Exposure machine special for DBC ceramic copper clad substrate

Abstract

The application discloses a DBC ceramic copper-clad plate special exposure machine and belongs to the technical field of exposure machines.The machine table is provided with a heat exchange and heat dissipation port on the top, is fixedly connected with an illumination plate on one side, is provided with an LED lamp plate on the bottom of the illumination plate, is provided with a table frame exchange port on the side corresponding to the illumination plate, is provided with a pair of exposure table frames in the table frame exchange port, and is provided with a storage box and an extended work plate on the two sides of the table frame exchange port.The base plate warping degree detection mechanism is arranged, the combination of the large-lead ball screw pair and the incremental rotary encoder is used to directly convert the small displacement of the pressing plate into a high-precision digital pulse signal, the fine measurement of the base plate flatness is realized, the originally invisible warping deformation becomes measurable and data-based, basic data basis is provided for subsequent accurate compensation, and the Mark point focusing failure and the alignment deviation problem caused by warping are solved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of exposure machines, in particular to a DBC ceramic copper-clad substrate special exposure machine. BACKGROUND

[0002] The DBC ceramic copper-clad substrate special exposure machine is a high-precision photoetching equipment for the manufacturing process of a DBC ceramic copper-clad substrate. The equipment is mainly used for completing a patterning exposure process on the surface of a DBC substrate and is a key equipment for realizing the transfer of a fine pattern of an electronic circuit. In the fields of electronic power modules, semiconductor packaging, new energy vehicles, and aerospace electronics, a DBC substrate has become a key basic material due to its excellent insulation performance, high thermal conductivity, and a thermal expansion coefficient matching a chip. The manufacturing process involves coating copper on the surface of a ceramic substrate (such as aluminum oxide or aluminum nitride) and realizing the firm combination of the copper layer and the ceramic through a high-temperature eutectic process. Subsequently, a series of patterning processes such as photoresist coating, exposure, and development need to be performed on the copper layer to form a circuit wiring pattern required by design.

[0003] The prior art also has the following disadvantages: The existing substrate exposure machine is not designed for DBC ceramic copper-clad substrates. Since a DBC substrate is bonded by a ceramic and a copper layer at high temperature, the substrate is prone to slight warping and deformation after etching, heat treatment, and roughening in the production and processing flow. In other words, the surface of part of the substrate in the exposure process is not a completely flat surface. The alignment system used by mainstream exposure machines is a Through-The-Lens (TTL) or Off-Axis visual alignment system. The heights of Mark points at different positions of the substrate in a slight warping state are different, which causes the camera to fail to capture all the marks and fail to accurately focus, thereby seriously affecting the alignment accuracy. To solve this problem, the existing equipment uses multi-point focusing and 3D curved surface compensation technology, but the cost is high and the compensation effect is very limited. SUMMARY

[0004] In order to overcome the above defects, the application provides a DBC ceramic copper-clad substrate special exposure machine, which solves the problems of the prior art.

[0005] To achieve the above purpose, the application provides the following technical scheme: a DBC ceramic copper-clad substrate special exposure machine, comprising:

[0006] The machine has a heat exchange port on its top and a lighting board fixedly connected to one side. An LED light panel is installed at the bottom of the lighting board. A frame exchange port is opened on the side of the machine corresponding to the lighting board. A pair of exposure frames are installed in the frame exchange port. A storage box and an extension work plate are respectively installed on both sides of the frame exchange port. An interaction port and an adjustment bracket are installed on the table surface where the frame exchange port is located. An emergency stop switch and a frame forward switch are installed on the interaction port. The machine control PC is installed on the adjustment bracket.

[0007] A sealing cover is hinged to one side of the exposure stage frame. A fixture plate is provided on the exposure stage frame. A special fixture plate is installed on the fixture plate. The special fixture plate has six carrier frames in two rows and three columns.

[0008] Both sides of the exposure stage frame are rotatably connected to support arms and electric telescopic rods. The output end of the electric telescopic rod is rotatably connected to the support arm. Both sides of the sealing cover are provided with mating grooves. The end of the support arm near the electric telescopic rod is slidably connected to the mating groove. Both sides of the exposure stage frame are fixedly connected to slide blocks. Both sides of the exchange port of the stage frame are fixedly connected to two slide rails. The exposure stage frame is slidably connected to the slide blocks and slide rails. Both sides of the two slide blocks that are close to each other are fixedly connected to racks. Both sides of the exchange port of the stage frame are rotatably connected to drive gears. The machine tool is equipped with a servo motor for driving the drive gears. The drive gears mesh with the two racks on the corresponding sides.

[0009] As a further aspect of the present invention: both sides of the carrier frame are provided with substrate warpage detection mechanisms. The substrate warpage detection mechanism includes a detection port provided on one side of the carrier frame. A bidirectional lead screw is rotatably connected inside the detection port. Both sides of the bidirectional lead screw are threaded with nuts. A pull rod is rotatably connected to one side of the nuts. A detection plate is rotatably connected to the two pull rods. Two hollow tubes are fixedly connected to the bottom of the detection plate. A pressure plate is slidably connected to the two hollow tubes. A ball screw is rotatably connected inside the hollow tubes. A ball nut is provided inside the hollow tubes. The ball nut is fixedly connected to the pressure plate. A rotary encoder is provided inside the detection plate. The detection end of the rotary encoder is connected to the ball screw. The rotary encoder contains a grating disk and a photoelectric interruptor.

[0010] As a further aspect of the present invention: multiple grooves are formed in the carrier frame, and an adsorption point is provided at the intersection of two mutually perpendicular grooves. The adsorption point is divided into two parts corresponding to the detection port positions on both sides of a single carrier frame. A vacuum pump is provided in the exposure stage frame, and the vacuum pump is connected to each part of the adsorption point, and a solenoid valve is provided at the connection position.

[0011] As a further aspect of the present invention: the machine tool is provided with a control port, the control port is provided with a control module and a detection module, the control module is signal-connected to the detection module, the control module is signal-connected to the solenoid valve, and the detection module is signal-connected to the rotary encoder.

[0012] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0013] This invention, by setting up a substrate warpage detection mechanism, uses a combination of a large-lead ball screw pair and an incremental rotary encoder to directly convert the minute displacement of the pressure plate into a high-precision digital pulse signal, thereby achieving precise measurement of the substrate flatness. This makes the originally invisible warpage deformation measurable and quantifiable, providing a basic data foundation for subsequent accurate compensation and solving the problems of Mark point focusing failure and alignment deviation caused by warpage. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0015] Figure 2 for Figure 1 Enlarged view of section A in the middle;

[0016] Figure 3 This is a three-dimensional structural schematic diagram of the present invention from another angle;

[0017] Figure 4 This is a three-dimensional structural diagram of the carrier frame portion of the present invention;

[0018] Figure 5 This is a top view of the carrier frame of the present invention;

[0019] Figure 6 for Figure 5 Enlarged view of section B;

[0020] Figure 7 This is a three-dimensional structural diagram of the detection port of the present invention;

[0021] Figure 8 This is a three-dimensional structural diagram of the pressure plate portion of the present invention;

[0022] Figure 9 This is a three-dimensional structural diagram of the hollow tube portion of the present invention.

[0023] In the diagram: 1. Machine base; 2. Heat exchanger port; 3. Lighting board; 4. LED light board; 5. Exposure stage frame; 6. Storage box; 7. Extension work plate; 8. Interaction port; 9. Adjustment bracket; 10. Emergency stop switch; 11. Stage frame forward switch; 12. Machine control PC terminal; 13. Sealing cover plate; 14. Special fixture plate; 15. Carrier frame; 16. Support arm; 17. Electric telescopic rod; 18. Slide seat; 19. Slide rail; 20. Rack; 21. Drive gear; 22. Detection port; 23. Bidirectional lead screw; 24. Nut; 25. Tie rod; 26. Detection plate; 27. Hollow tube; 28. Pressure plate; 29. ​​Ball screw; 30. Ball nut; 31. Rotary encoder; 32. Adsorption point. Detailed Implementation

[0024] The technical solution of the present invention will be further described in detail below with reference to specific embodiments.

[0025] Example 1

[0026] Reference Figures 1-3 This is the first embodiment of the present invention. This embodiment provides a DBC ceramic copper-clad substrate special exposure machine, which can realize semi-automatic exposure of copper-clad ceramic substrates. It includes a machine base 1. The top of the machine base 1 is provided with a heat exchange heat dissipation port 2. An illumination board 3 is fixedly connected to one side of the machine base 1. An LED light board 4 is provided at the bottom of the illumination board 3. A table frame exchange port is opened on the side of the machine base 1 corresponding to the illumination board 3. A pair of exposure table frames 5 are provided in the table frame exchange port. A storage box 6 and an extension work plate 7 are respectively provided on both sides of the table frame exchange port. An interaction port 8 and an adjustment bracket 9 are provided on the table surface where the table frame exchange port is located. An emergency stop switch 10 and a table frame forward switch 11 are provided on the interaction port 8. An organic table control PC terminal 12 is provided on the adjustment bracket 9.

[0027] Specifically, the cooling system used in this invention is water-cooled + air-cooled. Cooling water can enter the internal exposure lamp source for heat dissipation. After absorbing heat, the temperature of the cold water rises. After initial heat dissipation through the heat exchange heat dissipation port 2, it is discharged. The lighting board 3 on the machine 1 can provide good lighting conditions for the staff to load the substrate to be exposed for pre-inspection. The emergency stop switch 10 on the interaction port 8 can stop the overall operation of the device in an emergency. The machine control PC terminal 12 can perform further pre-inspection of the substrate and check the exposure status in detail.

[0028] A sealing cover plate 13 is hinged to one side of the exposure stage frame 5. A fixture plate is provided on the exposure stage frame 5. A special fixture plate 14 is installed on the fixture plate. A total of six carrier plate frames 15 are opened in two rows and three columns on the special fixture plate 14.

[0029] Specifically, in order to adapt to the DBC copper-clad ceramic substrate, a special fixture plate 14 of a unique type is installed on the exposure stage frame 5, and the parameters of the carrier frame 15 are determined according to the substrate parameters required for production.

[0030] Example 2

[0031] Reference Figures 4-5 This is the second embodiment of the present invention. Unlike the previous embodiment, this embodiment provides a sealing cover 13 opening and closing function and a dual exposure stage frame 5 switching function for the DBC ceramic copper-clad substrate special exposure machine. It can automatically open and close the sealing cover 13 on the exposure stage frame 5 and switch between the two sets of exposure stage frames 5. It includes support arms 16 and electric telescopic rods 17 rotatably connected to both sides of the exposure stage frame 5. The output end of the electric telescopic rod 17 is rotatably connected to the support arm 16. The sealing cover 13 has mating grooves on both sides, and the support arm 16 is close to... One end of the electric telescopic rod 17 is slidably connected to the mating groove. Both sides of the exposure stage frame 5 are fixedly connected to the slide blocks 18. Two slide rails 19 are fixedly connected to the inner walls of both sides of the exchange port of the stage frame. The exposure stage frame 5 is slidably connected to the slide blocks 18 and the slide rails 19. A rack 20 is fixedly connected to the side of the two slide blocks 18 that are close to each other. A drive gear 21 is rotatably connected to the inner walls of both sides of the exchange port of the stage frame. A servo motor is installed in the machine tool 1 to drive the drive gear 21. The drive gear 21 meshes with the two racks 20 on the corresponding side.

[0032] Specifically, the opening and closing of the sealing cover 13 can be achieved by the electric telescopic rod 17. When the electric telescopic rod 17 extends, the support arm 16, which is rotatably connected to its output end, will drive the sealing cover 13 to lift. The end of the support arm 16 will slide a certain distance in the mating groove. Since this invention is a double-frame alternating mode, the two sets of exposure frame 5 need to work alternately. The servo motor can drive the drive gear 21 to rotate. When the drive gear 21 rotates, the two racks 20 meshing with it will move relative to each other, and the two sets of exposure frame 5 can move relative to each other. When one set of exposure frame 5 is loading the plate, the other set of exposure frame 5 can enter the machine 1 for exposure processing.

[0033] It should be noted that the exposure machine proposed in this invention is essentially a semi-automatic exposure machine. It requires manual loading of the substrate and evaluation of the surface condition of the substrate before exposure. Therefore, in order to further improve the exposure efficiency, a dual-stage alternating mode is specially designed to maximize production efficiency without affecting the exposure quality.

[0034] Example 3

[0035] Reference Figures 5-9This is the third embodiment of the present invention. Unlike the previous embodiment, this embodiment provides a DBC ceramic copper-clad substrate special exposure machine for detecting substrate warpage. It includes a carrier frame 15, with substrate warpage detection mechanisms on both sides of the carrier frame 15. Each substrate warpage detection mechanism includes a detection port 22 on one side of the carrier frame 15. A bidirectional lead screw 23 is rotatably connected inside the detection port 22. Nuts 24 are threaded onto both sides of the bidirectional lead screw 23. A pull rod 25 is rotatably connected to one side of the nut 24. A detection plate 26 is rotatably connected to the two pull rods 25. Two hollow tubes 27 are fixedly connected to the bottom of the detection plate 26. Pressure plates 28 are slidably connected to the two hollow tubes 27. Ball screws 29 are rotatably connected inside the hollow tubes 27. Ball screws are installed inside the hollow tubes 27. The ball screw nut 30 is fixedly connected to the pressure plate 28. A rotary encoder 31 is installed inside the detection plate 26. The detection end of the rotary encoder 31 is connected to the ball screw 29. The rotary encoder 31 contains a grating disk and a photoelectric interruptor. Multiple grooves are opened in the carrier frame 15. Adsorption points 32 are set at the intersection of two mutually perpendicular grooves. Each carrier frame 15 corresponds to the position of the detection ports 22 on both sides, dividing the adsorption points 32 into two parts. A vacuum pump is installed inside the exposure stage frame 5. The vacuum pump is connected to each part of the adsorption points 32, and a solenoid valve is set at the connection position. A control port is set inside the machine base 1. The control port is equipped with a control module and a detection module. The control module is connected to the detection module and the solenoid valve. The detection module is connected to the rotary encoder 31.

[0036] The purpose of setting up a substrate warpage detection mechanism is as follows: Since the DBC substrate is made of ceramic and copper layers bonded at high temperature, it is prone to slight warpage and deformation after etching, heat treatment, and roughening during the production process. In other words, some substrate surfaces in the exposure process are not completely flat. The alignment system used by mainstream exposure machines is through-the-lens (TTL) or off-axis vision alignment system. The height of the mark points at different positions on the substrate in the slightly warped state is different, which makes it impossible for the camera to capture all the marks and thus cannot focus accurately, which seriously affects the alignment accuracy. To address this problem, existing equipment uses multi-point focusing and 3D surface compensation technology, but the cost is high and the compensation effect is extremely limited.

[0037] Specifically, the working principle of the substrate warpage detection mechanism is as follows: After the operator finishes loading the substrate, the sealing cover 13 is closed. Before exposure, the bidirectional screw 23 in the detection ports 22 on both sides of the carrier frame 15 rotates, and the nuts 24 on both sides of the bidirectional screw 23 move closer to each other. Supported by the support arm 16, the detection plate 26 extends to one side of the substrate, and the pressure plate 28 falls freely under its own weight. Due to the surface flatness of the warped substrate, the pressure plate 28 cannot be in the lowest position. The position of the pressure plate 28 is also the position of the ball screw nut 30. The downward movement of the ball screw nut 30 will drive the ball screw 29 to rotate a certain number of times. Since the encoder 31 is connected to the ball screw 29, the grating disk inside the rotary encoder 31, together with the photoelectric interruptor, can accurately count the number of rotations of the ball screw 29. In this way, the downward movement distance of the pressure plate 28 can be converted into the number of rotations of the ball screw 29, which is then converted into an electrical pulse signal and sent to the control port. The control port calculates the displacement / angle based on the number of pulses according to the two square wave pulse signals with a 90° phase difference output by the rotary encoder 31, thereby determining the degree of warping, and issuing a command to control the opening and closing of the solenoid valve to perform negative pressure suction on the designated adsorption point 32, thereby adsorbing the substrate and ensuring its flatness.

[0038] It should be noted that ball screws and nuts generally have self-locking properties. The ball screw 29 and ball nut 30 used in this invention are large-lead multi-start ball screw pairs without self-locking. The rotary encoder 31 used in this invention is an "incremental rotary encoder" with a resolution of 400 CPR and is a bushing type, which can be directly sleeved on the shaft of the ball screw 29 without the need for a coupling.

[0039] The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A dedicated exposure machine for DBC ceramic copper-clad substrates, characterized in that, include: The machine (1) has a heat exchange heat dissipation port (2) on the top of the machine (1), a lighting board (3) is fixedly connected to one side of the machine (1), an LED light board (4) is provided at the bottom of the lighting board (3), a table frame exchange port is opened on the side of the machine (1) corresponding to the lighting board (3), a pair of exposure table frames (5) are provided in the table frame exchange port, a storage box (6) and an extension work plate (7) are provided on both sides of the table frame exchange port, an interactive port (8) and an adjustment bracket (9) are provided on the table where the table frame exchange port is located, an emergency stop switch (10) and a table frame forward switch (11) are provided on the interactive port (8), and a machine table control PC terminal (12) is provided on the adjustment bracket (9). A sealing cover plate (13) is hinged to one side of the exposure stage frame (5). A fixture plate is provided on the exposure stage frame (5). A special fixture plate (14) is installed on the fixture plate. A total of six carrier frames (15) are opened in two rows and three columns on the special fixture plate (14). Both sides of the carrier frame (15) are provided with substrate warpage detection mechanisms. The substrate warpage detection mechanism includes a detection port (22) located on one side of the carrier frame (15). A bidirectional lead screw (23) is rotatably connected inside the detection port (22). Both sides of the bidirectional lead screw (23) are threaded with nuts (24). A pull rod (25) is rotatably connected to one side of the nuts (24). The two pull rods (25) are rotatably connected to a detection plate (26). The bottom of the detection plate (26) is fixedly connected to... There are two hollow tubes (27), and a pressure plate (28) is slidably connected to the two hollow tubes (27). A ball screw (29) is rotatably connected inside the hollow tubes (27). A ball nut (30) is provided inside the hollow tubes (27). The ball nut (30) is fixedly connected to the pressure plate (28). A rotary encoder (31) is provided inside the detection plate (26). The detection end of the rotary encoder (31) is connected to the ball screw (29). The rotary encoder (31) contains a grating disk and a photoelectric interruptor.

2. The DBC ceramic copper-clad substrate special exposure machine according to claim 1, characterized in that: Both sides of the exposure stage frame (5) are rotatably connected to support arms (16) and electric telescopic rods (17). The output end of the electric telescopic rod (17) is rotatably connected to the support arm (16). Both sides of the sealing cover plate (13) are provided with mating grooves. The end of the support arm (16) near the electric telescopic rod (17) is slidably connected to the mating groove. Both sides of the exposure stage frame (5) are fixedly connected to slide blocks (18). Both sides of the exchange port of the stage frame are fixedly connected to two slide rails (19). The exposure stage frame (5) is slidably connected to the slide rails (19) through the slide blocks (18). Both sides of the two slide blocks (18) are fixedly connected to racks (20). Both sides of the exchange port of the stage frame are rotatably connected to drive gears (21). The machine tool (1) is equipped with a servo motor for driving the drive gears (21). The drive gears (21) mesh with the two racks (20) on the corresponding side.

3. The DBC ceramic copper-clad substrate special exposure machine according to claim 2, characterized in that: Multiple grooves are formed in the carrier frame (15). Adsorption points (32) are set at the intersection of two perpendicular grooves. Each carrier frame (15) corresponds to the position of the detection ports (22) on both sides, dividing the adsorption points (32) into two parts. A vacuum pump is set in the exposure stage frame (5). The vacuum pump is connected to each part of the adsorption points (32), and a solenoid valve is set at the connection position.

4. The DBC ceramic copper-clad substrate special exposure machine according to claim 3, characterized in that: The machine tool (1) is equipped with a control port, which contains a control module and a detection module. The control module is connected to the detection module by signal, the control module is connected to the solenoid valve by signal, and the detection module is connected to the rotary encoder (31) by signal.

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