Film laminating machine for semiconductor wafer processing

Abstract

The invention relates to the technical field of wafer film laminating equipment, and discloses a film laminating machine for semiconductor wafer processing, which comprises a base, an inner support plate, a support ring plate and an elastic support device are sequentially arranged in the middle of the top end of the base from inside to outside, and the support ring plate is movably arranged relative to the inner support plate and the elastic support device. In a normal state, the top of the inner supporting plate, the top of the supporting ring plate and the top of the elastic supporting device are flush, a film pressing assembly is movably arranged over the supporting ring plate, a rubber ring and a tool apron are arranged on the film pressing assembly, and a blade is arranged on the tool apron. After a film pressing assembly moves downwards, the inner side of a rubber ring is matched with the outer side of an inner supporting plate to straighten a film material, a blade arranged on the outer side of the inner supporting plate rotates around the inner supporting plate to cut the film material, so that when the film material is cut, the film material adsorbed on the surface of a wafer is not prone to wrinkling, bubbles in the film material above the wafer can be eliminated, and the film material cutting efficiency is improved. Therefore, the film covering effect of the wafer is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer film coating equipment, in particular to a film coating machine for semiconductor wafer processing. BACKGROUND

[0002] The wafer film coating machine is a core equipment in the fields of semiconductor manufacturing, photovoltaic industry, etc., which is used for precisely attaching a protective film (such as a blue film or a UV film) to the surface of a wafer to prevent the wafer surface from being contaminated or damaged in subsequent processes (cutting, thinning, and splitting, etc.). The wafer is fixed by vacuum adsorption, and the film material is evenly attached to the wafer surface. The film material above the wafer is rotated by a film pressing roller to eliminate air bubbles, and then the film material is cut by a blade. In order to solve the problem of film material wrinkles that easily occur during cutting, the prior art uses a hot ring cutter for cutting.

[0003] For example, a full-automatic wafer film coating machine is disclosed in Chinese Patent No. CN115339093B. By cooperation between the mold pressing assembly and the fixed angle assembly, the BG film is kept in a flat state before being attached, and the angle between the BG film and the film attachment platform is kept unchanged between the mold pressing roller and the fixed angle roller. The mold pressing roller can exhaust the air below the BG film to avoid wrinkles. A hot ring cutter assembly is used for cutting the BG film, which can cut the BG film with a heated blade to avoid wrinkles caused by the ring cutter during cutting.

[0004] However, in the prior art, although a hot ring cutter is used, the cutter cuts in a ring shape directly above the film material, and the real-time change in the direction of the blade during cutting still easily causes the film material adsorbed on the wafer surface to wrinkle due to the pulling force during cutting. In addition, in the prior art, the film pressing roller is rotated above the film material on the wafer to eliminate air bubbles in cooperation with vacuum extraction below the wafer. However, when the film pressing roller rotates, the film material at the deflated air bubble position will still wrinkle, thereby reducing the wafer film coating effect. SUMMARY

[0005] The present application provides a film coating machine for semiconductor wafer processing, which has the advantage of preventing wrinkles during wafer film coating, to solve the problem that the prior art still easily causes film material wrinkles despite using a film pressing roller to eliminate air bubbles and an earring cutter to cut the film material, thereby affecting the wafer film coating effect.

[0006] In order to achieve the above object, the technical scheme adopted by the present application is as follows: a film laminating machine for semiconductor wafer processing, comprising a base, a first movable seat and a second movable seat movably arranged on the base, a film pressing shaft movably arranged on the inner side of the first movable seat and located above the base, and a film taking shaft movably arranged on the inner side of the second movable seat and located above the base, wherein a middle portion of the top end of the base is sequentially provided with an inner support plate, a support ring plate and an elastic support device from inside to outside, the support ring plate is movably arranged relative to the inner support plate and the elastic support device, and the top portions of the inner support plate, the support ring plate and the elastic support device are flush in a normal state, and a film pressing assembly is movably arranged above the support ring plate.

[0007] The film pressing assembly comprises a lower ring plate, a rubber ring is arranged on the inner edge of the top portion of the lower ring plate, an outer sleeve plate is further arranged on the top portion of the lower ring plate and located on the outer side of the lower ring plate, a rotating ring plate is movably arranged on the inner side of the outer sleeve plate through a bearing, the rotating ring plate is driven to rotate by a motor, a tool holder is movably arranged on one side of the bottom portion of the rotating ring plate, a blade is arranged on the side of the tool holder facing the inner support plate, and a cylinder for horizontally moving the tool holder is arranged on the rotating ring plate.

[0008] Further, a surrounding plate is fixedly arranged on the top portion of the base, an outer support plate is fixedly arranged on the top portion of the surrounding plate, a circular groove is formed in the outer support plate, the support ring plate and the inner support plate are located in the circular groove of the outer support plate, and a plurality of air holes are formed in the outer support plate, so that when the inner side of the surrounding plate is vacuumized, the film material can be attached to the surface of the outer support plate by using the air holes formed in the outer support plate.

[0009] Further, an elastic support device is movably arranged on the base, the number of the elastic support devices is not less than two, the elastic support device comprises a movable support shaft movably sleeved on the base, the connection part between the movable support shaft and the base is sealed, the top end of the movable support shaft is fixedly connected with the bottom portion of the support ring plate, a spring is movably sleeved on the movable support shaft and located between the base and the support ring plate, a stop block is fixedly arranged on the bottom end of the movable support shaft and located below the base, in a normal state, the support ring plate maintains a tendency to move upward by the elastic force of the spring, and the top portion of the support ring plate is located on the same plane as the top portion of the outer support plate by the limiting action of the stop block on the bottom portion of the base, and the support ring plate moves downward when the film pressing assembly moves downward.

[0010] Further, the film pressing assembly further comprises an upper ring plate fixedly installed on the top of the lower ring plate, an inner sleeve plate fixedly installed on the inner edge of the bottom of the upper ring plate, and a gap of at least one centimeter reserved between the top of the rubber ring and the bottom of the inner sleeve plate, a tooth ring fixedly installed on the top of the rotating ring plate, and a motor fixedly installed on one side of the top of the upper ring plate, wherein the output rotating shaft of the motor extends below the upper ring plate and is fixedly installed with a gear, and the external teeth of the gear are engaged with the external teeth of the tooth ring, the rubber ring cooperates with the outer side of the inner support plate to straighten the film material above the wafer placed on the inner support plate to eliminate bubbles by the downward movement of the film pressing assembly, the gear is driven to rotate by the motor to drive the tooth ring and the rotating ring plate to rotate together, and the knife seat on the rotating ring plate is driven to rotate together, and the film material on the outer side of the inner support plate is cut by the blade on one side of the knife seat.

[0011] Further, the inner and outer sides of the bottom of the lower ring plate are designed as smooth chamfers, and the inner and outer sides of the bottom of the lower ring plate are prevented from being raised to break the film material after the overall downward movement of the film pressing assembly.

[0012] Further, the lower ring plate is fixedly installed with a limiting ring located on the outer side of the rubber ring, the limiting ring is used for limiting on the outer side of the rubber ring to ensure that the inner side of the rubber ring can cooperate with the outer side of the lower ring plate to clamp the film material, and the straightening of the film material is facilitated after the overall downward movement of the film pressing assembly.

[0013] Further, two sliding grooves are formed in the rotating ring plate, and two sliding shafts are movably sleeved in the two sliding grooves, the bottom end of the sliding shaft is fixedly connected with the knife seat, the top end of the sliding shaft is fixedly connected with a sliding block located above the rotating ring plate, and one side of the sliding block is fixedly connected with one end of a piston shaft of a pneumatic cylinder, the sliding block is driven to move horizontally by the pneumatic cylinder driving the piston shaft, and the knife seat is driven to move horizontally, and the rotating ring plate can drive the sliding shaft and the knife seat to rotate around the outer side of the inner support plate to cut the film material on the outer side of the inner support plate by the limiting action of the sliding groove on the sliding shaft.

[0014] Further, a plurality of through holes are formed in the inner support plate, two ejection pneumatic cylinders are fixedly installed on the bottom of the base, the top end of the piston shaft of each ejection pneumatic cylinder is fixedly connected with an ejection ring plate, the top of the ejection ring plate is fixedly installed with vertical shafts corresponding to the number of through holes in the inner support plate, the top end of each vertical shaft is fixedly connected with a supporting block located in the through hole, and the supporting block is moved above the inner support plate by driving the piston shaft to push the ejection ring plate and the vertical shaft upwards by the ejection pneumatic cylinder, so that the wafer is placed on the inner support plate.

[0015] The present application has the following advantages: 1. The present application provides a laminating machine for semiconductor wafer processing, which is provided with an inner support plate, a support ring plate and an elastic support device in sequence from the inside to the outside through the middle of the top of the base, wherein the support ring plate is movably arranged relative to the inner support plate and the elastic support device, and cooperates with the film pressing assembly arranged above the inner support plate. The downward movement of the film pressing assembly enables the inner side of the rubber ring to cooperate with the outer side of the inner support plate, so as to straighten the film material above the wafer placed on the inner support plate, and cooperate with the vacuum treatment below the film material. Compared with the existing laminating machine using the pressure roller method, it is beneficial to eliminate bubbles in the film material above the wafer, and at the same time avoids the phenomenon of wrinkles in the film material at the bubble position under the action of the rotation of the pressure roller, thereby improving the wafer laminating effect.

[0016] 2. The present application provides a laminating machine for semiconductor wafer processing. After the film pressing assembly moves downward, the inner side of the rubber ring cooperates with the outer side of the inner support plate to straighten the film material, and then the blade arranged on the outer side of the inner support plate rotates around the inner support plate to cut the film material. Compared with the existing laminating machine that performs circular cutting directly above the film material, the film material adsorbed on the wafer surface is easily wrinkled due to the pulling force during cutting due to the real-time change of the direction of the blade during cutting. When the film material is cut, the film material adsorbed on the wafer surface is less likely to wrinkle. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only embodiments of the present invention. Those skilled in the art can also derive other drawings based on the provided drawings without inventive work. Figure 1 It is a structural schematic diagram of the present invention; Figure 2 for Figure 1 Schematic diagram of the middle cross-section structure of the middle base and the film pressing assembly; Figure 3 for Figure 2 Schematic diagram of the structure after removing the membrane material; Figure 4 for Figure 2 A schematic structural diagram of the elastic support device in FIG. Figure 5 for Figure 2 Schematic diagram of the structure of the medium pressure membrane module; Figure 6 for Figure 5 A local enlarged structural diagram in FIG. Figure 7 for Figure 2 Schematic diagram of the inner support plate structure; Figure 8 forFigure 2 The schematic diagram of the state of the middle-pressure film assembly after pressing the film material; Figure 9 For Figure 8 The schematic diagram of the local enlarged structure at B of the above.

[0018] In the figure: 1, base; 2, coaming; 3, outer support plate; 4, inner support plate; 5, elastic support device; 501, movable support shaft; 502, spring; 503, stop block; 6, support ring plate; 7, support frame; 8, lifting cylinder; 9, film pressing assembly; 901, upper ring plate; 902, inner sleeve plate; 903, outer sleeve plate; 904, lower ring plate; 905, rubber ring; 906, limiting ring; 10, rotating ring plate; 101, sliding groove; 11, tooth ring; 12, motor; 13, gear; 14, knife seat; 15, sliding block; 16, cylinder; 17, ejection cylinder; 18, ejection ring plate; 19, vertical shaft; 20, supporting block; 21, first moving seat; 22, second moving seat; 23, film pressing shaft; 24, film taking shaft. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0020] Embodiment one, as Figures 1-3 A film coating machine for semiconductor wafer processing, comprising a base 1, a coaming 2 fixedly installed on the top of the base 1, an outer support plate 3 fixedly installed on the top of the coaming 2, a circular slot formed in the middle of the outer support plate 3, an inner support plate 4 fixedly installed on the top of the base 1 and located in the middle of the circular slot of the outer support plate 3, and the top of the inner support plate 4 and the top of the outer support plate 3 are located on the same plane, an elastic support device 5 movably installed on the base 1, the number of the elastic support devices 5 is not less than two, the top of the elastic support device 5 is fixedly installed on a support ring plate 6, the support ring plate 6 is located on the inner side of the outer support plate 3 and the outer side of the inner support plate 4, the inner side of the support ring plate 6 and the outer side of the inner support plate 4, and the outer side of the support ring plate 6 and the inner side of the outer support plate 3 are not in contact, and the top of the support ring plate 6 is also located on the same plane as the top of the outer support plate 3 in normal state.

[0021] Please refer to Figures 3-4The elastic support device 5 includes a movable support shaft 501 movably sleeved on the base 1, the connection part between the movable support shaft 501 and the base 1 is sealed, the top of the movable support shaft 501 is fixedly connected to the bottom of the support ring plate 6, and the movable support shaft 501 is movably sleeved with a spring 502 located between the base 1 and the support ring plate 6, and the bottom end of the movable support shaft 501 is fixedly installed with a stopper 503 located below the base 1. Under normal circumstances, the elastic force of the spring 502 makes the support ring plate 6 maintain an upward trend, and cooperates with the limiting effect of the stopper 503 at the bottom of the base 1 to make the top of the support ring plate 6 and the top of the outer support plate 3 located on the same plane.

[0022] Please continue reading Figures 1-3 、 Figures 5-6 A support frame 7 is fixedly installed on the base 1, and two lifting cylinders 8 are fixedly installed on the support frame 7. The piston shafts of the two lifting cylinders 8 are fixedly connected to a film pressing assembly 9. The film pressing assembly 9 includes an upper ring plate 901, and an inner sleeve plate 902 is fixedly installed on the inner edge of the bottom of the upper ring plate 901. An outer sleeve plate 903 is fixedly installed on the outer edge of the bottom of the upper ring plate 901. A lower ring plate 904 is fixedly installed on the bottom of the outer sleeve plate 903. The inner and outer sides of the bottom of the lower ring plate 904 are both smooth chamfered. A rubber ring 905 is fixedly installed on the inner edge of the top of the lower ring plate 904. A gap of at least one centimeter is reserved between the top of the rubber ring 905 and the bottom of the inner sleeve plate 902. A limiting ring 906 located on the outside of the rubber ring 905 is fixedly installed on the lower ring plate 904.

[0023] A rotating ring plate 10 is movably mounted on the inner side of the outer sleeve plate 903 through a bearing, a gear ring 11 is fixedly mounted on the top of the rotating ring plate 10, and a motor 12 is fixedly mounted on one side of the top of the upper ring plate 901. The output shaft of the motor 12 extends to the bottom of the upper ring plate 901 and is fixedly mounted with a gear 13, and the outer teeth of the gear 13 are engaged with the outer teeth of the gear ring 11. The output shaft is driven by the motor 12 to drive the gear 13 to rotate, thereby driving the gear ring 11 and the rotating ring plate 10 to rotate together.

[0024] Two slide grooves 101 are provided on the rotating ring plate 10, and sliding shafts are movably mounted in the two slide grooves 101 respectively. A knife seat 14 is fixedly mounted on the bottom end of the sliding shaft, and a blade is provided on one side of the knife seat 14. The blade is located between the rubber ring 905 and the inner plate 902. A sliding block 15 is fixedly mounted on the top of the sliding shaft, and a cylinder 16 is fixedly mounted on the rotating ring plate 10 on one side of the sliding block 15. The piston shaft of the cylinder 16 is fixedly connected to the side of the sliding block 15. The piston shaft is driven by the cylinder 16 to move, pushing the sliding block 15, the sliding shaft and the knife seat 14 to move horizontally as a whole, thereby controlling the horizontal movement of the blade.

[0025] See also Figure 3 and Figure 7A plurality of through holes are formed in the inner support plate 4, the bottom of the base 1 is fixedly provided with two ejection cylinders 17, the top end of the piston shaft of each ejection cylinder 17 is fixedly connected with an ejection ring plate 18, the top of the ejection ring plate 18 is fixedly provided with a vertical shaft 19 corresponding to the through holes in the inner support plate 4, the top end of the vertical shaft 19 is fixedly connected with a supporting block 20 located in the through hole, the ejection ring plate 18 and the vertical shaft 19 are driven to move upward by the piston shaft of the ejection cylinder 17, so that the supporting block 20 moves above the inner support plate 4, and the wafer is placed on the inner support plate 4.

[0026] Please continue to refer to Figures 1-3 The base 1 is provided with a first movable seat 21 and a second movable seat 22 which can move horizontally, the moving mode of the first movable seat 21 and the second movable seat 22 can be realized by using the existing ball screw, which will not be described here, the inner side of the first movable seat 21 is provided with a film pressing shaft 23 which can move longitudinally, the inner side of the second movable seat 22 is provided with a film taking shaft 24 which can move longitudinally, the longitudinal movement of the second movable seat 22 and the film pressing shaft 23 can be controlled by using the existing cylinder or hydraulic cylinder, which will not be described here.

[0027] In use, the wafer is first placed on the inner support plate 4, the first movable seat 21 is controlled to drive the film pressing shaft 23 to move to the side close to the second movable seat 22, one end of the film material is wound around the top of the film taking shaft 24 and the bottom of the film pressing shaft 23, then the inside of the surrounding plate 2 is vacuumized, at the same time, the film pressing shaft 23 is controlled to move downward, so that the film pressing shaft 23 adheres the film material to the top of the outer support plate 3, then the first movable seat 21 is controlled to drive the film pressing shaft 23 to move away from the side of the second movable seat 22, and the film material is adhered to the surface of the outer support plate 3, the support ring plate 6 and the inner support plate 4 by the negative pressure suction force in the inside of the surrounding plate 2, at the same time, the air in the film material above the wafer is removed, then the piston shaft is driven by the lifting cylinder 8 to drive the whole film pressing assembly 9 to move downward, so that the bottom of the lower ring plate 904 first contacts the film material above the support ring plate 6, as the lower ring plate 904 continues to move downward, the inner side of the rubber ring 905 clamps the film material in cooperation with the outer side of the inner support plate 4, so that the film material above the wafer is straightened, and the film material is adhered to the surface of the wafer by the film pressing assembly 9. Figures 8-9In the shown state, further remove the air inside the film on the wafer, after the film on the wafer is defoaming treatment, through the cylinder 16 drive piston shaft push slide block 15 drive slide shaft, tool holder 14 and blade towards the inner support plate 4 move, and then through the motor 12 drive output shaft drive gear 13 rotation, in turn drive gear ring 11, cylinder 16, slide block 15, tool holder 14 and blade rotate around the outside of the inner support plate 4, using the blade on the outer side of the film on the inner support plate 4 cutting, finally control the lifting cylinder 8 drive piston shaft drive film compression assembly 9 whole body up, cooperate with the baffle 2 in the negative pressure suction, make the film compression assembly 9 whole body and film separate, at the same time the motor 12 drive output shaft drive gear 13, gear ring 11 and rotary ring plate 10 reset rotation, prevent the air pipe winding around the cylinder 16, and then stop the baffle 2 inner cavity vacuum, start the ejector cylinder 17 drive piston shaft push ejector ring plate 18 drive vertical shaft 19 and block 20 up, the wafer on the inner support plate 4 top up, in order to collect, then control the second moving seat 22 towards the first moving seat 21 one side movement, using the film taking shaft 24 will remaining film top up, in order to winding next wafer film.

[0028] The above description of disclosed embodiments enables one of ordinary skill in the art to make and use the application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein can be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A laminating machine for semiconductor wafer processing, comprising a base, a first movable seat and a second movable seat being provided on the base so as to be horizontally movable, a film pressing shaft being provided on the inner side of the first movable seat and a film removing shaft being provided on the inner side of the second movable seat, wherein: The middle part of the top of the base is provided with an inner support plate, a support ring plate and an elastic support device in sequence from the inside to the outside, wherein the support ring plate is movably arranged relative to the inner support plate and the elastic support device, and under normal conditions, the tops of the inner support plate, the support ring plate and the elastic support device are flush, and a film pressing assembly is movably arranged directly above the support ring plate; The film pressing assembly includes a lower ring plate, the inner edge of the top of the lower ring plate is provided with a rubber ring, and the top of the lower ring plate is also provided with an outer sleeve plate located on the outside of the lower ring plate, and a rotating ring plate is movably installed on the inner side of the outer sleeve plate through a bearing, and the rotating ring plate is driven to rotate by a motor, and a knife seat is movably provided on one side of the bottom of the rotating ring plate, and a blade is provided on the side of the knife seat facing the inner support plate, and a cylinder for pushing the knife seat to move horizontally is provided on the rotating ring plate.

2. The semiconductor wafer processing laminating machine according to claim 1, wherein: A surrounding plate is fixedly installed on the top of the base, and an outer support plate is fixedly installed on the top of the surrounding plate. A circular groove is provided on the outer support plate. The support ring plate and the inner support plate are both located in the circular groove of the outer support plate. A plurality of ventilation holes are provided on the outer support plate.

3. The semiconductor wafer processing laminating machine according to claim 1, wherein: An elastic support device is movably installed on the base, and the number of the elastic support devices is not less than two. The elastic support device includes a movable support shaft movably sleeved on the base, the connection portion between the movable support shaft and the base is sealed, the top of the movable support shaft is fixedly connected to the bottom of the support ring plate, the movable support shaft is movably sleeved with a spring located between the base and the support ring plate, and the bottom end of the movable support shaft is fixedly installed with a stop block located below the base.

4. The semiconductor wafer processing laminating machine according to claim 1, wherein: The film pressing assembly also includes an upper ring plate fixedly mounted on the top of the lower ring plate, an inner sleeve plate fixedly mounted on the inner edge of the bottom of the upper ring plate, a gap of at least one centimeter is reserved between the top of the rubber ring and the bottom of the inner sleeve plate, a gear ring fixedly mounted on the top of the rotating ring plate, a motor fixedly mounted on one side of the top of the upper ring plate, the output shaft of the motor extends to the bottom of the upper ring plate and is fixedly mounted with a gear, and the outer teeth of the gear are engaged with the outer teeth of the gear ring.

5. The semiconductor wafer processing laminating machine according to claim 4, wherein: The inner and outer sides of the bottom of the lower ring plate are both designed with smooth chamfers.

6. The semiconductor wafer processing laminating machine according to claim 4, wherein: A limiting ring located outside the rubber ring is fixedly mounted on the lower ring plate.

7. The semiconductor wafer processing laminating machine according to claim 4, wherein: Two sliding grooves are provided on the rotating ring plate, and sliding shafts are movably mounted in the two sliding grooves. The bottom end of the sliding shaft is fixedly connected to the tool holder, and the top end of the sliding shaft is fixedly connected to a sliding block located above the rotating ring plate, and one side of the sliding block is fixedly connected to one end of the piston shaft on the cylinder.

8. The semiconductor wafer processing laminating machine according to claim 1, wherein: The inner support plate is provided with a plurality of through holes, and two ejection cylinders are fixedly installed on the bottom of the base. The top ends of the piston shafts of the two ejection cylinders are fixedly connected to the ejection ring plate. The top of the ejection ring plate is fixedly provided with vertical shafts with the same number and one-to-one correspondence as the through holes on the inner support plate, and the top ends of the vertical shafts are fixedly connected with support blocks located in the through holes.

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