Preparation method and preparation device of MEMS (Micro Electro Mechanical System) device

Abstract

The invention relates to a preparation method and a preparation device of an MEMS (Micro Electro Mechanical System) device. The preparation method of the MEMS device comprises the following steps: providing a to-be-cleaned MEMS assembly comprising an adhesive film layer and a plurality of MEMS devices adhered to the adhesive film layer; the MEMS device is provided with a substrate layer and a structural layer, the side, away from the structural layer, of the substrate layer of the MEMS device faces the adhesive film layer, and the side, away from the substrate layer, of the structural layer of the MEMS device is provided with a protective film layer; the side, where the adhesive film layer is located, of the to-be-cleaned MEMS component faces upwards, the side, where the protective film layer is located, of the to-be-cleaned MEMS component faces downwards, and the to-be-cleaned MEMS component is placed in cleaning liquid to be cleaned; wherein the liquid level of the cleaning liquid is located below the adhesive film layer and located on the surface, away from the adhesive film layer, of the structural layer. According to the preparation method of the MEMS device, the MEMS device is cleaned by putting the side, where the adhesive film layer is located, of the to-be-cleaned MEMS assembly in the cleaning solution in a manner that the side, away from the substrate layer, of the structural layer of the MEMS device faces upwards and putting the MEMS device in the cleaning solution in a manner that the side, away from the substrate layer, of the to-be-cleaned MEMS assembly faces downwards; wherein the liquid level of the cleaning liquid is located below the adhesive film layer and located on the surface, away from the adhesive film layer, of the structural layer, and the cleaning effect of the MEMS device can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of MEMS devices, and in particular to a method for preparing a MEMS device and a preparation device thereof. Background Art

[0002] MEMS (Micro-electromechanical Systems), also known as micro-electromechanical systems, is based on mechanical and electrical technologies, especially micro-mechanics, and uses microelectronics and micromachining technologies to design, manufacture, and test a series of micro-devices within micro-nano and micro-electromechanical systems. In the manufacturing process of MEMS devices, the cleanliness of the device surface has a significant impact on packaging reliability and product performance. That is, during the wafer production process or the wafer dicing and dicing after completing various upstream manufacturing processes, when the wafer is cut into individual devices, some small particles or residues may remain on the surface of the device or adhere to the protective adhesive on the surface of the device, affecting the product quality of the individual device in subsequent manufacturing. Plastic-encapsulated products may cause voids, MEMS products may destroy the suspended structure, and imaging products may be affected by particle movement, etc. Therefore, device cleaning plays a vital role in packaging reliability and product quality. Summary of the Invention

[0003] The present application provides a method for preparing a MEMS device, which comprises:

[0004] A MEMS component to be cleaned is provided, comprising an adhesive film layer and a plurality of MEMS devices adhered to the adhesive film layer; the MEMS device comprises a substrate layer and a structural layer, the substrate layer of the MEMS device facing away from the structural layer faces the adhesive film layer, and the structural layer of the MEMS device is provided with a protective film layer on a side facing away from the substrate layer;

[0005] The MEMS component to be cleaned is placed with the side where the adhesive film layer is located facing upward and the side where the protective film layer is located facing downward in a cleaning liquid to clean the MEMS device; wherein the liquid level of the cleaning liquid is below the adhesive film layer and above the surface of the structural layer away from the adhesive film layer.

[0006] In some embodiments, the liquid level of the cleaning liquid is located below the adhesive film layer and above the structural layer.

[0007] In some embodiments, providing a MEMS component to be cleaned including an adhesive film layer and a plurality of MEMS devices disposed on the adhesive film layer includes:

[0008] Providing a MEMS wafer, and disposing a protective film layer on a surface of the MEMS wafer; the protective film layer is located on a side of the structural layer away from the substrate layer;

[0009] Placing a MEMS wafer with a protective film layer on the surface thereof on the adhesive film layer; the adhesive film layer is located on the side of the substrate layer away from the structural layer;

[0010] The MEMS wafer and the protective film layer disposed on the adhesive film layer are cut into pieces to form the MEMS components to be cleaned.

[0011] In some embodiments, providing a MEMS component to be cleaned including an adhesive film layer and a plurality of MEMS devices disposed on the adhesive film layer includes:

[0012] A MEMS device is provided, wherein a bonding film layer and a plurality of surfaces are provided with protective film layers. The MEMS device comprises a substrate layer and a structural layer, and the protective film layer is located on a side of the structural layer away from the substrate layer.

[0013] A plurality of MEMS devices are arranged on the adhesive film layer; the adhesive film layer is located on a side of the substrate layer away from the structural layer.

[0014] In some embodiments, the structural layer includes a sacrificial layer. After the MEMS component to be cleaned is placed in a cleaning solution with the adhesive film layer facing upward and the protective film layer facing downward to clean the MEMS device, the method includes:

[0015] The plurality of MEMS devices are removed from the adhesive film layer and the sacrificial layer is removed.

[0016] In some embodiments, the cleaning solution is a mixed solution comprising acetone and alcohol, and the volume ratio of acetone to alcohol in the cleaning solution is 0.25 to 1; / or,

[0017] During the cleaning process, at least a portion of the protective film layer is removed by the cleaning liquid.

[0018] The present application further provides a MEMS device manufacturing apparatus, which is used in a cleaning process during the MEMS device manufacturing process. The MEMS device manufacturing apparatus comprises:

[0019] a cleaning structure having a cleaning liquid containing tank for containing cleaning liquid, wherein the cleaning liquid containing tank has a cleaning opening;

[0020] A support plate, the support plate having a support portion for arranging a MEMS component to be cleaned; the MEMS component to be cleaned comprises an adhesive film layer and a plurality of MEMS devices adhered to the adhesive film layer, the MEMS devices having a substrate layer and a structural layer, the substrate layer of the MEMS device facing away from the structural layer faces the adhesive film layer, and the structural layer of the MEMS device is provided with a protective film layer on a side facing away from the substrate layer; wherein the adhesive film layer of the component to be cleaned is provided on the support portion, and the protective film layer is located on a side facing away from the support portion;

[0021] The support plate can be arranged on the cleaning opening so that the side of the MEMS component to be cleaned where the adhesive film layer is located faces upward, and the side where the protective film layer is located extends downward into the cleaning liquid containing tank to be placed in the cleaning liquid for cleaning; wherein the liquid level of the cleaning liquid can be adjusted to be below the adhesive film layer and above the surface of the structural layer away from the adhesive film layer.

[0022] In some embodiments, the cleaning structure has a cleaning portion that forms the cleaning liquid containing tank and a plurality of leveling feet arranged on the cleaning portion, and the leveling feet are height-adjustable so that the liquid level of the cleaning liquid in the cleaning liquid containing tank is parallel to the plane where the surface of the cleaning opening facing the support plate is located.

[0023] In some embodiments, the cleaning structure has a cleaning portion forming the cleaning liquid containing groove, the cleaning portion is provided with a solution overflow groove connected to the cleaning liquid containing groove, and the height of the bottom of the solution overflow groove is lower than the height of the cleaning opening.

[0024] In some embodiments, the support portion has a component support area located in the middle and corresponding to each MEMS device in the MEMS component to be cleaned, and a fixing area located outside the component support area, and the component support area is an outwardly protruding structure relative to the fixing area.

[0025] In some embodiments, for a device having a solution overflow groove, the depth of the solution overflow groove is D, the thickness of the adhesive film layer is B, the thickness of the MEMS device is A, and the height H of the protrusion of the component support area satisfies the following conditions:

[0026] DBA<H<DB.

[0027] In some embodiments, the preparation device comprises:

[0028] a cleaning liquid height adjustment structure, comprising a liquid level adjustment groove in communication with the cleaning liquid containing groove, wherein the cleaning liquid level in the liquid level adjustment groove is adjustable so that the cleaning liquid level in the cleaning liquid containing groove can be adjusted along with the cleaning liquid level in the liquid level adjustment groove;

[0029] The cleaning liquid containing tank has a communication opening connected to the liquid level height adjustment tank. For a solution overflow tank, the height of the communication opening is lower than the height of the solution overflow tank.

[0030] In some embodiments, the cleaning fluid height adjustment structure includes:

[0031] The liquid level adjusting block is liftably arranged in the liquid level height adjusting tank. When the liquid level in the cleaning liquid containing tank needs to be raised, the height of the liquid level adjusting block is lowered, occupying part of the space in the liquid level height adjusting tank, so that the liquid level in the liquid level height adjusting tank is raised, and the liquid level in the cleaning liquid containing tank is raised. When the liquid level in the cleaning liquid containing tank needs to be lowered, the height of the liquid level adjusting block is raised, releasing part of the space in the liquid level height adjusting tank, so that the liquid level in the liquid level height adjusting tank is lowered, and the liquid level in the cleaning liquid containing tank is lowered.

[0032] In some embodiments, the cleaning fluid height adjustment structure includes:

[0033] An adjustment support frame provided on the liquid level adjustment tank, wherein the adjustment support frame is provided with a threaded hole;

[0034] A threaded rod is arranged in the threaded hole and can cooperate with the threaded hole. During the rotation of the threaded rod, the threaded rod can rise or fall, and the liquid level regulating block is arranged at the lower end of the threaded rod.

[0035] The preparation method and preparation device of the above-mentioned MEMS device provided in the embodiment of the present application are configured to clean the MEMS device by placing the side of the MEMS component to be cleaned where the adhesive film layer is located upward and the side of the structural layer of the MEMS device facing away from the substrate layer downward in a cleaning liquid; wherein the liquid level of the cleaning liquid is located below the adhesive film layer and above the surface of the structural layer away from the adhesive film layer, which is beneficial to ensure that the adhesive film layer is not cleaned, avoid foreign particles from falling back into the MEMS device, especially entering the structural layer and causing adverse effects on the MEMS device, thereby improving the cleaning effect of the MEMS device.

[0036] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following briefly introduces the drawings required for use in the embodiments or related technical descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0038] Figure 1 A flow chart of a method for manufacturing a MEMS device according to an embodiment of the present application;

[0039] Figures 2 to 7 A schematic structural diagram corresponding to different manufacturing process stages of a method for manufacturing a MEMS device provided in one embodiment of the present application;

[0040] Figures 8 to 10 A schematic diagram of a cleaning process in a method for preparing a MEMS device according to an embodiment of the present application;

[0041] Figure 11 A schematic diagram of the three-dimensional structure of a MEMS device manufacturing apparatus provided in one embodiment of the present application;

[0042] Figure 12 An exploded view of a MEMS device manufacturing apparatus provided in one embodiment of the present application;

[0043] Figure 13 A schematic structural diagram of a support plate of a MEMS device manufacturing apparatus provided in one embodiment of the present application from one perspective;

[0044] Figure 14 A schematic cross-sectional view of a device for preparing a MEMS device according to an embodiment of the present application;

[0045] Figure 15 A cross-sectional view of a portion of the structure of another MEMS device manufacturing apparatus provided in one embodiment of the present application;

[0046] Figure 16 This is an auxiliary view of a partial structure of another MEMS device manufacturing device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0047] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

[0048] In the manufacturing process of MEMS devices, many complex three-dimensional or supporting structures are filled with sacrificial layers. Before cutting and dicing, the sacrificial layer is often sticky and may embed some small particles. When the release process is performed to remove the sacrificial layer, the surface particles will fall vertically due to the influence of gravity. At this time, the MEMS device has formed a three-dimensional structure and cannot withstand liquid cleaning. If a solution that does not react with the sacrificial layer is used for cleaning before the release process, the particles cannot be removed due to the embedded particles in the sacrificial layer. If a solution that reacts with the sacrificial layer is used for cleaning before the release process, it is very difficult to control the consumption rate of the sacrificial layer. Therefore, during the wafer manufacturing process, a protective glue is spin-coated on the surface, and the protective glue and the particles embedded in the protective glue are removed after the wafer is cut into individual devices. However, for such surfaces with protective glue, some small particles or residues produced after cutting will remain on the surface of the device or adhere to the protective glue on the surface of the device.

[0049] After the MEMS device wafer is cut into individual pieces, it needs to be cleaned and picked up repeatedly. During the picking process, the device circuit and MEMS structure are easily damaged, or electrostatic breakdown is caused. If it is not cleaned, the particles generated by dicing will affect the packaging reliability and product quality.

[0050] Wafers are diced after UV film application, and then sorted and sorted after being cut into individual wafers. Therefore, cleaning after dicing and before sorting is the optimal operation point. However, the UV film has a layer of adhesive on the surface, and the dicing protective adhesive is usually photoresist, which requires acetone solution to remove. UV film also reacts with acetone, making production impossible due to several restrictions.

[0051] To this end, the application provides a preparation method of a MEMS device and a preparation device thereof. The preparation method of the MEMS device comprises the following steps: providing a to-be-cleaned MEMS assembly comprising a bonding film layer and a plurality of MEMS devices adhered to the bonding film layer; the MEMS device has a substrate layer and a structure layer, a side of the substrate layer of the MEMS device away from the structure layer faces the bonding film layer, and a side of the structure layer of the MEMS device away from the substrate layer is provided with a protective film layer; placing the to-be-cleaned MEMS assembly with the side where the bonding film layer is located upward and the side where the protective film layer is located downward in a cleaning liquid to clean the MEMS device; wherein a liquid surface of the cleaning liquid is located below the bonding film layer and above a surface of the structure layer away from the bonding film layer. The preparation method of the MEMS device places the to-be-cleaned MEMS assembly with the side where the bonding film layer is located upward and the side of the structure layer of the MEMS device away from the substrate layer downward in the cleaning liquid to clean the MEMS device; wherein the liquid surface of the cleaning liquid is located below the bonding film layer and above the surface of the structure layer away from the bonding film layer, which is conducive to ensuring that the bonding film layer is not cleaned and avoiding the foreign particles from falling into the MEMS device, especially into the structure layer, to cause adverse effects on the MEMS device, thereby improving the cleaning effect of the MEMS device.

[0052] The application will be described in detail below with reference to the accompanying drawings. Figures 1 to 16 The application provides a preparation method of a MEMS device and a preparation device thereof.

[0053] Please refer to Figure 1 , and if necessary, in combination with Figures 2 to 11 , the application provides a preparation method of a MEMS device, which comprises the following steps S101 and S103:

[0054] In step S101, a to-be-cleaned MEMS assembly comprising a bonding film layer and a plurality of MEMS devices adhered to the bonding film layer is provided; the MEMS device has a substrate layer and a structure layer, a side of the substrate layer of the MEMS device away from the structure layer faces the bonding film layer, and a side of the structure layer of the MEMS device away from the substrate layer is provided with a protective film layer.

[0055] In step S103, the to-be-cleaned MEMS assembly with the side where the bonding film layer is located upward and the side where the protective film layer is located downward is placed in a cleaning liquid to clean the MEMS device; wherein a liquid surface of the cleaning liquid is located below the bonding film layer and above a surface of the structure layer away from the bonding film layer.

[0056] As Figure 5As shown, in step S101, a MEMS component to be cleaned is provided, comprising an adhesive film layer 300 and a plurality of MEMS devices 1 bonded to the adhesive film layer 300. The MEMS devices 1 have a substrate layer 10 and a structural layer 20. The side of the substrate layer 10 of the MEMS devices 1 facing away from the structural layer 20 faces the adhesive film layer 300, and the side of the structural layer 20 of the MEMS devices 1 facing away from the substrate layer 10 is provided with a protective film layer 200.

[0057] It should be noted that the substrate layer 10 can be a substrate structural layer formed of a silicon-based material. In some embodiments, no other film layers are provided on the side of the substrate layer 10 of the MEMS device facing away from the structural layer 20. Accordingly, the adhesive film layer 300 is directly adhered to the surface of the substrate layer 10 facing away from the structural layer 20. In other embodiments, an external metal layer or other material layer may be provided on the side of the substrate layer of the MEMS device facing away from the structural layer. Accordingly, the adhesive film layer 300 is adhered to the surface of the corresponding external metal layer or other material layer facing away from the structural layer.

[0058] The structure layer 20 may include a MEMS device layer and a readout circuit layer, or may only include a MEMS device layer.

[0059] The protective film layer can be a material layer such as a PI layer that can protect the structural layer 20 during cutting.

[0060] The adhesive film layer 300 here may be a cutting film or an adhesive film including a photosensitive adhesive (UV material).

[0061] like Figures 2 to 5 as well as Figure 7 As shown, in some embodiments, step S101 provides a MEMS component to be cleaned including an adhesive film layer 300 and a plurality of MEMS devices 1 disposed on the adhesive film layer 300, and may include the following steps S1011 to S1013:

[0062] like Figure 2 and Figure 3 As shown, in step S1011, a MEMS wafer 100 is provided, and a protective film layer 200 is provided on the surface of the MEMS wafer; the protective film layer 200 is located on the side of the structural layer 20 away from the substrate layer 10;

[0063] like Figure 4 As shown, in step S1012, the MEMS wafer with the protective film layer 200 on the surface is placed on the adhesive film layer 300; the adhesive film layer 300 is located on the side of the substrate layer 10 away from the structural layer 20;

[0064] like Figure 5As shown, in step S1013, the MEMS wafer and the protective film layer provided on the adhesive film layer are cut to form the MEMS components to be cleaned.

[0065] The MEMS wafer has a plurality of arrayed MEMS device units 101 and a cutting area 102 between every two adjacent MEMS device units 101. In step S1013, the MEMS wafer is cut along the cutting area 102 to form a plurality of MEMS devices 1 corresponding to each MEMS device unit 101.

[0066] It is understandable that the structural layer of the cutting area 102 does not actually provide the corresponding structure and sacrificial area of ​​the MEMS device, but is a material layer formed during the process of making the MEMS device.

[0067] It should be noted that the protective film layer 200 provided on the surface of the MEMS wafer is actually a continuous whole protective film layer. After being cut in step S1013, each MEMS device is attached with a corresponding portion of the cut protective film layer. Figure 7 As shown, after step S1011, a wafer assembly 1001 with a protective film layer 200 on its surface can be formed. In step S1012, the wafer assembly 1001 can be fixed to the adhesive film layer 300 by the carrying and fixing ring 400 so that it can be fixed on the cutting table 800 for cutting. It can be understood that in step S1013, when the MEMS wafer and the protective film layer provided on the adhesive film layer are cut, the adhesive film layer 300 is not actually cut. After step S1013, the adhesive film layer 300 is still a whole continuous film layer to adhere to each MEMS device 1. Therefore, after cutting, the adhesive film layer 300, each MEMS device 1 and the carrying and fixing ring 400 can be moved to the cleaning device as a whole as the MEMS assembly to be cleaned for cleaning.

[0068] In other embodiments, providing a MEMS component to be cleaned, including an adhesive film layer 300 and a plurality of MEMS devices 1 disposed on the adhesive film layer 300, includes the following steps S1014 and S1015:

[0069] In step S1014, a MEMS device 1 having a bonding film layer 300 and multiple surfaces provided with protective film layers is provided; the MEMS device 1 has a substrate layer 10 and a structural layer 20, and the protective film layer 200 is located on a side of the structural layer 20 away from the substrate layer 10;

[0070] In step S1015 , a plurality of MEMS devices 1 are disposed on the adhesive film layer 300 ; the adhesive film layer 300 is located on a side of the substrate layer 10 away from the structural layer 20 .

[0071] In this embodiment, after similar steps S1011 to S1013 , the MEMS devices formed by dicing can be removed from the adhesive film layer, tested, and qualified MEMS devices can be attached to a new adhesive film layer 300 to form corresponding MEMS components to be cleaned.

[0072] It is understandable that the MEMS devices formed by dicing can be tested after being removed from the adhesive film layer to screen out qualified MEMS devices, and then the qualified MEMS devices can be attached to a new adhesive film layer 300 .

[0073] like Figure 6 As shown, in step S103, the MEMS component to be cleaned is placed with the adhesive film layer 300 facing upward and the structural layer 20 of the MEMS device 1 facing away from the substrate layer 10 facing downward in a cleaning solution 600 to clean the MEMS device 1. The cleaning solution 600 has a liquid level 601 below the adhesive film layer 300 and above the surface of the structural layer 20 away from the adhesive film layer 300. In other words, the cleaning solution 600 has a liquid level 601 that is sufficient to submerge at least a portion of the structural layer 20 of each MEMS device in the thickness direction of the MEMS device 1. This arrangement allows the cleaning of foreign particles 104, such as silicon slag and metal debris, generated by cutting, on the surface of the structural layer 20 and the protective film layer 200 without cleaning the adhesive film layer 300. During cleaning, the adhesive film layer 300 to which the MEMS device is bonded will not be adversely affected, causing the MEMS device to fall off. After cleaning, the foreign particles 104 can fall into the cleaning liquid 600 from the side of the structural layer 20 of the MEMS device away from the substrate layer 10. Compared with placing individual MEMS device particles into the cleaning liquid, this is beneficial to preventing the foreign particles 104 from falling back into the MEMS device, especially entering the structural layer and causing adverse effects on the MEMS device, and can greatly improve the cleaning effect.

[0074] Preferably, the liquid level 601 of the cleaning liquid 600 is located below the adhesive film layer 300 and above the structural layer 20 , so that the height of the liquid level 601 can be better controlled on the basis of being able to well identify the structural layer 20 .

[0075] Please combine Figures 8 to 10As shown, in some embodiments, while cleaning away the foreign particles 104, the protective film layer 200 can also be cleaned simultaneously, so that the foreign particles 104 such as silicon slag and metal debris generated by cutting can be cleaned while removing the protective film layer 200, which is conducive to simplifying the preparation process.

[0076] Of course, in some other embodiments, a portion of the protective film layer 200 may be cleaned away, and the remaining protective film layer may be removed later.

[0077] In some embodiments, the structural layer 20 includes a sacrificial layer (not shown). After the side of the MEMS component to be cleaned where the adhesive film layer is located faces upward and the side of the structural layer 20 of the MEMS device 1 facing away from the substrate layer 10 faces downward in a cleaning solution to clean the MEMS device 1 in step S103, the method includes:

[0078] The plurality of MEMS devices 1 are removed from the adhesive film layer 300 and the sacrificial layer is removed.

[0079] It should be noted that when removing the sacrificial layer, the side of the substrate layer 10 of each MEMS device 1 facing away from the structural layer 20 needs to face downward, and the side of the structural layer 20 facing away from the substrate layer 10 needs to face upward.

[0080] The MEMS device 1 can be cleaned of foreign particles 104 such as silicon slag and metal debris generated by cutting after the cutting process. This prevents foreign particles from falling back into the MEMS device 1 during the sacrificial layer removal step, thereby preventing adverse effects such as short circuits on the MEMS device 1 caused by foreign particles falling back into the MEMS device 1. It can be seen that the method for preparing a MEMS device provided in this application ensures that foreign particles 104 are cleaned and helps improve the product quality of the MEMS device 1.

[0081] In some embodiments, the cleaning solution is acetone cleaning solution. Accordingly, after cleaning, the cleaned MEMS device needs to be dried (eg, spin-dried).

[0082] To reduce damage to MEMS devices during drying processes such as spin drying, this application also provides a cleaning solution mixed with alcohol. For example, in some preferred embodiments, the cleaning solution can be a mixed solution including acetone and alcohol, with a volume ratio of acetone to alcohol of 0.25 to 1. This solution evaporates automatically after cleaning without requiring further treatment, achieving higher cleaning efficiency and quality than conventional processes.

[0083] The present application further provides a MEMS device fabrication apparatus, which can be used in a cleaning process during MEMS device fabrication, such as cleaning the MEMS component described above, and includes a cleaning structure and a support plate.

[0084] The cleaning structure has a cleaning liquid containing tank for containing cleaning liquid, and the cleaning liquid containing tank has a cleaning opening;

[0085] The support plate has a support portion for arranging a MEMS component to be cleaned; the MEMS component to be cleaned includes an adhesive film layer and a plurality of MEMS devices adhered to the adhesive film layer, the MEMS device having a substrate layer and a structural layer, the substrate layer of the MEMS device facing away from the structural layer faces the adhesive film layer, and the structural layer of the MEMS device is provided with a protective film layer on a side facing away from the substrate layer; wherein the adhesive film layer of the component to be cleaned is provided on the support portion, and the protective film layer is located on a side facing away from the support portion;

[0086] The support plate can be arranged on the cleaning opening so that the side of the MEMS component to be cleaned where the adhesive film layer is located faces upward, and the side where the protective film layer is located extends downward into the cleaning liquid containing tank to be placed in the cleaning liquid for cleaning; wherein the liquid level of the cleaning liquid can be adjusted to be below the adhesive film layer and above the surface of the structural layer away from the adhesive film layer.

[0087] Please refer to Figure 11 , and when necessary, combine Figures 12 to 16 as well as Figures 2 to 10 Referring to the corresponding figures in FIG, in some embodiments, the preparation device 700 includes a cleaning structure 71 and a support plate 73.

[0088] The cleaning structure 71 has a cleaning liquid containing tank 701 for containing the cleaning liquid 600 . The cleaning liquid containing tank 701 has a cleaning opening 7011 .

[0089] The support plate 73 has a support portion 730 for arranging a MEMS component to be cleaned; the MEMS component to be cleaned includes an adhesive film layer 300 and a plurality of MEMS devices 1 adhered to the adhesive film layer 300, the MEMS device 1 having a substrate layer 10 and a structural layer 20, a side S21 of the substrate layer 10 of the MEMS device 1 facing away from the structural layer 20 faces the adhesive film layer 300, and a protective film layer 200 is provided on a side of the structural layer 20 of the MEMS device 1 facing away from the substrate layer 10; wherein the adhesive film layer 300 of the component to be cleaned is provided on the support portion 730, and the protective film layer 200 is located on a side facing away from the support portion 730;

[0090] The support plate 73 can be arranged on the cleaning opening 7011, so that the side of the adhesive film layer in the MEMS component to be cleaned is facing upward, and the side of the structural layer 20 of the MEMS device 1 facing away from the substrate layer 10 extends downward into the cleaning liquid containing groove 701 to be placed in the cleaning liquid 600 for cleaning; wherein, the liquid level of the cleaning liquid 600 can be adjusted to be below the adhesive film layer and above the surface of the structural layer 20 away from the adhesive film layer 300.

[0091] In some embodiments, the cleaning structure 71 includes a cleaning portion 711 forming the cleaning liquid receiving tank 701 and a leveling component 712 disposed on the cleaning portion 711 to level the cleaning portion 711 .

[0092] Combine Figure 12 and Figure 14 As shown, the leveling assembly includes a plurality of leveling legs 7120. The leveling legs 7120 are height-adjustable so that the liquid level in the cleaning liquid reservoir 701 is parallel to the plane of the surface of the cleaning opening 7011 facing the support plate 73. This ensures that when the component to be cleaned is cleaned, the areas where the MEMS devices are located in the component to be cleaned are immersed in the cleaning liquid to the same depth, thereby ensuring a cleaning effect.

[0093] The plurality of leveling legs 7120 are connected to the periphery of the cleaning portion 711 at intervals and extend out of the cleaning portion 711 toward a side away from the cleaning opening 7011 .

[0094] Combined with 15 and Figure 16 As shown, in some embodiments, the cleaning structure 71 has a cleaning portion 711 that forms the cleaning liquid accommodating groove 701, and the cleaning portion 711 is provided with a solution overflow groove 702 that is connected to the cleaning liquid accommodating groove 701, and the height of the bottom of the solution overflow groove 702 is lower than the height of the cleaning opening 7011, so that the liquid level of the cleaning liquid in the cleaning liquid accommodating groove 701 is lower than the cleaning opening 7011.

[0095] In some embodiments, the support portion 730 has a component support area 731 located in the middle and corresponding to each MEMS device in the MEMS component to be cleaned, and a fixing area 732 located outside the component support area 731 , and the component support area 731 is an outward protruding structure relative to the fixing area 732 .

[0096] Combine Figure 5 、 Figure 12 and Figure 13As shown, if the preparation device of the MEMS device is used for cleaning the above-mentioned MEMS component, the MEMS component can be arranged on the support part 730, wherein the side of the adhesive film layer 300 located away from each MEMS device 1 is fixed to the component support area 731, and the support fixing ring 400 can be fixed to the fixing area 732 together with the corresponding adhesive film layer 300.

[0097] In some embodiments, for a device having a solution overflow groove 702 , during a cleaning operation, the liquid level of the cleaning liquid in the cleaning liquid holding groove 701 is generally flush with the bottom of the solution overflow groove 702 . The depth of the solution overflow groove 702 is D, the thickness of the adhesive film layer 300 is B, the thickness of the MEMS device 1 is A, and the height H of the protrusion of the component support area 731 satisfies the following conditions:

[0098] DBA<H<DB.

[0099] In some embodiments, the preparation device 700 may include a cleaning liquid height adjustment structure 72 .

[0100] The cleaning liquid height adjustment structure 72 includes a liquid level adjustment groove 721 connected to the cleaning liquid storage groove 701. The liquid level of the cleaning liquid in the liquid level adjustment groove 721 is adjustable, so that the liquid level of the cleaning liquid in the cleaning liquid storage groove 701 can be adjusted along with the liquid level of the cleaning liquid in the liquid level adjustment groove 721.

[0101] The cleaning liquid containing tank 701 has a connecting opening 703 connected to the liquid level height adjustment tank 721. For a solution overflow tank 702, the height of the connecting opening 703 is lower than the height of the solution overflow tank 702, so as to prevent the cleaning liquid from overflowing from the solution overflow tank 702 while adjusting the liquid level of the cleaning liquid in the cleaning liquid containing tank 701.

[0102] Combine Figure 14 As shown, the cleaning liquid height adjustment structure 72 is provided with a communication channel 704 for connecting the liquid level adjustment groove 721 and the communication opening 703 of the cleaning liquid containing groove 701 .

[0103] In some embodiments, the cleaning liquid height adjusting structure 72 further comprises a liquid level adjusting block 722, which is arranged in the liquid level height adjusting groove 721 in a liftable manner. When the liquid level in the cleaning liquid accommodating groove 701 needs to be raised, the height of the liquid level adjusting block 722 is lowered, occupying part of the space in the liquid level height adjusting groove 721, so that the liquid level in the liquid level height adjusting groove 721 is raised, and the liquid level in the cleaning liquid accommodating groove 701 is raised. When the liquid level in the cleaning liquid accommodating groove 701 needs to be lowered, the height of the liquid level adjusting block 722 is raised, releasing part of the space in the liquid level height adjusting groove 721, so that the liquid level in the liquid level height adjusting groove 721 is lowered, and the liquid level in the cleaning liquid accommodating groove 701 is lowered.

[0104] In some embodiments, the cleaning liquid height adjusting structure 72 comprises:

[0105] An adjusting support frame 723 is arranged on the liquid level height adjusting groove 721, and the adjusting support frame 723 is provided with a threaded hole;

[0106] A threaded rod 724 is arranged in the threaded hole and can cooperate with the threaded hole. During rotation of the threaded rod 724, the threaded rod 724 can be raised or lowered. The liquid level adjusting block 722 is arranged at the lower end of the threaded rod 724, so that the raising and lowering of the liquid level adjusting block 722 is realized by controlling the raising and lowering of the threaded rod 724.

[0107] In the present application, the structural embodiments and the method embodiments can be complementary to each other without conflict.

[0108] In the present application, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance. The terms "a plurality of", "several" refer to two or more, unless otherwise explicitly limited.

[0109] Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the application disclosed herein. It is intended that the present application cover any and all variations of the application that come within the scope of the claims and their equivalents. It is intended that the specification and examples be considered exemplary only, with the true scope and spirit of the application indicated by the following claims.

[0110] It should be understood that the present application is not limited to the precise construction that has been described above and shown in the accompanying drawings, and that various modifications and changes can be made by those skilled in the art without departing from the scope of the application. The scope of the application is indicated only by the appended claims.

Claims

1. A method for preparing a MEMS device, characterized in that: include: Providing a MEMS component to be cleaned, comprising an adhesive film layer and a plurality of MEMS devices adhered to the adhesive film layer; The MEMS device comprises a substrate layer and a structural layer, wherein a side of the substrate layer of the MEMS device facing away from the structural layer faces the adhesive film layer, and a side of the structural layer of the MEMS device facing away from the substrate layer is provided with a protective film layer; The MEMS component to be cleaned is placed with the side where the adhesive film layer is located facing upward and the side where the protective film layer is located facing downward in a cleaning liquid to clean the MEMS device; wherein the liquid level of the cleaning liquid is below the adhesive film layer and above the surface of the structural layer away from the adhesive film layer.

2. The method for preparing a MEMS device according to claim 1, wherein: The liquid level of the cleaning liquid is located below the adhesive film layer and above the structural layer.

3. The method for preparing a MEMS device according to claim 1, wherein: The method of providing a MEMS component to be cleaned, comprising an adhesive film layer and a plurality of MEMS devices disposed on the adhesive film layer, comprises: Providing a MEMS wafer, and setting a protective film layer on the surface of the MEMS wafer; the MEMS wafer has a substrate layer and a structural layer, and the protective film layer is located on a side of the structural layer away from the substrate layer; Placing a MEMS wafer with a protective film layer on the surface thereof on the adhesive film layer; the adhesive film layer is located on the side of the substrate layer away from the structural layer; The MEMS wafer and the protective film layer disposed on the adhesive film layer are cut into pieces to form the MEMS components to be cleaned.

4. The method for preparing a MEMS device according to claim 1, wherein: The method of providing a MEMS component to be cleaned, comprising an adhesive film layer and a plurality of MEMS devices disposed on the adhesive film layer, comprises: A MEMS device is provided, wherein a bonding film layer and a plurality of surfaces are provided with protective film layers. The MEMS device comprises a substrate layer and a structural layer, and the protective film layer is located on a side of the structural layer away from the substrate layer. A plurality of MEMS devices are arranged on the adhesive film layer; the adhesive film layer is located on a side of the substrate layer away from the structural layer.

5. The method for preparing a MEMS device according to claim 1, wherein: The structural layer includes a sacrificial layer. After the MEMS component to be cleaned is placed in a cleaning solution with the side where the adhesive film layer is located facing upward and the side where the protective film layer is located facing downward to clean the MEMS device, the method includes: The plurality of MEMS devices are removed from the adhesive film layer and the sacrificial layer is removed.

6. The method for preparing a MEMS device according to claim 1, wherein: The cleaning solution is a mixed solution comprising acetone and alcohol, wherein the volume ratio of acetone to alcohol in the cleaning solution is 0.25 to 1; / or, During the cleaning process, at least a portion of the protective film layer is removed by the cleaning liquid.

7. A device for preparing a MEMS device, characterized in that: The preparation device is used for a cleaning process in the preparation process of the MEMS device, and the preparation device comprises: a cleaning structure having a cleaning liquid containing tank for containing cleaning liquid, wherein the cleaning liquid containing tank has a cleaning opening; A support plate, the support plate having a support portion for arranging a MEMS component to be cleaned; the MEMS component to be cleaned comprises an adhesive film layer and a plurality of MEMS devices adhered to the adhesive film layer, the MEMS devices having a substrate layer and a structural layer, the substrate layer of the MEMS device facing away from the structural layer faces the adhesive film layer, and the structural layer of the MEMS device is provided with a protective film layer on a side facing away from the substrate layer; wherein the adhesive film layer of the component to be cleaned is provided on the support portion, and the protective film layer is located on a side facing away from the support portion; The support plate can be arranged on the cleaning opening so that the side of the MEMS component to be cleaned where the adhesive film layer is located faces upward, and the side where the protective film layer is located extends downward into the cleaning liquid containing tank to be placed in the cleaning liquid for cleaning; wherein the liquid level of the cleaning liquid can be adjusted to be below the adhesive film layer and above the surface of the structural layer away from the adhesive film layer.

8. The MEMS device manufacturing apparatus according to claim 7, characterized in that: The cleaning structure includes a cleaning portion forming the cleaning liquid containing tank and a plurality of leveling feet provided on the cleaning portion, wherein the leveling feet are height-adjustable so that the liquid level of the cleaning liquid in the cleaning liquid containing tank is parallel to the plane where the surface of the cleaning opening facing the support plate is located.

9. The MEMS device manufacturing apparatus according to claim 7, characterized in that: The cleaning structure includes a cleaning portion forming the cleaning liquid containing groove, the cleaning portion is provided with a solution overflow groove communicating with the cleaning liquid containing groove, and the bottom height of the solution overflow groove is lower than the height of the cleaning opening.

10. The device for preparing a MEMS device according to any one of claims 7 to 9, wherein: The supporting portion comprises a component supporting area located in the middle and corresponding to each MEMS device in the MEMS component to be cleaned, and a fixing area located at the periphery of the component supporting area. The component supporting area is an outwardly protruding structure relative to the fixing area.

11. The MEMS device manufacturing apparatus according to claim 10, wherein: For a device with a solution overflow groove, the depth of the solution overflow groove is D, the thickness of the adhesive film layer is B, the thickness of the MEMS device is A, and the height H of the protrusion of the component support area meets the following conditions: DBA<H<DB.

12. The device for preparing a MEMS device according to any one of claims 7 to 9, wherein: The preparation device comprises: a cleaning liquid height adjustment structure, comprising a liquid level adjustment groove in communication with the cleaning liquid containing groove, wherein the cleaning liquid level in the liquid level adjustment groove is adjustable so that the cleaning liquid level in the cleaning liquid containing groove can be adjusted along with the cleaning liquid level in the liquid level adjustment groove; The cleaning liquid containing tank has a communication opening connected to the liquid level height adjustment tank. For a solution overflow tank, the height of the communication opening is lower than the height of the solution overflow tank.

13. The MEMS device manufacturing apparatus according to claim 12, wherein: The cleaning liquid height adjustment structure further includes: The liquid level adjusting block is liftably arranged in the liquid level height adjusting tank. When the liquid level in the cleaning liquid containing tank needs to be raised, the height of the liquid level adjusting block is lowered, occupying part of the space in the liquid level height adjusting tank, so that the liquid level in the liquid level height adjusting tank is raised, and the liquid level in the cleaning liquid containing tank is raised. When the liquid level in the cleaning liquid containing tank needs to be lowered, the height of the liquid level adjusting block is raised, releasing part of the space in the liquid level height adjusting tank, so that the liquid level in the liquid level height adjusting tank is lowered, and the liquid level in the cleaning liquid containing tank is lowered.

14. The MEMS device manufacturing apparatus according to claim 13, wherein: The cleaning liquid height adjustment structure includes: An adjustment support frame provided on the liquid level adjustment tank, wherein the adjustment support frame is provided with a threaded hole; A threaded rod is arranged in the threaded hole and can cooperate with the threaded hole. During the rotation of the threaded rod, the threaded rod can rise or fall, and the liquid level regulating block is arranged at the lower end of the threaded rod.

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