A tin ball preparation device for soldering

Abstract

The application relates to the technical field of welding, in particular to a tin ball preparation device for soft soldering, which comprises a ball storage tank body with a higher installation seat position than a tin ball separating device, a tin ball conveying shaft is sealingly and slidably connected in the tin ball storage tank body, a tin ball conveying channel is arranged in the center of the tin ball conveying shaft, a ball dropping hose is sealingly and fixedly connected to the lower end of the tin ball conveying shaft, a gas pipe connecting sleeve is sealingly and fixedly connected to the end of the ball dropping hose away from the tin ball conveying shaft, the gas pipe connecting sleeve is fixedly connected to the tin ball separating device, and the gas pipe connecting sleeve is communicated with a ball storage groove of the tin ball separating device. Through the synergistic effect of multiple structures, automatic and continuous supply of tin balls is finally realized, the problem of limited storage capacity of a ball storage bin in an existing tin ball separating device is overcome, the efficiency and stability of feeding of tin balls with large volume in a long-time welding process are guaranteed, and the demand of soft soldering for tin ball supply is met.

Description

Technical Field

[0001] This invention relates to the field of welding technology, and more specifically to a solder ball preparation device for soft soldering. Background Technology

[0002] Microelectronic soldering technology mainly refers to the connection technology used in the miniaturization design and manufacturing process of electronic components and circuits. Microelectronic soldering serves two purposes when joining two materials: firstly, to achieve good electrical conductivity, and secondly, to obtain durable and reliable mechanical connection strength. The primary technique used in microelectronic soldering is soft soldering. Soft soldering is a commonly used connection technology in fields such as electronics manufacturing and precision machining.

[0003] Chinese invention patent CN119035697B discloses a solder ball separation device for soft soldering. The device has a solder ball storage chamber fixedly mounted on the separation mechanism mounting plate, which is sealed and connected to a solder ball storage tank. The inside of the storage chamber is used to fill solder balls, and a cover is sealed to the end of the storage chamber away from the separation mechanism mounting plate. In use, the cover needs to be manually opened before adding solder balls to the storage chamber. However, the space inside the storage chamber is limited, especially when the volume of the solder balls increases, further limiting the number of solder balls that can be stored, making it difficult to meet the needs of long-term soldering, thus affecting the feeding efficiency and effect.

[0004] Therefore, how to achieve automatic and continuous replenishment of solder balls to expand the solder ball storage capacity, reduce the frequency of manual replenishment, and ensure that the feeding requirements for long-term soldering can be met even when the solder ball volume is large, thereby improving feeding efficiency and stability, is a problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] To overcome the shortcomings of existing solder ball separation devices, such as limited storage capacity of the ball storage bin, further limiting the storage quantity as the volume of solder balls increases, requiring frequent manual opening of the bin cover to add solder balls, making it difficult to meet the needs of long-term soldering and affecting feeding efficiency and effect, this application provides a solder ball preparation device for soft soldering. This device aims to achieve automatic and continuous replenishment of solder balls, expand storage capacity, reduce manual operation, and ensure the high efficiency and stability of feeding larger solder balls during long-term soldering.

[0006] The solder ball preparation device for soft soldering provided in this application adopts the following technical solution:

[0007] A solder ball preparation device for soft soldering includes a mounting base higher than the mounting position of a solder ball separation device. A solder ball storage tank for storing solder balls is fixedly mounted on the mounting base. A tank lid is detachably and sealingly connected to the top of the solder ball storage tank. A solder ball conveying shaft passing through the bottom of the tank is slidably and sealingly connected inside the tank. A solder ball conveying channel is formed at the center of the solder ball conveying shaft, passing through the lower end of the shaft. A ball dropping hose is fixedly and sealingly connected to the lower end of the shaft. An air pipe connecting sleeve is fixedly and sealingly connected to the end of the hose away from the shaft, and connected to the solder ball separation device. The air pipe connecting sleeve communicates with the ball storage tank of the solder ball separation device. A solder ball input hole is formed on the outer side of the conveying shaft corresponding to the solder ball, and communicates with the conveying channel. A drive assembly connected to the conveying shaft is mounted on the mounting base.

[0008] By adopting the above technical solution, and utilizing the design of the mounting base being higher than the solder ball separation device, gravity-assisted solder ball conveying can be achieved, reducing resistance and blockage. The externally connected ball storage tank helps increase the storage capacity of solder balls, reducing the frequency of manual replenishment. Combined with the sealed tank lid, it facilitates solder ball replenishment and ensures solder ball quality through a sealing structure. Simultaneously, the drive component drives the solder ball conveyor shaft to slide back and forth, precisely controlling the connection between the solder ball input hole and the ball storage tank, achieving intermittent solder ball conveying and preventing irregular entry of solder balls into the channel, thus avoiding blockage. The guide component ensures the smoothness and accuracy of the solder ball conveyor shaft's movement, further improving the reliability of the conveying process. This achieves automatic, continuous, and stable solder ball replenishment, improving feeding efficiency and stability, reducing manual operation intensity, and meeting the high-efficiency and reliable solder ball supply requirements for soft soldering in fields such as electronics manufacturing.

[0009] Furthermore, the drive assembly includes a drive motor, which is fixedly mounted on the mounting base. A cam disk is fixedly mounted on the output shaft of the drive motor. A crank is hinged to the cam disk. A drive frame is hinged to the end of the crank away from the cam disk. The drive frame is fixedly mounted on the outer side of the solder ball conveying shaft near its lower end.

[0010] By adopting the above technical solution, the rotational motion of the motor is converted into the reciprocating linear motion of the solder ball conveying shaft by utilizing the continuous and stable power provided by the drive motor and the synergistic effect of the cam plate, crank, and drive frame. This allows for precise control of the connection and disconnection between the solder ball inlet and the inside of the ball storage tank, enabling intermittent solder ball delivery. This ensures the continuity of solder ball supply to meet long-term soldering requirements while preventing excessive solder balls from entering the channel and causing blockages, effectively improving the stability and reliability of solder ball delivery.

[0011] Furthermore, a guide component is installed on the mounting base in cooperation with the drive component. The guide component includes a guide shaft fixedly installed on the mounting base. The guide shaft is arranged parallel to the solder ball conveying shaft. A guide hole is opened on the drive frame corresponding to the guide shaft. The guide shaft is slidably connected to the drive frame through the guide hole. A sliding groove is opened on the mounting base corresponding to the drive frame.

[0012] By adopting the above technical solution, the cooperation between the guide shaft and the guide hole ensures that the drive frame can only move in a straight line in a direction parallel to the solder ball conveying shaft, avoiding deviation or shaking of the drive frame during movement. The sliding groove further enhances this guiding effect, making the movement of the drive frame driving the solder ball conveying shaft more stable and precise. This ensures that the connection and disconnection between the solder ball input hole and the inside of the ball storage tank are more reliable, reducing solder ball conveying failures caused by movement deviations and improving the operational stability of the entire device.

[0013] Furthermore, a pressure assembly is provided at the bottom of the ball storage tank corresponding to the solder ball conveying shaft. The pressure assembly includes a piston chamber opened at the bottom of the ball storage tank. A piston body is slidably connected inside the piston chamber. The piston body is fixedly mounted on the solder ball conveying shaft. An air inlet mechanism is provided on the ball storage tank, and an exhaust mechanism is provided on the air pipe connecting sleeve.

[0014] By adopting the above technical solution, the air compressor assembly generates airflow through the reciprocating motion of the solder ball conveyor shaft. This airflow propels the solder balls within the conveying channel and drop hose, assisting in solder ball transport. Especially when the solder balls lack sufficient gravity, this effectively prevents jamming and improves transport smoothness. Simultaneously, the airflow cleans the transport path, reducing the impact of impurities on solder ball transport and further ensuring feeding efficiency and stability. Furthermore, the air compressor assembly is driven by the movement of the solder ball conveyor shaft, eliminating the need for an additional power source and saving energy and equipment space.

[0015] Furthermore, the air intake mechanism includes an air intake hole, which is located on the side wall of the ball storage tank near the top of the piston chamber. A first spring is fixedly installed inside the air intake hole at one end near the piston chamber, and an air intake ring is fixedly installed inside the air intake hole at the other end away from the piston chamber. A first valve body is abutting and connected inside the air intake hole between the air intake ring and the first spring, and the first valve body closes the air intake ring.

[0016] By adopting the above technical solution, the automatic opening and closing of the air inlet is achieved through the cooperation of the first valve body, the first spring, and the air inlet ring. This ensures that external gas can be smoothly drawn in when the piston body slides down and that the air inlet channel is effectively closed when it slides up, ensuring that all the gas in the piston chamber can enter the solder ball conveying path to form a driving airflow, thereby improving the working efficiency of the air compression assembly. This automatic control method requires no additional operation, responds quickly, and can be precisely coordinated with the movement of the piston body, further enhancing the stability of the airflow-assisted conveying of solder balls. At the same time, the structure is simple, the reliability is high, and the risk of device failure is reduced.

[0017] Furthermore, the exhaust mechanism includes an exhaust port, which is opened on the side wall of the air pipe connecting sleeve. An exhaust ring is fixedly installed at one end of the exhaust port near the outer surface of the air pipe connecting sleeve. A second spring is fixedly installed at one end of the exhaust ring located inside the exhaust port. A second valve body is connected to the end of the second spring away from the exhaust ring, and the second valve body closes the exhaust port.

[0018] By adopting the above technical solution, the automatic opening and closing of the exhaust port is achieved through the cooperation of the second valve body, the first spring, and the exhaust ring. This allows for timely exhaust when the air pressure inside the air pipe connection sleeve reaches a certain value, preventing excessively high air pressure from affecting solder ball delivery and preventing backflow of external gas when the air pressure is too low. This automatic adjustment method works in conjunction with the air compression component to ensure stable air pressure within the solder ball delivery path, further improving the smoothness and stability of solder ball delivery. Moreover, the structure is simple, requires no additional control, has high reliability, and reduces maintenance costs.

[0019] Furthermore, an agitation assembly is connected to the top of the solder ball conveying shaft. The agitation assembly includes a drive shaft, which is fixedly installed on the top of the solder ball conveying shaft. A drive groove arranged in a spiral pattern is opened on the outer surface of the drive shaft. An agitation frame is fitted onto the drive shaft. The agitation frame is rotatably connected inside the ball storage tank. A limit block is fixedly connected to the agitation frame corresponding to the drive groove. The limit block is slidably connected to the drive groove. An agitation rod is fixedly installed on the agitation frame.

[0020] By adopting the above technical solution, the reciprocating motion of the solder ball conveying shaft can realize the rotation of the agitator, eliminating the need for an additional power source and saving energy and space. The rotation of the agitator prevents solder balls from accumulating and clumping in the ball storage tank, keeping the solder balls in a loose state, making them easier to enter the solder ball inlet hole and reducing feeding problems caused by solder ball accumulation. At the same time, agitation also allows the solder balls to be more evenly distributed in the tank, ensuring a continuous and stable supply of solder balls from the solder ball inlet hole, further improving the feeding stability and reliability of the material preparation device. Working in conjunction with other components, it guarantees a supply of solder balls for long-term soldering.

[0021] Furthermore, the ball-dropping hose is made of a flexible transparent material, the diameter of the solder ball is d, and the inner diameter of the ball-dropping hose is D, satisfying: d > D > d.

[0022] By adopting the above technical solutions, the elastic material ensures the smoothness of solder ball conveying and avoids jamming; the specific inner diameter effectively prevents multiple solder balls from passing through at the same time and causing blockage, ensuring the orderliness and stability of feeding; the transparent material makes it easy for operators to monitor the solder ball conveying status in real time, promptly detect and handle abnormal situations, and further improve the reliability and maintainability of the device operation.

[0023] Furthermore, the solder ball input hole is tapered and angled, with a maximum diameter of D and a minimum diameter of D, satisfying: D < d, D > d.

[0024] By adopting the above technical solution, the tapered and oblique design of the solder ball input hole helps to improve the smoothness of the solder ball entering the input hole and reduce the phenomenon of ball jamming; the size limitation ensures that the solder ball enters the conveying channel one by one, further preventing channel blockage and maintaining the orderliness and stability of solder ball conveying. Together with the design of the ball drop hose, it improves the feeding efficiency and reliability of the entire material preparation device.

[0025] Furthermore, a first sealing ring mounting groove is provided on the top surface of the spherical storage tank corresponding to the inner bottom surface of the tank cover, and a second sealing ring mounting groove is provided on the outer surface of the spherical storage tank corresponding to the inner side surface of the tank cover. A first sealing ring is fixedly installed inside the first sealing ring mounting groove, and a second sealing ring is fixedly installed inside the second sealing ring mounting groove.

[0026] By adopting the above technical solution and utilizing the dual sealing structure of the first and second sealing rings, the sealing performance of the spool tank can be effectively enhanced, preventing external dust and moisture from entering the tank and contaminating the solder balls, thus ensuring the quality of the solder balls. It also prevents the solder balls from becoming damp inside the tank and affecting transportation, and provides a sealed environment for the compressed air assembly, further improving the reliability of the device. Furthermore, the sealing ring mounting groove helps to fix the sealing ring, preventing displacement during closing or disassembly, and ensuring the stability of the sealing effect.

[0027] Beneficial effects achieved:

[0028] This application effectively expands the solder ball storage capacity and reduces the frequency of manual replenishment by setting up an installation base higher than the solder ball separation device and a large-capacity solder ball storage tank, coupled with a removable sealing tank cover, thus overcoming the limitation of limited capacity in traditional solder ball storage bins. The drive and guide components drive the precise reciprocating motion of the solder ball conveying shaft, combined with a tapered, angled solder ball inlet and a specially sized elastic transparent drop tube, enabling the orderly intermittent delivery of larger solder balls. The airflow generated by the compressed air component assists in the movement of the solder balls, while the agitation component prevents solder ball accumulation. Through the synergistic effect of multiple structures, automatic and continuous replenishment of solder balls is ultimately achieved, overcoming the problem of limited storage capacity in existing solder ball separation devices. This ensures the high efficiency and stability of feeding larger solder balls during long-term soldering processes, meeting the solder ball supply requirements of soft soldering. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the overall installation structure according to one embodiment of this application.

[0030] Figure 2 This is a three-dimensional structural schematic diagram of one embodiment of this application.

[0031] Figure 3 This is a structural exploded view of one embodiment of this application.

[0032] Figure 4 This is a schematic diagram of the internal structure of the spherical storage tank in one embodiment of this application.

[0033] Figure 5 This is a schematic diagram of the installation structure of the driving component in one embodiment of this application.

[0034] Figure 6 yes Figure 4 Enlarged schematic diagram of Part I of the structure.

[0035] Figure 7 yes Figure 4 Enlarged schematic diagram of Part II of the structure.

[0036] Figure 8 This is a schematic diagram of the internal structure of the tracheal connector sleeve in one embodiment of this application.

[0037] Figure 9 This is an exploded view of the agitation component in one embodiment of this application.

[0038] Figure 10 This is a schematic diagram of the installation structure of the agitation component in one embodiment of this application.

[0039] Explanation of reference numerals in the attached drawings: 100, Solder ball separator; 101, Mounting base; 102, Ball storage tank; 103, Tank cover; 104, Solder ball conveying shaft; 105, Solder ball conveying channel; 106, Ball drop hose; 107, Air pipe connecting sleeve; 108, Solder ball inlet hole; 109, First sealing ring mounting groove; 110, Second sealing ring mounting groove; 111, First sealing ring; 112, Second sealing ring; 200, Drive assembly; 201, Drive motor; 202, Cam plate; 203, Crank; 204, Drive frame; 300, Guide assembly; 301, Guide shaft; 3 02. Guide hole; 303. Sliding groove; 400. Air compression assembly; 401. Piston chamber; 402. Piston body; 403. Air intake mechanism; 4031. Air intake hole; 4032. First spring; 4033. Air intake ring; 4034. First valve body; 404. Exhaust mechanism; 4041. Exhaust hole; 4042. Exhaust ring; 4043. Second spring; 4044. Second valve body; 500. Stirring assembly; 501. Drive shaft; 502. Drive groove; 503. Stirring frame; 504. Limiting block; 505. Stirring rod; 600. Solder ball; 601. Ball storage tank. Detailed Implementation

[0040] The following is in conjunction with the appendix Figures 1-10 This application will be described in further detail.

[0041] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0042] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0043] This application discloses a solder ball preparation device for soft soldering.

[0044] Example 1

[0045] Please refer to the above as well. Figures 1 to 8In one embodiment of this application, a solder ball preparation device for soft soldering includes a mounting base 101. Both the mounting base 101 and the solder ball separating device 100 are fixedly mounted on the Z-axis moving mechanism of a soft soldering equipment. The mounting base 101 is positioned higher than the solder ball separating device 100. The mounting base 101 serves as the basic load-bearing structure of the entire device, providing mounting references and support points for each component; ensuring the installation stability and relative positional accuracy of each component, and guaranteeing the overall structural stability. Simultaneously, the height difference between the mounting base 101 and the solder ball separating device 100 generates gravitational potential energy, assisting the solder balls 600 in moving downwards by their own weight during transport, reducing resistance during transport, lowering the probability of blockage during transport, and improving transport efficiency.

[0046] Please refer to the above as well. Figures 1 to 8 In one embodiment of this application, a solder ball storage tank 102 for storing solder balls 600 is fixedly installed on the mounting base 101. As a large-capacity storage container, the solder ball storage tank 102 can hold a large number of solder balls 600, continuously supplying material to the solder ball separation device 100; compared with traditional solder ball storage bins, it significantly increases the storage capacity of solder balls 600, reduces the frequency of manual addition of solder balls 600, and meets the material supply requirements for long-term soldering.

[0047] Please refer to the above as well. Figures 1 to 8 In one specific embodiment of this application, a can lid 103 is detachably and sealed to the top of the ball storage tank 102. The can lid 103 is detachably connected to the top of the ball storage tank 102, making it convenient to open the can lid and add solder balls 600 into the ball storage tank 102.

[0048] Please refer to the above as well. Figures 1 to 8 In one embodiment of this application, a solder ball conveying shaft 104 passing through the bottom of the ball storage tank 102 is internally sealed and slidably connected. The solder ball conveying shaft 104 can slide axially within the ball storage tank 102, ensuring the airtightness of the ball storage tank 102 and changing its own position through sliding; the sealing design prevents the solder balls 600 from getting damp or contaminated by the outside.

[0049] Please refer to the above as well. Figures 1 to 8 In one embodiment of this application, a solder ball conveying channel 105 is provided at the center of the solder ball conveying shaft 104. The solder ball conveying channel 105 is the path for conveying the solder balls 600 from the ball storage tank 102 to the solder ball separating device 100; it provides a directional conveying channel for the solder balls 600 to ensure the accuracy of the conveying.

[0050] Please refer to the above as well. Figures 1 to 8In one embodiment of this application, the solder ball conveying channel 105 extends through the lower end of the solder ball conveying shaft 104. This allows the solder ball 600 to enter from the upper end of the solder ball conveying channel 105 and exit smoothly from the lower end of the solder ball conveying channel 105; ensuring the continuity of the solder ball conveying channel 105 and ensuring that the solder ball 600 can be completely conveyed through the channel to subsequent components.

[0051] Please refer to the above as well. Figures 1 to 8 In one embodiment of this application, a ball drop hose 106 is fixedly and sealed to the lower end of the solder ball conveying shaft 104. The ball drop hose 106 is flexible and can be flexibly deformed as the solder ball conveying shaft 104 slides. At the same time, the sealed connection ensures the closedness of the solder ball 600 conveying path; it adapts to the movement of the solder ball conveying shaft 104, avoids component damage caused by rigid connection, and prevents the solder ball 600 from leaking during conveying.

[0052] Please refer to the above as well. Figures 1 to 8 In one embodiment of this application, an air pipe connecting sleeve 107 is fixedly and sealed to one end of the ball drop hose 106 away from the solder ball conveying shaft 104. The air pipe connecting sleeve 107 connects the ball drop hose 106 to the solder ball separating device 100, and the sealing design ensures that there are no gaps at the connection; thus achieving a stable connection between the ball drop hose 106 and the solder ball separating device 100, ensuring the continuity of the solder ball 600 conveying path, and preventing external impurities from entering.

[0053] Please refer to the above as well. Figures 1 to 8 In one embodiment of this application, the air tube connecting sleeve 107 is fixedly connected to the solder ball separating device 100. The fixed connection keeps the air tube connecting sleeve 107 and the solder ball separating device 100 relatively stationary; it ensures that the position of the solder ball 600 entering the solder ball separating device 100 from the air tube connecting sleeve 107 is stable, and avoids feeding deviation due to loose connection.

[0054] Please refer to the above as well. Figures 1 to 8 In one embodiment of this application, the air pipe connecting sleeve 107 is connected to the ball storage tank 601 of the solder ball separation device 100, so that the solder balls 600 conveyed by the air pipe connecting sleeve 107 directly enter the ball storage tank 601, thereby realizing the direct supply of solder balls 600 from the material preparation device to the ball storage tank 601 of the solder ball separation device 100 and ensuring the continuity of material supply.

[0055] Please refer to the above as well. Figures 1 to 8In one embodiment of this application, a solder ball inlet hole 108 is provided on the outer side of the solder ball conveying shaft 104 corresponding to the solder ball 600, and the solder ball inlet hole 108 communicates with the solder ball conveying channel 105. The size of the solder ball inlet hole 108 matches the solder ball 600. When the solder ball conveying shaft 104 slides to a specific position, the solder ball 600 in the ball storage tank 102 can enter the solder ball conveying channel 105 through the hole; the timing and number of solder balls 600 entering the conveying channel are precisely controlled to avoid the solder balls 600 entering irregularly and causing channel blockage.

[0056] Please refer to the above as well. Figures 1 to 8 In one specific embodiment of this application, a first sealing ring mounting groove 109 is provided on the top surface of the spherical storage tank 102 corresponding to the inner bottom surface of the tank cover 103, and a second sealing ring mounting groove 110 is provided on the outer side of the spherical storage tank 102 corresponding to the inner side of the tank cover 103. A first sealing ring 111 is fixedly installed inside the first sealing ring mounting groove 109, and a second sealing ring 112 is fixedly installed inside the second sealing ring mounting groove 110.

[0057] During operation, when the tank cover 103 is closed, the first sealing ring 111 is pressed between the top surface of the storage tank 102 and the inner bottom surface of the tank cover 103, and the second sealing ring 112 is pressed between the outer side of the storage tank 102 and the inner side of the tank cover 103. Through the double sealing effect of the two sealing rings, the top of the storage tank 102 is sealed.

[0058] Please refer to the above as well. Figures 1 to 8 In one embodiment of this application, a drive assembly 200, which is connected to the solder ball conveying shaft 104, is mounted on the mounting base 101. The drive assembly 200 provides power to the solder ball conveying shaft 104, causing it to slide axially. By driving the movement of the solder ball conveying shaft 104, the communication state between the solder ball inlet hole 108 and the inside of the ball storage tank 102 is controlled, realizing the intermittent conveying of solder balls 600 and meeting the needs of on-demand feeding.

[0059] Please refer to the above as well. Figures 1 to 8 In one specific embodiment of this application, the drive assembly 200 includes a drive motor 201, which is fixedly mounted on the mounting base 101. A cam disk 202 is fixedly mounted on the output shaft of the drive motor 201. A crank 203 is hingedly connected to the cam disk 202. A drive frame 204 is hingedly connected to the end of the crank 203 away from the cam disk 202. The drive frame 204 is fixedly mounted on the outer side of the solder ball conveying shaft 104 near its lower end.

[0060] During operation, the drive motor 201 serves as a power source. When its output shaft rotates, it drives the cam disk 202, which is fixedly mounted on it, to rotate synchronously. The rotational motion of the cam disk 202 is transmitted to the drive frame 204 through the hinged crank 203. Since the drive frame 204 is fixed to the outside of the solder ball conveying shaft 104, it drives the solder ball conveying shaft 104 to reciprocate and slide in the ball storage tank 102.

[0061] It is understood that in other embodiments of this application, the drive component 200 may also be configured as a linear motor, cam mechanism or other device or mechanism to achieve the purpose of driving the solder ball conveying shaft 104 to reciprocate within the ball storage tank 102.

[0062] Please refer to the above as well. Figures 1 to 8 In one embodiment of this application, a guide component 300 is installed on the mounting base 101 in cooperation with the drive component 200. The guide component 300 restricts and guides the movement direction of the drive component 200, ensuring that it drives the solder ball conveying shaft 104 to slide stably; it improves the stability and accuracy of the operation of the drive component 200, ensures the movement accuracy of the solder ball conveying shaft 104, and thus improves the reliability of the solder ball 600 conveying.

[0063] Please refer to the above as well. Figures 1 to 8 In one specific embodiment of this application, the guide assembly 300 includes a guide shaft 301 fixedly mounted on the mounting base 101. The guide shaft 301 is arranged parallel to the solder ball conveying shaft 104. A guide hole 302 is provided on the drive frame 204 corresponding to the guide shaft 301. The guide shaft 301 is slidably connected to the drive frame 204 through the guide hole 302. A sliding groove 303 is provided on the mounting base 101 corresponding to the drive frame 204.

[0064] During operation, the guide shaft 301 fixed on the mounting base 101 is parallel to the solder ball conveying shaft 104. The drive frame 204 is sleeved on the guide shaft 301 through the guide hole 302. When the drive frame 204 moves under the drive assembly 200, it will slide along the direction of the guide shaft 301. At the same time, the sliding groove 303 on the mounting base 101 further restricts and guides the movement range of the drive frame 204.

[0065] Please refer to the above as well. Figures 1 to 8 In one specific embodiment of this application, the ball drop hose 106 is made of an elastic transparent material, the diameter of the solder ball 600 is d, and the inner diameter of the ball drop hose 106 is D, satisfying: 2d>D>d.

[0066] During operation, the elasticity of the ball drop hose 106 allows it to deform appropriately as the solder balls 600 pass through, so that the position of the ball drop hose 106 can change with the reciprocating motion of the solder ball conveying shaft 104, thereby allowing the solder balls 600 to pass smoothly through the ball drop hose 106. The design of the inner diameter D being between d and 2d limits the number of solder balls 600 passing through at the same time, ensuring that the solder balls 600 are conveyed one by one in an orderly manner, and also helps to avoid the solder balls 600 getting stuck during the conveying process. The transparent material setting allows for a direct observation of the conveying of the internal solder balls 600.

[0067] Please refer to the above as well. Figures 1 to 8 In one specific embodiment of this application, the solder ball inlet hole 108 is arranged in a tapered oblique direction. The maximum diameter of the solder ball inlet hole 108 is D1, and the minimum diameter of the solder ball inlet hole 108 is D2, satisfying: D1 < 2d, D2 > d.

[0068] During operation, the solder ball inlet hole 108 adopts a tapered and inclined structure to guide the solder balls 600 in the ball storage tank 102, making it easier for the solder balls 600 to enter the hole. The maximum diameter D1 of the solder ball inlet hole 108 is less than 2d, which limits the number of solder balls 600 entering the hole at the same time and avoids congestion caused by two or more solder balls passing through side by side. The minimum diameter D2 is greater than d, which ensures that a single solder ball 600 can pass through the hole smoothly and enter the solder ball conveying channel 105.

[0069] Example 2

[0070] Please refer to the above as well. Figures 1 to 8 Based on Embodiment 1, a compressed air assembly 400 is provided at the bottom of the ball storage tank 102 corresponding to the solder ball conveying shaft 104. The compressed air assembly 400 includes a piston chamber 401 opened at the bottom of the ball storage tank 102. A piston body 402 is slidably connected inside the piston chamber 401. The piston body 402 is fixedly fitted on the solder ball conveying shaft 104. An air inlet mechanism 403 is provided on the ball storage tank 102, and an exhaust mechanism 404 is provided on the air pipe connecting sleeve 107.

[0071] During operation, as the solder ball conveying shaft 104 reciprocates under the drive assembly 200, the piston body 402, fixedly mounted on it, slides synchronously within the piston chamber 401 in a sealed manner. When the piston body 402 slides downward, the space within the piston chamber 401 increases, creating a negative pressure. The air intake mechanism 403 opens, allowing external gas to enter the piston chamber 401. When the piston body 402 slides upward, the space within the piston chamber 401 decreases, increasing the air pressure. The air intake mechanism 403 closes, and the gas enters the solder ball conveying channel 105 through the solder ball inlet hole 108, finally being discharged through the exhaust mechanism 404. This creates an airflow along the conveying path to assist in the conveying of the solder balls 600, preventing the solder balls from getting stuck.

[0072] Please refer to the above as well. Figures 1 to 8 In one specific embodiment of this application, the air intake mechanism 403 includes an air intake hole 4031, which is located on the side wall of the ball storage tank 102 near the top of the piston chamber 401. A first spring 4032 is fixedly installed inside the air intake hole 4031 at one end near the piston chamber 401, and an air intake ring 4033 is fixedly installed inside the air intake hole 4031 at the other end away from the piston chamber 401. A first valve body 4034 is abutting and connected inside the air intake hole 4031 between the air intake ring 4033 and the first spring 4032, and the first valve body 4034 closes the air intake ring 4033.

[0073] During operation, when the piston body 402 slides downward and a negative pressure is formed in the piston chamber 401, the external air pressure is greater than the air pressure inside the piston chamber 401. This pushes the first valve body 4034 to compress the first spring 4032 and move it towards the piston chamber 401, causing the first valve body 4034 to separate from the intake ring 4033. The intake port 4031 opens, and external gas enters the piston chamber 401 through the intake ring 4033 and the intake port 4031. When the piston body 402 slides upward and the air pressure inside the piston chamber 401 increases, the gas pressure pushes the first valve body 4034 towards the intake ring 4033. The first spring 4032 rebounds to assist the first valve body 4034 in re-closing the intake ring 4033, and the intake port 4031 closes, preventing the gas in the piston chamber 401 from being discharged from the intake port 4031.

[0074] Please refer to the above as well. Figures 1 to 8 In one specific embodiment of this application, the exhaust mechanism 404 includes an exhaust hole 4041, which is opened on the side wall of the air pipe connecting sleeve 107. An exhaust ring 4042 is fixedly installed at one end of the exhaust hole 4041 near the outer surface of the air pipe connecting sleeve 107. A second spring 4043 is fixedly installed at one end of the exhaust ring 4042 located inside the exhaust hole 4041. A second valve body 4044 is connected to the end of the second spring 4043 away from the exhaust ring 4042. The second valve body 4044 closes the exhaust hole 4041.

[0075] During operation, when the airflow generated by the air compressor 400 enters the air pipe connecting sleeve 107 through the solder ball inlet 108 and the solder ball delivery channel 105, the air pressure inside the air pipe connecting sleeve 107 increases to a certain level. The gas pressure will push the second valve body 4044 to compress the second spring 4043 and move it towards the exhaust ring 4042, causing the second valve body 4044 to separate from the closed part of the exhaust hole 4041. The exhaust hole 4041 opens, and the gas is discharged through the exhaust hole 4041 and the exhaust ring 4042. When the air pressure inside the air pipe connecting sleeve 107 decreases, the second spring 4043 rebounds and pushes the second valve body 4044 to re-close the exhaust hole 4041, preventing external gas from entering from the exhaust hole 4041.

[0076] Example 3

[0077] Please refer to the above as well. Figures 1 to 10 Based on Embodiment 2, an agitation assembly 500 is driven and connected to the top of the solder ball conveying shaft 104. The agitation assembly 500 includes a drive shaft 501, which is fixedly installed on the top of the solder ball conveying shaft 104. A drive groove 502 arranged in a spiral pattern is opened on the outer surface of the drive shaft 501. An agitation frame 503 is fitted on the drive shaft 501. The agitation frame 503 is rotatably connected to the inside of the ball storage tank 102. A limit block 504 is fixedly connected to the agitation frame 503 corresponding to the drive groove 502. The limit block 504 and the drive groove 502 are slidably connected. An agitation rod 505 is fixedly installed on the agitation frame 503.

[0078] During operation, when the solder ball conveying shaft 104 reciprocates linearly under the drive assembly 200, the drive shaft 501 fixed on its top will reciprocate linearly simultaneously. Since the agitator 503 is rotatably connected inside the ball storage tank 102, and the limiting block 504 on it slides in cooperation with the drive groove 502 on the drive shaft 501 which is arranged in a spiral, the reciprocating linear motion of the drive shaft 501 is converted into the rotational motion of the agitator 503 through the interaction between the drive groove 502 and the limiting block 504. This, in turn, drives the agitator rod 505 fixed on the agitator 503 to rotate inside the ball storage tank 102, agitating the solder balls 600 inside the tank.

[0079] The implementation principle of a solder ball preparation device for soft soldering according to an embodiment of this application is as follows:

[0080] This device is supported by the mounting base 101. The ball storage tank 102 stores a large number of solder balls 600. The double sealing structure of the tank cover 103 ensures the quality and sealing conditions of the solder balls. During operation, the drive motor 201 of the drive assembly 200 drives the cam disk 202 to rotate. The rotational motion is converted into the reciprocating sliding of the solder ball conveying shaft 104 via the crank 203 and the drive frame 204. The guide shaft 301 and the sliding groove 303 of the guide assembly 300 ensure smooth and precise movement.

[0081] When the solder ball conveying shaft 104 slides to connect the solder ball inlet hole 108 with the inside of the solder ball storage tank 102, the solder balls 600, aided by gravity and the agitation assembly 500, enter the solder ball conveying channel 105 through the tapered, inclined solder ball inlet hole 108. The agitation assembly 500 drives the agitator 503 to rotate through the reciprocating motion of the drive shaft 501, ensuring uniform distribution of the solder balls and preventing accumulation.

[0082] Solder balls 600 fall along the solder ball conveying channel 105, passing through the flexible transparent ball-falling hose 106 and the air pipe connecting sleeve 107, and enter the ball storage tank 601 of the solder ball separating device 100. At the same time, the reciprocating motion of the solder ball conveying shaft 104 drives the piston body 402 of the air compression assembly 400 to slide within the piston chamber 401, which, in conjunction with the air intake mechanism 403 and the air exhaust mechanism 404, generates airflow to assist in the solder ball conveying and clean the path.

[0083] This device achieves automatic and continuous replenishment of solder balls through the coordinated operation of its components. It overcomes the problem of limited storage capacity of the ball storage bin in existing solder ball separation devices, ensuring the efficiency and stability of feeding larger solder balls during long-term soldering processes, and meeting the solder ball supply requirements of soft soldering.

[0084] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A solder ball preparation device for soft soldering, characterized in that: The device includes a mounting base (101) positioned above the solder ball separation device (100). A storage tank (102) for storing solder balls (600) is fixedly mounted on the mounting base (101). A tank cover (103) is detachably and sealingly connected to the top of the storage tank (102). A solder ball conveying shaft (104) extending through the bottom of the storage tank (102) is slidably and sealingly connected inside the storage tank (102). A solder ball conveying channel (105) is formed at the center of the solder ball conveying shaft (104), extending through the lower end of the solder ball conveying shaft (104). A dropper is fixedly and sealingly connected to the lower end of the solder ball conveying shaft (104). A ball-dropping hose (106) is fixedly and sealed at one end away from the solder ball conveying shaft (104) with an air pipe connecting sleeve (107). The air pipe connecting sleeve (107) is fixedly connected to the solder ball separating device (100) and communicates with the ball storage tank (601) of the solder ball separating device (100). A solder ball input hole (108) is opened on the outer side of the solder ball conveying shaft (104) corresponding to the solder ball (600). The solder ball input hole (108) communicates with the solder ball conveying channel (105). A drive assembly (200) that is drivenly connected to the solder ball conveying shaft (104) is installed on the mounting base (101).

2. The solder ball preparation device for soft soldering according to claim 1, characterized in that: The drive assembly (200) includes a drive motor (201), which is fixedly mounted on the mounting base (101). A cam disk (202) is fixedly mounted on the output shaft of the drive motor (201). A crank (203) is hinged to the cam disk (202). A drive frame (204) is hinged to one end of the crank (203) away from the cam disk (202). The drive frame (204) is fixedly mounted on the outside of the solder ball conveying shaft (104) near its lower end.

3. The solder ball preparation device for soft soldering according to claim 2, characterized in that: A guide component (300) is installed on the mounting base (101) in cooperation with the drive component (200). The guide component (300) includes a guide shaft (301) fixedly installed on the mounting base (101). The guide shaft (301) is arranged parallel to the solder ball conveying shaft (104). A guide hole (302) is opened on the drive frame (204) corresponding to the guide shaft (301). The guide shaft (301) is slidably connected to the drive frame (204) through the guide hole (302). A sliding groove (303) is opened on the mounting base (101) corresponding to the drive frame (204).

4. The solder ball preparation device for soft soldering according to claim 1, characterized in that: A pressure assembly (400) is provided at the bottom of the ball storage tank (102) corresponding to the solder ball conveying shaft (104). The pressure assembly (400) includes a piston chamber (401) opened at the bottom of the ball storage tank (102). A piston body (402) is slidably connected inside the piston chamber (401). The piston body (402) is fixedly mounted on the solder ball conveying shaft (104). An air inlet mechanism (403) is provided on the ball storage tank (102), and an exhaust mechanism (404) is provided on the air pipe connecting sleeve (107).

5. A solder ball preparation device for soft soldering according to claim 4, characterized in that: The air intake mechanism (403) includes an air intake hole (4031), which is located on the side wall of the ball storage tank (102) near the top of the piston chamber (401). A first spring (4032) is fixedly installed inside the air intake hole (4031) at one end near the piston chamber (401), and an air intake ring (4033) is fixedly installed inside the air intake hole (4031) at one end away from the piston chamber (401). A first valve body (4034) is connected between the air intake ring (4033) and the first spring (4032) inside the air intake hole (4031), and the first valve body (4034) closes the air intake ring (4033).

6. A solder ball preparation device for soft soldering according to claim 4, characterized in that: The exhaust mechanism (404) includes an exhaust port (4041), which is located on the side wall of the air pipe connecting sleeve (107). An exhaust ring (4042) is fixedly installed at one end of the exhaust port (4041) near the outer surface of the air pipe connecting sleeve (107). A second spring (4043) is fixedly installed at one end of the exhaust ring (4042) inside the exhaust port (4041). A second valve body (4044) is connected to the end of the second spring (4043) away from the exhaust ring (4042). The second valve body (4044) closes the exhaust port (4041).

7. A solder ball preparation device for soft soldering according to claim 1, characterized in that: A stirring assembly (500) is connected to the top of the solder ball conveying shaft (104). The stirring assembly (500) includes a drive shaft (501), which is fixedly installed on the top of the solder ball conveying shaft (104). A drive groove (502) arranged in a spiral pattern is opened on the outer surface of the drive shaft (501). A stirring frame (503) is fitted on the drive shaft (501). The stirring frame (503) is rotatably connected inside the ball storage tank (102). A limiting block (504) is fixedly connected to the stirring frame (503) corresponding to the drive groove (502). The limiting block (504) is slidably connected to the drive groove (502). A stirring rod (505) is fixedly installed on the stirring frame (503).

8. A solder ball preparation device for soft soldering according to claim 1, characterized in that: The ball drop hose (106) is made of a flexible transparent material. The diameter of the solder ball (600) is d, and the inner diameter of the ball drop hose (106) is D, satisfying: 2d > D > d.

9. A solder ball preparation device for soft soldering according to claim 8, characterized in that: The solder ball input hole (108) is tapered and obliquely arranged. The maximum diameter of the solder ball input hole (108) is D1, and the minimum diameter of the solder ball input hole (108) is D2, satisfying: D1 < 2d, D2 > d.

10. A solder ball preparation device for soft soldering according to any one of claims 1-9, characterized in that: The top surface of the ball storage tank (102) is provided with a first sealing ring mounting groove (109) corresponding to the inner bottom surface of the tank cover (103). The outer side of the ball storage tank (102) is provided with a second sealing ring mounting groove (110) corresponding to the inner side of the tank cover (103). A first sealing ring (111) is fixedly installed inside the first sealing ring mounting groove (109), and a second sealing ring (112) is fixedly installed inside the second sealing ring mounting groove (110).

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