Highly integrated kick sensor
By integrating multiple modules into a single chip and adding anti-interference filtering and voltage monitoring functions, the design complexity and stability problems of traditional capacitive kick sensors are solved, and a high-reliability and low-cost kick sensor design is achieved.
Patent Information
- Application Number
- CN202511098497.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-06
- Publication Date
- 2025-10-17
AI Technical Summary
Traditional capacitive kick sensors have problems such as large PCB board area, high design difficulty and high cost, and single-chip solutions have challenges in stability and reliability.
The LIN communication module, voltage regulator, system control module and monitoring module are integrated into a single chip, and combined with the filtering module, voltage monitoring module and capacitance sensing module, the controller is driven to execute actions through hard wiring or the LIN communication module, and anti-interference and self-test functions are added.
Reduce peripheral devices, save PCB area, improve system reliability and stability, enhance anti-interference ability, ensure response speed and accuracy, and provide self-test function to ensure normal operation of the system.
Smart Images
Figure CN120792729A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of sensors, in particular to a highly integrated kick sensor. BACKGROUND
[0002] Capacitive kick sensors are widely used in the automotive field, mainly for functions such as opening the tailgate of a vehicle. With the increasing intelligence of automobiles, higher requirements are placed on the functionality and reliability of sensors. Traditional capacitive kick sensors usually require multiple independent chips and circuit components to work together, such as power management chips, LIN chips, MCUs, and capacitive sensors, etc. These elements are connected through complex circuits to achieve the basic functions of the kick sensor. Although this design can meet the basic requirements, it has many shortcomings in actual application.
[0003] In order to ensure the normal triggering performance of the kick sensor, the existing solutions mainly include two kinds: one is to use multiple independent chips and circuit components, and the other is to use a highly integrated single chip. The typical approach of the former is to configure multiple separate components such as power management chips, LIN chips, MCUs, and capacitive sensors in the circuit, and to realize the functions of the system through complex circuit connections. The latter uses a single highly integrated chip to complete all necessary functions, which integrates LIN interface, power management module, MCU, and capacitive sensing module inside the chip, and is connected to the sensing electrode to form a complete capacitive kick system.
[0004] However, both of these two solutions have certain defects in actual application. Although the multi-chip solution can achieve high reliability and functionality, it requires multiple independent chips and complex circuit connections, resulting in large PCB area, high design difficulty, and high cost. In contrast, the single-chip solution can significantly reduce the PCB area, design complexity, and production cost, but in some specific application scenarios, it is still a challenge to ensure the stability and reliability of the sensor. SUMMARY
[0005] In order to reduce costs while maintaining or even improving the performance and reliability of the sensor, the present application provides a highly integrated kick sensor.
[0006] The highly integrated kick sensor provided by the present application adopts the following technical solution: A highly integrated kick sensor based on a controller, comprising at least one sensing electrode; A chip integrated with a LIN communication module, a voltage stabilizer, a system control module and a monitoring module; the controller is electrically connected with the LIN communication module; an output end of the system control module is electrically connected to a signal input end of the controller through a hard-wire output module; an output end of the monitoring module is electrically connected to an input end of the sensing electrode through a capacitive induction module. When the sensing electrode is triggered, the sensing electrode outputs a start signal to the chip, after the chip receives the start signal, the system control module outputs a kick signal to the controller through the hard-wire output module or the LIN communication module, after the controller receives the kick signal, the controller can drive corresponding actions.
[0007] By adopting the above technical scheme, the LIN communication module, the voltage stabilizer, the system control module and the monitoring module are integrated in a single chip, the number of peripheral devices is reduced, the reliability and compactness of the system are improved, the use area of the PCB is effectively saved, and the design difficulty of the scheme is reduced. The voltage stabilizer provides stable power supply for the control system, ensuring stable operation of the system under various working conditions. After the controller receives the kick signal through the hard-wire output module or the LIN communication module, the controller can quickly respond and drive corresponding actions, improving the response speed and reliability of the system. The monitoring module is connected to the sensing electrode through the capacitive induction module, when the sensing electrode is triggered, the monitoring module can accurately output a start signal to the chip, avoiding false triggering and improving the sensitivity and accuracy of the system.
[0008] As a preferred, it further comprises a filter module, the filter module comprises a plurality of filter capacitors and a diode D2, wherein: a power supply end K2 of the controller is grounded, a power supply end K1 of the controller is grounded in sequence through a filter capacitor C1 and a filter capacitor C2; the power supply end K1 is electrically connected to an anode of the diode D2; a cathode of the diode D2 is grounded in sequence through a filter capacitor C3, a filter capacitor C4, a filter capacitor C5, a filter capacitor C7 and a filter capacitor C8; the cathode of the diode D2 is an output end out1 of the filter module, and the output end out1 is electrically connected to a first input end of the voltage stabilizer.
[0009] By adopting the above technical scheme, by increasing the filter module, the anti-interference ability of the sensor is improved. The plurality of filter capacitors and the diode D2 in the filter module can effectively filter out noise and interference in the power supply, ensuring stable operation of the chip and the controller, thereby improving the reliability and precision of the sensor.
[0010] As a preferred, the filter module further comprises a bidirectional TVS tube D1, and the power supply end K1 is grounded through the bidirectional TVS tube D1.
[0011] By adopting the above technical solution and adding a bidirectional TVS diode D1 to the filter module, the sensor's ability to withstand voltage shocks is further enhanced. The bidirectional TVS diode D1 can provide protection when the voltage is too high or too low, preventing damage to the chip and controller, thereby improving the durability and safety of the sensor.
[0012] Preferably, it further includes a voltage monitoring module, which includes a transistor Q3, a transistor Q4, a resistor R2 and a resistor R3, wherein: the base of the transistor Q4 is electrically connected to the enable terminal monitor EN of the controller; the emitter of the transistor Q4 is grounded, and the collector of the transistor Q4 is electrically connected to the base of the transistor Q3; the emitter of the transistor Q3 is electrically connected to the sampling terminal UBi, and the sampling terminal UBi is arranged between the output terminal of the filtering module and the input terminal of the voltage regulator; the collector of the transistor Q3 is grounded through the resistor R2 and the resistor R3 in sequence, and the connection point between the resistor R2 and the resistor R3 is electrically connected to the input terminal of the analog-to-digital converter.
[0013] By adopting the above technical solution and adding a voltage monitoring module, real-time monitoring of the sensor's operating voltage is achieved. The voltage monitoring module, through a combination of transistors and resistors, converts the voltage signal into a signal readable by an analog-to-digital converter, ensuring that the sensor operates within a stable voltage range and avoiding malfunction or damage caused by voltage fluctuations.
[0014] Preferably, the voltage monitoring module further includes a capacitor C9, one end of the capacitor C9 is electrically connected to the connection point between the resistor R2 and the resistor R3, and the other end of the capacitor C9 is grounded.
[0015] By adopting the above technical solution and adding capacitor C9 to the voltage monitoring module, the stability and anti-interference capability of the voltage monitoring are further improved. Capacitor C9 can filter out high-frequency noise in the voltage signal, ensuring that the voltage signal read by the analog-to-digital converter is more accurate, thereby improving the reliability of the sensor.
[0016] Preferably, the capacitive sensing module includes a resistor R4, a resistor R5, a resistor R6, a resistor R7, a capacitor C10, a capacitor C11, a capacitor C12, and a capacitor C13, wherein: the second output terminal Indicator2 of the monitoring module is grounded through the resistor R4 and the capacitor C10 in sequence; the connection point between the resistor R4 and the capacitor C10 is electrically connected to one end of the resistor R5 through the inductor L1 and is grounded through the capacitor C11, and the other end of the resistor R5 is electrically connected to the first input terminal Sensor1 of the sensing electrode; The first output end Indicator1 of the monitoring module is sequentially grounded through the resistor R6 and the capacitor C13; the connection point between the resistor R6 and the capacitor C13 is electrically connected to one end of the resistor R7 through the inductor L2 and grounded through the capacitor C14, and the other end of the resistor R7 is electrically connected to the second input end Sensor2 of the sensing electrode.
[0017] By adopting the above technical solution, the sensitivity and anti-interference ability of the sensing electrode are improved through the capacitive sensing module. Through the combination of resistors, capacitors and inductors, the small changes of the sensing electrode can be effectively detected, the accurate recognition of the kicking action is ensured, and the false triggering is reduced. The introduction of the inductor L1 and the inductor L2 helps to filter out high-frequency noise and reduce the influence of external electromagnetic interference on capacitive sensing, thereby improving the stability and reliability of the system.
[0018] Preferably, the parameters of the resistor R4, the resistor R5, the resistor R6, the resistor R7, the capacitor C10, the capacitor C11, the capacitor C12 and the capacitor C13 can be adjusted.
[0019] By adopting the above technical solution, the sensitivity of the capacitive sensing module can be adjusted by adjusting the parameters of the resistors and capacitors in the capacitive sensing module, so that it can accurately respond to the changes of the sensing electrode in different environments.
[0020] Preferably, the capacitive sensing module further comprises a diode D3, a diode D4, a capacitor C12 and a capacitor C15, wherein: one end of the resistor R5 away from the inductor L1 is electrically connected to the anode of the diode D3, and the cathode of the diode D3 is electrically connected to the first input end Sensor1 of the sensing electrode; one end of the capacitor C12 is electrically connected to the anode of the diode D3, and the other end of the capacitor C12 is electrically connected to the cathode of the diode D3. The other end of the resistor R7 away from the inductor L2 is electrically connected to the anode of the diode D4, and the cathode of the diode D4 is electrically connected to the second input end Sensor2 of the sensing electrode; one end of the capacitor C15 is electrically connected to the anode of the diode D4, and the other end of the capacitor C15 is electrically connected to the cathode of the diode D4.
[0021] By adopting the above technical solution, the diode D3 and the diode D4 in the capacitive sensing module can effectively prevent the impact of reverse current on the circuit, improve the reliability and stability of the system. At the same time, the capacitor C12 and the capacitor C15 can further filter out high-frequency noise, enhance the purity of the signal, and improve the sensing accuracy. These improvements enable the sensor to maintain high sensitivity and anti-interference ability in complex electromagnetic environments, suitable for various application scenarios.
[0022] As preferred, the hard-wired output module comprises a transistor Q1, a transistor Q2 and a resistor R1, wherein: the base of the transistor Q1 is electrically connected to the output of the system control module; the collector of the transistor Q1 is electrically connected to the signal input of the controller; the emitter of the transistor Q1 is grounded through the resistor R1; the base of the transistor Q2 is electrically connected to the emitter of the transistor Q1; the collector of the transistor Q2 is electrically connected to the base of the transistor Q1, and the emitter of the transistor Q2 is grounded.
[0023] By adopting the above technical solution, effective control of the signal input of the controller is realized. When the system control module outputs a high level, the transistor Q1 is turned on, the transistor Q2 is turned off, and the signal input receives a low level, so that the controller can respond to the action after the inductive electrode is triggered. When the system control module outputs a low level, the transistor Q1 and the transistor Q2 are both turned off, the signal input receives a high level, and the controller does not respond to the action after the inductive electrode is triggered. This design improves the reliability and stability of the system, ensuring that the corresponding operation is only performed under specific conditions, avoiding unnecessary actions caused by accidental triggering.
[0024] As preferred, the chip has a power-on self-test function. After the product is powered on, each module is first initialized, then it is tested whether the LIN communication module works normally, then the trigger performance of the kick sensor is tested, and finally a self-test report is generated and sent to external equipment through LIN communication.
[0025] By adopting the above technical solution, the highly integrated kick sensor can automatically complete the initialization of each module after the product is powered on, and test whether the LIN communication function works normally. This helps to ensure the reliability and stability of the entire system. Subsequently, the sensor tests its trigger performance to further verify its effectiveness. Finally, the system generates a detailed self-test report and sends it to external equipment through LIN communication, which facilitates users to promptly understand the status and potential problems of the sensor, and improves the efficiency of maintenance and troubleshooting.
[0026] In summary, the present application includes at least one of the following beneficial technical effects: 1. The highly integrated design integrates the LIN communication module, the voltage stabilizer, the system control module and the monitoring module in a single chip, reducing the number of peripheral components, effectively saving the PCB area, reducing the difficulty of scheme design, and improving the reliability and stability of the system; 2. The introduction of the filter module effectively filters out external environmental interference, ensuring the stability of the voltage output and the noise immunity, and further improving the robustness of the system; 3. The power-on self-test function can automatically detect the working status of each module, ensuring that the sensor can operate normally every time it is started, and promptly detect and report potential faults, enhancing system reliability and user experience. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] Figure 1 This is a principle block diagram of an embodiment of the present application; Figure 2 is a circuit diagram of the filter module in an embodiment of the present application; Figure 3 is a circuit diagram of a voltage monitoring module in an embodiment of the present application; Figure 4 It is the capacitive sensing module in the embodiment of this application.
[0028] Figure numerals: 100, controller; 1, chip; 11, LIN communication module; 12, voltage regulator; 13, system control module; 14, monitoring module; 2, capacitive sensing module; 3, sensing electrode; 4, hard-wired output module; 5, filtering module; 6, voltage monitoring module. DETAILED DESCRIPTION
[0029] The following is combined with Figures 1-4 This application is described in further detail.
[0030] The embodiments of the present application disclose a highly integrated kick sensor.
[0031] Reference Figure 1 A highly integrated kick sensor includes a single chip 1, a capacitive sensing module 2 and at least one sensing electrode 3, and the chip 1 is integrated with a LIN communication module 11, a voltage regulator 12, a system control module 13 and a monitoring module 14, and the controller 100 is electrically connected to the LIN communication module 11. The power supply end of the controller 100 is electrically connected to the input end of the voltage regulator 12 to achieve stable power supply to the chip 1. The output end of the monitoring module 14 is electrically connected to the input end of the sensing electrode 3 through the capacitive sensing module 2. When the sensing electrode 3 is triggered, the sensing electrode 3 will output a start signal to the chip 1. The output end of the system control module 13 is electrically connected to the signal input end of the controller 100 through the hard-wired output module 4. When the chip 1 receives the start signal, the chip 1 outputs a kick signal to the controller 100 through the hard-wired output module 4 or the LIN communication module 11. After receiving the kick signal, the controller 100 can drive the corresponding action.
[0032] The hard-wired output module 4 comprises a transistor Q1, a transistor Q2 and a resistor R1. The base of the transistor Q1 is electrically connected to the output of the system control module 13, the collector of the transistor Q1 is electrically connected to the signal input of the controller 100, and the emitter of the transistor Q1 is grounded through the resistor R1. The base of the transistor Q2 is electrically connected to the emitter of the transistor Q1, the collector of the transistor Q2 is electrically connected to the base of the transistor Q1, and the emitter of the transistor Q2 is grounded.
[0033] When the output of the system control module 13 outputs a high level, at this time the transistor Q1 is turned on, the base of the transistor Q2 is grounded through the resistor R1, and the transistor Q2 is turned off; the signal input sequentially passes through the transistor Q1 and the resistor R1 ground, that is, at this time the signal input receives a low level, thereby enabling the control end to respond to the action after the induction electrode 3 is triggered. When the output of the system control module 13 outputs a low level, at this time the transistor Q1 is turned off, the base of the transistor Q2 is grounded through the resistor R1, and the transistor Q2 is turned off, at this time the signal input receives a high level, and the controller 100 does not respond to the action after the induction electrode 3 is triggered.
[0034] Reference Figure 1 and Figure 2 Preferably, the embodiment further comprises a filtering module 5 for filtering out the interference of the external environment. The power supply end K1 of the controller 100 is electrically connected to the first input of the filtering module 5, and the power supply end K2 of the controller 100 is electrically connected to the second input of the filtering module 5. The first output of the filtering module 5 is electrically connected to the first input of the voltage stabilizer 12 through the voltage monitoring module 6, and the second output of the filtering module 5 and the second input of the voltage stabilizer 12 are both grounded.
[0035] Specifically, the filtering module 5 comprises a plurality of filtering capacitors, a bidirectional TVS tube D1 and a diode D2. The power supply end K1 sequentially passes through the filtering capacitor C1 and the filtering capacitor C2 to ground, and the power supply end K1 also sequentially passes through the bidirectional TVS tube D1 to ground. The power supply end K1 is electrically connected to the anode of the diode D2, the cathode of the diode D2 sequentially passes through the filtering capacitor C3 and the filtering capacitor C4 to ground, the cathode of the diode D2 also passes through the filtering capacitor C5 to ground, and the cathode of the diode D2 also sequentially passes through the filtering capacitor C7 and the filtering capacitor C8 to ground. The cathode of the diode D2 is set as the output end out1 of the filtering module 5, and the output end out1 is electrically connected to the first input of the voltage stabilizer 12 through the voltage monitoring module 6.
[0036] The plurality of filtering capacitors are used to filter out the interference of the external environment, thereby being able to improve the stability of the voltage output. The bidirectional TVS tube is a transient voltage suppressor, which is used to prevent high-voltage input from damaging the circuit and to ensure that it can quickly conduct when a transient overvoltage occurs, thereby protecting the subsequent circuit from damage.
[0037] Referring to Figure 3 The voltage monitoring module 6 is used to monitor the input voltage state in real time. Specifically, the voltage monitoring module 6 includes a transistor Q3 and a transistor Q4, and a sampling terminal UB1 is introduced at the output end out1 and the first input end of the voltage stabilizer 12. The base of the transistor Q4 is electrically connected to the enable end monitor EN of the controller 100, the emitter of the transistor Q4 is grounded, and the collector of the transistor Q4 is electrically connected to the base of the transistor Q3. The emitter of the transistor Q3 is electrically connected to the sampling terminal UB1, the collector of the transistor Q3 is grounded in sequence through the resistor R2 and the resistor R3, and the connection point between the resistor R2 and the resistor R3 is electrically connected to the input end of the analog-to-digital converter. Preferably, the voltage monitoring module 6 further includes a capacitor C9, one end of the capacitor C9 is electrically connected to the connection point between the resistor R2 and the resistor R3, and the other end of the capacitor C9 is grounded.
[0038] When voltage detection is not required, the enable end monitor EN of the controller 100 outputs a low level, at which time the transistor Q4 is cut off, the transistor Q3 is cut off, and voltage signal detection cannot be achieved. When voltage detection is required, the enable end monitor EN of the controller 100 outputs a high level, the transistor Q4 is turned on, at which time the base of the transistor Q3 is grounded through the transistor Q4, so that the transistor Q3 is turned on; after the transistor Q3 is turned on, the output voltage of the sampling terminal UB1 is output to the analog-to-digital converter through the transistor Q4 and under the voltage division effect of the resistor R2 and the resistor R3; the analog-to-digital converter quantitatively processes the received voltage signal, and then determines whether the current voltage is within the normal range through a software algorithm. If an abnormal condition is detected, an alarm can be issued through an LED indicator light or a buzzer, etc., to remind the user to take timely measures.
[0039] Reference Figure 4 The induction electrode 3 can be made of copper foil, aluminum sheet or other conductive materials, and different shapes and sizes can be selected according to actual application requirements. For example, for the opening scene of a passenger car tail door, a circular or rectangular copper foil can be used as the induction electrode 3 and attached to a suitable position at the bottom of the vehicle. For commercial vehicles, a long strip or polygonal induction electrode 3 can be selected according to the vehicle body structure to adapt to a larger detection range.
[0040] The capacitance sensing module comprises resistor R4, resistor R5, resistor R6, resistor R7, capacitor C10, capacitor C11, capacitor C12 and capacitor C13. The second output end Indicator2 of the monitoring module 14 is connected to ground through resistor R4 and capacitor C10 in sequence. The connection point between resistor R4 and capacitor C10 is electrically connected to one end of resistor R5 through inductor L1 and to ground through capacitor C11, and the other end of resistor R5 is electrically connected to the first input end Sensor1 of the sensing electrode 3. The first output end Indicator1 of the monitoring module 14 is connected to ground through resistor R6 and capacitor C13 in sequence. The connection point between resistor R6 and capacitor C13 is electrically connected to one end of resistor R7 through inductor L2 and to ground through capacitor C14, and the other end of resistor R7 is electrically connected to the second input end Sensor2 of the sensing electrode 3.
[0041] The sensitivity can be adjusted by adjusting the specific parameters of resistor R4, resistor R5, resistor R6, resistor R7, capacitor C10, capacitor C11, capacitor C12 and capacitor C13. Moreover, the adjustable parameters can also be adjusted by software to adapt to the use requirements in different environments.
[0042] Preferably, the capacitance sensing module further comprises diode D3, diode D4, capacitor C12 and capacitor C15. One end of resistor R5 away from inductor L1 is electrically connected to the anode of diode D3, and the cathode of diode D3 is electrically connected to the first input end Sensor1 of the sensing electrode 3. One end of capacitor C12 is electrically connected to the anode of diode D3, and the other end of capacitor C12 is electrically connected to the cathode of diode D3. One end of resistor R7 away from inductor L2 is electrically connected to the anode of diode D4, and the cathode of diode D4 is electrically connected to the first input end Sensor2 of the sensing electrode 3. One end of capacitor C15 is electrically connected to the anode of diode D4, and the other end of capacitor C15 is electrically connected to the cathode of diode D4.
[0043] On this basis, the LIN module can realize the power-on self-test function. Specifically, after the product is powered on, each module is initialized first, then it is tested whether the LIN communication works normally, then the trigger performance of the kick sensor is tested, and finally a self-test report is generated and sent to the external device through LIN communication.
[0044] The implementation principle of the highly integrated kick sensor according to an embodiment of the present application is that a plurality of functional modules are integrated in a single chip 1, thereby significantly reducing the volume of the sensor and making it more portable. In addition, the introduction of the filtering module 5 and the voltage monitoring module 6 effectively improves the stability and reliability of the system. In particular, in a complex electromagnetic environment, the filtering module 5 can effectively filter out external interference and ensure the normal operation of the sensor. The voltage monitoring module 6 can detect power abnormalities in the first time and notify the user through an alarm mechanism, thereby avoiding system failure caused by power problems.
[0045] When the sensing electrode 3 is triggered, the sensing electrode 3 outputs a start signal to the chip 1. After receiving the start signal, the chip 1 outputs a kick signal to the controller 100 through the hard-wire output module 4 or the LIN communication module 11. After receiving the kick signal, the controller 100 can drive the corresponding action.
[0046] The above are preferred embodiments of the present application, and do not limit the protection scope of the present application. Therefore, equivalent changes made on the basis of the structure, shape, and principle of the present application should be covered within the protection scope of the present application.
Claims
1. A highly integrated kick sensor, based on a controller (100), characterized by: include: at least one sensing electrode (3); A chip (1), wherein the chip (1) integrates a LIN communication module (11), a voltage regulator (12), a system control module (13), and a monitoring module (14); the controller (100) and the LIN communication module (11) are electrically connected; the output end of the system control module (13) is electrically connected to the signal input end of the controller (100) through a hard-line output module (4); the output end of the monitoring module (14) is electrically connected to the input end of the sensing electrode (3) through a capacitive sensing module (2); When the sensing electrode (3) is triggered, the sensing electrode (3) outputs a start signal to the chip (1). After the chip (1) receives the start signal, the system control module (13) outputs a kick signal to the controller (100) via the hard-wire output module (4) or the LIN communication module (11). After receiving the kick signal, the controller (100) can drive a corresponding action.
2. The highly integrated kick sensor according to claim 1, characterized in that: It also includes a filtering module (5), the filtering module (5) includes a plurality of filtering capacitors and a diode D2, wherein: the power supply terminal K2 of the controller (100) is grounded, and the power supply terminal K1 of the controller (100) is grounded in sequence through the filtering capacitor C1 and the filtering capacitor C2; the power supply terminal K1 is electrically connected to the anode of the diode D2; the cathode of the diode D2 is grounded in sequence through the filtering capacitor C3, the filtering capacitor C4, the filtering capacitor C5, the filtering capacitor C7 and the filtering capacitor C8; the cathode of the diode D2 is the output terminal out1 of the filtering module (5), and the output terminal out1 is electrically connected to the first input terminal of the voltage regulator (12).
3. The highly integrated kick sensor according to claim 2, characterized in that: The filtering module (5) further comprises a bidirectional TVS tube D1, and the power supply terminal K1 is grounded via the bidirectional TVS tube D1.
4. The highly integrated kick sensor according to claim 2, characterized in that: The invention also includes a voltage monitoring module (6), which includes a transistor Q3, a transistor Q4, a resistor R2 and a resistor R3, wherein: the base of the transistor Q4 is electrically connected to the enable terminal monitor EN of the controller (100); the emitter of the transistor Q4 is grounded, and the collector of the transistor Q4 is electrically connected to the base of the transistor Q3; the emitter of the transistor Q3 is electrically connected to the sampling terminal UBi, and the sampling terminal UBi is provided between the output terminal of the filter module (5) and the input terminal of the voltage regulator (12); the collector of the transistor Q3 is grounded through the resistor R2 and the resistor R3 in sequence, and the connection point between the resistor R2 and the resistor R3 is electrically connected to the input terminal of the analog-to-digital converter.
5. The highly integrated kick sensor according to claim 4, characterized in that: The voltage monitoring module (6) further comprises a capacitor C9, one end of which is electrically connected to a connection point between the resistor R2 and the resistor R3, and the other end of which is grounded.
6. The highly integrated kick sensor according to claim 1, characterized in that: The capacitance sensing module (2) includes a resistor R4, a resistor R5, a resistor R6, a resistor R7, a capacitor C10, a capacitor C11, a capacitor C12, and a capacitor C13, wherein: the second output terminal Indicator2 of the monitoring module (14) is grounded through the resistor R4 and the capacitor C10 in sequence; the connection point between the resistor R4 and the capacitor C10 is electrically connected to one end of the resistor R5 through the inductor L1 and is grounded through the capacitor C11, and the other end of the resistor R5 is electrically connected to the first input terminal Sensor1 of the sensing electrode (3); The first output terminal Indicator1 of the monitoring module (14) is grounded in sequence through the resistor R6 and the capacitor C13; the connection point between the resistor R6 and the capacitor C13 is electrically connected to one end of the resistor R7 through the inductor L2 and is grounded through the capacitor C14, and the other end of the resistor R7 is electrically connected to the second input terminal Sensor2 of the sensing electrode (3).
7. The highly integrated kick sensor according to claim 6, characterized in that: The parameters of the resistor R4, the resistor R5, the resistor R6, the resistor R7, the capacitor C10, the capacitor C11, the capacitor C12, and the capacitor C13 are all adjustable.
8. The highly integrated kick sensor according to claim 6, characterized in that: The capacitive sensing module (2) further comprises a diode D3, a diode D4, a capacitor C12 and a capacitor C15, wherein: one end of the resistor R5 away from the inductor L1 is electrically connected to the anode of the diode D3, and the cathode of the diode D3 is electrically connected to the first input terminal Sensor1 of the sensing electrode (3); one end of the capacitor C12 is electrically connected to the anode of the diode D3, and the other end of the capacitor C12 is electrically connected to the cathode of the diode D3; One end of the resistor R7 away from the inductor L2 is electrically connected to the anode of the diode D4, and the cathode of the diode D4 is electrically connected to the second input terminal Sensor2 of the sensing electrode (3); one end of the capacitor C15 is electrically connected to the anode of the diode D4, and the other end of the capacitor C15 is electrically connected to the cathode of the diode D4.
9. The highly integrated kick sensor according to claim 1, characterized in that: The hard-wire output module (4) includes a transistor Q1, a transistor Q2 and a resistor R1, wherein: the base of the transistor Q1 is electrically connected to the output end of the system control module (13); the collector of the transistor Q1 is electrically connected to the signal input end of the controller (100); the emitter of the transistor Q1 is grounded through the resistor R1; the base of the transistor Q2 is electrically connected to the emitter of the transistor Q1; the collector of the transistor Q2 is electrically connected to the base of the transistor Q1, and the emitter of the transistor Q2 is grounded.
10. The highly integrated kick sensor according to claim 1, characterized in that: The chip (1) has a power-on self-test function. After the product is powered on, each module is first initialized, and then the LIN communication module (11) is tested to see if it is working properly. Then, the triggering performance of the kick sensor is tested, and finally a self-test report is generated and sent to an external device via LIN communication.