Electronic paper display module production method

Abstract

The production method of the electronic paper display module comprises the following steps of: B10, adding silver colloid on the circuit connection points on the TFT layer; the electronic paper display combination layer module is attached to the TFT layer; step B20, attaching a waterproof protective film layer to the electronic paper display combination layer module; b30, local curing of the elargol: carrying out local heating on the elargol part, and curing the elargol; b40, sealing a peripheral gap of the electronic paper display module by using UV edge sealing glue; b50, bubbles in the electronic paper display module are eliminated within the set temperature range, and the temperature range is larger than or equal to 20 DEG C and smaller than or equal to 30 DEG C; and step B60, irradiating by using ultraviolet light, and curing the UV edge sealing glue.

Description

TECHNICAL FIELD

[0001] The application belongs to the field of display device manufacturing, and particularly relates to a production method of an electronic paper display module. BACKGROUND

[0002] Electronic paper, also known as electronic ink screen, has excellent characteristics such as ultra-low power consumption, continuous display without power consumption, eye protection, and the like, and has the same display effect and visual experience as paper. A plurality of black and white mixed electronic particles are arranged in the same ink capsule, and under the action of current, the plurality of ink capsules are arranged and combined to form "electronic ink". Under the influence of positive and negative charges, these tiny ink capsules operate like a liquid to form various characters and patterns. The core features are low power consumption and visual health. In the field of electronic paper, a plurality of special bonding processes need to be used in the manufacturing process of an electronic paper module, and the technical difficulty is also high.

[0003] The water content of the core material of the electronic paper online module, the electronic ink film (FPL), needs to be maintained stable, and the change of the water content will directly affect the display effect of the electronic paper. Therefore, a material is needed to seal the electronic ink film around to prevent water vapor in the electronic ink microcapsule from entering or flowing out during the production process of the electronic paper module.

[0004] In the production and manufacturing process of the electronic paper display module in the prior art, the edge sealing glue is heated for defoaming at high temperature, and the whole is heated. When the whole is heated, the FPL will lose water, which will affect the final display effect of the product.

[0005] Glossary:

[0006] EPD is the abbreviation of English "electronic paper display", and its Chinese meaning is electronic paper mother sheet display. The meaning of the electronic paper mother sheet in the application is electronic paper mother sheet display.

[0007] TFT is the abbreviation of English "Thin Film Transistor", and its Chinese meaning is thin film field effect transistor; each pixel point on the TFT display is driven by the integrated thin film transistor behind it.

[0008] UV is the abbreviation of English "Ultraviolet", and its Chinese meaning is ultraviolet.

[0009] PET is the abbreviation of English "Polyethylene terephthalate", and its Chinese meaning is polyester resin film layer.

[0010] IC is the abbreviation of English "Integrated Circuit", and its Chinese meaning is chip.

[0011] FPC is the abbreviation of English "Flexible Printed Circuit", the Chinese meaning is flexible circuit board.

[0012] PS is the abbreviation of English "Polystyrene", the Chinese meaning is polystyrene film.

[0013] FPL is the abbreviation of English "Front Plane Lamination", the Chinese meaning is front plane lamination display module.

[0014] ITO is the abbreviation of English "Indium Tin Oxide", the Chinese meaning is indium tin oxide. In this application, the electronic paper ITO refers to the conductive film layer material of the transparent conductive film shielding glass, mainly ITO (indium tin oxide semiconductor) film. SUMMARY

[0015] The technical problem to be solved by the present application is to avoid the problem of FPL water loss caused by overall heating in the process heating link in the prior art, which affects the display effect of the product. A process method is proposed, which locally heats and cures and performs normal temperature defoaming, reduces the FPL water loss problem caused by overall heating, and improves the display effect of the product.

[0016] The technical solution of the present application to solve the above technical problem is an electronic paper display module production method, comprising the following steps: B10: silver paste is added on the circuit connection point on the TFT layer; the electronic paper display combination layer module is attached to the TFT layer; B20: a waterproof protective film layer is attached to the electronic paper display combination layer module; B30: silver paste is locally cured, the silver paste part is locally heated, and the silver paste is cured; B40: the UV edge sealing glue is used to close the gap around the electronic paper display module; B50: in a set temperature range, the internal bubbles of the electronic paper display module are eliminated, the temperature range is greater than or equal to 20 degrees and less than or equal to 30 degrees; B60: the UV edge sealing glue is cured by ultraviolet light irradiation.

[0017] Alternatively, the step B30 specifically comprises step B31: the silver paste is locally cured by infrared light.

[0018] In the step B31, the time for locally heating and curing the silver paste by infrared light is 5-10 seconds.

[0019] Alternatively, the step B30 specifically comprises step B32: the silver paste is locally cured by heating strip.

[0020] In the step B32, the time for locally heating the silver paste by heating strip is 20-28 seconds.

[0021] Before the step B30, it further comprises step B300: the driving chip is bound to the glass substrate by ACF through COG process.

[0022] Before the step B30, the method further comprises a step B301: connecting the flexible circuit board FPC to the glass substrate by a hot-pressing process using the FOG process.

[0023] After the step B60, the method further comprises a step B70: sealing the driving chip by UV silicone.

[0024] One of the beneficial effects of the technical solution in the present application is that the overall process can reduce the risk of water loss of the FPL layer of the electronic paper module, improve product quality, and ensure display effect.

[0025] One of the beneficial effects of the technical solution in the present application is that local heating and curing of silver glue and room temperature defoaming greatly reduce the risk of water loss of the FPL layer of the electronic paper module under high-temperature process conditions, greatly improve product quality, and ensure display effect.

[0026] One of the beneficial effects of the technical solution in the present application is that local heating and curing of silver glue using infrared light can better control the range and temperature of local heating.

[0027] Or using a heating strip to locally heat and cure silver glue can not only better control the range and temperature of local heating, but also improve heat conduction efficiency and ensure the connection reliability of silver glue.

[0028] One of the beneficial effects of the technical solution in the present application is that the driving chip is bound to the glass substrate by ACF, which can be applied to more types of electronic paper display modules.

[0029] One of the beneficial effects of the technical solution in the present application is that the flexible circuit board FPC is connected to the glass substrate by a hot-pressing process, which can be applied to more types of electronic paper display modules.

[0030] One of the beneficial effects of the technical solution in the present application is that the driving chip is sealed by UV silicone, which ensures the reliable fixation of the driving chip.

[0031] One of the beneficial effects of the technical solution in the present application is that the relatively low temperature range can be adapted to more easily obtainable and controllable environmental conditions, or it can be in a room temperature environment. BRIEF DESCRIPTION OF DRAWINGS

[0032] Figure 1 is a schematic diagram of an electronic paper display module production method Figure 1 ;

[0033] Figure 2 is a schematic diagram of an electronic paper display module production method Figure 2 ;

[0034] Figure 3 is a schematic diagram of an electronic paper display module production method Figure 3 ;

[0035] Figure 4 This is the first step in the production process of an electronic paper display device;

[0036] Figure 5 This is the second step in the production process of an electronic paper display device;

[0037] Figure 6 This is the third step in the production process of an electronic paper display device;

[0038] Figure 7 This is the fourth schematic diagram of the production steps of the electronic paper display device;

[0039] Figure 8 This is the fifth step in the production process of an electronic paper display device;

[0040] Figure 9 This is the sixth schematic diagram of the production steps of an electronic paper display device;

[0041] Figure 10 This is the seventh schematic diagram of the steps in producing an electronic paper display device;

[0042] Figure 11 This is the eighth schematic diagram of the steps in producing an electronic paper display device;

[0043] Figure 12 This is the 9th schematic diagram of the production steps of the electronic paper display device;

[0044] Figure 13 This is the 10th schematic diagram of the production steps of the electronic paper display device. DETAILED DESCRIPTION

[0045] The embodiments of the present invention are further described below in conjunction with the accompanying drawings.

[0046] It should be noted that the following is a description of the preferred embodiments of the present application and does not constitute any limitation to the present application. The description of the preferred embodiments of the present application is merely an illustration of the general principles of the present application. The embodiments described in this application are only a part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making any creative work are within the scope of protection of this application.

[0047] In the description of the present application, it needs to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", and technical features numbered with Arabic numerals 1, 2, 3, and the like, and "A" and "B" such numbering, are only for the purpose of description, for the convenience of illustration, and do not represent the temporal or spatial sequence relationship; cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined with "first", "second", and technical features numbered with Arabic numerals 1, 2, 3, and the like can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "several" is two or more, unless otherwise explicitly and specifically limited.

[0048] As Figures 1 to 3 A method for producing an electronic paper display module includes a plurality of steps.

[0049] As Figure 4 shown, step B10: silver glue on the circuit connection point on the TFT layer; as Figure 5 shown, the electronic paper display assembly layer module is attached to the TFT layer; the electronic paper display assembly layer module is the FPL module;

[0050] As Figure 6 shown, before step B30, it further includes step B300: using COG (Chip On Glass) process, binding the driving chip to the glass substrate through ACF (Anisotropic Conductive Film).

[0051] COG (Chip On Glass) process refers to directly binding the driving chip to the glass substrate through conductive material. In some embodiments, the electrical connection between the chip and the glass can be achieved by using anisotropic conductive film (ACF), which has the characteristics of thinness and high integration. It is especially suitable for small size and high resolution screens.

[0052] As Figure 6As shown, the step B30 before, still includes step B301: with FOG (Flex On Glass) process, the flexible circuit board (FPC) is connected with the glass substrate by hot pressing process. FOG (Flex On Glass) refers to the flexible circuit board (FPC) is connected with the glass substrate by hot pressing process. Compared with COG, FOG technology can provide more flexible circuit layout and anti-shock performance, suitable for display module of complex shape. The glass substrate can include TFT substrate.

[0053] As shown in Figure 7 Step B20: the waterproof protective film layer is attached to the electronic paper display module; the waterproof protective film layer can be a PS film.

[0054] As shown in Figure 8 And Figure 9 Step B30: silver glue is partially solidified, and the silver glue part is locally heated to solidify the silver glue.

[0055] As shown in Figure 2 And Figure 8 Step B30 is specifically step B31: using infrared light, the silver glue is locally heated. The time for locally heating the silver glue by infrared light is 5-10 seconds, which can also be 6, 7, 8, 9 seconds.

[0056] As shown in Figure 3 And Figure 9 Or step B30 is specifically step B32: using a heating strip to locally heat and solidify the silver glue. The time for locally heating and solidifying the silver glue is 20-28 seconds, which can also be 21, 22, 23, 24, 25, 26, 27 seconds.

[0057] Using infrared heating to solidify the silver glue and using a heating strip to solidify the silver glue are two different solidification methods, and only one of them is needed, which are two different solidification schemes. It is not to use infrared to solidify first and then use a heating strip to solidify.

[0058] As shown in Figure 10 Step B40: the UV edge sealing glue is used to seal the gap around the electronic paper display module; step B50: the internal bubbles of the electronic paper display module are eliminated at a set temperature range, which is greater than or equal to 20 degrees and less than or equal to 30 degrees; it can also be 22-25 degrees; or 21-28 degrees; it can also be 21, 22, 23, 24, 25, 26, 27, 28, 29 degrees.

[0059] As shown in Figure 11 Step B60: the UV edge sealing glue is cured by ultraviolet light irradiation.

[0060] As shown in Figure 12As shown, the step B60 is followed by a step B70 of blocking the driving chip with UV silicon glue. Figure 13 The step B60 is followed by a step B61 of curing the UV silicon glue by irradiation with ultraviolet light.

[0061] In the prior art, the process scheme of the EPD module is: FPL+TFT attachment→FPL+PS attachment→COG&FOG→OTP→four-point waterproof sealing edge glue→high-temperature defoaming→pointing silicon glue→post-operation. The high-temperature defoaming scheme causes severe water loss of the FPL. The silver glue is baked and cured by using a high-temperature defoaming machine, which causes the FPL to easily lose water in a high-temperature state, resulting in abnormal display of the FPL edge during testing. The silver glue in the prior art is baked and cured by using a high-temperature defoaming machine at 60-90°C.

[0062] The process scheme of the present application is: FPL+TFT attachment→FPL+PS attachment→COG&FOG (using infrared local heating of silver glue)→OTP (or using a heating strip to locally cure the silver glue here)→pointing UV sealing edge glue→normal-temperature defoaming→UV curing of the sealing edge glue→pointing silicon glue→post-operation, which avoids water loss of the FPL. The scheme of the present application can reduce water loss of the FPL, improve the display effect of the product, and reduce the difficulty of waveform debugging.

[0063] As shown in the drawings, the above description is only an embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent flow transformation obtained by using the content of the present application, or direct or indirect application in other related technical fields is also included in the patent protection scope of the present application.

Claims

1. A method for producing an electronic paper display module, characterized in that: include Step B10: Add silver glue to the circuit connection points on the TFT layer; and laminate the electronic paper display assembly layer module to the TFT layer; Step B20: attaching the waterproof protective film layer to the electronic paper display assembly layer module; Step B30: local curing of the silver glue, locally heating the silver glue area to cure the silver glue; Step B40: Use UV edge sealing adhesive to seal the gaps around the electronic paper display module; Step B50: Eliminating bubbles inside the electronic paper display module within a set temperature range, wherein the temperature range is greater than or equal to 20 degrees Celsius and less than or equal to 30 degrees Celsius; Step B60: Irradiate with ultraviolet light to cure the UV edge sealing adhesive.

2. The method for producing an electronic paper display module according to claim 1, wherein: The step B30 is specifically as follows: Step B31: Use infrared light to locally heat and cure the silver paste.

3. The method for producing an electronic paper display module according to claim 1, wherein: In step B31, the silver paste is locally heated and cured using infrared light for 5 to 10 seconds.

4. The method for producing an electronic paper display module according to claim 1, wherein: The step B30 is specifically as follows: Alternatively, step B32 is used: using a heating strip to locally heat and cure the silver glue.

5. The method for producing an electronic paper display module according to claim 1, wherein: In the step B32, a heating strip is used to locally heat and solidify the silver paste, and the time for locally heating the silver paste is 20 seconds to 28 seconds.

6. The method for producing an electronic paper display module according to claim 1, wherein: Before step B30, the method further includes: Step B300: Using the COG process, the driver chip is bonded to the glass substrate through the ACF.

7. The method for producing an electronic paper display module according to claim 1, wherein: Before step B30, the method further includes: Step B301: Using the FOG process, the flexible circuit board (FPC) is connected to the glass substrate through a hot pressing process.

8. The method for producing an electronic paper display module according to claim 6, wherein: After step B60, the following steps are also included: Step B70: Use UV silicone to seal the driver chip.

9. The method for producing an electronic paper display module according to claim 1, wherein: The temperature range may also be 22 to 25 degrees or 21 to 28 degrees.

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