A surface self-cleaning spray dish automatic spraying device

Abstract

The application discloses a kind of surface self-cleaning spray disc automation spraying device, the present application relates to the technical field of injection device, the spraying device includes box, general control module, heating module, handling mechanical arm, coating mechanism, rotating mechanism and chuck, cabinet door and rotating hole are equipped on the box, coating mechanism includes three-axis displacement module and cleaning mechanism, rotating mechanism includes bottom column and driving motor, cabinet door is equipped with two groups, general control module, heating module, handling mechanical arm, three-axis displacement module, base, driving motor are all fixedly connected with the box, chuck is fixedly connected with handling mechanical arm, bottom column is rotatably connected with rotating hole, heating module, handling mechanical arm, coating mechanism, driving motor are all connected with general control module by electric signal;The application automatically coats glue and develops wafer, and millisecond level is covered by developing solution, avoids line width deviation and large droplet impact wafer to destroy pattern, avoids developing spot and comet tail defect, improves wafer manufacturing precision.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of spraying devices, and particularly relates to a surface self-cleaning spraying disc automatic spraying device. BACKGROUND

[0002] In the field of semiconductor manufacturing, as an important branch of thin film deposition technology, the spraying process forms a functional thin film with uniform thickness and controllable composition on the surface of a silicon wafer or other substrate by precisely regulating the fluid mechanics parameters and thermodynamic conditions. The process stability directly affects the electrical performance and reliability of semiconductor devices. As the core executive component of the spraying process, the spraying disc realizes the laminar flow distribution and quantitative delivery of liquid or gaseous chemicals through precise flow channel design and nozzle array layout, and the uniformity and controllability parameters are directly related to the size accuracy and manufacturing yield of the lithography pattern.

[0003] With the continuous miniaturization of semiconductor feature sizes, higher requirements are put forward for the resolution and overlay accuracy of the lithography process. In the developing spraying process, the difference between the edge and center developing rates caused by the fluid boundary layer effect on the wafer surface leads to the uniformity deviation of the critical dimension; the kinetic energy generated by the impact of large droplets destroys the photoresist pattern structure, and residual droplets or uneven atomization form developing defects. These factors jointly restrict the transfer accuracy of the photoresist pattern and become the key bottleneck affecting the performance and production yield of semiconductor devices. SUMMARY

[0004] The present application aims to provide a surface self-cleaning spraying disc automatic spraying device to solve the problems in the prior art.

[0005] To achieve the above-mentioned purpose, the present application provides the following technical scheme: a surface self-cleaning spraying disc automatic spraying device comprises a box body, a general control module, a heating module, a carrying mechanical arm, a coating and developing mechanism, a rotating mechanism and a clamping chuck, the box body is provided with a cabinet door and a rotating hole, the coating and developing mechanism comprises a three-axis displacement module and a cleaning mechanism, the cleaning mechanism comprises a base, the rotating mechanism comprises a bottom column and a driving motor, the cabinet door is provided with two groups, the general control module, the heating module, the carrying mechanical arm, the three-axis displacement module, the base and the driving motor are fixedly connected with the box body, the clamping chuck is fixedly connected with the carrying mechanical arm, the bottom column is rotatably connected with the rotating hole, and the heating module, the carrying mechanical arm, the coating and developing mechanism and the driving motor are connected with the general control module through electrical signals.

[0006] The application discloses an automatic device for semiconductor spin coating and developing, a carrying mechanical arm carries a semiconductor wafer to a rotating mechanism through a chuck, the rotating mechanism vacuum adsorbs the wafer, a driving motor outputs high-speed fixed-axis torque to drive the adsorbed wafer to rotate at high speed, a three-axis displacement module drives a coating and developing mechanism to displace above the wafer rotating at high speed, drops photoresist on the wafer rotating at high speed, spreads the photoresist uniformly on the whole wafer surface through centrifugal force, shakes off the excess material, forms a very uniform film, and then performs soft baking through a heating module; before developing process, a detection mechanism is used for self-detecting a spraying hole disc to ensure the hole passage property, the carrying mechanical arm displaces the wafer with completed photoresist to an external exposure station, then carries the wafer to the rotating mechanism again, the coating and developing mechanism covers the whole wafer with developing liquid within milliseconds, avoids line width deviation caused by developing rate difference between the edge and the center, after spraying and stopping, the wafer rotates at high speed to shake off the residual liquid, the heating module is heated again, and a cleaning mechanism is used for self-cleaning the spraying hole disc.

[0007] Further, the coating and developing mechanism further comprises a photoresist dropping nozzle and a spraying mechanism, the spraying mechanism comprises a shell and a flow guide mechanism, the shell is provided with a top hole, the flow guide mechanism comprises a spraying head rod, the photoresist dropping nozzle is fixedly connected with the three-axis displacement module, and the spraying head rod is fixedly connected with the three-axis displacement module and the top hole.

[0008] The three-axis displacement module drives the photoresist dropping nozzle to displace above the wafer rotating at high speed, drops photoresist on the wafer rotating at high speed, spreads the photoresist uniformly on the whole wafer surface through centrifugal force, shakes off the excess material, forms a very uniform film, the carrying mechanical arm carries the wafer with completed exposure process to the rotating mechanism, and the spraying mechanism covers the whole wafer with developing liquid within milliseconds.

[0009] Further, the spraying mechanism further comprises a spraying hole disc, an infrared probe and a backflow mechanism, the shell is further provided with a side hole, the flow guide mechanism further comprises a hinged frame and a fan blade, the backflow mechanism comprises a ring pipe and a liquid pipe, the spraying hole disc, the infrared probe and the hinged frame are fixedly connected with the shell, the liquid pipe is fixedly connected with the side hole, and the ring pipe is in contact with the fan blade.

[0010] When the developing liquid is sprayed to the wafer, the developing liquid needs to cover the whole wafer within milliseconds to avoid line width deviation caused by developing rate difference between the edge and the center, the spraying head rod sprays atomized developing liquid upward, the atomized developing liquid rebounds downward after impacting the fan blade upward, and uniformly covers the whole wafer surface through the spraying hole disc; in order to avoid line width deviation, the infrared probe feeds back an electric signal to the general control module through infrared identification of the distribution state of the atomized developing liquid when the atomized developing liquid is sprayed upward, the flow guide mechanism actively adjusts the inclination angle of the partition fan blade according to the feedback electric signal, so that the wafer outer diameter and the center are simultaneously covered by the atomized developing liquid, the nanometer channel of the spraying hole disc avoids that large droplets directly impact the wafer to damage the pattern, and avoids generating developing spot and comet tail defects.

[0011] Further, the flow guide mechanism further comprises servo motors and universal connecting rods, the servo motors, the fan blades and the universal connecting rods are provided in several groups, the several groups of servo motors, fan blades and universal connecting rods are evenly distributed along the annular array of the shell, the fan blades are provided with hinged buckles and inner arc grooves, the inner arc grooves are arranged on the side of the fan blades away from the top hole, the inner arc grooves are arranged in a tree shape along the surface of the fan blades, the hinged buckles are rotatably connected with the hinge frames, the servo motors are fixedly connected with the hinge frames, the hinged buckles are fixedly connected with the universal connecting rods and the output ends of the servo motors, and the three-axis displacement module, the glue dripping nozzle, the servo motors and the infrared probe are connected with the general control module through electrical signals.

[0012] The several groups of fan blades are evenly distributed along the annular array of the shell, that is, the adjacent several groups of fan blades in the same ring area form a virtual circular ring as a reflection partition, the atomized developing liquid sprayed upward by the spray rod is radiated from the spray rod as a starting point, according to fluid mechanics, the time for the atomized developing liquid to be sprayed from the spray rod to the fan blades is different, that is, there is a millisecond error in the conventional flow cover, which causes defects in the photoresist development, the distribution state of the atomized developing liquid when it is sprayed upward is identified by the infrared, the general control module calculates the angle adjustment feedback control signal of the fan blades according to fluid mechanics and feeds back the control signal to the servo motors, the servo motors output torque according to the control signal to drive the fan blades to rotate around the hinge frames to adjust the angle, the adjacent fan blades in the same ring area are synchronously adjusted through the transmission torque of the universal connecting rods, and the fan blades in different ring areas are adjusted to different inclination angles, so that the atomized developing liquid impacting different ring areas falls into the spray hole disc at the same time, and the developing liquid covers the entire wafer within milliseconds.

[0013] Further, the backflow mechanism further comprises a liquid pump, the liquid pipe is fixedly connected with the ring pipe and the liquid pump, and the ring pipe is provided with a side ring groove arranged on the side close to the fan blades.

[0014] The spray rod sprays the atomized developing liquid upward, the atomized developing liquid rebounds downward after impacting the fan blades, the excess developing liquid is gathered into the inner arc grooves arranged in a tree shape along the surface of the fan blades, under the action of the liquid pump, the excess developing liquid flows into the ring pipe through the inner arc grooves and the side ring grooves and is pumped away for recycling, so as to avoid that the developing liquid remains on the fan blades to form large droplets and directly falls to impact the wafer to damage the pattern, and to avoid the generation of developing spots.

[0015] Further, the cleaning mechanism further comprises an ultrasonic cleaning cylinder and a detection mechanism, the detection mechanism comprises a bottom table, and the ultrasonic cleaning cylinder and the bottom table are fixedly connected with the base.

[0016] Before the developing process, the spray hole disc is self-detected by the detection mechanism to ensure the flow through property of the hole on the spray hole disc, after the developing process, the spray hole disc is displaced into the ultrasonic cleaning cylinder by the three-axis displacement module to complete the self-cleaning of the spray hole disc.

[0017] Further, the detection mechanism further comprises a circular table and a micro humidity sensor, the circular table and the micro humidity sensor are fixedly connected with the base table, the base table is provided with a ring liquid groove, the ring liquid groove is arranged on the side of the base table away from the center of the circular table, and the micro humidity sensor is provided with a plurality of groups.

[0018] Before the developing process, the three-axis displacement module drives the spraying hole disc to be displaced above the circular table, the spraying hole disc is sprayed, the humidity change of the plurality of groups of micro humidity sensors arranged along the upper surface of the circular table is used to judge the flowability of the flow channel on the spraying hole disc according to the humidity change area, and the sprayed liquid is recycled through the ring liquid groove.

[0019] Further, the rotating mechanism further comprises an adsorption disc and a gear rod, the adsorption disc is provided with an adsorption hole, the adsorption hole is arranged at the center of the adsorption disc, the bottom column is provided with a ring gear groove, the gear rod is fixedly connected with the output end of the driving motor, and the gear rod is meshed with the gear surface of the ring gear groove.

[0020] The driving motor outputs a torque to the gear rod, the gear rod is meshed with the gear surface between the ring gear groove, the high-speed torque of the driving motor is transmitted to the bottom column, the external air pump is connected through the adsorption hole, the wafer is adsorbed in vacuum, and the adsorption disc drives the wafer to rotate at high speed.

[0021] Compared with the prior art, the beneficial effects of the present application are: the present application designs a flow guide mechanism, the spray rod sprays the atomized developing solution upward, the atomized developing solution rebounds downward after impacting the fan blade, uniformly covers the entire wafer surface through the spray hole disc, the distribution state of the atomized developing solution when sprayed upward is identified by infrared, the total control module calculates the angle adjustment feedback control signal of the fan blade to the servo motor according to fluid mechanics, the servo motor drives the fan blade to rotate around the hinge frame to adjust the angle according to the control signal output torque, the adjacent fan blades in the same ring area are synchronously adjusted through the universal connecting rod transmission torque, the fan blades in different ring areas are adjusted at different inclination angles, so that the atomized developing solution impacting different ring areas falls to the spray hole disc at the same time, ensuring that the developing solution covers the entire wafer within milliseconds; the present application designs a reflux mechanism, the spray rod sprays the atomized developing solution upward, the atomized developing solution rebounds downward after impacting the fan blade, the excess developing solution is gathered into the inner arc groove arranged in a tree shape along the fan blade surface, due to the surface tension of the liquid and the design of the fillet at the edge of the inner arc groove, the excess developing solution flows into the ring pipe under the action of the liquid pump along the inner arc groove and the side ring groove and is pumped away for recycling, avoiding the developing solution remaining on the fan blade to gather into large droplets and directly falling to impact the wafer to damage the pattern, avoiding the generation of developing spots; the present application automatically completes the wafer coating and developing process, ensures that the developing solution covers the entire wafer within milliseconds, avoids the line width deviation caused by the difference between the edge and the center developing rate, at the same time, avoids the direct impact of large droplets on the wafer to damage the pattern, avoids the generation of developing spots and comet tail defects, optimizes the wafer coating and developing process, and improves the wafer manufacturing precision. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall structure of the present application;

[0023] Figure 2 It is a schematic diagram of the coating and developing mechanism structure of the present application;

[0024] Figure 3 It is an isometric schematic diagram of the coating and developing mechanism of the present application;

[0025] Figure 4 It is a schematic diagram of the spraying mechanism structure of the present application;

[0026] Figure 5 It is a schematic diagram of the spraying mechanism structure of the present application; Figure 4

[0027] Figure 6 It is a schematic diagram of the flow guide mechanism structure of the present application;

[0028] Figure 7 It is a schematic diagram of the flow guide mechanism structure of the present application; Figure 6

[0029] Figure 8 Figure 3 ​​​a local C amplification schematic diagram of

[0030] Figure 9 for Figure 3 a local D amplification schematic diagram of

[0031] In the figure: 1, box; 11, cabinet door; 12, rotating hole; 2, general control module; 3, heating module; 4, carrying mechanical arm; 5, coating mechanism; 51, three-axis displacement module; 52, glue dripping nozzle; 53, spraying mechanism; 54, cleaning mechanism; 541, base; 542, ultrasonic cleaning cylinder; 543, detection mechanism; 544, bottom table; 5441, liquid ring groove; 545, circular table; 546, micro humidity sensor; 55, shell; 551, top hole; 552, side hole; 56, spraying hole disc; 57, infrared probe; 58, flow guide mechanism; 581, spray head rod; 582, hinged frame; 583, servo motor; 584, fan blade; 5841, hinged buckle; 5842, inner arc groove; 585, universal connecting rod; 59, backflow mechanism; 591, ring pipe; 5911, side ring groove; 592, liquid pipe; 593, liquid pumping pump; 6, rotating mechanism; 61, adsorption disc; 611, adsorption hole; 62, bottom column; 621, ring tooth groove; 63, driving motor; 64, gear rod; 7, clamping chuck. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0033] As Figure 1 , Figure 2 shown, the present application provides a technical scheme of a surface self-cleaning spraying disc automatic spraying device, which comprises a box 1, a general control module 2, a heating module 3, a carrying mechanical arm 4, a coating mechanism 5, a rotating mechanism 6 and a clamping chuck 7. The box 1 is provided with cabinet doors 11 and rotating holes 12. The coating mechanism 5 comprises a three-axis displacement module 51 and a cleaning mechanism 54. The cleaning mechanism 54 comprises a base 541. The rotating mechanism 6 comprises a bottom column 62 and a driving motor 63. The cabinet doors 11 are provided in two groups. The general control module 2, the heating module 3, the carrying mechanical arm 4, the three-axis displacement module 51, the base 541 and the driving motor 63 are fixedly connected with the box 1. The clamping chuck 7 is fixedly connected with the carrying mechanical arm 4. The bottom column 62 is rotationally connected with the rotating hole 12. The heating module 3, the carrying mechanical arm 4, the coating mechanism 5 and the driving motor 63 are connected with the general control module 2 through electrical signals.

[0034] This invention relates to an automated device for semiconductor spin coating and development. A robotic arm 4 transports semiconductor wafers via a chuck 7 to a rotating mechanism 6. The rotating mechanism 6 vacuum-adsorbs the wafers, and a drive motor 63 outputs high-speed fixed-axis torque to drive the adsorbed wafers to rotate at high speed. A three-axis displacement module 51 moves the coating and development mechanism 5 above the high-speed rotating wafer, dispensing photoresist onto it. Centrifugal force evenly spreads the photoresist across the entire wafer surface, removing excess material to form a very uniform thin film. Then, heating is applied... Before the development process, the spray nozzle plate 56 is self-inspected by the detection mechanism 543 to ensure the flowability of its channels. The transport robot arm 4 moves the coated wafer to the external exposure station and then transports the wafer to the rotation mechanism 6. The coating and development mechanism 5 covers the entire wafer with the developer in milliseconds to avoid linewidth deviation caused by the difference in development rate between the edge and the center. After the spraying is completed and stopped, the wafer is rotated at high speed to dry the residual solution. The heating module 3 heats it again and the cleaning mechanism 54 performs self-cleaning of the spray nozzle plate 56.

[0035] like Figure 3 As shown, the coating mechanism 5 also includes a dispensing nozzle 52 and a spraying mechanism 53. The spraying mechanism 53 includes a housing 55 and a flow guiding mechanism 58. The housing 55 is provided with a top hole 551. The flow guiding mechanism 58 includes a nozzle rod 581. The dispensing nozzle 52 is fixedly connected to the triaxial displacement module 51. The nozzle rod 581 is fixedly connected to the triaxial displacement module 51 and the top hole 551.

[0036] The three-axis displacement module 51 drives the dispensing nozzle 52 to move above the high-speed rotating wafer, dispensing photoresist onto the high-speed rotating wafer. Centrifugal force spreads the photoresist evenly across the entire wafer surface and removes excess material, forming a very uniform thin film. The transport robot arm 4 transports the wafer that has completed the exposure process to the rotating mechanism 6, and the spraying mechanism 53 covers the entire wafer with developer within milliseconds.

[0037] like Figure 4 As shown, the spray mechanism 53 also includes a spray orifice plate 56, an infrared probe 57, and a reflux mechanism 59. The housing 55 is also provided with a side hole 552. The flow guiding mechanism 58 also includes a hinge frame 582 and a fan blade 584. The reflux mechanism 59 includes a ring pipe 591 and a liquid pipe 592. The spray orifice plate 56, the infrared probe 57, and the hinge frame 582 are all fixedly connected to the housing 55. The liquid pipe 592 is fixedly connected to the side hole 552. The ring pipe 591 is in contact with the fan blade 584.

[0038] When the spray developer is sprayed to the wafer, it is necessary to ensure that the developer covers the entire wafer within milliseconds to avoid the line width deviation caused by the difference between the edge and the center of the wafer. The spray head rod 581 sprays the atomized developer upward, which rebounds downward after impacting the fan plate 584, and uniformly covers the entire wafer surface through the spray hole disc 56. In order to avoid line width deviation, the infrared probe 57 feeds back an electrical signal to the total control module 2 when the atomized developer is sprayed upward. The flow guide mechanism 58 actively adjusts the inclination angle of the partition fan plate 584 according to the feedback electrical signal, ensuring that the outer diameter and the center of the wafer are covered by the atomized developer at the same time. The nanoscale channels of the spray hole disc 56 avoid the direct impact of large droplets on the wafer, which can damage the pattern and cause developing spots and comet tail defects.

[0039] As shown in Figure 5 , Figure 6 The flow guide mechanism 58 also includes a servo motor 583 and a universal connecting rod 585. The servo motor 583, the fan plate 584, and the universal connecting rod 585 are provided in several groups, which are evenly distributed along the annular array of the shell 55. The fan plate 584 is provided with a hinged buckle 5841 and an inner arc groove 5842. The inner arc groove 5842 is located on the side of the fan plate 584 away from the top hole 551. The inner arc groove 5842 is arranged in a tree-like manner along the surface of the fan plate 584. The hinged buckle 5841 is connected with the hinged frame 582. The servo motor 583 is fixedly connected with the hinged frame 582. The hinged buckle 5841 is fixedly connected with the universal connecting rod 585 and the output end of the servo motor 583. The three-axis displacement module 51, the glue dripping nozzle 52, the servo motor 583, and the infrared probe 57 are connected with the total control module 2 through electrical signals.

[0040] The several groups of fan plates 584 are evenly distributed along the annular array of the shell 55, that is, the adjacent several groups of fan plates 584 in the same ring zone form a virtual circular ring as a reflection partition. The atomized developer sprayed upward by the spray head rod 581 is radiated from the spray head rod 581 as a starting point. According to fluid mechanics, the time of the atomized developer sprayed from the spray head rod 581 to the fan plate 584 is different, that is, there is a millisecond error in the conventional flow guide cover, which leads to defects in the development of photoresist. The total control module 2 calculates the angle adjustment of the fan plate 584 according to fluid mechanics and feeds back a control signal to the servo motor 583. The servo motor 583 drives the fan plate 584 to rotate around the hinged frame 582 to adjust the angle according to the control signal output torque. The adjacent fan plates 584 in the same ring zone are synchronously adjusted through the transmission torque of the universal connecting rod 585. The fan plates 584 in different displacement zones are adjusted to different inclination angles, so that the atomized developer impacting different ring zones falls to the spray hole disc 56 at the same time, ensuring that the developer covers the entire wafer within milliseconds.

[0041] AsFigure 7 As shown, the backflow mechanism 59 further comprises a liquid pumping pump 593, and the liquid pipe 592 is fixedly connected with the ring pipe 591 and the liquid pumping pump 593. The ring pipe 591 is provided with a side ring groove 5911, which is arranged on the ring pipe 591 and close to the side of the fan plate 584.

[0042] The nozzle rod 581 sprays the atomized developing liquid upward, which rebounds downward after impacting the fan plate 584. The excess developing liquid is gathered into the inner arc groove 5842 arranged in a tree shape along the surface of the fan plate 584. Due to the surface tension of the liquid and the round corner design of the edge of the inner arc groove 5842, the excess developing liquid flows into the ring pipe 591 along the inner arc groove 5842 and the side ring groove 5911 under the action of the liquid pumping pump 593 and is pumped away for recycling, so as to avoid the developing liquid remaining on the fan plate 584 to gather into large droplets and directly falling to impact the wafer and damage the pattern, and to avoid the generation of developing spots.

[0043] As shown in Figure 3 The cleaning mechanism 54 further comprises an ultrasonic cleaning cylinder 542 and a detection mechanism 543. The detection mechanism 543 comprises a bottom table 544, and the ultrasonic cleaning cylinder 542 and the bottom table 544 are fixedly connected with the base 541.

[0044] Before the developing process, the detection mechanism 543 is used to self-check the spray hole disc 56 to ensure the flow through property of the hole channel. After the developing process, the three-axis displacement module 51 drives the spray hole disc 56 to displace into the ultrasonic cleaning cylinder 542 to complete the self-cleaning of the spray hole disc 56.

[0045] As shown in Figure 8 The detection mechanism 543 further comprises a circular table 545 and a micro humidity sensor 546. The circular table 545 is fixedly connected with the bottom table 544 and the micro humidity sensor 546. The bottom table 544 is provided with a ring liquid groove 5441, which is arranged on the side away from the center of the bottom table 544. The micro humidity sensor 546 is provided with a plurality of groups, and the plurality of groups of micro humidity sensors 546 are arrayed and distributed along the upper surface of the circular table 545.

[0046] Before the developing process, the three-axis displacement module 51 drives the spray hole disc 56 to displace above the circular table 545, and the spray hole disc 56 is sprayed. The flow through property of the flow channel on the spray hole disc 56 is determined by the humidity change on the plurality of groups of micro humidity sensors 546 arrayed and distributed along the upper surface of the circular table 545, and the liquid sprayed is recycled through the ring liquid groove 5441.

[0047] As shown in Figure 9As shown, the rotating mechanism 6 further comprises an adsorption disc 61 and a gear rod 64, the adsorption disc 61 is provided with an adsorption hole 611, the adsorption hole 611 is arranged at the center of the adsorption disc 61, the bottom column 62 is provided with a ring gear groove 621, the gear rod 64 is fixedly connected with the output end of the driving motor 63, and the gear rod 64 is in meshing connection with the ring gear groove 621.

[0048] The driving motor 63 outputs a fixed shaft torque to the gear rod 64, the high-speed torque of the driving motor 63 is transmitted to the bottom column 62 through the meshing connection between the gear rod 64 and the ring gear groove 621, and the wafer is vacuum adsorbed through the connection of the adsorption hole 611 and an external air pump, and the adsorption disc 61 drives the wafer to rotate at a high speed.

[0049] The working principle of the present application is as follows: the handling mechanical arm 4 carries the semiconductor wafer through the chucking chuck 7, the rotating mechanism 6 vacuum adsorbs the wafer, the driving motor 63 outputs a high-speed fixed shaft torque to drive the adsorbed wafer to rotate at a high speed, the three-axis displacement module 51 drives the coating and developing mechanism 5 to displace above the wafer rotating at a high speed, drops the photoresist on the wafer rotating at a high speed, uniformly spreads the photoresist to the whole wafer surface through the centrifugal force, and shakes off the excess material to form a very uniform thin film, and then the wafer is baked soft through the heating module 3, before the developing process, the spraying hole disc 56 is self-checked through the detection mechanism 543 to ensure the flow through property of the hole channel thereon, the handling mechanical arm 4 displaces the wafer on which the photoresist is coated to an external exposure station, and then the wafer is carried to the rotating mechanism 6 again, the spray head rod 581 sprays the atomized developing liquid upward, the atomized developing liquid rebounds downward after impacting the fan blade plate 584 upward, uniformly covers the whole wafer surface through the spraying hole disc 56, the distribution state of the atomized developing liquid when sprayed upward is recognized through infrared, the servo motor 583 drives the fan blade plate 584 to rotate and adjust the angle according to the control signal outputted by the total control module 2 according to the calculation of fluid mechanics, the adjacent fan blade plates 584 located in the same ring area are synchronously adjusted through the universal connecting rod 585, the fan blade plates 584 located in different ring areas are adjusted at different inclination angles, the atomized developing liquid impacting different ring areas falls to the spraying hole disc 56 at the same time, the developing liquid is ensured to cover the whole wafer within milliseconds, after the spraying is stopped, the wafer rotates at a high speed to shake dry the residual liquid, the heating module 3 is heated again, and the spraying hole disc 56 is self-cleaned through the cleaning mechanism 54.

[0050] It will be apparent to those skilled in the art that the application is not limited to the details of the above-exemplified embodiments and that the present application can be implemented in other particular forms without departing from the spirit or essential characteristics of the present application. The embodiments should therefore be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the above description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. No reference signs in the claims should be considered as limiting the scope of the claims with respect to the figures of the patent document.

Claims

1. A surface self-cleaning spray-pod automated spray device, characterized by: The spraying device comprises a box (1), a general control module (2), a heating module (3), a carrying mechanical arm (4), a coating display mechanism (5), a rotating mechanism (6) and a clamping chuck (7), the box (1) is provided with a cabinet door (11) and a rotating hole (12), the coating display mechanism (5) comprises a three-axis displacement module (51) and a cleaning mechanism (54), the cleaning mechanism (54) comprises a base (541), the rotating mechanism (6) comprises a bottom column (62) and a driving motor (63), the cabinet door (11) is provided with two groups, the general control module (2), the heating module (3), the carrying mechanical arm (4), the three-axis displacement module (51), the base (541) and the driving motor (63) are fixedly connected with the box (1), the clamping chuck (7) is fixedly connected with the carrying mechanical arm (4), the bottom column (62) is rotatably connected with the rotating hole (12), the heating module (3), the carrying mechanical arm (4), the coating display mechanism (5) and the driving motor (63) are connected with the general control module (2) through electric signals; The coating display mechanism (5) further comprises a glue dropping nozzle (52) and a spraying mechanism (53), the spraying mechanism (53) comprises a shell (55) and a flow guide mechanism (58), the shell (55) is provided with a top hole (551), the flow guide mechanism (58) comprises a nozzle rod (581), the glue dropping nozzle (52) is fixedly connected with the three-axis displacement module (51), and the nozzle rod (581) is fixedly connected with the three-axis displacement module (51) and the top hole (551); The spraying mechanism (53) further comprises a spraying hole disc (56), an infrared probe (57) and a backflow mechanism (59), the shell (55) is further provided with a side hole (552), the flow guide mechanism (58) further comprises a hinged frame (582) and a fan blade (584), the backflow mechanism (59) comprises a ring pipe (591) and a liquid pipe (592), the spraying hole disc (56), the infrared probe (57) and the hinged frame (582) are fixedly connected with the shell (55), the liquid pipe (592) is fixedly connected with the side hole (552), and the ring pipe (591) is in contact with the fan blade (584). The flow guide mechanism (58) further comprises a servo motor (583) and a universal connecting rod (585), the servo motor (583), the fan blade (584) and the universal connecting rod (585) are provided with a plurality of groups, the plurality of groups of the servo motor (583), the fan blade (584) and the universal connecting rod (585) are uniformly distributed along the annular array of the shell (55), the fan blade (584) is provided with a hinged buckle (5841) and an inner arc groove (5842), the inner arc groove (5842) is arranged on the side of the fan blade (584) away from the top hole (551), the inner arc groove (5842) is arranged in a tree shape along the surface of the fan blade (584), the hinged buckle (5841) is rotatably connected with the hinged frame (582), the servo motor (583) is fixedly connected with the hinged frame (582), the hinged buckle (5841) is fixedly connected with the universal connecting rod (585) and the output end of the servo motor (583), the three-axis displacement module (51), the glue dripping nozzle (52), the servo motor (583) and the infrared probe (57) are connected with the general control module (2) through electrical signals; The rotating mechanism (6) further comprises an adsorption disc (61) and a gear rod (64), the adsorption disc (61) is provided with an adsorption hole (611), the adsorption hole (611) is arranged at the center of the adsorption disc (61), the bottom column (62) is provided with a ring gear groove (621), the gear rod (64) is fixedly connected with the output end of the driving motor (63), and the gear rod (64) is meshed with the tooth surface of the ring gear groove (621).

2. The automated spray device for a self-cleaning surface spray tray of claim 1, wherein: The backflow mechanism (59) further comprises a liquid pump (593), the liquid pipe (592) is fixedly connected with the ring pipe (591) and the liquid pump (593), and the ring pipe (591) is provided with a side ring groove (5911).

3. The automated spray device for a self-cleaning surface spray tray of claim 1, wherein: The cleaning mechanism (54) further comprises an ultrasonic cleaning cylinder (542) and a detection mechanism (543), the detection mechanism (543) comprises a bottom table (544), and the ultrasonic cleaning cylinder (542) and the bottom table (544) are fixedly connected with the base (541).

4. The automated spray device for a self-cleaning surface spray tray of claim 3, wherein: The detection mechanism (543) further comprises a circular table (545) and a micro humidity sensor (546), the circular table (545) is fixedly connected with the bottom table (544) and the micro humidity sensor (546), the bottom table (544) is provided with a ring liquid groove (5441), the ring liquid groove (5441) is arranged on the side of the bottom table (544) away from the center, and a plurality of groups of the micro humidity sensor (546) are arranged in an array on the upper surface of the circular table (545).

Images