detects the labeling situation When the labeling is unqualified, the transfer and handling module 66 transports the defective products out for processing; when the labeling is qualified, the second bonding and adsorption component 645 transfers the printed ROSH label and bonds it to the top surface of the outer bag, and the second detection component 643 detects whether there is a ROSH label. When no ROSH label is detected, the label removal and labeling action is performed again. If the device alarms more than twice, manual observation and processing is required; when a ROSH label is detected, the transfer and handling module 66 transports the defective products out to the unloading station 7 for unloading processing.

[0062] The automatic wafer box packaging method based on the above device specifically includes the following steps: Step one, the wafer box with the top surface attached with the incoming label is transported into the wafer box label detection station 2 by the transfer mechanism 14 in the feeding station 1, the incoming label is torn off by the wafer box label detection station 2, and then the information label is attached, the specific process is as follows: A. The wafer box is transported to the buffer position 213 by the transfer mechanism 14 in the feeding station 1, and the wafer box at the buffer position 213 is transported to the labeling position 211 by the labeling conveying device 23; B. The first detection assembly 243 collects information of the incoming label on the top surface of the wafer box, controls the corresponding label printer 25 to print the information label according to the obtained information, controls the tear label assembly 244 to tear off the incoming label by the labeling manipulator 241, and then the first detection assembly 243 detects the information label on the label seat 29 by taking a photo, when the information label has a defect, the labeling assembly 245 transfers and places the information label on the waste label rack 217, and controls the label printer 25 to reprint the information label; when the information label is qualified, the labeling manipulator 241 controls the labeling assembly 245 to transfer and attach the qualified information label on the label seat 29 to the top surface of the wafer box; C. The first detection assembly 243 detects the attached information label by taking a photo, when the attached information label has a defect, the wafer box is moved to the transfer position 214 by the labeling conveying device 23, and is moved to the defective product temporary storage area 26 by the defective product conveying device 27; when the attached information label is qualified, the wafer box is moved to the transfer position 214 by the labeling conveying device 23, and is conveyed to the inner bag bagging heat sealing station 3 by the labeling qualified wafer box through the unloading conveying device 28; Step two, the wafer box with the attached information label is sent into the pushing device 35, the inner bag 8 is taken out from the inner bag storage rack 32 and moved to the bagging position 311 by the bag taking device 33, the inner bag 8 at the bagging position 311 is opened by the bag opening device 34, the wafer box is pushed into the opened inner bag 8 by the pushing device 35, the bag opening is folded by the heat sealing device 36, and then vacuumizing and heat sealing are performed, the specific process is as follows: A. The wafer box with the attached information label is sent into the pushing device 35, the inner bag is taken out from the inner bag storage rack 32 and moved to the bagging position 311 by the bag taking device 33, the inner bag 8 at the bagging position 311 is opened by the bag opening device 34, and the wafer box is pushed into the opened inner bag 8 by the pushing device 35; B. The bag folding seat 361 moves close to the bagging position 311, drives the two bag folding knives 362 and the negative pressure pipe 363 to move close to the inner bag 8, so that the two bag folding knives 362 are respectively located at the opposite sides of the bag opening of the inner bag 8, and the negative pressure pipe 363 extends into the inner bag 8, then the second moving mechanism 367 drives the two bag folding knives 362 to move towards each other, drives the side of the inner bag 8 in contact with it to move inward to position, and completes the bag folding processing of the bag opening of the inner bag 8; C. The upper heat-sealing assembly 364 moves downward until it contacts the top surface of the inner bag 8, and the lower heat-sealing assembly 365 first moves upward until it contacts the bottom surface of the inner bag 8. The negative pressure tube 363 works to vacuum the inside of the inner bag 8. The wafer box is limited by the upper positioning plate 368 and the lower positioning plate 369 relative to each other and will not move. When the negative pressure tube 363 completes the vacuum treatment, the first moving mechanism 366 drives the bag folding seat 361 to move in the direction away from the bagging position 311, thereby driving the negative pressure tube 363 to be pulled out of the inner bag 8. At this time, the first heat-sealing cylinder 3653 drives the lower heat-sealing head 3652 to move upward and cooperate with the upper heat-sealing head 3642 to clamp the inner bag 8 for heat-sealing treatment, so as to complete the vacuum and heat-sealing treatment of the inner bag 8 after the bag folding treatment. Step 3: The wafer box with the inner bag installed enters the desiccant attaching station 4 for desiccant attaching. The specific process is as follows: A. The loading and transporting device 43 transports the wafer box with the inner bag to the gluing station 42. During the transport process, the loading and transporting device 43 moves the wafer box above the gluing station 42 and then slowly lowers the wafer box to the gluing station 42. During the descent, the inner bag folding section 84 is partially flattened upward by the flattening roller 443 and stored on the opposite side of the inner bag, and the remaining part is placed on the folding plate 4441. B. The first gluing and positioning assembly 441 works to fix the wafer box between the first positioning plate 4412 and the relative leveling frame 442. Then, the folding cylinder 4442 controls the folding plate 4441 to move closer to the first gluing and positioning assembly 441 so that the remaining portion of the folding section 84 is driven by the folding plate 4441 to fold downward to the top surface of the inner bag 8. C. The first adhesive pulling cylinder 4455 controls the first adhesive pulling pneumatic clamp 4453 to pull the adhesive tape outward to the outside of the first adsorption assembly 4456. The first adsorption assembly 4456 can adsorb and fix the relative adhesive tape so that the first cutting assembly 4454 can cut the pulled adhesive tape. The first transfer module 4458 and the second transfer module 4459 then work separately to move the cut adhesive tape to the top surface of the wafer box and fix the end of the folded edge section 84 to the top surface of the inner bag 8. D. The attachment conveyor 46 moves the wafer box at the gluing position 42 to the second gluing positioning assembly 453. The second positioning plate 4533 cooperates with the second fixing frame 4531 to position the wafer box. The attachment robot 451 controls the desiccant adsorption assembly 458 to adsorb and transfer the desiccant in the desiccant storage bin 454 to the top surface of the inner bag 8. The attachment robot 451 then controls the tape adsorption assembly 457 to obtain the tape from the tape supply mechanism 455. The fixed adsorption head 4571 cooperates with the floating adsorption head 4572 to fix the desiccant on the surface of the inner bag 8 to complete the attachment of the desiccant. The attachment conveyor 46 continues to work and transports the wafer box with the desiccant attached to the outer bagging and heat sealing station 5. Step four, the outer bag bagging heat sealing work station 5 is attached to the wafer box of desiccant and carries out outer bag setting and heat sealing treatment, and the wafer box of the outer bag setting enters the outer bag label detection work station 6, carries out the label of the outer bag and the ROSH label and is attached, has completed the packaging of the wafer box, enters the unloading work station 7 and carries out unloading treatment.

[0063] The application stabilizes the automatic completion of the label, bagging and desiccant attachment of the wafer box by limiting the structural composition of the packaging machine, setting the wafer box label detection work station 2, the inner bag bagging heat sealing work station 3 and the desiccant attachment work station 4, greatly reduces the labor input, improves the production efficiency, and has high cleanliness; the overall equipment has high automation degree, full-automatic operation, avoids the risk of wafer pollution in the wafer box caused by human operation, and can also be compatible with wafer box packaging of various sizes.

[0064] The above is only a preferred embodiment of the application, and therefore cannot limit the scope of the application, that is, equivalent changes and modifications made according to the patent range and content of the specification of the application should still be within the scope of the application.

Claims

1. A wafer box automatic packaging machine, characterized by: It includes a wafer box labeling and inspection station for labeling wafer boxes, an inner bagging and heat sealing station for bagging and sealing the labeled wafer boxes, and a desiccant attaching station for attaching desiccant to the inner bag; The inner bag filling and heat sealing station includes a packaging table, a bag filling position provided on the packaging table, an inner bag storage rack provided on the packaging table, a bag taking device for clamping the inner bag on the inner bag storage rack to the bag filling position, a bag opening device for opening the inner bag at the bag filling position, a material pushing device for pushing the wafer box into the opened inner bag, and a heat sealing device for heat sealing the bag opening of the inner bag; The desiccant attaching station includes an attaching workbench, a gluing position arranged on the attaching workbench, a loading and transporting device for transporting a wafer box to the gluing position, a first attaching device arranged on the attaching workbench to adhere the inner bag opening to one side of the inner bag, and a second attaching device for attaching the desiccant to the inner bag, wherein the first attaching device includes a first gluing positioning component arranged on the attaching workbench at one side of the gluing position, a push-flattening frame arranged on the attaching workbench opposite to the first gluing positioning component, a push-flattening roller rotatably arranged on the upper end of the push-flattening frame, and a push-flattening roller arranged on the push-flattening frame to fold the wafer box. A folding assembly with the end of the edge segment folded downward and a first tape attaching assembly arranged on the attaching workbench, the inner bag includes an inner bag body for housing the wafer box and a folding segment located on the outside of the heat seal. When the loading and handling device drives the wafer box housing the inner bag downward to the gluing position, the flattening roller pushes the folding segment upward to flatten it so that part of it is stored on the side of the opposite surface of the inner bag, and the remaining part is placed on the folding assembly. The folding assembly works to fold the remaining part of the folding segment downward to the top surface of the inner bag, and the first tape attaching assembly attaches the tape between the top surface of the inner bag and the end of the folding segment.

2. The wafer box automatic packaging machine according to claim 1, characterized in that: The folding assembly includes a folding plate arranged on the flattening frame and movable in a direction close to the first glue positioning assembly and a folding cylinder arranged on the flattening frame and connected to and driving the folding plate to move. The folding plate is provided with a plurality of glue clearance areas for the first tape attaching assembly to attach tape. After the folding section is flattened upward by the flattening roller and stored on the opposite side of the inner bag, the remaining part is placed on the folding plate. The folding cylinder controls the folding plate to move close to the first glue positioning assembly so that the remaining part of the folding section is driven by the folding plate to be folded downward to the top surface of the inner bag.

3. The wafer box automatic packaging machine according to claim 1, characterized in that: The heat sealing device includes a bag folding seat that can be moved in the direction close to the bag filling position, two bag folding knives that can be movably arranged on the packaging table, a negative pressure tube arranged on the inner side of one of the bag folding knives, an upper heat sealing assembly and a lower heat sealing assembly arranged opposite to each other, a first moving mechanism arranged on the packaging table to drive the bag folding seat to move, a second moving mechanism arranged on the bag folding seat to drive the two bag folding knives to move toward each other, an upper positioning plate extending downward on the upper heat sealing assembly, and a lower positioning plate extending upward on the lower heat sealing assembly and opposite to the upper positioning plate, the two bag folding knives are respectively opposite to the two side surfaces of the inner bag, and the upper positioning plate and the lower positioning plate are respectively opposite to the top surface and the bottom surface of the inner bag, the first moving mechanism drives the bag folding seat to move close to the bag filling position so that the negative pressure tube extends into the inner bag, and the bag folding knife on the same side is located on the outside of the inner bag; the second moving mechanism drives the two bag folding knives to move toward each other so that the bag folding knives drive the side surfaces of the inner bag in contact with them to move inward to complete the folding of the bag opening of the inner bag.

4. The wafer box automatic packaging machine according to claim 3, characterized in that: The bag taking device includes a first bag taking rack arranged on the packaging table and extending in a direction close to the bag filling position, a second bag taking rack arranged vertically on the first bag taking rack and extending in a direction close to the inner bag storage rack, a support plate movably arranged on the first bag taking rack for placing the inner bag, a correction mechanism located below the second bag taking rack to correct the position of the inner bag, a bag taking assembly movably arranged on the second bag taking rack for clamping the inner bag, a first driving assembly arranged on the first bag taking rack to drive the support plate to move, and a second driving assembly arranged on the second bag taking rack to drive the bag taking assembly to move, the bag taking assembly sucks the inner bag from the inner bag storage rack onto the support plate, and the first driving assembly drives the support plate with the inner bag placed thereon to move to the bag filling position.

5. The wafer box automatic packaging machine according to claim 4, characterized in that: The correction mechanism includes a correction frame that can be moved up and down and is arranged below the second bag-taking frame, two first correction assemblies relatively arranged on both sides of the correction frame, two second correction assemblies relatively arranged on both sides of the correction frame, and a correction lifting cylinder that is connected and drives the correction frame to move up and down. The two first correction assemblies and the two second correction assemblies are alternately arranged on the four sides of the correction frame. The first correction assembly includes a correction plate that can be moved along the relative side and a first correction cylinder arranged on the correction frame to drive the correction plate to move. The second correction assembly includes a correction column that can be moved along the relative side and a second correction cylinder arranged on the correction frame to drive the correction column to move. The support plate is provided with a strip-shaped movable hole for the relative correction column to pass through.

6. The wafer box automatic packaging machine according to claim 4, characterized in that: The bag taking assembly includes a movable seat movably arranged on the second bag taking rack, a bag taking plate arranged at the lower end of the movable seat and capable of extending into the inner bag storage rack, and a plurality of bag taking nozzles spaced apart at the lower end of the bag taking plate.

7. The wafer box automatic packaging machine according to claim 1, characterized in that: The second attaching device includes an attaching robot arranged on the attaching workbench, a rotating frame arranged at the front end of the attaching robot, a tape supply mechanism for supplying tape, a desiccant storage rack arranged on the attaching workbench for storing desiccant, and a second detection component, a desiccant adsorption transfer component and a tape adsorption transfer component arranged at intervals on the outer periphery of the rotating frame.

8. The wafer box automatic packaging machine according to claim 1, characterized in that: The wafer box labeling and inspection station includes a labeling table, a labeling conveying device arranged on the labeling table to transport the wafer box, a labeling device arranged on the labeling table and a label printer arranged on the labeling table. The labeling device includes a labeling robot arranged on the labeling table, a mounting plate arranged at the front end of the labeling robot, and a first detection component, a label tearing component and a labeling component arranged at intervals on the mounting plate.

9. The wafer box automatic packaging machine according to claim 1, characterized in that: It also includes an outer bag filling and heat sealing station and an outer bag labeling and inspection station. The outer bag filling and heat sealing station puts an outer bag on the wafer box with the desiccant attached and performs heat sealing. The outer bag labeling and inspection station labels the outer bag.

10. A wafer box automatic packaging method, characterized by: The packaging machine according to any one of claims 1 to 9 specifically comprises the following steps: Step 1: The wafer box with the incoming label on the top surface enters the wafer box labeling inspection station, where the incoming label is torn off and then the information label is attached; Step 2: The wafer box with the information label is sent to the pushing device. The bag taking device takes the inner bag from the inner bag storage rack and moves it to the bagging position. The bag opening device opens the inner bag on the bagging position. The pushing device then pushes the wafer box into the opened inner bag. The heat sealing device first folds the bag opening and then vacuumizes it. After vacuuming, it is immediately heat-sealed. Step three, the wafer box with the inner bag is transported to the gluing position by the loading and transporting device. When the loading and transporting device drives the wafer box with the inner bag to move downward to the gluing position, the flattening roller pushes the folding section upward to make part of it stored in the side of the opposite surface of the inner bag, and the rest of it is placed on the folding component. The folding component works to fold the rest of the folding section downward to the top surface of the inner bag, and the first tape attaching component then attaches the tape between the top surface of the inner bag and the end of the folding section to fix the folding section; the wafer box with the inner bag folding section fixed is moved to the second attaching device, and the desiccant is fixed to the top surface of the inner bag by the second attaching device to complete the attachment of the desiccant.

Images