System and method for capacitor lead frame for power converter of electric vehicle

Abstract

The invention relates to a system and method for a capacitor lead frame for a power converter of an electric vehicle. A system is provided that includes a power converter that includes a capacitor leadframe that includes: one or more capacitors; a carrier supporting the one or more capacitors; a first lead to connect the one or more capacitors to a first connector; a second lead to connect the one or more capacitors to a second connector; and one or more third leads to connect the one or more capacitors to a ground connector.

Description

[0001] Cross Reference to Related Applications

[0002] This application claims the benefit of priority of U.S. Provisional Patent Application No. 63 / 575,233, filed April 5, 2024, the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0003] Various embodiments of the present disclosure relate generally to capacitor lead frames, and more particularly to capacitor lead frames for one or more capacitors in a power converter for an electric vehicle. BACKGROUND

[0004] For example, EMC filters are used to suppress interference, such as high voltage direct current (HVDC) input for high voltage (HV) products, such as inverters. Capacitors can be used as interference suppression measures for differential noise between a DC positive terminal and a DC negative terminal of a battery, and for common mode noise between all conductors and ground. EMC filters can be disposed on a circuit board, which can increase the complexity and part count of the system.

[0005] The present disclosure aims to overcome one or more of these aforementioned challenges. SUMMARY

[0006] In some aspects, the technology described herein relates to a system comprising a power converter, the power converter comprising: a capacitor lead frame comprising: one or more capacitors; a carrier supporting the one or more capacitors; a first lead to connect the one or more capacitors to a first connector; a second lead to connect the one or more capacitors to a second connector; and one or more third leads to connect the one or more capacitors to a ground connector.

[0007] In some aspects, the technology described herein relates to a system wherein the one or more capacitors are configured to filter noise between a positive terminal of a battery and a negative terminal of the battery.

[0008] In some aspects, the technology described herein relates to a system wherein the one or more capacitors are configured to filter noise between a conductor and ground.

[0009] In some aspects, the technology described herein relates to a system wherein the first lead, the second lead, and the one or more third leads extend from the carrier in an outward direction.

[0010] In some aspects, the technology described herein relates to a system, wherein the first lead, the second lead, and the one or more third leads are connected via one or more of a pin, a clip, or solder.

[0011] In some aspects, the technology described herein relates to a system, wherein the capacitor lead frame further comprises a cover.

[0012] In some aspects, the technology described herein relates to a system, wherein the first connector is for a positive terminal of a power source and the second connector is for a negative terminal of the power source.

[0013] In some aspects, the technology described herein relates to a system, the system further comprising: a battery configured to provide DC power to the power converter; and a motor configured to receive AC power from the power converter to drive the motor, wherein the system is disposed as a vehicle comprising the power converter, the battery, and the motor.

[0014] In some aspects, the technology described herein relates to a capacitor lead frame for a power converter, the capacitor lead frame comprising: a carrier for one or more capacitors; a first lead to connect the one or more capacitors to a first connector; a second lead to connect the one or more capacitors to a second connector; and one or more third leads to connect the one or more capacitors to a ground connector.

[0015] In some aspects, the technology described herein relates to a capacitor lead frame, wherein the first connector is for a positive terminal of a power source and the second connector is for a negative terminal of the power source.

[0016] In some aspects, the technology described herein relates to a capacitor lead frame, wherein the capacitor lead frame further comprises a cover to connect to the carrier.

[0017] In some aspects, the technology described herein relates to a capacitor lead frame, wherein one or more of the cover or the carrier are configured to support the one or more capacitors.

[0018] In some aspects, the technology described herein relates to a capacitor lead frame, wherein the first lead, the second lead, and the one or more third leads extend from the carrier.

[0019] In some aspects, the technology described herein relates to a capacitor lead frame, wherein the one or more capacitors comprise: one or more first capacitors to suppress noise between the first connector and the second connector; and one or more second capacitors to suppress noise between a conductor and the ground connector.

[0020] In some aspects, the technology described herein relates to a capacitor lead frame, wherein the one or more first capacitors are configured to be arranged between the one or more second capacitors and the carrier.

[0021] In some aspects, the technology described herein relates to a capacitor lead frame assembly, comprising: one or more capacitors; a carrier for the one or more capacitors; a first lead extending from the carrier to electrically connect the one or more capacitors to a first connector; a second lead extending from the carrier to electrically connect the one or more capacitors to a second connector; and one or more third leads extending from the carrier to electrically connect the one or more capacitors to a ground connector.

[0022] In some aspects, the technology described herein relates to a capacitor lead frame assembly, further comprising: a cover connected to the carrier, wherein the one or more capacitors are arranged horizontally in the carrier between the carrier and the cover.

[0023] In some aspects, the technology described herein relates to a capacitor lead frame assembly, wherein the one or more capacitors are arranged vertically in the carrier.

[0024] In some aspects, the technology described herein relates to a capacitor lead frame assembly, wherein the one or more capacitors comprise: a first capacitor and a second capacitor configured to filter common mode noise to the ground connector; and a third capacitor to filter differential noise between the first connector and the second connector.

[0025] In some aspects, the technology described herein relates to a capacitor lead frame assembly, wherein the first capacitor and the second capacitor are arranged between the third capacitor and the carrier.

[0026] Additional objects and advantages of the disclosed embodiments will be set forth in part in the description that follows, and in part will be obvious from the description, or can be learned by practice of the disclosed embodiments. The objects and advantages of the disclosed embodiments will be realized and attained by means of the elements and combinations particularly pointed out in the appended claims.

[0027] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosed embodiments, as claimed. BRIEF DESCRIPTION OF DRAWINGS

[0028] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate various example embodiments and together with the description, explain the principles of the disclosed embodiments.

[0029] Figure 1 An example system infrastructure for a vehicle including a power converter is depicted in accordance with one or more embodiments.

[0030] Figure 2 An example system infrastructure for a power converter is depicted in accordance with one or more embodiments.

[0031] Figure 3 An example power converter having a capacitor lead frame assembly is depicted in accordance with one or more embodiments.

[0032] Figure 4A An isometric view of a capacitor lead frame assembly having a cover in accordance with one or more embodiments is depicted.

[0033] Figure 4B A top view of a capacitor lead frame assembly having a cover in accordance with one or more embodiments is depicted.

[0034] Figure 4C An exploded view of a capacitor lead frame assembly having a cover in accordance with one or more embodiments is depicted.

[0035] Figure 4D An example power converter having a capacitor lead frame assembly having a cover in accordance with one or more embodiments is depicted.

[0036] Figure 5A An isometric view of a soldered capacitor lead frame assembly in accordance with one or more embodiments is depicted.

[0037] Figure 5B A top view of a soldered capacitor lead frame assembly in accordance with one or more embodiments is depicted.

[0038] Figure 5C An exploded view of a soldered capacitor lead frame assembly in accordance with one or more embodiments is depicted.

[0039] Figure 5D An example power converter having a soldered capacitor lead frame assembly in accordance with one or more embodiments is depicted.

[0040] Figure 6A An example power converter having an XY capacitor lead frame assembly in accordance with one or more embodiments is depicted.

[0041] Figure 6BAn XY capacitor lead frame is depicted in accordance with one or more embodiments.

[0042] Figure 6C An exploded view of an XY capacitor lead frame assembly is depicted in accordance with one or more embodiments. DETAILED DESCRIPTION

[0043] Both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the claimed features. As used herein, the terms “comprises,” “comprising,” “has,” “having,” “includes,” “including,” or “contains,” “containing,” or variations thereof, are intended to cover a non-exclusive inclusion such that a process, method, article, or apparatus that comprises a list of elements is not necessarily limited to those elements, but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. In this disclosure, unless otherwise stated, relative terms such as, for example, “about,” “substantially,” and “approximately” are used to indicate a possible variation of ±10% in the stated value. In this disclosure, unless otherwise stated, any numerical values can include a possible variation of ±10% in the stated value.

[0044] The terms used below can be interpreted in their broadest reasonable manner, despite their use in conjunction with a detailed description of certain specific examples of the present disclosure. Indeed, certain terms can even be emphasized below; however, any terms intended to be interpreted in any manner that is constrained will be explicitly and specifically so limited in the DETAILED DESCRIPTION section. For example, in the context of the present disclosure, a switching device can be described as a switch or device, but can refer to any device used to control the flow of power in a circuit. For example, the switch can be, for example, a metal-oxide-semiconductor field-effect transistor (MOSFET), a bipolar junction transistor (BJT), an insulated-gate bipolar transistor (IGBT), or a relay, or any combination thereof, but is not limited thereto.

[0045] Various embodiments of the present disclosure relate generally to capacitor lead frames, and more particularly to capacitor lead frames for one or more capacitors in a power converter for an electric vehicle. Inverters, such as those used to drive motors in electric vehicles, for example, are responsible for converting high voltage direct current (HVDC) to alternating current (AC) to drive the motor. A three-phase inverter can include a bridge with six power device switches (e.g., power transistors, such as IGBTs or MOSFETs) that are controlled by pulse width modulation (PWM) signals generated by a controller. The inverter can include three half-H-bridge switches to control phase voltages, upper and lower gate drivers to control the switches, a PWM controller, and glue logic between the PWM controller and the gate drivers. The PWM controller can generate signals to define the intended state of the system. The gate drivers can send the signals from the PWM controller to the half-H-bridge switches. The half-H-bridge switches can drive the phase voltages. Six-phase (or other phase) inverters, chargers, DC-DC converters, and / or multi-level inverters are not excluded from this concept, and similar principles will be followed. The present disclosure refers to inverters as example embodiments of power converters. For example, the power converter can include a charger, an inverter, or a DC-DC converter.

[0046] High voltage (HV) products, such as inverters, have high voltage direct current (HVDC) inputs that use electromagnetic compatibility (EMC) filters to suppress interference. Capacitors can be used as interference suppression measures for differential noise between the HVDC positive terminal and the HVDC negative terminal of an HV battery. Capacitors can be used as interference suppression measures for common mode noise between all conductors and the ground potential. These capacitors (e.g., X and Y) can be soldered to a printed circuit board (PCB), e.g., a surface mount device (SMD), referred to as an HVDC filter board. The capacitors can be surface mount (SMT) ceramic capacitors (e.g., MOSFETs). A disadvantage of using a PCB in the HVDC filter board can be increased complexity and part count, which can be associated with high cost.

[0047] One or more embodiments can reduce complexity and part count, which can reduce costs associated with using a PCB HVDC filter board by replacing it with a capacitor lead frame. The capacitor lead frame can connect the positive and negative HVDC terminals to the rack inverter ground potential via conductor tracks of a stamped grid, which can be held and secured by a non-conductive carrier. One or more capacitors can be arranged on the connecting conductor tracks to be held and secured in the non-conductive carrier. Electrical connections between the conductor tracks and the one or more capacitors can be achieved using soldering or clamping. Advantages can be that the assembled PCB HVDC filter board can be completely replaced by the capacitor lead frame. Other advantages can include one or more of the following: use of low-cost stick lead capacitors, removal of FR4 PCB material, a larger range of capacitors can be used, soldering can not be needed using clamping connections, simplification of the assembly process at the manufacturing plant, or reduced cost of inverter products for HVDC filter components. Other advantages can include flexibility in the number and size of X and Y capacitors required. Advantages can include flexibility in fastener locations, which can only be achieved by additional soldered copper conductors on the circuit board, especially when fastener locations are at different levels, parallel, or angles.

[0048] Some inverters can include an HVDC positive terminal, an HVDC negative terminal, an HVDC filter board, and a grounded rack. The HVDC filter board can connect the HVDC positive terminal and the HVDC negative terminal to the grounded rack. Some HVDC filter boards can include one or more capacitors, a filter board, a resistor, and a filter. One or more embodiments can provide a capacitor lead frame that does not include a filter board, a resistor, or a filter.

[0049] One or more embodiments can include clamped electrical connections. The clamped electrical connections can include IDT pin connections that also serve as assembly tools. One or more embodiments can include soldered electrical connections. The soldered electrical connections can include simplified soldering of capacitor lead frames, carriers, and / or leads.

[0050] Figure 1An exemplary system infrastructure for a vehicle including a power converter is depicted in accordance with one or more embodiments. The power converter 100 can be a combined inverter and converter. Alternatively, the inverter can be an inverter without a converter. In the context of this disclosure, a battery charger, an inverter, a converter, or any combination thereof can be referred to as a power converter 100. The electric vehicle 185 can include the power converter 100, a motor 190, and a battery 140. The power converter 100 can include components for receiving electrical power from an external source and outputting electrical power to charge the battery 140 of the electric vehicle 185. For example, the power converter 100 can convert DC power from the battery 140 in the electric vehicle 185 to AC power to drive the motor 190 of the electric vehicle 185, although embodiments are not limited thereto. For example, the power converter 100 can include components for receiving electrical power from an external source and outputting electrical power to charge the battery 140 without a motor 190 connected to the power converter 100. The power converter 100 can convert DC power from the battery 140 in the electric vehicle 185 to AC power to drive AC components other than the motor 190 of the electric vehicle 185. For example, the power converter 100 can be bidirectional and can convert DC power to AC power or AC power to DC power, such as during regenerative braking. The power converter 100 can be a three-phase inverter, a single-phase inverter, or a multi-phase inverter.

[0051] Figure 2 An exemplary system infrastructure for a power converter is depicted in accordance with one or more embodiments. For example, the power converter 100 can be used to convert DC power from a battery in an electric vehicle 185 to AC power to drive a motor 190 of the electric vehicle 185, although embodiments are not limited thereto. Additionally, the power converter 100 can be bidirectional and used to convert DC power to AC power or AC power to DC power.

[0052] The power converter 100 can be connected to the battery 140 and the motor 190. The power converter 100 can include an upper phase switch 244 and a lower phase switch 248. A first phase (ΦΑ) can include switches Q1 and Q4, a second phase (ΦΒ) can include switches Q3 and Q6, and a third phase (ΦΟ) can include switches Q5 and Q2. The upper phase switch 244 can include a first phase switch Q1, a second phase switch Q3, and a third phase switch Q5. The lower phase switch 248 can include a first phase switch Q4, a second phase switch Q6, and a third phase switch Q2. For example, the switches Q1-Q6 can be metal oxide semiconductor field effect transistors (MOSFETs), although embodiments are not limited thereto.

[0053] The upper phase switch 244 and the lower phase switch 248 can be driven by pulse width modulation (PWM) signals generated by a controller (not shown) to convert the DC power delivered via the set of input terminals 285 at the bulk capacitor 230 to three-phase AC power at the outputs U, V, and W (associated with phases A, B, and C, respectively) to the motor 190 via the set of output terminals 295. Additionally, although Figure 2 A three-phase inverter is depicted, but the present disclosure is not limited thereto and can include single-phase or multi-phase or multi-level inverters.

[0054] Figure 3 An example power converter with a capacitor lead frame assembly is depicted in accordance with one or more embodiments. For example, the power converter 300 can be related to the power converter 100. The power converter 300 can include a chassis 315, a positive connector 305, a negative connector 310, and a capacitor lead frame 350.

[0055] For example, the chassis 315 can be a housing for the power converter 300. The chassis 315 can be an electrical ground for one or more power converters in the power converter 300, the battery 140, or the electric vehicle 185. For example, the positive connector 305 can be a connection for a positive terminal of the battery 140. For example, the negative connector 310 can be a connection for a negative terminal of the battery 140. The capacitor lead frame 350 can include one or more capacitors for the power converter 300. For example, the one or more capacitors can suppress differential noise between the positive terminal of the battery 140 and the negative terminal of the battery 140. For example, the one or more capacitors can suppress common mode noise between one or more conductors and a ground.

[0056] The capacitor lead frame 350 can include one or more leads extending in an outward direction from a carrier of the capacitor lead frame 350. For example, the capacitor lead frame 350 can include a first lead 361 to connect to the chassis 315, a second lead 362 to connect to the chassis 315, a third lead 363 to connect to the positive connector 305, and a fourth lead 364 to connect to the negative connector 310. However, the present disclosure is not limited to four leads, and the capacitor lead frame 350 can include one or more leads, such as three leads or, for example, eight leads.

[0057] Figure 4A An isometric view of a capacitor lead frame assembly with a cover is depicted in accordance with one or more embodiments. For example, the capacitor lead frame 450 can be related to the capacitor lead frame 350. As Figure 4DAs depicted, the power converter 400 can include a chassis 415, a positive connector 405, a negative connector 410, and a capacitor leadframe 450. The capacitor leadframe 450 can include a first lead 461 to connect to the chassis 415, a second lead 462 to connect to the chassis 415, a third lead 463 to connect to the positive connector 405, and a fourth lead 464 to connect to the negative connector 410.

[0058] Figure 4B A top view of a capacitor leadframe assembly with a cover is depicted in accordance with one or more embodiments. As depicted, the capacitor leadframe assembly can include a first lead 461, a second lead 462, a third lead 463, and a fourth lead 464. The capacitor leadframe assembly can include a cover 470, a carrier 475, a first capacitor 481, and a second capacitor 482. Figure 4B As depicted, the first lead 461, the second lead 462, the third lead 463, and the fourth lead 464 can be arranged to mount to corresponding terminals of a power converter 400. For example, each of the first lead 461, the second lead 462, the third lead 463, and the fourth lead 464 can be, for example, a ring terminal connector. However, the present disclosure is not so limited. Each of the first lead 461, the second lead 462, the third lead 463, and the fourth lead 464 can be a fork terminal, a spade terminal, or other connector type. The first lead 461, the second lead 462, the third lead 463, and the fourth lead 464 can each be the same connector type, or can be different connector types. For example, the first lead 461 and the second lead 462 can be ring terminal connectors, and the third lead 463 and the fourth lead 464 can be spade terminal connectors.

[0059] Figure 4C An exploded view of a capacitor leadframe assembly with a cover is depicted in accordance with one or more embodiments. The capacitor leadframe 450 can include a cover 470, a carrier 475, a first lead 461, a second lead 462, a third lead 463, and a fourth lead 464. The capacitor leadframe 450 can include (or enclose) a first capacitor 481 and a second capacitor 482. As depicted, the first capacitor 481 and the second capacitor 482 can be mounted horizontally in the capacitor leadframe 450. However, the present disclosure is not so limited. Figure 4C As depicted, the first lead 461, the second lead 462, the third lead 463, and the fourth lead 464 can be arranged to mount to corresponding terminals of a power converter 400. For example, each of the first lead 461, the second lead 462, the third lead 463, and the fourth lead 464 can be, for example, a ring terminal connector. However, the present disclosure is not so limited. Each of the first lead 461, the second lead 462, the third lead 463, and the fourth lead 464 can be a fork terminal, a spade terminal, or other connector type. The first lead 461, the second lead 462, the third lead 463, and the fourth lead 464 can each be the same connector type, or can be different connector types. For example, the first lead 461 and the second lead 462 can be ring terminal connectors, and the third lead 463 and the fourth lead 464 can be spade terminal connectors.

[0060] Capacitor lead frame 450 can include electrical connections (e.g., insulation displacement technology pin connections) to receive first capacitor 481 and second capacitor 482 and to connect first capacitor 481 and second capacitor 482 to first lead 461, second lead 462, third lead 463, and fourth lead 464 as needed. One or more of carrier 475 or cover 470 can be configured to support first capacitor 481 and second capacitor 482 within carrier 475. First capacitor 481 and second capacitor 482 can be disposed between cover 470 and carrier 475. Capacitor lead frame 450 can include physical connections to secure first capacitor 481 and second capacitor 482 in place. The physical connections can be in one or more of cover 470 or carrier 475. Cover 470 can be assembled to carrier 475 using snap connections, squeeze connections, clamp connections, or other components.

[0061] Figure 4D An example power converter having a capacitor lead frame assembly with a cover is depicted in accordance with one or more embodiments. Power converter 400 can include chassis 415, positive connector 405, negative connector 410, and capacitor lead frame 450. Power converter 400 can be related to power converter 300. Chassis 415, positive connector 405, negative connector 410, and capacitor lead frame 450 can be related to chassis 315, positive connector 305, negative connector 310, and capacitor lead frame 350, respectively.

[0062] Figure 5A An isometric view of a soldered capacitor lead frame assembly is depicted in accordance with one or more embodiments. For example, capacitor lead frame 550 can be related to capacitor lead frame 350. As Figure 5D Depicted, power converter 500 can include chassis 515, positive connector 505, negative connector 510, and capacitor lead frame 550. Capacitor lead frame 550 can include first lead 561 to connect to chassis 515, second lead 562 to connect to chassis 515, third lead 563 to connect to positive connector 505, and fourth lead 564 to connect to negative connector 510.

[0063] Figure 5B A top view of a soldered capacitor lead frame assembly is depicted in accordance with one or more embodiments. As Figure 5BAs depicted, the first lead 561, the second lead 562, the third lead 563, and the fourth lead 564 can be arranged to mount to corresponding terminals of the power converter 500. For example, each of the first lead 561, the second lead 562, the third lead 563, and the fourth lead 564 can be, for example, a ring terminal connector. However, the present disclosure is not so limited. Each of the first lead 561, the second lead 562, the third lead 563, and the fourth lead 564 can be a fork terminal, a shovel terminal, or other connector type. Each of the first lead 561, the second lead 562, the third lead 563, and the fourth lead 564 can be the same connector type, or can be different connector types. For example, the first lead 561 and the second lead 562 can be ring terminal connectors, and the third lead 563 and the fourth lead 564 can be shovel terminal connectors.

[0064] Figure 5C An exploded view of a soldered capacitor lead frame assembly is depicted in accordance with one or more embodiments. The capacitor lead frame 550 can include a carrier 575, a first lead 561, a second lead 562, a third lead 563, and a fourth lead 564. The capacitor lead frame 550 can include (or enclose) a first capacitor 581 and a second capacitor 582. As depicted, the first capacitor 581 and the second capacitor 582 can be mounted vertically in the capacitor lead frame 550. However, the present disclosure is not so limited. Figure 5C As depicted, the first capacitor 581 and the second capacitor 582 can be mounted vertically in the capacitor lead frame 550. However, the present disclosure is not so limited.

[0065] The capacitor lead frame 550 can include electrical connections (e.g., soldered connections) to receive the first capacitor 581 and the second capacitor 582, and to connect the first capacitor 581 and the second capacitor 582 to the first lead 561, the second lead 562, the third lead 563, and the fourth lead 564 as needed. The capacitor lead frame 550 can include physical connections to secure the first capacitor 581 and the second capacitor 582 in place.

[0066] Figure 5D An exemplary power converter having a soldered capacitor lead frame assembly is depicted in accordance with one or more embodiments. The power converter 500 can include a chassis 515, a positive connector 505, a negative connector 510, and a capacitor lead frame 550. The power converter 500 can be related to the power converter 300. The chassis 515, the positive connector 505, the negative connector 510, and the capacitor lead frame 550 can be related to the chassis 315, the positive connector 305, the negative connector 310, and the capacitor lead frame 350, respectively.

[0067] Figure 6AAn example power converter having an XY capacitor lead frame assembly is depicted in accordance with one or more embodiments. For example, the capacitor lead frame 650 can be related to the capacitor lead frame 350. The power converter 600 can include a chassis 615, a positive connector 605, a negative connector 610, and a capacitor lead frame 650. The capacitor lead frame 650 can include a first lead 661 to connect to the chassis 615, a second lead 662 to connect to the chassis 615, a third lead 663 to connect to the positive connector 605, and a fourth lead 664 to connect to the negative connector 610.

[0068] Figure 6B An XY capacitor lead frame is depicted in accordance with one or more embodiments. As Figure 6B depicted, the first lead 661, the second lead 662, the third lead 663, and the fourth lead 664 can be arranged to mount to corresponding terminals of the power converter 600. For example, each of the first lead 661, the second lead 662, the third lead 663, and the fourth lead 664 can be, for example, a ring terminal connector. However, the present disclosure is not so limited. Each of the first lead 661, the second lead 662, the third lead 663, and the fourth lead 664 can be a fork terminal, a spade terminal, or other connector type. Each of the first lead 661, the second lead 662, the third lead 663, and the fourth lead 664 can be the same connector type, or can be different connector types. For example, the first lead 661 and the second lead 662 can be ring terminal connectors, and the third lead 663 and the fourth lead 664 can be spade terminal connectors.

[0069] Figure 6C An exploded view of an XY capacitor lead frame assembly is depicted in accordance with one or more embodiments. The capacitor lead frame 650 can include a carrier 675, a first lead 661, a second lead 662, a third lead 663, and a fourth lead 664. The capacitor lead frame 650 can include a first capacitor 681, a second capacitor 682, and a third capacitor 683. As Figure 6C depicted, the first capacitor 681 and the second capacitor 682 can be mounted horizontally in the capacitor lead frame 650 between the carrier 675 and the third capacitor 683. However, the present disclosure is not so limited.

[0070] The capacitor lead frame 650 can include electrical connections (e.g., soldered connections) to receive the first capacitor 681 and the second capacitor 682 and to connect the first capacitor 681 and the second capacitor 682 to the first lead 661, the second lead 662, the third lead 663, and the fourth lead 664 as needed. The capacitor lead frame 650 can include physical connections to secure the first capacitor 681, the second capacitor 682, and the third capacitor 683 in place.

[0071] One or more embodiments can reduce complexity and part count, which can reduce costs associated with using a PCB HVDC filter board by replacing the HVDC filter board with a capacitor lead frame. The capacitor lead frame can connect the positive and negative HVDC terminals to the rack inverter ground potential via conductor tracks of a stamped grid, which can be held and secured by a non-conductive carrier. One or more capacitors can be arranged on the connecting conductor tracks to be held and secured in the non-conductive carrier. Electrical connections between the conductor tracks and the one or more capacitors can be achieved using soldering or clamping. Advantages can be that the assembled PCB HVDC filter board can be completely replaced by the capacitor lead frame. Other advantages can include one or more of the following: use of low-cost bar lead capacitors, removal of FR4 PCB material, a larger range of capacitors can be used, soldering can not be needed using clamping connections, simplification of the assembly process at the manufacturing plant, or reduced cost of inverter products for HVDC filter components. Other advantages can include flexibility in the number and size of X and Y capacitors required.

[0072] Some inverters can include an HVDC positive terminal, an HVDC negative terminal, an HVDC filter board, and a grounded rack. The HVDC filter board can connect the HVDC positive terminal and the HVDC negative terminal to the grounded rack. Some HVDC filter boards can include one or more capacitors, a filter board, a resistor, and a filter. One or more embodiments can provide a capacitor lead frame that does not include a filter board, a resistor, or a filter.

[0073] One or more embodiments can include clamped electrical connections. The clamped electrical connections can include IDT pin connections that also serve as assembly tools. One or more embodiments can include soldered electrical connections. The soldered electrical connections can include simplified soldering of capacitor lead frames, carriers, and / or leads.

[0074] Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the application disclosed herein. The specification and examples are intended to be exemplary only and not exhaustive in their description of the true scope and spirit of the application.

Claims

1. A system comprising a power converter, the power converter comprising: A capacitor lead frame comprising: one or more capacitors; a carrier supporting the one or more capacitors; a first lead for connecting the one or more capacitors to a first connector; a second lead for connecting the one or more capacitors to a second connector; and One or more third leads are used to connect the one or more capacitors to a ground connector. 2 . The system of claim 1 , wherein the one or more capacitors are configured to filter noise between a positive terminal of a battery and a negative terminal of the battery. 3 . The system of claim 1 , wherein the one or more capacitors are configured to filter noise between a conductor and ground. 4 . The system of claim 1 , wherein the first lead, the second lead, and the one or more third leads extend in an outward direction from the carrier. 5 . The system of claim 1 , wherein the first lead, the second lead, and the one or more third leads are connected via one or more of pins, clips, or solder.

6. The system of claim 1, wherein the capacitor lead frame further comprises a cover.

7. The system of claim 1, wherein the first connector is for a positive terminal of a power supply and the second connector is for a negative terminal of the power supply.

8. The system of claim 1, further comprising: a battery configured to provide DC power to the power converter; as well as A motor is configured to receive AC power from the power converter to drive the motor, wherein the system is provided as a vehicle including the power converter, the battery, and the motor.

9. A capacitor lead frame for a power converter, comprising: a carrier for one or more capacitors; a first lead for connecting the one or more capacitors to a first connector; a second lead for connecting the one or more capacitors to a second connector; as well as One or more third leads are used to connect the one or more capacitors to a ground connector.

10. The capacitor lead frame of claim 9, wherein the first connector is for a positive terminal of a power source, and the second connector is for a negative terminal of the power source. 11 . The capacitor lead frame of claim 9 , wherein the capacitor lead frame further comprises a cover for connecting to the carrier. 12 . The capacitor lead frame of claim 11 , wherein one or more of the cover or the carrier is configured to support the one or more capacitors. 13 . The capacitor lead frame of claim 9 , wherein the first lead, the second lead, and the one or more third leads extend from the carrier.

14. The capacitor lead frame of claim 9, wherein the one or more capacitors comprise: one or more first capacitors for suppressing noise between the first connector and the second connector; and one or more second capacitors for suppressing noise between the conductor and the ground connector. 15 . The capacitor lead frame of claim 14 , wherein the one or more first capacitors are configured to be arranged between the one or more second capacitors and the carrier.

16. A capacitor lead frame assembly comprising: one or more capacitors; a carrier for the one or more capacitors; a first lead extending from the carrier to electrically connect the one or more capacitors to a first connector; a second lead extending from the carrier to electrically connect the one or more capacitors to a second connector; as well as One or more third leads extend from the carrier to electrically connect the one or more capacitors to a ground connector.

17. The capacitor lead frame assembly of claim 16, further comprising: A cover is connected to the carrier, wherein the one or more capacitors are arranged horizontally in the carrier between the carrier and the cover.

18. The capacitor leadframe assembly of claim 16, wherein the one or more capacitors are arranged vertically in the carrier.

19. The capacitor leadframe assembly of claim 16, wherein the one or more capacitors comprise: a first capacitor and a second capacitor configured to filter common mode noise to the ground connector; as well as The third capacitor is used to filter differential noise between the first connector and the second connector. 20 . The capacitor leadframe assembly of claim 19 , wherein the first capacitor and the second capacitor are disposed between the third capacitor and the carrier.

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