Air-cooled semiconductor laser and packaging method thereof

Abstract

The invention provides an air-cooled semiconductor laser and a packaging method thereof, and relates to the technical field of semiconductor lasers. The air-cooled semiconductor laser comprises a heat-conducting insulating heat sink. A bar array and two electrode plates are arranged on one side of the heat conduction and insulation heat sink, a radiator is arranged on the other side of the heat conduction and insulation heat sink, and heat generated by the bar array can be transmitted to the radiator through the heat conduction and insulation heat sink. A heat dissipation fan is arranged on the heat dissipation device, and the heat dissipation fan can enable air flow to penetrate through gaps among fins of the heat dissipation device. According to the air-cooled semiconductor laser provided by the embodiment of the invention, the radiator is arranged and is in direct contact with the heat-conducting insulating heat sink for mounting the bar, so that a heat-conducting path is shortened, the size and the weight are reduced, and the heat dissipation effect is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor lasers, in particular to an air-cooled semiconductor laser and a packaging method thereof. Background Art

[0002] Semiconductor lasers have been widely used in ranging, machining, medical cosmetology, laser communication and other fields due to their advantages of small size, light weight and low cost.

[0003] Semiconductor lasers generate a significant amount of heat when powered and produce light. This heat must be dissipated quickly to ensure product reliability. Existing laser cooling methods primarily include water cooling and air cooling. However, water cooling systems are bulky and heavy, limiting their use to fixed locations such as medical beauty clinics. While air cooling allows for portability, it suffers from low heat dissipation efficiency and often fails to meet user requirements. Summary of the Invention

[0004] In response to the above problems, the present application provides an air-cooled semiconductor laser, which is not only small in size and reliable, but also has high heat dissipation efficiency, and can meet the user's demand for heat dissipation efficiency.

[0005] The technical solution adopted by the present invention to solve the technical problem is: An air-cooled semiconductor laser comprises a thermally conductive insulating heat sink; A bar array and two electrode sheets are provided on one side of the heat conductive insulating heat sink, and a heat sink is provided on the other side of the heat conductive insulating heat sink. The heat generated by the bar array can be transferred to the heat sink through the heat conductive insulating heat sink. The radiator is provided with a cooling fan, which can allow airflow to pass through the gaps between the fins of the radiator.

[0006] Furthermore, the radiator includes a central axis and fins arranged on the central axis, a connecting plate is provided on the central axis, and the heat dissipation fan is connected to an end of the connecting plate facing away from the heat-conducting insulating heat sink.

[0007] Furthermore, the area of ​​the end surface of the central axis facing the heat-conducting insulating heat sink is larger than the area of ​​the end surface of the central axis facing away from the heat-conducting insulating heat sink.

[0008] Furthermore, the outer side surface of the central axis includes a first shaft segment, a second shaft segment and a third shaft segment in sequence along a direction away from the thermally conductive insulating heat sink, the diameter of the first shaft segment is larger than the diameter of the third shaft segment, and the second shaft segment has a conical structure.

[0009] Furthermore, a mounting hole is provided on the central axis, a heat pipe is provided in the mounting hole, and an evaporation end of the heat pipe is in close contact with the heat-conducting insulating heat sink.

[0010] Furthermore, a cover is provided on the thermally conductive insulating heat sink, the bar array is located inside the cover, and the electrode sheet extends through the cover to the outside of the cover, a light outlet is provided on the cover, a waveguide is provided at the light outlet, and the light emitting end of the bar array is directed toward the waveguide.

[0011] Furthermore, a conductive heat sink is provided between the electrode sheet and the bar array, and one side of the conductive heat sink is in contact with the electrode sheet, and the other side is in contact with the bar array.

[0012] Furthermore, a temperature sensor is provided on the thermally conductive insulating heat sink, and the controller controls the start and stop of the heat dissipation fan according to a temperature signal fed back by the temperature sensor.

[0013] A method for packaging an air-cooled semiconductor laser comprises the following steps: S1, placing the bar array in the groove of the sintered base; S2, placing a thermally conductive insulating heat sink on the sintered base; S3, placing the heat sink on the upper side of the thermally conductive insulating heat sink; S4, placing the heat pipe into the mounting hole of the radiator; S5, placing the sintering compact on the heat sink and sintering; S6, using low-temperature solder secondary sintering to fix the electrode sheets and conductive heat sinks on both sides of the bar array; S7, install the cooling fan.

[0014] Furthermore, the sintered base is provided with at least two positioning posts, the thermally conductive insulating heat sink is provided with a first positioning hole matched with the positioning posts, and the radiator is provided with a second positioning hole matched with the positioning posts.

[0015] The beneficial effects of the present invention are: 1. The air-cooled semiconductor laser provided in the embodiments of this application is provided with a heat sink that directly contacts the heat-conducting and insulating heat sink on which the bar is mounted, thereby shortening the heat conduction path and improving heat dissipation efficiency. This not only reduces the overall size and weight of the semiconductor laser to adapt to different working environments, but also improves the heat dissipation effect, thus meeting the usage needs of most users.

[0016] 2. The embodiment of the present application provides an air-cooled semiconductor laser packaging method, which can realize the simultaneous packaging of the bar array and the heat sink by setting a special fixture, thereby improving the packaging efficiency and ensuring product consistency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of the three-dimensional structure of an air-cooled semiconductor laser provided in an embodiment of the present application; Figure 2 for Figure 1 Schematic diagram of the enlarged structure of part A; Figure 3 A front view of an air-cooled semiconductor laser provided in an embodiment of the present application; Figure 4 for Figure 3 AA section view in; Figure 5 for Figure 4 Schematic diagram of the enlarged structure of part B; Figure 6 for Figure 4 Schematic diagram of the enlarged structure of part C; Figure 7 An exploded view of an air-cooled semiconductor laser provided in an embodiment of the present application; Figure 8 for Figure 7 Schematic diagram of the enlarged structure of part D; Figure 9 Schematic diagram of the three-dimensional structure of the installation frame; Figure 10 Schematic diagram of the connection relationship between the bar array, electrode sheet, bar heat sink and thermally conductive insulating heat sink; Figure 11 Schematic diagram of the three-dimensional structure of the radiator Figure 1 ; Figure 12 Schematic diagram of the three-dimensional structure of the radiator Figure 2 ; Figure 13 is a cross-sectional view of the radiator; Figure 14 The packaging process of an air-cooled semiconductor laser packaging method provided in the embodiment of the present application Figure 1 ; Figure 15 The packaging process of an air-cooled semiconductor laser packaging method provided in the embodiment of the present application Figure 2 ; Figure 16 The packaging process of an air-cooled semiconductor laser packaging method provided in the embodiment of the present application Figure 3 ; Figure 17The packaging process of a wind-cooled semiconductor laser packaging method provided by the embodiment of the application Figure 4 .

[0018] In the figure: 11, heat-conducting insulation heat sink; 111, temperature detection hole; 112, first positioning hole; 121, bar array; 122, electrode sheet; 123, conductive heat sink; 13, heat sink; 131, central axis; 1311, first axis segment; 1312, second axis segment; 1313, third axis segment; 132, fin; 133, connecting plate; 1331, second positioning hole; 134, mounting hole; 14, cooling fan; 141, first screw; 15, heat pipe; 151, evaporation end; 152, condensation end; 16, cover; 161, second screw; 162, recess; 163, light outlet; 164, supporting boss; 165, avoiding opening; 17, light wave guide; 18, mounting frame; 181, first mounting slot; 182, second mounting slot; 183, plug-in boss; 19, bonding cavity; 21, sintering base; 211, positioning column; 22, sintering briquette. DETAILED DESCRIPTION

[0019] In order to make the personnel in the technical field better understand the technical solutions in the application, the technical solutions in the embodiments of the application will be described in detail below in combination with the drawings in the embodiments of the application, and the described embodiments are only some of the embodiments of the application, rather than all the embodiments. All other embodiments obtained by the personnel in the art without creative labor on the basis of the embodiments of the application shall belong to the protection scope of the application.

[0020] As Figure 1 , Figure 3 and Figure 4 A wind-cooled semiconductor laser includes a heat-conducting insulation heat sink 11, one side of the heat-conducting insulation heat sink 11 is provided with a bar array 121 and two electrode sheets 122, and the two electrode sheets 122 are respectively in contact with the bar array 121. One of the electrode sheets 122 is a positive electrode, and the other electrode sheet 122 is a negative electrode. When the two electrode sheets 122 are respectively connected with a power supply, the bar array 121 is connected with the power supply and can emit laser.

[0021] The other side of the heat-conducting insulation heat sink 11 is provided with a heat sink 13. The end face of the heat sink 13 facing the heat-conducting insulation heat sink 11 is attached to the heat-conducting insulation heat sink 11. In the working process, the heat generated by the bar array 121 can be transmitted to the heat sink 13 through the heat-conducting insulation heat sink 11.

[0022] The radiator 13 is provided with a cooling fan 14, which is detachably connected to the radiator 13. When the cooling fan 14 is turned on, the cooling fan 14 allows air to flow through the gaps between the fins 132 of the radiator 13, thereby achieving forced convection heat dissipation and improving heat dissipation efficiency.

[0023] As a specific implementation, the heat dissipation fan 14 in this embodiment is fixed to an end of the radiator 13 facing away from the heat-conducting insulating heat sink 11 by a first screw 141 .

[0024] As a specific implementation method, Figure 11 、 Figure 12 and Figure 13 As shown, the heat sink 13 described in this embodiment includes a central shaft 131 and fins 132 disposed on the central shaft 131. The central shaft 131 is also provided with a connecting plate 133. The connecting plate 133 is parallel to the axis of the central shaft 131 and extends radially along the central shaft 131. The heat dissipation fan 14 is fixedly connected to the end surface of the connecting plate 133 facing away from the heat-conducting insulating heat sink 11 by a first screw 141.

[0025] As a specific implementation, two connecting plates 133 are provided on the central shaft 131 in this embodiment, and the angle between the two connecting plates 133 is 180°.

[0026] Further, if Figure 13 As shown, the area of ​​the end surface of the central axis 131 facing the heat-conducting insulating heat sink 11 is larger than the area of ​​the end surface of the central axis 131 facing away from the heat-conducting insulating heat sink 11 .

[0027] The cross-section of the central axis 131 can be circular or non-circular, such as a regular polygon, ellipse, or other irregular closed loop. In this embodiment, the cross-section of the central axis 131 is circular, and the outer diameter of the end surface of the central axis 131 facing the heat-conducting insulating heat sink 11 is greater than the outer diameter of the end surface of the central axis 131 facing away from the heat-conducting insulating heat sink 11.

[0028] Preferably, the thermally conductive insulating heat sink 11 is in a circular structure, and the radiator 13 is in a cylindrical structure as a whole and is coaxially arranged with the central axis 131 of the radiator 13 .

[0029] As a specific embodiment, the outer side of the center shaft 131 in this embodiment comprises a first shaft section 1311, a second shaft section 1312 and a third shaft section 1313 in sequence in the direction away from the heat-conducting and insulating heat sink 11, the diameter of the first shaft section 1311 is greater than that of the third shaft section 1313, the second shaft section 1312 is in a conical structure, and the diameter of the second shaft section 1312 gradually decreases in the direction away from the heat-conducting and insulating heat sink 11.

[0030] In this way, not only the contact area of the heat radiator 13 and the heat-conducting and insulating heat sink 11 can be increased to improve the heat dissipation effect, but also Figure 13 the second shaft section 1312 can guide the airflow blown into the heat radiator 13 by the heat dissipation fan 14, so as to avoid the airflow directly hitting the heat-conducting and insulating heat sink 11 and causing vortex and turbulence. The airflow guidance can not only improve the heat dissipation effect to a certain extent, but also can reduce the noise.

[0031] Further, as shown in Figure 4 and Figure 7 the mounting hole 134 is provided on the center shaft 131, the heat pipe 15 is arranged in the mounting hole 134, the evaporation end 151 of the heat pipe 15 faces the heat-conducting and insulating heat sink 11 and is in close contact with the heat-conducting and insulating heat sink 11, and the condensation end 152 of the heat pipe 15 faces away from the heat-conducting and insulating heat sink 11. During operation, the cooling medium in the heat pipe 15 vaporizes at the evaporation end 151 by absorbing the heat of the heat-conducting and insulating heat sink 11, the vaporized cooling medium moves downward along the cavity in the middle of the heat pipe 15, exchanges heat with the heat radiator 13 in the process of moving downward, and transfers heat to the heat radiator 13, and the cooling medium itself is condensed into liquid at the condensation end 152 of the heat pipe 15. By arranging the heat pipe 15, the heat generated by the fin array 121 can be further quickly transferred to the heat radiator 13, and the heat dissipation rate of the heat radiator 13 is increased.

[0032] As a specific embodiment, the mounting hole 134 in this embodiment penetrates the center shaft 131 in the axial direction.

[0033] Further, as shown in Figure 1 and Figure 4As shown, a removable cover 16 is provided on one side of the thermally conductive insulating heat sink 11. The bar array 121 is located within the cover 16, and the electrode sheet 122 extends through the cover 16 to the outside of the cover 16. The cover 16 is provided with an escape opening 165 for evading the electrode sheet 122. A light outlet 163 is provided on the cover 16. A waveguide 17 is disposed at the light outlet 163 of the cover 16, and the light exit end of the bar array 121 faces the waveguide 17. The waveguide 17 can guide the laser light emitted by the bar array 121 outward.

[0034] As a specific implementation, the cover 16 in this embodiment is fixedly connected to the thermally conductive insulating heat sink 11 via a second screw 161 .

[0035] As a specific implementation method, Figure 5 、 Figure 7 、 Figure 8 and Figure 9 As shown, the cover 16 described in this embodiment includes a top plate and side panels. The top plate is provided with a through hole for accommodating the second screw 161. Under the locking action of the second screw 161, the side panels are pressed against the thermally conductive insulating heat sink 11. The avoidance opening 165 is provided on the side panels. A recess 162 is provided on the top plate, and the light outlet 163 is provided on the bottom surface of the recess 162. A supporting boss 164 is provided on the lower edge of the side wall of the light outlet 163. The end of the waveguide 17 facing the thermally conductive insulating heat sink 11 is inserted into the light outlet 163 and rests on the supporting boss 164. A mounting frame 18 is sleeved over the light guide 17 above the housing 16. A first mounting notch 181 is provided on the outer edge of the end surface of the mounting frame 18 facing one end of the housing 16, and a second mounting notch 182 is provided on the inner edge of the end surface of the mounting frame 18 facing the other end of the housing 16. An insertion boss 183 is formed between the first and second mounting notches 181, 182. The insertion boss 183 is inserted into the recess 162, and the outer side of the insertion boss 183 abuts against the sidewall of the recess 162. The inner side and the side facing the housing 16 of the second mounting notch 182 are blocked by the light guide 17 and the bottom surface of the recess 162, respectively, forming a bonding cavity 19. The bonding cavity 19 is filled with an adhesive that connects the housing 16, light guide 17, and mounting frame 18 into a single entity.

[0036] By providing the mounting frame 18 , not only can the bonding strength be improved, but the adhesive is also sealed in the bonding cavity 19 without overflowing, thereby ensuring aesthetics.

[0037] As a specific implementation manner, the light outlet 163 described in this embodiment has a square structure, and only the lower edges of two opposite side walls are provided with supporting bosses 164 .

[0038] Further, if Figure 6 and Figure 10 As shown, a conductive heat sink 123 is provided on the side of the electrode sheet 122 facing away from the heat-conducting insulating heat sink 11. One side of the conductive heat sink 123 is bonded and fixed to the electrode sheet 122, and the other side is bonded and fixed to the bar array 121. The provision of the conductive heat sink 123 ensures a reliable connection between the electrode sheet 122 and the bar array 121, preventing false connections.

[0039] Furthermore, the air-cooled semiconductor laser provided in the embodiments of the present application also includes a controller (not shown). The thermally conductive insulating heat sink 11 is provided with a temperature detection hole 111, within which is located a temperature sensor (not shown) for detecting the temperature of the thermally conductive insulating heat sink 11. During operation, the temperature sensor transmits the detected temperature signal to the controller, which then controls the start and stop of the cooling fan 14 based on the temperature signal fed back by the temperature sensor.

[0040] The advantage of this design is that when the temperature detected by the temperature sensor does not reach the preset value, the cooling fan 14 does not work and heat is dissipated by natural convection; when the temperature detected by the temperature sensor reaches the preset value, the cooling fan 14 is turned on and heat is dissipated by forced convection. This not only saves energy consumption of the product, but also can adapt to different usage environments and enhance the user experience.

[0041] A method for packaging an air-cooled semiconductor laser comprises the following steps: S1, such as Figure 14 As shown, the bar array 121 is placed in the groove of the sintered base 21.

[0042] The sintering base 21 is circular and has a groove formed therein. The groove's length is equal to the length of the bar array 121, and the width of the groove is equal to the width of the bar array 121. When the bar array 121 is placed in the groove, the upper surface of the bar array 121 is flush with the upper surface of the sintering base 21.

[0043] S2, such as Figure 15 As shown, the thermally conductive insulating heat sink 11 is placed on the sintered base 21 .

[0044] S3, such as Figure 16 As shown, the heat sink 13 is placed on the upper side of the thermally conductive insulating heat sink 11 .

[0045] Further, if Figure 7 and Figure 14 As shown, the sintered base 21 is provided with at least two positioning posts 211, the thermally conductive insulating heat sink 11 is provided with a first positioning hole 112 that cooperates with the positioning posts 211, and the connecting plate 133 of the heat sink 13 is provided with a second positioning hole 1331 that cooperates with the positioning posts 211. When the thermally conductive insulating heat sink 11 is placed on the sintered base 21, the positioning posts 211 are inserted into the corresponding first positioning holes 112 and extend through the first positioning holes 112 to above the thermally conductive insulating heat sink 11. When the heat sink 13 is placed on the upper side of the thermally conductive insulating heat sink 11, the positioning posts 211 are inserted into the corresponding second positioning holes 1331.

[0046] As a specific embodiment, the sintered base 21 described in this embodiment is provided with two positioning posts 211, and the two positioning posts 211 are symmetrically arranged about the center of the sintered base 21. Accordingly, the thermally conductive insulating heat sink 11 is provided with two first positioning holes 112, and the connecting plate 133 of the heat sink 13 is provided with two second positioning holes 1331. Preferably, the geometric center of the groove coincides with the center of the sintered base 21.

[0047] S4 , placing the heat pipe 15 into the mounting hole 134 of the radiator 13 .

[0048] S5, such as Figure 17 As shown, after placing the sintering block 22 on the heat sink 13, the whole is placed in a sintering furnace for sintering, thereby connecting and fixing the bar array 121, the thermally conductive insulating heat sink 11, the heat sink 13 and the heat pipe 15 into a whole.

[0049] S6 , using a low-temperature solder secondary sintering method to install and fix the electrode sheet 122 and the conductive heat sink 123 on both sides of the bar array 121 .

[0050] S7, install the cooling fan 14.

[0051] Other embodiments obtained by those skilled in the art by combining, splitting, reorganizing, etc. the embodiments provided in this application do not exceed the scope of protection of this application.

[0052] The above specific implementation methods provide a detailed description of the purpose, technical solutions and beneficial effects of the embodiments of the present application. The above is only a specific implementation method of the embodiments of the present application and is not intended to limit the scope of protection of the embodiments of the present application. That is, any modifications, equivalent replacements, improvements, etc. made on the basis of the embodiments of the present application should be included in the scope of protection of the embodiments of the present application.

Claims

1. An air-cooled semiconductor laser, characterized in that: including a thermally conductive insulating heat sink (11); A bar array (121) and two electrode sheets (122) are provided on one side of the thermally conductive insulating heat sink (11), and a heat sink (13) is provided on the other side of the thermally conductive insulating heat sink (11). Heat generated by the bar array (121) can be transferred to the heat sink (13) through the thermally conductive insulating heat sink (11); The radiator (13) is provided with a heat dissipation fan (14), and the heat dissipation fan (14) can allow airflow to pass through the gaps between the fins (132) of the radiator (13).

2. The air-cooled semiconductor laser according to claim 1, characterized in that: The radiator (13) comprises a central shaft (131) and fins (132) arranged on the central shaft (131); a connecting plate (133) is provided on the central shaft (131); and the heat dissipation fan (14) is connected to an end of the connecting plate (133) facing away from the heat-conducting insulating heat sink (11).

3. The air-cooled semiconductor laser according to claim 2, characterized in that: The end surface area of ​​the central axis (131) facing the heat-conducting insulating heat sink (11) is larger than the end surface area of ​​the central axis (131) facing away from the heat-conducting insulating heat sink (11).

4. The air-cooled semiconductor laser according to claim 3, characterized in that: The outer side surface of the central axis (131) comprises a first axis segment (1311), a second axis segment (1312) and a third axis segment (1313) in sequence along a direction away from the thermally conductive insulating heat sink (11); the diameter of the first axis segment (1311) is greater than the diameter of the third axis segment (1313); and the second axis segment (1312) has a conical structure.

5. The air-cooled semiconductor laser according to claim 2, characterized in that: The central axis (131) is provided with a mounting hole (134), a heat pipe (15) is provided in the mounting hole (134), and an evaporation end (151) of the heat pipe (15) is in close contact with the heat-conducting insulating heat sink (11).

6. The air-cooled semiconductor laser according to claim 1, characterized in that: A cover (16) is provided on the thermally conductive insulating heat sink (11), the bar array (121) is located in the cover (16), and the electrode sheet (122) extends through the cover (16) to the outside of the cover (16), a light outlet (163) is provided on the cover (16), a waveguide (17) is provided at the light outlet (163), and the light emitting end of the bar array (121) faces the waveguide (17).

7. The air-cooled semiconductor laser according to claim 1, characterized in that: A conductive heat sink (123) is provided between the electrode sheet (122) and the bar array (121), and one side of the conductive heat sink (123) is bonded to the electrode sheet (122), and the other side is bonded to the bar array (121).

8. The air-cooled semiconductor laser according to claim 1, characterized in that: The heat-conducting insulating heat sink (11) is provided with a temperature sensor, and the controller controls the start and stop of the heat dissipation fan (14) according to the temperature signal fed back by the temperature sensor.

9. A packaging method for the air-cooled semiconductor laser according to claim 7, characterized in that: The following steps are included: S1, placing the bar array (121) in the groove of the sintered base (21); S2, placing a thermally conductive insulating heat sink (11) on the sintered base (21); S3, placing the heat sink (13) on the upper side of the thermally conductive insulating heat sink (11); S4, placing the heat pipe (15) into the mounting hole (134) of the radiator (13); S5, placing the sintering compact (22) on the heat sink (13) and sintering it; S6, using a low-temperature solder secondary sintering method to install and fix the electrode sheet (122) and the conductive heat sink (123) on both sides of the bar array (121); S7, install the cooling fan (14).

10. The air-cooled semiconductor laser packaging method according to claim 9, characterized in that: At least two positioning columns (211) are provided on the sintered base (21), a first positioning hole (112) matching with the positioning columns (211) is provided on the thermally conductive insulating heat sink (11), and a second positioning hole (1331) matching with the positioning columns (211) is provided on the radiator (13).

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