Gypsum board forming thickness adjusting equipment and adjusting method thereof

Abstract

The invention discloses gypsum board forming thickness adjusting equipment and an adjusting method thereof, and relates to the technical field of gypsum board production.The gypsum board forming thickness adjusting equipment structurally comprises a base, an extrusion conveying belt is fixedly installed at the top of the base, a supporting roller is fixedly installed at the top of the base, and the supporting roller abuts against the bottom of the extrusion conveying belt; a support is fixedly connected to the top of the base and located on the top side of the extrusion conveying belt, a central controller is fixedly connected to the front face of the support, a hydraulic cylinder is fixedly installed at the top of the support, and a hydraulic rod is fixedly connected to the output end of the hydraulic cylinder. According to the gypsum board forming thickness adjusting equipment and the adjusting method thereof, the stress on the surface of the gypsum board can be released, and the strength of the surface of the gypsum board is enhanced in a drying mode, so that the gypsum board is not prone to deformation during extrusion, and the thickness adjusting precision and the forming quality of the gypsum board are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of gypsum board production, in particular to a gypsum board forming thickness adjusting device and adjusting method thereof. BACKGROUND

[0002] Gypsum board is a kind of building material made of gypsum as the main raw material. During the production of gypsum board, gypsum needs to be calcined, and the calcined gypsum powder is mixed with various ingredients and water in a certain proportion to form a slurry, which is then conveyed to the lower cover paper on the belt conveyor. After preliminary solidification, the upper cover paper is covered on the discharged slurry, and then the gypsum board is formed through extrusion, glue sticking, solidification, separation, drying, edge sawing and edge sealing. In order to meet the production of different specifications of gypsum board, a thickness adjusting device is usually used to adjust the distance between the forming belt and the forming table, so as to adjust the extrusion thickness of the gypsum board, ensure the accuracy of the gypsum board thickness, and improve the product quality.

[0003] The existing gypsum board forming thickness adjusting device and adjusting method have the problem that the gypsum slurry is not completely shaped during extrusion, and the gypsum board just extruded from the forming plate will swell and deform on the surface due to the release of internal stress, and even crack in severe cases, which will cause the actual thickness of the gypsum board to exceed the set thickness value during adjustment, thus not only making the forming thickness of the gypsum board inaccurate, but also reducing the forming quality of the gypsum board. SUMMARY

[0004] (I) Technical problems solved In view of the deficiencies of the prior art, the present application provides a gypsum board forming thickness adjusting device and adjusting method thereof, which solves the problem that the gypsum slurry is not completely shaped during extrusion, and the gypsum board just extruded from the forming plate will swell and deform on the surface due to the release of internal stress, and even crack in severe cases, which will cause the actual thickness of the gypsum board to exceed the set thickness value during adjustment, thus not only making the forming thickness of the gypsum board inaccurate, but also reducing the forming quality of the gypsum board.

[0005] (II) Technical solutions To achieve the above object, the gypsum board forming thickness adjusting equipment and the adjusting method thereof are implemented through the following technical scheme: a gypsum board forming thickness adjusting equipment and an adjusting method thereof, which comprise a base, a pressing conveying belt fixedly installed on the top of the base, a supporting roller fixedly installed on the top of the base and abutting against the bottom of the pressing conveying belt, a support fixedly connected to the top of the base and located on the top side of the pressing conveying belt, a central controller fixedly connected to the front of the support, a hydraulic cylinder fixedly installed on the top of the support, a hydraulic rod fixedly connected to the output end of the hydraulic cylinder, an adjusting plate fixedly connected to the bottom end of the hydraulic rod, a pressing plate arranged on the bottom side of the adjusting plate, an electric telescopic rod fixedly connected between the adjusting plate and the pressing plate, a stress releasing mechanism arranged on the top side of the pressing plate, a cooling mechanism arranged on the output end of the pressing plate and located on one side of the stress releasing mechanism, and the stress releasing mechanism comprising a releasing assembly and a drying assembly, wherein the releasing assembly is arranged on the top side of the pressing plate and the drying assembly is arranged on the top of the releasing assembly.

[0006] Preferably, the releasing assembly comprises a fixed shell fixedly connected to the top side of the pressing plate, pressure sensors fixedly connected to the inside of the fixed shell on both sides, first elastic telescopic rods fixedly connected to the bottom of the pressure sensors, and an installation plate fixedly connected to the bottom ends of the two first elastic telescopic rods.

[0007] Preferably, the surface of the pressing plate is provided with a through hole, the through hole is located on the bottom side of the fixed shell, two second elastic telescopic rods are fixedly connected to the bottom of the installation plate on both sides, and a roller shaft is rotatably connected between the bottom ends of the two second elastic telescopic rods.

[0008] Preferably, the second elastic telescopic rods and the roller shafts are provided in multiple groups, and the bottoms of the multiple groups of roller shafts are located on the same horizontal plane as the bottom of the through hole.

[0009] In the application, when the stress on the surface of the gypsum board is released by the releasing assembly, the roller shaft is pressed against the surface of the gypsum board through the action of the first and second elastic expansion rods, so that the stress on the surface of the gypsum board is released on the surface of the roller shaft, and the pressure on the roller shaft is monitored by the pressure sensor, and when the accumulated pressure is too large, the work is stopped to release the force on the roller shaft, and the double-row roller shaft setting can be used for secondary release, so that the stress on the surface of the gypsum board is released more thoroughly, and the first elastic expansion rod can be used to quickly release the stress on the whole gypsum board, and then the multiple roller shafts on the second elastic expansion rod can be used to correspondingly release the tiny stress at different positions, so that the release is more accurate, and the dry assembly can be used to quickly and roughly release most of the stress, and then accurately release the tiny stress, so that the stress on the surface of the gypsum board is released, and expansion deformation and other problems caused by stress when the gypsum board is squeezed out are avoided.

[0010] Preferably, the drying assembly comprises an air equalizing shell fixedly connected to the top of the fixed shell, and the bottom of the air equalizing shell is fixedly connected with air outlet pipes, and the number of the air outlet pipes is set to be multiple, and the bottom ends of the multiple air outlet pipes pass through the top wall of the fixed shell and extend to the inside of the fixed shell.

[0011] Preferably, the top of the adjusting plate is fixedly installed with a fan, the output end of the fan is connected with a hose, one end of the hose is connected to the surface of the heating shell and penetrates the heating shell, and the inside of the heating shell is fixedly connected with a heater.

[0012] In the application, the moisture on the surface of the gypsum board can be dried to a certain extent by the drying assembly, so that the gypsum board is not prone to hydration reaction, when drying, the fan is started to blow air, the blown air enters the heating shell through the hose, then enters the air equalizing shell, and finally blows to the surface of the gypsum board through the air outlet pipe, so that the surface of the gypsum board is dried to a certain extent, and at the same time, the heater heats the blown air, so that the hot air blown by the air outlet pipe dries the surface of the gypsum board faster, so that the gypsum board can be quickly dried when passing through the bottom side of the fixed shell.

[0013] Preferably, one end of the air equalizing shell is fixedly installed with a motor, the output end of the motor penetrates the outer wall of the air equalizing shell and is fixedly connected with a bidirectional screw rod, one end of the bidirectional screw rod is rotatably connected to the inner wall of the air equalizing shell, and the surface of the bidirectional screw rod is meshingly connected with air equalizing hole plates on both sides.

[0014] In the application, the bidirectional screw rod is repeatedly rotated back and forth by the motor, and the bidirectional screw rod drives the two side air uniforming hole plates to rotate back and forth, so that the air blown by the fan can be dispersed back and forth, and the blown air can be uniformly dispersed, so that the blown air can be more uniformly blown to the surface of the gypsum board, the drying is more uniform, and the drying effect is improved.

[0015] Preferably, the cooling mechanism comprises a leveling plate fixedly connected to the output end of the extrusion plate, the leveling plate is made of heat-conducting material, and the top of the leveling plate is fixedly connected with a height sensor, and the detection end of the height sensor is located on the same horizontal plane as the bottom of the leveling plate.

[0016] Preferably, the inside of the leveling plate is fixedly connected with a condenser pipe, one side of the top of the leveling plate is fixedly connected with a fixed plate, one side of the fixed plate is fixedly installed with a refrigerator, and the two ends of the condenser pipe pass through the inner wall of the leveling plate and are connected to the bottom of the refrigerator.

[0017] In the application, the surface of the gypsum board can be cooled by the cooling mechanism to prevent the surface of the gypsum board from being heated and deformed in the previous process, in work, the refrigerant in the condenser pipe is refrigerated by starting the refrigerator, the heat-conducting leveling plate is cooled after refrigeration, so that the heat of the surface of the gypsum board passing through the leveling plate is absorbed by the leveling plate, so that a certain cooling effect is achieved, and the surface of the gypsum board can be arranged more flatly by the leveling plate, so that the thickness of the gypsum board is kept as consistent as possible, and the thickness adjustment is more accurate.

[0018] An adjustment method of a gypsum board forming thickness adjustment device, comprising the following steps: S1, first, the adjusting plate and the extrusion plate are moved downward together by the hydraulic rod for coarse adjustment, then the extrusion plate is continuously moved by the electric telescopic rod for fine adjustment, and the thickness of the gypsum board is monitored by the height sensor during the coarse adjustment and the fine adjustment until the required thickness is reached; S2, after adjustment, the gypsum slurry is formed by extrusion of the extrusion plate, the stress on the surface of the gypsum board is released by the release assembly, the stress on the surface of the gypsum board is released to the surface of the roller shaft before the gypsum board is output at the bottom of the extrusion plate, and then the stress is transmitted to the pressure sensor through the second elastic telescopic rod and the first elastic telescopic rod, and the size of the stress value is monitored by the pressure sensor; S3, while releasing the stress, the surface of the output gypsum board is slightly dried by the drying assembly to temporarily increase the hardness of the surface of the gypsum board and prevent the gypsum board from being easily deformed, and when drying, the hot air is formed after the air blown by the fan is heated by the heater, and the hot air is blown to the surface of the gypsum board through the through hole for certain drying treatment; S4, after the water content on the surface of the gypsum board is reduced by drying, the surface of the gypsum board is cooled by a cooling mechanism, the refrigerant in the condenser pipe is refrigerated by a refrigerator, the temperature of the leveling plate is reduced due to the heat conductivity of the leveling plate, so that the gypsum board can be cooled and leveled when passing through the leveling plate; S5, the gypsum board after stress release is not easy to expand and deform during extrusion, is more level and uniform after leveling by the leveling plate, and the thickness measured by the height sensor is more accurate.

[0019] (Three) beneficial effects The application provides a gypsum board forming thickness adjusting device and an adjusting method thereof. (One), the gypsum board forming thickness adjusting device and the adjusting method thereof, by the setting of the stress release mechanism, the stress on the surface of the gypsum board can be released, the deformation caused by stress release during extrusion of the gypsum board is prevented, the water content on the surface of the gypsum board is dried by blowing, the hydration reaction is reduced, the toughness of the surface of the gypsum board is enhanced, the possibility of expansion and deformation of the gypsum board is reduced, the surface of the gypsum board is more level, the actual thickness is closer to the adjusted thickness, the thickness adjusting accuracy is improved, and the forming quality of the gypsum board is improved.

[0020] (Two), the gypsum board forming thickness adjusting device and the adjusting method thereof, by the setting of the first elastic expansion rod, the second elastic expansion rod and the double-row cutting multiple groups of roller shafts, the first elastic expansion rod can quickly release the stress of most of the gypsum board, then the multiple second elastic expansion rods and the roller shafts can correspondingly release the small stress at different positions, the release is more accurate, so that the situation that the local small stress cannot be released is prevented, the possibility of deformation of the gypsum board during extrusion is further reduced, and the forming quality is improved.

[0021] (Three), the gypsum board forming thickness adjusting device and the adjusting method thereof, by the setting of the drying assembly, the hot air blown by the fan can better dry the surface of the gypsum board, the water content on the surface of the gypsum board is reduced, the gypsum board is not easy to deform, and by the setting of the air uniformizing shell and the air uniformizing hole plate, the blown air is more uniform, so that the surface of the gypsum board can be uniformly dried, the drying effect is improved, the deformation caused by different drying degrees of the surface of the gypsum board is prevented, and the production quality of the gypsum board is improved.

[0022] (Four), the gypsum board forming thickness adjusting equipment and adjusting method, through the setting of the cooling mechanism, the temperature rising during the previous drying and heating can be cooled, the gypsum board surface is prevented from expanding and deforming due to heating, the forming quality of the gypsum board is improved, meanwhile, the flatness of the gypsum board surface is improved through the action of the leveling plate, the gypsum board surface is further leveled, the measured thickness of the gypsum board is more accurate and close to the adjusted thickness, and the precision of the gypsum board thickness adjustment is further improved. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 It is a structure schematic view of the whole front surface of the present application; Figure 2 It is a structure schematic view of the whole back surface of the present application; Figure 3 It is a structure schematic view of the inside of the support of the present application; Figure 4 It is a structure schematic view of the releasing assembly of the present application; Figure 5 It is a structure schematic view of the drying assembly of the present application; Figure 6 It is a top sectional view of the air equalizing shell of the present application; Figure 7 It is a side sectional view of the fixing shell and the air equalizing shell of the present application; Figure 8 It is a front sectional view of the cooling mechanism of the present application; Figure 9 It is a top sectional view of the cooling mechanism of the present application.

[0024] In the figure: 1, base; 2, extrusion conveying belt; 3, supporting roller; 4, support; 5, central controller; 6, hydraulic rod; 7, adjusting plate; 8, extrusion plate; 9, electric telescopic rod; 10, stress releasing mechanism; 101, releasing assembly; 1011, fixing shell; 1012, pressure sensor; 1013, first elastic telescopic rod; 1014, mounting plate; 1015, through hole; 1016, second elastic telescopic rod; 1017, roller shaft; 102, drying assembly; 1021, air equalizing shell; 1022, air outlet pipe; 1023, fan; 1024, hose; 1025, heating shell; 1026, heater; 1027, motor; 1028, bidirectional screw; 1029, air equalizing hole plate; 11, cooling mechanism; 111, leveling plate; 112, height sensor; 113, condenser pipe; 114, fixing plate; 115, refrigerator. DETAILED DESCRIPTION

[0025] Clearly, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the protection scope of the present application.

[0026] Referring to Figures 1-9 The present application provides a technical solution: a gypsum board forming thickness adjusting device, which comprises a base 1, an extrusion conveying belt 2 fixedly installed on the top of the base 1, a supporting roller 3 fixedly installed on the top of the base 1 and abutting against the bottom of the extrusion conveying belt 2, a support 4 fixedly connected to the top of the base 1 and located on the top side of the extrusion conveying belt 2, a central controller 5 fixedly connected to the front of the support 4, a hydraulic cylinder fixedly installed on the top of the support 4, a hydraulic rod 6 fixedly connected to the output end of the hydraulic cylinder, an adjusting plate 7 fixedly connected to the bottom end of the hydraulic rod 6, an extrusion plate 8 provided on the bottom side of the adjusting plate 7, an electric telescopic rod 9 fixedly connected between the adjusting plate 7 and the extrusion plate 8, a stress releasing mechanism 10 provided on one side of the top of the extrusion plate 8, a cooling mechanism 11 provided on the output end of the extrusion plate 8 and located on one side of the stress releasing mechanism 10, and the stress releasing mechanism 10 comprising a releasing assembly 101 and a drying assembly 102, wherein the releasing assembly 101 is provided on one side of the top of the extrusion plate 8, and the drying assembly 102 is provided on the top of the releasing assembly 101. Specifically, when the gypsum board is in the forming process, the thickness of the required gypsum board is first adjusted. During the adjustment, the hydraulic rod 6 is driven by the hydraulic cylinder to move the adjusting plate 7, and then the extrusion plate 8 is moved by the electric telescopic rod 9 until it reaches the appropriate position. At this time, the distance between the extrusion plate 8 and the extrusion conveying belt 2 is the thickness of the gypsum board. During the adjustment, the height sensor 112 is used for real-time monitoring to facilitate real-time adjustment of the thickness of the gypsum board. After adjustment, the gypsum slurry is transported to the input end of the extrusion plate 8 by external equipment. Due to the continuous rotation of the extrusion conveying belt 2, the gypsum slurry passes through the extrusion plate 8 and is extruded to obtain the gypsum board. Before the gypsum board is output from the extrusion plate 8, the stress releasing mechanism 10 is used to release the stress on the surface of the unformed gypsum board to prevent deformation of the gypsum board during output extrusion. In addition, the cooling mechanism 11 is used to cool the surface of the gypsum board to prevent the gypsum board from expanding due to heating in the previous process.

[0027] The release assembly 101 comprises a fixed shell 1011 fixedly connected to one side of the top of the extrusion plate 8, and pressure sensors 1012 are fixedly connected to the inside of the fixed shell 1011 on both sides, and first elastic telescopic rods 1013 are fixedly connected to the bottom of the pressure sensors 1012, and a mounting plate 1014 is fixedly connected to the bottom ends of the two first elastic telescopic rods 1013.

[0028] The surface of the extrusion plate 8 is provided with a through hole 1015 located at the bottom side of the fixed shell 1011, and two second elastic telescopic rods 1016 are fixedly connected to the bottom of the mounting plate 1014 on both sides, and a roller shaft 1017 is rotatably connected between the bottom ends of the two second elastic telescopic rods 1016.

[0029] The second elastic telescopic rods 1016 and the roller shaft 1017 are provided in multiple groups, and the bottoms of the multiple roller shafts 1017 are located on the same horizontal plane as the bottom of the through hole 1015.

[0030] Specifically, when the stress on the surface of the gypsum board is released by the release assembly 101, the roller shaft 1017 is pressed against the surface of the gypsum board through the action of the first elastic telescopic rod 1013 and the second elastic telescopic rod 1016, so that the stress on the surface of the gypsum board is released on the surface of the roller shaft 1017, and the pressure on the roller shaft 1017 is monitored by the pressure sensor 1012. When the accumulated pressure is too large, the release of the force on the roller shaft 1017 is stopped, and the double-row roller shaft 1017 can be used for secondary release, so that the stress on the surface of the gypsum board is released more thoroughly. The first elastic telescopic rod 1013 can quickly release the stress on the entire gypsum board, and then the multiple second elastic telescopic rods 1016 and the multiple roller shafts 1017 can release the micro stress at different positions correspondingly, so that the stress on the surface of the gypsum board is released, and the gypsum board is prevented from swelling and deforming due to the stress when it is extruded.

[0031] The drying assembly 102 comprises an air equalizing shell 1021 fixedly connected to the top of the fixed shell 1011, and the bottom of the air equalizing shell 1021 is fixedly connected with air outlet pipes 1022, and the number of the air outlet pipes 1022 is set to be multiple, and the bottom ends of the multiple air outlet pipes 1022 extend to the inside of the fixed shell 1011 through the top wall of the fixed shell 1011.

[0032] The top of the adjusting plate 7 is fixedly provided with a fan 1023, the output end of the fan 1023 is connected with a hose 1024, one side of the air distribution shell 1021 is fixedly connected with a heating shell 1025, one end of the hose 1024 is connected with the surface of the heating shell 1025 and penetrates the heating shell 1025, and the inside of the heating shell 1025 is fixedly connected with a heater 1026.

[0033] Specifically, the moisture on the surface of the gypsum board can be dried by the drying assembly 102, so that the gypsum board is not easy to produce hydration reaction. When drying, the fan 1023 is started to blow air, the blown air enters the heating shell 1025 through the hose 1024, then enters the air distribution shell 1021, and finally blows to the surface of the gypsum board through the air outlet pipe 1022, so as to dry the surface of the gypsum board. At the same time, the heater 1026 heats the blown air, so that the hot air blown by the air outlet pipe 1022 can dry the surface of the gypsum board faster, so that the gypsum board can be dried quickly when passing through the bottom side of the fixed shell 1011.

[0034] Specifically, the moisture on the surface of the gypsum board can be dried by the drying assembly 102, so that the gypsum board is not easy to produce hydration reaction. When drying, the fan 1023 is started to blow air, the blown air enters the heating shell 1025 through the hose 1024, then enters the air distribution shell 1021, and finally blows to the surface of the gypsum board through the air outlet pipe 1022, so as to dry the surface of the gypsum board. At the same time, the heater 1026 heats the blown air, so that the hot air blown by the air outlet pipe 1022 can dry the surface of the gypsum board faster, so that the gypsum board can be dried quickly when passing through the bottom side of the fixed shell 1011.

[0035] Specifically, the moisture on the surface of the gypsum board can be dried by the drying assembly 102, so that the gypsum board is not easy to produce hydration reaction. When drying, the fan 1023 is started to blow air, the blown air enters the heating shell 1025 through the hose 1024, then enters the air distribution shell 1021, and finally blows to the surface of the gypsum board through the air outlet pipe 1022, so as to dry the surface of the gypsum board. At the same time, the heater 1026 heats the blown air, so that the hot air blown by the air outlet pipe 1022 can dry the surface of the gypsum board faster, so that the gypsum board can be dried quickly when passing through the bottom side of the fixed shell 1011.

[0036] The cooling mechanism 11 comprises a leveling plate 111, the leveling plate 111 is fixedly connected to the output end of the extrusion plate 8, the leveling plate 111 is made of heat-conducting material, the top of the leveling plate 111 is fixedly connected with a height sensor 112, and the detection end of the height sensor 112 is located on the same horizontal plane as the bottom of the leveling plate 111.

[0037] The inside of the leveling plate 111 is fixedly connected with a condenser pipe 113, one side of the top of the leveling plate 111 is fixedly connected with a fixed plate 114, one side of the fixed plate 114 is fixedly provided with a refrigerator 115, and the two ends of the condenser pipe 113 penetrate the inner wall of the leveling plate 111 and are connected to the bottom of the refrigerator 115.

[0038] Specifically, the gypsum board surface can be cooled by the cooling mechanism 11 to prevent the gypsum board from being deformed due to thermal expansion caused by heating in the previous process. During operation, the condenser 115 is started to cool the condensing agent in the condenser pipe 113. The cooled condenser pipe 113 cools the heat-conducting leveling plate 111, so that the heat of the gypsum board surface passing through the leveling plate 111 is absorbed by the leveling plate 111, thereby achieving a certain cooling effect. At the same time, the leveling plate 111 can also arrange the surface of the gypsum board to be more flat, so that the thickness of the gypsum board is kept as consistent as possible, thereby making the thickness adjustment more accurate.

[0039] An adjusting method of a gypsum board forming thickness adjusting device, comprising the following steps: S1, first, the adjusting plate 7 and the extrusion plate 8 are moved downward together by the hydraulic rod 6 for coarse adjustment, and then the extrusion plate 8 is continuously moved by the electric telescopic rod 9 for fine adjustment. The thickness of the gypsum board is monitored by the height sensor 112 during the coarse adjustment and the fine adjustment until the required thickness is reached. S2, after the adjustment, the gypsum slurry is formed by the extrusion of the extrusion plate 8, and the stress on the surface of the gypsum board is released by the releasing assembly 101. Before the gypsum board is output at the bottom of the extrusion plate 8, the stress on the surface of the gypsum board is released to the surface of the roller shaft 1017, and then transmitted to the pressure sensor 1012 through the second elastic telescopic rod 1016 and the first elastic telescopic rod 1013. The size of the stress value is monitored by the pressure sensor 1012. S3, while releasing the stress, the surface of the gypsum board to be output is slightly dried by the drying assembly 102 to temporarily increase the hardness of the surface of the gypsum board and prevent it from being easily deformed. During drying, the hot air formed by the air blower 1023 after being heated by the heater 1026 blows towards the surface of the gypsum board through the through hole 1015 for certain drying treatment. S4, after the water content on the surface of the gypsum board is reduced by drying, the surface of the gypsum board is cooled by the cooling mechanism 11. The refrigerant in the condenser pipe 113 is cooled by the condenser 115. Due to the heat conductivity of the leveling plate 111, the temperature of the leveling plate 111 is reduced, so that the gypsum board can be cooled and leveled when passing through the leveling plate 111. S5, the gypsum board after releasing the stress is not easy to expand and deform during extrusion, and is more level and uniform after leveling by the leveling plate 111. Finally, the thickness measured by the height sensor 112 is more accurate.

[0040] It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting; it is not intended to exclude myriad other embodiments of the present application that other inventors can develop based on the same general inventive concepts embodied by the described embodiments. That is, although the present application is described in terms of particular embodiments and implementations, it is to be understood that the terminology used is for the purpose of descriptive clarity and that it should be taken in a descriptive sense and not a limiting sense.

[0041] While the embodiments of the application have been shown and described herein, it is to be understood that the application is not limited to these embodiments. Rather, many modifications, changes, substitutions, and alterations can be made to the embodiments of the application without departing from the spirit and scope of the application as defined by the appended claims and their equivalents.

Claims

1. A gypsum board molding thickness adjustment device, comprising a base (1), characterized in that: The top of the base (1) is fixedly mounted with an extrusion conveyor belt (2), the top of the base (1) is fixedly mounted with a support roller (3), the support roller (3) abuts against the bottom of the extrusion conveyor belt (2), the top of the base (1) is fixedly connected with a bracket (4), the bracket (4) is located on the top side of the extrusion conveyor belt (2), the front of the bracket (4) is fixedly connected with a central controller (5), the top of the bracket (4) is fixedly mounted with a hydraulic cylinder, the output end of the hydraulic cylinder is fixedly connected with a hydraulic rod (6), the bottom end of the hydraulic rod (6) is fixedly connected with an adjustment plate (7), the bottom of the adjustment plate (7) is fixedly connected with a hydraulic rod (6), and the bottom of the adjustment plate (7) is fixedly connected with a hydraulic rod (6). An extrusion plate (8) is provided on the side, an electric telescopic rod (9) is fixedly connected between the adjustment plate (7) and the extrusion plate (8), a stress release mechanism (10) is provided on the top side of the extrusion plate (8), a cooling mechanism (11) is provided at the output end of the extrusion plate (8), the cooling mechanism (11) is located on one side of the stress release mechanism (10), the stress release mechanism (10) includes a release component (101) and a drying component (102), the release component (101) is provided on the top side of the extrusion plate (8), and the drying component (102) is provided on the top of the release component (101).

2. The gypsum board forming thickness adjustment device according to claim 1, characterized in that: The release assembly (101) comprises a fixed shell (1011), the fixed shell (1011) being fixedly connected to one side of the top of the extrusion plate (8), pressure sensors (1012) being fixedly connected to both sides of the interior of the fixed shell (1011), the bottom of the pressure sensor (1012) being fixedly connected to a first elastic telescopic rod (1013), and the bottom ends of the two first elastic telescopic rods (1013) being fixedly connected to a mounting plate (1014).

3. The gypsum board forming thickness adjustment device according to claim 2, characterized in that: A through hole (1015) is provided on the surface of the extrusion plate (8), and the through hole (1015) is located on the bottom side of the fixed shell (1011). Two second elastic telescopic rods (1016) are fixedly connected to both sides of the bottom of the mounting plate (1014), and a roller (1017) is rotatably connected between the bottom ends of the two second elastic telescopic rods (1016).

4. The gypsum board forming thickness adjustment device according to claim 3, characterized in that: The second elastic telescopic rod (1016) and the roller shaft (1017) are both provided in multiple groups, and the bottoms of the multiple groups of roller shafts (1017) and the bottoms of the through holes (1015) are located on the same horizontal plane.

5. The gypsum board molding thickness adjustment device according to claim 2, characterized in that: The drying component (102) comprises an air distribution shell (1021), wherein the air distribution shell (1021) is fixedly connected to the top of the fixed shell (1011), and an air outlet pipe (1022) is fixedly connected to the bottom of the air distribution shell (1021), wherein the number of the air outlet pipes (1022) is set to be multiple, and the bottom ends of the multiple air outlet pipes (1022) pass through the top wall of the fixed shell (1011) and extend into the interior of the fixed shell (1011).

6. The gypsum board forming thickness adjustment device according to claim 5, characterized in that: A fan (1023) is fixedly installed on the top of the regulating plate (7), and the output end of the fan (1023) is connected to a hose (1024). A heating shell (1025) is fixedly connected to one side of the air equalizing shell (1021), and one end of the hose (1024) is connected to the surface of the heating shell (1025) and is interconnected with the heating shell (1025). A heater (1026) is fixedly connected to the interior of the heating shell (1025).

7. The gypsum board molding thickness adjustment device according to claim 5, characterized in that: A motor (1027) is fixedly mounted on one end of the air equalizing housing (1021); an output end of the motor (1027) passes through the outer wall of the air equalizing housing (1021) and is fixedly connected to a bidirectional screw rod (1028); one end of the bidirectional screw rod (1028) is rotatably connected to the inner wall of the air equalizing housing (1021); and both sides of the surface of the bidirectional screw rod (1028) are meshedly connected to air equalizing hole plates (1029).

8. The gypsum board molding thickness adjustment device according to claim 1, characterized in that: The cooling mechanism (11) includes a leveling plate (111), the leveling plate (111) is fixedly connected to the output end of the extrusion plate (8), the leveling plate (111) is made of a heat-conducting material, a height sensor (112) is fixedly connected to the top of the leveling plate (111), and a detection end of the height sensor (112) and a bottom of the leveling plate (111) are located on the same horizontal plane.

9. The gypsum board molding thickness adjustment device according to claim 8, characterized in that: A condenser tube (113) is fixedly connected to the interior of the screed plate (111), a fixed plate (114) is fixedly connected to one side of the top of the screed plate (111), a refrigerator (115) is fixedly installed on one side of the fixed plate (114), and both ends of the condenser tube (113) pass through the inner wall of the screed plate (111) and are connected to the bottom of the refrigerator (115).

10. A method for adjusting the thickness of a gypsum board molding device according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1. First, the hydraulic rod (6) drives the adjustment plate (7) and the extrusion plate (8) to move downward together for coarse adjustment, and then the electric telescopic rod (9) is activated to drive the extrusion plate (8) to continue moving for fine adjustment. During the coarse adjustment and fine adjustment, the thickness of the gypsum board is monitored by the height sensor (112) until the required thickness is adjusted; S2, after adjustment, the gypsum slurry is extruded and formed by the extrusion plate (8), and the stress on the surface of the gypsum board is released by the release component (101). Before the gypsum board is output from the bottom of the extrusion plate (8), the stress on the surface of the gypsum board is released to the surface of the roller (1017), and then transmitted to the pressure sensor (1012) through the second elastic telescopic rod (1016) and the first elastic telescopic rod (1013), and the magnitude of the stress value is monitored by the pressure sensor (1012); S3. While releasing the stress, the surface of the gypsum board to be output is lightly dried by the drying component (102) to temporarily increase the hardness of the gypsum board surface and prevent it from being easily deformed. During the drying process, the air blown out by the fan (1023) is heated by the heater (1026) to form hot air. The hot air passes through the through hole (1015) and blows toward the surface of the gypsum board to perform a certain drying process; S4. After the moisture on the surface of the gypsum board is reduced by drying, the surface of the gypsum board is cooled by the cooling mechanism (11). The refrigerant in the condenser (113) is cooled by the refrigerator (115). Due to the thermal conductivity of the leveling plate (111), the temperature of the leveling plate (111) is reduced, so that the gypsum board can be cooled and leveled when passing through the leveling plate (111); S5. After the stress is released, the gypsum board is not easily expanded and deformed during extrusion, and is more horizontal and even after being leveled by the leveling plate (111). Finally, the thickness measured by the height sensor (112) is more accurate.

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